TW201829476A - Photosensitive resin composition, cured product, interlayer insulating film, tft active matrix substrate, and image display device - Google Patents

Photosensitive resin composition, cured product, interlayer insulating film, tft active matrix substrate, and image display device Download PDF

Info

Publication number
TW201829476A
TW201829476A TW106125463A TW106125463A TW201829476A TW 201829476 A TW201829476 A TW 201829476A TW 106125463 A TW106125463 A TW 106125463A TW 106125463 A TW106125463 A TW 106125463A TW 201829476 A TW201829476 A TW 201829476A
Authority
TW
Taiwan
Prior art keywords
group
ring
less
meth
acid
Prior art date
Application number
TW106125463A
Other languages
Chinese (zh)
Other versions
TWI718325B (en
Inventor
石井宏明
斎藤恵子
Original Assignee
三菱化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱化學股份有限公司 filed Critical 三菱化學股份有限公司
Publication of TW201829476A publication Critical patent/TW201829476A/en
Application granted granted Critical
Publication of TWI718325B publication Critical patent/TWI718325B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Nonlinear Science (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

This photosensitive resin composition contains (a) zirconium dioxide particles, (b) a dispersant, (c) a solvent, (d) a binder resin, (e) polymerizable monomers, and (f) a polymerization initiator, the binder resin (d) containing an epoxy (meth)acrylate resin having the repeating unit structure expressed in formula (I) and/or an epoxy (meth)acrylate resin having the partial structure represented in formula (II). (In the formulas, each of R1, R2, R3, R4, and * is as defined in the specification.).

Description

感光性樹脂組合物、硬化物、層間絕緣膜、TFT主動矩陣基板、及圖像顯示裝置Photosensitive resin composition, cured product, interlayer insulating film, TFT active matrix substrate, and image display device

本發明係關於一種感光性樹脂組合物、硬化物、層間絕緣膜、TFT主動矩陣基板、及圖像顯示裝置。The present invention relates to a photosensitive resin composition, a cured product, an interlayer insulating film, a TFT active matrix substrate, and an image display device.

目前，主動矩陣型液晶顯示裝置正不斷推進高開口率化以實現高精細化及低耗電化。液晶顯示裝置之一種的稱為橫向電場方式或邊緣電場切換(FFS)方式之液晶顯示面板係於像素電極與對向電極之間之至少一部分產生平行於基板面之電場，藉由該電場驅動液晶而對透過液晶層之光進行調變，從而顯示圖像。該方式具有視角顯著較廣之特徵，但存在其結構上難以實現高開口率化之課題。作為FFS方式液晶顯示裝置中用以達成高開口率之方法之一，已知將相對介電常數較高之有機絕緣膜用於夾於面狀之對向電極與線狀之像素電極之間之層間絕緣膜的方法。 FFS方式之特徵在於：由像素電極與層間絕緣膜形成輔助電容(Cst)而更穩定地保持充電電荷。此處，電容器之電容C係以下式(1)表示。式(1)中，C表示電容、εr 表示相對介電常數、ε0 表示真空介電常數、S表示電極面積、d表示電極間距離。 由式(1)可知，於為了達成高精細化而減小像素電極面積之情形時，為了將輔助電容保持為固定，需要相對介電常數較高、膜厚較薄之層間絕緣膜。此時，要求薄膜之絕緣耐壓性或對漏電流之抑制。為了即便為薄膜亦保持絕緣耐壓性，重要的是膜面平坦且均勻。 先前，已知有使用於樹脂中分散有高介電常數之無機粒子之墨水，將其塗佈並加以乾燥、硬化而獲得高介電常數之絕緣膜的方法(例如參照專利文獻1)。又，已知若使絕緣膜具有感光性，則藉由光微影法形成圖案之方法(例如參照專利文獻2〜4)。 先前技術文獻 專利文獻 專利文獻1：日本專利特開2009-235359號公報 專利文獻2：日本專利特開2011-116943號公報 專利文獻3：日本專利特開2013-237804號公報 專利文獻4：日本專利特開2009-249411號公報At present, active matrix type liquid crystal display devices are continually advancing high aperture ratios to achieve high definition and low power consumption. A liquid crystal display panel called a lateral electric field mode or a fringe electric field switching (FFS) mode, which is one type of liquid crystal display device, generates an electric field parallel to a substrate surface at least a portion between a pixel electrode and a counter electrode, and the liquid crystal is driven by the electric field. The light transmitted through the liquid crystal layer is modulated to display an image. This method has a feature that the viewing angle is remarkably wide, but there is a problem that it is difficult to achieve a high aperture ratio in its structure. As one of methods for achieving a high aperture ratio in an FFS liquid crystal display device, it is known that an organic insulating film having a relatively high dielectric constant is used for sandwiching between a planar counter electrode and a linear pixel electrode. A method of interlayer insulating film. The FFS method is characterized in that the auxiliary capacitance (Cst) is formed by the pixel electrode and the interlayer insulating film to more stably maintain the charge. Here, the capacitance C of the capacitor is expressed by the following formula (1). In the formula (1), C represents a capacitance, ε r represents a relative dielectric constant, ε 0 represents a vacuum dielectric constant, S represents an electrode area, and d represents an interelectrode distance. As is clear from the formula (1), in order to reduce the pixel electrode area in order to achieve high definition, in order to keep the auxiliary capacitance constant, an interlayer insulating film having a relatively high dielectric constant and a small film thickness is required. At this time, the insulation withstand voltage of the film or the suppression of leakage current is required. In order to maintain the insulation withstand voltage even for the film, it is important that the film surface is flat and uniform. Heretofore, a method of applying an ink having a high dielectric constant inorganic particle dispersed therein to a resin, drying it, and curing it to obtain an insulating film having a high dielectric constant has been known (for example, see Patent Document 1). Further, a method of forming a pattern by a photolithography method when the insulating film is photosensitive is known (for example, refer to Patent Documents 2 to 4). CITATION LIST Patent Literature Patent Literature 1: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2011-116943. JP-A-2009-249411

[發明所欲解決之問題] 層間絕緣膜必須形成用以連接主動元件與像素電極之接觸孔，因此要求藉由光微影法形成接觸孔而無殘渣。然而，若為了提高相對介電常數而增加無機粒子之含量，則無機粒子容易發生凝集，難以完全消除凝集而達成良好分散，於藉由光微影法形成層間絕緣膜之圖案時難以形成無殘渣之圖案。又，凝集之無機粒子間容易留有微小空隙，從而有漏電流變多之傾向。 本發明者等人經過研究，結果發現，專利文獻1〜3中具體揭示之組合物使用二氧化鈦或鈦酸鋇作為高介電常數之無機粒子，雖然相對介電常數較高，但漏電流較多，接觸孔之開口性亦不充分，於實用上存在問題。 另一方面，發現專利文獻4由於使用雙酚A型之環氧丙烯酸酯樹脂作為黏合劑樹脂，故而雖然於高解像度圖案化下實現了孔解像性，但玻璃基板上出現微小殘渣，顯影性不充分。 本發明係鑒於上述情況而成者，本發明之目的在於提供一種感光性樹脂組合物，其即便為薄膜亦具有高介電常數，且抑制漏電流，並能夠藉由光微影法形成高精細圖案。 [解決問題之技術手段] 本發明者等人經過努力研究，結果發現，藉由使用二氧化鋯粒子，並使用特定之環氧(甲基)丙烯酸酯樹脂作為黏合劑樹脂而解決上述課題，從而達成本發明。即，本發明之主旨如下所述。 [1]一種感光性樹脂組合物，其係含有(a)二氧化鋯粒子、(b)分散劑、(c)溶劑、(d)黏合劑樹脂、(e)聚合性單體及(f)聚合起始劑者，上述(d)黏合劑樹脂含有具有下述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有下述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者。 [化1](式(I)中，R1 表示氫原子或甲基，R2 表示可具有取代基之2價烴基。式(I)中之苯環可進而經任意之取代基取代。*表示鍵結鍵) [化2](式(II)中，R3 分別獨立地表示氫原子或甲基。R4 表示具有脂肪族環基作為側鏈之2價烴基。*表示鍵結鍵) [2]如[1]記載之感光性樹脂組合物，其中上述(d)黏合劑樹脂之含有比率於全部固形物成分中為5質量%以上。 [3]如[1]或[2]記載之感光性樹脂組合物，其中上述(a)二氧化鋯粒子之含有比率於全部固形物成分中為50質量%以上。 [4]如[1]至[3]中任一項記載之感光性樹脂組合物，其中上述(f)聚合起始劑含有肟酯系化合物。 [5]如[1]至[4]中任一項記載之感光性樹脂組合物，其中上述(e)聚合性單體含有下述式(III)所表示之(甲基)丙烯酸酯化合物。 [化3](式(III)中，R5 表示具有環狀烴基作為側鏈之2價烴基。R6 分別獨立地表示可具有取代基之伸烷基。R7 分別獨立地表示氫原子或甲基。k及l分別獨立地表示1〜20之整數) [6]一種硬化物，其係使如[1]至[5]中任一項記載之感光性樹脂組合物硬化而成。 [7]一種層間絕緣膜，其包含如[6]記載之硬化物。 [8]一種TFT主動矩陣基板，其具備如[7]記載之層間絕緣膜。 [9]一種圖像顯示裝置，其具備如[8]記載之TFT主動矩陣基板。 [發明之效果] 根據本發明，可提供一種感光性樹脂組合物，其即便為薄膜亦具有高介電常數，且抑制漏電流，並能夠藉由光微影法形成高精細圖案。[Problem to be Solved by the Invention] The interlayer insulating film must form a contact hole for connecting the active device and the pixel electrode, and therefore it is required to form the contact hole by photolithography without residue. However, when the content of the inorganic particles is increased in order to increase the relative dielectric constant, the inorganic particles are likely to aggregate, and it is difficult to completely eliminate the aggregation to achieve good dispersion, and it is difficult to form a residue without forming a pattern of the interlayer insulating film by photolithography. The pattern. Further, there is a tendency that a small amount of voids are likely to remain between the aggregated inorganic particles, and leakage current tends to increase. As a result of investigation, the inventors of the present invention found that the composition specifically disclosed in Patent Documents 1 to 3 uses titanium oxide or barium titanate as the inorganic material having a high dielectric constant, and although the relative dielectric constant is high, the leakage current is high. The opening of the contact hole is also insufficient, and there is a problem in practical use. On the other hand, in Patent Document 4, since the bisphenol A type epoxy acrylate resin is used as the binder resin, the pore resolving property is achieved under high resolution patterning, but microscopic residue appears on the glass substrate, and developability insufficient. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a photosensitive resin composition which has a high dielectric constant even in a thin film and which suppresses leakage current, and can form high definition by photolithography. pattern. [Means for Solving the Problems] As a result of intensive studies, the inventors of the present invention have found that the above problems can be solved by using zirconium dioxide particles and using a specific epoxy (meth) acrylate resin as a binder resin. The invention has been achieved. That is, the gist of the present invention is as follows. [1] A photosensitive resin composition comprising (a) zirconium dioxide particles, (b) a dispersant, (c) a solvent, (d) a binder resin, (e) a polymerizable monomer, and (f) In the polymerization initiator, the (d) binder resin contains an epoxy (meth) acrylate resin having a repeating unit structure represented by the following formula (I) and a partial structure represented by the following formula (II). At least one of the epoxy (meth) acrylate resins. [Chemical 1] (In the formula (I), R 1 represents a hydrogen atom or a methyl group, and R 2 represents a divalent hydrocarbon group which may have a substituent. The benzene ring in the formula (I) may be further substituted with an arbitrary substituent. * represents a bond ) [Chemical 2] (In the formula (II), R 3 each independently represents a hydrogen atom or a methyl group. R 4 represents a divalent hydrocarbon group having an aliphatic cyclic group as a side chain. * represents a bonding bond) [2] as described in [1] In the photosensitive resin composition, the content ratio of the (d) binder resin is 5% by mass or more based on the total solid content. [3] The photosensitive resin composition according to the above [1], wherein the content ratio of the (a) zirconium dioxide particles is 50% by mass or more based on the total solid content. [4] The photosensitive resin composition according to any one of [1], wherein the (f) polymerization initiator contains an oxime ester compound. [5] The photosensitive resin composition according to any one of [1] to [4] wherein the (e) polymerizable monomer contains a (meth) acrylate compound represented by the following formula (III). [Chemical 3] (In the formula (III), R 5 represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. R 6 each independently represents an alkylene group which may have a substituent. R 7 each independently represents a hydrogen atom or a methyl group. And each of the above-mentioned [1] and [5], wherein the photosensitive resin composition according to any one of [1] to [5] is cured. [7] An interlayer insulating film comprising the cured product according to [6]. [8] A TFT active matrix substrate comprising the interlayer insulating film according to [7]. [9] An image display device comprising the TFT active matrix substrate according to [8]. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive resin composition which has a high dielectric constant even when it is a film, suppresses leakage current, and can form a high-definition pattern by photolithography.

