TW201919255A - Surface-mount laser diode and manufacturing process thereof including an insulating substrate, an adhesive, a light-emitting chip, a conductive layer, and a cover - Google Patents

Abstract

A surface-mount laser diode includes an insulating substrate, an adhesive, a light-emitting chip, a conductive layer, and a cover. A first circuit layer and a second circuit layer are respectively disposed on two sides of the insulating substrate. A first solder joint and a second solder joint are respectively provided on the same side edge of the insulating substrate. A first hollow area and a through hole are arranged at the center of the first circuit layer. The light-emitting chip is electrically connected to the first circuit layer, and electrically connected to the second circuit layer through the conductive layer disposed in the through hole. A light-emitting surface of the light-emitting chip is laterally disposed. The present invention has the feature that the light-emitting surface is arranged perpendicular to the welding surface in packaging, and heat dissipation can be carried out through the conductive layer during illumination, thereby greatly improving the convenience and stability during use or assembly.

Description

 Surface-adhesive laser diode and its process  

This creation belongs to the field of light source production technology, especially a surface-adhesive laser diode and its manufacturing process, so as to improve production efficiency and quality, and can also take into consideration the heat dissipation during use to improve the stability during use.

The so-called laser diode refers to a laser source made by using a two-pole system. The common red laser pen on the market is an application of a laser diode. However, laser diodes can be classified into infrared lasers, red lasers, blue lasers, and green lasers according to wavelengths. These different lasers, such as infrared lasers, pass through gallium arsenide (GaAs). Produced by polar bodies, red lasers are generated by AlGaAs or InGaAlP diodes, and blue and green lasers are transmitted through InGaN. Produced by the polar body.

However, with the current structure of various laser diodes, please refer to FIG. 1 , which is a schematic diagram of assembly of a general laser diode, as shown in the figure, the light surface system and package of the laser diode 1 . When the solder joints 11 are arranged in parallel, the laser diodes 1 must be adhered to the package holder 2 through a conductive adhesive 12, and the surface-adhesive package is convenient and small in size. The advantage is that the laser diode 12 and the package holder 2 must be adhered and fixed through the conductive adhesive 12, and the laser diode 12 is a high-energy light source due to high thermal resistance. Such a design may easily cause burnout due to poor heat dissipation. Therefore, it is necessary to dissipate heat through a large heat sink or heat sink 13 to maintain stability during use. Its volume will also become larger, but it will lose its original small size. Please refer to FIG. 2 , which is a schematic structural diagram of another type of laser diode. As shown in the figure, the laser diode structure 3 includes a pedestal 31 , an illuminating chip 32 , and a heat sink 33 . And a protective tube 34, wherein a plurality of conductive pins 35 for packaging are extended under the base 31. Since the light emitting surface of the light emitting chip 32 is laterally disposed, the light emitting chip 32 can only be disposed in a vertical manner. The surface of the heat sink 33 is such that the light emitting surface of the light emitting chip 32 faces upward, and the light emitting chip 32 is electrically connected to the conductive pins 35 respectively. The protective tube 34 is coated on the heat sink 33 and the base. The outside of the 31, and a light-emitting surface of the light-emitting chip 32 is provided with a through hole 341 through which the laser beam emitted from the light-emitting chip 32 can pass through, and is parallel to the direction in which the conductive pin 35 is disposed, but Since the illuminating chip 32 is still adhered and fixed through a conductive adhesive 321 , there is also a problem of poor heat dissipation. Moreover, when the illuminating chip 32 is to be combined with a package holder (not shown), it must be on the circuit board. Set the jack to work on soldering Thus increasing convenience when processes affect subsequent use.

In summary, the above two common laser diode packages have the above-mentioned various shortcomings to be improved. In view of this, the creator has accumulated many years of experience in designing LED carrier boards, and designed a surface-adhesive laser diode. And the process thereof, wherein the perforation is provided on the conductive substrate, and the illuminating chip is disposed on the perforation, and the conductive layer is disposed on the reverse surface, thereby greatly improving production efficiency and quality, and taking into consideration heat dissipation during use to improve use. The stability is achieved; and, the illuminating surface is disposed perpendicular to the solder joint after the package, and the convenience and yield in subsequent use can be improved.

One of the aims of this creation is to provide a surface-adhesive laser diode that enhances high productivity and quality through a newly designed package structure, and can also balance heat dissipation during use to improve stability during use. .

