TW201837144A - Adhesive composition, sealing sheet and sealed body - Google Patents

Adhesive composition, sealing sheet and sealed body Download PDF

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TW201837144A
TW201837144A TW107110488A TW107110488A TW201837144A TW 201837144 A TW201837144 A TW 201837144A TW 107110488 A TW107110488 A TW 107110488A TW 107110488 A TW107110488 A TW 107110488A TW 201837144 A TW201837144 A TW 201837144A
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component
adhesive composition
sealing sheet
adhesive
mass
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TW107110488A
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前谷枝保
西嶋健太
樫尾幹広
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日商琳得科股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00Adhesives based on unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • C09J201/02Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to: an adhesive composition which contains a rubber-based resin (component (A)), a curable resin (component (C)) and an allophanate-based crosslinking agent (component (D)); a sealing sheet which comprises an adhesive layer that is formed using this adhesive composition; and a sealed body which is obtained by sealing an object to be sealed with use of this sealing sheet. The present invention provides: an adhesive composition which does not decrease in the adhesive force even under high humidity conditions; a sealing sheet which comprises an adhesive layer that is formed using this adhesive composition; and a sealed body which is obtained by sealing an object to be sealed with use of this sealing sheet.

Description

黏著劑組合物、密封片及密封體    Adhesive composition, sealing sheet and sealing body   

本發明係關於一種即使放置於高濕條件下黏著力仍不會降低的黏著劑組合物,具有使用此黏著劑組合物所形成的黏著劑層的密封片,及被密封物被上述密封片密封而成的密封體。 The present invention relates to an adhesive composition that does not decrease in adhesion even when placed under high humidity conditions, a sealing sheet having an adhesive layer formed using the adhesive composition, and an object to be sealed sealed by the sealing sheet. The sealed body.

近年,有機EL元件作為藉由低電壓直流驅動的可高輝度發光的發光元件而受到矚目。 In recent years, organic EL devices have attracted attention as light-emitting devices capable of emitting light with high luminance driven by a low-voltage DC.

但是,有機EL元件隨著時間經過,有發光亮度、發光效率、發光均勻性等發光特性易於降低的問題。 However, the organic EL element has a problem that light emission characteristics such as light emission brightness, light emission efficiency, and light emission uniformity tend to decrease with time.

作為此發光特性降低的問題的原因,可推測是氧氣或水分等浸入有機EL元件的內部,使電極或有機層劣化。因此,為了解決此問題,可提案將水分遮蔽性佳的黏著片作為密封材使用。 As a cause of the problem of the decrease in light emission characteristics, it is presumed that oxygen, moisture, or the like is immersed in the organic EL element to deteriorate the electrode or the organic layer. Therefore, in order to solve this problem, it is proposed to use an adhesive sheet having excellent moisture shielding properties as a sealing material.

此外,於製造液晶顯示面板(LCD)或觸控面板等顯示裝置時,可使用以貼合光學構件為目的的黏著片,但近年來,為了抑制光學構件的機械性劣化,故要求水分遮蔽性佳的黏著片。 In addition, when manufacturing a display device such as a liquid crystal display panel (LCD) or a touch panel, an adhesive sheet for bonding optical members can be used. However, in recent years, in order to suppress mechanical deterioration of optical members, moisture shielding properties have been required. Best adhesive sheet.

作為具有此類特性的黏著片,專利文獻1中記載以橡膠系樹脂作為主成分的黏著片,係具有特定的黏著特性等者。 As an adhesive sheet having such characteristics, Patent Document 1 describes an adhesive sheet containing a rubber-based resin as a main component, which has specific adhesive properties and the like.

此文獻中記載此黏著片係水蒸氣穿透度低的黏著片,即使遇到濕熱時(置於高濕度環境下時)仍具有充分的黏著力,且抑 制遇到濕熱時的黃變者,因為易於顯現此等特性,黏著片中除了橡膠系樹脂之外,以含有矽烷耦合劑者為佳等。 It is described in this document that this adhesive sheet is an adhesive sheet with low water vapor permeability. Even when it is exposed to moist heat (when placed in a high-humidity environment), it still has sufficient adhesion and inhibits yellowing when it encounters moist heat. Since these characteristics are easily exhibited, it is preferable that the adhesive sheet contains a silane coupling agent in addition to the rubber-based resin.

[先前技術文獻] [Prior technical literature]

[專利文獻] [Patent Literature]

專利文獻1:日本特開2016-53157號公報。 Patent Document 1: Japanese Patent Application Laid-Open No. 2016-53157.

如專利文獻1中所記載,由於使用橡膠系樹脂作為主成分的黏著劑組合物,有能夠獲得水分遮蔽性佳的黏著片的傾向。 As described in Patent Document 1, an adhesive composition using a rubber-based resin as a main component tends to be able to obtain an adhesive sheet having excellent moisture shielding properties.

然而,根據本發明者的研究,得知即使是以橡膠系樹脂作為主成分,且含有矽烷耦合劑的黏著劑組合物,置於高濕條件下後仍有黏著力降低者。然後,具有使用此種黏著劑組合物所形成的黏著劑層的密封片,置於高濕條件下時,易於發生膨泡或浮凸。 However, according to the research by the present inventors, it was found that even if an adhesive composition containing a rubber-based resin as a main component and containing a silane coupling agent still has a reduced adhesive force after being placed under high humidity conditions. Then, a sealing sheet having an adhesive layer formed using such an adhesive composition is prone to blistering or embossing when placed under high humidity conditions.

本發明係以解決此等問題為目的而完成者,其目的係提供一種即使放置於高濕條件下黏著力仍不會降低的黏著劑組合物,具有使用此黏著劑組合物所形成的黏著劑層的密封片,以及被密封物被上述密封片密封而成的密封體。 The present invention has been made with a view to solving these problems, and an object thereof is to provide an adhesive composition that does not decrease in adhesion even under high humidity conditions, and has an adhesive formed by using the adhesive composition. Layer sealing sheet, and a sealed body in which the object to be sealed is sealed with the sealing sheet.

且,本發明中,「黏著劑組合物的黏著力仍不會降低」意指使用此黏著劑組合物所形成的黏著劑層的黏著力不會降低。此外,同樣地,本說明書中,關於黏著劑層的特性有時記載為黏著劑組合物的特性。 In addition, in the present invention, "the adhesive force of the adhesive composition will not decrease" means that the adhesive force of the adhesive layer formed by using the adhesive composition will not decrease. In addition, similarly, the characteristics of the adhesive layer may be described in this specification as the characteristics of the adhesive composition.

本發明者等為了解決上述課題精心研究的結果, 發現含有橡膠系樹脂與特定添加劑的黏著劑組合物,係即使放置於高濕條件下黏著力仍不會降低者,遂完成本發明。 As a result of careful research in order to solve the above-mentioned problems, the inventors have found that the adhesive composition containing a rubber-based resin and a specific additive does not decrease the adhesive force even under a high humidity condition, and completed the present invention.

因此,根據本發明,係提供下述[1]~[12]的黏著劑組合物,[13]~[16]的密封片以及[17]、[18]的密封體。 Therefore, according to the present invention, the following adhesive compositions of [1] to [12], the sealing sheets of [13] to [16], and the sealing bodies of [17] and [18] are provided.

[1]一種黏著劑組合物,係含有:下述(A)成分,(C)成分以及(D)成分:(A)成分:橡膠系樹脂;(C)成分:硬化性樹脂;(D)成分:脲甲酸酯系交聯劑。 [1] An adhesive composition containing the following (A) component, (C) component, and (D) component: (A) component: rubber-based resin; (C) component: curable resin; (D) Ingredients: Uremate-based crosslinking agent.

[2]根據[1]所記載之黏著劑組合物,其中,上述(A)成分為丁基橡膠。 [2] The adhesive composition according to [1], wherein the component (A) is butyl rubber.

[3]根據[1]所記載之黏著劑組合物,其中,復含有下述(B)成分,(B)成分:增黏劑。 [3] The adhesive composition according to [1], further comprising the following component (B), (B) component: a tackifier.

[4]根據[3]所記載之黏著劑組合物,其中,上述(B)成分為脂肪族系石油樹脂。 [4] The adhesive composition according to [3], wherein the component (B) is an aliphatic petroleum resin.

[5]根據[3]所記載之黏著劑組合物,其中,上述(B)成分的含量相對於(A)成分100質量份,為1~50質量份。 [5] The adhesive composition according to [3], wherein the content of the component (B) is 1 to 50 parts by mass based on 100 parts by mass of the component (A).

[6]根據[1]所記載之黏著劑組合物,其中,上述(C)成分為於兩末端具有羥基的聚合物。 [6] The adhesive composition according to [1], wherein the component (C) is a polymer having hydroxyl groups at both ends.

[7]根據[1]所記載之黏著劑組合物,其中,上述(C)成分的含量,相對於(A)成分100質量份,為1~50質量份。 [7] The adhesive composition according to [1], wherein the content of the component (C) is 1 to 50 parts by mass based on 100 parts by mass of the component (A).

[8]根據[1]所記載之黏著劑組合物,其中,上述(D)成分為脲甲酸酯改質六亞甲基二異氰酸酯。 [8] The adhesive composition according to [1], wherein the component (D) is a urethane-modified hexamethylene diisocyanate.

[9]根據[1]所記載之黏著劑組合物,其中,上述(D)成分的 含量,相對於(A)成分100質量份,為1~70質量份。 [9] The adhesive composition according to [1], wherein the content of the component (D) is 1 to 70 parts by mass based on 100 parts by mass of the component (A).

[10]根據[1]所記載之黏著劑組合物,其中,復含有下述(E)成分,(E)成分:矽烷耦合劑。 [10] The adhesive composition according to [1], further comprising the following component (E), (E) component: a silane coupling agent.

[11]根據[10]所記載之黏著劑組合物,其中,上述(E)成分為下述式(1)所示的化合物, [11] The adhesive composition according to [10], wherein the component (E) is a compound represented by the following formula (1),

(R1表示碳數3以上的伸烷基,R2表示碳數1~10的1價的烴基,R3表示碳數1~4的烷基;Z表示含有反應性基的基,n為0或1)。 (R 1 represents an alkylene group having 3 or more carbon atoms, R 2 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms, R 3 represents an alkyl group having 1 to 4 carbon atoms, Z represents a group containing a reactive group, and n is 0 or 1).

[12]根據[10]所記載之黏著劑組合物,其中,上述(E)成分的含量相對於上述(A)成分100質量份,為0.01~7質量份。 [12] The adhesive composition according to [10], wherein the content of the component (E) is 0.01 to 7 parts by mass based on 100 parts by mass of the component (A).

[13]一種密封片,係由2片剝離膜以及挾持於此等剝離膜間的黏著劑層而成的密封片,上述黏著劑層為使用[1]~[12]任一項所記載之黏著劑組合物所形成者。 [13] A sealing sheet, which is a sealing sheet composed of two release films and an adhesive layer held between the release films, wherein the adhesive layer is as described in any one of [1] to [12]. Formed by an adhesive composition.

[14]一種密封片,係由剝離膜,阻氣性膜,以及挾持於上述剝離膜與阻氣性膜間的黏著劑層而成的密封片,上述黏著劑層為使用[1]~[12]任一項所記載之黏著劑組合物所形成者。 [14] A sealing sheet is a sealing sheet made of a release film, a gas barrier film, and an adhesive layer held between the release film and the gas barrier film, and the adhesive layer is used [1] ~ [ 12] Formed by the adhesive composition according to any one of the above.

[15]根據[14]所記載之密封片,其中,上述阻氣性膜為金屬箔,樹脂製膜或薄膜玻璃。 [15] The sealing sheet according to [14], wherein the gas barrier film is a metal foil, a resin film, or a thin-film glass.

[16]根據[13]或[14]所記載之密封片,其中,黏著劑層的厚度為1~50μm。 [16] The sealing sheet according to [13] or [14], wherein the thickness of the adhesive layer is 1 to 50 μm.

[17]一種密封體,被密封物係使用[13]或[14]任一項所記載之密封片密封而成者。 [17] A sealed body which is sealed by using the sealing sheet according to any one of [13] or [14].

[18]根據[17]所記載之密封體,其中,上述被密封物為有機EL元件,有機EL顯示面板元件,液晶顯示面板元件或太陽電池元件。 [18] The sealed body according to [17], wherein the object to be sealed is an organic EL element, an organic EL display panel element, a liquid crystal display panel element, or a solar cell element.

根據本發明,係提供一種即使放置於高濕條件下黏著力仍不會降低的黏著劑組合物,具有使用此黏著劑組合物所形成的黏著劑層的密封片,以及被密封物被上述密封片密封而成的密封體。 According to the present invention, there is provided an adhesive composition that does not decrease in adhesion even when placed under high humidity conditions, a sealing sheet having an adhesive layer formed using the adhesive composition, and the object to be sealed is sealed as described above. A sealed body formed by sheet sealing.

以下,本發明分成1)黏著劑組合物,2)密封片以及3)密封體各項詳細說明。 Hereinafter, the present invention is divided into 1) an adhesive composition, 2) a sealing sheet, and 3) a sealing body in detail.

1)黏著劑組合物 1) Adhesive composition

本發明的黏著劑組合物係含有:下述(A)成分,(C)成分以及(D)成分者:(A)成分:橡膠系樹脂;(C)成分:硬化性樹脂;(D)成分:脲甲酸酯系交聯劑。 The adhesive composition system of this invention contains the following (A) component, (C) component, and (D) component: (A) component: rubber-type resin; (C) component: curable resin; (D) component : Uremate-based crosslinking agent.

[(A)成分:橡膠系樹脂] [(A) Component: Rubber-based resin]

本發明的黏著劑組合物含有橡膠系樹脂作為(A)成分。 The adhesive composition of the present invention contains a rubber-based resin as the (A) component.

本發明的黏著劑組合物由於含有橡膠系樹脂,故成為水分 遮蔽性佳者。 Since the adhesive composition of the present invention contains a rubber-based resin, it is excellent in moisture shielding properties.

