TW201911991A - Tin paste nozzle, work-bench and tin paste feeding apparatus - Google Patents

Abstract

Provided in the present application are a solder paste addition device capable of automatically removing residual solder paste, and a solder paste nozzle and a worktable thereof. The device comprises a solder paste nozzle and a worktable. The worktable is used for carrying the solder paste nozzle. The solder paste nozzle comprises: an upper nozzle portion, a lower nozzle portion, and a film disposed between the upper nozzle portion and the lower nozzle portion; a solder paste nozzle through-hole penetrating through the upper nozzle portion, the lower nozzle portion and the film; and a deformation space. The deformation space is disposed between an upper surface of the film and the upper nozzle portion and/or between a lower surface of the film and the lower nozzle portion. The lower nozzle portion is provided with at least one nozzle duct to enable a gas flow to be blown upwardly to the film through the at least one nozzle duct to upwardly deform the film, thereby forming a gas flow passage between the film and the lower nozzle portion to enable a gas flow to enter the lower nozzle through-hole via the gas flow passage to blow residual solder paste out of the lower nozzle through-hole.

Description

Solder paste nozzle, table and solder paste device

The present invention relates to a solder paste device, and more particularly to a workbench and a solder paste nozzle for an automatic solder paste device capable of automatically removing residual solder paste.

In the printed circuit board surface sealing process, a solder paste printer (also known as a stencil printer) is used to print solder paste onto electronic products such as circuit boards. Solder paste printing machines generally include a stencil (or a template), a solder paste device, a blade or a squeegee. At the time of printing, the board is automatically fed into a solder paste printer having a pattern of solder pads or some other conductive surface on which the solder paste can be deposited, and having a reference point on the board. One or more apertures or indicia for use as a reference point to align the board with the screen in the solder paste printer prior to printing the solder paste onto the board. After the board has been aligned with the screen in the printer, the solder paste is dispensed by moving the blade or squeegee through the screen to force the solder paste through the holes in the board and onto the board. After the printing operation, the board is then sent to another workstation within the printed circuit board processing line.

The automatic solder paste device on the solder paste printer is used to automatically add canned or packaged solder paste to the screen of the solder paste printer to supplement the solder paste that is consumed in the printing process. The solder paste can usually form a solder paste canister with a solder paste nozzle inserted into the solder paste can from the opening of the solder paste can, and distribute the solder paste from the solder paste can by the relative displacement of the solder paste can and the solder paste nozzle (or squeeze) Press it out. When using the automatic solder paste device, first install the solder paste can assembly on the automatic solder paste device so that the solder paste can has the opening facing down, and then move the solder paste can component to a certain position above the mesh plate. To "position"), the solder paste is dispensed from the solder paste can nozzle to the stencil by extrusion or extraction (this action is simply referred to as "plus tin"). After the solder paste is dispensed from the solder paste can nozzle to the screen by performing an extrusion or extraction operation, solder paste remains in the vicinity of the solder paste nozzle exit. In the process of removing the solder paste residue, the solder paste may be diffused into the surrounding environment, and after removing the solder paste residue, the solder paste may be further dripped due to gravity or the like.

The purpose of the present invention is to provide a solder paste device capable of automatically removing residual solder paste, which can effectively remove the solder paste remaining in the solder paste nozzle of the solder paste device.

According to a first aspect of the present invention, there is provided a solder paste nozzle comprising: an upper portion of a nozzle, a lower portion of the nozzle, and a film disposed between the upper portion of the nozzle and the lower portion of the nozzle; the upper portion of the nozzle, the lower portion of the nozzle, and a solder paste nozzle through hole of the film, wherein the solder paste nozzle through hole forms a nozzle lower through hole in the lower portion of the nozzle; and a deformation space, the deformation space is disposed on an upper surface of the film and the nozzle Between the upper portion and/or between the lower surface of the film and the lower portion of the nozzle; wherein the lower portion of the nozzle is provided with at least one nozzle air passage to enable airflow to be blown upward through the at least one nozzle air duct toward the film to cause the The film is deformed upwardly to form an air flow passage between the film and the lower portion of the nozzle, so that airflow can enter the lower nozzle through hole through the air flow passage to deposit residual tin in the lower through hole of the nozzle The paste is blown out.

According to the solder paste nozzle described above, the at least one nozzle air passage has a nozzle air duct outlet, the nozzle air duct outlet is disposed on a top surface of the lower portion of the nozzle, and the film covers the nozzle air duct outlet.

According to the solder paste nozzle described above, the deformation space is provided at the bottom of the upper portion of the nozzle, and the deformation space at least partially covers the nozzle air duct outlet.

According to the solder paste nozzle described above, the deformation space is disposed at the top of the lower portion of the nozzle, and the deformation space is in communication with the at least one nozzle air passage.

According to the solder paste nozzle described above, the nozzle upper portion has a head portion which can be inserted into a solder paste can containing a solder paste and moved relative to the solder paste can, so that the solder paste can pass through the solder paste nozzle The hole flows out.

According to the solder paste nozzle described above, the film is made of a rubber material or other elastic material.

