TW201928320A - Separated type sensing device improving the accuracy of sensing by separately disposing a sensor and a processor in different housings - Google Patents

Abstract

A separated type sensing device mainly comprises: a sensing unit having a sensing housing and a sensor, wherein the sensor is disposed in the sensing housing; a processing unit having a processing housing and a processor, the processor being disposed in the processing housing; a connecting unit electrically connected between the sensor of the sensing unit and the processor of the processing unit; and a transmitting unit electrically connected between the processor of the processing unit and an external device, By separately disposing the sensor and the processor in different housings, the influence of the processor on the sensor can be reduced, thereby improving the accuracy of sensing.

Description

Separate sensing device

The present invention relates to sensing devices and, more particularly, to a separate sensing device.

Press, generally on the linear transmission component, a sensing device is provided to sense temperature, vibration, torque and the like. However, a general sensing device is mounted on a moving member of a linear transmission component (such as a slider of a linear slide or a nut of a ball screw), and the structure of the sensing device mainly includes a fixed shell, a circuit board, a sensing chip and a processing wafer fixed on the moving member of the linear transmission component, the circuit board being disposed in the fixed housing, the sensing wafer and the processing wafer being fixed on the circuit board Electrically conductive. In this way, the signal measured by the sensing chip can be transmitted to the processing chip for calculation, and the processed chip outputs the calculated value to an end device (such as a computer) to enable the machine operator to Instantly obtain the values of temperature, vibration, torque and the like of the moving piece. However, since the processing wafer generates thermal energy and micro-vibration during operation, the sensing wafers located on the same circuit board are affected, thereby generating sensing errors, thereby reducing the accuracy of sensing.

In view of the above, in order to improve the prior art, the conventional sensing device has a problem that the sensing error is easy to be generated, thereby reducing the accuracy of sensing, and the like. Accordingly, the present invention provides a separate sensing device, which mainly includes There is: a sensing unit having a sensing housing and a sensor, wherein the sensor is disposed in the sensing housing; a processing unit having a processing housing and a processor, the processor a connecting unit is electrically connected between the sensor of the sensing unit and the processor of the processing unit; a transmitting unit is electrically connected to the processor of the processing unit and a processor By interposing the sensor separately from the processor in different housings, the influence of the processor on the sensor can be reduced to improve the accuracy of the sensing.

