TW201833272A - Electrically conductive sheet for use in three-dimensional molding - Google Patents

Abstract

The present invention provides an electrically conductive sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged such that adjacent electrically conductive linear bodies are regularly spaced apart from each other at intervals of from 0.3 mm to 12.0 mm; a resin protective layer provided at a side of one surface of the pseudo-sheet structure; and an adhesive layer provided between the pseudo-sheet structure and the resin protective layer.

Description

Three-dimensional forming conductive sheet

The present invention relates to a conductive sheet for three-dimensional molding.

The conductive sheet is used as various types of heat-generating sheets such as a heat-generating sheet for ice and snow melting and a heat-generating sheet for heating. For example, Patent Document 1 discloses a heat generating body including a transparent substrate, a conductive heating wire provided on at least one surface of the transparent substrate, a bus bar for electrically connecting the conductive heating wire and the electrical connection, and a power supply unit connected to the bus bar. Further, Patent Document 2 discloses "a heating element in which a wire is disposed on an adhesive". Further, Patent Document 3 discloses "a transparent flexible film heater having a line width of a metal thin line portion of 0.4 μm or more and 50 μm or less and a ratio of a light transmissive portion to a full film area of 70 Å. 99.9%".

In addition, TOM (Three dimension Overlay Method) molding, film insertion molding, and vacuum are used to impart a function such as creativity and scratch resistance to the surface of a molded article used for a home appliance frame, a vehicle interior component, and a building material interior material. A three-dimensional forming method such as vacuum forming has been known for three-dimensionally forming a three-dimensional forming sheet (see, for example, Patent Document 4).

Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei.

[Problems to be Solved by the Invention] However, in the conductive sheet having a pseudo sheet structure in which the conductive linear bodies are arranged, there is a case where the sheet structure is inferior to the adjacent layer or member. At this time, peeling is likely to occur at the interface between the sheet-like structure and the adjacent layer or member.

Further, when the electric resistance of the sheet-like structure is increased, for example, when the conductive sheet is used as a heat-generating sheet, the distribution of temperature rise is not uniform, and the function of producing the conductive sheet is lowered.

Therefore, when a conductive sheet having a sheet-like structure is used as a sheet for three-dimensional molding, all or a part of the sheet is peeled off by a sheet-like structure, or there is a fear that the function is lowered.

Therefore, an object of the present invention is to provide a conductive sheet for three-dimensional molding which suppresses peeling of a sheet which is bounded by a sheet-like structure and exhibits high performance. [Means to solve the problem]

The above problems are solved by the following means.

<1> A conductive sheet for three-dimensional molding, comprising: a plurality of conductive linear bodies extending in one direction having a space of 0.3 mm to 12.0 mm, and a distance between adjacent conductive linear bodies is kept constant A sheet-like structure, a resin protective layer provided on one surface of the similar sheet structure, and an adhesive layer provided between the similar sheet structure and the resin protective layer. <2> The conductive sheet for three-dimensional molding according to <1>, wherein the conductive linear body has a diameter of 5 μm to 75 μm. <3> The conductive sheet for three-dimensional molding of <1> or <2>, wherein a ratio of a thickness of the resin protective layer to a thickness of the adhesive layer (thickness of a resin protective layer/thickness of an adhesive layer) is 1 /1~100/1. <4> The conductive sheet for three-dimensional molding according to any one of <1> to <3> wherein the conductive linear body is a wave-shaped linear body. The conductive sheet for three-dimensional molding according to any one of <1> to <4> wherein the conductive linear body is a linear body including a metal wire or a linear body including a conductive wire. <6> The conductive sheet for three-dimensional molding according to any one of <1> to <4> wherein the conductive linear body is a linear body including a metal wire coated with a carbon material. The conductive sheet for three-dimensional molding according to any one of <1> to <4> wherein the conductive linear body is a linear body including a metal wire coated with a carbon material, and the adhesive layer is The peeling force was applied, and the adhesive layer was adhered to a stainless steel plate, and the peeling force after 30 minutes was 12 N/25 mm or more. The conductive sheet for three-dimensional molding according to any one of <1> to <4> wherein the conductive linear body is a linear body including a conductive wire, and the peeling force of the adhesive layer is as described above. Then, the agent layer was adhered to the stainless steel plate, and the peeling force after 30 minutes was 11 N/25 mm or less. The conductive sheet for three-dimensional molding according to any one of <1> to <8> wherein at least one of the layers constituting the surface of the similar sheet structure provided on the side having the resin protective layer contains coloring Agent. The conductive sheet for three-dimensional molding according to any one of <1> to <9> wherein at least any one of the layers constituting the surface of the similar sheet structure provided on the side having the resin protective layer contains heat conduction. Inorganic filler. The conductive sheet for three-dimensional molding according to any one of <1> to <10>, which has a resin layer provided on a surface of the above-described similar sheet structure on the side opposite to the side having the resin protective layer. <12> The conductive sheet for three-dimensional molding according to any one of <1> to <11>, which is a heat-generating sheet for three-dimensional molding. [Effect of the invention]

According to the present invention, it is possible to provide a three-dimensionally-formed conductive sheet which suppresses peeling of a sheet which is bounded by a sheet-like structure and exhibits high performance.

[Examples] Hereinafter, the present invention will be specifically described by way of examples. However, the invention is not limited to the embodiments.

[Example 1] An adhesive sheet of an acrylic pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 20 μm as an adhesive layer was prepared on a polypropylene film having a thickness of 100 μm as a resin protective layer. The peeling force of the adhesive layer measured according to the above method was 15 N/25 mm. A carbon-coated tungsten wire (diameter: 14 μm, manufacturer name: manufactured by Tokusai Co., Ltd., product name: TGW-B) was prepared as a conductive linear body. Next, the adhesive sheet is made to have the surface of the pressure-sensitive adhesive layer facing outward, to prevent wrinkles from being wound around the peripheral surface of the rubber roll member, and the both ends of the adhesive sheet in the circumferential direction are double-sided tape. fixed. The wire wound around the bobbin is attached to the surface of the pressure-sensitive adhesive layer of the adhesive sheet located near the end of the reel member, and the wire is fed, and the reel member is wound and wound The tubular member is moved a little in a direction parallel to the reel axis of the reel, and the spiral edges are drawn at equal intervals to be wound around the reel member. Thus, on the surface of the pressure-sensitive adhesive layer of the adhesive sheet, the distance between the adjacent lines is kept constant, and a plurality of lines are provided to form a similar sheet structure composed of the lines. At this time, the reel member moves while vibrating, and the wound line traces the wave shape. The lines are arranged at equal intervals with an interval of 1.7 mm. Further, the wavelength λ of the wave shape line (distance between waveforms) was 30 mm, and the amplitude A was 30 mm. Next, the surface of a similar sheet structure provided with an adhesive sheet similar to the sheet structure (the surface exposed by the lines and the adhesive layer) is bonded as a release film of the release layer (trade name: SP-381130 (Linde) Company system)). Then, in parallel with the reel axis of the reel, the sheet-like structure, the release film, and the adhesive sheet are cut to obtain a three-dimensionally-formed conductive sheet.

[Example 2] In addition to using a carbon nanotube bundle to be pulled out, a nano carbon line (diameter: 14 μm) obtained by twisting was used instead of the carbon-coated tungsten wire, and the thickness was 100 μm as a resin protective layer. On the polypropylene film, an adhesive sheet of an acrylic pressure-sensitive adhesive layer (pressure-sensitive adhesive layer) having a thickness of 20 μm as an adhesive layer (peeling force of the adhesive layer measured according to the above method = 10 N/25 mm) was provided instead of In the same manner as in Example 1, except for the adhesive sheet of Example 1, a conductive sheet for three-dimensional molding was obtained.

[Example 3] In addition to the thickness of the polypropylene film was set to 800 μm, the thickness of the adhesive layer was set to 70 μm, and a carbon wire (diameter 70 μm, manufacturer name: Arcor Electronics Co., Ltd. product name: Bare Copper Wire) was used instead of carbon coating. A conductive sheet for three-dimensional molding was obtained in the same manner as in Example 1 except that the distance between the wires was 8 mm.

[Comparative Example 1] A conductive sheet for three-dimensional molding was obtained in the same manner as in Example 1 except that the interval of the wires was 15 mm.

[Comparative Example 2] A three-dimensionally-formed conductive sheet was obtained in the same manner as in Example 1 except that the interval between the lines was changed to 0.1 mm.

[Evaluation of Sheet Peeling] A test piece having a width of 25 mm was produced from the three-dimensional forming conductive sheet obtained in each example. The test piece was placed on the opposite side of the adhesive layer 32, and the test piece was adhered to the surface of the acrylic plate. In this state, a load was applied to the entire test piece, and after 30 minutes, a 180° peel test prescribed in JIS-Z0237 (2000) was carried out. Specifically, the test piece was pulled at a speed of 300 mm/min in a 180° direction using a tensile tester, and the force (adhesion) required for peeling the test piece from the acrylic sheet was measured. Further, the conditions under which the load is applied are also as described in the above JIS. When the measured adhesive force was 1 N/25 mm or more, the evaluation was good, and when it was less than 1 N/25 mm, it was evaluated as poor.

