TW201901778A - Polishing apparatus and polishing method - Google Patents

Abstract

The present invention relates to a polishing apparatus and a polishing method, for pressing a polishing tool against the peripheral edge part of a substrate and polishing the peripheral edge part. The polishing apparatus is provided with a substrate retaining part (3) for retaining a substrate (W), a polishing head (50) for pressing a polishing tool (38) against the substrate (W), a support structure (24) for supporting the polishing head (50), a base structure (23) to which the support structure (24) is fixed, and a reinforcing structure (110) fixed to the support structure (24). The reinforcing structure (110) has an anchor mechanism (112) configured so as to be fixable to and detachable from the base structure (23).

Description

 Grinding device and grinding method  

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate such as a wafer, and more particularly to a polishing apparatus and a polishing method for pressing a polishing tool on a peripheral portion of a substrate to polish the peripheral portion.

In the past, a polishing apparatus was used to polish the peripheral portion of the substrate. The twenty-eighth figure shows a schematic diagram of the past grinding apparatus. The polishing apparatus shown in Fig. 18 has a substrate stage 300 that holds a substrate W such as a wafer, and a polishing head 307 that presses the polishing tape 305 of the polishing tool against the substrate W. The polishing head 307 has a pressing member 308 and an air cylinder 309. The polishing head 307 is supported by the support structure 311 fixed to the base 310.

The substrate W is held by the stage surface 300a of the substrate stage 300 by vacuum suction or the like, and rotates around the axis center together with the substrate stage 300. The polishing tape 305 of the polishing tool is pressed against the peripheral edge portion of the substrate W by the pressing member 308. The pressing member 308 is coupled to the air cylinder 309, and the force for pressing the polishing tape 305 against the substrate W is applied from the air cylinder 309 to the pressing member 308. In the polishing of the substrate W, pure water is supplied to the center of the substrate W, and the upper surface of the substrate W is covered with pure water. The polishing tape 305 polishes the peripheral portion of the substrate W in the presence of pure water, and forms a stepped recess 312 having a right-angled cross section as shown in Fig. 19 in the peripheral portion of the substrate W.

 [Previous Technical Literature]    [Patent Literature]  

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-213849

However, when the pressing member 308 presses the polishing tape 305 against the peripheral edge portion of the substrate W, the reaction force from the substrate W acts on the polishing head 307. The polishing head 307 and the support structure 311 are subjected to the reaction force and are inclined upward in the direction indicated by the arrow X in the twenty-eighth diagram, causing the entire pressing member 308 to be inclined. As a result, as shown in Fig. 30, the polishing tape 305 is obliquely contacted with the peripheral edge portion of the substrate W, and an inclined polishing surface is formed on the peripheral edge portion of the substrate W.

Accordingly, it is an object of the present invention to provide a polishing apparatus and a polishing method which can prevent a polishing head from being inclined when a substrate is polished, and can achieve a desired polishing profile.

A polishing apparatus according to another aspect of the present invention includes a substrate holding portion that holds a substrate, a polishing head that presses the polishing tool against the substrate, a support structure that supports the polishing head, and a base structure. The support structure is fixed; and the reinforcing structure is fixed to the support structure; and the reinforcing structure has an anchoring mechanism, and the structure can be fixed to the base structure and can be separated therefrom.

A feature of the present invention is that the anchoring mechanism includes an actuator that presses the base structure.

A feature of the present invention is that the actuator is disposed outside the support structure.

The present invention is characterized in that it further includes an operating system that operates the actuator, and the operating system is configured to cause the actuator to generate a force that changes according to a polishing load of the polishing tool according to the polishing head. Way composition.

According to a preferred aspect of the present invention, the base structure has a protruding portion that protrudes toward the actuator, and the actuator is disposed to face the protruding portion.

The present invention is characterized in that it further includes an operating system that operates the actuator, and the operating system is configured to cause the actuator to generate a force that changes according to a polishing load of the polishing tool according to the polishing head. Way composition.

According to a preferred aspect of the present invention, the polishing apparatus further includes a connection mechanism that connects the polishing head and the support structure, and the connection mechanism includes a first connection mechanism that is fixed to the polishing head; The two connection mechanism is fixed to the support structure; the first connection mechanism and the second connection mechanism are configured to be fixed to each other and separable from each other.

According to a preferred aspect of the present invention, one of the first connection mechanism and the second connection mechanism includes an electromagnet, and the other of the first connection mechanism and the second connection mechanism includes a magnetic member.

According to a preferred aspect of the present invention, one of the first connection mechanism and the second connection mechanism includes a pair of air cylinders, and the other one of the first connection mechanism and the second connection mechanism is disposed in the one The part between the air cylinders.

A feature of the present invention is that the support structure includes at least one polishing head moving mechanism that moves the polishing head.

A polishing apparatus according to another aspect of the present invention includes a substrate holding portion that holds a substrate, a polishing head that presses the polishing tool against the substrate, a support structure that supports the polishing head, and a base structure. And the connection mechanism that connects the polishing head and the support structure; the connection mechanism includes: a first connection mechanism fixed to the polishing head; and a second connection mechanism The first connecting mechanism and the second connecting mechanism are fixed to each other and separable from each other.

According to a preferred aspect of the present invention, one of the first connection mechanism and the second connection mechanism includes an electromagnet, and the other of the first connection mechanism and the second connection mechanism includes a magnetic member.

According to a preferred aspect of the present invention, one of the first connection mechanism and the second connection mechanism includes a pair of air cylinders, and the other one of the first connection mechanism and the second connection mechanism is disposed in the one The part between the air cylinders.

According to a preferred aspect of the present invention, the polishing apparatus further includes a reinforcing structure that is fixed to the support structure, and the reinforcing structure has an anchoring mechanism that can be fixed to the base structure and can be separated therefrom .

A feature of the present invention is that the anchoring mechanism includes an actuator that presses the base structure.

A feature of the present invention is that the support structure includes at least one polishing head moving mechanism that moves the polishing head.

A polishing method according to the present invention is characterized in that an anchoring mechanism fixed to a reinforcing structure of a supporting structure is fixed to a base structure, a substrate holding portion rotates the substrate, and a polishing head supported by the supporting structure The polishing tool is pressed against the substrate to polish the substrate, and after the substrate is polished, the anchoring mechanism is separated from the base structure.

The present invention is characterized in that it further includes a step of connecting a first connection mechanism fixed to the polishing head to a second connection mechanism fixed to the support structure before polishing the substrate, and the substrate polishing is completed. Thereafter, the first connecting mechanism is separated from the second connecting mechanism.

A polishing method according to the present invention is characterized in that a first connecting mechanism fixed to a polishing head is coupled to a second connecting mechanism fixed to a supporting structure for supporting the polishing head, and the substrate holding portion rotates the substrate, and The polishing head presses the polishing tool against the substrate to polish the substrate, and after the substrate is polished, the first connection mechanism is separated from the second connection mechanism.

The present invention is characterized in that it further includes a step of fixing an anchoring mechanism fixed to the reinforcing structure of the support structure to the base structure before polishing the substrate, and anchoring the substrate after the substrate is polished. The mechanism is separated from the aforementioned basic structure.

In the present invention, the support structure is reinforced by an anchoring mechanism and/or a coupling mechanism. Therefore, the posture of the polishing head is stabilized in the substrate polishing, and a desired polishing profile can be obtained.