In order to enable the reviewing committee to have a better understanding and recognition of the features and features of the present invention, the following embodiments are illustrated and described below with reference to the drawings: Referring to the first to third figures, the first preferred embodiment of the present invention The embodiment provides a separate sensing device 100, which mainly includes a sensing unit 10, a processing unit 20, a connecting unit 30 and a transmitting unit 40, wherein: see the first to second figures, the sense The measuring unit 10 has a sensing housing 11 and a sensor 12 . The accommodating housing 11 has a receiving portion 111 and a cover 112. The accommodating portion 111 has a receiving portion 113 and an outer protruding portion 114 from the end of the receiving portion 113. The base 111 is fixed to the moving member 91 of a linear transmission component 90. In the embodiment, the linear transmission component 90 is a ball screw, and the moving component 91 is a nut. The movable component 91 has a recessed on the axial surface thereof. The cover 112 extends into the slot 911, and the cover 112 closes the other end of the receptacle 111. The sensor 12 has a sensing circuit board 121 and a sensing chip 122 is disposed in the sensing housing 11. The sensing chip 122 is disposed on the sensing circuit board 121, and the sensing chip 122 is configured to sense temperature. And the sensing wafer 122 is located in the overhanging portion 114. Referring to the first to second figures, the processing unit 20 has a processing housing 21, a processor 22, and a power module 23. The processing housing 21 is a housing 211 that is opposite to each other. The processor 22 has a processing circuit board 221 and a processing chip 222. The processing circuit board 221 is disposed in the processing housing 21, and the processing chip 222 is The processing module 222 is disposed on the processing circuit board 221 for performing calculations. The power module 23 is disposed on the processing circuit board 221 for adjusting the voltage value. Referring to FIG. 1 to FIG. 2 , the connecting unit 30 is a physical wire electrically connected between the sensing circuit board 121 of the sensing unit 10 and the processing circuit board 221 of the processing unit 20 . The connecting unit 30 transmits the signal measured by the sensing chip 122 to the processing chip 222 for calculation, and the power is transmitted to the sensing chip 122 via the power module 23 by the connecting unit 30. Referring to the first to third figures, the transfer unit 40 is a physical wire electrically connected between the processing circuit board 221 of the processing unit 20 and an external device 99 for transmitting signals and power. The external device 99 can be a computer. Therefore, the above is the introduction of the components of the separate sensing device 100 and the assembly method thereof according to the first preferred embodiment of the present invention, and then the use characteristics thereof are as follows: First, when the present invention is in operation, Power is transmitted from the transmitting unit 40 to the power module 23 of the processing unit 20, and after the voltage is adjusted by the power module 23, the power is transmitted from the connecting unit 30 to the sensing chip 122 of the measuring unit 10. The sensing chip 122 is configured to obtain the power required for operation, and the temperature of the moving member 911 can be sensed, and the obtained temperature signal is transmitted to the processing chip 222 of the processing unit 20 by the connecting unit 30. After the processing, the processed chip 222 transmits the calculated value to the external device 99 through the transmitting unit 40, so that the machine operator can immediately monitor the temperature value of the moving member 91 to smoothly operate. Therefore, in the present invention, the processing wafer 222 and the power module 23 which generate heat energy and vibration are separated from the sensing wafer 122 for sensing temperature, that is, the separation is different on the different circuit boards. The thermal energy and vibration generated by the processing chip 222 and the power module 23 are not affected by the sensing wafer 122, and the sensing accuracy of the sensing wafer 122 can be ensured. According to the experiment of the present invention, the distance between the sensing unit 10 and the processing unit 20 is between 1 cm and 200 cm. In addition, in the above embodiment, the sensing wafer 122 is used to sense temperature, but in fact the sensing wafer can also be used to sense vibration, torsion or other parameters. In the above embodiment, although the connecting unit 30 is a physical transmission line, the connecting unit 30 may actually be a combination of two wireless transmitters, and a wireless transmitter is disposed in the sensing unit 10 for sensing. On the circuit board 121, another wireless transmitter is disposed on the processing circuit board 221 of the processing unit 20 to wirelessly transmit signals and power between the two wireless transmitters, which can achieve the same purpose. Furthermore, in the above embodiment, although the transmitting unit 40 is a physical transmission line, the transmitting unit 40 may actually be a combination of two wireless transmitters, and a wireless transmitter is disposed in the processing circuit of the processing unit 20. On the board 221, another wireless transmitter is disposed on the external device 99 to wirelessly transmit signals and power between the two wireless transmitters, which can also achieve the same purpose. In the above embodiment, the linear transmission component is a ball screw, and the moving component is a nut, but in reality, the linear transmission component may also be a linear slide rail, and the moving component is a slider, which may also Achieve the same purpose. Referring to the fourth and fifth figures, a second embodiment of the present invention provides a separate sensing device 200. The first embodiment includes a sensing unit 50, a processing unit 60, and a connecting unit. 70 and a transfer unit 80, but the main difference between the two is that: in this embodiment, the receiving seat 511 of the sensing housing 51 of the sensing unit 50 is fixed to the radial surface of the moving member 91. The radial surface is recessed with a protruding slot 911 for the extending portion 514 of the receiving seat 511 to extend, and the receiving portion 513 of the extending portion 514 and the receiving portion 511 are separate components. . Although in the present embodiment, the position between the sensing housing 51 and the moving member 91 is different from that of the first embodiment, it can effectively achieve the same purpose. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all of the related art in the art according to the present invention are equivalent to the present invention. The scope of coverage.

