TW201821989A - Test circuit board for NGFF slot testing - Google Patents
Test circuit board for NGFF slot testing Download PDFInfo
- Publication number
- TW201821989A TW201821989A TW105141282A TW105141282A TW201821989A TW 201821989 A TW201821989 A TW 201821989A TW 105141282 A TW105141282 A TW 105141282A TW 105141282 A TW105141282 A TW 105141282A TW 201821989 A TW201821989 A TW 201821989A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- ngff
- test
- module
- virtual
- Prior art date
Links
Landscapes
- Test And Diagnosis Of Digital Computers (AREA)
Abstract
Description
一種測試電路板,尤其是指一種透過快捷外設互聯標準交換模組以及測試模組對NGFF插槽進行各種對應的測試過程的適用於NGFF插槽的測試電路板。A test circuit board, in particular, a test circuit board suitable for an NGFF slot through a standard peripheral switching module and a test module for performing various corresponding test processes on the NGFF slot.
NGFF連接介面是發展以替換序列式SCSI(Serial Attached SCSI,SAS)連接介面,NGFF連接介面的特徵即是採用快捷外設互聯標準(Peripheral Component Interconnect Express,PCI-E)連接介面,藉以提供與具有快捷外設互聯標準連接介面的固態硬碟(Solid State Drive,SSD)直接連接。The NGFF connection interface is developed to replace the Serial Attached SCSI (SAS) connection interface. The NGFF connection interface is characterized by the use of a Peripheral Component Interconnect Express (PCI-E) connection interface. The Solid State Drive (SSD) is connected directly to the standard peripheral interface of the Fast Peripheral Interconnect.
然而對於待測試電路板上的NGFF連接介面的測試過程,都是需要透過外接固態硬碟來進行測試,然而固態硬碟的使用次數是有限制的,且使用固態硬碟來對待測試電路板上的NGFF連接介面進行測試的測試成本較高且未能提供較高的測試覆蓋率。However, the test process of the NGFF connection interface on the circuit board to be tested needs to be tested by an external solid state hard disk. However, the number of use of the solid state hard disk is limited, and the solid state hard disk is used to treat the test circuit board. The test of the NGFF connection interface is costly and fails to provide high test coverage.
綜上所述,可知先前技術中長期以來一直存在現有NGFF連接介面測試具有測試成本較高且未能提供較高的測試覆蓋率的問題,因此有必要提出改進的技術手段,來解決此一問題。In summary, it can be seen that the existing NGFF connection interface test in the prior art has a problem of high test cost and failure to provide high test coverage. Therefore, it is necessary to propose an improved technical means to solve this problem. .
有鑒於先前技術存在現有NGFF連接介面測試具有測試成本較高且未能提供較高的測試覆蓋率的問題,本發明遂揭露一種適用於NGFF插槽的測試電路板系統及其方法,其中:In view of the prior art existing NGFF connection interface test has the problem of high test cost and failure to provide high test coverage, the present invention discloses a test circuit board system suitable for an NGFF slot and a method thereof, wherein:
本發明所揭露第一實施態樣的適用於NGFF插槽的測試電路板,其包含:NGFF(Next Generation Form Factor)連接介面以及測試模組。A test circuit board suitable for an NGFF slot according to the first embodiment of the present invention includes: a NGFF (Next Generation Form Factor) connection interface and a test module.
其中,NGFF連接介面是採用快捷外設互聯標準(Peripheral Component Interconnect Express,PCI-E)連接介面,用以插接於待測試電路板的NGFF插槽;及測試模組與NGFF連接介面電性連接,用以透過NGFF連接介面對NGFF插槽進行快捷外設互聯標準訊號的測試、電源供應測試、輔助訊號輸入介面(Auxiliary,AUX)測試以及系統管理匯流排(System Management Bus,SMBus)測試。The NGFF connection interface is a Peripheral Component Interconnect Express (PCI-E) connection interface for plugging into the NGFF slot of the circuit board to be tested; and the test module is electrically connected to the NGFF connection interface. It is used to test the fast peripheral interconnection standard signal, power supply test, auxiliary signal input interface (Auxiliary, AUX) test and system management bus (SMBus) test in the NGFF slot through the NGFF connection.
本發明所揭露第二實施態樣的適用於NGFF插槽的測試電路板,其包含:多個NGFF連接介面、至少一快捷外設互聯標準交換(Switch)模組以及測試模組。The test circuit board applicable to the NGFF slot according to the second embodiment of the present invention comprises: a plurality of NGFF connection interfaces, at least one shortcut peripheral interconnection standard switching (Switch) module, and a test module.