3‧‧‧Substrate retention department

4‧‧‧ Keeping the stage

4a‧‧‧ditch

5‧‧‧ hollow shaft

6‧‧‧Spherical spline bearing

7‧‧‧Connected road

8‧‧‧Rotary joints

9‧‧‧vacuum pipeline

10‧‧‧Nitrogen supply line

11‧‧‧Action Control Department

12‧‧‧ Shell

14‧‧‧Shell

15‧‧‧Air cylinder

18‧‧‧ radial bearings

20‧‧‧ partition wall

20a‧‧‧Transportation port

20b‧‧ ‧Shutter

21‧‧‧floor

22‧‧‧ grinding room

23‧‧‧Basic structures

24‧‧‧Support structure

25‧‧‧grinding unit

27‧‧‧Setting table

28‧‧‧Support square

30‧‧‧ Grinding head moving mechanism

31‧‧‧Rolling screw mechanism

32‧‧‧Motor

33‧‧‧Power transmission mechanism

38‧‧‧ polishing tape

40A, 40B‧‧‧Direct motion guide

41A, 41B‧‧‧ Link Box

42A, 42B‧‧‧ servo motor

43A, 43B‧‧‧Rolling screw mechanism

44A, 44B‧‧‧Support members

50‧‧‧ polishing head

51‧‧‧ Pressing members

51a‧‧‧through holes

52‧‧‧ Pressing member retainer

53‧‧‧Air cylinder

55‧‧‧Retaining components

57‧‧‧Installation components

58‧‧‧Direct motion guide

60‧‧‧vacuum pipeline

62‧‧‧ box

70‧‧‧grinding belt supply mechanism

71‧‧‧Supply reel

72‧‧‧Recycling reels

73,74‧‧‧tension motor

76‧‧‧grinding tape feeding mechanism

77‧‧‧With feed roller

78‧‧‧Clamping roller

79‧‧‧With feed motor

81‧‧‧Abutment

82,83‧‧‧Support arm

84A, 84B, 84C, 84D, 84E‧‧ ‧ guide rollers

100‧‧‧With edge detection sensor

100A‧‧‧Projecting Department

100B‧‧‧Receiving Department

110‧‧‧ reinforcing structure

111‧‧‧ anchoring arm

112‧‧‧ anchoring mechanism

114‧‧‧First air cylinder

115‧‧‧Pressure room

116‧‧‧ Back pressure chamber

117‧‧‧First anchoring member

120‧‧‧Second air cylinder

121‧‧‧Pressure room

122‧‧‧ Back pressure chamber

123‧‧‧Second anchoring member

130‧‧‧Compressed gas supply line

131‧‧‧Pressure side gas supply line

131a‧‧‧Main pressurized side pipeline

131b‧‧‧First pressurized side branch line

131c‧‧‧Second pressurized side branch line

131A‧‧‧First pressurized side pipeline

131B‧‧‧Second pressurized side pipeline

132‧‧‧Back pressure side gas supply line

132a‧‧‧Main back pressure side pipeline

132b‧‧‧First back pressure side branch line

132c‧‧‧Second back pressure side branch line

132A‧‧‧First back pressure side pipeline

132B‧‧‧Second back pressure side pipeline

134‧‧‧ Pressurized side pressure regulator

134A‧‧‧First pressurized side pressure regulator

134B‧‧‧Second pressure side pressure regulator

135‧‧‧ Pressurized side pressure sensor

135A‧‧‧First pressurized side pressure sensor

135B‧‧‧Second pressure side pressure sensor

137‧‧‧First pressurized side opening and closing valve

138‧‧‧Second pressure side opening and closing valve

140‧‧‧Back pressure side pressure regulator

140A‧‧‧First back pressure side pressure regulator

140B‧‧‧Second back pressure side pressure regulator

141‧‧‧Back pressure side pressure sensor

141A‧‧‧First back pressure side pressure sensor

141B‧‧‧Second back pressure side pressure sensor

143‧‧‧First back pressure side opening and closing valve

144‧‧‧Second back pressure side opening and closing valve

150‧‧‧Protruding

150a‧‧‧ horizontal department

160‧‧‧Linked institutions

161‧‧‧ First Linkage

162‧‧‧Second Linkage

164‧‧‧ Magnetic components

165‧‧‧electromagnet

166‧‧‧ horizontal department

168‧‧‧ arm square

170‧‧‧third air cylinder

171‧‧‧fourth air cylinder

173‧‧‧pressure regulator

174‧‧‧pressure regulator

300‧‧‧Substrate stage

300a‧‧‧ countertops

305‧‧‧grinding tape

307‧‧‧ polishing head

308‧‧‧ Pressing members

309‧‧‧Air cylinder

310‧‧‧Abutment

311‧‧‧Support structure

312‧‧‧ recess

B‧‧‧ Groove

B1‧‧‧ belt

CP‧‧‧ Axis

E1, E2‧‧‧ Flat

K‧‧‧ Straight line

M1‧‧‧ motor

P1, p2‧‧‧ pulley

W‧‧‧Substrate

First (a) and (b) are enlarged cross-sectional views showing peripheral portions of the substrate.

The second drawing shows a plan view of a polishing apparatus according to an embodiment of the present invention.

The third figure is a cross-sectional view taken along line F-F of the second figure.

The fourth figure is a view as seen from the direction indicated by the arrow G of the third figure.

The fifth figure is a plan view of the polishing head and the polishing tape supply mechanism.

The sixth drawing is a front view of the polishing head and the abrasive tape supply mechanism.

The seventh figure is a cross-sectional view taken along line H-H shown in the sixth figure.

The eighth drawing is a side view of the polishing tape supply mechanism shown in the sixth drawing.

The ninth drawing is a longitudinal sectional view of the polishing head shown in Fig. 6 as seen from the direction indicated by the arrow I.

The tenth figure is a plan view of the polishing head and the polishing tape supply mechanism at the polishing position.

The eleventh diagram is a schematic view of the pressing member, the polishing tape, and the substrate at the polishing position as viewed from the lateral direction.

The twelfth diagram shows a state in which the polishing tape is pressed against the substrate by the pressing member.

The thirteenth diagram is a schematic view showing the polishing apparatus viewed from the direction indicated by the arrow J of the second figure.

The fourteenth diagram is a schematic view showing an operating system for operating the first actuator and the second actuator.

The fifteenth diagram is a schematic diagram showing other embodiments of the operating system.

Fig. 16 is a schematic view showing still another embodiment of the operating system.

Fig. 17 is a view showing another embodiment of the reinforcing structure.

Fig. 18 is a view showing still another embodiment of the reinforcing structure.

Fig. 19 is a schematic view showing an embodiment of a polishing apparatus having a coupling mechanism.

Fig. 20 is a schematic view showing the joint mechanism viewed from the direction indicated by the arrow L of Fig. 19.

The twenty-first embodiment is a schematic view showing another embodiment of the connection mechanism.

22(a) to 22(c) are schematic views showing an embodiment of the operation of the anchoring mechanism and the coupling mechanism.

23(a) to 23(c) are schematic views showing an embodiment of an operation of the anchoring mechanism and the connecting mechanism.

Figs. 24(a) to 24(c) are schematic views showing an embodiment of the operation of the anchoring mechanism and the connecting mechanism.

Figs. 25(a) and 25(b) are schematic views showing an embodiment of the operation of the anchoring mechanism and the connecting mechanism.

Fig. 26 is a view showing an embodiment of a polishing head having a grinding wheel as a polishing tool.

The twenty-seventh drawing shows a diagram of an embodiment of a polishing head having a grinding wheel as a polishing tool.

The twenty-eighth figure shows a pattern diagram of the past grinding apparatus.

The twenty-ninth drawing shows a cross-sectional view of a stepped recess formed in the peripheral portion of the substrate.

The thirtieth figure is a view showing a polishing tape which is in oblique contact with the peripheral portion of the substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In the present specification, the peripheral portion of the substrate is defined to include a groove portion located at the outermost periphery of the substrate, and a region between the top edge portion and the bottom edge portion on the inner side in the radial direction of the groove portion. The substrate is, for example, a wafer.

First (a) and (b) are enlarged cross-sectional views showing peripheral portions of the substrate. More specifically, the first diagram (a) is a cross-sectional view of a so-called straight-sided substrate, and the first diagram (b) is a cross-sectional view of a so-called circular substrate. In the substrate W of the first diagram (a), the groove portion is a substrate composed of an upper inclined portion (upper groove portion) P, a lower inclined portion (lower groove portion) Q, and a side portion (vertex) R. The outermost surface of W (indicated by symbol B). In the substrate W of the first diagram (b), the groove portion constitutes a portion (shown by symbol B) having a curved cross section of the outermost peripheral surface of the substrate W. The top edge portion is a flat portion E1 located radially inward of the groove portion B. The bottom edge portion is located on the side opposite to the top edge portion and is located at the flat portion E2 on the inner side in the radial direction from the groove portion B. The top edge portion E1 also includes an area in which elements are formed.

