TW201925970A - Locking structure and motherboard assembly - Google Patents

Abstract

A motherboard assembly includes a circuit board, a socket, a plurality of assembling plates, a backplane, and a plurality of locking structures. The circuit board has an installation surface, a backside surface, and a plurality of first through holes. The backside surface is opposite to the installation surface. The first through holes are penetrated from the installation surface to the backside surface. The socket is disposed on the installation surface. Each of the assembling plates is disposed on the installation surface and has at least one second through hole which is connected to the first through hole. The backplane is disposed on the backside surface and has a plurality of locking holes which are connected to the first through holes. Each of the locking structures includes a first stud, a pressing block, and a second stud. The two opposite sides of the pressing block are connected to the first stud and the second stud. Wherein, each of the first studs penetrates the second through hole and the first through hole, then locks in the locking hole so that the pressing blocks press the assembling plate. The second studs are used to connect to a dissipation device.

Description

Locking structure and motherboard assembly

The present invention relates to a locking structure and a motherboard assembly, and more particularly to a motherboard assembly having a locking structure having a pressing block.

At present, the motherboard of an electronic device is often provided with an electronic component slot and a plurality of slot fasteners. The electronic component slot is provided with an electronic component, and the electronic component is, for example, an electronic component that generates heat such as a central processing unit. Therefore, the main board is located around the electronic component slot, and a plurality of studs are arranged for the heat dissipating device to be assembled to provide heat dissipation, and one end of the plurality of studs is fastened to the back board by the main board to prevent the main board. bending. The slot fastener is disposed on the motherboard and abuts against the electronic component slot to enhance the strength of the electronic component slot fixed to the motherboard.

The manner in which the slot fasteners are disposed on the motherboard is mostly that the buckles are fastened to the studs of the motherboard through the buckles, so that the buckles press the socket fasteners on the motherboard. However, when assembling the buckle, the operator must use the clamp tool to press the buckle against the surface of the slot fastener and fasten it to the stud, but the assembly of the buckle is difficult to assemble in one place, thus increasing Assembly time. In addition, the operation of the pliers tool can only be done manually, making the assembly process of the buckle difficult to automate, and the assembly efficiency cannot be effectively improved.

On the contrary, when the buckle is disassembled, it is difficult for the buckle to be pulled through the clamp tool, so that the buckle must be manually taken out, which not only increases the disassembly time, but also causes the buckle to be damaged, so that the buckle is removed. The ring cannot be reused.

The invention provides a locking structure and a motherboard assembly, thereby solving the problem that the buckle of the fixed slot fastener in the prior art is difficult to disassemble.

A motherboard assembly for use in a heat sink assembly includes a circuit board, an expansion socket, a plurality of assembled panels, a back panel, and a plurality of locking structures. The circuit board has a setting surface, a back surface and a plurality of perforations, the back surface is opposite to the installation surface, and the perforations are inserted through the back surface from the installation surface. The expansion socket is placed on the setting surface of the circuit board. The plurality of assembled panels each have at least one through hole, and the assembled panels abut against the arrangement faces of the circuit board, and the through holes respectively communicate the through holes. The backboard has a plurality of locking holes, and the backing plate abuts against the back surface of the circuit board, and the locking holes respectively communicate the through holes. Each of the plurality of locking structures includes a first stud, a pressing block and a second stud. The opposite sides of the pressing block respectively connect the first stud and the second stud. The first studs are respectively inserted through the through holes, and the through holes are locked to the lock holes, so that the pressing blocks press the assembled plates, and the second studs are used for the heat sink assembly.

A locking structure disclosed in another embodiment of the present invention includes a first stud, a pressing block and a second stud. The pressing block is connected to one end of the first stud. The second stud is connected to one end of the pressing block facing away from the first stud.

According to the razor disclosed in the above embodiment, one end of the pressing block of the locking structure is connected to the first stud, so that when the locking structure is locked into the backboard through the assembled panel and the circuit board, the pressing is pressed. The block is pressed against the assembled board on the circuit board, so that the assembled board member does not need to be pressed against the circuit board via the buckle, but the process of assembling the assembled board to the circuit board can be simplified, and the time for assembling the assembled board to the circuit board is shortened. And can further meet the needs of automated assembly. In addition, the process of disassembling the assembled panel can be easily removed by loosening the locked first stud.

The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.

Please refer to Figure 1 to Figure 3. 1 is a perspective view showing a combination of a motherboard assembly and a heat sink according to a first embodiment of the present invention. 2 is an exploded view of the motherboard assembly of FIG. 1. 3 is a cross-sectional view of the motherboard assembly of FIG. 1.

The motherboard assembly 10 of this embodiment is used for a heat sink 11 to be assembled. The motherboard assembly 10 includes a circuit board 100, an expansion socket 200, two assembly panels 300, a back panel 400, and a four-lock structure 500.

