TW201821564A - Pressure sensitive adhesive - Google Patents

Pressure sensitive adhesive Download PDF

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TW201821564A
TW201821564A TW106124692A TW106124692A TW201821564A TW 201821564 A TW201821564 A TW 201821564A TW 106124692 A TW106124692 A TW 106124692A TW 106124692 A TW106124692 A TW 106124692A TW 201821564 A TW201821564 A TW 201821564A
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Taiwan
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group
sensitive adhesive
pressure
polymer
compound
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TW106124692A
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Chinese (zh)
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河野翔馬
綠川智洋
岡村直實
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日商思美定股份有限公司
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Publication of TW201821564A publication Critical patent/TW201821564A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02Polyalkylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers

Abstract

Provided is a pressure-sensitive adhesive which comprises silicone release paper and a pressure-sensitive adhesive layer of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average molecular weight of 3,000 or higher and having a crosslinkable silicon-containing group, (B) a tackifier resin, (C) a silicon compound having an Si-F bond, and (D) a photobase generator, the pressure-sensitive adhesive layer having excellent separability from the silicone release paper. The pressure-sensitive adhesive comprises silicone release paper and, superposed thereon, a pressure-sensitive adhesive layer constituted of a cured object obtained from a photocurable composition comprising (A) an organic polymer having a number-average molecular weight of 3,000 or higher and having a crosslinkable silicon-containing group, (B) a tackifier resin, (C) a silicon compound having an Si-F bond, (D) a photobase generator, and (E) a compound having a number-average molecular weight less than 3,000 and having a hydrolyzable silicon-containing group.

Description

感壓接著劑    Pressure sensitive adhesive   

本發明係有關一種感壓接著劑。尤其,本發明係有關一種感壓接著劑,其係由含有數量平均分子量3,000以上之具有交聯性矽基的有機聚合物與增黏樹脂之組成物的硬化物所成之感壓接著層、與剝離紙積層而成者。 The present invention relates to a pressure-sensitive adhesive. In particular, the present invention relates to a pressure-sensitive adhesive, which is a pressure-sensitive adhesive layer made of a hardened product of a composition containing an organic polymer having a crosslinkable silicon group and a tackifier resin having a number average molecular weight of 3,000 or more, Laminated with release paper.

含有具有交聯性矽基的聚合物與硬化觸媒之硬化性組成物係藉由空氣中之濕分等之水分的作用而交聯硬化,生成硬化物。因此,具有交聯性矽基之聚合物組成物係用於接著劑及密封材。 A curable composition containing a polymer having a crosslinkable silicon group and a curing catalyst is crosslinked and cured by the action of moisture such as moisture in the air to produce a cured product. Therefore, a polymer composition having a crosslinkable silicon group is used for an adhesive and a sealing material.

專利文獻1及專利文獻2中揭示一種用以製造含有具有交聯性矽基之聚醚聚合物(聚氧伸烷基聚合物)的感壓接著劑之硬化性組成物。在膠帶等之感壓接著劑基材上塗布該硬化性組成物,藉由空氣中之濕氣等使交聯性矽基交聯,製成感壓接著劑。該硬化性組成物中使用的具有交聯性矽基之有機聚合物,因黏度低、塗布容易,因此不使用具有毒性及危險性之有機溶劑而可製造感壓接著劑。 Patent Documents 1 and 2 disclose a curable composition for producing a pressure-sensitive adhesive containing a polyether polymer (polyoxyalkylene polymer) having a crosslinkable silicon group. This hardenable composition is coated on a pressure-sensitive adhesive base material such as an adhesive tape, and the cross-linkable silicon group is cross-linked with moisture in the air to prepare a pressure-sensitive adhesive. The organic polymer having a crosslinkable silicon group used in the curable composition has a low viscosity and is easy to apply. Therefore, a pressure-sensitive adhesive can be produced without using a toxic and dangerous organic solvent.

如專利文獻3及專利文獻4之揭示,上述專利文獻1及專利文獻2之感壓接著劑係有與聚矽氧剝離紙之剝離性差之問題。亦即,黏著劑與剝離紙之剝離阻力經時性地上升,當其不良時,會有剝離紙破裂而無法剝離之情形。 As disclosed in Patent Documents 3 and 4, the pressure-sensitive adhesives of Patent Documents 1 and 2 described above have a problem of poor releasability from polysiloxane release paper. That is, the peel resistance of the adhesive and the release paper rises over time, and when it is defective, the release paper may break and fail to peel.

本發明者等發現一種將含有(A)具有交聯性矽基的有機聚合物、(B)增黏樹脂、(C)具有Si-F鍵之矽化合物及(D)光鹼產生劑的光硬化性組成物之硬化物當作為感壓接著層而具有的感壓接著劑,依國際專利申請案PCT/JP2016/062820的形式進行申請。該國際專利申請案中記載之光硬化性組成物係具有下述優點:即使加熱至高溫,因空氣中之濕氣等而不進行交聯硬化,並且透過光照射而迅速地進行交聯硬化,故可簡便地製造感壓接著劑。然而,亦證實該國際專利申請案中記載的感壓接著劑亦有與聚矽氧剝離紙之剝離性差之問題。 The present inventors have discovered a light containing (A) an organic polymer having a crosslinkable silicon group, (B) a tackifying resin, (C) a silicon compound having a Si-F bond, and (D) a photobase generator. The cured product of the curable composition is a pressure-sensitive adhesive having a pressure-sensitive adhesive layer, and is applied in the form of an international patent application PCT / JP2016 / 062820. The photocurable composition described in this international patent application has the advantages of not undergoing cross-linking and hardening due to moisture in the air, etc., even if heated to a high temperature, and it is rapidly cross-linking and hardening by light irradiation, Therefore, the pressure-sensitive adhesive can be easily manufactured. However, it has also been confirmed that the pressure-sensitive adhesive described in the international patent application also has a problem of poor peelability from the silicone release paper.

先前技術文獻Prior art literature 專利文獻Patent literature

專利文獻1 日本特開昭55-056153號公報 Patent Document 1 Japanese Patent Laid-Open No. 55-056153

專利文獻2 日本特開昭60-035069號公報 Patent Document 2 Japanese Patent Laid-Open No. 60-035069

專利文獻3 日本特開昭61-060771號公報 Patent Document 3 Japanese Patent Laid-Open No. 61-060771

專利文獻4 日本特開2013-32450號公報 Patent Document 4 Japanese Patent Application Publication No. 2013-32450

本發明所欲解決之課題係提供一種感壓接著劑,其係將含有(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物、(B)增黏樹脂、(C)具有Si-F鍵之矽化合物及(D)光鹼產生劑的光硬化性組成物之硬化物當作為感壓接著層而具有者,其自聚矽氧剝離紙剝離的剝離性優異。 The problem to be solved by the present invention is to provide a pressure-sensitive adhesive which contains (A) an organic polymer having a crosslinkable silicon group in a number average molecular weight of 3,000 or more, (B) a tackifying resin, and (C) having The silicon compound of the Si-F bond and the cured product of the photocurable composition of the (D) photobase generator are provided as a pressure-sensitive adhesive layer, and have excellent releasability from a silicone release paper.

本發明者等發現,在含有(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物、(B)增黏樹脂、(C)具有Si-F鍵之矽化合物及(D)光鹼產生劑的光硬化性組成物中,進一步添加(E)數量平均分子量小於3,000之具有水解性矽基的化合物時,可得到自聚矽氧剝離紙剝離的剝離性優異之感壓接著劑。 The present inventors have found that (A) an organic polymer having a crosslinkable silicon group with a number average molecular weight of 3,000 or more, (B) a tackifying resin, (C) a silicon compound having a Si-F bond, and (D) In the photocurable composition of the photobase generator, when a compound having a hydrolyzable silicon group having a number average molecular weight of less than 3,000 (E) is further added, a pressure-sensitive adhesive having excellent peelability from a polysiloxane release paper can be obtained. .

亦即,本發明係有關一種感壓接著劑,係由感壓接著層、與聚矽氧剝離紙積層而成者,該感壓接著層係包含(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物、(B)增黏樹脂、(C)具有Si-F鍵之矽化合物、(D)光鹼產生劑、及(E)數量平均分子量小於3,000之含具有水解性矽基的化合物之光硬化性組成物的硬化物所構成。 That is, the present invention relates to a pressure-sensitive adhesive, which is formed by laminating a pressure-sensitive adhesive layer and a polysiloxane release paper, and the pressure-sensitive adhesive layer contains (A) a number having an average molecular weight of 3,000 or more and having crosslinking Organic silicon-based polymers, (B) tackifying resins, (C) silicon compounds with Si-F bonds, (D) photobase generators, and (E) hydrolyzable silicon with a number average molecular weight of less than 3,000 It is composed of a cured product of a photo-curable composition of a base compound.

而且,上述感壓接著劑中,(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物可為具有交聯性矽基之聚氧伸烷基系聚合物。 Further, in the pressure-sensitive adhesive, the (A) organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more may be a polyoxyalkylene-based polymer having a crosslinkable silicon group.

上述感壓接著劑中,(B)增黏樹脂係以萜烯酚樹脂及/或芳香族系石油樹脂為佳。 Among the pressure-sensitive adhesives, (B) the tackifying resin is preferably a terpene phenol resin and / or an aromatic petroleum resin.

而且,上述感壓接著劑中,(C)具有Si-F鍵之矽化合物係以具有Si-F鍵之有機聚合物為佳。 In the pressure-sensitive adhesive, the silicon compound (C) having a Si-F bond is preferably an organic polymer having a Si-F bond.

而且,上述感壓接著劑中,以已積層有一面具有輕剝離層(lightly releasable layer)、另一面具有重剝離層(heavy releasable layer)之聚矽氧剝離紙的感壓接著劑為佳。 Moreover, among the above pressure-sensitive adhesives, a pressure-sensitive adhesive of a silicone release paper having a lightly releasable layer on one side and a heavy releasable layer on the other side is preferably laminated.

可在感壓接著層之一面積層具有輕剝離層之聚矽氧剝離紙、在另一面積層具有重剝離層之聚矽氧剝離紙。 A silicone release paper having a light release layer in one area of the pressure-sensitive adhesive layer and a silicone release paper having a heavy release layer in the other area can be used.

本發明之感壓接著劑除了具有所使用之光硬化性組成物,因空氣中之濕氣等而不進行交聯硬化,並且透過光照射而迅速地進行交聯硬化,故可容易製造之效果,除此之外,具有自聚矽氧剝離紙剝離的剝離性優異之效果。 The pressure-sensitive adhesive of the present invention has the photocurable composition used, does not undergo cross-linking and hardening due to moisture in the air, and rapidly cross-links and hardens by light irradiation, so it can be easily produced. In addition, it has the effect of excellent peelability from silicone release paper.

發明之最佳實施形態Best Mode for Invention

(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物方面,如為數量平均分子量3,000以上之具有交聯性矽基的有機聚合物,則無特別限定。本發明中使用之具有交聯性矽基的有機聚合物係主鏈非為聚矽氧烷之有機聚合物,除了聚矽氧烷之具有各種主鏈骨架的有機聚合物,在電氣應用領域中,不含或不生成 成為接觸不良之主因的低分子環狀矽氧烷,由此觀點而言,為佳。 (A) The organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more is not particularly limited as long as it is an organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more. The organic polymer having a crosslinkable silicon group used in the present invention is an organic polymer whose main chain is not polysiloxane, except for polysiloxanes which have various main chain skeletons. In the field of electrical applications, From the viewpoint of not containing or not generating a low-molecular-weight cyclic siloxane that is a main cause of poor contact, it is preferable.

就(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物之主鏈骨架的例子而言,可列舉如:聚氧丙烯、聚氧丁烯、聚氧乙烯-聚氧丙烯共聚物等之聚氧伸烷基系聚合物;乙烯-丙烯系共聚物、聚異丁烯、聚異戊二烯、聚丁二烯、該等之聚烯烴系聚合物中氫化而得之氫化聚烯烴系聚合物等的烴系聚合物;己二酸等之二元酸與二醇之縮合、或透過內酯類之開環聚合而得的聚酯系聚合物;(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯等之單體進行自由基聚合而得的(甲基)丙烯酸酯系聚合物;(甲基)丙烯酸酯系單體、乙酸乙烯酯、丙烯腈、苯乙烯等之單體進行自由基聚合而得的乙烯系聚合物;有機聚合物中之乙烯基單體進行聚合而得之接枝聚合物;多硫系聚合物;聚醯胺系聚合物;聚碳酸酯系聚合物;酞酸二烯丙酯系聚合物等。該等之骨架,在(A)具有交聯性矽基之有機聚合物中可單獨含有、亦可依嵌段或無規形式而包含2種以上。 Examples of the main chain skeleton of the (A) organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more include polyoxypropylene, polyoxybutylene, and polyoxyethylene-polyoxypropylene copolymerization. Materials such as polyoxyalkylene-based polymers; ethylene-propylene-based copolymers, polyisobutylene, polyisoprene, polybutadiene, and the like, hydrogenated polyolefin-based polymers obtained by hydrogenation Hydrocarbon polymers such as polymers; Polyester polymers obtained by condensation of a dibasic acid such as adipic acid with a diol, or by ring-opening polymerization of lactones; ethyl (meth) acrylate, ( (Meth) acrylate polymer obtained by radical polymerization of monomers such as butyl (meth) acrylate; monomers such as (meth) acrylate monomers, vinyl acetate, acrylonitrile, and styrene Ethylene polymer obtained by radical polymerization; Graft polymer obtained by polymerizing vinyl monomer in organic polymer; Polysulfide polymer; Polyamide polymer; Polycarbonate polymer ; Diallyl phthalate polymer and the like. These skeletons may be contained alone in the organic polymer having a crosslinkable silicon group (A), or may be contained in two or more kinds in a block or random form.

更且,聚異丁烯、氫化聚異戊二烯、氫化聚丁二烯等之飽和烴系聚合物、或聚氧伸烷基系聚合物、(甲基)丙烯酸酯系聚合物係因玻璃轉移溫度較低,所得硬化物之耐寒性優異而佳。而且,聚氧伸烷基系聚合物及(甲基)丙烯酸酯系聚合物因透濕性高、在成為1液型組成物時,因深部硬化性優異而為特佳。 In addition, saturated hydrocarbon polymers such as polyisobutylene, hydrogenated polyisoprene, and hydrogenated polybutadiene, or polyoxyalkylene polymers, and (meth) acrylate polymers are due to the glass transition temperature. Lower, the resulting hardened product is excellent in cold resistance. In addition, polyoxyalkylene-based polymers and (meth) acrylate-based polymers are particularly preferred because they have high moisture permeability, and when they are formed into a one-liquid composition, they are excellent in deep hardenability.

(A)成分中之交聯性矽基係具有與矽原子鍵結之羥基或水解性基,可透過形成矽氧烷鍵而交聯之基。交聯性矽基方面係以通式(1)所示之基為佳。 The crosslinkable silicon group in the component (A) is a group having a hydroxyl group or a hydrolyzable group bonded to a silicon atom, and can be crosslinked by forming a siloxane bond. The crosslinkable silicon group is preferably a group represented by the general formula (1).

式(1)中,R1表示有機基。R1係以碳數1~20之烴基為佳。該等之中,R1以甲基為特佳。R1可具有取代基。X表示羥基、或水解性基,X存在2個以上時,複數個X可為相同,亦可為不同。a為1、2或3之整數的任一者。從考量硬化性,得到具有充分之硬化速度的光硬化性組成物之觀點來看,式(1)中a係以2以上為佳,以3更佳。從得到具有充分之柔軟性的光硬化性組成物之觀點來看,a係以2為佳。 In formula (1), R 1 represents an organic group. R 1 is preferably a hydrocarbon group having 1 to 20 carbon atoms. Among these, R 1 is particularly preferably a methyl group. R 1 may have a substituent. X represents a hydroxyl group or a hydrolyzable group. When two or more X are present, a plurality of X may be the same or different. a is any integer of 1, 2 or 3. From the standpoint of considering the hardenability and obtaining a photocurable composition having a sufficient hardening rate, in the formula (1), a is preferably 2 or more, and more preferably 3. From the viewpoint of obtaining a photocurable composition having sufficient flexibility, a is preferably 2.

X所示之水解性基方面,如為F原子以外,則無特別限定。可列舉例如:烷氧基、醯基氧基、酮肟酯基、胺基氧基、烯基氧基等。該等之中,從水解性基容易平穩地處理之觀點來看,以烷氧基為佳。烷氧基之中,以碳數少之基的反應性高。依序為甲氧基>乙氧基>丙氧基之方式,碳數越多者反應性越低。可依據目的及用途選擇,一般係可使用甲氧基及乙氧基。 The hydrolyzable group represented by X is not particularly limited as long as it is other than the F atom. Examples thereof include an alkoxy group, a fluorenyloxy group, a ketoxime ester group, an aminooxy group, and an alkenyloxy group. Among these, an alkoxy group is preferable from a viewpoint that a hydrolyzable group can be handled smoothly. Among the alkoxy groups, a group having a small number of carbon atoms has high reactivity. In the order of methoxy> ethoxy> propoxy, the higher the carbon number, the lower the reactivity. It can be selected according to the purpose and application. Generally, methoxy and ethoxy can be used.

交聯性矽基之具體構造方面,可列舉如:三甲氧基矽基、三乙氧基矽基等之三烷氧基矽基 [-Si(OR)3]、甲基二甲氧基矽基、甲基二乙氧基矽基等之二烷氧基矽基[-SiR1(OR)2],由於三烷氧基矽基[-Si(OR)3]之反應性高,因而為佳,以三甲氧基矽基更佳。在此,R係如甲基或乙基之烷基。本發明中使用之光硬化性組成物係使用反應性高之具有三甲氧基矽基的聚合物,且不會因空氣中之濕分而硬化,顯示優異之安定性。儘管如此穩定,經光照射亦會迅速硬化。因此,光硬化性組成物之製造中使用的(A)成分中之交聯性矽基方面,以三甲氧基矽基最佳。 Specific structural aspects of the crosslinkable silicon group include trialkoxysilyl groups such as trimethoxysilyl groups and triethoxysilyl groups [-Si (OR) 3 ], methyldimethoxysilyl groups, and the like. Dialkoxysilyl [-SiR 1 (OR) 2 ] such as methyl, methyldiethoxysilyl, etc., is highly reactive because of trialkoxysilyl [-Si (OR) 3 ]. It is better to use trimethoxysilyl. Here, R is an alkyl group such as methyl or ethyl. The photocurable composition used in the present invention is a polymer having a trimethoxysilyl group having high reactivity, does not harden due to moisture in the air, and exhibits excellent stability. Despite being stable, it will harden quickly when exposed to light. Therefore, in the crosslinkable silicon group in the (A) component used for manufacture of a photocurable composition, a trimethoxysilyl group is the most preferable.