According to a second aspect of the present invention, the present invention provides a work bench for a solder paste apparatus comprising: at least one work surface air duct, each of the at least one work surface air duct including a work surface air duct inlet and a work surface air duct outlet, A table duct inlet is for communicating with a source of gas to deliver airflow from the source of gas to the station duct outlet, the table duct outlet for providing airflow to the top of the table.

According to the above workbench, the work table further includes an opening for accommodating a lower end of the solder paste nozzle for supplying airflow to a nozzle air passage of the solder paste nozzle housed in the work table.

According to the above table, the table includes an upper surface and a lower surface, and the table air duct outlet is disposed on the upper surface.

According to the above workbench, the table air duct includes a first passage portion and a second passage portion, the first passage portion is connected to a gas source, and one end of the second passage portion is connected to the first passage portion, and One end is coupled to the table duct outlet, and wherein the second channel portion is configured to extend upwardly from the first channel portion.

According to the collaborators of the present invention, the present invention provides a solder paste device comprising: a solder paste nozzle, the solder paste nozzle comprising: an upper portion of the nozzle, a lower portion of the nozzle, and a film disposed between the upper portion of the nozzle and the lower portion of the nozzle a solder paste nozzle through hole penetrating the upper portion of the nozzle, the lower portion of the nozzle, and the film, wherein the solder paste nozzle through hole forms a nozzle lower through hole in the lower portion of the nozzle; and a deformation space, the deformation space Between the upper surface of the film and the upper portion of the nozzle and/or between the lower surface of the film and the lower portion of the nozzle; wherein the lower portion of the nozzle is provided with at least one nozzle air passage to enable airflow through at least one nozzle The air duct is blown upward toward the film to cause the film to be deformed upward, thereby forming an air flow passage between the film and the lower portion of the nozzle, so that airflow can enter the nozzle lower through hole through the air flow passage, And blowing a solder paste remaining in the through hole of the lower nozzle; and a workbench, the workbench carrying the solder paste nozzle, the workbench including at least one Typhoon path for the at least one working channel is configured with a typhoon to at least one nozzle in fluid communication with air channel for delivering air flow to the at least one nozzle of the air duct.

According to the above-described solder paste apparatus, the at least one nozzle air passage has a nozzle air duct inlet located at a bottom surface of the lower portion of the nozzle, and the at least one table air passage has a table air duct located on an upper surface of the table An outlet, the nozzle air duct inlet being aligned with the table air duct outlet.

According to the above-described solder paste apparatus, the at least one nozzle air passage has a nozzle air duct outlet, and the nozzle air duct outlet is provided on a top surface of the lower portion of the nozzle, and the film covers the nozzle air duct outlet.

According to the above-described paste applying apparatus, the deformation space is provided at the bottom of the upper portion of the nozzle, and the deformation space at least partially covers the nozzle air duct outlet.

According to the solder paste nozzle described above, the deformation space is disposed at the top of the lower portion of the nozzle, and the deformation space is in communication with the at least one nozzle air passage.

According to the solder paste nozzle of the present invention and the table of the automatic solder paste device, the residual solder paste in the through hole in the lower portion of the nozzle can be removed after the tinning working process is completed. By removing the solder paste remaining in the lower portion of the solder paste nozzle, and not only removing the solder paste attached to the nozzle opening, it is possible to better avoid the residual in the solder paste nozzle in the process of moving the solder paste device. The solder paste drops to an undesired place. Moreover, in the process of using high-pressure gas to remove residual solder paste, the solder paste may be dispersed into small droplets or powder, which pollutes the surrounding environment, and in this case, the action of the gas solder paste is limited to the through hole of the lower portion of the solder paste nozzle. In the space, small droplets or powders in which the solder paste is dispersed by the airflow are prevented from diffusing into the surrounding environment.

Various specific embodiments of the present invention are described below with reference to the accompanying drawings which form a part of this specification. It should be understood that although the term indicating direction is used in the present case, such as "before", "after", "upper", "lower", "left", "right", "inside", "outside", etc. Various example structural elements and elements are used, but these terms are used herein for convenience of description only, based on the example orientation shown in the figures. Since the embodiments disclosed herein may be arranged in different orientations, these terms are merely illustrative and are not to be considered as limiting.

FIG. 1 illustrates a perspective view and an exploded view of the solder paste device 100 of the present invention. As shown in FIG. 1, the solder paste device 100 includes a driving device 160, a support plate member 130, a push rod 110, a pressure plate 109, and a table 600. The support plate member 130 is used to support the solder paste device 100 on a solder paste printer. The pressure plate 109 is disposed at a lower portion of the push rod 110, and the push rod 110 can be driven by the driving device 160 to move up and down, thereby driving the pressure plate 109 to move up and down. The drive unit 160 is fixed to the support plate assembly 130, and the table 600 is also fixed to the support plate assembly 130. The table 600 is used to carry the solder paste can 107 and the solder paste nozzle 200 housed in the solder paste can 107, wherein the lower end of the solder paste nozzle 200 is supported by the table 600, and the upper end of the solder paste nozzle 200 is inserted with the inverted solder paste. In the tank 107. When the tinning action is performed, the bottom of the inverted solder paste can 107 is pressed by the downward movement of the pressing plate 109, so that the solder paste can 107 is moved downward relative to the solder paste nozzle 200, thereby causing the tin contained in the solder paste can 107. The paste flows out from the nozzle opening (not shown in Fig. 1) at the lower end of the solder paste nozzle 200. Since the solder paste has a certain viscosity, solder paste is usually left at the nozzle opening of the solder paste nozzle 200 after the tinning operation is completed. The tin paste device of the present invention can automatically remove the residual solder paste by setting the solder paste nozzle and the workbench.