其中,多個NGFF連接介面,採用快捷外設互聯標準(Peripheral Component Interconnect Express,PCI-E)連接介面,用以每一個NGF連接介面分別插接於待測試電路板的NGFF插槽;快捷外設互聯標準交換模組分為二邏輯單元,每一個邏輯單元包含虛擬快捷外設互聯標準交換模組以及非透明橋接(Non-Transparent Bridge,NT Bridge)模組,非透明橋接模組包含非透明連結(NT Link)模組以及非透明虛擬(NT Virtual)模組,虛擬快捷外設互聯標準交換模組與NGFF連接介面其中之一以及非透明虛擬模組電性連接,非透明連結模組與另一NGFF連接介面電性連接;及測試模組分別與NGFF連接介面、虛擬快捷外設互聯標準交換模組以及非透明虛擬電性連接,用以透過NGFF連接介面以及快捷外設互聯標準交換模組對NGFF插槽進行快捷外設互聯標準訊號的測試、電源供應測試、輔助訊號輸入介面(Auxiliary,AUX)測試以及系統管理匯流排(System Management Bus,SMBus)測試。Among them, a plurality of NGFF connection interfaces adopt a Peripheral Component Interconnect Express (PCI-E) connection interface, and each NGF connection interface is respectively inserted into the NGFF slot of the circuit board to be tested; The interconnected standard switch module is divided into two logical units, each of which includes a virtual shortcut peripheral interconnect standard switching module and a non-transparent bridge (NT Bridge) module, and the non-transparent bridge module includes a non-transparent link. (NT Link) module and non-transparent virtual (NT Virtual) module, virtual shortcut peripheral interconnection standard switching module and NGFF connection interface and opaque virtual module are electrically connected, non-transparent connection module and another An NGFF connection interface is electrically connected; and the test module is respectively connected with the NGFF connection interface, the virtual shortcut peripheral interconnection standard exchange module, and the non-transparent virtual electrical connection, for connecting the standard switching module through the NGFF connection interface and the shortcut peripheral interconnection. Fast peripheral interconnection standard signal test, power supply test, auxiliary signal input interface for NGFF slot (Auxil Iary, AUX) testing and System Management Bus (SMBus) testing.
本發明所揭露的測試電路板如上,與先前技術之間的差異在於透過具有NGFF連接介面的測試電路板直接插接於待測試電路板的NGFF插槽上以對NGFF插槽進行各種對應的測試過程,或是透過具有多個NGFF連接介面分別插接於待測試電路板的NGFF插槽,藉由快捷外設互聯標準交換模組以及測試模組以對NGFF插槽進行各種對應的測試過程。The test circuit board disclosed in the present invention is different from the prior art in that the test circuit board having the NGFF connection interface is directly inserted into the NGFF slot of the circuit board to be tested to perform various corresponding tests on the NGFF slot. The process is performed by inserting a plurality of NGFF connection interfaces into the NGFF slot of the circuit board to be tested, and interconnecting the standard switching module and the test module to perform various test processes on the NGFF slot.
透過上述的技術手段,本發明可以達成提供低成本NGFF連接介面測試且提高測試覆蓋率的技術功效。Through the above technical means, the present invention can achieve the technical effect of providing a low-cost NGFF connection interface test and improving test coverage.
以下將配合圖式及實施例來詳細說明本發明的實施方式,藉此對本發明如何應用技術手段來解決技術問題並達成技術功效的實現過程能充分理解並據以實施。The embodiments of the present invention will be described in detail below with reference to the drawings and embodiments, so that the application of the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.
以下首先要說明本發明所揭露第一實施態樣的適用於NGFF插槽的測試電路板,並請參考「第1圖」以及「第2圖」所示,「第1圖」繪示為本發明適用於NGFF插槽的測試電路板的第一實施態樣架構示意圖;「第2圖」繪示為本發明適用於NGFF插槽的測試電路板測試時的第一實施態樣架構示意圖。The following is a description of the test circuit board for the NGFF slot according to the first embodiment of the present invention. Please refer to "1" and "2", and "1" is shown as A schematic diagram of a first embodiment of a test circuit board suitable for use in an NGFF slot is shown in FIG. 2; FIG. 2 is a schematic diagram showing a first embodiment of the test circuit board for testing the NGFF slot.
