JP6840617B2 - Polishing equipment and polishing method - Google Patents

Description

The present invention relates to a polishing apparatus and a polishing method for polishing a substrate such as a wafer, and more particularly to a polishing apparatus and a polishing method for pressing a polishing tool against a peripheral portion of the substrate to polish the peripheral portion.

A polishing device has been conventionally used for polishing the peripheral edge of a substrate. FIG. 28 is a schematic view showing a conventional polishing apparatus. The polishing apparatus shown in FIG. 28 has a substrate stage 300 for holding a substrate W such as a wafer, and a polishing head 307 for pressing a polishing tape 305, which is a polishing tool, against the substrate W. The polishing head 307 includes a pressing member 308 and an air cylinder 309. The polishing head 307 is supported by a support structure 311 fixed to the base 310.

The substrate W is held on the stage surface 300a of the substrate stage 300 by vacuum suction or the like, and is rotated around the axis thereof together with the substrate stage 300. The polishing tape 305, which is a polishing tool, is pressed against the peripheral edge of the substrate W by the pressing member 308. The pressing member 308 is connected to the air cylinder 309, and a force for pressing the polishing tape 305 against the substrate W is applied from the air cylinder 309 to the pressing member 308. During polishing of the substrate W, pure water is supplied to the center of the substrate W, and the upper surface of the substrate W is covered with pure water. The polishing tape 305 polishes the peripheral edge of the substrate W in the presence of pure water to form a stepped recess 312 having a right-angled cross section on the peripheral edge of the substrate W, as shown in FIG. 29.

Japanese Unexamined Patent Publication No. 2012-213849

However, when the pressing member 308 presses the polishing tape 305 against the peripheral edge of the substrate W, the reaction force from the substrate W acts on the polishing head 307. In response to this reaction force, the polishing head 307 and the support structure 311 are tilted upward in the direction indicated by the arrow X in FIG. 28, and the entire pressing member 308 is tilted. As a result, as shown in FIG. 30, the polishing tape 305 is obliquely pressed against the peripheral edge of the substrate W, and an obliquely polished surface is formed on the peripheral edge of the substrate W.

Therefore, an object of the present invention is to provide a polishing apparatus and a polishing method capable of preventing tilting of the polishing head during substrate polishing and achieving a desired polishing profile.

One aspect of the present invention is a polishing device for polishing a substrate, which comprises a substrate holding portion for holding the substrate, a polishing head for pressing a polishing tool against the substrate, a support structure for supporting the polishing head, and the like. A base structure to which the support structure is fixed and a reinforcing structure fixed to the support structure are provided, and the reinforcing structure has an anchor mechanism configured to be fixed and detachable to the base structure. The anchor mechanism includes an actuator that presses the base structure, the polishing device further includes an operating system that operates the actuator, and the operating system includes a polishing load that the polishing head presses against the polishing tool. It is a polishing apparatus characterized in that it is configured to generate a force that changes according to the above.

A preferred embodiment of the present invention is characterized in that the actuator is arranged outside the support structure .
A preferred embodiment of the present invention is characterized in that the base structure has a protrusion that projects toward the actuator, and the actuator is arranged so as to face the protrusion .

In a preferred embodiment of the present invention, the polishing apparatus further includes a connecting mechanism for connecting the polishing head and the support structure, and the connecting mechanism includes a first connecting mechanism fixed to the polishing head. A second connecting mechanism fixed to the support structure is provided, and the first connecting mechanism and the second connecting mechanism are configured to be fixed to each other and detachable from each other.
A preferred embodiment of the present invention is characterized in that one of the first connecting mechanism and the second connecting mechanism includes an electromagnet, and the other of the first connecting mechanism and the second connecting mechanism includes a magnetic member. And.
In a preferred embodiment of the present invention, one of the first connecting mechanism and the second connecting mechanism includes a pair of air cylinders, and the other of the first connecting mechanism and the second connecting mechanism has the pair of air. It is characterized by having a portion arranged between cylinders.
A preferred embodiment of the present invention is characterized in that the support structure includes at least one polishing head moving mechanism for moving the polishing head.

A reference example of the present invention includes a substrate holding portion that holds a substrate, a polishing head that presses a polishing tool against a substrate, a support structure that supports the polishing head, and a base structure to which the support structure is fixed. A connecting mechanism for connecting the polishing head and the support structure is provided, and the connecting mechanism comprises a first connecting mechanism fixed to the polishing head and a second connecting mechanism fixed to the support structure. The polishing apparatus is characterized in that the first connecting mechanism and the second connecting mechanism are configured to be fixed to each other and detachable from each other.

A preferred embodiment of this reference example is that one of the first connecting mechanism and the second connecting mechanism includes an electromagnet, and the other of the first connecting mechanism and the second connecting mechanism includes a magnetic member. It is a feature.
In a preferred embodiment of this reference example , one of the first connecting mechanism and the second connecting mechanism includes a pair of air cylinders, and the other of the first connecting mechanism and the second connecting mechanism is the pair. It is characterized by having a portion arranged between air cylinders.
In a preferred embodiment of this reference example, the polishing apparatus further comprises a reinforcing structure fixed to the supporting structure, and the reinforcing structure is configured to be fixable and detachable to the base structure. It is characterized by having an anchor mechanism.
A preferred embodiment of this reference example is that the anchor mechanism includes an actuator that presses the base structure.
A preferred embodiment of the present invention is characterized in that the support structure includes at least one polishing head moving mechanism for moving the polishing head.

In one aspect of the present invention, the anchor mechanism of the reinforcing structure fixed to the support structure is fixed to the base structure, and the anchor mechanism includes an actuator for pressing the base structure, and is provided with a substrate holding portion. while rotating the substrate, and while the polishing head generates a force that varies in accordance with the polishing load for pressing the polishing tool to the actuator, the by pressing the polishing tool on the substrate by the polishing head supported on the support structure The polishing method is characterized in that the substrate is polished and the anchor mechanism is separated from the base structure after the polishing of the substrate is completed.
In a preferred embodiment of the present invention, before polishing the substrate, the first connecting mechanism fixed to the polishing head is connected to the second connecting mechanism fixed to the support structure to polish the substrate. It is characterized by further including a step of disconnecting the first connecting mechanism from the second connecting mechanism after completion.

In one reference example of the present invention, the first connecting mechanism fixed to the polishing head is connected to the second connecting mechanism fixed to the support structure supporting the polishing head, and the substrate is rotated by the substrate holding portion. However, the polishing method is characterized in that the substrate is polished by pressing the polishing tool against the substrate with the polishing head, and the first connecting mechanism is separated from the second connecting mechanism after the polishing of the substrate is completed. is there.
In a preferred embodiment of this reference example , the anchor mechanism of the reinforcing structure fixed to the support structure is fixed to the base structure before polishing the substrate, and after the polishing of the substrate is completed, the anchor mechanism is fixed. It is characterized by further including a step of separating the base structure from the base structure.

According to the present invention, the support structure is reinforced by an anchor mechanism and / or a connecting mechanism. Therefore, the posture of the polishing head during substrate polishing is stable, and a desired polishing profile can be obtained.