作為橡膠系樹脂,例如可列舉天然橡膠、於天然橡膠中與1種或2種以上選自(甲基)丙烯酸烷基酯、苯乙烯及(甲基)丙烯腈的單體使其接枝聚合的改質天然橡膠、聚異丁烯系樹脂、丁二烯橡膠、氯丁二烯橡膠、異戊二烯橡膠、苯乙烯-丁二烯共聚物(SBR)、苯乙烯-異戊二烯共聚物、丙烯腈-丁二烯的共聚物(腈橡膠)、甲基丙烯酸甲酯-丁二烯共聚物、脲烷橡膠、苯乙烯-1,3-丁二烯-苯乙烯嵌段共聚物(SBS)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)、乙烯-丙烯-非共軛二烯三聚物等。此等橡膠系樹脂可單獨1種或組合2種以上使用。此等當中,作為橡膠系樹脂,以含有聚異丁烯系樹脂者為佳。 Examples of the rubber-based resin include natural rubber, and one or two or more monomers selected from alkyl (meth) acrylate, styrene, and (meth) acrylonitrile are graft-polymerized in the natural rubber. Modified natural rubber, polyisobutylene resin, butadiene rubber, chloroprene rubber, isoprene rubber, styrene-butadiene copolymer (SBR), styrene-isoprene copolymer, Acrylonitrile-butadiene copolymer (nitrile rubber), methyl methacrylate-butadiene copolymer, urethane rubber, styrene-1,3-butadiene-styrene block copolymer (SBS) , Styrene-isoprene-styrene block copolymer (SIS), ethylene-propylene-non-conjugated diene terpolymer, and the like. These rubber-based resins can be used alone or in combination of two or more. Among these, a polyisobutylene-based resin is preferred as the rubber-based resin.

聚異丁烯系樹脂係指含有異丁烯作為單體成分的聚合物(包含共聚物的概念)者,可為單體成分僅為異丁烯而成的均聚物,亦可為作為單體成分的異丁烯與其他單體經聚合而得的共聚物。聚異丁烯系樹脂亦可為一部分經溴化或氯化的鹵化的聚異丁烯系樹脂,亦可為一部分經羥基、羧基等官能基取代者。 The polyisobutylene resin refers to a polymer (including the concept of a copolymer) containing isobutylene as a monomer component, and may be a homopolymer made of only isobutylene as a monomer component, or isobutene and other components as monomer components. A copolymer obtained by polymerizing monomers. The polyisobutylene-based resin may be a part of the brominated or chlorinated halogenated polyisobutylene-based resin, or may be partially substituted with a functional group such as a hydroxyl group or a carboxyl group.

作為上述其他單體,例如可列舉異戊二烯、正丁烯、丁二烯、苯乙烯等。其他單體可單獨或併用2種以上。且,若聚異丁烯系樹脂為共聚物的情況時,原料單體中,異丁烯係作為主成分的最大量單體。 Examples of the other monomer include isoprene, n-butene, butadiene, and styrene. Other monomers may be used alone or in combination of two or more. When the polyisobutylene-based resin is a copolymer, among the raw material monomers, the maximum amount of the isobutylene-based monomer is the main component.

上述當中,從水分遮蔽性佳的觀點來看,聚異丁烯系樹脂以單體成分僅為異丁烯而成的均聚物,作為單體成分的異丁烯與異戊二烯經聚合而得的異丁烯-異戊二烯共聚物(丁基橡膠)為佳。 Among the above, from the viewpoint of good moisture shielding property, the polyisobutylene resin is a homopolymer in which the monomer component is only isobutylene, and isobutylene-isoprene obtained by polymerizing isobutylene and isoprene as the monomer components. A pentadiene copolymer (butyl rubber) is preferred.

此等當中,從提升所形成的黏著劑層的耐久性及耐候性的觀點來看,以含有較多的聚合時具有緊密的分子構造,於主鏈及側鏈不殘留有聚合性雙鍵的異丁烯而成的構成單元者為佳。 Among these, from the standpoint of improving the durability and weather resistance of the formed adhesive layer, the polymer has a dense molecular structure when it contains a large amount of polymer, and polymerizable double bonds do not remain in the main chain and side chains. Isobutylene is preferred.

於主鏈及側鏈不殘留有聚合性雙鍵的異丁烯而成的構成單元的含量,相對於聚異丁烯系樹脂的全部構成單元,以80~99質量%為佳,較佳為90~99質量%,更佳為95~99質量%。 The content of the constituent units made of isobutene having no polymerizable double bond remaining in the main chain and the side chain is preferably 80 to 99% by mass, and more preferably 90 to 99% by mass relative to all the constituent units of the polyisobutylene resin. %, More preferably 95 to 99% by mass.

聚異丁烯系樹脂可藉由例如在氯化鋁、三氟化硼等路易士酸觸媒的存在下,將異丁烯等的單體成分進行聚合的方法等而獲得。 The polyisobutylene-based resin can be obtained, for example, by a method of polymerizing a monomer component such as isobutylene in the presence of a Lewis acid catalyst such as aluminum chloride or boron trifluoride.

橡膠系樹脂的質量平均分子量(Mw),以10,000~3,000,000為佳,較佳為20,000~1,000,000。 The mass average molecular weight (Mw) of the rubber-based resin is preferably 10,000 to 3,000,000, and more preferably 20,000 to 1,000,000.

本發明中,質量平均分子量(Mw)係進行凝膠滲透層析(GPC),可求得作為標準聚苯乙烯換算值。 In the present invention, the mass average molecular weight (Mw) is subjected to gel permeation chromatography (GPC), and can be obtained as a standard polystyrene conversion value.

[(C)成分:硬化性樹脂] [(C) component: curable resin]

本發明的黏著劑組合物含有硬化性樹脂作為(C)成分。 The adhesive composition of this invention contains a curable resin as (C) component.

本發明的黏著劑組合物由於含有硬化性樹脂,故成為即使放置於高濕條件下黏著力不易降低者。 Since the adhesive composition of the present invention contains a curable resin, the adhesive composition does not easily decrease in adhesion even under high humidity conditions.

硬化性樹脂係指具有2個以上可與(D)成分的脲甲酸酯系交聯劑反應的官能基的聚合物。作為相關的官能基,可列舉如羥基。 The curable resin refers to a polymer having two or more functional groups capable of reacting with the urethane-based crosslinking agent of the component (D). Examples of the related functional group include a hydroxyl group.

作為硬化性樹脂,可列舉如聚碳酸酯聚醇、聚醚聚醇、聚酯聚醇、聚內酯聚醇、聚二烯聚醇、氫化聚二烯聚醇、於兩末端具有羥基的多晶矽等於兩末端具有羥基的聚合物。 Examples of the curable resin include polycarbonate polyol, polyether polyol, polyester polyol, polylactone polyol, polydiene polyol, hydrogenated polydiene polyol, and polycrystalline silicon having hydroxyl groups at both ends. Equal to polymers with hydroxyl groups at both ends.

硬化性樹脂可單獨1種或組合2種以上使用。 The curable resin may be used alone or in combination of two or more.

此等當中,由於易於獲得即使放置於高濕條件下 黏著力不易降低的黏著劑組合物,以聚二烯聚醇或氫化聚二烯聚醇為佳。 Among these, a polydienepolyol or a hydrogenated polydienepolyol is preferred because it is easy to obtain an adhesive composition that is not easily reduced in adhesion even under high humidity conditions.

作為聚二烯聚醇,可列舉如聚丁二烯聚醇、聚異戊二烯聚醇等。 Examples of the polydiene polyol include polybutadiene polyol and polyisoprene polyol.

作為氫化聚二烯聚醇,可列舉如氫化聚丁二烯聚醇、氫化聚異戊二烯聚醇等。 Examples of the hydrogenated polydiene polyol include hydrogenated polybutadiene polyol and hydrogenated polyisoprene polyol.

作為聚二烯聚醇或氫化聚二烯聚醇,可使用市售物。 As the polydiene polyol or hydrogenated polydiene polyol, a commercially available product can be used.

作為相關的市售物,可列舉如日本曹達股份有限公司製的NISSO PB G-1000、G-2000、G-3000、出光興產股份有限公司製的Poly bd R-15HT,R-45HT、Cray Valley公司製的Krasol LBH2000、LBH-P2000、LBH3000、LBH-P3000(以上聚丁二烯聚醇)、日本曹達股份有限公司製的NISSO PB GI-1000、GI-2000、GI-3000、三菱化學股份有限公司製的POLYTAIL H、Cray Valley社製的Krasol HLBH-P2000、HLBH-P3000(以上氫化聚丁二烯聚醇)、出光興產股份有限公司製的Poly ip(聚異戊二烯聚醇)、出光興產股份有限公司製的EPOL(氫化聚異戊二烯聚醇)等。 Examples of related commercial products include Nisso PB G-1000, G-2000, G-3000, manufactured by Japan Soda Co., Ltd., Poly bd R-15HT, R-45HT, and Cray manufactured by Idemitsu Kosan Co., Ltd. Krasol LBH2000, LBH-P2000, LBH3000, LBH-P3000 (Polybutadiene Polyol) manufactured by Valley Corporation, NISSO PB GI-1000, GI-2000, GI-3000, Mitsubishi Chemical Corporation POLYTAIL H, Ltd., Krasol HLBH-P2000, HLBH-P3000 (Hydrogenated Polybutadiene Polyol) manufactured by Cray Valley, Poly ip (Polyisoprene Polyol) manufactured by Idemitsu Kosan Co., Ltd. , EPOL (hydrogenated polyisoprene polyol) manufactured by Idemitsu Kosan Co., Ltd. and the like.

硬化性樹脂的質量平均分子量(Mw),以1,000~5,000為佳,較佳為1,000~4,000。由於硬化性樹脂的質量平均分子量(Mw)於上述範圍內,可獲得黏著力更佳的黏著劑組合物。 The mass average molecular weight (Mw) of the curable resin is preferably 1,000 to 5,000, and more preferably 1,000 to 4,000. Since the mass average molecular weight (Mw) of the curable resin is within the above range, an adhesive composition having better adhesive force can be obtained.

硬化性樹脂的含量並無特別限定,但相對於(A)成分100質量份,通常為1~50質量份,以5~40質量份為佳。 The content of the curable resin is not particularly limited, but it is usually 1 to 50 parts by mass and preferably 5 to 40 parts by mass based on 100 parts by mass of the component (A).

由於硬化性樹脂的含量,相對於(A)成分100質量份,為1 質量份以上,可有效地形成黏著力更佳的黏著劑層,由於在50質量份以下,可避免黏著劑層的凝集力降低。 The content of the hardening resin is 1 part by mass or more with respect to 100 parts by mass of the component (A), which can effectively form an adhesive layer with better adhesion. Since the content is 50 parts by mass or less, aggregation of the adhesive layer can be avoided. Force is reduced.

[(D)成分:脲甲酸酯系交聯劑] [(D) component: Urea-based crosslinking agent]

本發明的黏著劑組合物含有脲甲酸酯系交聯劑作為(D)成分。 The adhesive composition of this invention contains a urethane type crosslinking agent as (D) component.

脲甲酸酯系交聯劑係可與(C)成分之間形成交聯構造者,使用含有此等成分的本發明的黏著劑組合物而獲得的黏著劑層係凝集力高,即使放置於高濕條件下黏著力不易降低者。 The urethane-based crosslinking agent can form a crosslinked structure with the component (C), and the adhesive layer system obtained by using the adhesive composition of the present invention containing these components has high cohesive force, Those who do not easily reduce adhesion under high humidity conditions.

脲甲酸酯系交聯劑為多元異氰酸酯的改質體,為含有脲甲酸酯鍵結者(以下,稱為「脲甲酸酯改質多元異氰酸酯」)。 The urethane-based cross-linking agent is a modified form of a polyisocyanate and contains a urethane bond (hereinafter, referred to as a "ureate-modified polyisocyanate").

脲甲酸酯改質多元異氰酸酯可藉由例如在脲甲酸酯化觸媒的存在下,將多元異氰酸酯化合物與單元醇化合物及/或多元醇化合物反應而獲得。 The urethane-modified polyisocyanate can be obtained, for example, by reacting a polyisocyanate compound with a monoalcohol compound and / or a polyhydric alcohol compound in the presence of a urethane-forming catalyst.

作為脲甲酸酯化觸媒,例如可由羧酸的金屬鹽等已知的觸媒當中適當選擇。 The urethanization catalyst can be appropriately selected from known catalysts such as a metal salt of a carboxylic acid.

多元異氰酸酯化合物係分子內具有至少2個異氰酸酯基的化合物。作為多元異氰酸酯化合物,可列舉如芳香族多元異氰酸酯、芳香脂肪族多元異氰酸酯、脂環族多元異氰酸酯、脂肪族多元異氰酸酯等。 Polyisocyanate compounds are compounds having at least two isocyanate groups in the molecule. Examples of the polyisocyanate compound include an aromatic polyisocyanate, an aromatic aliphatic polyisocyanate, an alicyclic polyisocyanate, and an aliphatic polyisocyanate.

作為芳香族多元異氰酸酯,可列舉如間伸苯基二異氰酸酯、對伸苯基二異氰酸酯、1,5-萘二異氰酸酯、4,4’-二甲苯二異氰酸酯(MDI)、2,4-或2,6-苯亞甲基二異氰酸酯(TDI)或此等的混合物、4,4’-甲苯胺二異氰酸酯、4,4’-二苯基醚二異氰酸酯等芳香族二異氰酸酯;三甲苯-4,4’,4”-三異氰酸酯、1,3,5-三異氰酸酯苯、2,4,6-三異氰酸酯甲苯等芳香族三異氰酸酯; 4,4’-二甲苯-2,2’,5,5’-四異氰酸酯等芳香族四異氰酸酯等。 Examples of the aromatic polyisocyanate include m-phenylene diisocyanate, p-phenylene diisocyanate, 1,5-naphthalene diisocyanate, 4,4'-xylene diisocyanate (MDI), 2, 4- or 2 Aromatic diisocyanates such as 1,6-benzylidene diisocyanate (TDI) or mixtures thereof, 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate; trimethylbenzene-4, Aromatic triisocyanates such as 4 ', 4 ”-triisocyanate, 1,3,5-triisocyanate benzene, 2,4,6-triisocyanate toluene; 4,4'-xylene-2,2', 5,5 Aromatic tetraisocyanate and the like such as' -tetraisocyanate.

