TW201922600A - Supply apparatus, processing system and processing method - Google Patents

Supply apparatus, processing system and processing method Download PDF

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Publication number
TW201922600A
TW201922600A TW107134236A TW107134236A TW201922600A TW 201922600 A TW201922600 A TW 201922600A TW 107134236 A TW107134236 A TW 107134236A TW 107134236 A TW107134236 A TW 107134236A TW 201922600 A TW201922600 A TW 201922600A
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TW
Taiwan
Prior art keywords
holding surface
granules
powder
supply device
supply
Prior art date
Application number
TW107134236A
Other languages
Chinese (zh)
Inventor
上野和樹
Original Assignee
日商尼康股份有限公司
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Publication of TW201922600A publication Critical patent/TW201922600A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/105Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/16Both compacting and sintering in successive or repeated steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20Bonding
    • B23K26/21Bonding by welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34Laser welding for purposes other than joining
    • B23K26/342Build-up welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/02Dispensing from vessels, e.g. hoppers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/141Processes of additive manufacturing using only solid materials
    • B29C64/153Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30Auxiliary operations or equipment
    • B29C64/307Handling of material to be used in additive manufacturing
    • B29C64/321Feeding
    • B29C64/329Feeding using hoppers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G27/00Jigging conveyors
    • B65G27/04Load carriers other than helical or spiral channels or conduits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00Loading or unloading
    • B65G65/30Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
    • B65G65/34Emptying devices
    • B65G65/40Devices for emptying otherwise than from the top
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)

Abstract

A supply apparatus has: a supply source having a supply port configured to supply particulates; a holding member that is configured to be away downwardly from the supply port and to have a holding surface for holding the particulates from the supply port; and a driving apparatus that is configured to move the holding surface. One portion of the particulates that is held on the holding surface while making an angle of repose is allowed to fall from the holding surface by the movement of the holding surface by the driving apparatus.

Description

供給裝置、加工系統及加工方法    Supply device, processing system and processing method   

本發明係關於一種例如供給粉粒體之供給裝置、以及使用由此種供給裝置所供給之粉粒體來進行加工處理之加工系統及加工方法之技術領域。 The present invention relates to the technical field of, for example, a supply device for supplying powder and granules, and a processing system and a processing method using the powder and granules supplied by such a supply device.

作為供給粉粒體之供給裝置之一例,可列舉向安裝於超音波馬達之前端之管道中供給粉體,藉由超音波馬達之橢圓振動而將粉體向固定方向搬送之供給裝置(參照專利文獻1)。此種供給裝置中,適當地搬送粉粒體成為技術性課題。 An example of a supply device for supplying powder and granules is a supply device that supplies powder to a pipe installed at the front end of an ultrasonic motor and transports the powder in a fixed direction by the elliptical vibration of the ultrasonic motor (see patent) Reference 1). In such a supply device, it is a technical problem to appropriately transfer the powder and granules.

[現有技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

[專利文獻1]美國專利第5,917,266號 [Patent Document 1] US Patent No. 5,917,266

依據本發明之第1形態,提供一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備保持來自上述供給口之上述粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且以上述驅動裝置驅動上述保持面,使於上述保持面上形成 靜止角而被保持之上述粉粒體之一部分從上述保持面上落下。 According to a first aspect of the present invention, there is provided a supply device including: a supply source having a supply port for supplying powder and granules; and a holding member located at a position separated downward from the supply port and provided with holding the supply from the supply. A holding surface of the powder and granules; and a driving device driving the holding surface; and driving the holding surface with the driving device so that a part of the powder and particles held by the holding surface forms a rest angle from the holding surface Drop on the holding surface.

依據本發明之第2形態,提供一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備將來自上述供給口之上述粉粒體保持於上述供給口與上述保持面之間之保持面;以及驅動裝置,其驅動上述保持面;並且藉由以上述驅動裝置驅動上述保持面,而使上述保持面所保持之上述粉粒體之一部分從上述保持面之端部落下,從上述供給口之邊緣延伸至上述端部為止之第1假想面與水平面所形成之角度為上述粉粒體之靜止角以下。 According to a second aspect of the present invention, there is provided a supply device including: a supply source having a supply port for supplying powder and granules; a holding member located at a position separated downward from the supply port; The powder and granules of the mouth are held on a holding surface between the supply port and the holding surface; and a driving device driving the holding surface; and the holding surface is held by driving the holding surface with the driving device. A part of the powder and granules forms an angle formed by the first imaginary plane extending from the edge of the supply port to the end with the horizontal plane below the end of the holding surface and below the rest angle of the powder and granules.

依據本發明之第3形態,提供一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備保持來自上述供給口之上述粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且以上述驅動裝置驅動上述保持面,使堆積於上述保持面與上述供給口之間之上述粉粒體之一部分從上述保持面上落下。 According to a third aspect of the present invention, there is provided a supply device including: a supply source having a supply port for supplying powder and granules; and a holding member located at a position separated downward from the supply port and provided with holding the supply from the supply. And a driving device for driving the holding surface; and driving the holding surface with the driving device, so that a part of the powder and particles accumulated between the holding surface and the supply port is removed from Drop on the holding surface.

依據本發明之第4形態,提供一種供給裝置,其具備:保持構件,其具有保持由供給源所供給之粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且藉由以上述驅動裝置使上述保持面振動,而使於上述保持面上形成靜止角而被保持之上述粉粒體之一部分從上述保持面落下,控制包含上述保持面之振動之振幅及頻率中之至少一者的上述保持面之振動,從而控制從上述保持面落下之上述粉粒體之每單位時間之搬出量。 According to a fourth aspect of the present invention, there is provided a supply device including: a holding member having a holding surface for holding powder and granules supplied from a supply source; and a driving device for driving the holding surface; The driving device vibrates the holding surface, and a portion of the powder and granules held by forming a rest angle on the holding surface falls from the holding surface, and controls at least one of the amplitude and frequency of the vibration including the holding surface. The holding surface is vibrated to control the carrying amount of the powder and granules dropped from the holding surface per unit time.

依據本發明第5之形態,提供一種供給裝置,其具備:保持構件,其具有保持粉粒體之保持面;以及具有搬送面之搬送構件,上述搬送面包含接收從上述保持面落下之上述粉粒體之面;並且上述搬送面包含相對於水平面而傾斜之傾斜面,上述搬送構件藉由從上述傾斜面上供給上述粉粒體,而使來自上述搬送面上之上述粉粒體之每單位時間之搬出量之變動小於從上述保持 面落下之上述粉粒體之每單位時間之搬出量之變動。 According to a fifth aspect of the present invention, there is provided a supply device including: a holding member having a holding surface for holding powder and granules; and a conveying member having a conveying surface for receiving the powder falling from the holding surface. And the conveying surface includes an inclined surface inclined with respect to a horizontal plane, and the conveying member supplies the powder and granules from the inclined surface so that each unit of the powder and granules from the conveying surface The change in the carrying amount of time is smaller than the change in the carrying amount per unit time of the powder and granules dropped from the holding surface.

依據本發明之第6形態,提供一種加工系統,其具備由上述本發明之第1形態至第5形態中之任一者所提供之供給裝置,且使用由上述供給裝置所供給之上述粉粒體來進行加工處理。 According to a sixth aspect of the present invention, there is provided a processing system including the supply device provided by any one of the first to fifth aspects of the present invention, and using the powder supplied from the supply device. Body for processing.

本發明之作用及其他利益係根據以下所說明之實施方式而明確。 The function and other benefits of the present invention are made clear by the embodiments described below.

1‧‧‧造形系統 1‧‧‧Shaping System

3‧‧‧材料供給裝置 3‧‧‧ material supply device

31‧‧‧料斗 31‧‧‧hopper

32‧‧‧保持構件 32‧‧‧ holding member

323‧‧‧保持面 323‧‧‧ keep face

33‧‧‧振動裝置 33‧‧‧Vibration device

34‧‧‧材料送出構件 34‧‧‧Material delivery member

35‧‧‧筐體 35‧‧‧Chassis

36a‧‧‧搬送構件 36a‧‧‧Transport component

361a‧‧‧上表面 361a‧‧‧upper surface

37d‧‧‧距離調整裝置 37d‧‧‧Distance adjustment device

38e‧‧‧角度調整裝置 38e‧‧‧Angle adjustment device

39f‧‧‧旋轉裝置 39f‧‧‧rotating device

W‧‧‧工件 W‧‧‧ Workpiece

M‧‧‧造形材料 M‧‧‧Shaping Materials

圖1係表示本實施方式之造形系統之構造之剖面圖。 FIG. 1 is a cross-sectional view showing the structure of a forming system according to this embodiment.

圖2(a)至圖2(c)係分別表示對工件上之某區域照射光且供給造形材料之情形時之狀態之剖面圖。 2 (a) to 2 (c) are cross-sectional views respectively showing a state in which light is irradiated to a certain area on a workpiece and a molding material is supplied.

圖3係表示本實施方式之材料供給裝置之構造之剖面圖。 FIG. 3 is a cross-sectional view showing the structure of a material supply device according to this embodiment.

圖4係將材料供給裝置之一部分放大表示之剖面圖及俯視圖。 FIG. 4 is an enlarged cross-sectional view and a plan view showing a part of the material supply device.

圖5係表示由材料供給裝置所引起之造形材料之供給動作之剖面圖。 Fig. 5 is a cross-sectional view showing a feeding operation of a shaping material by a material feeding device.

圖6係表示保持構件之振動之振幅與造形材料之供給量之間之關係之圖表。 FIG. 6 is a graph showing the relationship between the amplitude of the vibration of the holding member and the supply amount of the molding material.

圖7係表示造形頭之移動速度與造形材料之供給量之關係之圖表。 Fig. 7 is a graph showing the relationship between the moving speed of the forming head and the supply amount of the forming material.

圖8係表示第1變形例之材料供給裝置之構造之剖面圖。 Fig. 8 is a sectional view showing the structure of a material supply device according to a first modification.

圖9係表示第2變形例之材料供給裝置之構造之剖面圖。 Fig. 9 is a sectional view showing the structure of a material supply device according to a second modification.

圖10係表示第3變形例之材料供給裝置之構造之剖面圖。 Fig. 10 is a sectional view showing the structure of a material supply device according to a third modification.

圖11係表示第4變形例之材料供給裝置之構造之剖面圖。 Fig. 11 is a sectional view showing the structure of a material supply device according to a fourth modification.

圖12係表示第5變形例之材料供給裝置之構造之剖面圖。 Fig. 12 is a sectional view showing the structure of a material supply device according to a fifth modification.

圖13係表示第6變形例之材料供給裝置之構造之剖面圖。 Fig. 13 is a sectional view showing the structure of a material supply device according to a sixth modification.

圖14係表示第7變形例之材料供給裝置之構造之剖面圖。 Fig. 14 is a sectional view showing the structure of a material supply device according to a seventh modification.

圖15係表示第8變形例之材料供給裝置之構造之剖面圖。 Fig. 15 is a sectional view showing the structure of a material supply device according to an eighth modification.

以下,參照圖式,對供給裝置、加工系統及加工方法之實施方式進行說明。以下,利用雷射堆焊法(LMD:Laser Metal Deposition),使用可藉由進行使用粉粒體之一具體例即造形材料M之附加加工來形成造形物之造形系統1,對供給裝置、加工系統及加工方法之實施方式進行說明。 Hereinafter, embodiments of a supply device, a processing system, and a processing method will be described with reference to the drawings. In the following, a laser deposition method (LMD: Laser Metal Deposition) is used, and a forming system 1 capable of forming a shape by performing additional processing using a specific example of powder and granules, that is, a forming material M, is used for the supply device and An embodiment of the system and processing method will be described.

另外,以下之說明中,使用由相互正交之X軸、Y軸及Z軸所定義之XYZ正交座標系,對構成造形系統1之各種構成要素之位置關係進行說明。此外,以下之說明中,為便於說明而設為X軸方向及Y軸方向分別為水平方向(即,水平面內之既定方向),且Z軸方向為鉛直方向(即,與水平面正交之方向,實質上為上下方向)。另外,將繞X軸、Y軸及Z軸之旋轉方向(換言之,傾斜方向)分別稱為θX方向、θY方向及θZ方向。 In the following description, the positional relationship of the various constituent elements constituting the shaping system 1 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. In addition, in the following description, for convenience of explanation, the X-axis direction and the Y-axis direction are horizontal directions (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is a vertical direction (that is, a direction orthogonal to the horizontal plane). , Essentially up and down). In addition, the rotation directions (in other words, the tilt direction) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively.

(1)造形系統1(1) Shaping system 1

(1-1)造形系統1之整體構造(1-1) Overall structure of the shaping system 1

首先,參照圖1,對本實施方式之造形系統1之整體構造進行說明。圖1係表示本實施方式之造形系統1之構造之一例的剖面圖。 First, the overall structure of the shaping system 1 according to this embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing an example of a configuration of a forming system 1 according to this embodiment.

造形系統1可形成造形物(具體而言,三維之物體)。造形系統1可於成為用以形成物體之基礎之工件W上形成造形物。造形系統1可藉由對工件W進行附加加工而形成造形物。於工件W為後述之平台43之情形時,造形系統1可於平台43上形成造形物。於工件W為由平台43所保持之現有構造物之情形時,造形系統1可於現有之構造物上形成造形物。於該情形時,造形系統1亦可形成與現有構造物一體化之造形物。形成與現有構造物一體化之造形物之動 作係與對現有之構造物附加新的構造物之動作等價。或者造形系統1亦可形成可與現有之構造物分離之造形物。此外,圖1係表示工件W為由平台43所保持之現有構造物之例。另外,以下,使用工件W為由平台43所保持之現有構造物之例來進行說明。 The shaping system 1 can form shaped objects (specifically, three-dimensional objects). The shaping system 1 can form a shaped object on a workpiece W that becomes a basis for forming an object. The shaping system 1 can form a shaped object by performing additional processing on the workpiece W. When the workpiece W is a platform 43 described later, the shaping system 1 can form a shaped object on the platform 43. When the workpiece W is an existing structure held by the platform 43, the forming system 1 can form a shape on the existing structure. In this case, the shaping system 1 may also form a shaping object integrated with the existing structure. The action of forming a shape integrated with an existing structure is equivalent to the action of adding a new structure to an existing structure. Alternatively, the shaping system 1 may form a shaping object that can be separated from an existing structure. In addition, FIG. 1 shows an example in which the workpiece W is a conventional structure held by the stage 43. In the following description, an example in which the workpiece W is a conventional structure held by the stage 43 will be described.

如上所述,造形系統1可利用雷射堆焊法來形成造形物。即,造形系統1亦可稱為使用積層造形技術而形成物體之3D列印機。此外,積層造形技術亦稱為:快速原型設計(Rapid Prototyping)、快速製造(Rapid Manufacturing)、或者積層製造(Additive Manufacturing)。 As described above, the shaping system 1 can form a shaped object by a laser surfacing method. That is, the shaping system 1 can also be referred to as a 3D printer that forms an object using a multilayer shaping technique. In addition, multilayer forming technology is also called: Rapid Prototyping, Rapid Manufacturing, or Additive Manufacturing.

為形成造形物,造形系統1係如圖1所示,具備材料供給裝置3、造形裝置4、光源5、氣體供給裝置6、及控制裝置7。材料供給裝置3、造形裝置4、光源5、氣體供給裝置6、及控制裝置7係收容於筐體C內。於圖1所示之例中,造形裝置4收容於筐體C之上部空間UC中,材料供給裝置3、光源5、氣體供給裝置6及控制裝置7收容於位於上部空間UC之下方之筐體C之下部空間LC中。但,材料供給裝置3、造形裝置4、光源5、氣體供給裝置6及控制裝置7之各自於筐體C內之配置位置並不限定於圖1所示之配置位置。 As shown in FIG. 1, the forming system 1 includes a material supply device 3, a forming device 4, a light source 5, a gas supply device 6, and a control device 7 as shown in FIG. 1. The material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 are housed in a casing C. In the example shown in FIG. 1, the shaping device 4 is accommodated in the upper space UC of the casing C, and the material supply device 3, the light source 5, the gas supply device 6, and the control device 7 are accommodated in a casing located below the upper space UC. C is in the lower space LC. However, the arrangement positions of the material supply device 3, the shaping device 4, the light source 5, the gas supply device 6, and the control device 7 in the casing C are not limited to the arrangement positions shown in FIG.

材料供給裝置3對造形裝置4供給造形材料M。材料供給裝置3係以對造型裝置4供給份量造形裝置4為了形成造形物而於每單位時間內所必需之份量之造形材料M之方式,以與該所必需之份量對應之所需供給速率來供給造形材料M。即,材料供給裝置3係以每單位時間之造形材料M之供給量成為與所需之供給速率對應之供給量之方式,供給造形材料M。此外,關於材料供給裝置3之構造,後文參照圖3來詳細說明,因此省略此處之詳細說明。 The material supply device 3 supplies a forming material M to the forming device 4. The material supply device 3 is to supply the molding device 4 with the amount of the shaping material 4 required per unit time in order to form a shaped object, at a required supply rate corresponding to the required quantity. The forming material M is supplied. That is, the material supply device 3 supplies the forming material M so that the supply amount of the forming material M per unit time becomes the supply amount corresponding to the required supply rate. The structure of the material supply device 3 will be described in detail later with reference to FIG. 3, and therefore detailed descriptions thereof are omitted here.

造形材料M係可藉由既定強度以上之光EL之照射而熔融之材料。作為此種造形材料M,例如可使用金屬性之材料以及樹脂性之材料中之至少一者。但,作為造形材料M,亦可使用與金屬性之材料以及樹脂性之材料不 同之其他材料。造形材料M為粉狀或粒狀之材料。即,造形材料M為粉粒體。 The molding material M is a material that can be melted by irradiation with light EL having a predetermined intensity or more. As such a shaping material M, for example, at least one of a metallic material and a resinous material can be used. However, as the molding material M, other materials other than metallic materials and resinous materials may be used. The shaping material M is a powdery or granular material. That is, the molding material M is a powder or a granular material.

造形裝置4係將由材料供給裝置3所供給之造形材料M進行加工而形成造形物。為將造形材料M進行加工,造形裝置4具備:造形頭41、驅動系統42、及平台43。進而,造形頭41具備:照射系統411、以及材料嘴(即供給造形材料M之供給系統)412。造形頭41、驅動系統42、及平台43收容於腔室44內。 The shaping device 4 processes the shaping material M supplied from the material supply device 3 to form a shaped object. In order to process the shaping material M, the shaping device 4 includes a shaping head 41, a driving system 42, and a platform 43. Further, the shaping head 41 includes an irradiation system 411 and a material nozzle (that is, a supply system for supplying the shaping material M) 412. The shaping head 41, the driving system 42, and the platform 43 are housed in the cavity 44.

照射系統411從射出部411a中射出光EL。具體而言,照射系統411係透過光纖等未圖示之導光路而與發出光EL之光源5光學性連接。照射系統411係透過導光路而射出由光源5傳播而來之光EL。照射系統411係從照射系統411向下方(即,-Z側)照射光EL。於照射系統411之下方配置有平台43。於在平台43上搭載有工件W之情形時,照射系統411向工件W照射光EL。即,照射系統411對工件W照射光EL。進而,照射系統411之狀態可於控制裝置7之控制下,於照射光EL之狀態、與不照射光EL之狀態之間切換。 The irradiation system 411 emits light EL from the emitting portion 411a. Specifically, the irradiation system 411 is optically connected to the light source 5 that emits light EL through a light guide path (not shown) such as an optical fiber. The irradiation system 411 emits light EL transmitted from the light source 5 through the light guide path. The irradiation system 411 radiates light EL from the irradiation system 411 downward (that is, the -Z side). A platform 43 is arranged below the irradiation system 411. When the workpiece W is mounted on the stage 43, the irradiation system 411 irradiates the workpiece EL with light EL. That is, the irradiation system 411 irradiates the workpiece EL with light EL. Further, the state of the irradiation system 411 can be switched between a state in which the light EL is irradiated and a state in which the light EL is not irradiated under the control of the control device 7.

材料嘴412具有供給造形材料M之供給出口412a。材料嘴412從供給出口412a供給造形材料M。材料嘴412係經由未圖示之管道等而與作為造形材料M之供給源的材料供給裝置3物理性連接。材料嘴412係透過管道,來從材料供給裝置3供給以所需之供給速率供給之造形材料M。此外,圖1中,材料嘴412描繪為管狀,但材料嘴412之形狀並不限定於該形狀。材料嘴412係從材料嘴412向下方(即,Z側)供給造形材料M。於材料嘴412之下方配置有平台43。於平台43上搭載有工件W之情形時,材料嘴412向工件W供給造形材料M。材料嘴412係以向照射系統411照射光EL之區域(或者其近旁)供給造形材料M之方式,相對於照射系統411而對準。 The material nozzle 412 has a supply outlet 412a for supplying the molding material M. The material nozzle 412 supplies the molding material M from the supply outlet 412a. The material nozzle 412 is physically connected to the material supply device 3 as a supply source of the molding material M via a pipe or the like (not shown). The material nozzle 412 feeds the shaping material M supplied from the material supply device 3 at a required supply rate through a pipe. In addition, in FIG. 1, the material nozzle 412 is depicted as a tube, but the shape of the material nozzle 412 is not limited to this shape. The material nozzle 412 supplies the molding material M from the material nozzle 412 downward (that is, on the Z side). A platform 43 is arranged below the material nozzle 412. When the workpiece W is mounted on the platform 43, the material nozzle 412 supplies the shaping material M to the workpiece W. The material nozzle 412 is aligned with respect to the irradiation system 411 so that the shaping material M is supplied to the area (or its vicinity) where the irradiation system 411 irradiates the light EL.

驅動系統42使造形頭41移動。驅動系統42使造形頭41分別沿著X軸、Y軸及Z軸而移動。除X軸、Y軸及Z軸之各個以外,驅動系統42亦可使其 沿著θX方向、θY方向及θZ方向中之至少一方向移動。驅動系統42例如包含馬達等。此外,照射光EL之區域、與供給造形材料M之區域亦可分別控制。例如,亦可調整射出部411a之位置、射出部411a之朝向、供給出口412a之位置、供給出口412a之朝向中之至少一部分。另外,亦可驅動照射系統411之光學構件來調整光EL所照射之區域之位置。 The drive system 42 moves the shaping head 41. The driving system 42 moves the shaping head 41 along the X-axis, the Y-axis, and the Z-axis, respectively. In addition to each of the X-axis, Y-axis, and Z-axis, the drive system 42 may move it in at least one of the θX direction, θY direction, and θZ direction. The drive system 42 includes, for example, a motor. In addition, the area where the light EL is irradiated and the area where the shaping material M is supplied can be controlled separately. For example, at least a part of the position of the injection portion 411a, the orientation of the injection portion 411a, the position of the supply outlet 412a, and the direction of the supply outlet 412a may be adjusted. In addition, the optical components of the irradiation system 411 may be driven to adjust the position of the area irradiated by the light EL.

平台43可保持工件W。進而,平台43可將所保持之工件W釋放。上述照射系統411係於平台43保持有工件W之期間之至少一部分中照射光EL。進而,上述材料嘴412係於平台43保持有工件W之期間之至少一部分中供給造形材料M。此外,材料嘴412所供給之造形材料M之一部分存在從工件W之表面向工件W之外部(例如,向平台43之周圍)散落或灑落之可能性。因此,造形系統1亦可於平台43之周圍具備回收裝置,其將散落或灑落之造形材料M回收。 The stage 43 can hold the workpiece W. Further, the stage 43 can release the held workpiece W. The above-mentioned irradiation system 411 irradiates light EL in at least a part of the period in which the stage 43 holds the workpiece W. Further, the material nozzle 412 is configured to supply the shaping material M to at least a part of the period while the stage 43 holds the workpiece W. In addition, a part of the forming material M supplied from the material nozzle 412 may be scattered or spilled from the surface of the workpiece W to the outside of the workpiece W (for example, to the periphery of the platform 43). Therefore, the forming system 1 can also be provided with a recycling device around the platform 43, which recovers the scattered or spilled forming material M.

