TW201929610A - Ring structures and systems for use in a plasma chamber - Google Patents

Abstract

Systems and methods for securing an edge ring to a support ring are described. The edge ring is secured to the support ring via multiple fasteners that are inserted into a bottom surface of the edge ring. The securing of the edge ring to the support ring provides stability of the edge ring during processing of a substrate within a plasma chamber. In addition, the securing of the edge ring to the support ring secures the edge ring to the plasma chamber because the support ring is secured to an insulator ring, which is connected to an insulator wall of the plasma chamber. Moreover, the support ring and the edge ring are pulled down vertically using one or more clasp mechanisms during the processing of the substrate and are pushed up vertically using the clasp mechanisms to remove the edge ring and the support ring from the plasma chamber.

Description

Ring structure and system for plasma chamber

Embodiments of the invention relate to rings, systems, methods, and structures for securing rings in a plasma chamber.

The plasma chamber is used to perform a number of processes on the wafer. For example, a plasma chamber is used to clean a wafer, deposit material on a wafer, or etch a wafer. The plasma chamber contains a number of components, such as various rings, for processing different portions of the wafer.

The embodiments described in this disclosure are presented herein.

In the depicted embodiment, the plasma chamber is provided with an edge ring and a support ring. In an embodiment, the edge ring is coupled to a support ring disposed below the edge ring. The edge ring is coupled to the support ring, for example by a plurality of screws attached to the underside of the edge ring. To secure the support ring, a plurality of pull down structures are coupled to the underside of the support ring, and the plurality of pull down structures are pulled down to hold the edge ring stationary during processing. If the edge ring is improperly fixed during processing, the adhesive used to secure the edge ring is not sufficient. One reason why only the adhesive is not sufficient is due to the high temperature circulation in the plasma chamber, so that the adhesion provided by the adhesive colloid formed between the support ring and the edge ring is reduced. In addition, a constant force is applied to the colloid, so the colloid may disintegrate over time. Therefore, it is desirable that the edge ring and the support ring remain in the original position during processing of the substrate even when the adhesion provided by the colloid is reduced and/or the colloid disintegrates. For example, it is desirable for the edge ring to be fixed relative to the support ring during processing of the substrate. Otherwise, any displacement of the edge ring during processing of the substrate may result in an undesired process being performed on the substrate, or some undesired portion of the substrate being processed. In an embodiment, the bottom surface of the edge ring has a slot for receiving a plurality of fasteners, such as a screw hole, to connect the edge ring to the support ring during processing of the substrate. This helps to prevent the edge ring from moving relative to the support ring.

In an embodiment, it is desirable for the edge ring to have one or more curved edges to reduce the likelihood of arcing when the plasma is formed in the plasma chamber.

In another embodiment, it is desirable to provide a cover ring to surround the edge ring. The cover ring system is further configured to have one or more curved edges to reduce the likelihood of arcing as the plasma is formed within the plasma chamber. Moreover, the width of the cover ring is selected such that the tracking distance along the width contributes to achieving a stand-off voltage at the vertically oriented inner surface of the cover ring. For example, if the radio frequency (RF) voltage is dissipated in the cover ring from about 7 volts (V) (inclusive) to 10 volts per thousand inch of the cover ring, then the vertical of the cover ring A predetermined 5000 volt (V) isolation voltage is achieved at the oriented inner surface, the width of the cover ring corresponding to the tracking distance. The tracking distance is a multiple of the isolation voltage (such as two or three) and the ratio of voltage dissipation per unit length of the cover ring (such as one thousandth of an inch). In some embodiments, the width of the cover ring is the tracking distance provided by the ratio. In another embodiment, the surface length between the edge ring and the ground (eg, along several stepped surfaces) defines the tracking distance.

In an embodiment, it is desirable for the support ring and the edge ring to be fixed relative to the insulator ring positioned below the support ring. Otherwise, any moment of the support ring relative to the insulator ring moves the edge ring on the top of the support ring. Movement of the edge ring is undesirable during processing of the substrate. Any displacement of the support ring during processing of the substrate may result in an undesired process being performed on the substrate, or some undesired portion of the substrate being processed. Furthermore, in order to support or replace the ring or edge ring or both the edge ring and the support ring, it is desirable that the support ring and the edge ring be easily removed.

In some embodiments, an edge ring for a plasma processing chamber is described. The edge ring has an annular body that surrounds the substrate support of the plasma processing chamber. The annular body has a bottom side, a top side, an inner side, and an outer side. The edge ring has a plurality of fastener holes disposed in the annular body along the bottom side. Each fastener aperture has an inner surface for receiving a thread of a fastener for attaching the annular body to the support ring. The edge ring further includes a step disposed on the inner side of the annular body. The step has a lower surface that is separated from the upper surface of the top side by an angled surface. The edge ring has a curved edge formed on a top surface of the top side and an outer side.

In several embodiments, a cover ring for a plasma processing chamber is described. The cover ring has an annular body that surrounds the edge ring and is adjacent to the ground ring. The annular body has an upper body portion, an intermediate body portion, and a lower body portion. The intermediate body portion defines a stepped reduction from the upper body portion such that the intermediate body portion has a first annular width. The lower body portion defines a stepped reduction from the intermediate body portion such that the lower body portion has a second annular width that is less than the first annular width.

In various embodiments, a system for securing an edge ring of a plasma chamber is described. The system includes a support ring with an edge ring oriented thereon. The system further includes a colloidal layer disposed between the bottom surface of the edge ring and the top surface of the support ring. The system also includes a plurality of screws configured to secure the edge ring to the support ring. Each of the plurality of screws is attached to a screw hole disposed within the bottom surface of the edge ring and passing through the support ring. The system also includes a plurality of compression rods coupled to the bottom surface of the support ring. The system includes a plurality of pneumatic pistons. Each of the plurality of pneumatic pistons is coupled to an individual of the plurality of compression rods.

Some of the advantages of the systems and methods described herein include providing an edge ring having one or more non-sharp curved edges. When the plasma is formed within the plasma chamber, sharp edges, such as edges having a 90[deg.] angle, are typically responsible for arcing of RF power. One or more curved edges reduce the likelihood of such arcing.

A further advantage of the system and method includes having the edge ring be provided with one or more slots, such as screw holes, for receiving a fastener such as a screw for coupling the edge ring to the support ring. Even when the adhesion provided by the colloid between the edge ring and the support ring is reduced or the colloid is depleted or the colloid disintegrates due to the force applied to the colloid during the treatment period of the substrate, the coupling of the edge ring and the support ring causes the edge ring to be opposed to the support ring fixed. In addition, the support ring is secured relative to the insulator ring by one or more compression bars. Thus, the edge ring is fixed by the support ring to the insulator ring, and thus the edge ring cannot be displaced during processing of the substrate. Such a lack of displacement reduces (such as avoiding) the possibility of performing any undesired process on the substrate, or reducing the likelihood that an undesired area of the substrate will be processed.

An additional advantage of the system and method includes the provision of one or more mechanisms, such as one or more pneumatic mechanisms, for pulling down or pushing up the support ring by one or more compression rods. Pull-down is performed during processing of the substrate to reduce the likelihood of displacement of the support ring relative to the insulator ring. Thus, due to the pull down, the edge ring and the support ring remain stationary within the plasma chamber during multiple processing operations, such as from processing operations to the other, until they are replaced or removed from the plasma chamber for servicing. Push up to remove the edge ring or support ring for replacement or repair, such as cleaning.

Other advantages of the systems and methods described herein include providing the cover ring with one or more curved edges to reduce the likelihood of arcing as the plasma is formed within the plasma chamber. In addition, the cover ring has an annular width to achieve an isolation voltage at the vertically oriented inner surface of the cover ring as described above.

Other embodiments will be apparent from the following detailed description.

The following embodiments describe systems and methods for securing an edge ring within a plasma chamber. Obviously, embodiments of the invention may be practiced without some or all of these specific details. On the other hand, well-known process operations have not been described in detail to avoid unnecessarily obscuring the embodiments of the present invention.

1 is a diagram of an embodiment of a system 100 to illustrate the manner in which the edge ring 108 is secured to the support ring 112, which is sometimes referred to herein as an adjustable edge sheath (TES) ring. System 100 includes an edge ring 108, a ground ring 114, a base ring 116 (shown below in Figure 9G), an insulator ring 106, a cover ring 118 (shown in Figure 9G below), and a chuck 104. The edge ring 108 is made of a conductive material such as germanium, boron doped single crystal germanium, aluminum oxide, tantalum carbide, or a tantalum carbide layer on top of the aluminum oxide layer, or an alloy of tantalum, or a combination thereof. It should be noted that the edge ring 108 has an annular body such as a circular body, or an annular body, or a disk shaped body. Further, the support ring 112 is made of a dielectric material such as quartz, or ceramic, or aluminum oxide (Al ₂ O ₃ ), or a polymer. As an example, support ring 112 has an inner diameter of about 12.5 inches, an outer diameter of about 13.5 inches, and a thickness of about 0.5 inches along the y-axis. To illustrate, the support ring 112 has an inner diameter ranging from about 12.7 inches (inclusive) to about 13 inches, an outer diameter of from about 13.3 inches (inclusive) to about 14 inches, and from about 0.5 inches (including ) to a thickness of about 0.7 inches. This is just an example size for a plasma chamber for processing 300 mm wafers.

Further, the insulator ring 106 is made of an insulator material such as a dielectric material, and the base ring 116 is also made of a dielectric material. The grounding ring 114 is made of a conductive material. The grounding ring 114 is coupled to a ground potential. An example of the chuck 104 includes an electrostatic chuck. Each of the rings, such as the edge ring 108, the support ring 112, the ground ring 114, the base ring 116, and the insulator ring 106, has an annular shape, such as a ring shape or a disk shape. The cover ring 118 is made of a dielectric material such as molten vermiculite quartz or a ceramic material such as aluminum oxide (Al ₂ O ₃ ) or tantalum oxide (Y ₂ O ₃ ). The cover ring 118 has an annular body such as a disk-shaped or annular annular body.

The bottom surface of the edge ring 108 has a portion P1 coupled to the upper surface of the support ring 112 by a thermally conductive colloid layer 110A to dissipate the heat of the support ring 112 to the edge ring 108. Examples of thermally conductive colloids as used herein include polyimine, polyketone, polyetherketone, polyether oxime, polyethylene terephthalate, fluorinated ethylene-propylene copolymer, cellulose, triacetate ( Triacetates), and silicone. Furthermore, the bottom surface of the edge ring 108 has another portion P2 coupled to the upper surface of the chuck 104 by a thermally conductive colloid layer 110B. In addition, the bottom surface of the edge ring 108 still has another portion P3 positioned above the base ring 116 adjacent to the base ring 116.

The edge ring 108 is threaded over the base ring 116, the support ring 112, and the chuck 104. The bottom surface of the edge ring 108 faces the base ring 116, the support ring 112, and a portion of the chuck 104. The edge ring 108 also surrounds a portion of the chuck 104, such as the top portion PRTN1. The support ring 112 surrounds a portion of the chuck 104 and the insulator ring 106 surrounds another portion of the chuck 104. The base ring 116 surrounds a portion of the insulator ring 106 and the support ring 112. A cover ring 118 surrounds the edge ring 108 and the base ring 116. The ground ring 114 surrounds a portion of the cover ring 118 and the base ring 116. A portion of the cover ring 118 is threaded over the ground ring 114 and the cover ring 118 is disposed adjacent the side of the ground ring 114.

The edge ring 108 has a plurality of edges, such as edge 1, edge 2, edge 3, edge 4, edge 5, and edge 6. Each of the edges 1 to 6 is curved, such as curved. To illustrate, each of the edges 1 through 6 has no acute angle, has a radius, and has a smooth curve. It should be noted that in various embodiments, the radius of each of the edges 1 through 6 is greater than a range from about 0.01 inches to about 0.03 inches. Radius from an edge of from about 0.01 inches to about 0.03 inches reduces the likelihood of edge cracking during fabrication of the semiconductor wafer. Fragmentation produces particles during processing of the semiconductor wafer.