本發明所揭露第一實施態樣的適用於NGFF插槽的測試電路板10,其包含:NGFF(Next Generation Form Factor)連接介面11以及測試模組12。The test circuit board 10 for the NGFF slot according to the first embodiment of the present invention includes an NGFF (Next Generation Form Factor) connection interface 11 and a test module 12.
測試電路板10的NGFF連接介面11是採用快捷外設互聯標準(Peripheral Component Interconnect Express,PCI-E)連接介面實現,在第一實施態樣中,待測試電路板20的每一個NGFF插槽21用以插接一個測試電路板10的單一NGFF連接介面11。The NGFF connection interface 11 of the test circuit board 10 is implemented by using a Peripheral Component Interconnect Express (PCI-E) connection interface. In the first embodiment, each NGFF slot 21 of the circuit board 20 to be tested is tested. A single NGFF connection interface 11 for plugging in a test circuit board 10.
測試電路板10的測試模組12與測試電路板10的NGFF連接介面11電性連接,測試電路板10的測試模組12即可透過測試電路板10的NGFF連接介面11對對應的待測試電路板20的NGFF插槽21進行快捷外設互聯標準訊號的測試、電源供應測試、輔助訊號輸入介面(Auxiliary,AUX)測試以及系統管理匯流排(System Management Bus,SMBus)測試,其中,待測試電路板20的NGFF插槽21與待測試電路板20的中央處理器(Central Processing Unit,CPU)22直接電性連接。The test module 12 of the test circuit board 10 is electrically connected to the NGFF connection interface 11 of the test circuit board 10. The test module 12 of the test circuit board 10 can pass through the NGFF connection interface 11 of the test circuit board 10 to the corresponding circuit to be tested. The NGFF slot 21 of the board 20 performs the test of the fast peripheral interconnection standard signal, the power supply test, the auxiliary signal input interface (Auxiliary, AUX) test, and the system management bus (SMBus) test, wherein the circuit to be tested The NGFF slot 21 of the board 20 is directly electrically connected to a central processing unit (CPU) 22 of the circuit board 20 to be tested.
除此之外,測試電路板10更包含直接記憶體存取(Direct Memory Access,DMA)控制器13,測試電路板10的直接記憶體存取控制器13電性連接於測試電路板10的NGFF連接介面11,測試電路板10的直接記憶體存取控制器13是用以對待測試電路板20的NGFF插槽21進行快捷外設互聯標準數據流的測試。In addition, the test circuit board 10 further includes a direct memory access (DMA) controller 13, and the direct memory access controller 13 of the test circuit board 10 is electrically connected to the NGFF of the test circuit board 10. The connection interface 11, the direct memory access controller 13 of the test circuit board 10 is used to test the NGFF slot 21 of the test board 20 for a fast peripheral interconnection standard data stream.
測試電路板10的直接記憶體存取控制器13是透過設置於測試電路板10的第一基址暫存器(Base Address Register,BAR)14發送設置於測試電路板10的第二基址暫存器15的位址數據至待測試電路板20的中央處理器22,待測試電路板20的中央處理器22的快捷外設互聯標準控制器對位址數據進行解析,而將數據導向至位址數據所映射到的測試電路板10的第二基址暫存器15的位址,透過上述架構,測試電路板10的直接記憶體存取控制器13即可與待測試電路板20的中央處理器22之間形成迴圈(Loop)的讀寫模型,而數據的起始與結束是由測試電路板10的直接記憶體存取控制器13來控制,實現了待測試電路板20的NGFF插槽21上大量數據傳輸的壓力測試,藉以對待測試電路板20的NGFF插槽21進行快捷外設互聯標準數據流的測試。The direct memory access controller 13 of the test circuit board 10 transmits a second base address set on the test circuit board 10 through a first base address register (BAR) 14 disposed on the test circuit board 10. The address data of the memory 15 is sent to the central processing unit 22 of the circuit board 20 to be tested, and the fast peripheral interconnection standard controller of the central processing unit 22 of the circuit board 20 to be tested 20 parses the address data to direct the data into place. The address of the second base register 15 of the test circuit board 10 to which the address data is mapped is transmitted through the above structure, and the direct memory access controller 13 of the test circuit board 10 can be centered with the circuit board 20 to be tested. A read/write model of a loop is formed between the processors 22, and the start and end of the data are controlled by the direct memory access controller 13 of the test circuit board 10, and the NGFF of the circuit board 20 to be tested is realized. A pressure test of a large amount of data transmission on the slot 21 is performed by the NGFF slot 21 of the test board 20 for testing the standard data stream of the fast peripheral interconnection.