作為芳香脂肪族多元異氰酸酯,可列舉如1,3-或1,4-亞二甲苯基二異氰酸酯(XDI)或此等的混合物、ω,ω’-二異氰酸酯-1,4-二乙基苯、1,3-或1,4-雙(1-異氰酸酯-1-甲基乙基)苯(TMXDI)或此等的混合物等芳香脂肪族二異氰酸酯;1,3,5-三異氰酸酯甲基苯等芳香脂肪族三異氰酸酯等。 Examples of the aromatic aliphatic polyisocyanate include 1,3- or 1,4-xylylene diisocyanate (XDI) or a mixture thereof, and ω, ω'-diisocyanate-1,4-diethylbenzene Aromatic aliphatic diisocyanates such as 1,3- or 1,4-bis (1-isocyanate-1-methylethyl) benzene (TMXDI) or mixtures thereof; 1,3,5-triisocyanate methylbenzene And other aromatic aliphatic triisocyanates.

作為脂環族多元異氰酸酯,可列舉如1,3-環戊烷二異氰酸酯、1,4-環己烷二異氰酸酯、1,3-環己烷二異氰酸酯、3-異氰酸酯基甲基-3,5,5-三甲基環己基異氰酸酯(IPDI)、4,4’-亞甲基雙(環己基異氰酸酯)(H12MDI)、甲基-2,4-環己烷二異氰酸酯、甲基-2,6-環己烷二異氰酸酯、1,3-或1,4-雙(異氰酸酯基甲基)環己烷(H6XDI)或此等的混合物等脂環族二異氰酸酯:1,3,5-三異氰酸酯環己烷、1,3,5-三甲基異氰酸酯環己烷、2-(3-異氰酸酯基丙基)-2,5-二(異氰酸酯基甲基)-雙環(2.2.1)庚烷、2-(3-異氰酸酯基丙基)-2,6-二(異氰酸酯基甲基)-雙環(2.2.1)庚烷、3-(3-異氰酸酯基丙基)-2,5-二(異氰酸酯基甲基)-雙環(2.2.1)庚烷、5-(2-異氰酸酯基乙基)-2-異氰酸酯基甲基-3-(3-異氰酸酯基丙基)-雙環(2.2.1)庚烷、6-(2-異氰酸酯基乙基)-2-異氰酸酯基甲基-3-(3-異氰酸酯基丙基)-雙環(2.2.1)庚烷、5-(2-異氰酸酯基乙基)-2-異氰酸酯基甲基-2-(3-異氰酸酯基丙基)-雙環(2.2.1)-庚烷、6-(2-異氰酸酯基乙基)-2-異氰酸酯基甲基-2-(3-異氰酸酯基丙基)-雙環(2.2.1)庚烷等脂環族三異氰酸酯等。 Examples of the alicyclic polyisocyanate include 1,3-cyclopentane diisocyanate, 1,4-cyclohexane diisocyanate, 1,3-cyclohexane diisocyanate, and 3-isocyanate methyl-3,5 , 5-trimethylcyclohexyl isocyanate (IPDI), 4,4'-methylenebis (cyclohexyl isocyanate) (H 12 MDI), methyl-2,4-cyclohexane diisocyanate, methyl-2 Cycloaliphatic diisocyanate, 1,6-cyclohexane diisocyanate, 1,3- or 1,4-bis (isocyanatomethyl) cyclohexane (H 6 XDI) or mixtures of these: 1,3,5 -Triisocyanate cyclohexane, 1,3,5-trimethyl isocyanate cyclohexane, 2- (3-isocyanatepropyl) -2,5-bis (isocyanatemethyl) -bicyclic (2.2.1) Heptane, 2- (3-isocyanatopropyl) -2,6-bis (isocyanatemethyl) -bicyclo (2.2.1) heptane, 3- (3-isocyanatepropyl) -2,5- Bis (isocyanatomethyl) -bicyclo (2.2.1) heptane, 5- (2-isocyanatoethyl) -2-isocyanatomethyl-3- (3-isocyanatopropyl) -bicyclo (2.2. 1) heptane, 6- (2-isocyanateethyl) -2-isocyanatemethyl-3- (3-isocyanatepropyl) -bicyclo (2.2.1) heptane, 5- (2-isocyanate group Ethyl) -2-isocyanate Ester methyl-2- (3-isocyanatepropyl) -bicyclo (2.2.1) -heptane, 6- (2-isocyanateethyl) -2-isocyanatemethyl-2- (3- Alicyclic triisocyanates such as isocyanatopropyl) -bicyclo (2.2.1) heptane and the like.

作為脂肪族多元異氰酸酯,可列舉如三亞甲基二異氰酸酯、四亞甲基二異氰酸酯、六亞甲基二異氰酸酯(HDI)、 五亞甲基二異氰酸酯、1,2-丙烯二異氰酸酯、1,2-丁烯二異氰酸酯、2,3-丁烯二異氰酸酯、1,3-丁烯二異氰酸酯、2,4,4-或2,2,4-三甲基六亞甲基二異氰酸酯、2,6-二異氰酸酯甲基己酸等脂肪族二異氰酸酯;離胺酸酯三異氰酸酯、1,4,8-三異氰酸酯辛烷、1,6,11-三異氰酸酯十一烷、1,8-二異氰酸酯-4-異氰酸酯基甲基辛烷、1,3,6-三異氰酸酯己烷、2,5,7-三甲基-1,8-二異氰酸酯-5-異氰酸酯基甲基辛烷等脂肪族三異氰酸酯等。 Examples of the aliphatic polyisocyanate include trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HDI), pentamethylene diisocyanate, 1,2-propylene diisocyanate, and 1,2 -Butene diisocyanate, 2,3-butene diisocyanate, 1,3-butene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, 2,6 -Aliphatic diisocyanates such as diisocyanate methylhexanoic acid; lysine triisocyanate, 1,4,8-triisocyanate octane, 1,6,11-triisocyanate undecane, 1,8-diisocyanate- Aliphatic triisocyanates such as 4-isocyanate methyloctane, 1,3,6-triisocyanate hexane, 2,5,7-trimethyl-1,8-diisocyanate-5-isocyanate methyloctane Wait.

此等當中,作為多元異氰酸酯化合物,以脂肪族多元異氰酸酯為佳,較佳為六亞甲基二異氰酸酯。 Among these, as the polyisocyanate compound, an aliphatic polyisocyanate is preferred, and hexamethylene diisocyanate is preferred.

多元異氰酸酯化合物可單獨1種或組合2種以上使用。 The polyisocyanate compound may be used singly or in combination of two or more kinds.

作為單元醇化合物,可列舉如甲醇、乙醇、丙醇、丁醇、戊醇、己醇、辛醇等脂肪族單元醇類;環戊醇、二甲基環己醇等脂環族單元醇類;苯甲醇等芳香脂肪族單元醇類;苯酚、甲酚等苯酚類等。 Examples of the unit alcohol compound include aliphatic unit alcohols such as methanol, ethanol, propanol, butanol, pentanol, hexanol, and octanol; and alicyclic unit alcohols such as cyclopentanol and dimethylcyclohexanol. ; Aromatic aliphatic unit alcohols such as benzyl alcohol; phenols such as phenol and cresol.

作為多元醇化合物,可列舉如乙二醇、丙二醇、1,4-丁二醇、1,3-丁二醇、1,2-丁二醇、1,6-己二醇、新戊二醇、二乙二醇、三乙二醇、二丙二醇、環己烷二甲醇、雙酚A、氫化雙酚A、1,4-二羥基-2-丁烯、2,6-二甲基-1-辛烯-3,8-二醇、雙羥乙氧基甲苯、二甲苯二醇、雙羥乙二醇對苯二甲酸酯等二元醇化合物;丙三醇、2-甲基-2-羥甲基-1,3-丙二醇、2,4-二羥基-3-羥甲基戊烷、1,2,6-己三醇、1,1,1-參(羥甲基)丙烷、2,2-雙(羥甲基)-3-丁醇等三元醇化合物;新戊四醇、D-山梨糖醇、木糖醇、D-甘露醇等具有4個以上羥基的多元醇等。 Examples of the polyol compound include ethylene glycol, propylene glycol, 1,4-butanediol, 1,3-butanediol, 1,2-butanediol, 1,6-hexanediol, and neopentyl glycol. , Diethylene glycol, triethylene glycol, dipropylene glycol, cyclohexanedimethanol, bisphenol A, hydrogenated bisphenol A, 1,4-dihydroxy-2-butene, 2,6-dimethyl-1 Diol compounds such as octene-3,8-diol, dihydroxyethoxytoluene, xylene glycol, dihydroxyethylene glycol terephthalate; glycerol, 2-methyl-2 -Hydroxymethyl-1,3-propanediol, 2,4-dihydroxy-3-hydroxymethylpentane, 1,2,6-hexanetriol, 1,1,1-ginsyl (hydroxymethyl) propane, Triol compounds such as 2,2-bis (hydroxymethyl) -3-butanol; neopentyl tetraol, D-sorbitol, xylitol, D-mannitol and other polyhydric alcohols having 4 or more hydroxyl groups, etc. .

脲甲酸酯系交聯劑的含量並無特別限定,但相對 於(A)成分100質量份,通常為1~70質量份,以5~60質量份為佳。 The content of the urethane-based crosslinking agent is not particularly limited, but it is usually 1 to 70 parts by mass and preferably 5 to 60 parts by mass based on 100 parts by mass of the component (A).

由於脲甲酸酯系交聯劑的含量,相對於(A)成分100質量份,為1質量份以上,可充分地形成交聯構造,由於為70質量份以下,可避免黏著劑層的凝集力的降低。 The content of the urethane-based cross-linking agent is 1 part by mass or more relative to 100 parts by mass of the component (A), and the crosslinked structure can be sufficiently formed. Since it is 70 parts by mass or less, the cohesive force of the adhesive layer can be avoided. The reduction.

本發明的黏著劑組合物除了上述(A)成分,(C)成分以及(D)成分之外,以含有作為(B)成分的增黏劑為佳。 The adhesive composition of the present invention preferably contains a thickener as the component (B) in addition to the components (A), (C), and (D).

本發明的黏著劑組合物由於含有增黏劑,故成為水分遮蔽性佳,且黏著力高者。 Since the adhesive composition of the present invention contains a tackifier, it has a good moisture shielding property and a high adhesive force.

作為增黏劑,只要可提升黏著劑層的黏著力則無特別限定,可使用習知者。作為增黏劑,可列舉如脂環族系石油樹脂、脂肪族系石油樹脂、萜烯樹脂、酯系樹脂、香豆酮-茚樹脂、松香系樹脂、環氧樹脂、苯酚樹脂、丙烯酸樹脂、縮丁醛樹脂、烯烴樹脂、氯化烯烴樹脂、乙酸乙烯酯樹脂以及此等的改質樹脂或經添加氫的樹脂等。 The tackifier is not particularly limited as long as the tackiness of the tackifier layer can be improved, and a known one can be used. Examples of the tackifier include alicyclic petroleum resins, aliphatic petroleum resins, terpene resins, ester resins, coumarone-indene resins, rosin resins, epoxy resins, phenol resins, acrylic resins, Butyral resin, olefin resin, chlorinated olefin resin, vinyl acetate resin, and these modified resins or hydrogen-added resins.

此等當中,由於水分遮蔽性更佳,且易於獲得黏著力高的黏著劑組合物,以脂肪族系石油樹脂為佳。 Among these, an aliphatic petroleum resin is preferred because it has better moisture shielding properties and is easy to obtain an adhesive composition with high adhesion.

增黏劑可單獨1種或是組合2種以上使用。 Tackifiers can be used alone or in combination of two or more.

作為增黏劑,可直接使用市售物。例如,作為市售物,可列舉ESCOREZ 1000系列(Exxon Chemical公司製)、Quintone A、B、R、CX系列(日本ZEON公司製)等脂肪族系石油樹脂;ARKONP、M系列(荒川化學公司製)、ESCOREZ系列(Exxon Chemical公司製)、EASTOTAC系列(Eastman Chemical公司製)、IMARV系列(出光興產公司製)等脂環族系 石油樹脂;YS RESIN P、A系列(安原油脂公司製)、Clearon P系列(YASUHARA CHEMICAL公司製)、Piccolyte A、C系列(Hercules公司製)等萜烯系樹脂;Foral系列(Hercules公司製)、PENSEL A系列、ESTER GUM、SUPER ESTER、PINECRYSTAL(荒川化學工業公司製)等酯系樹脂等。 As the thickener, a commercially available product can be used as it is. Examples of commercially available products include aliphatic petroleum resins such as ESCOREZ 1000 series (manufactured by Exxon Chemical), Quintone A, B, R, CX series (manufactured by ZEON, Japan); ARKONP, M series (manufactured by Arakawa Chemical Co., Ltd.) ), ESCOREZ series (manufactured by Exxon Chemical), EASTOTAC series (manufactured by Eastman Chemical), IMARV series (manufactured by Idemitsu Kosan Co., Ltd.) and other alicyclic petroleum resins; YS RESIN P, A series (manufactured by Anhara Oil & Fats Co., Ltd.), Teronene resins such as Clearon P series (manufactured by YASUHARA CHEMICAL), Piccolyte A, C series (manufactured by Hercules); Foral series (manufactured by Hercules), PENSEL A series, ESTER GUM, SUPER ESTER, and PINECHRYSTAL Manufactured) and other ester resins.

增黏劑的質量平均分子量(Mw)以100~10,000為佳,較佳為500~5,000。 The mass average molecular weight (Mw) of the thickener is preferably 100 to 10,000, and more preferably 500 to 5,000.

增黏劑的軟化點以50~160℃為佳,較佳為60~140℃,更佳為70~130℃。 The softening point of the thickener is preferably 50 to 160 ° C, more preferably 60 to 140 ° C, and even more preferably 70 to 130 ° C.