[Temperature Evaluation] The three-dimensional molding conductive sheet obtained in each example was three-dimensionally formed by a vacuum forming method, and coated on a semi-spherical spherical molded article to obtain a sample. After the obtained sample was allowed to stand in an environment of 25 ° C for 5 minutes, a voltage of 12 V was applied to the similar sheet structure of the conductive sheet. When the surface temperature of the conductive sheet was raised to 50 ° C, the contact was made by hand, and when the temperature distribution was not felt, the evaluation was good, and the feeling was obtained, and it was evaluated as defective.

As a result of the above, the conductive sheet for three-dimensional molding of the present Example was excellent in both the peeling evaluation and the inter-temperature evaluation. In this way, the conductive sheet for three-dimensional molding of the present embodiment is obtained, and the peeling of the sheet which is similar to the sheet structure is suppressed, and the high function is exhibited.

Further, the entire disclosure of Japanese Patent Application No. 2016-230552 is incorporated herein by reference. All of the documents, patents, and technical specifications described in the specification are incorporated by reference to the respective documents, patent applications, and technical specifications, and are incorporated herein by reference.

10‧‧‧Fever sheets
11‧‧‧Sheet
12‧‧‧Sheet
13‧‧‧Sheet
13A‧‧‧A region of the sheet 13 having the first portion 22A
13B‧‧‧A region of the sheet 13 having the second portion 22B
13C‧‧‧A region of the sheet 13 having the third portion 22C
13AA‧‧‧A region with a sheet 13 of the first portion 22AA
13BB‧‧‧A region of the sheet 13 having the second portion 22BB
13CC‧‧‧The area of the sheet 13 with the third part 22CC
20‧‧‧Similar sheet structures
22‧‧‧Electrical linear body
The first part of the 22A‧‧ wave shape
The second part of the 22B‧‧ wave shape
The third part of the 22C‧‧ wave shape
22AA‧‧‧ first part
22BB‧‧‧Second part
22CC‧‧‧ third part
30‧‧‧Resin protective layer
32‧‧‧ adhesive layer
34‧‧‧ peeling layer
36‧‧‧Intermediate resin layer
38‧‧‧ resin layer
40‧‧‧Upper release layer

Fig. 1 is a schematic plan view showing a three-dimensional forming conductive sheet of the present embodiment. Fig. 2 is a schematic cross-sectional view showing a three-dimensional conductive sheet according to the embodiment. Fig. 3 is a schematic cross-sectional view showing a first modification of the three-dimensional forming conductive sheet of the embodiment. Fig. 4 is a schematic plan view showing a second modification of the three-dimensional forming conductive sheet of the embodiment. Fig. 5 is a schematic plan view showing a third modification of the three-dimensional forming conductive sheet of the embodiment. Fig. 6 is a schematic plan view showing another example of a third modification of the three-dimensional forming conductive sheet of the embodiment. [Formation of the Invention]

Hereinafter, an embodiment of an embodiment of the present invention will be described in detail. In addition, in this specification, the numerical range of "~" is a numerical range containing the minimum value and the maximum value of each of the numerical values shown before and after "~".

<Electrically conductive sheet for three-dimensional molding> The conductive sheet for three-dimensional molding (hereinafter also referred to as "conductive sheet") has a plurality of conductive linear bodies extending in one direction of 0.3 mm to 12.0 mm. a sheet-like structure in which the distance between adjacent conductive linear bodies is kept constant; a resin protective layer provided on one surface of the similar sheet structure; and a similar sheet structure and the foregoing resin An adhesive layer between the protective layers. In addition, the term "surface" as used herein refers to a surface which is formed by a plurality of conductive linear bodies and which has a two-dimensional structure as a sheet.

The conductive sheet of the present embodiment has a structure in which a similar sheet structure and an adhesive layer are laminated, and the adhesive layer is exposed from the conductive linear bodies of the similar sheet structure. Then, the exposed adhesive layer has a layer which is next adjacent to the similar sheet structure (for example, a resin layer or the like provided on the surface of a sheet-like structure opposite to the side having the resin protective layer) or a member (for example, a conductive sheet) The function of the molded article of the object to be coated.

In the sheet of the present embodiment, peeling of the sheet which is similar to the sheet structure can be suppressed, and high performance can be exhibited.

Further, since the sheet of the present embodiment has a structure in which an adhesive layer is provided between the sheet-like structure and the resin protective layer, the resin protective layer similar to the sheet structure (in other words, the conductive linear body) can be easily fixed. Further, when the sheet is produced, the conductive linear body to be fed can be directly fixed to the surface of the adhesive layer, and a sheet-like structure can be formed, so that the manufacturing steps can be simplified.

An example of the configuration of the three-dimensional forming conductive sheet of the present embodiment will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, the three-dimensionally-formed conductive sheet 10 (hereinafter sometimes referred to as "sheet 10") has, for example, a sheet-like structure 20 and one of the sheet-like structures 20 The resin protective layer 30 on the surface, the adhesive layer 32 disposed between the sheet-like structure 20 and the resin protective layer 30, and the surface of the similar sheet structure 20 disposed on the side opposite to the side having the adhesive layer 32. Stripping layer 34. In other words, for example, the sheet 10 is laminated in the order of the peeling layer 34, the sheet-like structure 20, the adhesive layer 32, and the resin protective layer 30.

Here, the sheet 10 having this layer is formed by peeling off the peeling layer 34, and the molded article (adhered matter) is formed to face the surface having the sheet-like structure 20 side while being three-dimensionally formed. At this time, the sheet 10 is covered with the surface of the molded article in a state in which it is adhered to the surface of the molded article from the adhesive force of the adhesive layer 32 exposed between the "plural linear bodies" in the similar sheet structure 20. Then, the sheet 10 composed of this layer is among the three-dimensional forming methods, and is suitable for TOM forming and vacuum forming.

(Similar sheet structure) The sheet-like structure 20 is a sheet-like structure in which a plurality of conductive linear bodies 22 extending in one direction are spaced apart from each other, and the distance between adjacent conductive linear bodies 22 is kept constant. Body composition. Specifically, in the sheet-like structure 20, for example, the conductive linear bodies 22 extending in a straight line are parallel to each other in the direction orthogonal to the longitudinal direction (or the direction in which the conductive linear bodies 22) are orthogonal to each other at equal intervals. The structure is arranged. In other words, the sheet-like structure 20, for example, the conductive linear body 22 is constituted by a structure in which stripes are arranged. Further, the respective intervals of the plurality of conductive linear bodies 22 are preferably equal intervals, but may be unequal intervals.

Here, in the sheet-like structure 20, the interval L of the conductive linear bodies 22 is 0.3 mm to 12.0 mm. In the conductive sheet 10 of this configuration, when the distance between the plurality of conductive linear bodies 22 is in the range of 0.3 mm to 12.0 mm, the adhesive layer 32 exposed between the conductive linear bodies 22 is secured. The exposed area prevents the subsequent use of the adhesive layer 32 exposed by the sheet-like structure 20 and is hindered by the conductive linear body 22. Further, when the distance between the plurality of conductive linear bodies 22 is in the above range, since the conductive linear bodies 22 are dense to some extent, the electric resistance of the sheet-like structure 20 can be increased, or the conductive sheets 10 can be heated. When the sheet is used, it is possible to suppress an increase in the area where no heat is generated, and the function of the conductive sheet 10 in which the temperature rise distribution becomes uneven (uneven temperature rise) is lowered. From the viewpoints of the above, the interval L of the conductive linear bodies 22 is preferably 0.5 mm to 10.0 mm, more preferably 0.8 mm to 7.0 mm.

The interval L between the conductive linear bodies 22 is observed by a digital microscope, and the conductive linear bodies 22 of the sheet-like structure 20 are observed, and the interval between the adjacent two conductive linear bodies 22 is measured. Further, the interval L between the adjacent two conductive linear members 22 means the length along the direction in which the conductive linear bodies 22 are arranged, and the length between the two conductive linear bodies 22 facing each other. (Refer to Figure 2). When the arrangement of the interval L-type conductive linear bodies 22 is unequal intervals, the average value of the distance between all adjacent conductive linear bodies 22 is obtained, but from the viewpoint of easily controlling the value of the interval L, light is worn. From the viewpoint of ensuring the uniformity of the function such as permeability and heat generation, the conductive linear bodies 22 are preferably arranged at slightly equal intervals in the sheet-like structure 20.

The diameter D of the conductive linear body 22 is preferably 5 μm to 75 μm, more preferably 8 μm to 60 μm, still more preferably 12 μm to 40 μm. When the diameter D of the conductive linear body 22 is 5 μm to 75 μm, the sheet resistance increase of the sheet-like structure 20 can be suppressed. Further, the thickness of the resin protective layer 30 is not excessively thick, and after the sheet 10 is three-dimensionally formed and coated on the surface of the molded article, the conductive linear body 22 is buried in a layer adjacent to the resin protective layer 30 side (the adhesive layer 32). In the resin protective layer or the like, the surface of the resin protective layer 30 may be prevented from expanding in the portion where the conductive linear body 22 exists. In the case where the conductive linear body 22 is a wave-shaped linear body, the linear shape of the conductive linear body 22 of the wave shape when the sheet 10 is three-dimensionally formed is adjacent to the layer (the adhesive layer 32, etc.). Obstruction and become difficult. In particular, when the diameter D of the conductive linear body 22 is 12 μm or more, the sheet resistance of the sheet-like structure 20 is easily lowered. When the surface of the molded article of the heat-generating sheet for three-dimensional molding is used as the sheet 10, it is easy to recognize that the conductive protective layer 30 is swollen by the conductive linear body 22. However, when the heat-generating sheet for three-dimensional molding is used, it is avoided. It is easy for the resin protective layer 30 to expand.