光源5係照射例如紅外光、可見光及紫外光中之至少一者來作為光EL。但,光EL亦可使用其他種類之光。光EL為雷射光。於該情形時,光源5包含雷射光源(例如,雷射二極體(LD:Laser Diode))。但,光EL亦可不為雷射光,光源5亦可包含任意之光源(例如,LED(Light Emitting Diode,發光二極體)、放電燈等)。 The light source 5 emits at least one of infrared light, visible light, and ultraviolet light as the light EL. However, the light EL may use other types of light. Light EL is laser light. In this case, the light source 5 includes a laser light source (for example, a laser diode (LD: Laser Diode)). However, the light EL may not be laser light, and the light source 5 may include any light source (for example, LED (Light Emitting Diode), discharge lamp, etc.).

氣體供給裝置6為惰性氣體之供給源。作為惰性氣體之一例,可列舉氮氣或氬氣。氣體供給裝置6於造形裝置4之腔室44內供給惰性氣體。其結果為,腔室44之內部空間成為由惰性氣體所清洗之空間。氣體供給裝置6進而亦對材料供給裝置3供給惰性氣體。供給至材料供給裝置3中之惰性氣體如後所述,主要用於壓送造形材料M。因此,氣體供給裝置6對於材料供給裝置3供給經加壓之惰性氣體。此外,亦可將向腔室44中之氣體供給與向材料供給裝置3中之氣體供給分別控制。例如,向腔室44中之每單位時間之氣體供給量、與向 材料供給裝置3中之每單位時間之氣體供給量亦可不同。例如,亦可於將向腔室44及材料供給裝置3中之其中一者之氣體供給停止之狀態下,進行向另一者之氣體供給。另外,向腔室44中供給之氣體與向材料供給裝置3中供給之氣體中,特性(例如溫度等)亦可不同。向腔室44中供給之氣體與向材料供給裝置3中供給之氣體中,組成亦可不同。向腔室44中供給氣體之氣體供給裝置、與向材料供給裝置3中供給氣體之氣體供給裝置亦可不同。 The gas supply device 6 is a supply source of an inert gas. Examples of the inert gas include nitrogen and argon. The gas supply device 6 supplies an inert gas in the chamber 44 of the shaping device 4. As a result, the internal space of the chamber 44 becomes a space cleaned by an inert gas. The gas supply device 6 also supplies an inert gas to the material supply device 3. The inert gas supplied to the material supply device 3 is mainly used for pressure-feeding the forming material M as described later. Therefore, the gas supply device 6 supplies a pressurized inert gas to the material supply device 3. In addition, the supply of gas to the chamber 44 and the supply of gas to the material supply device 3 may be controlled separately. For example, the gas supply amount per unit time in the chamber 44 may be different from the gas supply amount per unit time in the material supply device 3. For example, the gas supply to one of the chamber 44 and the material supply device 3 may be stopped while the gas supply to the other is performed. In addition, characteristics (for example, temperature, etc.) between the gas supplied to the chamber 44 and the gas supplied to the material supply device 3 may be different. The composition of the gas supplied to the chamber 44 and the gas supplied to the material supply device 3 may be different. The gas supply device that supplies gas to the chamber 44 may be different from the gas supply device that supplies gas to the material supply device 3.

控制裝置7控制造形系統1之動作。控制裝置7可包含例如CPU(Central Processing Unit)、或記憶體。尤其於本實施方式中,控制裝置7對藉由照射系統411之光EL之出射形態進行控制。出射形態並無限定,但包含光EL之強度、光EL之出射時刻中之至少一者。此外,於光EL為脈衝光之情形時,出射形態包含脈衝光之發光時間以及脈衝光之發光時間與消光時間之比(能率)中之至少一者。進而,控制裝置7對由驅動系統42所引起之造形頭41之移動形態進行控制。移動形態並無限定,但包含移動量、移動速度、移動方向、以及移動時刻中之至少一者。進而,控制裝置7對藉由材料供給裝置3之造形材料M之供給形態進行控制。供給形態並無限定,但包含供給速率。 The control device 7 controls the operation of the shaping system 1. The control device 7 may include, for example, a CPU (Central Processing Unit) or a memory. In particular, in this embodiment, the control device 7 controls the emission form of the light EL by the irradiation system 411. The emission form is not limited, but includes at least one of the intensity of the light EL and the emission time of the light EL. In addition, when the light EL is pulsed light, the emission form includes at least one of the emission time of the pulsed light and the ratio (energy rate) of the emission time of the pulsed light to the extinction time. Furthermore, the control device 7 controls the moving form of the shaping head 41 caused by the driving system 42. The movement form is not limited, but includes at least one of a movement amount, a movement speed, a movement direction, and a movement time. Furthermore, the control device 7 controls the supply form of the molding material M by the material supply device 3. The supply pattern is not limited, but includes the supply rate.

(1-2)由造形系統1所引起之造形物之形成動作(1-2) Forming action caused by the shaping system 1

繼而,對由造形系統1所引起之造形物之形成動作進行說明。如上所述,造形系統1係利用雷射堆焊法來形成造形物。因此,造形系統1亦可藉由進行依據雷射堆焊法之現有形成動作,來形成造形物。以下,對利用雷射堆焊法之造形物之形成動作之一例進行簡單說明。 Next, a description will be given of a forming operation of the shaped object caused by the shaping system 1. As described above, the forming system 1 forms a formed object by a laser surfacing method. Therefore, the forming system 1 can also form a shaped object by performing a conventional forming operation according to the laser surfacing method. Hereinafter, an example of a formation operation of a shape by the laser surfacing method will be briefly described.

造形系統1係基於所欲形成之造形物之三維模型資料(例如,CAD(Computer Aided Design)資料)等,於工件W上形成造形物。三維模型資料亦可使用CT(Computed Tomography)、MRI(Magnetic resonance imaging)之測量資料。為形成造形物,造形系統1依序形成例如沿著Z軸方向而 排列之複數個層狀之部分構造物(以下稱為「構造層」)。例如,造形系統1係逐層地依序形成藉由將造形物沿著Z軸方向切成圓片而獲得之複數個構造層。其結果為,形成作為複數個構造層之集合體之造形物。以下,對藉由逐層地依序形成複數個構造層而形成造形物之動作之流程進行說明。 The forming system 1 forms a forming object on the workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the desired forming object. The 3D model data can also use CT (Computed Tomography), MRI (Magnetic resonance imaging) measurement data. To form a shaped object, the shaped system 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") arranged along the Z-axis direction. For example, the shaping system 1 sequentially forms a plurality of structural layers obtained by cutting a shaped object into discs along the Z-axis direction one by one. As a result, a shape is formed as an aggregate of a plurality of structural layers. Hereinafter, a flow of an operation of forming a shape by sequentially forming a plurality of structural layers one by one will be described.

首先,對形成各構造層之動作進行說明。造形系統1係於控制裝置7之控制下,對工件W上之所需區域(具體而言,欲形成用以構成某構造層之構造物之區域),從照射系統411之射出部411a中照射光EL。本實施方式中,光EL之聚光位置於工件W之表面上基本一致。其結果為,如圖2(a)所示,藉由從照射系統411之射出部411a中射出之光EL,於工件W上形成熔融池(即,藉由光EL而熔融之金屬之池(pool))MA。造形系統1係於控制裝置7之控制下,如圖2(b)所示,對於該熔融池MA,由材料嘴412來供給造形材料M。其結果為,供給至熔融池MA中之造形材料M熔融。若隨著造形頭41之移動,不再對熔融池MA照射光EL,則於熔融池MA中熔融之造形材料M經冷卻而再次固化(即,凝固)。其結果為,如圖2(c)所示,再固化之造形材料M堆積於工件W上。即,形成由再固化之造形材料M之堆積物所形成之三維構造物。如上所述之藉由光之照射EL的熔融池MA之形成、造形材料M之供給、熔融及再固化係對於工件W,一面使造形頭41沿著XY平面而相對移動一面反覆進行。此時,光EL對於工件W上欲形成構造物之區域,選擇性地照射,另一方面,對於工件W上不欲形成構造物之區域,選擇性地不照射。其結果為,於工件W上形成相當於凝固之造形材料M之集合體的構造層。 First, the operation of forming each structural layer will be described. The shaping system 1 is controlled by the control device 7 to irradiate a desired area on the workpiece W (specifically, an area to form a structure to constitute a certain structural layer) from the emitting portion 411a of the irradiation system 411. Light EL. In this embodiment, the condensing position of the light EL is substantially the same on the surface of the workpiece W. As a result, as shown in FIG. 2 (a), a molten pool is formed on the workpiece W by the light EL emitted from the emitting portion 411a of the irradiation system 411 (that is, a pool of a metal that is molten by the light EL ( pool)) MA. The shaping system 1 is under the control of the control device 7, as shown in FIG. 2 (b). For the melting pool MA, the shaping material M is supplied from the material nozzle 412. As a result, the forming material M supplied to the melting pool MA is melted. If the melting head MA is no longer irradiated with light EL as the shaping head 41 moves, the shaping material M melted in the melting pool MA is cooled and solidified again (ie, solidified). As a result, as shown in FIG. 2 (c), the re-cured forming material M is deposited on the workpiece W. That is, a three-dimensional structure formed by the deposit of the re-cured molding material M is formed. As described above, the formation of the molten pool MA irradiated with light by EL and the supply, melting, and re-solidification of the forming material M are performed repeatedly on the workpiece W while the forming head 41 is relatively moved along the XY plane. At this time, the light EL is selectively irradiated to a region where a structure is to be formed on the workpiece W, and on the other hand, a region where the structure is not to be formed on the workpiece W is selectively irradiated. As a result, a structural layer corresponding to the aggregate of the solidified forming material M is formed on the workpiece W.

造形系統1係於控制裝置7之控制下,基於三維模型資料(尤其與第一層之構造層#1對應之三維模型資料),來進行用以形成此種構造層之動作。其結果為,於工件W上形成第1層之構造層#1。然後,造形系統1將第2層之構造層#2形成於工件W上。為形成構造層#2,控制裝置7首先以造形頭41沿 著Z軸方向而移動之方式控制驅動系統42。具體而言,控制裝置7控制驅動系統42,以照射光EL之區域以及供給造形材料M之區域設定於第1層之構造層#1之表面上之方式,朝向+Z軸側而使造形頭41移動。藉此,光EL之聚光位置於構造層#1之表面上基本一致。然後,造形系統1係於控制裝置7之控制下,以與形成第1層之構造層#1之動作相同之動作,基於與第2層之構造層#2對應之三維模型資料,於第1層之構造層#1上形成第2層之構造層#2。以下,反覆進行同樣之動作,直至形成構成應形成於工件W上之造形物之所有構造層為止。其結果為,藉由複數個構造層之集合體而形成造形物。此外,於某一個構造層之形成中,亦可以光EL之聚光位置與下方之構造層(或者工件W之表面)基本一致之方式,於造形頭41之Z軸方向上使位置變化。另外,光EL之聚光位置亦可例如不驅動造形頭41,而藉由照射系統411之光學構件等之移動而變化。 The shaping system 1 is under the control of the control device 7 and performs operations for forming such a structural layer based on the three-dimensional model data (especially the three-dimensional model data corresponding to the first structural layer # 1). As a result, the first structural layer # 1 is formed on the workpiece W. Then, the forming system 1 forms the second structural layer # 2 on the workpiece W. To form the structural layer # 2, the control device 7 first controls the driving system 42 so that the shaping head 41 moves in the Z-axis direction. Specifically, the control device 7 controls the driving system 42 so that the area where the light EL is irradiated and the area where the forming material M is supplied are set on the surface of the first structural layer # 1 so that the forming head faces the + Z axis side. 41 to move. Thereby, the light-concentrating position of the light EL is substantially uniform on the surface of the structure layer # 1. Then, the shaping system 1 is under the control of the control device 7 and performs the same operation as that of forming the first structural layer # 1, and based on the three-dimensional model data corresponding to the second structural layer # 2, the first The second structural layer # 2 is formed on the structural layer # 1. Hereinafter, the same operation is repeatedly performed until all the structural layers constituting the article to be formed on the workpiece W are formed. As a result, a shape is formed by an assembly of a plurality of structural layers. In addition, in the formation of a certain structural layer, the position of the light EL can be changed in the Z-axis direction of the shaping head 41 in a manner that the light-condensing position of the light EL is substantially consistent with the structure layer below (or the surface of the workpiece W). In addition, the light-condensing position of the light EL may be changed by, for example, not driving the shaping head 41 but by moving the optical member or the like of the irradiation system 411.

(2)材料供給裝置3(2) Material supply device 3

(2-1)材料供給裝置3之構造(2-1) Structure of material supply device 3

繼而,參照圖3及圖4,對材料供給裝置3之構造進行說明。圖3係表示材料供給裝置3之構造之剖面圖。圖4係將材料供給裝置3之一部分放大表示之剖面圖及俯視圖。 Next, the structure of the material supply device 3 will be described with reference to FIGS. 3 and 4. FIG. 3 is a cross-sectional view showing the structure of the material supply device 3. FIG. 4 is an enlarged cross-sectional view and a plan view showing a part of the material supply device 3.

如圖3所示,材料供給裝置3具備料斗31、保持構件32、振動裝置33、及材料送出構件34。料斗31、保持構件32、振動裝置33、及材料送出構件34收容於筐體35之內部空間351中。此外,振動裝置33之至少一部分亦可配置於筐體35之外部。 As shown in FIG. 3, the material supply device 3 includes a hopper 31, a holding member 32, a vibration device 33, and a material delivery member 34. The hopper 31, the holding member 32, the vibration device 33, and the material sending member 34 are housed in an internal space 351 of the casing 35. In addition, at least a part of the vibration device 33 may be disposed outside the casing 35.

料斗31係用以儲藏造形材料M之裝置。料斗31具有漏斗狀之形狀(即,倒圓錐狀之形狀)。由具有漏斗狀之形狀之隔離壁所包圍之空間係相當於用以儲藏造形材料M之儲藏空間313。但,料斗31亦可具有其他形狀。此外,料斗31之形狀亦可為其他形狀(例如倒四角錐狀之形狀)。 The hopper 31 is a device for storing the forming material M. The hopper 31 has a funnel-like shape (that is, an inverted conical shape). A space surrounded by a partition wall having a funnel shape is equivalent to a storage space 313 for storing the forming material M. However, the hopper 31 may have other shapes. In addition, the shape of the hopper 31 may be other shapes (for example, an inverted quadrangular pyramid shape).

於料斗31之下端(即,儲藏空間313之下方)形成有供給口311。供給口311係沿著Z軸方向而於料斗31之底部之隔離壁中貫通之開口(即,貫通孔)。供給口311係由料斗31之下部內表面314來規定(即,被包圍)。供給口311之剖面(具體而言為沿著XY平面之剖面)之形狀雖為圓形,但亦可為其他形狀。其他形狀包含長圓形、橢圓形以及矩形中之至少一者。供給口311係用以從料斗31中向料斗31之下方(即,-Z側)供給造形材料M之開口。即,料斗31所儲藏之造形材料M經由供給口311而供給至料斗31之外部(換言之,排出或掉落)。 A supply port 311 is formed at the lower end of the hopper 31 (ie, below the storage space 313). The supply port 311 is an opening (ie, a through hole) penetrating through the partition wall at the bottom of the hopper 31 along the Z-axis direction. The supply port 311 is defined (ie, surrounded) by the lower inner surface 314 of the hopper 31. Although the shape of the cross section of the supply port 311 (specifically, the cross section along the XY plane) is circular, other shapes may be used. The other shapes include at least one of an oval, an oval, and a rectangle. The supply port 311 is an opening for supplying the shaping material M from the hopper 31 to the lower side (ie, the -Z side) of the hopper 31. That is, the forming material M stored in the hopper 31 is supplied to the outside of the hopper 31 (in other words, discharged or dropped) through the supply port 311.

於料斗31之上部形成有通氣孔312。通氣孔312係以將料斗31之儲藏空間313(尤其是儲藏於儲藏空間313中之造形材料M之上部之空間)與筐體35之內部空間351(尤其是從料斗31中排出造形材料M之空間)連結之方式,於料斗31之隔離壁中貫通之開口(即,貫通孔)。藉由形成通氣孔312,則即便為於儲藏空間313中儲藏有造形材料M之情形,亦防止儲藏空間313之壓力與內部空間351之壓力之不均衡,從料斗31中順利地供給造形材料M。其結果為,不存在由於儲藏空間313之壓力與內部空間351之壓力之不均衡,而造成從料斗31中突發性地供給造形材料M之情形。另外,不存在由於儲藏空間313之壓力與內部空間351之壓力之不均衡,而造成從料斗31中不流暢地供給造形材料M(或者,從料斗31中排出之造形材料M經由供給口311而逆流至料斗31之儲藏空間313中)之情形。此外,亦可代替形成通氣孔312,而以消除儲藏空間313之壓力與內部空間351之壓力之不均衡之方式,將料斗31之儲藏空間313與筐體35之內部空間351以管道等來連結。另外,例如於儲藏空間313與內部空間351之壓力差小之情形時,儲藏空間313與內部空間351亦可不透過通氣孔312等來連接。 A vent hole 312 is formed in an upper portion of the hopper 31. The ventilation hole 312 is used to store the storage space 313 of the hopper 31 (especially the space above the forming material M stored in the storage space 313) and the internal space 351 of the casing 35 (especially the shape material M is discharged from the hopper 31). A space) connection, an opening (ie, a through hole) penetrating in the partition wall of the hopper 31. By forming the ventilation holes 312, even if the forming material M is stored in the storage space 313, the imbalance between the pressure of the storage space 313 and the pressure of the internal space 351 is prevented, and the forming material M is smoothly supplied from the hopper 31. . As a result, there is no case where the forming material M is suddenly supplied from the hopper 31 due to the imbalance between the pressure of the storage space 313 and the pressure of the internal space 351. In addition, there is no uneven supply of the molding material M from the hopper 31 due to the imbalance between the pressure of the storage space 313 and the pressure of the internal space 351 (or, the molding material M discharged from the hopper 31 does not pass through the supply port 311. To the storage space 313 of the hopper 31). In addition, instead of forming the ventilation holes 312, the storage space 313 of the hopper 31 and the internal space 351 of the casing 35 can be connected by pipes or the like in order to eliminate the imbalance between the pressure of the storage space 313 and the pressure of the internal space 351 . In addition, for example, when the pressure difference between the storage space 313 and the internal space 351 is small, the storage space 313 and the internal space 351 may be connected without passing through the vent hole 312 or the like.

保持構件32保持從料斗31之供給口311中向料斗31之外部供給之 造形材料M。保持構件32配置於料斗31之下方。保持構件32配置於供給口311之下方。保持構件32係以保持構件32之一部分位於供給口311之下方最近處之方式配置。即,保持構件32係以保持構件32之一部分沿著Z軸方向而與供給口311對向之方式配置。 The holding member 32 holds the molding material M supplied from the supply port 311 of the hopper 31 to the outside of the hopper 31. The holding member 32 is disposed below the hopper 31. The holding member 32 is disposed below the supply port 311. The holding member 32 is arranged so that a part of the holding member 32 is located nearest to the lower part of the supply port 311. That is, the holding member 32 is arranged so that a part of the holding member 32 faces the supply port 311 along the Z-axis direction.

保持構件32具備底構件321以及側壁構件322。 The holding member 32 includes a bottom member 321 and a side wall member 322.

底構件321配置於料斗31之下方。底構件321配置於供給口311之下方。底構件321係以底構件321之一部分位於供給口311之下方最近處之方式配置。即,底構件321係以底構件321之一部分沿著Z軸方向而與供給口311對向之方式配置。 The bottom member 321 is disposed below the hopper 31. The bottom member 321 is disposed below the supply port 311. The bottom member 321 is arranged so that a part of the bottom member 321 is located below the supply port 311 and closest. That is, the bottom member 321 is arranged so that a part of the bottom member 321 faces the supply port 311 along the Z-axis direction.

底構件321之上表面(即,+Z側之面)成為用以保持從供給口311中供給之造形材料M之保持面323。因此,保持面323配置於料斗31之下方。保持面323配置於供給口311之下方。保持面323係以保持面323之一部分位於供給口311之下方最近處之方式配置。即,保持面323係以保持面323之一部分沿著Z軸方向而與供給口311對向之方式配置。 The upper surface (ie, the + Z side surface) of the bottom member 321 becomes a holding surface 323 for holding the molding material M supplied from the supply port 311. Therefore, the holding surface 323 is arranged below the hopper 31. The holding surface 323 is disposed below the supply port 311. The holding surface 323 is arranged such that a part of the holding surface 323 is located below the supply port 311 and closest. That is, the holding surface 323 is arranged so that a part of the holding surface 323 faces the supply port 311 along the Z-axis direction.

保持面323係沿著XY平面(或者與XY平面平行)之面,為水平面。保持面323配置於從供給口311沿著Z軸方向而離開之位置。保持面323不與規定供給口311之料斗31之下部內表面314之下端部3141接觸。保持面323不與料斗31之下表面315接觸。保持面323不會堵塞供給口311。此外,料斗31之下表面315可與沿著XY平面之面(或者水平面)平行,亦可不平行。 The holding surface 323 is a surface along the XY plane (or parallel to the XY plane), and is a horizontal plane. The holding surface 323 is disposed at a position separated from the supply port 311 along the Z-axis direction. The holding surface 323 does not contact the lower end portion 3141 of the lower inner surface 314 of the hopper 31 of the predetermined supply port 311. The holding surface 323 does not contact the lower surface 315 of the hopper 31. The holding surface 323 does not block the supply port 311. In addition, the lower surface 315 of the hopper 31 may be parallel to the plane (or horizontal plane) along the XY plane, and may not be parallel.

保持面323之大小成為滿足以下所說明之第1條件、第2條件及第3條件之大小。 The size of the holding surface 323 is a size that satisfies the first condition, the second condition, and the third condition described below.

第1條件係保持面323之大小大於供給口311之剖面之條件。此處,供給口311之剖面可設為與保持面323平行之面中之剖面。即,第1條件係如圖4所示,保持面323之面積S2大於供給口311之截面積S1之條件。 The first condition is a condition that the size of the holding surface 323 is larger than the cross section of the supply port 311. Here, the cross section of the supply port 311 may be a cross section of a plane parallel to the holding surface 323. That is, as shown in FIG. 4, the first condition is a condition that the area S2 of the holding surface 323 is larger than the cross-sectional area S1 of the supply port 311.