2A illustrates a cross-sectional view of a solder paste nozzle 200 in accordance with one embodiment of the present disclosure, and FIG. 2B illustrates an exploded view of the solder paste nozzle 200 illustrated in FIG. 2A. As shown in FIGS. 2A and 2B, the solder paste nozzle 200 includes a nozzle upper portion 210, a film 220 and a nozzle lower portion 230, wherein the film 220 is disposed between the nozzle upper portion 210 and the nozzle lower portion 230, and the three pass through the tight body 240, such as a bolt. ,connected. The solder paste nozzle 200 has a through hole 280 penetrating the nozzle upper portion 210, the flexible sheet 220, and the nozzle lower portion 230 so that the solder paste in the solder paste can 107 can be accessed from the upper end 281 of the solder paste nozzle through hole 280, through the solder paste nozzle through hole The lower end 282 of the 280 is discharged to achieve the purpose of dispensing solder paste.

3 is a perspective view of the nozzle upper portion 210 of the solder paste nozzle 200 shown in FIGS. 2A and 2B. As shown in FIG. 3, the solder paste nozzle upper portion 210 has a head portion 212, a tail portion 214, and an upper through hole 216 that extends through the entire nozzle upper portion 210 through the head portion 212 and the tail portion 214. The head portion 212 of the nozzle upper portion 210 is generally cylindrical and has a diameter that matches the inner diameter of the solder canister 107 (as shown in FIG. 7) such that when the solder paste canister 107 is moved downward relative to the solder paste nozzle 200, The solder paste contained in the solder paste can 107 can flow out through the solder paste nozzle through hole 280.

As shown in Figures 3 and 2A, a deformation space 219 is provided at the bottom of the tail portion 214 of the nozzle upper portion 210 for receiving the deformation of the film 220 (described in detail below). According to an embodiment of the present disclosure, the deformation space 219 is formed by expanding the diameter of the lower section of the upper through hole 216. The deformation space 219 also forms part of the bottom surface of the nozzle upper portion 210 such that in the assembled nozzle 200, the deformation space 219 is disposed adjacent to the film 220. A mounting hole 218 is also provided in the tail portion 214 of the nozzle upper portion 210 for receiving the tight body to connect the nozzle upper portion 210, the film 220, and the nozzle lower portion 230 together.

4A and 4B are a perspective view and a partial cross-sectional view, respectively, of the lower portion of the nozzle of the solder paste nozzle shown in Figs. 2A and 2B. As shown in FIGS. 4A and 4B, the nozzle lower portion 230 has a head portion 232, a tail portion 234, and a lower through hole 236 that penetrates the head portion 232 and the tail portion 234.

As shown in Fig. 4B, the head 232 is provided with two nozzle ducts 233.1 and 233.2, and the nozzle ducts 233.1 and 233.2 have nozzle duct outlets 239.1 and 239.2 on the top surface of the nozzle lower portion 230 so that the airflow can be respectively The film 220 is blown upward through the nozzle ducts 233.1 and 233.2, causing the film 220 to deform upward. The two nozzle air passages 233.1 and 233.2 are symmetrically disposed relative to the lower through hole 236 such that the film 220 is subjected to a balanced airflow biasing force. According to one example of the present case, the nozzle ducts 233.1 and 233.2 are a section of the passage in the nozzle lower portion 230, which may be disposed vertically or obliquely. In addition, the curved nozzle ducts 233.1 and 233.2 may be provided, but a section of the nozzle ducts 233.1 and 233.2 adjacent the nozzle duct outlets 239.1 and 239.2 need to extend upwardly to provide an upward flow of air. Although FIGS. 4A and 4B illustrate two nozzle air passages, the nozzle air passage of the present case may be provided in more than two, or only one.

Still as shown in FIG. 4B, the outer diameter of the tail portion 234 of the nozzle lower portion 230 is set to be smaller than the outer diameter of the head portion 232, so that the nozzle lower portion 230 can be snapped into the table 600 through the head portion 232 (as shown in FIG. 7). To limit the downward movement of the solder paste nozzle 200 relative to the table 600. Of course, it is also possible to restrict the downward movement of the solder paste nozzle relative to the table 600 by means of a fixed connection. Nozzle ducts 233.1 and 233.2 extend through head 232 such that nozzle duct inlets 237.1 and 237.2 of nozzle ducts 233.1 and 233.2 are located on the bottom surface of head 232. A mounting hole 238 is also provided in the head portion 232 of the nozzle lower portion 230 for connecting the nozzle upper portion 210, the film 220, and the nozzle lower portion 230 together by the tight body.

