TW201840790A - Adhesive laminated film and structure - Google Patents

Abstract

An adhesive laminated film (50) adapted to protect the surface of an indium tin oxide (ITO) film, comprising a substrate layer (10) and an adhesive resin layer (20) disposed on one of the surfaces of the substrate layer (10) is provided. Moreover, in a temperature dependence curve of a dissipation factor (tan[delta]) of the adhesive resin layer (20) obtained by a dynamic viscoelasticity test performed at a heating rate of 5 DEG C/min and a frequency of 1 Hz, the adhesive laminated film (50) of the embodiment is observed to have a first peak having a peak top temperature of 0 DEG C or more.

Description

Adhesive laminated film and structure

The present invention relates to an adhesive laminate film and structure.

A transparent conductive film formed with an indium tin oxide (ITO) film is used for a touch panel or electronic paper. In order to prevent dirt or damage on the surface, the surface protective film may be bonded to the transparent conductive film.

The technique described in the patent document 1 (Japanese Patent Laid-Open Publication No. 2015-202681) is mentioned.

Patent Document 1 discloses a surface protective film for a conductive film, which is a surface protective film for protecting a surface of the transparent conductive film opposite to the surface on which the transparent conductive film is formed, and is characterized in that the polyester is laminated. The film has a coating layer on at least one side thereof, and when heated at 150 ° C for 90 minutes, the amount of ester cyclic trimer precipitated on the surface of the coating layer is 1.2 mg/m ² or less. [Prior Art Document] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 2015-202681

[Problems to be Solved by the Invention] According to the study by the inventors of the present invention, the surface protective film used for the transparent conductive film on which the ITO film is formed has the following problems. First, in order to perform crystallization treatment of the ITO film, heat treatment may be performed in a state in which the surface protective film is attached to the ITO film side of the transparent conductive film. The present inventors have found that when the surface protective film is attached to the ITO film and heat-treated, a residual gel phenomenon in which a part of the adhesive resin layer remains on the ITO film may occur after the heat treatment.

The present invention has been made in view of the above circumstances, and provides an adhesive laminated film capable of suppressing residual glue on an ITO film when heat-treated in a state of being attached to an ITO film. [Means for solving the problem]

The inventors of the present invention have repeatedly conducted intensive studies in order to achieve the above problems. As a result, it was found that the peak top temperature in the temperature dependence curve of the loss tangent (tan δ) of the adhesive resin layer was used as the ITO film for suppressing heat treatment in the state of being attached to the ITO film. The design of the adhesive film of the residual adhesive is effective, and the present invention has been completed.

According to the invention, the adhesive laminated film and the structure shown below are provided.

[1] An adhesive laminated film which is an adhesive laminated film for protecting a surface of an indium tin oxide (ITO) film, comprising a base material layer, and an adhesive resin provided on one surface of the base material layer The temperature dependence curve of the loss tangent (tan δ) of the adhesive resin layer obtained by dynamic viscoelasticity measurement under the conditions of a temperature increase rate of 5 ° C/min and a frequency of 1 Hz was observed. The peak top temperature is the first peak of 0 ° C or more. [2] The adhesive laminate film according to [1], wherein a peak top temperature of the first peak is 45 ° C or lower. [3] The adhesive laminated film according to the above [1], wherein the adhesive resin layer contains an adhesive resin (P1) having a glass transition temperature of 5 ° C or more and 50 ° C or less and glass transfer. Adhesive resin (P2) having a temperature of -50 ° C or more and less than 5 ° C. [4] The adhesive laminate film according to [3], wherein the peak top temperature of the first peak corresponds to a glass transition temperature of the adhesive resin (P1). [5] The adhesive laminated film according to any one of [1] to [4] wherein the ITO film deposited by the base film and the adhesive resin layer are measured by the following method The peel strength (P ₀ ) between them is 0.01 N/25 mm or more and 1.0 N/25 mm or less. (Measurement Method of Peel Strength) The adhesive laminated film is attached to the ITO film so that the adhesive resin layer is in contact with the ITO film deposited by the base film. Then, the adhesive laminated film was peeled from the ITO film in a 180-degree direction at 23 ° C and a tensile speed of 300 mm/min using a tensile tester, and the strength at this time (N/) 25 mm) as the peel strength. [6] The adhesive laminated film according to any one of [1], wherein the adhesive resin layer is in contact with the ITO film deposited by the base film. When the adhesive laminated film is attached to the ITO film, and the obtained structure is heat-treated at 150 ° C for 60 minutes, the ITO film deposited by the substrate film measured by the following method is used. The peel strength (P ₁ ) between the adhesive resin layer and the adhesive resin layer is 0.1 N/25 mm or more and 1.0 N/25 mm or less. (Method for Measuring Peel Strength) The adhesive laminated film was peeled from the ITO film in a 180-degree direction at 23 ° C and a tensile speed of 300 mm/min using a tensile tester. The strength (N/25 mm) was taken as the peel strength. [7] The adhesive laminated film according to any one of the above [1], wherein the adhesive resin layer has a thickness of 1 μm or more and 50 μm or less. [8] The adhesive laminated film according to any one of [1], wherein the resin constituting the base material layer is selected from the group consisting of polyolefin, polyester, polyamide, and polyacrylate. , polymethacrylate, polyvinyl chloride, polyvinylidene chloride, polyimine, polyetherimine, ethylene-vinyl acetate copolymer, polyacrylonitrile, polycarbonate, polystyrene, ion polymerization One or more of the substance, polyfluorene, polyether oxime and polyphenylene ether. [9] A structure comprising: an indium tin oxide (ITO) film, and a surface protective film attached to the ITO film, and the surface protective film is as described in [1] to [8] An adhesive laminated film as described in any one of the inventions. [Effects of the Invention]

According to the invention, it is possible to provide an adhesive laminated film capable of suppressing residual glue on the ITO film when heat-treated in a state of being attached to the ITO film.

Hereinafter, embodiments of the present invention will be described using the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description is omitted as appropriate. In addition, the figure is a schematic view and does not match the actual size ratio. In addition, "A to B" of the numerical range means A or more and B or less unless otherwise specified. In the present embodiment, "(meth)acrylic acid" means both acrylic acid, methacrylic acid, or both acrylic acid and methacrylic acid.