In an embodiment, the edge ring 108 has a plurality of edges. In an embodiment, the edges defining the edge ring 108 are rounded. For example, edge 1 of edge ring 108 is rounded to a radius of about 0.03 inches or greater and preferably greater than 0.07 inches. For purposes of illustration, edge 1 is rounded to have a radius ranging from about 0.03 inches (inclusive) to about 0.1 inch. As another example, the edge 1 is rounded to have a radius ranging from about 0.07 inches (inclusive) to about 0.1 inch. Since the edge 1 of the edge ring 108 is close to the ground ring 114, the edge 1 of the edge ring 108 is particularly susceptible to arcing. Due to the increased power level used in the plasma processing operation, a high electric field will be created between the edge ring 108 and the ground ring 114. The rounding of the edge 1 reduces the likelihood of such an arc discharge. It has been determined that the lower rounding of these edges may not be sufficient to prevent or reduce the likelihood of arcing of RF power when the plasma chamber is in operation. Affected by the sharper edge of the plasma chamber, the reduced likelihood of arcing can be detrimental to manufacturing processes performed on and above the semiconductor wafer. Slight edge rounding (e.g., from about 0.01 inch (inclusive) to about 0.03 inch edge 1) helps to reduce the likelihood of particle generation during fabrication of the semiconductor wafer, or edge cracking during fabrication. Thus, although some rounding is performed on the surface of a feature (e.g., edge 1) disposed within the plasma chamber, the degree of rounding is less than that used in view of the increased power level used in the plasma processing operation. Prevent or reduce the degree of rounding of the arc discharge.

When the plasma is formed in the plasma chamber in which the system 100 is located, the curved edges 1 to 6 reduce the likelihood of chipping or arcing. It should be noted that the edge 5 is less rounded than the edge 1 to reduce the likelihood of plasma ions entering the gap between the edge 5 and the chuck 104. For example, the radius of the edge 5 is lower than the radius of the edge 1. As an example, the edge ring 108 has an outer diameter ranging from about 13.6 inches (inclusive) to about 15 inches along the x-axis. As another example, the edge ring 108 has an outer diameter ranging from about 13 inches to about 15 inches. As yet another example, the edge ring 108 has a thickness of about 0.248 inches as measured along the y-axis. To illustrate, the thickness of the edge ring 108 ranges from about 0.24 inches (including) to about 0.256 inches. The x-axis is perpendicular to the y-axis. As the outer diameter of the edge ring 108 increases, the distance between the outer side surface of the edge 1 adjacent the edge ring 108 and the cover ring 118 decreases. When the plasma is formed in the plasma chamber, the reduction in distance reduces the likelihood of arcing of the RF power between the edge ring 108 and the cover ring 118.

The edge ring 108 includes a plurality of slots, such as slots 125, formed in the bottom surface of the edge ring 108. An example of a groove in the edge ring is a screw hole. Each slot surrounds a fastener aperture, such as fastener aperture 124A. The fastener holes do not extend completely along the y-axis along the length of the edge ring 108 to form a through hole in the edge ring 108. A plurality of fastener holes are formed in the bottom surface of the edge ring 108. An example of a fastener hole is a screw hole having a helical thread for receiving a screw. The groove 125 has a top surface TS and a side surface SS. The top surface TS and the side surface SS are surfaces formed by drilling into the bottom surface of the edge ring 108. The side surface SS is substantially perpendicular to the top surface TS. For example, the side surface SS is at an angle relative to the top surface TS, such as forming an angle ranging between 85 degrees and 95 degrees. As another example, the side surface SS is perpendicular to the top surface TS. The top surface TS partially surrounds the fastener holes 124A and the side surfaces SS partially surround the fastener holes 124A.

Additionally, a through hole 132A is formed in the support ring 112 for receiving a fastener 122, such as a screw or bolt or pin. Similarly, additional vias such as vias 132A are formed at other locations within the support ring 112 to accommodate a plurality of fasteners, such as fasteners 122, as described herein for coupling the support ring 112 to the edge ring. . For example, three through holes are formed in the support ring 112 at the vertices of an equilateral triangle in the horizontal plane along the x-axis. As another example, six or nine through holes are formed within the support ring 112, and the distance between a set of adjacent through holes is substantially equal (such as equal to or within predetermined limits) to another set of adjacent ones. The distance between the through holes. It should be noted that the adjacent through holes of the set have at least one of the at least one through hole and at least one of the other adjacent through holes.

The fastener 122 is made of a metal such as an alloy of steel, aluminum, steel, or an alloy of aluminum. The through hole 132A is formed to conform to the shape of the fastener 122. For example, the fastener 122 has a head that is larger in diameter than the body of the fastener 122. The lower portion of the through hole 132A is made to have a diameter that is slightly larger than the head of the fastener 122, such as a fraction of a millimeter (mm). Again, the upper portion of the through hole 132A is fabricated to have a diameter that is slightly larger (such as a fraction of a millimeter) than the body of the fastener 122. Moreover, the diameter of the fastener holes 124A is made slightly larger than the threaded portion of the fastener 122, such as a fraction of a millimeter. Further, a space is formed along the y-axis between the top surface TS of the groove 125 and the tip end of the fastener 122. Examples of spaces range from about 0 mm (inclusive) to a gap 1 of about 1 mm. Another example of gap 1 ranges from about 0 mm (inclusive) to about 0.5 mm. Yet another example of gap 1 ranges from about 0 mm (inclusive) to about 0.25 mm. The space of the gap 1 is in the vertical direction along the y-axis. The space between the top surface TS of the slot 125 and the threaded portion of the fastener 122 ranges from about 0 mm (inclusive) to about 0.5 mm to reduce the likelihood of arcing of RF power in the space. If arcing occurs, the fasteners 122 may melt due to the heat generated by the arcing.

The fastener 122 is inserted into the through hole 132A such that the head and main system of the fastener 122 are positioned within the support ring 112, while the threaded portion of the fastener 122 is inserted into the fastener hole 124A formed in the edge ring 108. A space (such as gap 2) formed between the side surface of the fastener 122 and the inner side surface of the support ring 112 ranges from about 0 mm (inclusive) to about 0.2 mm.

The support ring 112 has an electrode EL embedded therein for receiving radio frequency (RF) power of an RF signal received from an auxiliary RF generator via an auxiliary match, such as an impedance matching circuit.

In some embodiments, the support ring 112 is a coupling loop.

In many embodiments, the fastener 122 is made of plastic.

In some embodiments, instead of the conductive colloid layer, a double sided conductive tape having conductive colloids on both sides is used. In many embodiments, instead of a conductive colloid layer, interstitial beads with conductive colloids are used.

In some embodiments, instead of a fastener hole having a plurality of threads, the fastener holes described herein within the bottom surface of the edge ring are fitted with inserts, such as metal sleeves. To illustrate, the metal sleeve is screwed to a groove formed in the bottom surface of the edge ring. The insert has a thread in its inner surface. The fasteners are then screwed to the threads of the insert instead of being screwed to the threaded fastener holes.

2 is a diagram of an embodiment of system 200 to illustrate the coupling of power pin 208 to support ring 112. System 200 includes edge ring 228, cover ring 201, ground ring 114, insulator ring 106, base ring 210, device board 224, chuck 104, support ring 112, braid 218, and insulator wall 230. The insulator wall 230 is as described herein as the wall of the biasing shroud of the plasma chamber. The insulator ring 106 is fixed relative to the insulator wall 230, such as non-movable. The grounding ring 114 is uncoated. Edge ring 228 is sometimes referred to herein as a hot edge ring (HER). The edge ring 228 is made of the same material as the edge ring 108 of Figure 1, except that the edge ring 228 has a different shape than the edge ring 108. As an example, the edge ring 228 has an outer diameter ranging from about 13.6 inches (including) to about 15 inches along the x-axis. As another example, the edge ring 228 has an outer diameter ranging from about 13 inches to about 15 inches. As yet another example, the edge ring 228 has a thickness of about 0.248 inches as measured along the y-axis. To illustrate, the thickness of the edge ring 228 ranges from about 0.24 inches (including) to about 0.256 inches. A plurality of fastener holes of FIG. 1, such as fastener holes 124A, are formed within edge ring 228 to secure edge ring 228 to support ring 112.

Further, the cover ring 201 is made of the same material as the cover ring 118 of FIG. 1 except that the cover ring 201 has a different shape than the cover ring 118. The cover ring 201 has an annular body such as a disk-shaped or annular annular body. A portion of the cover ring 201 is tied above the ground ring 114 and adjacent to the ground ring 114, while another portion of the cover ring 201 is located adjacent the base ring 210 and above the base ring 210. Similarly, the base ring 210 is made of the same material as the base ring 116 of FIG. 1, except that the base ring 210 has a different shape than the base ring 116.

A portion P5 of the edge ring 228 is coupled to the support ring 112 by a colloid layer 110C to dissipate the support ring 112 toward the edge ring 228. Similarly, another portion P4 of the edge ring 228 is coupled to a portion of the chuck 104 by a colloid layer 110C. The edge ring 228 surrounds the top portion PRTN1 of the chuck 104. In addition, another portion P6 of the edge ring 228 is adjacent a portion of the top surface of the base ring 210. Additionally, the cover ring 201 surrounds the edge ring 228. The support ring 112 is positioned below the edge ring 228 and surrounds a portion of the chuck 104. The insulator ring 106 is positioned below the support ring 112 and around the bottom portion of the chuck 104. The base ring 210 is positioned below the cover ring 201 and around a portion of the insulator ring 106. The ground ring 114 surrounds a portion of the insulator ring 106 and the base ring 210. The braid 218 is positioned below the insulator ring 106. The insulator wall 230 is positioned below a portion of the insulator ring 106 and below the ground ring 114. The insulator wall 230 is made of an insulator material.

The power pin feedthrough portion 206 is inserted through a through hole in the insulator ring 106 and a hole formed in the support ring 112. The power pin feedthrough 206 is a sleeve made of an insulator such as plastic or ceramic to protect the power pin 208. The power pin 208 is located within the power pin feedthrough 206. Power pin 208 is a conductive rod made of a metal such as aluminum or steel for conducting RF power to electrode EL within support ring 112 or support ring 112. The tip end of the power pin 208 is in contact with the electrode EL to supply RF power to the electrode EL. The intermediate portion of the power pin feedthrough 206 is wrapped within a mount 216A made of an insulator material.

The O-ring 214 is positioned above the mount 216A and adjacent the mount 216A to seal the mount 216A against the power pin feedthrough 206. The O-ring 214 surrounds the bottom portion of the power pin feedthrough 206. An example of an O-ring described herein is a ring made of a metal such as aluminum or steel. In addition, another O-ring 204 is seated in the top portion of the power pin feedthrough 206 to prevent air between the power pin 208 and the power pin feedthrough 206 from entering the plasma within the plasma chamber containing the system 200 therein. . There is no vacuum between the power pin 208 and the power pin feedthrough 206. The O-ring 204 surrounds the top portion of the power pin feedthrough 206.

It should be noted that in some embodiments, multiple power pins are used. For example, two power pins are used to provide power to the electrodes EL at a plurality of locations, and the power pins can be connected to the power pin feeds, the O-rings surrounding the respective bottom portions of the power pin feedthroughs, and around The O-rings of the respective top portions of the power pin feedthroughs are used together.