Figure 5 is a perspective view of the film of the solder paste nozzle shown in Figures 2A and 2B. As shown in FIG. 5, the film 220 has a film through hole 226. As shown in FIG. 2A, the upper through hole 216 of the nozzle upper portion 210, the film through hole 226, and the lower through hole 236 of the nozzle lower portion 230 collectively constitute the solder paste nozzle through hole 280. The film 220 is made of an elastic material such as rubber or the like so that the film 220 can be deformed by force. The film 220 is further provided with mounting holes 228 for connecting the nozzle upper portion 210, the film 220 and the nozzle lower portion 230 together by the tight body.

As shown in FIG. 2A, the film 220 is disposed to cover the outlets 239.1 and 239.2 of the nozzle air passages 233.1 and 233.2 on the nozzle lower portion 230, and the deformation space 219 of the nozzle upper portion 210 is sized to at least partially cover the nozzle air passage 233. The exits are 239.1 and 239.2. Thus, when the solder paste is dispensed through the nozzle 200, the film 220 can cover the nozzle air passages 233.1 and 233.2 to prevent the solder paste flowing through the nozzle 200 from entering the nozzle air passages 233.1 and 233.2, while in the slave nozzle air passage 233.1 And 233.2, when the airflow is delivered to the nozzle 200, the airflow from the outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 can cause the film 220 to deform upwardly to form an air flow passage between the film 220 and the nozzle lower portion 230, so that the airflow The nozzle can be inserted into the nozzle lower through hole 236 through the air flow passage, thereby blowing out the solder paste remaining in the nozzle lower through hole 236.

6A and 6B are respectively a perspective view and a partial cross-sectional view of the table of the solder paste apparatus of the present invention. As shown in FIGS. 6A and 6B, the table 600 is provided with an opening 603 and a table duct 610.1 (see FIG. 7) and 610.2 for accommodating the tail portion 234 of the nozzle lower portion 230, and the ducts 610.1 and 610.2 are used for the gas. The gas in the source (not shown) is directed toward the nozzle ducts 233.1 and 233.2 of the nozzle lower portion 230 to cut (or remove) the residual solder paste in the nozzle lower portion 230 by the air flow. The table 600 has an upper surface 641 and a lower surface 642 that extend through the upper surface 641 and the lower surface 642.

According to one embodiment of the present invention, two nozzle ducts 233.1 and 233.2 are provided in the nozzle lower portion 230, and two table ducts 610.1 and 610.2 are correspondingly provided in the table 600. As shown in Figures 6A and 6B, two table ducts 610.1 and 610.2 are respectively disposed on both sides of the opening 603 of the table 600 so that the film 220 can be balanced when guiding the airflow to the nozzle ducts 233.1 and 233.2. . Both table ducts 610.1 and 610.2 include table duct inlets 608.1, 608.2 and table duct outlets 609.1, 609.2. Workbench air duct exits 609.1 and 609.2 are provided on the upper surface 641 of the table 600 for providing airflow to the nozzle ducts 233.1 and 233.2. When the nozzle 200 as shown in Fig. 4B is mounted in the table 600 as shown in Fig. 6B, the table duct outlets 609.1 and 609.2 are aligned with the nozzle duct inlets 237.1 and 237.2 to bring the table ducts 610.1 and 610.2. It is connected to the nozzle ducts 233.1 and 233.2, respectively. The table duct inlets 608.1 and 608.2 are respectively disposed on the outer wall of the table 600 to facilitate communication with an external source of gas. In the above embodiment of the present case, the table air ducts are two. However, the table air ducts can also be of other numbers as long as they match the number of nozzle ducts.

Although in the above embodiment, the opening 303 of the table 600 is recessed inwardly from one side of the table to form a U-shaped groove, the opening 303 may also be a through hole penetrating through the table 600.

As shown in FIG. 6B, the specific structure of the working platform air duct is introduced by taking the working platform air duct 610.2 as an example. The other working platform air duct 610.1 is similar in structure to the working platform air duct 610.1, and details are not described herein. The table duct 610.2 includes a first duct portion 625.2 and a second duct portion 626.2. The first duct portion 625.2 is connected to the gas source through the table duct inlet 608.2, and the second duct portion 626.2 is connected through the table duct outlet 609.2. Nozzle duct inlet 237.2. According to one example, the first duct portion 625.2 extends generally laterally and the second duct portion 626.2 extends vertically upward from the first duct portion 625.2. Of course, the extending direction of the second duct portion and the first duct portion may also be set to other forms as long as the airflow can be delivered to the outlets 609.1 and 609.2 of the table duct.

As an example, duct inlets 608.1 and 608.2 are disposed on side walls 643 of the table. In other embodiments, the duct inlets 608.1 and 608.2 may also be located elsewhere in the table as long as they are connectable to a source of gas.