1. Adhesive laminated film The adhesive laminated film 50 of this embodiment is demonstrated below. FIG. 1 is a cross-sectional view showing an example of a configuration of an adhesive laminated film 50 according to an embodiment of the present invention.

As shown in FIG. 1, the adhesive build-up film 50 of the present embodiment is an adhesive build-up film for protecting the surface of an indium tin oxide (ITO) film, and includes a base material layer 10 and a substrate layer 10 disposed therein. A surface of the adhesive resin layer 20. In the adhesive laminated film 50 of the present embodiment, the loss tangent (tan δ) of the adhesive resin layer 20 obtained by dynamic viscoelasticity measurement under the conditions of a temperature increase rate of 5 ° C/min and a frequency of 1 Hz. In the temperature dependency curve, the first peak having a peak top temperature of 0 ° C or more was observed.

According to the study by the inventors of the present invention, it has been found that when the surface protective film is attached to the ITO film, heat treatment may cause a part of the adhesive resin layer to remain on the ITO film after the heat treatment. Glue phenomenon. Further, the inventors of the present invention have repeatedly conducted diligent research in order to achieve the above problems. As a result, it was found for the first time that the peak top temperature in the temperature dependence curve of the loss tangent (tan δ) of the adhesive resin layer is used as a reference for suppressing the residue on the ITO film when heat-treated in a state of being attached to the ITO film. The design of the adhesive film of the glue is effective. In the temperature-dependent curve of the loss tangent (tan δ) of the adhesive resin layer 20, the first peak having a peak top temperature of 0 ° C or more is observed in the temperature-dependent curve of the adhesive laminated film 50, and can be suppressed. Residual glue on the ITO film when heat treatment is performed in the state of being attached to the ITO film.

In the adhesive laminated film 50 of the present embodiment, the lower limit of the peak top temperature of the first peak is further suppressed from the viewpoint of the residual glue on the ITO film when the heat treatment is performed in the state of being attached to the ITO film. The value is preferably 5 ° C or more, more preferably 10 ° C or more, and particularly preferably 12 ° C or more, particularly preferably 15 ° C or more. Further, in the adhesive build-up film 50 of the present embodiment, the adhesion to the ITO film before the heat treatment, that is, the initial adhesion is further improved, or the adhesive build-up film 50 is floated from the ITO film after the heat treatment. In view of the above, the upper limit of the peak top temperature of the first peak is preferably 45° C. or lower, more preferably 40° C. or lower, still more preferably 35° C. or lower, still more preferably 30° C. or lower, and particularly preferably 25° C. or lower. .

In addition, in the adhesive laminated film 50 of the present embodiment, the loss tangent (tan δ) of the adhesive resin layer 20 obtained by dynamic viscoelasticity measurement under the conditions of a temperature increase rate of 5 ° C/min and a frequency of 1 Hz. In the temperature dependency curve, a second peak whose peak top temperature is less than 0 ° C may be observed. In the adhesive laminated film 50 of the present embodiment, the lower limit of the peak top temperature of the second peak is further suppressed from the viewpoint of the residual glue on the ITO film when the heat treatment is performed in the state of being attached to the ITO film. The value is preferably -55 ° C or higher, more preferably -45 ° C or higher, and particularly preferably -35 ° C or higher, particularly preferably -30 ° C or higher. Further, in the adhesive build-up film 50 of the present embodiment, the adhesion to the ITO film before the heat treatment, that is, the initial adhesion is further improved, or the adhesive build-up film 50 is floated from the ITO film after the heat treatment. In view of the above, the upper limit of the peak top temperature of the second peak is preferably less than 0 ° C, more preferably -5 ° C or less, and particularly preferably -10 ° C or less.

In the adhesive laminated film 50 of the present embodiment, the initial adhesion is further improved, and the deposition of the base film by the following method is suppressed from the viewpoint of suppressing the floating of the adhesive laminated film 50 from the ITO film. The peel strength (P ₀ ) between the ITO film and the adhesive resin layer 20 is preferably 0.01 N/25 mm or more, more preferably 0.02 N/25 mm or more, and particularly preferably 0.03 N/25 mm or more. In the adhesive laminated film 50 of the present embodiment, the adhesive residue on the ITO film during the heat treatment in the state of being attached to the ITO film is further suppressed by the following method. The peel strength (P ₀ ) between the ITO film deposited on the substrate film and the adhesive resin layer 20 is preferably 1.0 N/25 mm or less, more preferably 0.5 N/25 mm or less, and particularly preferably 0.2 N/ 25 mm or less. (Measurement Method of Peel Strength) The adhesive build-up film 50 is attached to the ITO film so that the adhesive resin layer 20 is in contact with the ITO film deposited on the base film. Then, the adhesive laminated film 50 was peeled off from the ITO film in a 180-degree direction at 23 ° C and a tensile speed of 300 mm/min using a tensile tester, and the strength (N/25 mm) at this time was obtained. As the peel strength.

In the adhesive laminated film 50 of the present embodiment, the adhesive laminated film is attached to the ITO film so that the adhesive resin layer 20 comes into contact with the ITO film deposited on the base film, and the resultant structure is then 150. When the heat treatment is performed for 60 minutes at ° C, the peel strength (P ₁ ) between the ITO film deposited by the base film measured by the following method and the adhesive resin layer is preferably 0.1 N/25 mm. Above and 1.0 N/25 mm or less. By this, it is possible to further suppress the residual glue on the ITO film when the heat treatment is performed in the state of being attached to the ITO film, and further suppress the floating of the adhesive build-up film 50 from the ITO film after the heat treatment. (Measurement method of peeling strength) The adhesive laminated film 50 was peeled from the ITO film in a 180-degree direction at 23 ° C and a tensile speed of 300 mm/min using a tensile tester, and the strength at this time ( N/25 mm) as the peel strength.

In the present embodiment, in order to adjust P ₀ and P ₁ to the above-described range, for example, it is necessary to highly control the type or blending ratio of each component constituting the adhesive resin layer 20 and the adhesive resin constituting the adhesive resin layer 20 . The type or content ratio of each monomer. In particular, in the present embodiment, as a factor for controlling the P ₀ and P ₁ , the glass transition temperature of the adhesive resin constituting the adhesive resin layer 20 or the adhesive resin constituting the adhesive resin layer 20 may be mentioned. The type or content ratio of each monomer.