第2條件係如圖4所示,藉由如下之假想面VS2來記述,該假想面VS2係隨著從規定供給口311之料斗31之下部內表面314之下端部3141朝向下方而向外側擴展,且與保持面323(或者將保持面323放大之虛擬之面)形成之角度成為造形材料M之靜止角θr之面。第2條件係保持面323之大小成為圓形之區域3231之大小以上之條件,該圓形之區域3231係由假想面VS2與保持面323(或者將保持面323放大之虛擬之面)之交差部3230來規定外邊緣(即,圓周),且位於與保持面323相同之高度。即,第2條件係保持面323大至保持面323可包含區域3231(即,可於保持面323上設定區域3231)之程度之條件。即,假想面VS2係從下端部3141延伸至保持面323,且以與保持面323形成之角度成為造形材料M之靜止角θr之方式,相對於保持面323而傾斜之面。於該情形時,區域3231實質上可稱為如下之圓形區域,其從位於供給口311之下方最近處之保持面323上之基準點3233(參照圖4)向外側擴展,且大於供給口311之剖面。另外,靜止角θr係可於保持構件32靜止之狀況下,保持堆積於保持面323上之造形材料M之山之穩定(即,不會導致造形材料M之山之自發性崩塌)的該山之斜面之最大角。因此,第2條件實質上亦可稱為保持面323大至如下程度之條件,即,於保持構件32靜止之狀況下,可維持堆積於保持面323上之造形材料M之山之靜止角θr(即,可將造形材料M之山之斜面之角度設為靜止角θr以下)之程度。通常,由於靜止角θr成為45度以下,故而圓形之區域3231之半徑大於供給口311與保持面323之間之距離。此外,區域3231亦可不為圓形之區域。於區域3231不為圓形之區域之情形時,亦可將與該區域內切之圓或者外切之圓視為區域3231。 As shown in FIG. 4, the second condition is described by an imaginary surface VS2 that expands outward as it goes downward from the lower end portion 3141 of the inner surface 314 of the lower portion of the hopper 31 of the predetermined supply port 311. And the angle formed by the holding surface 323 (or a virtual surface that enlarges the holding surface 323) becomes the surface of the forming material M at a rest angle θr. The second condition is a condition that the size of the holding surface 323 becomes equal to or greater than the size of the circular area 3231. The circular area 3231 is the intersection between the virtual surface VS2 and the holding surface 323 (or a virtual surface that enlarges the holding surface 323). The portion 3230 defines the outer edge (ie, the circumference) and is located at the same height as the holding surface 323. That is, the second condition is a condition that the holding surface 323 is large enough that the holding surface 323 can include the area 3231 (that is, the area 3231 can be set on the holding surface 323). That is, the imaginary plane VS2 extends from the lower end portion 3141 to the holding surface 323 and is inclined with respect to the holding surface 323 so that the angle formed with the holding surface 323 becomes the rest angle θr of the molding material M. In this case, the area 3231 can be substantially referred to as a circular area that expands outward from the reference point 3233 (refer to FIG. 4) on the holding surface 323 located immediately below the supply port 311 and is larger than the supply port Section 311. In addition, the angle of repose θr is a mountain that can maintain the stability of the mountain of the forming material M deposited on the holding surface 323 (ie, does not cause the spontaneous collapse of the mountain of the forming material M) while the holding member 32 is stationary. The maximum angle of the bevel. Therefore, the second condition can also be substantially referred to as a condition where the holding surface 323 is large enough to maintain the stationary angle θr of the mountain of the forming material M deposited on the holding surface 323 while the holding member 32 is stationary. (In other words, the angle of the slope of the mountain of the forming material M can be set to be equal to or less than the angle of repose θr). Generally, since the angle of repose θr is 45 degrees or less, the radius of the circular region 3231 is larger than the distance between the supply port 311 and the holding surface 323. In addition, the area 3231 may not be a circular area. In the case where the area 3231 is not a circular area, the circle inscribed in or out of the area may also be regarded as the area 3231.

第3條件係指保持面323大至如下程度之條件,即,保持面323除了區域3231之外,還可具備向區域3231之外側擴展之區域3232(參照圖4)之程度。即,第3條件係保持面323大至可於區域3231之外側設定區域3232之程度 之條件。於保持面323具備區域3232之情形時,如圖4所明示,從料斗31之下端部(即,供給口311之邊緣)3141延伸至保持面323之外邊緣3234(即,區域3232之外邊緣,且為保持面323之端部)之面即假想面VS1與保持面323形成之角度θ1成為靜止角θr以下。因此,保持面323可於假想面VS1與供給口311之間保持造形材料M。此外,由於滿足保持面323大於供給口311之剖面之第1條件,故而假想面VS1成為相對於保持面323而傾斜之面。進而,於保持面323具備區域3232之情形時,假想面VS2成為與保持面323交叉之面。 The third condition refers to a condition that the holding surface 323 is large enough that the holding surface 323 may include an area 3232 (see FIG. 4) that extends beyond the area 3231 in addition to the area 3231. That is, the third condition is a condition that the holding surface 323 is large enough that the area 3232 can be set outside the area 3231. When the holding surface 323 is provided with the region 3232, as shown in FIG. 4, the lower end of the hopper 31 (that is, the edge of the supply port 311) 3141 is extended to the outer edge 3234 of the holding surface 323 (that is, the outer edge of the region 3232). And is an end portion of the holding surface 323), that is, an angle θ1 formed by the imaginary surface VS1 and the holding surface 323 becomes equal to or less than the rest angle θr. Therefore, the holding surface 323 can hold the molding material M between the virtual surface VS1 and the supply port 311. In addition, since the first condition that the holding surface 323 is larger than the cross section of the supply port 311 is satisfied, the imaginary surface VS1 becomes a surface inclined with respect to the holding surface 323. Furthermore, when the holding surface 323 includes the region 3232, the virtual surface VS2 becomes a surface that intersects the holding surface 323.

側壁構件322係從底構件321向+Z側突出之構件(換言之,部分)。圖3及圖4所示之例中,側壁構件322形成於保持面323之外邊緣3234(或者其近旁)。側壁構件322係作為止動器而發揮功能,該止動器係用以防止造形材料M從保持面323(即,底構件321)上灑落(即,落下,以下相同)至保持面323之外部之未預想之區域。相反而言,側壁構件322係作為引導構件而發揮功能,該引導構件係以造形材料M從保持面323(即,底構件321)上灑落至保持面323之外部之預想之區域之方式,來引導保持面323上之造形材料M。作為造形材料M灑落之區域而預想之區域係從保持面323來看,材料送出構件34所位處之區域。如後所述,保持面323所保持之造形材料M從保持面323上灑落而搬出至材料送出構件34上。因此,側壁構件322係以如下方式形成於底構件321上之適當位置:造形材料M從保持面323上搬出至材料送出構件34上,另一方面,造形材料M不會從保持面323上灑落至非材料送出構件34所位處之部分。具體而言,側壁構件322係形成於造形材料M不應灑落之保持面323上之區域(尤其是外邊緣3234或者其近旁之區域)。另一方面,側壁構件322不形成於造形材料M應灑落之保持面323上之區域(尤其是外邊緣3234或者其近旁之區域)。此外,亦可將側壁構件322設置於保持面323之外邊緣3234中的+X側之部分及-X側之部分。另外,側壁構件322之至少一部分亦可設置於保持面323上之區域 3231內。 The side wall member 322 is a member (in other words, a part) protruding from the bottom member 321 to the + Z side. In the examples shown in FIGS. 3 and 4, the side wall member 322 is formed on the outer edge 3234 (or near) of the holding surface 323. The side wall member 322 functions as a stopper for preventing the molding material M from being spilled from the holding surface 323 (ie, the bottom member 321) (that is, falling, the same below) to the outside of the holding surface 323. Unexpected area. In contrast, the side wall member 322 functions as a guide member in such a manner that the molding material M is spilled from the holding surface 323 (ie, the bottom member 321) to an intended area outside the holding surface 323. Guide the forming material M on the holding surface 323. The area envisioned as the area where the forming material M is dropped is the area where the material sending member 34 is located from the holding surface 323. As will be described later, the forming material M held by the holding surface 323 is dropped from the holding surface 323 and carried out onto the material feeding member 34. Therefore, the side wall member 322 is formed at an appropriate position on the bottom member 321 in such a manner that the shaping material M is carried out from the holding surface 323 to the material feeding member 34, and on the other hand, the shaping material M does not spill from the holding surface 323 To the portion where the non-material sending member 34 is located. Specifically, the side wall member 322 is formed on a region (particularly, the outer edge 3234 or a region adjacent thereto) on the holding surface 323 where the forming material M should not be spilled. On the other hand, the side wall member 322 is not formed on a region (particularly, the outer edge 3234 or a region near it) on the holding surface 323 to which the forming material M should be dropped. In addition, the side wall member 322 may be provided on the + X side portion and the −X side portion of the outer edge 3234 of the holding surface 323. In addition, at least a part of the side wall member 322 may be provided in a region 3231 on the holding surface 323.

返回至圖3,振動裝置33係於控制裝置7之控制下,使保持構件32振動。具體而言,振動裝置33係透過振動傳遞構件331而與保持構件32(圖3所示之例中,其底構件321)連結。振動裝置33係透過振動傳遞構件331而將振動傳遞至保持構件32。其結果為,保持構件32振動。振動裝置33可沿著X軸方向而使保持構件32振動,亦可沿著Y軸方向而使保持構件32振動,亦可沿著Z軸方向而使保持構件32振動,亦可在與X軸、Y軸、Z軸中之至少一者交叉之方向上振動。振動裝置33並無限定,但包含超音波馬達或者電磁馬達、使用積層壓電元件之致動器。根據振動裝置33之種類,亦可不透過振動傳遞構件331,而使用電磁力等遠距離力或者共振等而間接地使保持構件32振動。由振動裝置33所引起之振動並不限定於週期性之振動,亦可為非週期性之振動。 Returning to FIG. 3, the vibration device 33 is controlled by the control device 7 to vibrate the holding member 32. Specifically, the vibration device 33 is connected to the holding member 32 (the bottom member 321 in the example shown in FIG. 3) through the vibration transmission member 331. The vibration device 33 transmits vibration to the holding member 32 through the vibration transmission member 331. As a result, the holding member 32 vibrates. The vibration device 33 may vibrate the holding member 32 along the X-axis direction, may also vibrate the holding member 32 along the Y-axis direction, or may vibrate the holding member 32 along the Z-axis direction, or may Vibrate in a direction where at least one of the Y axis, the Y axis, and the Z axis intersect. The vibration device 33 is not limited, but includes an ultrasonic motor or an electromagnetic motor, and an actuator using a laminated piezoelectric element. Depending on the type of the vibration device 33, the holding member 32 may be indirectly vibrated by using a long-distance force such as electromagnetic force or resonance without transmitting the vibration transmission member 331. The vibration caused by the vibration device 33 is not limited to periodic vibration, and may be non-periodic vibration.

振動裝置33係於控制裝置7之控制下,藉由使保持構件32振動,而使保持面323所保持之造形材料M之一部分經由保持面323之外邊緣3234而落下至保持面323之外部。即,振動裝置33係藉由使保持構件32振動,而將保持面323所保持(即,堆積於保持面323上)之造形材料M之一部分,從保持面323上,於保持面323上通過而搬出至保持面323之外部(具體而言,材料送出構件34)。即,振動裝置33係於控制裝置7之控制下,以如下方式使保持構件32振動:保持面323所保持之造形材料M之一部分從保持面323上,通過保持面323而搬出至保持面323之外部(具體而言,材料送出構件34)。 The vibration device 33 is controlled by the control device 7, and by vibrating the holding member 32, a part of the molding material M held by the holding surface 323 is dropped to the outside of the holding surface 323 through the outer edge 3234 of the holding surface 323. That is, the vibrating device 33 vibrates the holding member 32 to pass a portion of the forming material M held by the holding surface 323 (that is, stacked on the holding surface 323) from the holding surface 323 to the holding surface 323. On the other hand, it is carried out to the outside of the holding surface 323 (specifically, the material feeding member 34). That is, the vibration device 33 is controlled by the control device 7 to vibrate the holding member 32 in such a manner that a part of the molding material M held by the holding surface 323 is carried out from the holding surface 323 to the holding surface 323 through the holding surface 323. Outside (specifically, the material sending member 34).

如上所述,保持面323與料斗31之供給口311分離(即,不接觸)。即,保持構件32與料斗31分離(即,不接觸)。因此,振動裝置33不會使料斗31振動。 As described above, the holding surface 323 is separated from the supply port 311 of the hopper 31 (ie, not in contact). That is, the holding member 32 is separated from the hopper 31 (ie, not in contact). Therefore, the vibration device 33 does not cause the hopper 31 to vibrate.

材料送出構件34接收從保持面323上搬出(即,落下,以下相同)之造形材料M。材料送出構件34為了接收從保持面323上搬出之造形材料 M,而配置於可接收從保持面323上搬出之造形材料M之位置。圖3所示之例中,材料送出構件34位於保持面323之下方及斜下方之至少一者。於該情形時,造形材料M係以從保持面323上灑落(即,落下)之方式搬出至保持面323之外部,材料送出構件34配置於造形材料M從保持面323上之落下路徑上。 The material sending-out member 34 receives the shaping material M carried out from the holding surface 323 (that is, dropped, the same applies hereinafter). The material sending-out member 34 is arranged at a position capable of receiving the shaping material M carried out from the holding surface 323 in order to receive the shaping material M carried out from the holding surface 323. In the example shown in FIG. 3, the material feeding member 34 is located at least one of below and obliquely below the holding surface 323. In this case, the forming material M is carried out to the outside of the holding surface 323 by being dropped (ie, dropped) from the holding surface 323, and the material sending member 34 is arranged on the falling path of the forming material M from the holding surface 323.

材料送出構件34為了適當地接收從保持面323上搬出之造形材料M,而具有漏斗狀之形狀(例如倒圓錐狀之形狀)。材料送出構件34係以藉由具有漏斗狀之形狀之隔離壁,收集從保持面323上搬出之造形材料M之方式來接收。但,材料送出構件34亦可具有其他形狀(例如,倒四角錐狀之形狀)。 The material feeding member 34 has a funnel-like shape (for example, an inverted conical shape) in order to appropriately receive the shaping material M carried out from the holding surface 323. The material sending member 34 is received by collecting the forming material M carried out from the holding surface 323 through a partition wall having a funnel shape. However, the material sending-out member 34 may have other shapes (for example, an inverted quadrangular pyramid shape).

材料送出構件34進而將從保持面323上接收之造形材料M送出至材料供給裝置3之外部(即,至造形裝置4)。為將造形材料M送出至造形裝置4中,而於材料送出構件34之下端形成有送出口341。送出口341係沿著Z軸方向從材料送出構件34之底部之隔離壁中貫通之開口(即,貫通孔)。送出口341之剖面(具體而言,沿著XY平面之剖面)之形狀為圓形,亦可為其他形狀。其他形狀包含長圓形、橢圓形及矩形中之至少一者。 The material sending-out member 34 further sends out the shaping material M received from the holding surface 323 to the outside of the material supply device 3 (ie, to the shaping device 4). In order to feed the molding material M into the molding device 4, a feeding port 341 is formed at the lower end of the material feeding member 34. The sending-out port 341 is an opening (ie, a through hole) penetrating from a partition wall at the bottom of the material sending-out member 34 along the Z-axis direction. The shape of the cross-section (specifically, the cross-section along the XY plane) of the delivery port 341 is circular, and may be other shapes. The other shapes include at least one of an oval, an oval, and a rectangle.

於筐體35上形成有送出口352。送出口352係與材料送出構件34之送出口341連通。於送出口352上,連接有與造形裝置4相連之上述未圖示之管道。因此,材料送出構件34所送出之造形材料M係經由送出口341及352以及未圖示之管道而送出至造形裝置4中。 A delivery port 352 is formed in the casing 35. The delivery port 352 is in communication with the delivery port 341 of the material delivery member 34. A pipe (not shown) connected to the shaping device 4 is connected to the delivery port 352. Therefore, the forming material M sent from the material sending member 34 is sent to the forming device 4 through the sending ports 341 and 352 and a pipe (not shown).

於筐體35上進而形成有流入口353。流入口(供氣口)353係與上述氣體供給裝置6連接。因此,於筐體35之內部空間351中,透過流入口353,由上述氣體供給裝置6來供給經加壓之惰性氣體。 An inlet 353 is further formed in the casing 35. The inflow port (air supply port) 353 is connected to the gas supply device 6 described above. Therefore, in the internal space 351 of the casing 35, a pressurized inert gas is supplied from the gas supply device 6 through the inflow port 353.

於筐體35上進而形成有材料補充口354。材料補充口354係用以於料斗31中補充造形材料M之開口。材料補充口354通常(具體而言,於料斗31中不補充造形材料M之期間中)由未圖示之蓋而密閉。因此,內部空間351之狀 態通常維持為經加壓之狀態。該材料補充口354之蓋係於料斗31中補充造形材料M之期間打開。 A material replenishing port 354 is formed in the casing 35. The material replenishing port 354 is an opening for replenishing the forming material M in the hopper 31. The material replenishing port 354 is normally closed (specifically, during the period when the forming material M is not replenished in the hopper 31) by a cover (not shown). Therefore, the state of the internal space 351 is usually maintained in a pressurized state. The cover of the material replenishing port 354 is opened during the replenishment of the forming material M in the hopper 31.

此外,材料補充口354亦可出於造形材料M之補充以外之目的(例如,配置於筐體35內之零件之交換、維護等)而使用。 In addition, the material replenishing port 354 can also be used for purposes other than replenishing the forming material M (for example, replacement and maintenance of parts arranged in the casing 35).

(2-2)由材料供給裝置3所引起之造形材料M之供給動作(2-2) Supply operation of the forming material M by the material supply device 3

繼而,參照圖5(進而,視需要參照上述圖4),對由材料供給裝置3所進行之造形材料M之供給動作進行說明。 Next, the supply operation of the shaping material M by the material supply device 3 will be described with reference to FIG. 5 (and, if necessary, the above-mentioned FIG. 4).

首先,如上所述,保持面323為沿著XY平面之面,且以從供給口311(換言之,料斗31之下表面315)起沿著Z軸方向而離開之方式配置於供給口311之下方。因此,如圖5所示,從供給口311中供給(即,落下)之造形材料M堆積於保持面323上。保持面323係以從供給口311中供給之造形材料M堆積於保持面323上之方式,保持造形材料M。保持面323係以於供給口311與保持面323之間(即,料斗31之下表面315與保持面323之間)保持造形材料M之方式,來保持造形材料M。此時,保持面323保持與供給口311與保持面323之間之距離D對應之份量之造形材料M。具體而言,供給口311與保持面323之間之距離D越大,保持面323保持越多份量之造形材料M。即,供給口311與保持面323之間之距離D越大,則保持面323所保持之造形材料M之份量越多。 First, as described above, the holding surface 323 is a surface along the XY plane, and is disposed below the supply port 311 from the supply port 311 (in other words, the lower surface 315 of the hopper 31) in the Z-axis direction. . Therefore, as shown in FIG. 5, the molding material M supplied (ie, dropped) from the supply port 311 is deposited on the holding surface 323. The holding surface 323 holds the forming material M such that the forming material M supplied from the supply port 311 is deposited on the holding surface 323. The holding surface 323 holds the forming material M in such a manner that the forming material M is held between the supply port 311 and the holding surface 323 (that is, between the lower surface 315 of the hopper 31 and the holding surface 323). At this time, the holding surface 323 holds the molding material M in an amount corresponding to the distance D between the supply port 311 and the holding surface 323. Specifically, the larger the distance D between the supply port 311 and the holding surface 323 is, the more portions of the forming material M are held by the holding surface 323. That is, the larger the distance D between the supply port 311 and the holding surface 323, the larger the amount of the molding material M held by the holding surface 323.

進而,如上所述,保持面323之大小成為滿足第1條件之大小,該第1條件為保持面323大於供給口311之剖面。因此,如圖5所示,從供給口311中供給之造形材料M係以形成隨著從供給口311朝向下方而向外側擴展之造形材料M之山之方式,堆積於保持面323上。越接近位於供給口311之下方最近處的保持面323上之基準點3233(參照圖4),保持面323保持更多之造形材料M。保持面323係以於供給口311、保持面323及假想面VS1(參照圖4)之間保持造形材料M而形成造形材料M之山之方式,來保持造形材料M。 Furthermore, as described above, the size of the holding surface 323 is a size that satisfies the first condition that the holding surface 323 is larger than the cross section of the supply port 311. Therefore, as shown in FIG. 5, the forming material M supplied from the supply port 311 is stacked on the holding surface 323 so as to form a mountain of the forming material M that expands outward from the supply port 311 downward. The closer to the reference point 3233 (refer to FIG. 4) on the holding surface 323 located below the supply port 311, the holding surface 323 holds more forming material M. The holding surface 323 holds the forming material M by holding the forming material M between the supply port 311, the holding surface 323, and the virtual surface VS1 (see FIG. 4) to form a mountain of the forming material M.

進而,如上所述,保持面323之大小成為滿足第2條件之大小,該第2條件為:保持面323大至可於保持面323上設定圓形之區域3231之程度(即,於保持構件32靜止之狀況下,可維持堆積於保持面323上之造形材料M之山之靜止角θr之程度)。因此,如圖5所示,保持面323可以如下方式來保持造形材料M:從供給口311中供給之造形材料M之山係以其斜面與保持面323所形成之角度不超過靜止角θr之狀態形成於保持面323上。即,保持面323可以於保持構件32靜止(即,振動裝置33不使保持構件32振動)之狀況下,造形材料M之山不會自發性地崩塌之方式,保持造形材料M。 Further, as described above, the size of the holding surface 323 is a size that satisfies the second condition that the holding surface 323 is large enough that a circular area 3231 can be set on the holding surface 323 (that is, on the holding member). (32) In a stationary state, the degree of repose angle θr of the mountain of the forming material M deposited on the holding surface 323 can be maintained). Therefore, as shown in FIG. 5, the holding surface 323 can hold the forming material M in such a manner that an angle formed by the slope of the forming material M supplied from the supply port 311 and the holding surface 323 does not exceed the rest angle θr The state is formed on the holding surface 323. That is, the holding surface 323 can hold the forming material M in a state where the holding member 32 is stationary (that is, the vibration device 33 does not cause the holding member 32 to vibrate) so that the mountain of the forming material M does not collapse spontaneously.

進而,如上所述,保持面323之大小滿足如下之第3條件:保持面323大至如下程度,即,保持面323除了區域3231以外,還具備向區域3231之外側擴展之區域3232之程度。因此,保持面323可不僅使用區域3231,而且亦使用區域3232,來保持造形材料M。因此,保持面323可將造形材料M於保持面323上形成之山,以其斜面與保持面323所形成之角度成為靜止角θr以下之狀態來保持。其結果為,保持面323可以從供給口311中供給之造形材料M之山更難以自發性地崩塌之方式,保持造形材料M。 Furthermore, as described above, the size of the holding surface 323 satisfies the third condition that the holding surface 323 is large enough that the holding surface 323 includes a region 3232 extending beyond the region 3231 in addition to the region 3231. Therefore, the holding surface 323 can use not only the area 3231 but also the area 3232 to hold the forming material M. Therefore, the holding surface 323 can hold the mountain formed by the forming material M on the holding surface 323 in a state where the angle formed by the inclined surface and the holding surface 323 is equal to or less than the rest angle θr. As a result, the holding surface 323 can hold the forming material M in such a manner that the mountain of the forming material M supplied from the supply port 311 is more difficult to collapse spontaneously.

如上所述,從料斗31中供給至料斗31之外部之造形材料M暫時藉由保持面323而穩定地保持。堆積於保持面323上之造形材料M與供給口311接觸,於保持構件32靜止之狀況下,所堆積之造形材料M堵塞供給口311,抑制其以上之造形材料M供給至保持面323上。於該狀態下,保持構件32藉由振動裝置33而振動。若靜止之保持構件32開始振動,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分緩緩地開始崩塌。或者,若靜止之保持構件32開始振動,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分緩緩地開始分離。 As described above, the forming material M supplied from the hopper 31 to the outside of the hopper 31 is temporarily held stably by the holding surface 323. The forming material M deposited on the holding surface 323 is in contact with the supply port 311. When the holding member 32 is stationary, the accumulated forming material M blocks the supply port 311 and inhibits the supply of more than the forming material M to the holding surface 323. In this state, the holding member 32 is vibrated by the vibration device 33. When the stationary holding member 32 starts to vibrate, a portion of the forming material M constituting the mountain gradually starts to collapse from the mountain of the forming material M stably held by the holding surface 323. Alternatively, when the stationary holding member 32 starts to vibrate, a portion of the forming material M constituting the mountain gradually starts to separate from the hill of the forming material M stably held by the holding surface 323.

