TW201821530A - Liquid crystal polyester composition and resin molded article using the same - Google Patents

Liquid crystal polyester composition and resin molded article using the same Download PDF

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TW201821530A
TW201821530A TW106128382A TW106128382A TW201821530A TW 201821530 A TW201821530 A TW 201821530A TW 106128382 A TW106128382 A TW 106128382A TW 106128382 A TW106128382 A TW 106128382A TW 201821530 A TW201821530 A TW 201821530A
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liquid crystal
crystal polyester
polyester composition
mass
filler
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TW106128382A
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TWI755421B (en
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藤田泰之
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日商住友化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04Polyesters derived from hydroxycarboxylic acids, e.g. lactones

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A liquid crystal polyester composition comprising an liquid crystal polyester, a hollow filler, a fibrous filler having a number average fiber length of 20 [mu]m or more and less than 190 [mu]m.

Description

液晶聚酯組成物及使用此之樹脂成形體Liquid crystal polyester composition and resin molded body using the same

[0001] 本發明係有關液晶聚酯組成物及使用此之樹脂成形體者。   本申請案係基於2016年8月24日向日本提出申請之申請號2016-164026號主張優先權,其內容援用於本文。[0001] The present invention relates to a liquid crystal polyester composition and a resin molded body using the same. The present application claims priority based on Application No. 2016-164026, filed on Jan.

[0002] 作為電子零件用連接器已知有例如CPU插座。CPU插座係指用以將CPU(Central Processing Unit,中央處理裝置)以可裝卸於電子電路基板之形態安裝之連接器。CPU插座可藉由例如流動性、耐熱性等優異之樹脂形成。作為此等樹脂,已知係採用液晶聚酯。然而,使用該等樹脂成形時,易發生龜裂,該龜裂之發生有成為問題之情況。   [0003] CPU插座具有與CPU之各連接銷對應之多數銷插入孔,形成格子。例如作為適於桌上型電腦之製品已知有具有1000~2000根左右之連接銷之CPU,又,作為適於伺服器之製品,亦已知具有超過3000根連接銷之CPU。   [0004] CPU之連接銷係於其CPU底面配置為例如矩陣狀。該等連接銷之間距具有連接銷數越多越小的傾向。連接銷之間距越小,銷插入孔之間距亦減少,區分銷插入孔彼此之壁寬變窄。因此,於CPU插座,銷插入孔越多則回焊加熱後於銷插入孔之周邊亦發生龜裂,該龜裂之發生有成為問題之情況。   [0005] 又,為了增加連接銷之數,CPU插座有大型化之傾向。作為大型CPU插座,已知有例如適用一片長度超過70mm之伺服器之CPU插座等。大型化之CPU插座中,有起因於殘留應力(內部應力)之回焊加熱後之翹曲成為問題之情況。且大型CPU插座之翹曲於使用上述樹脂成形時亦會成為問題。   [0006] 可減低CPU插座中之龜裂或翹曲發生之組成物為已知(例如專利文獻1)。專利文獻1中,揭示使用複合樹脂組成物作為連接器之形成材料,該複合樹脂組成物包含液晶性聚合物、板狀無機填充劑及重量平均纖維長為250~600μm之纖維狀填充劑(以下稱為「長纖維填充材」)。揭示藉由添加長纖維填充材而獲得成形性、平面度(平坦度)、橇變形、耐熱性等之性能優異的平面狀連接器。 [先前技術文獻] [專利文獻]   [0007]   [專利文獻1] 日本特開2010-003661號公報[0002] As a connector for an electronic component, for example, a CPU socket is known. The CPU socket is a connector for mounting a CPU (Central Processing Unit) in a form detachable from an electronic circuit board. The CPU socket can be formed by a resin excellent in fluidity, heat resistance, and the like. As such resins, liquid crystal polyesters are known. However, when these resins are used for molding, cracks are likely to occur, and the occurrence of such cracks may be a problem. [0003] The CPU socket has a plurality of pin insertion holes corresponding to the respective connection pins of the CPU to form a lattice. For example, a CPU having a connection pin of about 1000 to 2000 is known as a product suitable for a desktop computer, and a CPU having more than 3,000 connection pins is also known as a product suitable for a server. [0004] The connection pins of the CPU are arranged on the bottom surface of the CPU, for example, in a matrix shape. The distance between the connecting pins tends to be smaller as the number of connecting pins increases. The smaller the distance between the connecting pins, the smaller the distance between the pin insertion holes, and the narrower the wall width of the area distribution insertion holes. Therefore, in the CPU socket, the more the pin insertion hole is, the more the crack is generated around the pin insertion hole after reflow heating, and the occurrence of the crack may be a problem. [0005] Moreover, in order to increase the number of connection pins, the CPU socket has a tendency to increase in size. As a large CPU socket, for example, a CPU socket or the like for a server having a length of more than 70 mm is known. In a large-sized CPU socket, there is a problem that warping after reflow heating due to residual stress (internal stress) becomes a problem. Moreover, warpage of a large CPU socket may also become a problem when molding using the above resin. [0006] A composition that can reduce occurrence of cracks or warpage in a CPU socket is known (for example, Patent Document 1). Patent Document 1 discloses a composite resin composition comprising a liquid crystalline polymer, a plate-like inorganic filler, and a fibrous filler having a weight average fiber length of 250 to 600 μm (hereinafter referred to as a connector). It is called "long fiber filler"). It is disclosed that a planar connector having excellent properties such as moldability, flatness (flatness), slack deformation, and heat resistance is obtained by adding a long fiber filler. [Prior Art Document] [Patent Document] [0007] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-003661

