TW201839079A - Adhesive sheet - Google Patents

Abstract

Provided is an adhesive sheet (10) used in a case where a semiconductor element is sealed on an adhesive sheet, wherein: the adhesive sheet is provided with a base material (11) and an adhesive agent layer that contains an adhesive agent composition (12); the surface free energy of the adhesive agent layer (12) is in the range of 10-22 mJ/m2; and if the storage elastic modulus of the adhesive agent layer (12) at 100 DEG C is A (Pa) and the thickness of the adhesive agent layer (12) is B (m), the numerical value calculated using the relational expression (1) is at least 1.5 * 10<SP>-5</SP>. (1): A*B2.

Description

Adhesive sheet

This invention relates to adhesive sheets.

In recent years, in the mounting technology, the Chip Size Package (CSP) technology has attracted attention. In this technology, a wafer-only package that does not use a substrate, such as a wafer level package (WLP), has been attracting attention in terms of miniaturization and high integration. In such a manufacturing method of WLP or the like, it has been conventionally necessary to fix a wafer fixed to a substrate to another support. For example, in the case of manufacturing a semiconductor device, an adhesive sheet is used as a support for temporarily fixing a wafer (Document 1 (JP-A-2012-059934) and Document 2 (JP-A-2004-014930)). However, when a semiconductor device is manufactured using a conventional adhesive sheet, when the semiconductor wafer adhered to the adhesive sheet is sealed, the sealing resin leaks and enters between the wafer and the adhesive sheet, and there is a problem that the semiconductor wafer flows or floats. Further, for example, when a semiconductor device is manufactured using an adhesive sheet, the circuit surface of the semiconductor element becomes an adhesive layer fixed to the adhesive sheet. In the circuit surface of the semiconductor element, a step portion such as a dicing line is provided at a peripheral portion of the semiconductor element. Further, when the semiconductor element on the adhesive sheet is sealed, the sealing resin is buried in the gap between the step portion and the adhesive layer. However, depending on the kind of the sealing resin, it is understood that the sealing resin cannot be buried in the gap between the step portion and the adhesive layer to form a void. Further, when such a space is formed, the smoothness of the circuit surface of the semiconductor element is insufficient, and there is a problem in that the pattern of the circuit surface is formed. Therefore, for the adhesive sheet, the property in which the sealing resin is buried in the gap between the step portion and the adhesive layer (hereinafter also referred to as "filling property") is required.

SUMMARY OF THE INVENTION An object of the present invention is to provide an adhesive sheet which can prevent both resin leakage property and filling property when sealing a semiconductor element on an adhesive sheet. According to an aspect of the present invention, there is provided an adhesive sheet which is used for sealing a semiconductor element on an adhesive sheet, the adhesive sheet comprising a substrate and an adhesive layer containing an adhesive composition, the adhesive the free energy of the surface layer of 10mJ / m ² or more 22mJ / m ² or less, and the adhesive layer as the a (Pa) at 100 deg.] C storage elastic modulus of the thickness of the adhesive layer as B (m When the value is calculated by the following relation (1), the value is 1.5 ́10 ^-5 or more. A ́B ² (1) In the adhesive sheet of one aspect of the present invention, the contact angle of 1-bromonaphthalene to the above-mentioned adhesive layer is preferably 65 or more. In the adhesive sheet of one aspect of the invention, the value calculated by the following relation (2) is preferably 1.5 ^{́10 -10} or more. A ́B ³ (2) In the adhesive sheet of one aspect of the invention, the storage elastic modulus of the substrate at 100 ° C is preferably 1 ́10 ⁷ Pa or more. In the adhesive sheet according to one aspect of the invention, the adhesive layer is preferably composed of an acrylic adhesive composition or a polyoxygen adhesive composition. In the adhesive sheet according to one aspect of the invention, the pressure-sensitive adhesive layer is preferably composed of an acrylic pressure-sensitive adhesive composition, and the acrylic pressure-sensitive adhesive composition preferably comprises an acrylic copolymer. In the adhesive sheet according to one aspect of the invention, the mass ratio of the copolymer component derived from the alkyl (meth)acrylate is preferably 90% by mass or more based on the total mass of the acrylic copolymer. In the adhesive sheet according to an aspect of the invention, the alkyl group in the alkyl (meth)acrylate preferably has 6 to 8 carbon atoms. In the adhesive sheet according to one aspect of the invention, the acrylic copolymer preferably contains an acrylic copolymer containing 2-ethylhexyl (meth)acrylate as a main monomer. In the adhesive sheet according to one aspect of the invention, the acrylic copolymer preferably contains a copolymer component derived from a monomer having a hydroxyl group. In the adhesive sheet according to one aspect of the invention, the ratio of the copolymer component derived from the monomer having a hydroxyl group is preferably 3% by mass or more, based on the total mass of the acrylic copolymer. In the adhesive sheet according to one aspect of the invention, the acrylic copolymer preferably contains a copolymer component derived from a monomer having a carboxyl group or a copolymer component derived from a monomer having a carboxyl group, and occupies the foregoing The mass ratio of the copolymer component derived from the monomer having a carboxyl group is 1% by mass or less based on the mass of the entire acrylic copolymer. In the adhesive sheet according to one aspect of the invention, the acrylic adhesive composition preferably contains an adhesion aid comprising an oligomer having a hydrocarbon skeleton. In the adhesive sheet according to one aspect of the invention, it is preferable that the adhesive layer is composed of a polyoxynitride-based adhesive composition, and the polyfluorene-based adhesive composition comprises an addition polymerization type polyoxynoxy resin. . According to the present invention, it is possible to provide an adhesive sheet which can prevent both resin leakage property and filling property when sealing a semiconductor element on an adhesive sheet.