進而,若保持構件32繼續且以相同之方式持續振動,則從保持 面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分於每單位時間內以固定量緩緩地持續崩塌。若保持構件32繼續且以相同之方式持續振動,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分於每單位時間內以固定量緩緩地持續分離(即,持續受剪切)。從山上崩落或分離之造形材料M從保持面323上灑落至保持面323之外部(即,材料送出構件34)。其結果為,於每單位時間內,固定量之造形材料M從保持面323上搬出至材料搬出裝置34中。 Furthermore, if the holding member 32 continues to vibrate in the same manner, a portion of the forming material M constituting the mountain from the hill of the forming material M stably held by the holding surface 323 is gradually fixed by a fixed amount per unit time. The ground continued to collapse. If the holding member 32 continues and vibrates continuously in the same manner, from the mountain of the forming material M stably held by the holding surface 323, a part of the forming material M constituting the mountain is gradually continued in a fixed amount per unit time. Separation (ie, continuous shear). The shaping material M which has fallen or separated from the mountain is spilled from the holding surface 323 to the outside of the holding surface 323 (that is, the material feeding member 34). As a result, a fixed amount of the shaping material M is carried out from the holding surface 323 into the material carrying-out device 34 per unit time.

若由振動裝置33所引起之保持構件32之振動停止,則堆積於保持面323上之造形材料M停止崩塌,造形材料M不再從保持面323上灑落。即,造形材料M從保持面323上向材料送出構件34中之搬出停止。其結果為,造形材料M從材料供給裝置3中向造形裝置4中之供給亦停止。因此,振動裝置33係於控制裝置7之控制下,於亦可不向造形裝置4中供給造形材料M之時刻(例如,材料嘴412亦可不供給造形材料M之時刻),停止保持構件32之振動。 When the vibration of the holding member 32 caused by the vibration device 33 stops, the forming material M deposited on the holding surface 323 stops collapsing, and the forming material M is no longer sprinkled from the holding surface 323. That is, the carrying out of the shaping material M from the holding surface 323 into the material feeding member 34 is stopped. As a result, the supply of the forming material M from the material supply device 3 to the forming device 4 is also stopped. Therefore, the vibration device 33 is under the control of the control device 7 and stops the vibration of the holding member 32 when the molding material M may not be supplied to the molding device 4 (for example, when the material nozzle 412 may not supply the molding material M). .

每單位時間內從保持面323上搬出至保持面323之外部之造形材料M之份量(即,每單位時間之造形材料M之搬出量)可於保持構件32之振動之狀態下控制。因此,振動裝置33係於控制裝置7之控制下,以每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之振動之狀態。進而,振動裝置33係於控制裝置7之控制下,於造形裝置4形成造形物之期間(更具體而言,材料嘴412持續供給造形材料M之期間),以於所設定之振動之狀態下,保持構件32持續振動之方式,使保持構件32振動。其結果為,從保持面323上向材料送出構件34中,搬出為使造形裝置4形成造形物而於每單位時間內所必需之固定量之造形材料M。 The amount of the forming material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time (that is, the amount of the forming material M carried out per unit time) can be controlled under the vibration state of the holding member 32. Therefore, the vibration device 33 is controlled by the control device 7 and the amount of the forming material M carried out from the holding surface 323 to the material feeding member 34 per unit time becomes the amount of the forming material M necessary for the formation of the shaped object. The state of vibration of the holding member 32 is set in a manner of the required carrying-out amount corresponding to the supply rate. Further, the vibration device 33 is under the control of the control device 7 during the formation of the shaped object by the shaping device 4 (more specifically, the period during which the material nozzle 412 continues to supply the shaped material M) so as to be in a set vibration state. In a manner that the holding member 32 continues to vibrate, the holding member 32 is vibrated. As a result, from the holding surface 323 to the material feeding member 34, a fixed amount of the molding material M necessary for forming the molding device 4 into a shaped object per unit time is carried out.

振動之狀態例如亦可包含振動之振幅(即,強度)。例如,振 動之振幅越大,則保持面323越大幅度地振動。因此,振動之振幅越大,則從保持面323所保持之造形材料M之山上,每單位時間內崩落或分離之造形材料M之份量越多。即,振動之振幅越大,則於每單位時間內從保持面323上搬出至保持面323之外部的造形材料M之份量越多。於每單位時間內從保持面323上搬出至保持面323之外部的造形材料M之份量越多,則每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量(即,供給量)增多。因此,如圖6所示,振動之振幅越大,則每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之供給量增多。控制裝置7係考慮到此種保持構件32之振動之振幅與造形材料M之供給量之間之關係,以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之振動之振幅。例如,如圖6所示,於要求每單位時間內從材料供給裝置3向造形裝置4中供給份量M1之造形材料M之情形時,控制裝置7將保持構件32之振動之振幅設定為A1。同樣,例如,如圖6所示,於要求每單位時間內從材料供給裝置3向造形裝置4中供給份量M2(但,M2<M1)之造形材料M之情形時,控制裝置7將保持構件32之振動之振幅設定為A2(但,A2<A1)。 The state of the vibration may include, for example, the amplitude (ie, the intensity) of the vibration. For example, the larger the amplitude of the vibration, the more the holding surface 323 vibrates. Therefore, the larger the amplitude of the vibration, the more the amount of the shape-forming material M that collapses or separates from the mountain of the shape-forming material M held by the holding surface 323 per unit time. That is, the larger the amplitude of the vibration, the larger the amount of the molding material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time. The greater the amount of the molding material M carried out from the holding surface 323 to the outside of the holding surface 323 in each unit time, the more the molding material M supplied from the material supply device 3 to the molding device 4 per unit time (i.e., , Supply) increased. Therefore, as shown in FIG. 6, the larger the amplitude of the vibration, the greater the amount of the forming material M supplied from the material supplying device 3 to the forming device 4 per unit time. The control device 7 considers the relationship between the amplitude of the vibration of the holding member 32 and the supply amount of the forming material M, and the amount of the forming material M carried out from the holding surface 323 to the material sending member 34 per unit time. The amplitude of the vibration of the holding member 32 is set in such a manner as to be a required carrying-out amount corresponding to the supply rate of the forming material M necessary for the formation of the shaped object. For example, as shown in FIG. 6, when it is required to supply the forming material M of the amount M1 from the material supplying device 3 to the forming device 4 per unit time, the control device 7 sets the amplitude of the vibration of the holding member 32 to A1. Similarly, for example, as shown in FIG. 6, when it is required to supply the forming material M in a portion M2 (but M2 <M1) from the material supplying device 3 to the forming device 4 per unit time, the control device 7 holds the member. The amplitude of the vibration of 32 is set to A2 (however, A2 <A1).

但,若保持構件32之振動之振幅過大,則存在保持面323所保持之造形材料M之山一口氣崩塌之可能性。因此,控制裝置7亦可以滿足保持面323所保持之造形材料M之山緩緩崩塌(即,不一口氣崩塌)之制約之方式,來設定振動之振幅。 However, if the amplitude of the vibration of the holding member 32 is too large, there is a possibility that the mountain of the forming material M held by the holding surface 323 collapses at once. Therefore, the control device 7 can also set the amplitude of the vibration in such a way that the mountain of the forming material M held by the holding surface 323 can be slowly collapsed (that is, collapsed at one breath).

振動之狀態例如亦可包含振動之頻率。例如,振動之頻率越大,保持面323越高速地振動。因此,振動之頻率越大,則從保持面323所保持之造形材料M之山上,每單位時間內崩落或分離之造形材料M之份量增多。即,振動之頻率越大,則每單位時間內從保持面323上搬出至保持面323之外部 的造形材料M之份量增多。因此,與振動之振幅同樣,振動之頻率越大,則每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量(即,供給量)增多。控制裝置7係考慮到此種保持構件32之振動之頻率與造形材料M之供給量之間之關係,亦可以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之振動之頻率。 The state of vibration may include, for example, the frequency of vibration. For example, the larger the frequency of vibration, the faster the holding surface 323 vibrates. Therefore, the larger the frequency of the vibration, the more the amount of the shape-forming material M that collapses or separates per unit time from the hill of the shape-forming material M held by the holding surface 323. That is, the larger the frequency of the vibration, the greater the amount of the shaping material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time. Therefore, as with the amplitude of the vibration, the larger the frequency of the vibration, the greater the amount (ie, the amount of supply) of the molding material M supplied from the material supply device 3 to the molding device 4 per unit time. The control device 7 considers the relationship between the frequency of the vibration of the holding member 32 and the supply amount of the forming material M, and can also be carried out from the holding surface 323 to the forming material M in the material sending member 34 per unit time. The amount is set in such a manner that the frequency of the vibration of the holding member 32 is set in such a manner that the required carrying-out amount corresponds to the supply rate of the shaping material M necessary for the formation of the shaped object.

但,若保持構件32之振動之頻率過高,則存在保持面323所保持之造形材料M之山一口氣崩塌之可能性。因此,控制裝置7亦可以滿足保持面323所保持之造形材料M之山緩緩地崩塌(即,不一口氣崩塌)之制約之方式,來設定振動之頻率。 However, if the frequency of the vibration of the holding member 32 is too high, there is a possibility that the mountain of the forming material M held by the holding surface 323 collapses at once. Therefore, the control device 7 can also set the frequency of the vibration in such a manner that the mountain of the forming material M held by the holding surface 323 can be slowly collapsed (that is, collapsed at one breath).

進而,即便保持構件34之振動之狀態相同,亦存在每單位時間內從保持面323上搬出之第1狀態之造形材料M之份量、與每單位時間內從保持面323上搬出之第2狀態(但,第2狀態與第1狀態不同)之造形材料M之份量不成為相同之可能性。即,存在如下可能性:每單位時間內從以某狀態進行振動之保持面323上搬出之第1狀態之造形材料M之份量、與每單位時間內從以相同狀態進行振動之保持面323上搬出之不同之第2狀態之造形材料M之份量不成為相同。具體而言,例如存在如下可能性:每單位時間內從以某狀態進行振動之保持面323上搬出之第1種類之造形材料M之份量、與每單位時間內從以相同狀態進行振動之保持面323上搬出之第2種類(但,第2種類與第1種類不同)之造形材料M之份量不成為相同。例如存在如下可能性:每單位時間內從以某狀態進行振動之保持面323上搬出之第1粒徑之造形材料M之份量、與每單位時間內從以相同狀態進行振動之保持面323上搬出之第2粒徑(但,第2粒徑與第1粒徑不同)之造形材料M之份量不成為相同。例如存在如下可能性:每單位時間內從以某狀態進行振動之保持面323上搬出之第1形狀(尤其是外形)之造形材料 M之份量、與每單位時間內從以相同狀態進行振動之保持面323上搬出之第2形狀(但,第2形狀與第1形狀不同)之造形材料M之份量不成為相同。例如存在如下可能性:每單位時間內從以某狀態進行振動之保持面323上搬出的表面之摩擦係數成為第1值之造形材料M之份量、與每單位時間內從以相同狀態進行振動之保持面323上搬出的表面之摩擦係數為第2值(但,第2值與第1值不同)之造形材料M之份量不成為相同。因此,控制裝置7亦可除了或代替考慮保持構件32之振動之狀態與造形材料M之供給量之間之關係,而考慮造形材料M之狀態與造形材料M之供給量之間之關係,以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之振動之狀態。此處,造形材料M之狀態可包含造形材料M之種類、造形材料M之大小(粒徑)、造形材料M之形狀、造形材料M之表面之摩擦係數中的至少1個。 Furthermore, even if the state of vibration of the holding member 34 is the same, there is a first state of the molding material M removed from the holding surface 323 per unit time, and a second state of the forming material M removed from the holding surface 323 per unit time. (However, the second state is different from the first state) There is a possibility that the weights of the forming materials M may not be the same. That is, there is a possibility that the weight of the first-state molding material M carried out from the holding surface 323 vibrating in a certain state per unit time may be the same as that on the holding surface 323 vibrating in the same state per unit time. The amount of the molding material M in the second state that is carried out is not the same. Specifically, for example, there is a possibility that the weight of the first type of forming material M carried out from the holding surface 323 that vibrates in a certain state per unit time may be the same as that in which the vibration is maintained in the same state per unit time. The amount of the shaping material M of the second type (but the second type is different from the first type) carried out on the surface 323 is not the same. For example, there is a possibility that the weight of the molding material M of the first particle diameter carried out from the holding surface 323 vibrating in a certain state per unit time may be the same as that on the holding surface 323 vibrating in the same state per unit time. The amount of the shaping material M having the second particle diameter (but the second particle diameter is different from the first particle diameter) is not the same. For example, there is a possibility that the amount of the first shape (especially the outer shape) forming material M carried out from the holding surface 323 vibrating in a certain state per unit time may be the same as the amount of the forming material M vibrating in the same state per unit time. The second shape (however, the second shape is different from the first shape) of the molding material M carried on the holding surface 323 does not have the same weight. For example, there is a possibility that the amount of the friction coefficient of the surface carried out from the holding surface 323 that vibrates in a certain state per unit time becomes the first value of the amount of the molding material M, and The amount of the molding material M having the second coefficient (but the second value is different from the first value) of the friction coefficient of the surface carried out on the holding surface 323 is not the same. Therefore, in addition to or instead of considering the relationship between the vibration state of the holding member 32 and the supply amount of the molding material M, the control device 7 may consider the relationship between the state of the molding material M and the supply amount of the molding material M to The amount of the forming material M carried out from the holding surface 323 to the material feeding member 34 per unit time is set to a holding member in such a manner that it corresponds to a required carrying amount corresponding to the supply rate of the forming material M necessary for the formation of the shaped object. 32 state of vibration. Here, the state of the shaping material M may include at least one of the type of the shaping material M, the size (particle diameter) of the shaping material M, the shape of the shaping material M, and the friction coefficient of the surface of the shaping material M.

若從保持面323上向材料送出構件34中搬出造形材料M,則保持面323所保持之造形材料M之份量減少。另一方面,由於保持面323位於料斗31之供給口311之下方,故而若保持面323所保持之造形材料M之份量減少,則藉由造形材料M自身之重量,透過供給口311而從料斗31向保持面323上供給新的造形材料M。即,於保持面323上,與從保持面323上搬出至材料送出構件34中之造形材料M之份量相等的份量之造形材料M重新從料斗31中供給。因此,保持面323實質上保持大致相同份量之造形材料M。即,不論從保持面323上之造形材料M之搬出如何,保持面323均保持與料斗31之下表面315與保持面323之間之距離D對應之份量之造形材料M。 When the forming material M is carried out from the holding surface 323 into the material feeding member 34, the amount of the forming material M held by the holding surface 323 decreases. On the other hand, since the holding surface 323 is located below the supply port 311 of the hopper 31, if the amount of the molding material M held by the holding surface 323 is reduced, the weight of the molding material M itself passes through the supply port 311 and is removed from the hopper. 31. A new molding material M is supplied onto the holding surface 323. That is, on the holding surface 323, the molding material M of the same amount as the molding material M carried out from the holding surface 323 into the material feeding member 34 is supplied again from the hopper 31. Therefore, the holding surface 323 holds substantially the same amount of the shaping material M. That is, the holding surface 323 retains the forming material M in an amount corresponding to the distance D between the lower surface 315 of the hopper 31 and the holding surface 323 regardless of the removal of the forming material M from the holding surface 323.

從保持面323上搬出之造形材料M從保持面323上落下至材料送出構件34中。其結果為,材料送出構件34接收從保持面323上搬出之造形材料M。材料送出構件34所接收之造形材料M送出至材料供給裝置3之外部(即,造 形裝置4)。此處,如上所述,於收容有材料送出構件34之筐體35之內部空間351中,透過流入口353而從氣體供給裝置6中供給經加壓之惰性氣體。材料送出構件34藉由經加壓之惰性氣體之壓送,而將造形材料M送出至造形裝置4中。即,材料送出構件34所接收之造形材料M係以藉由供給至內部空間351中之惰性氣體之壓力,經由送出口341及352而於管道內擠出之方式送出。透過管道而送出之造形材料M係從材料嘴412供給。 The molding material M carried out from the holding surface 323 falls from the holding surface 323 into the material feeding member 34. As a result, the material sending member 34 receives the shaping material M carried out from the holding surface 323. The forming material M received by the material feeding member 34 is sent to the outside of the material supply device 3 (i.e., the forming device 4). Here, as described above, the pressurized inert gas is supplied from the gas supply device 6 through the inflow port 353 in the internal space 351 of the casing 35 in which the material sending member 34 is housed. The material sending-out member 34 sends out the shaping material M to the shaping device 4 by the pressure feeding of the pressurized inert gas. That is, the shaping material M received by the material sending-out member 34 is sent out through the sending-out ports 341 and 352 by being extruded into the pipe by the pressure of the inert gas supplied into the internal space 351. The forming material M sent out through the pipe is supplied from the material nozzle 412.

由於材料送出構件34藉由壓送而送出造形材料M,故而每單位時間內,材料送出構件34所送出之造形材料M之份量依存於每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量。因此,材料送出構件34可於每單位時間內將固定量之造形材料M送出至造形裝置4中。其結果為,材料供給裝置3可於每單位時間內將固定量之造形材料M供給至造形裝置4中。即,材料供給裝置3可以每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之固定之所需供給量之方式,於造形裝置4中供給造形材料M。 Since the material sending member 34 sends out the forming material M by pressure feeding, the weight of the forming material M sent by the material sending member 34 per unit time depends on being carried out from the holding surface 323 to the material sending member 34 per unit time. The amount of the shaping material M in. Therefore, the material sending member 34 can send out a fixed amount of the shaping material M to the shaping device 4 every unit time. As a result, the material supply device 3 can supply a fixed amount of the molding material M to the molding device 4 per unit time. That is, the material supply device 3 can supply the amount of the shaping material M supplied from the material supply device 3 to the shaping device 4 per unit time to a fixed required supply corresponding to the supply rate of the shaping material M necessary for the formation of the shaped object. In a measuring manner, the shaping material M is supplied to the shaping device 4.

如此一來,本實施方式之材料供給裝置3係藉由配置於料斗31之下方之保持構件32,來保持固定量之從料斗31中供給之造形材料M,並且藉由保持構件32之振動,而於每單位時間內將固定量之造形材料M從保持面323上搬出至材料送出構件34中。因此,材料供給裝置3可將為使造形裝置4形成造形物而於每單位時間內所必需之固定量之造形材料M穩定地供給至造形裝置4中。即,材料供給裝置3可於維持所需之供給速率之狀態下供給造形材料M。 In this way, the material supply device 3 of this embodiment uses a holding member 32 disposed below the hopper 31 to hold a fixed amount of the forming material M supplied from the hopper 31 and the vibration of the holding member 32, And, a fixed amount of the shaping material M is carried out from the holding surface 323 into the material feeding member 34 every unit time. Therefore, the material supply device 3 can stably supply the forming device 4 with a fixed amount of the forming material M necessary per unit time in order to form the forming device 4 into a forming object. That is, the material supply device 3 can supply the molding material M while maintaining a required supply rate.

此外,上述說明中,於造形裝置4形成造形物之期間,每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為固定。即,於造形裝置4形成造形物之期間,每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量成為固定。然而,材料供給裝置3亦可於控制裝 置7之控制下,於造形裝置4形成造形物之期間,變更每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量。具體而言,如上所述,每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量依存於保持構件323之振動之狀態。因此,控制裝置7亦可以於造形裝置4形成造形物之期間,變更保持構件32之振動之狀態之方式,控制振動裝置33。其結果為,隨著振動之狀態之變更,每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量變更。即,隨著振動之狀態之變更,每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量變更。 In addition, in the above description, the amount of the molding material M carried out from the holding surface 323 to the material feeding member 34 per unit time during the formation of the shape by the molding device 4 is fixed. That is, while the shaping device 4 is forming a shaped object, the amount of the shaping material M supplied from the material supply device 3 to the shaping device 4 per unit time is fixed. However, under the control of the control device 7, the material supply device 3 may change the amount of the molding material M supplied from the material supply device 3 to the molding device 4 per unit time while the molding device 4 forms the shaped object. Specifically, as described above, the amount of the shaping material M carried out from the holding surface 323 into the material feeding member 34 per unit time depends on the state of vibration of the holding member 323. Therefore, the control device 7 may control the vibration device 33 while changing the mode of the vibration state of the holding member 32 while the shape device 4 is forming the shaped object. As a result, as the state of the vibration changes, the amount of the shaping material M carried out from the holding surface 323 to the material feeding member 34 per unit time changes. That is, as the state of the vibration changes, the amount of the shaping material M carried out from the material supply device 3 to the shaping device 4 per unit time changes.

作為變更每單位時間內從材料供給裝置3中供給之造形材料M之份量之情況之一例,可列舉:由驅動系統42所引起之造形頭41之移動速度變化之情況。於該情形時,控制裝置7基於造形頭41之移動速度(即,與造形頭41之移動速度相關之資訊),來變更每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量。具體而言,造形頭41之移動速度越快,則材料嘴412朝向工件W上之某單位區域(或者於工件W上形成完畢之構造層上之某單位區域,以下相同)而供給造形材料M之時間越短。因此,造形頭41之移動速度越快,供給至單位區域之造形材料M之份量減少。其結果為,若造形頭41之移動速度變化,則存在供給至工件W上之某一個單位區域之造形材料M之份量、與供給至工件W上之其他單位區域之造形材料M之份量不成為相同之可能性。於該情形時,存在對所形成之造形物之精度產生影響之可能性。因此,控制裝置7亦可以對工件W上之複數個單位區域分別供給之造形材料M之份量成為相同之方式,基於造形頭41之移動速度,來變更每單位時間內從材料供給裝置3中供給之造形材料M之份量。具體而言,控制裝置7亦可如圖7所示,以造形頭41之移動速度越快,每單位時間內從材料供給裝置3中供給之造形材料M之份量(即,每單位時間內之造形材料M之供給量)增多之方式,來變更每單位時間 內之造形材料M之供給量。 As an example of a case where the amount of the shaping material M supplied from the material supply device 3 per unit time is changed, a case where the moving speed of the shaping head 41 caused by the driving system 42 is changed may be mentioned. In this case, the control device 7 changes the forming material carried out from the material supply device 3 to the forming device 4 per unit time based on the moving speed of the forming head 41 (ie, information related to the moving speed of the forming head 41). Servings of M. Specifically, the faster the moving speed of the shaping head 41 is, the material nozzle 412 faces a unit area on the workpiece W (or a unit area on the structural layer formed on the workpiece W, the same applies hereinafter) to supply the shaping material M The shorter the time. Therefore, the faster the moving speed of the forming head 41 is, the smaller the amount of the forming material M supplied to the unit area is. As a result, if the moving speed of the forming head 41 is changed, the amount of the forming material M supplied to one unit area on the workpiece W and the amount of the forming material M supplied to other unit areas on the workpiece W will not become Same possibility. In this case, there is a possibility that the accuracy of the formed object may be affected. Therefore, the control device 7 can also change the amount of the molding material M supplied to the plurality of unit areas on the workpiece W in the same manner, and change the supply from the material supply device 3 per unit time based on the moving speed of the molding head 41. The amount of molding material M. Specifically, as shown in FIG. 7, the control device 7 can also use the faster the moving speed of the forming head 41, the amount of the forming material M supplied from the material supply device 3 per unit time (i.e., per unit time The supply amount of the molding material M is increased to change the supply amount of the molding material M per unit time.