1 (a) and 1 (b) are enlarged cross-sectional views showing a peripheral edge of a substrate. It is a top view which shows the polishing apparatus which concerns on one Embodiment of this invention. FIG. 2 is a cross-sectional view taken along the line FF of FIG. It is a figure seen from the direction indicated by the arrow G of FIG. It is a top view of the polishing head and the polishing tape supply mechanism. It is a front view of a polishing head and a polishing tape supply mechanism. FIG. 6 is a cross-sectional view taken along the line HH shown in FIG. It is a side view of the polishing tape supply mechanism shown in FIG. 6 is a vertical cross-sectional view of the polishing head shown in FIG. 6 as viewed from the direction indicated by the arrow I. It is a top view of the polishing head and the polishing tape supply mechanism in the polishing position. It is a schematic view which looked at the pressing member, the polishing tape, and the substrate at the polishing position from the side. It is a figure which shows the state which the polishing tape is pressed against the substrate by the pressing member. It is a schematic diagram which shows the polishing apparatus seen from the direction indicated by the arrow J of FIG. It is a schematic diagram which shows the operation system for operating the 1st actuator and the 2nd actuator. It is a schematic diagram which shows the other embodiment of the operation system. It is a schematic diagram which shows still another embodiment of the operation system. It is a figure which shows the other embodiment of a reinforced structure. It is a figure which shows still another embodiment of a reinforced structure. It is a schematic diagram which shows one Embodiment of the polishing apparatus provided with the connecting mechanism. It is a schematic diagram which shows the connection mechanism seen from the direction indicated by the arrow L of FIG. It is a schematic diagram which shows the other embodiment of the connection mechanism. 22 (a) to 22 (c) are schematic views illustrating an embodiment of the operation of the anchor mechanism and the connecting mechanism. 23 (a) to 23 (c) are schematic views illustrating an embodiment of the operation of the anchor mechanism and the connecting mechanism. 24 (a) to 24 (c) are schematic views illustrating an embodiment of the operation of the anchor mechanism and the connecting mechanism. 25 (a) and 25 (b) are schematic views illustrating an embodiment of the operation of the anchor mechanism and the connecting mechanism. It is a figure which shows one Embodiment of the polishing head provided with a grindstone as a polishing tool. It is a figure which shows one Embodiment of the polishing head provided with a grindstone as a polishing tool. It is a schematic diagram which shows the conventional polishing apparatus. It is sectional drawing which shows the step-like depression formed in the peripheral part of the substrate. It is a figure which shows the polishing tape obliquely pressed against the peripheral edge part of a substrate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the present specification, the peripheral edge portion of the substrate is defined as a region including a bevel portion located at the outermost periphery of the substrate and a top edge portion and a bottom edge portion located inside the bevel portion in the radial direction. An example of a substrate is a wafer.

1 (a) and 1 (b) are enlarged cross-sectional views showing a peripheral edge of a substrate. More specifically, FIG. 1A is a cross-sectional view of a so-called straight type substrate, and FIG. 1B is a cross-sectional view of a so-called round type substrate. In the substrate W of FIG. 1A, the bevel portion is a substrate W composed of an upper inclined portion (upper bevel portion) P, a lower inclined portion (lower bevel portion) Q, and a side portion (apex) R. It is the outermost peripheral surface (indicated by reference numeral B). In the substrate W of FIG. 1B, the bevel portion is a portion having a curved cross section (indicated by reference numeral B) that constitutes the outermost peripheral surface of the substrate W. The top edge portion is a flat portion E1 located radially inside the bevel portion B. The bottom edge portion is a flat portion E2 located on the opposite side of the top edge portion and located inward in the radial direction with respect to the bevel portion B. The top edge portion E1 may include a region in which the device is formed.

FIG. 2 is a plan view showing a polishing apparatus according to an embodiment of the present invention, FIG. 3 is a sectional view taken along line FF of FIG. 2, and FIG. 4 is from the direction indicated by the arrow G of FIG. It is a view.

The polishing apparatus according to the present embodiment includes a substrate holding portion 3 that holds a substrate W such as a wafer and rotates the substrate W, and a polishing unit 25 that polishes the substrate W on the substrate holding portion 3. 2 and 3 show a state in which the substrate holding portion 3 holds the substrate W. The substrate holding portion 3 includes a holding stage 4 that holds the lower surface of the substrate W by vacuum suction, a hollow shaft 5 connected to the central portion of the holding stage 4, and a motor M1 that rotates the hollow shaft 5. .. The substrate W is placed on the holding stage 4 so that the center of the substrate W coincides with the axial center CP of the hollow shaft 5.

As shown in FIG. 2, the polishing unit 25 supplies a polishing head 50 for polishing the peripheral edge of the substrate W with a polishing tape 38 as a polishing tool, and the polishing tape 38 to the polishing head 50, and the polishing head 50. It is provided with a polishing tape supply mechanism 70 for collecting the polishing tape 38 from the surface. The polishing head 50 is configured to press the polished surface of the polishing tape 38 against the top edge portion of the substrate W to form a stepped depression on the peripheral edge portion of the substrate W. The polishing unit 25 and the holding stage 4 are arranged in the polishing chamber 22 formed by the partition wall 20.

As shown in FIG. 3, the partition wall 20 is fixed on the base plate 21, and the lower portion of the substrate holding portion 3 extends through the bottom portion of the partition wall 20 and the base plate 21. In the present embodiment, the base structure 23 is composed of the bottom surface of the partition wall 20 and the base plate 21. A support structure 24 that supports the polishing head 50 is fixed to the base structure 23. The partition wall 20 is provided with a transport port 20a for loading and unloading the substrate W into and out of the polishing chamber 22. The transport port 20a can be closed by the shutter 20b.

The hollow shaft 5 is supported by a ball spline bearing (linear motion bearing) 6 so as to be vertically movable. A groove 4a is formed on the upper surface of the holding stage 4, and the groove 4a communicates with a communication passage 7 extending through the hollow shaft 5. The communication passage 7 is connected to the vacuum line 9 via a rotary joint 8 attached to the lower end of the hollow shaft 5. The communication passage 7 is also connected to a nitrogen gas supply line 10 for separating the processed substrate W from the holding stage 4. By switching between these vacuum lines 9 and the nitrogen gas supply line 10, the substrate W is held on the upper surface of the holding stage 4 and separated.

The hollow shaft 5 is rotated by the motor M1 via a pulley p1 connected to the hollow shaft 5, a pulley p2 attached to the rotating shaft of the motor M1, and a belt b1 hung on these pulleys p1 and p2. .. The ball spline bearing 6 is a bearing that allows the hollow shaft 5 to move freely in the longitudinal direction thereof. The ball spline bearing 6 is fixed to a cylindrical casing 12. Therefore, the hollow shaft 5 can move linearly up and down with respect to the casing 12, and the hollow shaft 5 and the casing 12 rotate integrally. The hollow shaft 5 is connected to an air cylinder (elevating mechanism) 15, and the hollow shaft 5 and the holding stage 4 can be raised and lowered by the air cylinder 15.

A radial bearing 18 is interposed between the casing 12 and the cylindrical casing 14 arranged concentrically on the outer side of the casing 12, and the casing 12 is rotatably supported by the bearing 18. With such a configuration, the substrate holding portion 3 can rotate the substrate W around its axial center CP and raise and lower the substrate W along the axial center CP.

A polishing unit 25 for polishing the peripheral edge of the substrate W is arranged on the outside of the substrate holding portion 3. The polishing unit 25 is arranged inside the polishing chamber 22. As shown in FIG. 4, the entire polishing unit 25 is fixed on the installation table 27. The installation base 27 is connected to the polishing head moving mechanism 30 via a support block 28. The polishing head moving mechanism 30 is fixed to the base plate 21. In the present embodiment, the support structure 24 that supports the polishing head 50 includes an installation base 27, a support block 28, and a polishing head moving mechanism 30. The support structure 24 extends through the base structure 23 composed of the bottom of the partition wall 20 and the base plate 21. The polishing head moving mechanism 30 forming the end portion of the support structure 24 is fixed to the lower surface of the base structure 23, that is, the lower surface of the base plate 21.