[Embodiment of the Invention] [First Embodiment] [Adhesive Sheet] Fig. 1 is a schematic cross-sectional view showing an adhesive sheet 10 of the present embodiment. The adhesive sheet 10 has a substrate 11 and an adhesive layer 12 containing an adhesive composition. The base material 11 has a first base material surface 11a and a second base material surface 11b on the opposite side to the first base material surface 11a. In the adhesive sheet 10 of the present embodiment, the adhesive layer 12 is laminated on the first substrate surface 11a. On top of the adhesive layer 12, as shown in Fig. 1, the release sheet RL is laminated. The shape of the adhesive sheet 10 can be any shape such as a tape shape or a label shape. The adhesive sheet 10 of the present embodiment must have a surface free energy of 10 mJ/m of the adhesive layer 12. ² Above 22mJ/m ² Hereinafter, when the storage elastic modulus of the adhesive layer 12 at 100 ° C is taken as A (Pa) and the thickness of the adhesive layer 12 is taken as B (m), it is calculated by the following relation (1). The value is 1.5 ́10 ^-5 the above. A ́B ² (1) If the surface free energy of the adhesive layer 12 is 10 mJ/m ² Above 22mJ/m ² Hereinafter, the filling property of the semiconductor element on the adhesive sheet 10 is excellent, and when the semiconductor element on the adhesive sheet 10 is sealed, the sealing resin can be buried in the gap between the step portion of the semiconductor element and the adhesive layer. Further, if the value calculated by the above relation (1) is 1.5 ́10 ^-5 As described above, when the adhesive sheet of the present embodiment is used as a support for sealing a semiconductor wafer, leakage of the resin can be prevented. Further, in the present specification, the surface free energy of the adhesive layer 12 can be measured by the method shown below. Specifically, first, a contact angle measuring device ("DM701" manufactured by Kyowa Interface Science Co., Ltd.) was used to measure the contact angle of water, diiodomethane, and 1-bromonaphthalene to the adhesive layer 12. The amount of each droplet was set to 2 μL. Then, from these measured values, the surface free energy can be calculated by the Kitasaki-畑 method. Further, in the present specification, the storage elastic modulus of the adhesive layer is a value measured by a torsional shear method at a frequency of 1 Hz using a dynamic viscoelasticity measuring device. In the embodiment, the surface free energy of the adhesive layer is more preferably 12 mJ/m. ² Above 21.5mJ/m ² the following. In the present embodiment, the contact angle of 1-bromonaphthalene is preferably 65 or more, more preferably 67 or more, and particularly preferably 68 or more from the viewpoint of the filling property. The upper limit of the contact angle of 1-bromonaphthalene is preferably 75 or less, more preferably 72 or less. Further, as a method of adjusting the values of the surface free energy and the contact angle, the following methods can be mentioned. For example, the values of the surface free energy and the contact angle can be adjusted by changing the composition of the adhesive composition used for the adhesive layer 12. In the present embodiment, the numerical value calculated by the above relation (1) is preferably 2.0 ́10. ^-5 Above, more preferably 5.0 ́10 ^-5 the above. The upper limit of the numerical value calculated by the above relational expression (1) is not particularly limited. From the viewpoint of easily producing an adhesive sheet at a low cost, it is preferably 1.0 ́10. ^-2 the following. The value of the adhesive sheet 10 calculated by the following relation (2) is preferably 1.5 ́10. ^-10 Above, more preferably 5.0 ́10 ^-10 Above, especially good for 1.0 ́10 ^-9 the above. A ́B ³ (2) If the value calculated by the above relation (2) is 1.5 ́10 ^-10 Above, the resin leakage can be prevented more effectively. The adhesive sheet 10 of the present embodiment preferably exhibits an adhesive force as follows after heating. First, the adhesive sheet 10 is adhered to the attached body (copper foil or polyimide film), heated at 100 ° C for 30 minutes, and then heated at 180 ° C for 30 minutes, and further at 190 ° C. After heating under the condition of 1 hour, the adhesion of the adhesive layer 12 to the copper foil at room temperature and the adhesion of the adhesive layer 12 to the polyimide film at room temperature are preferably 0.7 N/25 mm. Above 2.0N/25mm. When the adhesion after the heating is 0.7 N/25 mm or more, it is possible to prevent the adhesive sheet 10 from being peeled off from the attached body when the substrate or the attached body is deformed by heating. In addition, when the adhesive force after the heating is 2.0 N/25 mm or less, the peeling force is not excessively high, and the adhesive sheet 10 is easily peeled off from the attached body. Further, the room temperature referred to in the present specification is a temperature of 22 ° C or more and 24 ° C or less. In the present specification, the adhesive force is measured by a 180° tearing method at a peeling speed (tensile speed) of 300 mm/min and a width of the adhesive sheet of 25 mm, specifically, the method described in the examples. (Substrate) The substrate 11 is a member that supports the adhesive layer 12. As the substrate 11, for example, a sheet material such as a synthetic resin film can be used. Examples of the synthetic resin film include a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, and a polyparaphenylene. Ethylene formate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionic polymer resin film, ethylene-( A methyl)acrylic copolymer film, an ethylene-(meth)acrylate copolymer film, a polystyrene film, a polycarbonate film, and a polyimide film. Moreover, as the base material 11, such a crosslinked film, a laminated film, etc. are mentioned. The base material 11 preferably contains a polyester resin, and more preferably consists of a material containing a polyester resin as a main component. In the present specification, the material containing the polyester resin as a main component means that the mass ratio of the polyester resin is 50% by mass or more based on the mass of the entire material constituting the substrate. The polyester resin is preferably selected from the group consisting of polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, and polybutylene naphthalate resin. Any of the resins of the group of the copolymerized resins of these resins is more preferably a polyethylene terephthalate resin. As the substrate 11, a polyethylene terephthalate film or a polyethylene naphthalate film is preferable, and a polyethylene terephthalate film is more preferable. The lower limit of the storage elastic modulus of the substrate 11 at 100 ° C is preferably 1 ́10 from the viewpoint of dimensional stability during processing. ⁷ Above Pa, preferably 1 ́10 ⁸ Pa above. The upper limit of the storage elastic modulus of the substrate 11 at 100 ° C is preferably 1 ́10 from the viewpoint of process suitability. ¹² Pa below. Further, in the present specification, the storage elastic modulus of the substrate 11 at 100 ° C is a value of a tensile elastic modulus measured at a frequency of 1 Hz using a viscoelasticity measuring machine. The measured substrate was cut into a width of 5 mm and a length of 20 mm, and a storage viscoelastic modulus at 100 ° C was measured using a viscoelasticity measuring apparatus (DMAQ800, manufactured by TA Instruments Co., Ltd.) at a frequency of 1 Hz and a tensile model. In order to improve the adhesion between the substrate 11 and the adhesive layer 12, the first substrate surface 11a may be subjected to at least one surface treatment such as primer treatment, corona treatment, and plasma treatment. Further, in order to improve the adhesion between the substrate 11 and the adhesive layer 12, an adhesive may be applied to the first substrate surface 11a of the substrate 11, and a preliminary adhesive treatment may be applied. Examples of the adhesive used for the adhesion treatment of the substrate 11 include an adhesive such as an acrylic adhesive, a rubber adhesive, a polyoxygen adhesive, and a urethane adhesive. The thickness of the substrate 11 is preferably 10 μm or more and 500 μm or less, more preferably 15 μm or more and 300 μm or less, and still more preferably 20 μm or more and 250 μm or less. (Adhesive Layer) The adhesive layer 12 of the present embodiment contains an adhesive composition. The adhesive contained in the adhesive composition is not particularly limited, and various types of adhesives can be applied to the adhesive layer 12. Examples of the adhesive contained in the adhesive layer 12 include a rubber-based adhesive, an acrylic adhesive, a polyoxygen-based adhesive, a polyester-based adhesive, and a urethane-based adhesive. Further, the type of the adhesive is selected in consideration of the use and the type of the attached body to be attached. The adhesive layer 12 is preferably composed of an acrylic adhesive composition or a polyoxynitride adhesive composition, and more preferably an acrylic adhesive composition. Since the adhesive layer 12 is composed of an acrylic adhesive composition, when the adhesive sheet 10 is peeled off from the attached body, the adhesive (so-called residual glue) remaining on the surface of the attached body or the like can be reduced.・Acrylic Adhesive Composition When the adhesive layer 12 is composed of an acrylic adhesive composition, the acrylic adhesive composition preferably contains an acrylic copolymer. In this case, the acrylic copolymer preferably contains an alkyl (meth)acrylate (CH). ₂ =CR ¹ COOR ² (R ¹ Is hydrogen or methyl, R ² It is a copolymer component of a linear, branched chain or cyclic (alicyclic) alkyl group)). Further, from the viewpoint of adjusting the surface free energy of the adhesive layer, an alkyl acrylate (CH) ₂ =CR ¹ COOR ² Part or all of which is preferably an alkyl group R ² The alkyl (meth)acrylate having a carbon number of 6 to 8. As alkyl R ² The alkyl (meth)acrylate having a carbon number of 6 to 8 may, for example, be n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate or 2-ethylhexyl (meth)acrylate. Base) isooctyl acrylate and n-octyl (meth) acrylate. Among these, preferably R ² It is an alkyl group of a straight chain or a branched chain. Also, preferably an alkyl group R ² The carbon number is 8 and more preferably 2-ethylhexyl (meth)acrylate, and particularly preferably 2-ethylhexyl acrylate. In the present embodiment, the acrylic copolymer preferably contains an acrylic copolymer containing 2-ethylhexyl (meth)acrylate as a main monomer. In the present specification, the term "2-ethylhexyl (meth)acrylate" as the main monomer means 2-ethylhexyl (meth)acrylate in terms of the mass of the entire acrylic copolymer. The mass ratio of the copolymer component is 50% by mass or more. As alkyl R ² An alkyl (meth)acrylate having a carbon number of 1 to 5 or 9 to 20 (the aforementioned CH) ₂ =CR ¹ COOR ² For example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, n-amyl (meth)acrylate, (A) Base) n-decyl acrylate, n-dodecyl (meth)acrylate, myristyl (meth)acrylate, palmityl (meth)acrylate, and octadecyl (meth)acrylate. The (meth)acrylic acid alkyl esters may be used singly or in combination of two or more. In addition, "(meth)acrylic acid" in this specification shows the expression used for the both "acrylic acid" and "methacrylic acid", and the similar similar terms are similar. In the present embodiment, the acrylic copolymer preferably contains the aforementioned CH ₂ =CR ¹ COOR ² An acrylic copolymer as a main monomer. In this specification, the so-called CH ₂ =CR ¹ COOR ² As the main monomer, it means that it accounts for the mass of the entire acrylic copolymer, from CH ₂ =CR ¹ COOR ² The mass ratio of the copolymer component is 50% by mass or more. From the viewpoint of adjusting the surface free energy of the adhesive layer, from the mass of the entire acrylic copolymer, from the alkyl (meth)acrylate (the aforementioned CH) ₂ =CR ¹ COOR ² The mass ratio of the copolymer component is preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 80% by mass or more, and still more preferably 90% by mass or more. From (meth)acrylic acid alkyl ester (previously CH ₂ =CR ¹ COOR ² The mass ratio of the copolymer component is preferably 96% by mass or less from the viewpoint of an increase in initial adhesion. When the first copolymer component in the acrylic copolymer is an alkyl (meth)acrylate, a copolymer component other than the alkyl (meth)acrylate in the acrylic copolymer (hereinafter referred to as "second copolymerization" The type and number of the substance components are not particularly limited. For example, as the second copolymer component, a functional group-containing monomer having a reactive functional group is preferred. As the reactive functional group of the second copolymer component, when a crosslinking agent to be described later is used, a functional group reactive with the crosslinking agent is preferred. Examples