The thickness of the entire adhesive laminated film 50 of the present embodiment is preferably 2 μm or more and 550 μm or less, more preferably 6 μm or more and 330 μm or less, and particularly preferably from the viewpoint of the balance between the mechanical properties and the operability. 12 μm or more and 165 μm or less.

Next, each layer constituting the adhesive laminated film 50 of the present embodiment will be described.

<Base Layer> The base layer 10 is a layer provided for the purpose of improving the operability, mechanical properties, and heat resistance of the adhesive laminated film 50. The base material layer 10 is not particularly limited, and examples thereof include a resin film.

Examples of the resin constituting the base material layer 10 include one or more selected from the group consisting of polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene). Polyolefins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.; nylon-6, nylon-66, poly(xamethylenediamine) (poly-meta-xylylene adipamide) and the like polyacrylamide; polyacrylate; polymethacrylate; polyvinyl chloride; polyvinylidene chloride; polyimine; polyether quinone; ethylene-vinyl acetate copolymerization Polyacrylonitrile; polycarbonate; polystyrene; ionic polymer; polyfluorene; polyether oxime; polyphenylene ether. Among these, from the viewpoint of excellent balance between heat resistance, transparency, mechanical strength, and price, it is preferably selected from the group consisting of polypropylene, polyethylene terephthalate, polyethylene naphthalate, and poly. One or more of guanamine and polyimine, more preferably at least one selected from the group consisting of polypropylene, polyethylene terephthalate, and polyethylene naphthalate.

The base material layer 10 may be a single layer or may be two or more layers. Further, the form of the resin film used to form the base layer 10 may be a stretched film or a film extending in the uniaxial direction or the biaxial direction, but the heat resistance and mechanical strength of the base material layer 10 are improved. From the viewpoint, it is preferred to extend the film in the uniaxial direction or the biaxial direction.

The thickness of the base material layer 10 is preferably 1 μm or more and 500 μm or less, more preferably 5 μm or more and 300 μm or less, and particularly preferably 10 μm or more and 150 μm or less from the viewpoint of obtaining good film properties. The base material layer 10 can also be subjected to surface treatment in order to improve the adhesion to other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment, or the like may be performed.

<Adhesive Resin Layer> The adhesive resin layer 20 is a layer which is provided on one surface side of the base material layer 10 and adheres to the surface of the ITO film, and is a layer for attaching the adhesive laminated film 50 to the ITO film.

The adhesive resin layer 20 contains an adhesive resin (P). Examples of the adhesive resin (P) include (meth)acrylic adhesive resin, anthrone-based adhesive resin, urethane-based adhesive resin, olefin-based adhesive resin, and styrene-based adhesiveness. Resin, etc. Among these, a (meth)acrylic adhesive resin is preferable because it is easy to adjust the adhesive force.

The (meth)acrylic-based adhesive resin used for the adhesive resin layer 20 is, for example, a copolymer comprising a constituent unit (A) derived from an alkyl (meth)acrylate. In the present embodiment, the alkyl (meth)acrylate means an alkyl acrylate, an alkyl methacrylate, or a mixture thereof.

The (meth)acrylic adhesive resin of the present embodiment can be, for example, a monomer comprising an alkyl (meth)acrylate and another monomer copolymerizable with an alkyl (meth)acrylate monomer. The mixture is obtained by copolymerization.

Examples of the (meth)acrylic acid alkyl ester monomer which forms the structural unit (A) derived from the alkyl (meth)acrylate include methyl (meth)acrylate and ethyl (meth)acrylate. Methyl) propyl acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, third (meth) acrylate Butyl ester, amyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (methyl) ) isooctyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate , dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, (meth)acrylic acid Cetyl ester, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, hexadecyl (meth) acrylate, eicosyl (meth) acrylate, etc. An alkyl group having 1 to 20 carbon atoms (Meth) acrylate and the like. These may be used alone or in combination of two or more. Among these, an alkyl (meth)acrylate having an alkyl group having 1 to 12 carbon atoms is preferable, and an alkyl (meth)acrylate having an alkyl group having 1 to 8 carbon atoms is more preferable. Specific examples thereof include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, and methacrylic acid-2. -ethylhexyl ester and the like. These may be used alone or in combination of two or more. In the (meth)acrylic adhesive resin of the present embodiment, when the total of all the constituent units in the (meth)acrylic adhesive resin is 100% by mass, the alkyl (meth)acrylate is derived. The content of the constituent unit (A) is preferably 50% by mass or more and 95% by mass or less, and more preferably 55% by mass or more and 92% by mass or less.