Figure 7 is a cross-sectional view showing the solder paste nozzle 200 shown in Figure 2A assembled in a solder paste can and assembled on the table 600 shown in Figures 6A and 6B. Next, a procedure for matching the solder paste nozzle of the present invention with the workbench to remove the residual solder paste in the solder paste nozzle will be described with reference to FIG.

As shown in FIG. 7, the upper end of the assembled solder paste nozzle 200 is inserted into the solder paste can 107, and the lower end of the solder paste nozzle 200 is mounted in the table 600 to carry the solder paste nozzle 200 and the solder paste can 107 through the table 600. . When the solder paste nozzle 200 is loaded into the solder paste can 107 containing the solder paste, the cap of the solder paste can 107 (shown in FIG. 7) is first removed, and then the nozzle of the solder paste nozzle is removed. The upper portion 210 is inserted into the solder paste can 107 from the can 171 of the solder paste can 107. The vicinity of the can 171 of the solder paste can 107 is not filled with solder paste, thereby leaving a mounting space for the solder paste nozzle 200.

In the tinning process, when the solder paste can 107 is pressed down, the solder can 107 is pressed to move downward relative to the solder paste nozzle 200 due to the outer diameter of the head 212 of the solder paste nozzle upper portion 210 and the solder paste. The inner diameters of the cans 107 are matched such that the solder paste in the solder paste cans 107 above the head 210 of the solder paste nozzle 200 is squeezed into the solder paste nozzle vias 280 and discharged therefrom. In the procedure of squeezing the solder paste can 107, since the through-hole 280 of the solder paste nozzle 200 has a downward flowing solder paste, the downward flow of the solder paste causes the film 220 to be pressed downward against the top surface of the nozzle lower portion 106. . Since the film 220 is disposed to cover the nozzle air duct outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2 on the nozzle lower portion 230, the solder paste cannot enter between the film 220 and the upper surface of the nozzle lower portion 230 when flowing through the film 220, thereby Solder paste cannot enter the nozzle ducts 233.1 and 233.2.

When the tinning action is completed, an external source of gas is activated to cause the gas stream to flow through the table channels 610.1 and 610.2 and the nozzle channels 233.1 and 233.2 to the film 220. Since the deformation space 219 of the nozzle upper portion 210 is sized to at least partially cover the nozzle duct outlets 239.1 and 239.2 of the nozzle ducts 233.1 and 233.2, thereby the nozzle duct outlets 239.1 and 239.2 from the nozzle ducts 233.1 and 233.2 The delivered airflow can cause the film 220 to deform upward. The film 220 is deformed upward to form an air flow passage between the film 220 and the top surface of the nozzle lower portion 230, through which the airflow can enter the nozzle lower through hole 236, thereby blowing out the residual solder paste in the nozzle lower through hole 236.

According to the present invention, the gas source can be in direct communication with the nozzle air passage to supply gas to the nozzle air passage. However, by providing a duct on the workbench and feeding the gas source through the table duct to the nozzle duct, it is not necessary to reconnect the gas source when replacing the solder paste nozzle. Due to the high frequency of solder paste nozzle replacement, the process can be saved and the operator's operation can be facilitated by setting the table air duct.

The gas source may be a compressed gas to increase the flow rate of the gas, thereby facilitating a greater pressure of the gas stream.

8A is a cross-sectional view of a solder paste nozzle according to another embodiment of the present invention, FIG. 8B is an exploded view of the solder paste nozzle illustrated in FIG. 8A, and FIG. 8C is a partially enlarged schematic view of a portion C of FIG. 8A.

The solder paste nozzle 800 shown in FIG. 8A is similar to the solder paste nozzle 200 of FIG. 2A, and also includes a nozzle upper portion 810, a film 820, and a nozzle lower portion 830. The film 820 is disposed between the nozzle upper portion 810 and the nozzle lower portion 830, and the solder paste. It enters from the upper end 881 of the solder paste nozzle through hole 880 and is discharged from the lower end 882 of the solder paste nozzle through hole 880. The difference is that in the embodiment shown in FIG. 8A, the deformation space 819 is disposed in the nozzle lower portion 830 (see FIG. 8C), and in the embodiment shown in FIG. 2A, the deformation space 219 is disposed in the nozzle upper portion 210.

Fig. 9 is a perspective view of the upper portion of the nozzle of the solder paste nozzle shown in Fig. 8A. As shown in FIG. 9, the nozzle upper portion 810 is similar in structure to the upper portion 210 of the nozzle 200, has a head portion 812 and a tail portion 814, and is provided with an upper through hole 816 and a mounting hole 818, but the bottom surface of the nozzle upper portion 810 is not provided with a deformation space.

10A and 10B are a perspective view and a cross-sectional view, respectively, of a lower portion of a nozzle of the solder paste nozzle shown in Fig. 8A. As shown in Figs. 10A and 10B, the nozzle lower portion 830 is similar in structure to the lower portion 230 of the nozzle 200, and is provided with a lower through hole 836 and nozzle ducts 833.1 and 833.2. However, the nozzle lower portion 830 is also provided with a deformation space 819 at its top, which is in communication with the nozzle ducts 833.1 and 833.2. As an example, the deformation space 819 is an elongated shallow groove formed by the top surface of the nozzle lower portion 830 being recessed downward, and the deformation space 819 extends through the lower through hole 836. The width of the deformation space 819 is set to be substantially the same as the diameter of the nozzle ducts 833.1 and 833.2, and its length is set to be covered by the film 820 (Fig. 8B).