of the reactive functional group include a carboxyl group, a hydroxyl group, an amine group, a substituted amine group, and an epoxy group. Examples of the monomer having a carboxyl group (hereinafter also referred to as "monomer having a carboxyl group") include ethylenic acid such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. Saturated carboxylic acid. Among the carboxyl group-containing monomers, acrylic acid is preferred from the viewpoint of reactivity and copolymerizability. The single system containing a carboxyl group may be used singly or in combination of two or more. Examples of the monomer having a hydroxyl group (hereinafter also referred to as "a monomer having a hydroxyl group") include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and (methyl). a hydroxyalkyl (meth)acrylate such as 3-hydroxypropyl acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate Wait. Among the hydroxyl group-containing monomers, 2-hydroxyethyl (meth)acrylate is preferred from the viewpoint of reactivity and copolymerizability of a hydroxyl group. The single system containing a hydroxyl group may be used singly or in combination of two or more. Examples of the acrylate having an epoxy group include glycidyl acrylate and glycidyl methacrylate. In addition to the above, examples of the second copolymer component in the acrylic copolymer include a (meth) acrylate selected from an alkoxyalkyl group and a (meth) acrylate having an aromatic ring. a copolymer component of at least one monomer selected from the group consisting of non-crosslinkable acrylamide, non-crosslinkable (meth) acrylate having a tertiary amino group, vinyl acetate, and styrene . Examples of the (meth) acrylate containing an alkoxyalkyl group include methoxymethyl (meth)acrylate, methoxyethyl (meth)acrylate, and ethoxylated (meth)acrylate. Ester and ethoxyethyl (meth)acrylate. Examples of the (meth) acrylate having an aromatic ring include phenyl (meth) acrylate and the like. Examples of the non-crosslinkable acrylamide include acrylamide, methacrylamide, and the like. Examples of the non-crosslinkable (meth) acrylate having a tertiary amino group include (N,N-dimethylamino)ethyl (meth)acrylate and (meth)acrylic acid (N, N-dimethylamino)propyl ester and the like. These single systems may be used singly or in combination of two or more. In the present embodiment, the acrylic copolymer preferably contains a copolymer component derived from a monomer having a hydroxyl group. When the acrylic copolymer contains a copolymer component derived from a monomer having a hydroxyl group, when a crosslinking agent to be described later is used, since the crosslinking density at which a hydroxyl group is used as a crosslinking point can be increased, resin leakage can be prevented, so that it is effective. Prevent wafer offset. The mass ratio of the copolymer component derived from the monomer having a hydroxyl group is preferably 3% by mass or more based on the mass of the entire acrylic copolymer. When the mass ratio of the copolymer component derived from the hydroxyl group-containing monomer is 3% by mass or more, leakage of the resin can be more effectively prevented. From the viewpoint of improving the filling property, the mass ratio of the copolymer component derived from the monomer having a hydroxyl group is preferably 9.9 mass% or less, based on the mass of the entire acrylic copolymer. In the present embodiment, from the viewpoint of preventing an increase in surface free energy, the acrylic copolymer is preferably not contained in a copolymer component derived from a monomer having a carboxyl group. Alternatively, the acrylic copolymer contains a copolymer component derived from a monomer having a carboxyl group, and the mass ratio of the copolymer component derived from the monomer having a carboxyl group is preferably 1 mass, based on the mass of the entire acrylic copolymer. % or less is more preferably 0.05% by mass or more and 1% by mass or less. The weight average molecular weight (Mw) of the acrylic copolymer is preferably from 300,000 to 2,000,000, more preferably from 600,000 to 1.5 million, and particularly preferably from 800,000 to 1.2 million. When the weight average molecular weight Mw of the acrylic copolymer is 300,000 or more, the adhesive sheet can be peeled off under the residue having no adhesive to the attached body. When the weight average molecular weight Mw of the acrylic copolymer is 2,000,000 or less, the adhesive sheet can be reliably attached to the attached body. The weight average molecular weight (Mw) of the acrylic copolymer is a standard polystyrene equivalent value measured by a Gel Permeation Chromatography (GPC) method. The acrylic copolymer can be produced by a conventional method using the various raw material monomers described above. The copolymerization form of the acrylic copolymer is not particularly limited, and may be any of a block copolymer, a random copolymer or a graft copolymer. In the present embodiment, the mass ratio of the acrylic copolymer is preferably 40% by mass or more and 90% by mass or less, and more preferably 50% by mass or more and 90% by mass or less, based on the total mass of the acrylic pressure-sensitive adhesive composition. In the present embodiment, when the pressure-sensitive adhesive layer 12 is composed of an acrylic pressure-sensitive adhesive composition, the acrylic pressure-sensitive adhesive composition preferably contains an acrylic copolymer and an adhesion aid. Since the acrylic adhesive composition contains an adhesion aid, the initial viscosity of the adhesive sheet is increased, and peeling off when the adhesive sheet is attached to the frame can be prevented. In the present embodiment, the adhesion aid contained in the acrylic pressure-sensitive adhesive composition preferably contains an oligomer having a hydrocarbon skeleton. The oligomer is preferably a polymer having a molecular weight of less than 10,000. Since the acrylic pressure-sensitive adhesive composition contains an adhesion aid containing an oligomer having a hydrocarbon skeleton, in addition to the above effects, an increase in surface free energy can be suppressed, and the filling property can be improved. As the oligomer having a hydrocarbon skeleton, a reactive group is preferred. Hereinafter, an oligomer having a hydrocarbon skeleton and having a reactive group is also referred to as a hydrocarbon-based reactive adhesion promoter. If the adhesive composition contains a hydrocarbon-based reactive adhesion aid, the residual glue can be reduced. In the present embodiment, the reactive group in the adhesion aid is preferably selected from the group consisting of a hydroxyl group, an isocyanate group, an amine group, an oxiran group, an acid anhydride group, an alkoxy group, an acrylonitrile group, and a methacrylium group. More than one functional group of the group formed by the group is more preferably a hydroxyl group. The reactive group of the adhesion aid may be one type or two or more types. The adhesion promoter having a hydroxyl group may further have a reactive group different from the foregoing. Further, the number of the reactive groups may be one or two or more of one molecule constituting the adhesion aid. The oligomer having a hydrocarbon skeleton is preferably a rubber-based material from the viewpoint of reduction in surface free energy of the adhesive layer and prevention of residual glue. The rubber-based material is not particularly limited, but is preferably a hydrogenated product of a polybutadiene-based resin and a polybutadiene-based resin, and is preferably a hydrogenated product of a polybutadiene-based resin. Examples of the polybutadiene-based resin include a resin having a 1,4-repeat unit, a resin having a 1,2-repeat unit, and a resin having both a 1,4-repeat unit and a 1,2-repeat unit. . The hydride of the polybutadiene-based resin of the present embodiment also contains a hydride of a resin having such a repeating unit. When the rubber-based material has a reactive group, the hydrogenated product of the polybutadiene-based resin and the polybutadiene-based resin preferably has a reactive group at both ends. The reactive groups at both ends may be the same or different. The reactive group at both ends is preferably one or more selected from the group consisting of a hydroxyl group, an isocyanate group, an amine group, an oxirane group, an acid anhydride group, an alkoxy group, an acryloyl group, and a methacryl group. A functional group is more preferably a hydroxyl group. In the hydride of the polybutadiene-based resin and the polybutadiene-based resin, both ends are more preferably a hydroxyl group. In the present embodiment, the adhesion promoter preferably further comprises acetyl citrate. If the adhesive composition contains acetyl citrate, the residual glue can be reduced. In the present embodiment, examples of the oxime citrate triester-based adhesion promoter include etidinyl tributyl citrate (ATBC). The mass ratio of the adhesion aid is preferably from 3% by mass to 50% by mass, and more preferably from 5% by mass to 30% by mass, based on the total mass of the adhesive composition. In addition, when the adhesion promoter contains an oligomer having a hydrocarbon skeleton, the mass ratio of the oligomer having a hydrocarbon skeleton is preferably 3% by mass or more and 50% by mass or less, based on the mass of the entire adhesive composition. It is preferably 5 mass% or more and 30 mass% or less. The acrylic pressure-sensitive adhesive composition of the present embodiment preferably further comprises a crosslinked product obtained by crosslinking the above-mentioned acrylic copolymer with a composition in which a crosslinking agent is further blended. Further, the acrylic pressure-sensitive adhesive composition of the present embodiment preferably further comprises cross-linking the above-mentioned acrylic copolymer, hydrocarbon-based reactive adhesive agent and a composition further blended with a crosslinking agent. Things. In the present embodiment, examples of the crosslinking agent include an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, a metal chelate crosslinking agent, and an amine crosslinking agent. An amino resin-based crosslinking agent or the like. These crosslinking agents may be used singly or in combination of two or more. In the present embodiment, from the viewpoint of improving heat resistance and adhesion of the acrylic pressure-sensitive adhesive composition, among these crosslinking agents, a crosslinking agent of a compound having an isocyanate group (isocyanate-based crosslinking) is preferred. Joint agent). Examples of the isocyanate crosslinking agent include 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 1,3-benzenedimethyl diisocyanate, 1,4-benzenedimethyl diisocyanate, and Phenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, A polyvalent isocyanate compound such as dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and isocyanuric acid isocyanate. Further, the polyvalent isocyanate compound may be a trimethylolpropane addition type modified body of the compound, a biuret type modified body after reacting with water, or an isomeric cyanate ring. Isocyanurate type modified body. In the present embodiment, the content of the crosslinking agent in the acrylic pressure-sensitive adhesive composition is preferably 0.1 parts by mass or more and 20 parts by mass or less, more preferably 1 part by mass or more and 15 parts by mass based on 100 parts by mass of the acrylic copolymer. It is especially preferably 5 parts by mass or more and 10 parts by mass or less. When the content of the crosslinking agent in the acrylic pressure-sensitive adhesive composition is within such a range, the storage elastic modulus of the pressure-sensitive adhesive layer 12 at 100 ° C can be easily adjusted to the above range. In the present embodiment, the isocyanate crosslinking agent is more preferably a compound having a cyanurate ring (isocyanurate type modified body) from the viewpoint of heat resistance of the acrylic pressure-sensitive adhesive composition. . The compound having an isomeric cyanate ring is preferably blended so as to have an isocyanate group of 0.7 equivalent or more and 1.5 equivalent or less with respect to the hydroxyl equivalent of the acrylic copolymer. When the blending amount of the compound having an isomeric cyanate ring is 0.7 equivalent or more, the adhesive force after heating is not excessively high, and the adhesive sheet can be easily peeled off to reduce the residual glue. When the blending amount of the compound having an isomeric cyanate ring is 1.5 equivalent or less, the initial adhesive strength can be prevented from being lowered or the adhesion can be prevented from being lowered. When the acrylic pressure-sensitive adhesive composition of the present embodiment contains a crosslinking agent, the acrylic pressure-sensitive adhesive composition preferably further contains a crosslinking accelerator. The crosslinking accelerator is preferably selected and used in accordance with the type of the crosslinking agent. For example, when the acrylic pressure-sensitive adhesive composition contains a polyisocyanate compound as a crosslinking agent, it is preferred to further contain an organic metal compound-based crosslinking accelerator such as an organic tin compound.