TW201913875A - Supporting structure - Google Patents

Abstract

Disclosed is a supporting structure including a housing having a hollow formed in a length direction thereof so that a substrate support pin is inserted into the hollow, a plurality of guide members provided at each of an upper portion and a lower portion of the housing in a circumferential direction, and guiding movement of the substrate support pin in a length direction of the housing by rolling contact with the substrate support pin, and coupling members coupled to an outer circumferential surface of the housing, provided to surround the guide members, and applying pressure to the guide members in a radial direction of the housing so as to couple the guide members to the housing.

Description

supporting structure

The present invention relates to a support structure that can effectively move a basic support pin with respect to a substrate receiving portion, reduce friction generated by the substrate support pin when moving the substrate support pin, and conveniently overcome thermal deformation.

The contents to be described below are simply used to provide background information of the embodiments, and do not constitute prior art.

The substrate receiving portion receives an object to be processed, such as a substrate, and the substrate receiving portion is provided in the chamber, and etching of the substrate and deposition on the substrate are performed in the chamber.

The substrate supporting pin is a device for raising the substrate received on the substrate receiving portion, or supporting the substrate conveyed by the robot arm, moving the substrate perpendicularly to the substrate receiving portion, and placing the substrate on the substrate receiving portion, so that the substrate can be placed in the chamber A substrate is transferred between the substrate receiving portion and the robot arm.

A substrate support pin is provided to be inserted into the through hole formed through the substrate receiving portion, and the substrate support pin is vertically moved with respect to the substrate receiving portion. Therefore, the substrate supporting pin and the inner wall of the through hole are rubbed.

Such friction between the substrate support pins and the inner walls of the through holes causes the substrate support pins to be worn or damaged, thereby causing damage to the substrates supported by the substrate support pins and causing defective products.

It is an object of the present invention to provide a support structure that can effectively move a basic support pin with respect to a substrate receiving portion, reduce friction generated by the substrate support pin when moving the substrate support pin, and conveniently overcome thermal deformation.

Other advantages, objects, and features of the invention will be set forth in part in the description which follows, It is understood or can be derived from the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the <RTIgt;

In order to achieve these and other features of the present invention, the present invention is embodied and broadly described. A support structure of the present invention includes a housing, a plurality of guiding assemblies, and a plurality of coupling assemblies. The outer casing has a hollow formed along its length such that the substrate support pin is inserted into the hollow. A plurality of guiding members are provided in each of the upper and lower portions of the outer casing in a peripheral direction, and guide the substrate supporting pins to move along the length of the outer casing by rolling contact with the substrate supporting pins. A plurality of coupling assemblies are coupled to the outer peripheral surface of the outer casing, are provided to surround the guide assemblies, and apply pressure to the guide assemblies in the radial direction of the outer casing to couple the guide assemblies to the outer casing.

These coupling components are formed in a ring shape and are coupled to the outer casing by a tight fit or a positive fit.

These coupling components are formed from aluminum.

These guide assemblies are provided along the length of the housing.

These guide assemblies are placed at each of the upper and lower ends of the housing.

The outer casing includes a main body and a plurality of coupling groove portions. The coupling groove portions are formed at the upper end and the lower end of the body so as to extend along the length of the outer casing, and the outer diameters of the coupling groove portions are smaller than the outer diameter of the main body, and the coupling members are coupled to the coupling groove portions.

These guide assemblies include four guide assemblies that are radially placed in each of the coupling slots along the peripheral direction of the housing.

These guide assemblies are placed in two columns along the length of the housing.

The coupling groove portions have a plurality of through holes formed in a radial direction of the outer casing and communicating with the hollow, and the guide members are placed in the through holes.

Each of the guiding assemblies includes a receiving portion including a receiving recess having an open side received by the first ball in the receiving recess, a portion of the first ball being exposed to the outside and rolling contact with the substrate support pin, and a plurality of The two spheres are received in the receiving recess and are in rolling contact with the inner wall of the receiving recess and the first sphere.