以下接著要說明本發明所揭露第二實施態樣的適用於NGFF插槽的測試電路板,並請參考「第3圖」以及「第4圖」所示,「第3圖」繪示為本發明適用於NGFF插槽的測試電路板的第二實施態樣架構示意圖;「第4圖」繪示為本發明適用於NGFF插槽的測試電路板測試時的第二實施態樣架構示意圖。The following is a description of the test circuit board for the NGFF slot according to the second embodiment of the present invention. Please refer to "3" and "4", and "3" is shown as A schematic diagram of a second embodiment of a test circuit board suitable for use in an NGFF slot is shown in FIG. 4; FIG. 4 is a schematic diagram showing a second embodiment of the test circuit board for testing the NGFF slot.
本發明所揭露第二實施態樣的適用於NGFF插槽的測試電路板10,其包含:多個NGFF連接介面11、至少一快捷外設互聯標準交換(Switch)模組16以及測試模組12。The test circuit board 10 applicable to the NGFF slot according to the second embodiment of the present invention comprises: a plurality of NGFF connection interfaces 11, at least one shortcut peripheral interconnection standard switch module 16 and a test module 12 .
測試電路板10的NGFF連接介面11是採用快捷外設互聯標準(Peripheral Component Interconnect Express,PCI-E)連接介面實現,在第二實施態樣中,待測試電路板20的第一NGFF插槽211至第四NGFF插槽214用以分別插接測試電路板10的第一NGFF連接介面111至第四NGFF連接介面114,上述待測試電路板20的第一NGFF插槽211至第四NGFF插槽214以及接測試電路板10的第一NGFF連接介面111至第四NGFF連接介面114的數量僅為舉例說明之,並不以此侷限本發明的應用範疇。The NGFF connection interface 11 of the test circuit board 10 is implemented by using a Peripheral Component Interconnect Express (PCI-E) connection interface. In the second embodiment, the first NGFF slot 211 of the circuit board 20 to be tested is tested. The fourth NGFF slot 214 is inserted into the first NGFF connection interface 111 to the fourth NGFF connection interface 114 of the test circuit board 10, and the first NGFF slot 211 to the fourth NGFF slot of the circuit board 20 to be tested. The number of 214 and the first NGFF connection interface 111 to the fourth NGFF connection interface 114 of the test circuit board 10 are merely illustrative and are not intended to limit the scope of application of the present invention.
測試電路板10的快捷外設互聯標準交換模組16分為第一邏輯單元161以及第二邏輯單元162,上述測試電路板10僅以單一快捷外設互聯標準交換模組16作為舉例說明,本發名並不以此為限制,事實上測試電路板10可以具有多個快捷外設互聯標準交換模組16,且每一個快捷外設互聯標準交換模組16皆分為二個邏輯單元,即單一快捷外設互聯標準交換模組16可提供述待測試電路板20的上四個NGFF插槽進行測試。The standard peripheral switching module 16 of the test circuit board 10 is divided into a first logic unit 161 and a second logic unit 162. The test circuit board 10 is only illustrated by a single fast peripheral interconnection standard switching module 16 as an example. The name is not limited to this. In fact, the test circuit board 10 can have a plurality of fast peripheral interconnection standard switching modules 16, and each of the fast peripheral interconnection standard switching modules 16 is divided into two logical units, that is, A single fast peripheral interconnect standard switch module 16 can provide the upper four NGFF slots of the test circuit board 20 for testing.
第一邏輯單元161包含第一虛擬快捷外設互聯標準交換模組1611以及第一非透明橋接(Non-Transparent Bridge,NT Bridge)模組1612,第一非透明橋接模組1612包含第一非透明連結(NT Link)模組16121以及第一非透明虛擬(NT Virtual)模組16122。The first logic unit 161 includes a first virtual shortcut peripheral interconnection standard switching module 1611 and a first non-transparent bridge (NT Bridge) module 1612. The first non-transparent bridge module 1612 includes a first non-transparent bridge. The NT Link module 16121 and the first non-transparent virtual (NT Virtual) module 16122 are connected.
第二邏輯單元162包含第二虛擬快捷外設互聯標準交換模組1621以及第二非透明橋接模組1622,第二非透明橋接模組1622包含第二非透明連結模組16221以及第二非透明虛擬模組16222。The second logic unit 162 includes a second virtual shortcut peripheral interconnection standard switching module 1621 and a second non-transparent bridge module 1622. The second non-transparent bridge module 1622 includes a second opaque connection module 16221 and a second non-transparent Virtual module 16222.