The stand-off RF voltage is generated from the RF power of the RF signal received from the auxiliary RF generator via the auxiliary matching. The isolated RF voltage has a traceable distance 213 from the vertically oriented inner surface 203 of the cover ring 201 to the ground ring 114. The isolated RF voltage is generated via a traceable distance 213 from the vertically oriented inner surface 203 to the ground ring 114. It should be noted that in some embodiments, the annular width of the cover ring 201 is selected such that the traceable distance 213 between the edge ring 228 and the ground ring 114 is sufficient to lose less than a predetermined amount of RF voltage from the edge ring 228 to the ground ring 114. . For example, if the predetermined amount of isolation voltage to be reached at the vertically oriented inner surface 203 of the cover ring 201 is 5000 volts (V), and the cover ring 201 per thousandth of an inch is dissipated by 7 and 10 volts. Between the voltages, the annular width of the cover ring 201 is selected such that the traceable distance 213 or the annular width is a multiple of 5,000 volts (such as two or three times) and a ratio of 10 volts. To illustrate, the ratio is (2 x 5000)/10 volts. The traceable distance 213 is in the x-y plane of the cross section of the cover ring 201. The x-y plane is formed by the x-axis and the y-axis and is tied between the x-axis and the y-axis.

In some embodiments, a plurality of power pin feedthroughs are coupled to the support ring 112 to provide RF power. Each power pin feedthrough has a power pin.

In some embodiments, the ground ring 114 is coated with a conductive material such as alumina to increase the conductivity of the ground ring 114.

In various embodiments, the colloid layer 110C is placed at a plurality of locations along the lower surface of the edge ring 228 and along the support ring 112 and the upper surface of the chuck 104 to be between the edge ring 228 and the support ring 112 and Electrical and thermal conductivity is provided between the edge ring 228 and the chuck 104.

FIG. 3A is a diagram of an embodiment of system 300. Each of the hold down rods 302A and 302B is inserted through each of the bottom surfaces 308 of the support ring 112. For example, the compression rod 302A is inserted into the first groove in the bottom surface 308 at the position L1 to secure the support ring 112 to the insulator ring 106 at the position L1. Similarly, the compression rod 302B is inserted into the second groove in the bottom surface 308 at the position L2 to secure the support ring 112 to the insulator ring 106 at the position L2. As another example, each of the compression bars 302A and 302B have threads at their top portions and the threads match the threads of the respective grooves formed in the bottom surface 308. As yet another example, each of the compression bars 302A and 302B has a spring-based retractable and extendable mechanism that retracts prior to insertion into the respective slots in the bottom surface 308 and extends after insertion.

It should be noted that the size of each of the through holes formed along the length measured by the y-axis of the support ring 112 varies with the outer diameter (OD) and the inner diameter (ID) of the support ring 112. The inner diameter of the support ring 112 varies with the diameter of the chuck 104 of Figures 1 and 2.

In various embodiments, any number of compression rods, such as two or more than two, are used to couple to the support ring 112.

3B is an isometric view illustrating the coupling of the compression rod 302A with the bottom surface 308 of the support ring 112. A groove 330 formed in the bottom surface that extends partially along the length of the support ring 112. The length of the support ring 112 is along the y-axis. The tank 330 is equipped with a receiver 332 which is made of a metal such as aluminum or steel or an alloy of titanium or aluminum or an alloy of steel or an alloy of titanium. For example, the receiver 332 is attached to the surface of the slot 330 via an attachment mechanism such as a thread. For further explanation, the slot 330 has threads that engage the threads of the receiver 332. The tip end of the compression rod 302A is inserted into the receiver 332 to engage the receiver 332 to connect the compression rod 302A to the support ring 112.

4 is a side elevational view of an embodiment of a system 900 for securing edge ring 924 and support ring 112 to insulator ring 106. Examples of edge ring 924 include edge ring 108 of FIG. 1 and edge ring 228 of FIG. System 900 includes a fastening mechanism 920A, an insulator ring 106, a support ring 112, and an edge ring 924. The fastening mechanism 920A includes a cylinder 912, a pneumatic piston 922, a threaded adapter 908, a compression connector 906, and a mount 604A for mounting the compression rod 302A to the insulator wall 230. Mount 604A is mounted to insulator wall 230 by a plurality of shoulder screws 902. The fastening mechanism 920A is coupled to a plurality of air fittings 914 that include an air fitting 914A and an air fitting 914B at one side of the fastening mechanism 920A. The fastening mechanism described herein is made of a metal such as steel, aluminum, an alloy of steel, or an alloy of aluminum. Further, the air fitting 914 is also made of a metal such as an alloy of steel, aluminum, steel, or an alloy of aluminum.

The piston 922 has a piston body 916 and a piston rod 918. The piston body 916 is within the cylinder 912. The piston body 916 has a larger diameter than the piston rod 918. The piston body 916 is integral with or attached to the piston rod 918. Mount 604A is attached to cylinder 912 by a plurality of screws 910 at the top surface of cylinder 912. The threaded adapter 908 is inserted into the central opening 930 of the mount 604A. The threaded adapter 908 is fitted into a groove formed in the top surface of the piston rod 918. Additionally, the threaded adapter 908 has a slot for fitting the press connector 906 within the slot. The press connector 906 is fitted with a compression rod 302A that is inserted through the central opening 930 of the mount 604A. A press connector 906 is attached to (such as screwed to) the bottom portion of the compression rod 302A.

Similarly, another compression rod 302B (Fig. 3A) is coupled to another pneumatic mechanism of the fastening mechanism 920B, which is described below. For example, the fastening mechanism 920B includes a piston (such as a piston 922) that is coupled to the compression rod 302B to move the compression rod 302B up and down in a vertical direction along the y-axis. The compression rod 302A has a thread 932 at its tip for mating with a corresponding thread 934 of the groove 931 formed in the bottom surface 308 of the support ring 112. The top portion PR1 of the compression rod 302A extends into the groove in the support ring 112 via the bottom surface of the support ring 112, while the intermediate portion PR2 of the compression rod 302A extends through the through hole in the insulator ring 106. Similarly, the top portion of the compression rod 302B extends into a groove in the bottom surface of the support ring 112, and the intermediate portion of the compression rod 302B extends into the through hole in the insulator ring 106.

As described above, the support ring 112 is physically coupled to the edge ring 924 via one or more fasteners. When air is supplied to the lower portion of the cylinder 912 via the air fitting 914B, the pressure is generated by the air below the lower surface of the piston body 916. Due to the pressure generated below the lower surface of the piston body 916, the piston 922 moves in a vertically upward direction along the y-axis to push the compression rod 302A upward. When the compression rod 302A is pushed up, the support ring 112 is raised in a vertically upward direction with respect to the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also raised in a direction perpendicular to the vertical direction away from the insulator ring 106. Support ring 112 and edge ring 924 are pushed away from insulator ring 106 in a vertically upward direction for removal of support ring 112 and edge ring 924 from the plasma chamber. Support ring 112 and edge ring 924 are removed for replacement or repair of support ring 112, or edge ring 924, or a combination thereof.

On the other hand, when air is supplied to the upper portion of the cylinder 912 via the air fitting 914A, the pressure is generated by the air above the upper surface of the piston body 916. Due to the pressure generated above the upper surface of the piston body 916, the piston 922 moves in a vertically downward direction along the y-axis to pull the compression rod 302A downward. When the compression rod 302A is pulled down, the support ring 112 is pulled downward in a vertically downward direction relative to the insulator ring 106. Simultaneously with the support ring 112, the edge ring 924 is also pulled downward toward the insulator ring 106 in a vertically downward direction. During processing of the substrate placed on the chuck 104, the support ring 112 and the edge ring 924 are pulled downward toward the insulator ring 106 for processing of the substrate placed on the chuck 104.

Figure 5 is an isometric view of an embodiment of the fastening mechanism 920A. Shown in Figure 5 is one of the screws 910 and the mount 604A.

FIG. 6A is a diagram of an embodiment of system 1100 for illustrating simultaneous pull-down of multiple compression bars 302A and 302B (FIG. 3A). System 1100 includes an air route 1102A, a fastening mechanism 920A, a fastening mechanism 920B, and a fastening mechanism 920C. The fastening mechanisms 920B and 920C have the same structure and function as the fastening mechanism 920A. As an example, each of the fastening mechanisms 920A to 920C has a double-acting cylinder. The fastening mechanism 920B is coupled to the compression rod 302B by a mount, and the fastening mechanism 920C is coupled to the compression rod by a mount.

The air route has a plurality of tubes as described herein, each of which is made of an insulator material, such as a combination of plastic and plasticizer, or plastic. The air path is flexible and can be coupled to the upper or lower portion of the fastening mechanism 920A-920C.

Air route 1102A includes a plurality of tubes 1106A, 1106B, 1106C, 1106D, and 1106E. Tubes 1106A and 1106D are connected to tube 1106B by connector C1, while tubes 1106B and 1106E are connected to tube 1106C by connector C2. Each of the connectors connecting the plurality of tubes described herein has a hollow space to allow air passage through the hollow space. As an example, each connector that connects a plurality of tubes is made of an insulator material.

Tube 1106D is coupled to upper portion 1104A of fastening mechanism 920A by air fitting 914A (Fig. 4). Similarly, tube 1106E is coupled to upper portion 1104C of fastening mechanism 920B by an air fitting (such as air fitting 914A), while tube 1106C is coupled to upper portion 1104E of fastening mechanism 920C by an air fitting, such as air fitting 914A.

Air is supplied to the upper portion 1104A of the fastening mechanism 920A via the tube 1106A, the connector C1, and the tube 1106D. Similarly, air is supplied to the upper portion 1104C of the fastening mechanism 920B via the tube 1106A, the connector C1, the tube 1106B, the connector C2, and the tube 1106E. Further, air is supplied to the upper portion 1104E of the fastening mechanism 920C via the tube 1106A, the connector C1, the tube 1106B, the connector C2, and the tube 1106C. When air is supplied to the upper portions 1104A, 1104C, and 1104E, the pistons of the fastening mechanisms 920A-920C are pulled down synchronously (such as simultaneously) along the y-axis to cause the support ring 112 (Fig. 4) and the edge ring 924 (Fig. 4) toward The insulator ring 106 (Fig. 4) moves.

As described below, there are a plurality of cartridge seals around the power pin 208, the compression bars 302A and 302B, and the temperature probe shaft. These cylindrical seals exert a force on the support ring 112 in a vertically upward direction along the y-axis. The fastening mechanism 920A-920C overcomes the upward force in a vertically upward direction to prevent the support ring 112 from rising upward relative to the chuck in the vertical direction. In addition, the fastening mechanisms 920A-920C apply a clamping force to the colloid layers 110B and 110C (Figs. 1 and 2) between the edge ring 924 and the chuck 104. The double acting cylinder exerts a constant force on the support ring 112 that is unaffected by the temperature of the support ring 112 in a vertically upward direction or in a vertically downward direction.

Figure 6B is a diagram of an embodiment of system 1150 for illustrating simultaneous push-up of multiple compression bars 302A and 302B (Figure 3A). System 1150 includes an air route 1102B, a fastening mechanism 920A, a fastening mechanism 920B, and a fastening mechanism 920C.

Air route 1102B includes a plurality of tubes 1106F, 1106G, 1106H, 1106I, and 1106J. Tubes 1106F and 1106I are connected to tube 1106G by connector C3, while tubes 1106G and 1106J are connected to tube 1106H by connector C4. Tube 1106I is coupled to lower portion 1104B of fastening mechanism 920A by air fitting 914B (Fig. 4). Similarly, tube 1106J is coupled to lower portion 1104D of fastening mechanism 920B by an air fitting (such as air fitting 914B), while tube 1106H is coupled to lower portion 1104F of fastening mechanism 920C by an air fitting such as air fitting 914B.