・Polyoxygen-based adhesive composition When the adhesive layer 12 is composed of a polyoxygen-based adhesive composition, the polyoxygen-based adhesive composition preferably contains a polyoxyl resin, more preferably an additive. Polymeric polyoxymethylene resin. In the present specification, a polyfluorene-based pressure-sensitive adhesive composition containing an addition polymerization type polyoxyxylene resin is referred to as an addition reaction type polyoxo-based pressure-sensitive adhesive composition. In the present embodiment, the addition reaction type polyoxo-based adhesive composition contains a main component (addition polymerization type polyoxyxylene resin) and a crosslinking agent. The addition reaction type polyoxo-based adhesive composition can be used only once hardened at a low temperature, and has the advantage of not requiring secondary hardening at a high temperature. Incidentally, the conventional peroxide-curable polyfluorene-based adhesive is required to be twice cured at a high temperature of 150 ° C or higher. Therefore, by using the addition reaction type polyoxynitride-based adhesive composition, the adhesive sheet can be produced at a relatively low temperature, and the energy economy is excellent, and the adhesive sheet 10 can be produced using the substrate 11 having a relatively low heat resistance. Further, since the peroxide-curable polyadhesive-based pressure-sensitive adhesive does not generate by-products during curing, there is no problem such as odor or corrosion. The addition reaction type polyoxynoxy adhesive composition generally includes a main component composed of a mixture of a polyoxyxylene resin component and a polyoxyxylene rubber component, and a crosslinking agent containing a hydroquinone group (SiH group), and The hardening catalyst that needs to be used. The polyoxyxylene resin component is an organic polyoxyalkylene having a network structure obtained by subjecting an organochlorosilane or an organoalkoxysilane to hydrolysis, followed by a dehydration condensation reaction. The polyoxyxene rubber component is a diorganopolyoxyalkylene having a linear structure. The organic group may be, for example, a methyl group, an ethyl group, a propyl group, a butyl group or a phenyl group together with the polyoxyxylene resin component and the polyoxyxylene rubber component. The aforementioned organic group may be partially substituted with, for example, a vinyl group, a hexenyl group, an allyl group, a butenyl group, a pentenyl group, an octenyl group, a (meth) acrylonitrile group, or a (meth) acrylonitrile group. An unsaturated group such as a (meth) propylene decyl propyl group or a cyclohexenyl group. It is preferably an organic group having a vinyl group which is industrially easy to obtain. In the addition reaction type polyoxo-based adhesive composition, crosslinking is carried out by an addition reaction of an unsaturated group in the main component with a hydroquinone group in the crosslinking agent to form a network structure, exhibiting adhesion. Sex. The number of the unsaturated groups such as a vinyl group in the polyoxyxylene resin component is usually 0.05 or more and 3.0 or less, preferably 0.1 or more and 2.5 or less, based on 100 parts of the organic group. By setting the number of the unsaturated groups to 100 or more with respect to 100 organic groups, it is possible to prevent the reactivity with the hydroquinone group from being lowered and it is difficult to be cured, and it is possible to impart an appropriate adhesive force. By setting the number of the unsaturated groups to 100 or less with respect to 100 organic groups, it is possible to prevent the crosslinking density of the adhesive from becoming high, and the adhesion and cohesive force are increased to adversely affect the surface to be attached. As the above-mentioned organopolyoxane, specifically, KS-3703 (the number of vinyl groups is 0.6 with respect to 100 methyl groups) manufactured by Shin-Etsu Chemical Co., Ltd., Toray-Dow Corning Co., Ltd. BY23-753 (the number of vinyl groups is 0.1 with respect to 100 methyl groups) and BY24-162 (the number of vinyl groups is 1.4 with respect to 100 methyl groups). Further, SD4560PSA, SD4570PSA, SD4580PSA, SD4584PSA, SD4585PSA, SD4587L, and SD4592PSA manufactured by Toray-Dow Corning Co., Ltd. may be used. As described above, the organopolysiloxane which is a component of the polyoxyxylene resin is usually used in combination with a polyoxyxene rubber component. As the component of the polyoxyxene rubber, KS-3800 (Vinyl) manufactured by Shin-Etsu Chemical Co., Ltd. The number is 7.6 with respect to 100 methyl groups. BY24-162 by Toray-Dow Corning Co., Ltd. (the number of vinyl is 1.4 with respect to 100 for methyl groups), BY24-843 (No There are unsaturated groups) and SD-7292 (the number of vinyl groups is 5.0 with respect to 100 methyl groups). A specific example of the above-mentioned addition polymerization type polyoxyxylene resin (additional polyoxymethylene) is described in, for example, Japanese Laid-Open Patent Publication No. Hei 10-219229. The cross-linking agent is usually one or more than 10 or less hydrogen atoms bonded to the ruthenium atom of one of the unsaturated groups (such as a vinyl group) of the polyoxyxylene resin component and the polyoxyxylene rubber component. It is preferably blended in a manner of one or more and 2.5 or less. By setting it as 0.5 or more, it can prevent that the reaction of the unsaturated group (vinyl group, etc.) and a hydroquinone group does not fully progress, and it is set as the hardening. By setting it as 10 or less, it is possible to prevent the crosslinking agent from remaining unreacted and causing adverse effects on the surface to be attached. The addition reaction type polyoxo-based adhesive composition preferably further contains the above-mentioned addition reaction type polyfluorene oxygen component (a main component composed of a polyoxyxylene resin component and a polyoxyxylene rubber component) and a crosslinking agent. Together with the hardening catalyst. This hardening catalyst is used to promote the hydroquinone reaction of the unsaturated group in the polyoxyxylene resin component and the polyoxyxylene rubber component and the SiH group in the crosslinking agent. Examples of the curing catalyst include a platinum-based catalyst, that is, an alcohol solution of chloroplatinic acid or chloroplatinic acid, a reaction product of chloroplatinic acid and an alcohol solution, a reaction product of chloroplatinic acid with an olefin compound, and chloroplatinic acid. A reactant of a vinyl group-containing siloxane compound, a platinum-olefin complex, a platinum-vinyl group-containing oxime complex, a platinum-phosphorus complex, and the like. Specific examples of the above-mentioned curing catalyst are described in, for example, JP-A-2006-28311 and JP-A-10-147758. More specifically, examples of the commercially available product include SRX-212 manufactured by Toray-Dow Corning Co., Ltd. and PL-50T manufactured by Shin-Etsu Chemical Co., Ltd. When the curing catalyst is a platinum-based catalyst, the blending amount is represented by a platinum component, and is usually 5 ppm by mass or more and 2000 ppm by mass or less based on the total amount of the polyoxyxylene resin component and the polyoxyxylene rubber component. It is preferably 10 ppm by mass or more and 500 ppm by mass or less. By setting the blending amount to 5 ppm by mass or more, it is possible to prevent the decrease in the curability and the decrease in the crosslinking density, that is, the adhesive force and the cohesive force (holding force), and it is possible to prevent the increase in cost while maintaining the amount of adhesion of 2000 mass ppm or less. The stability of the adhesive layer can prevent the excessively used hardening catalyst from adversely affecting the surface to be attached. In the addition-reactive polyoxo-based adhesive composition, the adhesion is exhibited even at normal temperature by blending the above-mentioned respective components, but it is preferred to coat the addition-reaction type polyoxygen-based adhesive composition. The substrate 11 and the release sheet RL are attached to the substrate 11 or the release sheet RL described later, and the substrate 11 and the release sheet RL are bonded to each other via an addition reaction type polyoxo-based adhesive composition, and then heated or activated energy rays are irradiated to promote the crosslinking agent. The cross-linking reaction of the polyoxymethylene resin component with the polyoxyxene rubber component. The cross-linking is carried out by irradiation of heat or active energy rays to obtain an adhesive sheet having a stable adhesive force. The heating temperature at the time of promoting the crosslinking reaction by heating is usually 60° C. or higher and 140° C. or lower, preferably 80° C. or higher and 130° C. or lower. Since it is heated at 60 ° C or higher, it is possible to prevent insufficient crosslinking of the polyoxynoxy resin component and the polyoxymethylene rubber component, and the adhesive strength is insufficient. Since heating at 140 ° C or lower, heat shrinkage wrinkles or prevention in the substrate can be prevented. Deterioration, discoloration. When the active energy ray is irradiated to accelerate the crosslinking reaction, an active energy ray having an energy source among the electromagnetic wave or the charged particle beam, that is, an active light such as an ultraviolet ray or an electron beam can be used. When the electron beam is irradiated and crosslinked, the photopolymerization initiator is not required, but when the active light such as ultraviolet rays is irradiated and crosslinked, it is preferred to have a photopolymerization initiator. The photopolymerization initiator which is crosslinked by ultraviolet irradiation is not particularly limited, and any photopolymerization initiator which is conventionally used in ultraviolet curable resins can be appropriately selected from any photopolymerization initiator. Used as a dose. Examples of the photopolymerization initiator include benzoin, diphenylketone, acetophenone, a-hydroxyketone, a-aminoketone, a-diketone, and a-di Keto-dialkyl acetals, anthraquinones, thioxanthones, other compounds, and the like. These photopolymerization initiators may be used singly or in combination of two or more. In addition, the amount of use is usually 0.01 parts by mass or more and 30 parts by mass or less, preferably 0.05 parts by mass or less based on 100 parts by mass of the total amount of the addition reaction type polyfluorene oxygen component and the crosslinking agent used as the main component. It is selected within the range of 20 mass parts or less. The acceleration voltage of the electron beam when the electron beam is irradiated by one of the active energy rays to be crosslinked is generally 130 kV or more and 300 kV or less, preferably 150 kV or more and 250 kV or less. By irradiating with an acceleration voltage of 130 kV or more, it is possible to prevent the adhesion between the polyoxyxylene resin component and the polyoxyxene rubber component from being insufficient and the adhesion is insufficient, and the adhesive layer can be prevented by irradiation with an acceleration voltage of 300 kV or less. And the substrate is deteriorated or discolored. The beam current is preferably in the range of 1 mA or more and 100 mA or less. The amount of the electron beam to be irradiated is preferably 1 Mrad or more and 70 Mrad or less, more preferably 2 Mrad or more and 20 Mrad or less. By irradiating with a linear amount of 1 Mrad or more, it is possible to prevent deterioration or discoloration of the adhesive layer and the substrate, and it is possible to prevent the adhesion from being insufficient due to insufficient crosslinking. By irradiating with a linear amount of 70 Mrad or less, it is possible to prevent deterioration of cohesive force due to deterioration or discoloration of the adhesive layer, and it is possible to prevent deterioration or shrinkage of the substrate. The amount of irradiation at the time of ultraviolet irradiation can be suitably selected, but the amount of light is preferably 100 mJ/cm. ² Above 500mJ/cm ² Hereinafter, the illuminance is preferably 10 mW/cm. ² Above 500mW/cm ² the following. In order to prevent the reaction hindrance caused by oxygen, the irradiation of the heating and active energy rays is preferably carried out under a nitrogen atmosphere. In the adhesive composition, other components may be contained within a range not impairing the effects of the present invention. Examples of other components which may be contained in the adhesive composition include an organic