此外,並不限定於上述情況,控制裝置7亦可依據與造形頭41之移動速度相關之資訊以及與光EL之照射相關之資訊中之至少一者,來變更每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量。此外,作為與光EL之照射相關之資訊之其他一例,可列舉光EL之強度、光EL之照射位置或者光EL之照射時刻等。例如,控制裝置7亦可根據光EL之強度之變化,來變更每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量。例如,控制裝置7亦可根據光EL之照射時刻之變化,來變更每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量。 In addition, not limited to the above, the control device 7 may change the material supply device per unit time based on at least one of the information related to the moving speed of the shaping head 41 and the information related to the irradiation of the light EL. 3 The amount of the shaping material M carried out into the shaping device 4. In addition, as another example of the information related to the irradiation of the light EL, the intensity of the light EL, the irradiation position of the light EL, or the irradiation time of the light EL may be mentioned. For example, the control device 7 may change the amount of the shaping material M carried out from the material supply device 3 to the shaping device 4 per unit time according to the change in the intensity of the light EL. For example, the control device 7 may change the amount of the molding material M carried out from the material supply device 3 to the molding device 4 per unit time in accordance with a change in the irradiation time of the light EL.

另外,上述說明中,以造形頭41之移動速度越快,每單位時間內從材料供給裝置3中供給之造形材料M之份量增多之方式,於控制裝置7之控制下變更保持面323之振動之狀態。然而,亦可根據振動裝置33可使保持面323振動之振幅或者頻率之上限,來逆算出材料供給裝置3可供給至造形裝置4中之每單位時間之造形材料M之供給量,基於該供給量來規定造形裝置4中之造形頭41之移動速度之上限。 In addition, in the above description, the vibration of the holding surface 323 is changed under the control of the control device 7 so that the faster the moving speed of the forming head 41 is, the more the amount of the forming material M supplied from the material supply device 3 per unit time increases. Of the state. However, based on the upper limit of the amplitude or frequency of the vibration of the holding surface 323 by the vibrating device 33, the amount of the forming material M per unit time that the material supplying device 3 can supply to the forming device 4 can be inversely calculated. The upper limit of the moving speed of the shaping head 41 in the shaping device 4 is determined by the amount.

(3)變形例(3) Modifications

繼而,對造形系統1之變形例進行說明。 Next, a modification of the shaping system 1 will be described.

(3-1)第1變形例(3-1) First modification

第1變形例之造形系統1a與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3a。造形系統1a之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖8,對第1變形例之材料供給裝置3a進行說明。 The forming system 1a of the first modification is different from the forming system 1 described above in that a material supply device 3a is provided instead of the material supply device 3. The other configurations of the shaping system 1 a may be the same as the other configurations of the shaping system 1. Therefore, the material supply device 3a according to the first modification will be described below with reference to FIG. 8.

如圖8所示,材料供給裝置3a與上述材料供給裝置3相比較,不同之處在於,於筐體35之內部空間351中進而具備搬送構件36a。材料供給裝置 3a之其他構成亦可與材料供給裝置3之其他構成相同。 As shown in FIG. 8, the material supply device 3 a is different from the above-mentioned material supply device 3 in that an internal space 351 of the casing 35 is further provided with a conveying member 36 a. The other configurations of the material supply device 3a may be the same as the other configurations of the material supply device 3.

搬送構件36a接收從保持面323上搬出之造形材料M。進而,搬送構件36a將從保持面323上接收之造形材料M搬出至材料送出構件34中。因此,第1變形例中,將造形材料M從料斗31中,依序經由保持構件32、搬送構件36a以及材料送出構件34而供給至材料供給裝置3之外部(即,造形裝置4)。 The transfer member 36 a receives the molding material M carried out from the holding surface 323. Further, the conveyance member 36 a conveys the molding material M received from the holding surface 323 into the material conveyance member 34. Therefore, in the first modification, the forming material M is supplied from the hopper 31 to the outside of the material supply device 3 (that is, the forming device 4) via the holding member 32, the conveying member 36a, and the material feeding member 34 in this order.

搬送構件36a為了接收從保持面323上搬出(即,灑落)之造形材料M,而配置於可接收從保持面323上搬出之造形材料M之位置。圖8所示之例中,搬送構件36a位於保持面323之下方及斜下方之至少一者。於該情形時,造形材料M係以從保持面323上灑落(即,落下)之方式搬出至保持面323之外部,搬送構件36a配置於造形材料M從保持面323上之落下路徑上。 The conveying member 36 a is arranged at a position where the forming material M carried out from the holding surface 323 can be received in order to receive the forming material M carried out (ie, spilled) from the holding surface 323. In the example shown in FIG. 8, the conveyance member 36 a is located at least one of below and obliquely below the holding surface 323. In this case, the forming material M is carried out to the outside of the holding surface 323 by being dropped (ie, dropped) from the holding surface 323, and the conveying member 36a is arranged on the falling path of the forming material M from the holding surface 323.

搬送構件36a係於上表面(即,朝向+Z側之面)361a上接收造形材料M。即,造形材料M從保持面323上灑落至上表面361a上。上表面361a係相對於作為水平面之XY平面而傾斜(即,與XY平面交叉)之面。上表面361a係相對於保持面323而傾斜之面。由於上表面361a傾斜,故而上表面361a所接收之造形材料M從上表面361a上滾落而來。於上表面361a之下方及斜下方之至少一者配置有材料送出構件34。即,於造形材料M從上表面361a上滾落之路徑上,配置有材料送出構件34。因此,材料送出構件34接收從上表面361a上滾落而來之造形材料M。即,第1變形例中,搬送構件36a可藉由上表面361a之傾斜而使造形材料M落下,將從保持面323上接收於上表面361a上之造形材料M,從上表面361a上搬出至上表面361a之外部(即,搬送構件36a之外部,材料送出構件34)。 The conveying member 36a receives the shaping material M on the upper surface (that is, the surface facing the + Z side) 361a. That is, the molding material M is sprinkled from the holding surface 323 onto the upper surface 361a. The upper surface 361a is a surface that is inclined with respect to the XY plane that is a horizontal plane (that is, that intersects the XY plane). The upper surface 361a is a surface inclined with respect to the holding surface 323. Because the upper surface 361a is inclined, the forming material M received by the upper surface 361a rolls off from the upper surface 361a. A material feeding member 34 is arranged at least one of the lower surface and the obliquely lower portion of the upper surface 361a. That is, a material feeding member 34 is disposed on a path where the forming material M rolls off from the upper surface 361a. Therefore, the material sending-out member 34 receives the shaping material M rolled down from the upper surface 361a. That is, in the first modification, the conveying member 36a can drop the forming material M by the inclination of the upper surface 361a, and the forming material M received from the holding surface 323 on the upper surface 361a can be carried out from the upper surface 361a. Outside the surface 361a (that is, outside the conveying member 36a, the material conveying member 34).

此種材料供給裝置3a可享受與上述材料供給裝置3可享受之效果相同之效果。進而,第1變形例中,從保持面323上搬出至搬送構件36a中之造形材料M藉由搬送構件36a之上表面361a之傾斜而從上表面361a上滾落。此時, 來自上表面361a之摩擦力作用於造形材料M。因此,造形材料M以大致固定之速度從上表面361a上穩定地滾落。其結果為,即便假設每單位時間內從保持面323上搬出至搬送構件36a中之造形材料M之份量變動,該變動亦藉由在搬送構件36a中,造形材料M從上表面361受到之摩擦力而緩和、抑制或者抵消。即,搬送構件36a可使每單位時間內從上表面361a搬出至材料送出構件34中之造形材料M之份量之變動,小於每單位時間內從保持面323上搬出至搬送構件36a中之造形材料M之份量之變動(換言之,脈動)。換言之,搬送構件36a可以緩和(或者抑制、或抵消)每單位時間內從保持面323上搬出至搬送構件36a中之造形材料M之份量之變動之方式,搬出造形材料M。其結果為,材料供給裝置3a可緩和每單位時間內從材料供給裝置3a中供給至造形裝置4中之造形材料M之份量之變動。因此,材料供給裝置3可於更適當地維持所需之供給速率之狀態下供給造形材料M。 Such a material supply device 3a can enjoy the same effects as those described above for the material supply device 3. Furthermore, in the first modification, the forming material M carried out from the holding surface 323 into the conveying member 36a is rolled off from the upper surface 361a by the inclination of the upper surface 361a of the conveying member 36a. At this time, the frictional force from the upper surface 361a acts on the shaping material M. Therefore, the forming material M is stably rolled off the upper surface 361a at a substantially constant speed. As a result, even if it is assumed that the amount of the shaping material M carried out from the holding surface 323 to the conveying member 36a changes per unit time, the change is caused by the friction of the shaping material M from the upper surface 361 in the conveying member 36a Force to ease, suppress or counteract. That is, the transfer member 36a can change the amount of the shaping material M carried out from the upper surface 361a to the material sending member 34 per unit time, which is smaller than the shaping material carried from the holding surface 323 to the carrying member 36a per unit time. Changes in M's weight (in other words, pulsation). In other words, the conveying member 36a can remove (or suppress, or offset) the change in the amount of the forming material M carried out from the holding surface 323 into the conveying member 36a per unit time, and the conveying member 36a can be taken out. As a result, the material supply device 3a can mitigate a change in the amount of the molding material M supplied from the material supply device 3a to the molding device 4 per unit time. Therefore, the material supply device 3 can supply the shaping material M while maintaining the required supply rate more appropriately.

但,若上表面361a相對於XY平面之傾斜角度(即,上表面361a相對於水平面或保持面323之傾斜角度)過大,則存在從保持面322上搬出至搬送構件36a中之造形材料M一口氣滾落之可能性。於該情形時,作為作用於造形材料M之力,存在較來自上表面361a之摩擦力而言,重力發揮更大之作用之可能性。其結果為,存在將每單位時間內從保持面323上搬出至搬送構件36a中之造形材料M之份量之變動加以緩和之效果減弱之可能性。因此,上表面361a相對於XY平面之傾斜角度亦可設定為如下程度之適當角度,即,可發揮將每單位時間內從保持面323上搬出至搬送構件36a中之造形材料M之份量之變動加以緩和之效果的程度。作為此種角度之一例,可列舉30度以下之角度(尤其是20度以下之角度)。 However, if the inclination angle of the upper surface 361a with respect to the XY plane (that is, the inclination angle of the upper surface 361a with respect to the horizontal plane or the holding surface 323) is too large, there is a molding material M_ Possibility of rolling down. In this case, as the force acting on the forming material M, there is a possibility that gravity may exert a larger effect than the frictional force from the upper surface 361a. As a result, there is a possibility that the effect of mitigating the change in the amount of the molding material M carried out from the holding surface 323 to the conveying member 36a per unit time can be reduced. Therefore, the inclination angle of the upper surface 361a with respect to the XY plane can also be set to an appropriate angle such that a change in the amount of the molding material M carried out from the holding surface 323 to the conveying member 36a per unit time can be exhibited The extent to which the effect is mitigated. An example of such an angle is an angle of 30 degrees or less (especially an angle of 20 degrees or less).

另一方面,若上表面361a相對於XY平面之傾斜角度過小,則存在從保持面322上搬出至搬送構件36a中之造形材料M於上表面361a上停滯(換 言之,滯留)之可能性。即,存在造形材料M不易從上表面361a上滾落之可能性。其結果為,存在材料供給裝置3無法於更適當地維持所需之供給速率之狀態下供給造形材料M之可能性。因此,上表面361a相對於XY平面之傾斜角度亦可設定為從保持面322上搬出至搬送構件36a中之造形材料M從上表面361a上適當地滾落之適當角度。作為此種角度之一例,可列舉5度以上之角度(尤其是15度以上之角度)。上表面361a之表面亦可實施對與造形材料M之摩擦係數進行調整之表面加工,以使造形材料M可適當滾落。該表面加工中至少包含變更造形材料M與上表面361a之表面之摩擦係數之處理。 On the other hand, if the inclination angle of the upper surface 361a with respect to the XY plane is too small, there is a possibility that the shaping material M carried out from the holding surface 322 into the conveying member 36a will stagnate (in other words, stay) on the upper surface 361a. That is, there is a possibility that the forming material M is not easily rolled off from the upper surface 361a. As a result, there is a possibility that the material supply device 3 cannot supply the forming material M in a state where the required supply rate is more appropriately maintained. Therefore, the inclination angle of the upper surface 361a with respect to the XY plane can also be set to an appropriate angle at which the molding material M carried out from the holding surface 322 into the conveying member 36a appropriately rolls off from the upper surface 361a. An example of such an angle is an angle of 5 degrees or more (especially an angle of 15 degrees or more). The surface of the upper surface 361a may also be subjected to surface processing for adjusting the friction coefficient with the forming material M, so that the forming material M can be appropriately rolled off. This surface processing includes at least a process of changing the friction coefficient between the forming material M and the surface of the upper surface 361a.

此外,搬送構件36a之上表面361之一部分可為沿著XY平面之面(即,水平面)。上表面361a之至少一部分亦可為曲面。搬送構件36a只要可接收從保持面323上搬出之造形材料M且將所接收之造形材料M搬出至材料送出構件34中,則可配置於任意位置。 In addition, a part of the upper surface 361 of the conveyance member 36a may be a plane (ie, a horizontal plane) along the XY plane. At least a part of the upper surface 361a may be a curved surface. The conveying member 36 a may be arranged at any position as long as it can receive the shaping material M carried out from the holding surface 323 and carry out the received shaping material M into the material feeding member 34.

材料供給裝置36a可具備複數個搬送構件36a。於該情形時,造形材料M從料斗31中,依序經由保持構件32、搬送構件36a以及材料送出構件34而供給至材料供給裝置3之外部(即,造形裝置4)。複數個搬送構件36a亦可包含:相對於保持面323而以第1傾斜角傾斜之第1搬送構件36a、以及相對於保持面323而以與第1傾斜角不同之第2傾斜角傾斜之第2搬送構件36a。複數個搬送構件36a亦可包含相對於保持面323而以相同之傾斜角傾斜之至少2個搬送構件36a。 The material supply device 36a may include a plurality of conveyance members 36a. In this case, the shaping material M is supplied from the hopper 31 to the outside of the material supply device 3 (that is, the shaping device 4) via the holding member 32, the conveying member 36a, and the material feeding member 34 in this order. The plurality of conveyance members 36a may include a first conveyance member 36a inclined at a first inclination angle with respect to the holding surface 323, and a second conveyance member 36a inclined at a second inclination angle different from the first inclination angle with respect to the holding surface 323. 2 conveying member 36a. The plurality of conveyance members 36 a may include at least two conveyance members 36 a inclined at the same inclination angle with respect to the holding surface 323.

(3-2)第2變形例(3-2) Second modification

第2變形例之造形系統1b與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3b。造形系統1b之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖9,對第2變形例之材料供給裝置3b進行說明。 The forming system 1 b according to the second modification is different from the forming system 1 described above in that a material supply device 3 b is provided instead of the material supply device 3. The other configurations of the shaping system 1b may be the same as the other configurations of the shaping system 1. Therefore, the material supply device 3b according to the second modification will be described below with reference to FIG. 9.

如圖9所示,材料供給裝置3b與上述材料供給裝置3a相比較,不同之處在於振動裝置33使搬送構件36a振動。材料供給裝置3b之其他構成亦可與材料供給裝置3a之其他構成相同。振動裝置33透過振動傳遞構件332b而與搬送構件32連結。振動裝置33透過振動傳遞構件332b而將振動傳遞至搬送構件36a。其結果為,搬送構件36a振動。振動裝置33可沿著X軸方向而使搬送構件36a振動,亦可沿著Y軸方向而使搬送構件36a振動,亦可沿著Z軸方向而使搬送構件36a振動。 As shown in FIG. 9, the material supply device 3 b is different from the above-mentioned material supply device 3 a in that the vibration device 33 vibrates the conveyance member 36 a. The other configuration of the material supply device 3b may be the same as the other configuration of the material supply device 3a. The vibration device 33 is connected to the conveyance member 32 through the vibration transmission member 332b. The vibration device 33 transmits vibration to the conveyance member 36a through the vibration transmission member 332b. As a result, the conveyance member 36a vibrates. The vibration device 33 may vibrate the conveyance member 36a along the X-axis direction, may vibrate the conveyance member 36a along the Y-axis direction, or may vibrate the conveyance member 36a along the Z-axis direction.

即便為此種材料供給裝置3b,亦可享受與上述材料供給裝置3a可享受之效果相同之效果。此外,第2變形例中,由於搬送構件36a振動,故而與搬送構件36a不振動之情形相比較,從保持面322上搬出至搬送構件36a中之造形材料M於上表面361a上停滯之可能性變小。即,第2變形例中,搬送構件36a可以造形材料M從上表面361a上適當地滾落之方式,將造形材料M搬出。 Even with such a material supply device 3b, the same effects as those of the above-mentioned material supply device 3a can be enjoyed. In addition, in the second modification, since the conveying member 36a vibrates, compared with the case where the conveying member 36a does not vibrate, the possibility that the molding material M carried out from the holding surface 322 into the conveying member 36a stagnates on the upper surface 361a Get smaller. That is, in the second modified example, the conveying member 36a can carry out the forming material M in such a manner that the forming material M is appropriately rolled off from the upper surface 361a.

此外,於圖9所示之例中,使保持構件32振動之振動裝置33使搬送構件36a振動。然而,材料供給裝置3b除了使保持構件32振動之振動裝置33以外,亦可分別獨立地具備使搬送構件36a振動之振動裝置33b。 In the example shown in FIG. 9, the vibration device 33 that vibrates the holding member 32 vibrates the conveying member 36 a. However, in addition to the vibration device 33 that vibrates the holding member 32, the material supply device 3b may be separately provided with a vibration device 33b that vibrates the conveying member 36a.

(3-3)第3變形例(3-3) Third modification

第3變形例之造形系統1c與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3c。造形系統1c之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖10,對第3變形例之材料供給裝置3c進行說明。 The forming system 1c according to the third modification is different from the forming system 1 described above in that a material supply device 3c is provided instead of the material supply device 3. The other configurations of the shaping system 1 c may be the same as the other configurations of the shaping system 1. Therefore, a material supply device 3c according to a third modification will be described below with reference to FIG. 10.

如圖10所示,材料供給裝置3c與上述材料供給裝置3b相比較,不同之處在於保持構件32與搬送構件36a一體化。材料供給裝置3b之其他構成亦可與材料供給裝置3b之其他構成相同。即便為此種材料供給裝置3c,亦可享受與上述材料供給裝置3b可享受之效果相同之效果。 As shown in FIG. 10, the material supply device 3c is different from the above-mentioned material supply device 3b in that the holding member 32 and the conveying member 36a are integrated. The other configuration of the material supply device 3b may be the same as the other configuration of the material supply device 3b. Even with such a material supply device 3c, the same effects as those of the above-mentioned material supply device 3b can be enjoyed.

(3-4)第4變形例(3-4) Fourth modification

第4變形例之造形系統1d與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3d。造形系統1d之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖11,對第4變形例之材料供給裝置3d進行說明。 The forming system 1d according to the fourth modification is different from the forming system 1 described above in that a material supply device 3d is provided instead of the material supply device 3. The other configurations of the shaping system 1 d may be the same as the other configurations of the shaping system 1. Therefore, the material supply device 3d according to the fourth modification will be described below with reference to FIG. 11.

如圖11所示,材料供給裝置3d與上述材料供給裝置3相比較,不同之處在於具備距離調整裝置37d。材料供給裝置3d之其他構成亦可與材料供給裝置3之其他構成相同。 As shown in FIG. 11, the material supply device 3d differs from the above-mentioned material supply device 3 in that it includes a distance adjustment device 37d. The other configurations of the material supply device 3 d may be the same as the other configurations of the material supply device 3.

距離調整裝置37d可於控制裝置7之控制下,調整料斗31之供給口311與保持構件32之保持面323之間之距離D。即,距離調整裝置37d可於控制裝置7之控制下,調整料斗31之下表面315與保持面323之間之距離(即,料斗31之下端部3141與保持面323之間之距離)D。 The distance adjusting device 37d can adjust the distance D between the supply port 311 of the hopper 31 and the holding surface 323 of the holding member 32 under the control of the control device 7. That is, the distance adjusting device 37d can adjust the distance between the lower surface 315 of the hopper 31 and the holding surface 323 (ie, the distance between the lower end portion 3141 of the hopper 31 and the holding surface 323) D under the control of the control device 7.

距離調整裝置37d可於控制裝置7之控制下,藉由使保持構件32相對於料斗31而相對地移動,來調整距離D。例如,距離調整裝置37d亦可藉由使保持構件32沿著Z軸移動,來調整距離D。於該情形時,若保持構件32向+Z側移動,則距離D減小。另一方面,若保持構件32向-Z側移動,則距離D增大。或者,距離調整裝置37d亦可藉由除了或代替使保持構件32沿著Z軸移動,而使料斗31沿著Z軸移動,來調整距離D。於該情形時,若料斗31向+Z側移動,則距離D增大。另一方面,若料斗31向-Z側移動,則距離D減小。距離調整裝置37d為使保持構件32及料斗31中之至少一者移動,例如亦可具備致動器等。距離調整裝置37d為了調整距離D,亦可具備測量距離D之測量裝置。測量距離D之測量裝置例如並無限定,可列舉光學感測器、靜電感測器或者磁氣感測器。 The distance adjustment device 37 d can adjust the distance D by moving the holding member 32 relative to the hopper 31 under the control of the control device 7. For example, the distance adjustment device 37d may adjust the distance D by moving the holding member 32 along the Z axis. In this case, when the holding member 32 moves to the + Z side, the distance D decreases. On the other hand, when the holding member 32 moves to the -Z side, the distance D increases. Alternatively, the distance adjustment device 37d may adjust the distance D by moving the holding member 32 along the Z axis in addition to or instead of moving the holding member 32 along the Z axis. In this case, when the hopper 31 moves to the + Z side, the distance D increases. On the other hand, when the hopper 31 moves to the -Z side, the distance D decreases. The distance adjustment device 37 d is provided to move at least one of the holding member 32 and the hopper 31, and may include, for example, an actuator or the like. The distance adjusting device 37d may include a measuring device for measuring the distance D in order to adjust the distance D. The measuring device for measuring the distance D is not limited, and examples thereof include an optical sensor, an electrostatic sensor, and a magnetic sensor.

如上所述,保持面323保持與供給口311與保持面323之間之距離D對應之份量之造形材料M。即,供給口311與保持面323之間之距離D越增大, 保持面323所保持之造形材料M之份量越增多。因此,控制裝置7亦可藉由以調整距離D之方式控制距離調整裝置37d,來調整保持構件32所保持之造形材料M之份量。 As described above, the holding surface 323 holds the molding material M in an amount corresponding to the distance D between the supply port 311 and the holding surface 323. That is, as the distance D between the supply port 311 and the holding surface 323 increases, the amount of the molding material M held by the holding surface 323 increases. Therefore, the control device 7 can also adjust the amount of the molding material M held by the holding member 32 by controlling the distance adjusting device 37d in a manner of adjusting the distance D.

