TW201828305A - Memory device and power control circuit thereof - Google Patents

Memory device and power control circuit thereof Download PDF

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TW201828305A
TW201828305A TW106102801A TW106102801A TW201828305A TW 201828305 A TW201828305 A TW 201828305A TW 106102801 A TW106102801 A TW 106102801A TW 106102801 A TW106102801 A TW 106102801A TW 201828305 A TW201828305 A TW 201828305A
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transistor
control
memory device
electrically coupled
signal
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TW106102801A
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TWI704564B (en
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鄭學誠
賴成孝
林英廷
傅嘉韋
林永祥
陳元輝
莫亞楠
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聯華電子股份有限公司
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Abstract

A memory device comprises a power control circuit and a non volatile memory circuit. The power control circuit is used to receive a mode switching signal and generate a power supply voltage value accordingly. When the memory device is operated in a power down mode, the power supply voltage value is a sum of a threshold voltage of a first transistor and a source/drain cross voltage of a second transistor. The non volatile memory circuit is electrically coupled to the power control circuit to store a plurality of data and receive the power supply voltage value.

Description

記憶體裝置及其電源控制電路Memory device and its power control circuit

本發明是有關於一種記憶體裝置,尤指一種包括電源控制電路且可降低漏電流的記憶體裝置。The present invention relates to a memory device, and more particularly to a memory device including a power supply control circuit and capable of reducing leakage current.

快閃記憶體是一種非揮發性記憶體,允許在操作中多次被清除或寫入,其並具有傳輸速度快、功率消耗低以及較長的使用壽命等優勢,並廣泛應用於各種不同電子產品,例如手機、平版、數位相機等。現代人對行動裝置依賴日深,因此行動裝置的續航力越來越重要,然而隨著快閃記憶體製程因應需求而越趨複雜,其對應產生的漏電流相對增加,因此,如何有效減少快閃記憶體的漏電流已成為本領域研究人員所重視的議題。Flash memory is a non-volatile memory that allows it to be erased or written multiple times during operation. It has the advantages of fast transmission speed, low power consumption and long service life, and is widely used in various electronic applications. Products such as cell phones, lithographs, digital cameras, etc. Modern people rely heavily on mobile devices, so the endurance of mobile devices is becoming more and more important. However, as the flash memory system process becomes more complicated due to the demand, the corresponding leakage current increases relatively. Therefore, how to effectively reduce the flash The leakage current of the memory has become an issue that researchers in the field have paid attention to.

為了解決上述之缺憾,本發明提供一種可減少其漏電流的記憶體裝置。In order to solve the above drawbacks, the present invention provides a memory device capable of reducing leakage current thereof.

本發明提供的記憶體裝置包括電源控制電路以及非揮發性記憶體電路。電源控制電路用以接收模式切換訊號,並根據模式切換訊號產生電源電壓值,當記憶體裝置操作於一深度省電模式,電源電壓值為第一電晶體的臨界電壓與第二電晶體的源/汲極跨壓的總合。非揮發性記憶體電路,與電源控制電路電性耦接,是用以儲存多個資料,非揮發性記憶體電路並接收電源電壓值。The memory device provided by the present invention includes a power control circuit and a non-volatile memory circuit. The power control circuit is configured to receive the mode switching signal, and generate a power voltage value according to the mode switching signal. When the memory device operates in a deep power saving mode, the power voltage value is a threshold voltage of the first transistor and a source of the second transistor. / The sum of the bungee cross pressure. The non-volatile memory circuit is electrically coupled to the power control circuit for storing a plurality of data, the non-volatile memory circuit and receiving the power voltage value.