增黏劑的含量並無特別限定,但相對於(A)成分100質量份,通常為1~50質量份,以5~45質量份為佳。 The content of the thickener is not particularly limited, but it is usually 1 to 50 parts by mass and preferably 5 to 45 parts by mass with respect to 100 parts by mass of the component (A).

由於增黏劑的含量相對於(A)成分100質量份,為1質量份以上,可有效率地形成黏著力更佳的黏著劑層,由於為50質量份以下,可避免黏著劑層的凝集力的降低。 Since the content of the tackifier is 1 part by mass or more relative to 100 parts by mass of the component (A), an adhesive layer with better adhesion can be efficiently formed, and since the content is 50 parts by mass or less, aggregation of the adhesive layer can be avoided Reduced force.

[其他成分] [Other ingredients]

本發明的黏著劑組合物除了上述(A)、(C)成分,(D)成分,以及必要時添加的(B)成分之外,以含有作為(E)成分的矽烷耦合劑者為佳。 In addition to the components (A) and (C), the component (D), and the component (B) added as necessary, the adhesive composition of the present invention preferably contains a silane coupling agent as the component (E).

本發明的黏著劑組合物由於含有矽烷耦合劑,在常溫及高溫高濕環境下有黏著力更加提升的傾向。 Since the adhesive composition of the present invention contains a silane coupling agent, the adhesive force tends to be further improved under normal temperature, high temperature and high humidity environments.

作為矽烷耦合劑,可使用習知的矽烷耦合劑,並無特別限定,當中,以下述式(1)所示的矽烷化合物為佳。 As the silane coupling agent, a conventional silane coupling agent can be used and is not particularly limited. Among them, a silane compound represented by the following formula (1) is preferred.

[化2] [Chemical 2]

式(1)中,R1表示碳數3以上的伸烷基,R2表示碳數1~10的1價烴基,R3表示碳數1~4的烷基。Z表示含有反應性基的基,n為0或1。 In formula (1), R 1 represents an alkylene group having 3 or more carbon atoms, R 2 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms, and R 3 represents an alkyl group having 1 to 4 carbon atoms. Z represents a group containing a reactive group, and n is 0 or 1.

R1表示的伸烷基的碳數為3以上,以3~20為佳,較佳為4~15。 The carbon number of the alkylene group represented by R 1 is 3 or more, preferably 3 to 20, and more preferably 4 to 15.

由於伸烷基的碳數為3以上,變得易於引發交聯反應。 Since the number of carbons of the alkylene group is 3 or more, it becomes easy to initiate a crosslinking reaction.

作為R1表示的伸烷基,可列舉如三亞甲基、伸丙基、四亞甲基、五亞甲基、六亞甲基、七亞甲基、八亞甲基、九亞甲基、十亞甲基等。 Examples of the alkylene group represented by R 1 include trimethylene, propylene, tetramethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, nonamethylene, and the like. Decamethylene and so on.

R2表示的1價的烴基的碳數為1~10,以1~6為佳,較佳為1~4。 The carbon number of the monovalent hydrocarbon group represented by R 2 is 1 to 10, preferably 1 to 6, and more preferably 1 to 4.

作為R2表示的1價烴基,可列舉如甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基等烷基;乙烯基、1-丙烯基、2-丙烯基、異丙烯基、3-丁烯基、4-戊烯基、5-己烯基等烯基;乙炔基、丙炔基、丁炔基等炔基;苯基、1-萘基、2-萘基等芳香基等。 Examples of the monovalent hydrocarbon group represented by R 2 include methyl, ethyl, n-propyl, isopropyl, n-butyl, second butyl, isobutyl, third butyl, n-pentyl, and n-hexyl. , N-heptyl, n-octyl, n-nonyl, n-decyl and other alkyl groups; vinyl, 1-propenyl, 2-propenyl, isopropenyl, 3-butenyl, 4-pentenyl, 5 -Alkenyl such as hexenyl; alkynyl such as ethynyl, propynyl, butynyl; aromatic groups such as phenyl, 1-naphthyl, 2-naphthyl, and the like.

R3表示的烷基的碳數為1~4,以1~3為佳,較佳為1或2。 The carbon number of the alkyl group represented by R 3 is 1 to 4, preferably 1 to 3, and more preferably 1 or 2.

作為R3表示的烷基,可列舉如甲基、乙基、正丙基、異丙基、正丁基、第二丁基、異丁基、第三丁基。 Examples of the alkyl group represented by R 3 include methyl, ethyl, n-propyl, isopropyl, n-butyl, second butyl, isobutyl, and third butyl.

Z中所包含的反應性基只要是可賦予交聯反應的基則無特別限定。 The reactive group contained in Z is not particularly limited as long as it is a group capable of imparting a crosslinking reaction.

作為反應性基,以環氧基或胺基為佳。 The reactive group is preferably an epoxy group or an amine group.

作為含有環氧基的Z,可列舉如環氧基、環氧丙基、環氧基環己基等。 Examples of the epoxy group-containing Z include an epoxy group, an epoxy group, and an epoxy cyclohexyl group.

作為含有胺基的Z,可列舉如胺基、2-胺乙基胺基、苯基胺基等。 Examples of the amine group-containing Z include an amine group, a 2-aminoethylamino group, and a phenylamino group.

作為式(1)所示的矽烷耦合劑,可列舉如3-環氧丙基丙基甲基二甲氧基矽烷、3-環氧丙基丙基三甲氧基矽烷、3-環氧丙基丙基甲基二乙氧基矽烷、3-環氧丙基丙基三乙氧基矽烷、8-環氧丙基辛基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-胺丙基三甲氧基矽烷、3-胺丙基三乙氧基矽烷、3-(2-胺乙基胺基)丙基甲基二甲氧基矽烷、3-(2-胺乙基胺基)丙基三甲氧基矽烷、3-(苯基胺基)丙基三甲氧基矽烷、8-(胺乙基胺基)辛基三甲氧基矽烷等。 Examples of the silane coupling agent represented by formula (1) include 3-glycidylpropylmethyldimethoxysilane, 3-glycidylpropyltrimethoxysilane, and 3-glycidyl Propylmethyldiethoxysilane, 3-glycidylpropyltriethoxysilane, 8-glycidyloctyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) Ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethylamino) propylmethyldimethoxysilane, 3 -(2-aminoethylamino) propyltrimethoxysilane, 3- (phenylamino) propyltrimethoxysilane, 8- (aminoethylamino) octyltrimethoxysilane, and the like.

矽烷耦合劑可單獨1種或組合2種以上使用。 Silane coupling agents can be used alone or in combination of two or more.

本發明的黏著劑組合物含有矽烷耦合劑時,矽烷耦合劑的含量相對於上述(A)成分100質量份,以0.01~7質量份為佳,較佳為0.1~5質量份。 When the adhesive composition of the present invention contains a silane coupling agent, the content of the silane coupling agent is preferably 0.01 to 7 parts by mass, and more preferably 0.1 to 5 parts by mass, relative to 100 parts by mass of the component (A).

矽烷耦合劑的含量於此範圍內的黏著劑組合物即使於高溫時,仍具有優良的黏著力的傾向。 Adhesive compositions having a silane coupling agent content within this range tend to have excellent adhesion even at high temperatures.

作為本發明的黏著劑組合物中所包含的(A)~(D)成分或矽烷耦合劑以外的成分,可列舉如溶媒、各種添加劑。 Examples of the components (A) to (D) and components other than the silane coupling agent included in the adhesive composition of the present invention include solvents and various additives.

作為溶媒,可列舉如苯、甲苯等芳香族烴系溶媒; 乙酸乙酯、乙酸丁酯等酯系溶媒;丙酮、丁酮、甲基異丙基酮等酮系溶媒;正戊烷、正己烷、正庚烷等脂肪族烴系溶媒;環戊烷、環己烷、甲基環己烷等脂環式烴系溶媒等。 Examples of the solvent include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isopropyl ketone; n-pentane and n-hexane , N-heptane and other aliphatic hydrocarbon solvents; cyclopentane, cyclohexane, methyl cyclohexane and other alicyclic hydrocarbon solvents.

此等溶媒可單獨1種或是組合2種以上使用。 These solvents can be used alone or in combination of two or more.

溶媒的使用量可考量塗層性等而適當決定。 The amount of the solvent to be used may be appropriately determined in consideration of coating properties and the like.

作為添加劑,可列舉如紫外線吸收劑、抗靜電劑、光穩定劑、抗氧化劑、樹脂穩定劑、填充劑、顏料、增量劑、軟化劑等添加劑。 Examples of the additives include additives such as ultraviolet absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, and softeners.

此等可單獨1種或是組合2種以上使用。 These can be used alone or in combination of two or more.

本發明的黏著劑組合物含有此等添加劑時,其含量可配合目的適當決定。 When the adhesive composition of the present invention contains such additives, its content can be appropriately determined depending on the purpose.

本發明的黏著劑組合物可將預定的成分根據常用方法適當混合、攪拌而調製。 The adhesive composition of the present invention can be prepared by appropriately mixing and stirring predetermined components according to a commonly used method.

本發明的黏著劑組合物係黏著力佳者。特別是黏著後,即使放置於高濕條件下,具有不易發生黏著力降低的特徵。 The adhesive composition of the present invention is one having good adhesion. In particular, even after being placed under high humidity conditions, there is a feature that it is difficult to reduce the adhesion force.

例如,針對使用本發明的黏著劑組合物所得的測試片進行180°剝離測試時,經由下述式所計算出的x值,以1.0以上為佳。 For example, when a 180 ° peel test is performed on a test piece obtained using the adhesive composition of the present invention, the x value calculated by the following formula is preferably 1.0 or more.

[式1]x=B/A [Formula 1] x = B / A

式中,A表示在溫度23℃,相對濕度50%條件下進行180°剝離測試所得的黏著力,B表示測試片於溫度60℃,相對濕度90%條件下靜置168小時,接著,於溫度23℃,相對濕度50%條件下靜置24小時後,於溫度23℃,相對濕度50%條件下進行180°剝離測試所得的黏著力。 In the formula, A represents the adhesive force obtained by carrying out a 180 ° peel test at a temperature of 23 ° C and a relative humidity of 50%, and B represents a test piece that is left to stand at a temperature of 60 ° C and a relative humidity of 90% for 168 hours, and then at After standing at 23 ° C and 50% relative humidity for 24 hours, the adhesive force obtained by performing a 180 ° peel test at 23 ° C and 50% relative humidity.

A值並無特別限定,但通常為2~25N/25mm,以2~20N/25mm為佳。 The A value is not particularly limited, but is usually 2 to 25 N / 25 mm, and preferably 2 to 20 N / 25 mm.

B值並無特別限定,但通常為5~35N/25mm,以5~30N/25mm為佳。 The B value is not particularly limited, but is usually 5 to 35 N / 25 mm, and preferably 5 to 30 N / 25 mm.

此等180°剝離測試的測試片可根據實施例所記載之方法調製。 These test pieces for the 180 ° peel test can be prepared according to the method described in the examples.

由於本發明的黏著劑組合物水分遮蔽性及黏著力佳,本發明的黏著劑組合物適合應用於形成密封材。 Since the adhesive composition of the present invention has good water-shielding properties and adhesion, the adhesive composition of the present invention is suitable for forming a sealing material.

2)密封片 2) sealing sheet

本發明的密封片為下述密封片(α)或密封片(β)。 The sealing sheet of the present invention is the following sealing sheet (α) or sealing sheet (β).

密封片(α):由2片剝離膜以及挾持於此等剝離膜間的黏著劑層而成的密封片,上述黏著劑層為使用本發明的黏著劑組合物所形成者。 Sealing sheet (α): a sealing sheet made of two release films and an adhesive layer held between the release films, the adhesive layer being formed using the adhesive composition of the present invention.

密封片(β):由剝離膜,阻氣性膜以及挾持於上述剝離膜與上述阻氣性膜間的黏著劑層而成的密封片,上述黏著劑層為使用本發明的黏著劑組合物所形成者。 Sealing sheet (β): a sealing sheet made of a release film, a gas barrier film, and an adhesive layer held between the release film and the gas barrier film, wherein the adhesive layer is the adhesive composition of the present invention Formed by.

且,此等密封片係顯示使用前的狀態者,使用本發明的密封片時,通常將剝離膜剝離除去。 In addition, when these sealing sheets show the state before use, when using the sealing sheet of this invention, a peeling film is peeled and removed normally.

構成密封片(α)的剝離膜係於密封片(α)的製造步驟中作為支撐體的機能,同時在使用密封片(α)為止期間作為黏著劑層的保護片的機能。 The release film constituting the sealing sheet (α) functions as a support in the manufacturing step of the sealing sheet (α) and functions as a protective sheet for the adhesive layer until the sealing sheet (α) is used.

作為剝離膜,可利用以往習知者,例如可列舉於剝離膜用的基材上,具有藉由剝離劑經剝離處理的剝離層者。 As a release film, a conventionally known person can be used, for example, the thing which has the release layer which performed the peeling process with the release agent on the base material for release films is mentioned.

作為剝離膜用的基材,可列舉如玻璃紙、塗覆紙、上質紙 等紙基材;於此等紙基材積層聚乙烯等熱可塑性樹脂的積層紙;聚對苯二甲酸乙二酯樹脂、聚對苯二甲酸丁二酯樹脂、聚萘二甲酸乙二酯樹脂、聚丙烯樹脂、聚乙烯樹脂等塑膠膜等。 Examples of the substrate for the release film include paper substrates such as cellophane, coated paper, and high-quality paper; laminates of these paper substrates with thermoplastic resins such as polyethylene; polyethylene terephthalate resins , Polybutylene terephthalate resin, polyethylene naphthalate resin, polypropylene resin, polyethylene resin and other plastic films.

作為剝離劑,可列舉如矽氧烷系樹脂、烯烴系樹脂、異戊二烯系樹脂、丁二烯系樹脂等橡膠系彈性體、長鏈烷基系樹脂、醇酸系樹脂、氟系樹脂等。 Examples of the release agent include rubber-based elastomers such as siloxane-based resins, olefin-based resins, isoprene-based resins, and butadiene-based resins, long-chain alkyl-based resins, alkyd-based resins, and fluorine-based resins. Wait.