The receiving portion includes a plurality of hook bodies projecting from a portion thereof opposite to the coupling assembly, and the coupling member includes a plurality of recessed recesses having a shape corresponding to the hook body and formed at a portion opposite to the hook bodies.

The upper end of the hook body is formed as an inclined surface, and the lower end of the hook body is formed as a stepped surface.

The support structure of one embodiment uses an annular coupling assembly having excellent pressure applied to the guiding assembly to couple the guiding assembly to the outer casing even if thermal deformation occurs, thereby effectively suppressing deformation of the guiding assembly, the outer casing and the supporting structure as a whole. Or damaged.

In the embodiment, the coupling assembly has excellent elastic force regardless of the temperature environment inside the chamber, that is, high temperature and low temperature, and the stable coupling state of the guiding assembly and the outer casing 0 can be maintained regardless of the temperature change.

In an embodiment, the guiding assembly is not fixed to the outer casing using a coupling unit such as a bolt, but the annular coupling assembly is for applying pressure to the guiding assembly to couple the guiding assembly to the outer casing, thereby avoiding deformation of the supporting structure due to thermal deformation of the coupling unit or Damage, and effectively coupling the guiding assembly to the housing.

In an embodiment, the coupling assembly is stably coupled to the outer casing through a stepped surface formed on the hook body, whereby the guiding assembly is stably coupled to the outer casing through the pressure exerted by the coupling assembly.

Hereinafter, embodiments will be described with reference to the drawings and embodiments. However, the embodiments described herein may be modified in various ways, and it should be understood that the invention is not intended to be limited to the specific forms disclosed. All the amendments, equivalents and substitutions within the spirit and scope of the disclosure.

It will be understood that, although the terms "first," "second," and the like are used herein to describe various elements, these terms are not intended to limit the elements. These terms are only used to distinguish one substance or element from another substance or element. In addition, the terms that are specifically defined in consideration of the configuration and function of the embodiments are merely used to describe the embodiments, and do not limit the scope of the disclosure.

In the following description of the embodiments, it is to be understood that, when each element is referred to as "above" or "below" One or more intermediate elements are formed between the two. In addition, when an element is referred to as being "above" or "below" another element, it does not include the upward direction of the above-mentioned elements, and the downward direction of the aforementioned elements.

In addition, it should be understood that relational terms such as "above/above/upper", "lower/lower/lower", etc., do not require or imply any physical or logical relationship or order between the elements or elements, and It can only be used to distinguish one substance or component from other substances or components.

Figure 1 is an exploded longitudinal cross-sectional view of a support structure of one embodiment. The support structure of an embodiment comprises a housing (or pin insertion assembly) 100, a guiding assembly (or support assembly) 200, and a coupling assembly 300.

The outer casing 100 has a hollow 110 formed along its longitudinal direction. The substrate support pin 10 is inserted into the hollow, and the substrate support pin 10 reciprocates with respect to the outer casing 100 along the length of the outer casing 100.

The outer casing 100 is inserted into and fixed to a through hole formed by a substrate receiving portion (not shown), wherein the substrate receiving portion is placed in a lower portion of the chamber, wherein the deposition on the substrate and the substrate are completed in the chamber. Etching.

Since the outer casing 100 is exposed to the reaction gas, the cleaning gas or the cleaning liquid in the chamber, thereby being corroded, the outer casing 100 is formed of a corrosion-resistant material. Therefore, the outer casing 100 is formed, for example, of one selected from the group consisting of aluminum, stainless steel (SUS), ceramics, and corrosion-resistant polymers, or a composite containing two or more selected from the above-mentioned collections.

Receiving a substrate (not shown) on the top end 11 of the substrate supporting pin 10, if the substrate, that is, the object to be processed enters the chamber and is received on the substrate receiving portion, or the substrate that has been processed is taken out from the chamber, the substrate supports The pin 10 is moved relative to the substrate receiving portion and the outer casing 100 to move the substrate.