在一實施例中,電源控制電路除了包括第一電晶體以及第二電晶體外,更可包括訊號產生單元、第三電晶體、第四電晶體、第五電晶體、分壓阻抗以及開關單元。訊號產生單元是用以接收模式切換訊號,並根據模式切換訊號產生第一控制訊號、第二控制訊號以及第三控制訊號。第三電晶體具有第一端、控制端以及第二端,第三電晶體的第一端用以接收外部電源電壓值,第三電晶體的控制端與訊號產生單元電性耦接,並接收第一控制訊號,第三電晶體的第二端用以輸出電源電壓值。第四電晶體具有第一端、控制端以及第二端,第四電晶體的第一端接收外部電源電壓值,第四電晶體的控制端與訊號產生單元電性耦接,並接收第二控制訊號。分壓阻抗,具有第一端以及第二端,分壓阻抗的第一端與第四電晶體的第二端電性耦接。開關單元具有第一端、控制端以及第二端,開關單元的第一端與分壓阻抗的第二端電性耦接,開關單元的控制端與訊號產生單元電性耦接,用以接收一第三控制訊號。第五電晶體具有第一端、控制端以及第二端,第五電晶體的第一端與分壓阻抗的第一端電性耦接,第五電晶體的控制端與開關單元的第二端電性耦接,第五電晶體的第二端與第三電晶體的第二端電性耦接。第一電晶體具有第一端、控制端以一第二端,第一電晶體的第一端與開關單元的第二端電性耦接,第一電晶體的控制端與第一電晶體的第二端電性耦接。第二電晶體具有第一端、控制端以及第二端,第二電晶體的第一端與第一電晶體的第二端電性耦接,第二電晶體的控制端與第五電晶體的第二端電性耦接,第二電晶體的第二端與低電壓準位電性耦接。In an embodiment, the power control circuit includes a signal generating unit, a third transistor, a fourth transistor, a fifth transistor, a voltage dividing impedance, and a switching unit in addition to the first transistor and the second transistor. . The signal generating unit is configured to receive the mode switching signal, and generate the first control signal, the second control signal, and the third control signal according to the mode switching signal. The third transistor has a first end, a control end and a second end. The first end of the third transistor is configured to receive an external power supply voltage value, and the control end of the third transistor is electrically coupled to the signal generating unit and received The first control signal, the second end of the third transistor is used to output a power voltage value. The fourth transistor has a first end, a control end and a second end. The first end of the fourth transistor receives an external power supply voltage value, and the control end of the fourth transistor is electrically coupled to the signal generating unit and receives the second Control signal. The voltage dividing impedance has a first end and a second end, and the first end of the voltage dividing impedance is electrically coupled to the second end of the fourth transistor. The switch unit has a first end, a control end and a second end. The first end of the switch unit is electrically coupled to the second end of the voltage dividing impedance, and the control end of the switch unit is electrically coupled to the signal generating unit for receiving A third control signal. The fifth transistor has a first end, a control end and a second end. The first end of the fifth transistor is electrically coupled to the first end of the voltage dividing impedance, and the control end of the fifth transistor and the second end of the switch unit The second end of the fifth transistor is electrically coupled to the second end of the third transistor. The first transistor has a first end, and the control end has a second end. The first end of the first transistor is electrically coupled to the second end of the switch unit, and the control end of the first transistor is coupled to the first transistor. The second end is electrically coupled. The second transistor has a first end, a control end and a second end. The first end of the second transistor is electrically coupled to the second end of the first transistor, and the control end of the second transistor and the fifth transistor The second end of the second transistor is electrically coupled to the low voltage level.

本案解決前述問題的方式,乃是在記憶體裝置操作於深度省電模式的時候,利用電源控制電路提供較低的電源電壓值至非揮發性記憶體電路,且此時的電源電壓值為第一電晶體的臨界電壓與第二電晶體的源/汲極跨壓的總合,因此非揮發性記憶體電路可對應電源電壓值而具有較低的漏電流。The solution to the above problem is to provide a lower power supply voltage value to the non-volatile memory circuit when the memory device is operated in the deep power saving mode, and the power supply voltage value at this time is the same. The sum of the threshold voltage of a transistor and the source/drain voltage across the second transistor, so the non-volatile memory circuit can have a lower leakage current corresponding to the supply voltage value.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂,下文特舉較佳實施例,並配合所附圖式,作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;

請參考圖1,圖1為本發明之記憶體裝置10實施例示意圖,記憶體裝置10包括電源控制電路11以及非揮發性記憶體電路12,電源控制電路11是用以提供非揮發性記憶體電路12所需的電源電壓值VD2 ,以使非揮發性記憶體可根據電源電壓值VD2 正常運作。Please refer to FIG. 1. FIG. 1 is a schematic diagram of an embodiment of a memory device 10 according to the present invention. The memory device 10 includes a power control circuit 11 and a non-volatile memory circuit 12. The power control circuit 11 is used to provide non-volatile memory. The supply voltage value V D2 required by the circuit 12 is such that the non-volatile memory can operate normally according to the supply voltage value V D2 .