solvent, a flame retardant, an adhesive, an ultraviolet absorber, a light stabilizer, an antioxidant, an antistatic agent, a preservative, and an antifungal agent. Plasticizers, defoamers, colorants, fillers, and wettability modifiers. In the addition reaction type polyoxo-based adhesive composition, a non-reactive polyorganosiloxane such as polydimethyl methoxyoxane or polymethylphenyl siloxane may be contained as an additive. More specific examples of the adhesive composition of the present embodiment include the following examples of the adhesive composition, but the present invention is not limited to such an example. An example of the adhesive composition of the present embodiment is an adhesive composition comprising an acrylic copolymer, an adhesion aid, and a crosslinking agent, and the acrylic copolymer is at least 2-ethyl acrylate. An acrylic copolymer obtained by copolymerizing an ester, a carboxyl group-containing monomer, and a hydroxyl group-containing monomer, wherein the adhesion aid comprises a rubber-based material having a reactive group as a main component, and the crosslinking agent is isocyanate-based crosslinking. Agent. An example of the adhesive composition of the present embodiment is an adhesive composition comprising an acrylic copolymer, an adhesion aid, and a crosslinking agent, and the acrylic copolymer is at least 2-ethyl acrylate. An acrylic copolymer obtained by copolymerizing an ester, a carboxyl group-containing monomer, and a hydroxyl group-containing monomer, wherein the adhesion aid is a terminal hydrogenated polybutadiene, and the crosslinking agent is an isocyanate crosslinking agent. An example of the adhesive composition of the present embodiment is an adhesive composition comprising an acrylic copolymer, an adhesion aid, and a crosslinking agent, and the acrylic copolymer is at least 2-ethyl acrylate. An acrylic copolymer obtained by copolymerizing an ester, acrylic acid, and 2-hydroxyethyl acrylate, wherein the adhesion aid contains a rubber-based material having a reactive group as a main component, and the crosslinking agent is an isocyanate-based crosslinking agent. An example of the adhesive composition of the present embodiment is an adhesive composition comprising an acrylic copolymer, an adhesion aid, and a crosslinking agent, and the acrylic copolymer is at least 2-ethyl acrylate. An acrylic copolymer obtained by copolymerizing an ester, acrylic acid, and 2-hydroxyethyl acrylate, wherein the adhesion aid is a terminal hydrogenated polybutadiene, and the crosslinking agent is an isocyanate crosslinking agent. The thickness of the adhesive layer 12 is suitably determined in accordance with the use of the adhesive sheet 10. In the present embodiment, the thickness of the adhesive layer 12 is preferably 5 μm or more and 60 μm or less, and more preferably 10 μm or more and 50 μm or less. When the thickness of the adhesive layer 12 is 5 μm or more, the adhesive layer 12 easily follows the unevenness of the wafer circuit surface, and the occurrence of the gap can be prevented. For this reason, for example, there is no gap between the unevenness of the circuit surface of the semiconductor wafer, such as the interlayer insulating material and the sealing resin, and the electrode pad for wiring connection of the wafer circuit surface is blocked. If the thickness of the adhesive layer 12 is 60 μm or less, the semiconductor wafer is less likely to sink into the adhesive layer, and the step of the semiconductor wafer portion and the resin portion of the sealed semiconductor wafer is less likely to occur. Therefore, there is no wire breakage due to the step difference at the time of rewiring. (Release Sheet) The release sheet RL is not particularly limited. For example, from the viewpoint of ease of handling, the release sheet RL preferably has a release substrate and a release agent layer formed by applying a release agent onto the release substrate. Further, the release sheet RL may be provided with a release agent layer only on one surface of the release substrate, or may have a release agent layer on both surfaces of the release substrate. Examples of the release substrate include a paper substrate, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. Examples of the paper substrate include cellophane, coated paper, and mirror coated paper. Examples of the plastic film include polyester films (for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.) and polyolefin films (for example, polypropylene and Polyethylene, etc.). Examples of the release agent include an olefin resin, a rubber elastomer (for example, a butadiene resin and an isoprene resin), a long-chain alkyl resin, an alkyd resin, and a fluorine resin. Polyoxymethylene resin or the like. When the adhesive layer is composed of a polyoxygen-based adhesive composition, the release agent is preferably a non-polyoxyl-based release agent. The thickness of the release sheet RL is not particularly limited. The thickness of the release sheet RL is usually 20 μm or more and 200 μm or less, and preferably 25 μm or more and 150 μm or less. The thickness of the release agent layer is not particularly limited. When the release agent layer is applied to form a release agent layer, the thickness of the release agent layer is preferably 0.01 μm or more and 2.0 μm or less, and more preferably 0.03 μm or more and 1.0 μm or less. When a plastic film is used as the release substrate, the thickness of the plastic film is preferably 3 μm or more and 50 μm or less, and more preferably 5 μm or more and 40 μm or less. (Method for Producing Adhesive Sheet) The method for producing the adhesive sheet 10 is not particularly limited. For example, the adhesive sheet 10 can be manufactured by the following steps. First, an adhesive composition is applied onto the first substrate surface 11a of the substrate 11 to form a coating film. Next, the coating film is dried to form the adhesive layer 12. Then, the release sheet RL is adhered in such a manner as to cover the adhesive layer 12. Moreover, as another manufacturing method of the adhesive sheet 10, it is manufactured by the following steps. First, an adhesive composition is applied on the release sheet RL to form a coating film. Next, the coating film is dried to form an adhesive layer 12, and the first substrate surface 11a of the substrate 11 is bonded to the adhesive layer 12. When the adhesive composition is applied to form the adhesive layer 12, it is preferred to dilute the adhesive composition with an organic solvent to prepare a coating liquid (adhesive liquid for coating). Examples of the organic solvent include toluene, ethyl acetate, methyl ethyl ketone, and the like. The method of applying the coating liquid is not particularly limited. Examples of the coating method include a spin coating method, a spray coating method, a bar coating method, a knife coating method, a roll coating method, a roll coating method, a knife coating method, a die coating method, and a gravure coating method. Wait. In order to prevent the organic solvent and the low-boiling component from remaining in the adhesive layer 12, it is preferred to apply the coating liquid onto the substrate 11 or the release sheet RL, and then heat the coating film to dry it. When the crosslinking agent is blended in the adhesive composition, it is preferred to heat the coating film in order to increase the cohesive force in order to carry out the crosslinking reaction. (Use of Adhesive Sheet) The adhesive sheet 10 is used for sealing a semiconductor element. The adhesive sheet 10 is not mounted on a metal lead frame, and is preferably used for sealing a semiconductor element in a state of being adhered to the adhesive sheet 10. Specifically, when the adhesive sheet 10 is not used for sealing a semiconductor element mounted on a metal lead frame, it is preferably used for sealing a semiconductor element in a state of being adhered to the adhesive layer 12. As a form in which the semiconductor element is packaged without using a metal lead frame, a panel scale package (PSP), a WLP, or the like can be given. The adhesive sheet 10 is preferably used in a process of adhering a frame member having a plurality of openings to the adhesive sheet 10, and adhering the semiconductor wafer to the adhesive layer 12 exposed in the opening of the frame member. And the step of covering the semiconductor wafer with a sealing resin and thermally hardening the sealing resin. (Method of Manufacturing Semiconductor Device) A method of manufacturing a semiconductor device using the adhesive sheet 10 of the present embodiment will be described. 2A to 2E are schematic views for explaining a method of manufacturing the semiconductor device of the embodiment. In the method of manufacturing the semiconductor device of the present embodiment, the frame member 20 in which the plurality of openings 21 are formed is adhered to the adhesive sheet 10 (adhesive sheet bonding step), and the adhesive is exposed in the opening portion 21 of the frame member 20. a step of bonding the semiconductor wafer CP on the layer 12 (joining step), a step of covering the semiconductor wafer CP with the sealing resin 30 (sealing step), a step of thermally hardening the sealing resin 30 (thermosetting step), and after heat curing, The step of peeling off the adhesive sheet 10 (peeling step). If necessary, after the thermosetting step, the step of adhering the reinforcing member 40 to the sealing body 50 sealed by the sealing resin 30 may be applied (the reinforcing member pasting step). Hereinafter, each step will be described. [Adhesive Sheet Adhesion Step] FIG. 2A is a schematic view showing a step of attaching the frame member 20 to the adhesive layer 12 of the adhesive sheet 10. Further, when the release sheet RL is adhered to the adhesive layer 12 of the adhesive sheet 10, the release sheet RL is peeled off in advance. The frame member 20 of the present embodiment is formed in a lattice shape and has a plurality of openings 21. The frame member 20 is preferably formed of a material having heat resistance. Examples of the material of the frame member include a metal such as copper or stainless steel, and a heat-resistant resin such as a polyimide resin or a glass epoxy resin. The opening portion 21 is a hole that penetrates the front surface of the frame member 20. The shape of the opening portion 21 is not particularly limited as long as the semiconductor wafer CP can be housed in the frame. The depth of the hole of the opening portion 21 is not particularly limited as long as it can accommodate the semiconductor wafer CP.・Joining Step FIG. 2B is a schematic view for explaining a step of attaching the semiconductor wafer CP to the adhesive layer 12. When the adhesive sheet 10 is adhered to the frame member 20, the adhesive layer 12 is exposed in the shape of the opening 21 in each of the openings 21. The semiconductor wafer CP is adhered to the adhesive layer 12 of each of the openings 21. The semiconductor wafer CP is pasted in such a manner that the adhesive layer 12 covers the circuit surface thereof. The semiconductor wafer CP is manufactured, for example, by performing a back grinding step of grinding the back surface of the semiconductor wafer on which the circuit is formed, and a dicing step of singulating the semiconductor wafer. In the dicing step, the back surface of the semiconductor wafer is adhered to the adhesive layer of the dicing sheet, and the semiconductor wafer is diced by a cutting means such as a dicing saw to obtain a semiconductor wafer CP (semiconductor element). The cutting device is not particularly limited, and a well-known cutting device can be used. Further, the conditions for cutting are not particularly limited. Further, instead of using a cutting blade cutting method, a laser cutting method or a stealth laser cutting method may be used. After the dicing step, a stretch dicing sheet may be applied to expand the interval between the plurality of semiconductor wafers CP. By performing the expansion step, the semiconductor wafer CP can be picked up using a transport means such as a collet. Further, by performing the expansion step, the adhesion force of the adhesive layer of the dicing sheet is reduced, and the semiconductor wafer CP can be easily picked up. When the energy ray-polymerizable compound is blended in the adhesive composition or the adhesive layer of the dicing sheet, the energy ray-polymerizable compound is cured by irradiating the adhesive layer with an energy ray from the substrate side of the dicing sheet. When the energy ray polymerizable compound is cured, the cohesive force of the adhesive layer is increased, and the adhesion of the adhesive layer can be lowered. Examples of the energy rays include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays. The irradiation of the energy rays can also be performed at any stage before the semiconductor wafer is attached (picked) after attachment of the semiconductor wafer. For example, the energy line can be illuminated before or after cutting, or the