The polishing head moving mechanism 30 includes a ball screw mechanism 31 that slidably holds the support block 28, a motor 32 that drives the ball screw mechanism 31, and a power transmission mechanism 33 that connects the ball screw mechanism 31 and the motor 32. It has. The ball screw mechanism 31 includes a linear motion guide (not shown) that guides the moving direction of the support block 28. The power transmission mechanism 33 is composed of a pulley, a belt, and the like. When the motor 32 is operated, the ball screw mechanism 31 moves the support block 28 in the direction indicated by the arrow in FIG. 4, and the entire polishing unit 25 moves in the tangential direction of the substrate W. The polishing head moving mechanism 30 also functions as an oscillation mechanism for swinging the polishing unit 25 at a predetermined amplitude and a predetermined speed. In the present embodiment, the polishing head moving mechanism 30 constitutes a first polishing head moving mechanism that moves the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 in the first direction.

FIG. 5 is a plan view of the polishing head 50 and the polishing tape supply mechanism 70, FIG. 6 is a front view of the polishing head 50 and the polishing tape supply mechanism 70, and FIG. 7 is a sectional view taken along line OH shown in FIG. 8 is a side view of the polishing tape supply mechanism 70 shown in FIG. 6, and FIG. 9 is a vertical cross-sectional view of the polishing head 50 shown in FIG. 6 as viewed from the direction indicated by the arrow I.

Two linear motion guides 40A and 40B extending in parallel with the radial direction of the substrate W are arranged on the installation table 27. These linear motion guides 40A and 40B are arranged in parallel with each other. The polishing head 50 and the linear motion guide 40A are connected via a connecting block 41A. Further, the polishing head 50 is connected to a servomotor 42A and a ball screw mechanism 43A that move the polishing head 50 along the linear motion guide 40A (that is, in the radial direction of the substrate W). More specifically, the ball screw mechanism 43A is fixed to the connecting block 41A, and the servomotor 42A is fixed to the installation base 27 via the support member 44A. The servomotor 42A is configured to rotate the screw shaft of the ball screw mechanism 43A, whereby the connecting block 41A and the polishing head 50 connected to the connecting block 41A are moved along the linear motion guide 40A. In the present embodiment, the servomotor 42A, the ball screw mechanism 43A, and the linear motion guide 40A constitute a second polishing head moving mechanism that moves the polishing head 50 in a second direction perpendicular to the first direction.

Similarly, the polishing tape supply mechanism 70 and the linear motion guide 40B are connected via the connecting block 41B. Further, the polishing tape supply mechanism 70 is connected to a servomotor 42B and a ball screw mechanism 43B that move the polishing tape supply mechanism 70 along the linear motion guide 40B (that is, in the radial direction of the substrate W). More specifically, the ball screw mechanism 43B is fixed to the connecting block 41B, and the servomotor 42B is fixed to the installation base 27 via the support member 44B. The servomotor 42B is configured to rotate the screw shaft of the ball screw mechanism 43B, whereby the connecting block 41B and the polishing tape supply mechanism 70 connected to the connecting block 41B are moved along the linear motion guide 40B. .. In the present embodiment, the servomotor 42B, the ball screw mechanism 43B, and the linear motion guide 40B constitute a polishing tool moving mechanism for moving the polishing tape supply mechanism 70.

As shown in FIG. 9, the polishing head 50 includes a pressing member 51 for pressing the polishing tape 38 against the substrate W, a pressing member holder 52 for holding the pressing member 51, and the pressing member holder 52 and the pressing member 51. It is provided with an air cylinder 53 as a pressing device for moving the vehicle up and down. The air cylinder 53 is held by the holding member 55. Further, the holding member 55 is fixed to the installation member 57 fixed to the connecting block 41A. The polishing load that the pressing member 51 presses the polishing tape 38 against the substrate W is generated by the air cylinder 53.

The pressing member holder 52 is connected to the installation member 57 via a linear motion guide 58 extending in the vertical direction. When the pressing member holder 52 is pushed down by the air cylinder 53, the pressing member 51 moves downward along the linear motion guide 58, and the pressing member 51 presses the polishing tape 38 against the peripheral edge of the substrate W. Further, the air cylinder 53 can raise the pressing member holder 52 and the pressing member 51 along the linear motion guide 58. The pressing member 51 is formed of a resin such as PEEK (polyetheretherketone), a metal such as stainless steel, or a ceramic such as SiC (silicon carbide).

The pressing member 51 has a plurality of through holes 51a extending in the vertical direction, and a vacuum line 60 is connected to the through holes 51a. The vacuum line 60 is provided with a valve (not shown), and a vacuum is formed in the through hole 51a of the pressing member 51 by opening the valve. When a vacuum is formed in the through hole 51a in a state where the lower surface of the pressing member 51 is in contact with the upper surface of the polishing tape 38, the upper surface of the polishing tape 38 is held by the lower surface of the pressing member 51. The pressing member 51 may have only one through hole 51a. During polishing of the substrate W, a vacuum is formed in the through hole 51a, and the polishing tape 38 is held on the lower surface of the pressing member 51.

The pressing member holder 52, the air cylinder 53, the holding member 55, and the installation member 57 are housed in the box 62. The lower part of the pressing member holder 52 protrudes from the bottom of the box 62, and the pressing member 51 is attached to the lower part of the pressing member holder 52.

The polishing tape supply mechanism 70 includes a supply reel 71 for supplying the polishing tape 38 and a recovery reel 72 for collecting the polishing tape 38. The supply reel 71 and the recovery reel 72 are connected to the tension motors 73 and 74, respectively. These tension motors 73 and 74 can apply a predetermined tension to the polishing tape 38 by applying a predetermined torque to the supply reel 71 and the recovery reel 72.

A polishing tape feeding mechanism 76 is provided between the supply reel 71 and the recovery reel 72. The polishing tape feeding mechanism 76 includes a tape feeding roller 77 for feeding the polishing tape 38, a nip roller 78 for pressing the polishing tape 38 against the tape feeding roller 77, and a tape feeding motor 79 for rotating the tape feeding roller 77. There is. The polishing tape 38 is sandwiched between the nip roller 78 and the tape feed roller 77. By rotating the tape feed roller 77 in the direction indicated by the arrow in FIG. 6, the polishing tape 38 is fed from the supply reel 71 to the recovery reel 72.

The tension motors 73 and 74 and the tape feed motor 79 are installed on the base 81. The base 81 is fixed to the connecting block 41B. The base 81 has two support arms 82, 83 extending from the supply reel 71 and the recovery reel 72 toward the polishing head 50. A plurality of guide rollers 84A, 84B, 84C, 84D, 84E that support the polishing tape 38 are attached to the support arms 82, 83. The polishing tape 38 is guided by these guide rollers 84A to 84E so as to surround the polishing head 50.

The extending direction of the polishing tape 38 is perpendicular to the radial direction of the substrate W when viewed from above. The two guide rollers 84D and 84E located below the polishing head 50 support the polishing tape 38 so that the polishing surface of the polishing tape 38 is parallel to the surface (upper surface) of the substrate W. Further, the polishing tape 38 between the two guide rollers 84D and 84E extends parallel to the tangential direction of the substrate W. A gap is formed between the polishing tape 38 and the substrate W in the vertical direction.

The polishing device further includes a tape edge detection sensor 100 that detects the position of the edge of the polishing tape 38. The tape edge detection sensor 100 is a transmissive optical sensor. The tape edge detection sensor 100 has a light emitting unit 100A and a light receiving unit 100B. The light emitting unit 100A is fixed to the installation base 27 as shown in FIG. 5, and the light receiving unit 100B is fixed to the base plate 21 as shown in FIG. The tape edge detection sensor 100 is configured to detect the position of the edge portion of the polishing tape 38 from the amount of light received by the light receiving unit 100B.