第一虛擬快捷外設互聯標準交換模組1611與第一NGFF連接介面111電性連接,第一非透明連結模組16121與第二NGFF連接介面112電性連接,第二非透明連結模組16221與第三NGFF連接介面113電性連接,以及第二虛擬快捷外設互聯標準交換模組1621與第四NGFF連接介面114電性連接。The first virtual open peripheral interconnect standard switch module 1611 is electrically connected to the first NGFF connection interface 111, the first opaque connection module 16121 is electrically connected to the second NGFF connection interface 112, and the second opaque connection module 16221 is electrically connected. The third NGFF connection interface 113 is electrically connected to the third NGFF connection interface, and the second virtual shortcut peripheral interconnection standard exchange module 1621 is electrically connected to the fourth NGFF connection interface 114.
第一虛擬快捷外設互聯標準交換模組1611亦與第一非透明虛擬模組16122電性連接,第二虛擬快捷外設互聯標準交換模組1621亦與第二非透明虛擬模組16222電性連接。The first virtual shortcut peripheral interconnect standard switch module 1611 is also electrically connected to the first opaque virtual module 16122, and the second virtual shortcut peripheral interconnect standard switch module 1621 is also electrically connected to the second opaque virtual module 16222. connection.
測試電路板10的測試模組12分別與第一NGFF連接介面111至第四NGFF連接介面114電性連接,且測試電路板10的測試模組12分別與第一虛擬快捷外設互聯標準交換模組1611、第一非透明連結模組16121、第二虛擬快捷外設互聯標準交換模組1621以及第二非透明連結模組16221電性連接。The test module 12 of the test circuit board 10 is electrically connected to the first NGFF connection interface 111 to the fourth NGFF connection interface 114, respectively, and the test module 12 of the test circuit board 10 is interconnected with the first virtual shortcut peripheral standard exchange mode. The group 1611, the first opaque connection module 16121, the second virtual shortcut peripheral interconnection standard switching module 1621, and the second opaque connection module 16221 are electrically connected.
對於待測試電路板20的中央處理器22來說,會分別將第一虛擬快捷外設互聯標準交換模組1611以及第二虛擬快捷外設互聯標準交換模組1621視為快捷外設互聯標準交換模組16的上游(PCIe Switch Upstream);及待測試電路板20的中央處理器22會分別將第一非透明連結模組16121以及第二非透明連結模組16221視為快捷外設互聯標準裝置(PCIe Device)。For the central processing unit 22 of the circuit board 20 to be tested, the first virtual shortcut peripheral interconnection standard switching module 1611 and the second virtual shortcut peripheral interconnection standard switching module 1621 are respectively regarded as a standard exchange of fast peripheral interconnection standards. The upstream of the module 16 (PCIe Switch Upstream); and the central processing unit 22 of the circuit board 20 to be tested will respectively regard the first opaque connection module 16121 and the second opaque connection module 16221 as standard devices for fast peripheral interconnection. (PCIe Device).
測試電路板10的測試模組12即可透過第一NGFF連接介面111至第四NGFF連接介面114以及快捷外設互聯標準交換模組16分別對待測試電路板20的第一NGFF插槽211至第四NGFF插槽214進行快捷外設互聯標準訊號的測試、電源供應測試、輔助訊號輸入介面(Auxiliary,AUX)測試以及系統管理匯流排(System Management Bus,SMBus)測試。The test module 12 of the test circuit board 10 can respectively test the first NGFF slot 211 of the circuit board 20 through the first NGFF connection interface 111 to the fourth NGFF connection interface 114 and the shortcut peripheral interconnection standard switching module 16 The four NGFF slots 214 perform standard peripheral signal testing, power supply testing, auxiliary signal input interface (Auxiliary, AUX) testing, and system management bus (SMBus) testing.