The diameter D of the conductive linear body 22 was observed by using a digital microscope, and the conductive linear body 22 of the sheet-like structure 20 was observed. The diameter of the conductive linear body 22 was measured at five points which were not intentionally selected, and the average value was measured.

The volume resistivity R of the conductive linear body 22 is preferably 1.0 × 10 ^-9 Ω ‧ m - 1.0 × 10 ^-3 Ω ‧ m, more preferably 1.0 × 10 ^-8 Ω ‧ m - 1.0 × 10 ^-4 Ω‧m. When the volume resistivity R of the conductive linear body 22 is in the above range, the sheet resistance similar to the sheet structure 20 is easily lowered.

The measurement of the volume resistivity R of the conductive linear body 22 is as follows. First, the diameter D of the conductive linear body 22 is obtained in accordance with the above method. Next, silver paste was applied to both ends of the conductive linear body 22, and the electric resistance of the portion having a length of 40 mm was measured to obtain the electric resistance value of the conductive linear body 22. Then, a columnar conductive linear body 22 having a diameter D is assumed, and the cross-sectional area of the conductive linear body 22 is calculated, and the measured length is multiplied as a volume. The volume resistivity R of the conductive linear body 22 was calculated by dividing the obtained resistance value by the volume.

When the conductive linear body 22 is electrically conductive, it is not particularly limited, and examples thereof include a linear body including a metal wire, a linear body including a conductive wire (Conductive Yarns), and the like. The conductive linear body 22 may be a linear body (twisted: a linear body of a metal wire and a conductive wire) including a metal wire and a conductive wire.

Here, as will be described later, when the conductive linear body 22 is formed into a wave-shaped linear body, and the sheet 10 is stretched in three dimensions, the conductive linear body 22 is linearized, and the sheet 10 is followed. When the conductive linear body 22 is also stretched and the conductive linear body 22 and the adhesive layer 32 are strongly adhered, the elongation of the conductive linear body 22 is hindered. When the linear body including the metal wire or the linear body including the conductive wire is used as the conductive linear body 22, the conductive linear body 22 and the adhesive layer 32 are appropriately followed. Therefore, following the elongation of the three-dimensionally formed sheet 10, the waveguide-shaped conductive linear body 22 is linearly elongated, and the conductive linear body 22 is also easily peeled off from the adhesive layer 32, and the conductive linear body can be easily generated. 22 elongation.

Since the linear body including the metal wire and the linear body including the conductive wire have high thermal conductivity and high electrical conductivity, when used as the conductive linear body 22, the surface resistance of the sheet-like structure 20 can be reduced. At the same time, it becomes easy to improve light penetration. Moreover, it is easier to achieve rapid heating. Further, as described above, it is easy to obtain a linear body having a small diameter.

Examples of the metal wire include a metal such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, or the like, or an alloy containing two or more kinds of metals (for example, steel or brass such as stainless steel or carbon steel). , phosphor bronze, zirconium copper, beryllium copper, iron nickel, nickel chromium, nickel titanium, kantal (kanthal: iron chrome aluminum heat resistant material), Hastelloy, tantalum tungsten, etc. Wire. Further, the metal wire may be a plated material such as tin, zinc, silver, nickel, chromium, nichrome, or antimony tin, or may be coated with a carbon material or a polymer described later.

The metal wire may be a metal wire covered with a carbon material. When the metal wire is coated with a carbon material, the adhesion to the adhesive layer 32 is lowered. Therefore, when a linear body including a metal wire coated with a carbon material is used as the conductive linear body 22, the elongation of the three-dimensionally formed sheet 10 is followed, and even if the wave-shaped conductive linear body 22 is linearly elongated, The conductive linear body 22 is also easily peeled off from the adhesive layer 32, and the elongation of the conductive linear body 22 can be easily generated. Further, when the metal wire is coated with a carbon material, corrosion of the metal can be suppressed.

Examples of the carbon material covering the metal wire include amorphous carbon such as carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber; graphite; fullerene; graphene;

Further, the linear body including the conductive wire may be a linear body formed of one conductive wire, or may be a linear body in which a plurality of conductive wires are twisted. Examples of the conductive wire include a wire containing a conductive fiber (a metal fiber, a carbon fiber, or an ion conductive polymer fiber), a surface plated or a wire on which a metal (copper, silver, nickel, or the like) is vapor-deposited, or a metal oxide impregnated. Line and so on.

A linear body including a conductive wire, in particular, a linear body including a wire using a carbon nanotube (hereinafter also referred to as "nanocarbon line-like body") is suitable. The nanocarbon line-like body is, for example, a carbon nanotube forest (a carbon nanotube forest (the carbon nanotubes are aligned in the vertical direction to form a plurality of grown lengths on the substrate, sometimes referred to as an "array"). In the case of the case, the carbon nanotubes are pulled out into a sheet shape, and the drawn carbon nanotube sheets are bundled, and the carbon nanotube bundles are twisted. In such a manufacturing method, when twisting is not applied, a ribbon-shaped nanocarbon line-like body can be obtained, and when twisted, a linear linear body can be obtained. The ribbon-shaped nanocarbon line-like body is a linear body having no structure in which a carbon nanotube is twisted. Further, a nanocarbon line-like body can also be obtained by spinning a dispersion of a carbon nanotube or the like. The production of a nanocarbon line-like body by spinning can be carried out, for example, by the method disclosed in U.S. Patent Publication No. US-A-2011-516140 (JP-A-2011-253140). From the viewpoint of obtaining the uniformity of the diameter of the nanocarbon line-like body, it is preferable to use a linear nanocarbon line-like body, and from the viewpoint of obtaining a high-purity nanocarbon line-like body, by twisting the nanometer The carbon tube sheet is preferably a linear nanocarbon line-like body. The nanocarbon line-like body may be a linear body in which two or more nanocarbon line-like bodies are woven with each other.

The nanocarbon line-like body may be a linear body including a carbon nanotube and a metal (hereinafter also referred to as a "composite linear body"). The composite linear system maintains the above characteristics of the nanocarbon line-like body and at the same time easily improves the conductivity of the linear body. In other words, it becomes easy to reduce the electric resistance similar to the sheet structure 20.

As the composite linear body, for example, (1) the carbon nanotubes are pulled out into a sheet shape from the end of the carbon nanotube bundle, and the drawn carbon nanotube sheets are bundled to obtain a twisted carbon nanotube bundle. In the process of the nanocarbon line-like body, the metal monomer or metal alloy is vapor-deposited, ion-plated, sputtered, wet-plated, etc., carried on a carbon nanotube bundle, a sheet or a bundle, or twisted. a composite linear body on the surface of the stranded linear body; (2) a composite linear body formed by twisting a bundle of carbon nanotubes together with a linear body of a metal monomer or a linear body or a composite linear body of a metal alloy; (3) A linear body in which a linear body of a metal monomer or a linear body or a composite linear body of a metal alloy is woven with a nanocarbon line-like body or a composite linear body. Further, in the composite linear body of (2), when the twisted carbon nanotube bundle is twisted, the carbon nanotube may be carried by the metal in the same manner as the composite linear body of (1). Further, in the composite linear system of (3), a composite linear body in which two linear bodies are knitted is used, but a linear body or a linear body of a metal alloy or a composite linear body is required as long as it contains at least one metal monomer. Further, it is also possible to knit a linear body of a nano carbon line or a linear body of a metal monomer or a linear body of a metal alloy or a composite linear body. The metal of the composite linear body may, for example, be a metal monomer such as gold, silver, copper, iron, aluminum, nickel, chromium, tin or zinc, or an alloy containing at least one of these metal monomers (copper-nickel-phosphorus). Alloy, copper-iron-phosphorus-zinc alloy, etc.).

(Resin Protective Layer) The resin protective layer 30 is a layer that forms the surface of the sheet 10 after the sheet 10 is three-dimensionally formed and coated on the molded article. In other words, the resin protective layer 30 protects the similar sheet structure 20, the functional layer (heat conductive layer, colored layer, decorative layer, etc.) provided between the resin protective layer 30 and the similar sheet structure 20, and improves the strength of the surface of the sheet 10, Maintain layers for functions and so on.

The resin protective layer 30 is preferably a thermoplastic resin from the viewpoint of three-dimensional formability. The thermoplastic resin may, for example, be a polyolefin resin, a polyester resin, a polyacryl resin, a polystyrene resin, a polyimide resin, a polyamidamine resin, a polyamide resin, a polyurethane resin, or the like. A conventional resin such as a polycarbonate resin, a polyarylate resin, a melamine resin, an epoxy resin, a urethane resin, a oxime resin, or a fluororesin, or a mixed resin of two or more kinds thereof.

The resin protective layer 30 is preferably a thermosetting resin from the viewpoint of surface protection. The thermosetting resin may, for example, be a known composition such as an epoxy resin composition, a resin composition which is cured by a carbamate reaction, or a resin composition which is cured by a radical polymerization reaction.