When polishing the substrate W, as shown in FIG. 10, the polishing head 50 and the polishing tape supply mechanism 70 are moved to predetermined polishing positions by the servomotors 42A and 42B and the ball screw mechanisms 43A and 43B, respectively. The polishing tape 38 at the polishing position extends in the tangential direction of the substrate W. FIG. 11 is a schematic view of the pressing member 51, the polishing tape 38, and the substrate W at the polishing position as viewed from the lateral direction. As shown in FIG. 11, the polishing tape 38 is located above the peripheral edge of the substrate W, and the pressing member 51 is further located above the polishing tape 38.

FIG. 12 is a diagram showing a state in which the polishing tape 38 is pressed against the substrate W by the pressing member 51. In this embodiment, as shown in FIG. 12, the edge portion of the pressing member 51 at the polishing position and the edge portion of the polishing tape 38 coincide with each other. That is, the polishing head 50 and the polishing tape supply mechanism 70 are independently moved to the polishing positions so that the edge portion of the pressing member 51 and the edge portion of the polishing tape 38 coincide with each other. In one embodiment, the edge of the polishing tape 38 may protrude from the edge of the pressing member 51.

Next, the polishing operation of the polishing apparatus configured as described above will be described. The operation of the polishing apparatus described below is controlled by the operation control unit 11 shown in FIG. The substrate W is held by the substrate holding portion 3 so that the film (for example, the device layer) formed on the surface thereof faces upward, and the substrate W is further rotated about the axial CP of the substrate holding portion 3. To. A liquid (for example, pure water) is supplied to the center of the rotating substrate W from a liquid supply nozzle (not shown). As shown in FIG. 11, the pressing member 51 and the polishing tape 38 of the polishing head 50 are each moved to a predetermined polishing position.

Next, the air cylinder 53 (see FIG. 9) pushes down the pressing member 51, and as shown in FIG. 12, the pressing member 51 presses the polishing tape 38 against the peripheral edge of the substrate W with a predetermined polishing load. The polishing load can be adjusted by the pressure of the gas supplied to the air cylinder 53. The peripheral edge of the substrate W is polished by the sliding contact between the rotating substrate W and the polishing tape 38. That is, the polishing tape 38 can form a stepped recess 312 having a right-angled cross section as shown in FIG. 29.

In order to increase the polishing rate of the substrate W, the polishing tape 38 may be swung along the tangential direction of the substrate W by the polishing head moving mechanism 30 during the polishing of the substrate W. During polishing, a liquid (for example, pure water) is supplied to the central portion of the rotating substrate W, and the substrate W is polished in the presence of water. The liquid supplied to the substrate W spreads over the entire upper surface of the substrate W due to centrifugal force, thereby preventing polishing debris from adhering to the device formed on the substrate W. The polishing tape 38 is an elongated strip-shaped polishing tool. As a polishing tool for polishing the substrate W, a grindstone may be used instead of the polishing tape 38.

FIG. 13 is a schematic view showing a polishing apparatus viewed from the direction indicated by the arrow J in FIG. As shown in FIG. 13, the polishing head 50 is supported by the support structure 24. In the present embodiment, the support structure 24 is provided by the connecting block 41A (see FIG. 6), the linear motion guide 40A (see FIG. 6), the installation base 27 (see FIG. 6), the support block 28, and the polishing head moving mechanism 30. It is configured. One end of the support structure 24 is fixed to the polishing head 50, and the other end of the support structure 24 is fixed to the base plate 21 of the base structure 23.

The polishing device includes a reinforcing structure 110 fixed to the support structure 24. The reinforcing structure 110 has an anchor arm 111 fixed to the support structure 24 and an anchor mechanism 112 fixed to the anchor arm 111. The anchor mechanism 112 is configured to be fixed and detachable to the base structure 23. In the present embodiment, the anchor mechanism 112 includes a first air cylinder 114 and a second air cylinder 120 as actuators for pressing the base structure 23. The first air cylinder 114 and the second air cylinder 120 are fixed to both ends of the anchor arm 111. In one embodiment, the actuator that presses the base structure 23 may be a combination of a servomotor and a ball screw mechanism.

Compressed gas (for example, compressed air) is supplied to the pressurizing chamber 115 and the back pressure chamber 116 of the first air cylinder 114, respectively. Similarly, compressed gas (for example, compressed air) is supplied to the pressurizing chamber 121 and the back pressure chamber 122 of the second air cylinder 120, respectively. The first air cylinder 114 includes a first anchor member 117 fixed to the piston rod, and the second air cylinder 120 includes a second anchor member 123 fixed to the piston rod.

When the pressure of the compressed gas in the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120 is higher than the pressure of the compressed gas in the back pressure chambers 116 and 122, the first air cylinder 114 and the second air The cylinder 120 presses the upper surface (bottom of the partition wall 20) of the base structure 23 with the first anchor member 117 and the second anchor member 123, whereby the first air cylinder 114 and the second air cylinder 120 itself are pressed against the base structure. It can be fixed to 23. When the pressure of the compressed gas in the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120 is lower than the pressure of the compressed gas in the back pressure chambers 116 and 122, the first anchor member 117 and the second anchor The member 123 is separated from the base structure 23, whereby the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. Therefore, the polishing head moving mechanism 30 can move the polishing unit 25 and the anchor mechanism 112 in the tangential direction of the substrate W.

The first air cylinder 114, which is the first actuator, is arranged outside the support structure 24, and the second air cylinder 120, which is the second actuator, is arranged inside the support structure 24. More specifically, the first air cylinder 114 is a support structure 24 with respect to a direction in which a straight line K extending vertically from the axial center CP of the substrate holding portion 3 and connecting the axial center CP and the center of the pressing member 51 extends. The second air cylinder 120 is arranged outside the support structure 24. The first air cylinder 114 and the second air cylinder 120 are located above or above the base structure 23.

The compressed gas (for example, compressed air) is supplied to both the pressurizing chambers 115 and 121 and the back pressure chambers 116 and 122 of the first air cylinder 114 and the second air cylinder 120. When the pressure of the compressed gas in the pressurizing chambers 115 and 121 is lower than that of the compressed gas in the back pressure chambers 116 and 122, the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. When the pressure of the compressed gas in the pressurizing chambers 115 and 121 is higher than the pressure of the compressed gas in the back pressure chambers 116 and 122, the first air cylinder 114 and the second air cylinder 120 press the upper surface of the base structure 23. As a result, the support structure 24 is reinforced by the reinforcing structure 110. As a result, the posture of the polishing head 50 supported by the support structure 24 is stabilized. Therefore, the polishing head 50 can polish the substrate W to form a desired polishing profile. More specifically, the polishing head 50 can form a stepped recess 312 having a right-angled cross section as shown in FIG. 29 on the peripheral edge of the substrate W.

In particular, the first air cylinder 114 can cancel the reaction force acting on the polishing head 50 from the substrate W. Therefore, in one embodiment, only the first air cylinder 114 may be provided and the second air cylinder 120 may be omitted. Since the first air cylinder 114 can cancel the reaction force acting on the polishing head 50 from the substrate W, as a result, the posture of the polishing head 50 supported by the support structure 24 can be stabilized.

FIG. 14 is a schematic view showing an operation system for operating the first air cylinder 114 which is the first actuator and the second air cylinder 120 which is the second actuator. This operating system is a compressed gas supply system capable of operating the first air cylinder 114 and the second air cylinder 120. The operation system includes the operation control unit 11 described above.

