TW201925754A - System and method for monitoring metal collision - Google Patents

Abstract

A system and a method for monitoring a metal collision are provided. A monitoring unit is used to provide a pulse signal to monitoring a change of a surface of a metal material, in which the metal material is used as a reference. Collison of a monitored subject is then observed.

Description

Metal corrosion monitoring system and method

The invention relates to a metal corrosion monitoring system and a metal corrosion monitoring method, and in particular to a metal corrosion monitoring system and a metal corrosion monitoring method using a pulse signal for active corrosion monitoring.

In order to know the corrosion of objects (underground pipes, offshore working platforms, wind turbines, bridge steel structures or hulls) in corrosive environments, it is necessary to observe them with the human eye. However, if the object is located on the seabed (such as the steel structure of the offshore work platform, etc.), it is necessary to send personnel to the seabed for exploration, which is more risky and expensive for the diver. Metal corrosion monitoring is often used to monitor the corrosion of various objects in a highly corrosive environment (such as in the sea or under the ground) to instantly replace the object before it is severely damaged.

There is currently a device that coats the outer coating of a metal line with a metal piece, the outer coating of the metal piece and the metal line being respectively connected to the wire. The metal member is used as an electrode, and the two wires are used to measure the change in the impedance value between the metal member and the outer coating of the metal line to understand whether the external coating of the metal line is damaged. However, the above method has the disadvantage of applying a slight voltage to the metal line, and if the metal line is a flammable fluid, it is easy to generate gas. burst. In addition, the application of some micro voltage may also accelerate the corrosion of metal lines. Furthermore, if the shape of the metal pipe is not cylindrical, the construction of the metal member is not easy.

There is currently another anti-corrosion device that provides an appropriate voltage to the object to be protected to inhibit corrosion of the article. However, the above-mentioned corrosion preventing device has the disadvantage that the above device only provides corrosion protection, but cannot monitor the corrosion state of the object. If the surface of the object has been corroded or has biological parasitics, it cannot correct the reference value. Furthermore, providing voltage to an object may also accelerate corrosion of the object.

There is another anti-corrosion device which coats the object to be ablated with concrete and adds an auxiliary anode to the concrete to lower the voltage of the applied object and generate less electrolysis gas. However, the coating cost of the above apparatus is too high and the construction is not easy, and although the corrosion state of the object is not known by the voltage corrosion prevention. Moreover, it is still impossible to overcome the disadvantage of requiring accelerated voltage corrosion by applying a voltage to the object.

Therefore, according to the above various shortcomings, it is urgent to propose a metal corrosion monitoring system and a metal corrosion monitoring method, which do not need to apply voltage or current to the monitoring object, and can observe the corrosion state of the monitored object in real time under various environments. .

Accordingly, an aspect of the present invention is to provide a metal corrosion monitoring system that is not electrically connected to a monitoring object to avoid accelerated corrosion, but can immediately observe the corrosion condition of the monitored object.

Another aspect of the present invention is to provide a metal corrosion monitor The measurement method is carried out using the above metal corrosion monitoring system.

According to the above aspect of the invention, a metal corrosion monitoring system is proposed. In some embodiments, the metal corrosion monitoring system includes at least one monitoring unit, a master, and a monitoring item. Each of the at least one monitoring unit can comprise a metal material, a pulse signal generating wafer, and a cladding material. The metallic material includes a first surface and an opposite second surface, wherein the first surface has opposing first and second ends. The pulse signal generating chip is disposed on the second surface, wherein the pulse signal generating chip can include a signal output end and a signal input end, the signal output end is electrically connected to the first end, and the signal input end is electrically connected to the second end . The cladding material coats the pulse signal to generate a wafer. The main controller includes a signal amplifier and a computer, wherein the signal input terminal is electrically connected to the signal amplifier, and the computer is electrically connected to the signal amplifier. The at least one monitoring unit is disposed on the monitoring object and exposes the first surface of the metallic material.

According to some embodiments of the invention, the first surface has a surface topography.

