TW201907418A - An insulated copper line and the method manufacturing the same - Google Patents

Abstract

The invention discloses an insulated copper line and the method manufacturing the same. The insulated copper line comprises: a copper line and a hybrid resin layer coated on the surface of the copper line. The materials of the hybrid resin layer are formed by graft connecting with organic materials and inorganic nano ceramic materials. The weight ratio of the inorganic nano ceramic materials in the hybrid resin layer is above 60%. The inorganic nano ceramic materials are selected from the group of Al2O3, SiO2, TiO2. By using the hybrid resin layer of the present invention, the insulated copper line can have a high breakdown strength and is suitable for the electrical connection of many electronic products.

Description

 Insulated copper wire and processing method thereof  

The present invention relates to a copper wire product, which is particularly related to a copper wire product having a high insulation effect and a method of processing the same.

Enamelled Wire is an indispensable material for modern electronics, such as electrical appliances, electronic machines, motors, transformers, relays, and automotive components. The enameled wire is coated with one or more layers of insulating paint on the surface of high-purity, high-conductivity conductors. A typical enamelled wire coats Vanilla water on the surface of a copper wire. Since the varnish water has the function of insulation, the copper wire can be used for various applications of electromagnetic induction, such as a motor, a transformer, etc., by winding into a coil. Depending on the coating and film thickness, each has its own characteristics and uses. The main applications are for motors, electronic products, and component coils.

For special purpose enameled wire, it can be treated by the unique technology of electroplating, alloy processing and processing. The special enameled wire produced includes copper clad aluminum wire, high tension wire, and stranded wire for high frequency products, which can bring added value to customers' products.

In some high-end applications, transformers, electric motors, generators and electrical measuring devices have always had strict requirements for the use of lacquer-insulated copper and aluminum wires. During processing, the enameled wire is gradually stretched, extruded and wound. At the same time, in the operation, the enameled wire is subjected to vibration, compression and temperature load pressure. Therefore, the wire enamel applied to the wire must meet many requirements at the same time. It should have a high degree of chemical and thermal stability, good adhesion to the wire, and especially good mechanical strength. When used in high current requiring appliances, they must be insensitive to the partial discharge that can occur to prevent short circuits. Therefore, in order to meet these more stringent material requirements, it is necessary to continue to improve the material properties of the enamelled lacquer used.

The varnish of the enameled wire currently on the market is basically a solution containing an organic solvent or a solvent mixed binder. Common adhesives such as polyester resin, 叁-2-hydroxyethyl isocyanurate (THEIC)-modified polyester resin, polyester phthalimide resin, THEIC-modified polyester yimimide resin And a binder of polyurethane resin. However, the resin cannot withstand high dielectric collapse strength.

In view of this, it is necessary to propose a copper wire product with high insulation effect and a processing method thereof.

The main object of the present invention is to provide a copper wire product with high insulation effect, which can improve the applicability and practicability of the copper wire in various electronic product connecting wires.

Another object of the present invention is to provide a method for processing a copper wire product having high insulation effect, which can improve the stability of the copper wire process and the applicability of various electronic product connecting wires.

For the main purpose of the present invention, the present invention provides an insulated copper wire comprising a copper wire, the surface of which is coated with a composite resin layer; wherein the composite resin layer is composed of an organic material and an inorganic nano ceramic. The material is formed by chemical grafting, which accounts for more than 60% of the total weight of the composite resin layer.

According to a feature of the invention, the composite resin layer has a thickness of from 10 micrometers to 100 micrometers.

According to a feature of the invention, the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm.

For the main purpose of the present invention, the present invention provides a method for processing an insulated copper wire, comprising the following steps: Step 1: preparing an inorganic nano ceramic material, the inorganic nano ceramic material having a powder size of 10 nm Between 100 nm; Step 2: mixing an organic material with the inorganic nano ceramic material to form a composite resin glue; Step 3: coating the composite resin on a surface of a copper wire to coat a composite resin Step 4: performing a curing process on the composite resin layer; wherein the composite resin is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the powder size of the inorganic nano ceramic material is Between 10 nm and 100 nm; wherein the composite resin is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the inorganic nano ceramic material has a powder size of 10 Nano to 100 nm.