The surface-adhesive laser diode system of the present invention comprises: an insulating substrate, wherein the opposite sides are respectively provided with a first circuit layer and a second circuit layer corresponding to the line layout, and in the center of the first circuit layer The first hollowed out area is provided with a through hole, and the first circuit layer and the second circuit layer are respectively provided with a first solder joint and a first solder joint on the same side edge of the insulating substrate a solder joint, the adhesive substrate is disposed on a surface of the insulating substrate opposite to the first circuit layer, and the adhesive material is disposed around the through hole; and an illuminating chip is respectively provided with a first electrode on each side thereof a second electrode is fixed to the first hollow region through the adhesive material and corresponding to the position of the through hole, so that the second electrode and the first circuit layer are electrically insulated, and the second electrode The first electrode is electrically connected to the first circuit layer, and the light emitting surface of the light emitting chip is laterally disposed; a conductive layer is disposed in the through hole to make the second electrode and the second circuit layer Electrically connected to each other; and a cover disposed on the first The line layer, and the lines to cover the light emitting surface should be provided with a perforation.

In one embodiment, the first electrode is electrically connected to the first circuit layer through a metal wire or a conductive adhesive. Moreover, the surface-adhesive laser diode of the present invention further has a third solder joint disposed on a second hollow region corresponding to one of the second circuit layers, and the third solder joint is electrically connected to the first The circuit layer is such that the third solder joint is on the same side as the second solder joint, and the present invention is provided in such a manner as to be parallel to the light exit surface. The insulating substrate is a printed circuit board, and therefore, the through hole is selected from one of mechanical drilling and laser drilling.

Furthermore, the present invention also provides a process for producing the aforementioned surface-adhesive laser diode, comprising the steps of: providing the insulating substrate, the adhesive material, the light-emitting chip and the outer cover, wherein the insulating substrate The first circuit layer and the second circuit layer are respectively disposed on the two sides of the first circuit layer, and the first hollow region is disposed at the center of the first circuit layer, and the first electrode and the first electrode are respectively disposed on the two sides of the light emitting chip a second electrode, wherein the light emitting surface is interposed between the first electrode and the second electrode, and the one side of the outer cover is provided with the through hole; and the insulating substrate is bored at a position corresponding to the first hollow area, Connecting the through hole to the two sides; using the adhesive material to fix the surface of the corresponding surface of the second electrode to the first hollow region, so that the second electrode corresponds to the position of the through hole; plating the conductive layer on the The second electrode layer and the through hole are electrically connected to the second circuit layer; the first electrode and the first circuit layer are electrically connected by using the metal wire or the conductive adhesive material; Encapsulating the outer cover a surface of the first circuit layer, the through hole is located on one side of the corresponding light emitting surface, and the first circuit layer and the second circuit layer are respectively provided with a first solder joint and a first solder joint on the same side edge of the insulating substrate Two solder joints. Therefore, if the above-mentioned steps are sequentially implemented, the surface-adhesive laser diode described above can be obtained, which greatly improves the smoothness of the process, and is greatly helpful for reducing the production difficulty.

1‧‧‧Laser diode

11‧‧‧ solder joints

12‧‧‧Electrical adhesive

13‧‧‧ Heat sink or heat sink

2‧‧‧Package bracket

3‧‧‧Laser diode structure

31‧‧‧ Pedestal

32‧‧‧Lighting chip

321‧‧‧Electrical adhesive

33‧‧‧ Heat sink

34‧‧‧protection cylinder

341‧‧‧Perforation

35‧‧‧Electrical pins

4‧‧‧Surface-adhesive laser diode

41‧‧‧Insulation substrate

411‧‧‧First line layer

4111‧‧‧The first hollow area

4112‧‧‧First solder joint

412‧‧‧second circuit layer

4121‧‧‧second solder joint

413‧‧‧through hole

42‧‧‧Adhesive

43‧‧‧Lighting chip

431‧‧‧First electrode

432‧‧‧second electrode

433‧‧‧Metal wire or conductive adhesive

434‧‧‧Glossy surface

44‧‧‧ Conductive layer

45‧‧‧ Cover

451‧‧‧Perforation

S1~S6‧‧‧Steps

Figure 1 is a schematic view showing the assembly of a general laser diode.

Figure 2 is a schematic view showing the structure of another type of laser diode.

Figure 3 is a schematic view showing the structure of the preferred embodiment of the present invention.

Figure 4 is a cross-sectional view of the preferred embodiment of the present invention assembled.

Figure 5 is a flow chart showing the steps in the production of the preferred embodiment of the present invention.