於保持構件32之振動之狀態固定之情形時,若保持構件32所保持之造形材料M之份量固定,則每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量成為固定。另一方面,於保持構件32之振動之狀態改變之情形時,若保持構件32所保持之造形材料M之份量隨著振動之狀態而改變,則每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量可成為固定。因此,控制裝置7亦可基於保持構件32之振動之狀態,以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定距離D。此時,控制裝置7亦可以與設定保持構件32之振動之狀態(例如,振幅或者頻率)之情形時相同之方式,考慮距離D與造形材料M之供給量(即,每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量)之間之關係以及造形材料M之狀態與造形材料M之供給量之間之關係中之至少一者,來設定距離D。進而,控制裝置7亦可以供給口311及保持面323沿著Z軸而分離所設定之距離D之方式,來控制距離調整裝置37d。 When the vibration state of the holding member 32 is fixed, if the amount of the forming material M held by the holding member 32 is fixed, the amount of the forming material M carried out from the holding surface 323 to the material sending member 34 per unit time is fixed. Become fixed. On the other hand, when the state of vibration of the holding member 32 is changed, if the amount of the shaping material M held by the holding member 32 changes with the state of the vibration, the material is removed from the holding surface 323 to the material per unit time. The amount of the forming material M in the feeding member 34 can be fixed. Therefore, based on the state of vibration of the holding member 32, the control device 7 can also be the amount of the forming material M carried out from the holding surface 323 into the material feeding member 34 per unit time as the forming material necessary for forming the shape. The distance D is set in such a manner that the supply rate of M corresponds to the required unloading amount. At this time, the control device 7 may also consider the distance D and the supply amount of the molding material M (that is, from the material per unit time) in the same manner as when the vibration state (for example, amplitude or frequency) of the holding member 32 is set. The distance D is set by at least one of the relationship between the amount of the molding material M supplied by the supply device 3 to the molding device 4 and the relationship between the state of the molding material M and the supply amount of the molding material M. Further, the control device 7 may control the distance adjustment device 37d in a manner that the supply port 311 and the holding surface 323 are separated along the Z axis by a set distance D.

或者,若保持構件32所保持之造形材料M之份量改變,則藉由保持構件32之振動,每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量亦可再次改變。因此,控制裝置7亦可藉由於造形裝置4形成造形物之期間調整(即,變更)距離D,來變更每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量。其結果為,隨著距離D之變更,每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量變更。此外,變更每單位時間內從材料供給裝置3中供給之造形材料M之份量之情況之 一例已如上所述。 Alternatively, if the amount of the shaping material M held by the holding member 32 is changed, the amount of the shaping material M carried out from the holding surface 323 to the material sending member 34 per unit time by the vibration of the holding member 32 can also be changed again. change. Therefore, the control device 7 can also adjust (ie, change) the distance D during the formation of the shaped object by the shaping device 4 to change the amount of the shaped material M carried out from the holding surface 323 to the material sending member 34 per unit time. . As a result, as the distance D is changed, the amount of the molding material M carried out from the material supply device 3 to the molding device 4 per unit time is changed. An example of the case where the amount of the shaping material M supplied from the material supply device 3 per unit time is changed has been described above.

即便為此種材料供給裝置3d,亦可享受與上述材料供給裝置3可享受之效果相同之效果。進而,材料供給裝置3d可藉由調整距離D,而將造形材料M更適當地供給至造形裝置4中。 Even if it is such a material supply device 3d, the same effect as the effect which the said material supply device 3 can enjoy can be enjoyed. Furthermore, the material supply device 3d can more appropriately supply the forming material M to the forming device 4 by adjusting the distance D.

(3-5)第5變形例(3-5) Fifth modification

第5變形例之造形系統1e與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3e。造形系統1e之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖12,對第5變形例之材料供給裝置3e進行說明。 The forming system 1e according to the fifth modification is different from the forming system 1 described above in that a material supply device 3e is provided instead of the material supply device 3. The other configurations of the forming system 1e may be the same as the other configurations of the forming system 1. Therefore, the material supply device 3e according to the fifth modification will be described below with reference to FIG. 12.

如圖12所示,材料供給裝置3e與上述材料供給裝置3a相比較,不同之處在於具備角度調整裝置38e。材料供給裝置3e之其他構成亦可與材料供給裝置3a之其他構成相同。 As shown in FIG. 12, the material supply device 3e is different from the above-mentioned material supply device 3a in that it includes an angle adjustment device 38e. The other configuration of the material supply device 3e may be the same as the other configuration of the material supply device 3a.

角度調整裝置38e可於控制裝置7之控制下,調整上表面361a相對於XY平面之傾斜角度(即,上表面361a相對於水平面或保持面323之傾斜角度)θ。角度調整裝置38e係於控制裝置7之控制下,藉由使搬送構件36a相對於保持構件32而移動,來調整傾斜角度θ。例如,角度調整裝置38e亦可藉由使搬送構件36a繞沿著XY平面之旋轉軸(例如,沿著X軸之旋轉軸)旋轉,來調整傾斜角度θ。例如,角度調整裝置38e可藉由使搬送構件36a沿著θX方向及θY方向中之至少一者而移動,來調整傾斜角度θ調整。角度調整裝置38e為了使搬送構件36a移動,例如亦可具備致動器等。角度調整裝置38e為了調整傾斜角度θ,亦可具備測量傾斜角度θ之測量裝置。測量傾斜角度θ之測量裝置例如可列舉傾斜感測器或者旋轉電位計。 The angle adjusting device 38e can adjust the inclination angle of the upper surface 361a with respect to the XY plane (ie, the inclination angle of the upper surface 361a with respect to the horizontal plane or the holding surface 323) θ under the control of the control device 7. The angle adjusting device 38e is controlled by the control device 7 and adjusts the inclination angle θ by moving the conveying member 36a relative to the holding member 32. For example, the angle adjustment device 38e may adjust the tilt angle θ by rotating the conveying member 36a about a rotation axis along the XY plane (for example, a rotation axis along the X axis). For example, the angle adjustment device 38e can adjust the tilt angle θ adjustment by moving the conveyance member 36a in at least one of the θX direction and the θY direction. In order to move the conveyance member 36a, the angle adjustment device 38e may be equipped with an actuator etc., for example. In order to adjust the inclination angle θ, the angle adjustment device 38e may be provided with a measurement device for measuring the inclination angle θ. Examples of the measurement device for measuring the tilt angle θ include a tilt sensor or a rotary potentiometer.

於保持構件32之振動之狀態為固定之情形時,若搬送構件36a之傾斜角度θ固定,則每單位時間內從保持面323上透過搬送構件36a而搬出至材 料送出構件34中之造形材料M之份量成為固定。另一方面,於保持構件32之振動之狀態改變之情形時,若搬送構件36a之傾斜角度θ隨著振動之狀態而改變,則每單位時間內從保持面323上透過搬送構件36a而搬出至材料送出構件34中之造形材料M之份量可成為固定。因此,控制裝置7亦可基於保持構件32之振動之狀態,以每單位時間內從保持面323上透過搬送構件36a而搬送至材料送出構件34中之造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定傾斜角度θ。此時,控制裝置7亦可以與設定保持構件32之振動之狀態(例如,振幅或頻率)之情形相同之方式,考慮傾斜角度θ與造形材料M之供給量(即,每單位時間內從材料供給裝置3供給至造形裝置4中之造形材料M之份量)之間之關係以及造形材料M之狀態與造形材料M之供給量之間之關係中之至少一者,來設定傾斜角度θ。進而,控制裝置7亦可以上表面361a相對於XY平面而以所設定之傾斜角度θ來傾斜之方式,控制角度調整裝置38e。 When the vibration state of the holding member 32 is fixed, if the inclination angle θ of the conveying member 36 a is fixed, the forming material M is conveyed from the holding surface 323 through the conveying member 36 a to the material conveying member 34 per unit time. The weight becomes fixed. On the other hand, when the state of vibration of the holding member 32 is changed, if the inclination angle θ of the conveying member 36a changes with the state of the vibration, the conveying member 36a is carried out from the holding surface 323 per unit time to the The amount of the forming material M in the material feeding member 34 can be fixed. Therefore, based on the state of vibration of the holding member 32, the control device 7 can also form the amount of the forming material M transferred from the holding surface 323 to the material sending member 34 through the carrying member 36a per unit time. The inclination angle θ is set in such a manner that the required supply rate of the forming material M corresponding to the required supply rate of the shaping material M is set. At this time, the control device 7 may also consider the inclination angle θ and the supply amount of the molding material M (that is, from the material per unit time) in the same manner as in the case of setting the vibration state (for example, amplitude or frequency) of the holding member 32. The inclination angle θ is set by at least one of the relationship between the amount of the molding material M supplied by the supply device 3 to the molding device 4 and the relationship between the state of the molding material M and the supply amount of the molding material M. Furthermore, the control device 7 may control the angle adjustment device 38e so that the upper surface 361a is inclined with respect to the XY plane at a set inclination angle θ.

或者,若傾斜角度θ改變,則每單位時間內從保持面323上透過搬送構件36a而搬出至材料送出構件34中之造形材料M之份量亦可再次改變。因此,控制裝置7亦可於造形裝置4形成造形物之期間,藉由調整(即,變更)傾斜角度θ,來變更每單位時間內從保持面323上透過搬送構件36a而搬出至材料送出構件34中之造形材料M之份量。其結果為,隨著傾斜角度θ之變更,每單位時間內從材料供給裝置3搬出至造形裝置4中之造形材料M之份量變更。此外,變更每單位時間內從材料供給裝置3中供給之造形材料M之份量之情況之一例為如上所述。 Alternatively, if the inclination angle θ is changed, the amount of the molding material M carried out from the holding surface 323 through the carrying member 36 a to the material sending member 34 may be changed again per unit time. Therefore, the control device 7 can also change (i.e., change) the tilt angle θ while the forming device 4 is forming the shaped object, so as to change from the holding surface 323 through the carrying member 36a to the material sending member per unit time. The amount of the shaping material M in 34. As a result, as the inclination angle θ is changed, the amount of the molding material M carried out from the material supply device 3 to the molding device 4 per unit time is changed. An example of the case where the amount of the shaping material M supplied from the material supply device 3 per unit time is changed is as described above.

即便為此種材料供給裝置3e,亦可享受與上述材料供給裝置3a可享受之效果相同之效果。進而,材料供給裝置3e可藉由調整傾斜角度θ,而將造形材料M更適當地供給至造形裝置4中。 Even with such a material supply device 3e, the same effects as those obtained by the material supply device 3a can be enjoyed. Furthermore, the material supply device 3e can more appropriately supply the forming material M to the forming device 4 by adjusting the inclination angle θ.

(3-6)第6變形例(3-6) Sixth modification

第6變形例之造形系統1f與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3f。造形系統1f之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖13,對第6變形例之材料供給裝置3f進行說明。 The forming system 1f according to the sixth modification is different from the forming system 1 described above in that a material supply device 3f is provided instead of the material supply device 3. The other configurations of the shaping system 1f may be the same as the other configurations of the shaping system 1. Therefore, the material supply device 3f according to the sixth modification will be described below with reference to FIG. 13.

如圖13所示,材料供給裝置3f與上述材料供給裝置3相比較,不同之處在於代替振動裝置33而具備旋轉裝置39f。材料供給裝置3f之其他構成亦可與材料供給裝置3之其他構成相同。此外,旋轉裝置39f之至少一部分亦可配置於筐體35之外部。 As shown in FIG. 13, the material supply device 3 f is different from the material supply device 3 described above in that a rotation device 39 f is provided instead of the vibration device 33. The other configuration of the material supply device 3f may be the same as the other configuration of the material supply device 3. In addition, at least a part of the rotation device 39f may be disposed outside the casing 35.

旋轉裝置39f係於控制裝置7之控制下,使保持構件32繞與保持面323交叉(例如,正交)之旋轉軸旋轉。具體而言,旋轉裝置39f係透過連結構件391f而與保持構件32(圖13所示之例中,其底構件321)連結。旋轉裝置39f藉由使連結構件391f旋轉,而使保持構件32旋轉。 The rotation device 39f is controlled by the control device 7 to rotate the holding member 32 around a rotation axis that intersects (for example, is orthogonal to) the holding surface 323. Specifically, the rotation device 39f is connected to the holding member 32 (the bottom member 321 in the example shown in FIG. 13) through the connection member 391f. The rotation device 39f rotates the connection member 391f to rotate the holding member 32.

旋轉裝置39f係於控制裝置7之控制下,藉由使保持構件32旋轉,而使保持面323所保持之造形材料M之一部分從保持面323上搬出至保持面323之外部(具體而言,材料送出構件34)。即,旋轉裝置39f係於控制裝置7之控制下,以保持面323所保持之造形材料M之一部分從保持面323上搬出至保持面323之外部(具體而言,材料送出構件34)之方式,使保持構件32旋轉。 The rotating device 39f is under the control of the control device 7 and rotates the holding member 32 to move a part of the molding material M held by the holding surface 323 out of the holding surface 323 to the outside of the holding surface 323 (specifically, The material feed member 34). That is, the rotation device 39f is controlled by the control device 7 so that a part of the molding material M held by the holding surface 323 is carried out from the holding surface 323 to the outside of the holding surface 323 (specifically, the material feeding member 34). , The holding member 32 is rotated.

如上所述,保持面323與料斗31之供給口311分離(即,不接觸)。即,保持構件32與料斗31分離(即,不接觸)。因此,旋轉裝置39f不會使料斗31旋轉。 As described above, the holding surface 323 is separated from the supply port 311 of the hopper 31 (ie, not in contact). That is, the holding member 32 is separated from the hopper 31 (ie, not in contact). Therefore, the rotating device 39f does not rotate the hopper 31.

若靜止之保持構件32開始旋轉,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分緩緩地開始崩塌。或者,若靜止之保持構件32開始旋轉,則從保持面323所穩定地保持之造形材料M之山 上,構成該山之造形材料M之一部分緩緩地開始分離。進而,若保持構件32繼續且以相同之方式持續旋轉,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分於每單位時間內以固定量緩緩地持續崩塌。若保持構件32繼續且以相同方式持續旋轉,則從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分於每單位時間內以固定量緩緩地持續分離。從山上崩落或分離之造形材料M從保持面323上灑落(即,搬出)至保持面323之外部(即,材料送出構件34)。其結果為,於每單位時間內,固定量之造形材料M從保持面323上搬出至材料搬出裝置34中。 When the stationary holding member 32 starts to rotate, a portion of the forming material M constituting the mountain gradually starts to collapse from the mountain of the forming material M stably held by the holding surface 323. Alternatively, when the stationary holding member 32 starts to rotate, a portion of the forming material M constituting the mountain gradually starts to separate from the mountain of the forming material M stably held by the holding surface 323. Further, if the holding member 32 continues and continues to rotate in the same manner, from the mountain of the forming material M stably held by the holding surface 323, a part of the forming material M constituting the mountain is gradually fixed at a fixed amount per unit time. The ground continued to collapse. If the holding member 32 continues and continues to rotate in the same manner, from the mountain of the forming material M stably held by the holding surface 323, a part of the forming material M constituting the mountain is gradually and continuously separated by a fixed amount per unit time. . The forming material M which has fallen or separated from the mountain is sprinkled (ie, carried out) from the holding surface 323 to the outside of the holding surface 323 (ie, the material feeding member 34). As a result, a fixed amount of the shaping material M is carried out from the holding surface 323 into the material carrying-out device 34 per unit time.

每單位時間內從保持面323上搬出至保持面323之外部的造形材料M之份量(即,每單位時間之造形材料M之搬出量)可於保持構件32之旋轉之狀態下控制。因此,旋轉裝置39f係於控制裝置7之控制下,以每單位時間內從保持面323上向材料送出構件34中搬出之造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之旋轉之狀態。進而,旋轉裝置39f係於控制裝置7之控制下,於造形裝置4形成造形物之期間(更具體而言,材料嘴412持續供給造形材料M之期間),以保持構件32於所設定之旋轉之狀態下持續旋轉之方式,使保持構件32旋轉。其結果為,為使造形裝置4形成造形物而於每單位時間內所必要之固定量之造形材料M從保持面323上搬出至材料送出構件34中。 The amount of the forming material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time (that is, the amount of the forming material M carried out per unit time) can be controlled in a state where the holding member 32 is rotated. Therefore, the rotating device 39f is under the control of the control device 7, and the amount of the forming material M carried out from the holding surface 323 to the material sending member 34 per unit time becomes the amount of the forming material M necessary for the formation of the forming object. The state of rotation of the holding member 32 is set in a manner of the required unloading amount corresponding to the supply rate. Further, the rotation device 39f is under the control of the control device 7 during the formation of the shape by the forming device 4 (more specifically, the period during which the material nozzle 412 continues to supply the shape material M) to keep the member 32 at the set rotation In this state, the holding member 32 is rotated in a manner of continuing to rotate. As a result, a fixed amount of the shaping material M necessary for forming the shaped object 4 per unit time is carried out from the holding surface 323 to the material feeding member 34.

旋轉之狀態例如亦可包含旋轉之速度。例如,旋轉之速度越快,則從保持面323所保持之造形材料M之山上,每單位時間內崩落或分離之造形材料M之份量增多。因此,旋轉之速度越快,每單位時間內從保持面323上搬出至保持面323之外部的造形材料M之份量增多。即,旋轉之速度越快,每單位時間內從材料供給裝置3供給至造形裝置4中的造形材料M之份量(即,供給量)增多。控制裝置7係考慮到此種保持構件32之旋轉之速度與造形材料M之供 給量之間之關係,以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之旋轉之速度。 The state of rotation may include, for example, the speed of rotation. For example, the faster the rotation speed, the greater the amount of the forming material M that has fallen or separated from the mountain of the forming material M held by the holding surface 323 per unit time. Therefore, the faster the rotation speed, the greater the amount of the molding material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time. That is, the faster the rotation speed, the greater the amount (ie, the supply amount) of the molding material M supplied from the material supply device 3 to the molding device 4 per unit time. The control device 7 considers the relationship between the rotation speed of the holding member 32 and the supply amount of the forming material M, and the amount of the forming material M carried out from the holding surface 323 to the material sending member 34 per unit time. The speed of the rotation of the holding member 32 is set in such a manner as to be a necessary carrying-out amount corresponding to the supply rate of the forming material M necessary for forming the forming object.

但,若保持構件32之旋轉之速度過快,則存在保持面323所保持之造形材料M之山一口氣崩塌之可能性。因此,控制裝置7亦可以滿足保持面323所保持之造形材料M之山緩緩地崩塌(即,不一口氣崩塌)之制約之方式,來設定旋轉之速度。 However, if the rotation speed of the holding member 32 is too high, there is a possibility that the mountain of the forming material M held by the holding surface 323 collapses at once. Therefore, the control device 7 can also set the rotation speed in a manner that satisfies the restriction that the mountain of the forming material M held by the holding surface 323 collapses slowly (that is, collapses at one breath).

進而,即便保持構件34之旋轉之速度相同,亦存在如下可能性:每單位時間內從保持面323上搬出之第1狀態之造形材料M之份量、與每單位時間內從保持面323上搬出之第2狀態(但,第2狀態與第1狀態不同)之造形材料M之份量不成為相同。因此,於第6變形例中,控制裝置7亦可除了或代替考慮保持構件32之旋轉之狀態與造形材料M之供給量之間之關係,而考慮到造形材料M之狀態與造形材料M之供給量之間之關係,以每單位時間內從保持面323上搬出至材料送出構件34中的造形材料M之份量成為與造形物之形成所必需之造形材料M之供給速率對應之所需搬出量之方式,來設定保持構件32之旋轉之狀態。 Furthermore, even if the rotation speed of the holding member 34 is the same, there is a possibility that the weight of the first-state molding material M carried out from the holding surface 323 per unit time and the carrying amount of the forming material M from the holding surface 323 per unit time may be removed. In the second state (however, the second state is different from the first state), the weights of the forming materials M are not the same. Therefore, in the sixth modification, the control device 7 may also consider or consider the relationship between the state of rotation of the holding member 32 and the supply amount of the shaping material M, and consider the state of the shaping material M and the shape of the shaping material M. The relationship between the supply amounts is such that the amount of the shaping material M carried out from the holding surface 323 into the material feeding member 34 per unit time becomes the required removal rate corresponding to the supply rate of the shaping material M necessary for the formation of the shaped object. The quantity is used to set the rotation state of the holding member 32.

從保持面323上搬出之造形材料M從保持面323上落下至材料送出構件34中。但,由於保持面323旋轉,故而造形材料M並非從保持面323上一直向相同方向落下。例如,如圖13所示,存在隨著保持面323之旋轉,造形材料M從保持面323上放射狀地、四面八方地或者向360度所有方向落下之可能性。因此,第6變形例中,材料送出構件34為了可接收從保持面323上放射狀地、四面八方地或者向360度所有方向落下之造形材料M,而具有適當尺寸且配置於適當之位置上。此外,於材料送出構件34可接收從保持面323上放射狀地、四面八方地或者向360度所有方向落下之造形材料M之情形時,保持構件32 亦可不具備作為引導保持面323上之造形材料M之引導構件而發揮功能之側壁構件322。 The molding material M carried out from the holding surface 323 falls from the holding surface 323 into the material feeding member 34. However, since the holding surface 323 rotates, the shaping material M does not fall from the holding surface 323 all the way in the same direction. For example, as shown in FIG. 13, as the holding surface 323 rotates, there is a possibility that the shaping material M falls from the holding surface 323 radially, in all directions, or in all directions of 360 degrees. Therefore, in the sixth modification, the material sending member 34 has an appropriate size and is disposed at an appropriate position so as to receive the forming material M dropped radially, in all directions, or 360 degrees from the holding surface 323. In addition, when the material sending member 34 can receive the forming material M falling radially, in all directions, or 360 degrees from the holding surface 323, the holding member 32 may not be provided with the forming material as a guide on the holding surface 323 The guide member of M functions as a side wall member 322.

即便為此種材料供給裝置3f,亦可享受與上述材料供給裝置3可享受之效果相同之效果。 Even if it is such a material supply device 3f, the same effect as the effect which the said material supply device 3 can enjoy can be enjoyed.

此外,材料供給裝置3f亦可代替旋轉裝置39f,而具備任意之驅動裝置,其可以保持面323所保持之造形材料M之一部分從保持面323上搬出至保持面323之外部(具體而言,材料送出構件34)之方式驅動保持構件32。進而,於該情形時,控制裝置7亦可控制保持構件32之動作之狀態,來控制每單位時間內從保持面323上搬出至保持面323之外部的造形材料M之份量。即便為該情形,材料供給裝置3f亦可享受與上述材料供給裝置3可享受之效果相同之效果。 In addition, the material supply device 3f may be provided with an arbitrary driving device instead of the rotation device 39f, and a part of the molding material M held by the holding surface 323 can be carried out from the holding surface 323 to the outside of the holding surface 323 (specifically, The material feeding member 34) drives the holding member 32. Furthermore, in this case, the control device 7 may also control the operation state of the holding member 32 to control the amount of the molding material M carried out from the holding surface 323 to the outside of the holding surface 323 per unit time. Even in this case, the material supply device 3f can enjoy the same effects as those described above for the material supply device 3.

另外,材料供給裝置3f除了旋轉裝置39f以外,亦可具備上述振動裝置33。或者,旋轉裝置39f亦可與上述振動裝置33同樣地使保持構件32振動。於該情形時,保持構件32亦可於振動之同時進行旋轉。 The material supply device 3f may include the vibration device 33 described above in addition to the rotation device 39f. Alternatively, the rotating device 39f may vibrate the holding member 32 in the same manner as the vibration device 33 described above. In this case, the holding member 32 may also rotate while vibrating.

(3-7)第7變形例 (3-7) Seventh modification

第7變形例之造形系統1g與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3g。造形系統1g之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖14,對第7變形例之材料供給裝置3g進行說明。 The forming system 1g of the seventh modification is different from the forming system 1 described above in that a material supply device 3g is provided instead of the material supply device 3. The other configurations of the shaping system 1g may be the same as the other configurations of the shaping system 1. Therefore, a material supply device 3g according to a seventh modification will be described below with reference to FIG. 14.