非揮發性記憶體電路12用以接收固定電源電壓值VDD 以及上述之電源電壓值VD2 以提供所需電壓值至內部元件。非揮發性記憶體電路12可包括控制單元121、邏輯單元122、記憶胞單元123以及暫存單元124,但不以此為限。控制單元121是用以接收多個控制訊號SC 、資料訊號SD 及多個位址訊號SA ,控制訊號SC 例如為非揮發性記憶體電路12的讀/寫操作訊號、模式切換訊號SM 等用以控制非揮發性記憶體電路12運作的控制訊號。資料訊號SD 則可為準備寫入非揮發性記憶體電路12或者由非揮發性記憶體電路12讀出的資料訊號,位址訊號SA 則可為準備存入非揮發性記憶體電路12或者由非揮發性記憶體電路12讀出的位址訊號。邏輯單元122與控制單元121電性耦接,邏輯單元122是用以控制存取記憶胞單元123中的實體位址,控制單元121可根據接收的邏輯位址於邏輯單元122中解碼出123中相對應之記憶胞單元。暫存單元124與該控制單元121電性耦接,可用以儲存非揮發性記憶體電路12運作時所需的電路設定參數及相關資料,例如記憶胞讀出、寫入、抹除相關電壓設定值及時序控制設定值等,控制單元121可由暫存單元124讀取上述之電路設定參數,以使非揮發性記憶體電路12正常運作。The non-volatile memory circuit 12 is operative to receive the fixed supply voltage value V DD and the supply voltage value V D2 described above to provide the desired voltage value to the internal components. The non-volatile memory circuit 12 may include the control unit 121, the logic unit 122, the memory cell unit 123, and the temporary storage unit 124, but is not limited thereto. The control unit 121 is configured to receive a plurality of control signals S C , data signals S D and a plurality of address signals S A , and the control signals S C are, for example, read/write operation signals of the non-volatile memory circuit 12 and mode switching signals. A control signal such as S M for controlling the operation of the non-volatile memory circuit 12. The data signal S D can be a data signal to be written into the non-volatile memory circuit 12 or read by the non-volatile memory circuit 12, and the address signal S A can be stored in the non-volatile memory circuit 12 Or an address signal read by the non-volatile memory circuit 12. The logic unit 122 is electrically coupled to the control unit 121. The logic unit 122 is configured to control the physical address in the memory cell unit 123. The control unit 121 can decode the 123 in the logic unit 122 according to the received logical address. Corresponding memory cell unit. The temporary storage unit 124 is electrically coupled to the control unit 121 and can be used to store circuit setting parameters and related data required for the operation of the non-volatile memory circuit 12, such as memory cell read, write, and erase related voltage settings. For the value and timing control set value, etc., the control unit 121 can read the above-mentioned circuit setting parameters by the temporary storage unit 124 to make the non-volatile memory circuit 12 operate normally.

請參考圖2,圖2為電源控制電路11實施例示意圖,電源控制電路11接收固定電源電壓值VDD 、外部電源電壓值VD1 以及上述之模式切換訊號SM ,在本實施例中,固定電源電壓值VDD 的電壓值大於外部電源電壓值VD1 。電源控制電路11更包括訊號產生單元111、電晶體T1、電晶體T2、電晶體T3、電晶體T4、電晶體T5、分壓阻抗R1以及開關單元SW。Please refer to FIG. 2. FIG. 2 is a schematic diagram of an embodiment of a power supply control circuit 11. The power supply control circuit 11 receives a fixed power supply voltage value V DD , an external power supply voltage value V D1 , and the above mode switching signal S M , which is fixed in this embodiment. The voltage value of the power supply voltage value V DD is greater than the external power supply voltage value V D1 . The power control circuit 11 further includes a signal generating unit 111, a transistor T1, a transistor T2, a transistor T3, a transistor T4, a transistor T5, a voltage dividing resistor R1, and a switching unit SW.