待測試電路板20的中央處理器22自記憶體23中讀取數據並發送至第一非透明虛擬模組16122對應的基址暫存器(Base Address Register,BAR)位址空間,數據會透過第一虛擬快捷外設互聯標準交換模組1611導向至第一非透明虛擬模組16122,第一非透明虛擬模組16122以及第一非透明連結模組16121之間透過位址轉換將數據導向至第一非透明連結模組16121對應的基址暫存器位址空間,藉以對待測試電路板20的第一NGFF插槽211以及第二NGFF插槽212進行第一態樣的快捷外設互聯標準數據流的測試。The central processing unit 22 of the circuit board 20 to be tested reads data from the memory 23 and sends it to the base address register (BAR) address space corresponding to the first opaque virtual module 16122. The first virtual shortcut peripheral interconnect standard switching module 1611 is directed to the first opaque virtual module 16122. The first opaque virtual module 16122 and the first opaque linking module 16121 direct data to and through the address translation. The first opaque connection module 16121 corresponds to the base address register address space, and the first NGFF slot 211 and the second NGFF slot 212 of the test circuit board 20 are subjected to the first aspect of the fast peripheral interconnection standard. Data flow testing.
待測試電路板20的中央處理器22自記憶體23中讀取數據並發送至第二非透明虛擬模組16222對應的基址暫存器位址空間,數據會透過第二虛擬快捷外設互聯標準交換模組1621導向至第二非透明虛擬模組16222,第二非透明虛擬模組16222以及第二非透明連結模組16221之間透過位址轉換將數據導向至第二非透明虛擬模組16222對應的第二基址暫存器位址空間,藉以對待測試電路板20的第三NGFF插槽213以及第四NGFF插槽214進行第一態樣的快捷外設互聯標準數據流的測試。The central processing unit 22 of the circuit board 20 to be tested reads data from the memory 23 and sends it to the base address register address space corresponding to the second opaque virtual module 16222, and the data is interconnected through the second virtual shortcut peripheral. The standard switch module 1621 is directed to the second opaque virtual module 16222, and the second opaque virtual module 16222 and the second opaque link module 16221 are forwarded to the second opaque virtual module by address translation. The second base register address space corresponding to the 16222 is used to test the first aspect of the fast peripheral interconnect standard data stream of the third NGFF slot 213 and the fourth NGFF slot 214 of the test circuit board 20.
除此之外,測試電路板20更包含第一直接記憶體存取(Direct Memory Access,DMA)控制器131,第一直接記憶體存取控制器131分別與第一虛擬快捷外設互聯標準交換模組1611以及第一非透明虛擬模組16122電性連接,用以對待測試電路板20的第一NGFF插槽211以及第二NGFF插槽212進行第二態樣的快捷外設互聯標準數據流的測試。In addition, the test circuit board 20 further includes a first direct memory access (DMA) controller 131, and the first direct memory access controller 131 is separately exchanged with the first virtual shortcut peripheral interconnect standard. The module 1611 and the first opaque virtual module 16122 are electrically connected to the second NGFF slot 211 and the second NGFF slot 212 of the test circuit board 20 for performing the second aspect of the fast peripheral interconnection standard data stream. Test.
第一直接記憶體存取控制器131是透過第一非透明連結模組16121對應的基址暫存器發送第一非透明虛擬模組16122對應的基址暫存器的位址數據至待測試電路板20,待測試電路板20由快捷外設互聯標準控制器對位址數據進行解析,而將數據導向至位址數據所映射到的基址暫存器的位址,藉以待測試電路板20的第一NGFF插槽211以及第二NGFF插槽212進行第二態樣的快捷外設互聯標準數據流的測試。The first direct memory access controller 131 transmits the address data of the base address register corresponding to the first opaque virtual module 16122 to the base to be tested through the base address register corresponding to the first opaque connection module 16121. The circuit board 20, the circuit board 20 to be tested is parsed by the shortcut peripheral interconnect standard controller for the address data, and the data is directed to the address of the base address register to which the address data is mapped, so that the circuit board to be tested is used. The first NGFF slot 211 of the 20 and the second NGFF slot 212 perform a test of the second aspect of the fast peripheral interconnect standard data stream.
測試電路板20更包含第二直接記憶體存取控制器132,第二直接記憶體存取控制器132分別與第二虛擬快捷外設互聯標準交換模組1621以及第二非透明虛擬模組16222電性連接,用以對待測試電路板20的第三NGFF插槽213以及第四NGFF插槽214進行第二態樣的快捷外設互聯標準數據流的測試。The test circuit board 20 further includes a second direct memory access controller 132. The second direct memory access controller 132 interconnects the standard switching module 1621 and the second non-transparent virtual module 16222 with the second virtual shortcut peripheral. The electrical connection is used to test the second NGFF slot 213 and the fourth NGFF slot 214 of the test circuit board 20 for the second aspect of the fast peripheral interconnection standard data stream.