The (meth)acrylic adhesive resin of the present embodiment is further derived from a copolymerizable with an alkyl (meth)acrylate monomer from the viewpoint of further improving cohesive force, heat resistance, crosslinkability, and the like. The constituent unit (B) of the other monomer. Examples of the monomer forming the structural unit (B) include cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxy amyl acrylate, itaconic acid, and the like. a carboxyl group-containing monomer such as maleic acid, fumaric acid or crotonic acid; an acid anhydride group-containing monomer such as maleic anhydride or itaconic anhydride; hydroxymethyl (meth)acrylate; Base) hydroxyethyl acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxy hydrazine (meth) acrylate a hydroxyl group-containing monomer such as ester, hydroxylauryl (meth)acrylate or (4-hydroxymethylcyclohexyl)methyl methacrylate; styrenesulfonic acid, allylsulfonic acid, 2-(methyl)propylene a sulfonic acid group such as decylamine-2-methylpropanesulfonic acid, (meth) acrylamide propyl sulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene decyl oxynaphthalene sulfonic acid Monomer; phosphate group-containing monomer such as 2-hydroxyethyl acryloyl phosphate; (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N, N-di Base (meth) acrylamide, N-isopropyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-hydroxy (N-substituted) guanamine monomer such as methyl propane (meth) acrylamide; aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, ( (meth)acrylic acid aminoalkyl group such as methyl butyl acrylate or methyl methacrylate; methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, etc. Alkenyl alkoxyalkyl monomer; N-cyclohexyl maleimide, N-isopropyl maleimide, N-lauryl maleimide, N - maleic acid imide monomer such as phenyl maleimide; N-methyl itaconimine, N-ethyl itaconide, N-butyl itacona Amine, N-octyl ketamine, N-2-ethylhexyl ketimine, N-cyclohexyl ketimine, N-lauryl ketimide, etc. Monomer; N-(methyl)propenyloxymethylene succinimide, N-(methyl)propenyl-6-oxyhexamethylene succinimide, N-(A) Propylene Amber quinone imine monomer such as mercapto-8-oxy octamethylene succinimide; vinyl ester such as vinyl acetate or vinyl propionate; N-vinyl-2-pyrrolidone, N- Methylvinylpyrrolidone, N-vinylpyridine, N-vinylpiperidone, N-vinylpyrimidine, N-vinylpiperazine, N-vinylpyrazine, N-vinylpyrrole, N- Vinyl imidazole, N-vinyloxazole, N-(methyl)propenyl-2-pyrrolidone, N-(methyl)propenylpyridinium, N-(methyl)propenylpyrrolidine a nitrogen-containing heterocyclic monomer such as N-vinylmorpholine; a decylamine N-vinylcarboxylate; a styrene monomer such as styrene or α-methylstyrene; and N-vinyl caprolactam Ethyleneamine-based monomer; epoxy group-containing acrylic monomer such as glycidyl (meth)acrylate; (meth)acrylic acid polyethylene glycol, (meth)acrylic polypropylene glycol, (meth)acrylic acid a glycol-based acrylate monomer such as methoxyethylene glycol or (meth)acrylic acid methoxypolypropylene glycol; tetrahydrofurfuryl (meth)acrylate, fluoroester (meth)acrylate, and anthrone (methyl) ) acrylates and the like have a hetero ring, a halogen atom, a ruthenium atom Acrylate monomer; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di( Methyl) acrylate, pentaerythritol di(meth) acrylate, trimethylolpropane tri(meth) acrylate, pentaerythritol tri(meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate Polyfunctional monomers such as ester, polyester acrylate, urethane acrylate, divinyl benzene, butyl di(meth) acrylate, hexyl di(meth) acrylate; isoprene, butyl An olefin monomer such as a diene or an isobutylene; a vinyl ether monomer such as methyl vinyl ether or ethyl vinyl ether; and the like. These may be used alone or in combination of two or more. Among these, a cyanoacrylate monomer, a carboxyl group-containing monomer, a hydroxyl group-containing monomer, an (N-substituted) guanamine monomer, an epoxy group-containing acrylic monomer, and the like are preferable. One or more of the functional monomers, more preferably selected from the group consisting of acrylonitrile, methacrylonitrile, acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, (methyl) Hydroxymethyl acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, (meth) acrylamide, N-methylol (meth) propylene One or more of guanamine, glycidyl (meth)acrylate, and divinylbenzene. In the (meth)acrylic adhesive resin of the present embodiment, when the total of all the constituent units in the (meth)acrylic adhesive resin is 100% by mass, the content of the constituent unit (B) is preferably 5 mass% or more and 50 mass% or less, more preferably 8 mass% or more and 45 mass% or less, and still more preferably 10 mass% or more and 40 mass% or less.

In the adhesive resin layer 20 of the present embodiment, the initial adhesive strength is further improved, and the residual adhesive on the ITO film during the heat treatment in the state of being attached to the ITO film is further suppressed. The adhesive resin (P) is preferably used by using two or more kinds of resins having different glass transition temperatures, and more preferably an adhesive resin containing an adhesive resin (P1) and a glass transition temperature different from that of the adhesive resin (P1). (P2). More specifically, it is more preferable to include an adhesive resin (P1) having a glass transition temperature of preferably 5° C. or higher and 50° C. or lower, more preferably 10° C. or higher and 40° C. or lower, and particularly preferably 15° C. or higher and 30° C. or lower. And the glass transition temperature is preferably -50 ° C or more and less than 5 ° C, more preferably -40 ° C or more and 0 ° C or less, and particularly preferably -30 ° C or more and -5 ° C or less of the adhesive resin (P2). Here, when the adhesive resin layer 20 contains the adhesive resin (P1) and the adhesive resin (P2) having different glass transition temperatures, the peak top temperature of the first peak corresponds to the adhesive resin (P1). Glass transfer temperature. By including the adhesive resin (P1), it is possible to further suppress the residual glue on the ITO film when the heat treatment is performed in a state of being attached to the ITO film. Further, by including the adhesive resin (P2), the initial adhesion can be further improved.

In addition, when the adhesive resin layer 20 contains the adhesive resin (P1) and the adhesive resin (P2) having different glass transition temperatures, the ITO during the heat treatment in the state of being attached to the ITO film is further suppressed. From the viewpoint of the residual adhesive on the film, when the total content of the adhesive resin (P1) and the adhesive resin (P2) is 100% by mass, the adhesive resin (P1) contained in the adhesive resin layer 20 is contained. The content is preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 65% by mass or more, still more preferably 70% by mass or more, and particularly preferably 75% by mass or more. In addition, in the state where the adhesive laminated film 50 is adhered to the ITO film after being stored under high temperature and high humidity, the adhesive layer on the ITO film is subjected to heat treatment, and the adhesive resin layer 20 is used. The content of the adhesive resin (P1) to be contained is preferably 80% by mass or more, and more preferably 85% by mass or more.

In addition, when the adhesive resin layer 20 contains the adhesive resin (P1) and the adhesive resin (P2) having different glass transition temperatures, the adhesive resin is obtained from the viewpoint of obtaining a further excellent initial adhesion. When the total content of the (P1) and the adhesive resin (P2) is 100% by mass, the content of the adhesive resin (P1) contained in the adhesive resin layer 20 is preferably 97% by mass or less, more preferably 95% by mass. % or less, particularly preferably 93% by mass or less.

In the production of the (meth)acrylic adhesive resin of the present embodiment, a known production method such as solution polymerization, bulk polymerization, emulsion polymerization, and various radical polymerizations can be suitably selected. Further, in the solution polymerization in the radical polymerization, as the polymerization solvent, for example, ethyl acetate, toluene or the like can be used.

