TW201910996A - Input device - Google Patents

Input device Download PDF

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Publication number
TW201910996A
TW201910996A TW107110596A TW107110596A TW201910996A TW 201910996 A TW201910996 A TW 201910996A TW 107110596 A TW107110596 A TW 107110596A TW 107110596 A TW107110596 A TW 107110596A TW 201910996 A TW201910996 A TW 201910996A
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Taiwan
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electrode
connecting portion
input device
substrate
central axis
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TW107110596A
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Chinese (zh)
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TWI661342B (en
Inventor
本幸治
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日商阿爾普士電氣股份有限公司
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

An input device according to the present invention is provided with: a base material; a plurality of first electrodes that extend in a first direction of a detection region of the base material and that are arranged in parallel in a second direction intersecting the first direction; and a plurality of second electrodes that extend in the second direction of the detection region of the base material and that are arranged in parallel in the first direction. In this input device, a first leader line that is provided to one side with respect to the center axis extending in the second direction and a second leader line that is provided to the other side with respect to the center axis are connected to the second electrode which has a portion positioned in a bendable region running through the detection region in the second direction. Thus, accurate position detection can be carried out even when the base material is bent.

Description

輸入裝置Input device

本發明,係有關於輸入裝置,特別是有關於就算是在使基材作了彎折的情況時也能夠正確地進行檢測之輸入裝置。The present invention relates to an input device, and more particularly to an input device that can accurately detect even when a substrate is bent.

在各種資訊處理裝置中,係於彩色液晶顯示面板的前方處配置有透光性之輸入裝置。將此輸入裝置稱作觸控面板。在觸控面板處,係於電極間被形成有靜電電容,並根據當人的手指作了接近時之電荷之移動的變化,來判定手指之接近位置的座標。為了檢測出此電荷之移動的變化,係使用有靜電電容式感測器。In various information processing apparatuses, a translucent input device is disposed in front of the color liquid crystal display panel. This input device is called a touch panel. At the touch panel, an electrostatic capacitance is formed between the electrodes, and the coordinates of the approaching position of the finger are determined according to the change in the movement of the electric charge when the human finger approaches. In order to detect the change in the movement of this charge, an electrostatic capacitance type sensor is used.

近年來,為了與各式各樣的裝置相對應,係並不僅是平面,而亦提案有可作彎折的觸控面板。在專利文獻1~3中,係揭示有具備有彎折區域以及彎折線的輸入裝置。在此些之輸入裝置中,係揭示有在彎折區域處並不設置檢測用之圖案的構成或是將彎折區域之圖案藉由適於進行彎折之材料來構成的構成。In recent years, in order to correspond to a wide variety of devices, it is not only a flat surface, but a touch panel that can be bent is also proposed. Patent Documents 1 to 3 disclose an input device including a bending region and a bending line. In such an input device, a configuration in which a pattern for detection is not provided in a bent region or a configuration in which a pattern of a bent region is made of a material suitable for bending is disclosed.

在專利文獻4、5中,係揭示有下述之內容:亦即是,作為在輸入裝置處之於彎折區域中所包含的檢測用圖案,使用在具有優良彎折性的黏合劑內混合有導電性材料的材料(例如,銀奈米線)。 [先前技術文獻] [專利文獻]In Patent Documents 4 and 5, it is disclosed that the detection pattern included in the bending region at the input device is mixed in an adhesive having excellent bending properties. A material with a conductive material (for example, a silver nanowire). [Prior Technical Literature] [Patent Literature]

[專利文獻1] 美國專利申請公開第2016/0188098號說明書   [專利文獻2] 美國專利申請公開第2013/0300678號說明書   [專利文獻3] 美國專利申請公開第2015/0022732號說明書   [專利文獻4] 日本特開2012-027888號公報   [專利文獻5] 日本特開2014-010516號公報[Patent Document 1] US Patent Application Publication No. 2016/0188098 [Patent Document 2] US Patent Application Publication No. 2013/0300678 [Patent Document 3] US Patent Application Publication No. 2015/0022732 [Patent Document 4] Japanese Patent Publication No. 2012-027888 [Patent Document 5] Japanese Patent Laid-Open Publication No. 2014-010516

[發明所欲解決之課題][Problems to be solved by the invention]

在可彎折的輸入裝置中,雖然亦可考慮在作彎折的部分處設置保護層以使彎折耐性提昇,但是,起因於設置保護層一事,會導致厚度的增加,並且也會成為製造工程之增加和成本上升的原因。又,在使用導電性材料的情況時,相較於透明電極(例如,ITO),在圖案不可視性的惡化、ESD耐性的惡化、遷移(migration)現象上係有著更大的擔憂。In the bendable input device, it is also conceivable to provide a protective layer at the bent portion to improve the bending resistance. However, due to the provision of the protective layer, the thickness is increased and the manufacturing is also made. The increase in engineering and the reasons for rising costs. Moreover, when a conductive material is used, there is a greater concern in terms of deterioration of pattern invisibility, deterioration of ESD resistance, and migration phenomenon than a transparent electrode (for example, ITO).

本發明之目的,係在於提供一種並不追加保護層等地來並不使不可視性惡化地而就算是有所彎折也能夠進行正確之檢測的輸入裝置。 [用以解決課題之手段]An object of the present invention is to provide an input device capable of performing accurate detection without bending a protective layer without adding a protective layer or the like. [Means to solve the problem]

為了解決上述課題,本發明之其中一個態樣之輸入裝置,係具備有:基材;和複數之第1電極,係朝基材之檢測區域的第1方向延伸出去,並被並排設置於與第1方向相交叉之第2方向上;和複數之第2電極,係朝基材之檢測區域的第2方向延伸出去,並被並排設置於第1方向上。   其特徵為:於此輸入裝置中,在具備有位置在將前述檢測區域於第2方向上作貫穿的可彎折區域內之部分的第2電極處,係被連接有相對於在第2方向上延伸的中心軸而被設置在其中一側處之第1導出配線、和相對於中心軸而被設置在另外一側處之第2導出配線。In order to solve the above problems, an input device according to one aspect of the present invention includes: a substrate; and a plurality of first electrodes extending in a first direction of the detection region of the substrate and arranged side by side The second direction in which the first direction intersects; and the plurality of second electrodes extend in the second direction of the detection region of the substrate, and are arranged side by side in the first direction. In the input device, the second electrode having a portion located in the bendable region through which the detection region is inserted in the second direction is connected to the second direction. The first lead-out wiring provided on one side of the central axis extending upward and the second lead-out wiring provided on the other side with respect to the central axis.

若依據此種構成,則就算是在可彎折區域處而基材有所彎折,並對於第2電極之導電性造成有影響,亦能夠藉由第1導出配線以及第2導出配線之至少其中一者來確保第2電極之對於第2方向的導通性。According to this configuration, even if the substrate is bent at the bendable region and has an influence on the conductivity of the second electrode, at least the first lead wiring and the second lead wiring can be used. One of them ensures the conductivity of the second electrode in the second direction.

在上述輸入裝置中,係亦可構成為:第2電極,係具備有在第2方向上被作並排設置之複數之第2電極部、和將相鄰之第2電極部之間作連結之連結部,連結部,係具備有相對於可彎折區域之在第2方向上延伸的中心軸而被設置在其中一側處之第1連結部分、和相對於中心軸而被設置在另外一側處之第2連結部分。In the above input device, the second electrode may be configured to include a plurality of second electrode portions that are arranged side by side in the second direction and a second electrode portion that is adjacent to each other. The connecting portion and the connecting portion are provided with a first connecting portion provided on one side with respect to a central axis extending in the second direction of the bendable region, and are provided on the other side with respect to the central axis The second joint part at the side.

若依據此種構成,則作為被設置在可彎折區域內之連結部,由於係具備有相對於可彎折區域之中心軸而被設置在其中一側處之第1連結部分、和相對於中心軸而被設置在另外一側處之第2連結部分,因此,就算是在沿著中心軸而使基材作了彎折的情況時,連結部也不會受到彎折的影響。例如,就算是第2電極沿著中心軸而彎折並對於導電性造成有影響,亦能夠藉由第1連結部分以及第2連結部分來確保第2電極之對於第2方向的導通性。According to this configuration, the connecting portion provided in the bendable region is provided with the first connecting portion provided at one side with respect to the central axis of the bendable region, and relative to Since the center axis is provided at the second connecting portion on the other side, even when the base material is bent along the central axis, the connecting portion is not affected by the bending. For example, even if the second electrode is bent along the central axis and has an influence on the conductivity, the first connection portion and the second connection portion can ensure the conductivity of the second electrode in the second direction.

在上述輸入裝置中,係亦可構成為:當基材以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,第1連結部分和第2連結部分之間之第1方向之間隔d,係為πφ/2以上。藉由此,就算是基材以曲率半徑(φ/2)而作彎折,第1連結部分以及第2連結部分也不會受到彎折的影響。In the above input device, when the base material is provided so as to be bendable by a radius of curvature (φ/2), between the first connecting portion and the second connecting portion The interval d between the first directions is πφ/2 or more. Thereby, even if the base material is bent by the radius of curvature (φ/2), the first joint portion and the second joint portion are not affected by the bending.