Examples of the epoxy resin composition include a polyfunctional epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin, a biphenyl epoxy resin, and a dicyclopentadiene epoxy resin. An oxygen resin is combined with a curing agent such as an amine compound or a phenolic curing agent. The resin composition which is hardened by the carbamide reaction may, for example, be a resin composition containing a (meth)acryl fluorenyl polyol and a polyisocyanate compound. The resin composition which is hardened by a radical polymerization reaction may, for example, be a radically polymerizable resin composition such as a (meth) acrylonitrile group or an unsaturated polyester, and may, for example, have a radical polymerizable group in a side chain. (meth)acrylic resin (a polymer having a reactive group of a vinyl monomer (hydroxy (meth) acrylate, glycidyl (meth) acrylate, etc.), and having a copolymer a monomer having a radical polymerizable group and a (meth)acrylic resin which reacts with a (meth)acrylic acid or a (meth)acrylate containing an isocyanate group), and a ring The epoxy resin has a (meth)acryloyl group-based epoxy acrylate which reacts with (meth)acrylic acid or the like, and an unsaturated polyester which condenses a carboxylic acid (fumaric acid or the like) having an unsaturated group with a diol. Wait.

The resin protective layer 30 may contain a thermally conductive inorganic filler. When the resin protective layer 30 contains a thermally conductive inorganic filler, when the sheet 10 is used as a heat-generating sheet for three-dimensional molding, it is possible to more effectively prevent uneven temperature rise on the surface (uneven distribution of temperature rise).

The thermally conductive inorganic filler is not particularly limited as long as it has an inorganic filler having a thermal conductivity of 10 W/mK or more, and examples thereof include metal particles, metal oxide particles, metal hydroxide particles, and metal nitride particles. . Specific examples of the thermally conductive inorganic filler include silver particles, copper particles, aluminum particles, nickel particles, zinc oxide particles, alumina particles, aluminum nitride particles, cerium oxide particles, magnesium oxide particles, and aluminum nitride particles. Conventional inorganic particles such as titanium particles, boron nitride particles, cerium nitride particles, cerium carbide particles, diamond particles, graphite particles, carbon nanotube particles, metal cerium particles, carbon fiber particles, fullerene particles, and glass particles . The thermally conductive inorganic filler may be used singly or in combination of two or more.

The content of the thermally conductive inorganic filler is preferably from 1% by mass to 90% by mass, more preferably from 2% by mass to 70% by mass, even more preferably from 5% by mass to 50% by mass, based on the entire resin protective layer.

The resin protective layer 30 may contain a colorant. When the resin protective layer 30 contains a coloring agent and the resin protective layer 30 is used as a colored layer, the concealability of the conductive linear body 22 can be improved. The coloring agent is not particularly limited, and conventional coloring agents such as inorganic pigments, organic pigments, and dyes can be used for the purpose of blending.

The resin protective layer 30 may also contain other additives. Examples of other additives include a curing agent, an anti-aging agent, a photostabilizer, a flame retardant, a conductive agent, an antistatic agent, a plasticizer, and the like.

In the surface of the resin protective layer 30 on the side similar to the sheet structure 20, an image (for example, an image of a figure, a character, a pattern, a pattern, or the like) can be formed by an image forming material (ink, toner, or the like). As the method of forming the image, a conventional printing method such as gravure printing, lithography, screen printing, inkjet printing, or thermal transfer printing can be used. At this time, the resin protective layer 30 functions as a decorative layer and has a function of protecting the decoration of the image. Then, at this time, the sheet 10 can be used as a three-dimensional decorative sheet.

The thickness of the resin protective layer 30 is preferably from 8 μm to 2500 μm, more preferably from 10 μm to 2300 μm, still more preferably from 15 μm to 2000 μm, from the viewpoints of three-dimensional moldability and protection of the resin protective layer 30.

(Adhesive Layer) The subsequent agent layer 32 is a layer containing an adhesive. The surface of the molded article of the sheet 10 is coated with the adhesive layer 32 by the adhesive sheet 32 between the resin protective layer 30 and the similar sheet structure 20 and in contact with the sheet-like structure 20, with the sheet 10 attached to the adhesive layer 32. It's easy. Specifically, as described above, in the sheet 10, the adhesion of the sheet 10 to the surface of the molded article is facilitated by the adhesive layer 32 exposed from the sheet-like structure 20 (the plurality of conductive linear bodies 22).

The subsequent agent layer 32 can also be hardenable. By the adhesive layer hardening, the sufficient hardness required to protect the sheet-like structure 20 is imparted to the adhesive layer 32. Further, the adhesiveness of the adhesive layer 32 after curing is improved, and deformation of the adhesive layer 32 after hardening due to punching can be suppressed.

The energy layer hardenability of the ultraviolet ray, visible light energy ray, infrared ray, electron beam or the like is preferably from the viewpoint that the agent layer 32 can be hardened in a short time and easily. Further, "energy line hardening" also includes thermal hardening using heating of an energy ray. The curing condition by the energy ray varies depending on the energy line used. For example, when the curing is performed by ultraviolet irradiation, the ultraviolet ray irradiation amount is 10 mJ/cm ² to 3,000 mJ/cm ² , and the irradiation time is 1 second to 180 seconds. good.

The adhesive of the adhesive layer 32 may be an adhesive which exhibits adhesiveness by heat, which is a type of heat sealing, and the like, and the adhesive layer (adhesive property) is applied. The adhesive layer formed by the subsequent agent is preferred. The adhesive of the adhesive layer is not particularly limited. Examples of the adhesive include an acrylic adhesive, an urethane-based adhesive, a rubber-based adhesive, a polyester-based adhesive, a bismuth-based adhesive, and a polyvinyl ether-based adhesive. Among these, the adhesive is preferably at least one selected from the group consisting of an acrylic pressure-sensitive adhesive, an urethane-based pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive, and more preferably an acrylic pressure-sensitive adhesive.

The acrylic adhesive may, for example, be a polymer comprising a constituent unit derived from an alkyl (meth) acrylate having a linear alkyl group or a branched alkyl group (in other words, polymerization of at least a polymerized alkyl (meth) acrylate). And an acrylic polymer containing a constituent unit derived from a (meth) acrylate having a cyclic structure (in other words, a polymer which polymerizes at least a (meth) acrylate having a cyclic structure). Here, "(meth) acrylate" is used as a term indicating both "acrylate" and "methacrylate", and the other similar terms are also the same.

When the acrylic polymer is a copolymer, the form of copolymerization is not particularly limited. The acrylic copolymer may be any of a block copolymer, a random copolymer, or a graft copolymer.

Among these, the acrylic adhesive contains an alkyl (meth) acrylate (a1') derived from a chain alkyl group having 1 to 20 carbon atoms (hereinafter also referred to as "monomer component (a1'). The structural unit (a1) and the acrylic copolymer derived from the structural unit (a2) of the functional group-containing monomer (a2') (hereinafter also referred to as "monomer component (a2')") are preferred. Further, the acrylic copolymer may further contain a constituent unit (a3) derived from the monomer component (a3') and the monomer component (a3') other than the monomer component (a2').

The carbon number of the chain alkyl group which the monomer component (a1') has is preferably from 1 to 12, more preferably from 4 to 8, more preferably from 4 to 6 from the viewpoint of improving the adhesion property. Examples of the monomer component (a1') include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and n-butyl (meth) acrylate. Ethylhexyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, octadecyl (meth) acrylate, and the like. Among these monomer components (a1'), butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable, and butyl (meth) acrylate is more preferable.

The content of the constituent unit (a1) is preferably 50% by mass to 99.5% by mass, more preferably 55% by mass to 99% by mass, even more preferably the total constituent unit (100% by mass) of the acrylic copolymer. It is 60% by mass to 97% by mass, and more preferably 65% by mass to 95% by mass.

Examples of the monomer component (a2') include a monomer having a hydroxyl group, a monomer having a carboxyl group, a monomer containing an epoxy group, a monomer having an amine group, a monomer having a cyano group, and a monomer having a ketone group. a monomer, a monomer containing an alkoxycarbenyl group, and the like. Among these monomer components (a2'), a monomer having a hydroxyl group and a monomer having a carboxyl group are preferred. Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl group. (Meth) acrylate, 4-hydroxybutyl (meth) acrylate, etc., preferably 2-hydroxyethyl (meth) acrylate. Examples of the monomer having a carboxyl group include (meth)acrylic acid, maleic acid, fumaric acid, and econic acid, and (meth)acrylic acid is preferred. Examples of the epoxy group-containing monomer include a glycidyl (meth)acrylate and the like. Examples of the amino group-containing monomer include diaminoethyl (meth) acrylate and the like. Examples of the cyano group-containing monomer include acrylonitrile and the like.

The content of the constituent unit (a2) is preferably from 0.1% by mass to 50% by mass, more preferably from 0.5% by mass to 40% by mass, based on the total constituent unit (100% by mass) of the acrylic copolymer. It is 1.0% by mass to 30% by mass, and more preferably 1.5% by mass to 20% by mass.

Examples of the monomer component (a3') include cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isodecyl (meth) acrylate, and dicyclopentyl (meth) acrylate. Dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, quinone imine (meth) acrylate, cyclic structure having acryloyl morpholine or the like ( Methyl) acrylate; vinyl acetate; styrene, and the like.

The content of the constituent unit (a3) is preferably from 0% by mass to 40% by mass, more preferably from 0% by mass to 30% by mass, based on the total constituent unit (100% by mass) of the acrylic copolymer. It is 0% by mass to 25% by mass, and more preferably 0% by mass to 20% by mass.