The second drawing shows a plan view of a polishing apparatus according to an embodiment of the present invention, the third drawing is a cross-sectional view taken along the line F-F of the second drawing, and the fourth drawing is a view seen from the direction indicated by the arrow G of the third figure.

The polishing apparatus of the present embodiment includes a substrate holding portion 3 that holds a substrate W such as a wafer and rotates the substrate W, and a polishing unit 25 that polishes the substrate W on the substrate holding portion 3. The second and third figures show the state in which the substrate holding portion 3 holds the substrate W. The substrate holding portion 3 includes a holding stage 4 that holds the lower surface of the substrate W by vacuum suction, a hollow shaft 5 that is coupled to the central portion of the holding stage 4, and a motor M1 that rotates the hollow shaft 5. The substrate W is mounted on the holding stage 4 such that the center of the substrate W coincides with the axis CP of the hollow shaft 5 .

As shown in the second figure, the polishing unit 25 includes a polishing head 50 that polishes the peripheral edge portion of the substrate W using the polishing tape 38 as a polishing tool, and supplies the polishing tape 38 to the polishing head 50, and recovers the polishing tape 38 from the polishing head 50. The polishing tape supply mechanism 70. The polishing head 50 is configured to form a stepped recess in the peripheral edge portion of the substrate W by bringing the polishing surface of the polishing tape 38 into contact with the top edge portion of the substrate W. The polishing unit 25 and the holding stage 4 are disposed in the polishing chamber 22 formed by the partition wall 20.

As shown in the third figure, the partition wall 20 is fixed to the bottom plate 21, and the lower portion of the substrate holding portion 3 extends through the bottom portion of the partition wall 20 and the bottom plate 21. In the present embodiment, the base structure 23 is constituted by the bottom surface of the partition wall 20 and the bottom plate 21. A support structure 24 that supports the polishing head 50 is fixed to the base structure 23. The partition wall 20 is provided with a transfer port 20a for carrying the substrate W into the polishing chamber 22 and carrying it out from the polishing chamber 22. The transfer port 20a can be closed by the shutter 20b.

The hollow shaft 5 is supported by a spherical spline bearing (linear motion bearing) 6 so as to be movable up and down. A groove 4a is formed on the upper surface of the holding stage 4, and the groove 4a communicates with the communication path 7 extending through the hollow shaft 5. The communication path 7 is connected to the vacuum line 9 via a rotary joint 8 attached to the lower end of the hollow shaft 5. The communication path 7 is also connected to the nitrogen gas supply line 10 for detaching the processed substrate W from the holding stage 4. By switching these vacuum lines 9 and the nitrogen supply line 10, the substrate W is held on or off the holding stage 4.

The hollow shaft 5 is rotated by the motor M1 via a pulley p1 coupled to the hollow shaft 5, a pulley p2 attached to a rotating shaft of the motor M1, and a belt b1 attached to the pulleys p1 and p2. The spherical spline bearing 6 is a bearing that allows the hollow shaft 5 to freely move in the longitudinal direction thereof. The spherical spline bearing 6 is fixed to the cylindrical outer casing 12. Therefore, the hollow shaft 5 can linearly move up and down the outer casing 12, and the hollow shaft 5 rotates integrally with the outer casing 12. The hollow shaft 5 is coupled to an air cylinder (lifting mechanism) 15, and the hollow shaft 5 and the holding stage 4 can be raised and lowered by the air cylinder 15.

A radial bearing 18 is interposed between the outer casing 12 and the cylindrical outer casing 14 disposed concentrically with the outer side thereof, and the outer casing 12 is rotatably supported by the bearing 18. According to this configuration, the substrate holding portion 3 can rotate the substrate W around the axis CP thereof and raise and lower the substrate W along the axis CP.

A polishing unit 25 that polishes a peripheral edge portion of the substrate W is disposed outside the substrate holding portion 3. The polishing unit 25 is disposed inside the polishing chamber 22. As shown in the fourth figure, the entire grinding unit 25 is fixed to the setting table 27. The installation table 27 is coupled to the polishing head moving mechanism 30 via a support block 28. The polishing head moving mechanism 30 is fixed to the bottom plate 21. In the present embodiment, the support structure 24 that supports the polishing head 50 includes a mounting table 27, a support block 28, and a polishing head moving mechanism 30. The support structure 24 extends through the base structure 23 composed of the bottom of the partition wall 20 and the bottom plate 21. The polishing head moving mechanism 30 constituting the end portion of the support structure 24 is fixed to the lower surface of the base structure 23, that is, the lower surface of the bottom plate 21.

The polishing head moving mechanism 30 includes a ball screw mechanism 31 that slidably holds the support block 28, a motor 32 that drives the ball screw mechanism 31, and a power transmission mechanism 33 that connects the ball screw mechanism 31 and the motor 32. The ball screw mechanism 31 is provided with a linear motion guide (not shown) that guides the moving direction of the support block 28. The power transmission mechanism 33 is constituted by a pulley, a belt, or the like. When the motor 32 is operated, the ball screw mechanism 31 moves the support block 28 to the direction indicated by the arrow of the fourth figure, and the entire grinding unit 25 moves to the tangential direction of the substrate W. The polishing head moving mechanism 30 also functions as a vibration mechanism that causes the polishing unit 25 to swing at a predetermined amplitude and a predetermined speed. The polishing head moving mechanism 30 of the present embodiment constitutes a first polishing head moving mechanism that moves the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 in the first direction.

The fifth drawing is a plan view of the polishing head 50 and the polishing tape supply mechanism 70, the sixth drawing is a front view of the polishing head 50 and the polishing tape supply mechanism 70, and the seventh drawing is a cross-sectional view of the HH line shown in the sixth drawing, and the eighth drawing. A side view of the polishing tape supply mechanism 70 shown in the sixth drawing, and a ninth drawing is a longitudinal sectional view of the polishing head 50 shown in the sixth drawing in the direction indicated by the arrow I.

Two linear motion guides 40A and 40B extending in parallel with the radial direction of the substrate W are disposed on the installation table 27. These linear motion guides 40A, 40B are arranged in parallel with each other. The polishing head 50 and the linear motion guide 40A are coupled via a connection block 41A. Further, the polishing head 50 is coupled to a servo motor 42A and a ball screw mechanism 43A that move the polishing head 50 along the linear motion guide 40A (that is, in the radial direction of the substrate W). More specifically, the ball screw mechanism 43A is fixed to the connection block 41A, and the servo motor 42A is fixed to the installation table 27 via the support member 44A. The servo motor 42A is configured to rotate the screw shaft of the ball screw mechanism 43A, whereby the connecting block 41A and the polishing head 50 coupled thereto move along the linear motion guide 40A. The servo motor 42A, the ball screw mechanism 43A, and the linear motion guide 40A of the present embodiment constitute a second polishing head moving mechanism that moves the polishing head 50 in the second direction perpendicular to the first direction.

Similarly, the polishing tape supply mechanism 70 and the linear motion guide 40B are coupled via a connection block 41B. Further, the polishing tape supply mechanism 70 is coupled to the servo motor 42B and the ball screw mechanism 43B that move the polishing tape supply mechanism 70 along the linear motion guide 40B (that is, in the radial direction of the substrate W). More specifically, the ball screw mechanism 43B is fixed to the connection block 41B, and the servo motor 42B is fixed to the installation table 27 via the support member 44B. The servo motor 42B is configured to rotate the screw shaft of the ball screw mechanism 43B, whereby the connecting block 41B and the polishing tape supply mechanism 70 coupled thereto are moved along the linear motion guide 40B. The servo motor 42B, the ball screw mechanism 43B, and the linear motion guide 40B of the present embodiment constitute a polishing tool moving mechanism that moves the polishing tape supply mechanism 70.

As shown in FIG. 9, the polishing head 50 includes a pressing member 51 for pressing the polishing tape 38 against the substrate W, a pressing member holder 52 holding the pressing member 51, and the pressing member holder 52 and the pressing member 51. An air cylinder 53 that moves up and down as a pressing device. The air cylinder 53 is held by the holding member 55. Further, the holding member 55 is fixed to the mounting member 57 fixed to the connecting block 41A. The polishing load by which the pressing member 51 presses the polishing tape 38 on the substrate W is generated by the air cylinder 53.