在上述輸入裝置中,係亦可構成為:第1連結部分以及第2連結部分的至少其中一者,係以通過被設置在第1電極處之細縫部的方式而被作設置。藉由此,係能夠將第1連結部分以及第2連結部分的至少其中一者,形成於與第1電極相同層處。In the input device described above, at least one of the first connecting portion and the second connecting portion may be provided so as to pass through the slit portion provided at the first electrode. Thereby, at least one of the first connecting portion and the second connecting portion can be formed in the same layer as the first electrode.

在上述輸入裝置中,係亦可構成為:第1連結部分以及第2連結部分的至少其中一者,係以與第1電極相交叉的方式而被作設置。藉由此,係能夠針對第1連結部分以及第2連結部分的至少其中一者而並不於第1電極處設置細縫部地來作導通。In the above input device, at least one of the first connecting portion and the second connecting portion may be provided so as to intersect the first electrode. Thereby, it is possible to provide conduction to at least one of the first connection portion and the second connection portion without providing a slit portion at the first electrode.

在上述輸入裝置中,係亦可構成為:第2電極,係具備有在第2方向上被作並排設置之複數之第2電極部、和將相鄰之第2電極部之間作連結之連結部,被設置在可彎折區域內之連結部,係被設置在可彎折區域內之全面處。又,當基材以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,連結部之前述第1方向之寬幅,若是為πφ/2以上,則為理想。In the above input device, the second electrode may be configured to include a plurality of second electrode portions that are arranged side by side in the second direction and a second electrode portion that is adjacent to each other. The joint portion is provided at a joint portion in the bendable region, and is disposed at a full extent in the bendable region. Further, when the base material is provided so as to be bendable by a radius of curvature (φ/2), it is preferable that the width of the first direction of the connecting portion is πφ/2 or more. .

若依據此種構成,則由於係在可彎折區域之全面處設置有連結部,因此,就算是在沿著中心軸而使基材作了彎折的情況時,連結部也不會受到彎折的影響。藉由此,就算是在使基材作了彎折的情況時,亦能夠確保經由連結部所致之第2電極之對於第2方向的導通性。According to this configuration, since the connecting portion is provided at the entire area of the bendable region, even when the base material is bent along the central axis, the joint portion is not bent. The impact of the fold. Thereby, even when the base material is bent, the conductivity of the second electrode in the second direction due to the connection portion can be ensured.

在上述輸入裝置中,當基材以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,連結部之第1方向之寬幅,係亦可為πφ/2以上。藉由此,就算是基材以曲率半徑(φ/2)而作彎折,連結部也不會受到彎折的影響。In the above input device, when the base material is provided so as to be bendable by a radius of curvature (φ/2), the width of the first direction of the connecting portion may be πφ/2. the above. Thereby, even if the base material is bent by the radius of curvature (φ/2), the joint portion is not affected by the bending.

在上述輸入裝置中,係亦可構成為:連結部的至少一部分,係以通過被設置在第1電極處之細縫部的方式而被作設置。藉由此,就算是連結部和第1電極相互被設置在相同之層處,也能夠進行對於干涉作了避免的圖案布局。   在上述輸入裝置中,係亦可構成為:連結部的至少一部分,係以與第1電極相交叉的方式而被作設置。藉由此,係能夠避免連結部與第1電極之間之干涉。In the above input device, at least a part of the connecting portion may be provided so as to pass through the slit portion provided at the first electrode. Thereby, even if the joint portion and the first electrode are disposed at the same layer, it is possible to perform pattern layout in which interference is avoided. In the above input device, at least a part of the connection portion may be provided so as to intersect the first electrode. Thereby, interference between the connection portion and the first electrode can be avoided.

在上述輸入裝置中,係亦可構成為:基材,係在可彎折區域之中心軸之位置處而彎折。於此情況下,係亦可構成為:基材,係以曲率半徑0.5mm以下而彎折。藉由此,就算是在沿著中心軸而使基材作了彎折的情況時,亦能夠確保第2電極之對於第2方向的導通性。In the above input device, the base material may be bent at a position of a central axis of the bendable region. In this case, the base material may be bent by a curvature radius of 0.5 mm or less. Thereby, even when the base material is bent along the central axis, the conductivity of the second electrode in the second direction can be ensured.

在上述輸入裝置中,係亦可構成為:第1電極與第2電極,係被配置在基材之同一面側處,第1電極,係具備有在第1方向上被作並排設置之複數之第1電極部、和將在第1電極與第2電極所相交叉的位置處而相鄰之第1電極部之間作連結之架橋連結部。藉由此,相較於在相異之基材的各者處而被設置有第1電極以及第2電極的情況,係能夠謀求層積構造之簡單化。 [發明之效果]In the input device described above, the first electrode and the second electrode may be disposed on the same surface side of the substrate, and the first electrode may be provided in a plurality of rows arranged in the first direction. The first electrode portion and the bridge connecting portion that connects the first electrode portions adjacent to each other at a position intersecting the first electrode and the second electrode. By this, it is possible to simplify the laminated structure as compared with the case where the first electrode and the second electrode are provided in each of the different base materials. [Effects of the Invention]

若依據本發明,則係可提供一種並不追加保護層等地來並不使不可視性惡化地而就算是有所彎折也能夠進行正確之檢測的輸入裝置。According to the present invention, it is possible to provide an input device capable of performing accurate detection even if the bending is not performed without adding a protective layer or the like.

以下,根據圖面,對於本發明之實施形態作說明。另外,在以下之說明中,對於相同之構件,係附加相同之元件符號,針對已作過說明的構件,係適宜省略其說明。Hereinafter, embodiments of the present invention will be described based on the drawings. In the following description, the same components are denoted by the same reference numerals, and the description of the components that have been described is omitted.

(輸入裝置之構成)   [圖1] (a)以及(b),係為對於第1實施形態的輸入裝置作例示之平面圖。在圖1(a)中,係展現有輸入裝置1之全體圖,在圖1(b)中,係展現有圖1(a)之A部分的擴大圖。在本實施形態中,輸入裝置1,例如係為靜電電容式感測器。另外,在本說明書中,所謂「透明」、「透光性」,係指可視光線透射率為50%以上(較理想為80%以上)的狀態。進而,霧值係以6%以下為理想。(Configuration of Input Device) [Fig. 1] (a) and (b) are plan views exemplified for the input device of the first embodiment. In Fig. 1(a), a whole view of the input device 1 is shown, and in Fig. 1(b), an enlarged view of the portion A of Fig. 1(a) is shown. In the present embodiment, the input device 1 is, for example, a capacitive sensor. In the present specification, the term "transparent" or "transparent" refers to a state in which the visible light transmittance is 50% or more (more preferably 80% or more). Further, the haze value is preferably 6% or less.

如同圖1(a)中所示一般,本實施形態之輸入裝置1,係具備有被設置在基材10之位置檢測區域S處的第1電極11和第2電極12。基材10,係藉由聚對苯二甲酸乙二酯(PET)、環烯聚合物(COP)等之薄膜狀的透明基材或玻璃基材等所形成。第1電極11以及第2電極12,係為在位置檢測區域S內而將手指所作了接觸(接近)之位置檢測出來的檢測電極。第1電極11以及第2電極12,係藉由ITO(Indium Tin Oxide)等之透明導電材料,而以濺鍍或蒸鍍等來成膜。第1電極11以及第2電極12,係亦可藉由包含有金屬奈米線(例如,銀奈米線)的材料來形成,亦可部分性地藉由相異之材料來形成。As shown in FIG. 1(a), the input device 1 of the present embodiment includes the first electrode 11 and the second electrode 12 which are provided in the position detecting region S of the substrate 10. The substrate 10 is formed of a film-form transparent substrate such as polyethylene terephthalate (PET) or cycloolefin polymer (COP), or a glass substrate. The first electrode 11 and the second electrode 12 are detection electrodes that are detected in the position detection region S and that are in contact (close) with the finger. The first electrode 11 and the second electrode 12 are formed by sputtering or vapor deposition using a transparent conductive material such as ITO (Indium Tin Oxide). The first electrode 11 and the second electrode 12 may be formed of a material containing a metal nanowire (for example, a silver nanowire), or may be partially formed of a different material.

第1電極11,係在沿著基材10之表面的X(第1方向)上而延伸存在,第2電極12,係在沿著基材10之表面的與X方向正交之Y方向(第2方向)上而延伸存在。第1電極11以及第2電極12,係相互被絕緣。在本實施形態中,係於Y方向上以特定之節距而被配置有複數之第1電極11,並於X方向上以特定之節距而被配置有複數之第2電極12。The first electrode 11 extends in the X (first direction) along the surface of the substrate 10, and the second electrode 12 is in the Y direction orthogonal to the X direction along the surface of the substrate 10 ( The second direction) extends over. The first electrode 11 and the second electrode 12 are insulated from each other. In the present embodiment, a plurality of first electrodes 11 are arranged at a specific pitch in the Y direction, and a plurality of second electrodes 12 are arranged at a specific pitch in the X direction.