In addition, the monomer component (a1') may be used singly or in combination of two or more kinds, and the monomer component (a2') may be used alone or in combination of two or more. The monomer component (a3') may be used alone or in combination of two or more. Used above.

The acrylic copolymer can be crosslinked by a crosslinking agent. Examples of the crosslinking agent include a known epoxy crosslinking agent, an isocyanate crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent. When the acrylic copolymer is crosslinked, it can be used as a crosslinking point at which a functional group derived from the monomer component (a2') reacts with a crosslinking agent.

The adhesive layer may contain an energy ray-curable component in addition to the above adhesive. When the energy ray-curable component is, for example, an ultraviolet ray, the trimethylolpropane tri(meth) acrylate, the ethoxylated iso-cyanuric acid tri(meth) acrylate, or the bis- Trimethylolpropane tetra(meth)acrylate, tetramethylolmethanetetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol (Meth) acrylate, caprolactone modified dipentaerythritol hexa(meth) acrylate, 1,4-butanediol di(meth) acrylate, 1,6-hexanediol di(meth)acrylic acid Ester, dicyclopentadienyl dimethoxy di(meth) acrylate, polyethylene glycol di(meth) acrylate, oligoester (meth) acrylate, urethane (meth) acrylate A compound such as an ester oligomer, an epoxy-modified (meth) acrylate or a polyether (meth) acrylate, or a compound having two or more ultraviolet-polymerizable functional groups in one molecule. The energy ray-hardening component may be used singly or in combination of two or more.

When an acrylic adhesive is used as the adhesive, the energy ray-curable component may have a functional group and an energy which react with a functional group derived from the monomer component (a2') in the acrylic copolymer. A compound having a linear polymerizable functional group. By the reaction of the functional group of the compound with the functional group derived from the monomer component (a2') in the acrylic copolymer, the side chain of the acrylic copolymer becomes polymerizable by irradiation with an energy ray. The adhesive is a copolymer component other than the copolymer of the adhesive, in addition to the acrylic adhesive, and similarly, a component in which the side chain is energy ray polymerizable can be used.

In the case where the adhesive layer is energy ray hardenable, the adhesive layer may contain a photopolymerization initiator. By the photopolymerization initiator, the rate at which the adhesive layer is hardened by the irradiation of the energy ray can be increased. Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzoin. Benzoic acid, benzoin methyl benzoate, benzoin dimethyl acetal, 2,4-diethyl thioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethyl Kithiram monosulfide, azobisisobutyronitrile, benzyl, bibenzyl, diethylidene, 2-chloroindole, 2,4,6-trimethylbenzhydryldiphenylphosphine oxide , 2-benzothiazole-N,N-diethyldithiocarbamate (Dithiocarbamates), oligomeric {2-hydroxy-2-methyl-1-[4-(1-propenyl) Phenyl]acetone}.

The subsequent agent layer 32 may also contain an inorganic filler. By containing an inorganic filler, the hardness of the adhesive layer 32 after hardening can be further improved. Moreover, the thermal conductivity of the adhesive layer 32 is improved. Further, when the adherend is made of glass as a main component, the coefficient of linear expansion of the sheet 10 and the adherend can be approximated, whereby the reliability of the device in which the sheet 10 is adhered to the adherend and, if necessary, hardened can be improved. .

Examples of the inorganic filler include a powder of cerium oxide, aluminum oxide, talc, calcium carbonate, titanium white, iron oxide red, cerium carbide, boron nitride, or the like; beads which are spheroidized; single crystal Fiber; glass fiber, etc. Among these, as the inorganic filler, a cerium oxide filler and an alumina filler are preferred. Further, the adhesive layer 32 may contain a thermally conductive inorganic filler which may be contained in the resin protective layer 30 as an inorganic filler. At this time, the same effect as in the case of the intermediate resin layer 36 in which the heat conductive layer is provided will be obtained. The inorganic filler may be used singly or in combination of two or more.

The inorganic filler is preferably surface-modified (coupling) by a compound having a curable functional group. Examples of the curable functional group include a hydroxyl group, a carboxyl group, an amine group, a glycidyl group, an epoxy group, an ether group, an ester group, and a group having an ethylenically unsaturated bond. Examples of the compound having such a curable functional group include a decane coupling agent and the like.

The inorganic filler is an energy ray-curable functional group having a group such as an ethylenically unsaturated bond, from the viewpoint of the deterioration resistance of the adhesive layer 32 (the strength of the adhesive layer 32 after curing) The compound is preferably surface modified. Examples of the group having an ethylenically unsaturated bond include a vinyl group, a (meth) acrylonitrile group, and a maleimide group. From the viewpoint of high reactivity or versatility, (meth) is preferred. Acryl sulfhydryl. When the inorganic filler having a surface-modified compound having an energy ray-curable functional group is subjected to three-dimensional molding, for example, the sheet 10 is coated on the surface of the molded article, the cured adhesive layer 32 is strengthened. Further, when the adhesive layer 32 contains a surface-modified inorganic filler, the adhesive layer 32 preferably contains an energy ray-curable component.

The average particle diameter of the inorganic filler is preferably 1 μm or less, more preferably 0.5 μm or less. When the average particle diameter of the inorganic filler is in this range, the light transmittance of the adhesive layer 32 is easily improved, and further, the haze of the sheet 10 (i.e., the adhesive layer 32) can be easily lowered. The lower limit of the average particle diameter of the inorganic filler is not particularly limited, but is preferably 5 nm or more. Further, the average particle diameter of the inorganic filler was measured by a digital microscope to observe 20 inorganic fillers, and the average diameter of the largest diameter and the smallest diameter of the inorganic filler was measured as a diameter, and the average value was obtained.

The content of the inorganic filler is preferably from 0% by mass to 95% by mass, more preferably from 5% by mass to 90% by mass, even more preferably from 10% by mass to 80% by mass, based on the entire adhesive layer 32.

The pencil hardness of the adhesive layer 32 after hardening is preferably HB or more, more preferably F or more, still more preferably H or more. Thereby, the function of the adhesive-like adhesive layer 32 to protect the sheet-like structure 20 is further enhanced, and the sheet-like structure 20 can be more sufficiently protected. Further, the pencil hardness is a value measured in accordance with JIS K5600-5-4.

The subsequent agent layer 32 may also contain a colorant. Thereby, the same effect as the case of providing the intermediate resin layer 36 of the colored layer described later can be obtained.

The subsequent layer 32 may also contain other components. Other components include, for example, an organic solvent, a flame retardant, an adhesion-imparting agent, an ultraviolet absorber, an antioxidant, a preservative, a mold inhibitor, a plasticizer, an antifoaming agent, and a wettability adjuster.

The thickness of the subsequent agent layer 32 is preferably from 3 μm to 150 μm, more preferably from 5 μm to 100 μm, from the viewpoint of adhesion.

(Release Layer) The release layer 34 has a function of protecting the sheet-like structure 20 and the adhesive layer 32 exposed by the sheet-like structure 20 (the plurality of conductive linear bodies 22) before the three-dimensional molding of the sheet 10. By providing the peeling layer 34, it is possible to suppress breakage of the similar sheet structure 20 due to the operation and reduction in the subsequent energy of the adhesive layer 32. Then, when the sheet 10 is three-dimensionally formed, the peeling layer 34 is peeled off from the sheet 10.

The peeling layer 34 is not particularly limited. For example, from the viewpoint of ease of handling, the release layer 34 preferably includes a release substrate and a release agent layer formed by applying a release agent to the release substrate. Further, the release layer 34 may be provided with a release agent layer only on one side of the release substrate, or may have a release agent layer on both surfaces of the release substrate. Examples of the release substrate include a paper base material, a laminated paper in which a thermoplastic resin (such as polyethylene) is laminated on a paper base material, a plastic film, or the like. Examples of the paper substrate include cellophane, coated paper, cast coated paper, and the like. Examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefin films such as polypropylene and polyethylene. Examples of the release agent include an olefin resin, a rubber elastomer (for example, a butadiene resin or an isoprene resin), a long-chain alkyl resin, an alkyd resin, a fluorine resin, and a ruthenium resin. Wait.

The thickness of the peeling layer 34 is not particularly limited. Usually, the thickness of the peeling layer 34 is preferably 20 μm to 200 μm, more preferably 25 μm to 150 μm. The thickness of the release agent layer of the release layer 34 is not particularly limited. When the solution containing the release agent is applied to form the release agent layer, the thickness of the release agent layer 34 is preferably from 0.01 μm to 2.0 μm, more preferably from 0.03 μm to 1.0 μm. When a plastic film is used as the release substrate, the thickness of the plastic film is preferably from 3 μm to 150 μm, more preferably from 5 μm to 100 μm.

(The characteristics of the sheet, etc.) The sheet 10 of the present embodiment is provided on the surface of the sheet-like structure 20 having the side of the resin protective layer 30 (hereinafter also referred to as "the surface layer of the sheet-like structure 20"). The total thickness is 1.5 to 80 times the diameter of the conductive linear body 22. More preferably 3 to 40 times, and even more preferably 5 to 20 times.