而且,交聯性矽基係可使用1種以上,亦可合併使用2種以上。交聯性矽基可存在於主鏈或側鏈或者任一者。 In addition, the crosslinkable silicon-based system may be used singly or in combination of two or more. The crosslinkable silicon group may be present in the main chain or the side chain, or either.

數量平均分子量3,000以上之具有交聯性矽基的有機聚合物可為直鏈狀或具有分支鏈。在GPC中換算聚苯乙烯時,該數量平均分子量為3,000~100,000左右,以3,000~50,000更佳,以3,000~30,000為特佳。數量平均分子量小於3,000時,在硬化物之拉伸特性方面會有不足之傾向,而當超出100,000時,由於黏度變高而有操作性降低之傾向。另外,從確保使光硬化性組成物之硬化而得到之硬化物之柔軟性的觀點來看,數量平均分子量以高者為佳。 The organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more may be linear or branched. When polystyrene is converted in GPC, the number average molecular weight is about 3,000 to 100,000, more preferably 3,000 to 50,000, and particularly preferably 3,000 to 30,000. When the number-average molecular weight is less than 3,000, there is a tendency that the tensile properties of the cured product are insufficient, and when it exceeds 100,000, the viscosity tends to increase and the workability tends to decrease. In addition, from the viewpoint of ensuring the flexibility of the cured product obtained by curing the photocurable composition, the higher the number average molecular weight is, the better.

為了得到高強度、高伸長率且呈現低彈性模數之橡膠狀硬化物,在數量平均分子量3,000以上之具有交聯性矽基的有機聚合物中所含的交聯性矽基,較佳者係在聚合物1分子中平均存在0.8個以上,以1.0個以 上為佳,以1.1~5個以上更佳。分子中所含的交聯性矽基之數,平均小於0.8個時,硬化性不足,難以呈現良好的橡膠彈性。而且,從降低交聯密度之觀點而言,以合併使用分子中所含的交聯性矽基之數平均為1.0個以下之有機聚合物者為佳。交聯性矽基可在有機聚合物分子鏈之主鏈的末端或側鏈的末端,亦可在雙方。尤其是,交聯性矽基僅在分子鏈之主鏈的末端時,最後形成的硬化物中所含的有機聚合物成分之有效網眼長度變長,因此可容易得到高強度、高伸長率且呈現低彈性模數之橡膠狀硬化物。 In order to obtain a rubber-like hardened product with high strength, high elongation, and low elastic modulus, a crosslinkable silicon group contained in an organic polymer having a crosslinkable silicon group having a number average molecular weight of 3,000 or more is preferred There are more than 0.8 in one molecule of the polymer, preferably 1.0 or more, and more preferably 1.1 to 5 or more. When the number of crosslinkable silicon groups contained in the molecule is less than 0.8 on average, the hardenability is insufficient and it is difficult to exhibit good rubber elasticity. Further, from the viewpoint of reducing the crosslinking density, it is preferable to use an organic polymer in which the number of crosslinkable silicon groups contained in the molecule is 1.0 or less on average in combination. The crosslinkable silicon group may be at the end of the main chain or the side chain of the molecular chain of the organic polymer, or at both ends. In particular, when the crosslinkable silicon group is only at the end of the main chain of the molecular chain, the effective mesh length of the organic polymer component contained in the final hardened product becomes longer, so high strength and high elongation can be easily obtained. And exhibits a rubber-like hardened product with a low elastic modulus.

聚氧伸烷基系聚合物實質上係具有通式(2)所示之重複單元的聚合物。 The polyoxyalkylene-based polymer is essentially a polymer having a repeating unit represented by the general formula (2).

-R2-O-...(2) -R 2 -O -... (2)

通式(2)中,R2係碳數1~14之直鏈狀或分支伸烷基,以碳數1~14之直鏈狀或分支伸烷基為佳,以碳數2~4之直鏈狀或分支伸烷基更佳。 In the general formula (2), R 2 is a linear or branched alkylene group having 1 to 14 carbon atoms, preferably a linear or branched alkylene group having 1 to 14 carbon atoms, and 2 to 4 carbon atoms A linear or branched alkylene group is more preferred.

在通式(2)所示之重複單元的具體例方面,可列舉如:-CH2CH2O-、-CH2CH(CH3)O-、-CH2CH2CH2CH2O-等。聚氧伸烷基系聚合物之主鏈骨架,可僅由1種重複單元所構成,亦可由2種以上之重複單元所構成。 Specific examples of the repeating unit represented by the general formula (2) include -CH 2 CH 2 O-, -CH 2 CH (CH 3 ) O-, -CH 2 CH 2 CH 2 CH 2 O- Wait. The main chain skeleton of the polyoxyalkylene-based polymer may be composed of only one repeating unit, or may be composed of two or more repeating units.

在聚氧伸烷基系聚合物之合成法之例方面,可列舉如:使用KOH等之鹼觸媒的聚合法、使用雙金屬氰化物錯合物觸媒的聚合法等,惟並無特別限定。依據使用雙金屬氰化物錯合物觸媒的聚合法,可得到數量平均分子量6,000以上、Mw/Mn為1.6以下之高分子量且分子量分布窄的聚氧伸烷基系聚合物。 Examples of the synthesis method of the polyoxyalkylene-based polymer include a polymerization method using an alkali catalyst such as KOH, a polymerization method using a double metal cyanide complex catalyst, and the like, but there is no particular limitation. limited. According to the polymerization method using a double metal cyanide complex catalyst, a polyoxyalkylene-based polymer having a high molecular weight with a number average molecular weight of 6,000 or more, Mw / Mn of 1.6 or less, and a narrow molecular weight distribution can be obtained.

聚氧伸烷基系聚合物在主鏈骨架中可含有胺甲酸乙酯鍵等之其它鍵。在胺甲酸乙酯鍵方面,其例可列舉如:甲苯(甲伸苯基)二異氰酸酯、二苯基甲烷二異氰酸酯等之芳香族多異氰酸酯;由異佛酮二異氰酸酯等之脂肪族系多異氰酸酯與具有羥基之聚氧伸烷基系聚合物的反應所得之鍵。 The polyoxyalkylene polymer may contain other bonds such as a urethane bond in the main chain skeleton. In terms of urethane bonds, examples include aromatic polyisocyanates such as toluene (methylenephenyl) diisocyanate, diphenylmethane diisocyanate, and the like; aliphatic polyisocyanates such as isophorone diisocyanate; and the like. A bond obtained by reaction with a polyoxyalkylene polymer having a hydroxyl group.

在分子中具有不飽和基、羥基、環氧基或異氰酸酯基等之官能基的聚氧伸烷基系聚合物,使對該官能基具有反應性之官能基,以及具有交聯性矽基之反應物反應,即可對聚氧伸烷基系聚合物導入交聯性矽基(以下稱為高分子反應法)。 A polyoxyalkylene polymer having a functional group such as an unsaturated group, a hydroxyl group, an epoxy group, or an isocyanate group in the molecule, a functional group that is reactive to the functional group, and a functional group that has a crosslinkable silicon group. The reactant reacts to introduce a crosslinkable silicon group into the polyoxyalkylene-based polymer (hereinafter referred to as a polymer reaction method).

高分子反應法之例係可列舉如:在含不飽和基之聚氧伸烷基系聚合物,使具有交聯性矽基之氫矽烷、具有交聯性矽基之巰基化合物作用而矽氫化或巰基化,得到具有交聯性矽基之聚氧伸烷基系聚合物的方法。含不飽和基之聚氧伸烷基系聚合物係在具有羥基等之官能基的有機聚合物,使具有對該官能基呈現反應性之活性基及不飽和基的有機化合物反應,得到含有不飽和基之聚氧伸烷基系聚合物。 Examples of the polymer reaction method include hydrosilylation of a hydrosilane having a crosslinkable silyl group and a mercapto compound having a crosslinkable silyl group in a polyoxyalkylene-based polymer containing an unsaturated group. Or a method of thiolization to obtain a polyoxyalkylene polymer having a crosslinkable silicon group. An unsaturated group-containing polyoxyalkylene-based polymer is an organic polymer having a functional group such as a hydroxyl group, and an organic compound having an active group and an unsaturated group that are reactive to the functional group is reacted to obtain an organic compound containing an unsaturated group. Polyoxyalkylene polymer of saturated group.

而且,作為高分子反應法之其它例,可列舉如:使末端具有羥基之聚氧伸烷基系聚合物與具有異氰酸酯基,以及交聯性矽基之化合物反應的方法;使末端具有異氰酸酯基之聚氧伸烷基系聚合物與具有羥基或胺基等之活性氫基,以及交聯性矽基之化合物反應的方法。在使用異氰酸酯化合物時,可容易得到具有交聯性矽基之聚氧伸烷基系聚合物。 In addition, as another example of the polymer reaction method, a method of reacting a polyoxyalkylene-based polymer having a hydroxyl group at a terminal with a compound having an isocyanate group and a crosslinkable silicon group may be mentioned, and an terminal having an isocyanate group. A method for reacting a polyoxyalkylene-based polymer with a compound having an active hydrogen group such as a hydroxyl group or an amine group, and a crosslinkable silicon group. When an isocyanate compound is used, a polyoxyalkylene-based polymer having a crosslinkable silicon group can be easily obtained.

具有交聯性矽基之聚氧伸烷基系聚合物係可單獨使用,亦可合併使用2種以上。 The polyoxyalkylene-based polymer having a crosslinkable silicon group can be used alone or in combination of two or more kinds.

飽和烴系聚合物係除了芳香環以外,實質上不含其它碳-碳不飽合鍵之聚合物。具有該骨架之聚合物係可藉由下述方法而得:(1)使乙烯、丙烯、1-丁烯、異丁烯等之碳數2~6的烯烴系化合物作為主要單體而聚合、或者(2)使丁二烯、異戊二烯等之二烯系化合物均聚、或使二烯系化合物與烯烴系化合物共聚後,進行氫化等之方法。異丁烯系聚合物及氫化聚丁二烯系聚合物係在末端容易導入官能基,容易控制分子量,而且,可增加末端官能基之數,因而為佳。以異丁烯系聚合物為特佳。主鏈骨架為飽和烴系聚合物具有耐熱性、耐候性、耐久性及防潮性優異之特徵。 The saturated hydrocarbon polymer is a polymer that does not substantially contain other carbon-carbon unsaturated bonds except for the aromatic ring. The polymer having this skeleton can be obtained by (1) polymerizing an olefin-based compound having 2 to 6 carbon atoms, such as ethylene, propylene, 1-butene, and isobutene, as a main monomer, or ( 2) A method of homopolymerizing a diene-based compound such as butadiene or isoprene, or copolymerizing a diene-based compound with an olefin-based compound, followed by a method such as hydrogenation. Isobutylene-based polymers and hydrogenated polybutadiene-based polymers are preferred because functional groups can be easily introduced at the ends, molecular weight can be easily controlled, and the number of terminal functional groups can be increased. Particularly preferred is an isobutylene-based polymer. The main chain skeleton is a saturated hydrocarbon-based polymer that is excellent in heat resistance, weather resistance, durability, and moisture resistance.

異丁烯系聚合物係可由單體單元全部為異丁烯單元所形成,亦可為與其它單體之共聚物。由橡膠特性方面而言,以含有源自異丁烯之重複單元50質量%以上之聚合物為佳,以含有80質量%以上之聚合物更佳,以含有90~99質量%以上之聚合物為特佳。 The isobutylene-based polymer may be formed of all the monomer units being isobutylene units, or may be a copolymer with other monomers. In terms of rubber characteristics, polymers containing 50% by mass or more of repeating units derived from isobutylene are preferred, polymers containing 80% by mass or more are more preferred, and polymers containing 90 to 99% by mass are particularly preferred. good.

作為飽和烴系聚合物之合成法,可列舉各種聚合方法。尤其是有開發各種活性聚合。飽和烴系聚合物,特別是異丁烯系聚合物,可容易透過Kennedy等發現出之引發轉移聚合(J.P.Kennedy等、J.Polymer Sci.,Polymer Chem.Ed.1997年、15卷、2843頁)而製造。根據該製造方法,可得到分子量500~100,000左右,分子量分布1.5以下之聚合物,可在分子末端導入各種官能基。 As a method for synthesizing a saturated hydrocarbon polymer, various polymerization methods may be mentioned. In particular, various living polymerizations have been developed. Saturated hydrocarbon-based polymers, especially isobutylene-based polymers, can easily undergo transfer polymerization initiated by Kennedy et al. (JP Kennedy et al., J. Polymer Sci., Polymer Chem. Ed. 1997, Vol. 15, p. 2843) and Manufacturing. According to this manufacturing method, a polymer having a molecular weight of about 500 to 100,000 and a molecular weight distribution of 1.5 or less can be obtained, and various functional groups can be introduced at the molecular end.

在具有交聯性矽基之飽和烴系聚合物的製法之例方面,可列舉如:將生成安定之碳陽離子的有機鹵化合物與Friedel Crafts酸觸媒之組合作為共聚起始劑使用的陽離子聚合法。其例可列舉如:日本特公平4-69659號所揭示之引發轉移法。 As an example of a method for producing a saturated hydrocarbon polymer having a crosslinkable silicon group, a cationic polymerization using a combination of an organic halogen compound that generates a stable carbocation and a Friedel Crafts acid catalyst as a copolymerization initiator can be cited. law. Examples include the initiation of the transfer method disclosed in Japanese Patent No. 4-69659.

具有交聯性矽基之飽和基系聚合物係可單獨使用,亦可合併使用2種以上。 The saturated-based polymer having a crosslinkable silicon group can be used alone or in combination of two or more kinds.

作為構成(甲基)丙烯酸酯系聚合物之主鏈的(甲基)丙烯酸酯系單體,可使用各種單體。例如,可列舉如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸硬脂酯等之(甲基)丙烯酸烷酯系單體;脂環式(甲基)丙烯酸酯系單體;芳香族(甲基)丙烯酸酯系單體;(甲基)丙烯酸2-甲氧基乙酯等之(甲基)丙烯酸酯系單體;γ-(甲基)丙烯醯基氧基丙基三甲氧基矽烷、γ-(甲基)丙烯醯基氧基丙基二甲氧基甲基矽烷等之含矽基的(甲基)丙烯酸酯系單體;(甲基)丙烯酸之衍生物;含氟(甲基)丙烯酸酯系單體等。 As a (meth) acrylic acid ester monomer which comprises the main chain of a (meth) acrylic acid ester polymer, various monomers can be used. Examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and stearin (meth) acrylate (Meth) acrylic acid alkyl ester-based monomers; alicyclic (meth) acrylic acid ester-based monomers; aromatic (meth) acrylic acid ester-based monomers; 2-methoxyethyl (meth) acrylate (Meth) acrylate monomers such as esters; γ- (meth) acrylfluorenyloxypropyltrimethoxysilane, γ- (meth) acrylfluorenyloxypropyldimethoxymethyl Silane-containing (meth) acrylate-based monomers; derivatives of (meth) acrylic acid; fluorine-containing (meth) acrylate-based monomers and the like.

(甲基)丙烯酸酯系聚合物中,(甲基)丙烯酸酯系單體可與以下之乙烯系單體共聚。乙烯系單體之例係可列舉如:苯乙烯、馬來酸酐、乙酸乙烯酯等。 In the (meth) acrylate-based polymer, the (meth) acrylate-based monomer can be copolymerized with the following vinyl-based monomer. Examples of the vinyl-based monomer include styrene, maleic anhydride, and vinyl acetate.

該等可單獨使用,亦可使複數種共聚。更且,透過含交聯性矽基之(甲基)丙烯酸酯系單體的合併使用,可控制(甲基)丙烯酸酯系聚合物中的交聯性矽基之數。由於接著性良好,包含甲基丙烯酸酯單體之甲基丙 烯酸酯系聚合物為特佳。而且,在低黏度化、賦予柔軟性、賦予黏著性的情況下,宜適當地使用丙烯酸酯單體。另外,本說明書中,(甲基)丙烯酸表示丙烯酸及/或甲基丙烯酸。 These may be used singly or in a plurality of types. In addition, the number of crosslinkable silicon groups in the (meth) acrylate polymer can be controlled by the combined use of (meth) acrylate monomers containing a crosslinkable silicon group. Since the adhesion is good, a methacrylate polymer containing a methacrylate monomer is particularly preferable. When the viscosity is lowered, flexibility is provided, and adhesiveness is provided, an acrylate monomer is suitably used. In the present specification, (meth) acrylic acid means acrylic acid and / or methacrylic acid.

(甲基)丙烯酸酯系聚合物之製造方法並無特別限定,例如可使用採用自由基聚合反應之自由基聚合法。自由基聚合法之例可列舉如:使用聚合起始劑使既定之單體單元共聚之自由基聚合法(游離自由基聚合法)、及可在末端等之控制的位置導入交聯性矽基之控制型自由基聚合法。透過使用作為聚合起始劑之偶氮系化合物、過氧化物等游離自由基聚合法所得的聚合物,其分子量分布通常大到2以上,黏度增高。因此,為了要得到一種分子量分布窄、黏度低的(甲基)丙烯酸酯系聚合物,其係以高比例在分子鏈末端具有交聯性官能基之(甲基)丙烯酸酯系聚合物時,以使用控制型自由基聚合法為理想。 The manufacturing method of a (meth) acrylate type polymer is not specifically limited, For example, the radical polymerization method using a radical polymerization reaction can be used. Examples of the radical polymerization method include a radical polymerization method (free radical polymerization method) in which a predetermined monomer unit is copolymerized using a polymerization initiator, and a crosslinkable silicon group can be introduced at a controlled position such as a terminal. Controlled radical polymerization. A polymer obtained by using a free radical polymerization method such as an azo compound as a polymerization initiator and a peroxide generally has a molecular weight distribution of 2 or more and a high viscosity. Therefore, in order to obtain a (meth) acrylic acid ester polymer having a narrow molecular weight distribution and a low viscosity, when a (meth) acrylic acid ester polymer having a crosslinkable functional group at a molecular chain end in a high proportion, It is desirable to use a controlled radical polymerization method.