密封片(α)中2片剝離膜可相同,亦可相異,但以2片剝離膜具有相異的剝離力者為佳。由於2片剝離膜的剝離力相異,密封片的使用時不易發生問題。換言之,由於2片剝離膜的剝離力相異,可更有效率地進行最初將剝離膜剝離的步驟。 The two peeling films in the sealing sheet (α) may be the same or different, but it is preferable that the two peeling films have different peeling forces. Since the peeling forces of the two peeling films are different, problems are unlikely to occur during the use of the sealing sheet. In other words, since the peeling forces of the two peeling films are different, the step of peeling the peeling film first can be performed more efficiently.

密封片(α)的黏著劑層的厚度並無特限定,但通常為1~50μm,以5~30μm為佳。 The thickness of the adhesive layer of the sealing sheet (α) is not particularly limited, but is usually 1 to 50 μm, and preferably 5 to 30 μm.

厚度為上述範圍內的黏著劑層適合作為密封材使用。 The adhesive layer having a thickness within the above range is suitable for use as a sealing material.

密封片(α)的製造方法並無特別限定。例如可使用澆鑄法,製造密封片(α)。 The method for producing the sealing sheet (α) is not particularly limited. The sealing sheet (α) can be produced, for example, by a casting method.

藉由澆鑄法製造密封片(α)時,使用習知的方法,本發明的黏著劑組合物塗層於剝離膜的剝離處理面,將所得的塗膜乾燥,製造附帶剝離膜的黏著劑層,接著,將再1片剝離膜重疊於黏著劑層上,可獲得密封片(α)。 When a sealing sheet (α) is produced by a casting method, the adhesive composition of the present invention is coated on the release-treated surface of a release film using a conventional method, and the resulting coating film is dried to produce an adhesive layer with a release film. Next, another sheet of release film is laminated on the adhesive layer to obtain a sealing sheet (α).

作為塗層黏著劑組合物的方法,例如可列舉旋轉塗佈法、噴灑塗佈法、棒塗佈法、刀塗佈法、輥塗佈法、刮刀塗佈法、模具塗佈法、凹版塗佈法等。 Examples of the method of the coating adhesive composition include a spin coating method, a spray coating method, a bar coating method, a knife coating method, a roll coating method, a doctor blade coating method, a die coating method, and a gravure coating method. Buffa and so on.

作為將塗膜乾燥時的乾燥條件,例如可列舉於80~150℃,30秒~5分鐘。 Examples of the drying conditions when the coating film is dried include 80 to 150 ° C. for 30 seconds to 5 minutes.

進行乾燥處理後,可原封不動地靜置1週左右,使黏著劑層熟成。藉由使黏著劑層熟成,可充分地形成交聯構造。 After the drying process, it can be left as it is for about 1 week to mature the adhesive layer. By maturing the adhesive layer, the cross-linked structure can be sufficiently formed.

構成密封片(β)的剝離膜與黏著劑層分別可列舉如與作為構成密封片(α)的剝離膜與黏著劑層所示相同者。 Examples of the release film and the adhesive layer constituting the sealing sheet (β) are the same as those shown as the release film and the adhesive layer constituting the sealing sheet (α), respectively.

構成密封片(β)的阻氣性膜只要具有水分遮蔽性的膜則無特別限定。 The gas barrier film constituting the sealing sheet (β) is not particularly limited as long as it has a moisture-shielding film.

作為阻氣性膜,可列舉如於基材層上,直接或隔著底塗層等其他層,具有阻氣層者。 Examples of the gas barrier film include those having a gas barrier layer directly or through another layer such as an undercoat layer on the base material layer.

[基材層] [Substrate layer]

構成本發明的阻氣性積層體的基材層只要是透明性佳,且可支持阻氣層等者即可並無特別限制。 The base material layer constituting the gas barrier laminate of the present invention is not particularly limited as long as it is excellent in transparency and can support the gas barrier layer and the like.

作為基材層,通常可使用樹脂膜。 As the base material layer, a resin film can be generally used.

作為樹脂膜的樹脂成分,可列舉如聚醯亞胺、聚醯胺、聚醯胺醯亞胺、聚苯醚、聚醚酮、聚醚醚酮、聚烯烴、聚酯、聚碳酸酯、聚碸、聚醚碸、聚苯硫醚、丙烯酸系樹脂、環烯烴系聚合物、芳香族系聚合物等。 Examples of the resin component of the resin film include polyimide, polyimide, polyimide, polyphenylene ether, polyetherketone, polyetheretherketone, polyolefin, polyester, polycarbonate, and polyimide. Rhenium, polyethersulfonium, polyphenylene sulfide, acrylic resin, cycloolefin polymer, aromatic polymer, etc.

上述樹脂膜在不妨礙本發明效果的範圍內,亦可含有各種添加劑。作為添加劑,可列舉如紫外線吸收劑、抗靜電劑、穩定劑、抗氧化劑、塑化劑、潤滑劑、著色顏料等。此等添加劑的含量可配合目的適當決定即可。 The said resin film may contain various additives in the range which does not inhibit the effect of this invention. Examples of the additive include an ultraviolet absorber, an antistatic agent, a stabilizer, an antioxidant, a plasticizer, a lubricant, and a coloring pigment. The content of these additives may be appropriately determined depending on the purpose.

樹脂膜可藉由調製含有樹脂成分及依需要的各種添加劑的樹脂組合物,將此等成形為膜狀而獲得。成形方法並無特別限定,可利用澆鑄法或熔融擠出法等習知方法。 The resin film can be obtained by preparing a resin composition containing a resin component and various additives as needed, and molding these into a film shape. The molding method is not particularly limited, and a known method such as a casting method or a melt extrusion method can be used.

基材層的厚度並無特別限定,配合阻氣性積層體 的目的決定即可。基材層的厚度通常為0.5~500μm,以1~100μm為佳。 The thickness of the substrate layer is not particularly limited, and it may be determined in accordance with the purpose of the gas barrier laminate. The thickness of the substrate layer is usually 0.5 to 500 μm, and preferably 1 to 100 μm.

構成阻氣性膜的阻氣層係具有抑制氧氣或水蒸氣等氣體穿透的特性(阻氣性)的層。此阻氣層係於上述基材層的一側面(A)上,直接或隔著其他層經積層而成者。 The gas barrier layer constituting the gas barrier film is a layer having a characteristic (gas barrier property) of suppressing the penetration of gas such as oxygen or water vapor. The gas barrier layer is formed on one side (A) of the above-mentioned base material layer, and is laminated directly or through other layers.

阻氣層的厚度通常為1~2000nm,以3~1000nm為佳,較佳為5~500nm。 The thickness of the gas barrier layer is usually 1 to 2000 nm, preferably 3 to 1000 nm, and more preferably 5 to 500 nm.

作為阻氣層,可列舉如金屬箔而成的阻氣層、薄膜玻璃而成的阻氣層、阻氣性樹脂而成的阻氣層、無機膜而成的阻氣層、高分子層的表面經改質而成的阻氣層[此時,阻氣層不僅意指經改質的區域而已,係指「包含經改質區域的層」]等。 Examples of the gas barrier layer include a gas barrier layer made of metal foil, a gas barrier layer made of thin film glass, a gas barrier layer made of a gas barrier resin, a gas barrier layer made of an inorganic film, and a polymer layer. A modified gas barrier layer on the surface [At this time, the gas barrier layer means not only the modified region but also the "layer containing the modified region"] and the like.

此等當中,從阻氣性、透明性、生產性等觀點來看,以無機膜而成的阻氣層、高分子層的表面經改質而成的阻氣層為佳。 Among these, from the viewpoints of gas barrier properties, transparency, productivity, etc., a gas barrier layer made of an inorganic film and a modified gas barrier layer on the surface thereof is preferred.

金屬箔係將金屬拉薄延伸者。作為金屬箔,可列舉如鋁、鎳、不銹鋼、鐵、銅、鈦等金屬箔。 The metal foil is a thin metal stretcher. Examples of the metal foil include metal foils such as aluminum, nickel, stainless steel, iron, copper, and titanium.

金屬箔可為單層,亦可為由同一材料而成的層或由相異材料而成的層予以積層的積層體。 The metal foil may be a single layer, or a layered body in which layers made of the same material or layers made of dissimilar materials are laminated.

作為薄膜玻璃的材質,可列舉如無鹼玻璃、硼矽酸玻璃、鋁矽酸鹽玻璃等多成分系氧化物玻璃等。 Examples of the material of the thin-film glass include multi-component oxide glasses such as alkali-free glass, borosilicate glass, and aluminosilicate glass.

作為阻氣性樹脂,可列舉如聚乙烯醇、或其部分皂化物、乙烯-乙烯醇共聚物、聚丙烯腈、聚氯乙烯、聚偏二氯乙烯、聚氯三氟乙烯等氧氣或水蒸氣等不易穿透的樹脂。 Examples of the gas barrier resin include oxygen or water vapor such as polyvinyl alcohol or a part of saponified product thereof, an ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl chloride, polyvinylidene chloride, and polyvinyl chloride trifluoroethylene. Wait for resin that is not easy to penetrate.

作為無機膜,可列舉如無機化合物或金屬的蒸鍍膜。 Examples of the inorganic film include a vapor-deposited film of an inorganic compound or a metal.

作為無機化合物的蒸鍍膜的原料,可列舉如氧化矽、氧化 鋁、氧化鎂、氧化鋅、氧化銦、氧化錫等無機氧化物;氮化矽、氮化鋁、氮化鈦等無機氮化物;無機碳化物;無機硫化物;氧化氮化矽等無機氧化氮化物;無機氧化碳化物;無機氮化碳化物;無機氧化氮化碳化物等。 Examples of raw materials for the vapor-deposited film of inorganic compounds include inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide, and tin oxide; inorganic nitrides such as silicon nitride, aluminum nitride, and titanium nitride; Inorganic carbides; inorganic sulfides; inorganic oxide nitrides such as silicon oxide nitride; inorganic oxide carbides; inorganic nitride carbides; inorganic oxide nitride carbides.

作為金屬的蒸鍍膜的原料,可列舉如鋁、鎂、鋅及錫等。 Examples of the raw material of the metal vapor-deposited film include aluminum, magnesium, zinc, and tin.

此等可單獨1種或是組合2種以上使用。 These can be used alone or in combination of two or more.

此等當中,從阻氣性的觀點來看,以無機氧化物、無機氮化物或金屬為原料的無機蒸鍍膜為佳,再者,從透明性的觀點來看,以無機氧化物或無機氮化物為原料的無機蒸鍍膜為佳。 Among these, an inorganic vapor-deposited film using an inorganic oxide, an inorganic nitride, or a metal as a raw material is preferable from the viewpoint of gas barrier properties, and an inorganic oxide or an inorganic nitrogen is preferable from the viewpoint of transparency. An inorganic vapor-deposited film as a raw material is preferred.

作為形成無機膜的方法,可列舉如真空蒸鍍法、濺鍍法、離子被覆法等PVD(物理性蒸鍍)法,或熱CVD(化學性蒸鍍)法、電漿CVD法、光CVD法等CVD法。 Examples of the method for forming the inorganic film include a PVD (physical vapor deposition) method such as a vacuum deposition method, a sputtering method, and an ion coating method; a thermal CVD (chemical vapor deposition) method; a plasma CVD method; and a photoCVD CVD method.

無機膜的厚度根據使用的無機化合物或金屬而異,但從阻氣性及操作性的觀點來看,以1~2000nm為佳,較佳為3~1000nm,更佳為5~500nm的範圍。 The thickness of the inorganic film varies depending on the inorganic compound or metal used, but from the viewpoint of gas barrier properties and operability, it is preferably from 1 to 2000 nm, more preferably from 3 to 1000 nm, and more preferably from 5 to 500 nm.

於高分子層的表面經改質而成的阻氣層,作為高分子層的形成中使用的高分子,可列舉如含有矽的高分子化合物。 The modified gas barrier layer on the surface of the polymer layer. Examples of the polymer used in the formation of the polymer layer include a polymer compound containing silicon.

作為含有矽的高分子化合物,可列舉如聚矽氮烷系化合物、聚碳矽烷系化合物、聚矽烷系化合物、聚有機矽氧烷系化合物、聚(二亞矽基亞苯基)系化合物、及聚(二亞矽基伸乙炔基)系化合物等,以聚矽氮烷系化合物為佳。 Examples of the silicon-containing polymer compound include a polysilazane-based compound, a polycarbosilane-based compound, a polysilane-based compound, a polyorganosiloxane compound, a poly (disilylidene) -based compound, and the like. And poly (disiladeneethynyl) -based compounds, etc., polysilazane-based compounds are preferred.

聚矽氮烷系化合物係具有於分子內包含-Si-N-鍵結(矽氮烷鍵結)的重複單元的化合物。具體而言,以具有式(1)表示的重複單元的化合物為佳。 The polysilazane-based compound is a compound having a repeating unit of -Si-N-bond (silazane bond) in the molecule. Specifically, a compound having a repeating unit represented by the formula (1) is preferred.

此外,使用的聚矽氮烷系化合物的數量平均分子量無特別限定,但以100~50,000為佳。 The number average molecular weight of the polysilazane-based compound used is not particularly limited, but it is preferably 100 to 50,000.

上述式(1)中,n表示任意的自然數。Rx、Ry、Rz分別獨立地表示氫原子、無取代或具有取代基的烷基、無取代或具有取代基的環烷基、無取代或具有取代基的烯基、無取代或具有取代基的芳香基或烷矽基等非水解性基。 In the formula (1), n represents an arbitrary natural number. Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, an unsubstituted or substituted group Non-hydrolyzable groups such as aromatic groups and alkylsilyl groups.

作為上述無取代或具有取代基的烷基的烷基,例如可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、正戊基、異戊基、新戊基、正己基、正庚基、正辛基等碳數1~10的烷基。 Examples of the unsubstituted or substituted alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, and the like. Alkyl groups having 1 to 10 carbon atoms such as n-pentyl, isopentyl, neopentyl, n-hexyl, n-heptyl, and n-octyl.