Figure 11 is a cross-sectional view showing the solder paste nozzle shown in Figure 8A assembled in a solder paste can and assembled on a table. The solder paste nozzle 800 shown in FIG. 8A can also cooperate with the table 600 shown in FIGS. 6A and 6B to remove the solder paste remaining in the solder paste nozzle 800. Next, a procedure for matching the solder paste nozzle 800 shown in FIG. 8A with the table 600 to remove residual solder paste in the solder paste nozzle will be described with reference to FIG.

As shown in FIG. 11, the upper end of the assembled solder paste nozzle 800 is inserted into the solder paste can 107, and the lower end of the solder paste nozzle 820 is mounted in the table 600 to carry the solder paste nozzle 800 and the solder paste can 107 through the table 600. . In the tinning process, when the solder paste can 107 is pressed down, the solder can 107 is pressed to move downward relative to the solder paste nozzle 800 such that the solder paste can 107 is above the head 810 of the solder paste nozzle 800. The solder paste is squeezed into the solder paste nozzle via 880 and discharged therefrom. In the procedure of squeezing the solder paste can 107, since the through-hole 880 of the solder paste nozzle 800 has a downward flowing solder paste, the downward flow of the solder paste causes the flexible film 820 to be pressed downward against the top surface of the lower nozzle portion 106. And the film 820 is deformed downward toward the deformation space 819 to enter the deformation space 819, so that the solder paste cannot enter the deformation space 819 and the nozzle air passages 833.1 and 833.2 while flowing through the solder paste nozzle through hole 880.

When the tinning action is completed, an external source of gas is activated to cause the gas stream to flow through the table channels 610.1 and 610.2 and the nozzle channels 833.1 and 833.2 to the film 820. Airflow from the outlets 839.1 and 839.2 of the nozzle ducts 833.1 and 833.2 can push the film 820 entering the deformation space 819 upwardly, causing the downwardly deformed film to undergo an upward deformation and return to its original shape. At this time, the deformation space 819 forms an air flow passage between the flexible sheet 820 and the lower portion 830 of the nozzle, through which the air flow can enter the nozzle lower through hole 836, thereby blowing out the solder paste remaining in the nozzle lower through hole 836.

According to the solder paste nozzle of the present invention and the table of the solder paste device, the residual solder paste in the through hole in the lower portion of the nozzle can be removed after the tinning working process is completed. Compared with the solder paste attached to the nozzle opening only by the airflow outside the nozzle opening of the solder paste nozzle, the present invention can remove the residual solder paste in the lower portion of the solder paste nozzle in time, thereby preventing the residual in the lower portion of the solder paste nozzle. The solder paste continues to flow down the solder paste nozzle. Due to the large viscosity of the solder paste, more solder paste remains in the solder paste nozzle after the tinning process is completed. By removing the solder paste remaining in the lower portion of the solder paste nozzle, and not only removing the solder paste attached to the nozzle opening, it is possible to better avoid the tin remaining in the solder paste nozzle during the process of moving the solder paste device. The cream drops to an undesired place. Moreover, in the process of using high-pressure gas to remove residual solder paste, the solder paste may be dispersed into small droplets or powder, which pollutes the surrounding environment, and in this case, the action of the gas solder paste is limited to the through hole of the lower portion of the solder paste nozzle. In the space, small droplets or powders in which the solder paste is dispersed by the airflow are prevented from diffusing into the surrounding environment.

This description uses examples to disclose the present invention, one or more examples of which are illustrated in the drawings. Each example is provided to explain the case, not to limit the case. In fact, it will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the scope and spirit of the invention. For example, the illustrated or described features that are part of one embodiment can be used with another embodiment to provide a still further embodiment. Therefore, it is intended that the present invention cover the modifications and variations of the scope of the appended claims.