energy line can be illuminated after the expanding step. Sealing Step and Thermal Curing Step FIG. 2C is a schematic view for explaining a step of sealing the semiconductor wafer CP and the frame member 20 adhered to the adhesive sheet 10. The material of the sealing resin 30 is a thermosetting resin, and examples thereof include an epoxy resin. The epoxy resin used as the sealing resin 30 may contain, for example, a phenol resin, an elastomer, an inorganic filler, a curing accelerator, or the like. The method of covering the semiconductor wafer CP and the frame member 20 with the sealing resin 30 is not particularly limited. In the present embodiment, the aspect in which the sheet-like sealing resin 30 is used will be described as an example. The sheet-shaped sealing resin 30 is placed so as to cover the semiconductor wafer CP and the frame member 20, and the sealing resin 30 is heat-cured to form the sealing resin layer 30A. In this manner, the semiconductor wafer CP and the frame member 20 are buried in the sealing resin layer 30A. When the sheet-shaped sealing resin 30 is used, it is preferable to seal the semiconductor wafer CP and the frame member 20 by vacuum lamination. By this vacuum lamination, it is possible to prevent a void from occurring between the semiconductor wafer CP and the frame member 20. The temperature condition of the heat curing of the vacuum layer is, for example, 80 ° C or more and 120 ° C or less. When the sheet-shaped sealing resin 30 is used, the sheet-shaped sealing resin is solid before the sealing step. Therefore, there is a case where the filling property is worse than that of the liquid sealing resin. The adhesive sheet 10 of the present embodiment has a surface free energy of 10 mJ/m because of the adhesive layer 12. ² Above 22mJ/m ² In the following, even if the sealing resin is in the form of a sheet, the filling property is excellent, and the occurrence of defects in this step can be prevented. In the sealing step, a laminated sheet in which the sheet-like sealing resin 30 is supported by a resin sheet such as polyethylene terephthalate may be used. At this time, after the laminated sheet is placed so as to cover the semiconductor wafer CP and the frame member 20, the resin sheet can be peeled off from the sealing resin 30, and the sealing resin 30 can be heat-cured. As such a laminated sheet, for example, an ABF film (manufactured by Ajinomoto Precision Technology Co., Ltd.) or the like can be given. As a method of sealing the semiconductor wafer CP and the frame member 20, a transfer molding method can also be employed. At this time, for example, the semiconductor wafer CP and the frame member 20 adhered to the adhesive sheet 10 are housed inside the mold of the sealing device. A fluid resin material is injected into the mold to harden the resin material. In the case of the transfer molding method, the conditions of heating and pressure are not particularly limited. As an example of the normal conditions in the transfer molding method, the temperature of 150 ° C or more and the pressure of 4 MPa or more and 15 MPa or less are maintained between 30 seconds and 300 seconds or less. Then, the pressurization is released, and the cured product is taken out from the sealing device, and placed in an oven, and the temperature at 150 ° C or higher is maintained for 2 hours or longer and 15 hours or shorter. In this manner, the semiconductor wafer CP and the frame member 20 are sealed. When the sheet-shaped sealing resin 30 is used in the sealing step described above, the first heating and pressurizing step may be performed before the step of thermally curing the sealing resin 30 (thermal curing step). In the first heating and pressurizing step, the adhesive sheet 10 with the semiconductor wafer CP and the frame member 20 covered with the sealing resin 30 is sandwiched between the both sides by a plate-like member, and is applied under the conditions of a specified temperature, time and pressure. Pressure. By performing the first heating and pressurizing step, the sealing resin 30 also easily fills the gap between the semiconductor wafer CP and the frame member 20. Further, by performing the heating and pressurizing step, the unevenness of the sealing resin layer 30A composed of the sealing resin 30 can be flattened. As the plate member, for example, a metal plate such as stainless steel can be used. After the heat-hardening step, when the adhesive sheet 10 is peeled off, the semiconductor wafer CP and the frame member 20 sealed by the sealing resin 30 are obtained. Hereinafter, this is also referred to as a sealing body 50.・Reinforcing Member Adhesion Step FIG. 2D is a schematic view for explaining a step of adhering the reinforcing member 40 to the sealing body 50. After the adhesive sheet 10 is peeled off, a rewiring step and a bump attaching step capable of forming a rewiring layer are performed on the circuit surface of the exposed semiconductor wafer CP. In order to increase the operability of the sealing body 50 in the step of rewiring and the step of attaching the bumps, the step of adhering the reinforcing member 40 to the sealing body 50 may be performed as needed (the reinforcing member pasting step). When the reinforcing member pasting step is carried out, it is preferably carried out before the adhesive sheet 10 is peeled off. As shown in FIG. 2D, the sealing body 50 is supported in a state of being sandwiched by the adhesive sheet 10 and the reinforcing member 40. In the present embodiment, the reinforcing member 40 is provided with a heat-resistant reinforcing plate 41 and a heat-resistant adhesive layer 42. The reinforcing plate 41 is, for example, a plate-shaped member comprising a heat-resistant resin such as a polyimide resin or a glass epoxy resin. Next, the layer 42 is followed by the reinforcing plate 41 and the sealing body 50. The adhesive layer 42 can be suitably selected according to the material of the reinforcing plate 41 and the sealing resin layer 30A. For example, when the sealing resin layer 30A contains an epoxy resin and the reinforcing plate 41 contains a glass epoxy resin, the backing layer 42 is preferably a glass cloth containing a thermoplastic resin as a thermoplastic resin contained in the adhesive layer 42. Good for double horses Resin (BT resin). In the reinforcing member pasting step, the adhesive layer 42 is interposed between the sealing resin layer 30A of the sealing body 50 and the reinforcing plate 41, and the plate member is sandwiched between the reinforcing plate 41 side and the adhesive sheet 10 side, preferably A second heated and pressurized step of pressurization is carried out under specified conditions of temperature, time and pressure. The sealing body 50 and the reinforcing member 40 are temporarily fixed by the second heating and pressurizing step. After the second heating and pressurizing step, in order to cure the adhesive layer 42, it is preferred to heat the temporarily fixed sealing body 50 and the reinforcing member 40 at a predetermined temperature and time. The conditions for heat hardening can be suitably set according to the material of the adhesive layer 42, and are, for example, conditions of 185 ° C, 80 minutes, and 2.4 MPa. In the second heating and pressurizing step, as the plate member, for example, a metal plate such as stainless steel may be used.・Peeling Step FIG. 2E shows a schematic view showing a step of peeling off the adhesive sheet 10. In the present embodiment, the base material 11 of the adhesive sheet 10 can be bent, and the adhesive sheet 10 can be easily peeled off from the frame member 20, the semiconductor wafer CP, and the sealing resin layer 30A. Peeling angle θ It is not particularly limited, but is preferably a peel angle of 90 degrees or more. θ To peel off the adhesive sheet 10. As long as the peel angle θ When the thickness is 90 degrees or more, the adhesive sheet 10 can be easily peeled off from the frame member 20, the semiconductor wafer CP, and the sealing resin layer 30A. Peeling angle θ It is preferably 90 degrees or more and 180 degrees or less, more preferably 135 degrees or more and 180 degrees or less. By peeling the adhesive sheet 10 while bending it, the peeling can be performed while reducing the load applied to the frame member 20, the semiconductor wafer CP, and the sealing resin layer 30A, and the semiconductor wafer due to the peeling of the adhesive sheet 10 can be suppressed. Damage to the CP and the sealing resin layer 30A. The temperature environment in which the adhesive sheet 10 is peeled off may be room temperature, but when the interface between the members and the members of the attached body at the time of peeling is broken, the adhesiveness of the adhesive is lowered, and it is possible to be more than room temperature. The adhesive sheet 10 is peeled off in a high temperature environment. The temperature environment higher than room temperature is preferably in the range of 30 to 60 ° C, more preferably in the range of 35 to 50 ° C. After the adhesive sheet 10 is peeled off, the above-described rewiring step, adhesion bump step, and the like are performed. After the peeling of the adhesive sheet 10, the above-described reinforcing member pasting step may be carried out as needed before the rewiring step and the attaching bump step or the like. When the reinforcing member 40 is pasted, the reinforcing member 40 can be peeled off from the sealing body 50 after the step of supporting the rewiring step and the step of attaching the bumps, etc., without supporting the reinforcing member 40. Then, the sealing body 50 is diced in a semiconductor wafer CP unit (single step). The method of singulating the sealing body 50 is not particularly limited. For example, it can be singulated in the same manner as the method used to cut the aforementioned semiconductor wafer. The step of singulating the sealing body 50 can also be carried out in a state in which the sealing body 50 is adhered to the dicing sheet or the like. The semiconductor package of the semiconductor wafer CP unit is manufactured by singulating the sealing body 50, and the semiconductor package is mounted on a printed wiring board or the like in the mounting step. According to the present embodiment, it is possible to provide an adhesive sheet 10 which can prevent resin leakage when the semiconductor element on the adhesive sheet is sealed, and which has good filling property when sealing the semiconductor element on the adhesive sheet. Moreover, by using the method of manufacturing a semiconductor device using the adhesive sheet 10 of the present embodiment, leakage of the resin can be prevented, and the wafer can be prevented from flowing or floating. Therefore, the yield of the semiconductor device is increased. Moreover, in the sealing step, as shown in FIG. 3, the sealing resin 30 can be buried in the peripheral portion of the circuit surface CPA of the semiconductor wafer CP by the method of manufacturing the semiconductor device using the adhesive sheet 10 of the present embodiment. The gap S between the step portion CPB and the adhesive layer 12. The height dimension x of the step difference between the step portion CPB and the circuit surface CPA is usually 0.1 μm or more and 10 μm or less, preferably 0.5 μm or more and 5 μm or less. The smaller the height dimension x is, the more difficult it is for the sealing resin 30 to be buried in the gap S. However, the sealing resin 30 can be buried in the gap S as long as it is at least the above lower limit. The width dimension y of the step portion CPB is usually 1 μm or more and 100 μm or less, and preferably 5 μm or more and 50 μm or less. The larger the width dimension y is, the more difficult it is for the sealing resin 30 to be buried in the gap S. However, the sealing resin 30 can be buried in the gap S as long as it is equal to or less than the above upper limit. [Modifications of the Invention] The present invention is not limited to the above-described embodiments, and modifications and improvements within a scope that can achieve the object of the present invention are included in the present invention. In the following description, the same components as those described in the above embodiments are denoted by the same reference numerals, and their description will be omitted or simplified. In the above embodiment, the aspect in which the adhesive layer 12 of the adhesive sheet 10 is covered by the release sheet RL is taken as an example, but the present invention is not limited to such an aspect. Further, the adhesive sheet 10 may be a sheet or may be provided in a state in which a plurality of sheets of the adhesive sheet 10 are laminated. At this time, for example, the adhesive layer 12 may be covered by the substrate 11 of the other adhesive sheet to be laminated. Further, the adhesive sheet 10 may be a strip-shaped sheet or may be provided in a state of being wound into a roll. The adhesive sheet 10 which is wound into a roll shape can be taken out from a roll, cut into a desired size, and used. In the above