According to some embodiments of the present invention, the computer includes a database module, the database module includes a plurality of pulse signal data, and the pulse signal data corresponds to a surface topography of the metal material.

According to some embodiments of the invention, each of the pulse signal data includes a current value, a voltage value, or a resistance value.

According to some embodiments of the present invention, the cladding material comprises a polymer material or a metal cover, and at least one monitoring unit is disposed on the monitoring object by the cladding material.

According to some embodiments of the present invention, the above pulse signal generation The chip further contains a microprocessor.

According to some embodiments of the present invention, the signal amplifier is electrically connected to the signal output end of the pulse signal generating chip.

According to some embodiments of the invention, the monitoring article is of the same material as the metallic material.

According to the above aspect of the invention, a method of monitoring metal corrosion is proposed. In some embodiments, the above method comprises the steps described below. First, at least one monitoring unit is fixed to the monitoring object. Each of the at least one monitoring unit can comprise a metal material, a pulse signal generating wafer, and a cladding material. The metallic material includes a first surface and an opposite second surface, wherein the first surface has opposing first and second ends. The pulse signal generating chip is disposed on the second surface, wherein the pulse signal generating chip can include a signal output end and a signal input end, the signal output end is electrically connected to the first end, and the signal input end is electrically connected to the second end . The cladding material coats the pulse signal to generate a wafer. At least one monitoring unit is disposed on the monitoring object by the covering material and exposing the first surface. Then, the pulse signal generating chip applies a first pulse signal to the first end from the signal output end and transmits the first pulse signal to the second end to form a second pulse signal. The first pulse signal is transmitted along the first surface, and the signal input terminal receives the second pulse signal. Then, the difference between the first pulse signal and the second pulse signal is calculated. Next, the difference is compared with a plurality of pulse signal data in the database module, wherein the pulse signal data corresponds to the surface topography of the metal material. After that, the degree of corrosion of the monitored object is judged.

According to some embodiments of the present invention, the step of calculating the difference between the first pulse signal and the second pulse signal comprises using the pulse The signal generates a microprocessor in the wafer for calculation.

According to some embodiments of the present invention, after calculating the difference, the monitoring method of the present invention further comprises converting the difference into an electrical signal.

According to some embodiments of the present invention, the signal output end and the signal input end are respectively electrically connected to the computer of the main controller, and the step of calculating the difference between the first pulse signal and the second pulse signal comprises using the computer Calculation.

According to some embodiments of the present invention, before the calculating the difference, the monitoring method of the present invention further comprises converting the first pulse signal and the second pulse signal into electrical signals, respectively.

According to some embodiments of the invention, each of the pulse signal data and the electrical signal comprise a current value, a voltage value or a resistance value.

The metal corrosion monitoring system and the metal corrosion monitoring method of the invention use a monitoring unit for providing a pulse signal, and a metal signal which is the same material as the monitoring object in the monitoring unit, and the pulse signal which is changed by the surface topography of the metal material is used. Observe the corrosion condition of the monitored object. Since no current or voltage is applied to the monitored object, accelerated corrosion due to the applied current or voltage can be avoided.

100, 200, 300‧‧‧ metal corrosion monitoring system

110, 210, 311, 313, 315, 510‧ ‧ monitoring units

111, 211, 511‧‧‧Metal materials

111A, 211A‧‧‧ first surface

111B, 211B‧‧‧ second surface

112, 212‧‧‧ first end

113, 213‧‧‧ pulse signal generation chip

114, 214‧‧‧ second end

115, 215‧‧‧ cladding materials

116, 216‧‧‧ signal output

118, 218‧‧‧ signal input

119, 219‧‧‧Microprocessor

120, 220, 320‧‧‧ master controller

121, 221‧‧‧ signal amplifier

122, 222‧‧‧ database module

123, 223‧‧‧ computer

330‧‧‧Monitoring objects

331‧‧‧

333‧‧‧Metal column

341‧‧‧ Environment

343‧‧ ‧ intertidal zone

345‧‧‧ seawater

400‧‧‧Monitoring methods

410‧‧‧Install at least one monitoring unit on the monitoring object, the monitoring unit contains metal material and pulse signal generating chip

420‧‧‧ pulse signal generation wafer generates a first pulse signal and transmits along the surface of the metal material to form a second pulse signal

430‧‧‧ Calculate the difference between the first pulse signal and the second pulse signal

440‧‧‧Compare the difference with the plurality of pulse signal data in the database module

450‧‧‧Determination of the degree of corrosion of monitored objects

520, 530, 540‧‧‧ surface topography

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood.