According to a feature of the invention, the inorganic nanoceramic material is selected from the group consisting of nano alumina, nano cerium oxide and nano titanium oxide.

The insulated copper wire of the present invention and the processing method thereof have the following effects:

1. The material of the composite resin layer of the present invention is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the material has a relatively high process stability.

2. The inorganic nano-ceramic material of the composite resin layer of the present invention has a nano-sized particle size and has good bonding ability, so that it can be well combined with an organic material, thereby improving the coating ability of the copper wire.

3. The composite resin layer of the present invention has a high proportion by weight of an inorganic nano ceramic material, and thus has high insulating properties, thereby increasing the dielectric collapse strength of the composite resin layer.

10‧‧‧Insulated copper wire

20‧‧‧ copper wire

30‧‧‧Composite resin layer

The above and other objects, features, and advantages of the present invention will become more apparent and understood.

Figure 1 is a schematic view showing the structure of an insulated copper wire according to the present invention.

While the invention may be embodied in a variety of forms, the embodiments shown in the drawings and illustrated herein are the preferred embodiments of the invention. Those skilled in the art will appreciate that the devices and methods specifically described herein and illustrated in the drawings are considered as an example of the invention, non-limiting exemplary embodiments, and the scope of the invention Defined. Features illustrated or described in connection with an exemplary embodiment may be combined with features of other embodiments. Such modifications and variations are intended to be included within the scope of the invention.

Reference is now made to Fig. 1, which is a schematic view of the structure of an insulated copper wire according to the present invention. The insulated copper wire 10 mainly comprises a copper wire 20, and the surface of the copper wire 20 is coated with a composite resin layer 30.

The copper wire 20 generally refers to various copper-containing wires, such as a flower wire, a single core wire, a white flat wire, a twisted wire, and a cable wire, but is not limited thereto. The flower line is composed of a plurality of small (0.18mm) copper wire conductors and insulating layers, which are used in the wiring of small appliances. The single-core wire, also known as the solid wire, is composed of a single copper wire conductor and an insulating layer. It is used on indoor wiring and has a wire diameter of not less than 1.6 mm. The white flat wire is composed of two single-core insulation layers and is generally applied to indoor wiring. The stranded wire is composed of a plurality of conductors and insulating layers of a single copper wire. Stranded wires should be used when the wire diameter of the insulated wire is 3.2 mm or more. The stranded wire can be used in a place with a large load current. If it is used in indoor wiring, its wire diameter should not be less than 2.0mm. The cable is composed of multiple (more than 2) strands and insulation layers, and can be generally applied to indoor and outdoor wiring and poor wiring environment.

The composite resin layer 30 is formed by chemical grafting of an organic material and an inorganic nano ceramic material. The composite resin layer has a thickness of from 10 micrometers to 100 micrometers. The inorganic nano ceramic material is selected from the group consisting of nano alumina, nano cerium oxide and nano titanium oxide. The inorganic nano ceramic material has a powder size of between 10 nm and 100 nm. The organic material is selected from the group consisting of epoxy resin, acrylic resin, oxime resin, fluorocarbon resin, acid alcohol resin, amino resin, phenolic resin and acrylic resin.

Different from the conventional resin, the composite resin of the present invention is formed by chemical grafting of an organic material and an inorganic nano ceramic material. The organic material and the inorganic nano ceramic material are distributed in the overall weight of the composite resin layer as follows: the inorganic nano ceramic material accounts for more than 60% of the total weight of the composite resin layer, and the organic material accounts for less than the entire weight of the composite resin layer. At 40%. Therefore, it can be understood that the composite resin layer of the present invention has an extremely high solid content. The ratio of the overall weight is defined as follows: the inorganic nano ceramic material has a weight of X grams, and the weight of the organic material is Y grams, the composite resin layer formed of the inorganic nano ceramic material and the organic material. The overall weight is (X+Y) gram, the ratio of the inorganic nano ceramic material to the overall weight of the composite resin layer is X/(X+Y), and the ratio of the organic material to the overall weight of the composite resin layer Is Y/(X+Y).