訊號產生單元111是用以接收上述的固定電源電壓值VDD 以及模式切換訊號SM ,所述固定電源電壓值VDD 為訊號產生單元111之操作電壓,訊號產生單元111並根據模式切換訊號SM 產生控制訊號S1 、控制訊號S2 以及控制訊號S3 。電晶體T1具有第一端、第二端以及控制端,電晶體T1的第一端用以接收外部電源電壓值VD1 ,電晶體T1的控制端用以接收控制訊號S1 ,電晶體T1的第二端用以輸出上述的電源電壓值VD2 。電晶體T2具有第一端、第二端以及控制端,電晶體T2的第一端用以接收外部電源電壓值VD1 ,電晶體T2的控制端用以接收控制訊號S2 ,電晶體T2的第二端與分壓阻抗R1電性耦接。分壓阻抗R1具有一第一端以及一第二端,分壓電阻R1的第一端與電晶體T2的第二端電性耦接,分壓阻抗R1的第二端與開關單元SW電性耦接,其中,分壓阻抗R1可以由單個或多個的電阻元件或P型電晶體來實現,例如為電阻元件或P型電晶體的串列,但不以此為限。The signal generating unit 111 is configured to receive the fixed power voltage value V DD and the mode switching signal S M , wherein the fixed power voltage value V DD is an operating voltage of the signal generating unit 111, and the signal generating unit 111 switches the signal according to the mode. M generates a control signal S 1 , a control signal S 2 , and a control signal S 3 . The transistor T1 has a first end, a second end and a control end. The first end of the transistor T1 is for receiving an external power supply voltage value V D1 , and the control end of the transistor T1 is for receiving the control signal S 1 , the transistor T1 The second end is configured to output the above-mentioned power supply voltage value V D2 . The transistor T2 has a first end, a second end and a control end. The first end of the transistor T2 is for receiving an external power supply voltage value V D1 , and the control end of the transistor T2 is for receiving the control signal S 2 , the transistor T2 The second end is electrically coupled to the voltage dividing resistor R1. The voltage dividing resistor R1 has a first end and a second end. The first end of the voltage dividing resistor R1 is electrically coupled to the second end of the transistor T2, and the second end of the voltage dividing resistor R1 is electrically connected to the switching unit SW. The coupling, wherein the voltage dividing impedance R1 can be implemented by a single or a plurality of resistive elements or P-type transistors, such as a series of resistive elements or P-type transistors, but not limited thereto.

開關單元SW具有第一端、控制端以及第二端,開關單元SW的第一端與分壓電阻R1的第二端電性耦接,開關單元SW的控制端與訊號產生單元111電性耦接,用以接收控制訊號S3 ,開關單元SW的第二端與電晶體T3以及電晶體T4電性耦接,開關單元SW是用以根據控制訊號S3 決定是否導通其第一端以及第二端,其中,開關單元SW可以由傳輸閘(transmission gate)或P型電晶體等導通跨壓較低的電子元件來實現,以避免開關單元SW導通時其第二端的電壓過低。電晶體T3具有第一端、控制端以及第二端,電晶體T3的第一端與分壓阻抗R1的第一端電性耦接,電晶體T3的控制端與開關單元SW的第二端電性耦接,電晶體T3的第二端與電晶體T1的第二端電性耦接,其中電晶體T3可以為原生電晶體(Native transistor)。電晶體T4具有第一端、控制端以及第二端,電晶體T4的第一端與開關單元SW的第二端電性耦接,電晶體T4的控制端與電晶體T4的第二端電性耦接。電晶體T5具有第一端、控制端以及第二端,電晶體T5的第一端與電晶體T4的第二端電性耦接,電晶體T5的控制端與電晶體T3的第二端電性耦接,電晶體T5的第二端與低電壓準位VSS 電性耦接,此低電壓準位VSS 低於固定電源電壓值VDD 的電壓準位,例如為接地。在本實施例中,電晶體T1、電晶體T2以及電晶體T4可以為P型電晶體,電晶體T5可以為N型電晶體。在其他實施例中,電源控制電路11更可包括阻抗R2,阻抗R2具有第一端以及第二端,阻抗R2的第一端與電晶體T5的控制端電性耦接,阻抗R2的第二端與電晶體T3的第二端電性耦接,阻抗R2可用以調整電晶體T5控制端的電壓準位,阻抗R2可以由單個或多個的電阻元件或P型電晶體來實現,例如為電阻元件或P型電晶體的串列,但不以此為限。The switch unit SW has a first end, a control end and a second end. The first end of the switch unit SW is electrically coupled to the second end of the voltage dividing resistor R1, and the control end of the switch unit SW is electrically coupled to the signal generating unit 111. Connected to receive the control signal S 3 , the second end of the switch unit SW is electrically coupled to the transistor T3 and the transistor T4, and the switch unit SW is configured to determine whether to turn on the first end according to the control signal S 3 and The two ends, wherein the switch unit SW can be implemented by a transmission gate or a P-type transistor to conduct an electronic component having a lower voltage across the second step, so as to prevent the voltage of the second terminal from being too low when the switch unit SW is turned on. The transistor T3 has a first end, a control end and a second end. The first end of the transistor T3 is electrically coupled to the first end of the voltage dividing resistor R1, and the control end of the transistor T3 and the second end of the switch unit SW The second end of the transistor T3 is electrically coupled to the second end of the transistor T1, wherein the transistor T3 can be a native transistor. The transistor T4 has a first end, a control end and a second end. The first end of the transistor T4 is electrically coupled to the second end of the switch unit SW, and the control end of the transistor T4 is electrically connected to the second end of the transistor T4. Sexual coupling. The transistor T5 has a first end, a control end and a second end. The first end of the transistor T5 is electrically coupled to the second end of the transistor T4, and the control end of the transistor T5 is electrically connected to the second end of the transistor T3. coupled, transistor T5 and a second level V SS terminal is electrically coupled to a low voltage, the low voltage level V SS is lower than the voltage level of the fixed power supply voltage V DD of, for example, ground. In this embodiment, the transistor T1, the transistor T2, and the transistor T4 may be P-type transistors, and the transistor T5 may be an N-type transistor. In other embodiments, the power control circuit 11 further includes an impedance R2 having a first end and a second end, the first end of the impedance R2 being electrically coupled to the control end of the transistor T5, and the second end of the impedance R2 The terminal is electrically coupled to the second end of the transistor T3, and the impedance R2 can be used to adjust the voltage level of the control terminal of the transistor T5. The impedance R2 can be implemented by a single or multiple resistor elements or a P-type transistor, such as a resistor. A string of components or P-type transistors, but not limited to this.