以下，詳細地說明本發明之實施形態，但以下之記載為本發明之實施態樣之一例，本發明並不限定於該等內容。 本發明中，所謂「(甲基)丙烯酸」包括丙烯酸與甲基丙烯酸該兩者，「(甲基)丙烯酸酯」、「(甲基)丙烯醯基」等亦表達相同含義。又，於單體名稱前帶有「(聚)」者意指該單體及該聚合物。 本發明中，所謂「全部固形物成分」意指本發明之感光性樹脂組合物之構成成分中之除溶劑以外之全體成分。 本發明中，「質量」與「重量」同義。 ＜感光性樹脂組合物＞ 本發明之感光性樹脂組合物含有(a)二氧化鋯粒子、(b)分散劑、(c)溶劑、(d)黏合劑樹脂、(e)聚合性單體及(f)聚合起始劑。 首先，對(a)二氧化鋯粒子進行詳細說明。 [(a)二氧化鋯粒子] 本發明之感光性樹脂組合物含有(a)二氧化鋯粒子(以下有時簡記為「氧化鋯粒子」)。藉由含有(a)二氧化鋯粒子，能夠獲得相對介電常數較高、且漏電流得以抑制之有機絕緣膜。 具有長週期型週期表第4族元素之化合物之粒子、尤其是具有長週期型週期表第4族元素之氧化物之粒子其相對介電常數較高，適於高介電常數之有機絕緣膜用途。該等之中，認為二氧化鋯粒子之相對介電常數較低，為了使所獲得之有機絕緣膜之相對介電常數成為所需值而必須增大該粒子之含有比率，但二氧化鋯粒子因其良好之分散性而緻密地堆積於塗膜內，塗膜之吸濕性減弱，藉此可抑制漏電流。 (a)二氧化鋯粒子之一次粒子之平均粒徑通常為100 nm以下，較佳為8O nm以下，更佳為70 nm以下，進而較佳為60 nm以下。又，通常為1 nm以上。若粒徑為上述上限值以下，則有表面無粗糙現象、圖案化特性亦變得良好之傾向。又，若為上述下限值以上，則有分散性變得良好之傾向。 (a)二氧化鋯粒子之一次粒子之平均粒徑係藉由使用穿透式電子顯微鏡(TEM)或掃描式電子顯微鏡(SEM)，根據其電子顯微鏡照片而直接計測一次粒子之大小的方法進行測定。具體而言，由圓當量徑算出各個粒子之一次粒徑。對100〜500 nm之四方範圍進行成像，對範圍內存在之全部粒子實施測定。若干次對不同範圍進行成像，合計測定200〜1000個一次粒子之粒徑，將該等粒徑進行數量平均，藉此求出平均粒徑。一次粒徑之測定例如可對單獨之二氧化鋯粒子、其分散液、樹脂組合物之硬化膜實施。於製作測定樣品時，必須使(a)二氧化鋯粒子均勻地存在於樣品中。於分散液之情形時，使用剛分散後之分散液，使溶劑揮發後實施測定。又，於硬化膜之情形時，使用均勻分散有粒子之感光性樹脂組合物製作硬化膜，沿膜之厚度方向切斷，觀察其剖面，藉此實施測定。 (a)二氧化鋯粒子之形狀並無特別限定，例如為球狀、中空狀、多孔質狀、棒狀、板狀、纖維狀或不定形狀，較佳為球狀。 (a)二氧化鋯粒子之含有比率於感光性樹脂組合物之全部固形物成分中通常為50質量%以上，較佳為55質量%以上，更佳為60質量%以上，進而較佳為65質量%以上，尤佳為70質量%以上，又，較佳為95質量%以下，更佳為90質量%以下，進而較佳為85質量%以下，進而更佳為80質量%以下，尤佳為75質量%以下。藉由設為上述下限值以上，有獲得相對介電常數較高之介電膜之傾向，又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 [(b)分散劑] 本發明之感光性樹脂組合物含有(b)分散劑。藉由含有(b)分散劑，可使(a)二氧化鋯粒子穩定地分散於感光性樹脂組合物中。 作為(b)分散劑，較佳為具有官能基之高分子分散劑，就分散穩定性之方面而言，更佳為羧基；磷酸基；磺酸基；或該等之鹽基；一級、二級或三級胺基；四級銨鹽基；吡啶、嘧啶、吡𠯤等源自含氮雜環之基等具有官能基之高分子分散劑。該等之中，尤佳為一級、二級或三級胺基；四級銨鹽基；吡啶、嘧啶、吡𠯤等源自含氮雜環之基等具有鹼性官能基之高分子分散劑。 又，作為高分子分散劑，例如可列舉：胺基甲酸酯系分散劑、丙烯酸系分散劑、聚伸乙基亞胺系分散劑、聚烯丙胺系分散劑、包含具有胺基之單體與巨單體之分散劑、聚氧乙烯烷基醚系分散劑、聚氧乙烯二酯系分散劑、聚醚磷酸酯系分散劑、聚酯磷酸酯系分散劑、山梨醇酐脂肪族酯系分散劑、脂肪族改性聚酯系分散劑等。 作為此種分散劑之具體例，以商品名表示，可列舉：EFKA(EFKA Chemicals BV(EFKA)公司製造)、DISPERBYK(BYK-Chemie公司製造)、Disparlon(楠本化成公司製造)、SOLSPERSE(Lubrizol公司製造)、KP(信越化學工業公司製造)、Polyflow(共榮社化學公司製造)、Ajisper(味之素公司製造)等。該等高分子分散劑可單獨使用1種，或可將2種以上併用。 高分子分散劑之重量平均分子量(Mw)通常為700以上，較佳為1,000以上，又，通常為100,000以下，較佳為50,000以下。 該等之中，就與顯影液之親和性之觀點而言，較佳為胺值為60 mgKOH/g以下之分散劑及/或具有磷酸基之分散劑。於具有胺基之情形時，較佳為聚酯胺、聚醚胺等具有醚鍵者。再者，此處所謂胺值表示有效固形物成分換算之胺值，乃以相當於分散劑之每1 g固形物成分之鹼量的KOH之質量所表示之值。 就圖案化特性之觀點而言，上述具有磷酸基之分散劑較佳為進而具有聚醚結構。聚醚結構為具有進一步提高與顯影液之親和性、並提高分散性之功能的部位，藉由具有聚醚結構，有能夠以更高解像度實現圖案化之傾向。 上述具有磷酸基之分散劑之化學結構並無特別限定，就圖案化特性與分散性之兼備之觀點而言，例如較佳為具有下述通式(X)所表示之化學結構者。 [化4]上述式(X)中，RA 表示可具有取代基之烷基，α表示聚醚結構，β表示直接鍵或聚酯結構。又，n表示1〜3之整數。 RA 為可具有取代基之烷基，其碳數並無特別限定，通常為1以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下，尤佳為5以下。藉由設為上述範圍內，有與顯影液之親和性提高，圖案化特性變得良好之傾向。 作為RA 中之烷基可具有之取代基，可列舉：磺醯基、羧基、苄基、苯甲醯基等，就易合成性之觀點而言，較佳為未經取代。 α表示聚醚結構，就與顯影液之親和性之觀點而言，較佳為聚乙二醇結構、聚丙醚結構、聚異丙醚結構、丁醚結構，更佳為聚乙二醇結構，進而較佳為下述式(X-1)所表示之結構。 [化5]上述式(X-1)中，RB 表示可具有取代基之伸烷基。其碳數並無特別限定，通常為1以上，較佳為2以上，又，較佳為10以下，更佳為5以下。藉由設為上述範圍內，有圖案化特性變得良好之傾向。 作為RB 中之伸烷基可具有之取代基，可列舉：磺醯基、羧基、苄基、苯甲醯基等，就易合成性之觀點而言，較佳為未經取代。 又，上述式(X-1)中，x表示5〜30之整數。 x較佳為10以上，又，較佳為25以下。藉由設為上述下限值以上，有與顯影液之親和性變得良好之傾向。又，藉由設為上述上限值以下，有保存穩定性變得良好之傾向。再者，一分子中所含之複數個RB 彼此可相同亦可不同，例如可如伸丁基與伸戊基般為碳數不同之伸烷基。 上述式(X)中，β表示直接鍵或聚酯結構，尤其更佳為下述式(X-2)所表示之結構。 [化6]上述式(X-2)中，RC 表示可具有取代基之伸烷基，y表示0〜10之整數。 RC 為可具有取代基之伸烷基，其碳數並無特別限定，通常為1以上，較佳為2以上，更佳為4以上，又，較佳為15以下，更佳為10以下，進而較佳為8以下。藉由設為上述下限值以上，有保存穩定性變得良好之傾向，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 作為RC 中之伸烷基可具有之取代基，可列舉：磺醯基、羧基、苄基、苯甲醯基等，就易合成性之觀點而言，較佳為未經取代。 y為0〜10之整數，就保存穩定性與圖案化特性之兼備之觀點而言，較佳為1以上，更佳為2以上，又，較佳為7以下，更佳為5以下。藉由設為上述下限值以上，有保存穩定性變得良好之傾向。又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。再者，於y為2以上之整數之情形時，一分子中所含之2個以上之RC 彼此可相同亦可不同，例如可如伸丁基與伸戊基般為碳數不同之伸烷基。 上述具有磷酸基之分散劑之重量平均分子量(Mw)並無特別限定，較佳為1,000以上，更佳為5,000以上，又，較佳為40,000以下，更佳為30,000以下。藉由設為上述下限值以上，有分散性變得良好之傾向，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 作為上述具有磷酸基之分散劑，可使用市售者，例如可列舉：DISPERBYK(註冊商標，以下相同)-102、110、111、140、142、145、180、2001(BYK-Chemie公司製造)，DA-7301、DA-325、DA-375、DA-234、ED-152、ED-251(楠本化成公司製造)，TEGO(註冊商標)Dispers628、655(Evonik公司製造)等。 (b)分散劑之含有比率於感光性樹脂組合物之全部固形物成分中通常為1質量%以上，較佳為2質量%以上，更佳為3質量%以上，又，較佳為10質量%以下，更佳為7質量%以下，進而較佳為5質量%以下。藉由設為上述下限值以上，有感光性樹脂組合物之穩定性提高之傾向，又，藉由設為上述上限值以下，有圖案化特性提高之傾向。 (b)分散劑中上述具有磷酸基之分散劑所占之含有比率並無特別限定，較佳為50質量%以上，更佳為70質量%以上，又，通常為100質量%以下，尤佳為100質量%。藉由設為上述下限值以上，有圖案化特性提高之傾向。 又，相對於(a)二氧化鋯粒子100質量份，較佳為包含(b)分散劑15質量份以下，更佳為包含10質量份以下，進而較佳為包含8質量份以下，又，較佳為包含1質量份以上，更佳為包含3質量份以上。藉由設為上述下限值以上，有分散性變得良好之傾向，又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 [(c)溶劑] 本發明之感光性樹脂組合物含有(c)溶劑。 作為(c)溶劑，只要為可使各成分溶解、分散且操作性較佳者，則並無特別限定。具體而言，可列舉：甲基溶纖劑、乙基溶纖劑、丁基溶纖劑、二乙二醇單甲醚、丙二醇單乙酸酯、丙二醇二乙酸酯、丙二醇單甲醚乙酸酯(以下有時簡記為「PGMEA」)、甲基乙基酮、甲基異丁基酮、環己酮、甲苯、氯仿、二氯甲烷、乙酸乙酯、乳酸甲酯、乳酸乙酯、丙酸3-甲氧基甲酯、丙酸3-乙氧基乙酯、丙二醇單甲醚(以下有時簡記為「PGME」)、甲醇、乙醇、丙醇、丁醇、四氫呋喃、二乙二醇二甲醚、乙酸甲氧基丁酯、SOLVEST、卡必醇等有機溶劑。該等之中，就塗佈性或組合物中之構成成分之溶解度之觀點而言，較佳為二醇烷基醚乙酸酯類、二醇單烷基醚類，更佳為二醇烷基醚乙酸酯類。又，二醇烷基醚乙酸酯類可單獨使用，亦可與其他溶劑併用。作為併用之溶劑，尤佳為二醇單烷基醚類。其中，尤其就組合物中之構成成分之溶解性或分散性之方面而言，較佳為丙二醇單甲醚。於選擇溶劑時，若為高極性，則損害分散性，又，若為高沸點，則即便於塗膜化時之減壓乾燥(VCD)下溶劑亦不會完全揮發，從而有圖案化特性大幅劣化之傾向。又，於塗膜焙燒後亦會產生殘留溶劑，從而有導致電氣特性大幅降低之傾向。 於藉由光微影法形成介電膜之情形時，作為溶劑，較佳為選擇沸點處於100〜200℃(壓力1013.25[hPa]條件下。以下有關沸點均相同)之範圍者。更佳為具有120〜170℃之沸點者。藉由設為上述下限值以上，有容易抑制因急遽乾燥導致之粒子凝集、或因氣泡痕跡造成之缺陷之傾向。藉由設為上述上限值以下，有可縮短乾燥時間而於耗電性或生產速度之方面有利之傾向。上述溶劑中，就塗佈性與表面張力等之均衡性較佳、組合物中之構成成分之溶解度相對較高之方面而言，較佳為二醇烷基醚乙酸酯類。 又，溶劑可單獨使用1種，亦可將2種以上混合使用。作為混合使用之溶劑之組合，例如可列舉對PGMEA混合選自二乙二醇二甲醚、乙酸甲氧基丁酯、SOLVEST、卡必醇中之1種以上之溶劑而成者。 進而，關於上述混合溶劑中的選自二乙二醇二甲醚、乙酸甲氧基丁酯、SOLVEST、卡必醇中之1種以上之溶劑之調配比率，相對於PGMEA，通常為10質量%以上，較佳為30質量%以上，又，通常80質量%以下，較佳為70質量%以下。 又，進而於上述混合溶劑之中，PGMEA與乙酸甲氧基丁酯之混合溶劑會使塗佈乾燥步驟中之塗佈膜具有適度流動性，因此適用於實現基板凹凸之平坦化。 本發明之感光性樹脂組合物中之(c)溶劑之含有比率並無特別限定，較佳為50質量%以上，更佳為60質量%以上，進而較佳為70質量%以上，又，通常為99質量%以下，較佳為90質量%以下，更佳為85質量%以下。藉由設為上述範圍內，可使組合物含有充足量之(a)二氧化鋯粒子或(d)黏合劑樹脂等成分，又，有塗佈性亦變得良好之傾向。 [(d)黏合劑樹脂] 本發明之感光性樹脂組合物含有(d)黏合劑樹脂。藉由含有(d)黏合劑樹脂，能夠獲得均質膜。 (d)黏合劑樹脂之種類並無特別限定，就於鹼性顯影液中之溶解性之觀點而言，較佳為包含羧基或羥基之樹脂，例如可列舉：環氧(甲基)丙烯酸酯系樹脂、丙烯酸系樹脂、含羧基之環氧樹脂、含羧基之胺基甲酸酯樹脂、酚醛清漆系樹脂、聚乙烯基苯酚系樹脂等。該等可單獨使用1種，或可將複數種混合使用。 本發明之感光性樹脂組合物之特徵在於：含有具有下述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有下述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者作為(d)黏合劑樹脂。環氧(甲基)丙烯酸酯樹脂由於為高感度，故而圖案化特性良好，又，由於具有疏水骨架、溶解速度適度，故而基板密接性良好。進而，由於不同於丙烯酸系樹脂而具有剛直骨架，容易進行三維交聯，硬化時取得排列結構而緻密交聯，故而認為可使漏電流得到抑制。 認為尤其是具有下述式(I)所表示之重複單元結構者及具有下述式(II)所表示之部分結構者由於在中央部具有大體積之剛直骨架，故而成為(甲基)丙烯醯基等親水部位向外側展開之形狀，顯影性變得良好。 [化7](式(I)中，R1 表示氫原子或甲基，R2 表示可具有取代基之2價烴基。式(I)中之苯環可進而經任意之取代基取代。*表示鍵結鍵) [化8](式(II)中，R3 分別獨立地表示氫原子或甲基。R4 表示具有脂肪族環基作為側鏈之2價烴基。*表示鍵結鍵) 再者，所謂環氧(甲基)丙烯酸酯樹脂意指以下之(d1)及/或(d2)之鹼可溶性樹脂，又，亦意指使該等樹脂之羧基進而與其他化合物反應所得者。該環氧(甲基)丙烯酸酯樹脂於化學結構上實質不具有環氧基，且不限定於「(甲基)丙烯酸酯」，但由於以環氧樹脂作為原料、且「(甲基)丙烯酸酯」乃代表例，故而依照慣用如此命名。 「鹼可溶性樹脂(d1)」 藉由對環氧樹脂加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而使之與多元酸及/或其酐進行反應而獲得的鹼可溶性樹脂。 「鹼可溶性樹脂(d2)」 藉由對環氧樹脂加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而使之與多元醇、以及多元酸及/或其酐進行反應而獲得的鹼可溶性樹脂。 「環氧(甲基)丙烯酸酯樹脂(d-1)」 其次，詳細說明具有上述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂(以下簡記為「環氧(甲基)丙烯酸酯樹脂(d-1)」)。 [化9](式(I)中，R1 表示氫原子或甲基，R2 表示可具有取代基之2價烴基。式(I)中之苯環可進而經任意之取代基取代。*表示鍵結鍵) (R2 ) 上述式(I)中，R2 表示可具有取代基之2價烴基。 作為2價烴基，可列舉：2價脂肪族基、2價芳香族環基、由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基。 作為2價脂肪族基，可列舉直鏈狀、支鏈狀、環狀者或由該等連結而成者。該等之中，就顯影溶解性之觀點而言，較佳為直鏈狀者，另一方面，就減輕顯影液向曝光部之滲透之觀點而言，較佳為環狀者。其碳數通常為1以上，較佳為3以上，更佳為6以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為2價直鏈狀脂肪族基之具體例，可列舉：亞甲基、伸乙基、伸正丙基、伸正丁基、伸正己基、伸正庚基等。該等之中，就骨架之剛直性之觀點而言，較佳為亞甲基。 作為2價支鏈狀脂肪族基之具體例，可列舉：伸異丙基、伸第二丁基、伸第三丁基、伸異戊基等。該等之中，就骨架之剛直性之觀點而言，較佳為伸第三丁基。 2價環狀脂肪族基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下。藉由設為上述下限值以上，有成為強固之膜，基板密接性與電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。作為2價環狀脂肪族基之具體例，可列舉自環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等環去除2個氫原子所得之基。該等之中，就骨架之剛直性之觀點而言，較佳為自金剛烷環去除2個氫原子所得之基。 作為2價脂肪族基可具有之取代基，可列舉：羥基，甲氧基、乙氧基等碳數1〜5之烷氧基，羥基，硝基，氰基，羧基等。該等之中，就易合成性之觀點而言，較佳為未經取代。 又，作為2價芳香族環基，可列舉2價芳香族烴環基及2價芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 2價芳香族烴環基中之芳香族烴環可為單環亦可為縮合環。作為2價芳香族烴環基，例如可列舉具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，2價芳香族雜環基中之芳香族雜環可為單環亦可為縮合環。作為2價芳香族雜環基，例如可列舉具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。該等之中，就圖案化特性之觀點而言，較佳為具有2個自由原子價之苯環或萘環，更佳為具有2個自由原子價之苯環。 作為2價芳香族環基可具有之取代基，可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。該等之中，就顯影溶解性、耐吸濕性之觀點而言，較佳為未經取代。 又，作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基，可列舉將1個以上之上述2價脂肪族基與1個以上之上述2價芳香族環基進行連結而獲得之基。 2價脂肪族基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 2價芳香族環基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基之具體例，可列舉下述式(I-A)〜(I-E)所表示之基等。該等之中，就骨架之剛直性與膜之疏水化之觀點而言，較佳為下述式(I-A)所表示之基。 [化10]如上所述，式(I)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數量亦無特別限定，可為1個，亦可為2個以上。 該等之中，就圖案化特性之觀點而言，較佳為未經取代，另一方面，就電氣特性之觀點而言，較佳為鄰位上取代有甲基。 又，上述式(I)所表示之重複單元結構就合成之簡易性之觀點而言，較佳為下述式(I-1)所表示之重複單元結構。 [化11](式(I-1)中，R1 及R2 與上述式(I)中含義相同。RX 表示氫原子或多元酸殘基。*表示鍵結鍵。式(I-1)中之苯環可進而經任意之取代基取代) 所謂多元酸殘基意指自多元酸或其酐去除1個OH基後獲得之1價基。作為多元酸，可列舉選自順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、二苯甲酮四羧酸、甲基六氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、氯菌酸、甲基四氫鄰苯二甲酸、聯苯四羧酸之1種或2種以上。 該等之中，就圖案化特性之觀點而言，較佳為順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、聯苯四羧酸，更佳為四氫鄰苯二甲酸、聯苯四羧酸、四氫鄰苯二甲酸、聯苯四羧酸。 環氧(甲基)丙烯酸酯樹脂(d-1)一分子中所含之上述式(I-1)所表示之重複單元結構可為1種或2種以上，例如可混合存在RX 為氫原子者與RX 為多元酸殘基者。 又，環氧(甲基)丙烯酸酯樹脂(d-1)一分子中所含之上述式(I)所表示之重複單元結構之數量並無特別限定，較佳為1個以上，更佳為3個以上，又，較佳為20個以下，更佳為15個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 環氧(甲基)丙烯酸酯樹脂(d-1)之藉由凝膠滲透層析法(GPC)所測得之聚苯乙烯換算之重量平均分子量(Mw)並無特別限定，較佳為1,000以上，更佳為1,500以上，進而較佳為2,000以上，尤佳為3,000以上，又，較佳為30,000以下，更佳為20,000以下，進而較佳為10,000以下，進而更佳為8,000以下，尤佳為5,000以下。藉由設為上述下限值以上，有感光性樹脂組合物之殘膜率變得良好之傾向，又，藉由設為上述上限值以下，有解像性變得良好之傾向。 環氧(甲基)丙烯酸酯樹脂(d-1)之酸值並無特別限定，較佳為10 mgKOH/g以上，更佳為20 mgKOH/g以上，進而較佳為40 mgKOH/g以上，尤佳為50 mgKOH/g以上，又，較佳為150 mgKOH/g以下，更佳為130 mgKOH/g以下，進而更佳為100 mgKOH/g以下，尤佳為80 mgKOH/g以下。藉由設為上述下限值以上，有顯影溶解性提高，解像性變得良好之傾向，又，藉由設為上述上限值以下，有硬化性樹脂組合物之殘膜率變得良好之傾向。 以下列舉環氧(甲基)丙烯酸酯樹脂(d-1)之具體例。 [化12][化13][化14][化15][化16]「環氧(甲基)丙烯酸酯樹脂(d-2)」 其次，詳細說明具有上述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂(以下簡記為「環氧(甲基)丙烯酸酯樹脂(d-2)」)。 [化17](式(II)中，R3 分別獨立地表示氫原子或甲基。R4 表示具有脂肪族環基作為側鏈之2價烴基。*表示鍵結鍵) (R4 ) 上述式(II)中，R4 表示具有脂肪族環基作為側鏈之2價烴基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就感光性樹脂組合物之殘膜率與解像性之觀點而言，較佳為金剛烷環。 又，具有脂肪族環基作為側鏈之2價烴基中之2價烴基並無特別限定，例如可列舉：2價脂肪族基、2價芳香族環基、由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基。 2價脂肪族基可列舉直鏈狀、支鏈狀、環狀者。該等之中，就顯影溶解性之觀點而言，較佳為直鏈狀者，另一方面，就減輕顯影液向曝光部之滲透之觀點而言，較佳為環狀者。其碳數通常為1以上，較佳為3以上，更佳為6以上，又，較佳為25以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為2價直鏈狀脂肪族基之具體例，可列舉：亞甲基、伸乙基、伸正丙基、伸正丁基、伸正己基、伸正庚基等。該等之中，就骨架之剛直性之觀點而言，較佳為亞甲基。 作為2價支鏈狀脂肪族基之具體例，可列舉：伸異丙基、伸第二丁基、伸第三丁基、伸異戊基等。該等之中，就骨架之剛直性之觀點而言，較佳為伸第三丁基。 2價環狀脂肪族基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有成為強固之膜，基板密接性與電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。作為2價環狀脂肪族基之具體例，可列舉自環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等環去除2個氫原子所得之基。該等之中，就骨架之剛直性之觀點而言，較佳為自金剛烷環去除2個氫原子所得之基。 作為2價脂肪族基可具有之取代基，可列舉：羥基，甲氧基、乙氧基等碳數1〜5之烷氧基，羥基，硝基，氰基，羧基等。該等之中，就易合成性之觀點而言，較佳為未經取代。 又，作為2價芳香族環基，可列舉2價芳香族烴環基及2價芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為30以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為2價芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環。作為2價芳香族烴環基，例如可列舉具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為2價芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環。作為2價芳香族雜環基，例如可列舉具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。 該等之中，就圖案化特性之觀點而言，較佳為具有2個自由原子價之苯環或萘環，更佳為具有2價自由原子價之茀環。 作為2價芳香族環基可具有之取代基，可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。該等之中，就顯影溶解性、耐吸濕性之觀點而言，較佳為未經取代。 又，作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基，可列舉將1個以上之上述2價脂肪族基與1個以上之上述2價芳香族環基進行連結而獲得之基。 2價脂肪族基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 2價芳香族環基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基之具體例，可列舉上述式(I-A)〜(I-E)所表示之基等。該等之中，就骨架之剛直性與膜之疏水化之觀點而言，較佳為上述式(I-A)所表示之基。 作為側鏈之脂肪族環基於該等2價烴基上之鍵結態樣並無特別限定，例如可列舉：2價脂肪族基或2價芳香族環基之1個氫原子被該側鏈取代的態樣、或者包含構成2價脂肪族基之1個碳原子而構成作為側鏈之脂肪族環基的態樣。 又，上述式(II)所表示之部分結構就孔解像性之觀點而言，較佳為下述式(II-1)所表示之部分結構。 [化18](式(II-1)中，R3 與上述式(II)中含義相同。Rα 表示可具有取代基之1價脂肪族環基。n為1以上之整數。式(II-1)中之苯環可進而經任意之取代基取代) 再者，本說明書中之化學式中，*表示鍵結鍵。 (Rα ) 上述式(II-1)中，Rα 表示可具有取代基之1價脂肪族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為6個以下，較佳為4個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就強固之膜特性與電氣特性之觀點而言，較佳為金剛烷環。 作為脂肪族環基可具有之取代基，可列舉：羥基，甲氧基、乙氧基等碳數1〜5之烷氧基，羥基，硝基，氰基，羧基等。該等之中，就合成之容易性之觀點而言，較佳為未經取代。 n表示1以上之整數，較佳為2以上，又，較佳為3以下。藉由設為上述下限值以上，有膜硬化度與殘膜率變得良好之傾向，又，藉由設為上述上限值以下，有孔解像性變得良好之傾向。 該等之中，就強固之膜硬化度與電氣特性之觀點而言，較佳為金剛烷基。 如上所述，式(II-1)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數量亦無特別限定，可為1個，亦可為2個以上。 該等之中，就圖案化特性之觀點而言，較佳為未經取代。 以下列舉上述式(II-1)所表示之部分結構之具體例。 [化19][化20]又，上述式(II)所表示之部分結構就骨架之剛直性、及膜疏水化之觀點而言，較佳為下述式(II-2)所表示之部分結構。 [化21](式(II-2)中，R3 與上述式(II)中含義相同；Rβ 表示可具有取代基之2價脂肪族環基；式(II-2)中之苯環可進而經任意之取代基取代) (Rβ ) 上述式(II-2)中，Rβ 表示可具有取代基之2價脂肪族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為35以下，進而較佳為30以下。藉由設為上述下限值以上，有容易抑制顯影時之膜粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就保存穩定性之觀點而言，較佳為金剛烷環。 作為脂肪族環基可具有之取代基，可列舉：羥基，甲氧基、乙氧基等碳數1〜5之烷氧基，羥基，硝基，氰基，羧基等。該等之中，就合成之簡易性之觀點而言，較佳為未經取代。 該等之中，就保存穩定性及電氣特性之觀點而言，Rβ 較佳為2價金剛烷環基。 如上所述，式(II-2)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數量亦無特別限定，可為1個，亦可為2個以上。 該等之中，就圖案化特性之觀點而言，較佳為未經取代。 以下列舉上述式(II-2)所表示之部分結構之具體例。 [化22][化23][化24]另一方面，上述式(II)所表示之部分結構就塗膜殘膜率與圖案化特性之觀點而言，較佳為下述式(II-3)所表示之部分結構。 [化25](式(II-3)中，R3 及R4 與上述式(II)中含義相同；RZ 表示氫原子或多元酸殘基) 所謂多元酸殘基意指自多元酸或其酐去除1個OH基所得之1價基。再者，多元酸殘基亦可進而自多元酸或其酐再去除1個OH基而與式(II-3)所表示之其他分子中之RZ 共用OH基，即，可將複數個式(II-3)經由RZ 而連結。 作為多元酸，可列舉選自順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、二苯甲酮四羧酸、甲基六氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、氯菌酸、甲基四氫鄰苯二甲酸、聯苯四羧酸之1種或2種以上。 該等之中，就圖案化特性之觀點而言，較佳為順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、聯苯四羧酸，更佳為四氫鄰苯二甲酸、聯苯四羧酸、聯苯四羧酸。 環氧(甲基)丙烯酸酯樹脂(d-2)一分子中所含之上述式(II-3)所表示之部分結構可為1種或2種以上，例如可混合存在RZ 為氫原子者與RZ 為多元酸殘基者。 又，環氧(甲基)丙烯酸酯樹脂(d-2)一分子中所含之上述式(II)所表示之部分結構之數量並無特別限定，較佳為1個以上，更佳為3個以上，又，較佳為20個以下，更佳為15個以下，進而較佳為10個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 環氧(甲基)丙烯酸酯樹脂(d-2)之藉由凝膠滲透層析法(GPC)所測得之聚苯乙烯換算之重量平均分子量(Mw)並無特別限定，較佳為1,000以上，更佳為1,500以上，進而較佳為2,000以上，又，較佳為30,000以下，更佳為20,000以下，進而較佳為10,000以下，尤佳為5,000以下。藉由設為上述下限值以上，有圖案化特性變得良好之傾向，又，藉由設為上述上限值以下，有容易獲得強固之膜，不易產生表面粗糙之傾向。 環氧(甲基)丙烯酸酯樹脂(d-2)之酸值並無特別限定，較佳為10 mgKOH/g以上，更佳為20 mgKOH/g以上，進而較佳為40 mgKOH/g以上，進而更佳為60 mgKOH/g以上，尤佳為80 mgKOH/g以上，又，較佳為200 mgKOH/g以下，更佳為150 mgKOH/g以下，進而較佳為120 gKOH/g以下。藉由設為上述下限值以上，有容易獲得強固之膜，電特性提高之傾向，又，藉由設為上述上限值以下，有顯影溶解性提高，解像性變得良好之傾向。 「環氧(甲基)丙烯酸酯樹脂(d-1)及(d-2)之製法」 環氧(甲基)丙烯酸酯樹脂(d-1)及(d-2)可藉由如下方式獲得：對具有與上述式(I)及上述式(II)對應之結構之環氧樹脂(i)加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而與多元酸及/或其酐進行反應；或者(ii)加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，進而與多元醇以及多元酸及/或其酐進行反應。 作為成為原料之環氧樹脂，例如可較佳地使用苯酚酚醛清漆型環氧樹脂(例如日本化藥公司製造之「EPPN-201」、三菱化學公司製造之「EP-152」、「EP-154」)、(鄰/間/對)甲酚酚醛清漆型環氧樹脂(例如日本化藥公司製造之「EOCN-102S」、「EOCN-1020」、「EOCN-104S」)、將由二環戊二烯與苯酚反應獲得之酚樹脂進行縮水甘油化而成之環氧樹脂(例如日本化藥公司製造之「NC-7300」)、下述通式(D1)〜(D3)所表示之環氧樹脂等。具體而言，作為下述通式(D1)所表示之環氧樹脂，可列舉日本化藥公司製造之「XD-1000」，作為下述通式(D2)所表示之環氧樹脂，可列舉日本化藥公司製造之「NC-3000」等。 [化26]上述通式(D1)中，a為平均值，表示0〜10之數。R11 表示氫原子、鹵素原子、碳數1〜8之烷基、碳數3〜10之環烷基、苯基、萘基或聯苯基中之任一者。再者，一分子中存在之複數個R1 1 相互可相同或不同。 [化27]上述通式(D2)中，b為平均值，表示0〜10之數。R21 表示氫原子、鹵素原子、碳數1〜8之烷基、碳數3〜10之環烷基、苯基、萘基或聯苯基中之任一者。再者，一分子中存在之複數個R21 相互可相同或不同。 [化28]上述通式(D3)中，X表示下述通式(D3-1)或(D3-2)所表示之連結基。其中，分子結構中包含1個以上之金剛烷結構。c表示2或3之整數。 [化29]上述通式(D3-1)及(D3-2)中，R31 〜R34 及R35 〜R37 分別獨立地表示可具有取代基之金剛烷基、氫原子、可具有取代基之碳數1〜12之烷基、或可具有取代基之苯基。 該等之中，較佳為使用通式(D1)〜(D3)所表示之環氧樹脂。 作為α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯，可列舉：(甲基)丙烯酸、丁烯酸、鄰/間/對乙烯基苯甲酸、(甲基)丙烯酸之α位鹵烷基、烷氧基、鹵素、硝基、氰基取代體等單羧酸，琥珀酸2-(甲基)丙烯醯氧基乙酯、己二酸2-(甲基)丙烯醯氧基乙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、順丁烯二酸2-(甲基)丙烯醯氧基乙酯、琥珀酸2-(甲基)丙烯醯氧基丙酯、己二酸2-(甲基)丙烯醯氧基丙酯、四氫鄰苯二甲酸2-(甲基)丙烯醯氧基丙酯、鄰苯二甲酸2-(甲基)丙烯醯氧基丙酯、順丁烯二酸2-(甲基)丙烯醯氧基丙酯、琥珀酸2-(甲基)丙烯醯氧基丁酯、己二酸2-(甲基)丙烯醯氧基丁酯、氫鄰苯二甲酸2-(甲基)丙烯醯氧基丁酯、鄰苯二甲酸2-(甲基)丙烯醯氧基丁酯、順丁烯二酸2-(甲基)丙烯醯氧基丁酯，對(甲基)丙烯酸加成有ε-己內酯、β-丙內酯、γ-丁內酯、δ-戊內酯等內酯類之單體，或者對(甲基)丙烯酸羥基烷基酯、季戊四醇三(甲基)丙烯酸酯加成有琥珀酸(酐)、鄰苯二甲酸(酐)、順丁烯二酸(酐)等酸(酐)之單體，(甲基)丙烯酸二聚物等。 該等之中，就感度之方面而言，尤佳為(甲基)丙烯酸。 作為對環氧樹脂加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之方法，可採用公知方法。例如可於酯化觸媒之存在下，於50〜150℃之溫度下，使α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯與環氧樹脂進行反應。作為此處所用之酯化觸媒，可使用三乙胺、三甲胺、苄基二甲基胺、苄基二乙基胺等三級胺，氯化四甲基銨、氯化四乙基銨、氯化十二烷基三甲基銨等四級銨鹽等。 再者，環氧樹脂、α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯、及酯化觸媒均可單獨使用1種，亦可將2種以上併用。 關於α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之使用量，相對於環氧樹脂之環氧基1當量，較佳為0.5〜1.2當量之範圍，更佳為0.7〜1.1當量之範圍。若α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之使用量處於上述範圍內，則有不飽和基之導入量充足，其後與多元酸及/或其酐之反應亦變得充分之傾向。 作為多元酸及/或其酐，可列舉選自順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、二苯甲酮四羧酸、甲基六氫鄰苯二甲酸、內亞甲基四氫鄰苯二甲酸、氯菌酸、甲基四氫鄰苯二甲酸、聯苯四羧酸、及該等之酸酐等之1種或2種以上。 較佳為順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、均苯四甲酸、偏苯三甲酸、聯苯四羧酸、或該等之酸酐。尤佳為四氫鄰苯二甲酸、聯苯四羧酸、四氫鄰苯二甲酸酐或聯苯四羧酸二酐。 關於多元酸及/或其酐之加成反應，亦可採用公知方法，於與對環氧樹脂加成α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之加成反應相同的條件下，使之持續反應而可獲得目標物。多元酸及/或其酐成分之加成量較佳為如使生成之含羧基之環氧(甲基)丙烯酸酯樹脂之酸值成為10〜150 mgKOH/g之範圍的程度，更佳為如使上述酸值成為20〜140 mgKOH/g之範圍的程度。若含羧基之環氧(甲基)丙烯酸酯樹脂之酸值處於上述範圍內，則有鹼性顯影性或硬化性能變得良好之傾向。 再者，於該多元酸及/或其酐之加成反應時，可添加三羥甲基丙烷、季戊四醇、二季戊四醇等多官能醇而導入多支結構。 含羧基之環氧(甲基)丙烯酸酯樹脂通常藉由如下方式獲得：於環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物中混合多元酸及/或其酐後，或者於環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物中混合多元酸及/或其酐以及多官能醇後，進行加溫。於該情形時，多元酸及/或其酐與多官能醇之混合順序並無特別限制。藉由加溫，多元酸及/或其酐對環氧樹脂與α,β-不飽和單羧酸或具有羧基之α,β-不飽和單羧酸酯之反應物和多官能醇的混合物中存在之某個羥基進行加成反應。 「其他黏合劑樹脂」 本發明之感光性樹脂組合物所含之(d)黏合劑樹脂含有具有上述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有上述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者，亦可含有其以外之黏合劑樹脂(以下簡記為「其他黏合劑樹脂」)。 作為其他黏合劑樹脂，例如可列舉：丙烯酸系樹脂、含羧基之環氧樹脂、含羧基之胺基甲酸酯樹脂、酚醛清漆系樹脂、聚乙烯基苯酚系樹脂等，該等可單獨使用1種，亦可將複數種混合使用。 本發明之感光性樹脂組合物中之(d)黏合劑樹脂之含有比率於全部固形物成分中通常為1質量%以上，較佳為5質量%以上，更佳為10質量%以上，進而較佳為15質量%以上，又，通常為50質量%以下，較佳為45質量%以下，進而較佳為35質量%以下，尤佳為25質量%以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性變得良好之傾向，又，藉由設為上述上限值以下，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向。 (d)黏合劑樹脂中環氧(甲基)丙烯酸酯樹脂所占之含有比率並無特別限定，較佳為5質量%以上，更佳為30質量%以上，進而較佳為50質量%以上，又，通常為100質量%以下，尤佳為100質量%。藉由設為上述下限值以上，有圖案化特性或基板密接性變得良好之傾向。 又，(d)黏合劑樹脂中具有上述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有下述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者之所占之含有比率並無特別限定，較佳為5質量%以上，更佳為30質量%以上，進而較佳為50質量%以上，又，通常為100質量%以下，尤佳為100質量%。藉由設為上述下限值以上，有耐水性提高，塗膜面變得均勻之傾向。 [(e)聚合性單體] 本發明之感光性樹脂組合物含有(e)聚合性單體。藉由含有(e)聚合性單體，可獲得硬化性較高之膜。 本發明之感光性樹脂組合物中，(e)聚合性單體之中，可較佳地列舉具有乙烯性不飽和基之化合物(以下有時簡記為「乙烯性不飽和化合物」)。 所謂乙烯性不飽和化合物意指分子內具有1個以上之乙烯性不飽和鍵之化合物。進而，本發明中之感光性樹脂組合物較佳為含有具有2個以上之乙烯性不飽和基之化合物。 作為具有1個乙烯性不飽和鍵之化合物，例如可列舉：(甲基)丙烯酸、丁烯酸、異丁烯酸、順丁烯二酸、伊康酸、檸康酸等不飽和羧酸、及其烷基酯、(甲基)丙烯腈、(甲基)丙烯醯胺、苯乙烯等。 又，作為分子內具有2個以上之乙烯性不飽和鍵之化合物，例如可列舉：不飽和羧酸與多羥基化合物之酯類、含(甲基)丙烯醯氧基之磷酸酯類、羥基(甲基)丙烯酸酯化合物與聚異氰酸酯化合物之(甲基)丙烯酸胺基甲酸酯類、以及(甲基)丙烯酸或羥基(甲基)丙烯酸酯化合物與聚環氧化合物之環氧(甲基)丙烯酸酯類等。 該等可單獨使用1種或將2種以上併用。 (e-1)不飽和羧酸與多羥基化合物之酯類 作為不飽和羧酸與多羥基化合物之酯類(以下有時簡記為「酯(甲基)丙烯酸酯類」)，具體而言，可例示以下之化合物。 上述不飽和羧酸與糖醇之反應物：作為糖醇，例如可列舉：乙二醇、聚乙二醇(加成數2〜14)、丙二醇、聚丙二醇(加成數2〜14)、三亞甲基二醇、四亞甲基二醇、六亞甲基二醇、三羥甲基丙烷、甘油、季戊四醇、二季戊四醇等。 上述不飽和羧酸與糖醇之環氧烷加成物的反應物：糖醇可列舉與上述相同者。作為環氧烷加成物，例如可列舉：環氧乙烷加成物、或環氧丙烷加成物等。 上述不飽和羧酸與醇胺之反應物：作為醇胺類，例如可列舉：二乙醇胺、三乙醇胺等。 作為上述不飽和羧酸與多羥基化合物之酯類，更具體而言，可例示以下之化合物。 乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、三羥甲基丙烷二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷環氧乙烷加成三(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、甘油環氧丙烷加成三(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等、及同樣之丁烯酸酯、異丁烯酸酯、順丁烯二酸酯、伊康酸酯、檸康酸酯等。 另外，作為上述不飽和羧酸與多羥基化合物之酯類，可列舉上述不飽和羧酸與對苯二酚、間苯二酚、鄰苯三酚、雙酚F、雙酚A等芳香族多羥基化合物或該等之環氧乙烷加成物的反應物。具體而言，例如雙酚A二(甲基)丙烯酸酯、雙酚A雙[氧乙烯(甲基)丙烯酸酯]、雙酚A雙[縮水甘油醚(甲基)丙烯酸酯]等。 進而，作為上述不飽和羧酸與多羥基化合物之酯類，可列舉上述不飽和羧酸與異氰尿酸三(2-羥基乙基)酯等雜環式多羥基化合物之反應物。具體而言，例如異氰尿酸三(2-羥基乙基)酯之二(甲基)丙烯酸酯、三(甲基)丙烯酸酯等。 又，進而，作為上述不飽和羧酸與多羥基化合物之酯類，可列舉上述不飽和羧酸與多元羧酸與多羥基化合物之反應物。具體而言，例如(甲基)丙烯酸與鄰苯二甲酸與乙二醇之縮合物、(甲基)丙烯酸與順丁烯二酸與二乙二醇之縮合物、(甲基)丙烯酸與對苯二甲酸與季戊四醇之縮合物、(甲基)丙烯酸與己二酸與丁二醇與甘油之縮合物等。 (e-2)羥基(甲基)丙烯酸酯化合物與聚異氰酸酯化合物之(甲基)丙烯酸胺基甲酸酯類 作為羥基(甲基)丙烯酸酯化合物，例如可列舉：(甲基)丙烯酸羥基甲酯、(甲基)丙烯酸羥基乙酯、四羥甲基乙烷三(甲基)丙烯酸酯等羥基(甲基)丙烯酸酯化合物。 又，作為聚異氰酸酯化合物，例如可列舉： 六亞甲基二異氰酸酯、1,8-二異氰酸基-4-異氰酸基甲基辛烷等脂肪族聚異氰酸酯； 環己烷二異氰酸酯、二甲基環己烷二異氰酸酯、4,4-亞甲基雙(異氰酸環己酯)、異佛爾酮二異氰酸酯、聯環庚烷三異氰酸酯等脂環式聚異氰酸酯； 4,4-二苯基甲烷二異氰酸酯、硫代磷酸三(異氰酸基苯基)酯等芳香族聚異氰酸酯； 異氰尿酸酯等雜環式聚異氰酸酯； 藉由日本專利特開2001-260261號公報記載之方法所製造之脲基甲酸酯改性聚異氰尿酸酯； 等聚異氰酸酯化合物。 作為羥基(甲基)丙烯酸酯化合物與聚異氰酸酯化合物之(甲基)丙烯酸胺基甲酸酯類，其中，較佳為含有上述脲基甲酸酯改性聚異氰尿酸酯之(甲基)丙烯酸胺基甲酸酯類。含有脲基甲酸酯改性聚異氰尿酸酯之(甲基)丙烯酸胺基甲酸酯類於如下方面較佳：黏度較低，於溶劑中之溶解性優異，且藉由光硬化及/或熱硬化而對提高與基板之密接性及膜強度有效。 作為本發明中之上述(甲基)丙烯酸胺基甲酸酯類，可使用市售者。具體而言，例如可列舉：新中村化學公司製造之商品名「U-4HA」、「UA-306A」、「UA-MC340H」、「UA-MC340H」、「U6LPA」，BAYER Japan公司製造之作為具有脲基甲酸酯骨架之化合物的「AGROR4060」等。 作為本發明中之上述(甲基)丙烯酸胺基甲酸酯類，就感度之觀點而言，較佳為一分子中具有4個以上(較佳為6個以上，更佳為8個以上)之胺基甲酸酯鍵[-NH-CO-O-]、及4個以上(較佳為6個以上，更佳為8個以上)之(甲基)丙烯醯氧基的化合物。該化合物例如可藉由使下述(i)之化合物與下述(ii)之化合物進行反應而獲得。 (i)一分子中具有4個以上之胺基甲酸酯鍵之化合物 例如可列舉： 使季戊四醇、聚甘油等一分子中具有4個以上之羥基之化合物與六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯、甲苯二異氰酸酯等二異氰酸酯化合物進行反應而獲得之化合物(i-1)； 或者 使乙二醇等一分子中具有2個以上之羥基之化合物與Asahi Kasei Chemicals公司製造之「Duranate 24A-100」、Asahi Kasei Chemicals公司製造之「Duranate 22A-75PX」、Asahi Kasei Chemicals公司製造之「Duranate 21S-75E」、Asahi Kasei Chemicals公司製造之「Duranate 18H-70B」等縮二脲型、Asahi Kasei Chemicals公司製造之「Duranate P-301-75E」、Asahi Kasei Chemicals公司製造之「Duranate E-402-90T」、Asahi Kasei Chemicals公司製造之「Duranate E-405-80T」等加成物型等一分子中具有3個以上之異氰酸基之化合物進行反應而獲得之化合物(i-2)； 或者 使(甲基)丙烯酸異氰酸基乙酯等進行聚合或共聚合而獲得之化合物(i-3)等。 作為此種化合物，可使用市售品，例如可列舉Asahi Kasei Chemicals公司製造之「Duranate ME20-100」。 (ii)一分子中具有4個以上之(甲基)丙烯醯氧基之化合物 例如可列舉：季戊四醇二(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六丙烯酸酯等一分子中具有1個以上之羥基及2個以上、較佳為3個以上之(甲基)丙烯醯氧基的化合物。 此處，作為上述(i)之化合物之分子量，較佳為500〜200,000，尤佳為1,000〜150,000。又，作為上述(甲基)丙烯酸胺基甲酸酯類之分子量，較佳為600〜150,000。 再者，此種(甲基)丙烯酸胺基甲酸酯類例如可藉由如下方法製造：使上述(i)之化合物與上述(ii)之化合物於甲苯或乙酸乙酯等有機溶劑中，於10〜150℃下反應5分鐘〜3小時左右。於該情形時，較佳為將前者之異氰酸基與後者之羥基的莫耳比設為1/10〜10/1之比率，視需要使用二月桂酸正丁基錫等觸媒。 (e-3)(甲基)丙烯酸或羥基(甲基)丙烯酸酯化合物與聚環氧化合物之環氧(甲基)丙烯酸酯類 作為聚環氧化合物，例如可列舉： (聚)乙二醇聚縮水甘油醚、(聚)丙二醇聚縮水甘油醚、(聚)四亞甲基二醇聚縮水甘油醚、(聚)五亞甲基二醇聚縮水甘油醚、(聚)新戊二醇聚縮水甘油醚、(聚)六亞甲基二醇聚縮水甘油醚、(聚)三羥甲基丙烷聚縮水甘油醚、(聚)甘油聚縮水甘油醚、(聚)山梨糖醇聚縮水甘油醚等脂肪族聚環氧化合物； 苯酚酚醛清漆聚環氧化合物、溴化苯酚酚醛清漆聚環氧化合物、(鄰/間/對)甲酚酚醛清漆聚環氧化合物、雙酚A聚環氧化合物、雙酚F聚環氧化合物等芳香族聚環氧化合物； 山梨醇酐聚縮水甘油醚、異氰尿酸三縮水甘油酯、異氰尿酸三縮水甘油基三(2-羥基乙基)酯等雜環式聚環氧化合物等聚環氧化合物。 關於作為(甲基)丙烯酸或羥基(甲基)丙烯酸酯化合物與聚環氧化合物之反應物的環氧(甲基)丙烯酸酯類，可列舉如該等之聚環氧化合物與(甲基)丙烯酸或上述羥基(甲基)丙烯酸酯化合物之反應物等。 (e-4)其他乙烯性不飽和化合物 作為其他乙烯性不飽和化合物，除上述以外，例如可列舉：伸乙基雙(甲基)丙烯醯胺等(甲基)丙烯醯胺類；鄰苯二甲酸二烯丙酯等烯丙酯類；鄰苯二甲酸二乙烯酯等含乙烯基之化合物類；藉由利用五硫化二磷等將含醚鍵之乙烯性不飽和化合物之醚鍵進行硫化而變為硫醚鍵，從而使交聯速度獲得提高的含硫醚鍵之化合物類。 該等分別可單獨使用，亦可將2種以上併用。 本發明中，作為乙烯性不飽和化合物，就聚合性、交聯性等方面而言，較佳為包含分子內具有2個以上之乙烯性不飽和基之化合物。其中，較佳為酯(甲基)丙烯酸酯類、含(甲基)丙烯醯氧基之磷酸酯類、或(甲基)丙烯酸胺基甲酸酯類，更佳為酯(甲基)丙烯酸酯類。該酯(甲基)丙烯酸酯類之中，尤佳為雙酚A二(甲基)丙烯酸酯、雙酚A雙[氧乙烯(甲基)丙烯酸酯]、雙酚A雙[縮水甘油醚(甲基)丙烯酸酯]等與芳香族多羥基化合物或該等之環氧乙烷加成物的反應物。 又，本發明之乙烯性不飽和化合物中，不含芳香族環者、或者含有未經取代或p(對)位具有取代基之苯基者可抑制層間絕緣膜因加熱處理產生之變色(紅色著色)，因此較佳。作為此種乙烯性不飽和化合物，例如可列舉：脂肪族之多官能(甲基)丙烯酸酯、及具有雙酚A或茀骨架之多元醇之(甲基)丙烯酸酯化合物等。 該等之中，就硬化性與解像性之均衡性之觀點而言，作為(e)聚合性單體，較佳為使用(e-3)(甲基)丙烯酸或羥基(甲基)丙烯酸酯化合物與聚環氧化合物之環氧(甲基)丙烯酸酯類，尤佳為較佳為下述式(III)所表示之(甲基)丙烯酸酯化合物。 [化30](式(III)中，R5 表示具有環狀烴基作為側鏈之2價烴基。R6 分別獨立地表示可具有取代基之伸烷基。R7 分別獨立地表示氫原子或甲基。k及l分別獨立地表示1〜20之整數) (R5 ) 上述式(III)中，R5 表示具有環狀烴基作為側鏈之2價烴基。 作為環狀烴基，可列舉脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為6個以下，較佳為4個以下，更佳為3個以下。藉由設為上述下限值以上，有成為強固之塗膜，殘膜率變得良好之傾向，又，藉由設為上述上限值以下，有顯影溶解性提高，圖案化特性變得良好之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有成為強固之塗膜，殘膜率變得良好之傾向，又，藉由設為上述上限值以下，有顯影溶解性提高，圖案化特性變得良好之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就強固之膜質與圖案化特性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，更佳為3個以上，又，通常為6個以下，較佳為4個以下。藉由設為上述下限值以上，有膜質強固，基板密接性變得良好之傾向，又，藉由設為上述上限值以下，有顯影溶解性提高，圖案化特性變得良好之傾向。 作為芳香族環基，可列舉芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，進而更佳為10以上，尤佳為12以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有基板密接性變得良好之傾向，又，藉由設為上述上限值以下，有圖案化特性變得良好之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、蒽環、菲環、茀環等。該等之中，就顯影溶解性之觀點而言，較佳為苯環。 又，具有環狀烴基作為側鏈之2價烴基中之2價烴基並無特別限定，例如可列舉：2價脂肪族基、2價芳香族環基、由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基。 作為2價脂肪族基，可列舉直鏈狀、支鏈狀、環狀者或由該等組合而成者。該等之中，就顯影溶解性之觀點而言，較佳為直鏈狀者，另一方面，就減輕顯影液向曝光部之滲透之觀點而言，較佳為環狀者。其碳數通常為1以上，較佳為3以上，更佳為6以上，又，較佳為30以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為2價直鏈狀脂肪族基之具體例，可列舉：亞甲基、伸乙基、伸正丙基、伸正丁基、伸正己基、伸正庚基等。該等之中，就骨架之剛直性之觀點而言，較佳為亞甲基。 作為2價支鏈狀脂肪族基之具體例，可列舉：伸異丙基、伸第二丁基、伸第三丁基、伸異戊基等。該等之中，就骨架之剛直性之觀點而言，較佳為伸第三丁基。 2價環狀脂肪族基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有成為強固之膜，基板密接性與電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。作為2價環狀脂肪族基之具體例，可列舉自環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等環去除2個氫原子所得之基。該等之中，就骨架之剛直性之觀點而言，較佳為自金剛烷環去除2個氫原子所得之基。 作為2價脂肪族基可具有之取代基，可列舉：羥基，甲氧基、乙氧基等碳數1〜5之烷氧基，羥基，硝基，氰基，羧基等。該等之中，就易合成性之觀點而言，較佳為未經取代。 又，作為2價芳香族環基，可列舉2價芳香族烴環基及2價芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為40以下，更佳為35以下，進而較佳為30以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為2價芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環。作為2價芳香族烴環基，例如可列舉具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、并四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、乙烷合萘環、螢蒽環、茀環等之基。 又，作為2價芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環。作為2價芳香族雜環基，例如可列舉具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、呸啶環、喹唑啉環、喹唑啉酮環、薁環等之基。該等之中，就圖案化特性之觀點而言，較佳為具有2個自由原子價之苯環或萘環，更佳為具有2價自由原子價之苯環。 作為2價芳香族環基可具有之取代基，可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。該等之中，就顯影溶解性、耐吸濕性之觀點而言，較佳為未經取代。 又，作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基，可列舉將1個以上之上述2價脂肪族基與1個以上之上述2價芳香族環基進行連結而獲得之基。 2價脂肪族基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 2價芳香族環基之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下，更佳為3個以下。藉由設為上述下限值以上，有容易獲得強固之膜，不易產生表面粗糙，與基板之密接性、電氣特性變得良好之傾向，又，藉由設為上述上限值以下，有容易抑制膜之表面平滑性或感度之劣化，解像性提高之傾向。 作為由1個以上之2價脂肪族基與1個以上之2價芳香族環基連結而成之基之具體例，可列舉上述式(I-A)〜(I-E)所表示之基等。該等之中，就骨架之剛直性與膜之疏水化之觀點而言，較佳為上述式(I-A)所表示之基。 作為側鏈之環狀烴基於該等2價烴基上之鍵結態樣並無特別限定，例如可列舉：2價脂肪族基或2價芳香族環基之1個氫原子被該側鏈取代的態樣、或者包含構成2價脂肪族基之1個碳原子而構成作為側鏈之環狀烴基的態樣。 (R6 ) 上述式(III)中，R6 分別獨立地表示可具有取代基之伸烷基。 作為伸烷基，可列舉直鏈狀、支鏈狀、環狀者或由該等組合而成者。該等之中，就顯影時之溶解性之觀點而言，較佳為直鏈狀。其碳數通常為1以上，較佳為2以上，更佳為6以上，進而較佳為10以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下。藉由設為上述下限值以上，有基板密接與孔解像性變得良好之傾向，又，藉由設為上述上限值以下，有未曝光部之殘渣減少之傾向。 作為伸烷基之具體例，可列舉：伸乙基、伸正丙基、伸異丙基、伸第二丁基、伸第三丁基、伸環己基等。該等之中，就顯影溶解性之觀點而言，較佳為伸乙基。 作為伸烷基可具有之取代基，可列舉：羥基、甲氧基、乙氧基、碸基、磺醯基、羧基、苄基等。該等之中，就曝光感度之觀點而言，較佳為未經取代，就顯影溶解性之觀點而言，較佳為羥基。 式(III)中，k及l分別獨立地表示1〜20之整數。較佳為2以上，更佳為3以上，又，較佳為15以下，更佳為13以下。藉由設為上述下限值以上，有圖案化特性變得良好之傾向，又，藉由設為上述上限值以下，有成為強固之塗膜，殘膜率變得良好之傾向。 又，上述式(III)所表示之(甲基)丙烯酸酯化合物之中，就較高解像性之觀點而言，較佳為下述式(III-1)所表示之(甲基)丙烯酸酯化合物。 [化31](式(III-1)中，R6 、R7 、k及l與上述式(III)中含義相同。Rγ 表示可具有取代基之1價環狀烴基。m為1以上之整數。式(III-1)中之苯環可進而經任意之取代基取代) (Rγ ) 上述式(III-1)中，Rγ 表示可具有取代基之1價環狀烴基。 作為環狀烴基，可列舉脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為6個以下，較佳為4個以下，更佳為3個以下。藉由設為上述下限值以上，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向，又，藉由設為上述上限值以下，可保證未曝光部之鹼溶解性，因此有解像性提高之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向，又，藉由設為上述上限值以下，可保證未曝光部之鹼溶解性，因此有解像性提高之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就將顯影液向曝光部之滲透程度抑制為較低，抑制膜之表面平滑性或感度之劣化的觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，更佳為3個以上，又，通常為6個以下，較佳為5個以下。藉由設為上述下限值以上，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向，又，藉由設為上述上限值以下，可保證未曝光部之鹼溶解性，因此有解像性提高之傾向。 作為芳香族環基，可列舉芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為6以上，較佳為8以上，更佳為10以上，又，較佳為40以下，更佳為35以下，進而較佳為30以下。藉由設為上述下限值以上，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向，又，藉由設為上述上限值以下，可保證未曝光部之鹼溶解性，因此有解像性提高之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、聯苯環、聯三伸苯環、菲環、茀環等。該等之中，就顯影液之滲透特性與解像性之保證之觀點而言，較佳為茀環。 作為環狀烴基可具有之取代基，可列舉：羥基；甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、戊基、異戊基等碳數1〜5之烷基；甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就易合成性之觀點而言，較佳為未經取代。 m表示1以上之整數，較佳為2以上，又，較佳為3以下。藉由設為上述下限值以上，有將顯影液向曝光部之滲透程度抑制為較低，容易抑制膜之表面平滑性或感度之劣化之傾向，又，藉由設為上述上限值以下，可保證未曝光部之鹼溶解性，因此有解像性提高之傾向。 該等之中，就塗膜之耐吸濕性、與未曝光部之鹼溶解性之保證之觀點而言，Rγ 較佳為1價脂肪族環基，更佳為金剛烷基。 如上所述，式(III-1)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數量亦無特別限定，可為1個，亦可為2個以上。 該等之中，就圖案化特性之觀點而言，較佳為未經取代。 以下列舉上述式(III-1)所表示之(甲基)丙烯酸酯化合物之具體例。 [化32][化33]又，上述式(III)所表示之(甲基)丙烯酸酯化合物就塗膜之耐吸濕性、與未曝光部之鹼溶解性之保證之觀點而言，較佳為下述式(III-2)所表示之(甲基)丙烯酸酯化合物。 [化34](式(III-2)中，R6 、R7 、k及l與上述式(III)中含義相同。Rδ 表示可具有取代基之2價環狀烴基。式(III-2)中之苯環可進而經任意之取代基取代) (Rδ ) 上述式(III-2)中，Rδ 表示可具有取代基之2價環狀烴基。 作為環狀烴基，可列舉脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，又，通常為10個以下，較佳為5個以下。藉由設為上述下限值以上，有成為強固之塗膜，殘膜率提高之傾向，又，藉由設為上述上限值以下，有圖案化特性提高之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下。藉由設為上述下限值以上而提高膜疏水性，從而有基板密接性提高之傾向，又，藉由設為上述上限值以下而增強未曝光時之顯影溶解性，藉此有圖案化特性提高之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就基板密接性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1個以上，較佳為2個以上，更佳為3個以上，又，通常為6個以下，較佳為4個以下。藉由設為上述下限值以上，有成為強固之塗膜，殘膜率提高之傾向，又，藉由設為上述上限值以下，有圖案化特性提高之傾向。 作為芳香族環基，可列舉芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，進而較佳為10以上，又，較佳為30以下，更佳為25以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，有塗膜變得疏水化，基板密接性提高之傾向，又，藉由設為上述上限值以下，可保證顯影溶解性，因此有圖案化特性提高之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、蒽環、菲環、茀環等。該等之中，就基於塗膜疏水化之基板密接性之觀點而言，較佳為茀環。 作為環狀烴基可具有之取代基，可列舉：羥基；甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、戊基、異戊基等碳數1〜5之烷基；甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就顯影溶解性與曝光感度之觀點而言，較佳為未經取代。 該等之中，就保存穩定性及電氣特性之觀點而言，Rδ 較佳為2價脂肪族環基，更佳為2價金剛烷環基。 另一方面，就塗膜之低吸濕性及圖案化特性之觀點而言，Rδ 較佳為2價芳香族環基，更佳為2價茀環基。 如上所述，式(III-2)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數量亦無特別限定，可為1個，亦可為2個以上。 該等之中，就圖案化特性之觀點而言，較佳為未經取代。 以下列舉上述式(III-2)所表示之(甲基)丙烯酸酯化合物之具體例。 [化35][化36][化37]本發明之感光性樹脂組合物中，關於(e)聚合性單體之含有比率，相對於全部固形物成分，通常為1質量%以上，較佳為3質量%以上，又，通常為20質量%以下，較佳為18質量%以下，更佳為15質量%以下，進而較佳為12質量%以下，尤佳為10質量%以下。藉由設為上述下限值以上，有膜硬化性提高之傾向，又，藉由設為上述上限值以下，有可抑制塗膜表面之膜粗糙之傾向。 又，上述式(III)所表示之(甲基)丙烯酸酯化合物之含有比率並無特別限定，相對於全部固形物成分，較佳為0.5質量%以上，更佳為1質量%以上，進而較佳為2質量%以上，又，較佳為15質量%以下，更佳為10質量%以下，進而較佳為8質量%以下。藉由設為上述下限值以上，有電氣特性與孔解像性優化之傾向，又，藉由設為上述上限值以下，有抑制塗膜表面之膜粗糙之傾向。 [(f)聚合起始劑] 本發明之感光性樹脂組合物含有(f)聚合起始劑。藉由含有(f)聚合起始劑，利用曝光而發生之光硬化進行。聚合起始劑可使用公知之任意者，可列舉於紫外線至可見光線照射下能夠產生使乙烯性不飽和基聚合之自由基之化合物。 以下列舉本發明中可使用之聚合起始劑之具體例。 (i)2-(4-甲氧基苯基)-4,6-雙(三氯甲基)均三𠯤、2-(4-甲氧基萘基)-4,6-雙(三氯甲基)均三𠯤、2-(4-乙氧基萘基)-4,6-雙(三氯甲基)均三𠯤、2-(4-乙氧基羰基萘基)-4,6-雙(三氯甲基)均三𠯤等鹵甲基化三𠯤衍生物。 (ii)鹵甲基化㗁二唑衍生物、2-(鄰氯苯基)-4,5-二苯基咪唑二聚物、2-(鄰氯苯基)-4,5-雙(3'-甲氧基苯基)咪唑二聚物、2-(鄰氟苯基)-4,5-二苯基咪唑二聚物、2-(鄰甲基苯基)-4,5-二苯基咪唑二聚物、2-(鄰甲氧基苯基)-4,5-二苯基咪唑二聚物等咪唑衍生物。 (iii)安息香甲醚、安息香異丁醚、安息香異丙醚等安息香烷基醚類。 (iv)2-甲基蒽醌、2-乙基蒽醌、2-第三丁基蒽醌、1-氯蒽醌等蒽醌衍生物。 (v)苯并蒽酮衍生物。 (vi)二苯甲酮、米其勒酮、2-甲基二苯甲酮、3-甲基二苯甲酮、4-甲基二苯甲酮、2-氯二苯甲酮、4-溴二苯甲酮、2-羧基二苯甲酮等二苯甲酮衍生物。 (vii)2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基苯乙酮、1-羥基環己基苯基酮、α-羥基-2-甲基苯基丙酮、1-羥基-1-甲基乙基-(對異丙基苯基)酮、1-羥基-1-(對十二烷基苯基)酮、2-甲基-(4'-(甲硫基)苯基)-2-𠰌啉基-1-丙酮、1,1,1-三氯甲基-(對丁基苯基)酮等苯乙酮衍生物。 (viii)9-氧硫𠮿、2-乙基9-氧硫𠮿、2-異丙基9-氧硫𠮿、2-氯9-氧硫𠮿、2,4-二甲基9-氧硫𠮿、2,4-二乙基9-氧硫𠮿、2,4-二異丙基9-氧硫𠮿等9-氧硫𠮿衍生物。 (ix)對二甲基胺基苯甲酸乙酯、對二乙基胺基苯甲酸乙酯等苯甲酸酯衍生物。 (x)9-苯基吖啶、9-(對甲氧基苯基)吖啶等吖啶衍生物。 (xi)9,10-二甲基苯并啡𠯤等啡𠯤衍生物。 (xii)二環戊二烯基-Ti-二氯化物、二環戊二烯基-Ti-聯苯、二環戊二烯基-Ti-雙-2,3,4,5,6-五氟苯-1-基、二環戊二烯基-Ti-雙-2,3,5,6-四氟苯-1-基、二環戊二烯基-Ti-雙-2,4,6-三氟苯-1-基、二環戊二烯基-Ti-2,6-二氟苯-1-基、二環戊二烯基-Ti-2,4-二氟苯-1-基、二甲基環戊二烯基-Ti-雙-2,3,4,5,6-五氟苯-1-基、二甲基環戊二烯基-Ti-雙-2,6-二氟苯-1-基、二環戊二烯基-Ti-2,6-二氟-3-(吡咯-1-基)-苯-1-基等二茂鈦衍生物。 (xiii)2-甲基-1[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)丁酮-1-酮、2-苄基-2-二甲基胺基-1-(4-𠰌啉基苯基)丁烷-1-酮、苯甲酸4-二甲基胺基乙酯、苯甲酸4-二甲基胺基異戊酯、4-二乙基胺基苯乙酮、4-二甲基胺基苯丙酮、1,4-二甲基胺基苯甲酸2-乙基己酯、2,5-雙(4-二乙基胺基亞苄基)環己酮、7-二乙基胺基-3-(4-二乙基胺基苯甲醯基)香豆素、4-(二乙基胺基)查耳酮等α-胺基烷基苯酮系化合物。 (xiv)2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦等醯基氧化膦系化合物。 (xv)1,2-辛二酮-1-[4-(苯硫基)苯基]-2-(O-苯甲醯基肟)、乙酮-1-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-1-(O-乙醯基肟)。 (xvi)以日本專利特開2000-80068號公報、日本專利特開2001-233842號公報、日本專利特開2001-235858號公報、日本專利特開2005-182004號公報、國際公開第2002/00903號及日本專利特開2007-041493號公報中記載之化合物為代表之肟酯系化合物等。 聚合起始劑之中，就圖案化特性與透明性之觀點而言，較佳為肟酯系化合物，更佳為上述(xv)或(xvi)，其中，尤佳地使用下述結構之化合物Y。 [化38]該等聚合起始劑可單獨使用或將複數種組合使用。作為組合，例如可列舉日本專利特公昭53-12802號公報、日本專利特開平1-279903號公報、日本專利特開平2-48664號公報、日本專利特開平4-164902號公報或日本專利特開平6-75373號公報等中記載之聚合起始劑之組合。 作為本發明之感光性樹脂組合物中之聚合起始劑之含有比率，相對於全部固形物成分，通常為0.1質量%以上，較佳為0.5質量%以上，更佳為1質量%以上，進而較佳為2質量%以上，尤佳為3質量%以上，又，通常為40質量%以下，較佳為30質量%以下，更佳為20質量%以下，進而較佳為10質量%以下，尤佳為7質量%以下。藉由設為上述下限值以上，有硬化性變得充分，可抑制膜強度降低之傾向，藉由設為上述上限值以下，有熱收縮之程度變小，可抑制熱硬化後產生裂縫、裂痕之傾向。 [(g)界面活性劑] 本發明中之感光性樹脂組合物基於組合物作為塗佈液之塗佈性、及感光性樹脂組合物層之顯影性提高等之目的，可含有非離子性、陰離子性、陽離子性、兩性界面活性劑、或者氟系或聚矽氧系等之界面活性劑。 作為上述非離子性界面活性劑，例如可列舉：聚氧乙烯烷基醚類、聚氧乙烯聚氧丙烯烷基醚類、聚氧乙烯烷基苯醚類、聚氧乙烯烷基酯類、聚氧乙烯脂肪酸酯類、甘油脂肪酸酯類、聚氧乙烯甘油脂肪酸酯類、季戊四醇脂肪酸酯類、聚氧乙烯季戊四醇脂肪酸酯類、山梨醇酐脂肪酸酯類、聚氧乙烯山梨醇酐脂肪酸酯類、山梨糖醇脂肪酸酯類、聚氧乙烯山梨糖醇脂肪酸酯類等。作為該等之市售品，可列舉：花王公司製造之「Emulgen 104P」、「Emulgen A60」等聚氧乙烯系界面活性劑等。 又，作為上述陰離子性界面活性劑，例如可列舉：烷基磺酸鹽類、烷基苯磺酸鹽類、烷基萘磺酸鹽類、聚氧乙烯烷基醚磺酸鹽類、烷基硫酸鹽類、烷基硫酸酯鹽類、高級醇硫酸酯鹽類、脂肪族醇硫酸酯鹽類、聚氧乙烯烷基醚硫酸鹽類、聚氧乙烯烷基苯醚硫酸鹽類、烷基磷酸酯鹽類、聚氧乙烯烷基醚磷酸鹽類、聚氧乙烯烷基苯醚磷酸鹽類、特殊高分子系界面活性劑等。該等之中，較佳為特殊高分子系界面活性劑，更佳為特殊聚羧酸型高分子系界面活性劑。 作為此種陰離子性界面活性劑，可使用市售品，例如關於烷基硫酸酯鹽類，可列舉花王公司製造之「Emal 10」等，關於烷基萘磺酸鹽類，可列舉花王公司製造之「Pelex NB-L」等，關於特殊高分子系界面活性劑，可列舉花王公司製造之「Homogenol L-18」、「Homogenol L-100」等。 進而，作為上述陽離子性界面活性劑，可列舉：四級銨鹽類、咪唑啉衍生物類、胺鹽類等，又，作為上述兩性界面活性劑，可列舉：甜菜鹼型化合物類、咪唑鎓鹽類、咪唑啉類、胺基酸類等。該等之中，較佳為四級銨鹽類，更佳為硬脂基三甲基銨鹽類。作為市售者，例如關於烷基胺鹽類，可列舉花王公司製造之「Acetamin(註冊商標)24」等，關於四級銨鹽類，可列舉花王公司製造之「Quartamin(註冊商標，以下相同)24P」、「Quartamin 86W」等。 另一方面，作為上述氟系界面活性劑，適宜為於末端、主鏈及側鏈之至少任一部位具有氟烷基或氟伸烷基之化合物。 具體而言，例如可列舉：1,1,2,2-四氟辛基(1,1,2,2-四氟丙基)醚、1,1,2,2-四氟辛基己基醚、八乙二醇二(1,1,2,2-四氟丁基)醚、六乙二醇二(1,1,2,2,3,3-六氟戊基)醚、八丙二醇二(1,1,2,2-四氟丁基)醚、六丙二醇二(1,1,2,2,3,3-六氟戊基)醚、全氟十二烷基磺酸鈉、1,1,2,2,8,8,9,9,10,10-十氟十二烷、1,1,2,2,3,3-六氟癸烷等。 作為該等之市售品，可列舉：BM Chemie公司製造之「BM-1000」、「BM-1100」，DIC公司製造之「MEGAFAC(註冊商標，以下相同)F142D」、「MEGAFAC F172」、「MEGAFAC F173」、「MEGAFAC F183」、「MEGAFAC F470」、「MEGAFAC F475」，3M公司製造之「FC430」、「FC4432」，NEOS公司製造之「DFX-18」等。 又，作為聚矽氧系界面活性劑，例如可列舉：Dow Corning Toray公司製造之「Toray Silicone DC3PA」、「Toray Silicone SH7PA」、「Toray Silicone DC11PA」、「Toray Silicone SH21PA」、「Toray Silicone SH28PA」、「Toray Silicone SH29PA」、「Toray Silicone SH30PA」、「Toray Silicone SH8400」、「FZ2122」，Momentive Performance Materials公司製造之「TSF-4440」、「TSF-4300」、「TSF-4445」、「TSF-4460」、「TSF-4452」，Silicone公司製造之「KP341」，BYK-Chemie公司製造之「BYK323」、「BYK330」等市售品。 該等界面活性劑之中，就塗佈膜厚之均勻性之觀點而言，較佳為氟系界面活性劑、聚矽氧系界面活性劑。 界面活性劑亦可為2種以上之組合，可列舉：聚矽氧系界面活性劑/氟系界面活性劑、聚矽氧系界面活性劑/特殊高分子系界面活性劑、氟系界面活性劑/特殊高分子系界面活性劑之組合等。該等之中，較佳為聚矽氧系界面活性劑/氟系界面活性劑。 關於該聚矽氧系界面活性劑/氟系界面活性劑之組合，例如可列舉：Momentive Performance Materials公司製造之「TSF4460」/NEOS公司製造之「DFX-18」、BYK-Chemie公司製造之「BYK-300」或「BYK-330」/Seimi Chemical公司製造之「S-393」、Shin-Etsu Silicones公司製造之「KP340」/Dainippon Ink公司製造之「F-478」或「F-475」、Dow Corning Toray公司製造之「SH7PA」/Daikin公司製造之「DS-401」、Dow Corning Toray公司製造之「FZ2122」/3M公司製造之「FC4432」、Nippon Unicar公司製造之「L-77」/3M公司製造之「FC4430」等。 於本發明中之感光性樹脂組合物含有界面活性劑之情形時，感光性樹脂組合物中之界面活性劑之含有比率於全部固形物成分中較佳為10質量%以下，更佳為0.01〜5質量%。 [其他成分] 本發明之感光性樹脂組合物可進而含有熱交聯劑、接著助劑、硬化劑及紫外線吸收劑等添加劑，作為該等成分，例如可列舉國際公開第2007/139005號中所記載者。 ＜感光性樹脂組合物之製造方法＞ 其次，說明製造本發明之感光性樹脂組合物之方法。 [無機粒子分散液之製造方法] 首先，製造無機粒子分散液。無機粒子分散液含有(a)二氧化鋯粒子、(b)分散劑、(c)溶劑，視情況含有分散樹脂。將該等材料混合，使其他成分分散於(c)溶劑中，藉此可獲得無機粒子分散液。 作為分散方法，並無特別限制，可列舉使用塗料振盪機、砂磨機、球磨機、輥磨機、石磨機、噴射磨機、均質機等之方法。 各成分之混合順序只要無損本發明之效果則無特別限制，可於添加(c)溶劑後添加(a)二氧化鋯粒子、(b)分散劑及視情況之分散樹脂，亦可為相反順序。 作為分散樹脂，可使用作為上述(d)黏合劑樹脂所記載者。可使用製備感光性樹脂組合物時使用之(d)黏合劑樹脂之一部分作為分散樹脂，亦可使用與製備感光性樹脂組合物時所使用者不同之(d)黏合劑樹脂。於利用砂磨機使(a)二氧化鋯粒子分散之情形時，可較佳地使用粒徑0.05〜5 mm左右之玻璃珠粒或氧化鋯珠粒。關於分散處理條件，溫度通常為0℃至100℃，較佳為室溫至80℃之範圍。 [感光性樹脂組合物之製備方法] 其次，說明製備本發明之感光性樹脂組合物之方法。 首先，將上述無機粒子分散液與作為必需成分之(c)溶劑、(d)黏合劑樹脂、(e)聚合性單體及(f)聚合起始劑、視情況之作為任意成分之界面活性劑、以及該等以外之成分加以混合，而製成均勻溶液，藉此獲得感光性樹脂組合物。混合較佳為於室溫下進行，通常於遮斷紫外線下實施以避免開始聚合反應。又，於混合等各步驟中有混入微細之污物之情況，因此較佳為利用過濾器等對所獲得之感光性樹脂組合物進行過濾處理。 ＜層間絕緣膜之形成方法＞ 藉由塗佈本發明之感光性樹脂組合物並使之硬化，可獲得硬化物。本發明之感光性樹脂組合物尤其是可較佳地用作形成層間絕緣膜之材料。以下，對使用本發明之感光性樹脂組合物之層間絕緣膜之形成方法進行說明。 [1-1]塗佈步驟 首先，使用旋轉塗佈機、線棒塗佈機、流塗機、模嘴塗佈機、輥式塗佈機、噴霧器等塗佈裝置，於形成有TFT陣列之基板上塗佈上述本發明之感光性樹脂組合物。感光性樹脂組合物之塗佈膜厚通常為0.1〜5 μm。 [1-2]乾燥步驟 將揮發成分自上述塗佈膜去除(乾燥)而形成乾燥塗膜。乾燥可採用真空乾燥、加熱板、IR(Infrared Radiation，紅外線)烘箱、對流烘箱等。乾燥條件較佳為溫度40〜150℃、乾燥時間10秒〜60分鐘之範圍。 [1-3]曝光、顯影步驟 繼而，於感光性樹脂組合物層之乾燥塗膜上放置光罩，隔著該光罩進行圖像曝光。曝光後，利用顯影去除未曝光之未硬化部分，藉此形成像素。再者，亦存在為了提高感度而於曝光後且顯影前進行曝光後烘烤之情況。該情形時之烘烤可採用加熱板、IR烘箱、對流烘箱等。曝光後烘烤條件通常為40〜150℃、乾燥時間10秒〜60分鐘之範圍。 通常於層間絕緣膜形成用以連接主動元件與像素電極之接觸孔。接觸孔係藉由對塗佈膜進行圖案化曝光並顯影而獲得。於高精細之顯示器中，要求形成更小之接觸孔。