The polymerization initiator, chain transfer agent, emulsifier and the like used in the radical polymerization are not particularly limited, and can be appropriately selected and used. The polymerization initiator is not particularly limited, and examples thereof include 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-amidinopropane) dihydrochloride, and 2,2. '-Azobis[2-(5-methyl-2-imidazolin-2-yl)propane]dihydrochloride, 2,2'-azobis(2-methylpropionamidine) disulfate, 2,2'-azobis(N,N'-dimethyleneisobutylphosphonium), 2,2'-azobis[N-(2-carboxyethyl)-2-methylpropionamidine] An azo initiator such as hydrate (VA-057 manufactured by Wako Pure Chemical Industries Co., Ltd.); persulfate such as sodium persulfate, potassium persulfate or ammonium persulfate; di(2-ethyl)peroxydicarbonate Hexyl) ester, bis(4-tert-butylcyclohexyl)peroxydicarbonate, di-second butyrate diperate, tert-butyl peroxy neodecanoate, third peroxypivalate Ester, tert-butyl peroxypivalate, dilaurin peroxide, di-n-octyl peroxide, peroxy-2-ethylhexanoic acid-1,1,3,3-tetramethylbutyl ester, Bis(4-methylbenzhydrazide) peroxide, benzamidine peroxide, tert-butyl peroxyisobutyrate, 1,1-di(trihexylperoxy)cyclohexane, tert-butyl Hydrogen peroxide, hydrogen peroxide, etc. Compound-based initiator; combination of a persulfate and sodium hydrogen sulfite; a combination of a peroxide and sodium ascorbate with a reducing agent like a peroxide-based combination of reducing initiator. The polymerization initiator may be used singly or in combination of two or more. The amount of the polymerization initiator to be used is preferably from 0.005 parts by mass to 1 part by mass, more preferably from 0.02 part by mass to 0.6 parts by mass, per 100 parts by mass of the monomer.

In addition, a chain transfer agent can also be used in the polymerization. The molecular weight of the (meth)acrylic adhesive resin can be suitably adjusted by using a chain transfer agent. As the chain transfer agent, for example, lauryl mercaptan, glycidyl mercaptan, mercaptoacetic acid, 2-mercaptoethanol, thioglycolic acid, thioglycolic acid-2-ethylhexyl Ester, 2,3-dimercapto-1-propanol, and the like. These chain transfer agents may be used singly or in combination of two or more. The amount of the chain transfer agent used is, for example, 0.01 parts by mass to 0.4 parts by mass based on 100 parts by mass of the monomer.

In addition, examples of the emulsifier used in the case of performing emulsion polymerization include sodium lauryl sulfate, ammonium lauryl sulfate, sodium dodecylbenzenesulfonate, sodium alkyl diphenyl ether disulfonate, and poly Anionic emulsifier such as oxyethylene alkyl ether sulfate or polyoxyethylene alkyl phenyl ether sulfate; polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, polyoxyethylene fatty acid ester, polyoxyethylene a nonionic emulsifier such as a polyoxypropylene block polymer. These emulsifiers may be used singly or in combination of two or more.

The adhesive resin (P) in the adhesive resin layer 20 of the present embodiment is 100% by mass in terms of the balance of the initial adhesive force and the suppression of the residual adhesive. The content is preferably 60% by mass or more and 100% by mass or less, more preferably 70% by mass or more and 99% by mass or less, and particularly preferably 80% by mass or more and 98% by mass or less, particularly preferably 85% by mass or more and 97% by mass. %the following.

The adhesive resin layer 20 of the present embodiment preferably contains two or more molecules in one molecule, in addition to the adhesive resin (P), from the viewpoint of the adhesion of the adhesive resin (P) and the cohesive force. Crosslinking functional crosslinker. Examples of such a crosslinking agent include sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerin polyglycidyl ether, glycerol polyglycidyl ether, and new An epoxy compound such as pentanediol diglycidyl ether or resorcinol diglycidyl ether; tetramethylene diisocyanate, hexamethylene diisocyanate, trimethylolpropane toluene diisocyanate triadduct, Isocyanate compound such as polyisocyanate, diphenylmethane diisocyanate or toluene diisocyanate; trimethylolpropane-tri-β-aziridine propionate, tetramethylolmethane-tri-β-aziridine group Propionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxydecylamine), N,N'-hexamethylene-1,6-bis(1-nitrogen Propionate carboxy decylamine), N,N'-toluene-2,4-bis(1-aziridinecarboxy decylamine), trimethylolpropane-tri-β-(2-methylaziridine) Aziridine compound such as acid ester; N, N, N', N'-tetraglycidyl-m-xylylenediamine, 1,3-bis(N,N'-diglycidylaminomethyl) a tetrafunctional epoxy compound such as cyclohexane; hexamethoxyhydroxyl Melamine-based compounds such as melamine and the like. These crosslinking agents may be used singly or in combination of two or more. Among these, one or two or more selected from the group consisting of an epoxy compound, an isocyanate compound, and an aziridine compound are preferable, and an epoxy compound is more preferable.

The content of the crosslinking agent in the adhesive resin layer 20 of the present embodiment is preferably from 100 parts by mass of the adhesive resin (P) from the viewpoint of improving the balance between the initial adhesion and the suppression of the residual adhesive. It is 0.1 part by mass or more and 10 parts by mass or less, more preferably 0.5 part by mass or more and 8 parts by mass or less, and particularly preferably 1 part by mass or more and 6 parts by mass or less.

The adhesive resin layer 20 preferably contains a surfactant in addition to the adhesive resin (P) from the viewpoint of adjusting the adhesive force and cohesive force of the adhesive resin (P). Examples of the surfactant include a cationic surfactant, an anionic surfactant, a nonionic surfactant, and an amphoteric surfactant.

Examples of the cationic surfactant include dodecyltrimethylammonium chloride, tetradecyldimethylbenzylammonium chloride, tetradecyltrimethylammonium chloride, and hexadecyl group. Trimethylammonium chloride, octadecyltrimethylammonium chloride, didodecyldimethylammonium chloride, ditetradecyldimethylammonium chloride, dihexadecane Dimethylammonium chloride, dioctadecyldimethylammonium chloride, dodecylbenzyldimethylammonium chloride, cetylbenzyldimethylammonium chloride, octadecyl Benzyl dimethyl ammonium chloride, palmityl trimethyl ammonium chloride, oleyl trimethyl ammonium chloride, dipalmityl benzyl methyl ammonium chloride, dioleyl benzyl methyl ammonium chloride Wait.