As shown in FIG. 14, the operation system includes a pressurized gas supply line 131 connected to a compressed gas supply line (for example, a compressed air supply line) 130 provided in a factory where the polishing apparatus is installed, and a back pressure side. A gas supply line 132 is provided. The pressurizing side gas supply line 131 includes a main pressurizing side line 131a, a first pressurizing side branching line 131b and a second pressurizing side branching line 131c branching from the main pressurizing side line 131a. The main pressurizing side line 131a is connected to the compressed gas supply line 130. The first pressurizing side branch line 131b is connected to the pressurizing chamber 115 of the first air cylinder 114, and the second pressurizing side branch line 131c is connected to the pressurizing chamber 121 of the second air cylinder 120. A pressurizing side pressure regulator 134 and a pressurizing side pressure sensor 135 are attached to the main pressurizing side line 131a. A first pressurizing side on-off valve 137 is attached to the first pressurizing side branch line 131b, and a second pressurizing side on-off valve 138 is attached to the second pressurizing side branch line 131c.

The back pressure side gas supply line 132 has a main back pressure side line 132a, a first back pressure side branch line 132b and a second back pressure side branch line 132c that branch from the main back pressure side line 132a. The main back pressure side line 132a is connected to the compressed gas supply line 130. The first back pressure side branch line 132b is connected to the back pressure chamber 116 of the first air cylinder 114, and the second back pressure side branch line 132c is connected to the back pressure chamber 122 of the second air cylinder 120. A back pressure side pressure regulator 140 and a back pressure side pressure sensor 141 are attached to the main back pressure side line 132a. The first back pressure side on-off valve 143 is attached to the first back pressure side branch line 132b, and the second back pressure side on-off valve 144 is attached to the second back pressure side branch line 132c.

The operation control unit 11 includes the pressurizing side pressure regulator 134, the first pressurizing side on-off valve 137, the second pressurizing side on-off valve 138, the back pressure side pressure regulator 140, the first back pressure side on-off valve 143, and the second back pressure side on-off valve 144. The operation of these pressure regulators 134, 140 and valves 137, 138, 143, 144 are controlled by the operation control unit 11. The pressure sensors 135 and 141 may be omitted.

When the operation control unit 11 opens the first pressurizing side on-off valve 137 and the second pressurizing side on-off valve 138, the compressed gas causes the main pressurizing side line 131a, the first pressurizing side branch line 131b, and the second pressurizing side branch line 131c. It is supplied to the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120 through the cylinder. The operation control unit 11 transmits a command value of the pressurizing side target pressure to the pressurizing side pressure regulator 134, and the pressurizing side pressure regulator 134 is in the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120. Adjust the pressure of the compressed gas so that the pressure of the compressed gas is maintained at the pressure side target pressure.

When the operation control unit 11 opens the first back pressure side on-off valve 143 and the second back pressure side on-off valve 144, the compressed gas pushes the main back pressure side line 132a, the first back pressure side branch line 132b, and the second back pressure side branch line 132c. It is supplied to the back pressure chambers 116 and 122 of the first air cylinder 114 and the second air cylinder 120 through the air. The operation control unit 11 transmits a command value of the back pressure side target pressure to the back pressure side pressure regulator 140, and the back pressure side pressure regulator 140 is in the back pressure chambers 116 and 122 of the first air cylinder 114 and the second air cylinder 120. The pressure of the compressed gas is adjusted so that the pressure of the compressed gas is maintained at the back pressure side target pressure.

While the compressed gas is being supplied to the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120, the back pressure chambers 116 and 122 of the first air cylinder 114 and the second air cylinder 120 are also compressed gas. Is supplied. This is the first air cylinder 114 and the second air cylinder 120 regardless of disturbances such as fluctuations in the pressure of the compressed gas supplied from the compressed gas supply line 130 and fluctuations in the positions of the piston rods of the air cylinders 114 and 120. This is because it makes it possible to generate a stable force.

In one embodiment, when the first air cylinder 114 and the second air cylinder 120 are fixed to the base structure 23, the compressed gas is supplied to the pressurizing chambers 115 and 121 and supplied to the back pressure chambers 116 and 122. You don't have to. Further, when the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23, the compressed gas may be supplied to the back pressure chambers 116 and 122 and may not be supplied to the pressurizing chambers 115 and 121. ..

Compressed gas of the same pressure is supplied to the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120, and the back pressure chambers 116 and 122 of the first air cylinder 114 and the second air cylinder 120 are supplied with the same pressure. Since the compressed gas of the same pressure is supplied, the first air cylinder 114 and the second air cylinder 120 press the base structure 23 with the same force.

The first back pressure side on-off valve 143 and the second back pressure side on-off valve 144 may be kept open at all times. It is preferable that the operation control unit 11 opens the first back pressure side on-off valve 143 and the second back pressure side on-off valve 144 at the same time and closes them at the same time.

The operation control unit 11 may change the above-mentioned target pressure on the pressurizing side and / or the target pressure on the back pressure side according to the polishing load that the pressing member 51 presses the polishing tape 38 against the substrate W. For example, when the operation control unit 11 issues a command to the air cylinder 53 to increase the polishing load during polishing of the substrate W, the operation control unit 11 may increase the pressurizing side target pressure as the polishing load increases. By such an operation, the first air cylinder 114 and the second air cylinder 120 can press the base structure 23 with a force that changes according to the polishing load. As a result, the posture of the polishing head 50 during polishing of the substrate W can be more stabilized.

FIG. 15 is a schematic diagram showing another embodiment of the operation system. Since the configuration and operation of the present embodiment not particularly described are the same as those of the embodiment shown in FIG. 14 described above, the duplicate description thereof will be omitted. The operation system of the present embodiment is a compressed gas supply system capable of independently changing the forces generated by the first air cylinder 114 and the second air cylinder 120.

The operation system of the present embodiment pressurizes the compressed gas supply line 130 and the first air cylinder 114 in place of the main pressurizing side line 131a, the first pressurizing side branch line 131b, and the second pressurizing side branch line 131c described above. It includes a first pressurizing side line 131A connected to the chamber 115, and a second pressurizing side line 131B connected to the pressurized gas supply line 130 and the pressurizing chamber 121 of the second air cylinder 120. A first pressurizing side pressure regulator 134A, a first pressurizing side pressure sensor 135A, and a first pressurizing side on-off valve 137 are attached to the first pressurizing side line 131A. A second pressurizing side pressure regulator 134B, a second pressurizing side pressure sensor 135B, and a second pressurizing side on-off valve 138 are attached to the second pressurizing side line 131B. The pressure sensors 135A and 135B may be omitted. The first pressurizing side pressure regulator 134A adjusts the pressure of the compressed gas in the pressurizing chamber 115 of the first air cylinder 114, and the second pressurizing side pressure regulator 134B adjusts the pressure in the pressurizing chamber 121 of the second air cylinder 120. It is configured to regulate the pressure of the compressed gas.

The first pressurizing side pressure regulator 134A and the second pressurizing side pressure regulator 134B are connected to the operation control unit 11. The operation control unit 11 transmits a command value of the first pressurizing side target pressure to the first pressurizing side pressure regulator 134A, and the first pressurizing side pressure regulator 134A is a compressed gas in the pressurizing chamber 115 of the first air cylinder 114. The pressure of the compressed gas is adjusted so that the pressure of is maintained at the target pressure on the first pressurizing side. Similarly, the operation control unit 11 transmits the command value of the second pressurizing side target pressure to the second pressurizing side pressure regulator 134B, and the second pressurizing side pressure regulator 134B is inside the pressurizing chamber 121 of the second air cylinder 120. The pressure of the compressed gas is adjusted so that the pressure of the compressed gas is maintained at the target pressure on the second pressurizing side. An operating system having such a configuration can independently control the force with which the first air cylinder 114 and the second air cylinder 120 press the base structure 23.