Air is supplied to the lower portion 1104B of the fastening mechanism 920A via the tube 1106F, the connector C3, and the tube 1106I. Similarly, air is supplied to the lower portion 1104D of the fastening mechanism 920B via the tube 1106F, the connector C3, the tube 1106G, the connector C4, and the tube 1106J. Further, air is supplied to the lower portion 1104F of the fastening mechanism 920C via the tube 1106F, the connector C3, the tube 1106G, the connector C4, and the tube 1106H. When air is supplied to the lower portions 1104B, 1104D, and 1104F, the pistons of the fastening mechanisms 920A-920C are pushed up along the y-axis (such as simultaneously) to push the support ring 112 (Fig. 4) and the edge ring 924 (Fig. 4). Move away from the insulator ring 106 (Fig. 4).

7 is a block diagram of an embodiment of system 1200 to illustrate the supply of air to fastening mechanisms 920A through 920C. System 1200 includes a plurality of air compressors 1202A and 1202B, a plurality of air pressure regulators 1204A and 1204B, a plurality of apertures 1206A and 1206B, air routes 1102A and 1102B, and fastening mechanisms 920A-920C. The air compressor 1202A is coupled to the upper portions of the fastening mechanisms 920A through 920C by a regulator 1204A and an orifice 1206A and an air path 1102A. Similarly, air compressor 1202B is coupled to the lower portions of fastening mechanisms 920A through 920C by regulator 1204B and orifice 1206B and air path 1102B.

Air compressor 1202A compresses air to produce compressed air. The compressed air is supplied to the air pressure regulator 1204A. The air pressure regulator 1204A controls (such as changes) the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air having a predetermined air pressure to the upper portion of the fastening mechanism 920A via the orifice 1206A and the air route 1102A. . An example of a predetermined air pressure described herein is an air pressure of 28 pounds per square inch (psi). Other examples of predetermined air pressures as described herein are air pressures ranging between 25 psi and 31 psi.

Similarly, air compressor 1202B compresses air to produce compressed air. The compressed air is supplied to the air pressure regulator 1204B. The air pressure regulator 1204B controls (such as changes) the pressure of the compressed air to a predetermined air pressure, and supplies the compressed air having a predetermined air pressure to the lower portion of the fastening mechanism 920B via the orifice 1206B and the air route 1102B. .

FIG. 8A is an isometric view of an embodiment of an edge ring 228. The edge ring 228 has a top surface 1604. FIG. 8A illustrates a perspective view of a plurality of fastener apertures 124A, 124B, and 124C formed within the bottom surface 1612 of the edge ring 228.

In some embodiments, any other number of fastener holes, such as six or nine fastener holes, are formed in the bottom surface 1612 for fitting the same number of fasteners within the respective holes. For example, the distance between two adjacent apertures forming a set within the bottom surface 1612 of the edge ring 228 is between the two adjacent apertures of another set formed within the bottom surface 1612 of the edge ring 228. The distance is the same. To illustrate, either one of the two adjacent apertures of the set is identical or different than one of the two adjacent apertures of the other set.

FIG. 8B is a top view of an embodiment of an edge ring 228. The edge ring 228 has an inner diameter ID1 and an outer diameter OD1. The outer diameter OD1 ranges from about 13.6 inches (inclusive) to about 15 inches. As another example, the outer diameter OD1 ranges from about 13.6 inches (inclusive) to about 16 inches. As yet another example, the outer diameter OD1 ranges from about 12 inches (inclusive) to about 18 inches. When the outer diameter OD1 exceeds 13.6 inches (such as greater than 14 inches or nearly 15 inches), the likelihood of arcing of RF power between the edge ring 228 and the cover ring 118 is reduced. The inner diameter ID1 is the diameter of the inner circumference of the edge ring 228, and the outer diameter OD1 is the diameter of the outer circumference of the edge ring 228. Top surface 1604 is visible in a top view of edge ring 228.

Figure 8C is a cross-sectional view of edge ring 228 along the A-A cross-section depicted in Figure 8B. The edge ring 228 has a top surface 1604 (sometimes referred to herein as the top side) and a bottom surface 1612 (which is sometimes referred to herein as the bottom side). The top surface 1604 and the bottom surface 1612 are each a horizontally oriented surface. Top surface 1604 is sometimes referred to herein as the top side. The edge ring 228 further has an inner surface 1620 (sometimes referred to herein as the inner side) and an outer surface 1614 (which is sometimes referred to herein as the outer side). The outer surface 1614 is a vertically oriented surface. It should be noted that the edge ring 228 has an annular body such as a circular body, or an annular body, or a disk shaped body.

The edge ring 228 has a step 1622 that includes an angled inner surface 1606 and a horizontally oriented inner surface 1608. The angled inner surface 1606 forms an angle A2 that is about 15 or about 50 relative to the vertically oriented inner surface 1610. In an embodiment, the angle A2 ranges between about 5° and about 55°. In another embodiment, the angle A2 ranges between about 12° and about 20°. In yet another embodiment, the angle A2 ranges between about 10° and about 20°. The angled inner surface 1606 is contiguous with the top surface 1604. For example, the angled inner surface 1606 forms a radius R3 relative to the top surface 1604. To illustrate, the radius R3 is a maximum of about 0.01 inches. For example, a curve having a radius R3 is formed between the angled inner surface 1606 and the top surface 1604. As an example, radius R3 ranges from about 0.009 inches (inclusive) to about 0.011 inch.

The horizontally oriented inner surface 1608 is contiguous with the angled inner surface 1606. For example, the horizontally oriented inner surface 1608 forms a radius R4 with respect to the angled inner surface 1606. To illustrate, the radius R4 is about 0.032 inches. For example, a curve having a radius R4 is formed between a horizontally oriented inner surface 1608 and an angled inner surface 1606. As an example, radius R4 ranges from about 0.003 inches (inclusive) to about 0.0034 inches. The intermediate diameter (MD) of the edge ring 228 at the location where the radius R4 is formed is about 11.858 inches. For example, the intermediate diameter ranges from about 11.856 inches (inclusive) to about 11.86 inches.

The horizontally oriented surface system as described herein is substantially parallel to the x-axis, while the vertically oriented surface system as described herein is substantially parallel to the y-axis. For example, the horizontally oriented surface forms an angle ranging from -5° to +5° with respect to the x-axis, while the vertically oriented surface forms an angle ranging from -5° to +5° with respect to the y-axis. To illustrate, the horizontally oriented surface is parallel to the x-axis and perpendicular to the y-axis, while the vertically oriented surface is parallel to the y-axis and perpendicular to the x-axis. An angled surface as described herein is a non-vertically oriented surface that is also not a horizontally oriented surface.

The horizontally oriented inner surface 1608 is separated from the top surface 1604 by an angled inner surface 1606. For example, the angled inner surface 1606 is adjacent the top surface 1604 and the horizontally oriented inner surface 1608, but the horizontally oriented inner surface 1608 is not adjacent the top surface 1604.

In addition, inner surface 1620 has a vertically oriented inner surface 1610 that abuts a horizontally oriented inner surface 1608. For example, the vertically oriented inner surface 1610 forms a radius R5 relative to the horizontally oriented inner surface 1608. To illustrate, a curve having a radius R5 is formed between the vertically oriented inner surface 1610 and the horizontally oriented inner surface 1608. As an example, the radius R5 is about 0.012 inches. To illustrate, the radius R5 ranges from about 0.007 inches (inclusive) to about 0.017 inches. The distance d3 of the vertically oriented inner surface 1610 along the y-axis is about 0.0169 inches. For example, the distance d3 ranges from about 0.0164 inches (inclusive) to about 0.0174 inches. The distance of the vertically oriented surface is the length along the y-axis in the vertical direction of the vertically oriented surface. Furthermore, the distance of the horizontally oriented surface is the width of the horizontally oriented surface along the x-axis in the horizontal direction. Furthermore, the distance from the angular surface is measured in the vertical direction along the y-axis. The vertically oriented inner surface 1610 has an inner diameter ID1 of approximately 11.7 inches. For example, the inner diameter ID1 ranges from about 11 inches (inclusive) to about 12.4 inches.

In addition, inner surface 1620 has an angled inner surface 1618 that is angled relative to vertically oriented inner surface 1610 and bottom surface 1612. The angled inner surface 1618 is contiguous with the vertically oriented inner surface 1610. For example, the angled inner surface 1618 forms a radius R6 relative to the vertically oriented inner surface 1610. To illustrate, a curve having a radius R6 is formed between the angled inner surface 1618 and the vertically oriented inner surface 1610. As an example, the radius R6 is about 0.015 inches. To illustrate, the radius R6 ranges from about 0.0149 inches (inclusive) to about 0.0151 inches. Additionally, the angled inner surface 1618 is contiguous with the bottom surface 1612. For example, the angled inner surface 1618 forms a radius R7 relative to the bottom surface 1612. To illustrate, a curve having a radius R7 is formed between the angled inner surface 1618 and the bottom surface 1612. As an example, the radius R7 is about twice the radius R6. To illustrate, radius R6 ranges from about 2 x 0.0149 inches (inclusive) to about 2 x 0.0151 inches.

The angled inner surface 1618 has a length d2 of about 0.035 inches. For example, the length d2 ranges from about 0.0345 inches (inclusive) to about 0.0355 inches. The angled inner surface 1618 forms an angle A1 of about 30° with respect to the vertically oriented inner surface 1610. For example, angle A1 ranges from about 28° to about 32°. It should be noted that the combination of the angled inner surface 1606, the horizontally oriented inner surface 1608, the vertically oriented inner surface 1610, and the angled inner surface 1618 is sometimes referred to herein as the inner side of the edge ring 228.

The outer surface 1614 is contiguous with the bottom surface 1612, such as adjacent to or in connection with the bottom surface 1612. For example, outer surface 1614 forms a radius R2 relative to bottom surface 1612. To illustrate, a curve having a radius R2 is formed between the outer surface 1614 and the bottom surface 1612. As an example, the radius R2 is about 0.012 inches. To illustrate, the radius R2 ranges between 0.0119 inches and 0.0121 inches.

The edge ring 228 includes a curved edge 1616 formed between the top surface 1604 and the outer surface 1614 of the edge ring 228. For example, curved edge 1616 is adjacent to top surface 1604 and outer surface 1614, such as beside top surface 1604 and outer surface 1614. The curved edge 1616 has a radius R1. For example, the radius R1 is about 0.1 inch. To illustrate, the radius R1 ranges between 0.8 inches and 0.12 inches. The curvature of the curved edge 1616 reduces the likelihood of arcing of the RF power between the edge ring 228 and the cover ring 201. Arcing occurs when plasma is formed and maintained within the plasma chamber. Sharp edges increase the likelihood of arcing. The distance d1 of the sum of the height of the curved edge 1616 along the y-axis and the vertical distance along the length of the outer surface 1614 of the y-axis is about 0.23 inches. As an example, the distance d1 ranges from about 0.229 inches (inclusive) to about 0.231 inches. As an example, outer surface 1614 has an outer diameter OD1 of about 14.06 inches and outer diameter OD1 ranges between 13.5 inches and 14.5 inches. It should be noted that the inner or outer diameter or intermediate diameter of the edge ring described herein is formed relative to the central axis through the center of mass of the edge ring.

It should be noted that the edge ring systems described herein are consumable. For example, after multiple uses of the edge ring for processing the substrate, the edge ring may be worn out. To illustrate, the residual material is output after processing the plasma of the substrate, and the residual material erodes the edge ring. In addition, the plasma corrodes the edge ring.

In addition, the edge ring is replaceable. For example, after the edge ring is reused, the edge ring is replaced. For purposes of illustration, the edge ring is pushed up vertically away from the insulator ring 106 (FIG. 2) using the compression bars 302A and 302B of FIG. 3A to be released from the insulator ring 106 of FIGS. 1 and 2. The edge ring is then replaced with another edge ring. The other edge rings are then pulled vertically downward toward the insulator ring 106 using the compression bars 302A and 302B for processing the substrate or another substrate.