第二直接記憶體存取控制器132是透過第二非透明連結模組16221對應的基址暫存器發送第二非透明虛擬模組16222對應的基址暫存器的位址數據至待測試電路板20,待測試電路板20由快捷外設互聯標準控制器對位址數據進行解析,而將數據導向至位址數據所映射到的基址暫存器的位址,藉以待測試電路板20的第三NGFF插槽213以及第四NGFF插槽214進行第二態樣的快捷外設互聯標準數據流的測試。The second direct memory access controller 132 sends the address data of the base address register corresponding to the second opaque virtual module 16222 to the base to be tested through the base address register corresponding to the second opaque connection module 16221. The circuit board 20, the circuit board 20 to be tested is parsed by the shortcut peripheral interconnect standard controller for the address data, and the data is directed to the address of the base address register to which the address data is mapped, so that the circuit board to be tested is used. The third NGFF slot 213 and the fourth NGFF slot 214 of 20 perform the test of the second aspect of the fast peripheral interconnection standard data stream.
綜上所述,可知本發明與先前技術之間的差異在於透過具有NGFF連接介面的測試電路板直接插接於待測試電路板的NGFF插槽上以對NGFF插槽進行各種對應的測試過程,或是透過具有多個NGFF連接介面分別插接於待測試電路板的NGFF插槽,藉由快捷外設互聯標準交換模組以及測試模組以對NGFF插槽進行各種對應的測試過程。In summary, it can be seen that the difference between the present invention and the prior art is that a test circuit board having an NGFF connection interface is directly inserted into the NGFF slot of the circuit board to be tested to perform various corresponding testing processes on the NGFF slot. Alternatively, the NGFF slot is inserted into the NGFF slot of the circuit board to be tested by using a plurality of NGFF connection interfaces, and the standard peripheral switching module and the test module are interconnected to perform various corresponding testing processes on the NGFF slot.
藉由此一技術手段可以來解決先前技術所存在現有NGFF連接介面測試具有測試成本較高且未能提供較高的測試覆蓋率的問題,進而達成提供低成本NGFF連接介面測試且提高測試覆蓋率的技術功效。By means of this technical means, the existing NGFF connection interface test existing in the prior art has the problems of high test cost and failure to provide high test coverage, thereby achieving low-cost NGFF connection interface test and improving test coverage. Technical efficacy.
雖然本發明所揭露的實施方式如上,惟所述的內容並非用以直接限定本發明的專利保護範圍。任何本發明所屬技術領域中具有通常知識者,在不脫離本發明所揭露的精神和範圍的前提下,可以在實施的形式上及細節上作些許的更動。本發明的專利保護範圍,仍須以所附的申請專利範圍所界定者為準。While the embodiments of the present invention have been described above, the above description is not intended to limit the scope of the invention. Any changes in the form and details of the embodiments may be made without departing from the spirit and scope of the invention. The scope of the invention is to be determined by the scope of the appended claims.
10‧‧‧測試電路板10‧‧‧Test circuit board
11‧‧‧NGFF連接介面11‧‧‧NGFF connection interface
111‧‧‧第一NGFF連接介面111‧‧‧First NGFF connection interface
112‧‧‧第二NGFF連接介面112‧‧‧Second NGFF connection interface
113‧‧‧第三NGFF連接介面113‧‧‧ Third NGFF connection interface
114‧‧‧第四NGFF連接介面114‧‧‧Four NGFF connection interface
12‧‧‧測試模組12‧‧‧Test module
13‧‧‧直接記憶體存取控制器13‧‧‧Direct Memory Access Controller
131‧‧‧第一直接記憶體存取控制器131‧‧‧First Direct Memory Access Controller
132‧‧‧第二直接記憶體存取控制器132‧‧‧Second Direct Memory Access Controller
14‧‧‧第一基址暫存器14‧‧‧First base register
15‧‧‧第二基址暫存器15‧‧‧Second base register
16‧‧‧快捷外設互聯標準交換模組16‧‧‧Quick Peripheral Interconnect Standard Switching Module
161‧‧‧第一邏輯單元161‧‧‧First logical unit
1611‧‧‧第一虛擬快捷外設互聯標準交換模組1611‧‧‧The first virtual shortcut peripheral interconnect standard switching module
1612‧‧‧第一非透明橋接模組1612‧‧‧First non-transparent bridge module
16121‧‧‧第一非透明連結模組16121‧‧‧First non-transparent connection module
16122‧‧‧第一非透明虛擬模組16122‧‧‧First non-transparent virtual module
162‧‧‧第二邏輯單元162‧‧‧Second logic unit
1621‧‧‧第二虛擬快捷外設互聯標準交換模組1621‧‧‧Second virtual shortcut peripheral interconnection standard switching module
1622‧‧‧第二非透明橋接模組1622‧‧‧Second non-transparent bridge module
16221‧‧‧第二非透明連結模組16221‧‧‧Second non-transparent connection module