Since the total thickness of the surface layer of the sheet-like structure 20 is 1.5 times or more the diameter of the conductive linear body 22, the sheet 10 is three-dimensionally formed and coated on the surface of the molded article, and the conductive linear body 22 is buried. In the layer adjacent to the side of the resin protective layer 30 (the adhesive layer 32, the resin protective layer 30, etc.), the portion of the resin protective layer 30 (in other words, the surface of the sheet) can also be avoided in the portion where the conductive linear body 22 exists. The situation of expansion. Further, when the sheet 10 is used as a heat generating sheet, the heat generation efficiency similar to the surface of the sheet structure 20 is improved.

The total thickness of the surface layer of the sheet-like structure 20 is preferably 80 times or less the diameter of the conductive linear body 22. Thereby, when the sheet 10 is used as a heat generating sheet, the heat generating sheet is excellent in heat generation efficiency and suppresses the expansion of the sheet surface.

Here, the surface layer of the sheet-like structure 20 corresponds to another layer (the adhesive layer 32, another resin layer, etc.) provided between the resin protective layer 30 and the resin protective layer 30 and the sheet-like structure 20, and It corresponds to a layer (peeling layer or the like) provided on the surface of the sheet-like structure 20 similar to the side opposite to the side having the resin protective layer 30.

Further, the thickness of the surface layer similar to the sheet 20 means that part or all of the sheet-like structure 20 (the conductive linear body 22) is buried in a layer adjacent to the side having the resin protective layer (this embodiment) In the case of the adhesive layer 32 or the like, the thickness of the region in which the sheet structure 20 (the conductive linear body 22) is not buried is similar. Further, the thickness of each layer constituting the surface layer similar to the sheet 20 is also the same.

In the sheet 10, the ratio of the thickness of the resin protective layer 30 to the thickness of the adhesive layer 32 (the thickness of the resin protective layer 30 / the thickness of the adhesive layer 32) is preferably from 1/1 to 100/1, more preferably 2 /1~50/1, and more preferably 3/1~20/1.

When the sheet 10 is three-dimensionally formed and coated on the molded article, the conductive linear body 22 may be embedded not only in the adhesive layer 32 but also in a layer other than the surface layer constituting the adhesive layer 32 (resin protective layer 30). Wait). Therefore, the surface layer thickness is preferred, but the means for increasing the thickness of the surface layer not only depends on increasing the thickness of the adhesive layer. Therefore, it is not necessary to consider the embedding of the conductive linear body 22, increase the thickness of the adhesive layer 32, and it is preferable that the adhesive layer 32 is not too thick in consideration of the durability of the sheet 10 after three-dimensional molding. Therefore, the ratio of the thickness of the resin protective layer 30 to the thickness of the adhesive layer 32 is preferably in the above range.

In the sheet 10, when the conductive linear body 22 is a linear body including a metal wire coated with a carbon material, the peeling force of the adhesive layer 32 is adhered to the stainless steel plate, and the peeling is performed after 30 minutes. The force is preferably 12 N/25 mm or more. When the metal wire is coated with a carbon material, the adhesion to the adhesive layer 32 is lowered. Therefore, in the production of the sheet 10, when the linear body including the metal wire is pushed out and fixed on the surface of the adhesive layer 32, the linear body including the metal wire is easily peeled off from the adhesive layer 32. Therefore, the peeling force is set to 12 N/25 mm or more, and it is preferable to use the adhesive layer 32 which has a strong adhesiveness. Further, the peeling force of the adhesive layer 32 at this time is more preferably 13 N/25 mm or more. However, the upper limit of the peeling force of the adhesive layer 32 is preferably 35 N/25 mm or less.

Further, in the sheet 10, when the conductive linear body 22 is a linear body including a conductive wire, the peeling force of the adhesive layer 32, and the adhesive layer 32 is adhered to the stainless steel plate, and the peeling force after 30 minutes is preferably used. It is 11N/25mm or less. Therefore, when the peeling force is 11 N/25 mm or less, the elongation of the three-dimensionally formed sheet 10 is traced by using the adhesive layer 32 having a weak adhesion, and the wave-shaped conductive linear body 22 is linearly elongated. The conductive linear body 22 is also easily peeled off from the adhesive layer 32, and the elongation of the conductive linear body 22 can be easily generated. Further, the peeling force of the adhesive layer 32 at this time is more preferably 10 N/25 mm or less. However, the lower limit of the peeling force of the adhesive layer 32 is preferably 2 N/25 mm or less.

Here, the peeling force of each of the adhesive layers 32 described above is a value measured as follows. A surface layer (having a width of 25 mm) having the adhesive layer 32 was prepared so that the surface of the adhesive layer 32 was adhered to the surface of the stainless steel plate. In this state, a load was applied, and after 30 minutes passed, the 180° peel test prescribed in JIS-Z0237 (2000) was carried out. Specifically, the surface layer was pulled at a speed of 300 mm/min in the direction of 180° using a tensile tester, and the force required to peel the surface layer from the stainless steel sheet was measured by the peeling force of each of the above-mentioned adhesive layers 32. Further, the conditions under which the load is applied are also as described in the above JIS.

In the sheet 10 of the present embodiment, the sheet resistance (Ω/□ = Ω/sq.) of the sheet (which is similar to the sheet structure 20) is preferably 800 Ω/□ or less, more preferably 0.01 Ω/□ to 500 Ω/□. More preferably, it is 0.05 Ω/□~300 Ω/□. From the viewpoint of lowering the applied voltage, the sheet 10 having a low sheet resistance is required. When the sheet resistance of the sheet is 800 Ω/□ or less, it is easy to reduce the applied voltage.

Further, the sheet resistance of the sheet was measured in accordance with the following method. First, in order to improve the electrical connection, silver paste is applied to both ends of the sheet-like structure 20. Then, on the glass substrate to which the copper tape was adhered at both ends, the silver paste was brought into contact with the copper tape to adhere the sheet 10, and then the resistance was measured using an electric meter to calculate the sheet resistance of the sheet.

(Method for Producing Sheet) The method for producing the sheet 10 of the present embodiment is not particularly limited. The sheet 10 is produced, for example, by the following steps. First, a composition for forming the adhesive layer 32 is applied onto the resin protective layer 30 to form a coating film. Next, the coating film is dried to form the adhesive layer 32. Next, on the laminate (the adhesive layer 32) of the resin protective layer 30 and the adhesive layer 32, the conductive linear bodies 22 are arranged in an array to form a sheet-like structure 20. For example, in a state where the laminate of the resin protective layer 30 and the adhesive layer 32 is disposed on the peripheral surface of the roll member, the roll member is rotated, and the conductive linear body 22 is wound on the surface of the adhesive layer 32. Spiral. Then, the conductive linear body 22 wound in a spiral shape is cut in the axial direction of the winding member. Thereby, a sheet-like structure 20 is formed while being applied to the surface of the adhesive layer 32. Then, the laminate of the resin protective layer 30 and the adhesive layer 32 and the sheet-like structure 20 is taken out from the roll member. Further, the peeling layer 34 is adhered to the surface of the similar sheet structure on the side opposite to the side having the adhesive layer 32 in the laminated body after the removal. Further, the release layer 34 is placed on the surface of the sheet-like structure of the laminate in a state in which the release layer 34 is placed on the roll member. According to this method, for example, by rotating the reel member, the feeding portion of the conductive linear body 22 is moved in a direction parallel to the axis of the reel member, and the similar sheet structure 20 can be easily adjusted. The interval L between adjacent conductive linear bodies 22.

Further, the laminated body of the resin protective layer 30 and the adhesive layer 32 is not disposed on the peripheral surface of the roll member, and the conductive linear body 22 is arranged to form the sheet-like structure 20, and the obtained similar sheet structure 20 is obtained. A surface and a laminate of the resin protective layer 30 and the adhesive layer 32 (the adhesive layer 32) are bonded together, and the other surface of the sheet-like structure 20 and the peeling layer 34 are bonded to each other to form the sheet 10.

(Use of the sheet) The sheet 10 of the present embodiment is formed on the surface of a molded article such as a home appliance casing, a vehicle interior component, or a building material interior material, and is formed by three-dimensional molding such as TOM molding, film insert molding, or vacuum molding. The method is used to coat a molded article. The coating layer formed by the sheet 10 is a molded article formed by surface conduction, and can be used as a surface conductive article such as a curved touch panel, a heat-generating article for ice and snow melting (such as a lamp light-emitting portion), and a heating article for heating. It is used for surface heat-generating articles such as (the interior of a car, etc.).

As described above, the sheet 10 of the present embodiment prevents the adhesive layer 32 exposed by the sheet-like structure 20 from being hindered by the conductive linear body, and the conductive linear body can be formed to a certain degree. Therefore, when a molded article in which a surface conductor is formed is used as a surface heat-generating article, occurrence of uneven temperature rise on the surface can be prevented. For example, when the heat-generating article for ice and snow melting is a display body outside the house, the surface of the region where the conductive linear body 22 does not exist can be prevented from occurring in an undesired state in which the snow and ice melt remains. Further, for example, when it is used as a heat-generating sheet for heating which can be provided on the outermost surface of the molded article, it is possible to reduce the portion of the human body that is sensitive to the relative temperature between the linear bodies, and to use it in a comfortable state.

In addition, when the sheet 10 of the present embodiment is used as a heat-generating sheet for three-dimensional molding, it is not shown, but a power supply unit (electrode) that is supplied to the sheet-like structure 20 is used. The power supply portion is made of, for example, a metal material to be electrically connected to the end portion of the sheet-like structure 20 . The joining of the power feeding portion and the similar sheet structure 20 is performed by a known method such as welding by supplying power to the respective conductive linear bodies 22 of the sheet-like structure 20.