控制型自由基聚合法之例可列舉如:使用具有特定官能基之鏈轉移劑的游離自由基聚合法或活性自由基聚合法。以加成-斷裂轉移反應(可逆加成-斷裂鏈轉移:RAFT)聚合法、使用過渡金屬錯合物之自由基聚合法(過渡金屬介導之活性自由基聚合)等之活性自由基聚合法更佳。而且,使用具有反應性矽基之硫醇化合物之反應、或使用具有反應性矽基之硫醇化合物及使用茂金屬化合物之反應亦佳。 Examples of the controlled radical polymerization method include a free radical polymerization method using a chain transfer agent having a specific functional group, or a living radical polymerization method. Additive-fragment transfer reaction (reversible addition-fracture chain transfer: RAFT) polymerization method, radical polymerization method using transition metal complex (transition metal-mediated living radical polymerization), and other living radical polymerization methods Better. Further, a reaction using a thiol compound having a reactive silicon group, or a reaction using a thiol compound having a reactive silicon group and a metallocene compound are also preferable.

具有交聯性矽基之(甲基)丙烯酸酯系聚合物係可單獨使用,亦可合併使用2種以上。 The (meth) acrylate-based polymer having a crosslinkable silicon group may be used alone or in combination of two or more kinds.

該等數量平均分子量為3,000以上之具有交聯性矽基之有機聚合物係可單獨使用,亦可合併使用2種以上。具體上,亦可使用將選自具有交聯性矽基之聚氧伸烷基系聚合物、具有交聯性矽基之飽和烴系聚合物,以及具有交聯性矽基之(甲基)丙烯酸酯系聚合物所成組群中之2種以上混合的有機聚合物。尤其是混合有具有交聯性矽基之聚氧伸烷基系聚合物與具有交聯性矽基之(甲基)丙烯酸酯系聚合物的有機聚合物具有優異特性。將如此之聚合物使用在光硬化性組成物時,可提高感壓接著劑之拉伸剪切接著力及黏著力。 These organic polymers having a crosslinkable silicon group having a number average molecular weight of 3,000 or more may be used alone or in combination of two or more kinds. Specifically, a polyoxyalkylene polymer having a crosslinkable silicon group, a saturated hydrocarbon polymer having a crosslinkable silicon group, and a (methyl) group having a crosslinkable silicon group can also be used. An organic polymer in which two or more kinds of acrylate-based polymers are mixed. In particular, an organic polymer in which a polyoxyalkylene polymer having a crosslinkable silicon group and a (meth) acrylate polymer having a crosslinkable silicon group are mixed has excellent characteristics. When such a polymer is used in a photocurable composition, the tensile shear adhesive force and the adhesive force of the pressure-sensitive adhesive can be improved.

作為混合有具有交聯性矽基之聚氧伸烷基系聚合物與具有交聯性矽基之(甲基)丙烯酸酯系聚合物的有機聚合物之製造方法,可列舉各種方法。例如:在具有交聯性矽基,分子鏈實質上由通式(3)所示之(甲基)丙烯酸酯單體單元、與通式(4)所示之(甲基)丙烯酸酯單體單元所構成的共聚物中,混合具有交聯性矽基之聚氧伸烷基系聚合物而製造之方法。 Various methods can be mentioned as a manufacturing method of the organic polymer which mixed the polyoxyalkylene type polymer which has a crosslinkable silicon group, and the (meth) acrylate type polymer which has a crosslinkable silicon group. For example, in a crosslinkable silicon group, the molecular chain is substantially composed of a (meth) acrylate monomer unit represented by the general formula (3) and a (meth) acrylate monomer represented by the general formula (4) A method of producing a copolymer composed of units by mixing a polyoxyalkylene-based polymer having a crosslinkable silicon group.

-CH2-C(R3)(COOR4)-...(3) -CH 2 -C (R 3 ) (COOR 4 ) -... (3)

(式中,R3表示氫原子或甲基、R4表示碳數1~5之烷基);-CH2-C(R3)(COOR5)-...(4) (Wherein R 3 represents a hydrogen atom or a methyl group, and R 4 represents an alkyl group having 1 to 5 carbon atoms); -CH 2 -C (R 3 ) (COOR 5 ) -... (4)

(式中,R3與上述相同,R5表示碳數6以上之烷基)。 (In the formula, R 3 is the same as described above, and R 5 represents an alkyl group having 6 or more carbon atoms).

通式(3)所示之R4可列舉例如:甲基、乙基、丙基、正丁基、三級丁基等之碳數1~5之烷基,以碳數1~4之烷基為佳,以碳數1~2之烷基更佳。而且,R4之烷基可單獨或混合2種以上。 Examples of R 4 represented by the general formula (3) include an alkyl group having 1 to 5 carbon atoms such as methyl, ethyl, propyl, n-butyl, and tertiary butyl, and an alkane having 1 to 4 carbon atoms. A radical is preferred, and an alkyl group having 1 to 2 carbon atoms is more preferred. The alkyl group of R 4 may be used alone or in combination of two or more.

通式(4)之R5可列舉例如:2-乙基己基、十二烷基、十八烷基等之碳數6以上之烷基,一般為碳數7~30之烷基,以碳數8~20之長鏈烷基為佳。而且,R5之烷基係與R4相同,可單獨或混合2種以上。 Examples of R 5 in the general formula (4) include an alkyl group having 6 or more carbon atoms such as 2-ethylhexyl, dodecyl, and octadecyl, and generally an alkyl group having 7 to 30 carbon atoms. A long-chain alkyl group of 8 to 20 is preferred. Further, the same group of lines 4 and R R 5, may be used alone or as a mixture of two or more.

(甲基)丙烯酸酯系聚合物之分子鏈實質上係由式(3)及式(4)之單體單元所構成。此處,「實質上」係指存在於共聚物中的式(3)及式(4)之單體單元的合計超出50質量%。式(3)及式(4)之單體單元的合計係以70質量%以上為佳。而且,式(3)之單體單元與式(4)之單體單元的存在比,以質量比計係以95:5~40:60為佳,以90:10~60:40更佳。 The molecular chain of the (meth) acrylic acid ester polymer is substantially composed of monomer units of the formula (3) and the formula (4). Here, "substantially" means that the total of the monomer units of the formula (3) and the formula (4) existing in the copolymer exceeds 50% by mass. The total of the monomer units of the formula (3) and the formula (4) is preferably 70% by mass or more. In addition, the existence ratio of the monomer unit of the formula (3) and the monomer unit of the formula (4) is preferably 95: 5 to 40:60 in terms of mass ratio, and more preferably 90:10 to 60:40.

(甲基)丙烯酸酯系共聚物之數量平均分子量係以3,000~10,000為佳,以3,000~5,000更佳,以4,000~4,500又更佳。透過將數量平均分子量設定在該範圍,提高與具有交聯性矽基之聚氧伸烷基系聚合物之相容性。(甲基)丙烯酸酯系聚合物係可單獨使用,亦可合併使用2種以上。具有交聯性矽基之聚氧伸烷基系聚合物與具有交聯性矽基之(甲基)丙烯酸酯系聚合物之調配比並無特別限制,惟相對於(甲基)丙烯酸酯系聚合物與聚氧伸烷基系聚合物之合計100質量份,(甲基)丙烯酸酯系聚合物以在10~60質量份之範圍內為佳,以在20~ 50質量份之範圍內更佳,以在25~45質量份之範圍內又更佳。(甲基)丙烯酸酯系聚合物多於60質量份時,黏度增高,操作性變差,故不佳。 The number average molecular weight of the (meth) acrylate copolymer is preferably 3,000 to 10,000, more preferably 3,000 to 5,000, and even more preferably 4,000 to 4,500. By setting the number average molecular weight within this range, compatibility with a polyoxyalkylene-based polymer having a crosslinkable silicon group is improved. The (meth) acrylic polymer may be used alone or in combination of two or more kinds. The blending ratio of the polyoxyalkylene polymer having a crosslinkable silicon group and the (meth) acrylate polymer having a crosslinkable silicon group is not particularly limited, but it is relative to the (meth) acrylate system. The total of the polymer and the polyoxyalkylene-based polymer is 100 parts by mass. The (meth) acrylate polymer is preferably within a range of 10 to 60 parts by mass, and more preferably within a range of 20 to 50 parts by mass. It is better to be in the range of 25 to 45 parts by mass. When the (meth) acrylic acid ester polymer is more than 60 parts by mass, the viscosity is increased and the handleability is deteriorated, which is not preferable.

更且,亦可使用混合有具有交聯性矽基之飽和烴系聚合物與具有交聯性矽基之(甲基)丙烯酸酯系聚合物之有機聚合物。作為混合有具有交聯性矽基之(甲基)丙烯酸酯系共聚物而得的有機聚合物之製造方法,還可利用在具有交聯性矽基之有機聚合物的存在下,將(甲基)丙烯酸酯系聚合物進行聚合之方法。 Furthermore, an organic polymer in which a saturated hydrocarbon-based polymer having a crosslinkable silicon group and a (meth) acrylate polymer having a crosslinkable silicon group are mixed may be used. As a method for producing an organic polymer obtained by mixing a (meth) acrylic acid ester copolymer having a crosslinkable silicon group, it is also possible to use (A) in the presence of an organic polymer having a crosslinkable silicon group. A method for polymerizing an acrylate-based polymer.

(B)成分之增黏樹脂方面,並無特別限制,可使用例如:松香酯樹脂、酚樹脂、二甲苯樹脂、二甲苯酚樹脂、萜烯酚樹脂等之具有極性基的樹脂;極性較小之芳香族系、脂肪族-芳香族共聚物系、或脂環式系等的各種石油樹脂、或苯并呋喃樹脂、低分子量聚乙烯樹脂、萜烯樹脂及該等經氫化之樹脂等的增黏樹脂。該等係可單獨使用,亦可合併使用2種以上。 (B) The tackifying resin of the component is not particularly limited, and resins having a polar group such as rosin ester resin, phenol resin, xylene resin, xylenol resin, terpene phenol resin, and the like can be used; Various aromatic resins, aliphatic-aromatic copolymers, or alicyclic resins, or benzofuran resins, low molecular weight polyethylene resins, terpene resins, and these hydrogenated resins. Sticky resin. These systems can be used alone or in combination of two or more.

作為芳香族系石油樹脂之例,可列舉如:α-甲基苯乙烯單一聚合樹脂[FTR Zero系列、三井化學股份有限公司製造]、苯乙烯系單體單一聚合樹脂[FTR 8000系列、三井化學股份有限公司製造]、苯乙烯系單體/芳香族系單體共聚系樹脂[FMR系列、三井化學股份有限公司製造]、α-甲基苯乙烯/苯乙烯共聚系樹脂[FTR 2000系列、三井化學股份有限公司製造]等之芳香族系苯乙烯系樹脂、或苯乙烯系單體/脂肪族系單體共聚系樹脂[FTR 6000系列、三井化學股份有限公司製造]、苯乙烯系單體 /α-甲基苯乙烯/脂肪族系單體共聚系樹脂[FTR 7000系列、三井化學股份有限公司製造]等之脂肪族-芳香族共聚物系苯乙烯樹脂。 Examples of the aromatic petroleum resin include α-methylstyrene monopolymer resin [FTR Zero series, manufactured by Mitsui Chemicals Co., Ltd.], styrene monomer monopolymer resin [FTR 8000 series, Mitsui Chemicals Co., Ltd.], styrene monomer / aromatic monomer copolymer resin [FMR series, Mitsui Chemicals Co., Ltd.], α-methylstyrene / styrene copolymer resin [FTR 2000 series, Mitsui Chemical Co., Ltd.] and other aromatic styrene resins, or styrene monomer / aliphatic monomer copolymer resins [FTR 6000 series, manufactured by Mitsui Chemicals Co., Ltd.], styrene monomer / Alpha-methylstyrene / aliphatic monomer copolymer resins [FTR 7000 series, manufactured by Mitsui Chemicals Co., Ltd.] and other aliphatic-aromatic copolymer-based styrene resins.

從對(A)數量平均分子量3,000以上之具有交聯性矽基之有機聚合物的相容性之觀點來說,增黏樹脂係透過使用Hoy常數的Small法計算出的溶解度參數(以下,原則上簡記為「SP值」)以7.9~11.0為佳,以8.2~9.8更佳,以8.5~9.5為最佳。從感壓接著劑之接著力的觀點來說,以選擇具有與被黏物的極性相符之樹脂為佳。將增黏樹脂使用在極性低的被黏物時,以使用極性低之增黏樹脂為佳,使用在極性高的被黏物時,以極性高的增黏樹脂者為佳。在使用增黏樹脂於從極性高的被黏物至極性低的被黏物之廣範圍中的被黏物時,以將極性低的增黏樹脂與極性高的增黏樹脂混合使用者為佳。而且,萜烯酚樹脂之極性(SP值)係YS Polystar(Yasuhara Chemical公司製造)U系列之SP值為8.69、T系列之SP值為8.81、S系列之SP值為8.98、G系列之SP值為9.07、K系列之SP值為9.32。藉由選擇極性(SP值),從極性低的被黏物至極性高的被黏物可適應各種極性之被黏物。 From the viewpoint of compatibility with (A) organic polymers having a crosslinkable silicon group having a number average molecular weight of 3,000 or more, the tackifying resin is a solubility parameter calculated by the Small method using the Hoy constant (hereinafter, the principle The abbreviated "SP value" above is preferably 7.9 to 11.0, more preferably 8.2 to 9.8, and most preferably 8.5 to 9.5. From the viewpoint of the adhesive force of the pressure-sensitive adhesive, it is preferable to select a resin having a polarity consistent with the adherend. When the tackifying resin is used on an adherend having a low polarity, it is preferable to use a tackifying resin having a low polarity. When using a tackifying resin with a high polarity, a tackifying resin having a high polarity is preferred. When using a tackifying resin for a wide range of adherends from a highly polar adherend to a low-polar adherend, it is better to mix the user with the lower polar tackifier resin and the higher polar tackifier resin. . In addition, the polarity (SP value) of the terpene phenol resin is YS Polystar (manufactured by Yasuhara Chemical) U-series SP value 8.69, T-series SP value 8.81, S-series SP value 8.98, and G-series SP value It is 9.07 and the SP value of K series is 9.32. By selecting the polarity (SP value), it is possible to adapt to various types of adherends from low-polar adherends to high-polar adherends.

作為增黏樹脂,從與具有交聯性矽基之有機聚合物的相容性良好之觀點來說,以萜烯酚樹脂及芳香族系石油樹脂為佳。芳香族系石油樹脂方面,以芳香族系苯乙烯樹脂、脂肪族-芳香族共聚物系苯乙烯樹脂為佳,以脂肪族-芳香族共聚物系苯乙烯樹脂更佳。從黏著 力優異之觀點來說,以萜烯酚樹脂為最佳。而且,從VOC及成霧之觀點來說,以使用脂肪族-芳香族共聚物系苯乙烯樹脂為佳。而且,從操作性之觀點來說,以使用黏度不易增高之脂肪族-芳香族共聚物系苯乙烯樹脂為佳。 As the tackifier resin, a terpene phenol resin and an aromatic petroleum resin are preferred from the viewpoint of good compatibility with an organic polymer having a crosslinkable silicon group. As the aromatic petroleum resin, an aromatic styrene resin and an aliphatic-aromatic copolymer styrene resin are preferred, and an aliphatic-aromatic copolymer styrene resin is more preferred. From the standpoint of excellent adhesion, terpene phenol resin is the most preferable. From the viewpoint of VOC and fogging, it is preferable to use an aliphatic-aromatic copolymer-based styrene resin. Furthermore, from the viewpoint of operability, it is preferable to use an aliphatic-aromatic copolymer-based styrene resin that is hardly increased in viscosity.

相對於(A)成分100質量份,增黏樹脂(B)之使用量係以10~200質量份為佳,以20~150質量份更佳。小於10質量份時,黏著力不足,而多於200質量份時,因硬化物過硬而使黏著力不足、或因黏度過高而有操作性降低之情形。 With respect to 100 parts by mass of the component (A), the amount of the tackifying resin (B) used is preferably 10 to 200 parts by mass, and more preferably 20 to 150 parts by mass. When it is less than 10 parts by mass, the adhesive force is insufficient, and when it is more than 200 parts by mass, the adhesive force is insufficient due to the hardened material, or the operability may be lowered due to the excessive viscosity.

(C)具有Si-F鍵之矽化合物係可使用具有Si-F鍵之包含矽基(以下,有稱為氟矽基之情形)的各種化合物。作為(C)成分之矽化合物,係可使用無機化合物及有機化合物之任一者。(C)成分係以具有氟矽基之有機化合物為佳,具有氟矽基之有機聚合物因安全性高而更佳。而且,從光硬化性組成物成為低黏度之觀點來說,以具有氟矽基之低分子有機矽化合物為佳。 (C) As the silicon compound having a Si-F bond, various compounds including a silicon group (hereinafter, referred to as a fluorosilyl group) having a Si-F bond can be used. As the silicon compound as the component (C), either an inorganic compound or an organic compound can be used. The component (C) is preferably an organic compound having a fluorosilicon group, and an organic polymer having a fluorosilicon group is more preferable because of high safety. In addition, from the viewpoint that the photocurable composition has a low viscosity, a low-molecular organosilicon compound having a fluorosilicon group is preferred.