Referring now to Figure 2, there is shown a flow chart of a method of processing the above insulated copper wire. The processing method comprises the following steps: Step 1: preparing an inorganic nano ceramic material, the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm; and step 2: mixing an organic material with the The inorganic nano ceramic material reacts to form a composite resin glue; Step 3: the composite resin is coated on a surface of one of the copper wires to coat a composite resin layer; Step 4: performing a curing process on the composite resin layer; The composite resin is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm.

In the first step, the inorganic nano ceramic material is prepared by using a nano ceramic solution and a heating process when prepared by a sol-gel method. Wherein, the nano ceramic solution is composed of at least one or more organometallic oxides and has a protecting group for stable storage of the nano ceramic solution.

The chemical formula of the organometallic oxide may be (OR) _x MOM(OR) _x , (R) _y (OR) _xy MOM(OR) _xy (R) _y , M(OR) _x , M(OR) _xy (R _y and (OR) _x MOM(OR) _x , where x is the valence of the cation and y is the valence of the anion. Generally, the valence of the cation is between 1 and 6, and the valence of the anion is between 1 and 6. The M system may be selected from the group consisting of aluminum (Al), iron (Fe), titanium (Ti), zirconium (Zr), hafnium (Hf), cerium (Si), rhenium (Rh), cerium (Cs), platinum (Pt), One of metal elements such as indium (In), tin (Sn), gold (Au), germanium (Ge), copper (Cu) or tantalum (Ta). R may be one of an alkyl group, an alkenyl group, an aromatic group (Aryl), a haloalkyl group (Alkylhalide), and hydrogen (Hydrogen).

The prepared nano ceramic solution is added to the organic acid. The pH (pH value) of the nano ceramic solution is adjusted by an organic acid so that the pH is between 3 and 11, preferably between 4 and 10. The colloidal nano ceramic solution having a chemically grafted protecting group is formed by a condensation reaction of the organic acid with water to form a chemically grafted protecting group, which allows the nano ceramic solution to be stably stored.

Preferably, the organic acid is of the formula R-(COOH), (HO)-R-(COOH), (HOOC)-R-(COOH) and (R ₁ O), (R ₂ O)-( POOH). R may be one of an alkyl group, an alkenyl group, an aryl group, a haloalkyl group or a hydrogen or alkynyl group. If R is an alkyl group, the organic acid is an alkanoic acid; if R is an alkenyl group, the organic acid is an olefinic acid; if R is an aromatic group, the organic acid is an aromatic acid; and if R is a haloalkyl group, the organic acid is Haloalkanic acid; if R is hydrogen, the organic acid is formic acid; if R is alkynyl, the organic acid is acetylenic acid. The inorganic acid may be one of hydrochloric acid, nitric acid or sulfuric acid.

Preferably, the chemically grafted protecting group has the chemical formula A-(CO-B-CO)-C, which enables stable storage of the nano ceramic solution. Among them, the A system may be one of an alkyl group, an alkenyl group, an aromatic group, a haloalkyl group, a hydrogen group, and an alkynyl group. The B system may be one of an alkyl group, an alkenyl group, an aromatic group, a haloalkyl group, a hydrogen group, and an alkynyl group. The C system may be one of an alkyl group, an alkenyl group, an aromatic group, a haloalkyl group, a hydrogen group, and an alkynyl group.

In the second step, it is a feature of the present invention. The material of the composite resin glue is a Graft copolymers formed by chemical grafting of an organic material and an inorganic nano ceramic material. The organic material is selected from the group consisting of epoxy resin, acrylic resin, oxime resin, fluorocarbon resin, acid alcohol resin, amino resin, phenolic resin and acrylic resin. The graft copolymer is structurally a branched polymer having a main chain and a longer branch, and the main chain and the branch are composed of different structural units. Different effects can be achieved by controlling the ratio of the aqueous phase to the oil phase of the composite resin. In this embodiment, the composite resin is in the state of an oil phase.