Examples of the anionic surfactant include diammonium dodecyl diphenyl ether disulfonate, sodium dodecyl diphenyl ether disulfonate, and calcium lauryl diphenyl ether disulfonate. An alkyl diphenyl ether disulfonate such as sodium alkyl diphenyl ether disulfonate; an alkylbenzene sulfonate such as sodium dodecylbenzenesulfonate or ammonium dodecylbenzenesulfonate; An alkyl sulfate salt such as sodium sulfate or ammonium lauryl sulfate; an aliphatic carboxylate such as sodium fatty acid or potassium oleate; or a sulfate salt containing a polyoxyalkylene unit (for example, sodium polyoxyethylene alkyl ether sulfate, Polyoxyethylene alkyl ether sulfate salt such as polyoxyethylene alkyl ether sulfate; polyoxyethylene alkylphenyl ether sulfate such as polyoxyethylene alkylphenyl ether sulfate or polyoxyethylene alkylphenyl ether ammonium sulfate Ester salt; polyoxyethylene polycyclic phenyl ether sulfate such as polyoxyethylene polycyclic phenyl ether sulfate, polyoxyethylene polycyclic phenyl ether ammonium sulfate, etc.; naphthalene sulfonate such as sodium sulfamate condensate Acid fumarate condensate salt; sodium dialkyl sulfosuccinate, alkyl sulfosuccinate such as disodium monoalkyl sulfosuccinate; polyoxyethylene - polyoxygen Propylene glycol ether sulfate; a sulfonate or a surfactant having a sulfate group and a polymerizable carbon-carbon (unsaturated) double bond in the molecule.

Examples of the nonionic surfactant include polyoxyalkylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene tridecyl ether, and polyoxyethylene oleyl ether. Polyether alkylene phenyl ether compound such as polyether octyl phenyl ether or polyoxyethylene nonyl phenyl ether, polyoxyalkylene polycyclic ring such as polyoxyethylene polycyclic phenyl ether An ether compound containing a polyoxyalkylene unit such as a phenyl ether compound; a polyoxyalkylene alkyl ester compound such as polyoxyethylene monolaurate, polyoxyethylene monostearate or polyoxyethylene monooleate Polyoxyalkylenamine compounds such as polyoxyethylene alkylamine; sorbitan monolaurate, sorbitan monostearate, sorbitan trioleate, polyoxyethylene dehydration A sorbitan compound such as sorbitol monolaurate or polyoxyethylene sorbitan monooleate.

Examples of the amphoteric surfactant include lauryl betaine and lauryl dimethylamine oxide.

These surfactants may be used alone or in combination of two or more. Among these, a nonionic surfactant is preferred, and more preferably polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene tridecyl ether, polyoxyethylene oleyl ether, etc. An alkylene alkyl ether compound, particularly preferably a polyoxyethylene alkyl ether compound.

From the viewpoint of improving the balance between the initial adhesion and the suppression of the residual glue, the content of the surfactant in the adhesive resin layer 20 of the present embodiment is preferably 100 parts by mass of the adhesive resin (P). It is 0.1 part by mass or more and 15 parts by mass or less, more preferably 0.5 part by mass or more and 10 parts by mass or less, and particularly preferably 1 part by mass or more and 8 parts by mass or less. The adhesive resin layer 20 is entirely provided from the viewpoint of further suppressing the residual adhesive on the ITO film during heat treatment or storage under high temperature and high humidity in the state of being attached to the ITO film. When the content is 100% by mass, the content of the surfactant in the adhesive resin layer 20 of the present embodiment is preferably more than 6.5 mass% and 35.0 mass% or less. Here, the content of the surfactant in the adhesive resin layer 20 can be determined by the following formula. The content of the surfactant in the adhesive resin layer 20 = 100 × (the mass of the surfactant) / the mass of the adhesive resin layer 20 The quality of the adhesive resin layer 20 is the quality of the adhesive resin and the surfactant, and further In the case where an additive such as a plasticizer is contained, the mass is also obtained as a total. Further, the quality of the surfactant or the mass of the adhesive resin layer 20 is the mass of the solid component obtained by removing the solvent or moisture.

The adhesive resin layer 20 may further be formulated with an adhesion-imparting agent, a plasticizer, an anti-aging agent, an antioxidant, a colorant (pigment or dye, etc.), a softener, a light stabilizer, a UV absorber, a polymerization inhibitor, and the like. Other components such as inorganic or organic fillers, metal powders, particulates, and foils.

The thickness of the adhesive resin layer 20 is not particularly limited, and is preferably 1 μm or more and 50 μm or less, and more preferably 1 μm or more and 30 μm or less from the viewpoint of balance between initial adhesion and suppression of residual adhesive. It is preferably 2 μm or more and 15 μm or less, and particularly preferably 3 μm or more and 12 μm or more.

<Other Layers> The adhesive laminated film 50 of the present embodiment may further laminate a release film on the adhesive resin layer 20. The release film may, for example, be a polyester film subjected to a release treatment.

<Method for Producing Adhesive Laminated Film> Next, an example of a method for producing the adhesive laminated film 50 of the present embodiment will be described. The adhesive laminated film 50 of the present embodiment can be obtained, for example, by forming the adhesive resin layer 20 on one surface of the base material layer 10.

The adhesive resin layer 20 can be formed, for example, by applying an adhesive containing an adhesive resin (P), an optional crosslinking agent, a surfactant, and other components to the base material layer 10. The adhesive can be used by dissolving an adhesive resin (P), an optional crosslinking agent, a surfactant, other components, etc. in an organic solvent to form a coating liquid, or emulsification in water to prepare a water emulsion. use. In addition, when the adhesive is in the form of a liquid, it can be used as it is. As a method of applying the adhesive on the base material layer 10, a conventionally known coating method such as a roll coater method, a reverse roll coater method, a gravure roll method, a bar coating method, and a corner wheel coating can be employed. Cloth machine method, die coating machine method, etc. The drying conditions of the applied adhesive are not particularly limited, but it is usually preferably dried in a temperature range of 80 ° C to 200 ° C for 10 seconds to 10 minutes. It is especially preferred to dry at 80 ° C to 170 ° C for 15 seconds to 5 minutes. In order to sufficiently promote the crosslinking reaction between the crosslinking agent and the adhesive resin, it may be heated at 40 to 80 ° C for 5 to 300 hours after the drying of the adhesive is completed. Further, the base material layer 10 and the adhesive resin layer 20 can be formed by co-extrusion molding, or the film-form base material layer 10 and the film-form adhesive resin layer 20 can be laminated (laminated).