The operation control unit 11 changes the first pressurizing side target pressure and / or the second pressurizing side target pressure and / or the back pressure side target pressure according to the polishing load that the pressing member 51 presses the polishing tape 38 against the substrate W. May be good. For example, when the operation control unit 11 issues a command to the air cylinder 53 to increase the polishing load during polishing of the substrate W, the operation control unit 11 may increase the first pressurizing side target pressure as the polishing load increases. By such an operation, the first air cylinder 114 and / or the second air cylinder 120 can press the base structure 23 with a force that changes according to the polishing load. As a result, the posture of the polishing head 50 during polishing of the substrate W can be more stabilized.

FIG. 16 is a schematic diagram showing still another embodiment of the operating system. The configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in FIG. The operation system of the present embodiment is a compressed gas supply system capable of independently changing the forces generated by the first air cylinder 114 and the second air cylinder 120.

In the operation system of the present embodiment, the back pressure of the compressed gas supply line 130 and the first air cylinder 114 is replaced with the main back pressure side line 132a, the first back pressure side branch line 132b, and the second back pressure side branch line 132c described above. It includes a first back pressure side line 132A connected to the chamber 116, and a second back pressure side line 132B connected to the back pressure chamber 122 of the compressed gas supply line 130 and the second air cylinder 120. A first back pressure side pressure regulator 140A, a first back pressure side pressure sensor 141A, and a first back pressure side on-off valve 143 are attached to the first back pressure side line 132A. A second back pressure side pressure regulator 140B, a second back pressure side pressure sensor 141B, and a second back pressure side on-off valve 144 are attached to the second back pressure side line 132B. The pressure sensors 141A and 141B may be omitted. The first back pressure side pressure regulator 140A adjusts the pressure of the compressed gas in the back pressure chamber 116 of the first air cylinder 114, and the second back pressure side pressure regulator 140B adjusts the pressure in the back pressure chamber 122 of the second air cylinder 120. It is configured to regulate the pressure of the compressed gas.

The first back pressure side pressure regulator 140A and the second back pressure side pressure regulator 140B are connected to the operation control unit 11. The operation control unit 11 transmits the command value of the first back pressure side target pressure to the first back pressure side pressure regulator 140A, and the first back pressure side pressure regulator 140A is the compressed gas in the back pressure chamber 116 of the first air cylinder 114. The pressure of the compressed gas is adjusted so that the pressure of is maintained at the target pressure on the first back pressure side. Similarly, the operation control unit 11 transmits the command value of the second back pressure side target pressure to the second back pressure side pressure regulator 140B, and the second back pressure side pressure regulator 140B is inside the back pressure chamber 122 of the second air cylinder 120. The pressure of the compressed gas is adjusted so that the pressure of the compressed gas is maintained at the target pressure on the second back pressure side. An operating system having such a configuration can independently control the force with which the first air cylinder 114 and the second air cylinder 120 press the base structure 23.

FIG. 17 is a diagram showing another embodiment of the reinforcing structure 110. The configuration and operation of the present embodiment, which are not particularly described, are the same as those of the embodiment shown in FIG. 13 described above, and thus the duplicate description thereof will be omitted. The reinforcing structure 110 of the present embodiment includes a first air cylinder 114 and a second air cylinder 120 arranged inside the support structure 24. The first air cylinder 114 is located below the second air cylinder 120, and the first air cylinder 114 and the second air cylinder 120 face each other. The first air cylinder 114 and the second air cylinder 120 are fixed to the anchor arm 111, and the anchor arm 111 is fixed to the support structure 24.

The base structure 23 includes a protrusion 150 that projects from the base plate 21 toward the first air cylinder 114 and the second air cylinder 120. The end of the protrusion 150 is fixed to the base plate 21 of the base structure 23. The protruding portion 150 has a horizontal portion 150a, and the horizontal portion 150a is located between the first air cylinder 114 and the second air cylinder 120. More specifically, the horizontal portion 150a of the protruding portion 150 is arranged between the first anchor member 117 of the first air cylinder 114 and the second anchor member 123 of the second air cylinder 120. The first air cylinder 114 is located below the horizontal portion 150a and faces the lower surface of the horizontal portion 150a. The second air cylinder 120 is located above the horizontal portion 150a and faces the upper surface of the horizontal portion 150a.

When the pressure of the compressed gas in the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120 is higher than the pressure of the compressed gas in the back pressure chambers 116 and 122, the first air cylinder 114 and the second air The cylinder 120 sandwiches the horizontal portion 150a of the projecting portion 150 between the first anchor member 117 and the second anchor member 123, whereby the first air cylinder 114 and the second air cylinder 120 itself are fixed to the base structure 23. Can be done. When the pressure of the compressed gas in the pressurizing chambers 115 and 121 of the first air cylinder 114 and the second air cylinder 120 is lower than the pressure of the compressed gas in the back pressure chambers 116 and 122, the first anchor member 117 and the second anchor The member 123 is separated from the horizontal portion 150a of the protruding portion 150, whereby the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. Therefore, the polishing head moving mechanism 30 can move the polishing unit 25 and the anchor mechanism 112 in the tangential direction of the substrate W.

FIG. 18 is a diagram showing still another embodiment of the reinforcing structure 110. The reinforcing structure 110 of the present embodiment includes a first air cylinder 114 and a second air cylinder 120 arranged outside the support structure 24. The first air cylinder 114 is located above the second air cylinder 120. More specifically, the first air cylinder 114 is located above the horizontal portion 150a and faces the upper surface of the horizontal portion 150a. The second air cylinder 120 is located below the horizontal portion 150a and faces the lower surface of the horizontal portion 150a. Other configurations and operations of the present embodiment are the same as those of the embodiment shown in FIG. 17 described above, and thus the overlapping description thereof will be omitted.

In FIGS. 17 and 18, in one embodiment, only the first air cylinder 114 may be provided, and the second air cylinder 120 may be omitted. Since the first air cylinder 114 can cancel the reaction force acting on the polishing head 50 from the substrate W, as a result, the posture of the polishing head 50 supported by the support structure 24 can be stabilized.

FIG. 19 is a schematic view showing an embodiment of a polishing device provided with a connecting mechanism. In addition to the anchor mechanism 112 described above, the polishing device of the present embodiment further includes a connecting mechanism 160 for connecting the polishing head 50 and the support structure 24. In FIG. 19, the above-mentioned anchor mechanism 112 is not shown. The connecting mechanism 160 includes a first connecting mechanism 161 fixed to the installation member 57 of the polishing head 50 and a second connecting mechanism 162 fixed to the support block 28 of the support structure 24. The first connecting mechanism 161 and the second connecting mechanism 162 are configured to be fixed to each other and separable from each other. The connecting mechanism 160 is arranged inside the support structure 24. More specifically, the connecting mechanism 160 is more than the support structure 24 with respect to the extending direction of the straight line K extending vertically from the axial center CP of the substrate holding portion 3 and connecting the axial center CP and the center of the pressing member 51. It is located inside. In one embodiment, the coupling mechanism 160 may be arranged outside the support structure 24.

FIG. 20 is a schematic view showing the connecting mechanism 160 as viewed from the direction indicated by the arrow L in FIG. As shown in FIG. 20, in the present embodiment, the first connecting mechanism 161 includes a magnetic member 164, and the second connecting mechanism 162 includes an electromagnet 165. The entire first connecting mechanism 161 may be composed of a magnetic member. In one embodiment, the first connecting mechanism 161 may include an electromagnet 165 and the second connecting mechanism 162 may include a magnetic member 164. In this case as well, the entire second connecting mechanism 162 may be composed of a magnetic member.