The pressing member holder 52 is coupled to the mounting member 57 via a linear motion guide 58 that extends in the vertical direction. When the pressing member holder 52 is pressed by the air cylinder 53, the pressing member 51 moves downward along the linear motion guide 58 and the pressing member 51 presses the polishing tape 38 on the peripheral edge portion of the substrate W. Further, the air cylinder 53 can raise the pressing member holder 52 and the pressing member 51 along the linear motion guide 58. The pressing member 51 is formed of a resin such as PEEK (polyether ether ketone), a metal such as stainless steel, or a ceramic such as tantalum carbide (SiC).

The pressing member 51 has a plurality of through holes 51a extending in the vertical direction, and a vacuum line 60 is connected to the through holes 51a. A vacuum valve 60 is provided with a valve (not shown), and by opening the valve, a vacuum can be formed in the through hole 51a of the pressing member 51. When a vacuum is formed in the through hole 51a in a state where the lower surface of the pressing member 51 is in contact with the upper surface of the polishing tape 38, the upper surface of the polishing tape 38 is held under the pressing member 51. Further, the number of the through holes 51a of the pressing member 51 may be one. In the polishing of the substrate W, a vacuum is formed in the through hole 51a, and the polishing tape 38 is held under the pressing member 51.

The pressing member holder 52, the air cylinder 53, the holding member 55, and the mounting member 57 are housed in the case 62. The lower portion of the pressing member holder 52 protrudes from the bottom of the cartridge 62, and a pressing member 51 is attached to the lower portion of the pressing member holder 52.

The polishing tape supply mechanism 70 includes a supply reel 71 that supplies the polishing tape 38, and a collection reel 72 that collects the polishing tape 38. The supply reel 71 and the recovery reel 72 are coupled to the tension motors 73 and 74, respectively. These tension motors 73, 74 can apply a specified tension to the polishing tape 38 by imparting a specified torque to the supply reel 71 and the recovery reel 72.

A polishing tape feeding mechanism 76 is provided between the supply reel 71 and the recovery reel 72. The belt feeding mechanism 76 is provided with a belt feeding roller 77 that feeds the polishing belt 38, a nip roller 78 that presses the polishing belt 38 to the belt feeding roller 77, and a belt feeding motor 79 that rotates the belt feeding roller 77. The abrasive tape 38 is sandwiched between the nip roller 78 and the tape feed roller 77. The polishing tape 38 is fed from the supply reel 71 to the recovery reel 72 by rotating the tape feed roller 77 in the direction indicated by the arrow of the sixth figure.

The tension motors 73, 74 and the belt feed motor 79 are disposed on the base 81. The base 81 is fixed to the joint block 41B. The base 81 has two support arms 82, 83 extending from the supply reel 71 and the recovery reel 72 toward the polishing head 50. A plurality of guide rollers 84A, 84B, 84C, 84D, 84E supporting the abrasive belt 38 are mounted on the support arms 82, 83. The polishing tape 38 is guided by the isolating rollers 84A to 84E so as to surround the polishing head 50.

When the extending direction of the polishing tape 38 is viewed from above, it is perpendicular to the radial direction of the substrate W. The two guide rolls 84D, 84E located below the polishing head 50 support the polishing tape 38 such that the polishing surface of the polishing tape 38 is parallel to the surface (upper surface) of the substrate W. Further, the polishing tape 38 between the two guide rollers 84D, 84E extends in parallel with the tangential direction of the substrate W. A gap is formed between the polishing tape 38 and the substrate W in the vertical direction.

The polishing apparatus further includes a belt edge detecting sensor 100 that detects the position of the edge portion of the polishing tape 38. The belt edge detecting sensor 100 is a transmissive type optical sensor. The belt edge detecting sensor 100 has a light projecting portion 100A and a light receiving portion 100B. The light projecting unit 100A is fixed to the installation table 27 as shown in Fig. 5, and the light receiving unit 100B is fixed to the bottom plate 21 as shown in Fig. 3 . The edge detecting sensor 100 is configured to detect the position of the edge portion of the polishing tape 38 from the amount of light received by the light receiving unit 100B.

When the substrate W is polished, as shown in the tenth diagram, the polishing head 50 and the polishing tape supply mechanism 70 are moved to the designated polishing positions by the servo motors 42A, 42B and the ball screw mechanisms 43A, 43B, respectively. The polishing tape 38 at the polishing position extends in the tangential direction of the substrate W. The eleventh diagram is a schematic view of the pressing member 51, the polishing tape 38, and the substrate W at the polishing position as viewed from the lateral direction. As shown in the eleventh diagram, the polishing tape 38 is positioned above the peripheral edge portion of the substrate W, and further, the pressing member 51 is positioned above the polishing tape 38.

The twelfth diagram shows a state in which the polishing tape 38 is pressed against the substrate W by the pressing member 51. In the present embodiment, as shown in Fig. 12, the edge portion of the pressing member 51 at the polishing position coincides with the edge portion of the polishing tape 38. That is, the polishing head 50 and the polishing tape supply mechanism 70 are independently moved to the polishing position so that the edge portion of the pressing member 51 coincides with the edge portion of the polishing tape 38. In one embodiment, the edge portion of the polishing tape 38 may protrude from the edge portion of the pressing member 51.

Next, the polishing operation of the polishing apparatus configured as described above will be described. The operation of the polishing apparatus described below is controlled by the operation control unit 11 shown in the second figure. The substrate W is held by the substrate holding portion 3 such that the film (for example, the element layer) formed on the surface thereof is upward, and the substrate W is rotated about the axis CP of the substrate holding portion 3. A liquid (for example, pure water) is supplied from a liquid supply nozzle (not shown) at the center of the rotating substrate W. The pressing member 51 of the polishing head 50 and the polishing tape 38 are respectively moved to the designated polishing positions as shown in FIG.

Next, the air cylinder 53 (see FIG. 9) presses the pressing member 51, and as shown in FIG. 12, the pressing member 38 presses the polishing tape 38 against the peripheral edge portion of the substrate W with a predetermined polishing load. The grinding load can be adjusted by the gas pressure supplied to the air cylinder 53. The peripheral portion of the substrate W is polished by sliding the substrate W in sliding contact with the polishing tape 38. That is, the abrasive tape 38 can form a stepped recess 312 having a right-angled cross section as shown in FIG.

In order to increase the polishing rate of the substrate W, the polishing tape 38 may be oscillated in the tangential direction of the substrate W by the polishing head moving mechanism 30 during the polishing of the substrate W. In the polishing, a liquid (for example, pure water) is supplied to the center portion of the rotating substrate W, and the substrate W is polished in the presence of water. The liquid supplied to the substrate W is diffused to the entire substrate W by centrifugal force, thereby preventing the abrasive particles from adhering to the elements formed on the substrate W. The abrasive tape 38 is an elongated strip-shaped abrasive article. Instead of the abrasive tape 38, a grinding wheel can also be used as the abrasive for polishing the substrate W.

The thirteenth diagram is a schematic view showing the polishing apparatus viewed from the direction indicated by the arrow J of the second figure. As shown in the thirteenth diagram, the polishing head 50 is supported by the support structure 24. The support structure 24 of the present embodiment is connected by a block 41A (see FIG. 6), a linear motion guide 40A (refer to FIG. 6), a mounting table 27 (refer to FIG. 6), a support block 28, and a polishing head. The moving mechanism 30 is configured. One end of the support structure 24 is fixed to the polishing head 50, and the other end of the support structure 24 is fixed to the bottom plate 21 of the base structure 23.

The polishing apparatus includes a reinforcing structure 110 that is fixed to the support structure 24 . The reinforcing structure 110 has an anchoring arm 111 fixed to the supporting structure 24 and an anchoring mechanism 112 fixed to the anchoring arm 111. The anchoring mechanism 112 is configured to be fixed to and detachable from the base structure 23. The anchor mechanism 112 of the present embodiment includes a first air cylinder 114 and a second air cylinder 120 as actuators that press the base structure 23. The first air cylinder 114 and the second air cylinder 120 are fixed to both ends of the anchor arm 111. In one embodiment, the actuator that presses the base structure 23 can also be a combination of a servo motor and a ball screw mechanism.