FIG. 1 is a partial schematic view of a metal corrosion monitoring system according to some embodiments of the present invention.

2 is a partial schematic view of a metal corrosion monitoring system according to further embodiments of the present invention.

FIG. 3 is a schematic diagram of a metal corrosion monitoring system including a monitoring object according to still another embodiment of the present invention.

FIG. 4 is a schematic flow chart showing a method of monitoring metal corrosion according to some embodiments of the present invention.

[Fig. 5A] to [Fig. 5C] are schematic views of various surface topography of the metal material of the monitoring unit of the present invention in a corrosive environment.

Various aspects of the present invention are directed to providing a metal corrosion monitoring system and a method of monitoring metal corrosion. The above system comprises a wafer having a pulse signal and a monitoring unit for the metal material, wherein the metal material has the same material as the monitoring object, and the surface of the metal material is exposed to an environment which may cause corrosion (hereinafter referred to as a corrosive environment). The monitoring method mainly applies a pulse signal to the surface of the metal material by using the wafer to obtain surface topography information of the metal material. Further, by comparing the pulse signal data related to the surface topography in the previously established database module, the corrosion state of the metal material (the monitoring object with the same material) disposed in a corrosive environment can be determined.

The monitoring object referred to in the present invention may be, for example, a steel structure of an offshore working platform, a buried pipe, a hull, a wind power generation device, a bridge steel structure, or the like.

The corrosive environment referred to herein as "corrosion environment" may be, for example, seawater, intertidal zone, coastal area, soil, wind erosion environment or an environment susceptible to biological attachment.

The pulse signal referred to herein as a wave is transmitted in the form of a wave on the surface of the metal material, rather than an electrical signal (such as voltage or current). The advantage of using pulse signal transmission is that it does not cause accelerated corrosion of the metal material or the monitoring object itself due to the applied current or voltage, and can more accurately observe the corrosion condition of the monitored object without causing additional damage to the monitored object.

The metal corrosion monitoring system of the present invention will be described below using Figs. 1 is a partial schematic view of a metal corrosion monitoring system in accordance with some embodiments of the present invention. 2 is a partial schematic view of a metal corrosion monitoring system in accordance with further embodiments of the present invention. 3 is a schematic diagram of a metal corrosion monitoring system including a monitoring object according to still further embodiments of the present invention.

Referring first to FIG. 1, the metal corrosion monitoring system 100 can include a monitoring unit 110, a main controller 120, and a monitoring object (not shown in FIG. 1, please refer to the monitoring object 330 of FIG. 3). The monitoring unit 110 further includes a metal material 111, a pulse signal generating wafer 113, and a cladding material 115. The metal material 111 has a first surface 111A and an opposite second surface 111B, the first surface 111A having opposite first and second ends 112, 114, and the first surface 111A having a surface morphology. The pulse signal generating chip 113 is disposed on the second surface 111B, and the pulse signal generating chip 113 includes a signal output end 116 and a signal input end 118. The signal output end 116 is electrically connected to the first end 112, and the signal input end 118 and the first The two ends 114 are electrically connected. In some implementations In one example, the pulse signal generating wafer 113 can include, but is not limited to, any commercially available or known single wafer, DSP wafer, or other type of wafer.

The cladding material 115 covers the pulse signal generating wafer 113. In some embodiments, the cladding material 115 comprises a polymeric material or a metal cover. For example, the covering member 115 may use a common insulating material such as an epoxy resin. The cladding material 115 is used to protect the pulse signal generating wafer 113 from the external corrosive environment, increase the accuracy of the metal corrosion monitoring system 100 and extend the service life of the metal corrosion monitoring system 100. In some embodiments, the monitoring unit 110 is disposed on the monitoring item (eg, the monitoring item 330) by the cladding material 115. In other words, the side of the cladding material of the monitoring unit 110 is in contact with and fixed to the surface of the monitoring article.