In order to effectively move the substrate support pin 10 relative to the outer casing 100, the diameter of the substrate support pin 10 excluding the top end 11 of the substrate support pin 10 is smaller than the diameter of the hollow 110 penetrating the outer casing 100.

A plurality of through holes are formed to penetrate the substrate receiving portion, and the outer casing 100 and the substrate supporting pin 10 are placed in the through holes to stably support the substrate.

A plurality of guide assemblies 200 are placed in the peripheral direction of the outer casing 100, and support or guide the movement of the substrate support pins 10 in the longitudinal direction of the outer casing 100 by rolling contact with the substrate support pins 10.

The guide assembly 200 is placed at regular intervals along the peripheral direction of the outer casing 100, whereby the guide assembly 200 is radially placed based on the center of the outer casing 100.

By radially placing the guide assembly 200, the substrate support pins 10 uniformly contact the respective guide assemblies 200, thereby being effectively moved within the hollow 110 of the outer casing 100.

Referring to FIG. 2, for example, in this embodiment, four guide assemblies 200 are provided in the peripheral direction of the outer casing 100. The four guide assemblies 200 are suitable in view of the size of the guide assembly 200 and the outer casing 100, the convenience of manufacturing the support structure, and the avoidance of blockage between the substrate support pins 10 between the guide assemblies 200.

The guide assembly 200 can be provided along the length of the outer casing 100. As shown representatively in FIG. 1, the guide assembly 200 is placed at each of the upper and lower portions of the outer casing 100.

For example, the guide assembly 200 is placed at each of the upper and lower ends of the outer casing 100, as representatively shown in FIG. Here, the coupling assembly 300 is placed at a position corresponding to the configuration position of the guide assembly 200, thereby coupling the guide assembly 200 to the outer casing 100.

The coupling assembly 300 is provided to surround the guide assembly 200, thereby applying pressure to the guide assembly 200, and coupling the guide assembly 200 to the outer casing 100. Referring to FIG. 2, the coupling assembly 300 is formed to have a ring shape.

Even if the coupling assembly 300 repeatedly expands and contracts due to heating and cooling, the coupling assembly 300 does not plastically deform and maintains an excellent elastic force, thereby stably applying pressure to the guide assembly 200 and maintaining the guide assembly 200 and the outer casing 100. Coupling between.

The coupling assembly 300 is coupled to the outer casing 100 through an interference fit or form fit to facilitate coupling to the outer casing 100.

The coupling assembly 300 is coupled to an outer peripheral surface of the outer casing 100 and applies pressure to the guide assembly 200 in the radial direction of the outer casing 100.

Generally, the guide assembly 200 is fixed to the outer casing 100 using a coupling unit such as a bolt. However, if the guiding assembly 200 is fixed to the outer casing 100 using the coupling unit, the coupling unit is susceptible to thermal deformation due to heating inside the chamber.

If the interior of the chamber is heated and thereby reaches a high temperature, the coupling unit may thermally expand, whereby the entirety of the guiding assembly 200, the outer casing 100 or the support structure may be deformed or damaged due to expansion of the coupling unit.

Therefore, in the embodiment, even if thermal deformation occurs, the annular coupling assembly 300 having excellent pressure applied to the guiding assembly 200 is used to couple the guiding assembly 200 to the outer casing 100, thereby effectively suppressing the guiding assembly 200, the outer casing 100 or the supporting structure The overall deformation or damage.

As representatively shown in FIG. 1, the outer casing 100 includes a body 140 and a coupling groove portion 130. The outer diameter of the main body 140 is larger than the outer diameter of the coupling groove portion 130.

The coupling groove portion 130 is formed at an upper end and a lower end of the main body 140 so as to extend along the length direction of the outer casing 100, and the outer diameter of the coupling groove portion 130 is smaller than the outer diameter of the main body 140. Here, the coupling assembly 300 is coupled to the coupling groove portion 130.