第1電極11,係具備有複數之第1島狀電極部111。在本實施形態中,複數之第1島狀電極部111係具備有近似於菱形之形狀,並在X方向上並排地而被作配置。又,第2電極12,係具備有複數之第2島狀電極部121。複數之第2島狀電極部121,亦係具備有近似於菱形之形狀,並在Y方向上並排地而被作配置。The first electrode 11 is provided with a plurality of first island-shaped electrode portions 111. In the present embodiment, the plurality of first island-shaped electrode portions 111 are provided in a shape similar to a rhombic shape, and are arranged side by side in the X direction. Further, the second electrode 12 is provided with a plurality of second island-shaped electrode portions 121. The plurality of second island-shaped electrode portions 121 are also provided in a shape similar to a rhombus, and are arranged side by side in the Y direction.

在複數之第1電極11之各者處,係分別被連接有被朝向位置檢測區域S之外側而導出的導出配線TX。又,在複數之第2電極12之各者處,亦係分別被連接有被朝向位置檢測區域S之外側而導出的導出配線TY。在輸入裝置1處,係將在各導出配線TX以及TY處所流動的電流之變化,藉由未圖示之檢測電路而檢測出來。例如,在對於第1電極11以及第2電極12賦予有特定之電位的狀態下,若是使手指接近位置檢測區域S,則在第1電極11以及第2電極12之各者與手指之間,係產生有靜電電容之變化。藉由將起因於此靜電電容之變化所產生的電位降低檢測出來,而判定手指所作了接近的位置檢測區域S內之X、Y座標。Each of the plurality of first electrodes 11 is connected to a lead-out wiring TX that is led out toward the outside of the position detecting region S. Further, in each of the plurality of second electrodes 12, the lead wires TY led out toward the outside of the position detecting region S are connected to each other. At the input device 1, the change in the current flowing through each of the lead wires TX and TY is detected by a detecting circuit (not shown). For example, when a specific potential is applied to the first electrode 11 and the second electrode 12, if the finger is brought close to the position detecting region S, between the first electrode 11 and the second electrode 12 and the finger, There is a change in electrostatic capacitance. The X and Y coordinates in the position detecting region S in which the finger is approached are determined by detecting the potential drop due to the change in the electrostatic capacitance.

如同圖1(b)中所示一般,第1電極11和第2電極12,係於相鄰之2個的第1島狀電極部111之連結位置和相鄰之2個的第2島狀電極部121之連結位置處,而相互交叉。在此交叉部分處,係隔著島狀絕緣部30而被設置有架橋配線部20,在交叉部分處,第1電極11和第2電極12係成為並不會相互接觸。As shown in FIG. 1(b), the first electrode 11 and the second electrode 12 are connected to the adjacent first island-shaped electrode portions 111 and two adjacent islands. The electrode portions 121 are connected to each other at the joint position. At the intersection, the bridge wiring portion 20 is provided via the island-shaped insulating portion 30, and the first electrode 11 and the second electrode 12 are not in contact with each other at the intersection portion.

在本實施形態中,架橋配線部20,係以橫跨相鄰之2個的第1島狀電極部111之間的方式而被作設置。架橋配線部20,係被設置在於X方向上而並排的各第1島狀電極部111之間。藉由此,複數之第1島狀電極部111係成為導通狀態。島狀絕緣部30,係被設置在架橋配線部20與於後所說明的連結部40之間,並在交叉部分處發揮將第1電極11和第2電極12絕緣的功能。In the present embodiment, the bridge wiring portion 20 is provided so as to extend between the adjacent two island-shaped electrode portions 111. The bridge wiring portion 20 is provided between the first island-shaped electrode portions 111 which are arranged side by side in the X direction. Thereby, the plurality of first island-shaped electrode portions 111 are in an on state. The island-shaped insulating portion 30 is provided between the bridge wiring portion 20 and the connecting portion 40 described later, and functions to insulate the first electrode 11 and the second electrode 12 at the intersection portion.

在第2電極12處的相鄰之2個的第2島狀電極部121之間,係被設置有連結部40。連結部40,係被設置在於Y方向上而並排的各第2島狀電極部121之間。藉由此,複數之第2島狀電極部121係成為導通狀態。如同前述一般,架橋配線部20,係在此連結部40之上,隔著島狀絕緣部30而被作設置。The connection portion 40 is provided between the adjacent two island-shaped electrode portions 121 at the second electrode 12. The connection portion 40 is provided between the second island-shaped electrode portions 121 that are arranged side by side in the Y direction. Thereby, the plurality of second island-shaped electrode portions 121 are in an on state. As described above, the bridge wiring portion 20 is provided on the connecting portion 40 via the island-shaped insulating portion 30.

在基材10之位置檢測區域S處,係被設置有於Y方向上而貫穿之可彎折區域BR。於此,所謂的可彎折區域BR,係指在將基材10彎折並作使用時(例如,參考圖5),於包含有彎折中心線(後述之中心軸BL)的區域中而基材10成為圓弧(例如,半圓)形狀的區域。係亦可將基材10成為圓弧形狀之區域的一部分,作為可彎折區域BR。At the position detecting area S of the substrate 10, a bendable area BR penetrating therethrough in the Y direction is provided. Here, the bendable region BR means that when the base material 10 is bent and used (for example, refer to FIG. 5), it is included in a region including a bending center line (a center axis BL to be described later). The substrate 10 is a region of an arc shape (for example, a semicircle). The base material 10 may also be a part of a circular arc shape as a bendable region BR.

在可彎折區域BR之中心處,係被設置有於Y方向上延伸的中心軸BL。另外,可彎折區域BR和中心軸BL,係為為了方便作說明所定義者。At the center of the bendable region BR, a central axis BL extending in the Y direction is provided. In addition, the bendable region BR and the central axis BL are defined for convenience of explanation.

圖2,係為對於電極圖案作例示之示意圖。   在圖2中,為了使說明容易理解,係將各圖案相較於實際情況而更大地作展示。   圖3,係為對於本實施形態的輸入裝置作例示之示意剖面圖。在圖3中,係展示有圖2中所示之A-A線剖面圖。Fig. 2 is a schematic view showing an example of an electrode pattern. In Fig. 2, in order to make the description easy to understand, each pattern is more displayed than the actual situation. Fig. 3 is a schematic cross-sectional view showing an input device of the embodiment. In Fig. 3, a cross-sectional view taken along line A-A shown in Fig. 2 is shown.

第1電極11以及第2電極12,係被形成在身為基材10之其中一例的由PET或COP所致之透光性基材51之上。在第1電極11以及第2電極12之上,係隔著透光性黏著材53而被安裝有透光性覆蓋薄膜55。在透光性覆蓋薄膜55處,例如係使用有PC。具備有此種層構造之輸入裝置1,例如係在有機EL或液晶等之顯示裝置300之上,隔著透光性黏著材56而被作安裝。The first electrode 11 and the second electrode 12 are formed on the light-transmitting substrate 51 made of PET or COP which is one example of the substrate 10 . On the first electrode 11 and the second electrode 12, a light-transmitting cover film 55 is attached via the light-transmitting adhesive 53. At the light-transmitting cover film 55, for example, a PC is used. The input device 1 having such a layer structure is mounted on a display device 300 such as an organic EL or a liquid crystal, and is attached via a translucent adhesive 56.

在可彎折區域BR處,構成第2電極12之複數之第2島狀電極部121,係於Y方向上而被作並排。又,在可彎折區域BR中,於第1電極11處,係被設置有細縫部SL1、SL2。細縫部SL1,係以於Y方向上貫穿第1電極11的方式,而被設置在中心軸BL之其中一側處,細縫部SL2,係以於Y方向上貫穿第1電極11的方式,而被設置在中心軸BL之另外一側處。In the bendable region BR, the plurality of second island-shaped electrode portions 121 constituting the second electrode 12 are arranged side by side in the Y direction. Further, in the bendable region BR, the slit portions SL1, SL2 are provided at the first electrode 11. The slit portion SL1 is provided on one side of the central axis BL so as to penetrate the first electrode 11 in the Y direction, and the slit portion SL2 penetrates the first electrode 11 in the Y direction. It is disposed at the other side of the center axis BL.

被設置在可彎折區域BR處之連結部40,係具備有第1連結部分41和第2連結部分42。第1連結部分41,係沿著被設置在中心軸BL之其中一側處的細縫部SL1而被作設置。第1連結部分41,係以將於Y方向上而相鄰之2個的第2島狀電極部121作連接的方式,而被作設置。第1連結部分41,係並未與第1電極11(第1島狀電極部111)作導通。The connecting portion 40 provided in the bendable region BR is provided with a first connecting portion 41 and a second connecting portion 42. The first joint portion 41 is provided along the slit portion SL1 provided at one side of the center axis BL. The first connecting portion 41 is provided in such a manner that two second island-shaped electrode portions 121 adjacent to each other in the Y direction are connected. The first connecting portion 41 is not electrically connected to the first electrode 11 (the first island-shaped electrode portion 111).

第2連結部分42,係沿著被設置在中心軸BL之另外一側處的細縫部SL2而被作設置。第2連結部分42,係以將於Y方向上而相鄰之2個的第2島狀電極部121作連接的方式,而被作設置。第2連結部分42,係並未與第1電極11(第1島狀電極部111)作導通。The second joint portion 42 is provided along the slit portion SL2 provided at the other side of the center axis BL. The second connecting portion 42 is provided in such a manner that two second island-shaped electrode portions 121 adjacent to each other in the Y direction are connected. The second connecting portion 42 is not electrically connected to the first electrode 11 (the first island-shaped electrode portion 111).