In some embodiments, each of the radii R1 to R7 of the edge of the edge ring 228 is greater than about 0.03 inches to reduce the likelihood of arcing of RF power toward or away from the edge. To further illustrate, the radii R1 to R7 of the edges of the edge ring 228 range from about 0.03 inches to about 0.1 inch to reduce the likelihood of arcing of RF power toward or away from the edge. It should be noted that in various embodiments, each radius R1 to R7 is greater than a range from about 0.01 inches to about 0.03 inches. A radius from about 0.01 inches to about 0.03 inches reduces the likelihood of edge fragmentation of the radius during fabrication of the semiconductor wafer.

In an embodiment, the edge ring 228 has a plurality of edges. In an embodiment, the edges defining the edge ring 228 are rounded. For example, the edges of edge ring 228 having radii RA and RC (as shown in Figure 9E below) are rounded to a radius of about 0.03 inches or more. It has been determined that the lower rounding of these edges may not be sufficient to prevent or reduce the likelihood of arcing of RF power when the plasma chamber is in operation. Affected by the sharper edge of the plasma chamber, the reduced likelihood of arcing can be detrimental to manufacturing processes performed on and above the semiconductor wafer. Slight edge rounding (e.g., less than about 0.03 inches of radius RA and RC (as shown in Figure 9E below), each radius RA and RC (as shown in Figure 9E below) ranges from about 0.01 inches (inclusive) Up to about 0.03 inches) helps to reduce the likelihood of particle generation during manufacturing of semiconductor wafers or edge cracking during fabrication. Thus, although some rounding is performed on the surface of features (e.g., radii RA and RC (as shown in Figure 9E below)) disposed within the plasma chamber, in view of the increased power levels used in plasma processing operations Precisely, this degree of rounding is less than the degree of rounding used to prevent or reduce arcing.

FIG. 8D is a diagram of an embodiment of system 1650 to illustrate the coupling of fastener 122 to edge ring 228. The cross-sectional view of the edge ring 228 is taken along the cross section a-a shown in Figure 8A. A slot 125 is drilled into the bottom surface 1612 of the edge ring 228. In addition to drilling the groove 125, the thread 1652 is formed on the side surface SS of the groove 125. The side surface SS is substantially vertical, such as perpendicular to the top surface TS of the slot 125 or between 85 and 95. The slot 125 surrounds the fastener aperture 124A.

The fastener 122 has a thread 1654 formed at the tip end of the fastener 122. Additionally, the fastener 122 has a body 1658 below the thread 1654. The head 1660 of the fastener 122 is positioned below the body 1658.

The fastener 122 is inserted into the fastener hole 124A and rotated in a clockwise direction to engage the thread 1654 with the thread 1652 to connect the support ring 112 (FIG. 1) with the edge ring 228. Similarly, additional fasteners, such as fasteners 122, are inserted into the plurality of fastener holes 124B and 124C to connect the support ring 112 with the edge ring 228. A plurality of fastener holes 124B and 124C are formed in respective slots in the bottom surface 1612 of the edge ring 228. For example, the fastener holes 124A-124C form vertices of an equilateral triangle in the horizontal plane of the bottom surface 1612 of the edge ring 228. Where more than three fastener holes are formed in the bottom surface 1612, the fastener holes are tied at substantially equal (such as equal) distances. For example, the distance between one set of two adjacent fastener holes in the bottom surface 1612 is the same as the distance between another set of two adjacent fastener holes in the bottom surface 1612. When at least one of the set of fastener holes is not identical to one of the other set of fastener holes, the two sets of fastener holes are different from the other set of two fastener holes. To illustrate, two different sets of fastener holes have at least one unusual fastener hole. As another example, within the bottom surface 1612, the distance between the two adjacent fastener apertures of the set is within a predetermined limit of the distance between the other two adjacent fastener apertures. When the support ring 112 is coupled to the edge ring 228 and the edge ring 228 or support ring 112 is moved, the edge ring 228 and the support ring 112 move simultaneously in a vertical direction along the y-axis or in a horizontal direction along the x-axis.

FIG. 9A is an isometric view of an embodiment of a cover ring 202. In some embodiments, a cover ring 202 is used in place of the cover ring 201 of FIG. The cover ring 202 has a top surface 1704. It should be noted that the cover ring described herein is consumable. For example, after using the cover ring multiple times during processing of the substrate, the cover ring may be worn out. For the sake of illustration, since the substrate is treated by plasma, residual material is generated and the residual material erodes the cover ring. In addition, the plasma corrodes the cover ring.

In addition, the cover ring is replaceable. For example, after reusing the cover ring, replace the cover ring. To illustrate, the cover ring is removed from the plasma chamber for replacement with another cover ring.

FIG. 9B is a bottom view of an embodiment of a cover ring 202. The cover ring has a bottom surface 1705.

Figure 9C is a top view of an embodiment of a cover ring 202. The cover ring 202 has an inner diameter ID2 and a width W1. The inner diameter ID2 is the diameter of the inner circumference of the cover ring 202. The width W1 is the width of the annular body of the cover ring 202 between the inner diameter ID2 and the outer diameter of the cover ring 202.

Figure 9D is a cross-sectional view of an embodiment of a cover ring 202 taken along section A-A of Figure 9C. The cover ring 202 has a vertically oriented inner surface 1724, another vertically oriented inner surface 1720, a vertically oriented outer surface 1716, another vertically oriented outer surface 1714, and a vertically oriented outer surface 1710. The diameter of the vertically oriented inner surface 1724 is ID2. The diameter ID2 is approximately 13.615 inches. For example, diameter ID2 ranges from about 13.4 inches (inclusive) to about 13.8 inches. Additionally, the diameter of the vertically oriented inner surface 1720 is D1. The diameter D1 is about 13.91 inches. For example, the diameter D1 ranges from about 13.8 inches (inclusive) to about 14 inches. Additionally, the diameter of the vertically oriented outer surface 1716 is D2. The diameter D2 is about 14.21 inches. For example, the diameter D2 ranges from about 14 inches (inclusive) to about 14.5 inches. The diameter of the vertically oriented outer surface 1714 is D3 and the diameter of the vertically oriented outer surface 1710 is OD2. The diameter D3 is about 14.38 inches. For example, diameter D3 ranges from about 14.2 inches (inclusive) to about 14.5 inches. The diameter OD2 is about 14.7 inches. For example, the diameter OD2 ranges from about 14 inches (inclusive) to about 15 inches.

The diameter D1 is greater than the diameter ID2. Further, the diameter D2 is larger than the diameter D1, and the diameter D3 is larger than the diameter D2. The diameter OD2 is greater than the diameter D3.

Figure 9E is a cross-sectional view of an embodiment of a cover ring 202. The cover ring 202 includes an upper body portion 1730, an intermediate body portion 1732, and a lower body portion 1734. The upper body portion 1730 has a vertically oriented outer surface 1710, a horizontally oriented outer surface 1712, another horizontally oriented inner surface 1722, a vertically oriented inner surface 1724, and a horizontally oriented top surface 1704. Curved edge 1706 is formed between vertically oriented outer surface 1710 and top surface 1704. The curved edge 1706 has a radius RC of about 0.06 inches. For example, the radius RC ranges from about 0.059 inches (inclusive) to about 0.061 inches. The curved edge 1706 is contiguous with the top surface 1704 and the vertically oriented outer surface 1710, such as with or adjacent to the top surface 1704 and the vertically oriented outer surface 1710.

The vertically oriented outer surface 1710 is contiguous with the horizontally oriented outer surface 1712. For example, a curve having a radius RD is formed between the vertically oriented outer surface 1710 and the horizontally oriented outer surface 1712. The radius RD is about 0.015 inches. For example, the radius RD ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Additionally, the horizontally oriented inner surface 1722 is contiguous with the vertically oriented inner surface 1724. For example, a curve having a radius RK is formed between the vertically oriented inner surface 1724 and the horizontally oriented inner surface 1722. To illustrate, the radius RK is about 0.015 inches. As an example, the radius RK ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Additionally, top surface 1704 is contiguous with vertically oriented inner surface 1724. For example, a curve having a radius RA is formed between the vertically oriented inner surface 1724 and the top surface 1704. To illustrate, the radius RA is about 0.015 inches. As an example, the radius RA ranges from about 0.0145 inches (inclusive) to about 0.0155 inches. Radius RA reduces the likelihood of arcing of RF power between cover ring 202 and edge ring 228. Arcing occurs during the formation of plasma in the plasma chamber.

The intermediate body portion 1732 includes a vertically oriented inner surface 1720, a vertically oriented outer surface 1714, and a horizontally oriented outer surface 1719. The vertically oriented outer surface 1714 is contiguous with the horizontally oriented outer surface 1712 of the upper body portion 1730. For example, a curve having a radius RE is formed between the vertically oriented outer surface 1714 and the horizontally oriented outer surface 1712. As an example, the radius RE is about 0.03 inches. To illustrate, the radius RE ranges from about 0.029 inches (inclusive) to about 0.31 inches.

In addition, the vertically oriented inner surface 1720 is contiguous with the horizontally oriented inner surface 1722 of the upper body portion 1730. For example, a curve having a radius RB is formed between the horizontally oriented inner surface 1722 and the vertically oriented inner surface 1720. As an example, the radius RB is about 0.01 inches. To illustrate, the radius RB ranges from about 0.09 inches (inclusive) to about 0.011 inch.

The horizontally oriented outer surface 1719 is contiguous with the vertically oriented outer surface 1714. For example, a curve having a radius RF is formed between a horizontally oriented outer surface 1719 and a vertically oriented outer surface 1714. As an example, the radius RF is about 0.015 inches. To illustrate, the radius RF ranges from about 0.0145 inches (inclusive) to about 0.0155 inches.

Lower body portion 1734 includes a vertically oriented inner surface 1736, a bottom surface 1718, and a vertically oriented outer surface 1716. The vertically oriented inner surface 1736 is contiguous with the vertically oriented inner surface 1720 of the intermediate body portion 1732. For example, vertically oriented inner surfaces 1720 and 1736 are integrated as one surface and have the same diameter D1 (Fig. 9D). The vertically oriented inner surface 1736 is contiguous with the bottom surface 1718. For example, a curve having a radius RJ is formed between the vertically oriented inner surface 1736 and the bottom surface 1718. As an example, the radius RJ is about 0.02 inches. To illustrate, the radius RJ ranges from about 0.019 inches (inclusive) to about 0.021 inches.

The vertically oriented outer surface 1716 is contiguous with the bottom surface 1718. For example, a curve having a radius RH is formed between the bottom surface 1718 and the vertically oriented outer surface 1716. As an example, the radius RH is about 0.02 inches. To illustrate, the radius RH ranges from about 0.019 inches (inclusive) to about 0.021 inches.

The vertically oriented outer surface 1716 is contiguous with the horizontally oriented outer surface 1719 of the intermediate body portion 1732. For example, a curve having a radius RG is formed between the vertically oriented outer surface 1716 and the horizontally oriented outer surface 1719. For example, the radius RG is about 0.01 inches. To illustrate, the radius RG ranges from about 0.09 inches (inclusive) to about 0.011 inches.

A vertical distance dB, such as a distance along the y-axis, is formed between the horizontally oriented inner surface 1722 and the top surface 1704. As an example, the vertical distance dB is about 0.27 inches. To illustrate, the vertical distance dB ranges from about 0.25 inches (inclusive) to about 0.29 inches.

Further, a vertical distance dA is formed between the horizontally oriented outer surface 1712 and the horizontally oriented inner surface 1722. As an example, the distance dA is about 0.011 inch. To illustrate, the distance dA ranges from about 0.009 inches (inclusive) to about 0.013 inches.

Moreover, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented outer surface 1719 is dD. As an example, the distance dD is about 0.172 inches. To illustrate, the distance dD ranges from about 0.17 inches (inclusive) to about 0.174 inches.