(Modification) The sheet 10 of the present embodiment is not limited to the above embodiment, and can be modified or improved. A modification of the sheet 10 of the present embodiment will be described below. In the following description, the same components as those of the sheet 10 of the present embodiment are denoted by the same reference numerals, and their description will be omitted or simplified.

- First Modification - The sheet 10 of the present embodiment is not limited to the above-described layer configuration, and may be another layer configuration. For example, as shown in FIG. 3, the sheet 10 is basically constituted by the layer illustrated in FIG. 2, and may have a resin layer 36 which is provided between the resin protective layer 30 and the adhesive layer 32 (hereinafter also referred to as "Intermediate resin layer 36"), 2) a resin layer 38 (hereinafter also referred to as "lower resin layer 38") provided on the surface of the sheet-like structure 20 opposite to the side having the resin protective layer 30, and 3) A sheet 11 of at least one layer of a peeling layer 40 (hereinafter also referred to as "upper peeling layer 40") provided on the surface of the resin protective layer 30 on the side opposite to the side having the sheet-like structure 20.

Moreover, FIG. 3 shows the sheet 11 further having the intermediate resin layer 36, the lower resin layer 38, and the upper peeling layer 40 in the sheet 10.

The intermediate resin layer 36 will be described. The intermediate resin layer 36 is, for example, a layer provided as a functional layer such as a heat conductive layer, a colored layer, a decorative layer, a primer layer, or a component migration preventing layer. The intermediate resin layer 36 may also be provided with a plurality of layers different from these functions. Further, the intermediate resin layer 36 may also be a single layer and have a plurality of functions.

For example, when the intermediate resin layer 36 is a heat conductive layer, the intermediate resin layer 36 is composed of, for example, a layer containing a thermally conductive inorganic filler and a thermoplastic resin. When the intermediate resin layer 36 is a heat conductive layer, it is possible to more effectively prevent the occurrence of uneven temperature rise on the surface when the sheet 10 is used as a heat generating sheet for three-dimensional molding. Further, when the intermediate resin layer 36 is a colored layer, the intermediate resin layer 36 is composed of, for example, a layer containing a colorant and a thermoplastic resin. When the intermediate resin layer 36 is a colored layer, the concealability of the conductive linear body 22 is improved. At this time, a layer having light transparency can also be used as the resin protective layer 30. Further, when the intermediate resin layer is a decorative layer, a resin layer (for example, containing heat) which forms an image (for example, an image of a picture, a character, a pattern, a pattern, or the like) on the surface by an image forming material (ink, carbon powder, or the like) may be used. It is composed of a layer of a plastic resin. A method of forming an image may be a conventional printing method such as gravure printing, lithography, screen printing, inkjet printing, or thermal transfer printing. When the intermediate resin layer is a decorative layer, the sheet 11 can be used as a three-dimensional decorative sheet. Further, at this time, a layer having light transparency can be used as the resin protective layer 30.

Further, the respective components and other components constituting the intermediate resin layer 36 are the same as those of the resin protective layer 30.

The thickness of the intermediate resin layer 36 is preferably from 5 to 1300 μm, more preferably from 10 to 1,000 μm, still more preferably from 15 to 900 μm, from the viewpoints of the three-dimensional formability and the functions of the resin protective layer 30.

Here, the layer (colored layer) containing the colorant is not limited to the intermediate resin layer 36, and can be applied to at least any one of the layers constituting the surface of the similar sheet structure 20 provided on the side having the resin protective layer 30. Further, the layer (heat-conductive layer) containing the thermally conductive inorganic filler is not limited to the intermediate resin layer 36, and can be applied to at least one layer constituting the layer provided on the surface of the similar sheet structure 20 having the side of the resin protective layer 30. . Further, the decorative layer is not limited to the intermediate resin layer 36, and can be applied to at least one of the layers constituting the surface of the similar sheet structure 20 provided on the side having the resin protective layer 30.

The lower resin layer 38 will be described. When the sheet 11 is three-dimensionally formed and coated on the surface of the molded article, the lower resin layer 38 thermally bonds the sheet 11 to the resin layer for the surface of the molded article. In particular, the sheet 11 having the lower resin layer 38 is suitable for the film embedding method among the three-dimensional forming methods.

The lower resin layer 38 is, for example, suitable for a layer containing a thermoplastic resin. The components and other components constituting the intermediate resin layer 36 are the same as those of the resin protective layer 30. In particular, the lower resin layer 38 has a layer made of a polyolefin such as polypropylene and a layer made of an acrylonitrile-butadiene-styrene copolymer, from the viewpoint of improving the heat viscosity of the molded article. good.

The thickness of the lower resin layer 38 is preferably from 5 to 1300 μm, more preferably from 10 to 1,000 μm, still more preferably from 15 to 900 μm, from the viewpoint of improving the heat adhesion of the molded article.

The upper peeling layer 40 is illustrated. The upper peeling layer 40 has a function of protecting the resin protective layer 30 before three-dimensional molding and three-dimensional molding. The upper peeling layer 40 is peeled off from the sheet 11 after being three-dimensionally formed. In particular, the sheet 11 having the upper peeling layer 40 is suitable for the film embedding method among the three-dimensional forming methods. Further, the upper peeling layer 40 may be peeled off from the sheet 11 before three-dimensional molding, if necessary. When the upper peeling layer 40 is resistant to heating at the time of three-dimensional molding, it is not particularly limited, and the same configuration as that of the peeling layer 34 is exemplified. In particular, the upper release layer 40 is preferably a layer made of a heat-resistant resin film from the viewpoint of the protective function of the resin protective layer 30 and the resistance to heat during three-dimensional molding.

Further, in the sheet 10 of the present embodiment, for example, a surface of the sheet-like structure 20 on the side opposite to the side having the adhesive layer 32 may be provided with another adhesive layer, or may be On the surface of the other adhesive layer having the side opposite to the side of the sheet structure 20, a state of another peeling layer or the like is provided.

- Second Modification - The sheet 10 of the present embodiment, for example, as shown in Fig. 4, the conductive linear body 22 similar to the sheet structure 20 may be a periodic or irregularly bent or bent sheet 12 . Specifically, the conductive linear body 22 may have a wave shape such as a sine wave, a rectangular wave, a triangular wave, or a sawtooth wave. In other words, the sheet-like structure 20 may have a structure in which the conductive linear bodies 22 extending in one wave shape are arranged at equal intervals in a direction orthogonal to the direction in which the conductive linear bodies 22 extend.

Moreover, FIG. 4 shows a sheet 12 having a sheet-like conductive body 22 having a wave shape extending in a direction perpendicular to the direction in which the conductive linear body 22 extends, and a similar sheet structure 20 arranged at equal intervals. .

As the conductive linear body 22, the sheet 12 is three-dimensionally formed by using a corrugated linear body, and when it is coated on the surface of the molded article, the elongation of the sheet 12 is followed, and in the extending direction of the conductive linear body 22, The waveguide-shaped conductive linear body 22 is linearized and can be easily elongated. Therefore, the extending direction of the conductive linear body 22 is not limited to the conductive linear body 22, and the sheet 12 can be easily elongated.

Further, since the conductive linear bodies 22 are not connected to each other in the arrangement direction of the conductive linear bodies 22, they are not limited to the conductive linear bodies 22, and the sheets 12 can be easily elongated.

In other words, when the wire-shaped linear body is used as the conductive linear body 22, and the sheet 12 is three-dimensionally formed and coated on the surface of the molded article, the elongation of the sheet 12 or the breakage of the conductive linear body 22 can be suppressed. .

Here, from the viewpoint of suppressing the elongation failure of the sheet 12 or the breakage of the conductive linear body 22, the wavelength λ of the wave-shaped conductive linear body 22 (distance between waveforms: see FIG. 4) is preferably 0.3 mm. ~100mm, more preferably 0.5mm~80mm. Further, from the same viewpoint, the amplitude A (see FIG. 4) of the waveguide-shaped conductive linear body 22 is preferably 0.3 mm to 200 mm, more preferably 0.5 mm to 160 mm. The amplitude A refers to the peak to peak.

- Third Modification - The sheet 10 of the present embodiment may be, for example, as shown in Figs. 5 and 6, a sheet 13 having a sheet-like structure 20 in which a conductive linear body is arranged, which is electrically conductive. The linear body includes a first portion having a wave shape of a wavelength λ1 and an amplitude A1, and a second portion having a wave shape of a wavelength λ2 and an amplitude A2 which are different from at least one of the wavelength λ1 and the amplitude A1 of the first portion.

Here, in the three-dimensional molding, when a large linear elongation of the sheet 10 is used, when a linear body having a small wavelength or a large amplitude is used as the conductive linear body 22, the wave-shaped conductive line can be increased. When the shape 22 is linearized, the conductive linear body 22 can easily follow the large elongation of the sheet 10.

However, in the case where the molded article of the coated object has a complicated three-dimensional shape, in the three-dimensional forming of the sheet 10, a region in which the degree of elongation of the sheet 10 is greatly different may occur. Therefore, a portion of the wave-shaped conductive linear body 22 having a large degree of linearity may appear. In other words, after three-dimensional molding, the conductive linear body 22 has a portion that is linearized or nearly linear, and that is not linearized to maintain the wave shape.