The operation of the electromagnet 165 is controlled by the operation control unit 11. The magnetic member 164 is made of a corrosion-resistant metal such as stainless steel. The electromagnet 165 is arranged at a position facing the magnetic member 164. When the liquid (for example, pure water) supplied to the upper surface of the substrate W comes into contact with the electromagnet 165, the electromagnet 165 rusts, which may cause contamination of the substrate W. Therefore, in order to prevent the electromagnet 165 from rusting, it is preferable that the surface of the electromagnet 165 in contact with the magnetic member 164 is formed of a surface that has been subjected to a rust preventive treatment such as unichrome treatment.

When the electromagnet 165 is not operating, the first connecting mechanism 161 and the second connecting mechanism 162 are separated from each other. Therefore, the polishing head 50 is moved in the direction closer to the axis CP of the substrate holding portion 3 and in the direction away from the axis CP by the second polishing head moving mechanism (servomotor 42A, ball screw mechanism 43A, and linear motion guide 40A). You can move. When the operation control unit 11 operates the electromagnet 165, the electromagnet 165 attracts the magnetic member 164, and the first connecting mechanism 161 and the second connecting mechanism 162 are fixed to each other.

When the substrate W is being polished, the movable portion of the linear motion guide 40A constituting the second polishing head moving mechanism may be slightly displaced due to the reaction force of the polishing load. As a result, the polishing head 50 may be tilted. According to the present embodiment, when the pressing member 51 is in the polishing position (for example, immediately before the polishing of the substrate W is started), the electromagnet 165 is operated to perform the polishing head 50 when the substrate W is being polished. The posture can be stabilized. After the polishing of the substrate W is completed, the operation control unit 11 stops the operation of the electromagnet 165 and separates the first connecting mechanism 161 and the second connecting mechanism 162 from each other.

FIG. 21 is a schematic view showing another embodiment of the connecting mechanism 160. Since the configuration and operation of the present embodiment not particularly described are the same as those of the embodiment shown in FIG. 20, the duplicated description will be omitted. In the present embodiment, the first connecting mechanism 161 includes a horizontal portion 166, and the second connecting mechanism 162 includes an arm block 168, a third air cylinder 170, and a fourth air cylinder 171. The arm block 168 has an L shape and is fixed to the support block 28 of the support structure 24. The third air cylinder 170 is fixed to the arm block 168, and the fourth air cylinder 171 is fixed to the support block 28 of the support structure 24.

The third air cylinder 170 is arranged above the fourth air cylinder 171, and the horizontal portion 166 of the first connecting mechanism 161 is located between the third air cylinder 170 and the fourth air cylinder 171. In one embodiment, the second connecting mechanism 162 may include a horizontal portion 166, and the first connecting mechanism 161 may include a third air cylinder 170 and a fourth air cylinder 171. The operation of the third air cylinder 170 and the fourth air cylinder 171 is controlled by a pressure regulator 173 and a pressure regulator 174 for adjusting the pressure of the compressed gas in the pressurizing chamber and the back pressure chamber of the air cylinders 170 and 171. .. The operation of the pressure regulator 173 and the pressure regulator 174 is controlled by the operation control unit 11.

When the third air cylinder 170 and the fourth air cylinder 171 are separated from the horizontal portion 166, the first connecting mechanism 161 and the second connecting mechanism 162 are separated from each other. Therefore, the polishing head 50 is moved in the direction closer to the axis CP of the substrate holding portion 3 and in the direction away from the axis CP by the second polishing head moving mechanism (servomotor 42A, ball screw mechanism 43A, and linear motion guide 40A). You can move. When the horizontal portion 166 is sandwiched between the third air cylinder 170 and the fourth air cylinder 171, the first connecting mechanism 161 and the second connecting mechanism 162 are fixed to each other, and the posture of the polishing head 50 is stabilized.

Next, an embodiment of the operation of the anchor mechanism 112 and the connecting mechanism 160 described above will be described. In step 1, as shown in FIG. 22A, the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 is in the retracted position. When the polishing unit 25 is in the retracted position, the operation control unit 11 issues a command to the substrate holding unit 3 to rotate the substrate W around the axis CP. Further, a liquid (for example, pure water) is supplied to the upper surface of the substrate W from the liquid supply nozzle. In FIG. 22A, the positions and shapes of the first air cylinder 114, the second air cylinder 120, and the connecting mechanism 160 are schematically drawn. The white circles indicating the first air cylinder 114 and the second air cylinder 120 constituting the anchor mechanism 112 indicate a state in which the first air cylinder 114 and the second air cylinder 120 are separated from the base structure 23. Similarly, the white circles indicating the connecting mechanism 160 indicate a state in which the first connecting mechanism 161 and the second connecting mechanism 162 constituting the connecting mechanism 160 are separated from each other.

In step 2, as shown in FIG. 22B, the motion control unit 11 operates the first polishing head moving mechanism 30 to move the polishing unit 25 in the first direction, and the pressing member of the polishing head 50. The 51 and the polishing tape 38 are brought close to the substrate W on the substrate holding portion 3. In step 3, as shown in FIG. 22 (c), the motion control unit 11 presses the first air cylinder 114 and the second air cylinder 120 constituting the anchor mechanism 112 against the base structure 23, and the first air cylinder 114 And the second air cylinder 120 is fixed to the base structure 23. The black circles indicating the first air cylinder 114 and the second air cylinder 120 indicate a state in which the first air cylinder 114 and the second air cylinder 120 are pressing the base structure 23.

In step 4, as shown in FIG. 23A, the motion control unit 11 operates the servomotor 42A (second polishing head moving mechanism) and the servomotor 42B (polishing tool moving mechanism) to polish the pressing member 51 and the polishing tool. The polishing head 50 and the polishing tape supply mechanism 70 are moved toward the axial center CP of the substrate holding portion 3 until the tape 38 is located above the peripheral edge portion of the substrate W on the substrate holding portion 3. In step 5, as shown in FIG. 23B, the motion control unit 11 fixes the first connecting mechanism 161 and the second connecting mechanism 162 to each other. Specifically, the operation control unit 11 operates the electromagnet 165 shown in FIG. 20, or sandwiches the horizontal portion 166 between the third air cylinder 170 and the fourth air cylinder 171 shown in FIG. 21. The black circle indicating the connecting mechanism 160 indicates a state in which the first connecting mechanism 161 and the second connecting mechanism 162 are fixed to each other.

In step 6, as shown in FIG. 23 (c), the first air cylinder 114 and the second air cylinder 120 are fixed to the base structure 23, and the first connecting mechanism 161 and the second connecting mechanism 162 are fixed to each other. In this state, the polishing head 50 lowers the pressing member 51, and the pressing member 51 presses the polishing tape 38 against the peripheral edge of the substrate W. The black pressing member 51 shows a state in which the pressing member 51 presses the polishing tape 38 against the peripheral edge of the substrate W. The polishing tape 38 is slidably contacted with the peripheral edge of the substrate W in the presence of a liquid to polish the peripheral edge of the substrate W.

In step 7, as shown in FIG. 24A, the polishing head 50 raises the pressing member 51 to separate the polishing tape 38 from the peripheral edge of the substrate W. This completes the polishing of the substrate W. The white pressing member 51 indicates a state in which the pressing member 51 is raised and the polishing tape 38 is separated from the peripheral edge portion of the substrate W. In step 8, as shown in FIG. 24B, the first connecting mechanism 161 and the second connecting mechanism 162 are separated from each other. In step 9, as shown in FIG. 24 (c), the motion control unit 11 operates the servomotor 42A (second polishing head moving mechanism) and the servomotor 42B (polishing tool moving mechanism) to polish the polishing head 50 and polishing. The tape supply mechanism 70 is moved in a direction away from the axial center CP of the substrate holding portion 3.