作為無取代或具有取代基的環烷基的環烷基,例如可列舉環丁基、環戊基、環己基、環庚基等碳數3~10的環烷基。 Examples of the cycloalkyl group having an unsubstituted or substituted cycloalkyl group include a cycloalkyl group having 3 to 10 carbon atoms such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.

作為無取代或具有取代基的烯基的烯基,例如可列舉乙烯基、1-丙烯基、2-丙烯基、1-丁烯基、2-丁烯基、3-丁烯基等碳數2~10的烯基。 Examples of the unsubstituted or substituted alkenyl alkenyl include carbon numbers such as vinyl, 1-propenyl, 2-propenyl, 1-butenyl, 2-butenyl, and 3-butenyl. 2 to 10 alkenyl.

作為上述烷基、環烷基及烯基的取代基,可列舉如氟原子、氯原子、溴原子、碘原子等鹵原子;羥基;巰基;環氧基;環氧丙基;(甲基)丙烯醯氧基;苯基、4-甲基苯基、4-氯苯基等無取代或具有取代基的芳香基等。 Examples of the substituent of the above-mentioned alkyl group, cycloalkyl group and alkenyl group include halogen atoms such as fluorine atom, chlorine atom, bromine atom, and iodine atom; hydroxyl group; mercapto group; epoxy group; epoxy propyl group; (methyl) Propylene fluorenyloxy; unsubstituted or substituted aromatic groups such as phenyl, 4-methylphenyl, and 4-chlorophenyl.

作為無取代或具有取代基的芳香基的芳香基,例如可列舉苯基、1-萘基、2-萘基等碳數6~15的芳香基。 Examples of the aromatic group having an unsubstituted or substituted aromatic group include an aromatic group having 6 to 15 carbon atoms such as a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.

作為上述芳香基的取代基,可列舉如氟原子、氯原子、溴原子、碘原子等鹵原子;甲基、乙基等碳數1~6的烷基;甲氧基、乙氧基等碳數1~6的烷氧基;硝基;氰基;羥基;巰基;環氧基;環氧丙基;(甲基)丙烯醯氧基;苯基、4-甲基苯基、4-氯苯基等無取代或具有取代基的芳香基等。 Examples of the substituent of the aromatic group include halogen atoms such as a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom; alkyl groups having 1 to 6 carbon atoms such as a methyl group and an ethyl group; and carbons such as a methoxy group and an ethoxy group. 1 to 6 alkoxy groups; nitro; cyano; hydroxyl; mercapto; epoxy; epoxypropyl; (meth) acryloxy; phenyl, 4-methylphenyl, 4-chloro Unsubstituted or substituted aromatic groups such as phenyl.

作為烷矽基,可列舉如三甲基矽烷基、三乙基矽烷基、三異丙基矽烷基、三第三丁基矽烷基、甲基二乙基矽烷基、二甲基矽烷基、二乙基矽烷基、甲基矽烷基、乙基矽烷基等。 Examples of the alkylsilyl group include trimethylsilyl group, triethylsilyl group, triisopropylsilyl group, tritertiary butylsilyl group, methyldiethylsilyl group, dimethylsilyl group, and diethylsilyl group. Ethylsilyl, methylsilyl, ethylsilyl, etc.

此等當中,作為Rx、Ry、Rz,以氫原子、碳數1~6的烷基或苯基為佳,特別佳為氫原子。 Among these, as the Rx, Ry, and Rz, a hydrogen atom, an alkyl group having 1 to 6 carbons or a phenyl group is preferred, and a hydrogen atom is particularly preferred.

作為具有上述式(1)表示的重複單元的聚矽氮烷系化合物,可以是Rx、Ry、Rz全部為氫原子的無機聚矽氮烷,Rx、Ry、Rz至少1個不是氫原子的有機聚矽氮烷的任一者。 The polysilazane-based compound having a repeating unit represented by the formula (1) may be an inorganic polysilazane in which all of Rx, Ry, and Rz are hydrogen atoms, and at least one of Rx, Ry, and Rz is not an organic hydrogen atom. Any of polysilazane.

此外,本發明中,作為聚矽氮烷系化合物,可使用聚矽氮烷改質物。作為聚矽氮烷改質物,例如可列舉日本特開昭62-195024號公報、日本特開平2-84437號公報、日本特開昭63-81122號公報、日本特開平1-138108號公報等、日本特開平2-175726號公報、日本特開平5-238827號公報、日本特開平5-238827號公報、日本特開平6-122852號公報、日本特開平6-306329號公報、日本特開平6-299118號公報、日本特開平9-31333號公報、日本特開平5-345826號公報、日本特開平4-63833號公報等中所記載者。 In the present invention, as the polysilazane-based compound, a polysilazane modified product can be used. Examples of the modified polysilazane include Japanese Patent Laid-Open No. 62-195024, Japanese Patent Laid-Open No. 2-84437, Japanese Patent Laid-Open No. 63-81122, Japanese Patent Laid-Open No. 1-138108, and the like, Japanese Patent Laid-Open No. 2-175726, Japanese Patent Laid-Open No. 5-238827, Japanese Patent Laid-Open No. 5-238827, Japanese Patent Laid-Open No. 6-122852, Japanese Patent Laid-Open No. 6-306329, Japanese Patent Laid-Open No. 6-306329 Those described in Japanese Patent Publication No. 299118, Japanese Patent Application Laid-Open No. 9-31333, Japanese Patent Application Laid-Open No. 5-345826, Japanese Patent Application Laid-Open No. 4-63833, and the like.

此等當中,作為聚矽氮烷系化合物,從易於取得性及可形成具有優良的阻氣性的離子注入層的觀點來看,以Rx、Ry、Rz全部為氫原子的全氫聚矽氮烷為佳。 Among these, as the polysilazane-based compound, from the viewpoint of easy availability and formation of an ion-implanted layer having excellent gas barrier properties, perhydropolysilicon nitrogen in which all of Rx, Ry, and Rz are hydrogen atoms Alkanes are preferred.

此外,作為聚矽氮烷系化合物,可直接使用玻璃質塗佈材等作為市售的市售物。 As the polysilazane-based compound, a glassy coating material or the like can be directly used as a commercially available product.

聚矽氮烷系化合物可單獨1種或是組合2種以上使用。 The polysilazane-based compound may be used singly or in combination of two or more kinds.

高分子層除了含有矽的高分子化合物之外,在不阻礙本發明目的範圍內亦可含有其他成分。作為其他成分,可列舉如硬化劑、抗氧化劑、光穩定劑、阻燃劑等。 In addition to the polymer compound containing silicon, the polymer layer may contain other components within a range not hindering the object of the present invention. Examples of the other components include a hardener, an antioxidant, a light stabilizer, and a flame retardant.

高分子層中的含有矽的高分子化合物的含量,從更可形成阻氣性佳的阻氣層來看,以50質量%以上為佳,較佳為70質量%以上。 The content of the silicon-containing polymer compound in the polymer layer is more preferably 50% by mass or more, and more preferably 70% by mass or more, in terms of forming a gas barrier layer having better gas barrier properties.

高分子層的厚度無特別限制,但通常為1~2000nm,以3~1000nm為佳,較佳為5~500nm的範圍。 The thickness of the polymer layer is not particularly limited, but it is usually 1 to 2000 nm, preferably 3 to 1000 nm, and more preferably 5 to 500 nm.

高分子層可藉由例如將含有矽的高分子化合物溶解或分散於有機溶劑的溶液,藉由習知塗佈方法,直接或隔著其他層塗佈於基材層上,使所得的塗膜乾燥而形成。 The polymer layer can be applied, for example, by dissolving or dispersing a polymer compound containing silicon in an organic solvent, by a conventional coating method, or directly or through another layer onto the substrate layer to make the resulting coating film. Formed on drying.

作為有機溶劑,可列舉如苯、甲苯等芳香族烴系溶媒;乙酸乙酯、乙酸丁酯等酯系溶媒;丙酮、丁酮、甲基異丙基酮等酮系溶媒;正戊烷、正己烷、正庚烷等脂肪族烴系溶媒;環戊烷、環己烷等脂環式烴系溶媒等。 Examples of the organic solvent include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isopropyl ketone; n-pentane and n-hexane Aliphatic hydrocarbon solvents such as alkane and n-heptane; alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane.

此等溶媒可單獨1種或是組合2種以上使用。 These solvents can be used alone or in combination of two or more.

作為塗佈方法,可列舉如棒塗佈法、旋轉塗佈法、浸漬法、輥塗佈法、凹版塗佈法、刀塗佈法、空氣刀塗佈法、輥刀 塗佈法、模具塗佈法、網版印刷法、噴霧塗佈法、凹版轉印法等。 Examples of the coating method include a bar coating method, a spin coating method, a dipping method, a roll coating method, a gravure coating method, a knife coating method, an air knife coating method, a roll knife coating method, and a die coating method. Cloth method, screen printing method, spray coating method, gravure transfer method, and the like.

作為塗膜的乾燥方法,可列舉如熱風乾燥、熱輥乾燥、紅外線照射等過去習知的乾燥方法。加熱溫度通常為80~150℃,加熱時間通常從數十秒鐘至數十分鐘。 Examples of the drying method of the coating film include conventionally known drying methods such as hot air drying, hot roll drying, and infrared irradiation. The heating temperature is usually 80 ~ 150 ° C, and the heating time is usually from tens of seconds to tens of minutes.

作為改質高分子層的表面的方法,可列舉如離子注入處理、電漿處理、紫外線照射處理、熱處理等。 Examples of the method for modifying the surface of the polymer layer include ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, and heat treatment.

離子注入處理如後述,係使被加速的離子注入高分子層中,改質高分子層的方法。 As described later, the ion implantation process is a method in which accelerated ions are implanted into the polymer layer to modify the polymer layer.

電漿處理係將高分子層曝曬於電漿中,將高分子層改質的方法。例如可依據日本特開2012-106421號公報所記載之方法,進行電漿處理。 Plasma treatment is a method of exposing a polymer layer to a plasma to modify the polymer layer. For example, plasma processing can be performed according to the method described in Japanese Patent Application Laid-Open No. 2012-106421.

紫外線照射處理係對高分子層照射紫外線,將高分子層改質的方法。例如可依據日本特開2013-226757號公報所記載之方法,進行紫外線改質處理。 The ultraviolet irradiation treatment is a method of irradiating ultraviolet rays to a polymer layer to modify the polymer layer. For example, UV-modification treatment can be performed according to the method described in Japanese Patent Application Laid-Open No. 2013-226757.

作為注入至高分子層的離子,可列舉如氬、氦、氖、氪、氙等稀有氣體的離子;氟碳、氫、氮、氧氣、二氧化碳、氯、氟、硫等的離子;甲烷、乙烷等烷烴系氣體類的離子;乙烯、丙烯等烯烴系氣體類的離子;戊二烯、丁二烯等二烯烴系氣體類的離子;乙炔等炔烴系氣體類的離子;苯、甲苯等芳香族烴系氣體類的離子;環丙烷等環烷烴系氣體類的離子;環戊烯等環烯烴系氣體類的離子;金屬的離子;有機矽化合物的離子等。 Examples of ions implanted into the polymer layer include ions of rare gases such as argon, helium, neon, krypton, and xenon; ions of fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur; methane and ethane Ions such as alkane-based gases; Ions based on olefins such as ethylene and propylene; Ions based on diene-based gases such as pentadiene and butadiene; Ions based on acetylene-based gases such as acetylene; Aromatics such as benzene and toluene Ions of family hydrocarbon-based gases; Ions of cycloalkane-based gases such as cyclopropane; Ions of cycloolefin-based gases such as cyclopentene; Ions of metals; Ions of organosilicon compounds, etc.

此等離子可單獨1種或是組合2種以上使用。 These plasmas can be used alone or in combination of two or more.

此等當中,由於可更簡便地注入離子,可形成具有更佳阻氣性的阻氣層,以氬、氦、氖、氪、氙等稀有氣體的離子為佳。 Among these, since the ions can be more easily implanted, a gas barrier layer having better gas barrier properties can be formed, and ions of rare gases such as argon, helium, neon, krypton, and xenon are preferred.

離子的注入量可配合阻氣性積層體的使用目的(必要的阻氣性、透明性等)等而適當決定。 The amount of ion implantation can be appropriately determined in accordance with the purpose of use of the gas-barrier laminated body (necessary gas-barrier properties, transparency, etc.) and the like.

作為注入離子的方法,可列舉如照射藉由電場而加速的離子(離子束)的方法,電漿中的注入離子的方法等。當中,由於可更簡便地形成目的阻氣層,以後者的電漿中的注入離子的方法(電漿離子注入法)為佳。 Examples of the method of implanting ions include a method of irradiating ions (ion beams) accelerated by an electric field, and a method of implanting ions in a plasma. Among them, since the target gas barrier layer can be formed more easily, the latter plasma implantation method (plasma ion implantation method) is preferred.

電漿離子注入法係例如將包含稀有氣體等電漿生成氣體的環境下使電漿產生,藉由於高分子層施加負的高電壓脈衝,將該電漿中的離子(陽離子)於高分子層的表面部份進行注入。更具體而言,電漿離子注入法可藉由WO2010/107018號手冊等中所記載的方法而實施。 Plasma ion implantation method, for example, generates a plasma in an environment containing a plasma-generating gas such as a rare gas, and applies a negative high voltage pulse to the polymer layer to ions (cations) in the plasma to the polymer layer. Part of the surface is implanted. More specifically, the plasma ion implantation method can be implemented by a method described in WO2010 / 107018 and the like.

藉由離子注入,注入有離子的區域的厚度,可藉由離子的種類或施加電壓、處理時間等注入條件而控制,對應高分子層的厚度或積層體的使用目的等而決定即可,通常為10~400nm。 By ion implantation, the thickness of the region where the ions are implanted can be controlled by the type of ions, the implantation conditions such as applied voltage, and processing time. The thickness can be determined according to the thickness of the polymer layer or the purpose of the laminate. It is 10 ~ 400nm.