16222‧‧‧第二非透明虛擬模組16222‧‧‧Second non-transparent virtual module
20‧‧‧待測試電路板20‧‧‧Test board to be tested
21‧‧‧NGFF插槽21‧‧‧NGFF slot
211‧‧‧第一NGFF插槽211‧‧‧First NGFF slot
212‧‧‧第二NGFF插槽212‧‧‧Second NGFF slot
213‧‧‧第三NGFF插槽213‧‧‧ Third NGFF slot
214‧‧‧第四NGFF插槽214‧‧‧Four NGFF slot
22‧‧‧中央處理器22‧‧‧Central processor
23‧‧‧記憶體23‧‧‧ memory
第1圖繪示為本發明適用於NGFF插槽的測試電路板的第一實施態樣架構示意圖。 第2圖繪示為本發明適用於NGFF插槽的測試電路板測試時的第一實施態樣架構示意圖。 第3圖繪示為本發明適用於NGFF插槽的測試電路板的第二實施態樣架構示意圖。 第4圖繪示為本發明適用於NGFF插槽的測試電路板測試時的第二實施態樣架構示意圖。FIG. 1 is a schematic diagram showing a first embodiment of a test circuit board suitable for use in an NGFF slot according to the present invention. FIG. 2 is a schematic diagram showing the first embodiment of the present invention when testing the test circuit board for the NGFF slot. FIG. 3 is a schematic diagram showing the second embodiment of the test circuit board applicable to the NGFF slot of the present invention. FIG. 4 is a schematic diagram showing a second embodiment of the present invention when the test circuit board for testing the NGFF slot is tested.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105141282A TW201821989A (en) | 2016-12-13 | 2016-12-13 | Test circuit board for NGFF slot testing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105141282A TW201821989A (en) | 2016-12-13 | 2016-12-13 | Test circuit board for NGFF slot testing |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201821989A true TW201821989A (en) | 2018-06-16 |
Family
ID=63258138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105141282A TW201821989A (en) | 2016-12-13 | 2016-12-13 | Test circuit board for NGFF slot testing |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201821989A (en) |
-
2016
- 2016-12-13 TW TW105141282A patent/TW201821989A/en unknown
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102035258B1 (en) | Die-stacked device with partitioned multi-hop network | |
US7913027B2 (en) | Configurable storage array controller | |
US7895374B2 (en) | Dynamic segment sparing and repair in a memory system | |
US8843689B2 (en) | Concurrent repair of the PCIe switch units in a tightly-coupled, multi-switch, multi-adapter, multi-host distributed system | |
TW201621657A (en) | Electronic device | |
JP2007529813A (en) | PCI Express endpoint simulation circuit and downstream port for PCI Express switch | |
JP6033913B2 (en) | Universal test platform and test method thereof | |
CN108153624B (en) | Test circuit board suitable for NGFF slot | |
TWI755259B (en) | Memory device and associated flash memory controller | |
TWI605347B (en) | System of flexible server configuration | |
TWI779205B (en) | Debug device and electronic device with the same | |
CN107908585A (en) | A kind of PCIE BOX plates for surpassing calculation function with PCIe card and GPU | |
US9792230B2 (en) | Data input circuit of semiconductor apparatus | |
TW201821989A (en) | Test circuit board for NGFF slot testing | |
CN106503369A (en) | A kind of device for realizing that multiple high-speed bus PCB links are shared and its method for designing | |
TW201821988A (en) | Testing system for NGFF slot of expansion circuit board | |
CN216014148U (en) | Server and server backboard | |
TWI450118B (en) | Hybrid electronic design system and reconfigurable connection matrix thereof | |
TW201514709A (en) | Expanding card | |
CN208538123U (en) | Expansion card based on SFF-8654 interface | |
TW201624282A (en) | Electronic device | |
TW201416883A (en) | Detecting system for PCI express slot and method thereof | |
TWI526842B (en) | Controlling and switching module capable of being applied in x86 systems for writing data | |
TW201624283A (en) | Electronic device | |
TWI518522B (en) | Controlling and switching module capable of being applied in x86 systems for reading data |