Therefore, stairs can be formed between the main body 140 and the coupling groove portion 130. The step serves as a stop for the coupling assembly 300.

That is, if the coupling assembly 300 is coupled to the coupling groove portion 130, when one surface of the coupling assembly 300 contacts the step, the coupling assembly 300 is no longer moved in the length direction of the outer casing 100, and is stably installed in the coupling groove portion 130. in.

Of course, the guide assembly 200 is placed radially on the coupling groove portion 130 in the radial direction of the outer casing 100, and the coupling assembly 300 applies pressure to the guide assembly 200 to couple the guide assembly 200 to the outer casing 100.

Figure 2 is a schematic plan view of the support structure of the embodiment. FIG. 2 shows a cross-sectional view of the coupling groove portion 130. The coupling assembly 300 is formed in a ring shape and coupled to the coupling groove portion 130.

The coupling assembly 300 maintains the coupled state of the guide assembly 200 with the outer casing 100 by applying pressure to the radially placed guide assembly 200.

The coupling assembly 300 is formed of a material that is not plastically deformed, such as aluminum, even though the coupling assembly 300 repeatedly expands and contracts due to heat, maintaining excellent elastic force.

If the radial width of the coupling assembly 300 is too small, the coupling assembly 300 may be plastically deformed when the coupling assembly 300 is coupled to the coupling groove portion 130 of the outer casing 100 and thermally expands.

On the other hand, if the radial width of the coupling assembly 300 is too large, it is difficult to couple the coupling assembly 300 to the outer casing 100, and when the coupling assembly 300 is coupled to the outer casing 100, the coupling groove portion 130 and the guiding assembly 200 may be deformed or damaged. .

In addition, when the coupling assembly 300 is coupled to the coupling groove portion 130 of the outer casing 100 and thermally expanded, the coupling assembly 300 has a suitable radial width to avoid plastic deformation and to suppress deformation of the outer casing 100 and the guiding assembly 200 and to the outer casing 100 and the guiding assembly. 200 damage.

In the embodiment, the coupling groove portion 130 has a through hole 120 formed in the radial direction of the outer casing 100 and communicates with the hollow 110, and the guide assembly 200 is placed in the through hole 120.

Here, the area of the through hole 120 that is in contact with the guide assembly 200 is formed to have a shape corresponding to the shape of the guide assembly 200, thereby significantly reducing the shaking of the guide assembly 200 placed in the through hole 120.

If the interior of the chamber is heated from room temperature or a similar low temperature to a high temperature, the outer casing 100, the guide assembly 200, and the coupling assembly 300 can be simultaneously thermally expanded.

Here, the coupling assembly 300 has an excellent elastic force even at a high temperature, whereby pressure can be applied to the guide assembly 200, and the stable coupling state of the guide assembly 200 to the outer casing 100 can be maintained.

If the interior of the chamber is cooled from a high temperature to a room temperature or a low temperature similar thereto, the outer casing 100, the guide assembly 200, and the coupling assembly 300 may be simultaneously thermally contracted.

Here, even when the coupling assembly 300 is thermally contracted in a low temperature environment, the coupling assembly 300 has an excellent elastic force, whereby pressure can be applied to the guide assembly 200 and the stable coupling state of the guide assembly 200 to the outer casing 100 can be maintained.

In the embodiment, the coupling assembly 300 has excellent elastic force regardless of the temperature environment inside the chamber, that is, high temperature and low temperature, whereby the stable coupling state of the guide assembly 200 and the outer casing 100 can be maintained regardless of the temperature change.

3 is a cross-sectional view of the guide assembly 200 of the embodiment. The guiding assembly 200 of the embodiment includes a receiving portion 210, a first sphere 220, and a second sphere 230.