The main controller 120 includes a signal amplifier 121 and a computer 123. The computer 123 is electrically connected to the signal amplifier 121. The signal amplifier 121 and the signal input terminal 118 are electrically connected. In some embodiments, the signal amplifier 121 can be used to convert a pulse signal into an electrical signal. In some examples, the electrical signal can be, for example, a voltage value, a current value, or a resistance value. In particular, the metal corrosion monitoring system of the present invention performs the conversion when the pulse signal is transmitted to the signal amplifier, instead of directly applying the voltage or current, thereby avoiding accelerated corrosion of the metal material or the monitoring object by the voltage or current. In some embodiments, the computer 123 can include a library module 122. The database module 122 includes a plurality of pulse signal data, and the pulse signal data can correspond to the surface topography of the metal material 111.

In some embodiments, the monitoring unit 110 is disposed on the monitoring object (eg, the monitoring object 330) and exposes the metal material 111. First surface 111A. For example, if the metal corrosion monitoring system 100 is corrosion monitoring of a steel structure for an offshore work platform, the first surface 111A can be exposed, for example, to sea water, intertidal zone, or sea breeze. In some embodiments, the metallic material 111 and the monitored article are of the same material. Specifically, the metal corrosion monitoring system of the present invention uses the metal material 111 of the same material as the monitoring object as a reference to observe the surface topography change to know the state of the monitored object under the same corrosive environment. Therefore, if the metal material 111 and the monitoring object use different materials, the corrosion state of the monitored object cannot be immediately known. In some examples, the metal material may be, for example, various steel materials, but the present invention is not limited thereto, and specific examples of the metal material may be replaced depending on the monitored object.

In some embodiments, the pulse signal generating chip 113 in the monitoring unit 110 shown in FIG. 1 may further have one or more microprocessors 119 for calculating between the signal output terminal 116 and the signal input terminal 118. The difference between the pulse signals (details are described later). The difference is transmitted to the signal amplifier 121 and/or the computer 123 by the electrical connection of the signal input terminal 118 to the signal amplifier 121.

Referring next to Figure 2, a metal corrosion monitoring system 200 is provided. In general, the monitoring unit 210, the main controller 220, the metal material 211, the pulse signal generating wafer 213, the cladding material 215, the first surface 211A, the second surface 211B, and the second surface 211B in the metal corrosion monitoring system 200 shown in FIG. The first end 212, the second end 214, the signal output end 216, the signal input end 218, the signal amplifier 221, the database module 222 and the computer 223 are all similar or identical to those in the metal corrosion monitoring system 100 shown in FIG. Monitoring unit 110, master control 120, metal material 111, pulse signal generating chip 113, cladding material 115, first surface 111A, second surface 111B, first end 112, second end 114, signal output end 116, signal input end 118, signal amplifier 121. The database module 122 and the computer 123 are not further described herein.

The difference is that the pulse signal generating chip 213 in the monitoring unit 210 shown in FIG. 2 may not include a microprocessor. In this embodiment, which does not include a microprocessor, in addition to the signal input terminal 218 being electrically connected to the signal amplifier 221, the signal output terminal 216 is also electrically connected to the signal amplifier 221 . Further, the signal output terminal 216 and the signal input terminal 218 are also electrically connected to the computer 223 via the signal amplifier 221. The purpose of the above setting is to transmit a pulse signal from the signal output terminal 216 and another pulse signal from the signal input terminal 218, and convert it into a signal by the signal amplifier 221, and then transmit it to the computer 223 to calculate the conversion. The difference between the two subsequent electrical signals to observe the corrosion state of the monitored object.