如圖14所示,材料供給裝置3g與上述材料供給裝置3f相比較,不同之處在於具備搬送構件36a。材料供給裝置3g之其他構成亦可與材料供給裝置3f之其他構成相同。此外,搬送構件36a由於已於第1變形例等中說明完畢,故而省略詳細說明。但,第7變形例中,搬送構件36a係以可接收從保持面323上放射狀地、四面八方地或者向360度所有方向落下之造形材料M,而具有 適當之尺寸且配置於適當之位置上。 As shown in FIG. 14, the material supply device 3g differs from the above-mentioned material supply device 3f in that it includes a conveying member 36a. The other configuration of the material supply device 3g may be the same as the other configuration of the material supply device 3f. In addition, since the conveyance member 36a was already demonstrated in 1st modification etc., detailed description is abbreviate | omitted. However, in the seventh modification, the conveying member 36a is capable of receiving the forming material M that is dropped from the holding surface 323 radially, in all directions, or in all directions of 360 degrees, and has an appropriate size and is arranged at an appropriate position. .

即便為此種材料供給裝置3g,亦可享受與上述材料供給裝置3a及3f各自可享受之效果相同之效果。 Even with such a material supply device 3g, the same effects as those of the above-mentioned material supply devices 3a and 3f can be enjoyed.

(3-8)第8變形例(3-8) Eighth modification

第8變形例之造形系統1h與上述造形系統1相比較,不同之處在於代替材料供給裝置3而具備材料供給裝置3h。造形系統1h之其他構成亦可與造形系統1之其他構成相同。因此,以下,參照圖15,對第8變形例之材料供給裝置3h進行說明。 The forming system 1h according to the eighth modification is different from the forming system 1 described above in that a material supply device 3h is provided instead of the material supply device 3. The other configurations of the shaping system 1h may be the same as the other configurations of the shaping system 1. Therefore, the material supply device 3h according to the eighth modification will be described below with reference to FIG. 15.

如圖15所示,材料供給裝置3h與上述材料供給裝置3相比較,不同之處在於底構件321亦可不沿著Z軸方向而與供給口311對向。材料供給裝置3h與上述材料供給裝置3相比較,不同之處在於保持面323亦可不沿著Z軸方向而與供給口311對向。但,於保持面323不與供給口311對向之情形時,從供給口311中供給(即,落下)之造形材料M並不直接供給至保持面323上。因此,材料供給裝置3h具備將從供給口311中供給之造形材料M引導至保持面323上之引導構件30h。材料供給裝置3h之其他構成亦可與材料供給裝置3之其他構成相同。 As shown in FIG. 15, the material supply device 3 h is compared with the above-mentioned material supply device 3 with the difference that the bottom member 321 may also face the supply port 311 not along the Z-axis direction. The material supply device 3h is different from the material supply device 3 described above in that the holding surface 323 may also face the supply port 311 not along the Z-axis direction. However, when the holding surface 323 is not opposed to the supply port 311, the forming material M supplied (ie, dropped) from the supply port 311 is not directly supplied to the holding surface 323. Therefore, the material supply device 3h includes a guide member 30h that guides the molding material M supplied from the supply port 311 onto the holding surface 323. The other configuration of the material supply device 3h may be the same as the other configuration of the material supply device 3.

引導構件30h具備上表面301h。上表面301h之一部分係沿著Z軸方向而與供給口311對向。上表面301h之端部302h配置於保持面323之上方。上表面301h係以從供給口311向保持面323下降之方式,相對於水平面而傾斜。其結果為,從供給口311中供給之造形材料M落下至上表面301h上,然後,從上表面301h上滑落下去,然後,從上表面301h之端部302h落下至保持面323上。即便為該情形,亦由於上表面301h之端部302h位於保持面323之上方,故而從上表面301h上落下之造形材料M係以形成隨著從端部302h朝向下方而向外側擴展之造形材料M之山之方式,堆積於保持面323上。其結果為,保持面323可以如 下方式保持造形材料M:從上表面301h上落下之造形材料M之山係以其斜面(具體而言,從供給口311之下端部3141至保持面323為止之斜面)與保持面323所形成之角度不超過靜止角θr之狀態,形成於保持面323上。即,保持面323可於保持構件32靜止之狀況下,以造形材料M之山不會自發性崩塌之方式,保持造形材料M。進而,由於在保持構件32靜止之狀況下,造形材料M之山不會自發性崩塌,故而於保持構件32靜止之狀況下,堆積於上表面301h及保持面323上之造形材料M堵塞供給口311,可抑制其以上之造形材料M供給至上表面301h上(進而抑制透過上表面301h而供給至保持面323上)。另一方面,若保持構件32振動,則與上述材料供給裝置3同樣地,從保持面323所穩定地保持之造形材料M之山上,構成該山之造形材料M之一部分落下至材料搬出裝置34中。其結果為,於每單位時間內,固定量之造形材料M從保持面323上搬出至材料搬出裝置34中。 The guide member 30h includes an upper surface 301h. A part of the upper surface 301h faces the supply port 311 along the Z-axis direction. An end portion 302h of the upper surface 301h is disposed above the holding surface 323. The upper surface 301h is inclined with respect to a horizontal plane so as to descend from the supply port 311 toward the holding surface 323. As a result, the forming material M supplied from the supply port 311 drops onto the upper surface 301h, then slides down from the upper surface 301h, and then falls from the end portion 302h of the upper surface 301h to the holding surface 323. Even in this case, since the end portion 302h of the upper surface 301h is above the holding surface 323, the forming material M falling from the upper surface 301h is a forming material that expands outward as the end portion 302h goes downward. The way of M Mountain is stacked on the holding surface 323. As a result, the holding surface 323 can hold the forming material M in such a manner that the mountain of the forming material M dropped from the upper surface 301h with its slope (specifically, from the lower end portion 3141 of the supply port 311 to the holding surface 323). The inclined surface is formed on the holding surface 323 in a state where the angle formed by the holding surface 323 does not exceed the rest angle θr. That is, the holding surface 323 can hold the forming material M in a state where the holding member 32 is stationary, so that the mountain of the forming material M does not collapse spontaneously. Furthermore, since the mountain of the molding material M does not collapse spontaneously when the holding member 32 is stationary, the molding material M deposited on the upper surface 301h and the holding surface 323 blocks the supply opening while the holding member 32 is stationary. 311, it is possible to suppress the supply of the above-mentioned forming material M to the upper surface 301h (and further to suppress the supply of the forming material M to the holding surface 323 through the upper surface 301h). On the other hand, when the holding member 32 vibrates, similar to the material supply device 3 described above, a part of the forming material M constituting the mountain is dropped from the mountain of the forming material M stably held by the holding surface 323 to the material carrying-out device 34. in. As a result, a fixed amount of the shaping material M is carried out from the holding surface 323 into the material carrying-out device 34 per unit time.

即便為此種第8變形例之材料供給裝置3h,亦可享受與上述材料供給裝置3可享受之效果相同之效果。進而,材料供給裝置3h中,與上述材料供給裝置3相比較,保持構件32亦可不必與供給口311對向,因此保持構件32之配置之自由度增加。 Even with the material supply device 3h of the eighth modification, the same effects as those of the material supply device 3 described above can be enjoyed. Furthermore, in the material supply device 3h, as compared with the above-mentioned material supply device 3, the holding member 32 does not have to be opposed to the supply port 311, so the degree of freedom in the arrangement of the holding member 32 is increased.

此外,圖16所示之引導構件30h之構造或形狀或配置僅為一例,具有任意構造及形狀之引導構件30h亦可配置於任意之位置。即便為該情形,亦只要引導構件30h可將從供給口311中供給之造形材料M引導至保持面323上,,則可享受上述效果。 In addition, the structure, shape, or arrangement of the guide member 30h shown in FIG. 16 is only an example, and the guide member 30h having an arbitrary structure and shape may be arranged at an arbitrary position. Even in this case, as long as the guide member 30h can guide the molding material M supplied from the supply port 311 onto the holding surface 323, the above-mentioned effect can be enjoyed.

(3-9)其他變形例(3-9) Other modifications

上述說明中,保持面323之大小滿足保持面323增大至如下程度之第3條件,即,保持面323除了區域3231以外,還可具備向區域3231之外側擴展之區域3232之程度。然而,保持面323之大小亦可不滿足第3條件。即,保持面323 亦可不具備向區域3231之外側擴展之區域3232。即便為該情形,亦只要可於保持面323上規定區域3231,則保持面323可將造形材料M於保持面323上所形成之山,以該山之斜面與保持面323形成之角度成為靜止角θr之狀態來保持。因此,保持面323亦可以從供給口311中供給之造形材料M於保持面323上形成之造形材料M之山不會自發性地崩塌之方式,保持造形材料M。 In the above description, the size of the holding surface 323 satisfies the third condition that the holding surface 323 is increased to the extent that the holding surface 323 may include an area 3232 extending beyond the area 3231 in addition to the area 3231. However, the size of the holding surface 323 may not satisfy the third condition. In other words, the holding surface 323 may not include the area 3232 extending outward from the area 3231. Even in this case, as long as a region 3231 can be specified on the holding surface 323, the holding surface 323 can make a mountain formed by the molding material M on the holding surface 323, and become stationary at an angle formed by the slope of the mountain and the holding surface 323. The state of the angle θr is maintained. Therefore, the holding surface 323 can also hold the forming material M in such a manner that the mountain of the forming material M formed on the holding surface 323 supplied from the supply port 311 does not collapse spontaneously.

上述說明中,保持構件32具備側壁構件322。然而,保持構件32亦可不具備側壁構件322。但,於該情形時,存在隨著保持面323之振動,造形材料M從保持面323上放射狀地、四面八方地或者向360度所有方向落下之可能性。因此,於該情形時,材料送出構件34為了可接收從保持面323上放射狀地、四面八方地或者向360度所有方向落下之造形材料M,而具有適當之尺寸且配置於適當之位置上。 In the above description, the holding member 32 includes the side wall member 322. However, the holding member 32 may not include the side wall member 322. However, in this case, with the vibration of the holding surface 323, the shaping material M may fall radially from the holding surface 323, in all directions, or in all directions of 360 degrees. Therefore, in this case, the material sending member 34 has an appropriate size and is disposed at an appropriate position so as to receive the forming material M falling radially, in all directions, or 360 degrees from the holding surface 323.

此外,上述說明中,保持構件32(或者底構件321)由於接收從料斗31中供給之造形材料M,故而亦稱為材料接收構件。另外,亦可將保持面323稱為材料接收面。 In addition, in the above description, the holding member 32 (or the bottom member 321) is also referred to as a material receiving member because it receives the forming material M supplied from the hopper 31. The holding surface 323 may be referred to as a material receiving surface.

此外,上述說明中,保持面323係與XY平面平行之面,但亦可為曲面,亦可存在凹凸。 In the above description, the holding surface 323 is a surface parallel to the XY plane. However, the holding surface 323 may be a curved surface or may have unevenness.

上述說明中,造形裝置4具備使造形頭41移動之驅動系統42。然而,造形裝置4除了或代替驅動系統42,亦可具備使平台43移動之驅動系統。平台43可於X軸方向、Y軸方向、Z軸方向、θX方向、θY方向及θZ方向中之至少一個方向上移動。於該情形時,控制裝置7亦可以對工件W上之複數個單位區域分別供給之造形材料M之份量成為相同之方式,基於平台43之移動速度,來變更每單位時間內從材料供給裝置3供給至造形裝置4中之造形材料M之份量。具體而言,控制裝置7亦可以平台43之移動速度越快,每單位時間內從材料供給裝置3供給至造形裝置4中之造形材料M之份量(即,每單位時間之造形 材料M之供給量)越多之方式,來變更每單位時間之造形材料M之供給量。 In the above description, the shaping device 4 includes a drive system 42 for moving the shaping head 41. However, in addition to or instead of the drive system 42, the shaping device 4 may be provided with a drive system for moving the platform 43. The stage 43 is movable in at least one of an X-axis direction, a Y-axis direction, a Z-axis direction, a θX direction, a θY direction, and a θZ direction. In this case, the control device 7 can also change the amount of the molding material M supplied to the plurality of unit areas on the workpiece W in the same manner, and change the material supply device 3 per unit time based on the moving speed of the platform 43. The amount of the forming material M supplied to the forming device 4. Specifically, the control device 7 can also move the platform 43 faster, and the amount of the molding material M supplied from the material supply device 3 to the molding device 4 per unit time (that is, the supply of the molding material M per unit time) The greater the amount, the more the supply amount of the forming material M per unit time is changed.

上述說明中,材料送出構件34藉由壓送而送出造形材料M,藉此使材料送出構件34於每單位時間內送出之造形材料M之份量依存於每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量。然而,亦可藉由將材料供給裝置3配置於造形裝置4之上方,材料送出構件34以重力來送出造形材料M,而使材料送出構件34於每單位時間內送出之造形材料M之份量依存於每單位時間內從保持面323上搬出至材料送出構件34中之造形材料M之份量。 In the above description, the material sending member 34 sends out the forming material M by pressure feeding, so that the weight of the forming material M sent by the material sending member 34 per unit time is carried out from the holding surface 323 to the unit surface time. The amount of the shaping material M in the material feeding member 34. However, by arranging the material supply device 3 above the shaping device 4, the material sending member 34 sends the shaping material M by gravity, and the amount of the shaping material M sent by the material sending member 34 per unit time depends on The amount of the shaping material M carried out from the holding surface 323 into the material feeding member 34 per unit time.

上述說明中,造形裝置4藉由對造形材料M照射光EL,而使造形材料M熔融。然而,造形裝置4亦可藉由對造形材料M照射任意之能量束,而使造形材料M熔融。於該情形時,造形裝置4亦可除了或代替照射系統411,而具備可照射任意之能量束的光束照射裝置。任意之能量束並無限定,包含電子束、離子束等帶電粒子束或者電磁波。 In the above description, the shaping device 4 irradiates the shaping material M with light EL to melt the shaping material M. However, the shaping device 4 may melt the shaping material M by irradiating the shaping material M with an arbitrary energy beam. In this case, the shaping device 4 may be provided with a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or instead of the irradiation system 411. The arbitrary energy beam is not limited, and includes a charged particle beam such as an electron beam, an ion beam, or an electromagnetic wave.

上述說明中,造形系統1可藉由雷射堆焊法來形成造形物。然而,造形系統1亦可利用由粉狀或粒狀之造形材料M來形成造形物之其他方式,由造形材料M來形成造形物。作為其他方式,例如可列舉:粉末燒結積層造形法(SLS:Selective Laser Sintering)等粉末床熔融結合法(Powder Bed Fusion)、結合材噴射法(Binder Jetting)或者、雷射金屬熔融法(LMF:Laser Metal Fusion)。於該情形時,為供給粉狀或粒狀之造形材料M,亦可使用上述材料供給裝置3。 In the above description, the shaping system 1 can form a shaped object by a laser surfacing method. However, the shaping system 1 may also use other methods of forming the shaped object from the powdered or granular shaped material M, and the shaped material M may be used to form the shaped object. Other methods include, for example, a powder bed fusion method (SLS: Selective Laser Sintering), a powder bed fusion method (Powder Bed Fusion), a binder jetting method (Binder Jetting), or a laser metal fusion method (LMF: Laser Metal Fusion). In this case, in order to supply the powdery or granular forming material M, the above-mentioned material supply device 3 may be used.

上述說明中,可由造形材料M來形成造形物之造形系統1具備材料供給裝置3。然而,可使用任意之粉粒體來進行加工處理之加工系統亦可代替造形材料M而具備供給該任意之粉粒體之材料供給裝置3。此種加工系統之一例可列舉由粒狀或粉狀之原料來製造醫藥品之藥品製造系統。於該情形時,材 料供給裝置3供給粒狀或粉狀之原料。或者,作為此種加工系統之一例,可列舉由粒狀或粉狀之原料來製造食品之食品製造系統。於該情形時,材料供給裝置3供給粒狀或粉狀之原料。或者,作為此種加工系統之一例,可列舉:利用藉由將寶特瓶或玻璃容器粉碎而獲得之再生顆粒來製造寶特瓶或玻璃容器(或者其他各種製品)之再循環製造系統。於該情形時,材料供給裝置3供給再生顆粒。或者,作為此種加工系統之一例,可列舉由微小之零件來製造電子製品之電子製品製造系統。於該情形時,材料供給裝置3供給微小之零件。 In the above description, the shaping system 1 that can form a shaped object from the shaping material M includes the material supply device 3. However, a processing system that can use any powder or granular material for processing can be provided with a material supply device 3 that supplies the arbitrary powder or granular material instead of the molding material M. An example of such a processing system is a pharmaceutical manufacturing system for manufacturing pharmaceutical products from granular or powdery raw materials. In this case, the material supply device 3 supplies granular or powdery materials. Alternatively, as an example of such a processing system, a food production system for producing food from granular or powdery raw materials can be mentioned. In this case, the material supply device 3 supplies granular or powdery raw materials. Alternatively, as an example of such a processing system, a recycling manufacturing system for manufacturing a PET bottle or glass container (or other various products) using recycled particles obtained by pulverizing the PET bottle or glass container may be mentioned. In this case, the material supply device 3 supplies recycled particles. Alternatively, as an example of such a processing system, an electronic product manufacturing system for manufacturing electronic products from minute parts can be cited. In this case, the material supply device 3 supplies minute parts.

上述各實施方式之構成要件之至少一部分可與上述各實施方式之構成要件之至少其他之一部分適當組合。上述各實施方式之構成要件中之一部分亦可不使用。另外,只要法令容許,則援引上述各實施方式中引用之所有公開公報以及美國專利之揭示來作為本文之記載之一部分。 At least a part of the constituent elements of each of the above-mentioned embodiments may be appropriately combined with at least another part of the constituent elements of each of the above-mentioned embodiments. Some of the constituent elements of the above-mentioned embodiments may not be used. In addition, as long as the statute permits, all the publications cited in the above-mentioned embodiments and the disclosure of the US patent are cited as part of the description herein.

本發明並不限定於上述實施例,可於不違反從專利申請之範圍以及說明書整體中讀取之發明之要旨或思想之範圍內適當變更,另外,伴隨此種變更之供給裝置、加工系統及加工方法亦包含於本發明之技術範圍內。 The present invention is not limited to the above-mentioned embodiments, and may be appropriately modified within a range that does not violate the spirit or idea of the invention read from the scope of the patent application and the entire specification. In addition, the supply device, processing system, and The processing method is also included in the technical scope of the present invention.

Claims (75)