例如亦存在要求邊長3〜10 μm之正方形孔之開口之情況。 作為乾燥塗膜之曝光步驟中使用之光源，例如可列舉：氙氣燈、鹵素燈、鎢絲燈、高壓水銀燈、超高壓水銀燈、金屬鹵素燈、中壓水銀燈、低壓水銀燈等燈光源，或氬離子雷射、YAG(Yttrium Aluminium Garnet，釔鋁石榴石)雷射、準分子雷射、氮氣雷射等雷射光源等。於僅使用特定波長之光之情形時，亦可利用光學濾光片。 作為用於顯影處理之溶劑，只要為具有使未硬化部之塗佈膜溶解之能力的溶劑，則並無特別限制，就環境污染、對人體之有害性、火災危險性等方面而言，較佳為使用鹼性顯影液而非溶劑。 作為此種鹼性顯影液，例如可列舉含有碳酸鈉、碳酸氫鈉、碳酸鉀、碳酸氫鉀、矽酸鈉、矽酸鉀、氫氧化鈉、氫氧化鉀等無機鹼化合物，或二乙醇胺、三乙胺、三乙醇胺、氫氧化四甲基銨等有機鹼化合物之水溶液。 再者，鹼性顯影液中視需要亦可含有界面活性劑、水溶性溶劑、濕潤劑、具有羥基或羧酸基之低分子化合物等。作為顯影液所使用之界面活性劑，例如可列舉：具有萘磺酸鈉基、苯磺酸鈉基之陰離子性界面活性劑，具有聚伸烷氧基之非離子性界面活性劑，具有四烷基銨基之陽離子性界面活性劑等。 關於顯影處理之方法，並無特別限制，通常於10〜50℃、較佳為於15〜45℃之顯影溫度下，藉由浸漬顯影、浸置顯影、噴霧顯影、磁刷顯影、超音波顯影等進行。 [1-4]熱處理步驟 藉由曝光、顯影步驟而形成有圖像之感光性樹脂組合物膜繼而經過熱處理(硬烤)步驟而成為硬化物(熱硬化膜)。再者，亦存在為了抑制於硬烤時產生釋氣而於顯影後且硬烤前進行整面曝光之情況。 於硬烤前進行整面曝光之情形時，作為光源，使用紫外光或可見光，例如可列舉：氙氣燈、鹵素燈、鎢絲燈、高壓水銀燈、超高壓水銀燈、金屬鹵素燈、中壓水銀燈、低壓水銀燈等燈光源，或氬離子雷射、YAG雷射、準分子雷射、氮氣雷射等雷射光源等。 硬烤時可使用加熱板、IR烘箱、對流烘箱等。作為硬烤條件，通常為100〜250℃、乾燥時間30秒〜90分鐘之範圍。 ＜TFT主動矩陣基板及圖像顯示裝置＞ 其次，說明本發明之圖像顯示裝置、尤其是液晶顯示裝置(面板)之製造法。液晶顯示裝置通常具備TFT(Thin Film Transistor，薄膜電晶體)主動矩陣基板。 首先，TFT主動矩陣基板係藉由如下方式製作：於形成有TFT元件陣列之基板上形成上述硬化物作為層間絕緣膜，於其上形成ITO(Indium Tin Oxides，氧化銦錫)膜後，利用光微影法製作ITO配線。 繼而，可將上述TFT主動矩陣基板與對向基板進行貼合而形成液晶單元，向所形成之液晶單元內注入液晶，進而與對向電極接線而完成液晶顯示裝置之製作。 作為對向基板，通常宜使用具備配向膜之彩色濾光片基板。作為配向膜，宜為聚醯亞胺等之樹脂膜。配向膜之形成通常採用凹版印刷法及/或軟版印刷法，配向膜之厚度設為數10 nm。於藉由熱焙燒而進行配向膜之硬化處理後，藉由紫外線之照射或利用磨擦布之處理而實施表面處理，加工成能夠調整液晶斜度之表面狀態。再者，亦可進而於配向膜上形成與上述相同之層間絕緣膜。 作為上述TFT主動矩陣基板與對向基板之貼合間隙，根據液晶顯示裝置之用途而異，通常於2 μm以上且8 μm以下之範圍內選擇。與對向基板貼合後，將除液晶注入口以外之部分利用環氧樹脂等密封材料加以密封。 作為此種密封材料，通常使用能夠藉由UV照射及/或加熱而硬化者，將液晶單元周邊加以密封。將周邊經密封之液晶單元切斷成面板單元後，於真空腔室內進行減壓，將上述液晶注入口浸漬於液晶中，使壓力恢復至大氣壓，藉此可向上述液晶單元內注入液晶。 作為液晶單元內之減壓度，通常為1×10-2 Pa以上，較佳為1×10-3 Pa以上，又，通常為1×10- 7 Pa以下，較佳為1×10- 6 Pa以下之範圍。又，減壓時較佳為對液晶單元進行加溫。作為加溫溫度，通常為30℃以上，較佳為50℃以上，又，通常為100℃以下，較佳為90℃以下之範圍。 作為減壓時之加溫保持條件，通常為10分鐘以上且60分鐘以下之範圍。其後，將液晶單元浸漬入液晶中。使UV硬化樹脂硬化，而將注入有液晶之液晶單元之液晶注入口加以密封。如此可完成液晶顯示裝置(面板)之製作。 再者，液晶之種類無特別限制，可使用芳香族系、脂肪族系、多環狀化合物等先前已知之液晶，可為溶致型液晶、熱致型液晶等任意之液晶。作為熱致型液晶，已知向列型液晶、層列型液晶及膽固醇狀液晶等，可為其中之任意者。 實施例 以下，藉由實施例而詳細地說明本發明。但本發明並不限定於以下之實施例，可於不脫離其主旨之範圍內任意變更而實施。 以下之實施例及比較例中所使用之感光性樹脂組合物之構成成分如下所示。 (a)二氧化鋯粒子(高介電常數無機粒子) 1：UEP(第一稀元素化學工業公司製造，ZrO2 ) 一次粒徑：10〜30 nm (a')其他高介電常數無機粒子 1：T-BTO-020RF(戶田工業公司製造，BaTiO3 ) 一次粒徑：10〜30 nm 2：TTO-51N(石原產業公司製造，TiO2 ) 一次粒徑：10〜30 nm (b)分散劑 DISPERBYK-111(BYK-Chemie公司製造) (c)溶劑 PGMEA(丙二醇單甲醚乙酸酯) (d)黏合劑樹脂 (合成例1)含金剛烷基之環氧(甲基)丙烯酸酯樹脂之合成 [化39]向安裝有溫度計、攪拌機、冷卻管之燒瓶內裝入上述結構之環氧化合物(環氧當量264)50 g、丙烯酸13.65 g、乙酸甲氧基丁酯60.5 g、三苯基膦0.936 g及對甲氧基苯酚0.032 g，一面攪拌一面於90℃下反應，直至酸值成為5 mgKOH/g以下。反應需要12小時，獲得環氧丙烯酸酯溶液。 將上述環氧丙烯酸酯溶液25質量份、及三羥甲基丙烷(TMP)0.76質量份、聯苯四羧酸二酐(BPDA)3.3質量份、四氫鄰苯二甲酸酐(THPA)3.5質量份裝入至安裝有溫度計、攪拌機、冷卻管之燒瓶內，一面攪拌一面緩慢升溫至105℃而使之反應。 於樹脂溶液變得透明之時，利用乙酸甲氧基丁酯進行稀釋，調整成固形物成分70質量%，獲得酸值115 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)2,600之黏合劑樹脂(1)。 (合成例2)含聯苯基之環氧(甲基)丙烯酸酯樹脂之合成 將「NC3000H」(日本化藥公司製造)(環氧當量288)400質量份、丙烯酸102質量份、對甲氧基苯酚0.3質量份、三苯基膦5質量份及丙二醇單甲醚乙酸酯264質量份裝入至反應容器內，於95℃下攪拌直至酸值成為3 mgKOH/g以下。達到目標酸值需要9小時(酸值2.2 mgKOH/g)。繼而，進而添加琥珀酸酐39質量份，於95℃下反應4小時，利用丙二醇單甲醚乙酸酯(PGMEA)調整成固形物成分40質量%，獲得酸值40 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)4,000之下述結構式(其中，式中之m及n為3或4，黏合劑樹脂(2)為該等之混合物)所表示之黏合劑樹脂(2)。 [化40](合成例3)含茀環之環氧(甲基)丙烯酸酯樹脂之合成 [化41]合成例1中，將環氧化合物替換成上述結構之環氧化合物，除此以外，藉由與合成例1相同之方式合成，獲得酸值60 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)6,500之黏合劑樹脂(3)。 (合成例4)雙酚A型環氧(甲基)丙烯酸酯樹脂之合成 合成例1中，將環氧化合物替換成雙酚A型環氧樹脂(日本化藥製造之RE-310S)，除此以外，藉由與合成例1相同之方式合成，獲得酸值60 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)8,600之黏合劑樹脂(4)。 (合成例5)雙酚F型環氧(甲基)丙烯酸酯樹脂之合成 合成例1中，將環氧化合物替換成雙酚F型環氧樹脂(日本化藥製造之RE-303S-L)，除此以外，藉由與合成例1相同之方式合成，獲得酸值60 mgKOH/g、藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)10,500之黏合劑樹脂(5)。 (合成例6)丙烯酸系樹脂之合成 一面進行氮氣置換一面攪拌丙二醇單甲醚乙酸酯150質量份，升溫至120℃。於其中歷時3小時滴下具有三環癸烷骨架之單甲基丙烯酸酯FA-513M(日立化成公司製造)20.0質量份、甲基丙烯酸甲酯4.0質量份、甲基丙烯酸37.4質量份及甲基丙烯酸環己酯73.2質量份之混合液，進而於90℃下攪拌2小時，獲得黏合劑樹脂(6)。所獲得之黏合劑樹脂(6)藉由GPC測得之聚苯乙烯換算之重量平均分子量(Mw)為5,800，酸值為60 mgKOH/g。 (e)聚合性單體 1：二季戊四醇六丙烯酸酯(DPHA) 2：雙酚A型環氧酯；3000A(共榮社化學公司製造) 3：含茀基之環氧酯；EA-0300(Osaka Gas Chemicals公司製造) (f)聚合起始劑 肟酯系聚合起始劑：說明書中記載之化合物Y (e)添加劑 界面活性劑：F554(DIC公司製造) 密接性提高劑：KAYAMER PM-21(日本化藥公司製造) (高介電常數無機粒子分散液之製備) 根據以下之組成，將高介電常數無機粒子、分散劑、分散樹脂、溶劑進行調合，藉由以下之方法製備高介電常數無機粒子分散液。首先，以高介電常數無機粒子、分散劑、分散樹脂之固形物成分成為如下之方式進行調合。再者，以下之溶劑之量係亦包括分散劑及分散樹脂所含之溶劑量在內之總量。 ·高介電常數無機粒子：UEP 100質量份 ·分散劑：DISPERBYK-111(BYK-Chemie公司製造) 5質量份/固形物成分換算 ·分散樹脂：含金剛烷基之鹼可溶性樹脂(上述黏合劑樹脂(1)) 10質量份/固形物成分換算 ·溶劑：丙二醇單甲醚乙酸酯(PGMEA) 350質量份 將以上成分充分攪拌，進行混合。 繼而，利用塗料振盪機於25〜45℃之範圍內進行6小時之分散處理。作為珠粒，使用直徑0.3 mm之氧化鋯珠粒，添加分散液10 g與珠粒20 g。分散結束後，利用過濾器將珠粒與分散液加以分離，而製備固形物成分25質量%之高介電常數無機粒子分散液1。 又，將作為高介電常數無機粒子之UEP替換成T-BTO-020RF、TTO-51N，除此以外，藉由與上述相同之方式製備高介電常數無機粒子分散液2及3。 又，實施例及比較例中之評價條件如下所述。 (感光性樹脂組合物之膜厚之測定方法) 使用觸針式輪廓儀“α-step IQ”(KLA Tencor公司製造)進行測定。膜厚之測定係隨機於2個位置實施，將該2點之平均值作為膜厚。測定長度設為0.7 mm，掃描速度設為0.5 mm/s。 (電測定樣品製作) 於玻璃基板上以膜厚70 nm整面濺鍍ITO電極而獲得導電性基板。使用旋轉塗佈機，於該導電性基板上塗佈感光性樹脂組合物，利用100℃之加熱板乾燥90秒。其後，利用曝光裝置MA-1100(大日本科研公司製造)以曝光量120 mJ/cm2 (波長365 nm下之強度)進行整面曝光。繼而，使用瀧澤產業股份有限公司製造之顯影裝置AD-1200，使用氫氧化四甲基銨之2.38質量%水溶液作為顯影液，於該顯影液中浸漬50秒而進行顯影，經20秒之水洗處理後，將水吹離。其後，於潔淨烘箱中以230℃焙燒30分鐘，而獲得介電膜。介電膜之膜厚設為0.3 μm。 藉由蒸鍍法於該介電膜之上形成鋁電極。鋁電極係厚度60 nm、面積3 mm2 之圓形圖案之電極。將夾於ITO電極與鋁電極之間的部分作為測定対象。 (相對介電常數測定) 使電測定樣品之基板上之ITO電極與介電膜上之1個鋁電極接觸端子而製作電路，測定頻率1.0 kHz下之靜電電容。由所測得之靜電電容與介電膜之膜厚、鋁電極面積，採用式(1)算出相對介電常數。上述式(1)中，C：電容、εr ：相對介電常數、ε0 ：真空介電常數(常數)、S：電極面積、d：電極間距離。 該測定係使用LCR計-4284A(惠普公司製造)。 (漏電流測定) 使電測定樣品之基板上之ITO電極與介電膜上之1個鋁電極接觸端子，以每相差2 V之方式施加1 V至50 V之電壓，測定此時之電流。作為比較各感光性樹脂組合物之值，使用15 V施加時之電流值。該測定係使用Ultra-High Resistance Meter R8340A(ADVANTEST公司製造)。 (顯影性評價) 使用旋轉塗佈機於濺鍍有ITO電極之玻璃基板上塗佈感光性樹脂組合物，利用100℃之加熱板乾燥90秒。其後，利用曝光裝置MA-1100(大日本科研公司製造)，使用15/15 μm、50/50 μm之線與間隙(L/S)遮罩進行圖案化曝光。此時，遮罩與基板之間隙設為5 μm，曝光量設為20〜100 mJ/cm2 (波長365 nm下之強度)。繼而，使用瀧澤產業股份有限公司製造之顯影裝置AD-1200，使用氫氧化四甲基銨之2.38質量%水溶液作為顯影液進行顯影。一面以30 rpm進行旋轉，一面於噴壓0.15 MPa下噴灑顯影液90秒，以300 rpm進行10秒之水洗處理。其後，於潔淨烘箱中以230℃焙燒30分鐘，而獲得膜厚300 nm之介電膜。 顯影性之評價基準如下所述。 〇：形成15/15 μm之線與間隙。 △：未形成15/15 μm之線與間隙，但形成50/50 μm之線與間隙。 ×：未形成50/50 μm之線與間隙。 (感光性樹脂組合物之製備) 將表1所示之各成分以表1所示之調配量於玻璃瓶內混合，製備各感光性樹脂組合物。再者，表1中之值表示固形物成分之質量份，以各感光性樹脂組合物之全部固形物成分成為20質量%之方式使用溶劑(PGMEA)。作為高介電常數無機粒子分散液，使用上述高介電常數無機粒子分散液1〜3。其中，於使用黏合劑樹脂(1)以外之黏合劑樹脂之實施例、比較例中，使用將高介電常數無機粒子分散液1中之分散樹脂由黏合劑樹脂(1)替換成該黏合劑樹脂而製備之高介電常數無機粒子分散液。又，表1中之黏合劑樹脂之調配量表示包括分散樹脂之調配量在內之總量。 [表1] 實施例1中，儘管於感光性樹脂組合物之全部固形物成分中以非常高之比率含有二氧化鋯粒子，但15 V施加時之漏電流低至10-9 (A/cm)左右，顯影性亦良好。相對於此，比較例1、2中，以較高比率含有鈦酸鋇粒子或二氧化鈦粒子，因此漏電流增多，顯影性亦較差。 認為二氧化鋯粒子由於表面官能基數較少，故抑制塗膜之吸濕性，而使漏電流變低。又，認為二氧化鋯粒子由於分散性較高，易吸附分散劑或樹脂，故成為經高溶解性之分散劑或樹脂被覆之狀態，顯影性良好。另一方面，認為鈦酸鋇粒子或二氧化鈦粒子由於分散性較低，與高溶解性之樹脂之配合性較差，故顯影時產生膜粗糙，漏電流變高。又，認為鈦酸鋇粒子或二氧化鈦粒子由於粒子表面之極性較高，與玻璃基板之界面處之密接力較強，顯影時無法充分溶解而產生溶解殘留。 又，根據實施例1與2之比較，可確認無論二氧化鋯粒子之含有比率為多少，漏電流抑制及顯影性均良好。 進而，根據實施例1及3之比較，可確認不僅於黏合劑樹脂為具有式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之情形時，且於為具有式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂之情形時，漏電流抑制及顯影性均良好。 於如比較例3〜5般使用含茀環之環氧(甲基)丙烯酸酯樹脂、雙酚A型含環氧(甲基)丙烯酸酯樹脂、雙酚F型含環氧(甲基)丙烯酸酯樹脂之情形時顯影性不良，相對於此，於如實施例1〜3般使用具有式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者之情形時顯影性良好。認為其原因在於：該等環氧(甲基)丙烯酸酯樹脂於其中央部具有大體積之剛直骨架，因此作為親水基之(甲基)丙烯醯基容易向外側展開，溶解性提高。 另一方面，認為含茀環之環氧(甲基)丙烯酸酯樹脂由於體積較大、疏水性較強，故而顯影性不良。又，認為雙酚A型含環氧(甲基)丙烯酸酯樹脂或雙酚F型含環氧(甲基)丙烯酸酯樹脂由於具有能夠旋轉之骨架，故而與具有無法旋轉之骨架之樹脂相比感度有所提高，但產生感度不均，尤其於如低極性溶劑存在下之親水部容易凝集之條件下顯影性不良。 另一方面，於如比較例6及7般使用丙烯酸系樹脂之情形時，顯影性良好，相對介電常數與實施例1〜3相同，但漏電流較多。認為其係由於丙烯酸系樹脂之骨架之柔軟性導致塗膜中產生感度不均，顯影後塗膜變得不均勻，膜之吸濕性增強而致使漏電流增多。進而認為，丙烯酸系樹脂之耐熱性較低，於熱硬化時丙烯酸系樹脂發生分解，因此產生空隙。 又，根據實施例1、4及5之比較，可確認無論聚合性單體為何種類，漏電流抑制及顯影性均良好。尤其是實施例1中使用6官能性(甲基)丙烯酸酯作為聚合性單體，相對於此，實施例4及5中使用2官能性(甲基)丙烯酸酯作為聚合性單體，感度因此稍有降低，但由於具有強直且疏水之骨架，而形成於鹼性顯影下強固之膜，結果電氣特性提高。 採用特定態樣而詳細地說明了本發明，但作為業者應明瞭可於不脫離本發明之主旨與範圍之情況下實施各種變更及變形。再者，本申請案係基於2016年7月29日提出申請之日本專利申請(日本專利特願2016-150610)，以引用之形式援用其全文。Hereinafter, the embodiment of the present invention will be described in detail, but the following description is an example of an embodiment of the present invention, and the present invention is not limited to the above. In the present invention, "(meth)acrylic acid" includes both acrylic acid and methacrylic acid, and "(meth)acrylate", "(meth)acrylinyl) and the like also have the same meaning. Further, the phrase "(poly)" before the monomer name means the monomer and the polymer. In the present invention, the "all solid content component" means all components other than the solvent in the constituent components of the photosensitive resin composition of the present invention. In the present invention, "quality" is synonymous with "weight". <Photosensitive Resin Composition> The photosensitive resin composition of the present invention contains (a) zirconium dioxide particles, (b) a dispersant, (c) a solvent, (d) a binder resin, (e) a polymerizable monomer, and (f) a polymerization initiator. First, the (a) zirconium dioxide particles will be described in detail. [(a) Zirconium dioxide particles] The photosensitive resin composition of the present invention contains (a) zirconium dioxide particles (hereinafter sometimes abbreviated as "zirconia particles"). By containing the (a) zirconium dioxide particles, an organic insulating film having a high relative dielectric constant and suppressing leakage current can be obtained. A particle having a compound of a Group 4 element of a long-period periodic table, particularly an oxide having an oxide of a Group 4 element of a long-period periodic table, has a high relative dielectric constant and is suitable for an organic insulating film having a high dielectric constant use. Among these, it is considered that the zirconium dioxide particles have a low relative dielectric constant, and in order to increase the relative dielectric constant of the obtained organic insulating film to a desired value, it is necessary to increase the content ratio of the particles, but the zirconium dioxide particles Due to its good dispersibility, it is densely deposited in the coating film, and the hygroscopicity of the coating film is weakened, whereby leakage current can be suppressed. The average particle diameter of the primary particles of (a) the zirconium dioxide particles is usually 100 nm or less, preferably 80 nm or less, more preferably 70 nm or less, still more preferably 60 nm or less. Also, it is usually 1 nm or more. When the particle diameter is at most the above upper limit value, there is a tendency that the surface has no roughness and the patterning property is also good. In addition, when it is at least the above lower limit value, the dispersibility tends to be good. (a) The average particle diameter of the primary particles of the zirconium dioxide particles is determined by directly measuring the size of the primary particles based on the electron micrograph by using a transmission electron microscope (TEM) or a scanning electron microscope (SEM). Determination. Specifically, the primary particle diameter of each particle is calculated from the circle-equivalent diameter. The quadrilateral range of 100 to 500 nm was imaged, and all the particles present in the range were measured. The different ranges were imaged several times, and the particle diameters of 200 to 1000 primary particles were measured in total, and the average particle diameters were determined by number-averaging the particle diameters. The measurement of the primary particle diameter can be carried out, for example, on the individual zirconium dioxide particles, the dispersion thereof, and the cured film of the resin composition. When the measurement sample is produced, it is necessary to uniformly deposit (a) the zirconium dioxide particles in the sample. In the case of the dispersion, the dispersion is immediately dispersed, and the solvent is volatilized and then measured. Further, in the case of a cured film, a cured film was formed using a photosensitive resin composition in which particles were uniformly dispersed, and the film was cut in the thickness direction of the film, and the cross section was observed to carry out measurement. (a) The shape of the zirconium dioxide particles is not particularly limited, and is, for example, a spherical shape, a hollow shape, a porous shape, a rod shape, a plate shape, a fibrous shape or an indefinite shape, and is preferably spherical. The content ratio of the (a) zirconium dioxide particles is usually 50% by mass or more, preferably 55% by mass or more, more preferably 60% by mass or more, and still more preferably 65% by mass of the total solid content of the photosensitive resin composition. The mass% or more is more preferably 70% by mass or more, more preferably 95% by mass or less, still more preferably 90% by mass or less, further preferably 85% by mass or less, and still more preferably 80% by mass or less. It is 75 mass% or less. When the dielectric film having a relatively high dielectric constant is obtained, the dielectric properties of the dielectric film having a relatively high dielectric constant tend to be obtained, and the patterning property tends to be good. [(b) Dispersant] The photosensitive resin composition of the present invention contains (b) a dispersant. By containing (b) a dispersing agent, the (a) zirconium dioxide particles can be stably dispersed in the photosensitive resin composition. The (b) dispersing agent is preferably a polymer dispersing agent having a functional group, and more preferably a carboxyl group; a phosphate group; a sulfonic acid group; or a salt group; a tertiary or tertiary amine group; a quaternary ammonium salt group; a polymer dispersing agent having a functional group derived from a nitrogen-containing heterocyclic group such as a pyridine, a pyrimidine or a pyridinium. Among these, it is preferably a primary, secondary or tertiary amine group; a quaternary ammonium salt group; a pyridine, a pyrimidine, a pyridinium or the like, a polymer dispersant having a basic functional group derived from a nitrogen-containing heterocyclic group or the like. . In addition, examples of the polymer dispersant include a urethane dispersant, an acryl dispersant, a polyethylenimine dispersant, a polyallylamine dispersant, and a monomer having an amine group. Dispersing agent with macromonomer, polyoxyethylene alkyl ether dispersing agent, polyoxyethylene diester dispersing agent, polyether phosphate dispersing agent, polyester phosphate dispersing agent, sorbitan fatty ester system A dispersant, an aliphatic modified polyester-based dispersant, or the like. Specific examples of such a dispersing agent include EFKA (manufactured by EFKA Chemicals BV (EFKA) Co., Ltd.), DISPERBYK (manufactured by BYK-Chemie Co., Ltd.), Disparlon (manufactured by Nanben Chemical Co., Ltd.), and SOLSPERS (Lubrizol Co., Ltd.). Manufacturing), KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), Ajisper (manufactured by Ajinomoto Co., Ltd.), and the like. These polymer dispersing agents may be used alone or in combination of two or more. The weight average molecular weight (Mw) of the polymer dispersant is usually 700 or more, preferably 1,000 or more, and usually 100,000 or less, preferably 50,000 or less. Among these, from the viewpoint of affinity with the developer, a dispersant having an amine value of 60 mgKOH/g or less and/or a dispersant having a phosphate group is preferable. In the case of having an amine group, it is preferred that the polyesteramine, polyetheramine or the like has an ether bond. Here, the amine value herein means an amine value in terms of an effective solid content, and is a value expressed by the mass of KOH corresponding to the amount of alkali per 1 g of the solid content of the dispersant. From the viewpoint of the patterning property, the above dispersing agent having a phosphoric acid group preferably further has a polyether structure. The polyether structure has a function of further improving the affinity with the developer and improving the dispersibility, and the polyether structure has a tendency to be patterned with higher resolution. The chemical structure of the dispersant having a phosphate group is not particularly limited, and from the viewpoint of both the patterning property and the dispersibility, for example, it is preferably a chemical structure represented by the following formula (X). [Chemical 4]In the above formula (X), RA Represents an alkyl group which may have a substituent, α represents a polyether structure, and β represents a direct bond or a polyester structure. Further, n represents an integer of 1 to 3. RA The alkyl group which may have a substituent is not particularly limited, and is usually 1 or more, more preferably 20 or less, still more preferably 15 or less, still more preferably 10 or less, and still more preferably 5 or less. When it is in the above range, the affinity with the developer is improved, and the patterning property tends to be good. As RA The alkyl group may have a substituent, and examples thereof include a sulfonyl group, a carboxyl group, a benzyl group, and a benzamidine group. From the viewpoint of ease of synthesis, it is preferably unsubstituted. α represents a polyether structure, and from the viewpoint of affinity with a developer, a polyethylene glycol structure, a polypropyl ether structure, a polyisopropyl ether structure, a dibutyl ether structure, and more preferably a polyethylene glycol structure are preferable. Further, it is preferably a structure represented by the following formula (X-1). [Chemical 5]In the above formula (X-1), RB Represents an alkylene group which may have a substituent. The carbon number is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 10 or less, still more preferably 5 or less. By setting it as the said range, it is the tendency for the patterning characteristic to become favorable. As RB The substituent which may be contained in the alkylene group may, for example, be a sulfonyl group, a carboxyl group, a benzyl group or a benzamidine group, and is preferably unsubstituted from the viewpoint of ease of synthesis. Further, in the above formula (X-1), x represents an integer of 5 to 30. x is preferably 10 or more, and more preferably 25 or less. When it is set to the above lower limit value, the affinity with the developer tends to be good. In addition, when it is set to the above upper limit value, storage stability tends to be good. Furthermore, a plurality of Rs contained in one moleculeB They may be the same or different from each other, and for example, an alkylene group having a carbon number different from that of a butyl group and a pentyl group. In the above formula (X), β represents a direct bond or a polyester structure, and more preferably a structure represented by the following formula (X-2). [Chemical 6]In the above formula (X-2), RC It represents an alkylene group which may have a substituent, and y represents an integer of 0 to 10. RC The number of carbon atoms of the alkylene group which may have a substituent is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 4 or more, still more preferably 15 or less, still more preferably 10 or less, and further It is preferably 8 or less. When it is set to the above lower limit value, the storage stability tends to be good, and the patterning property tends to be good by setting it as the upper limit or less. As RC The substituent which may be contained in the alkylene group may, for example, be a sulfonyl group, a carboxyl group, a benzyl group or a benzamidine group, and is preferably unsubstituted from the viewpoint of ease of synthesis. y is an integer of 0 to 10, and is preferably 1 or more, more preferably 2 or more, more preferably 7 or less, and still more preferably 5 or less from the viewpoint of storage stability and patterning characteristics. When it is set to the above lower limit value, the storage stability tends to be good. Moreover, when it is set to the said upper limit or less, the patterning characteristic becomes favorable. Furthermore, when y is an integer of 2 or more, two or more Rs contained in one moleculeC They may be the same or different from each other, and for example, an alkylene group having a carbon number different from that of a butyl group and a pentyl group. The weight average molecular weight (Mw) of the dispersing agent having a phosphoric acid group is not particularly limited, but is preferably 1,000 or more, more preferably 5,000 or more, still more preferably 40,000 or less, and still more preferably 30,000 or less. When it is set to the above lower limit value, the dispersibility tends to be good, and the patterning property tends to be good by setting it as the upper limit or less. As the dispersing agent having a phosphate group, a commercially available one can be used, and for example, DISPERBYK (registered trademark, the same applies hereinafter)-102, 110, 111, 140, 142, 145, 180, 2001 (manufactured by BYK-Chemie Co., Ltd.) can be used. , DA-7301, DA-325, DA-375, DA-234, ED-152, ED-251 (manufactured by Nanben Chemical Co., Ltd.), TEGO (registered trademark) Dispers 628, 655 (manufactured by Evonik Co., Ltd.), and the like. (b) The content ratio of the dispersing agent is usually 1% by mass or more, preferably 2% by mass or more, more preferably 3% by mass or more, and more preferably 10% by mass of the total solid content of the photosensitive resin composition. % or less is more preferably 7% by mass or less, further preferably 5% by mass or less. When it is set to the above lower limit value, the stability of the photosensitive resin composition tends to be improved, and the patterning property tends to be improved by setting it as the upper limit or less. (b) The content ratio of the dispersing agent having a phosphate group in the dispersing agent is not particularly limited, but is preferably 50% by mass or more, more preferably 70% by mass or more, and usually 100% by mass or less. It is 100% by mass. When it is set to the above lower limit value, the patterning property tends to be improved. In addition, it is preferable to contain (b) the dispersing agent 15 parts by mass or less, more preferably 10 parts by mass or less, even more preferably 8 parts by mass or less, based on 100 parts by mass of the (a) zirconium dioxide particles. It is preferably contained in an amount of 1 part by mass or more, more preferably 3 parts by mass or more. When the value is equal to or higher than the lower limit value, the dispersibility tends to be good, and the patterning property tends to be good by setting it as the upper limit or less. [(c) Solvent] The photosensitive resin composition of the present invention contains (c) a solvent. The solvent (c) is not particularly limited as long as it can dissolve and disperse the respective components and has good handleability. Specific examples thereof include methyl cellosolve, ethyl cellosolve, butyl cellosolve, diethylene glycol monomethyl ether, propylene glycol monoacetate, propylene glycol diacetate, and propylene glycol monomethyl ether acetate. (hereinafter sometimes abbreviated as "PGMEA"), methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, chloroform, dichloromethane, ethyl acetate, methyl lactate, ethyl lactate, propionic acid 3-methoxymethyl ester, 3-ethoxyethyl propionate, propylene glycol monomethyl ether (hereinafter sometimes abbreviated as "PGME"), methanol, ethanol, propanol, butanol, tetrahydrofuran, diethylene glycol An organic solvent such as methyl ether, methoxybutyl acetate, SOLVEST or carbitol. Among these, from the viewpoint of coatability or solubility of constituent components in the composition, a glycol alkyl ether acetate, a glycol monoalkyl ether, and more preferably a glycol alkyl group are preferred. Ether acetates. Further, the glycol alkyl ether acetates may be used singly or in combination with other solvents. As the solvent to be used in combination, a glycol monoalkyl ether is particularly preferable. Among them, propylene glycol monomethyl ether is preferred in terms of solubility or dispersibility of the constituent components in the composition. When the solvent is selected, if it is highly polar, the dispersibility is impaired, and if it is a high boiling point, the solvent does not completely volatilize even under reduced pressure drying (VCD) at the time of coating, and the patterning property is largely large. The tendency to deteriorate. Further, after the coating film is baked, a residual solvent is generated, which tends to cause a large decrease in electrical characteristics. In the case of forming a dielectric film by photolithography, it is preferred to use a solvent having a boiling point of 100 to 200 ° C (pressure 1013.25 [hPa], and the following boiling points are the same). More preferably, it has a boiling point of 120 to 170 °C. When it is set to the above lower limit value, it is easy to suppress aggregation of particles due to rapid drying or defects due to bubble marks. When it is set to the above upper limit or less, it is possible to shorten the drying time and it is advantageous in terms of power consumption and production speed. Among the above solvents, a glycol alkyl ether acetate is preferred in that the balance between coatability and surface tension is good, and the solubility of the constituent components in the composition is relatively high. Further, the solvent may be used singly or in combination of two or more. Examples of the combination of the solvents to be used in combination include one or more solvents selected from the group consisting of diethylene glycol dimethyl ether, methoxybutyl acetate, SOLVEST, and carbitol. Further, the blending ratio of one or more solvents selected from the group consisting of diethylene glycol dimethyl ether, methoxybutyl acetate, SOLVEST, and carbitol in the mixed solvent is usually 10% by mass based on PGMEA. The above is preferably 30% by mass or more, and usually 80% by mass or less, preferably 70% by mass or less. Further, among the mixed solvents, the mixed solvent of PGMEA and methoxybutyl acetate causes the coating film in the coating and drying step to have appropriate fluidity, and is therefore suitable for flattening the unevenness of the substrate. The content ratio of the solvent (c) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 50% by mass or more, more preferably 60% by mass or more, still more preferably 70% by mass or more, and usually It is 99% by mass or less, preferably 90% by mass or less, and more preferably 85% by mass or less. By setting it as the said range, the composition may contain a sufficient amount of (a) zirconium dioxide particle or (d) binder resin, etc., and the coating property also becomes favorable. [(d) Binder Resin] The photosensitive resin composition of the present invention contains (d) a binder resin. A homogeneous film can be obtained by containing (d) a binder resin. (d) The type of the binder resin is not particularly limited, and is preferably a resin containing a carboxyl group or a hydroxyl group from the viewpoint of solubility in an alkaline developer, and examples thereof include epoxy (meth)acrylate. A resin, an acrylic resin, a carboxyl group-containing epoxy resin, a carboxyl group-containing urethane resin, a novolac resin, a polyvinyl phenol resin, or the like. These may be used alone or in combination of plural kinds. The photosensitive resin composition of the present invention is characterized by comprising an epoxy (meth) acrylate resin having a repeating unit structure represented by the following formula (I) and a partial structure represented by the following formula (II). At least one of the epoxy (meth) acrylate resins is used as (d) a binder resin. Since the epoxy (meth) acrylate resin has high sensitivity, the patterning property is good, and since it has a hydrophobic skeleton and a moderate dissolution rate, the substrate adhesion is good. Further, since it has a rigid skeleton unlike the acrylic resin, it is easy to carry out three-dimensional crosslinking, and it is densely crosslinked by obtaining an alignment structure during curing. Therefore, it is considered that leakage current can be suppressed. It is considered that, in particular, those having a repeating unit structure represented by the following formula (I) and a partial structure having the following formula (II) have a large-volume rigid skeleton at the central portion, thereby becoming (meth)acrylofluorene. The shape in which the hydrophilic portion such as the base is developed outward is improved in developability. [Chemistry 7](in formula (I), R1 Represents a hydrogen atom or a methyl group, R2 A divalent hydrocarbon group which may have a substituent is represented. The benzene ring in the formula (I) may be further substituted with any substituent. * indicates the key bond) [Chemical 8](in formula (II), R3 Each represents a hydrogen atom or a methyl group independently. R4 A divalent hydrocarbon group having an aliphatic cyclic group as a side chain is represented. * indicates a bonding bond. Further, the epoxy (meth) acrylate resin means the following alkali-soluble resin of (d1) and/or (d2), and also means that the carboxyl group of the resin is further The compound obtained by the reaction of the compound. The epoxy (meth) acrylate resin does not substantially have an epoxy group in chemical structure, and is not limited to "(meth) acrylate", but uses epoxy resin as a raw material and "(meth)acrylic acid. "Ester" is a representative example and is therefore named as it is. "Alkali-soluble resin (d1)" by adding an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group to an epoxy resin, thereby further reacting it with a polybasic acid and/or An alkali-soluble resin obtained by reacting an anhydride. "Alkali-soluble resin (d2)" by adding an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group to an epoxy resin, thereby making it compatible with a polyhydric alcohol and a polybasic acid And an alkali-soluble resin obtained by reacting with / or an anhydride thereof. "Epoxy (meth) acrylate resin (d-1)" Next, an epoxy (meth) acrylate resin having a repeating unit structure represented by the above formula (I) (hereinafter abbreviated as "epoxy" (hereinafter referred to as "epoxy") will be described in detail. Methyl) acrylate resin (d-1)"). [Chemistry 9](in formula (I), R1 Represents a hydrogen atom or a methyl group, R2 A divalent hydrocarbon group which may have a substituent is represented. The benzene ring in the formula (I) may be further substituted with any substituent. * indicates the key bond) (R2 In the above formula (I), R2 A divalent hydrocarbon group which may have a substituent is represented. Examples of the divalent hydrocarbon group include a divalent aliphatic group and a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups. Examples of the divalent aliphatic group include those which are linear, branched, or ring-shaped. Among these, from the viewpoint of developing solubility, it is preferably a linear one, and on the other hand, from the viewpoint of reducing the penetration of the developer into the exposed portion, it is preferably a ring. The carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, further preferably 20 or less, more preferably 15 or less, still more preferably 10 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the divalent linear aliphatic group include a methylene group, an ethylidene group, an exo-propyl group, an exo-butyl group, a hexyl group, and a perylene group. Among these, a methylene group is preferred from the viewpoint of the rigidity of the skeleton. Specific examples of the divalent branched aliphatic group include an isopropyl group, a second butyl group, a tert-butyl group, and an isoamyl group. Among these, from the viewpoint of the rigidity of the skeleton, it is preferred to extend the third butyl group. The number of rings of the divalent cyclic aliphatic group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less. When it is set as the above-mentioned lower limit, it is a film which is a strong film, and the adhesiveness and electrical characteristics of a board|substrate are favorable, and it is easy to suppress the surface smoothness or sensitivity of a film by setting it as the above-mentioned upper-limit. Deterioration, the tendency to improve resolution. Specific examples of the divalent cyclic aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and an adamantane ring. A ring obtained by removing a hydrogen atom from a ring such as a cyclododecane ring. Among these, from the viewpoint of the rigidity of the skeleton, a group obtained by removing two hydrogen atoms from the adamantane ring is preferred. Examples of the substituent which the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a hydroxyl group, a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, and a carboxyl group. Among these, from the viewpoint of ease of synthesis, it is preferably unsubstituted. Further, examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, further preferably 20 or less, more preferably 15 or less, still more preferably 10 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring having two free valences, a naphthalene ring, an anthracene ring, a phenanthrene ring, an anthracene ring, a naphthac ring, an anthracene ring, a benzofluorene ring, an anthracene ring, and A combination of a benzene ring, an ethane naphthalene ring, a fluorene ring, an anthracene ring, and the like. Further, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring having two free valences, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, and an oxadiazole ring. Anthracene ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furanfuran ring, thienofuran ring, benzene And isoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyridinium ring, anthracene ring, pyrimidine ring, triterpene ring, quinoline ring, isoquinoline ring, porphyrin ring, quinoxaline a group of a phenyl ring, a phenazin ring, a benzimidazole ring, an acridine ring, a quinazoline ring, a quinazolinone ring, an anthracene ring or the like. Among these, from the viewpoint of the patterning property, a benzene ring or a naphthalene ring having two free valences is preferable, and a benzene ring having two free valences is more preferable. Examples of the substituent which the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among these, from the viewpoint of developing solubility and moisture absorption resistance, it is preferably unsubstituted. In addition, as a group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups, one or more of the above divalent aliphatic groups and one or more of the above 2 may be mentioned. A group obtained by linking a valent aromatic ring group. The number of the divalent aliphatic groups is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The number of the divalent aromatic ring groups is not particularly limited, and is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups include a group represented by the following formulas (I-A) to (I-E). Among these, from the viewpoint of the rigidity of the skeleton and the hydrophobicization of the film, a group represented by the following formula (I-A) is preferred. [化10]As described above, the benzene ring in the formula (I) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. Among these, from the viewpoint of the patterning property, it is preferably unsubstituted, and on the other hand, from the viewpoint of electrical characteristics, it is preferred to substitute a methyl group in the ortho position. Further, from the viewpoint of the simplicity of synthesis, the repeating unit structure represented by the above formula (I) is preferably a repeating unit structure represented by the following formula (I-1). [11](in the formula (I-1), R1 And R2 It has the same meaning as in the above formula (I). RX Represents a hydrogen atom or a polybasic acid residue. * indicates the key combination. The benzene ring in the formula (I-1) may be further substituted with an arbitrary substituent. The so-called polybasic acid residue means a monovalent group obtained by removing one OH group from a polybasic acid or an anhydride thereof. Examples of the polybasic acid include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, and trimellitic acid. One of benzophenone tetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chloric acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid or 2 or more types. Among these, from the viewpoint of patterning properties, maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and the like are preferable. Pyromellitic acid, trimellitic acid, biphenyltetracarboxylic acid, more preferably tetrahydrophthalic acid, biphenyltetracarboxylic acid, tetrahydrophthalic acid, biphenyltetracarboxylic acid. The repeating unit structure represented by the above formula (I-1) contained in one molecule of the epoxy (meth) acrylate resin (d-1) may be one type or two or more types, for example, may be mixed in the presence of R.X For hydrogen atoms and RX It is a polybasic acid residue. Further, the number of the repeating unit structures represented by the above formula (I) contained in one molecule of the epoxy (meth) acrylate resin (d-1) is not particularly limited, but is preferably one or more, and more preferably Three or more, more preferably 20 or less, more preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress surface smoothness of the film. Or the deterioration of sensitivity and the tendency to improve resolution. The polystyrene-equivalent weight average molecular weight (Mw) of the epoxy (meth) acrylate resin (d-1) measured by gel permeation chromatography (GPC) is not particularly limited, and is preferably 1,000. More preferably, it is 1,500 or more, more preferably 2,000 or more, still more preferably 3,000 or more, further preferably 30,000 or less, more preferably 20,000 or less, further preferably 10,000 or less, and still more preferably 8,000 or less. The best is 5,000 or less. When it is set to the above lower limit value, the residual film ratio of the photosensitive resin composition tends to be good, and the resolution is preferably equal to or lower than the above upper limit value. The acid value of the epoxy (meth) acrylate resin (d-1) is not particularly limited, but is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, and still more preferably 40 mgKOH/g or more. It is preferably 50 mgKOH/g or more, more preferably 150 mgKOH/g or less, more preferably 130 mgKOH/g or less, further preferably 100 mgKOH/g or less, and particularly preferably 80 mgKOH/g or less. When it is set to the above lower limit value, the development solubility is improved, and the resolving property tends to be good. When the content is equal to or less than the above upper limit, the residual film ratio of the curable resin composition is good. The tendency. Specific examples of the epoxy (meth) acrylate resin (d-1) are listed below. [化12][Chemistry 13][Chemistry 14][化15][Chemistry 16]"Epoxy (meth) acrylate resin (d-2)" Next, an epoxy (meth) acrylate resin having a partial structure represented by the above formula (II) will be described in detail (hereinafter abbreviated as "epoxy" Base) acrylate resin (d-2)"). [化17](in formula (II), R3 Each represents a hydrogen atom or a methyl group independently. R4 A divalent hydrocarbon group having an aliphatic cyclic group as a side chain is represented. * indicates the key bond) (R4 In the above formula (II), R4 A divalent hydrocarbon group having an aliphatic cyclic group as a side chain is represented. The number of rings of the aliphatic ring group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress surface smoothness of the film. Or the deterioration of sensitivity and the tendency to improve resolution. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 40 or less, still more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress surface smoothness of the film. Or the deterioration of sensitivity and the tendency to improve resolution. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, the adamantane ring is preferred from the viewpoint of the residual film ratio and the resolution of the photosensitive resin composition. Further, the divalent hydrocarbon group in the divalent hydrocarbon group having an aliphatic cyclic group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group and a divalent aromatic ring group, and one or more divalent aliphatic groups. A group in which a group is bonded to one or more divalent aromatic ring groups. Examples of the divalent aliphatic group include a linear chain, a branched chain, and a ring. Among these, from the viewpoint of developing solubility, it is preferably a linear one, and on the other hand, from the viewpoint of reducing the penetration of the developer into the exposed portion, it is preferably a ring. The carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, further preferably 25 or less, more preferably 20 or less, still more preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the divalent linear aliphatic group include a methylene group, an ethylidene group, an exo-propyl group, an exo-butyl group, a hexyl group, and a perylene group. Among these, a methylene group is preferred from the viewpoint of the rigidity of the skeleton. Specific examples of the divalent branched aliphatic group include an isopropyl group, a second butyl group, a tert-butyl group, and an isoamyl group. Among these, from the viewpoint of the rigidity of the skeleton, it is preferred to extend the third butyl group. The number of rings of the divalent cyclic aliphatic group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 Below. When it is set as the above-mentioned lower limit, it is a film which is a strong film, and the adhesiveness and electrical characteristics of a board|substrate are favorable, and it is easy to suppress the surface smoothness or sensitivity of a film by setting it as the above-mentioned upper-limit. Deterioration, the tendency to improve resolution. Specific examples of the divalent cyclic aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and an adamantane ring. A ring obtained by removing a hydrogen atom from a ring such as a cyclododecane ring. Among these, from the viewpoint of the rigidity of the skeleton, a group obtained by removing two hydrogen atoms from the adamantane ring is preferred. Examples of the substituent which the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a hydroxyl group, a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, and a carboxyl group. Among these, from the viewpoint of ease of synthesis, it is preferably unsubstituted. Further, examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, further preferably 30 or less, more preferably 20 or less, still more preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring having two free valences, a naphthalene ring, an anthracene ring, a phenanthrene ring, an anthracene ring, a naphthac ring, an anthracene ring, a benzofluorene ring, an anthracene ring, and A combination of a benzene ring, an ethane naphthalene ring, a fluorene ring, an anthracene ring, and the like. Further, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring having two free valences, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, and an oxadiazole ring. Anthracene ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furanfuran ring, thienofuran ring, benzene And isoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyridinium ring, anthracene ring, pyrimidine ring, triterpene ring, quinoline ring, isoquinoline ring, porphyrin ring, quinoxaline a group of a phenyl ring, a phenazin ring, a benzimidazole ring, an acridine ring, a quinazoline ring, a quinazolinone ring, an anthracene ring or the like. Among these, from the viewpoint of the patterning property, a benzene ring or a naphthalene ring having two free valences is preferable, and an anthracene ring having a divalent free valence is more preferable. Examples of the substituent which the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among these, from the viewpoint of developing solubility and moisture absorption resistance, it is preferably unsubstituted. In addition, as a group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups, one or more of the above divalent aliphatic groups and one or more of the above 2 may be mentioned. A group obtained by linking a valent aromatic ring group. The number of the divalent aliphatic groups is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The number of the divalent aromatic ring groups is not particularly limited, and is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups include the groups represented by the above formulas (I-A) to (I-E). Among these, from the viewpoint of the rigidity of the skeleton and the hydrophobicization of the film, the group represented by the above formula (I-A) is preferred. The aliphatic ring as a side chain is not particularly limited based on the bonding state on the divalent hydrocarbon group, and for example, one hydrogen atom of a divalent aliphatic group or a divalent aromatic ring group may be substituted by the side chain. The aspect or the aspect which comprises one carbon atom which comprises a divalent aliphatic group, and comprises the aliphatic cyclic group as a side chain. Further, the partial structure represented by the above formula (II) is preferably a partial structure represented by the following formula (II-1) from the viewpoint of pore resolving property. [化18](in formula (II-1), R3 It has the same meaning as in the above formula (II). Rα A monovalent aliphatic ring group which may have a substituent is represented. n is an integer of 1 or more. The benzene ring in the formula (II-1) may be further substituted with an arbitrary substituent. Further, in the chemical formula in the present specification, * represents a bond. (Rα In the above formula (II-1), Rα A monovalent aliphatic ring group which may have a substituent is represented. The number of rings of the aliphatic ring group is not particularly limited, and is usually one or more, preferably two or more, and usually six or less, preferably four or less, and more preferably three or less. When it is set to the above lower limit value, it is easy to obtain a film which is strong, and it is less likely to cause surface roughness and electrical characteristics tend to be good, and the patterning property is improved by setting it as the upper limit or less. tendency. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 40 or less, still more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a film which is strong, and it is less likely to cause surface roughness and electrical characteristics tend to be good, and the patterning property is improved by setting it as the upper limit or less. tendency. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, an adamantane ring is preferred from the viewpoint of strong film properties and electrical properties. Examples of the substituent which the aliphatic ring group may have include an alkoxy group having a carbon number of 1 to 5 such as a hydroxyl group, a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, a carboxyl group and the like. Among these, from the viewpoint of easiness of synthesis, it is preferably unsubstituted. n represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. When it is set to the above lower limit value, the film hardening degree and the residual film ratio tend to be good, and the pore resolution is preferably improved by setting it as the upper limit or less. Among these, adamantyl group is preferred from the viewpoint of a strong film hardening degree and electrical characteristics. As described above, the benzene ring in the formula (II-1) can be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. Among these, from the viewpoint of the patterning property, it is preferably unsubstituted. Specific examples of the partial structure represented by the above formula (II-1) are listed below. [Chemistry 19][Chemistry 20]Further, the partial structure represented by the above formula (II) is preferably a partial structure represented by the following formula (II-2) from the viewpoint of the rigidity of the skeleton and the hydrophobicity of the film. [Chem. 21](in formula (II-2), R3 Same as in the above formula (II); Rβ a divalent aliphatic ring group which may have a substituent; the benzene ring in the formula (II-2) may be further substituted with an arbitrary substituent) (Rβ In the above formula (II-2), Rβ A divalent aliphatic cyclic group which may have a substituent. The number of rings of the aliphatic ring group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress surface smoothness of the film. Or the deterioration of sensitivity and the tendency to improve resolution. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 40 or less, still more preferably 35 or less, still more preferably 30 or less. When it is set to the above lower limit value, it is easy to suppress film roughness during development, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress the surface smoothness or sensitivity of the film. Deterioration, the tendency to improve resolution. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, an adamantane ring is preferred from the viewpoint of storage stability. Examples of the substituent which the aliphatic ring group may have include an alkoxy group having a carbon number of 1 to 5 such as a hydroxyl group, a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, a carboxyl group and the like. Among these, from the viewpoint of the simplicity of the synthesis, it is preferably unsubstituted. Among these, in terms of preserving stability and electrical characteristics, Rβ It is preferably a divalent adamantane ring group. As described above, the benzene ring in the formula (II-2) can be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. Among these, from the viewpoint of the patterning property, it is preferably unsubstituted. Specific examples of the partial structure represented by the above formula (II-2) are listed below. [化22][化23][Chem. 24]On the other hand, the partial structure represented by the above formula (II) is preferably a partial structure represented by the following formula (II-3) from the viewpoint of the residual film ratio of the coating film and the patterning property. [化25](in formula (II-3), R3 And R4 Same as in the above formula (II); RZ The hydrogen atom or the polybasic acid residue is a residue. The polybasic acid residue means a monovalent group obtained by removing one OH group from a polybasic acid or an anhydride thereof. Furthermore, the polybasic acid residue may further remove one OH group from the polybasic acid or its anhydride and the R in the other molecules represented by the formula (II-3).Z Sharing OH groups, that is, a plurality of formulas (II-3) can be passed through RZ And the link. Examples of the polybasic acid include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, and trimellitic acid. One of benzophenone tetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chloric acid, methyltetrahydrophthalic acid, and biphenyltetracarboxylic acid or 2 or more types. Among these, from the viewpoint of patterning properties, maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and the like are preferable. Pyromellitic acid, trimellitic acid, biphenyltetracarboxylic acid, more preferably tetrahydrophthalic acid, biphenyltetracarboxylic acid, biphenyltetracarboxylic acid. The partial structure represented by the above formula (II-3) contained in one molecule of the epoxy (meth) acrylate resin (d-2) may be one type or two or more types, for example, it may be mixed in the presence of R.Z For hydrogen atoms and RZ It is a polybasic acid residue. Further, the number of partial structures represented by the above formula (II) contained in one molecule of the epoxy (meth) acrylate resin (d-2) is not particularly limited, but is preferably one or more, and more preferably 3 More preferably, it is preferably 20 or less, more preferably 15 or less, still more preferably 10 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and electrical characteristics tend to be good. Further, by setting it as the upper limit or less, it is easy to suppress surface smoothness of the film. Or the deterioration of sensitivity and the tendency to improve resolution. The polystyrene-equivalent weight average molecular weight (Mw) of the epoxy (meth) acrylate resin (d-2) measured by gel permeation chromatography (GPC) is not particularly limited, and is preferably 1,000. The above is more preferably 1,500 or more, further preferably 2,000 or more, more preferably 30,000 or less, still more preferably 20,000 or less, still more preferably 10,000 or less, and still more preferably 5,000 or less. When it is set to the above lower limit value, the patterning property tends to be good, and when it is set to the above upper limit value, it is easy to obtain a strong film, and the surface roughness tends to be less likely to occur. The acid value of the epoxy (meth) acrylate resin (d-2) is not particularly limited, but is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, and still more preferably 40 mgKOH/g or more. More preferably, it is 60 mgKOH/g or more, more preferably 80 mgKOH/g or more, further preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, still more preferably 120 gKOH/g or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and the electrical properties tend to be improved. Further, when the thickness is equal to or less than the above upper limit, the development solubility is improved, and the resolution is improved. "Production method of epoxy (meth) acrylate resin (d-1) and (d-2)" Epoxy (meth) acrylate resins (d-1) and (d-2) can be obtained as follows : addition of an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group to an epoxy resin (i) having a structure corresponding to the above formula (I) and the above formula (II) And further reacting with a polybasic acid and/or an anhydride thereof; or (ii) adding an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group, and further with a polyhydric alcohol and a polybasic acid And / or its anhydride to carry out the reaction. As the epoxy resin to be used as a raw material, for example, a phenol novolac type epoxy resin (for example, "EPPN-201" manufactured by Nippon Kayaku Co., Ltd., "EP-152" manufactured by Mitsubishi Chemical Corporation, and "EP-154" can be preferably used. "), (o/m/pair) cresol novolac type epoxy resin (for example, "EOCN-102S", "EOCN-1020", "EOCN-104S" manufactured by Nippon Kayaku Co., Ltd.), will be produced by dicyclopentane An epoxy resin obtained by glycidation of a phenol resin obtained by reacting an ene with a phenol (for example, "NC-7300" manufactured by Nippon Kayaku Co., Ltd.), and an epoxy resin represented by the following formula (D1) to (D3) Wait. Specifically, the epoxy resin represented by the following general formula (D1) is "XD-1000" manufactured by Nippon Kayaku Co., Ltd., and the epoxy resin represented by the following general formula (D2) is exemplified. "NC-3000" manufactured by Nippon Kasei Co., Ltd., etc. [Chem. 26]In the above formula (D1), a is an average value and represents a number of 0 to 10. R11 Any of a hydrogen atom, a halogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a phenyl group, a naphthyl group or a biphenyl group. Furthermore, a plurality of Rs present in one molecule1 1 They can be the same or different from each other. [化27]In the above formula (D2), b is an average value and represents a number of 0 to 10. Rtwenty one Any of a hydrogen atom, a halogen atom, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a phenyl group, a naphthyl group or a biphenyl group. Furthermore, a plurality of Rs present in one moleculetwenty one They can be the same or different from each other. [化28]In the above formula (D3), X represents a linking group represented by the following formula (D3-1) or (D3-2). Among them, the molecular structure contains one or more adamantane structures. c represents an integer of 2 or 3. [化29]In the above formulas (D3-1) and (D3-2), R31 ~R34 And R35 ~R37 Each of them may independently represent an adamantyl group which may have a substituent, a hydrogen atom, an alkyl group having 1 to 12 carbon atoms which may have a substituent, or a phenyl group which may have a substituent. Among these, epoxy resins represented by the general formulae (D1) to (D3) are preferably used. Examples of the α,β-unsaturated monocarboxylic acid or the α,β-unsaturated monocarboxylic acid ester having a carboxyl group include (meth)acrylic acid, crotonic acid, o/di/p-vinylbenzoic acid, (A). Monocarboxylic acid such as α-haloalkyl, alkoxy, halogen, nitro, cyano substituent of acrylic acid, 2-(meth)acryloxyethyl succinate, 2-(Adipic acid) Base) propylene methoxyethyl ester, 2-(methyl) propylene methoxyethyl phthalate, 2-(methyl) propylene methoxyethyl hexaphthalate, maleic acid 2-(Methyl) propylene methoxyethyl ester, 2-(methyl) propylene methoxy propyl succinate, 2-(methyl) propylene methoxy propyl acrylate, tetrahydrophthalic acid 2-(Methyl)propenyl propyl propyl ester, 2-(methyl) propylene methoxy propyl phthalate, 2-(methyl) propylene methoxy propyl maleate, succinic acid 2-(Methyl) propylene decyl butyl acrylate, 2-(methyl) propylene decyl butyl acrylate, 2-(methyl) propylene oxy butyl phthalate, phthalic acid 2-(methyl)propene decyl butyl acrylate, 2-(methyl) propylene decyl butyl acrylate, ε-hexyl (meth) acrylate Monoesters such as lactones, β-propiolactone, γ-butyrolactone, δ-valerolactone, or hydroxyalkyl (meth) acrylate, pentaerythritol tri(meth) acrylate Examples of the acid (anhydride) such as succinic acid (anhydride), phthalic acid (anhydride), maleic acid (anhydride), and a (meth)acrylic acid dimer. Among these, in terms of sensitivity, (meth)acrylic acid is particularly preferred. As a method of adding an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group to an epoxy resin, a known method can be employed. For example, an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group can be reacted with an epoxy resin in the presence of an esterification catalyst at a temperature of 50 to 150 ° C. . As the esterification catalyst used herein, a tertiary amine such as triethylamine, trimethylamine, benzyldimethylamine or benzyldiethylamine, tetramethylammonium chloride or tetraethylammonium chloride can be used. And a quaternary ammonium salt such as dodecyltrimethylammonium chloride. Further, the epoxy resin, the α,β-unsaturated monocarboxylic acid or the α,β-unsaturated monocarboxylic acid ester having a carboxyl group, and the esterification catalyst may be used singly or in combination of two or more. . The amount of the α,β-unsaturated monocarboxylic acid or the α,β-unsaturated monocarboxylic acid ester having a carboxyl group is preferably in the range of 0.5 to 1.2 equivalents per equivalent of the epoxy group of the epoxy resin. More preferably, it is in the range of 0.7 to 1.1 equivalents. If the amount of the α,β-unsaturated monocarboxylic acid or the α,β-unsaturated monocarboxylic acid ester having a carboxyl group is in the above range, the amount of introduction of the unsaturated group is sufficient, and thereafter, the polybasic acid and/or The reaction of the anhydride also tends to be sufficient. The polybasic acid and/or its anhydride may be selected from the group consisting of maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and pyromellitic acid. Trimellitic acid, benzophenone tetracarboxylic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chloric acid, methyltetrahydrophthalic acid, biphenyltetracarboxylic acid One or two or more kinds of acids and the like. Preferred are maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, pyromellitic acid, trimellitic acid, biphenyltetracarboxylic acid Or such anhydrides. More preferably, it is tetrahydrophthalic acid, biphenyltetracarboxylic acid, tetrahydrophthalic anhydride or biphenyltetracarboxylic dianhydride. With respect to the addition reaction of the polybasic acid and/or its anhydride, a known method may be employed to add an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group to the epoxy resin. Under the same conditions of the addition reaction, the reaction is continued to obtain a target. The amount of addition of the polybasic acid and/or its anhydride component is preferably such that the acid value of the carboxyl group-containing epoxy (meth) acrylate resin is in the range of 10 to 150 mgKOH/g, more preferably The acid value is made to the extent of 20 to 140 mgKOH/g. When the acid value of the carboxyl group-containing epoxy (meth) acrylate resin is in the above range, the alkali developability or the hardenability tends to be good. Further, in the addition reaction of the polybasic acid and/or its anhydride, a polyfunctional alcohol such as trimethylolpropane, pentaerythritol or dipentaerythritol may be added to introduce a multi-branched structure. The carboxyl group-containing epoxy (meth) acrylate resin is usually obtained by reacting an epoxy resin with an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group. After mixing the polybasic acid and/or its anhydride, or mixing the polybasic acid and/or the epoxy resin with the α,β-unsaturated monocarboxylic acid or the α,β-unsaturated monocarboxylic acid ester having a carboxyl group; After the anhydride and the polyfunctional alcohol, the heating is carried out. In this case, the order of mixing the polybasic acid and/or its anhydride with the polyfunctional alcohol is not particularly limited. By heating, a mixture of a polybasic acid and/or an anhydride thereof and a reaction of an epoxy resin with an α,β-unsaturated monocarboxylic acid or an α,β-unsaturated monocarboxylic acid ester having a carboxyl group and a polyfunctional alcohol A certain hydroxyl group is present for the addition reaction. "Other binder resin" (d) The binder resin contained in the photosensitive resin composition of the present invention contains an epoxy (meth) acrylate resin having a repeating unit structure represented by the above formula (I) and has the above formula At least one of the epoxy (meth) acrylate resins having a partial structure (II) may contain a binder resin (hereinafter abbreviated as "other binder resin"). Examples of the other binder resin include an acrylic resin, a carboxyl group-containing epoxy resin, a carboxyl group-containing urethane resin, a novolak resin, and a polyvinyl phenol resin. These may be used alone. Alternatively, a plurality of types may be used in combination. The content ratio of the (d) binder resin in the photosensitive resin composition of the present invention is usually 1% by mass or more, preferably 5% by mass or more, more preferably 10% by mass or more, and further preferably 10% by mass or more, based on the total solid content. It is preferably 15% by mass or more, and is usually 50% by mass or less, preferably 45% by mass or less, more preferably 35% by mass or less, and still more preferably 25% by mass or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate tends to be good, and the developer is oriented to the upper limit or less. The degree of penetration of the exposed portion is suppressed to be low, and the tendency of the surface smoothness or sensitivity of the film to be easily deteriorated is easily suppressed. (d) The content ratio of the epoxy (meth) acrylate resin in the binder resin is not particularly limited, but is preferably 5% by mass or more, more preferably 30% by mass or more, and still more preferably 50% by mass or more. Further, it is usually 100% by mass or less, and particularly preferably 100% by mass. When it is set to the above lower limit value, the patterning property or the substrate adhesion property tends to be good. Further, (d) an epoxy (meth) acrylate resin having a repeating unit structure represented by the above formula (I) in the binder resin, and an epoxy having a partial structure represented by the following formula (II) (methyl group) The content ratio of at least one of the acrylate resins is not particularly limited, but is preferably 5% by mass or more, more preferably 30% by mass or more, still more preferably 50% by mass or more, and usually 100% by mass. % or less, particularly preferably 100% by mass. When it is set to the above lower limit value, the water resistance is improved and the coating film surface tends to be uniform. [(e) Polymerizable monomer] The photosensitive resin composition of the present invention contains (e) a polymerizable monomer. By containing (e) a polymerizable monomer, a film having high curability can be obtained. In the photosensitive resin composition of the present invention, among the (e) polymerizable monomers, a compound having an ethylenically unsaturated group (hereinafter sometimes abbreviated as "ethylenically unsaturated compound") is preferably exemplified. The ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated bonds in the molecule. Further, the photosensitive resin composition of the present invention preferably contains a compound having two or more ethylenically unsaturated groups. Examples of the compound having one ethylenically unsaturated bond include unsaturated carboxylic acids such as (meth)acrylic acid, crotonic acid, methacrylic acid, maleic acid, itaconic acid, and citraconic acid, and the like. Alkyl ester, (meth)acrylonitrile, (meth) acrylamide, styrene, and the like. In addition, examples of the compound having two or more ethylenically unsaturated bonds in the molecule include esters of an unsaturated carboxylic acid and a polyhydroxy compound, phosphates containing a (meth)acryloxy group, and a hydroxyl group ( (meth)acrylic acid urethanes of poly(meth)acrylate compounds and polyisocyanate compounds, and epoxy (meth)acrylic acid of (meth)acrylic acid or hydroxy (meth) acrylate compounds and polyepoxides Esters and the like. These may be used alone or in combination of two or more. (e-1) an ester of an unsaturated carboxylic acid and a polyhydroxy compound as an ester of an unsaturated carboxylic acid and a polyhydroxy compound (hereinafter sometimes abbreviated as "ester (meth) acrylate"), specifically, The following compounds can be exemplified. The reactant of the unsaturated carboxylic acid and the sugar alcohol: examples of the sugar alcohol include ethylene glycol, polyethylene glycol (addition number 2 to 14), propylene glycol, polypropylene glycol (addition number 2 to 14), and triamethylene Glycol, tetramethylene glycol, hexamethylene glycol, trimethylolpropane, glycerin, pentaerythritol, dipentaerythritol, and the like. The reactant of the above-mentioned unsaturated carboxylic acid and the alkylene oxide adduct of a sugar alcohol: the sugar alcohol is the same as the above. Examples of the alkylene oxide adduct include an ethylene oxide adduct or a propylene oxide adduct. The reactant of the unsaturated carboxylic acid and the alcohol amine: examples of the alcohol amines include diethanolamine and triethanolamine. The ester of the above unsaturated carboxylic acid and a polyhydroxy compound, more specifically, the following compounds can be exemplified. Ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylolpropane Tris(meth)acrylate, trimethylolpropane ethylene oxide addition tris(meth)acrylate, glycerol di(meth)acrylate, glycerol tri(meth)acrylate, glycerin propylene oxide plus Tris(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol Methyl) acrylate or the like, and the same crotonate, methacrylate, maleate, itaconate, citraconate, and the like. Further, examples of the ester of the unsaturated carboxylic acid and the polyhydroxy compound include aromatics such as the above unsaturated carboxylic acid, hydroquinone, resorcin, pyrogallol, bisphenol F, and bisphenol A. A reactant of a hydroxy compound or such an ethylene oxide adduct. Specifically, for example, bisphenol A di(meth)acrylate, bisphenol A bis[oxyethylene (meth) acrylate], bisphenol A bis [glycidyl ether (meth) acrylate], and the like. Further, examples of the ester of the unsaturated carboxylic acid and the polyhydroxy compound include a reaction product of the above heterocyclic polyhydroxy compound such as an unsaturated carboxylic acid and tris(2-hydroxyethyl) isocyanurate. Specifically, for example, di(meth)acrylate, tris(meth)acrylate or the like of tris(2-hydroxyethyl) isocyanurate. Further, examples of the ester of the unsaturated carboxylic acid and the polyhydroxy compound include a reaction product of the above unsaturated carboxylic acid and a polyvalent carboxylic acid and a polyhydroxy compound. Specifically, for example, a condensate of (meth)acrylic acid with phthalic acid and ethylene glycol, a condensate of (meth)acrylic acid with maleic acid and diethylene glycol, (meth)acrylic acid and a pair a condensate of phthalic acid and pentaerythritol, a condensate of (meth)acrylic acid and adipic acid with butanediol and glycerin, and the like. (e-2) a (meth) acrylate compound and a (meth) acrylate urethane of a polyisocyanate compound, as a hydroxy (meth) acrylate compound, for example, hydroxymethyl (meth) acrylate A hydroxy (meth) acrylate compound such as hydroxyethyl (meth) acrylate or tetramethylol ethane tri(meth) acrylate. Further, examples of the polyisocyanate compound include aliphatic polyisocyanates such as hexamethylene diisocyanate and 1,8-diisocyanato-4-isocyanatomethyloctane; and cyclohexane diisocyanate; An alicyclic polyisocyanate such as dimethylcyclohexane diisocyanate, 4,4-methylenebis(cyclohexyl isocyanate), isophorone diisocyanate or bicycloheptane triisocyanate; 4,4- An aromatic polyisocyanate such as diphenylmethane diisocyanate or tris(isocyanatophenyl) thiophosphate; a heterocyclic polyisocyanate such as isocyanurate; and described in Japanese Patent Laid-Open Publication No. 2001-260261 The allophanate-modified polyisocyanurate produced by the method; a polyisocyanate compound. a (meth)acrylic acid urethane which is a hydroxy (meth) acrylate compound and a polyisocyanate compound, and preferably contains the above-mentioned allophanate-modified polyisocyanurate (methyl) Amino acrylates. The (meth)acrylic acid urethane containing an allophanate-modified polyisocyanurate is preferred in that the viscosity is low, the solubility in a solvent is excellent, and light hardening and/or Or heat hardening is effective for improving the adhesion to the substrate and the film strength. The above (meth)acrylic acid urethanes in the present invention can be used commercially. Specifically, for example, the brand names "U-4HA", "UA-306A", "UA-MC340H", "UA-MC340H", and "U6LPA" manufactured by Shin-Nakamura Chemical Co., Ltd. are manufactured by BAYER Japan. "AGROR4060" or the like having a compound of an allophanate skeleton. The above-mentioned (meth)acrylic acid urethane in the present invention preferably has 4 or more (preferably 6 or more, more preferably 8 or more) in one molecule from the viewpoint of sensitivity. A urethane bond [-NH-CO-O-] and a compound of four or more (preferably six or more, more preferably eight or more) (meth) acryloxy groups. This compound can be obtained, for example, by reacting a compound of the following (i) with a compound of the following (ii). (i) A compound having four or more urethane bonds in one molecule, for example, a compound having four or more hydroxyl groups in one molecule such as pentaerythritol or polyglycerin, and hexamethylene diisocyanate, and a top three a compound (i-1) obtained by reacting a diisocyanate compound such as hexamethylene diisocyanate, isophorone diisocyanate or toluene diisocyanate; or having two or more hydroxyl groups in one molecule such as ethylene glycol The compound is "Duranate 24A-100" manufactured by Asahi Kasei Chemicals Co., Ltd., "Duranate 22A-75PX" manufactured by Asahi Kasei Chemicals Co., Ltd., "Duranate 21S-75E" manufactured by Asahi Kasei Chemicals Co., Ltd., and "Duranate 18H" manufactured by Asahi Kasei Chemicals Co., Ltd. -70B" and other biuret type, "Duranate P-301-75E" manufactured by Asahi Kasei Chemicals Co., Ltd., "Duranate E-402-90T" manufactured by Asahi Kasei Chemicals Co., Ltd., and "Duranate E-405" manufactured by Asahi Kasei Chemicals Co., Ltd. a compound (i-2) obtained by reacting a compound having three or more isocyanate groups in one molecule such as an addition type of -80T"; or A compound (i-3) obtained by polymerization or copolymerization of (meth)acrylic acid isocyanatoethyl ester or the like. As such a compound, a commercially available product can be used, and for example, "Duranate ME20-100" manufactured by Asahi Kasei Chemicals Co., Ltd. can be used. (ii) A compound having four or more (meth) acryloxy groups in one molecule, for example, pentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol tetra(methyl) Having one or more hydroxyl groups and two or more, preferably three or more (meth) acryloxy groups in one molecule such as acrylate, dipentaerythritol penta (meth) acrylate or dipentaerythritol hexaacrylate Compound. Here, the molecular weight of the compound (i) is preferably from 500 to 200,000, particularly preferably from 1,000 to 150,000. Further, the molecular weight of the (meth)acrylic acid urethane is preferably 600 to 150,000. Further, such a (meth)acrylic acid urethane can be produced, for example, by subjecting the compound of the above (i) and the compound of the above (ii) to an organic solvent such as toluene or ethyl acetate at 10 The reaction is carried out at ~150 ° C for 5 minutes to about 3 hours. In this case, it is preferred to set the molar ratio of the isocyanate group of the former to the hydroxyl group of the latter to a ratio of from 1/10 to 10/1, and a catalyst such as n-butyltin dilaurate is used as needed. (e-3) Epoxy (meth) acrylate of (meth)acrylic acid or a hydroxy (meth) acrylate compound and a polyepoxy compound, as a polyepoxy compound, for example, (poly)ethylene glycol Polyglycidyl ether, (poly)propylene glycol polyglycidyl ether, (poly)tetramethylene glycol polyglycidyl ether, (poly) pentamethylene glycol polyglycidyl ether, (poly) neopentyl glycol polymerization Glycidyl ether, (poly) hexamethylene glycol polyglycidyl ether, (poly) trimethylolpropane polyglycidyl ether, (poly) glycerol polyglycidyl ether, (poly) sorbitol polyglycidyl ether Aliphatic polyepoxides; phenol novolac polyepoxides, brominated phenol novolac polyepoxides, (o/m/p) cresol novolac polyepoxides, bisphenol A polyepoxides, Aromatic polyepoxides such as bisphenol F polyepoxide; sorbitan polyglycidyl ether, isocyanuric acid triglycidyl ester, isocyanuric acid triglycidyl tris(2-hydroxyethyl) ester and the like A polyepoxy compound such as a polyepoxy compound. Examples of the epoxy (meth) acrylate which is a reaction product of (meth)acrylic acid or a hydroxy (meth) acrylate compound and a polyepoxy compound include polyepoxides and (meth) such as these. A reaction product of acrylic acid or the above hydroxy (meth) acrylate compound or the like. (e-4) Other ethylenically unsaturated compound Other than the above, other than the above, (ethyl) acrylamide such as ethyl bis(meth) acrylamide; Allyl esters such as diallyl dicarboxylate; vinyl-containing compounds such as divinyl phthalate; and vulcanization of an ether bond of an ethylenically unsaturated compound containing an ether bond by using phosphorus pentasulfide or the like A thioether bond, such that the crosslinking rate is increased, and the thioether bond-containing compound is obtained. These may be used alone or in combination of two or more. In the present invention, the ethylenically unsaturated compound preferably contains a compound having two or more ethylenically unsaturated groups in the molecule in terms of polymerizability and crosslinkability. Among them, preferred are ester (meth) acrylates, phosphates containing (meth) propylene decyloxy groups, or methacrylate acrylates, and more preferably ester (meth) acrylates. class. Among the ester (meth) acrylates, bisphenol A di(meth) acrylate, bisphenol A bis [oxyethylene (meth) acrylate], bisphenol A bis [glycidyl ether] are preferred. A reaction product such as a methyl acrylate or the like with an aromatic polyhydroxy compound or such an ethylene oxide adduct. Further, among the ethylenically unsaturated compounds of the present invention, those which do not contain an aromatic ring or which contain an unsubstituted or phenyl group having a substituent at the p (pair) position can suppress discoloration of the interlayer insulating film due to heat treatment (red Coloring) is therefore preferred. Examples of such an ethylenically unsaturated compound include an aliphatic polyfunctional (meth) acrylate, a (meth) acrylate compound having a bisphenol A or a hydrazine skeleton, and the like. Among these, as the (e) polymerizable monomer, (e-3) (meth)acrylic acid or hydroxy (meth)acrylic acid is preferably used from the viewpoint of the balance between hardenability and resolution. The epoxy (meth) acrylate of the ester compound and the polyepoxy compound is preferably a (meth) acrylate compound represented by the following formula (III). [化30](in formula (III), R5 A divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is represented. R6 The alkylene group which may have a substituent is independently represented. R7 Each represents a hydrogen atom or a methyl group independently. k and l each independently represent an integer from 1 to 20) (R5 In the above formula (III), R5 A divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is represented. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group or an aromatic cyclic group. The number of rings of the aliphatic ring group is not particularly limited, and is usually one or more, preferably two or more, and usually six or less, preferably four or less, and more preferably three or less. When it is set to the above-mentioned lower limit value, it is a coating film which is strong, and the residual film rate tends to be good, and when it is set to the said upper limit or less, the development solubility improves, and patterning characteristics are favorable. The tendency. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 30 or less, still more preferably 25 or less, still more preferably 20 or less, and particularly preferably 15 or less. When it is set to the above-mentioned lower limit value, it is a coating film which is strong, and the residual film rate tends to be good, and when it is set to the said upper limit or less, the development solubility improves, and patterning characteristics are favorable. The tendency. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, an adamantane ring is preferred from the viewpoint of a strong film quality and patterning property. On the other hand, the number of rings of the aromatic ring group is not particularly limited, and is usually one or more, preferably two or more, more preferably three or more, and usually six or less, and preferably 4 or less. When it is set to the above lower limit value, the film quality is strong, and the substrate adhesiveness tends to be good. When the thickness is equal to or less than the above upper limit, the development solubility is improved, and the patterning property tends to be good. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. Further, the number of carbon atoms of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, still more preferably 12 or more, still more preferably 30 or less, more preferably 25 or less, further preferably 20 or less, and particularly preferably 15 or less. When it is set to the above lower limit value, the substrate adhesion tends to be good, and the patterning property tends to be good by setting it as the upper limit or less. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and an anthracene ring. Among these, a benzene ring is preferred from the viewpoint of developing solubility. Further, the divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group and a divalent aromatic ring group, and one or more divalent aliphatic groups. A group formed by linking one or more divalent aromatic ring groups. Examples of the divalent aliphatic group include a linear chain, a branched chain, and a ring, or a combination thereof. Among these, from the viewpoint of developing solubility, it is preferably a linear one, and on the other hand, from the viewpoint of reducing the penetration of the developer into the exposed portion, it is preferably a ring. The carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, further preferably 30 or less, more preferably 20 or less, still more preferably 15 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the divalent linear aliphatic group include a methylene group, an ethylidene group, an exo-propyl group, an exo-butyl group, a hexyl group, and a perylene group. Among these, a methylene group is preferred from the viewpoint of the rigidity of the skeleton. Specific examples of the divalent branched aliphatic group include an isopropyl group, a second butyl group, a tert-butyl group, and an isoamyl group. Among these, from the viewpoint of the rigidity of the skeleton, it is preferred to extend the third butyl group. The number of rings of the divalent cyclic aliphatic group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 Below. When it is set as the above-mentioned lower limit, it is a film which is a strong film, and the adhesiveness and electrical characteristics of a board|substrate are favorable, and it is easy to suppress the surface smoothness or sensitivity of a film by setting it as the above-mentioned upper-limit. Deterioration, the tendency to improve resolution. Specific examples of the divalent cyclic aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and an adamantane ring. A ring obtained by removing a hydrogen atom from a ring such as a cyclododecane ring. Among these, from the viewpoint of the rigidity of the skeleton, a group obtained by removing two hydrogen atoms from the adamantane ring is preferred. Examples of the substituent which the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a hydroxyl group, a methoxy group or an ethoxy group, a hydroxyl group, a nitro group, a cyano group, and a carboxyl group. Among these, from the viewpoint of ease of synthesis, it is preferably unsubstituted. Further, examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, further preferably 40 or less, more preferably 35 or less, still more preferably 30 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring having two free valences, a naphthalene ring, an anthracene ring, a phenanthrene ring, an anthracene ring, a naphthac ring, an anthracene ring, a benzofluorene ring, an anthracene ring, and A combination of a benzene ring, an ethane naphthalene ring, a fluorene ring, an anthracene ring, and the like. Further, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring having two free valences, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, and an oxadiazole ring. Anthracene ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furanfuran ring, thienofuran ring, benzene And isoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyridinium ring, anthracene ring, pyrimidine ring, triterpene ring, quinoline ring, isoquinoline ring, porphyrin ring, quinoxaline a group of a phenyl ring, a phenazin ring, a benzimidazole ring, an acridine ring, a quinazoline ring, a quinazolinone ring, an anthracene ring or the like. Among these, from the viewpoint of the patterning property, a benzene ring or a naphthalene ring having two free valences is preferable, and a benzene ring having a divalent free valence is more preferable. Examples of the substituent which the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among these, from the viewpoint of developing solubility and moisture absorption resistance, it is preferably unsubstituted. In addition, as a group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups, one or more of the above divalent aliphatic groups and one or more of the above 2 may be mentioned. A group obtained by linking a valent aromatic ring group. The number of the divalent aliphatic groups is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. The number of the divalent aromatic ring groups is not particularly limited, and is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. When it is set to the above lower limit value, it is easy to obtain a strong film, and it is less likely to cause surface roughness, and the adhesion to the substrate and electrical properties tend to be good, and it is easy to be equal to or less than the above upper limit value. The surface smoothness or sensitivity of the film is suppressed from deteriorating, and the resolution is improved. Specific examples of the group in which one or more divalent aliphatic groups are bonded to one or more divalent aromatic ring groups include the groups represented by the above formulas (I-A) to (I-E). Among these, from the viewpoint of the rigidity of the skeleton and the hydrophobicization of the film, the group represented by the above formula (I-A) is preferred. The cyclic hydrocarbon in the side chain is not particularly limited based on the bonding state on the divalent hydrocarbon group, and for example, one hydrogen atom of a divalent aliphatic group or a divalent aromatic ring group may be substituted by the side chain. The aspect or the aspect which comprises the cyclic hydrocarbon group which is a side chain by the one carbon atom which comprises a divalent aliphatic group. (R6 In the above formula (III), R6 The alkylene group which may have a substituent is independently represented. Examples of the alkylene group include a linear chain, a branched chain, and a ring, or a combination thereof. Among these, from the viewpoint of solubility at the time of development, it is preferably linear. The carbon number is usually 1 or more, preferably 2 or more, more preferably 6 or more, still more preferably 10 or more, further preferably 30 or less, more preferably 25 or less, still more preferably 20 or less. When it is set to the above lower limit value, the substrate adhesion and the hole resolving property tend to be good, and the residue of the unexposed portion tends to decrease as the upper limit or lower. Specific examples of the alkylene group include an ethyl group extending, a propyl group, an isopropyl group, a second butyl group, a thirteenth butyl group, and a cyclohexyl group. Among these, from the viewpoint of developing solubility, an ethyl group is preferred. Examples of the substituent which the alkylene group may have include a hydroxyl group, a methoxy group, an ethoxy group, a decyl group, a sulfonyl group, a carboxyl group, a benzyl group and the like. Among these, from the viewpoint of exposure sensitivity, it is preferably unsubstituted, and from the viewpoint of developing solubility, a hydroxyl group is preferred. In the formula (III), k and l each independently represent an integer of 1 to 20. It is preferably 2 or more, more preferably 3 or more, still more preferably 15 or less, still more preferably 13 or less. When it is set to the above lower limit value, the patterning property tends to be good, and when it is equal to or less than the above upper limit value, the coating film is formed to be strong, and the residual film ratio tends to be good. Further, among the (meth) acrylate compounds represented by the above formula (III), from the viewpoint of high resolution, (meth)acrylic acid represented by the following formula (III-1) is preferred. Ester compound. [化31](in formula (III-1), R6 , R7 , k and l have the same meanings as in the above formula (III). Rγ A monovalent cyclic hydrocarbon group which may have a substituent is represented. m is an integer of 1 or more. The benzene ring in the formula (III-1) may be further substituted with an arbitrary substituent) (Rγ In the above formula (III-1), Rγ A monovalent cyclic hydrocarbon group which may have a substituent is represented. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group or an aromatic cyclic group. The number of rings of the aliphatic ring group is not particularly limited, and is usually one or more, preferably two or more, and usually six or less, preferably four or less, and more preferably three or less. When the amount is higher than the lower limit, the degree of penetration of the developer into the exposed portion is kept low, and the surface smoothness or sensitivity of the film tends to be suppressed, and the upper limit is used. In addition, the alkali solubility of the unexposed portion can be ensured, so that the resolution is improved. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 30 or less, still more preferably 25 or less, still more preferably 20 or less, and particularly preferably 15 or less. When the amount is higher than the lower limit, the degree of penetration of the developer into the exposed portion is kept low, and the surface smoothness or sensitivity of the film tends to be suppressed, and the upper limit is used. In addition, the alkali solubility of the unexposed portion can be ensured, so that the resolution is improved. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, the degree of penetration of the developer into the exposed portion is suppressed to be low, and from the viewpoint of suppressing deterioration of surface smoothness or sensitivity of the film, an adamantane ring is preferable. On the other hand, the number of rings of the aromatic ring group is not particularly limited, and is usually one or more, preferably two or more, more preferably three or more, and usually six or less, and preferably 5 or less. When the amount is higher than the lower limit, the degree of penetration of the developer into the exposed portion is kept low, and the surface smoothness or sensitivity of the film tends to be suppressed, and the upper limit is used. In addition, the alkali solubility of the unexposed portion can be ensured, so that the resolution is improved. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. Further, the number of carbon atoms of the aromatic ring group is usually 6 or more, preferably 8 or more, more preferably 10 or more, still more preferably 40 or less, still more preferably 35 or less, still more preferably 30 or less. When the amount is higher than the lower limit, the degree of penetration of the developer into the exposed portion is kept low, and the surface smoothness or sensitivity of the film tends to be suppressed, and the upper limit is used. In addition, the alkali solubility of the unexposed portion can be ensured, so that the resolution is improved. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, a biphenyl ring, a ternary benzene ring, a phenanthrene ring, and an anthracene ring. Among these, from the viewpoint of ensuring the permeation characteristics and resolution of the developer, an anthracene ring is preferred. Examples of the substituent which the cyclic hydrocarbon group may have include a hydroxyl group; a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a second butyl group, a third butyl group, a pentyl group, an isopentyl group, and the like. An alkyl group having 1 to 5 carbon atoms; an alkoxy group having 1 to 5 carbon atoms such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; a carboxyl group; Among these, from the viewpoint of ease of synthesis, it is preferably unsubstituted. m represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. When the amount is higher than the lower limit, the degree of penetration of the developer into the exposed portion is kept low, and the surface smoothness or sensitivity of the film tends to be suppressed, and the upper limit is used. In addition, the alkali solubility of the unexposed portion can be ensured, so that the resolution is improved. Among these, in terms of the hygroscopicity of the coating film and the guarantee of the alkali solubility of the unexposed portion, Rγ It is preferably a monovalent aliphatic ring group, more preferably an adamantyl group. As described above, the benzene ring in the formula (III-1) can be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. Among these, from the viewpoint of the patterning property, it is preferably unsubstituted. Specific examples of the (meth) acrylate compound represented by the above formula (III-1) are listed below. [化32][化33]Further, from the viewpoint of the moisture absorption resistance of the coating film and the alkali solubility of the unexposed portion, the (meth) acrylate compound represented by the above formula (III) is preferably the following formula (III-2). ) a (meth) acrylate compound represented. [化34](in formula (III-2), R6 , R7 , k and l have the same meanings as in the above formula (III). Rδ A divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in the formula (III-2) may be further substituted with any substituent) (Rδ In the above formula (III-2), Rδ A divalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group or an aromatic cyclic group. The number of rings of the aliphatic ring group is not particularly limited, but is usually one or more, preferably two or more, and usually 10 or less, preferably 5 or less. When it is set to the above-mentioned lower limit value, it is a coating film which is strong, and the residual film rate tends to be improved, and the patterning property tends to be improved by setting it as the said upper limit or less. Further, the number of carbon atoms of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 30 or less, still more preferably 25 or less, still more preferably 20 or less. When the film hydrophobicity is increased by the above lower limit value, the substrate adhesion property tends to be improved, and the development solubility in the case of no exposure is enhanced by setting it as the upper limit or less. The tendency to improve characteristics. Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isodecane ring, and adamantane. Ring, cyclododecane ring, and the like. Among these, from the viewpoint of substrate adhesion, an adamantane ring is preferred. On the other hand, the number of rings of the aromatic ring group is not particularly limited, and is usually one or more, preferably two or more, more preferably three or more, and usually six or less, and preferably 4 or less. When it is set to the above-mentioned lower limit value, it is a coating film which is strong, and the residual film rate tends to be improved, and the patterning property tends to be improved by setting it as the said upper limit or less. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. Further, the number of carbon atoms of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, further preferably 30 or less, more preferably 25 or less, and further preferably It is 20 or less, and particularly preferably 15 or less. When the coating film is made of the above lower limit value, the coating film becomes hydrophobic, and the adhesion of the substrate tends to be improved. Further, by setting the upper limit or lower, the development solubility can be ensured, and thus the patterning property is improved. tendency. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and an anthracene ring. Among these, the anthracene ring is preferred from the viewpoint of the substrate adhesion property in which the coating film is hydrophobized. Examples of the substituent which the cyclic hydrocarbon group may have include a hydroxyl group; a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, a second butyl group, a third butyl group, a pentyl group, an isopentyl group, and the like. An alkyl group having 1 to 5 carbon atoms; an alkoxy group having 1 to 5 carbon atoms such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; a carboxyl group; Among these, from the viewpoint of developing solubility and exposure sensitivity, it is preferably unsubstituted. Among these, in terms of preserving stability and electrical characteristics, Rδ It is preferably a divalent aliphatic ring group, more preferably a divalent adamantane ring group. On the other hand, in terms of the low hygroscopicity and patterning properties of the coating film, Rδ It is preferably a divalent aromatic ring group, more preferably a divalent anthracene ring group. As described above, the benzene ring in the formula (III-2) can be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of the substituents is not particularly limited, and may be one or two or more. Among these, from the viewpoint of the patterning property, it is preferably unsubstituted. Specific examples of the (meth) acrylate compound represented by the above formula (III-2) are listed below. [化35][化36][化37]In the photosensitive resin composition of the present invention, the content ratio of the (e) polymerizable monomer is usually 1% by mass or more, preferably 3% by mass or more, and usually 20% by mass based on the total solid content. % or less is preferably 18% by mass or less, more preferably 15% by mass or less, further preferably 12% by mass or less, and particularly preferably 10% by mass or less. When it is set to the above lower limit value, the film hardenability tends to be improved, and when it is at most the above upper limit value, the film surface roughness of the coating film can be suppressed. In addition, the content ratio of the (meth) acrylate compound represented by the above formula (III) is not particularly limited, and is preferably 0.5% by mass or more, more preferably 1% by mass or more, based on the total solid content of the component. It is preferably 2% by mass or more, more preferably 15% by mass or less, still more preferably 10% by mass or less, and still more preferably 8% by mass or less. When it is set to the above lower limit value, the electric properties and the hole resolution are optimized, and the film thickness on the surface of the coating film is suppressed by setting it as the upper limit or less. [(f) Polymerization Initiator] The photosensitive resin composition of the present invention contains (f) a polymerization initiator. It is carried out by photohardening which occurs by exposure by containing (f) a polymerization initiator. Any known one can be used as the polymerization initiator, and examples thereof include a compound capable of generating a radical which polymerizes an ethylenically unsaturated group under ultraviolet light to visible light irradiation. Specific examples of the polymerization initiator which can be used in the present invention are listed below. (i) 2-(4-Methoxyphenyl)-4,6-bis(trichloromethyl)-tetramethyl, 2-(4-methoxynaphthyl)-4,6-bis(trichloro) Methyl)-tetramethyl, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-tetramethyl, 2-(4-ethoxycarbonylnaphthyl)-4,6 - Halomethylated triterpene derivatives such as bis(trichloromethyl)-triterpene. (ii) halomethylated oxadiazole derivatives, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis (3) '-Methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methylphenyl)-4,5-diphenyl An imidazole derivative such as a base imidazole dimer or a 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer. (iii) Benzoin alkyl ethers such as benzoin methyl ether, benzoin isobutyl ether, and benzoin isopropyl ether. (iv) an anthracene derivative such as 2-methylindole, 2-ethylanthracene, 2-tert-butylindole or 1-chloroindole. (v) a benzofluorenone derivative. (vi) benzophenone, mischoketone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-chlorobenzophenone, 4- A benzophenone derivative such as bromobenzophenone or 2-carboxybenzophenone. (vii) 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, α-hydroxy-2-methylbenzene Acetone, 1-hydroxy-1-methylethyl-(p-isopropylphenyl)one, 1-hydroxy-1-(p-dodecylphenyl)one, 2-methyl-(4'- An acetophenone derivative such as (methylthio)phenyl)-2-carbolinyl-1-propanone or 1,1,1-trichloromethyl-(p-butylphenyl) ketone. (viii) 9-oxopurine2-ethyl 9-oxothione2-isopropyl 9-oxothiolane2-chloro 9-oxosulfuron2,4-Dimethyl 9-oxothione2,4-Diethyl 9-oxothione2,4-diisopropyl 9-oxothione9-oxopurinederivative. (ix) a benzoate derivative such as p-dimethylaminobenzoic acid ethyl ester or p-diethylaminobenzoic acid ethyl ester. (x) an acridine derivative such as 9-phenyl acridine or 9-(p-methoxyphenyl)acridine. (xi) a quinone derivative such as 9,10-dimethylbenzophenanthine. (xii) Dicyclopentadienyl-Ti-dichloride, dicyclopentadienyl-Ti-biphenyl, dicyclopentadienyl-Ti-bis-2,3,4,5,6-five Fluorophenyl-1-yl, dicyclopentadienyl-Ti-bis-2,3,5,6-tetrafluorophenyl-1-yl, dicyclopentadienyl-Ti-bis-2,4,6 -trifluorophenyl-1-yl, dicyclopentadienyl-Ti-2,6-difluorophenyl-1-yl, dicyclopentadienyl-Ti-2,4-difluorophenyl-1-yl , dimethylcyclopentadienyl-Ti-bis-2,3,4,5,6-pentafluorophenyl-1-yl, dimethylcyclopentadienyl-Ti-bis-2,6-di A titanocene derivative such as fluorophenyl-1-yl, dicyclopentadienyl-Ti-2,6-difluoro-3-(pyrrol-1-yl)-phenyl-1-yl. (xiii) 2-methyl-1[4-(methylthio)phenyl]-2-indolyl propan-1-one, 2-benzyl-2-dimethylamino-1-(4- Porphyrinylphenyl)butanone-1-one, 2-benzyl-2-dimethylamino-1-(4-carbolinylphenyl)butan-1-one, 4-methyl benzoate Aminoethyl ester, 4-dimethylaminoisoamyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 1,4-dimethylaminobenzene 2-ethylhexyl formate, 2,5-bis(4-diethylaminobenzylidene)cyclohexanone, 7-diethylamino-3-(4-diethylaminobenzamide) An α-aminoalkylphenone compound such as coumarin or 4-(diethylamino)chalcone. (xiv) a fluorenylphosphine oxide compound such as 2,4,6-trimethylbenzimidyldiphenylphosphine oxide or bis(2,4,6-trimethylbenzylidene)phenylphosphine oxide. (xv) 1,2-octanedione-1-[4-(phenylthio)phenyl]-2-(O-benzhydrylhydrazine), ethyl ketone-1-[9-ethyl-6- (2-Methylbenzylidene)-9H-indazol-3-yl]-1-(O-ethylindenyl). (xvi) Japanese Patent Laid-Open No. 2000-80068, Japanese Patent Laid-Open No. 2001-233842, Japanese Patent Laid-Open No. 2001-235858, Japanese Patent Laid-Open Publication No. 2005-182004, and International Publication No. 2002/00903 The oxime ester compound represented by the compound described in Japanese Laid-Open Patent Publication No. 2007-041493. Among the polymerization initiators, from the viewpoint of the patterning property and the transparency, an oxime ester compound is preferable, and the above (xv) or (xvi) is more preferable, and among them, a compound having the following structure is particularly preferably used. Y. [化38]These polymerization initiators may be used singly or in combination of plural kinds. As a combination, for example, Japanese Patent Publication No. Sho 53-12802, Japanese Patent Laid-Open No. Hei No. 1-279903, Japanese Patent Laid-Open No. Hei 2-48486, Japanese Patent Laid-Open No. Hei-4-164902, or Japanese Patent Laid-Open A combination of polymerization initiators described in JP-A-6-75373 or the like. The content ratio of the polymerization initiator in the photosensitive resin composition of the present invention is usually 0.1% by mass or more, preferably 0.5% by mass or more, and more preferably 1% by mass or more, based on the total solid content. It is preferably 2% by mass or more, more preferably 3% by mass or more, and usually 40% by mass or less, preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 10% by mass or less. More preferably, it is 7 mass% or less. When the thickness is more than or equal to the lower limit, the curability is sufficient, and the film strength tends to be lowered. When the temperature is less than or equal to the upper limit, the degree of heat shrinkage is reduced, and cracking after thermal curing can be suppressed. The tendency of cracks. [(g) Surfactant] The photosensitive resin composition of the present invention may contain nonionics, for the purpose of improving the coatability of the composition as a coating liquid, and improving the developability of the photosensitive resin composition layer. An anionic, cationic, amphoteric surfactant, or a surfactant such as a fluorine-based or polyfluorene-based surfactant. Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl esters, and polycondensation. Oxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbus Sugar alcohol fatty acid esters, polyoxyethylene sorbitan fatty acid esters, and the like. Examples of such commercially available products include polyoxyethylene surfactants such as "Emulgen 104P" and "Emulgen A60" manufactured by Kao Corporation. Further, examples of the anionic surfactant include alkylsulfonates, alkylbenzenesulfonates, alkylnaphthalenesulfonates, polyoxyethylene alkyl ethersulfonates, and alkyl groups. Sulfates, alkyl sulfates, higher alcohol sulfates, aliphatic alcohol sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkylphenyl ether sulfates, alkyl phosphates Ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special polymer surfactants, and the like. Among these, a special polymer type surfactant is preferable, and a special polycarboxylic acid type polymer type surfactant is more preferable. Commercially available products can be used as the anionic surfactant. For example, "Amal 10" manufactured by Kao Corporation can be used as the alkyl sulfate salt, and the alkyl naphthalenesulfonate can be produced by Kao Corporation. For example, "Homogenol L-18" and "Homogenol L-100" manufactured by Kao Corporation are listed as "Pelex NB-L". Further, examples of the cationic surfactant include quaternary ammonium salts, imidazoline derivatives, and amine salts. Further, examples of the amphoteric surfactant include betaine-based compounds and imidazolium. Salts, imidazolines, amino acids, and the like. Among these, a quaternary ammonium salt is preferred, and a stearyltrimethylammonium salt is more preferred. For example, "Acetamin (registered trademark) 24" manufactured by Kao Corporation, and the like, and "Quartamin (registered trademark, the same below) can be cited as the quaternary ammonium salt. ) 24P", "Quartamin 86W", etc. On the other hand, the fluorine-based surfactant is preferably a compound having a fluoroalkyl group or a fluorine-extended alkyl group at at least any of a terminal, a main chain and a side chain. Specifically, for example, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether, 1,1,2,2-tetrafluorooctylhexyl ether , octaethylene glycol di(1,1,2,2-tetrafluorobutyl)ether, hexaethylene glycol bis(1,1,2,2,3,3-hexafluoropentyl)ether, octapropylene glycol (1,1,2,2-tetrafluorobutyl)ether, hexapropylene glycol bis(1,1,2,2,3,3-hexafluoropentyl)ether, sodium perfluorododecylsulfonate, 1 1,2,2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, and the like. As such a commercial product, "BM-1000" and "BM-1100" manufactured by BM Chemie Co., Ltd., "MEGAFAC (registered trademark, the same as below) F142D", "MEGAFAC F172", " MEGAFAC F173", "MEGAFAC F183", "MEGAFAC F470", "MEGAFAC F475", "FC430" and "FC4432" manufactured by 3M Company, "DFX-18" manufactured by NEOS. Further, examples of the polyoxo-based surfactant include "Toray Silicone DC3PA", "Toray Silicone SH7PA", "Toray Silicone DC11PA", "Toray Silicone SH21PA", and "Toray Silicone SH28PA" manufactured by Dow Corning Toray Co., Ltd. "Toray Silicone SH29PA", "Toray Silicone SH30PA", "Toray Silicone SH8400", "FZ2122", "TSF-4440", "TSF-4300", "TSF-4445", "TSF-" manufactured by Momentive Performance Materials 4460", "TSF-4452", "KP341" manufactured by Silicone, "BYK323" and "BYK330" manufactured by BYK-Chemie. Among these surfactants, a fluorine-based surfactant and a polyfluorene-based surfactant are preferred from the viewpoint of uniformity of coating film thickness. The surfactant may be a combination of two or more kinds, and examples thereof include a polyfluorene-based surfactant/fluorine-based surfactant, a polyfluorene-based surfactant, a special polymer-based surfactant, and a fluorine-based surfactant. / Combination of special polymer surfactants, etc. Among these, a polyfluorene-based surfactant/fluorine-based surfactant is preferred. For example, "TFX-18" manufactured by Momentive Performance Materials Co., Ltd. / "DFX-18" manufactured by NEOS Co., Ltd., and "BYK" manufactured by BYK-Chemie Co., Ltd. are exemplified as the combination of the polyoxo-based surfactant/fluorine-based surfactant. "S-393" manufactured by -300" or "BYK-330"/Seimi Chemical Co., Ltd., "F-478" or "F-475" manufactured by Shin-Etsu Silicones Co., Ltd. / "F-475" manufactured by Dainippon Ink Co., Ltd., Dow "DS-401" manufactured by Corning Toray, "DS-401" manufactured by Daikin Co., Ltd., "FZ2122" manufactured by Dow Corning Toray, "FC4432" manufactured by 3M Company, and "L-77"/3M manufactured by Nippon Unicar "FC4430" manufactured by the company. In the case where the photosensitive resin composition of the present invention contains a surfactant, the content ratio of the surfactant in the photosensitive resin composition is preferably 10% by mass or less, more preferably 0.01%, based on the total solid content. 5 mass%. [Other components] The photosensitive resin composition of the present invention may further contain an additive such as a thermal crosslinking agent, a bonding aid, a curing agent, and an ultraviolet absorber. Examples of the components include, for example, International Publication No. 2007/139005. Recorder. <Method for Producing Photosensitive Resin Composition> Next, a method of producing the photosensitive resin composition of the present invention will be described. [Method for Producing Inorganic Particle Dispersion] First, an inorganic particle dispersion liquid is produced. The inorganic particle dispersion contains (a) zirconium dioxide particles, (b) a dispersant, and (c) a solvent, and optionally contains a dispersion resin. These materials are mixed, and the other components are dispersed in (c) a solvent, whereby an inorganic particle dispersion can be obtained. The dispersion method is not particularly limited, and examples thereof include a paint shaker, a sand mill, a ball mill, a roll mill, a stone mill, a jet mill, and a homogenizer. The mixing order of the components is not particularly limited as long as the effect of the present invention is not impaired, and (a) the zirconium dioxide particles, (b) the dispersing agent and, if appropriate, the dispersing resin may be added after adding the solvent (c), or the reverse order may be employed. . As the dispersion resin, those described as the above (d) binder resin can be used. A part of the (d) binder resin used in the preparation of the photosensitive resin composition may be used as the dispersion resin, and (d) a binder resin different from the user used in the preparation of the photosensitive resin composition may be used. When the (a) zirconium dioxide particles are dispersed by a sand mill, glass beads or zirconia beads having a particle diameter of about 0.05 to 5 mm can be preferably used. Regarding the dispersion treatment conditions, the temperature is usually from 0 ° C to 100 ° C, preferably from room temperature to 80 ° C. [Method for Preparing Photosensitive Resin Composition] Next, a method of preparing the photosensitive resin composition of the present invention will be described. First, the inorganic particle dispersion liquid and the (c) solvent as an essential component, (d) a binder resin, (e) a polymerizable monomer, and (f) a polymerization initiator, and optionally, an interface activity as an optional component The agent and the components other than the above are mixed to prepare a homogeneous solution, whereby a photosensitive resin composition is obtained. The mixing is preferably carried out at room temperature, usually under UV blocking to avoid starting the polymerization. Further, in the case where fine dirt is mixed in each step such as mixing, it is preferred to subject the obtained photosensitive resin composition to filtration treatment by a filter or the like. <Method of Forming Interlayer Insulating Film> A cured product can be obtained by applying and curing the photosensitive resin composition of the present invention. The photosensitive resin composition of the present invention is particularly preferably used as a material for forming an interlayer insulating film. Hereinafter, a method of forming an interlayer insulating film using the photosensitive resin composition of the present invention will be described. [1-1] Coating Step First, a coating device such as a spin coater, a wire coater, a flow coater, a die coater, a roll coater, or a sprayer is used to form a TFT array. The photosensitive resin composition of the present invention described above is applied onto a substrate. The coating film thickness of the photosensitive resin composition is usually 0.1 to 5 μm. [1-2] Drying step The volatile component is removed (dried) from the above coating film to form a dried coating film. Drying can be carried out by vacuum drying, heating plates, IR (Infrared Radiation) ovens, convection ovens, and the like. The drying conditions are preferably in the range of 40 to 150 ° C and a drying time of 10 to 60 minutes. [1-3] Exposure and development step Next, a photomask is placed on the dried coating film of the photosensitive resin composition layer, and image exposure is performed through the mask. After the exposure, the unexposed unhardened portion is removed by development, thereby forming a pixel. Further, there is also a case where post-exposure baking is performed after exposure and before development in order to improve sensitivity. In this case, a baking plate, an IR oven, a convection oven, or the like can be used for the baking. The post-exposure baking conditions are usually in the range of 40 to 150 ° C and a drying time of 10 seconds to 60 minutes. A contact hole for connecting the active element and the pixel electrode is usually formed in the interlayer insulating film. The contact holes are obtained by patterning and developing the coating film. In high-definition displays, smaller contact holes are required. For example, there is also a case where an opening of a square hole having a side length of 3 to 10 μm is required. Examples of the light source used in the exposure step of the dried coating film include a xenon lamp, a halogen lamp, a tungsten lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, a medium pressure mercury lamp, a low pressure mercury lamp, or the like, or an argon ion. Laser, YAG (Yttrium Aluminium Garnet) laser, excimer laser, nitrogen laser and other laser sources. Optical filters can also be utilized when only light of a particular wavelength is used. The solvent used for the development treatment is not particularly limited as long as it has a capability of dissolving the coating film of the uncured portion, and is in terms of environmental pollution, harmfulness to human body, fire risk, and the like. It is best to use an alkaline developer instead of a solvent. Examples of such an alkaline developing solution include inorganic alkali compounds such as sodium carbonate, sodium hydrogencarbonate, potassium carbonate, potassium hydrogencarbonate, sodium citrate, potassium citrate, sodium hydroxide, and potassium hydroxide, or diethanolamine. An aqueous solution of an organic base compound such as triethylamine, triethanolamine or tetramethylammonium hydroxide. Further, the alkaline developing solution may optionally contain a surfactant, a water-soluble solvent, a wetting agent, a low molecular compound having a hydroxyl group or a carboxylic acid group, and the like. Examples of the surfactant used in the developer include an anionic surfactant having a sodium naphthalenesulfonate group and a sodium benzenesulfonate group, a nonionic surfactant having a polyalkylene group, and tetraoxane. A cationic surfactant such as a quaternary ammonium group. The method for the development treatment is not particularly limited, and is usually carried out by dipping development, immersion development, spray development, magnetic brush development, ultrasonic development at a development temperature of 10 to 50 ° C, preferably 15 to 45 ° C. Wait. [1-4] Heat treatment step The photosensitive resin composition film on which the image is formed by the exposure and development steps is then subjected to a heat treatment (hard baking) step to become a cured product (thermosetting film). Further, in order to suppress the occurrence of outgassing during hard baking, the entire surface exposure is performed after development and before hard baking. When the whole surface exposure is performed before the hard baking, ultraviolet light or visible light is used as the light source, and examples thereof include a xenon lamp, a halogen lamp, a tungsten lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a metal halide lamp, and a medium pressure mercury lamp. Light sources such as low-pressure mercury lamps, or laser sources such as argon-ion lasers, YAG lasers, excimer lasers, and nitrogen lasers. A hot plate, an IR oven, a convection oven, etc. can be used for hard baking. The hard baking conditions are usually in the range of 100 to 250 ° C and a drying time of 30 seconds to 90 minutes. <TFT Active Matrix Substrate and Image Display Device> Next, a method of manufacturing an image display device, particularly a liquid crystal display device (panel), according to the present invention will be described. The liquid crystal display device usually includes a TFT (Thin Film Transistor) active matrix substrate. First, the TFT active matrix substrate is formed by forming the cured material on the substrate on which the TFT element array is formed as an interlayer insulating film, and forming an ITO (Indium Tin Oxides) film thereon, and using the light. The ITO wiring is produced by the lithography method. Then, the TFT active matrix substrate and the counter substrate are bonded together to form a liquid crystal cell, liquid crystal is injected into the formed liquid crystal cell, and the counter electrode is connected to complete the liquid crystal display device. As the counter substrate, a color filter substrate having an alignment film is usually used. As the alignment film, a resin film such as polyimide or the like is preferable. The formation of the alignment film is usually carried out by gravure printing and/or soft printing, and the thickness of the alignment film is set to several 10 nm. After the hardening treatment of the alignment film by thermal baking, the surface treatment is performed by irradiation of ultraviolet rays or treatment with a rubbing cloth, and processed into a surface state capable of adjusting the slope of the liquid crystal. Further, an interlayer insulating film similar to the above may be further formed on the alignment film. The bonding gap between the TFT active matrix substrate and the counter substrate is generally selected from the range of 2 μm or more and 8 μm or less depending on the application of the liquid crystal display device. After bonding to the counter substrate, a portion other than the liquid crystal injection port is sealed with a sealing material such as an epoxy resin. As such a sealing material, those which can be cured by UV irradiation and/or heating are generally used, and the periphery of the liquid crystal cell is sealed. After the peripheral sealed liquid crystal cell is cut into panel units, the pressure is reduced in the vacuum chamber, and the liquid crystal injection port is immersed in the liquid crystal to return the pressure to atmospheric pressure, whereby liquid crystal can be injected into the liquid crystal cell. As the degree of pressure reduction in the liquid crystal cell, usually 1 × 10-2 Above Pa, preferably 1×10-3 Above Pa, again, usually 1×10- 7 Below Pa, preferably 1 × 10- 6 The following range of Pa. Further, it is preferable to heat the liquid crystal cell at the time of pressure reduction. The heating temperature is usually 30 ° C or higher, preferably 50 ° C or higher, and usually 100 ° C or lower, preferably 90 ° C or lower. The temperature holding condition at the time of pressure reduction is usually in the range of 10 minutes or more and 60 minutes or less. Thereafter, the liquid crystal cell is immersed in the liquid crystal. The UV hardening resin is cured, and the liquid crystal injection port of the liquid crystal cell into which the liquid crystal is injected is sealed. Thus, the production of the liquid crystal display device (panel) can be completed. In addition, the type of the liquid crystal is not particularly limited, and a liquid crystal known in the art such as an aromatic system, an aliphatic system or a polycyclic compound may be used, and any liquid crystal such as a lyotropic liquid crystal or a thermotropic liquid crystal may be used. As the thermotropic liquid crystal, a nematic liquid crystal, a smectic liquid crystal, a cholesteric liquid crystal, or the like is known, and any of them may be used. EXAMPLES Hereinafter, the present invention will be described in detail by way of examples. However, the present invention is not limited to the embodiments described below, and may be carried out without departing from the spirit and scope of the invention. The constituent components of the photosensitive resin composition used in the following examples and comparative examples are as follows. (a) Zirconium dioxide particles (high dielectric constant inorganic particles) 1: UEP (manufactured by First Rare Elements Chemical Industry Co., Ltd., ZrO2 Primary particle size: 10 to 30 nm (a') Other high dielectric constant inorganic particles 1: T-BTO-020RF (manufactured by Toda Industrial Co., Ltd., BaTiO)3 Primary particle size: 10~30 nm 2: TTO-51N (manufactured by Ishihara Sangyo Co., Ltd., TiO2 Primary particle size: 10 to 30 nm (b) Dispersant DISPERBYK-111 (manufactured by BYK-Chemie Co., Ltd.) (c) Solvent PGMEA (propylene glycol monomethyl ether acetate) (d) Adhesive resin (Synthesis Example 1) Synthesis of adamantyl epoxy (meth) acrylate resin [39]The epoxy compound (epoxy equivalent 264) 50 g of the above structure, 13.65 g of acrylic acid, 60.5 g of methoxybutyl acetate, 0.936 g of triphenylphosphine, and the like were placed in a flask equipped with a thermometer, a stirrer, and a cooling tube. 0.032 g of methoxyphenol was reacted at 90 ° C while stirring until the acid value became 5 mgKOH/g or less. The reaction took 12 hours to obtain an epoxy acrylate solution. 25 parts by mass of the above epoxy acrylate solution, 0.76 parts by mass of trimethylolpropane (TMP), 3.3 parts by mass of biphenyltetracarboxylic dianhydride (BPDA), and 3.5 mass of tetrahydrophthalic anhydride (THPA) The mixture was placed in a flask equipped with a thermometer, a stirrer, and a cooling tube, and the mixture was slowly heated to 105 ° C while stirring to cause a reaction. When the resin solution became transparent, it was diluted with methoxybutyl acetate to adjust the solid content to 70% by mass to obtain an acid value of 115 mgKOH/g, and the weight average molecular weight in terms of polystyrene measured by GPC. (Mw) 2,600 binder resin (1). (Synthesis Example 2) Synthesis of a biphenyl group-containing epoxy (meth) acrylate resin: "NC3000H" (manufactured by Nippon Kayaku Co., Ltd.) (epoxy equivalent 288) 400 parts by mass, acrylic acid 102 parts by mass, p-methoxy 0.3 parts by mass of phenol, 5 parts by mass of triphenylphosphine, and 264 parts by mass of propylene glycol monomethyl ether acetate were placed in a reaction vessel, and stirred at 95 ° C until the acid value became 3 mgKOH/g or less. It takes 9 hours to reach the target acid value (acid value 2.2 mgKOH/g). Then, 39 parts by mass of succinic anhydride was further added, and the mixture was reacted at 95 ° C for 4 hours, and adjusted to 40% by mass of the solid content by propylene glycol monomethyl ether acetate (PGMEA) to obtain an acid value of 40 mgKOH/g, which was measured by GPC. The polystyrene-converted weight average molecular weight (Mw) 4,000 of the following structural formula (wherein m and n in the formula are 3 or 4, and the binder resin (2) is a mixture of the binders) Resin (2). [化40](Synthesis Example 3) Synthesis of an epoxy (meth) acrylate resin containing an anthracene ring [Chem. 41]In the same manner as in Synthesis Example 1, except that the epoxy compound was replaced with the epoxy compound of the above-mentioned structure, the acid value of 60 mgKOH/g and the polystyrene measured by GPC were obtained. A binder resin (3) having a weight average molecular weight (Mw) of 6,500 was converted. (Synthesis Example 4) Synthesis of bisphenol A type epoxy (meth) acrylate resin In Synthesis Example 1, an epoxy compound was replaced with a bisphenol A type epoxy resin (RE-310S manufactured by Nippon Kayaku Co., Ltd.). In the same manner as in Synthesis Example 1, a binder resin (4) having an acid value of 60 mgKOH/g and a polystyrene-equivalent weight average molecular weight (Mw) of 8,600 as measured by GPC was obtained. (Synthesis Example 5) Synthesis of bisphenol F-type epoxy (meth) acrylate resin In Synthesis Example 1, an epoxy compound was replaced with a bisphenol F-type epoxy resin (RE-303S-L manufactured by Nippon Kayaku Co., Ltd.) In the same manner as in Synthesis Example 1, a binder resin (5) having an acid value of 60 mgKOH/g and a polystyrene-equivalent weight average molecular weight (Mw) of 10,500 as measured by GPC was obtained. (Synthesis Example 6) Synthesis of Acrylic Resin 150 parts by mass of propylene glycol monomethyl ether acetate was stirred while replacing with nitrogen, and the temperature was raised to 120 °C. 20.0 parts by mass of a monomethacrylate FA-513M (manufactured by Hitachi Chemical Co., Ltd.) having a tricyclodecane skeleton, 4.0 parts by mass of methyl methacrylate, 37.4 parts by mass of methacrylic acid, and methacrylic acid were added thereto over 3 hours. A mixture of 73.2 parts by mass of cyclohexyl ester was further stirred at 90 ° C for 2 hours to obtain a binder resin (6). The obtained binder resin (6) had a weight average molecular weight (Mw) of 5,800 in terms of polystyrene measured by GPC, and an acid value of 60 mgKOH/g. (e) Polymerizable monomer 1: dipentaerythritol hexaacrylate (DPHA) 2: bisphenol A type epoxy ester; 3000A (manufactured by Kyoeisha Chemical Co., Ltd.) 3: thiol-containing epoxy ester; EA-0300 ( (Manufactured by Osaka Gas Chemicals Co., Ltd.) (f) Polymerization initiator oxime ester polymerization initiator: Compound Y (e) additive described in the specification Surfactant: F554 (manufactured by DIC) Adhesion improver: KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.) (Preparation of high dielectric constant inorganic particle dispersion) According to the following composition, high dielectric constant inorganic particles, a dispersant, a dispersion resin, and a solvent are blended, and a high medium is prepared by the following method. Electric constant inorganic particle dispersion. First, the solid content of the high dielectric constant inorganic particles, the dispersant, and the dispersion resin are blended as follows. Further, the amount of the solvent below also includes the total amount of the dispersant and the amount of the solvent contained in the dispersion resin. High dielectric constant inorganic particles: UEP 100 parts by mass Dispersant: DISPERBYK-111 (manufactured by BYK-Chemie Co., Ltd.) 5 parts by mass / solid content conversion · Dispersion resin: alkali-soluble resin containing adamantyl group (the above binder) Resin (1)) 10 parts by mass / solid content conversion solvent: propylene glycol monomethyl ether acetate (PGMEA) 350 parts by mass The above components were thoroughly stirred and mixed. Then, dispersion treatment was carried out for 6 hours in a range of 25 to 45 ° C using a paint shaker. As the beads, zirconia beads having a diameter of 0.3 mm were used, and 10 g of the dispersion and 20 g of the beads were added. After the completion of the dispersion, the beads and the dispersion were separated by a filter to prepare a high dielectric constant inorganic particle dispersion 1 having a solid content of 25% by mass. In addition, the high dielectric constant inorganic particle dispersions 2 and 3 were prepared in the same manner as described above except that UEP which is a high dielectric constant inorganic particle was replaced with T-BTO-020RF and TTO-51N. Further, the evaluation conditions in the examples and comparative examples are as follows. (Method for Measuring Film Thickness of Photosensitive Resin Composition) Measurement was carried out using a stylus profilometer "α-step IQ" (manufactured by KLA Tencor Co., Ltd.). The measurement of the film thickness was carried out at two positions at random, and the average value of the two points was taken as the film thickness. The measurement length was set to 0.7 mm and the scanning speed was set to 0.5 mm/s. (Electric measurement sample preparation) An ITO electrode was sputtered on a glass substrate at a film thickness of 70 nm over the entire surface to obtain a conductive substrate. The photosensitive resin composition was applied onto the conductive substrate by a spin coater, and dried by a hot plate at 100 ° C for 90 seconds. Thereafter, the exposure apparatus MA-1100 (manufactured by Dainippon Research Co., Ltd.) was used to have an exposure amount of 120 mJ/cm.2 (Intensity at a wavelength of 365 nm) is exposed to the entire surface. Then, using a developing device AD-1200 manufactured by Takizawa Industry Co., Ltd., a 2.38 mass% aqueous solution of tetramethylammonium hydroxide was used as a developing solution, and the developing solution was immersed for 50 seconds for development, and washed with water for 20 seconds. After that, blow off the water. Thereafter, it was baked at 230 ° C for 30 minutes in a clean oven to obtain a dielectric film. The film thickness of the dielectric film was set to 0.3 μm. An aluminum electrode is formed on the dielectric film by evaporation. Aluminum electrode thickness 60 nm, area 3 mm2 The electrode of the circular pattern. The portion sandwiched between the ITO electrode and the aluminum electrode was used as a measurement target. (Measurement of Relative Dielectric Constant) An ITO electrode on the substrate of the electric measurement sample was brought into contact with one of the aluminum electrodes on the dielectric film to form a circuit, and the capacitance at a frequency of 1.0 kHz was measured. From the measured capacitance and the film thickness of the dielectric film and the area of the aluminum electrode, the relative dielectric constant was calculated by the formula (1).In the above formula (1), C: capacitance, εr : Relative dielectric constant, ε0 : vacuum dielectric constant (constant), S: electrode area, d: distance between electrodes. This measurement was performed using an LCR meter-4284A (manufactured by Hewlett Packard). (Measurement of Leakage Current) The ITO electrode on the substrate of the electric measurement sample was brought into contact with one of the aluminum electrodes on the dielectric film, and a voltage of 1 V to 50 V was applied so as to be 2 V out of phase, and the current at this time was measured. As a value for comparing each photosensitive resin composition, the current value at the time of application of 15 V was used. For the measurement, an Ultra-High Resistance Meter R8340A (manufactured by ADVANTEST Co., Ltd.) was used. (Evaluation of developability) A photosensitive resin composition was applied onto a glass substrate on which an ITO electrode was sputter coated using a spin coater, and dried on a hot plate at 100 ° C for 90 seconds. Thereafter, pattern exposure was performed using a 15/15 μm, 50/50 μm line and gap (L/S) mask using an exposure apparatus MA-1100 (manufactured by Dainippon Research Co., Ltd.). At this time, the gap between the mask and the substrate is set to 5 μm, and the exposure amount is set to 20 to 100 mJ/cm.2 (Intensity at 365 nm). Then, using a developing device AD-1200 manufactured by Takizawa Industry Co., Ltd., a 2.38 mass% aqueous solution of tetramethylammonium hydroxide was used as a developing solution for development. While rotating at 30 rpm, the developer was sprayed at a pressure of 0.15 MPa for 90 seconds, and subjected to a water washing treatment at 300 rpm for 10 seconds. Thereafter, it was baked at 230 ° C for 30 minutes in a clean oven to obtain a dielectric film having a film thickness of 300 nm. The evaluation criteria of developability are as follows. 〇: Lines and gaps of 15/15 μm are formed. △: No lines and gaps of 15/15 μm were formed, but lines and gaps of 50/50 μm were formed. ×: A line and a gap of 50/50 μm were not formed. (Preparation of photosensitive resin composition) The components shown in Table 1 were mixed in a glass bottle in the amount shown in Table 1, and each photosensitive resin composition was prepared. In addition, the value in Table 1 is a mass part of the solid content component, and the solvent (PGMEA) is used so that the total solid content of each photosensitive resin composition becomes 20 mass %. As the high dielectric constant inorganic particle dispersion, the above high dielectric constant inorganic particle dispersions 1 to 3 are used. In the examples and comparative examples in which the binder resin other than the binder resin (1) is used, the dispersion resin in the high dielectric constant inorganic particle dispersion 1 is replaced with the binder resin (1) to the binder. A high dielectric constant inorganic particle dispersion prepared by a resin. Further, the blending amount of the binder resin in Table 1 indicates the total amount including the blending amount of the dispersion resin. [Table 1] In Example 1, although the zirconium dioxide particles were contained in a very high ratio among all the solid components of the photosensitive resin composition, the leakage current at the time of application of 15 V was as low as 10-9 About (A/cm), the developability is also good. On the other hand, in Comparative Examples 1 and 2, since barium titanate particles or titanium dioxide particles were contained at a high ratio, leakage current increased and developability was also inferior. Since the zirconium dioxide particles have a small number of surface functional groups, it is considered that the hygroscopicity of the coating film is suppressed and the leakage current is lowered. Further, the zirconium dioxide particles are considered to have a high dispersibility and are easy to adsorb a dispersant or a resin, so that they are in a state of being coated with a highly soluble dispersant or a resin, and the developability is good. On the other hand, it is considered that barium titanate particles or titanium dioxide particles have poor dispersibility and poor compatibility with a resin having high solubility, so that film coarsening occurs during development, and leakage current is increased. Further, it is considered that the barium titanate particles or the titanium dioxide particles have a high polarity on the surface of the particles, and have a strong adhesion to the interface between the glass substrates, and are not sufficiently dissolved during development to cause dissolution. Further, according to the comparison between Examples 1 and 2, it was confirmed that the leakage current suppression and the developability were good regardless of the content ratio of the zirconium dioxide particles. Further, according to the comparison of Examples 1 and 3, it was confirmed that not only the case where the binder resin is an epoxy (meth) acrylate resin having a partial structure represented by the formula (II), but also the formula (I) In the case of the epoxy (meth) acrylate resin having a repeating unit structure, the leakage current is suppressed and the developability is good. An epoxy (meth) acrylate resin containing an anthracene ring, a bisphenol A type epoxy-containing (meth) acrylate resin, and a bisphenol F type epoxy-containing (meth) acrylate were used as in Comparative Examples 3 to 5. In the case of an ester resin, the developability is poor. On the other hand, an epoxy (meth) acrylate resin having a repeating unit structure represented by the formula (I) and having the formula (II) are used as in Examples 1 to 3. In the case of at least one of the epoxy (meth) acrylate resins having a partial structure, the developability is good. The reason for this is that the epoxy (meth) acrylate resin has a large-volume rigid skeleton at its central portion. Therefore, the (meth) acrylonitrile group as a hydrophilic group is easily spread outward, and the solubility is improved. On the other hand, the epoxy (meth) acrylate resin containing an anthracene ring is considered to have a large volume and a high hydrophobicity, and thus the developability is poor. Further, it is considered that the bisphenol A type epoxy group-containing (meth) acrylate resin or the bisphenol F type epoxy group-containing (meth) acrylate resin has a rotatable skeleton, and thus is comparable to a resin having a skeleton which cannot be rotated. The sensitivity is improved, but the sensitivity is uneven, and in particular, the developability is poor under the condition that the hydrophilic portion is easily aggregated in the presence of a low-polar solvent. On the other hand, in the case of using an acrylic resin as in Comparative Examples 6 and 7, the developability was good, and the relative dielectric constant was the same as in Examples 1 to 3, but the leakage current was large. It is considered that the sensitivity of the skeleton of the acrylic resin causes unevenness in the coating film, and the coating film becomes uneven after development, and the hygroscopicity of the film is enhanced to increase the leakage current. Further, it is considered that the acrylic resin has low heat resistance, and the acrylic resin is decomposed during thermal curing, so that voids are generated. Further, according to the comparison of Examples 1, 4, and 5, it was confirmed that the leakage current suppression and the developability were good regardless of the type of the polymerizable monomer. In particular, in Example 1, a hexafunctional (meth) acrylate was used as a polymerizable monomer, and in contrast, in Examples 4 and 5, a bifunctional (meth) acrylate was used as a polymerizable monomer, and thus the sensitivity was Although it is slightly lowered, it has a strong and hydrophobic skeleton and is formed into a film which is strong under alkaline development, and as a result, electrical characteristics are improved. The present invention has been described in detail with reference to the specific embodiments of the invention. In addition, the present application is based on a Japanese patent application filed on Jul. 29, 2016 (Japanese Patent Application No. Hei.