(C)具有Si-F鍵之矽化合物的較佳例可列舉如:式(5)所示之WO2015-088021號公報所記載之氟矽烷、式(6)所示之WO2015-088021號公報所記載之具有氟矽基的化合物(以下亦稱為氟化化合物)、以及WO2015-088021號公報所記載之具有氟矽基的有機聚合物(以下亦稱為氟化聚合物)等。 (C) Preferred examples of the silicon compound having a Si-F bond include fluorosilane described in WO2015-088021 shown in formula (5), and WO2015-088021 shown in formula (6). Compounds having a fluorosilicon group (hereinafter also referred to as fluorinated compounds), organic polymers having a fluorosilicon group (hereinafter also referred to as fluorinated polymers) described in WO2015-088021, and the like.

R6 4-dSiFd...(5) R 6 4-d SiF d ... (5)

(式(5)中,R6各自獨立地表示取代或未取代之碳數1~20之烴基、或R7SiO-(R7各自獨立為碳數1~20之取代或未取代之烴基、或氟原子)所示之有機矽氧基之任一者。d為1~3之任一者,d以3為佳。R6及R7存在複數個時,該等可為相同或相異。) (In formula (5), R 6 each independently represents a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or R 7 SiO- (R 7 is each independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, Or fluorine atom) any of the organosiloxy groups. D is any of 1 to 3, and d is preferably 3. When there are a plurality of R 6 and R 7 , these may be the same or different. .)

-SiFdR6 eZf...(6) -SiF d R 6 e Z f ... (6)

(式(6)中,R6及d分別與式(5)相同,Z各自獨立為羥基或氟以外之水解基,e為0~2之任一者,f為0~2之任一者,d+e+f為3。R6、R7及Z存在複數個時,該等可為相同或相異。) (In formula (6), R 6 and d are the same as those in formula (5), each Z is independently a hydrolyzable group other than a hydroxyl group or fluorine, e is any of 0 to 2, and f is any of 0 to 2 , D + e + f is 3. When there is a plurality of R 6 , R 7 and Z, these may be the same or different.)

式(5)所示之氟矽烷之例方面,可列舉如:氟二甲基苯基矽烷、乙烯基三氟矽烷、γ-甲基丙烯醯氧基丙基三氟矽烷、十八烷基三氟矽烷等。 Examples of the fluorosilane represented by the formula (5) include fluorodimethylphenylsilane, vinyltrifluorosilane, γ-methacryloxypropyltrifluorosilane, and octadecyltrisiloxane. Fluorosilane and so on.

式(6)所示之具有氟矽基的化合物中,Z所示之水解基方面,從水解性溫和且易於操作之觀點來說,係以烷氧基為佳,R6方面,以甲基為佳。 Among the compounds having a fluorosilyl group represented by formula (6), the hydrolyzable group represented by Z is preferably an alkoxy group from the viewpoint of mild hydrolyzability and ease of handling, and R 6 is a methyl group Better.

作為式(6)所示之氟矽基之例示時,氟之外以不具有水解基之矽基或R6為甲基之氟矽基為佳,以三氟矽基更佳。 As an example of the fluorosilyl group represented by the formula (6), a fluorosilyl group having no hydrolyzable group or a fluorosilyl group in which R 6 is a methyl group is more preferable, and a trifluorosilyl group is more preferable.

式(6)所示之具有氟矽基的化合物,並無特別限定,可使用低分子化合物、高分子化合物之任一者。例如可列舉:無機矽化合物;乙烯基二氟甲氧基矽烷、乙烯基三氟矽烷、苯基二氟甲氧基矽烷、苯基三氟矽烷等之低分子有機矽化合物;末端具有式(6)所示之氟矽基 的氟化聚矽氧烷等之高分子化合物等。式(5)所示之氟矽烷、主鏈或側鏈之末端具有式(6)所示之氟矽基的聚合物為理想。 The compound having a fluorosilyl group represented by the formula (6) is not particularly limited, and any of a low-molecular compound and a high-molecular compound can be used. Examples include: inorganic silicon compounds; low-molecular-weight organic silicon compounds such as vinyldifluoromethoxysilane, vinyltrifluorosilane, phenyldifluoromethoxysilane, phenyltrifluorosilane, etc .; ) And other polymer compounds such as fluorosilyl-based fluorinated polysiloxane. The fluorosilane represented by formula (5), a polymer having a fluorosilicon group represented by formula (6) at the end of the main chain or a side chain is preferable.

氟化聚合物方面,可使用具有Si-F鍵之各種的有機聚合物。 For the fluorinated polymer, various organic polymers having Si-F bonds can be used.

氟化聚合物可為氟矽基,及主鏈骨架相同的單一聚合物,亦即每1分子之氟矽基的數、其鍵結位置,以及氟矽基所具有之F數,以及主鏈骨架相同的單一聚合物。而且,該等之任一者或全部可為不同之複數種聚合物之混合物。該等之氟化聚合物的任一者係作為顯示快速硬化性之光硬化性組成物的樹脂成分而作用。 The fluorinated polymer may be a fluorosilyl group, and a single polymer having the same backbone skeleton, that is, the number of fluorosilyl groups per molecule, its bonding position, the F number of the fluorosilyl group, and the main chain. A single polymer with the same backbone. Moreover, any or all of these may be a mixture of different plural kinds of polymers. Any of these fluorinated polymers functions as a resin component of a photocurable composition that exhibits rapid hardening properties.

氟化聚合物可為直鏈狀,亦可具有分支。氟化聚合物之數量平均分子量在GPC中的聚苯乙烯換算中,以3,000~100,000為佳,以3,000~50,000更佳,以3,000~30,000為特佳。 The fluorinated polymer may be linear or branched. The number average molecular weight of the fluorinated polymer is 3,000 to 100,000, more preferably 3,000 to 50,000, and particularly preferably 3,000 to 30,000 in terms of polystyrene in GPC.

(C)具有Si-F鍵之矽化合物的調配比並無特別限制,惟相對於(A)含交聯性矽基之有機聚合物100質量份,以0.01~30質量份為佳,以0.05~20質量份更佳。在使用作為(C)之氟化聚合物等之數量平均分子量3,000以上的高分子化合物時,相對於(A)含交聯性矽基之有機聚合物100質量份,以0.01~80質量份為佳,以0.01~30質量份更佳,以0.05~20質量份又更佳。在使用作為成分(C)之數量平均分子量小於3,000的具有氟矽基之低分子化合物時,相對於(A)含交聯性矽基之有機聚合物100質量份,以0.01~10質量份為佳,以0.05~5質量份更佳。 (C) The compounding ratio of the silicon compound having a Si-F bond is not particularly limited, but it is preferably 0.01 to 30 parts by mass, and 0.05 to 100 parts by mass of the organic polymer containing (A) a crosslinkable silicon group. ~ 20 parts by mass is better. When using a polymer compound having a number average molecular weight of 3,000 or more as the fluorinated polymer (C), 0.01 to 80 parts by mass relative to 100 parts by mass of the organic polymer containing (A) a crosslinkable silicon group Good, 0.01 to 30 parts by mass is more preferred, and 0.05 to 20 parts by mass is even better. When a low-molecular-weight compound having a fluorosilicon group whose number average molecular weight is less than 3,000 as the component (C) is used, 0.01 to 10 parts by mass relative to 100 parts by mass of the organic polymer containing (A) a crosslinkable silicon group. Good, more preferably 0.05 to 5 parts by mass.

(D)光鹼產生劑係當照射光時,作為(A)含交聯性矽基之有機聚合物之硬化觸媒而作用。(D)光鹼產生劑係透過紫外線、電子束、X射線、紅外線及可見光線等之活性能量射線之作用而產生鹼。可使用(1)透過紫外線/可見光/紅外線等之活性能量射線的照射而脫碳酸並分解之有機酸與鹼之鹽、(2)透過分子內親核取代反應或重排反應等而分解並釋出胺類的化合物、或者(3)透過紫外線/可見光/紅外線等之活性能量射線的照射引起既定的化學反應而釋出鹼的化合物等之習知的(D)光鹼產生劑。由(D)光鹼產生劑產生之鹼具有使(A)成分硬化之機能。 (D) Photobase generators act as hardening catalysts for (A) crosslinkable silicon-based organic polymers when irradiated with light. (D) Photobase generators generate alkali through the action of active energy rays such as ultraviolet rays, electron beams, X-rays, infrared rays, and visible rays. (1) Salts of organic acids and bases that are decarbonated and decomposed by irradiation with active energy rays such as ultraviolet / visible light / infrared rays, etc., (2) Decomposed and released by intramolecular nucleophilic substitution reaction or rearrangement reaction, etc. Conventional (D) photobase generators that emit amine compounds or (3) compounds that emit a predetermined chemical reaction by irradiation with active energy rays such as ultraviolet, visible light, and infrared rays. The alkali produced by the (D) photobase generator has a function of hardening the (A) component.

由(D)光鹼產生劑產生之鹼方面,例如以胺化合物等之有機鹼為佳,可使用例如:WO2015-088021號公報記載之1級烷基胺類、1級芳香族胺類、2級烷基胺類、具有2級胺基及3級胺基之胺類、3級烷基胺類、3級雜環式胺、3級芳香族胺類、脒、磷腈衍生物。其中,以具有3級胺基之胺化合物為佳,以強鹼之脒類、磷腈衍生物更佳。脒類係可使用非環狀脒類及環式脒類之任一者,以環式脒類更佳。該等鹼可單獨使用,亦可組合2種以上。 As for the alkali generated from the (D) photobase generator, for example, an organic base such as an amine compound is preferred. For example, primary alkylamines, primary aromatic amines, and the like described in WO2015-088021 can be used. Primary alkylamines, amines having secondary amine groups and tertiary amine groups, tertiary alkylamines, tertiary heterocyclic amines, tertiary aromatic amines, pyrene, phosphazene derivatives. Among them, an amine compound having a tertiary amine group is preferable, and a fluorene or a phosphazene derivative with a strong base is more preferable. Any of the non-cyclic amidines and cyclic amidines may be used for the amidines, and the amidines are more preferable. These bases may be used alone or in combination of two or more.

非環狀脒類方面,可列舉例如:WO2015-088021號公報記載之胍系化合物、雙胍系化合物等。而且,非環狀脒化合物之中,例如WO2015-088021號公報記載之芳基取代胍系化合物、或產生芳基取代雙胍系化合物之光鹼產生劑,作為聚合物(A)之觸媒使用 時,由於呈現出表面硬化性變佳之傾向、所得硬化物之接著性變佳之傾向等而佳。 As for the acyclic hydrazones, for example, guanidine-based compounds and biguanide-based compounds described in WO2015-088021 can be cited. Among the acyclic fluorene compounds, for example, the aryl-substituted guanidine-based compound described in WO2015-088021 or a photobase generator that generates an aryl-substituted biguanide-based compound is used as a catalyst for the polymer (A). It is preferred because it shows a tendency to improve the surface hardening property, and a tendency to improve the adhesion of the obtained hardened material.

環式脒類方面,可列舉例如:WO2015-088021號公報記載之環式胍系化合物、咪唑啉系化合物、咪唑系化合物、四氫嘧啶系化合物、三氮雜雙環烯烴系化合物、二氮雜雙環烯烴系化合物。 The cyclic amidines include, for example, the cyclic guanidine-based compound, imidazoline-based compound, imidazole-based compound, tetrahydropyrimidine-based compound, triazabicyclic olefin-based compound, and diazabicyclic compound described in WO2015-088021. Olefin compounds.

環式脒類之中,從可容易地由工業上取得之觀點來說,共軛酸之pKa值為12以上,基於呈現出高觸媒活性之觀點,以1,8-二氮雜雙環[5.4.0]十一烯-7(DBU)、1,5-二氮雜雙環[4.3.0]壬烯-5(DBN)為特佳。 Among the cyclic amidines, from the viewpoint that they can be easily obtained industrially, the pKa value of the conjugate acid is 12 or more. Based on the viewpoint of exhibiting high catalyst activity, 1,8-diazabicyclo [ 5.4.0] Undecene-7 (DBU), 1,5-diazabicyclo [4.3.0] nonene-5 (DBN) are particularly preferred.

(D)光鹼產生劑係可使用各種光鹼產生劑。以透過活性能量射線之作用而產生胺化合物的光潛伏性胺化合物為佳。光潛伏性胺化合物係可使用透過活性能量射線之作用而產生具有1級胺基之胺化合物的光潛伏性1級胺、透過活性能量射線之作用而產生具有2級胺基之胺化合物的光潛伏性2級胺、及透過活性能量射線之作用而產生具有3級胺基之胺化合物的光潛伏性3級胺之任一者。從生成之鹼呈現高的硬化觸媒之觀點來說,係以光潛伏性3級胺更佳。 (D) Various types of photobase generators can be used. A photo-lattice amine compound that generates an amine compound through the action of active energy rays is preferred. The photo-latent amine compound is a light-latent primary amine that generates an amine compound having a primary amine group through the action of active energy rays, and a light that generates a secondary amine compound having a secondary amine group through the action of active energy rays Either a latent secondary amine or a photo-latent tertiary amine that generates an amine compound having a tertiary amine group through the action of active energy rays. From the viewpoint that the generated alkali exhibits a high hardening catalyst, a photo-latency tertiary amine is more preferable.

作為光潛伏性1級胺及光潛伏性2級胺之例,可列舉如:WO2015-088021號公報記載之鄰硝基苄基胺甲酸乙酯系化合物;二甲氧基苄基胺甲酸乙酯系化合物;胺甲酸苯偶姻類;鄰-醯基肟類;鄰-胺甲醯基肟類;N-羥基醯亞胺胺甲酸酯類;甲醯苯胺衍生物;芳香族磺醯胺類;鈷胺錯合物等。 Examples of the photo-latent primary amine and photo-latent secondary amine include the o-nitrobenzyl urethane-based compounds described in WO2015-088021; and dimethoxybenzyl urethane. Compounds; benzoic acid benzoin; o-fluorenyl oxime; o-carbamidine oxime; N-hydroxyfluorenimine carbamate; formamidine aniline derivative; aromatic sulfonamide; Cobaltamine complexes, etc.

作為光潛伏性3級胺之例,可列舉如:WO2015-088021號公報記載之α-胺基酮衍生物、α-銨酮衍生物、苄基胺衍生物、苄基銨鹽衍生物、α-胺基烯烴衍生物、α-銨烯烴衍生物、胺亞胺類、透過光產生脒的苄氧基羰基胺衍生物、及羧酸與3級胺之鹽等。 Examples of the photo-latent tertiary amine include α-aminoketone derivatives, α-ammonone ketone derivatives, benzylamine derivatives, benzylammonium salt derivatives, and α described in WO2015-088021. -Amine olefin derivatives, α-ammonium olefin derivatives, imines, benzyloxycarbonylamine derivatives that generate fluorene by light, and salts of carboxylic acids and tertiary amines.

作為α-胺基酮衍生物之例,可列舉如:產生5-萘甲醯基甲基-1,5-二氮雜雙環[4.3.0]壬烷、5-(4'-硝基)苯甲醯甲基-1,5-二氮雜雙環[4.3.0]壬烷等之脒類的α-胺基酮衍生物;產生4-(甲基硫基苯甲醯基)-1-甲基-1-N-啉基乙烷(Irgacure 907)、2-苄基-2-二甲基胺基-1-(4-啉基苯基)-丁酮(Irgacure 369)、2-(4-甲基苄基)-2-二甲基胺基-1-(4-啉基苯基)-丁酮(Irgacure 379)等之以1個氮原子所構成的具有3級胺基之3級胺類的α-胺基酮化合物。 Examples of α-amino ketone derivatives include 5-naphthyridylmethyl-1,5-diazabicyclo [4.3.0] nonane, 5- (4'-nitro) Benzamidinemethyl-1,5-diazabicyclo [4.3.0] nonane and other 脒 -aminoketone derivatives such as nonane; yield 4- (methylthiobenzyl) -1- Methyl-1-N- Porphyrinethane (Irgacure 907), 2-benzyl-2-dimethylamino-1- (4- Phenylphenyl) -butanone (Irgacure 369), 2- (4-methylbenzyl) -2-dimethylamino-1- (4- An α-amino ketone compound having a tertiary amine group and a tertiary amine group composed of one nitrogen atom, such as phosphonophenyl) -butanone (Irgacure 379).

作為α-銨酮衍生物之例,可列舉如:1-萘甲醯基甲基-(1-氮鎓離子-4-氮雜雙環[2,2,2]-辛烷)四苯基硼酸鹽、5-(4'-硝基)苯甲醯甲基-(5-氮鎓離子-1-氮雜雙環[4.3.0]-5-壬烯)四苯基硼酸鹽等。 Examples of the α-ammonone derivatives include 1-naphthylmethylmethyl- (1-azenium ion-4-azabicyclo [2,2,2] -octane) tetraphenylboronic acid. Salt, 5- (4'-nitro) benzamidinemethyl- (5-azanium ion-1-azabicyclo [4.3.0] -5-nonene) tetraphenylborate and the like.

作為苄基胺衍生物之例,可列舉如:5-苄基-1,5-二氮雜雙環[4.3.0]壬烷、5-(蒽-9-基-甲基)-1,5-二氮雜雙環[4.3.0]壬烷、5-(萘并-2-基-甲基)-1,5-二氮雜雙環[4.3.0]壬烷等之苄基胺衍生物等。 Examples of benzylamine derivatives include 5-benzyl-1,5-diazabicyclo [4.3.0] nonane, 5- (anthracene-9-yl-methyl) -1,5 -Benzylamine derivatives such as diazabicyclo [4.3.0] nonane, 5- (naphtho-2-yl-methyl) -1,5-diazabicyclo [4.3.0] nonane, etc. .

作為苄基銨鹽衍生物之例,可列舉如:(9-蒽基甲基)-1-氮雜雙環[2.2.2]辛鎓四苯基硼酸鹽、5-(9-蒽基甲基)-1,5-二氮雜雙環[4.3.0]-5-壬鎓四苯基硼酸鹽等。 Examples of the benzylammonium salt derivative include (9-anthrylmethyl) -1-azabicyclo [2.2.2] octanium tetraphenylborate, and 5- (9-anthrylmethyl) ) -1,5-diazabicyclo [4.3.0] -5-nonium tetraphenylborate and the like.