接著將配合圖2進一步說明本發明之記憶體裝置10的運作方式。當記憶體裝置10運作於一般模式時,也就是記憶體裝置10正常執行資料的讀寫的 運作模式。圖2的訊號產生單元111以及控制單元121根據模式切換訊號SM 判斷目前運作於一般模式,訊號產生單元111使控制訊號S1 為致能,控制訊號S2 以及控制訊號S3 為禁能,因此電晶體T2以及開關單元SW為關閉,電晶體T1為開啟,外部電源電壓值VD1 透過電晶體T1導通的第一端以及第二端輸出為電源電壓值VD2Next, the operation of the memory device 10 of the present invention will be further described with reference to FIG. When the memory device 10 operates in the normal mode, that is, the operation mode in which the memory device 10 normally performs reading and writing of data. The signal generating unit 111 and the control unit 121 of FIG. 2 determine that the current mode of operation is in the normal mode according to the mode switching signal S M. The signal generating unit 111 enables the control signal S 1 to be enabled, and the control signal S 2 and the control signal S 3 are disabled. Therefore, the transistor T2 and the switching unit SW are turned off, the transistor T1 is turned on, and the first terminal and the second terminal of the external power source voltage value V D1 being turned on through the transistor T1 are outputted as the power source voltage value V D2 .