The circuit board 100 has a mounting surface 110, a back surface 120, and four through holes 130. The back surface 120 is opposite to the installation surface 110, and four perforations 130 extend through the back surface 120 from the installation surface 110.

In the present embodiment, the expansion socket 200 is, for example, a socket of a central processing unit. The expansion socket 200 is disposed on the installation surface 110 of the circuit board 100, and the expansion socket 200 has an outer frame 210 and two buckle slots 220. The two buckle slots 220 are formed by recessing the outer frame 210. The four through holes 130 on the circuit board 100 are respectively located around the outer frame 210 of the expansion socket 200.

The two assembled plates 300 each have two through holes 340. The two assembled plates 300 respectively abut against the setting surface 110 of the circuit board 100, and the four through holes 340 respectively communicate with the four through holes 130. In detail, the two assembled panels 300 each include a flat portion 310 , two recessed portions 320 , and a crimping portion 330 . The two recessed portions 320 are recessed from the flat portion 310 . The four through holes 340 are respectively located in the four recessed portions 320 , and the four recessed portions 320 are stacked on the setting surface 110 of the circuit board 100 . The two crimping portions 330 are respectively protruded from the two flat portions 310, and the two crimping portions 330 are respectively buckled into the two fastening slots 220 of the expansion socket 200, so that the fixing strength of the expansion socket 200 to the circuit board 100 is increased.

In the motherboard assembly 10 of the embodiment, the buckle portion 330 of the assembled panel 300 is buckled into the buckle slot 220 of the expansion socket 200 to increase the strength of the expansion socket 200 fixed on the circuit board 100, which is not used to limit this invention. In other embodiments, the crimping portion of the assembled panel can be disposed without the crimping portion, and the assembled panel can be connected to other electronic components to be mounted above the expansion slot, and the manner in which the expansion socket is fixed to the circuit board is enhanced. It can be modified by screwing or welding.

The backplane 400 has four locking holes 410, the backing plate 400 abuts against the back surface 120 of the circuit board 100, and the four locking holes 410 respectively communicate with the four through holes 130.

Each of the four locking structures 500 includes a pressing block 510 , a first stud 520 and a second stud 530 . Each of the pressing blocks 510 has an end surface 511 , a first pressing surface 512 and a second pressing surface 513 . The first abutting surface 512 and the second abutting surface 513 both face the end surface 511 , and the second abutting surface 513 surrounds the first abutting surface 512 . The distance L1 from the first abutting surface 512 to the end surface 511 is greater than the distance L2 from the second abutting surface 513 to the end surface 511. That is to say, the shape of the pressing block 510 has a step design. The first stud 520 is connected to a central area of the first abutting surface 512 to expose the peripheral area. The second stud 530 is coupled to the end surface 511. Each of the first studs 520 has an external thread 521, and each of the second studs 530 has a screw hole 531.

Next, the assembly process of the motherboard assembly 10 will be described. Please refer to FIG. 1 to FIG. 3 again. First, the two assembled panels 300 are stacked on the circuit board 100, and the four through holes 340 of the second assembled panel 300 are respectively aligned with the four through holes 130 on the circuit board 100, and the crimping portion 330 is buckled into the expansion socket 200. Buckle 220. Then, the back plate 400 is abutted against the back surface 120 of the circuit board 100, and the four locking holes 410 of the back plate 400 are respectively aligned with the through holes 130 of the circuit board 100, and the four locking structures 500 respectively pass through the four through holes. The hole 340 and the four through holes 130 are locked in the four locking holes 410, so that the first pressing surface 512 of each pressing block 510 is pressed against the circuit board 100, and the second pressing surface 513 is pressed and assembled. The recessed portion 320 of the plate member 300 causes the circuit board 100 and the assembled panel member 300 to be pressed and fixed between the pressing block 510 of each of the locking structures 500 and the backing plate 400.

The screw holes 531 of the second stud 530 of the embodiment are used for assembling a heat sink 11 . In detail, the heat dissipating device 11 is respectively inserted into the screw holes 531 of the four second studs 530 through the four locking screws, and the heat dissipating device 11 is fixed above the expansion socket 200. In the present embodiment, the device that is connected to the four second studs 530 is a heat dissipating device 11 and is not limited thereto.

In addition, in the present embodiment, the first stud 520 has an external thread 521, and the second stud 530 has a screw hole 531 arrangement, which is not intended to limit the present invention. In other embodiments, the first stud may instead have a screw hole, and the manner of fixing the circuit board and the board member may be locked into the screw hole of the first stud via a screw from a side of the back board away from the circuit. In addition, the second stud can be changed to have an externally threaded arrangement, and the heat dissipating device combined with the second stud can be combined with a stud having a screw hole.