Fig. 6 is a schematic diagram showing the state corresponding to step S1.

Fig. 7 is a schematic diagram showing the state corresponding to step S2.

Figure 8 is a schematic diagram showing the state corresponding to step S3.

Figure 9 is a schematic diagram showing the state corresponding to step S4.

Figure 10 is a schematic diagram showing the state corresponding to step S5.

Figure 11 is a schematic diagram showing the state corresponding to step S6.

In order for your review board to have a clear understanding of the content of this creation, please refer to the following description only.

Please refer to Figures 3 and 4 for a schematic view of a preferred embodiment of the present invention and a cross-sectional view thereof after assembly. As shown in the figure, the surface-adhesive laser diode 4 of the present invention comprises an insulating substrate 41, an adhesive material 42, an illuminating wafer 43, a conductive layer 44 and a cover 45.

The insulating substrate 41 is a commonly used printed circuit board. Therefore, the opposite surfaces of the insulating substrate 41 are respectively provided with a first circuit layer 411 and a second circuit layer 412 corresponding to the line layout, and A first hollow region 4111 is disposed at a center of a circuit layer 411, and a through hole 413 is defined at a position opposite to the first hollow region 4111. The first circuit layer 411 and the second circuit layer 412 are respectively disposed on the insulating base. A first solder joint 4112 and a second solder joint 4121 are disposed on the same side edge of the material 41. It should be noted that the through hole 413 is made by one of mechanical drilling and laser drilling, and thus can be mass-produced by batch.

The adhesive material 42 is disposed on one surface of the insulating substrate 41 opposite to the first wiring layer 411 so as to surround the through hole 413, so that the periphery of the through hole 413 is viscous.

A first electrode 431 and a second electrode 432 are respectively disposed on the two sides of the illuminating chip 43 . The surface of the second electrode 432 is fixed to the first hollow region 4111 through the adhesive material 42 and corresponds to the through hole 413 . The second electrode 432 is electrically insulated from the first circuit layer 411, and the first electrode 431 is electrically connected to the first circuit layer 411 through a metal wire or a conductive adhesive 433. It is noted that the metal wire is achieved by one of a wire bonding process and a yellow light process. Further, one of the light-emitting surfaces 434 of the light-emitting chip 43 is laterally disposed.

The conductive layer 44 is disposed in the through hole 413 to electrically connect the second electrode 432 and the second circuit layer 412 to each other.

The outer cover 45 is a rectangular box-shaped structure formed corresponding to the shape of the insulating base material 41, and is covered on the first circuit layer 411, and the center of one side of the outer cover 45 corresponds to the light-emitting surface. 433 is provided with a through hole 451. Accordingly, the surface-applied laser diode 4 of the present invention can be fixed perpendicular to the circuit board through the first solder joint 4112 and the second solder joint 4121, so that the package method can derive more The variability can be prevented from being thermally blocked by the exposed conductive layer 44 during use, and is not blocked by a material having a large thermal resistance such as a substrate or a rubber material, thereby affecting the heat dissipation effect during use.

In addition, the surface-adhesive laser diode 4 of the present invention further has a third solder joint 46 disposed on a second hollow region 4122 corresponding to the second wiring layer 412, and the third solder joint 46 is transparent. Drilling or other means, the third solder joint 46 is electrically connected to the first circuit layer 411, so that the third solder joint 46 and the second solder joint 4121 are located on the same side, and the creation is provided to parallel the light output. Assembly in a faceted manner.

Please refer to FIG. 5 to FIG. 11 as a flowchart of the steps in the production of the preferred embodiment of the present invention, and a schematic diagram of the state corresponding to each step. As shown in the figure, the present invention also provides a process for producing the surface-adhesive laser diode 4, which includes the following steps:

S1: providing the insulating substrate 41, the adhesive material 42, the light-emitting chip 43, and the outer cover 45, wherein the two sides of the insulating substrate 41 are respectively provided with the first circuit layer 411 and the second line corresponding to the line layout The first vacant area 4111 is disposed in the center of the first circuit layer 411, and the first electrode 431 and the second electrode 432 are respectively disposed on the two sides of the illuminating chip 43. The through hole 451 is provided between the first electrode 431 and the second electrode 432 and on one side of the outer cover 45.

S2: drilling the position of the insulating substrate 41 corresponding to the first hollow region 4111, and connecting the through hole 413 to both sides of the insulating substrate 41, and drilling together with the adhesive material 42.