A receiving recess 211 that is open at one side is formed at the receiving portion 210. The coupling assembly 300 applies pressure to the rear region of the receiving portion 210, that is, the receiving recess 211 does not have the region on the opening side, whereby the guiding assembly 200 is stably placed in the through hole 120 formed in the outer casing 100.

The first spherical body 220 and the second spherical body 230 are received in the receiving recess 211, and a portion of the first spherical body 220 located on the opening side of the receiving concave portion 211 is exposed to the outside, and the exposed portion of the first spherical body 220 contacts the substrate supporting pin 10.

Due to such a structure, the first spherical body 220 is received in the receiving recess 211, and a portion of the first spherical body 220 is exposed to the outside to be in rolling contact with the substrate supporting pin 10.

If the substrate support pin 10 moves relative to the outer casing 100, the first sphere 220 rolls, thereby greatly reducing the friction between the substrate support pin 10 and the guide assembly 200, thereby effectively moving the substrate support pin 10, and reducing the substrate support pin 10. Wear and tear.

The first sphere 220 is corroded in a chamber of a high temperature environment, and thus is suitably formed of a material having high corrosion resistance, and is wearable by friction with the substrate support pin 10 and the second sphere 230, thereby being suitable for high wear resistance. Sexual material formation. Therefore, the first sphere 220 is formed of alumina (Al ₂ O ₃ ) or has a structure in which the surface thereof is coated with alumina.

A plurality of second spheres 230 are provided to be received in the receiving recess 211 and to contact the inner wall of the receiving recess 211 with the first sphere 220. The second sphere 230 is formed of a different material than the first sphere 220.

The first sphere 220 and the second sphere 230 have a spherical shape, and the inner wall of the receiving recess 211 has a spherical shape, a part of which is open. The second sphere 230 fills a space between the first sphere 220 and the inner wall of the receiving recess 211.

If the first sphere 220 rolls, the second sphere 230 rolls relative to the first sphere 220 and the receiving recess 211, thereby significantly reducing the friction generated by the surface of the first sphere 220 during the rolling of the first sphere 220, thereby The ball 220 can smoothly roll.

Figure 4 is a schematic illustration of a longitudinal section of the support structure of the embodiment. As described above, the four guide assemblies 200 are radially provided at the coupling groove portion 130 in the peripheral direction of the outer casing 100.

In addition, two rows of guide assemblies 200 are placed along the length of the outer casing 100. Here, each column is placed at each of the coupling groove portions 130 formed at the upper end and the lower end of the outer casing 100.

The coupling assembly 300 is placed at a position of the outer casing 100 corresponding to the guiding assembly 200, and the coupling assembly 300 is placed so as to be easily coupled with the outer casing 100.

Therefore, for this reason, the coupling groove portion 130 is formed at each of the upper end and the lower end of the outer casing 100 to which the coupling assembly 300 is easily coupled, and the guiding assembly 200 and the coupling assembly 300 are placed at the coupling groove portion 130.

In addition, for this reason, a total of two rows of the guide assembly 200 and the coupling assembly 300 are placed at the upper and lower ends of the outer casing 100 along the length direction of the outer casing 100.

The annular coupling assembly 300 is coupled to the coupling groove portion 130 of the outer casing 100 by a tight fit or form fit.

Because a separate coupling unit is not required, the coupling assembly 300 is coupled to the coupling slot 130 by a tight fit or form fit, so the coupling assembly 300 is easily coupled to the outer casing 100.

In the same manner, because the guide assembly 200 is coupled to the outer casing 100 by the pressure applied by the coupling assembly 300, a separate coupling unit is not required, so the guide assembly 200 is easily coupled to the outer casing 100.

In an embodiment, the guide assembly 200 is not fixed to the outer casing 100 using a coupling unit such as a bolt, but the annular coupling assembly 300 applies pressure to the guide assembly 200 to couple the guide assembly 200 to the outer casing 100, thereby avoiding support due to thermal deformation of the coupling unit. Deformation or damage to the structure, as well as effectively coupling the guide assembly 200 to the outer casing 100.