Moreover, the vertical distance between the horizontally oriented inner surface 1722 and the horizontally oriented bottom surface 1718 is represented as dC. As an example, the distance dC is about 0.267 inches. To illustrate, the distance dC ranges from about 0.265 inches (inclusive) to about 0.269 inches.

It should be noted that the bottom surface 1705 of the cover ring 202 includes a horizontally oriented inner surface 1722, vertically oriented inner surfaces 1720 and 1736, a bottom surface 1718, a vertically oriented outer surface 1716, a horizontally oriented outer surface 1719, and a vertically oriented outer surface 1714. And a horizontally oriented outer surface 1712.

It should further be noted that all of the edges of the cover ring 202 are curved, such as curved. For example, the radii RA, RB, RC, RD, RE, RF, RG, RH, RJ, and RK define the edges of the arc.

9F is a cross-sectional view of an embodiment of a system including edge ring 228, cover ring 202, base ring 210, and ground ring 212. A stepped reduction 1726 is formed that includes a change in direction from a vertically oriented inner surface 1724 to a vertically oriented inner surface 1720. The stepped reduction portion 1726 is in a horizontal direction along the x-axis, such as the +x or x-direction. The stepped reduction portion 1726 is between the upper body portion 1730 and the intermediate body portion 1732. The stepped reduction 1726 is in the +x direction away from the edge ring 228.

In addition, another stepped reduction 1729 is formed that occurs from the vertically oriented outer surface 1710 to the vertically oriented outer surface 1714. Again, the stepped reduction portion 1729 is in the horizontal direction, such as the -x direction of the x-axis, except that the stepped reduction portion 1729 is in a direction opposite to the stepped reduction portion 1726. The stepped reduction portion 1729 is in the direction toward the edge ring 228.

A depth 1762 is formed that is the distance from the horizontally oriented inner surface 1722 to the horizontally oriented outer surface 1719 of the intermediate body portion 1732. The depth as used herein is in the direction of the y-axis, such as the -y direction.

In addition, another stepped reduction 1728 is formed from a vertically oriented outer surface 1714 to a vertically oriented outer surface 1716. The stepped reduction portion 1728 is in the -x direction.

Another depth 1764 is formed between the horizontally oriented outer surface 1719 and the bottom surface 1718 of the lower body portion 1734. Depth 1764 is the depth of the lower body portion 1734. It should be noted that the depth 1764 is less than the depth 1762. Moreover, the depth of the vertically oriented inner surface 1724 is greater than the depth 1762.

An annular width 1746 is created between the vertically oriented inner surface 1720 and the vertically oriented outer surface 1714. The annular width as used herein is along the x-axis. In addition, another annular width 1754 is created between the vertically oriented inner surface 1736 and the vertically oriented outer surface 1716. The annular width 1754 is less than the annular width 1746.

Traceable distance 1735 is between edge ring 228 and ground ring 212. The traceable distance 1735 is the width L11 of the horizontally oriented inner surface 1722, the combined length L12 of the vertically oriented inner surfaces 1720 and 1736, the width L13 of the bottom surface 1718, the length L14 of the vertically oriented outer surface 1716, and the horizontal orientation. The outer surface 1719 has a width L15. The combined length L12 is the sum of the length of the vertically oriented inner surface 1720 and the length of the vertically oriented inner surface 1736. The traceable distance 1735 is the path along which the voltage received from the RF power pin 208 is dissipated along the cover ring 202. The edge ring 228 acts as a capacitor plate for the capacitor and the electrode EL (Fig. 2) acts as another capacitor plate for the capacitor, with the dielectric material of the support ring 112 being between the two capacitor plates. The horizontal distance between the edge ring 228 and the ground ring 212 along the x-axis of the 1 series is used to dissipate the voltage provided by the RF power pin 208.

The traceable distance 1735 or distance 1 defines the annular width of the cover ring 202. In addition, the voltage dissipation along the traceable distance 1735 or distance 1 defines the annular width of the cover ring 202. The annular width of the cover ring 202 is the difference between the inner diameter ID2 of the cover ring 202 and the outer diameter OD2 of the cover ring 202. The annular width of the cover ring 202 is defined such that a predetermined amount of isolated voltage is achieved at the vertically oriented inner surface 1724. For example, the ring width of the cover ring 202 is equal to 7-10 volts that are dissipated along the thousandth of an inch of the cover ring 202 and the isolated voltage is 5000 volts at the vertically oriented inner surface 1724. The ratio of the multiple of 5000 volts (such as two or three times) to the dissipation of 7-10 volts per one thousandth of the lap ring 202.

In some embodiments, the depth 1764 is greater than the depth 1762. Moreover, in various embodiments, the depth of the vertically oriented inner surface 1724 is less than the depth 1762.

9G is a cross-sectional view of an embodiment of a system including edge ring 108, cover ring 118, base ring 116, and ground ring 114. The cover ring 118 includes an upper body portion 1761, an intermediate body portion 1763, and a lower body portion 1765.

The upper body portion 1761 includes a vertically oriented inner surface 1782, a horizontally oriented top surface 1766, a vertically oriented outer surface 1768, and a horizontally oriented outer surface 1770. The vertically oriented outer surface 1768 is contiguous with the top surface 1766, while the horizontally oriented outer surface 1770 is contiguous with the vertically oriented outer surface 1768. For example, a curve having a radius is formed between the vertically oriented outer surface 1768 and the top surface 1766, and a curve having a radius is formed between the horizontally oriented outer surface 1770 and the vertically oriented outer surface 1768. Additionally, the vertically oriented inner surface 1782 is contiguous with the top surface 1766. For example, a curve having a radius is formed between the vertically oriented inner surface 1782 and the top surface 1766.

The intermediate body portion 1763 includes a vertically oriented outer surface 1772, a vertically oriented inner surface 1780, and a horizontally oriented inner surface 1781. The vertically oriented outer surface 1772 is contiguous with the horizontally oriented outer surface 1770 of the upper body portion 1761. For example, a curve having a radius is formed between the vertically oriented outer surface 1772 and the horizontally oriented outer surface 1770.

In addition, the vertically oriented inner surface 1780 is contiguous with the vertically oriented inner surface 1782, such as adjacent the vertically oriented inner surface 1782. To illustrate, the vertically oriented inner surface 1782 is in the same vertical plane as the vertically oriented inner surface 1780.

The horizontally oriented inner surface 1781 is contiguous with the vertically oriented inner surface 1780. For example, a curve having a radius is formed between the horizontally oriented inner surface 1781 and the vertically oriented inner surface 1780.

Lower body portion 1765 includes a vertically oriented outer surface 1774, a horizontally oriented bottom surface 1776, and a vertically oriented inner surface 1778. The vertically oriented inner surface 1778 is contiguous with the horizontally oriented inner surface 1781 of the intermediate body portion 1763. For example, a curve having a radius is formed between the vertically oriented inner surface 1778 and the horizontally oriented inner surface 1781.

Additionally, the bottom surface 1776 is contiguous with the vertically oriented inner surface 1778. For example, a curve having a radius is formed between the bottom surface 1776 and the vertically oriented inner surface 1778.

Additionally, the bottom surface 1776 is contiguous with the vertically oriented outer surface 1774. For example, a curve having a radius is formed between the bottom surface 1776 and the vertically oriented outer surface 1774. The vertically oriented outer surface 1774 is in the same vertical plane as the vertically oriented outer surface 1772 of the intermediate body portion 1763.

The stepped reduction 1783 is formed between the vertically oriented outer surface 1768 of the upper body portion 1761 and the vertically oriented outer surface 1772 of the intermediate body portion 1763. The stepped reduction portion 1783 is in the -x direction toward the edge ring 108.

In addition, another stepped reduction 1784 is formed from the vertically oriented inner surface 1780 of the intermediate body portion 1763 to the horizontally oriented inner surface 1781 of the intermediate body portion 1763. The stepped reduction 1784 from the vertically oriented inner surface 1780 occurs in the +x direction away from the x-axis of the edge ring 108.

An annular width 1786 is formed between the vertically oriented inner surface 1780 of the intermediate body portion 1763 and the vertically oriented outer surface 1772. The annular width 1786 is along the x-axis. In addition, another annular width 1788 is formed between the vertically oriented inner surface 1778 of the lower body portion 1765 and the vertically oriented outer surface 1774. The annular width 1788 is along the x-axis. The annular width 1788 is less than the annular width 1786.

The depth 1790 of the intermediate body portion 1763 along the y-axis is formed from a horizontally oriented outer surface 1770 to a horizontally oriented inner surface 1781. In addition, another depth 1792 of the lower body portion 1765 along the y-axis is formed from the horizontally oriented inner surface 1781 to the bottom surface 1776. The depth 1792 is less than the depth 1790.

It should be noted that the bottom surface of the cover ring 118 includes surfaces 1781, 1778, 1776, 1774, 1772, and 1770.

A traceable distance 1794 is formed between the edge ring 108 and the ground ring 114. Traceable distance 1794 is along the following: depth L21 of the inner surface 1780 oriented vertically along the y-axis, width L22 of the inner surface 1781 oriented horizontally along the x-axis, depth L23 of the vertically oriented inner surface 1778, and bottom The width of the surface 1776 is L24. The depth L23 is the same as the depth 1792. The traceable distance 1794 is the path along which the voltage received by the edge ring 108 reaches the ground ring 114 via the support ring 112. The edge ring 108 acts as a capacitor plate for the capacitor and the electrode EL (Fig. 2) acts as another capacitor plate for the capacitor, with the dielectric material of the support ring 112 being between the two capacitor plates.

A distance 2 along the x-axis is formed between the edge ring 108 and the ground ring 114. The distance 2 is smaller than the distance 1 of Figure 9F. Because the outer diameter of the edge ring 228 of FIG. 9F is less than the outer diameter of the edge ring 108, the upper body portion 1730 of the cover ring 202 of FIG. 9F has a greater width than the body portion 1761 above the cover ring 118. The increase in the width of the body portion 1730 over the width of the upper body portion 1761 increases the distance 1 from the distance 2. The larger distance 1 compensates for the reduced width of the edge ring 228 compared to the edge ring 108 to provide a predetermined amount of distance for the RF voltage of the RF signal supplied by the power pin 208 (FIG. 2) to pass the traceable distance 213. (Fig. 2) or 1735 (Fig. 9F) traverse to ground ring 212. For example, a cover ring of one thousandth of an inch has a loss of about 7 to about 10 volts. If a predetermined isolation voltage of 5000 V is reached at the vertically oriented inner surface of the body portion above the cover ring, the annular width of the body portion above the cover ring is calculated as (positive real number X 5000) / (per thousand points) One of the volts of the ring of the British ring), where "positive real number" is a multiple, such as 2 or 3 or 4.

In some embodiments, the depth 1792 is greater than the depth 1790.

The embodiments described herein can be implemented using a number of computer system configurations including handheld hardware units, microprocessor systems, microprocessor-based or programmable consumer electronics, mini computers, large computers, and the like. . The embodiments can also be practiced in a decentralized computing environment in which tasks are performed by remote processing hardware units that are linked through the network.

In some embodiments, the controller described herein is part of a system that may be part of the above examples. Such systems include semiconductor processing equipment including processing tools or complex processing tools, chambers or complex chambers, platforms or complex platforms for processing, and/or specific processing elements (wafer pedestals, airflow systems, etc.). These systems are integrated with electronic devices that control the operation of these systems before, during, and after processing semiconductor wafers or substrates. Electronic equipment is referred to as a "controller" that controls many components or sub-portions of a system or complex system. Depending on the processing needs and/or type of system, the controller is programmed to control any of the processes disclosed herein, including: delivery of process gases, temperature settings (eg, heating and/or cooling), pressure settings, vacuum settings, power settings , RF generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operational settings, access to a tool and other transfer tools and/or load locks coupled or interfaced with the system Round transfer.