S3: The surface of the second electrode 432 corresponding to the light-emitting chip 43 is fixed to the first hollow region 4111 by using the adhesive material 42 so that the second electrode 432 corresponds to the position of the through hole 413.

S4: plating the conductive layer 44 in the second circuit layer 412 and the through hole 413 to electrically connect the second electrode 432 and the second circuit layer 412.

S5: The first electrode 431 and the first circuit layer 411 are electrically connected by using the metal wire or the conductive adhesive 433.

S6: encapsulating the outer cover 45 on the surface of the first circuit layer 411 such that the through hole 451 is located on one side of the corresponding light emitting surface 433, and the first circuit layer 411 and the second circuit layer 412 are respectively disposed on the insulating substrate. A first solder joint 4112 and a second solder joint 4121 are provided on the same side edge of 41.

However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, it is common knowledge in the technical field or equivalent or easy to be familiar with the technology. The changes and modifications made by the changer without departing from the spirit and scope of this creation shall be covered by the scope of this creation.

Claims (10)

 A surface-adhesive laser diode comprising: an insulating substrate, wherein the opposite sides are respectively provided with a first circuit layer and a second circuit layer corresponding to the line layout, and are disposed at the center of the first circuit layer The first hollowed out area is provided with a through hole, and the first circuit layer and the second circuit layer are respectively provided with a first solder joint and a second on the same side edge of the insulating substrate. a soldering material; an adhesive material disposed on a surface of the insulating substrate opposite to the first circuit layer, wherein the adhesive material is disposed around the through hole; and an illuminating chip having a first electrode and a first surface respectively The second electrode is fixed to the first hollow region through the adhesive material and corresponding to the position of the through hole, so that the second electrode and the first circuit layer are electrically insulated, and the first electrode An electrode is electrically connected to the first circuit layer, and a light emitting surface of the light emitting chip is laterally disposed; and a conductive layer is disposed in the through hole to make the second electrode and the second circuit layer Electrically connected to each other.    The surface-adhesive laser diode according to claim 1, wherein the first electrode is electrically connected to the first circuit layer through a metal wire or a conductive adhesive.    The surface-adhesive laser diode according to claim 2 of the patent application has a third solder joint disposed in a second hollow region corresponding to one of the second circuit layers, and the third solder joint is electrically connected. The first circuit layer is connected to the third bonding point and the second bonding point.    The surface-adhesive laser diode according to claim 1, wherein the insulating substrate is a printed circuit board.    The surface-adhesive laser diode according to claim 1, wherein the through-hole is selected from one of mechanical drilling and laser drilling.    The surface-adhesive laser diode according to claim 1, further comprising a cover disposed on the first circuit layer, wherein the cover is provided with a through hole corresponding to the light-emitting surface.    A process for producing a surface-adhesive laser diode according to claim 6 of the invention, comprising: providing the insulating substrate, the adhesive material, the light-emitting chip and the outer cover, wherein two sides of the insulating substrate The first circuit layer and the second circuit layer are respectively disposed corresponding to the circuit layout, wherein the first circuit layer is provided with the first hollow region, and the first electrode and the second portion are respectively disposed on two sides of the light emitting chip An electrode, wherein the light emitting surface is interposed between the first electrode and the second electrode, and the one side of the outer cover is provided with the through hole; and the position of the insulating substrate corresponding to the first hollow area is drilled The through hole is connected to the two sides; the adhesive wafer is used to fix one side of the second electrode to the first hollow region, so that the second electrode corresponds to the position of the through hole; and the conductive layer is plated to the second The second electrode and the second circuit layer are electrically connected to each other in the circuit layer and the through hole; the first electrode and the first circuit layer are electrically connected by using the metal wire or the conductive adhesive; and encapsulating the a cover on the first circuit layer The surface of the first circuit layer and the second circuit layer are respectively provided with a first solder joint and a second solder joint on the same side edge of the insulating substrate.    The process of the surface-adhesive laser diode according to claim 7, wherein the first electrode is electrically connected to the first circuit layer through a metal wire or a conductive adhesive.    The process of the surface-adhesive laser diode according to claim 7 of the patent application has a third solder joint disposed in a second hollow region corresponding to one of the second circuit layers, and the third solder joint The first circuit layer is electrically connected such that the third solder joint is on the same side as the second solder joint.    The process of the surface-adhesive laser diode according to claim 7, wherein the insulating substrate is a printed circuit board, and the through-hole is selected from the group consisting of mechanical drilling and laser drilling. Made of one of them.