作為α-胺基烯烴衍生物之例,可列舉如:5-(2'-(2"-萘基)烯丙基)-1,5-二氮雜雙環[4.3.0]壬烷等。 Examples of the α-amino olefin derivative include 5- (2 '-(2 "-naphthyl) allyl) -1,5-diazabicyclo [4.3.0] nonane and the like.

作為α-銨烯烴衍生物之例,可列舉如:1-(2'-苯基烯丙基)-(1-氮鎓離子-4-氮雜雙環[2,2,2]-辛烷)四苯基硼酸鹽等。 Examples of α-ammonium olefin derivatives include 1- (2'-phenylallyl)-(1-azenium ion-4-azabicyclo [2,2,2] -octane) Tetraphenylborate, etc.

作為透過光產生脒的苄基氧基羰基胺衍生物之例,可列舉如WO2015-088021號公報所記載的苄基氧基羰基咪唑類、苄基氧基羰基胍類、二胺衍生物等。 Examples of benzyloxycarbonylamine derivatives that generate fluorene through light include benzyloxycarbonylimidazoles, benzyloxycarbonylguanidines, diamine derivatives, and the like described in WO2015-088021.

作為羧酸與3級胺之鹽的例,可列舉如WO2015-088021號公報所記載的α-酮羧酸銨鹽及羧酸銨鹽等。 Examples of the salt of a carboxylic acid and a tertiary amine include α-ketocarboxylic acid ammonium salts and carboxylic acid ammonium salts described in WO2015-088021.

(D)光鹽產生劑之中,從產生之鹼呈現高的觸媒活性之觀點來說,係以光潛伏性3級胺為佳,從鹼的產生效率高及作為組成物之貯藏安定性佳等而言,係以苄基銨鹽衍生物、苄基取代胺衍生物、α-胺基酮衍生物、α-銨酮衍生物為佳。尤其是就鹼的產生效率更佳的方面而言,以α-胺基酮衍生物、α-銨酮衍生物更佳,基於對光硬化性組成物之溶解性,則以α-胺基酮衍生物更佳。α-胺基酮衍生物之中,從產生鹼的鹼性強度來說,亦以產生脒類之α-胺基酮化合物為佳,從易於取得之觀點來說,可列舉如產生具有以1個氮原子構成的3級胺基之3級胺類的α-胺基酮化合物。 (D) Among the photo-salt generators, from the viewpoint that the generated alkali exhibits a high catalytic activity, it is preferably a photo-latent tertiary amine, from the high efficiency of alkali generation and storage stability of the composition. For example, benzyl ammonium salt derivatives, benzyl substituted amine derivatives, α-amino ketone derivatives, and α-ammonone ketone derivatives are preferred. In particular, in terms of better base production efficiency, α-amino ketone derivatives and α-ammonone ketone derivatives are more preferred, and α-amino ketone is based on solubility in photocurable compositions. Derivatives are better. Among the α-amino ketone derivatives, from the viewpoint of the alkalinity of generating alkali, it is also preferable to generate α-amino ketone compounds of hydrazones. From the viewpoint of easy availability, examples include Α-amino ketone compounds of tertiary amines of tertiary amine groups composed of three nitrogen atoms.

該等(D)光鹽產生劑係可單獨使用,亦可組合2種以上使用。(D)光鹽產生劑之調配比並無特別限制,惟相對於(A)含交聯性矽基之有機聚合物100質量份,以 0.01~50質量份為佳,以0.1~40質量份更佳,以0.2~15質量份又更佳。作為硬化觸媒使用之(D)光鹽產生劑與具有Si-F鍵之矽化合物(C)的調配比,(D):(C)以質量比係以1:0.008~1:300為佳,以1:0.016~1:40更佳。 These (D) light salt generating agents may be used alone or in combination of two or more kinds. (D) The blending ratio of the light salt generator is not particularly limited, but it is preferably 0.01 to 50 parts by mass and 0.1 to 40 parts by mass relative to 100 parts by mass of the organic polymer containing (A) a crosslinkable silicon group. More preferably, it is even better at 0.2 to 15 parts by mass. The blending ratio of (D) photo-salt generator and silicon compound (C) with Si-F bond used as hardening catalyst, (D): (C) is preferably 1: 0.008 ~ 1: 300 based on mass ratio. It is better to use 1: 0.016 ~ 1: 40.

作為(E)成分之數量平均分子量小於3,000的具有水解性矽基之化合物,並無特別限制,例如可使用:不具有水解性矽基以外之官能基的矽烷化合物、有機聚矽氧烷及矽烷偶合劑、矽烷偶合劑之反應物及縮合體等具有水解性矽基之矽烷化合物。其中,以不具有水解性矽基以外之官能基的矽烷化合物、及矽烷偶合劑為佳。該等可單獨使用,亦可合併使用2種以上。 The compound having a hydrolyzable silyl group having a number average molecular weight of less than 3,000 as the component (E) is not particularly limited. For example, a silanic compound having no functional group other than a hydrolyzable silyl group, an organic polysiloxane, and a silan Coupling agents, reactants and condensates of silane coupling agents have hydrolyzable silane compounds. Among them, a silane compound having no functional group other than a hydrolyzable silane group and a silane coupling agent are preferred. These can be used alone or in combination of two or more.

作為(E)成分之數量平均分子量小於3,000的具有水解性矽基之化合物所具有的水解性矽基,只要為F原子以外,並無特別限定。例如可列舉:烷氧基、醯基氧基、酮肟酯基、胺基氧基、烯基氧基等。該等之中,從水解性穩定且操作容易之觀點來說,以烷氧基為佳。烷氧基之中,碳數少之基者反應性高。如甲氧基>乙氧基>丙氧基之順序,隨著碳數的增加反應性降低。雖可根據目的及用途選擇,惟一般可使用甲氧基及乙氧基。 The hydrolyzable silicon group contained in the hydrolyzable silicon group-containing compound having a number average molecular weight of less than 3,000 as the component (E) is not particularly limited as long as it is other than an F atom. Examples include alkoxy, fluorenyloxy, ketoxime, amineoxy, and alkenyloxy. Among these, an alkoxy group is preferable from the viewpoint of stable hydrolyzability and easy handling. Among the alkoxy groups, those having a small carbon number are highly reactive. Such as the order of methoxy> ethoxy> propoxy, the reactivity decreases as the carbon number increases. Although it can be selected according to the purpose and application, methoxy and ethoxy are generally used.

感壓接著劑大多與聚矽氧剝離紙一起使用。然而,本發明中使用之含有(A)、(B)、(C)及(D)成分的光硬化性組成物之硬化物作為感壓接著層之感壓接著劑中,使用聚矽氧剝離紙時,在剝離紙剝離後,作為感壓接著劑的特性,尤其是黏著性會有降低的情形。然而, 在含有(A)、(B)、(C)及(D)成分的光硬化性組成物,進一步添加(E)數量平均分子量小於3,000之具有水解性矽基的化合物時,發現在剝離紙剝離後,作為感壓接著劑的特性不會降低。 Pressure-sensitive adhesives are mostly used with silicone release paper. However, in the present invention, the cured product of the photocurable composition containing the components (A), (B), (C), and (D) is used as the pressure-sensitive adhesive of the pressure-sensitive adhesive layer, and polysiloxane is used for peeling. In the case of paper, the properties of the pressure-sensitive adhesive, especially the adhesiveness, may be reduced after the paper is peeled off. However, when a photocurable composition containing the components (A), (B), (C), and (D) was further added, the compound having a hydrolyzable silicon group having a number average molecular weight of less than 3,000 (E) was found to peel off. After the paper is peeled off, the characteristics as a pressure-sensitive adhesive do not decrease.

數量平均分子量小於3,000之具有水解性矽基的化合物,其數量平均分子量在GPC之聚苯乙烯換算中,以小於3,000為佳,以小於2,000更佳,以小於1,000又更佳,以小於700為特佳。 Compounds with hydrolyzable silicon groups whose number-average molecular weight is less than 3,000. The number-average molecular weight in polystyrene conversion of GPC is preferably less than 3,000, more preferably less than 2,000, less than 1,000 and more preferably, and less than 700. Extraordinary.

經4個水解性基取代之矽烷化合物之例,可列舉如:四氯矽烷、四胺基矽烷、四乙醯氧基矽烷、四甲氧基矽烷、四乙氧基矽烷、四丁氧基矽烷、四苯氧基矽烷、四苄氧基矽烷、三甲氧基矽烷、三乙氧基矽烷等。 Examples of the silane compound substituted with four hydrolyzable groups include tetrachlorosilane, tetraaminosilane, tetraethoxysilane, tetramethoxysilane, tetraethoxysilane, and tetrabutoxysilane , Tetraphenoxysilane, tetrabenzyloxysilane, trimethoxysilane, triethoxysilane, etc.

而且,經3個水解性基取代之矽烷化合物之例,可列舉如:甲基三氯矽烷、甲基三甲氧基矽烷、甲基三乙氧基矽烷、甲基三丁氧基矽烷、乙基三甲氧基矽烷、乙基三異丙氧基矽烷、乙基三丁氧基矽烷、丁基三甲氧基矽烷、五氟苯基三甲氧基矽烷、苯基三甲氧基矽烷、苯基三乙氧基矽烷、九氟丁基乙基三甲氧基矽烷、三氟甲基三甲氧基矽烷等。 Examples of the silane compound substituted with three hydrolyzable groups include methyltrichlorosilane, methyltrimethoxysilane, methyltriethoxysilane, methyltributoxysilane, and ethyl. Trimethoxysilane, ethyltriisopropoxysilane, ethyltributoxysilane, butyltrimethoxysilane, pentafluorophenyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxy Silyl, nonafluorobutylethyltrimethoxysilane, trifluoromethyltrimethoxysilane, and the like.

而且,經2個水解性基取代之矽烷化合物之例,可列舉如:二甲基二氯矽烷、二甲基二胺基矽烷、二甲基二乙醯氧基矽烷、二甲基二甲氧基矽烷、二苯基二甲氧基矽烷、二苯基二乙氧基矽烷、二丁基二甲氧基矽烷等。進一步可列舉如:三甲基氯矽烷、六甲基二矽氮烷、三甲基矽烷、三丁基矽烷、三甲基甲氧基矽烷、三丁基乙氧基矽烷等之矽烷化合物。 Examples of the silane compound substituted with two hydrolyzable groups include dimethyldichlorosilane, dimethyldiaminosilane, dimethyldiethoxysilane, and dimethyldimethoxy Silane, diphenyldimethoxysilane, diphenyldiethoxysilane, dibutyldimethoxysilane, etc. Further examples include silane compounds such as trimethylchlorosilane, hexamethyldisilazane, trimethylsilane, tributylsilane, trimethylmethoxysilane, and tributylethoxysilane.

矽烷偶合劑之例係可列舉如:γ-環氧丙氧基丙基三甲氧基矽烷、β-(3,4-乙氧基環己基)乙基三甲氧基矽烷等之含環氧基之矽烷類;γ-胺基丙基三甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基三甲氧基矽烷等之含胺基的矽烷類;N-(1,3-二甲基亞丁基)-3-(三乙氧基矽基)-1-丙烷胺等之酮亞胺型矽烷類;γ-巰基丙基三甲氧基矽烷等含巰基之矽烷類;乙烯基三甲氧基矽烷、γ-甲基丙烯醯基氧基丙基三甲氧基矽烷等之含乙烯基型不飽和基之矽烷類;γ-氯丙基三甲氧基矽烷等之含氯原子之矽烷類;γ-異氰酸酯丙基三乙氧基矽烷、三甲氧基矽基丙基異氰酸酯等之含異氰酸酯的矽烷類;該等之3聚物的三(3-三甲氧基矽基丙基)三聚異氰酸酯等之縮合體;癸基三甲氧基矽烷等之烷基矽烷類;苯基三甲氧基矽烷等之含苯基之矽烷類等,惟並不限於該等。 Examples of the silane coupling agent include epoxy-containing compounds such as γ-glycidoxypropyltrimethoxysilane, β- (3,4-ethoxycyclohexyl) ethyltrimethoxysilane, and the like. Silanes; γ-aminopropyltrimethoxysilane, N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane, and other amine-containing silanes; N- (1,3 -Dimethylbutylene) -3- (triethoxysilyl) -1-propaneamine and other ketimine-type silanes; γ-mercaptopropyltrimethoxysilane and other mercapto-containing silanes; vinyl Vinyl unsaturated group-containing silanes such as trimethoxysilane, γ-methacryl methoxypropyltrimethoxysilane, and the like; chlorine-containing silanes such as γ-chloropropyltrimethoxysilane ; Isocyanate-containing silanes such as γ-isocyanatepropyltriethoxysilane, trimethoxysilylpropylisocyanate, etc .; tris (3-trimethoxysilylpropyl) trimeric isocyanate of these 3 polymers And other condensates; alkylsilanes such as decyltrimethoxysilane; phenyltrimethoxysilanes such as phenyltrimethoxysilane; but not limited to these.

矽烷偶合劑之反應物及縮合體之例係可列舉如:含胺基之矽烷類,與包含上述矽烷類之含環氧基的化合物、含異氰酸酯基之化合物、含(甲基)丙烯醯基之化合物反應,使胺基改質之含改質胺基的矽烷類。 Examples of the reactant and condensate of the silane coupling agent include silanes containing amine groups, epoxy-containing compounds containing the above-mentioned silanes, isocyanate-containing compounds, and (meth) acrylic acid-containing groups. The compound reacts with the modified amino group-containing silanes.

有機聚矽氧烷之例,可列舉如:信越化學工業股份有限公司製造之KR-517、KR-513、KR-511、KC-89S、KR-213等。 Examples of the organic polysiloxane include KR-517, KR-513, KR-511, KC-89S, and KR-213 manufactured by Shin-Etsu Chemical Industry Co., Ltd.

含胺基之矽烷類係作為矽醇縮合觸媒而作用、酮亞胺型矽烷類係在水分的存在下生成含胺基之矽烷類,此係作為矽醇縮合觸媒而作用。因此,以使用含胺基之矽烷類或酮亞胺型矽烷類以外之矽烷偶合劑為 佳。而且,在使用含胺基之矽烷類或酮亞胺型矽烷類時,在達成本發明之目的/效果之範圍內,應注意種類及使用量而加以使用。 Amine-containing silanes act as silanol condensation catalysts, and ketimine-type silanes produce amine-containing silanes in the presence of moisture, which act as silanol condensation catalysts. Therefore, it is preferable to use a silane coupling agent other than an amine-containing silane or a ketimine-type silane. In addition, when using amine-containing silanes or ketimine-type silanes, it is necessary to pay attention to the type and the amount to be used within the scope of achieving the object / effect of the present invention.

如上所述,含胺基之矽烷類或酮亞胺型矽烷類在本發明中係有使用限制。然而,當需要使用作為接著性賦予劑之含胺基之矽烷類或酮亞胺型矽烷類時,光照射前,不會產生具有胺基之化合物,可使用經光照射產生含胺基之矽烷類的化合物(以下亦稱為產生光胺基矽烷的化合物)。作為產生光胺基矽烷的化合物,可列舉如WO2015-088021號公報記載之光官能基為鄰-硝基苄基、對-硝基苄基、肟殘基、苄基、苄醯基或經取代之該等之基等的化合物。作為光官能基為鄰-硝基苄基的產生光胺基矽烷之化合物之例,可列舉如:2-硝基苄基-N-[3-(三甲氧基矽基)丙基]胺基甲酸酯、2-硝基苄基-N-[3-(三乙氧基矽基)丙基]胺基甲酸酯、3,4-二甲氧基-2-硝基苄基-N-[3-(三甲氧基矽基)丙基]胺基甲酸酯等。作為光官能基為鄰-硝基苄基的產生光胺基矽烷之化合物之例,可列舉如:4-硝基苄基-N-[3-(三甲氧基矽基)丙基]胺基甲酸酯等。作為光官能基為苄基的產生光胺基矽烷之化合物之例,可列舉如:1-(3,5-二甲氧基苯基)-1-甲基乙基-N-[3-(三甲氧基矽基)丙基]胺基甲酸酯等。作為光官能基為肟殘基的產生光胺基矽烷之化合物之例,可列舉如:二苯基酮O-{[3-(三甲氧基矽基)丙基]}肟等。 As described above, amine-containing silanes or ketimine-type silanes are limited in use in the present invention. However, when it is necessary to use an amine-containing silane or a ketimine-type silane as an adhesiveness-imparting agent, a compound having an amine group is not generated before light irradiation, and an amine group-containing silane can be generated by light irradiation Compounds (hereinafter also referred to as compounds that produce photoaminosilanes). Examples of the compound that generates a photoamine silane include ortho-nitrobenzyl, p-nitrobenzyl, oxime residue, benzyl, benzamidine, or substituted as described in WO2015-088021. Compounds such as these. Examples of the photoamine silane-generating compound whose photofunctional group is o-nitrobenzyl include 2-nitrobenzyl-N- [3- (trimethoxysilyl) propyl] amine Formate, 2-nitrobenzyl-N- [3- (triethoxysilyl) propyl] carbamate, 3,4-dimethoxy-2-nitrobenzyl-N -[3- (trimethoxysilyl) propyl] carbamate and the like. Examples of the photoamine silane-generating compound whose photofunctional group is o-nitrobenzyl include 4-nitrobenzyl-N- [3- (trimethoxysilyl) propyl] amine Formate and so on. Examples of the photoamine-based silane-generating compound whose photofunctional group is benzyl include 1- (3,5-dimethoxyphenyl) -1-methylethyl-N- [3- ( Trimethoxysilyl) propyl] carbamate and the like. Examples of the photoamine silane-generating compound whose photofunctional group is an oxime residue include diphenyl ketone O-{[3- (trimethoxysilyl) propyl]} oxime and the like.

數量平均分子量小於3,000之具有水解性矽基的化合物之調配比並無特別限制,惟在組成物中,以0.01~20質量%為佳,以0.025~10質量%更佳。 The compounding ratio of the hydrolyzable silicon-based compound having a number-average molecular weight of less than 3,000 is not particularly limited, but in the composition, it is preferably 0.01 to 20% by mass, and more preferably 0.025 to 10% by mass.