離子注入可藉由使用X線光電子分光分析(XPS)進行高分子層的表面起10nm附近的元素分析測定而確認。 Ion implantation can be confirmed by performing an elemental analysis measurement around 10 nm from the surface of the polymer layer using X-ray photoelectron spectroscopy (XPS).

阻氣性膜以在溫度40℃,相對濕度90%(以下,簡記為「90%RH」)的環境下,水蒸氣穿透率為0.1g/m2/day以下為佳,較佳為0.05g/m2/day以下,更佳為0.005g/m2/day以下。 The gas barrier film is preferably at a temperature of 40 ° C and a relative humidity of 90% (hereinafter, abbreviated as "90% RH"). The water vapor transmission rate is preferably 0.1 g / m 2 / day or less, more preferably 0.05. g / m 2 / day or less, more preferably 0.005 g / m 2 / day or less.

由於阻氣性膜於溫度40℃,90%RH的環境下,水蒸氣穿透率為0.1g/m2/day以下,可有效地抑制氧氣或水分等浸入形成於透明基板上的有機EL元件等元件內部,進而使電極或有機層劣化。 Since the gas barrier film has a water vapor transmission rate of 0.1 g / m 2 / day or less under the environment of a temperature of 40 ° C and 90% RH, it can effectively prevent oxygen or moisture from entering the organic EL element formed on the transparent substrate. Wait for the inside of the device to deteriorate the electrode or organic layer.

阻氣性膜的水蒸氣等的穿透率可使用習知的氣體穿透率測定裝置而測定。 The transmission rate of water vapor or the like of the gas barrier film can be measured using a conventional gas transmission rate measuring device.

作為底塗層並無特別限定,可使用習知者。例如可列舉WO2012/039387號、WO2013/147090號等所記載的底塗層等。 The primer layer is not particularly limited, and a known one can be used. For example, the undercoat layer described in WO2012 / 039387, WO2013 / 147090, etc. is mentioned.

密封片(β)的製造方法並無特別限定。例如在先前說明的密封片(α)的製造方法中,可將剝離膜的1片以阻氣性膜取代而製造密封片(β)。 The manufacturing method of a sealing sheet ((beta)) is not specifically limited. For example, in the manufacturing method of the sealing sheet ((alpha)) demonstrated previously, one sheet of a peeling film can be replaced with a gas barrier film, and a sealing sheet ((beta)) can be manufactured.

此外,可於製造密封片(α)後,剝離其1片剝離膜,將露出的黏著劑層與阻氣性膜貼附,而製造密封片(β)。此時,密封片(α)具有2片具有相異剝離力的剝離膜時,從操作性的觀點來看,以將剝離力小的剝離膜剝離為佳。 In addition, after the sealing sheet (α) is manufactured, one of the peeling films is peeled off, and the exposed adhesive layer and the gas barrier film can be attached to produce a sealing sheet (β). In this case, when the sealing sheet (α) has two peeling films having different peeling forces, it is preferable to peel the peeling film having a small peeling force from the viewpoint of operability.

本發明的密封片的黏著劑層黏著力及水分遮蔽性佳。因此,使用本發明的密封片密封有機EL元件,可有效地抑制其劣化。 The adhesive layer of the sealing sheet of the present invention has good adhesion and moisture shielding property. Therefore, the sealing of the organic EL element using the sealing sheet of the present invention can effectively suppress the deterioration.

3)密封體 3) Sealing body

本發明的密封體係被密封物使用本發明的密封片密封而成者。 The sealing system of the present invention is obtained by sealing a sealed object using the sealing sheet of the present invention.

「被密封物使用本發明的密封片密封而成」係指去除構成本發明的密封片的剝離膜,使黏著劑層露出,將此黏著劑層密附被密封物而覆蓋被密封物。 The phrase "the object to be sealed is sealed using the sealing sheet of the present invention" means that the release film constituting the sealing sheet of the present invention is removed, the adhesive layer is exposed, and the adhesive layer is adhered to the object to be sealed to cover the object to be sealed.

作為本發明的密封體,係具備例如透明基板,形成於該透明基板上的元件(被密封物),用以密封該元件的密封材者,上述密封材可列舉如本發明的密封片的黏著劑層。 The sealing body of the present invention includes, for example, a transparent substrate, an element (an object to be sealed) formed on the transparent substrate, and a sealing material for sealing the element. Examples of the sealing material include adhesion of the sealing sheet of the present invention.剂 层。 The agent layer.

透明基板並無特別限定,可使用各種基板材料。特別是以使用可見光穿透率高的基板材料為佳。此外,以阻止從元件外部浸入的水分或氣體的遮蔽性能高,耐溶劑性或耐候性佳的材料為佳。具體而言,可列舉如石英或玻璃等透明無機材料;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚碳酸酯、聚苯乙烯、聚乙烯、聚丙烯、聚伸苯硫醚、聚偏二氟乙烯、乙酸纖維素、溴化苯氧基、聚芳醯胺類、聚醯亞胺類、聚苯乙烯類、聚芳香酯類、聚碸類、聚烯烴類等透明塑膠、上述的阻氣性膜。 The transparent substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having a high visible light transmittance. In addition, a material having a high shielding performance against moisture or gas from the outside of the device and a solvent-resistant or weather-resistant material is preferred. Specific examples include transparent inorganic materials such as quartz or glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, and polyphenylene sulfide Transparent plastics such as ether, polyvinylidene fluoride, cellulose acetate, brominated phenoxy, polyaramide, polyimide, polystyrene, polyaromatic ester, polyfluorene, and polyolefin And the above gas barrier film.

透明基板的厚度無特別限制,但可考量光的穿透率或遮蔽元件內外的性能,而適當選擇。 The thickness of the transparent substrate is not particularly limited, but may be appropriately selected in consideration of the light transmittance or the performance inside and outside the shielding element.

作為被密封物,可列舉如有機EL元件,有機EL顯示面板元件,液晶顯示面板元件,太陽電池元件等。 Examples of the object to be sealed include organic EL elements, organic EL display panel elements, liquid crystal display panel elements, and solar cell elements.

本發明的密封體的製造方法無特別限定。例如,藉由本發明的密封片的黏著劑層重疊於被密封物上並貼附使,密封片的黏著劑層與被密封物黏附。 The manufacturing method of the sealing body of this invention is not specifically limited. For example, the adhesive layer of the sealing sheet of the present invention is superimposed on the object to be sealed and adhered, so that the adhesive layer of the sealing sheet is adhered to the object to be sealed.

本發明的密封體係被密封物被本發明的密封片密封而成者。 The sealing system of the present invention is obtained by sealing the object to be sealed with the sealing sheet of the present invention.

因此,本發明的密封體中,經過長期仍維持被密封物的性能。 Therefore, in the sealed body of the present invention, the performance of the object to be sealed is maintained over a long period of time.

[實施例] [Example]

以下,列舉實施例更詳細說明本發明。但是,本發明並非限定於以下實施例者。 Hereinafter, the present invention will be described in more detail with examples. However, the present invention is not limited to the following examples.

各例中的份及%若無特別註明,係質量基準。 Unless otherwise stated, the parts and% in each case are quality standards.

[製造例1] [Manufacturing example 1]

作為(甲基)丙烯酸酯系電離放射線硬化型化合物,將二季 戊四醇六丙烯酸酯(新中村化學公司製,商品名:A-DPH)20份溶解於甲基異丁基酮100份中之後,將光聚合起始劑(BASF社製,商品名:Irgacure127)以相對於底塗層形成用溶液的固形份100份,其量成為3份的方式添加,調製底塗層形成用溶液。 As a (meth) acrylate-based ionizing radiation-hardening compound, 20 parts of dipentaerythritol hexaacrylate (produced by Shin Nakamura Chemical Co., Ltd .: A-DPH) was dissolved in 100 parts of methyl isobutyl ketone. A photopolymerization initiator (manufactured by BASF, trade name: Irgacure127) was added to 100 parts of the solid content of the undercoat layer forming solution, and the amount was 3 parts to prepare an undercoat layer forming solution.

接著,於厚度為50μm的聚對苯二甲酸乙二酯膜(以下,稱為「PET膜」)(東洋紡公司製,COSMOSHINE A-4300)上,塗佈上述底塗層形成用溶液,使所得的塗膜乾燥,形成厚度1μm的底塗層。 Subsequently, 50 μ m in thickness of polyethylene terephthalate film (hereinafter referred to as "PET film") (manufactured by Toyobo Co., COSMOSHINE A-4300) was coated with the primer layer-forming solution, The obtained coating film was dried to form an undercoat layer having a thickness of 1 μm .

接著,於此底塗層上塗佈以全氫聚矽氮烷為主成分的塗佈劑(Merck Performance Materials公司製,「AZNN110-20」),所得的塗膜於120℃加熱2分鐘,形成厚度200nm的聚矽氮烷層。 Next, a coating agent ("AZNN110-20", manufactured by Merck Performance Materials, Inc.) containing perhydropolysilazane as a main component was coated on this undercoat layer, and the obtained coating film was heated at 120 ° C for 2 minutes to form A polysilazane layer with a thickness of 200 nm.

接著,於此聚矽氮烷層,使用電漿離子注入裝置,依照下述條件進行電漿離子注入,對聚矽氮烷層的表面改質,獲得阻氣性膜。 Next, plasma ion implantation was performed on the polysilazane layer using a plasma ion implantation device in accordance with the following conditions to modify the surface of the polysilazane layer to obtain a gas barrier film.

此阻氣性膜的水蒸氣穿透率為0.02g/m2/day。 The water vapor transmission rate of this gas barrier film was 0.02 g / m 2 / day.

[電漿離子注入的處理條件] [Processing conditions for plasma ion implantation]

電漿生成氣體:氬 Plasma generated gas: Argon

氣體流量:100sccm Gas flow: 100sccm

Duty比:0.5% Duty ratio: 0.5%

重複頻率:1000Hz Repetition frequency: 1000Hz

施加電壓:-10kV Applied voltage: -10kV

RF輸出:1000W RF output: 1000W

RF電源:(頻率)13.56MHz,(施加電力)1000W RF power: (frequency) 13.56MHz, (applied power) 1000W

艙內壓:0.2Pa Cabin pressure: 0.2Pa

脈波寬度:5μsec Pulse width: 5μsec

處理時間(離子注入時間):5分鐘 Processing time (ion implantation time): 5 minutes

運送速度:0.2m/min Transport speed: 0.2m / min

[實施例或比較例所使用的化合物] [Compounds used in Examples or Comparative Examples]

實施例或比較例中,使用以下的化合物。 In the examples or comparative examples, the following compounds were used.

橡膠系樹脂(1):丁基橡膠,質量平均分子量(Mw):34,000,JSR股份有限公司製,商品名:JSR BUTYL268 Rubber-based resin (1): butyl rubber, mass average molecular weight (Mw): 34,000, manufactured by JSR Corporation, trade name: JSR BUTYL268

橡膠系樹脂(2):丁基橡膠,質量平均分子量(Mw):28,000,JSR股份有限公司製,商品名:JSR BUTYL365 Rubber-based resin (2): butyl rubber, mass average molecular weight (Mw): 28,000, manufactured by JSR Corporation, trade name: JSR BUTYL365

增黏劑(1):脂肪族系石油樹脂,日本ZEON股份有限公司製,商品名:Quintone A-100 Tackifier (1): aliphatic petroleum resin, made by Japan Zeon Co., Ltd., trade name: Quintone A-100

硬化性樹脂(1):氫化聚丁二烯聚醇,Cray Valley社製,商品名:Krasol HLBH-P2000 Curable resin (1): hydrogenated polybutadiene polyol, manufactured by Cray Valley, trade name: Krasol HLBH-P2000

硬化性樹脂(2):聚丁二烯聚醇,Cray Valley社製,商品名:Krasol LBH-P2000 Curable resin (2): polybutadiene polyol, manufactured by Cray Valley, trade name: Krasol LBH-P2000

交聯劑(1):脲甲酸酯改質六亞甲基二異氰酸酯,三井化學股份有限公司製,商品名:TAKENATE D-178NL Crosslinking agent (1): Uremate modified hexamethylene diisocyanate, manufactured by Mitsui Chemicals Co., Ltd., trade name: TAKENATE D-178NL

交聯劑(2):五亞甲基二異氰酸酯系多元異氰酸酯,三井化學股份有限公司製,商品名:STABiO D-370N Crosslinking agent (2): Pentamethylene diisocyanate polyisocyanate, manufactured by Mitsui Chemicals Co., Ltd., trade name: STABiO D-370N

矽烷耦合劑(1):8-(胺乙基胺基)辛基三甲氧基矽烷,信越化學工業股份有限公司製,商品名:KBM6803 Silane coupling agent (1): 8- (aminoethylamino) octyltrimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM6803

矽烷耦合劑(2):3-環氧丙基丙基三甲氧基矽烷,信越化學工業股份有限公司製,商品名:KBM403 Silane coupling agent (2): 3-glycidylpropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Industry Co., Ltd., trade name: KBM403

矽烷耦合劑(3):8-環氧丙基辛基三甲氧基矽烷,信越化學 工業股份有限公司製,商品名:KBM4803 Silane coupling agent (3): 8-epoxypropyloctyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM4803

[實施例1] [Example 1]

將橡膠系樹脂(1)80份,橡膠系樹脂(2)20份,增黏劑(1)20份,硬化性樹脂(1)15份,交聯劑(1)5份以及矽烷耦合劑(1)0.1份溶解於甲苯中,調製固形份濃度17%的黏著劑組合物(1)。 80 parts of rubber-based resin (1), 20 parts of rubber-based resin (2), 20 parts of tackifier (1), 15 parts of curable resin (1), 5 parts of cross-linking agent (1), and silane coupling agent ( 1) 0.1 part of the adhesive composition (1) dissolved in toluene to prepare a solid content concentration of 17%.