The number of the perforations 130 of the circuit board 100, the assembled panel 300 and its through holes 340, and the locking holes 410 of the backing plate 400 are not intended to limit the present invention. In other embodiments, the number of perforations of the circuit board, the component plate and its through hole, and the number of keyholes of the backplane can be adjusted according to the design of each manufacturer.

According to the motherboard assembly disclosed in the above embodiment, the pressing block of the locking structure has a design that the first pressing surface and the second pressing surface are stepped, so that the locking structure is locked through the assembled panel and the circuit board. When entering the backboard, the first pressing surface resists the circuit board, and the second pressing surface abuts the recessed portion of the assembled board member, so that the circuit board and the assembled board member are fixed between the pressing block and the backboard . In this way, the assembled panel does not need to be pressed against the circuit board via the buckle, but the process of assembling the assembly to the circuit board can be simplified, the time for assembling the assembly to the circuit board is shortened, and the assembly can be further automated. demand. In addition, the process of disassembling the assembled panel can be easily removed by loosening the locked first stud.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧ motherboard components

11‧‧‧ Heat sink

100‧‧‧ boards

110‧‧‧Setting surface

120‧‧‧Back

130‧‧‧Perforation

200‧‧‧Expansion socket

210‧‧‧Front frame

220‧‧‧ buckle groove

300‧‧‧Assembled panels

310‧‧‧ Flat section

320‧‧‧Depression

330‧‧‧Depression

340‧‧‧through hole

400‧‧‧ Backplane

410‧‧‧Keyhole

500‧‧‧Locking structure

510‧‧‧Pressure block

511‧‧‧ end face

512‧‧‧First pressure surface

513‧‧‧second pressure surface

520‧‧‧First stud

521‧‧‧ external thread

530‧‧‧Second stud

531‧‧‧ screw holes

L1, L2‧‧‧ distance

1 is a perspective view showing a combination of a motherboard assembly and a heat sink according to a first embodiment of the present invention. 2 is an exploded view of the motherboard assembly of FIG. 1. 3 is a cross-sectional view of the motherboard assembly of FIG. 1.

Claims (8)

A motherboard assembly for assembling a heat sink, the motherboard assembly comprising: a circuit board having a setting surface, a back surface and a plurality of through holes, the back surface being opposite to the setting surface, and the holes are An installation surface is disposed through the rear surface; an expansion socket is disposed on the installation surface of the circuit board; and the plurality of assembly panels each have at least one through hole, the assembly plate members abutting the installation surface of the circuit board, and the assembly board The through holes respectively communicate with the through holes; a back plate has a plurality of locking holes, the back plate abuts against the back surface of the circuit board, and the locking holes respectively communicate the through holes; and a plurality of locking structures, Each of the first studs, the first stud and the second stud are respectively connected to the first stud and the second stud; wherein the first studs are respectively The plurality of through holes and the through holes are locked to the locking holes, so that the pressing blocks are pressed against the assembled plates, and the second studs are used for assembling the heat dissipating devices. The motherboard assembly of claim 1, wherein the assembled panels each comprise a flat portion and at least one recessed portion, the recessed portion being recessed from the flat portion, wherein the through holes are respectively located in the recesses The recesses are stacked on the mounting surface of the circuit board, and the pressing blocks are pressed against the recessed portions of the assembled panel. The motherboard assembly of claim 2, wherein each of the pressing blocks has an end surface, a first pressing surface and a second pressing surface, the first pressing surface and the second abutting surface The pressing surface is opposite to the end surface, and the first pressing surface and the second pressing surface surround the first stud, and the distance from the first pressing surface to the end surface is greater than the second pressing surface to the end surface The first pressing surface is pressed against the circuit board, and the second pressing surface is pressed against the recessed portion of the assembled panel. The first stud is connected to the first pressing surface, and the second screw is connected to the first pressing surface. A column is attached to the end face. The motherboard assembly of claim 2, wherein each of the assembled panels further comprises at least one crimping portion, the at least one crimping portion protruding from the flat portion, the expansion socket having an outer frame and a plurality of The buckles are formed by recessing the outer frame, and the buckles are respectively fastened into the buckles to fix the expansion sockets. The motherboard assembly of claim 1, wherein the first studs have an external thread, and the second studs have a screw hole. A locking structure includes: a first stud; a pressing block connected to one end of the first stud; and a second stud connected to the end of the pressing block facing the first stud . The motherboard assembly of claim 6, wherein the pressing block has an end surface, a first pressing surface and a second pressing surface, the first pressing surface and the second pressing surface The first abutting surface and the second abutting surface surround the first stud, and the distance from the first abutting surface to the end surface is greater than the distance from the second abutting surface to the end surface The first stud is connected to the first pressing surface, and the second stud is connected to the end surface. The motherboard assembly of claim 6, wherein the first stud has an external thread, and the second studs have a screw hole.