本發明之感壓接著劑中使用的光硬化性組成物,如考慮塗布時之作業性,可依需要而加熱、甚至調配稀釋劑使降低黏度以進行塗布。塗布時之光硬化性組成物的黏度期望為1~500Pa.s,以1~100Pa.s為佳,尤以1~30Pa.s之範圍內為特佳。 The photo-curable composition used in the pressure-sensitive adhesive of the present invention can be heated or even blended with a diluent to reduce the viscosity for coating if the workability during coating is considered. The viscosity of the photocurable composition at the time of coating is desirably 1 to 500 Pa. s, with 1 ~ 100Pa. s is better, especially 1 ~ 30Pa. The range of s is particularly preferable.

光硬化性組成物係藉由一面加熱一面塗布而調整成想要的黏度範圍,可得到優異之塗布作業性。塗布溫度係以50℃以上為佳,以70℃以上更佳,以75~120℃最佳。 The photo-curable composition is applied while heating and adjusting to a desired viscosity range, and excellent coating workability can be obtained. The coating temperature is preferably 50 ° C or higher, more preferably 70 ° C or higher, and most preferably 75 to 120 ° C.

藉由調配稀釋劑,即可調整光硬化性組成物之黏度等之物性。稀釋劑方面,可廣泛地使用習知的稀釋劑,並無特別限制,例如可列舉:正烷烴、異烷烴等之飽和烴系溶劑、HS二聚物(豐國製油股份有限公司商品名)等之α-烯烴衍生物、芳香族烴系溶劑、雙丙酮醇等之醇系溶劑、酯系溶劑、乙醯檸檬酸三乙酯等之檸檬酸酯系溶劑、酮系溶劑等之各種溶劑。 By blending the diluent, the physical properties such as the viscosity of the photocurable composition can be adjusted. As for the diluent, conventional diluents can be widely used without particular limitation. Examples of the diluent include saturated hydrocarbon solvents such as n-alkanes and iso-alkanes, and HS dimers (trade names of Fungoku Oil Co., Ltd.). Various solvents such as α-olefin derivatives, aromatic hydrocarbon solvents, alcohol solvents such as diacetone alcohol, ester solvents, citrate solvents such as triethylacetate, and ketone solvents.

稀釋劑之閃點(flash point)並無特別限制,惟考量到組成物的安全性時,組成物之閃點宜高,以組成物之揮發物質較少者為佳。因此,稀釋劑之閃點以60℃以上者為佳,以70℃以上者更佳。混合2種以上之稀釋劑時,混合之稀釋劑之閃點係以70℃以上者為佳。而且,一般而言,閃點高的稀釋劑對組成物之稀釋效果會有降低之傾向,因此,閃點係以250℃以下者為佳。 The flash point of the diluent is not particularly limited, but when the safety of the composition is taken into consideration, the flash point of the composition should be high, and preferably the composition has less volatile matter. Therefore, the flash point of the diluent is preferably above 60 ° C, and more preferably above 70 ° C. When two or more diluents are mixed, the flash point of the mixed diluent is preferably 70 ° C or higher. In addition, in general, a diluent having a high flash point tends to reduce the dilution effect of the composition. Therefore, the flash point is preferably 250 ° C or lower.

考量組成物之安全性、稀釋效果之兩者時,稀釋劑係以飽和烴系溶劑為佳,以正烷烴、異烷烴更佳,正烷烴、異烷烴之碳數係以10~16為佳。 When considering both the safety and dilution effect of the composition, the diluent is preferably a saturated hydrocarbon-based solvent, more preferably n-alkane and iso-alkane, and the carbon number of n-alkane and iso-alkane is preferably 10-16.

稀釋劑之調配比並無特別限制,從透過混合而提高塗布作業性與物性降低之平衡的觀點來說,以在組成物中調配0~25%為佳,以調配0.1~15%較佳,以調配1~7%更佳。該等稀釋劑係可單獨使用,亦可合併使用2種以上。 The blending ratio of the diluent is not particularly limited. From the viewpoint of improving the balance between coating workability and physical properties reduction by mixing, it is better to blend 0 to 25% in the composition, and it is better to blend 0.1 to 15%. It is better to mix 1 ~ 7%. These diluents can be used alone or in combination of two or more.

感壓接著劑中使用之光硬化性組成物中,可依需要而添加光敏劑、填料、塑化劑、水分吸收劑、(C)成分及(D)成分以外之其它的縮合反應促進觸媒、具有自由基聚合性之官能基的化合物、改善拉伸特性之物性調整劑、強化劑、著色劑、阻燃劑、防垂劑、抗氧化劑、抗老化劑、紫外線吸收劑、溶劑、香料、顏料、染料、導電粉末、導熱粉末、螢光體、蠟等之各種添加劑。 In the photocurable composition used in the pressure-sensitive adhesive, a photosensitizer, a filler, a plasticizer, a moisture absorbent, a condensation reaction other than the component (C) and the component (D) may be added as needed Compounds with functional groups that are radically polymerizable, physical property modifiers that improve tensile properties, strengthening agents, colorants, flame retardants, anti-sagging agents, antioxidants, anti-aging agents, ultraviolet absorbers, solvents, perfumes, Various additives such as pigments, dyes, conductive powders, thermally conductive powders, phosphors, and waxes.

填料方面,係可使用樹脂填料(樹脂微粉末)或無機填料。樹脂填料方面,係可使用由有機樹脂等所構成的粒狀之填料。例如:樹脂填料係可使用聚丙烯酸乙酯樹脂、聚胺甲酸酯樹脂、聚乙烯樹脂、聚丙烯樹脂、脲樹脂、三聚氰胺樹脂、苯并胍胺樹脂、酚樹脂、丙烯酸樹脂、苯乙烯樹脂等之有機質微粒。 As for the filler, a resin filler (resin fine powder) or an inorganic filler can be used. As for the resin filler, a granular filler made of an organic resin or the like can be used. For example, the resin filler can be polyethylene acrylate resin, polyurethane resin, polyethylene resin, polypropylene resin, urea resin, melamine resin, benzoguanamine resin, phenol resin, acrylic resin, styrene resin, etc. Organic particles.

樹脂填料係以藉由使單體(例如:甲基丙烯酸甲酯)等懸浮聚合等而可容易地得到正球形的填料者為佳。而且,由於在組成物中適當地含有樹脂填料之填充材,故以球形的交聯樹脂填料為佳。另外,將感壓接著劑使用在液晶顯示裝置的周邊部等之需要遮光性的用途時,樹脂填料係以包含黑色之樹脂填料者為佳。藉由使用平均粒徑1~150μm之黑色的樹脂填料,即使在使用 單一波長的LED燈等,亦可得到良好的硬化性,可達到優異之遮光性與硬化性。 The resin filler is preferably one that can easily obtain a spherical filler by suspension polymerization of a monomer (for example, methyl methacrylate) or the like. In addition, since a filler containing a resin filler is appropriately contained in the composition, a spherical crosslinked resin filler is preferred. In addition, when the pressure-sensitive adhesive is used in applications requiring light-shielding properties, such as a peripheral portion of a liquid crystal display device, the resin filler is preferably a resin filler containing black. By using a black resin filler having an average particle diameter of 1 to 150 µm, even if a single-wavelength LED lamp is used, good hardening properties can be obtained, and excellent light-shielding properties and hardening properties can be achieved.

無機填料方面,例如可列舉如:滑石、黏土、碳酸鈣、碳酸鎂、無水矽、水合矽、矽酸鈣、二氧化鈦、碳黑等。該等可單獨使用,亦可合併使用2種以上。 Examples of the inorganic filler include talc, clay, calcium carbonate, magnesium carbonate, anhydrous silicon, hydrated silicon, calcium silicate, titanium dioxide, and carbon black. These can be used alone or in combination of two or more.

塑化劑方面,例如可列舉:磷酸三丁酯、磷酸三甲苯酯等之磷酸酯類;酞酸二辛酯等之酞酸酯類;甘油單油酸酯等之脂肪酸一元酸酯類、己二酸二辛酯等之脂肪族二元酸酯類、聚丙二醇類等。該等可單獨使用,亦可合併使用2種以上。 Examples of plasticizers include phosphate esters such as tributyl phosphate and tricresyl phosphate; phthalate esters such as dioctyl phthalate; fatty acid monoesters such as glycerol monooleate; Aliphatic dibasic acid esters such as dioctyl diacid, polypropylene glycols and the like. These can be used alone or in combination of two or more.

水分吸收劑方面,係以上述矽烷偶合劑及矽酸鹽為宜。矽酸鹽並無特別限定,例如可列舉:四甲氧基矽烷、四烷氧基矽烷等及其部分水解縮合物。 As the moisture absorbent, the above-mentioned silane coupling agent and silicate are suitable. The silicate is not particularly limited, and examples thereof include tetramethoxysilane, tetraalkoxysilane, and the like and partial hydrolyzed condensates thereof.

(C)成分及(D)成分以外之其它的縮合反應促進觸媒方面,可廣泛地使用習知的縮合反應促進觸媒,並無特別限制,例如可列舉:有機金屬化合物、酸或胺等之鹼。有機金屬化合物之例方面,可列舉如:有機錫化合物;二烷基錫氧化物;二丁基錫氧化物與酞酸酯之反應物等;酞酸酯類;有機鋁化合物類;四乙醯丙酮鈦等之螯合化合物類;有機酸鉍、三氟化硼、三氟化硼之錯合物、氟化劑、及多價氟化合物之鹼金屬鹽等。矽醇縮合觸媒方面,可列舉各種之其它的酸性觸媒及鹼性觸媒等。作為矽醇縮合觸媒係可列舉如:習知之其它的酸性觸媒及鹼性觸媒等。然而,有機錫化合物依所添加之量,會有所得組成物之毒性變強之情形。本發明中使用 之組成物的(C)成分及(D)成分係作為縮合反應促進觸媒而作用,因此,在使用該等以外之硬化觸媒時,係以在可達成本發明之目的及效果之範圍內使用者為佳。 As for the condensation reaction promotion catalyst other than the (C) component and the (D) component, conventional condensation reaction promotion catalysts can be widely used without particular limitation, and examples thereof include organometallic compounds, acids, and amines. The base. Examples of organometallic compounds include organic tin compounds; dialkyltin oxides; reactants of dibutyltin oxide and phthalates; phthalates; organic aluminum compounds; titanium tetraacetamidine acetone And other chelating compounds; organic acid bismuth, boron trifluoride, boron trifluoride complexes, fluorinating agents, and alkali metal salts of polyvalent fluorine compounds. As for the silanol condensation catalyst, various other acidic catalysts and alkaline catalysts can be cited. Examples of the silanol condensation catalyst system include conventional acid catalysts and alkaline catalysts. However, depending on the amount of the organic tin compound added, the toxicity of the resulting composition may become strong. The (C) component and (D) component of the composition used in the present invention act as a condensation reaction promotion catalyst. Therefore, when using hardening catalysts other than these, the purpose of the invention and Users within the range of effects are better.

具有自由基聚合性之官能基的化合物方面,可列舉如:具有由自由基聚合性之乙烯基、亞乙烯基及伸乙烯基所成組群中選擇之至少1個基的有機化合物。尤其是,以使用具有乙烯基之有機化合物為佳。更且,自由基聚合性之官能基可為由丙烯醯基及甲基丙烯醯基所成組群中選擇之至少1個基。有機化合物係可使用例如:具有(甲基)丙烯醯基之化合物及氮原子上直接與乙烯基鍵結之N-乙烯基化合物。在添加具有自由基聚合性之官能基的化合物時,光照射後可立即提高剝離強度。 Examples of the compound having a radically polymerizable functional group include organic compounds having at least one group selected from the group consisting of radically polymerizable vinyl, vinylidene, and vinylidene. In particular, it is preferable to use an organic compound having a vinyl group. Furthermore, the radically polymerizable functional group may be at least one group selected from the group consisting of an acrylfluorenyl group and a methacrylfluorenyl group. As the organic compound, for example, a compound having a (meth) acrylfluorenyl group and an N-vinyl compound directly bonded to a vinyl group on a nitrogen atom can be used. When a compound having a radical polymerizable functional group is added, the peel strength can be increased immediately after light irradiation.

在使用具有自由基聚合性之官能基的化合物時,可合併使用光自由基起始劑。光自由基起始劑方面,例如可列舉:苯偶因醚衍生物、苄基縮酮衍生物、α-羥基苯乙酮衍生物、α-胺基苯乙酮衍生物等之芳基烷基酮類、醯基膦氧化物類、二茂鈦類、肟酮類、硫代苯甲酸S-苯酯類,以及該等經高分子量化之衍生物。 When a compound having a radical polymerizable functional group is used, a photo radical initiator may be used in combination. Examples of the photo radical initiator include arylalkyl groups such as benzoin ether derivatives, benzyl ketal derivatives, α-hydroxyacetophenone derivatives, and α-aminoacetophenone derivatives. Ketones, fluorenylphosphine oxides, titanocene, oxime ketones, thiobenzoic acid S-phenyl esters, and these polymerized derivatives.

本發明中使用之光硬化性組成物之製造方法並無特別限制,例如:藉由調配既定量之成分(A)、(B)、(C)、(D)及(E),且依需要而調配其它之調配物質,進行脫氣攪拌即可製造。各成分及其它之調配物質的調配順序並無特別限制,可適當地決定。該光硬化性組成物可依需要而製成1液型者,亦可作成2液型者,尤以1液型者為適用。 The manufacturing method of the photocurable composition used in the present invention is not particularly limited, for example, by formulating a predetermined amount of the components (A), (B), (C), (D), and (E), and as required It can be manufactured by blending other blending substances and degassing. The preparation sequence of each component and other preparation materials is not particularly limited, and can be appropriately determined. The photocurable composition can be made into a one-liquid type as required, and can also be made into a two-liquid type, and especially a one-liquid type is suitable.

本發明之感壓接著劑係將由光硬化性組成物之硬化物所成的感壓接著層、與聚矽氧剝離紙積層而構成。感壓接著層可為僅由光硬化性組成物之硬化物所形成的無基材之感壓接著劑,亦可為基材之至少一面形成有光硬化性組成物之硬化物層的附有基材之感壓接著劑。而且,感壓接著劑可為將剝離紙之單面具有輕剝離層,另一面具有重剝離層之兩面施行有剝離處理之一片剝離紙、與感壓接著層予以積層而成的單隔片型,亦可為剝離紙之至少一面施行有剝離處理之二片剝離紙各自積層的雙隔片型。在使用本發明之感壓接著劑作為雙隔片型時,剝離紙係以感壓接著層之單面具有輕剝離層,且另一面具有重剝離層者為佳。感壓接著劑可以捲成滾輪狀之型態形成,亦可以積層薄片之型態形成。 The pressure-sensitive adhesive of the present invention is formed by laminating a pressure-sensitive adhesive layer made of a cured product of a photocurable composition and a silicone release paper. The pressure-sensitive adhesive layer may be a pressure-sensitive adhesive without a base material formed of only a hardened material of the photocurable composition, or may be an attachment of a hardened material layer having a photocurable composition formed on at least one side of the base material. Substrate pressure sensitive adhesive. In addition, the pressure-sensitive adhesive may be a single-separated type in which one side of the release paper has a light release layer and the other side has a heavy release layer. It may also be a double-separated type in which two release papers each having a release treatment on at least one side of the release paper are laminated. When the pressure-sensitive adhesive of the present invention is used as a double-separator type, it is preferable that the release paper has a light release layer on one side of the pressure-sensitive adhesive layer and a heavy release layer on the other side. The pressure-sensitive adhesive can be formed in the form of a roll, or it can be formed in the form of a laminated sheet.

作為剝離紙,例如可適當使用在剝離紙用基材之至少一面形成剝離處理層之剝離紙。作為如此剝離紙用基材,可列舉如:聚酯膜(聚對酞酸乙二酯膜等)、烯烴系樹脂膜、聚氯乙烯膜、聚醯亞胺膜、聚醯胺膜、螺縈膜等之塑膠系基材膜,及紙類(上質紙、日本和紙、牛皮紙、合成紙、面塗紙等)等。而且,可列舉出該等之層積層等經複數層化者(2至3層的複合體)等。 As the release paper, for example, a release paper in which a release treatment layer is formed on at least one side of a release paper substrate can be suitably used. Examples of such a base material for release paper include polyester films (such as polyethylene terephthalate films), olefin resin films, polyvinyl chloride films, polyimide films, polyimide films, and spiron Films, such as plastic-based substrate films, and paper (high-quality paper, Japanese paper, kraft paper, synthetic paper, top-coated paper, etc.). In addition, a plurality of layers (such as a complex of 2 to 3 layers) and the like such as a laminated layer are mentioned.

構成剝離處理層之剝離處理劑方面,已知有:聚矽氧系剝離處理劑、氟系剝離處理劑、長鏈烷基系剝離處理劑等。本發明中,基於剝離性之觀點,使用經聚矽氧系剝離處理劑處理之聚矽氧剝離紙。 As the release treatment agent constituting the release treatment layer, a polysiloxane-based release treatment agent, a fluorine-based release treatment agent, a long-chain alkyl-based release treatment agent, and the like are known. In the present invention, from the viewpoint of releasability, a silicone release paper treated with a silicone release treatment agent is used.