In the third step, the coating method includes a barrel plating method, a spin coating method, a immersion plating method, or a spray coating method. For example, the barrel plating method uniformly coats the composite resin solution on the copper wire 20 by a roller coating. Another common immersion plating method is a method of immersing the copper wire 20 in a bath containing the composite resin solution for film coating. However, in this way, considerable care must be taken to control the circulation, filtration, and temperature and viscosity of the coating solution.

In the fourth step, the curing process includes curing the bonding effect between the copper wire 20 and the composite resin layer 30 via a heat curing process or a photo curing process. The composite resin layer 30 has an inorganic nano ceramic material having a special chemical ability. The copper wire 20 does not require an additional surface treatment, and the composite resin layer 30 and the copper wire 20 can have good bonding properties. The heat curing process or the photo-curing process can cause molecular bonding between the composite resin layer 30 and the copper wire 20, so that the composite resin solution can be smoothly cured and bonded to the surface of the copper wire 20 to form the composite resin. Layer 30. Preferably, the temperature range of the heat curing process is between 50 ° C and 500 ° C.

The insulated copper wire of the invention has the following effects:

1. The material of the composite resin layer of the present invention is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the material has a relatively high process stability.

2. The inorganic nano-ceramic material of the composite resin layer of the present invention has a nano-sized particle size and has good bonding ability, so that it can be well combined with an organic material, thereby improving the coating ability of the copper wire.

3. The composite resin layer of the present invention has a high proportion by weight of an inorganic nano ceramic material, and thus has high insulating properties, thereby increasing the dielectric collapse strength of the composite resin layer.

While the present invention has been described in its preferred embodiments, it is not intended to limit the scope of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. As explained above, various modifications and variations can be made without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Claims (10)

 An insulated copper wire comprising: a copper wire, the surface of the copper wire is coated with a composite resin layer; wherein the composite resin layer is formed by chemical grafting of an organic material and an inorganic nano ceramic material, the inorganic The nano ceramic material water molecules account for more than 95% of the total weight of the composite resin layer.    The insulated copper wire according to claim 1, wherein the composite resin layer has a thickness of from 10 μm to 100 μm.    The invention relates to a method for processing an insulated copper wire, comprising the following steps: Step 1: preparing an inorganic nano ceramic material, the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm; and step 2: mixing An organic material reacts with the inorganic nano ceramic material to form a composite resin glue; Step 3: the composite resin is coated on a surface of one of the copper wires to coat a composite resin layer; Step 4: performing the composite resin layer a curing process; wherein the composite resin is formed by chemical grafting of an organic material and an inorganic nano ceramic material, and the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm. .    The method of processing an insulated copper wire according to claim 3, wherein the composite resin layer has a thickness of from 10 micrometers to 100 micrometers.    The method for processing an insulated copper wire according to claim 3, wherein in the first step, the inorganic nano ceramic material is prepared by using a sol-gel method.    The method for processing an insulated copper wire according to claim 3, wherein the inorganic nano ceramic material has a powder size of between 10 nm and 100 nm.    The method for processing an insulated copper wire according to claim 3, wherein the inorganic nano ceramic material is selected from the group consisting of nano alumina, nano cerium oxide and nano titanium oxide.    The method for processing an insulated copper wire according to claim 3, wherein the organic material is selected from the group consisting of epoxy resin, acrylic resin, enamel resin, fluorocarbon resin, acid alcohol resin, amino resin, phenol resin and acrylic resin. The group of people.    The method for processing an insulated copper wire according to claim 3, wherein the inorganic nano ceramic material accounts for 60% or more of the total weight of the composite resin layer.    The method for processing an insulated copper wire according to claim 3, wherein in the fifth step, the curing temperature is between 50 degrees and 500 degrees.