Compressed gas (for example, compressed air) is supplied to the pressurizing chamber 115 and the back pressure chamber 116 of the first air cylinder 114, respectively. Similarly, compressed gas (for example, compressed air) is supplied to the pressurizing chamber 121 and the back pressure chamber 122 of the second air cylinder 120, respectively. The first air cylinder 114 has a first anchoring member 117 fixed to the piston rod thereof, and the second air cylinder 120 includes a second anchoring member 123 fixed to the piston rod thereof.

When the compressed gas pressure in the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120 is higher than the compressed gas in the back pressure chambers 116, 122, the first air cylinder 114 and the second air cylinder 120 are first anchor members The 117 and the second anchoring member 123 press the upper surface of the base structure 23 (the bottom of the partition wall 20), whereby the first air cylinder 114 and the second air cylinder 120 itself can be fixed to the base structure 23. When the compressed gas pressure in the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120 is lower than the compressed gas in the back pressure chambers 116, 122, the first anchor member 117 and the second anchor member 123 are from the base structure 23 Leaving, whereby the first air cylinder 114 and the second air cylinder 120 are separated from the base structure body 23. Therefore, the polishing head moving mechanism 30 can move the polishing unit 25 and the anchoring mechanism 112 in the tangential direction of the substrate W.

The first air cylinder 114 of the first actuator is disposed outside the support structure 24 , and the second air cylinder 120 of the second actuator is disposed inside the support structure 24 . More specifically, the first air cylinder 114 is disposed outside the support structure 24 with respect to the direction in which the axis C of the substrate holding portion 3 extends perpendicularly and the line K connecting the center of the axis CP and the center of the pressing member 51 is extended. The second air cylinder 120 is disposed inside the support structure 24 . The first air cylinder 114 and the second air cylinder 120 are located above or above the base structure 23.

Compressed gas (e.g., compressed air) is supplied to both the first air cylinder 114 and the pressurizing chambers 115, 121 and the back pressure chambers 116, 122 of the second air cylinder 120. When the pressure of the compressed gas in the pressurizing chambers 115, 121 is lower than the compressed gas in the back pressure chambers 116, 122, the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. When the pressure of the compressed gas in the pressurizing chambers 115, 121 is higher than the compressed gas in the back pressure chambers 116, 122, the first air cylinder 114 and the second air cylinder 120 press against the upper surface of the base structure 23, whereby the reinforcing structure 110 is used. The support structure 24 is reinforced. As a result, the posture of the polishing head 50 supported by the support structure 24 is stabilized. Thus, the polishing head 50 can polish the substrate W to form a desired abrasive profile. More specifically, the polishing head 50 can form a stepped recess 312 having a right-angled cross section as shown in FIG. 19 at the peripheral portion of the substrate W.

In particular, the first air cylinder 114 can eliminate the reaction force acting on the polishing head 50 from the substrate W. Therefore, in one embodiment, only the first air cylinder 114 may be provided, and the second air cylinder 120 may be omitted. Since the first air cylinder 114 can eliminate the reaction force acting on the polishing head 50 from the substrate W, the posture of the polishing head 50 supported by the support structure 24 can be stabilized.

The fourteenth diagram is a schematic view showing an operating system for operating the first air cylinder 114 of the first actuator and the second air cylinder 120 of the second actuator. The operating system is a compressed gas supply system that operates the first air cylinder 114 and the second air cylinder 120. The operating system includes the above-described operation control unit 11.

As shown in FIG. 14, the operating system includes: a pressurized side gas supply line 131 connected to a compressed gas supply line (for example, a compressed air supply line) 130 provided in a factory provided with a polishing apparatus; and a gas on the back pressure side Supply line 132. The pressurized side gas supply line 131 has a main pressurization side line 131a, a first pressurization side branch line 131b and a second pressurization side branch line 131c which are branched from the main pressurization side line 131a. The main pressurization side line 131a is connected to the compressed gas supply line 130. The first pressurizing side branch line 131b is connected to the pressurizing chamber 115 of the first air cylinder 114, and the second pressurizing side branch line 131c is connected to the pressurizing chamber 121 of the second air cylinder 120. A pressure side pressure regulator 134 and a pressure side pressure sensor 135 are attached to the main pressure side line 131a. The first pressure side opening and closing valve 137 is attached to the first pressure side branch line 131b, and the second pressure side opening and closing valve 138 is attached to the second pressure side branch line 131c.

The back pressure side gas supply line 132 has a main back pressure side line 132a, a first back pressure side branch line 132b and a second back pressure side branch line 132c which are branched from the main back pressure side line 132a. The main back pressure side line 132a is connected to the compressed gas supply line 130. The first back pressure side branch line 132b is connected to the back pressure chamber 116 of the first air cylinder 114, and the second back pressure side branch line 132c is connected to the back pressure chamber 122 of the second air cylinder 120. A back pressure side pressure regulator 140 and a back pressure side pressure sensor 141 are installed in the main back pressure side line 132a. The first back pressure side opening and closing valve 143 is attached to the first back pressure side branch line 132b, and the second back pressure side opening and closing valve 144 is attached to the second back pressure side branch line 132c.

The pressure side pressure regulator 134, the first pressure side opening and closing valve 137, the second pressure side opening and closing valve 138, the back pressure side pressure regulator 140, the first back pressure side opening and closing valve 143, and the second back pressure side opening and closing The valve 144 is connected to the operation control unit 11, and the operations of the pressure regulators 134, 140 and the valves 137, 138, 143, 144 are controlled by the operation control unit 11. The pressure sensors 135, 141 can also be omitted.

When the operation control unit 11 opens the first pressure side opening and closing valve 137 and the second pressure side opening and closing valve 138, the compressed gas passes through the main pressure side line 131a, the first pressure side branch line 131b, and the second pressure side side. The line 131c is supplied to the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120. The operation control unit 11 transmits the command value of the pressure-side target pressure to the pressure-side pressure regulator 134, and the pressure-side pressure regulator 134 adjusts the pressure of the compressed gas to add the first air cylinder 114 and the second air cylinder 120. The pressure of the compressed gas in the pressure chambers 115, 121 is maintained at the pressure side target pressure.

When the operation control unit 11 opens the first back pressure side opening and closing valve 143 and the second back pressure side opening and closing valve 144, the compressed gas passes through the main back pressure side line 132a, the first back pressure side branch line 132b, and the second back pressure side side. The line 132c is supplied to the back pressure chambers 116, 122 of the first air cylinder 114 and the second air cylinder 120. The operation control unit 11 transmits the command value of the back pressure side target pressure to the back pressure side pressure regulator 140, and the back pressure side pressure regulator 140 adjusts the pressure of the compressed gas so that the back of the first air cylinder 114 and the second air cylinder 120 The compressed gas pressure in the pressure chambers 116, 122 is maintained at the back pressure side target pressure.

When compressed gas is supplied to the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120, compressed gas is also supplied to the back pressure chambers 116, 122 of the first air cylinder 114 and the second air cylinder 120. For this reason, the first air cylinder 114 and the second air cylinder 120 can generate a stable force despite the disturbance of the pressure of the compressed gas supplied from the compressed gas supply line 130 and the positional fluctuation of the piston rods of the air cylinders 114 and 120. .

In one embodiment, when the first air cylinder 114 and the second air cylinder 120 are fixed to the base structure 23, the compressed gas may be supplied to the pressurizing chambers 115, 121 without being supplied to the back pressure chambers 116, 122. Further, when the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23, the compressed gas may be supplied to the back pressure chambers 116, 122 without being supplied to the pressurizing chambers 115, 121.

Since the compressed gas of the same pressure is supplied to the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120, and the compression of the same pressure is supplied to the back pressure chambers 116, 122 of the first air cylinder 114 and the second air cylinder 120. Since the first air cylinder 114 and the second air cylinder 120 press the base structure 23 with the same force.

The first back pressure side opening and closing valve 143 and the second back pressure side opening and closing valve 144 can also be maintained in a state of being opened at any time. It is preferable that the operation control unit 11 simultaneously opens and closes the first back pressure side opening and closing valve 143 and the second back pressure side opening and closing valve 144 at the same time.