Broadly speaking, in many embodiments, the controller is defined as having a plurality of integrated circuits, logic, memory, and/or software having receiving instructions, issuing instructions, controlling operations, enabling cleaning operations, enabling endpoint measurements, and the like. Electronic equipment. The integrated circuit includes a die in the form of firmware for storing program instructions, a digital signal processor (DSP), a chip defined as an ASIC, a PLD, and/or one or more microprocessors or micro-executing program instructions (eg, software). Controller. The program instructions are instructions that communicate with the controller in a number of individual settings (or program files) that define parameters, factors, variables, etc. for the particular process to be performed on the semiconductor wafer or system. In some embodiments, the program instructions are part of a recipe defined by a process engineer to one or more layers, materials, metals, oxides, germanium, germanium dioxide, surfaces, circuits, and/or wafers. One or more processing steps are completed during the fabrication of the die.

In some embodiments, the controller is part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller is in whole or in part of the "cloud" or fab host computer system, allowing remote access to wafer processing. The computer may allow remote access to the system to monitor the current progress of the manufacturing operation, check the history of past manufacturing operations, check trends or performance metrics from the complex manufacturing operations, to change the currently processed parameters to set the current operation Processing steps or new processes.

In some embodiments, a remote computer (eg, a server) provides a process recipe to the system via a network that includes a regional network or an internet network. The remote computer includes a user interface that allows for input and programming of parameters and/or settings that are then passed from the remote computer to the system. In some examples, the controller receives instructions in the form of data that explicitly specifies parameters, factors, and/or variables of various processing steps to be performed during one or more operations. It should be understood that the parameters, factors, and/or variables are specific to the type of process to be executed and the type of tool to which the controller is configured or controlled. Thus, as noted above, the controller is decentralized, such as by including one or more distributed controllers that are networked together and work toward a common purpose, such as the process and control described herein. . An example of a decentralized controller for such purposes includes one or more integrated circuits in a chamber that communicate one or more integrated at a remote end (such as at the platform level or as part of a remote computer) Circuitry, combined to control the process in the chamber.

Without limitation, in various embodiments, example systems employing such methods include plasma etch chambers or modules, deposition chambers or modules, spin-running chambers or modules, metal plating chambers, or Modules, cleaning chambers or modules, bevel etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) a chamber or module, an atomic layer etch (ALE) chamber or module, a plasma enhanced chemical vapor deposition (PECVD) chamber or module, a cleaning type chamber or module, an ion implantation chamber or mode Groups, track chambers or modules, and any other semiconductor processing system associated with or used in the manufacture and/or manufacture of semiconductor wafers.

Further note that in some embodiments, the above operations can be applied to some types of plasma chambers, such as: plasma containing inductively coupled plasma (ICP) reactors, transformer coupled plasma reactors, conductor tools, dielectric tools. a chamber; a plasma chamber containing an electron cyclotron resonance (ECR) reactor, and the like. For example, one or more RF generators are coupled to an inductor within the ICP reactor. Examples of the shape of the inductor include a solenoid, a dome coil, a flat coil, and the like.

As described above, the host computer communicates with one or more of the following according to a process step or a plurality of process steps to be performed by the tool: other tool circuits or modules, other tool components, group tools, other tool interfaces, adjacent tools, adjacent Tools, tools located throughout the plant, host computer, another controller, or tools for material transfer, such tools for material transfer carry wafer containers into and out of the tool location within the semiconductor manufacturing facility and/or Load side.

After considering the above embodiments, it should be understood that some embodiments use a number of computer-available operations involving data stored in a computer system. These operations are physical quantities of physical manipulation. Any of the operations described herein that form part of these embodiments are useful mechanical operations.

Some embodiments are also directed to hardware units or devices for performing these operations. This equipment is specially constructed for special purpose computers. When defined as a special purpose computer, the computer performs other processing, program execution or routines that are not part of a special purpose, but can still operate for a particular purpose.

In some embodiments, the operations are performed by a computer that is selectively activated or configured by one or more computer programs stored in computer memory, cache memory, or via a computer network. . When the data is obtained through a computer network, the data can be processed by other computers (such as cloud computing resources) on the computer network.

One or more embodiments can also be fabricated as computer readable code on a non-transitory computer readable medium. The non-transitory computer readable medium stores any data stored in a hardware unit (eg, a memory device, etc.), which is then read by a computer system. Examples of non-transitory computer readable media include hard disk, network attached storage (NAS), ROM, RAM, compact disk ROM (CD-ROM), recordable compact disc (CD-R), readable and writable optical disc (CD-RW), magnetic tape and other optical and non-optical data storage hardware units. In some embodiments, the non-transitory computer readable medium comprises computer readable physical media distributed over a network coupled computer system such that the computer readable code is stored and executed in a distributed manner.

Although the above method operations are described in a particular order, it should be understood that in various embodiments, other housekeeping operations are performed between operations, or that the method operations are adjusted such that the operations occur at slightly different points in time, Or dispersed in a system that allows such method operations to occur within various time intervals, or in a different order than described above.

It should be further noted that in an embodiment, one or more features from any of the above embodiments are combined with one or more features of any other embodiment without departing from the various embodiments described in the present disclosure. range.

Although the above-described embodiments have been described in some detail for the purpose of clarity, it will be apparent that various changes and modifications may be made within the scope of the appended claims. Therefore, the present embodiments are to be considered as illustrative and not restrictive

100‧‧‧ system

104‧‧‧ chuck

106‧‧‧Insulator ring

108‧‧‧Edge ring

110A‧‧‧colloid layer

110B‧‧‧colloid layer

110C‧‧‧colloid layer

112‧‧‧Support ring

114‧‧‧ Grounding ring

116‧‧‧Foundation

118‧‧‧ Cover ring

122‧‧‧fasteners

124A‧‧‧ fastener holes

124B‧‧‧ fastener holes

124C‧‧‧ fastener holes

125‧‧‧ slots

132A‧‧‧through hole

200‧‧‧ system

201‧‧‧ Cover ring

202‧‧‧ Cover ring

203‧‧‧ inner surface

204‧‧‧O-ring

206‧‧‧Power Supply and Communication Department

208‧‧‧Power pin

210‧‧‧Base ring

212‧‧‧ Grounding ring

213‧‧‧ Traceable distance

214‧‧‧O-ring

216A‧‧‧ Mounting Block

218‧‧‧钵

224‧‧‧ equipment board

228‧‧‧Edge ring

230‧‧‧Insulator wall

300‧‧‧ system

302A‧‧‧ compression rod

302B‧‧‧ compression rod

308‧‧‧ bottom surface

330‧‧‧ slot

332‧‧‧ Receiver

604A‧‧‧ Mounting Block

900‧‧‧ system

902‧‧‧ shoulder screw

906‧‧‧Press connector

908‧‧‧Thread Adapter

910‧‧‧ screws

912‧‧‧ cylinder

914‧‧‧Air fittings

914A‧‧‧Air Accessories

914B‧‧‧Air Accessories

916‧‧‧ piston body

918‧‧‧Piston rod

920A‧‧‧ fastening mechanism

920B‧‧‧ fastening mechanism

920C‧‧‧ fastening mechanism

922‧‧‧Piston

924‧‧‧Edge ring

930‧‧‧ center opening

931‧‧‧ slot

932‧‧‧ thread

934‧‧‧Thread

1100‧‧‧ system

1102A‧‧‧Air route

1102B‧‧‧Air route

1104A‧‧‧ upper

1104B‧‧‧ lower

1104C‧‧‧Upper

1104D‧‧‧ lower

1104E‧‧‧Upper

Lower part of 1104F‧‧

1106A‧‧‧ tube

1106B‧‧‧ tube

1106C‧‧‧ tube

1106D‧‧‧ tube

1106E‧‧‧ tube

1106F‧‧‧ tube

1106G‧‧‧ tube

1106H‧‧‧ tube

1106I‧‧‧ tube

1106J‧‧‧ tube

1150‧‧‧ system

1200‧‧‧ system

1202A‧‧ Air Compressor

1202B‧‧ Air Compressor

1204A‧‧‧Regulator

1204B‧‧‧Regulator

1206A‧‧ ‧ mouth

1206B‧‧ ‧ orifice

1604‧‧‧ top surface

1606‧‧‧ inner surface

1608‧‧‧ inner surface

1610‧‧‧ inner surface

1612‧‧‧ bottom surface

1614‧‧‧ outer surface

1616‧‧‧Bent edges

1618‧‧‧ inner surface

1620‧‧‧ inner surface

1622‧‧‧ steps

1650‧‧‧System

1652‧‧‧Thread

1654‧‧‧Thread

1658‧‧‧ Subject

1660‧‧‧ head

1704‧‧‧ top surface

1705‧‧‧ bottom surface

1706‧‧‧Bent edges

1710‧‧‧ outer surface

1712‧‧‧ outer surface

1714‧‧‧ outer surface

1716‧‧‧ outer surface

1718‧‧‧ bottom surface

1719‧‧‧ Exterior surface

1720‧‧‧ inner surface

1722‧‧‧ inner surface

1724‧‧‧ inner surface

1726‧‧‧Stepped Reduction Department

1728‧‧‧Stepped Reduction Department

1729‧‧‧Stepped Reduction Department

1730‧‧‧ upper body part

1732‧‧‧Intermediate body part

1734‧‧‧The main part

1735‧‧‧ Traceable distance

1736‧‧‧ inner surface

1746‧‧‧ ring width

1754‧‧‧Ring width

1761‧‧‧ upper body part

1762‧‧ depth

1763‧‧‧Intermediate body part

1764‧‧ depth

1765‧‧‧The main part

1766‧‧‧ top surface

1768‧‧‧ outer surface

1770‧‧‧ outer surface

1772‧‧‧ outer surface

1774‧‧‧ outer surface

1776‧‧‧ bottom surface

1778‧‧‧ inner surface

1780‧‧‧ inner surface

1781‧‧‧ inner surface

1782‧‧‧ inner surface

1783‧‧‧Stepped Reduction Department

1784‧‧‧Stepped Reduction Department

1786‧‧‧Ring width

1788‧‧‧Ring width

1790‧‧ depth

1792‧‧ depth

1794‧‧‧ Traceable distance

A1‧‧‧ angle

A2‧‧‧ angle

C1‧‧‧Connector

C2‧‧‧ connector

C3‧‧‧Connector

C4‧‧‧Connector

D1‧‧‧ diameter

D2‧‧‧ diameter

D3‧‧‧diameter

D1‧‧‧ distance

D2‧‧‧ length

D3‧‧‧ distance

dA‧‧‧ distance

Distance from dB‧‧‧

dC‧‧‧Distance

dD‧‧‧ distance

EL‧‧‧electrode

ID‧‧‧ inner diameter

ID1‧‧‧ inner diameter

ID2‧‧‧(inner) diameter

L1‧‧‧ position

L2‧‧‧ position

L11‧‧‧Width

L12‧‧‧ length

L13‧‧‧Width

L14‧‧‧ length

L15‧‧‧Width

L21‧‧ depth

L22‧‧‧Width

L23‧‧‧Deep

L24‧‧‧Width

MD‧‧‧ intermediate diameter

OD‧‧‧outer diameter

OD1‧‧‧ outer diameter

OD2‧‧‧ (outer) diameter

Part P1‧‧‧

P2‧‧‧ part

Part P3‧‧‧

Part P4‧‧‧

P5‧‧‧ part

Part P6‧‧‧

The top part of PR1‧‧

The middle part of PR2‧‧

PRTN1‧‧‧ top part

Radius of R1‧‧

Radius of R2‧‧

Radius of R3‧‧

Radius of R4‧‧

Radius of R5‧‧‧

R6‧‧‧ Radius

Radius of R7‧‧

RA‧‧‧ Radius

RB‧‧‧ Radius

RC‧‧ radius

Radius of RD‧‧‧

RE‧‧‧ Radius

RF‧‧‧ Radius

Radius of RG‧‧

Radius of RH‧‧

Radius of RJ‧‧

RK‧‧ radius

SS‧‧‧ side surface

TS‧‧‧ top surface

W1‧‧‧Width

The embodiments are best understood by reference to the following description in conjunction with the drawings.