When the adhesive for forming the adhesive resin layer 20 is an aqueous latex, it is preferable to contain an organic solvent, for example, in order to improve the coatability of the adhesive to the base layer 10. Examples of the organic solvent include lower aliphatic alcohols such as methanol, ethanol, isopropanol (IPA), n-butanol, and isobutanol; ethylene glycol, ethylene glycol monobutyl ether, and ethylene glycol monoethyl ether. Ethylene glycol derivatives; diethylene glycol derivatives such as diethylene glycol and diethylene glycol monobutyl ether; hydrophilic organic solvents such as diacetone alcohol. Among these, a diethylene glycol derivative such as diethylene glycol or diethylene glycol monobutyl ether is preferred. These organic solvents may be used singly or in combination of two or more. Further, it may be used in combination with the hydrophilic organic solvent, and toluene, xylene, hexane, ethyl heptane, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methyl ethyl ketone may be used. One or two or more of 肟. The amount of the organic solvent used is preferably 0.1 parts by mass or more and 15 parts by mass or less, more preferably 100 parts by mass of the adhesive resin (P), from the viewpoint of improving the balance between the initial adhesion and the suppression of the residual adhesive. It is preferably 0.5 parts by mass or more and 10 parts by mass or less, and particularly preferably 1 part by mass or more and 8 parts by mass or less.

2. Structure Next, the structure 100 of the present embodiment will be described. FIG. 2 is a cross-sectional view schematically showing an example of a configuration of a structure 100 according to an embodiment of the present invention.

As shown in FIG. 2, the structure 100 of the present embodiment includes an indium tin oxide (ITO) film 70 and a surface protective film attached to the ITO film 70, and the surface protective film is an adhesive laminated film of the present embodiment. 50. The ITO film 70 is formed, for example, on the substrate layer 90. Since the structure 100 of the present embodiment includes the adhesive build-up film 50 as the surface protective film, it is difficult to cause a part of the adhesive resin layer to remain on the ITO film even when heat treatment is performed at a high temperature such as crystallization treatment of the ITO film. Glue phenomenon. Therefore, heat treatment such as crystallization treatment of the ITO film can be performed while suppressing contamination of the ITO film.

As the base material layer 90, a soft material which is colorless and transparent in the visible light region and which can form an ITO film is preferable. For example, polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN); cycloolefin resins; polycarbonate Resin; polyimine resin; cellulose resin. Among these, polyethylene terephthalate or a cycloolefin resin is preferable.

The method of forming the ITO film on the base material layer 90 is not particularly limited as long as it is a method capable of forming a uniform film. For example, sputtering, vapor deposition, various chemical vapor deposition (CVD), spin coating, roll coating, spray coating, dip coating, and the like can be mentioned.

Although the embodiments of the present invention have been described above, these are examples of the present invention, and various configurations other than the above may be employed.

Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within a scope that can achieve the object of the invention are included in the present invention. [Examples]

Hereinafter, the present invention will be specifically described by way of examples, but the invention is not limited thereto.

<Material> Details of the materials used in the production of the adhesive laminated film are as follows.

Base material layer 1: Polypropylene (PP) film (manufactured by Toray Film Processing Co., Ltd., product name: 3701J, thickness: 40 μm) Crosslinking agent 1: Sorbitol polyglycidyl ether (manufactured by Nagase Chemical Co., Ltd., product name) :Denacol EX-614) Surfactant 1: Polyoxyethylene alkyl ether (manufactured by Kao Corporation, product name: Emalgen 705) Organic solvent 1: diethylene glycol monobutyl ether

(Adhesive resin 1) 51.69 parts by mass of deionized water, 0.23 parts by mass of potassium persulfate as a polymerization initiator, 19.30 parts by mass of 2-ethylhexyl acrylate, and acrylic acid were added to a polymerization reactor equipped with a reflux cooling tube. 19.30 parts by mass of butyl ester, 3.68 parts by mass of acrylonitrile, 2.30 parts by mass of methacrylic acid, 2.76 parts by mass of acrylamide, 0.23 parts by mass of divinylbenzene, and sodium alkyl diphenyl ether disulfonate 0.51 as a surfactant. The mass fraction was subjected to emulsion polymerization at 70 ° C for 8 hours while stirring in a nitrogen atmosphere, and the obtained latex was neutralized with 25% ammonia water. An adhesive resin solution containing 44.5 mass% of the adhesive resin 1 was obtained by the above procedure.

(Adhesive Resin 2) 54.78 parts by mass of deionized water, 0.22 parts by mass of potassium persulfate as a polymerization initiator, 29.39 parts by mass of butyl acrylate, and 10.23 parts by mass of acrylonitrile were added to a polymerization reactor equipped with a reflux cooling tube. 1.77 parts by mass of 2-hydroxyethyl methacrylate, 1.78 parts by mass of acrylic acid, 1.34 parts by mass of acrylamide, and 0.49 parts by mass of sodium alkyl diphenyl ether disulfonate as a surfactant, under nitrogen atmosphere The mixture was stirred and subjected to emulsion polymerization at 70 ° C for 8 hours, and the obtained latex was neutralized with 25% aqueous ammonia. An adhesive resin solution containing 44.5 mass% of the adhesive resin 2 was obtained by the above procedure.

[Example 1] Each component was separately mixed at the ratio shown in Table 1, and the adhesive 1 was obtained. Further, the pH was adjusted to 7 using ammonia water, and the viscosity was adjusted to 100 mPa·s using pure water. After the adhesive 1 was applied onto the base material layer 1, it was dried to form an adhesive resin layer having a thickness of 5 μm to obtain an adhesive laminated film. The obtained adhesive laminated film was evaluated as follows. The results obtained are shown in Table 1.

[Examples 2 to 3] Adhesive laminated films were obtained in the same manner as in Example 1 except that the adhesives prepared in the ratios shown in Table 1 were used instead of the adhesive 1. Further, the pH was adjusted to a range of 6.5 to 8.5 using ammonia water, and each adhesive was adjusted to a viscosity of 100 mPa·s to 200 mPa·s using pure water. The obtained adhesive laminated film was evaluated as follows. The results obtained are shown in Table 1.