將此黏著劑組合物(1)塗佈於剝離膜(LINTEC公司製,商品名:SP-PET382150)的剝離處理面上,所得的塗膜於100℃乾燥1分鐘,形成厚度為20μm的黏著劑層,於其上,貼合再1片剝離膜(LINTEC公司製,商品名:SP-PET381031)的剝離處理面,獲得密封片(1)。 This adhesive composition (1) was applied to a release-treated surface of a release film (manufactured by LINTEC, trade name: SP-PET382150), and the obtained coating film was dried at 100 ° C. for 1 minute to form an adhesive having a thickness of 20 μm. Layer, and the peeling process surface of another peeling film (made by LINTEC company, brand name: SP-PET381031) was bonded together, and the sealing sheet (1) was obtained.

[實施例2~8、比較例1] [Examples 2 to 8, Comparative Example 1]

變更第1表所記載之組成,調製黏著劑組合物(2)~(9),除了使用此等黏著劑組合物外,其餘與實施例1相同,獲得密封片(2)~(9)。 The composition described in Table 1 was changed, and adhesive compositions (2) to (9) were prepared. Except that these adhesive compositions were used, the rest were the same as in Example 1, and sealing sheets (2) to (9) were obtained.

針對實施例1~8、比較例1所得的密封片(1)~(9),進行以下測試。且,測試在密封片製作完成後,於23℃相對濕度50%環境下,7日熟成後進行。 The following tests were performed on the sealing sheets (1) to (9) obtained in Examples 1 to 8 and Comparative Example 1. In addition, the test was performed after 7 days of maturation at 23 ° C and 50% relative humidity after the completion of the sealing sheet.

[黏著力測定] [Adhesion measurement]

剝除1片寬度為25mm的密封片的剝離膜,使露出的黏著劑層重疊於製造例1所得的阻氣性膜。接著,再剝除1片剝離膜使露出的黏著劑層重疊於無鹼玻璃,以壓輥壓合,獲得測試片。 A peeling film of a sealing sheet having a width of 25 mm was peeled off, and the exposed adhesive layer was superposed on the gas barrier film obtained in Production Example 1. Next, one more peeling film was peeled off so that the exposed adhesive layer was superimposed on the alkali-free glass, and pressed with a pressure roller to obtain a test piece.

作為剝離測試(a),測試片於溫度23℃,相對濕度50%條件下,進行180°剝離測試。 As a peel test (a), the test piece was subjected to a 180 ° peel test at a temperature of 23 ° C and a relative humidity of 50%.

作為剝離測試(b),測試片於溫度60℃,相對濕度90%條 件下靜置168小時,接著,於溫度23℃,相對濕度50%條件下靜置24小時後,於溫度23℃,相對濕度50%條件下進行180°剝離測試。 As the peel test (b), the test piece was left to stand at a temperature of 60 ° C and a relative humidity of 90% for 168 hours, and then was left to stand at a temperature of 23 ° C and a relative humidity of 24% for 24 hours. A 180 ° peel test was performed at 50% humidity.

於此剝離測試中,上述測試條件以外,根據JIS Z0237:2000所記載之黏著力的測定方法進行。 In this peel test, other than the above test conditions, it was performed in accordance with the method for measuring the adhesive force described in JIS Z0237: 2000.

[起泡性評估] [Foaming evaluation]

剝除1片1邊125mm的正方形狀的密封片的剝離膜,將露出的黏著劑層重疊於製造例1所得的阻氣性膜。接著,再剝除1片剝離膜,將露出的黏著劑層重疊於無鹼玻璃,使用輥貼合機予以貼附。之後,以加熱加壓爐(LINTEC公司製,型號:RAD-9100),於溫度50℃,壓力0.5MPa條件下處理20分鐘,獲得測試片。將此測試片放入恆溫恆濕器(ESPEC公司製,型號:PL-2KT),於溫度85℃,相對濕度85%環境下靜置72小時後,進行目視觀察,根據以下的基準評估起泡性。 The peeling film of one 125 mm square sealing sheet was peeled off, and the exposed adhesive layer was superimposed on the gas barrier film obtained in Production Example 1. Next, one more peeling film was peeled off, and the exposed adhesive layer was superimposed on the alkali-free glass, and it was attached using a roll bonding machine. Thereafter, a test piece was obtained by processing in a heating and pressure furnace (manufactured by LINTEC, model: RAD-9100) at a temperature of 50 ° C and a pressure of 0.5 MPa for 20 minutes. This test piece was placed in a constant temperature and humidity device (manufactured by ESPEC, model: PL-2KT), and allowed to stand for 72 hours at a temperature of 85 ° C and a relative humidity of 85%, and then visually observed to evaluate foaming according to the following criteria. Sex.

○:膨泡發生個數未達5個 ○: The number of blisters has not reached 5

×:膨泡發生個數5個以上。 ×: Number of blisters occurred 5 or more.

[有機EL元件的評估測試] [Evaluation test of organic EL element]

具有成膜有氧化銦錫(ITO)膜(厚度:100nm,片電阻:50Ω/□)的玻璃基板作為陽極的有機EL元件,藉由以下方法製作。 An organic EL element having a glass substrate formed with an indium tin oxide (ITO) film (thickness: 100 nm, sheet resistance: 50 Ω / □) as an anode was produced by the following method.

首先,於上述玻璃基板的ITO膜上,將N,N’-雙(萘-1-基)-N,N’-雙(苯基)-聯苯胺)(Luminescence Technology公司製)50nm,參(8-羥基喹啉)鋁(Luminescence Technology公司製)50nm,以0.1~0.2nm/分的速度依序蒸鍍,形成發光層。 First, N, N'-bis (naphthalene-1-yl) -N, N'-bis (phenyl) -benzidine) (manufactured by Luminescence Technology) 50 nm on the ITO film of the glass substrate, 8-Hydroxyquinoline) aluminum (manufactured by Luminescence Technology) at 50 nm was sequentially vapor-deposited at a rate of 0.1 to 0.2 nm / min to form a light emitting layer.

於所得的發光層上,作為電子注入材料的氟化鋰(LiF)(高 純度化學研究所公司製)以0.1nm/分的速度蒸鍍4nm,接著,將鋁(Al)(高純度化學研究所公司製)以0.1nm/分的速度蒸鍍100nm,藉此形成陰極,獲得有機EL元件。 On the obtained light-emitting layer, lithium fluoride (LiF) (produced by the High Purity Chemical Research Institute) as an electron injection material was vapor-deposited at a rate of 0.1 nm / minute at 4 nm, and then aluminum (Al) (high purity chemical research Co., Ltd.) was deposited at a rate of 0.1 nm / min to 100 nm to form a cathode, thereby obtaining an organic EL element.

且,蒸鍍時的真空度全部為1×10-4Pa以下。 The degree of vacuum at the time of vapor deposition was all 1 × 10 -4 Pa or less.

剝除1片實施例或比較例所得的密封片的剝離膜,露出的黏著劑層重疊於製造例1所得的阻氣性膜上,使用輥貼合機將此等貼附。接著,再剝離1片剝離膜,露出的黏著劑層以覆蓋形成於玻璃基板上的有機EL元件的方式重疊,使用輥貼合機將此貼附,獲得有機EL元件被密封的底部發光型的電子裝置。 One peeling film of the sealing sheet obtained in the example or the comparative example was peeled off, and the exposed adhesive layer was superimposed on the gas barrier film obtained in the manufacturing example 1, and these were attached using a roll bonding machine. Next, one more peeling film was peeled off, and the exposed adhesive layer was overlapped so as to cover the organic EL element formed on the glass substrate, and this was attached using a roll bonding machine to obtain a bottom-emitting type in which the organic EL element was sealed. Electronic device.

此電子裝置於溫度60℃,相對濕度90%環境下靜置250小時後,啟動有機EL元件,觀察有無啞點(不發光處),計算出相對於全體的啞點的面積比例。 This electronic device was left to stand for 250 hours under the environment of a temperature of 60 ° C. and a relative humidity of 90%. Then, the organic EL device was started, and the presence or absence of dull spots (non-light-emitting areas) was observed, and the area ratio of the dull spots to the whole was calculated.

從第1表可得知如以下。 As can be seen from Table 1, it is as follows.

實施例1~8的密封片(1)~(8)靜置於高濕條件後,顯示更佳的黏著力,此外,密封性佳。 The sealing sheets (1) to (8) of Examples 1 to 8 showed better adhesion after being left to stand in a high-humidity condition, and also had good sealing properties.

另一方面,比較例1的密封片(9)黏著力小,此外,放置於高濕條件時,黏著力大幅降低,然後,密封片(9)密封性劣化。 On the other hand, the sealing sheet (9) of Comparative Example 1 has a small adhesive force, and when placed under high humidity conditions, the adhesive force is greatly reduced, and then the sealing property of the sealing sheet (9) is deteriorated.

Claims (18)

一種黏著劑組合物,係包含:下述(A)成分,(C)成分以及(D)成分:(A)成分:橡膠系樹脂;(C)成分:硬化性樹脂;(D)成分:脲甲酸酯系交聯劑。     An adhesive composition comprising the following (A) component, (C) component, and (D) component: (A) component: rubber-based resin; (C) component: curable resin; (D) component: urea Formate-based crosslinking agent.     根據申請專利範圍第1項之黏著劑組合物,其中,上述(A)成分為丁基橡膠。     The adhesive composition according to item 1 of the patent application range, wherein the component (A) is butyl rubber.     根據申請專利範圍第1項之黏著劑組合物,其中,復含有下述(B)成分,(B)成分:增黏劑。     The adhesive composition according to item 1 of the scope of patent application, which further contains the following (B) component, (B) component: a tackifier.     根據申請專利範圍第3項之黏著劑組合物,其中,上述(B)成分為脂肪族系石油樹脂。     The adhesive composition according to claim 3, wherein the component (B) is an aliphatic petroleum resin.     根據申請專利範圍第3項之黏著劑組合物,其中,上述(B)成分的含量,相對於(A)成分100質量份,為1~50質量份。     According to the adhesive composition of claim 3, the content of the component (B) is 1 to 50 parts by mass relative to 100 parts by mass of the component (A).     根據申請專利範圍第1項之黏著劑組合物,其中,上述(C)成分為於兩末端具有羥基的聚合物。     The adhesive composition according to item 1 of the patent application scope, wherein the component (C) is a polymer having hydroxyl groups at both ends.     根據申請專利範圍第1項之黏著劑組合物,其中,上述(C)成分的含量,相對於(A)成分100質量份,為1~50質量份。     According to the adhesive composition of claim 1, the content of the component (C) is 1 to 50 parts by mass based on 100 parts by mass of the component (A).     根據申請專利範圍第1項之黏著劑組合物,其中,上述(D)成分為脲甲酸酯改質六亞甲基二異氰酸酯。     The adhesive composition according to item 1 of the scope of patent application, wherein the component (D) is a urethane modified hexamethylene diisocyanate.     根據申請專利範圍第1項之黏著劑組合物,其中,上述(D)成分的含量,相對於(A)成分100質量份,為1~70質量份。     According to the adhesive composition of claim 1, the content of the component (D) is 1 to 70 parts by mass based on 100 parts by mass of the component (A).     根據申請專利範圍第1項之黏著劑組合物,其中,復含有下述(E)成分,(E)成分:矽烷耦合劑。     The adhesive composition according to item 1 of the scope of patent application, which further contains the following (E) component and (E) component: a silane coupling agent.     根據申請專利範圍第10項之黏著劑組合物,其中,上述(E)成分為下述式(1)所示的化合物: R 1表示碳數3以上的伸烷基,R 2表示碳數1~10的1價的烴基,R 3表示碳數1~4的烷基;Z表示含有反應性基的基;n為0或1。 The adhesive composition according to claim 10, wherein the component (E) is a compound represented by the following formula (1): R 1 represents an alkylene group having 3 or more carbon atoms, R 2 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms, R 3 represents an alkyl group having 1 to 4 carbon atoms, Z represents a group containing a reactive group, and n is 0 Or 1. 根據申請專利範圍第10項之黏著劑組合物,其中,上述(E)成分的含量,相對於上述(A)成分100質量份,為0.01~7質量份。     According to the adhesive composition of claim 10, the content of the component (E) is 0.01 to 7 parts by mass relative to 100 parts by mass of the component (A).     一種密封片,係由2片剝離膜以及挾持於此等剝離膜間的黏著劑層而成的密封片,上述黏著劑層係使用申請專利範圍第1項至第12項中任一項之黏著劑組合物所形成者。     A sealing sheet is a sealing sheet composed of two release films and an adhesive layer held between the release films, and the adhesive layer is an adhesive using any one of claims 1 to 12 of the scope of patent application. Agent composition formed.     一種密封片,係由剝離膜,阻氣性膜以及挾持於上述剝離膜與阻氣性膜間的黏著劑層而成的密封片,上述黏著劑層係使用申請專利範圍第1項至第12項中任一項之黏著劑組合物所形成者。     A sealing sheet is a sealing sheet made of a release film, a gas barrier film, and an adhesive layer held between the release film and the gas barrier film, and the adhesive layer uses the first to the twelfth aspects of the application patent scope. Formed by the adhesive composition according to any one of the items.     根據申請專利範圍第14項之密封片,其中,上述阻氣性膜為金屬箔,樹脂製膜或薄膜玻璃。     The sealing sheet according to item 14 of the application, wherein the gas barrier film is a metal foil, a resin film, or a thin-film glass.     根據申請專利範圍第13或14項之密封片,其中,黏著劑層的厚度為1~50μm。     The sealing sheet according to item 13 or 14 of the scope of patent application, wherein the thickness of the adhesive layer is 1 to 50 μm.     一種密封體,係被密封物使用申請專利範圍第13項或14 項之密封片密封而成。     The utility model relates to a sealing body, which is obtained by sealing the object to be sealed by using the sealing sheet of the patent application scope item 13 or item 14.     根據申請專利範圍第17項之密封體,其中,上述被密封物為有機EL元件,有機EL顯示面板元件,液晶顯示面板元件或太陽電池元件。     The sealed body according to item 17 of the scope of patent application, wherein the sealed object is an organic EL element, an organic EL display panel element, a liquid crystal display panel element, or a solar cell element.    
TW107110488A 2017-03-30 2018-03-27 Adhesive composition, sealing sheet and sealed body TW201837144A (en)

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