在可彎折區域BR處,於中心軸BL上係並未被設置有連結部40,並隔著中心軸BL,而於其中一側處被設置有第1連結部分41,並於另外一側處被設置有第2連結部分42。亦即是,在可彎折區域BR處,藉由位在從中心軸BL而離開了的位置處之第1連結部分41以及第2連結部分42,於Y方向上而並排的複數之第2島狀電極部121係成為導通狀態。In the bendable region BR, the joint portion 40 is not provided on the center axis BL, and the first joint portion 41 is provided at one side thereof via the center shaft BL, and is disposed on the other side. The second connecting portion 42 is provided at the place. In other words, in the bendable region BR, the first connecting portion 41 and the second connecting portion 42 which are located at positions apart from the central axis BL are plural in the Y direction. The island-shaped electrode portion 121 is in an on state.

藉由此,就算是在沿著中心軸BL而使基材10作了彎折的情況時,連結部40也不會受到彎折的影響。另一方面,在可彎折區域BR處,藉由第1連結部分41以及第2連結部分42,第2電極12之對於Y方向的導通性係被保持。例如,就算是第2電極12沿著中心軸BL而彎折並對於導電性造成有影響,亦能夠藉由第1連結部分41以及第2連結部分42來確保第2電極12之對於Y方向的導通性。Thereby, even when the base material 10 is bent along the central axis BL, the joint portion 40 is not affected by the bending. On the other hand, in the bendable region BR, the conductivity of the second electrode 12 in the Y direction is maintained by the first connecting portion 41 and the second connecting portion 42. For example, even if the second electrode 12 is bent along the central axis BL and has an influence on the conductivity, the first connecting portion 41 and the second connecting portion 42 can ensure the second electrode 12 in the Y direction. Continuity.

於此,當基材10以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,第1連結部分41和第2連結部分42之間之X方向之間隔d,較理想,係為πφ/2以上(φ為直徑)。藉由此,就算是基材10在中心軸BL之位置處以曲率半徑(φ/2)而作彎折,第1連結部分41以及第2連結部分42也不會位置在起因於基材10作了彎折一事所導致的彎折部分處,而不會受到彎折的影響。Here, when the base material 10 is provided so as to be bendable by a radius of curvature (φ/2), the interval between the first connecting portion 41 and the second connecting portion 42 in the X direction is d. Preferably, it is πφ/2 or more (φ is a diameter). Thereby, even if the base material 10 is bent at a position of the central axis BL by a radius of curvature (φ/2), the first connecting portion 41 and the second connecting portion 42 are not positioned at the substrate 10 The bent portion caused by the bending is not affected by the bending.

如此這般,由於第1連結部分41以及第2連結部分42係難以受到基材10之彎折的影響,因此,就算是使基材10以曲率半徑(φ/2)=0.5mm以下而彎折,也能夠確保在可彎折區域BR處之第2電極12的導通性。In this manner, the first connecting portion 41 and the second connecting portion 42 are less likely to be affected by the bending of the base material 10, and therefore the base material 10 is bent at a radius of curvature (φ/2) = 0.5 mm or less. The folding can also ensure the conductivity of the second electrode 12 at the bendable region BR.

在本實施形態中,藉由細縫部SL1、SL2,在X方向上延伸的第1電極11係被作分斷。故而,在可彎折區域BR之其中一側的第1電極11處,係被連接有導出配線TX1,在可彎折區域BR之另外一側的第1電極11處,係被連接有導出配線TX2。在未圖示之檢測電路處,係進行將基於互為同列之導出配線TX1以及TX2之訊號所得到的電容作加算之演算。藉由此,就算是第1電極11被作分斷,也能夠將作為在X方向上延伸之1個的第1電極11之電容變化檢測出來。In the present embodiment, the first electrode 11 extending in the X direction is divided by the slit portions SL1 and SL2. Therefore, the lead-out wiring TX1 is connected to the first electrode 11 on one side of the bendable region BR, and the lead-out wiring is connected to the other electrode 11 on the other side of the bendable region BR. TX2. At the detection circuit (not shown), the calculation is performed by adding the capacitances obtained based on the signals of the derived wirings TX1 and TX2 which are mutually identical. Thereby, even if the first electrode 11 is divided, the capacitance change of the first electrode 11 which is one in the X direction can be detected.

在可彎折區域BR以外之中心軸BL之其中一側的第2電極12處,係被連接有導出配線TY1,在中心軸BL之另外一側的第2電極處,係被連接有導出配線TY2。另一方面,在可彎折區域BR之第2電極12處,係於中心軸BL之其中一側處被連接有第1導出配線TY11,並於中心軸BL之另外一側處被連接有第2導出配線TY21。藉由此,就算是起因於基材10之彎折而可彎折區域BR之第2電極12被中心軸BL所分斷,藉由進行將基於第1導出配線TY11以及第2導出配線TY12之訊號所得到的電容作加算之演算,也能夠將作為在Y方向上延伸之1個的第2電極12之電容變化檢測出來。另外,係只要使第1導出配線TY11以及第2導出配線TY21中之至少一者於可彎折區域BR以外處被作連接即可,較理想,係只要使雙方均於可彎折區域BR以外被作連接即可。The second electrode 12 on one side of the central axis BL other than the bendable region BR is connected to the lead-out wiring TY1, and the second electrode on the other side of the central axis BL is connected to the lead-out wiring. TY2. On the other hand, in the second electrode 12 of the bendable region BR, the first lead-out wiring TY11 is connected to one side of the central axis BL, and the other side is connected to the other side of the central axis BL. 2 Export wiring TY21. As a result, even if the second electrode 12 of the bendable region BR is broken by the central axis BL due to the bending of the substrate 10, the first lead-out wiring TY11 and the second lead-out wiring TY12 are formed. The calculation of the capacitance obtained by the signal can also detect the change in capacitance of the second electrode 12 which is one extending in the Y direction. In addition, it is preferable that at least one of the first lead-out wiring TY11 and the second lead-out wiring TY21 is connected to the bendable region BR, and it is preferable that both of them are outside the bendable region BR. It can be connected.

圖4,係為對於導出配線之布局例作展示之示意圖。   在圖4中,為了使說明容易理解,係將各圖案相較於實際情況而更大地作展示。   在基材10上之周緣部分處,係被導出有導出配線TX1、TX2、TY1、TY2、第1導出配線TY11、第2導出配線TY21。此些之導出配線,係被集中於基材10之其中一端側處,並被與可撓性基板100之各圖案作連接。可撓性基板100之連接位置,係成為基材10之可彎折區域BR以外的周緣部分。藉由此,就算是基材10在可彎折區域BR之中心軸BL處而彎折,與可撓性基板100之間之連接位置(連接墊片部)也不會受到彎折的影響。Fig. 4 is a schematic view showing an example of the layout of the lead wiring. In Fig. 4, in order to make the description easy to understand, each pattern is displayed more than the actual situation. The lead-out wirings TX1, TX2, TY1, TY2, the first lead-out wiring TY11, and the second lead-out wiring TY21 are led out at the peripheral portion of the substrate 10. The lead wires are concentrated on one end side of the substrate 10 and connected to the respective patterns of the flexible substrate 100. The connection position of the flexible substrate 100 is a peripheral portion other than the bendable region BR of the substrate 10. Thereby, even if the base material 10 is bent at the central axis BL of the bendable region BR, the connection position (connection pad portion) with the flexible substrate 100 is not affected by the bending.

又,在本實施形態中,係將可撓性基板100連接於基材10之其中一端側處。亦即是,第2電極12之導出配線TY1、TY2、第1導出配線TY11以及第2導出配線TY21,係僅被導出至基材10之其中一端側處。又,第1電極11之導出配線TX1以及TX2,係從兩側而被導出至基材10之其中一端側處。藉由此,係能夠將可撓性基板100連接於基材10之其中一端側(其中一邊)處。Further, in the present embodiment, the flexible substrate 100 is connected to one end side of the substrate 10. In other words, the lead wires TY1, TY2, the first lead wires TY11, and the second lead wires TY21 of the second electrode 12 are led out only to one end side of the substrate 10. Further, the lead wires TX1 and TX2 of the first electrode 11 are led out from both sides to one end side of the substrate 10. Thereby, the flexible substrate 100 can be attached to one end side (one side) of the substrate 10.

(彎折狀態)   圖5~圖7,係為對於使基材作了彎折的狀態作例示之示意立體圖。   在圖5中,係對於使使用有本實施形態的輸入裝置1之基材作了彎折的狀態作展示,在圖6以及圖7中,係對於使使用有比較例之輸入裝置2以及3之基材作了彎折的狀態作展示。   不論是在何者之例中,均同樣的,係對於使基材10在可彎折區域BR之中心軸BL處作180度彎折的狀態作展示。輸入裝置1、2以及3,係被配置在作了彎折的基材10之外側處。(Bending state) FIGS. 5 to 7 are schematic perspective views illustrating a state in which the base material is bent. In Fig. 5, a state in which the base material using the input device 1 of the present embodiment is bent is shown. In Figs. 6 and 7, the input devices 2 and 3 using the comparative example are used. The substrate is shown in a bent state. In any of the examples, the same is true for the state in which the substrate 10 is bent at 180 degrees at the central axis BL of the bendable region BR. The input devices 1, 2, and 3 are disposed at the outer side of the bent substrate 10.