<Evaluation> (1) Determination of peel strength P ₀ P ITO peel strength between the film and the adhesive resin layer is _0. Z0237, measured by a method according to Japanese Industrial Standard (Japanese Industrial Standards, JIS). The adhesive layer was adhered to the ITO film (P02) manufactured by the polyester film at a pressure of 2 kg/cm and a bonding speed of 2 m/min. The laminated film is attached to the ITO film. Then, using an tensile tester (manufactured by ORIENTEC Co., Ltd., RTA-1210A), an adhesive laminated film was applied from the ITO film at a direction of 180 degrees at 23 ° C and a tensile speed of 300 mm/min. peeling strength at that time (N / 25 mm) as the peel strength (P _0).

(2) Determination of peel strength P peel strength between the ITO film and the adhesive resin layer ₁ P ₁ is based JIS Z0237, measured by the following method. The adhesive laminated film was attached to the ITO film so that the adhesive resin layer was in contact with the ITO film (P02 manufactured by Zhuowei Optoelectronics Co., Ltd.) which was deposited on the polyester film. Then, the obtained structure was subjected to heat treatment at 150 ° C for 60 minutes. Then, using an tensile tester (manufactured by ORIENTEC Co., Ltd., RTA-1210A), an adhesive laminated film was applied from the ITO film at a direction of 180 degrees at 23 ° C and a tensile speed of 300 mm/min. Peeling, the strength (N/25 mm) at this time was taken as the peeling strength (P ₁ ).

(3) Dynamic viscoelasticity measurement The temperature dependence curve of the loss tangent (tan δ) of the adhesive resin layer was measured by dynamic viscoelasticity measurement under the conditions of a temperature increase rate of 5 ° C / min and a frequency of 1 Hz. Then, based on the temperature dependence curve of the loss tangent (tan δ) of the obtained adhesive resin layer, the presence or absence of the peak was observed, and the peak top temperature was calculated in the presence of a peak.

After measuring the intensity P ₁ (4) to release adhesive residue, adhesive residue was visually laminated film adhesion release surface side of the ITO film was observed, was evaluated by the following criteria residual adhesive tack film is laminated. ◎: No residue was observed on the peeling surface of the ITO film side by visual observation. Good 〇: Residual glue was slightly observed on the peeling surface of the ITO film side by visual observation, but it was substantially good ×: by visual observation, in ITO Residual glue was observed on the entire surface of the peeling surface on the film side, which was poor.

[Table 1] Table 1

When the adhesive laminated film of the example in which the peak top temperature was 0 ° C or more was observed, the adhesive layer on the ITO film was heat-treated while being attached to the ITO film.

The priority of Japanese Patent Application No. 2017-066130, filed on March 29, 2009, is hereby incorporated by reference.

10‧‧‧Substrate layer

20‧‧‧Adhesive resin layer

50‧‧‧Adhesive laminated film

70‧‧‧ITO film

90‧‧‧ substrate layer

100‧‧‧ structure

The above and other objects, features and advantages of the invention will be apparent from

FIG. 1 is a cross-sectional view showing an example of a structure of an adhesive laminated film according to an embodiment of the present invention. Fig. 2 is a cross-sectional view schematically showing an example of a structure of a structure according to an embodiment of the present invention.

Claims (9)

An adhesive laminated film which is an adhesive laminated film for protecting a surface of an indium tin oxide film, comprising a substrate layer and an adhesive resin layer provided on one surface of the substrate layer, and is heated by heating The dynamic viscoelasticity measurement under the conditions of a speed of 5 ° C / min and a frequency of 1 Hz, in the temperature dependence curve of the loss tangent (tan δ) of the obtained adhesive resin layer, the peak top temperature was observed to be 0 ° C or more. The first peak. The adhesive laminated film according to claim 1, wherein the peak top temperature of the first peak is 45 ° C or lower. The adhesive laminated film according to claim 1 or 2, wherein the adhesive resin layer contains an adhesive resin (P1) having a glass transition temperature of 5 ° C or more and 50 ° C or less, and a glass transition temperature of An adhesive resin (P2) of -50 ° C or more and less than 5 ° C. The adhesive laminated film according to claim 3, wherein the peak top temperature of the first peak corresponds to a glass transition temperature of the adhesive resin (P1). The adhesive laminated film according to claim 1 or 2, wherein the indium tin oxide film deposited by the substrate film and the adhesive resin layer are measured by the following method The peel strength (P ₀ ) is 0.01 N/25 mm or more and 1.0 N/25 mm or less. (Method for Measuring Peel Strength) The indium tin oxide deposited by the adhesive resin layer and the base film In the manner of film contact, the adhesive laminated film is attached to the indium tin oxide film; then, using a tensile tester, at a temperature of 23 ° C and a tensile speed of 300 mm/min, in a direction of 180 degrees The adhesive laminated film was peeled off from the indium tin oxide film, and the strength (N/25 mm) at this time was taken as the peeling strength. The adhesive laminated film according to claim 1 or 2, wherein the adhesive resin layer is in contact with the indium tin oxide film deposited by the base film The adhesive laminated film is attached to the indium tin oxide film, and then the obtained structure is subjected to heat treatment at 150 ° C for 60 minutes, and the substrate film is deposited by the following method. The peel strength (P ₁ ) between the indium tin oxide film and the adhesive resin layer is 0.1 N/25 mm or more and 1.0 N/25 mm or less, and a method for measuring peel strength is performed using a tensile tester. The adhesive laminated film was peeled from the indium tin oxide film in a direction of 180 degrees at 23 ° C and a tensile speed of 300 mm/min, and the strength (N/25 mm) at this time was taken as a peeling. strength. The adhesive laminate film according to the first or second aspect of the invention, wherein the adhesive resin layer has a thickness of 1 μm or more and 50 μm or less. The adhesive laminated film according to claim 1 or 2, wherein the resin constituting the substrate layer comprises a polyolefin, a polyester, a polyamide, a polyacrylate, a polymethacrylate. , polyvinyl chloride, polyvinylidene chloride, polyimide, polyether oximine, ethylene-vinyl acetate copolymer, polyacrylonitrile, polycarbonate, polystyrene, ionic polymer, polyfluorene, poly One or more of ether oxime and polyphenylene ether. A structure comprising: an indium tin oxide film; and a surface protection film attached to the indium tin oxide film, and the surface protection film is any one of items 1 to 8 of the patent application scope The adhesive laminated film.