The sheet 10 including the sheet-like structure 20 in which the conductive linear body 22 having the portion which is nearly linear and which is not linearized and which maintains the wave shape is arranged is mainly because of the conductive linear body 22 When the portion of the wave-shaped structure 20 is not linearized, the electric resistance of the sheet-like structure 20 is increased, the power consumption is increased, or the portion having a larger area per unit area of the conductive linear body 22 is used, for example, as a heat generating sheet. At the time, the amount of heat generation is increased only in this portion, and the function of producing the sheet is lowered.

Therefore, the sheet 10 has a second shape having a wave shape having a wavelength λ1 and an amplitude A1 and a second wave shape having a wavelength λ2 and an amplitude A2 different from at least one of the wavelength λ1 and the amplitude A1 of the first portion. The portion is a sheet 13 constituting the conductive linear body 22.

Specifically, the shape of the molded article of the covering object to be three-dimensionally formed is, for example, a small wavelength or a large amplitude or a portion of the conductive linear body 22 in a region where the elongation of the sheet 13 at the time of three-dimensional molding is large. In the first portion of the wave shape, the portion of the conductive linear body 22 in the region where the elongation of the sheet 13 is three-dimensionally formed is a second portion having a large wavelength, a small amplitude, or a wave shape of both.

When the conductive linear body 22 having the first portion and the second portion having at least one of such wavelength and amplitude is used, the portion where the elongation of the sheet 13 is large during the three-dimensional molding is the first of the conductive linear body 22 The portion where the portion is large and linear, and the portion where the sheet 13 is elongated is small, and the second portion of the conductive linear body 22 is small and linear, so that the degree of linearization of each portion is uniform.

Therefore, the sheet 13 is similar in resistance to the sheet structure 20, and the power consumption is increased, or the portion having the conductive linear body 22 has a relatively large portion. For example, when used as a heat generating sheet, the amount of heat generation is locally increased. , and the function of the sheet can be suppressed from being lowered.

Hereinafter, the sheet 13 of the third modification will be described in more detail.

As shown in FIG. 5, in the sheet 13, the conductive linear body 22 has a wave-shaped first portion 22A, a wave-shaped second portion 22B, and a wave-shaped third portion 22C. The first portion 22A has a wavelength λ1 and an amplitude A1. The second portion 22B has a wavelength λ2 smaller than the wavelength λ1 and an amplitude A2 which is the same as the amplitude A1. The third portion 22C has the same wavelength λ3 as the wavelength λ1 and the same amplitude A3 as the amplitude A1 and the amplitude A2.

In other words, the second portion 22B is in the extending direction of the conductive linear body 22, and the linear length of the conductive linear body 22 is longer than that of the first portion 22A and the third portion 22C. On the other hand, the third portion 22C is in the extending direction of the conductive linear body 22, and the conductive linear body 22 is linearized as the first portion 22A.

Further, the region of the sheet 13 having the second portion 22B is a region in which the sheet 13 is elongated in a three-dimensional shape larger than the region of the sheet 13 having the first portion 22A and the third portion 22C.

The sheet 13 of the sheet-like structure 20 in which the conductive linear bodies 22 having the wave-shaped first portions 22A to the third portions 22C are arranged is three-dimensionally formed and coated on the surface of the molded article, according to the sheet 13 The extent of the elongation, the respective portions of the conductive linear body 22 are linearized to different extents, and any portion of the three-dimensionally shaped conductive linear body 22 can be adjusted to have a nearly linear shape.

Therefore, the sheet 13 having the wave-shaped first portion 22A to the third portion 22C can suppress the function of the sheet from being lowered.

Here, in Fig. 5, 13A indicates a region having the sheet 13 of the first portion 22A, 13B indicates a region of the sheet 13 having the second portion 22B, and 13C indicates a region of the sheet 13 having the third portion 22C.

Further, in the sheet 13, the conductive linear body 22 is not limited to the above. For example, as shown in FIG. 6, the conductive linear body 22 may have a first portion 22AA having a different amplitude and a second portion 22BB to a third portion 22CC.

In this aspect (refer to FIG. 6), the first portion 22AA has a wavelength λ1 and an amplitude A2. The second portion 22BB has the same wavelength λ2 as the wavelength λ1 and an amplitude A2 smaller than the amplitude A1. The third portion 22CC has the same wavelength λ3 as the wavelength λ1 and the wavelength λ2, and the same amplitude A3 as the amplitude A1.

In other words, in the extending direction of the conductive linear body 22, the second portion 22BB has a shorter linear length of the conductive linear body 22 than the first portion 22AA and the third portion 22CC. On the other hand, in the extending direction of the conductive linear body 22, the third portion 22CC is similar to the first portion 22AA, and the conductive linear body 22 is linearized.

Then, the region of the sheet 13 having the second portion 22BB is three-dimensionally formed, and the sheet 13 is elongated in a region smaller than the region of the sheet 13 having the first portion 22AA and the third portion 22CC.

The sheet 13 of the sheet-like structure 20 including the conductive linear bodies 22 having the wave-shaped first portions 22AA to the third portions 22CC is three-dimensionally formed and coated on the surface of the molded article, according to the sheet 13 The extent of the elongation, the respective portions of the conductive linear body 22 are linearized to different extents, and any portion of the three-dimensionally shaped conductive linear body 22 can be adjusted to have a nearly linear shape.

Therefore, the sheet 13 having the wave-shaped first portion 22AA to the third portion 22CC can also suppress the function of the sheet from being lowered.

Here, in Fig. 6, 13AA indicates a region of the sheet 13 having the first portion 22AA, 13BB indicates a region of the sheet 13 having the second portion 22BB, and 13CC indicates a region of the sheet 13 having the third portion 22CC.

Further, although not shown, in the sheet 13, the conductive linear body 22 may have a first portion, a second portion, and a third portion having different wavelengths and amplitudes.

The conductive linear body 22 is not limited to the above-described aspect, and may be a first portion including a wave shape having a wavelength λ1 and an amplitude A1, and having a wavelength λ2 different from at least one of the wavelength λ1 and the amplitude A1 of the first portion. And the aspect of the linear body of the second portion of the wave shape of the amplitude A2. The conductive linear body 22 is different in wavelength and amplitude from each part, and can be adjusted in accordance with the shape of the molded article. Further, the conductive linear body may have a linear portion. Further, the wavelengths and amplitudes of the respective portions may be different in stages or may be gradually different.

Here, the first to third modifications are examples, and the sheet 10 of the present embodiment can have various configurations depending on the purpose. For example, although not shown, the sheet 10 of the present embodiment may be a sheet in which the sheet-like structures 20 are arranged in a plurality of thin single-sided directions (in the direction along the sheet surface). The plurality of similar sheet structures may be arranged in parallel with each other or may be staggered in the direction in which the conductive linear bodies 22 extend.

Claims (12)

A three-dimensional forming conductive sheet having: a plurality of conductive linear bodies extending in one direction having a spacing of 0.3 mm to 12.0 mm, and adjacent conductive wires having a constant distance and arranged in a similar sheet The structure, a resin protective layer provided on one surface of the similar sheet structure, and an adhesive layer provided between the similar sheet structure and the resin protective layer. The conductive sheet for three-dimensional molding of claim 1, wherein the conductive linear body has a diameter of 5 μm to 75 μm. The conductive sheet for three-dimensional molding of claim 1 or claim 2, wherein a ratio of a thickness of the resin protective layer to a thickness of the adhesive layer (thickness of a resin protective layer/thickness of an adhesive layer) is 1/1~ 100/1. The conductive sheet for three-dimensional molding of claim 1 or claim 2, wherein the conductive linear body is a wave-shaped linear body. The conductive sheet for three-dimensional molding of claim 1 or claim 2, wherein the conductive linear body is a linear body including a metal wire or a linear body including a conductive wire. The conductive sheet for three-dimensional molding of claim 1 or claim 2, wherein the conductive linear body is a linear body including a metal wire coated with a carbon material. The conductive sheet for three-dimensional molding according to claim 1 or claim 2, wherein the conductive linear body is a linear body including a metal wire coated with a carbon material, and the peeling force of the adhesive layer is the adhesive The layer was adhered to a stainless steel plate, and the peeling force after 30 minutes was 12 N/25 mm or more. The conductive sheet for three-dimensional molding according to claim 1 or claim 2, wherein the conductive linear body is a linear body including a conductive wire, and the adhesive layer is adhered to the stainless steel plate by a peeling force of the adhesive layer The peeling force after 30 minutes was 11 N/25 mm or less. The three-dimensional forming conductive sheet of claim 1 or claim 2, wherein at least any one of the layers constituting the surface of the aforementioned similar sheet structure provided on the side having the resin protective layer contains a colorant. The conductive sheet for three-dimensional molding of claim 1 or claim 2, wherein at least one of the layers constituting the surface of the aforementioned similar sheet structure provided on the side having the resin protective layer contains a thermally conductive inorganic filler. The three-dimensional forming conductive sheet of claim 1 or claim 2, which has a resin layer provided on a surface of the aforementioned similar sheet structure on the side opposite to the side having the resin protective layer. The three-dimensional forming conductive sheet of claim 1 or claim 2 is a heat-generating sheet for three-dimensional molding.