如同圖5中所示一般,在使使用有本實施形態之輸入裝置1之基材10作了彎折的情況時,沿著可彎折區域BR之中心軸BL,係並未被設置有連結部40,而於中心軸BL之其中一側處被設置有第1連結部分41,並於另外一側處被設置有第2連結部分42。亦即是,在可彎折區域BR處,第2電極12,係藉由被設置在從中心軸BL而離開了的位置處之第1連結部分41以及第2連結部分42,而被作導通。As shown in Fig. 5, when the base material 10 using the input device 1 of the present embodiment is bent, the central axis BL of the bendable region BR is not provided with a link. In the portion 40, the first connecting portion 41 is provided on one side of the central axis BL, and the second connecting portion 42 is provided on the other side. In other words, in the bendable region BR, the second electrode 12 is turned on by the first connecting portion 41 and the second connecting portion 42 which are provided at positions apart from the central axis BL. .

於此,就算是在藉由基材10之彎折而以中心軸BL來使第2電極12作了分斷的情況時,亦同樣的,被作了分斷的其中一側,係能夠藉由第1連結部分41來維持導通狀態,被作了分斷的另外一側,係能夠藉由第2連結部分42來維持導通狀態。第2電極12之被作了分斷的其中一側,係經由第1連結部分41而與第1導出配線TY11作導通,另外一側,係經由第2連結部分42而與第2導出配線TY21作導通。故而,若是進行將基於第1導出配線TY11以及第2導出配線TY12之訊號所得到的電容作加算之演算,則係能夠將被中心軸BL所分斷的第2電極12之電容變化,作為1個的第2電極12之電容變化而檢測出來。Here, even when the second electrode 12 is divided by the central axis BL by the bending of the substrate 10, the same side can be borrowed. The conduction state is maintained by the first connection portion 41, and the other side is divided, and the conduction state can be maintained by the second connection portion 42. One of the second electrodes 12 that is divided is electrically connected to the first lead-out wiring TY11 via the first connecting portion 41, and the second lead-out wiring TY21 is connected to the second lead-out wiring 42 via the second connecting portion 42. Conduction. Therefore, if the calculation is performed by adding the capacitance obtained based on the signals of the first lead-out wiring TY11 and the second lead-out wiring TY12, the capacitance of the second electrode 12 divided by the central axis BL can be changed as 1 The capacitance of the second electrode 12 is detected and detected.

在使基材10作了彎折時的可彎折區域BR,係成為電子機器之邊緣部分。藉由使用本實施形態之輸入裝置1,就算是在電子機器之邊緣部分處,也能夠將由第2電極12所致之電容變化正確地檢測出來。故而,係能夠以良好精確度來進行在電子機器之邊緣部分處的觸碰動作。The bendable region BR when the substrate 10 is bent is the edge portion of the electronic device. By using the input device 1 of the present embodiment, the change in capacitance caused by the second electrode 12 can be accurately detected even at the edge portion of the electronic device. Therefore, the touch action at the edge portion of the electronic device can be performed with good precision.

如同圖6中所示一般,在使使用有比較例(其之1)之輸入裝置2的基材10作了彎折的情況時,位置在中心軸BL上之第2電極12,係由複數之第2島狀電極部121和位置在相鄰之第2島狀電極部121之間之連結部40所成,連結部40,係以位置在當彎折時會施加有最大的拉張力之中心軸BL上的方式而被作配置。而,被與此第2電極12作連接的導出配線,係為1個。因此,只要起因於彎折而在中心軸BL上之複數之連結部40中的1個發生斷線,則位置在中心軸BL上之第2電極12的導通性便會喪失。其結果,係成為無法適當地進行關連於第2電極12之位置檢測。如此這般,在圖6中所示之輸入裝置2中,於可彎折區域BR處之位置偵測的精確度係容易降低。As shown in FIG. 6, in the case where the substrate 10 using the input device 2 of the comparative example (No. 1) is bent, the second electrode 12 positioned on the central axis BL is plural The second island-shaped electrode portion 121 is formed by the connecting portion 40 between the adjacent second island-shaped electrode portions 121, and the connecting portion 40 is positioned to have the maximum tensile force when bent. The configuration on the central axis BL is configured. Further, one lead-out wiring to be connected to the second electrode 12 is one. Therefore, as long as one of the plurality of connecting portions 40 on the central axis BL is broken due to the bending, the conductivity of the second electrode 12 positioned on the central axis BL is lost. As a result, the position detection related to the second electrode 12 cannot be appropriately performed. As such, in the input device 2 shown in Fig. 6, the accuracy of the position detection at the bendable region BR is easily lowered.

如同圖7中所示一般,在比較例(其之2)之輸入裝置3中,係沿著在可彎折區域BR處之中心軸BL而被設置有細縫部SL,沿著此細縫部SL,第2電極12之第2島狀電極部121係被分斷。在使此基材10作了彎折的情況時,由於在中心軸BL上係並未被設置有圖案,因此第1電極11和第2電極12係並不會有起因於彎折而直接受到影響的情形。As shown in FIG. 7, in the input device 3 of the comparative example (No. 2), a slit portion SL is provided along the center axis BL at the bendable region BR, along which the slit portion SL is provided. The second island-shaped electrode portion 121 of the second electrode 12 is divided. When the base material 10 is bent, since the pattern is not provided on the central axis BL, the first electrode 11 and the second electrode 12 are not directly affected by the bending. The situation of influence.

但是,由於藉由細縫部SL,第2電極12係被作分斷,因此,在可彎折區域BR處,係並無法進行在第2電極12處之位置檢測。故而,在使用有此輸入裝置3之電子機器中,係並無法進行在作了彎折時的於邊緣部處之位置檢測。However, since the second electrode 12 is divided by the slit portion SL, the position detection at the second electrode 12 cannot be performed in the bendable region BR. Therefore, in the electronic device using the input device 3, the position detection at the edge portion when the bending is performed cannot be performed.

如此這般,藉由使用本實施形態之輸入裝置1,係成為能夠並不在可彎折區域BR處設置複雜之圖案構造地而以良好精確度來進行在彎折部分處之位置檢測。又,由於就算是在可彎折區域BR處而第2電極12受到彎折的影響,也能夠作為檢測電極來利用,因此,係能夠正確地進行電子機器之在邊緣部分處的位置檢測。又,由於就算是在可彎折區域BR處,也能夠選擇ITO等之不會對於不可視性有所犧牲的電極材料,因此係能夠維持在可彎折區域BR處之不可視性。As described above, by using the input device 1 of the present embodiment, it is possible to perform position detection at the bent portion with good precision without providing a complicated pattern structure at the bendable region BR. Moreover, even if the second electrode 12 is affected by the bending in the bendable region BR, it can be used as the detecting electrode. Therefore, the position detection of the electronic device at the edge portion can be accurately performed. Further, even in the bendable region BR, it is possible to select an electrode material such as ITO which does not sacrifice the invisibility, and therefore it is possible to maintain the invisibility in the bendable region BR.

(其他構成例)   圖8~圖14,係為針對其他構成例作展示之示意圖。   圖8中所示之其他構成例(其之1)之輸入裝置1B,係為使第1連結部分41以及第2連結部分42成為架橋構造之例。   另外,在圖8所示之例中,第1連結部分41以及第2連結部分42之雙方係均成為架橋構造,但是,係亦可僅為其中一者。   藉由使第1連結部分41以及第2連結部分42成為架橋構造,係能夠針對第1連結部分41以及第2連結部分42而並不於第1電極11處設置細縫部SL1、SL2地來將於Y方向上相鄰之2個的第2島狀電極部121作導通。(Other Configuration Examples) FIGS. 8 to 14 are schematic views showing other configuration examples. The input device 1B of the other configuration example (the first one) shown in FIG. 8 is an example in which the first connection portion 41 and the second connection portion 42 have a bridge structure. Further, in the example shown in FIG. 8, both of the first connecting portion 41 and the second connecting portion 42 have a bridging structure, but they may be only one of them. By making the first connecting portion 41 and the second connecting portion 42 into a bridging structure, it is possible to provide the slit portions SL1 and SL2 to the first connecting portion 41 and the second connecting portion 42 without providing the slit portions SL1 and SL2. The second island-shaped electrode portions 121 adjacent to each other in the Y direction are electrically connected.

圖9中所示之其他構成例(其之2)之輸入裝置1C,係除了圖1以及圖2中所示之輸入裝置1之構成之外,更進而亦在可彎折區域BR處設置有架橋配線部20。另外,設置在可彎折區域BR處之架橋配線部20,由於係容易受到彎折的影響,因此,較理想,係預先設為較被設置在可彎折區域BR以外處的架橋配線部20而更粗。The input device 1C of the other configuration example (the second one) shown in FIG. 9 is provided in addition to the configuration of the input device 1 shown in FIGS. 1 and 2, and further in the bendable region BR. The bridge wiring portion 20. In addition, since the bridge wiring portion 20 provided in the bendable region BR is easily affected by the bending, it is preferable to set the bridge wiring portion 20 to be disposed outside the bendable region BR in advance. And thicker.