Claims (9)

一種感光性樹脂組合物，其係含有(a)二氧化鋯粒子、(b)分散劑、(c)溶劑、(d)黏合劑樹脂、(e)聚合性單體及(f)聚合起始劑者， 上述(d)黏合劑樹脂含有具有下述式(I)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂及具有下述式(II)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂之至少一者， [化1](式(I)中，R1 表示氫原子或甲基，R2 表示可具有取代基之2價烴基；式(I)中之苯環可進而經任意之取代基取代；*表示鍵結鍵) [化2](式(II)中，R3 分別獨立地表示氫原子或甲基；R4 表示具有脂肪族環基作為側鏈之2價烴基；*表示鍵結鍵)。A photosensitive resin composition comprising (a) zirconium dioxide particles, (b) a dispersant, (c) a solvent, (d) a binder resin, (e) a polymerizable monomer, and (f) a polymerization initiation The (d) binder resin contains an epoxy (meth) acrylate resin having a repeating unit structure represented by the following formula (I) and an epoxy having a partial structure represented by the following formula (II). At least one of (meth) acrylate resins, [Chemical 1] (In the formula (I), R 1 represents a hydrogen atom or a methyl group, and R 2 represents a divalent hydrocarbon group which may have a substituent; the benzene ring in the formula (I) may be further substituted with an arbitrary substituent; * represents a bond ) [Chemical 2] (In the formula (II), R 3 each independently represents a hydrogen atom or a methyl group; R 4 represents a divalent hydrocarbon group having an aliphatic cyclic group as a side chain; * represents a bonding bond). 如請求項1之感光性樹脂組合物，其中上述(d)黏合劑樹脂之含有比率於全部固形物成分中為5質量%以上。The photosensitive resin composition of claim 1, wherein the content ratio of the (d) binder resin is 5% by mass or more based on the total solid content. 如請求項1或2之感光性樹脂組合物，其中上述(a)二氧化鋯粒子之含有比率於全部固形物成分中為50質量%以上。The photosensitive resin composition of claim 1 or 2, wherein the content ratio of the (a) zirconium dioxide particles is 50% by mass or more based on the total solid content. 如請求項1至3中任一項之感光性樹脂組合物，其中上述(f)聚合起始劑含有肟酯系化合物。The photosensitive resin composition according to any one of claims 1 to 3, wherein the (f) polymerization initiator contains an oxime ester compound. 如請求項1至4中任一項之感光性樹脂組合物，其中上述(e)聚合性單體含有下述式(III)所表示之(甲基)丙烯酸酯化合物， [化3](式(III)中，R5 表示具有環狀烴基作為側鏈之2價烴基；R6 分別獨立地表示可具有取代基之伸烷基；R7 分別獨立地表示氫原子或甲基；k及l分別獨立地表示1〜20之整數)。The photosensitive resin composition according to any one of claims 1 to 4, wherein the (e) polymerizable monomer contains a (meth) acrylate compound represented by the following formula (III), [Chem. 3] (In the formula (III), R 5 represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain; R 6 each independently represents an alkylene group which may have a substituent; and R 7 each independently represents a hydrogen atom or a methyl group; k And l each independently represent an integer from 1 to 20). 一種硬化物，其係使如請求項1至5中任一項之感光性樹脂組合物硬化而成。A cured product obtained by hardening the photosensitive resin composition according to any one of claims 1 to 5. 一種層間絕緣膜，其包含如請求項6之硬化物。An interlayer insulating film comprising the cured product of claim 6. 一種TFT主動矩陣基板，其包含如請求項7之層間絕緣膜。A TFT active matrix substrate comprising the interlayer insulating film of claim 7. 一種圖像顯示裝置，其包含如請求項8之TFT主動矩陣基板。An image display device comprising the TFT active matrix substrate as claimed in claim 8.
TW106125463A 2016-07-29 2017-07-28 Photosensitive resin composition, cured product, interlayer insulating film, TFT active matrix substrate, and image display device TWI718325B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2016-150610 2016-07-29
JP2016150610 2016-07-29