embodiment, the case where the material of the sealing resin 30 is a thermosetting resin is described as an example, but the present invention is not limited to such a form. For example, the sealing resin 30 may be an energy ray curable resin which is cured by an energy ray such as ultraviolet rays. In the above-described embodiments, it is not necessary to perform all the steps in the respective steps in the method of manufacturing the semiconductor device, and a part of the steps may be omitted. In the above-described embodiment, in the description of the method of manufacturing the semiconductor device, the case where the frame member 20 is adhered to the adhesive sheet 10 will be described as an example, but the present invention is not limited to such an aspect. The adhesive sheet 10 can also be used in a method of manufacturing a semiconductor device in which a semiconductor element is sealed without using a frame member. Example Hereinafter, the present invention will be described in more detail by way of examples. The invention is completely unrestricted by these examples. [Evaluation Method] The evaluation of the adhesive sheet was carried out in accordance with the method shown below. [Storage Elastic Modulus] The coating adhesive liquid of Example 1 was applied to a release film ("PET3801", manufactured by LINTEC Co., Ltd.) using Comma Coater (registered trademark), and then dried (dry conditions). : 90 ° C, 90 seconds, and 115 ° C, 90 seconds), a layer having a thickness of 30 μm was formed, and this was laminated to prepare a circular measurement sample having a thickness of 1 mm and a diameter of 8 mm. The storage elastic modulus (Pa) of the obtained sample for measurement at 100 ° C was measured by a torsional shear method using a viscoelasticity measuring apparatus (manufactured by Anton-Paar MCR Japan). The heating rate was 5 ° C / min, and the measurement frequency was 1 Hz. Using the coating adhesive liquids of Examples 2 to 5 and Comparative Examples 1 to 3, the storage elastic modulus (Pa) at 100 ° C of the obtained measurement sample was measured in the same manner as above. [Adhesive strength] The adhesive surface of the adhesive sheet produced in Example 1 was attached to the adherend (polyimine film) by applying a load of 2 kgf. As the polyimide film, a Kapton 100H (product name) having a thickness of 25 μm manufactured by Toray DuPont Co., Ltd. was used. The adhesive sheet with the polyimide film was stored in an environment of 50% relative humidity at 25 ° C for 0.5 hours, and then a thermostat (PEH-202, manufactured by ESPEC Co., Ltd.) was used at 190 ° C for 1 hour. After heating down, the adhesive sheet with the polyimide film was stored in an environment of 25 ° C and 50% relative humidity for 1 hour. Then, the adhesion of the adhesive sheet was measured by a 180° tearing method in an environment of 50% relative humidity at 25 °C. In addition, as the measuring machine, a measuring machine (manufactured by A&D Co., Ltd., TENSILON) equipped with a thermostatic chamber was used, and the stretching speed was 300 mm/min, and the width of the adhesive sheet was 25 mm. In the adhesive sheets produced in Examples 2 to 5 and Comparative Examples 1 to 3, the adhesive force of the adhesive sheet was measured in the same manner as described above. [Resin-Resistant Leakage] On the adhesive surface of the adhesive sheet produced in Example 1, a mirror-processed tantalum wafer (2.3 mm ́1.7) was placed in an array of 80 rows and 100 columns so that the mirror-finished surface was attached thereto. Mm ́0.2mm thickness) 8000 pieces. At this time, the direction parallel to the side of the length of the wafer of 2.3 mm is made to coincide with the column direction of the arrangement of the wafers. Further, the distance between adjacent wafers is such that the distance between the centers of the rectangular shapes of the wafer is 5 mm. The wafer on the adhesive sheet was sealed with an interlayer insulating resin (ABF of Ajinomoto Precision Chemical Co., Ltd.; T-15B) using a vacuum heating and pressure laminator (manufactured by ROHM and HAAS; 7024HP5). The sealing condition is that the preheating temperature of the platform of the vacuum heating and pressure laminator and the separator are both set to 100 ° C, vacuuming for 60 seconds, dynamic press mode for 30 seconds, static pressing (Static Press) mode. Sealed under 10 seconds. Then, the state of the interface between the wafer and the adhesive sheet is confirmed by a digital microscope through the adhesive sheet. If the interlayer insulating resin invades 10 μm or more from the end portion of the wafer between the wafer and the adhesive sheet, the resin is leaked and will not be reached. In the case of 10 μm, there is no resin leakage. In the adhesive sheets produced in Examples 2 to 5 and Comparative Examples 1 to 3, the resin leakage resistance was evaluated in the same manner as described above. [Surface Free Energy and Contact Angle] The surface free energy of the adhesive layer was measured by the method shown below. Specifically, first, a contact angle measuring device ("DM701" manufactured by Kyowa Interface Chemical Co., Ltd.) was used to measure the contact angle of water, diiodomethane, and 1-bromonaphthalate with respect to the adhesive layer produced in Example 1. The amount of each droplet was set to 2 μL. Then, from these measured values, the surface free energy was calculated by the Kitasaki-畑 method. With respect to the adhesive layers produced in Examples 2 to 5 and Comparative Examples 1 to 3, the contact angle was measured in the same manner as described above, and the surface free energy was calculated from the measured values. [Filling evaluation] On the adhesive surface of the adhesive sheet produced in Example 1, the semiconductor wafer was placed in an array of 80 rows and 100 columns so that the adhesive surface of the adhesive sheet was in contact with the circuit surface of the semiconductor wafer. Mirror wafer after wafer processing, wafer size: 2.3mm ́1.7mm, wafer thickness: 0.2mm, height dimension of step difference between step and circuit surface x: 1μm, width dimension of step portion y: 30μm (limited by shares) The company's ULVAC system, Dektak 150 measured)) 8,000. At this time, the direction parallel to the side of the length of the wafer of 2.3 mm is made to coincide with the column direction of the arrangement of the wafers. Further, the distance between adjacent wafers is such that the distance between the centers of the rectangular shapes of the wafer is 5 mm. Then, using a sealing resin (ABF film manufactured by Ajinomoto Precision Technology Co., Ltd., GX LE-T15B), a vacuum heating and laminating machine ("7024HP5" manufactured by ROHM and HAAS) was used to bond the semiconductor on the sheet. The wafer is sealed (sealing step). The sealing conditions are as follows.・Preheating temperature: 100°C for the platform and diaphragm ・Vacuum vacuum: 60 seconds ・Dynamic pressurization mode: 30 seconds ・Static pressurization mode: 10 seconds Then, observe the semiconductor wafer on the adhesive sheet after the sealing step with a microscope (each It is confirmed whether or not the sealing resin is buried in the gap between the step portion of the semiconductor wafer and the adhesive layer. The case where the sealing resin was buried in the gap was judged as "A", and the case where the sealing resin was not buried in the gap or the gap was formed in the gap was judged as "B". The adhesiveness of the adhesive sheets produced in Examples 2 to 5 and Comparative Examples 1 to 3 was evaluated in the same manner as described above. [Production of Adhesive Sheet] (Example 1) (1) Preparation of Adhesive Composition The following materials (polymer, adhesion aid, crosslinking agent, and diluent solvent) were blended, and the mixture was thoroughly stirred to prepare the coating of Example 1. The adhesive solution for the cloth (adhesive composition). - Polymer: acrylate copolymer, 40 parts by mass (solid content) Acrylate copolymer-based copolymerization of 2-ethylhexyl acrylate 92.8% by mass, 2-hydroxyethyl acrylate 7.0% by mass, and acrylic acid 0.2% by mass . The resulting polymer had a weight average molecular weight of 850,000.・Adhesive additive: Hydroxylated polybutadiene at both ends [made by Nippon Soda Co., Ltd.; GI-1000], 5 parts by mass (solid content) ・ Crosslinking agent: aliphatic isocyanate having hexamethylene diisocyanate (Iso-polycyanate type modified substance of hexamethylene diisocyanate) [manufactured by Japan Polyurethane Industrial Co., Ltd.; Coronate HX], 3.5 parts by mass (solid content) ・Dilution solvent: use A The solid content concentration of the ethyl ketone and the coating adhesive liquid was adjusted to 30% by mass. (2) Adhesive layer was produced by a release film of a 38 μm transparent polyethylene terephthalate film provided with a polyoxynitride-based release layer [LINTEC Co., Ltd.; SP-PET382150] On the other side, the coating adhesive liquid prepared by applying Comm Coater (registered trademark) was applied and heated at 90 ° C for 90 seconds, followed by heating at 115 ° C for 90 seconds to dry the coating film to prepare an adhesive layer. . The thickness of the adhesive layer was 50 μm. (3) Preparation of Adhesive Sheet After the coating film of the coating adhesive liquid was dried, the adhesive layer and the substrate were bonded to each other to obtain an adhesive sheet of Example 1. Further, as the substrate, a transparent polyethylene terephthalate film [manufactured by Teijin DuPont Film Co., Ltd.; PET 50KFL12D, thickness 50 μm, storage elastic modulus at 100 ° C 3.1 ́10 was used. ⁹ Pa), an adhesive layer is applied to one side of the substrate. (Example 2) (1) Preparation of Adhesive Composition In Example 2, a polyoxynitride-based adhesive was used. In Example 2, 18 parts by mass (solid content) of polyoxyxide-based adhesive A (SD4580PSA), 40 parts by mass (solid content) of polyoxyxide-based adhesive B (SD-4587L), and catalyst A ( NC-25CAT) 0.3 parts by mass (solid content), catalyst B (CAT-SRX-212) 0.65 parts by mass (solid content), and polyfluorene oxide dispersion (BY-24-712) 5 parts by mass (solid content) The toluene was used as a diluent solvent, and the solid content was diluted to 20% by mass, and the mixture was thoroughly stirred to prepare a coating adhesive liquid (adhesive composition) of Example 2. The materials used in the adhesive composition of Example 2 were all manufactured by Toray-Dow Corning Co., Ltd. (2) Adhesive sheet was produced on a polyimide film as a substrate [Dongli-DuPont Co., Ltd.; Kapton 100H, thickness 25 μm, storage elastic modulus at 100 ° C 3.1 ́10 ⁹ On one side of Pa], the coating adhesive liquid of Example 2 was applied by Comma Coater (registered trademark), and the coating film was dried by heating at 130 ° C for 2 minutes to prepare an adhesive layer, and Example 2 was obtained. Adhesive sheets. The thickness of the adhesive layer was 20 μm. (Example 3) An adhesive sheet was produced in the same manner as in Example 2 except that the thickness of the adhesive layer after drying was 30 μm. (Example 4) An adhesive sheet was produced in the same manner as in Example 2 except that the thickness of the adhesive layer after drying was 40 μm. (Example 5) An adhesive sheet was produced in the same manner as in Example 2 except that the thickness of the adhesive layer after drying was 50 μm. (Comparative Example 1) An adhesive sheet was produced in the same manner as in Example 2 except that the thickness of the adhesive layer after drying was 10 μm. (Comparative Example 2) An adhesive sheet was produced in the same manner as in Example 1 except that the polymer of Example 1 was changed to the following. The acrylate copolymer was prepared by copolymerizing 80.8% by mass of 2-ethylhexyl acrylate, 12% by mass of acryloylmorpholine, 7.0% by mass of 2-hydroxyethyl acrylate, and 0.2% by mass of acrylic acid. The resulting polymer had a weight average molecular weight of 760,000. (Comparative Example 3) An adhesive sheet was produced in the same manner as in Comparative Example 2 except that the thickness of the adhesive of Comparative Example 2 was changed to 20 μm. Table 1 shows the evaluation results of the adhesive sheets of Examples 1 to 5 and Comparative Examples 1 to 3. As shown in Table 1, the adhesive sheets of Examples 1 to 5 had a surface free energy of 10 mJ/m due to the adhesive layer. ² Above 22mJ/m ² Following, and by A ́B ² The calculated value is 1.5 ́10 ^-5 As described above, it was confirmed that the filling property was good and the resin leakage was prevented. On the other hand, the adhesive sheet of Comparative Example 1 was made by A ́B ² The calculated value is less than 1.5 ́10 ^-5 Therefore, it is judged that the resin cannot be prevented from leaking. Further, the adhesive sheets of Comparative Examples 2 to 3 had a surface free energy of more than 22 mJ/m due to the adhesive layer. ² Therefore, it is judged that the filling property of the semiconductor element on the adhesive sheet is poor.