藉由如此這般地而在可彎折區域BR處設置架橋配線部20,係能夠並不將同列之第1電極11作分斷地而確保對於X方向之導通性。By providing the bridge wiring portion 20 in the bendable region BR as described above, it is possible to ensure the continuity in the X direction without dividing the first electrode 11 in the same row.

圖10中所示之其他構成例(其之3)之輸入裝置1D,係在可彎折區域BR之全面處設置有連結部45。亦即是,連結部45,係設置為橫跨中心軸BL來以可彎折區域BR之寬幅而於Y方向上延伸。連結部45,係被設置在於Y方向上而相鄰之2個的第2島狀電極部121之間。The input device 1D of the other configuration example (No. 3) shown in Fig. 10 is provided with a joint portion 45 at the entire periphery of the bendable region BR. That is, the connecting portion 45 is provided to extend in the Y direction with the width of the bendable region BR across the central axis BL. The connection portion 45 is provided between the adjacent two island-shaped electrode portions 121 in the Y direction.

若依據此種輸入裝置1D,則就算是在以中心軸BL來使第2電極12作了分斷的情況時,亦同樣的,被作了分斷的其中一側,係能夠藉由被作了分斷的連結部45來維持導通狀態,另外一側,係能夠藉由被作了分斷的連結部45來維持導通狀態。第2電極12之被作了分斷的其中一側,係經由被作了分斷的連結部45而與第1導出配線TY11作導通,另外一側,係經由被作了分斷的連結部45而與第2導出配線TY21作導通。故而,若是進行將基於第1導出配線TY11以及第2導出配線TY12之訊號所得到的電容作加算之演算,則係能夠將被中心軸BL所分斷的第2電極12之電容變化,作為1個的第2電極12之電容變化而檢測出來。藉由此,就算是在沿著中心軸BL而使基材10作了彎折的情況時,在寬幅為廣之連結部45也成為難以受到彎折的影響。藉由此,就算是在使基材10作了彎折的情況時,亦能夠確保經由連結部45所致之第2電極12之對於Y方向的導通性。According to the input device 1D, even when the second electrode 12 is divided by the central axis BL, the same side can be divided. The disconnected connecting portion 45 maintains the conductive state, and the other side can maintain the conductive state by the disconnected connecting portion 45. One of the second electrode 12 that has been divided is electrically connected to the first lead-out wiring TY11 via the disconnected connecting portion 45, and the other side is connected via the disconnected portion. 45 is electrically connected to the second lead-out wiring TY21. Therefore, if the calculation is performed by adding the capacitance obtained based on the signals of the first lead-out wiring TY11 and the second lead-out wiring TY12, the capacitance of the second electrode 12 divided by the central axis BL can be changed as 1 The capacitance of the second electrode 12 is detected and detected. As a result, even when the base material 10 is bent along the central axis BL, the joint portion 45 having a wide width is hardly affected by the bending. Thereby, even when the base material 10 is bent, the conductivity of the second electrode 12 via the connection portion 45 in the Y direction can be ensured.

圖11中所示之其他構成例(其之4)之輸入裝置1E,係具備有被設置在基材10之位置檢測區域S處的複數之第1電極11、和被設置在基材10之位置檢測區域S處的複數之第2電極12。另外,在圖10中,為了方便說明,係將第1電極11以虛線作標示。複數之第1電極11的各者,係分別朝X方向延伸出去,並在Y方向上被作並排設置。又,複數之第2電極12的各者,係分別朝Y方向延伸出去,並在X方向上被作並排設置。亦即是,複數之第1電極11和複數之第2電極12,係以相互交叉的方式而被作配置。The input device 1E of the other configuration example (the fourth item) shown in FIG. 11 is provided with a plurality of first electrodes 11 provided at the position detecting region S of the substrate 10, and is provided on the substrate 10. A plurality of second electrodes 12 at the position detecting region S. In addition, in FIG. 10, for convenience of description, the first electrode 11 is indicated by a broken line. Each of the plurality of first electrodes 11 extends in the X direction and is arranged side by side in the Y direction. Further, each of the plurality of second electrodes 12 is extended in the Y direction and arranged side by side in the X direction. In other words, the plurality of first electrodes 11 and the plurality of second electrodes 12 are arranged to intersect each other.

當在基材10之其中一側處被設置有複數之第1電極11以及複數之第2電極12的情況時,在第1電極11與第2電極12之間之交叉位置處,係被設置有絕緣層(未圖示),在兩者間係被構成有靜電電容。又,係亦可在基材10之其中一面側處被設置有複數之第1電極11,並在基材10之另外一面側處被設置有複數之第2電極12。於此情況,在第1電極11與第2電極12之間之交叉位置處,係中介存在有基材10並構成靜電電容。又,係亦可具備有2個的基材10,並在其中一方之基材10處被設置有第1電極11,並在另外一方之基材10處被設置有第2電極12。於此情況,亦同樣的,在第1電極11與第2電極12之間之交叉位置處,係至少中介存在有1枚的基材10或者是如同光學黏著層一般之介電質層並構成靜電電容。When a plurality of first electrodes 11 and a plurality of second electrodes 12 are provided on one side of the substrate 10, the intersection between the first electrode 11 and the second electrode 12 is set. There is an insulating layer (not shown), and an electrostatic capacitance is formed between the two. Further, a plurality of first electrodes 11 may be provided on one side of the substrate 10, and a plurality of second electrodes 12 may be provided on the other side of the substrate 10. In this case, the substrate 10 is interposed at the intersection between the first electrode 11 and the second electrode 12 to constitute a capacitance. Further, two base materials 10 may be provided, and the first electrode 11 may be provided on one of the base materials 10, and the second electrode 12 may be provided on the other base material 10. In this case as well, at the intersection between the first electrode 11 and the second electrode 12, at least one substrate 10 or a dielectric layer like an optical adhesive layer is interposed. Electrostatic capacitance.

在輸入裝置1E處,於基材10之可彎折區域BR內,係被設置有第2電極12,於此第2電極12處,係被連接有第1導出配線TY11和第2導出配線TY21。第1導出配線TY11,係相對於可彎折區域BR之中心軸BL而被設置在其中一側處,第2導出配線TY21,係相對於中心軸BL而被設置在另外一側處。In the input device 1E, the second electrode 12 is provided in the bendable region BR of the substrate 10, and the first lead wiring TY11 and the second lead wiring TY21 are connected to the second electrode 12 . The first lead-out wiring TY11 is provided on one side with respect to the central axis BL of the bendable region BR, and the second lead-out wiring TY21 is provided on the other side with respect to the central axis BL.

若依據此種輸入裝置1E,則就算是在以中心軸BL來使第2電極12作了分斷的情況時,亦同樣的,被作了分斷的其中一側,係能夠藉由第1導出配線TY11來維持導通狀態,另外一側,係能夠藉由第2導出配線TY21來維持導通狀態。故而,若是進行將基於第1導出配線TY11以及第2導出配線TY12之訊號所得到的電容作加算之演算,則係能夠將被中心軸BL所分斷的第2電極12之電容變化,作為1個的第2電極12之電容變化而檢測出來。藉由此,就算是在沿著中心軸BL而使基材10作了彎折的情況時,可彎折區域BR之第2電極12也成為難以受到彎折的影響。故而,就算是在使基材10作了彎折的情況時,亦能夠確保第2電極12之對於Y方向的導通性。According to the input device 1E, even when the second electrode 12 is divided by the central axis BL, the same side can be divided by the first one. The wiring TY11 is derived to maintain the ON state, and the other side is maintained in the ON state by the second lead wiring TY21. Therefore, if the calculation is performed by adding the capacitance obtained based on the signals of the first lead-out wiring TY11 and the second lead-out wiring TY12, the capacitance of the second electrode 12 divided by the central axis BL can be changed as 1 The capacitance of the second electrode 12 is detected and detected. Thereby, even when the base material 10 is bent along the central axis BL, the second electrode 12 of the bendable region BR is hardly affected by the bending. Therefore, even when the base material 10 is bent, the conductivity of the second electrode 12 in the Y direction can be ensured.

另外,就算是當在可彎折區域BR處第1電極11受到彎折的影響並沿著中心軸BL而被作了分斷的情況時,亦同樣的,只要藉由進行將基於被連接於第1電極11處的其中一側處之導出配線TX1以及被連接於另外一側處之導出配線TX2的各者之訊號所得到的電容作加算之演算,便成為能夠進行在可彎折區域BR處之位置檢測。In addition, even when the first electrode 11 is affected by the bending at the bendable region BR and is broken along the central axis BL, the same is true, as long as it is based on being connected The calculation of the capacitance obtained by the signal of each of the lead-out wiring TX1 at one side of the first electrode 11 and the lead-out wiring TX2 connected to the other side is made possible in the bendable region BR. Location detection.

圖12中所示之其他構成例(其之5)之輸入裝置1F,係具備有下述之構成:亦即是,其之具備有略菱形之複數之第1島狀電極部111的第1電極11、和具備有略菱形之複數之第2島狀電極部121的第2電極12,係相互被設置在相異之層處,並相互交叉。The input device 1F of the other configuration example (the fifth aspect) shown in FIG. 12 has a configuration in which the first island-shaped electrode portion 111 having a plurality of rhombohedral shapes is provided. The electrode 11 and the second electrode 12 including the plurality of second island-shaped electrode portions 121 having a substantially rhombic shape are disposed at mutually different layers and intersect each other.