雙隔片型中使用之剝離紙係基於抑制分開(試圖剝離剝離紙時,有感壓接著劑之部分隨著一面的剝離紙而剝離,感壓接著層之其它部分隨著另一面的剝離紙而剝離)之觀點,以使用一面為重剝離層,另一面為輕剝離層之2片剝離紙為佳。輕剝離層係能以小於重剝離層之剝離力自感壓接著層剝離。另外,本說明書中,「重剝離層」及「輕剝離層」並非表示剝離強度之大小,而是2種剝離層之中,對感壓接著層之剝離力較大者稱為重剝離層、剝離力較小者稱為輕剝離層。而且,重剝離層對感壓接著層的剝離力、與輕剝離層對感壓接著層的剝離力之差並無特別限制,惟從較難以分開之觀點來看,相對於輕剝離層之剝離力,重剝離層之剝離力係以1.5倍以上者為佳,以2.0倍以上者更佳。而且,單隔片型中使用的兩面施行有剝離處理之剝離紙,從抑制分開之觀點來看,以單面為輕剝離層、另一面為重剝離層者為佳。 The release paper used in the double-separated type is based on suppression of separation (when trying to release the release paper, the pressure sensitive adhesive part is peeled off along with the release paper on one side, and the other parts of the pressure sensitive adhesive layer are peeled off along with the release paper on the other side From the viewpoint of peeling), it is preferable to use two release papers having one side as a heavy release layer and the other side as a light release layer. The light release layer is capable of self-adhesive pressure-sensitive adhesive layer peeling with a peel force smaller than that of the heavy release layer. In addition, in this specification, "heavy peeling layer" and "light peeling layer" do not indicate the magnitude of peeling strength, but among two kinds of peeling layers, the one having a larger peeling force to the pressure-sensitive adhesive layer is called a heavy peeling layer or peeling. Those with less force are called light peeling layers. In addition, the difference between the peeling force of the heavy release layer to the pressure-sensitive adhesive layer and the peeling force of the light release layer to the pressure-sensitive adhesive layer is not particularly limited, but from the viewpoint of being more difficult to separate, the peeling is relative to the light-peeling layer The peeling force of the heavy peeling layer is preferably 1.5 times or more, and more preferably 2.0 times or more. In addition, in the single-separator type, a release paper having a peeling treatment on both sides is preferred. From the standpoint of suppressing separation, it is preferable to use one side as a light release layer and the other side as a heavy release layer.

關於附有基材之感壓接著劑中使用之基材方面,作為黏著膠帶或薄片用之基材,可由習知之基材適當地選擇使用。基材方面,並無特別限制,可使用例如:聚對酞酸乙二酯等之塑膠系基材、鋁箔等之金屬系基材、不織布等之多孔質基材、上質紙等之紙基材、發泡薄片等之發泡基材。其中,從作業性之觀點來說,以塑膠系基材為佳。塑膠系基材係可藉由拉伸處理等而抑制伸長率等之變形性。 Regarding the substrate used in the pressure-sensitive adhesive with a substrate, as a substrate for an adhesive tape or a sheet, a conventional substrate can be appropriately selected and used. There is no particular limitation on the substrate. For example, plastic substrates such as polyethylene terephthalate, metal substrates such as aluminum foil, porous substrates such as non-woven fabrics, and paper substrates such as high-quality paper can be used. , Foamed substrates, etc. Among them, a plastic base material is preferred from the viewpoint of workability. The plastic base material is capable of suppressing deformability such as elongation by stretching.

附有基材之感壓接著劑中使用的基材表面係,為了提高與感壓接著層等的密接性,可施行常用的表面處理,例如:經電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理等之化學性或物理性的方法之氧化處理等。而且,亦可施行經底塗劑等的塗布處理等。 The surface of the substrate used in the pressure-sensitive adhesive with a substrate can be subjected to common surface treatments such as corona treatment, chromic acid treatment, ozone exposure, etc. in order to improve the adhesion with the pressure-sensitive adhesive layer. Oxidation treatment by chemical or physical methods such as flame exposure, high voltage electric shock exposure, ionizing radiation treatment, etc. In addition, a coating treatment such as a primer may be performed.

附有基材之感壓接著劑中使用的基材厚度,並無特別限制,可依照強度、柔軟度或使用目的等而適當地選擇,例如為10~1000μm,以10~50μm左右為佳。另外,基材可具有單層,或積層的任一種型態。 The thickness of the substrate used in the pressure-sensitive adhesive with a substrate is not particularly limited, and may be appropriately selected according to the strength, flexibility, purpose of use, and the like, for example, 10 to 1000 μm, and preferably about 10 to 50 μm. In addition, the substrate may have a single layer or any of a plurality of layers.

附有基材之感壓接著劑係在PET膜等之基材的至少一面上塗布光硬化性組成物,在照射紫外線等之光後,可藉由積層剝離紙而製造。而且,亦可將光硬化性組成物塗布在轉印基材並照射紫外線等之光後,轉印在基材而製造。 The pressure-sensitive adhesive with a substrate is coated with a photocurable composition on at least one side of a substrate such as a PET film, and can be produced by laminating a release paper after irradiating light such as ultraviolet rays. Further, the photocurable composition may be coated on a transfer substrate and irradiated with light such as ultraviolet rays, and then transferred to the substrate to produce it.

本發明中使用之感壓接著層係在剝離紙或基材上塗布光硬化性組成物,再藉由照射紫外線等之光而製造。而且,可將光硬化性組成物塗布在轉印基材並照射紫外線等之光後,轉印在剝離紙而製造。 The pressure-sensitive adhesive layer used in the present invention is produced by applying a photocurable composition on a release paper or a substrate and then irradiating light such as ultraviolet rays. In addition, the photocurable composition can be produced by applying the photocurable composition to a transfer substrate and irradiating light such as ultraviolet rays, and then transferring it to a release paper.

光硬化性組成物之塗布厚度係可適當地選擇,一般為1~500μm,以5~250μm左右為佳,以10~200μm左右為特佳。 The coating thickness of the photocurable composition can be appropriately selected, and is generally 1 to 500 μm, preferably about 5 to 250 μm, and particularly preferably about 10 to 200 μm.

在剝離紙或基材的至少一面上,將光硬化性組成物以輥塗機、模塗機、棒塗機、逗號塗布機、凹版塗布機、邁耶棒塗機等塗布。 The photocurable composition is applied on at least one side of the release paper or the substrate with a roll coater, a die coater, a bar coater, a comma coater, a gravure coater, a Meyer bar coater, or the like.

如此而將光硬化性組成物塗布在剝離紙或基材表面後,該經塗布的光硬化性組成物以紫外線等之光照射,使塗布在剝離紙或基材上之光硬化性組成物中的硬化性成分交聯硬化。此時,紫外線等之光的照射時間,一般為1秒鐘~300秒鐘,以1秒鐘~180秒鐘為佳。 After the photocurable composition is coated on the surface of a release paper or a substrate in this manner, the coated photocurable composition is irradiated with light such as ultraviolet rays, so that the photocurable composition coated on the release paper or the substrate is applied. The hardening component is crosslinked and hardened. At this time, the irradiation time of light such as ultraviolet rays is generally 1 second to 300 seconds, and preferably 1 second to 180 seconds.

本發明中所謂的光係指除了紫外線、可見光、紅外線等之光線、X射線、γ射線等之電磁波以外,亦包含電子束、質子束、中子束等之活性能量射線。 The light in the present invention refers to active energy rays including electron beams, proton beams, neutron beams, and the like in addition to electromagnetic waves such as ultraviolet rays, visible light, infrared rays, and X-rays and γ-rays.

從硬化速度、照射裝置之取得容易性、價格、在太陽光及一般照明下的操作容易性等之觀點來看,以經紫外線或電子束照射而硬化者為佳,以經紫外線照射而硬化者更佳。另外,紫外線亦包含g射線(波長436nm)、h射線(波長405nm)、i射線(波長365nm)等。活性能量射線源方面並無特別限定,惟根據使用之光鹼產生劑之性質,例如:係有高壓水銀燈、低壓水銀燈、電子束照射裝置、鹵素燈、發光二極體、半導體雷射、金屬鹵化物等。 From the viewpoints of curing speed, availability of irradiation equipment, price, and ease of operation under sunlight and general lighting, those cured by ultraviolet or electron beam irradiation are preferred, and those cured by ultraviolet irradiation Better. In addition, ultraviolet rays include g rays (wavelength 436 nm), h rays (wavelength 405 nm), i rays (wavelength 365 nm), and the like. There is no particular limitation on the active energy ray source, but according to the nature of the photo-alkali generator used, for example: high-pressure mercury lamp, low-pressure mercury lamp, electron beam irradiation device, halogen lamp, light-emitting diode, semiconductor laser, metal halide Things.

照射能量係可根據累積光量及光的照射時間而選擇。為了儘可能縮短光的照射時間,例如紫外線的情形,照明度係以10mW/cm2以上為佳,以50mW/cm2以上更佳,以100mW/cm2以上又更佳,以1,000mW/cm2以上為特佳。 The irradiation energy can be selected according to the amount of accumulated light and the irradiation time of the light. In order to shorten the irradiation time of light as much as possible, such as in the case of ultraviolet rays, the illumination is preferably 10 mW / cm 2 or more, more preferably 50 mW / cm 2 or more, 100 mW / cm 2 or more, and 1,000 mW / cm Above 2 is particularly good.

照射能量之上限並無特別限定,即使不必要照射光的情況下,亦浪費時間與成本,而有損及基材之情形,因此,照射度係以20,000mW/cm2以下為佳,以 10,000mW/cm2以下更佳,以8,000mW/cm2以下又更佳,以5,000mW/cm2以下再更佳,以3,000mW/cm2以下為特佳。 The upper limit of the irradiation energy is not particularly limited. Even if it is unnecessary to irradiate light, time and cost are wasted, and the substrate is damaged. Therefore, the irradiation intensity is preferably 20,000 mW / cm 2 or less, and 10,000 mW / cm 2 or less more preferably, 2 or less and more preferably 8,000mW / cm, at 5,000mW / cm 2 or less and still more preferably, at 3,000mW / cm 2 or less is particularly preferred.

透過如上之光照射,藉由光照射而迅速地進行交聯反應。更且,如此而製造之感壓接著劑係隔著剝離紙等而捲繞。感壓接著劑之寬度並無特別限制。以上,主要對於膠帶狀之感壓接著劑進行說明,惟亦可同樣地製造片狀之感壓接著片。更且,本發明中使用之感壓接著劑亦可作為雙面膠帶或雙面薄片等之雙面感壓接著劑來使用。 When the light is irradiated as described above, the crosslinking reaction is rapidly performed by the light. Furthermore, the pressure-sensitive adhesive produced in this way is wound through a release paper or the like. The width of the pressure-sensitive adhesive is not particularly limited. Although the tape-shaped pressure-sensitive adhesive has been mainly described above, a sheet-shaped pressure-sensitive adhesive sheet can also be produced in the same manner. Furthermore, the pressure-sensitive adhesive used in the present invention can also be used as a double-sided pressure-sensitive adhesive such as a double-sided tape or a double-sided sheet.

感壓接著劑一般為膠帶狀或薄片狀者。然而,亦可不使用膠帶或薄片而使直接存在於要接合的被黏物上。例如:可在塑膠成型品等之第1被黏物上塗布光硬化性組成物後,照射活性能量射線,在夾持經硬化而生成之感壓接著層的位置,將別的塑膠成型品等之第2被黏物與第1被黏物貼合。在照射活性能量射線後,光硬化性組成物並不立即完全硬化,在短時間內處於未硬化狀態。在此時間內,第2被黏物與第1被黏物貼合時,感壓接著劑容易滲透到被黏物中,可得到更充分的接合。而且,可在第1被黏物上塗布光硬化性組成物,照射活性能量射線後,積層剝離紙。此時,可使用分散器、對被黏物塗布之熱熔槍、鼓熔機等之附有加熱供給裝置的噴槍、配有加熱單元的分配器等。 The pressure-sensitive adhesive is generally tape-shaped or sheet-shaped. However, it is also possible to directly exist on the adherend to be bonded without using an adhesive tape or a sheet. For example, after coating a photocurable composition on a first adherend such as a plastic molded product, the active energy ray may be irradiated, and another plastic molded product may be held at a position where the pressure-sensitive adhesive layer generated by curing is held. The second adherend is bonded to the first adherend. After irradiating active energy rays, the photocurable composition does not completely harden immediately, and is in an uncured state in a short time. During this time, when the second adherend is bonded to the first adherend, the pressure-sensitive adhesive easily penetrates into the adherend, and a more sufficient joint can be obtained. Further, the first adherend can be coated with a photocurable composition, and after irradiating active energy rays, the paper can be laminated. In this case, a disperser, a spray gun with a heating supply device such as a hot-melt gun for coating the adherend, a drum melter, and a dispenser equipped with a heating unit can be used.

本發明之感壓接著劑係可利用在電氣/電子電路、電子零件、建材及/或汽車等之運輸機、土木工程 /建築、醫療或休閒的用途、標籤類等之辦公用品、影像顯示裝置的貼合等。另外,在土木工程/建築之用途方面,可列舉如:感壓接著片、防水片或防震片等。 The pressure-sensitive adhesive of the present invention can be used in electrical / electronic circuits, electronic parts, building materials and / or automobiles, transporters, civil engineering / construction, medical or leisure applications, office supplies for labels, image display devices, etc. Fitting and so on. In addition, civil engineering / building applications include pressure-sensitive adhesive sheets, waterproof sheets, and shock-proof sheets.

[實施例]     [Example]    

以下,列舉實施例以更具體地說明本發明,惟該等實施例僅為例示者,不應被限制性地闡釋。 In the following, the present invention is enumerated to illustrate the present invention more specifically, but these embodiments are only examples and should not be interpreted restrictively.

除非另有說明,數量平均分子量係依凝膠滲透層析儀(GPC)並以下述條件測定。實施例之說明中,係將在下述測定條件下以GPC測定,並用標準聚苯乙烯換算的最大頻率分子量稱為「數量平均分子量」。 Unless otherwise stated, the number average molecular weight is determined by a gel permeation chromatography (GPC) under the following conditions. In the description of the examples, the maximum frequency molecular weight measured by GPC under the following measurement conditions and converted by standard polystyrene is referred to as "number average molecular weight".

‧分析儀:Alliance(Waters公司製)、2410型示差折射檢測器(Waters公司製造)、996型多波長檢測器(Waters公司製)、Milleniam數據處理裝置(Waters公司製造) ‧Analyzers: Alliance (manufactured by Waters), 2410 differential refractometer (manufactured by Waters), 996 multi-wavelength detector (manufactured by Waters), Milleniam data processing device (manufactured by Waters)

‧管柱:Plgel GUARD+5μm混合C×3支(50×7.5mm,300×7.5mm:Polymer Lab公司製造) ‧Column: Plgel GUARD + 5μm mixed C × 3 (50 × 7.5mm, 300 × 7.5mm: manufactured by Polymer Lab)

‧流速:1mL/分鐘 ‧Flow rate: 1mL / min

‧經換算之聚合物:聚苯乙烯 ‧Converted polymer: polystyrene

‧測定溫度:40℃ ‧Measuring temperature: 40 ℃

‧GPC測定時之溶媒:THF ‧Solvent for GPC measurement: THF

(合成例1)末端具有三甲氧基矽基之聚氧伸烷基系聚合物A1之合成     (Synthesis Example 1) Synthesis of polyoxyalkylene-based polymer A1 having a trimethoxysilyl group at the end    

將乙二醇作為起始劑,在六氰鈷酸鋅-二甘醇二甲醚錯合物觸媒之存在下,使環氧丙烷反應,得到聚氧丙二醇。依照WO2015-088021之合成例2的方法,得到所得之聚氧丙二醇之末端具有烯丙基的聚氧伸烷基系 聚合物。對該聚合物,添加作為氫化矽化合物的三甲氧基矽烷與鉑乙烯基矽氧烷錯合物異丙醇溶液,使進行反應,得到末端具有三甲氧基矽基之聚氧伸烷基系聚合物A1。 Using ethylene glycol as a starting agent, propylene oxide was reacted in the presence of a zinc hexacyanocobaltate-diglyme complex catalyst to obtain polyoxypropylene glycol. According to the method of Synthesis Example 2 of WO2015-088021, a polyoxyalkylene polymer having an allyl group at the end of the obtained polyoxypropylene glycol was obtained. To this polymer, a solution of trimethoxysilane and platinum vinylsiloxane complex isopropanol as a hydrogenated silicon compound was added and reacted to obtain a polyoxyalkylene-based polymerization having a trimethoxysilyl group at the terminal.物 A1.

所得之末端具有三甲氧基矽基之聚氧伸烷基系聚合物A1之分子量以GPC測定之結果,峰頂分子量為25000,分子量分布為1.3。經1H-NMR測定之末端的三甲氧基矽基係每分子為1.7個。 The molecular weight of the obtained polyoxyalkylene-based polymer A1 having a trimethoxysilyl group at the end was measured by GPC. The peak top molecular weight was 25,000, and the molecular weight distribution was 1.3. The number of trimethoxysilyl groups at the end measured by 1H-NMR was 1.7 per molecule.

(合成例2)末端具有二甲氧基矽基之聚氧伸烷基系聚合物A2之合成     (Synthesis Example 2) Synthesis of polyoxyalkylene-based polymer A2 having a dimethoxysilyl group at the end    

將乙二醇作為起始劑,在六氰鈷酸鋅-二甘醇二甲醚錯合物觸媒之存在下,使環氧丙烷反應,得到聚氧丙二醇。依照WO2015-088021之合成例2的方法,得到所得之聚氧丙二醇之末端具有烯丙基的聚氧伸烷基系聚合物。對該聚合物,添加作為氫化矽化合物的甲基二甲氧基矽烷與鉑乙烯基矽氧烷錯合物異丙醇溶液,使進行反應,得到末端具有甲基二甲氧基矽基之聚氧伸烷基系聚合物A2。 Using ethylene glycol as a starting agent, propylene oxide was reacted in the presence of a zinc hexacyanocobaltate-diglyme complex catalyst to obtain polyoxypropylene glycol. According to the method of Synthesis Example 2 of WO2015-088021, a polyoxyalkylene polymer having an allyl group at the end of the obtained polyoxypropylene glycol was obtained. To this polymer, a solution of methyldimethoxysilane and platinum vinylsiloxane complex isopropanol as a hydrogenated silicon compound was added and reacted to obtain a polymer having a methyldimethoxysilyl terminal. Oxyalkylene polymer A2.

所得之末端具有二甲氧基矽基之聚氧伸烷基系聚合物A2之分子量以GPC測定之結果,峰頂分子量為5,000,分子量分布為1.3。經1H-NMR測定之末端的二甲氧基矽基係每分子為1.0個。 The molecular weight of the obtained polyoxyalkylene-based polymer A2 having a dimethoxysilyl group at the end was measured by GPC. The peak top molecular weight was 5,000, and the molecular weight distribution was 1.3. The number of dimethoxysilyl groups at the ends measured by 1H-NMR was 1.0 per molecule.