The operation control unit 11 can also change the above-described pressing side target pressure and/or back pressure side target pressure by pressing the polishing tape 38 against the polishing load of the substrate W by the pressing member 51. For example, when the operation control unit 11 in the substrate W polishing commands the air cylinder 53 to increase the polishing load, the operation control unit 11 can increase the pressure on the pressurizing side target pressure as the polishing load increases. By doing so, the first air cylinder 114 and the second air cylinder 120 can press the base structure 23 with a force that varies with the grinding load. As a result, the posture of the polishing head 50 in the polishing of the substrate W can be made more stable.

The fifteenth diagram is a schematic diagram showing other embodiments of the operating system. Since the configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in the fourteenth embodiment, the description thereof will not be repeated. The operating system of the present embodiment is a compressed gas supply system in which the forces generated by the first air cylinder 114 and the second air cylinder 120 are independently changed.

The operating system of the present embodiment is provided to be connected to the compressed gas supply line 130 and the first air instead of the main pressurization side line 131a, the first pressurization side branch line 131b, and the second pressurization side branch line 131c. a first pressurizing side line 131A of the pressurizing chamber 115 of the cylinder 114; and a second pressurizing side line 131B connected to the compressed gas supply line 130 and the pressurizing chamber 121 of the second air cylinder 120. The first pressure side pressure regulator 134A, the first pressure side pressure sensor 135A, and the first pressure side opening and closing valve 137 are attached to the first pressure side line 131A. The second pressure side pressure regulator 134B, the second pressure side pressure sensor 135B, and the second pressure side opening and closing valve 138 are attached to the second pressure side line 131B. Pressure sensors 135A, 135B may also be omitted. The first pressurization side pressure regulator 134A adjusts the pressure of the compressed gas in the pressurizing chamber 115 of the first air cylinder 114, and the second pressurization side pressure regulator 134B adjusts the compressed gas in the pressurizing chamber 121 of the second air cylinder 120. Composed of pressure.

The first pressurization side pressure regulator 134A and the second pressurization side pressure regulator 134B are connected to the operation control unit 11. The operation control unit 11 transmits the command value of the first pressurization side target pressure to the first pressurization side pressure regulator 134A, and the first pressurization side pressure regulator 134A adjusts the pressure of the compressed gas to increase the first air cylinder 114. The pressure of the compressed gas in the pressure chamber 115 is maintained at the first pressure side target pressure. Similarly, the operation control unit 11 transmits the command value of the second pressurization side target pressure to the second pressurization side pressure regulator 134B, and the second pressurization side pressure regulator 134B adjusts the pressure of the compressed gas to cause the second air cylinder 120. The compressed gas pressure in the pressurizing chamber 121 is maintained at the second pressurizing side target pressure. The operating system having such a configuration can independently control the force at which the first air cylinder 114 and the second air cylinder 120 press the base structure body 23.

The operation control unit 11 may press the polishing tape 38 against the polishing load of the substrate W according to the pressing member 51 to set the first pressure side target pressure, and/or the second pressure side target pressure, and/or the back pressure side target pressure. Variety. For example, when the operation control unit 11 issues a command to the air cylinder 53 to increase the polishing load, the operation control unit 11 may increase the first pressure side target pressure as the polishing load increases. By doing so, the first air cylinder 114 and/or the second air cylinder 120 can press the base structure 23 with a force that varies with the grinding load. As a result, the posture of the polishing head 50 in the polishing of the substrate W can be made more stable.

Fig. 16 is a schematic view showing still another embodiment of the operating system. Since the configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in the fifteenth embodiment, the description thereof will not be repeated. The operating system of the present embodiment is a compressed gas supply system in which the forces generated by the first air cylinder 114 and the second air cylinder 120 are independently changed.

The operating system of the present embodiment is provided to be connected to the compressed gas supply line 130 and the first air instead of the main back pressure side line 132a, the first back pressure side branch line 132b, and the second back pressure side branch line 132c. a first back pressure side line 132A of the back pressure chamber 116 of the cylinder 114; and a second back pressure side line 132B connected to the compressed gas supply line 130 and the back pressure chamber 122 of the second air cylinder 120. The first back pressure side pressure regulator 140A, the first back pressure side pressure sensor 141A, and the first back pressure side opening and closing valve 143 are attached to the first back pressure side line 132A. The second back pressure side pressure regulator 140B, the second back pressure side pressure sensor 141B, and the second back pressure side opening and closing valve 144 are attached to the second back pressure side line 132B. The pressure sensors 141A, 141B may also be omitted. The first back pressure side pressure regulator 140A adjusts the pressure of the compressed gas in the back pressure chamber 116 of the first air cylinder 114, and the second back pressure side pressure regulator 140B adjusts the compressed gas in the back pressure chamber 122 of the second air cylinder 120. Composed of pressure.

The first back pressure side pressure regulator 140A and the second back pressure side pressure regulator 140B are connected to the operation control unit 11. The operation control unit 11 transmits the command value of the first back pressure side target pressure to the first back pressure side pressure regulator 140A, and the first back pressure side pressure regulator 140A adjusts the pressure of the compressed gas so that the back of the first air cylinder 114 The pressure of the compressed gas in the pressure chamber 116 is maintained at the first back pressure side target pressure. Similarly, the operation control unit 11 transmits the command value of the second back pressure side target pressure to the second back pressure side pressure regulator 140B, and the second back pressure side pressure regulator 140B adjusts the pressure of the compressed gas to make the second air cylinder The compressed gas pressure in the back pressure chamber 122 of 120 is maintained at the second back pressure side target pressure. The operating system having such a configuration can independently control the force at which the first air cylinder 114 and the second air cylinder 120 press the base structure body 23.

The seventeenth embodiment shows another embodiment of the reinforcing structure 110. Since the configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in the above-described thirteenth embodiment, the description thereof will not be repeated. The reinforcing structure 110 of the present embodiment includes the first air cylinder 114 and the second air cylinder 120 which are disposed inside the support structure 24 . The first air cylinder 114 is located below the second air cylinder 120, and the first air cylinder 114 and the second air cylinder 120 are opposed to each other. The first air cylinder 114 and the second air cylinder 120 are fixed to the anchor arm 111, and the anchor arm 111 is fixed to the support structure 24.

The base structure 23 includes a protruding portion 150 that protrudes from the bottom plate 21 toward the first air cylinder 114 and the second air cylinder 120. The end of the protruding portion 150 is fixed to the bottom plate 21 of the base structure 23. The protruding portion 150 has a horizontal portion 150a that is located between the first air cylinder 114 and the second air cylinder 120. More specifically, the horizontal portion 150a of the protruding portion 150 is disposed between the first anchoring member 117 of the first air cylinder 114 and the second anchoring member 123 of the second air cylinder 120. The first air cylinder 114 is located below the horizontal portion 150a and opposite the lower surface of the horizontal portion 150a. The second air cylinder 120 is located above the horizontal portion 150a and opposite to the upper surface of the horizontal portion 150a.

When the compressed gas pressure in the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120 is higher than the compressed gas in the back pressure chambers 116, 122, the first air cylinder 114 and the second air cylinder 120 are first anchor members The 117 and the second anchoring member 123 sandwich the horizontal portion 150a of the protruding portion 150, whereby the first air cylinder 114 and the second air cylinder 120 itself can be fixed to the base structure 23. When the compressed gas pressure in the pressurizing chambers 115, 121 of the first air cylinder 114 and the second air cylinder 120 is lower than the compressed gas in the back pressure chambers 116, 122, the first anchoring member 117 and the second anchoring member 123 are horizontal from the protruding portion 150. The portion 150a is separated, whereby the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. Therefore, the polishing head moving mechanism 30 can move the polishing unit 25 and the anchoring mechanism 112 in the tangential direction of the substrate W.

Fig. 18 is a view showing still another embodiment of the reinforcing structure 110. The reinforcing structure 110 of the present embodiment includes a first air cylinder 114 and a second air cylinder 120 that are disposed outside the support structure 24 . The first air cylinder 114 is located above the second air cylinder 120. More specifically, the first air cylinder 114 is positioned above the horizontal portion 150a and opposite the upper surface of the horizontal portion 150a. Since the other configurations and operations of the present embodiment are the same as those of the embodiment shown in the seventeenth embodiment, the description thereof will not be repeated.