In step 10, as shown in FIG. 25A, the motion control unit 11 separates the first air cylinder 114 and the second air cylinder 120 constituting the anchor mechanism 112 from the base structure 23. In step 11, as shown in FIG. 25B, the operation control unit 11 operates the first polishing head moving mechanism 30 to bring the polishing unit 25 including the polishing head 50 and the polishing tape supply mechanism 70 to the retracted position. Move. Although not shown, in step 12, the rotation of the substrate W is stopped, and the supply of the liquid to the upper surface of the substrate W is stopped.

In the above-described embodiment, the polishing device includes both the anchor mechanism 112 and the connecting mechanism 160, but in one embodiment, the polishing device may include only one of the anchor mechanism 112 and the connecting mechanism 160. Good.

The polishing tool for polishing the substrate W may be a grindstone. For example, as shown in FIG. 26, the polishing head 50 may be provided with one or more grindstones 180 on its lower surface. The polishing head 50 shown in FIG. 26 is fixed to the support structure 24. The polishing head 50 polishes the peripheral edge of the substrate W by pressing a plurality of grindstones 180 as polishing tools against the peripheral edge of the substrate W while rotating around its axis. In one embodiment, as shown in FIG. 27, the polishing head 50 may include a disc-shaped grindstone 180 fixed to a rotating shaft 181 extending parallel to the surface of the substrate W. The rotating shaft 181 is connected to a motor 182 fixed to the support structure 24. While the motor 182 rotates the grindstone 180, the outer peripheral surface of the grindstone 180 is pressed against the peripheral edge portion of the substrate W to polish the peripheral edge portion of the substrate W. Since the other configurations and operations of the embodiments shown in FIGS. 26 and 27 are the same as those of the embodiments shown in FIGS. 13 to 17, the duplicated description thereof will be omitted. The embodiments shown in FIGS. 18 to 25 are also applicable to the embodiments shown in FIGS. 26 and 27.

The above-described embodiment is described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention belongs to carry out the present invention. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is construed in the broadest range according to the technical idea defined by the claims.

3 Board holding part 4 Holding stage 5 Hollow shaft 6 Ball spline bearing (linear motion bearing)
7 consecutive passages 8 rotary joints 9 vacuum line 10 nitrogen gas supply line 11 operation control unit 12 casing 14 casing 15 air cylinder (elevating mechanism)
18 Radial bearing 20 Partition 21 Base plate 22 Polishing chamber 23 Base structure 24 Support structure 25 Polishing unit 27 Installation stand 28 Support block 30 Polishing head movement mechanism 31 Ball screw mechanism 32 Motor 33 Power transmission mechanism 38 Polishing tape 40A, 40B Linear motion Guides 41A, 41B Connecting blocks 42A, 42B Servo motors 43A, 43B Ball screw mechanism 44A, 44B Support member 50 Polishing head 51 Pressing member 52 Pressing member holder 53 Air cylinder 55 Holding member 57 Installation member 58 Linear guide 60 Vacuum line 62 Box 70 Polishing tape supply mechanism 71 Supply reel 72 Recovery reel 73,74 Tension motor 76 Polishing tape feed mechanism 77 Tape feed roller 78 Nip roller 79 Tape feed motor 81 Base 82,83 Support arm 84A, 84B, 84C, 84D, 84E Guide roller 100 Tape edge detection sensor 100A Light emitting part 100B Light receiving part 110 Reinforcing structure 111 Anchor arm 112 Anchor mechanism 114 First air cylinder 115 Pressurizing chamber 116 Back pressure chamber 117 First anchor member 120 Second air cylinder 121 Pressurizing chamber 122 Back pressure chamber 123 Second anchor member 130 Compressed gas supply line 131 Pressurized gas supply line 131a Main pressurizing side line 131b First pressurizing side branch line 131c Second pressurizing side branch line 131A First pressurizing side line 131B Second pressurizing side line 132 Back pressure side gas supply line 132a Main back pressure side line 132b 1st back pressure side branch line 132c 2nd back pressure side branch line 132A 1st back pressure side line 132B 2nd back pressure side line 134 Pressurization side pressure regulator 134A 1st pressure side pressure regulator 134B 2nd pressurizing side pressure regulator 135 Pressurizing side pressure sensor 135A 1st pressurizing side pressure sensor 135B 2nd pressurizing side pressure sensor 137 1st pressurizing side on-off valve 138 2nd pressurizing side on-off valve 140 Back pressure side pressure regulator 140A 1st back pressure side pressure Regulator 140B 2nd back pressure side pressure regulator 141 Back pressure side pressure sensor 141A 1st back pressure side pressure sensor 141B 2nd back pressure side pressure sensor 143 1st back pressure side on-off valve 144 2nd back pressure side on-off valve 150 Protruding part 150a Horizontal part 160 Connecting mechanism 161 1st connecting mechanism 162 2nd connecting mechanism 164 Magnetic member 165 Electromagnet 166 Horizontal part 168 Arm block 170 3rd air cylinder 171 4th air cylinder 173 Pressure regulator 174 Pressure regulator p1, p2 Pulley b1 Belt M1 Motor W board

Claims (9)

A polishing device for polishing a substrate,
The board holding part that holds the board and
A polishing head that presses the polishing tool against the substrate,
A support structure that supports the polishing head and
A base structure to which the support structure is fixed and
A reinforcing structure fixed to the support structure is provided.
The reinforcing structure has an anchor mechanism configured to be fixed and detachable to the base structure .
The anchor mechanism comprises an actuator that presses the base structure.
The polishing device further includes an operating system for operating the actuator.
The operation system is a polishing apparatus characterized in that the polishing head is configured to generate a force on the actuator that changes according to a polishing load that presses the polishing tool. The polishing apparatus according to claim 1 , wherein the actuator is arranged outside the support structure. The base structure has a protrusion that projects toward the actuator.
The polishing apparatus according to claim 1 , wherein the actuator is arranged so as to face the protruding portion. The polishing device further includes a connecting mechanism for connecting the polishing head and the support structure.
The connecting mechanism includes a first connecting mechanism fixed to the polishing head and a second connecting mechanism fixed to the support structure, and the first connecting mechanism and the second connecting mechanism can be fixed to each other. The polishing apparatus according to claim 1, wherein the polishing apparatus is configured to be separable from each other. The fourth aspect of claim 4, wherein one of the first connecting mechanism and the second connecting mechanism includes an electromagnet, and the other of the first connecting mechanism and the second connecting mechanism includes a magnetic member. Polishing device. One of the first connecting mechanism and the second connecting mechanism includes a pair of air cylinders, and the other of the first connecting mechanism and the second connecting mechanism is arranged between the pair of air cylinders. The polishing apparatus according to claim 4 , wherein the polishing apparatus has a portion. The polishing apparatus according to claim 1, wherein the support structure includes at least one polishing head moving mechanism for moving the polishing head. The anchor mechanism of the reinforcing structure fixed to the support structure is fixed to the base structure, and the anchor mechanism includes an actuator for pressing the base structure.
While rotating the substrate by the substrate holder, and while the polishing head generates a force that varies in accordance with the polishing load for pressing the polishing tool to the actuator, the polishing tool on the substrate by the polishing head supported on the support structure By pressing, the substrate is polished and
A polishing method characterized in that the anchor mechanism is separated from the base structure after the polishing of the substrate is completed. Before polishing the substrate, the first connecting mechanism fixed to the polishing head is connected to the second connecting mechanism fixed to the support structure.
The polishing method according to claim 8 , further comprising a step of disconnecting the first connecting mechanism from the second connecting mechanism after the polishing of the substrate is completed.

Images