(合成例3)氟化聚合物C1之合成     (Synthesis example 3) Synthesis of fluorinated polymer C1    

將分子量約2,000的聚氧丙二醇作為起始劑,在六氰鈷酸鋅-二甘醇二甲醚錯合物觸媒之存在下, 使環氧丙烷反應,得到聚氧丙二醇。依照WO2015-088021之合成例2的方法,得到所得之聚氧丙二醇之末端具有烯丙基的聚氧伸烷基系聚合物。對該聚合物,添加作為氫化矽化合物的甲基二甲氧基矽烷與鉑乙烯基矽氧烷錯合物異丙醇溶液使反應,得到末端具有甲基二甲氧基矽基之聚氧伸烷基系聚合物A3。 Polyoxypropylene glycol having a molecular weight of about 2,000 was used as a starter, and propylene oxide was reacted in the presence of a zinc hexacyanocobaltate-diglyme complex catalyst to obtain polyoxypropylene glycol. According to the method of Synthesis Example 2 of WO2015-088021, a polyoxyalkylene polymer having an allyl group at the end of the obtained polyoxypropylene glycol was obtained. To this polymer, a solution of methyldimethoxysilane and platinum vinylsiloxane complex isopropanol as a hydrogenated silicon compound was added and reacted to obtain a polyoxysilane having a methyldimethoxysilyl terminal. Alkyl polymer A3.

所得之末端具有甲基二甲氧基矽基之聚氧伸烷基系聚合物A3之分子量以GPC測定之結果,峰頂分子量為15,000,分子量分布為1.3。經1H-NMR測定之末端的甲基二甲氧基矽基係每分子為1.7個。 The molecular weight of the obtained polyoxyalkylene-based polymer A3 having a methyldimethoxysilyl group at the terminal was measured by GPC. The peak top molecular weight was 15,000, and the molecular weight distribution was 1.3. The number of methyldimethoxysilyl groups at the end measured by 1H-NMR was 1.7 per molecule.

接著,使用BF3乙醚錯合物2.4g、脫水甲醇1.6g、聚合物A3 100g及甲苯5g,依照WO2015-088021之合成例4的方法,得到末端具有氟矽基之聚氧伸烷基系聚合物(以下稱為氟化聚合物C1)。測定所得氟化聚合物C1之1H-NMR光譜,對應於作為原料之聚合物的矽基亞甲基(-CH2-Si)的波峰(m,0.63ppm)消失,在低磁場側(0.7ppm~)出現寬峰。 Next, using 2.4 g of BF 3 ether complex, 1.6 g of dehydrated methanol, 100 g of polymer A3, and 5 g of toluene, according to the method of Synthesis Example 4 of WO2015-088021, polyoxyalkylene-based polymerization having a fluorosilyl group at the end was obtained (Hereinafter referred to as fluorinated polymer C1). When the 1H-NMR spectrum of the obtained fluorinated polymer C1 was measured, the peak (m, 0.63 ppm) corresponding to the silane methylene (-CH 2 -Si) of the polymer as a raw material disappeared, and the low magnetic field side (0.7 ppm ~) Broad peaks appear.

(實施例1~8、比較例1~9)     (Examples 1 to 8, Comparative Examples 1 to 9)    

如表1所示之調配比例,在裝設有攪拌機、溫度計、氮氣導入口及水冷冷凝器之燒瓶中,投入(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物及(B)增黏樹脂,在120℃下減壓攪拌,使增黏樹脂溶解。然後,投入(C)具有Si-F鍵之矽化合物、(D)光鹼產生劑及(E)數量平均分子量小於3,000之具有水解性矽基的化合物,進行減壓攪拌,得到實施例1之光硬化性 組成物。將所得之組成物的特性以下述方法進行評定。評定結果呈示於表1。而且,在評定光照射後之硬化性的試料中,經光照射而硬化者具有可作為感壓接著層使用之黏著性。更且,進行與實施例1之相同操作,調製實施例2~8之光硬化性組成物,與實施例1相同評定組成物之特性。其評定結果呈示於表1。而且,對於比較例1~9,除了變更如表2所示之調配以外,以與實施例1之相同方法調製光硬化性組成物,進行特性之評定。其結果呈示於表2。 As shown in Table 1, in a flask equipped with a stirrer, a thermometer, a nitrogen inlet, and a water-cooled condenser, put (A) an organic polymer with a crosslinkable silicon group and an average molecular weight of 3,000 or more ( B) Tackifying resin, stirred at 120 ° C under reduced pressure to dissolve the tackifying resin. Then, (C) a silicon compound having a Si-F bond, (D) a photobase generator, and (E) a compound having a hydrolyzable silicon group having a number-average molecular weight of less than 3,000, and stirred under reduced pressure to obtain Example 1 Photocurable composition. The characteristics of the obtained composition were evaluated by the following methods. The evaluation results are shown in Table 1. Moreover, among the samples for evaluating the hardenability after light irradiation, those who hardened by light irradiation have adhesiveness that can be used as a pressure-sensitive adhesive layer. Furthermore, the same operation as in Example 1 was performed to prepare the photocurable compositions of Examples 2 to 8, and the characteristics of the composition were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1. In addition, for Comparative Examples 1 to 9, the photocurable composition was prepared in the same manner as in Example 1 except that the formulation shown in Table 2 was changed, and the characteristics were evaluated. The results are shown in Table 2.

在表1及表2中,各調配物質之調配量係以g表示,其它的調配物質之細節係如下述。另外,軟化點係根據JIS K 2207(環球法)之值。 In Tables 1 and 2, the blending amount of each blending substance is expressed in g, and details of other blending substances are as follows. It should be noted that the softening point is a value according to JIS K 2207 (ring and ball method).

*1 SP值8.81、軟化點130℃、商品名「YS Polystar T130」,由安原化學公司製造 * 1 SP value 8.81, softening point 130 ° C, trade name "YS Polystar T130", manufactured by Anhara Chemical Co., Ltd.

*2 SP值9.32、軟化點125℃、商品名「YS Polystar K125」,由安原化學公司製造 * 2 SP value 9.32, softening point 125 ° C, trade name "YS Polystar K125", manufactured by Anhara Chemical Co., Ltd.

*3苯乙烯系單體/脂肪族系單體共聚物樹脂、軟化點95℃、商品名「FTR-6100」,由三井化學公司製造 * 3Styrenic monomer / aliphatic monomer copolymer resin, softening point: 95 ° C, trade name "FTR-6100", manufactured by Mitsui Chemicals

*4商品名「IRGACURE 379EG」之50%PC(碳酸伸丙酯)溶液、BASF公司製造 * 4 50% PC (propylene carbonate) solution with the trade name "IRGACURE 379EG", manufactured by BASF

*5商品名「KBM-403」、信越化學工業股份有限公司製造 * 5 Trade name "KBM-403", manufactured by Shin-Etsu Chemical Industry Co., Ltd.

*6商品名「KBM-3103C」、信越化學工業股份有限公司製造 * 6 Trade name "KBM-3103C", manufactured by Shin-Etsu Chemical Industry Co., Ltd.

*7商品名「KBM-503」、信越化學工業股份有限公司製造 * 7 Trade name "KBM-503", manufactured by Shin-Etsu Chemical Industry Co., Ltd.

*8商品名「KBM-3066」、信越化學工業股份有限公司製造 * 8 Trade name "KBM-3066", manufactured by Shin-Etsu Chemical Industry Co., Ltd.

*9商品名「矽酸乙酯28」、Colcoat股份有限公司製造 * 9 Trade name "Ethyl Silicate 28", manufactured by Colcoat Co., Ltd.

*10三氟化硼單乙胺之10%PC(碳酸伸丙酯)溶液 * 10 10% PC (propylene carbonate) solution of boron trifluoride monoethylamine

*11商品名「DBU」、San Apro股份有限公司製造 * 11 Trade name "DBU", manufactured by San Apro Co., Ltd.

*12商品名「AlumiChelate D」、川研精細化學股份有限公司製造 * 12 Trade name "AlumiChelate D", manufactured by Kawaken Fine Chemical Co., Ltd.

*13商品名「Neostan U-100」、日東化成工業股份有限公司製造 * 13 Trade name "Neostan U-100", manufactured by Nitto Chemical Industry Co., Ltd.

1)濕分穩定性(未照射UV時之濕分穩定性試驗)     1) Moisture stability (wet stability test without UV irradiation)    

在直徑100mm、高度1mm之圓筒型容器中,以使厚度成為1mm之方式,注入光硬化性組成物,在暗室中,23℃、50%RH的環境下,每5分鐘以手指觸摸確認光硬化性組成物之狀態。經8小時以上,手指觸摸後,手指上有附著物殘留時為○(亦即,光硬化性組成物呈現液體狀的情形)、經4小時以上且小於8小時,手指上無附著物殘留時為△、小於4小時,手指上無附著物殘留時為×(亦即,光硬化性組成物呈現凝膠狀、或固體狀的情形)。 Into a cylindrical container with a diameter of 100mm and a height of 1mm, inject the photohardenable composition so that the thickness is 1mm. In a dark room, at 23 ° C and 50% RH, touch the light every 5 minutes to confirm the light. The state of the hardening composition. After 8 hours or more, after the finger touches, there is an attachment remaining on the finger (that is, a case where the photocurable composition is liquid), and after 4 hours or more and less than 8 hours, there is no attachment remaining on the finger It is △ and less than 4 hours, and when there is no attached matter on the finger, it is × (that is, when the photocurable composition is gel-like or solid).

2)表面硬化性試驗     2) Surface hardening test    

在聚矽氧剝離紙上,以厚度成為200μm之方式,塗布光硬化性組成物,經UV照射[照射條件:UV-LED 365nm、照明度:1000mW/cm2、累積光量:3000mJ/cm2]後,立即在暗室中,23℃、50%RH的環境下,每分鐘以手指觸摸並測定表面到硬化為止之時間。除了(C)成分及(D)成分以外,調配其它的矽醇縮合反應促進觸媒之比較例3~7的試料在塗布後,在暗室中,23℃、50%RH的環境下,每分鐘以手指觸摸並測定表面硬化為止之時間。表面硬化時間小於1小時者,評定為「○」,1小時以上時評定為「×」。另外,比較例8及比較例9之試料並未硬化。 A polysilicone release paper was coated with a photocurable composition so that the thickness became 200 μm, and then UV-irradiated [irradiation conditions: UV-LED 365 nm, illumination: 1000 mW / cm 2 , cumulative light amount: 3000 mJ / cm 2 ] , Immediately in a dark room, 23 ° C, 50% RH, touch the surface with a finger every minute and measure the time until the surface hardens. In addition to the components (C) and (D), the samples of Comparative Examples 3 to 7 in which other silanol condensation reaction-promoting catalysts were prepared. After coating, the samples were applied in a dark room at 23 ° C and 50% RH per minute. Touch the finger and measure the time until the surface hardens. If the surface hardening time is less than 1 hour, it is rated as "○", and if it is more than 1 hour, it is rated as "X". In addition, the samples of Comparative Examples 8 and 9 were not hardened.

3)在聚矽氧剝離紙的適性試驗     3) Suitability test on silicone release paper    

在PET膜上,以厚度成為200μm之方式,塗布光硬化性組成物,在照射UV[照射條件:UV-LED365nm、照明度:1000mW/cm2、累積光量:3000mJ/cm2]後,立即與聚矽氧剝離紙(OjiF-Tex股份有限公司製造;N-64-GPS)貼合。然後,在50℃熟化24小時。而且,亦調製不與剝離紙貼合而在50℃熟化24小時之試料。熟化後,以手剝下剝離紙,以手指觸摸評定感壓接著層的黏性。相較於不與剝離紙貼合的感壓接著層,黏性不降低者為◎、黏性降低者為○、不易以手剝下剝離紙或黏性幾乎消失者為×。 On the PET film, a photocurable composition was applied so that the thickness became 200 μm, and immediately after irradiation with UV [irradiation conditions: UV-LED365nm, illuminance: 1000mW / cm 2 , cumulative light amount: 3000mJ / cm 2 ], Silicone release paper (manufactured by OjiF-Tex Corporation; N-64-GPS) is bonded. Then, it aged at 50 degreeC for 24 hours. In addition, a sample was prepared for 24 hours at 50 ° C without sticking to the release paper. After the curing, the release paper was peeled off by hand, and the tackiness of the pressure-sensitive adhesive layer was evaluated by finger touch. Compared with the pressure-sensitive adhesive layer not bonded to the release paper, the non-reduced tackiness was ◎, the reduced tackiness was ○, and it was difficult to peel off the release paper by hand or the tackiness almost disappeared was ×.

4)在聚矽氧剝離紙的分開試驗     4) Separation test on silicone release paper    

對於實施例1之感壓接著劑,在聚矽氧重剝離紙(Oji F-Tex股份有限公司製造;N-80-GS)上,以厚度成為200μm之方式,塗布光硬化性組成物,在照射UV[照射條件:UV-LED365nm、照明度:1000mW/cm2、累積光量:3000mJ/cm2]後,立即與聚矽氧輕剝離紙(Oji F-Tex股份有限公司製造;N-64-GPS)貼合。然後,在50℃熟化24小時。熟化後,以手剝下聚矽氧輕型剝離紙,輕易分開者為○、不易分開者為×。 The pressure-sensitive adhesive of Example 1 was coated with a photocurable composition on a polysiloxane heavy-duty paper (manufactured by Oji F-Tex Co., Ltd .; N-80-GS) so that the thickness became 200 μm. After irradiating UV [irradiation conditions: UV-LED365nm, illumination: 1000mW / cm 2 , cumulative light amount: 3000mJ / cm 2 ], immediately with a silicone light release paper (manufactured by Oji F-Tex Corporation; N-64- GPS) fit. Then, it aged at 50 degreeC for 24 hours. After curing, the silicone light release paper is peeled off by hand. Those who are easy to separate are ○ and those who are not easy to separate are ×.

如表1所示,實施例中之感壓接著劑之任一者,與聚矽氧剝離紙之剝離性均佳,所使用之硬化性組成物因空氣中之濕分而發生硬化,亦即,除了塗布時之安定性優異,且透過光的照射而迅速地進行交聯反應而易於製造。而且,評定光照射後之硬化性的試料中,因光照射而硬化的試料具有可作為感壓接著層使用之黏著性。 As shown in Table 1, any of the pressure-sensitive adhesives in the examples had good releasability from the silicone release paper, and the hardening composition used was hardened due to moisture in the air, that is, In addition to being excellent in stability at the time of coating, it is easy to manufacture because it undergoes a rapid crosslinking reaction through the irradiation of light. In addition, among the samples for evaluating the hardenability after light irradiation, the sample hardened by light irradiation has adhesiveness that can be used as a pressure-sensitive adhesive layer.

以上,說明了本發明之實施型態及實施例,惟上述所記載之實施型態及實施例並不限定申請專利範圍的發明。而且,應當注意,實施型態及實施例中所說明的特徵組合之全部並非僅限於解決本發明之課題的手段。 The embodiments and examples of the present invention have been described above, but the above-mentioned embodiments and examples do not limit the scope of the invention for which the patent is applied. Furthermore, it should be noted that all of the feature combinations described in the implementation modes and the embodiments are not limited to the means for solving the problems of the present invention.

Claims (6)

一種感壓接著劑,係由感壓接著層、與聚矽氧剝離紙積層而成者,其具有含有下述(A)、(B)、(C)、(D)及(E)之光硬化性組成物的硬化物:(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物、(B)增黏樹脂、(C)具有Si-F鍵之矽化合物、(D)光鹼產生劑、(E)數量平均分子量小於3,000之具有水解性矽基的化合物。     A pressure-sensitive adhesive, which is formed by laminating a pressure-sensitive adhesive layer and a silicone release paper, and has light containing the following (A), (B), (C), (D), and (E) Hardened product of hardening composition: (A) organic polymer having crosslinkable silicon group in number average molecular weight of 3,000 or more, (B) tackifying resin, (C) silicon compound having Si-F bond, (D) Photobase generator, (E) A compound having a hydrolyzable silicon group having a number average molecular weight of less than 3,000.     如請求項1之感壓接著劑,其中上述(A)數量平均分子量3,000以上之具有交聯性矽基的有機聚合物係具有交聯性矽基之聚氧伸烷基系聚合物。     The pressure-sensitive adhesive according to claim 1, wherein the (A) organic polymer having a cross-linkable silicon group having a number average molecular weight of 3,000 or more is a polyoxyalkylene-based polymer having a cross-linkable silicon group.     如請求項1或2之感壓接著劑,其中上述(B)增黏樹脂係萜烯酚樹脂及/或芳香族系石油樹脂。     The pressure-sensitive adhesive according to claim 1 or 2, wherein the (B) tackifying resin-based terpene phenol resin and / or aromatic petroleum resin.     如請求項1至3中任一項之感壓接著劑,其中上述(C)具有Si-F鍵之矽化合物係具有Si-F鍵之有機聚合物。     The pressure-sensitive adhesive according to any one of claims 1 to 3, wherein (C) the silicon compound having a Si-F bond is an organic polymer having a Si-F bond.     如請求項1至4中任一項之感壓接著劑,其中聚矽氧剝離紙係一面具有輕剝離層、另一面具有重剝離層之聚矽氧剝離紙。     The pressure-sensitive adhesive according to any one of claims 1 to 4, wherein the silicone release paper is a silicone release paper having a light release layer on one side and a heavy release layer on the other side.     如請求項1至4中任一項之感壓接著劑,其中在感壓接著劑層之一面積層具有輕剝離層之聚矽氧剝離紙,在另一面積層具有重剝離層之聚矽氧剝離紙而成。     The pressure-sensitive adhesive according to any one of claims 1 to 4, wherein a silicone release paper having a light release layer is provided on one area of the pressure-sensitive adhesive layer, and a silicone release having a heavy release layer is provided on the other area. Made of paper.    
TW106124692A 2016-07-25 2017-07-24 Pressure sensitive adhesive TW201821564A (en)

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