The metal corrosion monitoring system 100 of Figure 1 and the illustrated metal corrosion monitoring system 200 provide different configurations when using different wafer types (with or without microprocessor), although it will be appreciated that the above examples are only illustrative of this The application of the inventive metal corrosion monitoring system is not intended to limit the scope of the invention. Those of ordinary skill in the art should be able to apply a variety of different wafers or configurations after retouching based on the concepts set forth above for the metal corrosion monitoring system 100 and the metal corrosion monitoring system 200 without departing from the spirit of the present invention. in.

Next, please refer to Figure 3, which provides a marine work platform. A metal corrosion monitoring system 300 of 330. As shown in FIG. 3, the metal corrosion monitoring system 300 can include three monitoring units (eg, monitoring unit 311, monitoring unit 313, and monitoring unit 315), a master 320, and a monitoring object 330. The monitoring unit 311, the monitoring unit 313 and the monitoring unit 315 are similar or identical to the monitoring unit 110 of FIG. 1 or the monitoring unit 210 of FIG. 2, and the main controller 320 can be similar or identical to the main controller 120 of FIG. Or the main controller 220 of FIG. 2, which is not described here. In particular, Figure 3 illustrates an example using three monitoring units, although other numbers of monitoring units may be used. The number of monitoring units can be determined by actual needs or design.

In an embodiment, the monitoring unit 311 can be installed on the loading platform 331 of the offshore working platform (or monitoring object) 330. The corrosion of the environment 341 where the loading table 331 is located mainly comes from sea breeze, flying sand, and weather factors. (rain, temperature, sun, typhoon). In another embodiment, the monitoring unit 313 can be mounted on the metal post 333 of the offshore working platform 330 of the intertidal zone 343. The corrosion of the intertidal zone 343 is mainly caused by tidal, biological (such as barnacle) parasites and the like. In yet another embodiment, the monitoring unit 315 can be mounted on a metal post 333 of the offshore working platform 330 located in the seawater 345. The corrosion of the seawater 345 is primarily due to electrolytes, ocean currents, drifting sand, drifting matter, and the like in the seawater.

In yet another embodiment, the monitoring unit can be densely mounted on the monitored item to be monitored for more accurate corrosion monitoring.

Next, the method of monitoring metal corrosion of the present invention will be described. In some embodiments, the method of monitoring metal corrosion can be performed, for example, using metal corrosion monitoring system 100, metal corrosion monitoring system 200, or metal corrosion monitoring as described above. System 300 proceeds. The monitoring method of the present invention will now be described with reference to Figs. 1 through 4, wherein Fig. 4 is a schematic flow chart showing a method 400 of monitoring metal corrosion in accordance with some embodiments of the present invention.

To clarify the monitoring method 400, only the metal corrosion monitoring system 100 of FIG. 1 and the monitoring object 330 of FIG. 3 are described herein. However, it will be appreciated by those of ordinary skill in the art that the metal corrosion monitoring system 200 of FIG. 2 can also be used to perform the monitoring method 400 described below.

As shown in step 410 of FIG. 4, the monitoring method 400 first fixes at least one monitoring unit 110 to the monitoring object 330. Next, as shown in step 420, the pulse signal generating wafer 113 generates a first pulse signal and transmits it along the first surface 111A of the metal material 111 to form a second pulse signal. Specifically, the pulse signal generating chip 113 applies a first pulse signal to the first end 112 of the metal material 111 from the signal output end 116 and transmits the first pulse signal to the second end 114 of the metal material 111, and then receives the above by the signal input terminal 118. The second pulse signal.

Then, as shown in step 430, the difference between the first pulse signal and the second pulse signal is calculated. In an embodiment using the monitoring unit 110 of FIG. 1, the above described steps of calculating the difference may be performed in the microprocessor 119. In this embodiment, after the difference is calculated, the result is transmitted to the signal amplifier 121 via the signal input terminal 118, and the difference is converted into an electrical signal by the signal amplifier 121 and transmitted to the computer 123.