Publications (2)

Publication Number Publication Date
TW201829476A true TW201829476A (en) 2018-08-16
TWI718325B TWI718325B (en) 2021-02-11

Family

ID=61017002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106125463A TWI718325B (en) 2016-07-29 2017-07-28 Photosensitive resin composition, cured product, interlayer insulating film, TFT active matrix substrate, and image display device

Country Status (5)

Country Link
JP (1) JP6881455B2 (en)
KR (1) KR102351163B1 (en)
CN (1) CN109564385B (en)
TW (1) TWI718325B (en)
WO (1) WO2018021497A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220108046A (en) * 2019-11-27 2022-08-02 오사카 유키가가쿠고교 가부시키가이샤 (meth)acrylate, curable resin composition and cured product
JP7458909B2 (en) * 2020-06-10 2024-04-01 東京応化工業株式会社 Photocurable composition and pattern forming method
CN113736373A (en) * 2021-09-23 2021-12-03 深圳市通泰盈科技股份有限公司 Acrylate pressure-sensitive adhesive, preparation method thereof and protective film

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007279489A (en) * 2006-04-10 2007-10-25 Hitachi Chem Co Ltd Photosensitive resin composition, method for producing resist pattern, flexible substrate and electronic component
JP4818839B2 (en) * 2006-07-19 2011-11-16 株式会社 日立ディスプレイズ Liquid crystal display device and manufacturing method thereof
JP5144341B2 (en) 2008-03-28 2013-02-13 大阪瓦斯株式会社 Fluorene resin composition
JP5407164B2 (en) 2008-04-02 2014-02-05 東レ株式会社 Paste composition and dielectric composition using the same
JP2010129344A (en) * 2008-11-27 2010-06-10 Mitsubishi Chemicals Corp Composition for under-coating layer, organic thin film patterning substrate, organic electroluminescent element, organic el display device, and organic el illumination
JP2010197952A (en) * 2009-02-27 2010-09-09 Sekisui Chem Co Ltd Photosensitive composition and solder resist composition
JP5505726B2 (en) 2009-10-28 2014-05-28 ナガセケムテックス株式会社 Composite resin composition
JP2013237804A (en) * 2012-05-16 2013-11-28 Mitsubishi Chemicals Corp Inorganic compound dispersion, curable resin composition, cured product, tft active matrix substrate, liquid crystal display device, and method for producing dispersion
JP2014102391A (en) * 2012-11-20 2014-06-05 Fujifilm Corp Photosensitive resin composition, cured product and production method of the same, method for producing resin pattern, cured film, organic electroluminescence (el) display device, liquid crystal display device, and touch panel display device
CN104981739A (en) * 2013-02-12 2015-10-14 富士胶片株式会社 Method for producing cured film, cured film, liquid crystal display device, organic el display device, and touch panel display device
WO2014136897A1 (en) * 2013-03-07 2014-09-12 日立化成株式会社 Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board
CN104102091B (en) * 2013-04-10 2020-04-21 东京应化工业株式会社 Composition for forming transparent insulating film

Also Published As

Publication number Publication date
WO2018021497A1 (en) 2018-02-01
TWI718325B (en) 2021-02-11
CN109564385B (en) 2022-12-09
CN109564385A (en) 2019-04-02
KR20190034209A (en) 2019-04-01
JPWO2018021497A1 (en) 2019-05-23
JP6881455B2 (en) 2021-06-02
KR102351163B1 (en) 2022-01-14

Similar Documents

Publication Publication Date Title
KR101242912B1 (en) Heat curable composition for protective film, cured product, and liquid crystal display device
TWI632426B (en) Colored photosensitive resin composition, cured film, color filter, method for manufacturing color filter, solid-state image sensing device, and image display device
KR101217952B1 (en) Thermosetting composition for protective film cured object and liquid-crystal display
JP6304026B2 (en) Photosensitive resin composition, cured product, interlayer insulating film, TFT active matrix substrate, and liquid crystal display device
TWI708995B (en) Photosensitive resin composition for light-shielding film functioning as spacer, light-shielding film, lcd device, method for manufacturing photosensitive resin composition for light-shielding film functioning as spacer, method for manufacturing light-shielding film and method for manufacturing lcd device
JP7100828B2 (en) Scanning antenna and related technologies
JP2019144543A (en) Coloring resin composition, color filter, and image display device
TWI718325B (en) Photosensitive resin composition, cured product, interlayer insulating film, TFT active matrix substrate, and image display device
WO2007139007A1 (en) Heat curable composition for protective film, cured product, and liquid crystal display device
CN105911818A (en) Photoresist composition, hardening film making method, hardening film and application thereof
TWI812845B (en) Colored resin composition, color filter and image display device
TW201715306A (en) Photosensitive resin composition for light-shielding film with the role of spacer, light-shielding film, liquid crystal display device, method for producing photosensitive resin composition for light-shielding film with the role of spacer obtain hardened substance having excellent flexible modulus, deformation and flexible recovery rate under condition of retaining shading and insulation
TWI676080B (en) Curable composition, cured film, organic electroluminescence display device, liquid crystal display device, and touch panel display device
TW201906875A (en) Photosensitive resin composition, cured product, black matrix, and image display device
JP6853493B2 (en) Photopolymerizable composition, cured product, image display device and oxime ester compound
JP2007241084A (en) Heat-curable composition for protective film, color filter and liquid crystal display device
CN111095104B (en) Photosensitive coloring composition, cured product, black matrix, and image display device
JP6547330B2 (en) Curable resin composition, cured product, TFT active matrix substrate, and liquid crystal display device
JP2010085767A (en) Green curable resin composition for color filter, color filter, and display device
WO2019065246A1 (en) Resin composition and resin film
JP2017116659A (en) Curable composition for protection film, protection film, tft active matrix substrate, and image display device
TW202225842A (en) Photosensitive coloring composition, cured product, organic electroluminescent element, and image display device
KR101953923B1 (en) Thermosetting resin composition, color filter and display device having a protective film formed by using the same
CN111812942A (en) Photosensitive resin composition, cured film and display device
KR20130006315A (en) A black coating composition