在圖13(a)中,係展示有圖12中所示之B-B線剖面中的層構造。   在圖13(a)所示之層構造中,在第1透光性基材511處係被形成有第1電極11,在第2透光性基材512處係被形成有第2電極12、第1連結部分41以及第2連結部分42。而,兩者係藉由透光性黏著材54而被作貼合。又,在被形成於第2透光性基材512處的第2電極12、第1連結部分41以及第2連結部分42之上,係隔著透光性黏著材53而被安裝有透光性覆蓋薄膜55。藉由此種層構造所構成之輸入裝置1F,係藉由透光性黏著材56而被安裝在顯示裝置300之上。In Fig. 13 (a), the layer configuration in the line B-B shown in Fig. 12 is shown. In the layer structure shown in FIG. 13( a ), the first electrode 11 is formed on the first light-transmitting substrate 511 , and the second electrode 12 is formed on the second light-transmitting substrate 512 . The first connecting portion 41 and the second connecting portion 42. Moreover, both are bonded by the light-transmitting adhesive 54. Further, the second electrode 12, the first connecting portion 41, and the second connecting portion 42 which are formed on the second light-transmitting substrate 512 are provided with light-transmitting light via the light-transmitting adhesive 53 Cover film 55. The input device 1F constituted by such a layer structure is mounted on the display device 300 by the light-transmitting adhesive 56.

藉由使第1電極11以及第2電極12分別被設置在相異之透光性基材處,係能夠將第1電極11以及第2電極12之各者的電極層構造體之構成簡單化,並藉由將此些之電極層構造體作重疊貼合而容易地製造出交叉電極構造。By providing the first electrode 11 and the second electrode 12 in separate light-transmitting substrates, the electrode layer structure of each of the first electrode 11 and the second electrode 12 can be simplified. The cross-electrode structure is easily fabricated by laminating these electrode layer structures.

在上述之層構造中,雖係成為將被形成有第1電極11之第1透光性基材511和被形成有第2電極12、第1連結部分41以及第2連結部分42之第2透光性基材512之2個的透光性基材作了貼合的構造,但是,係亦可如同圖13(b)中所示一般地藉由1個的透光性基材51來構成。In the layer structure described above, the first light-transmitting substrate 511 on which the first electrode 11 is formed and the second electrode 12, the first connection portion 41, and the second connection portion 42 are formed. The two light-transmitting substrates of the light-transmitting substrate 512 are bonded to each other. However, as shown in FIG. 13(b), one light-transmitting substrate 51 may be used. Composition.

亦即是,在圖13(b)所示之層構造中,於透光性基材51之其中一面處係被形成有第1電極11,在另外一面處係被形成有第2電極12、第1連結部分41以及第2連結部分42。在透光性基材51之被形成有第2電極12、第1連結部分41以及第2連結部分42之側處,係隔著透光性黏著材53而被安裝有透光性覆蓋薄膜55。藉由此種層構造所構成之輸入裝置1F,係藉由透光性黏著材56而被安裝在顯示裝置300之上。In other words, in the layer structure shown in FIG. 13(b), the first electrode 11 is formed on one surface of the light-transmitting substrate 51, and the second electrode 12 is formed on the other surface. The first connecting portion 41 and the second connecting portion 42. A translucent cover film 55 is attached to the side of the light-transmitting substrate 51 on which the second electrode 12, the first connection portion 41, and the second connection portion 42 are formed, via the translucent adhesive 53. . The input device 1F constituted by such a layer structure is mounted on the display device 300 by the light-transmitting adhesive 56.

不論是圖13(a)以及(b)中所示之何者的層構造,均係如同圖12中所示一般地,於中心軸BL之其中一側處係被連接有第1導出配線TY11,於中心軸BL之另外一側處係被連接有第2導出配線TY21。藉由此,就算是起因於基材10之彎折而可彎折區域BR之第2電極12被中心軸BL所分斷,藉由進行將基於第1導出配線TY11以及第2導出配線TY12之訊號所得到的電容作加算之演算,也能夠將作為在Y方向上延伸之1個的第2電極12之電容變化檢測出來。Regardless of the layer structure shown in FIGS. 13(a) and (b), as shown in FIG. 12, the first lead wiring TY11 is connected to one side of the central axis BL, The second lead-out wiring TY21 is connected to the other side of the central axis BL. As a result, even if the second electrode 12 of the bendable region BR is broken by the central axis BL due to the bending of the substrate 10, the first lead-out wiring TY11 and the second lead-out wiring TY12 are formed. The calculation of the capacitance obtained by the signal can also detect the change in capacitance of the second electrode 12 which is one extending in the Y direction.

又,就算是當在可彎折區域BR處第1電極11受到彎折的影響並沿著中心軸BL而被作了分斷的情況時,亦同樣的,只要藉由進行將基於被連接於第1電極11處的其中一側處之導出配線TX1以及被連接於另外一側處之導出配線TX2的各者之訊號所得到的電容作加算之演算,便能夠將作為在X方向上延伸之1個的第1電極11之電容變化檢測出來。Moreover, even when the first electrode 11 is affected by the bending at the bendable region BR and is broken along the central axis BL, the same is true, as long as it is based on being connected The calculation of the capacitance obtained by the signal of each of the lead-out wiring TX1 at one side of the first electrode 11 and the lead-out wiring TX2 connected to the other side can be added as an extension in the X direction. The change in capacitance of one of the first electrodes 11 is detected.

另外,不論是針對上述所說明的任一之實施形態,均同樣的,係亦可將設置有輸入裝置1、1B、1C、1D、1E、1F的基材之面作為內側並作彎折(內折)。特別是,在本實施形態中,就算是作了彎折時的曲率半徑(φ/2)係為0.5mm以下,也能夠得到第2電極12之導通性。故而,就算是將基材10作內折,亦能夠成為難以受到對於第2電極12之彎折的影響。Further, in the same manner as in any of the above-described embodiments, the surface of the base material on which the input devices 1, 1B, 1C, 1D, 1E, and 1F are provided may be bent inside (for example). Inside fold). In particular, in the present embodiment, even when the radius of curvature (φ/2) at the time of bending is 0.5 mm or less, the conductivity of the second electrode 12 can be obtained. Therefore, even if the base material 10 is folded inward, it is difficult to be affected by the bending of the second electrode 12.

如同以上所作了說明一般,若依據本實施形態,則係可提供一種並不設為保護層等之複雜的構造地來並不使不可視性惡化地而就算是有所彎折也能夠進行正確之檢測的輸入裝置。As described above, according to the present embodiment, it is possible to provide a structure that is not made of a protective layer or the like without deteriorating the invisibility, and even if it is bent, it can be made correct. Input device for detection.

另外,雖係於上而對於本實施形態作了說明,但是,本發明係並非為被限定於此些之例者。例如,在本實施形態中,雖係針對設定了貫穿Y方向之可彎折區域BR的粒子來作了展示,但是,係亦可設定貫穿X方向之可彎折區域。於此情況,係只要構成為使連結部40將第1島狀電極部111作連接,並使架橋配線部20將第2島狀電極部121作連接,並在第1島狀電極部111處連接第1連結部分41以及第2連結部分42即可。又,第1島狀電極部和第2島狀電極部121之形狀,係亦可為略菱形以外之形狀。進而,同業者所對於前述之各實施形態而適宜進行了構成要素之追加、削除、設計變更者,或者是將各實施形態之特徵作了適宜組合者,只要是具備有本發明之要旨內容,則係亦被包含於本發明之範圍內。Further, although the present embodiment has been described above, the present invention is not limited to the examples. For example, in the present embodiment, the particles which are set to the bendable region BR in the Y direction are displayed. However, the bendable region in the X direction may be set. In this case, the connection portion 40 is connected to the first island-shaped electrode portion 111, and the bridge wiring portion 20 is connected to the second island-shaped electrode portion 121, and is disposed at the first island-shaped electrode portion 111. The first connecting portion 41 and the second connecting portion 42 may be connected. Further, the shape of the first island-shaped electrode portion and the second island-shaped electrode portion 121 may be a shape other than a rhomboid shape. Further, the same as those of the above-described embodiments, the addition, the deletion, and the design change of the components are appropriately performed, or the features of the respective embodiments are appropriately combined, as long as the gist of the present invention is provided. It is also included in the scope of the present invention.