In the seventeenth and eighteenth embodiments, in one embodiment, only the first air cylinder 114 may be provided and the second air cylinder 120 may be omitted. Since the first air cylinder 114 can eliminate the reaction force acting on the polishing head 50 from the substrate W, the posture of the polishing head 50 supported by the support structure 24 can be stabilized.

Fig. 19 is a schematic view showing an embodiment of a polishing apparatus having a coupling mechanism. In addition to the above-described anchoring mechanism 112, the polishing apparatus of the present embodiment further includes a coupling mechanism 160 that connects the polishing head 50 and the support structure 24. The illustration of the anchoring mechanism 112 described above is omitted in the nineteenth embodiment. The coupling mechanism 160 includes a first coupling mechanism 161 that is fixed to the attachment member 57 of the polishing head 50 , and a second coupling mechanism 162 that is fixed to the support block 28 of the support structure 24 . The first link mechanism 161 and the second link mechanism 162 are configured to be fixed to each other and separable from each other. The connection mechanism 160 is disposed inside the support structure 24 . More specifically, the connection mechanism 160 is disposed inside the support structure 24 with respect to the extending direction of the straight line K extending from the axis CP of the substrate holding portion 3 and connecting the axis CP and the center of the pressing member 51. In one embodiment, the connection mechanism 160 may be disposed outside the support structure 24 .

Fig. 20 is a schematic view showing the link mechanism 160 viewed from the direction indicated by the arrow L of Fig. 19. As shown in the twentieth diagram, the first coupling mechanism 161 of the present embodiment includes the magnetic member 164, and the second coupling mechanism 162 includes the electromagnet 165. Alternatively, the entire first connecting mechanism 161 may be composed of a magnetic member. In one embodiment, the first connection mechanism 161 may include the electromagnet 165, and the second connection mechanism 162 may include the magnetic member 164. At this time, the entire second coupling mechanism 162 may be composed of a magnetic member.

The operation of the electromagnet 165 is controlled by the motion control unit 11. The magnetic member 164 is made of a metal having corrosion resistance such as stainless steel. The electromagnet 165 is disposed at a position opposed to the magnetic member 164. When the liquid (for example, pure water) supplied to the upper surface of the substrate W comes into contact with the electromagnet 165, the electromagnet 165 is rusted, which also causes contamination of the substrate W. Therefore, in order to prevent the electromagnet 165 from rusting, the surface of the electromagnet 165 in contact with the magnetic member 164 is preferably made of a surface subjected to rust-preventing treatment such as galvanizing treatment.

When the electromagnet 165 is not in operation, the first coupling mechanism 161 and the second coupling mechanism 162 are separated from each other. Therefore, the polishing head 50 can be separated from the axis CP by the second polishing head moving mechanism (the servo motor 42A, the ball screw mechanism 43A, and the linear motion guide 40A) in the direction approaching the axis CP of the substrate holding portion 3. Move in direction. When the operation control unit 11 operates the electromagnet 165, the electromagnet 165 approaches the magnetic member 164, and the first connection mechanism 161 and the second connection mechanism 162 are fixed to each other.

When the substrate W is polished, the reaction force of the movable portion of the linear motion guide 40A constituting the second polishing head moving mechanism is slightly displaced by the reaction load of the polishing load. The result may cause the polishing head 50 to tilt. In the present embodiment, when the pressing member 51 is in the polishing position (for example, before starting the polishing of the substrate W), by operating the electromagnet 165, the posture of the polishing head 50 when the substrate W is polished can be stabilized. After the polishing of the substrate W is completed, the operation control unit 11 stops the operation of the electromagnet 165, and separates the first connection mechanism 161 and the second connection mechanism 162 from each other.

The twenty-first figure shows a schematic view of another embodiment of the link mechanism 160. Since the configurations and operations of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in the twentieth embodiment, the description thereof will not be repeated. In the present embodiment, the first coupling mechanism 161 includes a horizontal portion 166, and the second coupling mechanism 162 includes an arm block 168, a third air cylinder 170, and a fourth air cylinder 171. The arm block 168 has an L shape and is fixed to the support block 28 of the support structure 24. The third air cylinder 170 is fixed to the arm block 168, and the fourth air cylinder 171 is fixed to the support block 28 of the support structure 24.

The third air cylinder 170 is disposed above the fourth air cylinder 171, and the horizontal portion 166 of the first coupling mechanism 161 is located between the third air cylinder 170 and the fourth air cylinder 171. In one embodiment, the second coupling mechanism 162 may include a horizontal portion 166, and the first coupling mechanism 161 includes a third air cylinder 170 and a fourth air cylinder 171. The operations of the third air cylinder 170 and the fourth air cylinder 171 are controlled by a pressure regulator 173 and a pressure regulator 174 for adjusting the pressure of the compressed gas in the pressurizing chambers and the back pressure chambers of the air cylinders 170, 171. The operation of the pressure regulator 173 and the pressure regulator 174 is controlled by the operation control unit 11.

When the third air cylinder 170 and the fourth air cylinder 171 are separated from the horizontal portion 166, the first coupling mechanism 161 and the second coupling mechanism 162 are separated from each other. Therefore, the polishing head 50 can be separated from the axis CP by the second polishing head moving mechanism (the servo motor 42A, the ball screw mechanism 43A, and the linear motion guide 40A) in the direction close to the axis CP of the substrate holding portion 3. Move in direction. When the horizontal portion 166 is interposed between the third air cylinder 170 and the fourth air cylinder 171, the first coupling mechanism 161 and the second coupling mechanism 162 are fixed to each other, and the posture of the polishing head 50 is stabilized.

Next, an embodiment of the operation of the anchoring mechanism 112 and the connecting mechanism 160 will be described. Step 1 is as shown in Fig. 22 (a), and the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 is in the retracted position. When the polishing unit 25 is in the retracted position, the operation control unit 11 issues a command to the substrate holding unit 3 to rotate the substrate W around the axis CP. Further, a liquid (for example, pure water) is supplied from the liquid supply nozzle to the upper surface of the substrate W. In the twenty-second diagram (a), the positions and shapes of the first air cylinder 114, the second air cylinder 120, and the coupling mechanism 160 are schematically depicted. The hollow circle showing the first air cylinder 114 and the second air cylinder 120 constituting the anchoring mechanism 112 is a state in which the first air cylinder 114 and the second air cylinder 120 are separated from the base structure body 23. Similarly, the hollow circle showing the connection mechanism 160 indicates a state in which the first connection mechanism 161 and the second connection mechanism 162 constituting the connection mechanism 160 are apart from each other.

Step 2 is as shown in the twenty-second diagram (b), the operation control unit 11 operates the polishing head moving mechanism 30, and moves the polishing unit 25 in the first direction, and the pressing member 51 of the polishing head 50 and the polishing tape 38 are close to each other. The substrate W on the substrate holding portion 3. Step 3 is as shown in FIG. 22(c), and the operation control unit 11 presses the first air cylinder 114 and the second air cylinder 120 constituting the anchor mechanism 112 against the base structure 23, and causes the first air cylinder 114. The second air cylinder 120 is fixed to the base structure 23 . The solid circles of the first air cylinder 114 and the second air cylinder 120 are displayed, and the state in which the first air cylinder 114 and the second air cylinder 120 press the base structure 23 is shown.

Step 4 is as shown in Fig. 23 (a), and the operation control unit 11 operates the servo motor 42A (second polishing head moving mechanism) and the servo motor 42B (grinding tool moving mechanism), and causes the polishing head 50 and the polishing. The tape supply mechanism 70 moves toward the axis CP of the substrate holding portion 3 until the pressing member 51 and the polishing tape 38 are positioned above the peripheral edge portion of the substrate W on the substrate holding portion 3. Step 5 is as shown in FIG. 23(b), and the operation control unit 11 fixes the first connection mechanism 161 and the second connection mechanism 162 to each other. Specifically, the operation control unit 11 operates the electromagnet 165 shown in the twentieth diagram, or sandwiches the horizontal portion 166 with the third air cylinder 170 and the fourth air cylinder 171 shown in FIG. The solid circle showing the connection mechanism 160 indicates a state in which the first connection mechanism 161 and the second connection mechanism 162 are fixed to each other.