Figure 5 is an enlarged schematic view of a portion A of Figure 2. The content shown in FIG. 5 corresponds to another embodiment, whereby the hook body 212 and the recessed recess 312 which are not shown in FIG. 2 are shown in FIG. Figure 6 is a cross-sectional view taken along line B-B of Figure 5.

In the embodiment, the hook body 212 is formed on the receiving portion 210, and the recessed concave portion 312 is formed on the coupling assembly 300.

That is, the receiving portion 210 includes a hook body 212 that protrudes from a portion of the receiving portion 210 opposite to the coupling assembly 300, and the coupling assembly 300 includes a recessed recess 312 having a shape corresponding to the shape of the hook body 212, and The portion of the coupling assembly 300 opposite the hook body 212 protrudes.

For example, the hook 212 may be formed at both corners of the portion of the receiving portion 210 opposite to the coupling assembly 300. In the embodiment, four guide assemblies 200 are provided, whereby a total of eight hooks 212 are provided.

In another embodiment, the hook body 212 is formed at the center of the portion of the receiving portion 210 opposite to the coupling assembly 300. Here, since the hook body 212 is formed at the center of the receiving portion 210, and four guiding members 220 are provided, a total of four hook bodies 212 are provided.

Of course, the recessed recess 312 is provided at a position in the coupling assembly 300 corresponding to the hook body 212 formed at the center of the receiving portion 210, and the number provided corresponds to the total number of the hook bodies 212.

The coupling assembly 300 is coupled to the coupling groove portion 130 of the outer casing 100 by a tight fit or a positive fit, but is separated from the outer casing 100.

That is, the coupling assembly 300 repeats thermal expansion and contraction in accordance with the temperature rise/fall of the inside of the chamber, and vibration may continuously occur in accordance with the operation of various devices provided in the chamber.

Since the coupling assembly 300 is separated from the outer casing 100 due to such thermal expansion/contraction and vibration, it is necessary to maintain a stable coupling state of the coupling assemblies 300 and 100.

Therefore, the hook body 212 formed on the receiving portion 210 is installed in the recessed recess 312 formed in the coupling assembly 300, thereby suppressing the coupling assembly 300 from being separated from the outer casing 100.

That is, the coupling assembly 300 applies pressure to the receiving portion 210, thereby maintaining the coupled state of the guiding assembly 200 to the outer casing 100, and inhibiting the guiding assembly 200 from being separated from the outer casing 100.

The hook body 212 formed at the receiving portion 210 of the guiding assembly 200 is installed in the recessed recess 312 formed on the coupling assembly 300, thereby maintaining the coupled state of the coupling assembly 300 to the outer casing 100, and suppressing the guiding assembly 200 and the outer casing 100. Separation.

With this configuration, the coupling assembly 300 and the guiding assembly 200 are constrained to each other, whereby the coupling assembly 300 and the guiding assembly 200 can maintain their stable coupling with the housing 100 and avoid separation from the housing 100.

Referring to FIG. 6, the upper end of the hook body 212 is formed as an inclined surface 212a, and the lower end of the hook body 212 is formed as a stepped surface 212b. In order to correspond to the hook body 212, the recessed recess 312 has an inclined surface at its upper portion and a stepped surface at its lower portion.

When the coupling assembly 300 is mounted on the coupling groove portion 130 of the outer casing 100, the coupling assembly 300 can be moved downward along the length direction of the outer casing 100, that is, moved downward in FIG. 6, thereby being mounted on the coupling groove portion 130. in.

Here, if the coupling assembly 300 moves down the outer casing 100, the coupling assembly 300 slides along the inclined surface 212a of the hook body 212, and then when the hook body 212 is completed in the recessed recess 312, the coupling on the outer casing 100 is completed. Assembly of assembly 300.