1、1B、1C、1D、1E、1F‧‧‧輸入裝置1, 1B, 1C, 1D, 1E, 1F‧‧‧ input devices

2、3‧‧‧輸入裝置2, 3‧‧‧ input device

10‧‧‧基材10‧‧‧Substrate

11‧‧‧第1電極11‧‧‧1st electrode

12‧‧‧第2電極12‧‧‧2nd electrode

20‧‧‧架橋配線部20‧‧‧Bridge wiring department

30‧‧‧島狀絕緣部30‧‧‧ island-shaped insulation

40‧‧‧連結部40‧‧‧Connecting Department

41‧‧‧第1連結部分41‧‧‧1 link

42‧‧‧第2連結部分42‧‧‧Part 2

45‧‧‧連結部45‧‧‧Connecting Department

51‧‧‧透光性基材51‧‧‧Transparent substrate

53、54、56‧‧‧透光性黏着材53, 54, 56‧‧‧ Translucent adhesive

55‧‧‧透光性覆蓋薄膜55‧‧‧Transparent cover film

100‧‧‧可撓性基板100‧‧‧Flexible substrate

111‧‧‧第1島狀電極部111‧‧‧1st island electrode

121‧‧‧第2島狀電極部121‧‧‧2nd island electrode

300‧‧‧顯示裝置300‧‧‧ display device

511‧‧‧第1透光性基材511‧‧‧1st light-transmitting substrate

512‧‧‧第2透光性基材512‧‧‧2nd light transmissive substrate

BL‧‧‧中心軸BL‧‧‧ central axis

BR‧‧‧可彎折區域BR‧‧‧ bendable area

S‧‧‧位置檢測區域S‧‧‧ position detection area

SL、SL1、SL2‧‧‧細縫部SL, SL1, SL2‧‧‧ slitting

TX、TX1、TX2、TY、TY1、TY2‧‧‧導出配線TX, TX1, TX2, TY, TY1, TY2‧‧‧ Export wiring

TY11‧‧‧第1導出配線TY11‧‧‧1st export wiring

TY21‧‧‧第2導出配線TY21‧‧‧2nd export wiring

d‧‧‧間隔D‧‧‧ interval

[圖1] (a)以及(b),係為對於第1實施形態的輸入裝置作例示之平面圖。   [圖2] 係為對於電極圖案作例示之示意圖。   [圖3] 係為對於本實施形態的輸入裝置作例示之示意剖面圖。   [圖4] 係為對於導出配線之布局例作展示之示意圖。   [圖5] 係為對於使基材作了彎折的狀態作例示之示意立體圖。   [圖6] 係為對於使比較例之輸入裝置之基材作彎折的狀態作例示之示意立體圖。   [圖7] 係為對於使比較例之輸入裝置之基材作了彎折的狀態作例示之示意立體圖。   [圖8] 係為針對其他構成例(其之1)作展示之示意圖。   [圖9] 係為針對其他構成例(其之2)作展示之示意圖。   [圖10] 係為針對其他構成例(其之3)作展示之示意圖。   [圖11] 係為針對其他構成例(其之4)作展示之示意圖。   [圖12] 係為針對其他構成例(其之5)作展示之示意圖。   [圖13] (a)以及(b),係為對於其他構成例(其之5)之層構造作例示之剖面圖。[Fig. 1] (a) and (b) are plan views exemplified for the input device of the first embodiment. [Fig. 2] is a schematic diagram illustrating an electrode pattern. Fig. 3 is a schematic cross-sectional view showing an input device of the embodiment. [Fig. 4] is a schematic diagram showing an example of the layout of the lead wiring. Fig. 5 is a schematic perspective view showing a state in which a base material is bent. Fig. 6 is a schematic perspective view showing a state in which a base material of an input device of a comparative example is bent. Fig. 7 is a schematic perspective view showing a state in which a base material of an input device of a comparative example is bent. FIG. 8 is a schematic view showing another configuration example (No. 1). [Fig. 9] is a schematic diagram showing another configuration example (the second one). FIG. 10 is a schematic view showing other configuration examples (No. 3). [Fig. 11] is a schematic diagram showing another configuration example (the fourth one). [Fig. 12] is a schematic diagram showing another configuration example (part 5). [Fig. 13] (a) and (b) are cross-sectional views exemplified as a layer structure of another configuration example (part 5).

Claims (12)

一種輸入裝置,其特徵為,係具備有:   基材;和   複數之第1電極,係朝前述基材之檢測區域的第1方向延伸出去,並被並排設置於與前述第1方向相交叉之第2方向上;和   複數之第2電極,係朝前述基材之檢測區域的第2方向延伸出去,並被並排設置於前述第1方向上,   在具備有位置在將前述檢測區域於前述第2方向上作貫穿的可彎折區域內之部分的前述第2電極處,係被連接有相對於在前述第2方向上延伸的中心軸而被設置在其中一側處之第1導出配線、和相對於前述中心軸而被設置在另外一側處之第2導出配線。An input device comprising: a substrate; and a plurality of first electrodes extending in a first direction of the detection region of the substrate and arranged side by side in a direction intersecting the first direction And the second electrode in the second direction extends in the second direction of the detection region of the substrate, and is disposed side by side in the first direction, and has a position in which the detection region is in the first The second electrode at a portion of the bendable region that penetrates in the two directions is connected to the first lead-out wiring provided on one side of the second axis extending in the second direction, And a second lead-out wiring that is provided on the other side with respect to the central axis. 如申請專利範圍第1項所記載之輸入裝置,其中,   前述第2電極,係具備有在前述第2方向上被作並排設置之複數之第2電極部、和將相鄰之前述第2電極部之間作連結之連結部,   前述連結部,係具備有相對於前述可彎折區域之在前述第2方向上延伸的中心軸而被設置在其中一側處之第1連結部分、和相對於前述中心軸而被設置在另外一側處之第2連結部分。The input device according to claim 1, wherein the second electrode includes a plurality of second electrode portions that are arranged side by side in the second direction, and the second electrode that is adjacent to the second electrode a connecting portion that connects the portions, wherein the connecting portion includes a first connecting portion that is provided at one side with respect to a central axis extending in the second direction of the bendable region, and a relative portion The second connecting portion is provided on the other side of the central axis. 如申請專利範圍第2項所記載之輸入裝置,其中,   當前述基材以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,前述第1連結部分和前述第2連結部分之間之前述第1方向之間隔d,係為πφ/2以上。The input device according to the second aspect of the invention, wherein the first connecting portion and the aforesaid base material are provided so as to be bendable by a radius of curvature (φ/2) The interval d between the first connecting portions in the first direction is πφ/2 or more. 如申請專利範圍第2項或第3項所記載之輸入裝置,其中,   前述第1連結部分以及前述第2連結部分的至少其中一者,係以通過被設置在前述第1電極處之細縫部的方式而被作設置。The input device according to the second or third aspect of the invention, wherein at least one of the first connecting portion and the second connecting portion passes through a slit portion provided at the first electrode The way is set. 如申請專利範圍第2項或第3項所記載之輸入裝置,其中,   前述第1連結部分以及前述第2連結部分的至少其中一者,係以與前述第1電極相交叉的方式而被作設置。The input device according to the second or third aspect of the invention, wherein at least one of the first connecting portion and the second connecting portion is formed to intersect the first electrode Settings. 如申請專利範圍第1項所記載之輸入裝置,其中,   前述第2電極,係具備有在前述第2方向上被作並排設置之複數之第2電極部、和將相鄰之前述第2電極部之間作連結之連結部,   被設置在前述可彎折區域內之前述連結部,係被設置在前述可彎折區域內之全面處。The input device according to claim 1, wherein the second electrode includes a plurality of second electrode portions that are arranged side by side in the second direction, and the second electrode that is adjacent to the second electrode The connecting portion that connects the portions is connected to the connecting portion in the bendable region, and is provided at a total position in the bendable region. 如申請專利範圍第6項所記載之輸入裝置,其中,   當前述基材以能夠以曲率半徑(φ/2)來作彎折的方式而被作設置的情況時,前述連結部之前述第1方向之寬幅,係為πφ/2以上。The input device according to claim 6, wherein when the base material is provided so as to be bendable by a radius of curvature (φ/2), the first portion of the connecting portion is The width of the direction is πφ/2 or more. 如申請專利範圍第6項或第7項所記載之輸入裝置,其中,   前述連結部的至少一部分,係以通過被設置在前述第1電極處之細縫部的方式而被作設置。The input device according to claim 6 or 7, wherein at least a part of the connecting portion is provided so as to pass through a slit portion provided at the first electrode. 如申請專利範圍第6項或第7項所記載之輸入裝置,其中,   前述連結部的至少一部分,係以與前述第1電極處相交叉的方式而被作設置。The input device according to claim 6 or 7, wherein at least a part of the connecting portion is provided so as to intersect the first electrode. 如申請專利範圍第1項所記載之輸入裝置,其中,   前述基材,係在前述可彎折區域之前述中心軸之位置處而彎折。The input device according to claim 1, wherein the base material is bent at a position of the central axis of the bendable region. 如申請專利範圍第10項所記載之輸入裝置,其中,   前述基材,係以曲率半徑0.5mm以下而彎折。The input device according to claim 10, wherein the substrate is bent at a radius of curvature of 0.5 mm or less. 如申請專利範圍第1項所記載之輸入裝置,其中,   前述第1電極與前述第2電極,係被配置在前述基材之同一面側處,   前述第1電極,係具備有在前述第1方向上被作並排設置之複數之第1電極部、和將在前述第1電極與前述第2電極所相交叉的位置處而相鄰之前述第1電極部之間作連結之架橋連結部。The input device according to the first aspect of the invention, wherein the first electrode and the second electrode are disposed on a side of the same surface of the substrate, and the first electrode is provided in the first A plurality of first electrode portions that are arranged side by side in the direction, and a bridge connecting portion that connects the adjacent first electrode portions at a position intersecting the first electrode and the second electrode.
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