當記憶體裝置10運作於深度省電模式時,也就是記憶體裝置10不進行資料的讀寫,並將內部電子元件耗電保持為最低的模式。圖2的訊號產生單元111以及控制單元121根據模式切換訊號SM 判斷目前運作於深度省電模式,訊號產生單元111使控制訊號S1 為禁能,控制訊號S2 以及控制訊號S3 為致能,因此電晶體T1為關閉,電晶體T1的第二端不輸出電源電壓值VD2 。同時電晶體T2因為控制訊號S2 而開啟,外部電源電壓值VD1 透過電晶體T2傳送到分壓阻抗R1以及電晶體T3的第一端,開關單元SW因為控制訊號S3 而開啟,電晶體T3因此而開啟。此時電晶體T5因為其控制端的電壓準位而開啟,進而將電晶體T5的第一端維持於低電壓準位,電晶體T4因此對應開啟,電晶體T4的第一端的電壓準位因而維持在電晶體T5的臨界電壓加上電晶體T4的第一端(源/汲極其中之一)與第二端(源/汲極其中之另一)之間的跨壓的總合。同時由於電晶體T3為原生電晶體,其第二端的電壓準位可等於其控制端的電壓準位,因此此時電源電壓值VD2 的電壓值將為電晶體T5的臨界電壓加上電晶體T4的第一端(源/汲極其中之一)與第二端(源/汲極其中之另一)之間的跨壓的總合。When the memory device 10 operates in the deep power saving mode, that is, the memory device 10 does not perform reading and writing of data, and maintains the power consumption of the internal electronic components to the lowest mode. The signal generating unit 111 and the control unit 121 of FIG. 2 determine that the current operating mode is in the deep power saving mode according to the mode switching signal S M. The signal generating unit 111 disables the control signal S 1 , and the control signal S 2 and the control signal S 3 are Therefore, the transistor T1 is turned off, and the second terminal of the transistor T1 does not output the power supply voltage value V D2 . At the same time, the transistor T2 is turned on by the control signal S 2 , and the external power supply voltage value V D1 is transmitted through the transistor T2 to the voltage dividing impedance R1 and the first end of the transistor T3, and the switching unit SW is turned on by the control signal S 3 , the transistor T3 is thus turned on. At this time, the transistor T5 is turned on because of the voltage level of its control terminal, thereby maintaining the first end of the transistor T5 at a low voltage level, and the transistor T4 is accordingly turned on, and the voltage level of the first end of the transistor T4 is thus The threshold voltage across transistor T5 is maintained plus the sum of the voltages across the first end of the transistor T4 (one of the source/drain) and the second end (the other of the source/drain). At the same time, since the transistor T3 is a primary transistor, the voltage level of the second terminal can be equal to the voltage level of its control terminal. Therefore, the voltage value of the power supply voltage value V D2 at this time will be the threshold voltage of the transistor T5 plus the transistor T4. The sum of the voltage across the first end (one of the source/drain) and the second end (the other of the source/drain).

因此根據上述,記憶體裝置10在深度省電模式時,非揮發性記憶體電路12所接收的電源電壓值VD2 的電壓值會由外部電源電壓值VD1 轉換為電晶體T5的臨界電壓加上電晶體T4的第一端(源/汲極其中之一)與第二端(源/汲極其中之另一)之間的跨壓的總合,也就是電源電壓值VD2 在深度省電模式時轉換為相對較低的電壓值,故,當非揮發性記憶體電路12內部的電子元件產生漏電流時,其漏電流將根據電源電壓值VD2 的減少而大幅降低。此外,在現行的某些實施例中,當暫存單元124運作於深度省電模式時,暫存單元124需額外接收上述的模式切換訊號SM ,暫存單元124並 需刪除其儲存資料以運作於深度省電模式,且當記憶體裝置10再次運作於一般模式時,暫存單元124需再次讀取所需參數或資料以利記憶體裝置10正常運作。而本發明之記憶體裝置10,其暫存單元124操作於深度省電模式時,無需接收上述的模式切換訊號SM 也無需刪除其儲存資料,且藉由在深度省電模式時提供較低的電源電壓值VD2 ,不僅可有效減少暫存單元124的漏電流,更可將暫存單元124維持於當前儲存狀態,因此當記憶體裝置10再次運作於一般模式時,暫存單元124馬上即可提供操作所需的參數及資訊,加速記憶體裝置10的執行速度。Therefore, according to the above, when the memory device 10 is in the deep power saving mode, the voltage value of the power supply voltage value V D2 received by the non-volatile memory circuit 12 is converted from the external power supply voltage value V D1 to the threshold voltage of the transistor T5. The sum of the voltage across the first end (one of the source/drain) and the second end (the other of the source/drain) of the transistor T4, that is, the power supply voltage value V D2 in the depth province In the electrical mode, the voltage is converted to a relatively low voltage value. Therefore, when the electronic components inside the non-volatile memory circuit 12 generate a leakage current, the leakage current thereof is greatly reduced according to the decrease of the power supply voltage value V D2 . In addition, in some embodiments, when the temporary storage unit 124 operates in the deep power saving mode, the temporary storage unit 124 needs to additionally receive the mode switching signal S M , and the temporary storage unit 124 needs to delete the stored data. Operating in the deep power saving mode, and when the memory device 10 is again operating in the normal mode, the temporary storage unit 124 needs to read the required parameters or data again to facilitate the normal operation of the memory device 10. And the memory device of the present invention the body 10, the temporary storage unit 124 when it is operating in deep power saving mode, without receiving the above-described mode switching signal S M need not delete stored data, and by providing a lower depth in the power saving mode when The power supply voltage value V D2 can not only effectively reduce the leakage current of the temporary storage unit 124, but also maintain the temporary storage unit 124 in the current storage state. Therefore, when the memory device 10 operates in the normal mode again, the temporary storage unit 124 immediately The parameters and information required for the operation can be provided to accelerate the execution speed of the memory device 10.

雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

10‧‧‧記憶體裝置10‧‧‧ memory device

11‧‧‧電源控制電路11‧‧‧Power Control Circuit

111‧‧‧訊號產生單元111‧‧‧Signal generating unit

12‧‧‧非揮發性記憶體電路12‧‧‧Non-volatile memory circuits

121‧‧‧控制單元121‧‧‧Control unit

122‧‧‧邏輯單元122‧‧‧Logical unit

123‧‧‧記憶胞單元123‧‧‧ memory cell unit

124‧‧‧暫存單元124‧‧‧Scratch unit

VDD‧‧‧固定電源電壓值V DD ‧‧‧fixed power supply voltage value

VD1‧‧‧外部電源電壓值V D1 ‧‧‧External power supply voltage value

VD2‧‧‧電源電壓值V D2 ‧‧‧Power supply voltage value

SM‧‧‧模式切換訊號Mode switch signal S M ‧‧‧

SC‧‧‧控制訊號S C ‧‧‧Control signal

SD‧‧‧資料訊號S D ‧‧‧Information Signal

SA‧‧‧位址訊號S A ‧‧‧ address signal

S1、S2、S3‧‧‧控制訊號S 1 , S 2 , S 3 ‧‧‧ control signals

T1、T2、T3、T4、T5‧‧‧電晶體T1, T2, T3, T4, T5‧‧‧ transistors

R1‧‧‧分壓阻抗R1‧‧‧voltage impedance

R2‧‧‧阻抗R2‧‧‧ impedance

SW‧‧‧開關單元SW‧‧‧Switch unit

VSS‧‧‧低電壓準位V SS ‧‧‧low voltage level

圖1為本發明之記憶體裝置實施例示意圖。 圖2為本發明之電源控制電路實施例示意圖。1 is a schematic diagram of an embodiment of a memory device of the present invention. 2 is a schematic diagram of an embodiment of a power control circuit of the present invention.

Claims (7)