When the mounting of the coupling assembly 300 on the outer casing 100 is completed, the coupling assembly 300 is constrained by the stepped surface 212b of the hook body 212, thereby preventing the coupling assembly 300 from moving upward along the length of the outer casing 100, and the coupling assembly 300 can be avoided. Separated from the outer casing 100.

Due to the above structure, in the embodiment, the coupling assembly 300 can be stably coupled to the outer casing 100 through the stepped surface 212b of the hook body 212, whereby the guiding assembly 200 can be stably coupled to the outer casing 100 through the pressure applied by the coupling assembly 300.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

10‧‧‧Substrate support pin

11‧‧‧Top

100‧‧‧ Shell

110‧‧‧ hollow

120‧‧‧through hole

130‧‧‧Coupling groove

140‧‧‧ Subject

200‧‧‧Guide components

210‧‧‧ Receiving Department

211‧‧‧ receiving recess

212‧‧‧ hook body

212a‧‧‧ sloped surface

212b‧‧‧step surface

220‧‧‧First sphere

230‧‧‧Second sphere

300‧‧‧Coupling components

312‧‧‧ recessed recess

Part A‧‧‧

Figure 1 is an exploded longitudinal cross-sectional view of a support structure of one embodiment. Figure 2 is a schematic plan view of the support structure of the embodiment. Figure 3 is a cross-sectional view of the guide assembly of the embodiment. Figure 4 is a longitudinal cross-sectional view of the support structure of this embodiment. Figure 5 is an enlarged schematic view of a portion A of Figure 2. Figure 6 is a cross-sectional view taken along line B-B of Figure 5.

Claims (12)

A support structure comprising: a casing having a hollow formed along a length thereof such that a substrate support pin is inserted into the hollow; a plurality of guide assemblies are provided in an upper portion and a lower portion of the outer casing in a peripheral direction Moving the substrate support pin along the length of the outer casing by rolling contact with the substrate support pin; and a plurality of coupling components coupled to an outer peripheral surface of the outer casing, the coupling components being A guide member is provided to surround the guide members and to apply pressure to the guide members in a radial direction of the outer casing to couple the guide members to the outer casing. The support structure of claim 1 wherein the coupling assemblies are formed to have an annular shape and to be coupled to the outer casing by a tight fit or a positive fit. The support structure of claim 2, wherein the coupling components are formed of aluminum. The support structure of claim 1 wherein the guide assemblies are provided along the length of the outer casing. The support structure of claim 4, wherein the guide assemblies are placed at each of the upper and lower ends of the housing. The support structure of claim 1, wherein the outer casing comprises: a main body; and a plurality of coupling groove portions formed at an upper end and a lower end of the main body so as to extend along a length direction of the outer casing, and the coupling groove portion The outer diameter is less than the outer diameter of the body, wherein the coupling components are coupled to the coupling grooves. The support structure of claim 6, wherein the guide assemblies comprise four guide assemblies that are radially placed in each of the coupling grooves along a peripheral direction of the outer casing. The support structure of claim 6, wherein the guide members are placed in two columns along the length of the outer casing. The support structure of claim 6, wherein the coupling groove portion has a plurality of through holes formed in a radial direction of the outer casing, and the through holes communicate with the hollow, wherein the guiding members are placed in the communication In the hole. The support structure of claim 1, wherein each of the guiding assemblies comprises: a receiving portion comprising a receiving recess having an open side; a first sphere received in the receiving recess, the first One portion of the sphere is exposed to the outside and in rolling contact with the substrate support pin; and a plurality of second spheres are received in the receiving recess and in rolling contact with an inner wall of the receiving recess and the first sphere. The support structure of claim 10, wherein the receiving portion includes a plurality of hooks projecting from a portion thereof opposite to the coupling assembly; and the coupling assembly includes a plurality of recessed recesses having a shape corresponding to the hook body And formed at a portion opposite to the hooks. The support structure according to claim 11, wherein an upper end of the hook body is formed as an inclined surface, and a lower end of the hook body is formed as a step surface.