一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備保持來自上述供給口之上述粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且以上述驅動裝置驅動上述保持面,使於上述保持面上形成靜止角而被保持之上述粉粒體之一部分從上述保持面上落下。     A supply device includes a supply source having a supply port for supplying powder and granules, and a holding member located at a position away from the supply port and having a holding surface for holding the powder and granules from the supply port. And a driving device that drives the holding surface; and drives the holding surface with the driving device so that a part of the powder and granules held by forming a rest angle on the holding surface falls from the holding surface.     如申請專利範圍第1項之供給裝置,其中藉由以上述驅動裝置驅動上述保持面,而使上述保持面所保持之上述粉粒體之一部分從上述保持面之端部落下,從上述供給口之邊緣延伸至上述端部為止之假想面與水平面所形成之角度為上述粉粒體之靜止角以下。     For example, the supply device according to the scope of patent application, wherein the holding surface is driven by the driving device, so that a part of the powder and granules held by the holding surface is lowered from the end of the holding surface and from the supply port The angle formed by the imaginary plane extending from the edge to the end portion and the horizontal plane is equal to or less than the rest angle of the powder and granules.     一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備將來自上述供給口之上述粉粒體保持於上述供給口與上述保持面之間之保持面;以及驅動裝置,其驅動上述保持面;並且藉由以上述驅動裝置驅動上述保持面,而使上述保持面所保持之上述粉粒體之一部分從上述保持面之端部落下,從上述供給口之邊緣延伸至上述端部為止之假想面與水平面所形成之角度為上述粉粒體之靜止角以下。     A supply device includes a supply source including a supply port for supplying powder and granules, and a holding member located at a position away from the supply port and holding the powder and granules from the supply port. A holding surface between the supply port and the holding surface; and a driving device that drives the holding surface; and by driving the holding surface with the driving device, a part of the powder and granules held by the holding surface is removed from the above Below the end of the holding surface, the angle formed by the imaginary surface extending from the edge of the supply port to the end and the horizontal plane is below the rest angle of the powder and granules.     如申請專利範圍第2或3項之供給裝置,其中上述保持面將來自上述供給口之上述粉粒體保持於從上述供給口之邊緣延 伸至上述端部為止之假想面與上述供給口之間。     For example, in the supply device according to the second or third aspect of the patent application, the holding surface holds the powder and granules from the supply port between an imaginary surface extending from an edge of the supply port to the end and the supply port. .     如申請專利範圍第2至4項中任一項之供給裝置,其中上述保持構件於上述粉粒體之一部分不落下之端部之至少一部分具有側壁。     For example, in the supply device according to any one of claims 2 to 4, the holding member has a side wall on at least a part of an end portion where a part of the powder and granules does not fall.     如申請專利範圍第1至5項中任一項之供給裝置,其中藉由上述供給源供給上述粉粒體,上述粉粒體可於上述保持面上形成靜止角而被保持。     For example, the supply device according to any one of claims 1 to 5, wherein the powder and granules are supplied by the supply source, and the powder and granules can be held at a rest angle on the holding surface.     如申請專利範圍第1至6項中任一項之供給裝置,其中以上述驅動裝置驅動上述保持面,使堆積於上述保持面與上述供給口之間之上述粉粒體之一部分從上述保持面上落下。     The supply device according to any one of claims 1 to 6, wherein the driving device drives the holding surface so that a part of the powder and granules accumulated between the holding surface and the supply port is lifted from the holding surface. Falling down.     一種供給裝置,其具備:供給源,其具備供給粉粒體之供給口;保持構件,其位於從上述供給口向下方離開之位置,且具備保持來自上述供給口之上述粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且以上述驅動裝置驅動上述保持面,使堆積於上述保持面與上述供給口之間之上述粉粒體之一部分從上述保持面上落下。     A supply device includes a supply source having a supply port for supplying powder and granules, and a holding member located at a position away from the supply port and having a holding surface for holding the powder and granules from the supply port. And a driving device that drives the holding surface; and drives the holding surface with the driving device so that a part of the powder and granules deposited between the holding surface and the supply port fall from the holding surface.     如申請專利範圍第7或8項之供給裝置,其中上述粉粒體係以從上述供給口擴散之方式堆積於上述保持面上。     For example, the supply device according to the seventh or eighth aspect of the patent application, wherein the powder system is deposited on the holding surface in a manner of diffusing from the supply port.     如申請專利範圍第7至9項中任一項之供給裝置,其中上述保持面之大小係可於上述保持面之靜止時,維持堆積於上述供給口與上述保持面之間之上述粉粒體之靜止角的大小。     For example, the supply device according to any one of claims 7 to 9, wherein the size of the holding surface can maintain the powder and granules accumulated between the supply port and the holding surface when the holding surface is stationary. The angle of repose.     如申請專利範圍第7至10項中任一項之供給裝置,其中堆積於上述保持面上之上述粉粒體與上述供給口接觸。     For example, the supply device according to any one of claims 7 to 10, wherein the powder and granules deposited on the holding surface are in contact with the supply port.     如申請專利範圍第7至11項中任一項之供給裝置,其中當上述驅動裝置不驅動上述保持面時,以與上述供給口接觸之方式堆積於上述保持面之上述粉粒體抑制來自上述供給口之上述粉粒體之供給。     The supply device according to any one of claims 7 to 11, wherein when the driving device does not drive the holding surface, the powder and granules deposited on the holding surface in a manner contacting the supply port are suppressed from coming from the above. Supply of the powder and granules at the supply port.     如申請專利範圍第7至12項中任一項之供給裝置,其中藉由上述供給源供給粉粒體,而於上述保持面上保持既定量之上述粉粒體。     For example, the supply device according to any one of claims 7 to 12, wherein the powder and granules are supplied by the supply source, and the powder and granules of a predetermined amount are held on the holding surface.     如申請專利範圍第1至13項中任一項之供給裝置,其中上述保持面包含:圓形之第1區域,其從位於上述供給口之下方最近處之上述保持面上之基準點向外側擴散,且半徑大於上述供給口與上述保持面之間之距離。     For example, the supply device according to any one of claims 1 to 13, wherein the holding surface includes: a circular first area, which is outward from a reference point on the holding surface located below the supply port nearest to the holding surface. Diffuse, and the radius is larger than the distance between the supply port and the holding surface.     如申請專利範圍第14項之供給裝置,其中從上述供給口延伸至上述第1區域之外邊緣之假想面係相對於上述保持面而傾斜。     For example, in the supply device of the scope of application for a patent, the imaginary surface extending from the supply port to the outer edge of the first region is inclined with respect to the holding surface.     如申請專利範圍第14或15項之供給裝置,其中從上述供給口延伸至上述第1區域之外邊緣之假想面係與上述保持面交叉。     For example, in the supply device of claim 14 or 15, the imaginary surface extending from the supply port to the outer edge of the first region intersects the holding surface.     如申請專利範圍第15或16項之供給裝置,其中從上述供給口延伸至上述第1區域之外邊緣之假想面與上述保持面所形成之角度為上述粉粒體之靜止角。     For example, the supply device of the patent application No. 15 or 16, wherein the angle formed by the imaginary surface extending from the supply port to the outer edge of the first region and the holding surface is the rest angle of the powder and granules.     如申請專利範圍第14至17項中任一項之供給裝置,其中上述保持面包含向上述第1區域之外側擴散之第2區域。     For example, the supply device according to any one of claims 14 to 17, wherein the holding surface includes a second region that diffuses to the outside of the first region.     如申請專利範圍第1至18項中任一項之供給裝置,其中上述保持面與位於上述供給口之下方最近處之上述保持面上之基準點越接近,則保持越多之上述粉粒體。     For example, if the supply device according to any one of claims 1 to 18 of the patent application scope, the closer the reference point of the holding surface to the holding surface closest to the bottom of the supply port is, the more the powder and granules are held. .     如申請專利範圍第1至19項之供給裝置,其中上述驅動裝置不驅動上述供給口。     For example, the supply device of claims 1 to 19, wherein the driving device does not drive the supply port.     如申請專利範圍第1至20項之供給裝置,其中從上述保持面落下之上述粉粒體之每單位時間之搬出量,係與從上述供給口供給至上述保持面之上述粉粒體之每單位時間之供給量相等,上述粉粒體之落下係由上述驅動裝置驅動上述保持面所造成。     For example, in the supply device of the scope of claims 1 to 20, the amount of the powder and granules carried out from the holding surface per unit time is equal to that of each of the powders and granules supplied from the supply port to the holding surface. The supply amount per unit time is equal, and the falling of the powder and granules is caused by the driving device driving the holding surface.     如申請專利範圍第21項之供給裝置,其中於上述供給口與上述保持面之間,堆積可於上述保持面之靜止時維持上述粉粒體之靜止角之量之上述粉粒體。     For example, in the supply device of the scope of patent application No. 21, between the supply port and the holding surface, the powder and granules can be deposited in an amount capable of maintaining a rest angle of the powder and granules when the holding surface is stationary.     如申請專利範圍第1至22項中任一項之供給裝置,其中上述保持面包含水平面。     For example, the supply device according to any one of claims 1 to 22, wherein the bread keeps the water level of the bread.     如申請專利範圍第1至23項中任一項之供給裝置,其中藉由停止由上述驅動裝置所引起之上述保持面之動作,而使來自上述保持面上之上述粉粒體之落下停止。     For example, the supply device according to any of claims 1 to 23 of the patent application scope, wherein the falling of the powder and granules from the holding surface is stopped by stopping the operation of the holding surface caused by the driving device.     如申請專利範圍第1至24項中任一項之供給裝置,其進而具備調整上述供給口與上述保持面之間之距離的距離調整裝置,並且利用上述距離調整裝置來調整上述距離,控制從上述保持面落下之上述粉粒體之每單位時間之搬出量。     For example, the supply device according to any of claims 1 to 24 of the patent application scope further includes a distance adjustment device that adjusts the distance between the supply port and the holding surface, and uses the distance adjustment device to adjust the distance to control the distance from The carrying amount of the powder and granules dropped from the holding surface per unit time.     如申請專利範圍第1至25項中任一項之供給裝置,其中控制由上述驅動裝置所引起之上述保持面之動作,來控制從上述保持面落下之上述粉粒體之每單位時間之搬出量。     For example, the supply device according to any one of claims 1 to 25, wherein the operation of the holding surface caused by the driving device is controlled to control the removal of the powder and granular material per unit time from the holding surface. the amount.     如申請專利範圍第26項之供給裝置,其中上述驅動裝置係使上述保持面繞與上述保持面交叉之旋轉軸旋轉,且上述動作之控制包含上述保持面之旋轉之控制。     For example, the supply device of the 26th aspect of the patent application, wherein the driving device rotates the holding surface about a rotation axis that intersects the holding surface, and the control of the action includes control of the rotation of the holding surface.     如申請專利範圍第27項之供給裝置,其中上述旋轉之控制包含上述保持面之旋轉速度之控制。     For example, the supply device of the scope of application for patent No. 27, wherein the control of the rotation includes the control of the rotation speed of the holding surface.     如申請專利範圍第26至28項中任一項之供給裝置,其中上述驅動裝置使上述保持面振動,且上述動作之控制包含上述保持面之振動之控制。     For example, the supply device according to any one of claims 26 to 28, wherein the driving device vibrates the holding surface, and the control of the operation includes controlling the vibration of the holding surface.     如申請專利範圍第29項之供給裝置,其中上述振動之控制包含上述振動之振幅及頻率中之至少一者之控制。     For example, the supply device according to the scope of patent application No. 29, wherein the control of the vibration includes control of at least one of the amplitude and frequency of the vibration.     一種供給裝置,其具備:保持構件,其具備保持從供給源供給之粉粒體之保持面;以及驅動裝置,其驅動上述保持面;並且藉由以上述驅動裝置使上述保持面振動,而使於上述保持面上形成靜止角而被保持之上述粉粒體之一部分從上述保持面落下,對包含上述保持面之振動之振幅及頻率中之至少一者的上述保持面之振動進行控制,從而控制從上述保持面落下之上述粉粒體之每單位時間之搬出量。     A supply device includes: a holding member having a holding surface for holding powder and granules supplied from a supply source; and a driving device for driving the holding surface; and vibrating the holding surface with the driving device to cause the holding surface to vibrate. A part of the powder and granules held by forming a rest angle on the holding surface is dropped from the holding surface, and the vibration of the holding surface including at least one of the amplitude and frequency of the vibration of the holding surface is controlled, so that The amount of the powder and granules dropped from the holding surface per unit time is controlled.     如申請專利範圍第31項之供給裝置,其中藉由上述供給源供給上述粉粒體,上述粉粒體可於上述保持面上形成靜止角而被保持。     For example, in the supply device according to the 31st aspect of the application, wherein the powder and granules are supplied by the supply source, the powder and granules can be held at a rest angle on the holding surface.     如申請專利範圍第1至32項中任一項之供給裝置,其中藉由以上述驅動裝置使上述保持面振動,而使上述粉粒體從上述保持面上落下。     The supply device according to any one of claims 1 to 32 of the patent application scope, wherein the powder and granules are dropped from the holding surface by vibrating the holding surface with the driving device.     如申請專利範圍第33項之供給裝置,其中由上述驅動裝置所引起之上述保持面之振動之振幅及頻率中之至少一者為可變。     For example, in the supply device of claim 33, at least one of the amplitude and frequency of the vibration of the holding surface caused by the driving device is variable.     如申請專利範圍第1至34項中任一項之供給裝置,其中 藉由利用上述驅動裝置,使上述保持面繞與上述保持面交叉之旋轉軸旋轉,從而使上述粉粒體從上述保持面上落下。     For example, the supply device according to any of claims 1 to 34 of the scope of patent application, in which the holding surface is rotated about a rotation axis intersecting the holding surface by using the driving device, so that the powder and granules are moved from the holding surface. Falling down.     如申請專利範圍第35項之供給裝置,其中由上述驅動裝置所引起之上述保持面之旋轉速度為可變。     For example, the supply device of the scope of patent application No. 35, wherein the rotation speed of the holding surface caused by the driving device is variable.     如申請專利範圍第1至36項中任一項之供給裝置,其中基於與上述粉粒體相關之資訊,來控制由上述驅動裝置所引起之上述保持面之動作。     For example, the supply device according to any one of claims 1 to 36, wherein the action of the holding surface caused by the driving device is controlled based on information related to the powder and granules.     如申請專利範圍第37項之供給裝置,其中與上述粉粒體相關之資訊包含上述粉粒體之種類、上述粉粒體之粒徑、上述粉粒體之表面之摩擦係數、以及上述粉粒體之形狀中之至少一者。     For example, the supply device of the 37th scope of the patent application, wherein the information related to the powder and granules includes the type of the powders and granules, the particle size of the powders and granules, the friction coefficient of the surface of the powders and granules, and the powders and granules. At least one of the shapes of the body.     如申請專利範圍第1至38項中任一項之供給裝置,其中基於與使用供給至上述供給裝置之外部之上述粉粒體來進行之加工處理相關之資訊,來控制由上述驅動裝置所引起之上述保持面之動作。     For example, the supply device according to any one of claims 1 to 38, wherein the drive device is controlled based on information related to processing using the powder and granules supplied to the outside of the supply device. The operation of the above holding surface.     如申請專利範圍第1至39項中任一項之供給裝置,其進而具備調整上述供給口與上述保持面之間之距離的距離調整裝置。     The supply device according to any one of claims 1 to 39 of the scope of patent application, further comprising a distance adjustment device that adjusts a distance between the supply port and the holding surface.     如申請專利範圍第40項之供給裝置,其中基於與上述粉粒體相關之資訊,利用上述距離調整裝置來調整上述供給口與上述保持面之間之距離。     For example, the supply device of the scope of application for patent No. 40, wherein the distance adjustment device is used to adjust the distance between the supply port and the holding surface based on the information related to the powder and granules.     如申請專利範圍第41項之供給裝置,其中與上述粉粒體相關之資訊包含上述粉粒體之種類、上述粉粒體之粒徑、上述粉粒體之表面之摩擦係數、以及上述粉粒體之形狀中之至少一者。     For example, the supply device for item 41 of the scope of patent application, wherein the information related to the powder and granule includes the type of the powder and granule, the particle size of the powder and granule, the friction coefficient of the surface of the powder and granule, and the powder and granule. At least one of the shapes of the body.     如申請專利範圍第40至42項中任一項之供給裝置,其中基於與使用供給至上述供給裝置之外部之上述粉粒體來進行之加工處理相關之資訊,利用上述距離調整裝置來調整上述供給口與上述保持面之間之距 離。     For example, the supply device according to any one of claims 40 to 42 of the scope of patent application, wherein the distance adjustment device is used to adjust the above-mentioned information based on information related to processing using the powder and granules supplied to the outside of the supply device. The distance between the supply port and the holding surface.     如申請專利範圍第1至43項中任一項之供給裝置,其進而具備具有搬送面之搬送構件,上述搬送面包含接收從上述保持面落下之上述粉粒體之面,上述搬送面包含相對於水平面而傾斜之傾斜面,上述搬送構件藉由將上述粉粒體從上述傾斜面供給至材料送出構件中,而使來自上述搬送面之上述粉粒體之每單位時間之搬出量之變動小於從上述保持面落下之上述粉粒體之每單位時間之搬出量之變動。     For example, the supply device according to any one of the scope of claims 1 to 43 further includes a conveying member having a conveying surface including a surface for receiving the powder and granules falling from the holding surface, and the conveying surface including a relative surface. On the inclined surface inclined on the horizontal plane, the conveying member supplies the powder and granules from the inclined surface to the material feeding member, so that the change in the amount of the powder and granules from the conveying surface per unit time is less than the change Changes in the carrying amount of the powder and granules dropped from the holding surface per unit time.     如申請專利範圍第44項之供給裝置,其中上述驅動裝置為第1驅動裝置,且具備驅動上述搬送面之第2驅動裝置。     For example, the supply device according to item 44 of the patent application, wherein the driving device is a first driving device and includes a second driving device that drives the conveying surface.     如申請專利範圍第45項之供給裝置,其中上述第2驅動裝置使上述搬送面振動。     For example, the supply device according to item 45 of the patent application, wherein the second driving device vibrates the conveying surface.     一種供給裝置,其具備:保持構件,其具有保持粉粒體之保持面;以及具有搬送面之搬送構件,上述搬送面包含接收從上述保持面落下之上述粉粒體之面;並且上述搬送面包含相對於水平面而傾斜之傾斜面,上述搬送構件藉由從上述傾斜面上供給上述粉粒體,而使來自上述搬送面之上述粉粒體之每單位時間之搬出量之變動小於從上述保持面落下之上述粉粒體之每單位時間之搬出量之變動。     A supply device comprising: a holding member having a holding surface for holding powder and granules; and a carrying member having a conveying surface including a surface for receiving the powder and granules dropped from the holding surface; and the carrying surface Including the inclined surface inclined with respect to the horizontal plane, the conveying member supplies the powder and granules from the inclined surface, so that the change in the amount of the powder and granules from the conveying surface per unit time is smaller than that maintained from the above. Changes in the amount of the powder and granules dropped out of the surface per unit time.     如申請專利範圍第47項之供給裝置,其中藉由上述供給源供給上述粉粒體,而於上述保持面上保持既定量之上述粉粒體。     For example, the supply device according to item 47 of the patent application, wherein the powder and granules are supplied by the supply source, and a predetermined amount of the powders and granules are held on the holding surface.     如申請專利範圍第47或48項之供給裝置,其進而具備驅動上述保持面及上述搬送面中之至少一者之驅動裝置。     For example, the supply device according to item 47 or 48 of the patent application scope further includes a drive device that drives at least one of the holding surface and the conveying surface.     如申請專利範圍第44至49項中任一項之供給裝置,其進而具備調整上述傾斜面之傾斜角度之角度調整裝置。     For example, the supply device according to any one of claims 44 to 49 of the scope of patent application, further comprising an angle adjustment device for adjusting the inclination angle of the inclined surface.     如申請專利範圍第50項之供給裝置,其中利用上述角度調整裝置來調整上述傾斜角度,控制來自上述搬送面之上述粉粒體之每單位時間之搬出量。     For example, the supply device of the scope of application for patent No. 50, wherein the above-mentioned angle adjusting device is used to adjust the above-mentioned inclination angle, and the amount of the powder and granular materials from the above-mentioned conveying surface per unit time is controlled.     如申請專利範圍第50或51項之供給裝置,其中基於與上述粉粒體相關之資訊來調整上述傾斜角度。     For example, the supply device of the scope of patent application No. 50 or 51, wherein the tilt angle is adjusted based on the information related to the powder and granules.     如申請專利範圍第52項之供給裝置,其中與上述粉粒體相關之資訊包含上述粉粒體之種類、上述粉粒體之粒徑、上述粉粒體之表面之摩擦係數、以及上述粉粒體之形狀中之至少一者。     For example, the supply device of the 52th scope of the patent application, wherein the information related to the powder and granules includes the type of the powders and granules, the particle size of the powders and granules, the friction coefficient of the surface of the powders and granules, and the powders and granules. At least one of the shapes of the body.     如申請專利範圍第50至53項中任一項之供給裝置,其中基於與使用透過上述搬送面而供給至上述供給裝置之外部之上述粉粒體來進行之加工處理相關之資訊,利用上述角度調整裝置來調整上述傾斜角度。     For example, the supply device according to any one of claims 50 to 53 of the scope of patent application, wherein the above-mentioned angle is used based on information related to processing using the powder and granules supplied to the outside of the supply device through the conveying surface. The adjusting device adjusts the above-mentioned inclination angle.     如申請專利範圍第1至54項中任一項之供給裝置,其進而具備將上述供給源及上述保持構件收容於內部空間中之收容裝置。     For example, the supply device according to any of claims 1 to 54 of the patent application scope further includes a storage device that stores the supply source and the holding member in an internal space.     如申請專利範圍第44至54項中任一項之供給裝置,其進而具備將上述供給源、上述保持構件、以及上述搬送面收容於內部空間中之收容裝置。     The supply device according to any one of claims 44 to 54 of the scope of patent application, further comprising a storage device that stores the supply source, the holding member, and the transport surface in an internal space.     如申請專利範圍第55或56項之供給裝置,其進而具備對上述內部空間進行加壓之加壓裝置。     For example, the supply device according to the 55th or 56th of the scope of the patent application may further include a pressurizing device for pressurizing the internal space.     如申請專利範圍第57項之供給裝置,其中上述加壓裝置對上述內部空間供給氣體而對上述內部空間進行加壓。     For example, the supply device according to claim 57, wherein the pressurizing device supplies gas to the internal space and pressurizes the internal space.     如申請專利範圍第58項之供給裝置,其中上述氣體為惰性氣體。     For example, the supply device according to item 58 of the patent application, wherein the above-mentioned gas is an inert gas.     如申請專利範圍第57至59項中任一項之供給裝置,其中將從上述保持面落下之上述粉粒體,藉由上述內部空間之加壓而送出至裝置外部。     For example, the supply device according to any one of claims 57 to 59, wherein the powder and granules dropped from the holding surface are sent to the outside of the device by the pressure of the internal space.     如申請專利範圍第57至59項中任一項之供給裝置,其進而具備收容於上述內部空間之具有搬送面之搬送構件,上述搬送面包含接收從上述保持面落下之上述粉粒體之面,並且將從上述搬送面上供給之上述粉粒體,藉由上述內部空間之加壓而送出至裝置外部。     For example, the supply device according to any one of claims 57 to 59 may further include a conveying member having a conveying surface accommodated in the internal space, and the conveying surface includes a surface for receiving the powder and granules falling from the holding surface. And the powder and granules supplied from the conveying surface are sent to the outside of the device by the pressure of the internal space.     如申請專利範圍第39、43或54項之供給裝置,其具備:供給上述粉粒體之供給系統、照射能量束之照射系統、以及使上述供給系統及上述照射系統中之至少一者與對象物相對移動之驅動系統,且對於如下之加工系統供給經供給至上述裝置外部之上述粉粒體,上述加工系統係與來自上述供給系統之上述粉粒體之供給並行地進行來自上述照射系統之能量束之照射,從而對上述對象物進行附加加工,並且與使用上述粉粒體來進行之加工處理相關之資訊包含與上述相對移動相關之資訊以及與上述能量束之照射相關之資訊中之至少一者。     For example, the supply device of claim 39, 43 or 54 includes a supply system for supplying the powder and granules, an irradiation system for irradiating an energy beam, and at least one of the supply system and the irradiation system and an object. A driving system for relative movement of objects, and for supplying the powder and granules supplied to the outside of the device with a processing system, the processing system performs the supply from the irradiation system in parallel with the supply of the powder and granules from the supply system. The energy beam is irradiated to perform additional processing on the object, and the information related to the processing using the powder and granules includes at least one of the information related to the relative movement and the information related to the energy beam irradiation. One.     如申請專利範圍第62項之供給裝置,其中上述相對移動之速度越大,越使供給至上述裝置外部之上述粉粒體之上述每單位時間之供給量增多。     For example, in the supply device of the scope of application for patent No. 62, the greater the relative speed of the relative movement, the more the above-mentioned supply amount per unit time of the powder and granules supplied to the outside of the device increases.     一種加工系統,其具備如申請專利範圍第1至63項中任一項之供給裝置,並且使用從上述供給裝置中供給之上述粉粒體來進行加工處理。     A processing system includes a supply device as set forth in any of claims 1 to 63 in the scope of patent application, and uses the powder and granules supplied from the supply device to perform processing.     如申請專利範圍第64項之加工系統,其中使用上述粉粒體來進行之加工處理包含使用上述粉粒體來對對象物進行附加加工之處理。     For example, the processing system of the scope of application for a patent No. 64, wherein the processing using the above-mentioned powder and granules includes a process of performing additional processing on the object using the above-mentioned powder and granules.     如申請專利範圍第64或65項之加工系統,其中上述加工系統係利用粉末燒結積層造形法來進行附加加工之3D列印機。     For example, the processing system with the scope of patent application No. 64 or 65, wherein the above processing system is a 3D printer using powder sintering and lamination to perform additional processing.     如申請專利範圍第64至66項中任一項之加工系統,其中上述加工系統係藉由對形成於上述對象物上之熔融池中供給上述粉粒體而熔融之雷射金屬沈積方式,來進行附加加工之3D列印機。     For example, the processing system according to any one of claims 64 to 66, wherein the processing system is a laser metal deposition method in which the powder and granules are supplied and melted in a melting pool formed on the object. 3D printer for additional processing.     如申請專利範圍第64至67項中任一項之加工系統,其具備:供給系統,其供給來自上述供給裝置中之上述粉粒體;照射系統,其進行能量束之照射;以及驅動系統,其使上述供給系統及上述照射系統中之至少一者與上述對象物相對移動。     For example, the processing system according to any one of claims 64 to 67 includes a supply system that supplies the powder and granules from the supply device, an irradiation system that irradiates an energy beam, and a drive system, It moves at least one of the supply system and the irradiation system relative to the object.     如申請專利範圍第68項之加工系統,其中基於與上述加工處理相關之資訊,來控制來自上述供給裝置中之上述粉粒體之每單位時間之供給量。     For example, the processing system of the scope of application for patent No. 68, wherein the supply amount of the powder and granules from the supply device per unit time is controlled based on the information related to the processing.     如申請專利範圍第69項之加工系統,其中與上述加工處理相關之資訊包含與上述相對移動相關之資訊以及與上述照射系統所進行之上述能量束之照射相關之資訊中之至少一者。     For example, the processing system of the scope of application for patent No. 69, wherein the information related to the processing includes at least one of information related to the relative movement and information related to the irradiation of the energy beam performed by the irradiation system.     如申請專利範圍第70項之加工系統,其中與上述相對移動相關之資訊包含上述相對移動之速度。     For example, the processing system of the scope of patent application No. 70, wherein the information related to the relative movement includes the speed of the relative movement.     如申請專利範圍第71項之加工系統,其中上述相對移動之速度越大,越使上述每單位時間之供給量增多。     For example, the processing system of the 71st scope of the patent application, in which the greater the speed of the relative movement is, the more the above-mentioned supply amount per unit time is increased.     如申請專利範圍第70至72項中任一項之加工系統,其中 與上述照射相關之資訊包含上述能量束之強度。     For example, the processing system according to any one of claims 70 to 72, wherein the information related to the above-mentioned irradiation includes the intensity of the above-mentioned energy beam.     一種加工方法,其使用由如申請專利範圍第1至63項中任一項之供給裝置所供給之上述粉粒體來進行加工處理。     A processing method that uses the above-mentioned powder and granules supplied from a supply device according to any one of claims 1 to 63 for processing.     如申請專利範圍第74項之加工方法,其中使用上述粉粒體來進行之加工處理包含使用上述粉粒體來對對象物進行附加加工之處理。     For example, the processing method of the scope of application for patent No. 74, wherein the processing using the above-mentioned powder and granules includes a process of using the above-mentioned powder and granules to perform additional processing on the object.    
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