In other embodiments, the monitoring unit 210 of FIG. 2 can be used, for example, and the step of calculating the difference can be performed in the computer 223. In this embodiment, the first pulse signal passes through the signal output terminal 216 and the second pulse The signals are respectively transmitted to the signal amplifier 221 via the signal input terminal 218, and the first pulse signal and the second pulse signal are respectively converted into electrical signals and transmitted to the computer 223, and the difference calculation is performed by the computer 223. The aforementioned electrical signals may include current values, voltage values or resistance values.

Next, as shown in step 440, the difference is compared with a plurality of pulse signal data in the database module, wherein the pulse signal data can correspond to the surface topography of the metal material 111. In some embodiments, the database module is included in the computer 123 described above.

In some embodiments, the monitoring method of the present invention further includes establishing pulse signal data in the database module. First, an environmental factor model corresponding to the aforementioned corrosive environment is established, and the environmental factors may be, for example, seawater concentration, seawater temperature, seawater conductivity, marine species, flow rate, amount of sand drift, sea breeze, and large natural disaster frequency. In one embodiment, the environmental factor model described above can be performed on a laboratory scale to facilitate data collection and recording. Please refer to FIG. 5A to FIG. 5C, which are schematic diagrams showing various surface topography of the metal material of the monitoring unit of the present invention in the corrosive environment of the above environmental factors. The monitoring unit 510 is used to continuously record the surface change of the metal material 511 in the above environment, wherein the components of the monitoring unit 510 are the same as the monitoring unit 110 or the monitoring unit 210, and are not described herein. After the monitoring unit 510 is placed in the above environment, the metal material 511 is pulsed at a specific time interval (step 420 as described above) to obtain a surface topography corresponding to the metal material 511 that changes with time in a specific environmental factor. Pulse signal data.

The method of establishing the pulse signal data of the database module by using the surface topography change will be described below using FIG. 5A to FIG. 5C. Specifically, as shown in FIG. 5A, the metal material 511 just placed in a corrosive environment has a flat surface topography 520, and the surface topography 520 can correspond to the pulse signal data (ie, the difference described above) V ₀ . Then, with increasing time of placement, by etching said corrosive environment, resulting in surface topography 530 of the metal material 511, as shown in FIG. 5B, at this time the surface topography data pulse signal 530 may correspond to V _1. Then, the metal material 511 is continuously placed in a corrosive environment to form a surface topography 540 as shown in FIG. 5C, and the surface topography 540 may correspond to the pulse signal data V ₂ . Although the invention only refers to three sets of pulse signal data, according to the different requirements of the corrosive environment and the degree of corrosion, more groups of pulse signal data can be added. In some embodiments, the establishment of the above-mentioned database can be autonomously learned by means of a neural network, etc., to facilitate a larger amount of data collection.

The monitoring method 400 of the present invention further includes a reference value defining a surface topography, which represents a limit value of the degree of corrosion of the metal material 511 (that is, when the degree of corrosion (or surface topography) is reached, the system needs to notify To replace/maintain monitoring objects).

As shown in step 450, after the comparison is made, the degree of corrosion of the monitored article 330 is determined. Specifically, the determination of the degree of corrosion is performed by determining whether the difference reaches the above reference value. In some embodiments, the surface topography 540 of FIG. 5C is used as the above reference value. When the difference measured by the metal material 111 of the monitoring unit 110 is the same as or close to the pulse signal data V ₂ , monitoring is required. Repair and replacement of the object 330.

The metal corrosion monitoring system and the metal corrosion monitoring method of the present invention are used to measure the surface topography of the metal material by applying a pulse signal to the surface of the reference metal material instead of the monitoring object itself. The surface topography is matched to a plurality of sets of pulse signal data in a previously established database module, so that the surface topography of the reference metal material can be instantly known. When the surface topography reaches the reference value of the maintenance monitoring object defined in the database module, the system issues a notification, so that active corrosion monitoring can be achieved.

The invention has the advantages that the pulse signal is matched with the reference metal material, and the current or voltage is not directly applied to the monitoring object, so that the accelerated corrosion of the monitoring object can be avoided. In addition, active anti-corrosion monitoring can reduce the maintenance cost of monitored objects, and provide online real-time understanding of the structure and predictive maintenance functions, thereby reducing monitoring costs and monitoring the risk of object replacement personnel. Moreover, the monitoring method using the pulse signal makes the monitoring system of the present invention applicable to various environments (conducting, non-conductive, flammable, etc.).