100‧‧‧plus solder paste device

107‧‧‧ solder paste cans

109‧‧‧Pressing

110‧‧‧Put

130‧‧‧Support plate components

160‧‧‧ drive

171‧‧‧ cans

200‧‧‧ solder paste nozzle

210‧‧‧Nozzle upper

212‧‧‧ head

214‧‧‧ tail

216‧‧‧Upper through hole

218‧‧‧ mounting holes

219‧‧‧Deformation space

220‧‧‧ films

226‧‧‧film through hole

228‧‧‧Mounting holes

230‧‧‧lower nozzle

232‧‧‧ head

233.1‧‧‧Nozzle duct

233.2‧‧‧Nozzle duct

234‧‧‧ tail

236‧‧‧Lower through hole

237.1‧‧‧Nozzle duct inlet

237.2‧‧‧Nozzle duct inlet

238‧‧‧Installation holes

239.1‧‧‧Nozzle duct exit

239.2‧‧‧Nozzle duct exit

240‧‧‧ Firm Firm

280‧‧‧through hole

281‧‧‧ upper end

282‧‧‧Bottom

600‧‧‧Workbench

603‧‧‧ openings

608.1‧‧‧Workbench air duct entrance

608.2‧‧‧Workbench air duct entrance

609.1‧‧‧Workbench air duct exit

609.2‧‧‧Workbench air duct exit

610.1‧‧‧Workbench air duct

610.2‧‧‧Workbench air duct

625.2‧‧‧First air duct section

626.2‧‧‧Second air duct section

641‧‧‧ upper surface

642‧‧‧ lower surface

643‧‧‧ side wall

800‧‧‧ solder paste nozzle

810‧‧‧Nozzle upper

812‧‧‧ head

814‧‧‧ tail

816‧‧‧Upper through hole

818‧‧‧Mounting holes

819‧‧‧Deformation space

820‧‧‧ films

830‧‧‧lower nozzle

833.1‧‧‧Nozzle duct

833.2‧‧‧Nozzle duct

836‧‧‧Lower through hole

837.1‧‧‧Nozzle duct entrance

837.2‧‧‧Nozzle duct inlet

839.1‧‧‧Nozzle duct exit

839.2‧‧‧Nozzle duct exit

880‧‧‧ solder paste nozzle through hole

881‧‧‧ upper end

882‧‧‧Bottom

These and other features, aspects, and advantages of the present invention will become better understood from the following detailed description of the invention.

Figure 1 is a perspective view of the solder paste device of the present invention;

2A illustrates a cross-sectional view of a solder paste nozzle in accordance with an embodiment of the present disclosure;

2B is an exploded view of the solder paste nozzle shown in FIG. 2A;

Figure 3 is a perspective view of the upper portion of the nozzle of the solder paste nozzle shown in Figures 2A and 2B;

Figure 4A is a perspective view of the lower portion of the nozzle of the solder paste nozzle shown in Figures 2A and 2B;

Figure 4B is a partial cross-sectional view of the lower portion of the nozzle shown in Figure 4A;

Figure 5 is a perspective view of the film of the solder paste nozzle shown in Figures 2A and 2B;

Figure 6A is a perspective view showing the table of the solder paste apparatus of the present invention;

Figure 6B is a partial cross-sectional view of the table of the solder paste apparatus shown in Figure 6A;

Figure 7 is a cross-sectional view showing the solder paste nozzle shown in Figures 2A and 2B assembled in a solder paste can and assembled on a table;

Figure 8A illustrates a cross-sectional view of a solder paste nozzle in accordance with another embodiment of the present disclosure;

Figure 8B is an exploded view of the solder paste nozzle shown in Figure 8A;

8C is a partial enlarged schematic view of the solder paste nozzle shown in FIG. 8A;

Figure 9 is a perspective view of the upper portion of the nozzle of the solder paste nozzle shown in Figures 8A and 8B;

Figure 10A is a perspective view of the lower portion of the nozzle of the solder paste nozzle shown in Figures 8A and 8B;

Figure 10B is a partial cross-sectional view of the lower portion of the nozzle shown in Figure 10A;

Figure 11 is a cross-sectional view showing the solder paste nozzle shown in Figures 8A and 8B assembled in a solder paste can and assembled on a table.

Domestic deposit information (please note according to the order of the depository, date, number)

Foreign deposit information (please note in the order of country, organization, date, number)

Claims (15)