一種記憶體裝置,其包括: 一電源控制電路,用以接收一模式切換訊號,並根據該模式切換訊號產生一電源電壓值,當該記憶體裝置操作於一深度省電模式,該電源電壓值為一第一電晶體的一臨界電壓與一第二電晶體的一源/汲極跨壓的總合;以及 一非揮發性記憶體電路,與該電源控制電路電性耦接,是用以儲存多個資料,該非揮發性記憶體電路並接收該電源電壓值。A memory device includes: a power control circuit for receiving a mode switching signal, and generating a power voltage value according to the mode switching signal, when the memory device operates in a deep power saving mode, the power voltage value a sum of a threshold voltage of a first transistor and a source/drain voltage of a second transistor; and a non-volatile memory circuit electrically coupled to the power control circuit for Storing a plurality of materials, the non-volatile memory circuit and receiving the power voltage value. 如請求項第1項所述之記憶體裝置,其中,該電源控制電路包括: 一訊號產生單元,用以接收該模式切換訊號,並根據該模式切換訊號產生一第一控制訊號、一第二控制訊號以及一第三控制訊號; 一第三電晶體,其具有一第一端、一控制端以及一第二端,該第三電晶體的該第一端用以接收一外部電源電壓值,該第三電晶體的該控制端與該訊號產生單元電性耦接,並接收該第一控制訊號,該第三電晶體的該第二端用以輸出該電源電壓值; 一第四電晶體,其具有一第一端、一控制端以及一第二端,該第四電晶體的該第一端接收該外部電源電壓值,該第四電晶體的該控制端與該訊號產生單元電性耦接,並接收該第二控制訊號; 一分壓阻抗,具有一第一端以及一第二端,該分壓阻抗的該第一端與該第四電晶體的該第二端電性耦接; 一開關單元,其具有一第一端、一控制端以及一第二端,該開關單元的該第一端與該分壓阻抗的該第二端電性耦接,該開關單元的該控制端與該訊號產生單元電性耦接,用以接收該第三控制訊號; 一第五電晶體,具有一第一端、一控制端以及一第二端,該第五電晶體的該第一端與該分壓阻抗的該第一端電性耦接,該第五電晶體的該控制端與該開關單元的該第二端電性耦接,該第五電晶體的該第二端與該第三電晶體的該第二端電性耦接; 該第一電晶體,具有一第一端、一控制端以及一第二端,該第一電晶體的該第一端與該開關單元的該第二端電性耦接,該第一電晶體的該控制端與該第一電晶體的該第二端電性耦接;以及 該第二電晶體,其具有一第一端、一控制端以及一第二端,該第二電晶體的該第一端與該第一電晶體的該第二端電性耦接,該第二電晶體的該控制端與該第五電晶體的該第二端電性耦接,該第二電晶體的該第二端與一低電壓準位電性耦接。The memory device of claim 1, wherein the power control circuit comprises: a signal generating unit configured to receive the mode switching signal, and generate a first control signal, a second according to the mode switching signal a control signal and a third control signal; a third transistor having a first end, a control end and a second end, the first end of the third transistor receiving an external power supply voltage value, The control terminal of the third transistor is electrically coupled to the signal generating unit and receives the first control signal, the second end of the third transistor is configured to output the power voltage value; a fourth transistor The first end of the fourth transistor receives the external power supply voltage value, and the control end of the fourth transistor and the signal generating unit are electrically connected. The first control signal is coupled to the second control signal Connected; a switch unit having a The first end of the switch unit is electrically coupled to the second end of the voltage dividing impedance, and the control end of the switch unit is electrically coupled to the signal generating unit Receiving the third control signal; a fifth transistor having a first end, a control end, and a second end, the first end of the fifth transistor and the first end of the voltage dividing impedance The second end of the fifth transistor is electrically coupled to the second end of the fifth transistor, and the second end of the fifth transistor and the second end of the third transistor are electrically coupled Electrically coupled; the first transistor has a first end, a control end, and a second end, the first end of the first transistor is electrically coupled to the second end of the switch unit, The control end of the first transistor is electrically coupled to the second end of the first transistor; and the second transistor has a first end, a control end, and a second end. The first end of the second transistor is electrically coupled to the second end of the first transistor, and the control end of the second transistor The second end of the five transistor coupled to the second terminal of the second transistor and a low level voltage is electrically coupled. 如請求項第2項所述之記憶體裝置,其中,該開關單元為傳輸閘或P型電晶體。The memory device of claim 2, wherein the switching unit is a transmission gate or a P-type transistor. 如請求項第2項所述之記憶體裝置,其中,該第五電晶體為原生電晶體。The memory device of claim 2, wherein the fifth transistor is a native transistor. 如請求項第2項所述之記憶體裝置,其中,當該記憶體裝置操作於該深度省電模式,該第三電晶體根據該第一控制訊號而關閉,該第四電晶體根據一第二控制訊號而開啟,該開關單元根據一第三控制訊號而開啟。The memory device of claim 2, wherein when the memory device operates in the deep power saving mode, the third transistor is turned off according to the first control signal, and the fourth transistor is The second control signal is turned on, and the switch unit is turned on according to a third control signal. 如請求項第2項所述之記憶體裝置,其中,當該記憶體裝置操作於一一般模式,該第三電晶體根據該第一控制訊號而開啟,該第四電晶體根據一第二控制訊號而關閉,該開關單元根據一第三控制訊號而關閉。The memory device of claim 2, wherein when the memory device operates in a general mode, the third transistor is turned on according to the first control signal, and the fourth transistor is in accordance with a second control The signal is turned off, and the switch unit is turned off according to a third control signal. 如請求項第1項所述之記憶體裝置,其中,該分壓阻抗為電阻元件或P型電晶體的串列。The memory device of claim 1, wherein the voltage dividing impedance is a series of resistive elements or P-type transistors.
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