Step 6 is as shown in FIG. 23(c), in which the first air cylinder 114 and the second air cylinder 120 are fixed to the base structure 23, and the first joint mechanism 161 and the second joint mechanism 162 are fixed to each other. The polishing head 50 lowers the pressing member 51, and the pressing member 51 presses the polishing tape 38 against the peripheral edge portion of the substrate W. The black pressing member 51 shows a state in which the pressing member 51 presses the polishing tape 38 against the peripheral edge portion of the substrate W. The polishing tape 38 is slidably contacted with the peripheral edge portion of the substrate W in the presence of a liquid to polish the peripheral edge portion of the substrate W.

Step 7 is as shown in Fig. 24(a), in which the polishing head 50 raises the pressing member 51 to separate the polishing tape 38 from the peripheral edge portion of the substrate W. Thereby, the polishing of the substrate W is completed. The white pressing member 51 indicates a state in which the pressing member 51 is raised and the polishing tape 38 is separated from the peripheral edge portion of the substrate W. Step 8 is as shown in FIG. 24(b), and the first link mechanism 161 and the second link mechanism 162 are distant from each other. Step 9 is as shown in FIG. 24(c), and the operation control unit 11 operates the servo motor 42A (second polishing head moving mechanism) and the servo motor 42B (grinding tool moving mechanism) to cause the polishing head 50 and the polishing tape. The supply mechanism 70 moves in a direction away from the axis CP of the substrate holding portion 3.

Step 10 is as shown in Fig. 15 (a), and the operation control unit 11 separates the first air cylinder 114 and the second air cylinder 120 constituting the anchor mechanism 112 from the base structure body 23. In step 11, as shown in Fig. 15(b), the operation control unit 11 operates the polishing head moving mechanism 30, and moves the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 to the retracted position. In step 12, the rotation of the substrate W is stopped, and the supply of the liquid to the upper surface of the substrate W is stopped, but it is not shown.

In the above embodiment, the polishing apparatus includes both the anchoring mechanism 112 and the coupling mechanism 160. However, in one embodiment, the polishing apparatus may include only one of the anchoring mechanism 112 and the coupling mechanism 160.

The abrasive tool for polishing the substrate W may also be a grinding wheel. For example, as shown in the twenty-sixth diagram, the polishing head 50 may have one or a plurality of grinding wheels 180 underneath. The polishing head 50 shown in Fig. 26 is fixed to the support structure 24. The polishing head 50 is rotated around the axis thereof, and a plurality of grinding wheels 180 as polishing tools are pressed against the peripheral edge portion of the substrate W to polish the peripheral edge portion of the substrate W. According to an embodiment, as shown in the twenty-seventh aspect, the polishing head 50 may include a disk-shaped grinding wheel 180 fixed to a rotating shaft 181 extending in parallel with the surface of the substrate W. The rotating shaft 181 is coupled to a motor 182 fixed to the support structure 24 . The grinding wheel 180 is rotated by the motor 182, and the outer peripheral surface of the grinding wheel 180 is pressed against the peripheral edge portion of the substrate W to polish the peripheral edge portion of the substrate W. Since the other configurations and operations of the embodiments shown in the twenty-sixth and twenty-seventh drawings are the same as those in the thirteenth to seventeenth embodiments, the description thereof will not be repeated. The embodiments shown in Figs. 18 to 25 can also be applied to the embodiments shown in Figs. 26 and 27.

The above embodiments are described for the purpose of carrying out the invention by those having ordinary skill in the art to which the invention pertains. Those skilled in the art can of course form various modifications of the above-described embodiments, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the embodiments described, but should be interpreted broadly in accordance with the technical scope defined in the claims.

Claims (20)

 A polishing apparatus comprising: a substrate holding portion that holds a substrate; a polishing head that presses the polishing tool against the substrate; a support structure that supports the polishing head; and a base structure that is fixed to the substrate a support structure; and a reinforcing structure fixed to the support structure; the reinforcing structure has an anchoring mechanism, and the structure can be fixed to the base structure and can be separated therefrom.    A polishing apparatus according to claim 1, wherein the anchoring mechanism includes an actuator that presses the base structure.    A polishing apparatus according to claim 2, wherein the actuator is disposed outside the support structure.    A polishing apparatus according to claim 3, further comprising an operating system for operating the actuator, wherein the operating system is configured to cause the actuator to be changed in accordance with a polishing load of the polishing tool according to the polishing head. The way of force.    The polishing apparatus according to claim 2, wherein the base structure has a protruding portion that protrudes toward the actuator, and the actuator is disposed to face the protruding portion.    A polishing apparatus according to claim 5, further comprising an operating system for operating the actuator, wherein the operating system is configured to cause the actuator to be changed in accordance with a polishing load of the polishing tool according to the polishing head. The way of force.    The polishing apparatus according to claim 1, wherein the polishing apparatus further includes a connection mechanism that connects the polishing head and the support structure, and the connection mechanism includes a first connection mechanism that is fixed to the polishing head; And a second connecting mechanism fixed to the support structure; the first connecting mechanism and the second connecting mechanism are configured to be fixed to each other and separable from each other.    The polishing apparatus according to claim 7, wherein one of the first connection mechanism and the second connection mechanism includes an electromagnet, and the other of the first connection mechanism and the second connection mechanism includes a magnetic member.    The polishing apparatus of claim 7, wherein one of the first connection mechanism and the second connection mechanism includes a pair of air cylinders, and the other of the first connection mechanism and the second connection mechanism is disposed A portion between the pair of air cylinders.    The polishing apparatus according to claim 1, wherein the support structure includes at least one polishing head moving mechanism that moves the polishing head.    A polishing apparatus comprising: a substrate holding portion that holds a substrate; a polishing head that presses the polishing tool against the substrate; a support structure that supports the polishing head; and a base structure that is fixed to the substrate a support structure; and a connection mechanism that connects the polishing head and the support structure; the connection mechanism includes: a first connection mechanism fixed to the polishing head; and a second connection mechanism fixed to the support The structure; the first connecting mechanism and the second connecting mechanism are configured to be fixed to each other and separable from each other.    The polishing apparatus according to claim 11, wherein one of the first connection mechanism and the second connection mechanism includes an electromagnet, and the other of the first connection mechanism and the second connection mechanism includes a magnetic member.    The polishing apparatus of claim 11, wherein one of the first connection mechanism and the second connection mechanism includes a pair of air cylinders, and the other of the first connection mechanism and the second connection mechanism is disposed A portion between the pair of air cylinders.    The polishing apparatus according to claim 11, wherein the polishing apparatus further includes a reinforcing structure that is fixed to the support structure, wherein the reinforcing structure has an anchoring mechanism, and the structure is fixable to the base structure and Separated from it.    A polishing apparatus according to claim 14, wherein the anchoring mechanism includes an actuator that presses the base structure.    The polishing apparatus of claim 11, wherein the support structure comprises at least one polishing head moving mechanism that moves the polishing head.    A polishing method for fixing an anchoring mechanism fixed to a reinforcing structure of a support structure to a base structure, rotating the substrate with a substrate holding portion, and pressing the polishing tool with a polishing head supported by the support structure The substrate is polished on the substrate, and after the substrate is polished, the anchoring mechanism is separated from the base structure.    The polishing method of claim 17, further comprising the step of: connecting the first connection mechanism fixed to the polishing head to a second connection mechanism fixed to the support structure before polishing the substrate, the substrate After the polishing is completed, the first connecting mechanism is separated from the second connecting mechanism.    A polishing method is characterized in that a first connection mechanism fixed to a polishing head is coupled to a second connection mechanism fixed to a support structure for supporting the polishing head, and the substrate holding portion rotates the substrate, and the polishing head is used The polishing tool presses the substrate to polish the substrate, and after the substrate is polished, the first connection mechanism is separated from the second connection mechanism.    The polishing method according to claim 19, further comprising the step of fixing an anchoring mechanism fixed to the reinforcing structure of the support structure to the base structure before polishing the substrate, and after the substrate polishing is completed, The aforementioned anchoring mechanism is separated from the aforementioned basic structure.