While the invention has been described above in terms of several embodiments, it is not intended to limit the scope of the invention, and the invention may be practiced in various embodiments without departing from the spirit and scope of the invention. The scope of protection of the present invention is defined by the scope of the appended claims.

Claims (14)

A metal corrosion monitoring system, comprising: at least one monitoring unit, comprising: a metal material having a first surface and an opposite second surface, wherein the first surface has an opposite first end and a second end; a pulse signal generating chip is disposed on the second surface, wherein the pulse signal generating chip comprises a signal output end and a signal input end, wherein the signal output end is electrically connected to the first end, and the signal input end is The second end is electrically connected; and a cladding material encapsulating the pulse signal to generate a wafer; a main controller comprising: a signal amplifier electrically connected to the signal input end; and a computer and the signal amplifier An electrical connection; and a monitoring object, wherein the at least one monitoring unit is disposed on the monitoring object to expose the first surface of the metal material. The metal corrosion monitoring system of claim 1, wherein the first surface has a surface topography. The metal corrosion monitoring system of claim 2, wherein the computer comprises a database module, the database module comprises a plurality of pulse signal data, and the pulse signal data corresponds to the surface of the metal material Morphology. Metal corrosion supervision as described in item 3 of the patent application scope The measurement system, wherein each of the pulse signal data comprises a current value, a voltage value or a resistance value. The metal corrosion monitoring system of claim 1, wherein the cladding material comprises a polymer material or a metal cover, and the at least one monitoring unit is disposed on the monitoring object by the coating material. The metal corrosion monitoring system of claim 1, wherein the pulse signal generating chip further comprises a microprocessor. The metal corrosion monitoring system of claim 1, wherein the signal amplifier is electrically connected to the signal output end of the pulse signal generating chip. The metal corrosion monitoring system of claim 1, wherein the monitoring object is the same material as the metal material. A method for monitoring metal corrosion, comprising: fixing at least one monitoring unit to a monitoring object, wherein the at least one monitoring unit comprises: a metal material, comprising a first surface and an opposite second surface, wherein the A surface has an opposite first end and a second end; a pulse signal generating chip is disposed on the second surface, wherein the pulse signal generating chip comprises a signal output end and a signal input end, the signal output end Electrically connected to the first end, and the signal input The end is electrically connected to the second end; and a cladding material is coated on the pulse signal generating chip, wherein the at least one monitoring unit is disposed on the monitoring object by the covering material, and exposes the first The pulse signal generating chip sends a first pulse signal to the first end from the signal output end and transmits the first pulse signal to the second end to form a second pulse signal, wherein the first pulse signal is along the first a surface is transmitted, and the signal input end receives the second pulse signal; calculating a difference between the first pulse signal and the second pulse signal; and the difference is combined with a plurality of pulses in a database module The signal data is compared, wherein the pulse signal data corresponds to a surface topography of the metal material; and a degree of corrosion of the monitored object is determined. The method for monitoring metal corrosion as described in claim 9, wherein calculating the difference between the first pulse signal and the second pulse signal comprises using the pulse signal to generate a microprocessor in the chip for calculation . The method for monitoring metal corrosion as described in claim 10, wherein after the calculating the difference, the monitoring method further comprises converting the difference into an electrical signal. Metal corrosion as described in claim 9 The monitoring method, wherein the signal output end and the signal input end are respectively electrically connected to a computer of a main controller, and calculating the difference between the first pulse signal and the second pulse signal comprises using the computer Calculation. The method for monitoring metal corrosion as described in claim 12, wherein before the calculating the difference, the monitoring method further comprises converting the first pulse signal and the second pulse signal into an electrical signal, respectively. The method for monitoring metal corrosion as described in claim 11 or 13, wherein each of the pulse signal data and the electrical signal comprises a current value, a voltage value or a resistance value.