10‧‧‧Adhesive sheets

11‧‧‧Substrate

11a‧‧‧First substrate surface

11b‧‧‧Second substrate surface

12‧‧‧Adhesive layer

21‧‧‧ openings

20‧‧‧Box components

30‧‧‧ Sealing resin

30A‧‧‧ sealing resin layer

50‧‧‧ Sealing body

40‧‧‧Reinforcing components

41‧‧‧ reinforcing plate

42‧‧‧Next layer

CP‧‧‧Semiconductor wafer

CPA‧‧‧ circuit surface

CPB‧‧‧Step Department

RL‧‧‧ peeling sheet

S‧‧‧ gap

Fig. 1 is a schematic cross-sectional view showing an adhesive sheet of the first embodiment. Fig. 2A is a view showing a part of a manufacturing process of a semiconductor device using the adhesive sheet of the first embodiment. Fig. 2B is a view showing a part of a manufacturing procedure of a semiconductor device using the adhesive sheet of the first embodiment. Fig. 2C is a view showing a part of a manufacturing procedure of a semiconductor device using the adhesive sheet of the first embodiment. Fig. 2D is a view showing a part of a manufacturing procedure of a semiconductor device using the adhesive sheet of the first embodiment. Fig. 2E is a view showing a part of a manufacturing procedure of a semiconductor device using the adhesive sheet of the first embodiment. Fig. 3 is a cross-sectional view showing the semiconductor element after the sealing step in the manufacturing process of the semiconductor device using the adhesive sheet of the first embodiment.

Claims (14)

An adhesive sheet which is used for sealing a semiconductor element on an adhesive sheet, the adhesive sheet comprising a substrate and an adhesive layer comprising an adhesive composition, the surface free energy of the adhesive layer being 10 mJ/m ² or more and 22 mJ/m ² or less, and the storage elastic modulus of the adhesive layer at 100 ° C is regarded as A (Pa), and when the thickness of the adhesive layer is regarded as B (m), the following relationship is obtained. (1) The calculated value is 1.5 ́10 ^-5 or more, A ́B ² (1). The adhesive sheet of claim 1, wherein the contact angle of the 1-bromonaphthalene to the adhesive layer is 65 or more. The adhesive sheet of claim 1, wherein the value calculated by the following relation (2) is 1.5 ^{́10 -10} or more, A ́B ³ (2). The adhesive sheet according to any one of claims 1 to 3, wherein the substrate has a storage elastic modulus at 100 ° C of 1 ́10 ⁷ Pa or more. The adhesive sheet of claim 1, wherein the adhesive layer is composed of an acrylic adhesive composition or a polyoxygen adhesive composition. The adhesive sheet according to claim 5, wherein the adhesive layer is composed of an acrylic adhesive composition, and the acrylic adhesive composition contains an acrylic copolymer. The adhesive sheet of claim 6, wherein the mass ratio of the copolymer component derived from the alkyl (meth)acrylate is 90% by mass or more, based on the total mass of the acrylic copolymer. The adhesive sheet of claim 7, wherein the alkyl group in the alkyl (meth)acrylate has a carbon number of 6 to 8. The adhesive sheet of claim 6, wherein the acrylic copolymer comprises an acrylic copolymer having 2 ethylhexyl (meth)acrylate as a main monomer. The adhesive sheet of claim 6, wherein the acrylic copolymer comprises a copolymer component derived from a monomer having a hydroxyl group. The adhesive sheet of the claim 10, wherein the mass ratio of the copolymer component derived from the monomer having a hydroxyl group is 3% by mass or more, based on the total mass of the acrylic copolymer. The adhesive sheet according to claim 6, wherein the acrylic copolymer is one which does not contain a copolymer component derived from a monomer having a carboxyl group or a copolymer component derived from a monomer having a carboxyl group, and accounts for the entire acrylic copolymer The mass ratio of the copolymer component derived from the monomer having a carboxyl group is 1% by mass or less. The adhesive sheet according to any one of claims 6 to 12, wherein the acrylic adhesive composition contains an adhesion aid comprising an oligomer having a hydrocarbon skeleton. The adhesive sheet according to claim 5, wherein the adhesive layer is composed of a polyoxynitride-based adhesive composition, and the polyoxygen-based adhesive composition comprises an addition polymerization type polyoxynoxy resin.