A solder paste nozzle (200, 800), comprising: a nozzle upper portion (210, 810), a nozzle lower portion (230, 830), and an upper portion (210, 810) of the nozzle and a lower portion of the nozzle (230, a film (220, 820) between 830); a solder paste nozzle through hole (280, penetrating the upper portion (210, 810) of the nozzle, the lower portion of the nozzle (230, 830), and the film (220, 820) 880), wherein the solder paste nozzle through holes (280, 880) form a nozzle lower through hole (236, 836) in the nozzle lower portion (230, 830); and a deformation space (219, 819), the deformation A space (219, 819) is disposed between the upper surface of the film (220, 820) and the upper portion (210, 810) of the nozzle and/or the lower surface of the film (220, 820) and the lower portion of the nozzle (230) Between 830); wherein the nozzle lower portion (230, 830) is provided with at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) to enable airflow through at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) ) blowing upward toward the film (220, 820) causing the film (220, 8) 20) deforming upwardly to form an air flow passage between the film (220, 820) and the lower portion of the nozzle (230, 830) such that airflow can enter the nozzle lower through hole (236, via the air flow passage, In 836), the solder paste remaining in the nozzle lower through holes (236, 836) is blown out. A solder paste nozzle according to claim 1, wherein: said at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) has a nozzle air duct outlet (239.1, 239.2; 839.1, 839.2), said nozzle air duct outlet (239) , 239.2; 839.1, 839.2) is disposed on the top surface of the lower portion (230, 830) of the nozzle, the film (220, 820) covering the nozzle air outlet (239.1, 239.2; 839.1, 839.2). A solder paste nozzle according to claim 2, wherein: said deformation space (219) is disposed at a bottom of said nozzle upper portion (210, 810), said deformation space (219) at least partially covering said nozzle air duct outlet ( 239.1, 239.2; 839.1, 839.2). A solder paste nozzle according to claim 2, wherein: said deformation space (819) is disposed at a top of said nozzle lower portion (230, 830), said deformation space (819) and said at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) are connected. A solder paste nozzle according to claim 1, wherein: said nozzle upper portion (210, 810) has a head portion (212, 812) which can be inserted into a solder paste canister filled with solder paste and The solder paste is moved relative to the solder paste can, so that the solder paste can flow out from the solder paste nozzle through holes (280, 880). A solder paste nozzle according to claim 1, wherein: said film (220, 820) is made of a rubber material or other elastic material. A table for a solder paste apparatus, comprising: at least one table air duct (610.1, 610.2), each of the at least one table air duct (610.1, 610.2) including a table duct inlet (608.1, 608.2) And a table air duct outlet (609.1, 609.2) for communicating with a gas source to deliver airflow from the gas source to the table air duct outlet (609.1, 609.2) The table air duct exit (609.1, 609.2) is used to provide airflow to the top of the workbench (600). A workbench according to claim 7, wherein: said work table (600) further comprises an opening (603) for accommodating a lower end of the solder paste nozzle (200, 800) for accommodating Airflow is provided at the nozzle air passages (233.1, 233.2; 833.1, 833.2) of the solder paste nozzles (200, 800) in the table (600). A workbench according to claim 7, wherein: said work table (600) includes an upper surface (641) and a lower surface (642), said table air duct outlet (609.1, 609.2) being disposed on said upper surface (641) on. A workbench according to claim 9, wherein: said worktable air duct (610) includes a first passage portion (625) and a second passage portion (626), said first passage portion (625) being connected to a gas source, said One end of the second passage portion (626) is coupled to the first passage portion (625) and the other end is coupled to the table duct outlet (609.1, 609.2), wherein the second passage portion (626) is configured to The first channel portion (625) is formed to extend upward. A solder paste device characterized by comprising: a solder paste nozzle (200, 800), the solder paste nozzle (200, 800) comprising: a nozzle upper portion (210, 810), a nozzle lower portion (230, 830), and a a film (220, 820) between the upper portion (210, 810) of the nozzle and the lower portion (230, 830) of the nozzle; through the upper portion of the nozzle (210, 810), the lower portion of the nozzle (230, 830), and a solder paste nozzle through hole (280, 880) of the film (220, 820), wherein the solder paste nozzle through hole (280, 880) forms a nozzle lower through hole in the lower portion (230, 830) of the nozzle ( 236, 836); and deformation space (219, 819), the deformation space (219, 819) is disposed between the upper surface of the film (220, 820) and the upper portion of the nozzle (210, 810) and / Or between the lower surface of the film (220, 820) and the lower portion of the nozzle (230, 830); wherein the lower portion (230, 830) of the nozzle is provided with at least one nozzle air passage (233.1, 233.2; 833.1, 833.2), Allowing airflow through at least one nozzle air duct (233.1, 233.2; 833.1, 833.2) Blowing onto the film (220, 820) causes the film (220, 820) to deform upwardly, thereby forming an airflow path between the film (220, 820) and the lower portion of the nozzle (230, 830) ???flowing airflow into the nozzle lower through hole (236, 836) via the air flow passage to blow out the residual solder paste in the nozzle lower through hole (236, 836); and the work table (600), The work table (600) carries the solder paste nozzle (200, 800), the work table (600) includes at least one work surface air duct (610.1, 610.2), the at least one work surface air duct (610.1, 610.2) It is configured to be in fluid communication with the at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) for delivering airflow into the at least one nozzle air passage (233.1, 233.2; 833.1, 833.2). A solder paste apparatus according to claim 11, wherein: said at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) has a nozzle air duct inlet (237.1, located at a bottom surface of said nozzle lower portion (230, 830), 237.2; 837.1, 837.2), the at least one table air duct (610.1, 610.2) has a table duct outlet (609.1, 609.2) located on an upper surface of the table (600), the nozzle duct inlet (237.1 , 237.2; 837.1, 837.2) aligned with the table air duct exit (609.1, 609.2). A solder paste apparatus according to claim 11, wherein: said at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) has a nozzle air duct outlet (239.1, 239.2; 839.1, 839.2), said nozzle air duct outlet ( 239, 239.2; 839.1, 839.2) are disposed on the top surface of the lower portion (230, 830) of the nozzle, the film (220, 820) covering the nozzle air duct outlet (239.1, 239.2; 839.1, 839.2). A solder paste apparatus according to claim 13 wherein: said deformation space (219) is disposed at a bottom of said nozzle upper portion (210, 810), said deformation space (219) at least partially covering said nozzle air duct outlet (239.1, 239.2; 839.1, 839.2). A solder paste nozzle according to claim 13, wherein: said deformation space (819) is disposed at a top of said nozzle lower portion (230, 830), said deformation space (819) and said at least one nozzle air passage (233.1, 233.2; 833.1, 833.2) are connected.