"First Embodiment"

100‧‧‧Separate sensing device

10‧‧‧Sensor unit

11‧‧‧Sensor housing

111‧‧‧ 容座

113‧‧‧ 容部

114‧‧‧Extension

112‧‧‧ Cover

12‧‧‧ Sensors

121‧‧‧Sensor board

122‧‧‧Sensor wafer

20‧‧‧Processing unit

21‧‧‧Processing shell

211‧‧‧Outer casing

22‧‧‧ Processor

221‧‧‧Processing board

222‧‧‧Processing wafer

23‧‧‧Power Module

30‧‧‧Link unit

40‧‧‧Transfer unit

90‧‧‧Linear transmission components

91‧‧‧Mobile parts

911‧‧‧ into the slot

99‧‧‧External devices

"Second embodiment"

200‧‧‧Separate sensing device

50‧‧‧Sensor unit

51‧‧‧Sensing housing

511‧‧‧ 容座

513‧‧‧ 容 部

514‧‧‧Extension

60‧‧‧Processing unit

70‧‧‧Link unit

80‧‧‧Transfer unit

91‧‧‧Mobile parts

911‧‧‧ into the slot

The first figure is an exploded perspective view of a first preferred embodiment of the present invention. The second drawing is a perspective assembled view of the embodiment shown in the first figure. The third figure is a schematic structural view of the embodiment shown in the first figure. The fourth drawing is an exploded perspective view of a second preferred embodiment of the present invention. The fifth drawing is a perspective assembled view of the embodiment shown in the fourth figure.

Claims (10)

A separate sensing device, comprising: a sensing unit having a sensing housing and a sensor, wherein the sensor is disposed in the sensing housing; and a processing unit having a processing shell And a processor disposed in the processing housing; a connecting unit electrically connected between the sensor of the sensing unit and the processor of the processing unit; a transmitting unit, electrically Connected between the processor of the processing unit and an external device. The separate sensing device according to claim 1, wherein the sensing housing has a receiving seat and a cover, and the sensor is disposed in the receiving seat, the cover is The accommodating portion has an accommodating portion and an outer protruding portion extending from an end of the accommodating portion. The sensor is located in the protruding portion, and the accommodating seat is disposed The moving member is fixedly connected to the moving member of the linear transmission component, and the moving member is recessed into the extending slot, and the protruding portion extends into the extending slot. The separate sensing device of claim 2, wherein the sensing housing of the sensing unit is fixed to an axial surface of the moving member. The separate sensing device of claim 2, wherein the sensing housing of the sensing unit is fixed to a radial surface of the moving member. The separate sensing device of claim 1, wherein the sensor has a sensing circuit board and a sensing chip, and the sensing circuit board is disposed in the sensing housing, the sensing The chip is disposed on the sensing circuit board, the processor has a processing circuit board and a processing chip, the processing circuit board is disposed in the processing housing, and the processing chip is disposed on the processing circuit board, the processing chip Used to perform calculations. The separate sensing device of claim 5, wherein the sensing chip is configured to sense at least one of temperature, vibration, and torsion. The separate sensing device of claim 5, wherein the processing unit further has a power module disposed on the processing circuit board for adjusting a voltage value. The separate sensing device of claim 1, wherein the connecting unit and the transmitting unit are physical wires for transmitting signals and power. The separate sensing device according to claim 1, wherein the distance between the sensing unit and the processing unit is between 1 cm and 200 cm. The separate sensing device according to claim 1, wherein the connecting unit is a combination of two wireless transmitters, one wireless transmitter is disposed on the sensor of the sensing unit, and the other is The wireless transmitter is disposed on the processor of the processing unit, and the transmitting unit is a combination of two wireless transmitters, one wireless transmitter is disposed on the processor of the processing unit, and the other wireless transmitter is Set on the external device.