1 is a diagram of an embodiment of a system to illustrate the manner in which the edge ring is secured to the support ring.

2 is a diagram of an embodiment of a system to illustrate the coupling of a power pin to a support ring.

3A is a diagram of an embodiment of a system to illustrate the attachment of a plurality of hold down rods to a plurality of locations of a support ring.

Figure 3B is an isometric view illustrating the coupling of the compression rod to the bottom surface of the support ring.

4 is a side elevational view of an embodiment of a system for securing an edge ring and a support ring to an insulator ring.

Figure 5 is an isometric view of an embodiment of a fastening mechanism.

Figure 6A is a diagram of an embodiment of a system for illustrating simultaneous pull-down of a compression rod.

Figure 6B is a diagram of an embodiment of a system for illustrating simultaneous push-up of a compression rod.

Figure 7 is a block diagram of an embodiment of a system to illustrate the supply of air to a plurality of fastening mechanisms.

Figure 8A is an isometric view of an embodiment of an edge ring.

Figure 8B is a top plan view of an embodiment of the edge ring of Figure 8A.

Figure 8C is a cross-sectional view of the edge ring of Figure 8B.

Figure 8D is a diagram of an embodiment of the system to illustrate the coupling of the fastener to the edge ring of Figure 8A.

Figure 9A is an isometric view of an embodiment of a cover ring.

Figure 9B is a bottom plan view of the embodiment of the cover ring of Figure 9A.

Figure 9C is a top plan view of the embodiment of the cover ring of Figure 9A.

Figure 9D is a cross-sectional view of the embodiment of the cover ring of Figure 9C.

Figure 9E is a cross-sectional view of the embodiment of the cover ring of Figure 9A.

Figure 9F is a cross-sectional view of the embodiment of the cover ring of Figure 9A.

Figure 9G is a cross-sectional view of an embodiment of a cover ring.

Claims (30)

An edge ring for a plasma processing chamber, the edge ring having an annular body configured to surround a substrate support of the plasma processing chamber, the edge ring comprising: the annular body having a bottom side a top side, an inner side, and an outer side; a plurality of fastener holes disposed in the annular body along the bottom side, each fastener hole having an inner surface for receiving a thread of a fastener, the fastener being used for The annular body is attached to a support ring; a step disposed on the inner side of the annular body, the step having a lower surface separated from the upper surface of the top side by an angled surface; and a curved edge formed on the The upper surface of the top side is between the side surface of the outer side. An edge ring for a plasma processing chamber according to claim 1 wherein the edge ring is consumable and replaceable. An edge ring for a plasma processing chamber according to claim 1, wherein the inner side has the angled surface, a horizontally oriented surface adjacent the angled surface, and abuts the horizontally oriented surface a vertically oriented surface, wherein the bottom side is horizontally oriented and abuts the outer and the vertically oriented surfaces, wherein the outer side is a vertically oriented surface, wherein the curved edge is adjacent the top side and the outer side. An edge ring for a plasma processing chamber according to claim 1, wherein the substrate holder is a chuck and the support ring is an adjustable edge sheath ring, wherein the bottom side has a first portion and a second portion a portion and a third portion, the first portion being configured to be conductively coupled to the chuck by a conductive gel, the second portion being configured to be conductively coupled to the adjustable edge sheath ring by a conductive gel And the third portion is adjacent to a base ring. The edge ring for a plasma processing chamber of claim 1, wherein the plurality of fastener holes are spaced apart by equal distances on the bottom side. An edge ring for a plasma processing chamber according to claim 1, wherein one of the plurality of fastener holes is formed by a top surface of a groove formed in the bottom side of the edge ring and The side surface of the groove is partially enclosed. An edge ring for a plasma processing chamber according to claim 6 wherein the gap between the top surface of the groove and the fastener is less than one millimeter when the fastener is received in the groove. To reduce the possibility of arcing within the gap. An edge ring for a plasma processing chamber according to claim 1, wherein the edge ring has an outer diameter ranging from about 13.6 inches (about) to about 15 inches, wherein the outer diameter is limited to The outside. An edge ring for a plasma processing chamber according to claim 1, wherein the top side has an outer diameter of more than 13.6 inches and at most 15 inches, to be reduced when a cover ring is disposed adjacent to the outer side The possibility of arcing from the top side to the cover ring. An edge ring for a plasma processing chamber according to claim 1 wherein the curved edge reduces the likelihood of arcing from the curved edge to the cover ring when a cover ring is disposed adjacent the outer side. An edge ring for a plasma processing chamber according to claim 1 wherein all edges of the edge ring are curved. A cover ring for a plasma processing chamber, the cover ring having an annular body configured to surround an edge ring and adjacent to a grounding ring, the cover ring comprising: the annular body having an upper body portion, An intermediate body portion, and a lower body portion, wherein the intermediate body portion defines a stepped reduction from the upper body portion such that the intermediate body portion has a first annular width, wherein the lower body portion defines a step from the intermediate body portion The reduced portion is such that the lower body portion has a second annular width that is less than the first annular width. A cover ring for a plasma processing chamber according to claim 12, wherein the cover ring is consumable and replaceable. A cover ring for a plasma processing chamber according to claim 12, wherein the upper body portion, the intermediate body portion, and the lower body portion provide a path for voltage from the edge ring to the ground ring . A cover ring for a plasma processing chamber according to claim 12, wherein the stepped reduction portion of the intermediate body portion from the upper body portion is in a direction away from the edge ring, and the lower body A portion of the stepped reduction from the intermediate body portion is in a direction toward the edge ring. A cover ring for a plasma processing chamber according to claim 12, wherein the stepped reduction portion of the intermediate body portion from the upper body portion is in a direction toward the edge ring, and the lower body A portion of the stepped reduction from the intermediate body portion is in a direction away from the edge ring. A cover ring for a plasma processing chamber according to claim 12, wherein the intermediate body portion has a first elongated depth and the lower body portion has a second elongated depth. A cover ring for a plasma processing chamber according to claim 12, wherein the upper body portion has a horizontally oriented top surface, a curved edge adjacent the horizontally oriented top surface, adjacent to the curved edge a vertically oriented outer surface, a vertically oriented inner surface abutting the horizontally oriented top surface, a horizontally oriented inner surface abutting the vertically oriented inner surface, and a horizontally oriented outer surface adjacent the vertically oriented outer surface a surface, wherein the intermediate body portion has a vertically oriented inner surface abutting the horizontally oriented inner surface of the upper body portion, wherein the intermediate body portion has an abutment with the horizontally oriented outer surface of the upper body portion a vertically oriented outer surface and a horizontally oriented outer surface abutting the vertically oriented outer surface of the intermediate body portion, wherein the lower body portion has a vertical orientation adjacent the horizontally oriented outer surface of the intermediate body portion An outer surface, a horizontally oriented bottom surface abutting the vertically oriented outer surface of the lower body portion, and The horizontal portion of the body adjacent to the vertical orientation of the bottom surface and the intermediate body portion of an inner surface oriented vertically oriented inner surface. A cover ring for a plasma processing chamber according to claim 18, wherein the upper body portion is between the vertically oriented outer surface of the upper body portion and the horizontally oriented outer surface of the upper body portion. Having a second curved edge, wherein the upper body portion has a third curved edge between the horizontally oriented top surface of the upper body portion and the vertically oriented inner surface of the upper body portion, wherein the upper body portion is A fourth curved edge is formed between the vertically oriented inner surface of the upper body portion and the horizontally oriented inner surface of the upper body portion. A cover ring for a plasma processing chamber according to claim 19, wherein the intermediate body portion is between the horizontally oriented outer surface of the upper body portion and the vertically oriented outer surface of the intermediate body portion. Having a fifth curved edge, wherein the intermediate body portion has a sixth curved edge between the horizontally oriented inner surface of the upper body portion and the vertically oriented inner surface of the intermediate body portion, wherein the intermediate body portion is A seventh curved edge is formed between the vertically oriented outer surface of the intermediate body portion and the horizontally oriented outer surface of the intermediate body portion. A cover ring for a plasma processing chamber according to claim 20, wherein the lower body portion is between the horizontally oriented outer surface of the intermediate body portion and the vertically oriented outer surface of the lower body portion. Having an eighth curved edge, wherein the lower body portion has a ninth curved edge abutting the vertically oriented outer surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion, wherein the lower body portion is A tenth curved edge is formed between the vertically oriented inner surface of the lower body portion and the horizontally oriented bottom surface of the lower body portion. A cover ring for a plasma processing chamber according to claim 12, wherein the inner edge of the cover ring is curved to reduce the likelihood of arcing between the inner edge and the edge ring. A cover ring for a plasma processing chamber according to claim 12, wherein all edges of the cover ring are curved. A system for securing an edge ring of a plasma chamber, comprising: a support ring; an edge ring oriented above the support ring; a colloid layer disposed on a bottom surface of the edge ring and a top surface of the support ring a plurality of screws configured to fix the edge ring to the support ring, each of the plurality of screws being attached to a screw hole disposed in the bottom surface of the edge ring and passing through the support ring; a tension rod coupled to the bottom surface of the support ring; and a plurality of pneumatic pistons, each of the plurality of pneumatic pistons coupled to the individual of the plurality of compression rods. A system for securing an edge ring of a plasma chamber according to claim 24, wherein the plurality of pneumatic piston systems are configured to apply a pull-down force to the plurality of compression rods such that one of the substrates in the plasma chamber The edge ring and the support ring are secured to an insulator ring during processing. A system for securing an edge ring of a plasma chamber according to claim 24, wherein the plurality of pneumatic pistons are configured to push the plurality of compression rods upward to remove the edge from the plasma chamber The ring and the support ring are for maintenance. The system for fixing an edge ring of a plasma chamber according to claim 24, further comprising: an insulator ring disposed under the support ring; and a plurality of fastening mechanisms configured to have the plurality of compression bars, Wherein each of the plurality of compression bars has a portion extending within the support ring and a portion extending within the insulator ring, wherein each of the plurality of fastening mechanisms is configured to individually define the plurality of compression bars Pulling down the support ring and the edge ring to the insulator ring during the processing operation in the plasma chamber, and pushing the support ring and the edge ring relative to the insulator ring to release the support ring and The edge ring. A system for securing an edge ring of a plasma chamber according to claim 27, wherein each of the plurality of fastening mechanisms comprises: a cylinder; a piston body in the cylinder; attached to the a piston rod of the piston body; and a mounting seat configured to mount one of the plurality of compression rods relative to the cylinder. A system for securing an edge ring of a plasma chamber according to claim 28, further comprising: an air path configured to supply compressed air to a top portion of the cylinder to pull the plurality of compression rods downward; And an air route configured to supply compressed air to the bottom portion of the cylinder to push the plurality of compression bars up. A system for securing an edge ring of a plasma chamber according to claim 24, wherein the first of the plurality of pneumatic pistons is part of the first fastening mechanism, wherein the second of the plurality of pneumatic pistons a portion of the second fastening mechanism, wherein the third of the plurality of pneumatic pistons is part of a third fastening mechanism, the system further comprising: the second fastening mechanism configured to support the support with the first fastening mechanism Fixing the support ring and the edge ring to the insulator ring at different positions of the ring and the edge ring fixed to an insulator ring; the third fastening mechanism is configured to be in the second fastening mechanism Fixing the support ring and the edge ring to the position of the insulator ring, and at different positions of the first fastening mechanism fixing the support ring and the edge ring to the position of the insulator ring, the support ring and The edge ring is secured to the insulator ring.