[發明欲解決之課題]   [0008]   然而,即使使用專利文獻1中記載之複合樹脂組成物,仍無法充分減低龜裂或翹曲之發生。又,上述連接器以外,於具有壁厚較小的部分的成形體或大型成形體等中,與連接器同樣,龜裂或翹曲之發生亦成為問題。   [0009] 本發明係鑑於此等情況而完成者,目的在於提供可成形耐龜裂性及翹曲耐性優異之連接器的液晶聚酯組成物及使用其之樹脂成形體。 [用以解決課題之手段]   [0010] 為達成該目的,本發明人等針對連接器之形成材料的組成進行檢討,因而完成本發明。   [0011] 本發明之一態樣係提供一種液晶聚酯組成物,其包含液晶聚酯、中空狀填充材、數平均纖維長為20μm以上且未達190μm之纖維狀填充材。   [0012] 本發明一態樣中,較好中空狀填充材係數平均粒徑為5μm以上且100μm以下。   [0013] 本發明一態樣中,纖維狀填充材係數平均纖維徑為5μm以上且20μm以下。   [0014] 本發明一態樣中,較好液晶聚酯係對於液晶聚酯之全部重複單位含有30莫耳%以上之下述構造單位:   [0015]。   [0016] 本發明一態樣中,較好於100℃之容積比熱為1.0J/cm3 K以上3.0J/cm3 K以下。   [0017] 本發明一態樣係提供一種樹脂成形體,其係以上述之液晶聚酯組成物所形成。   [0018] 本發明一態樣中,上述樹脂成形體較好係連接器。   [0019] 亦即,本發明包含以下態樣。   [1] 一種液晶聚酯組成物,其包含液晶聚酯、中空狀填充材、數平均纖維長為20μm以上且未達190μm之纖維狀填充材。   [2] 如[1]之液晶聚酯組成物,其中前述中空狀填充材係數平均粒徑為5μm以上且100μm以下。   [3] 如[1]或[2]之液晶聚酯組成物,其中前述纖維狀填充材係數平均纖維徑為5μm以上且20μm以下。   [4] 如[1]~[3]中任一項之液晶聚酯組成物,其中前述液晶聚酯係對於前述液晶聚酯之全部重複單位之合計莫耳數含有30莫耳%以上之下述構造單位:。   [5] 如[1]~[4]中任一項之液晶聚酯組成物,其於100℃之容積比熱為1.0J/cm3 K以上3.0J/cm3 K以下。   [6] 一種樹脂成形體,其係以如[1]~[5]中任一項之液晶聚酯組成物所形成。   [7] 如[6]之樹脂成形體,其係連接器。 [發明效果]   [0020] 依據本發明一態樣,係提供可成形耐龜裂性及翹曲耐性優異之樹脂成形體的液晶聚酯組成物及使用其之樹脂成形體,尤其是連接器。[Problems to be Solved by the Invention] However, even if the composite resin composition described in Patent Document 1 is used, the occurrence of cracks or warpage cannot be sufficiently reduced. In addition, in the molded body or the large molded body having a small wall thickness, the occurrence of cracks or warpage is also a problem similar to the connector. The present invention has been made in view of the above circumstances, and an object of the invention is to provide a liquid crystal polyester composition of a connector which is excellent in crack resistance and warpage resistance, and a resin molded body using the same. [Means for Solving the Problem] In order to achieve the object, the inventors of the present invention have reviewed the composition of the material for forming the connector, and have completed the present invention. [0011] An aspect of the present invention provides a liquid crystal polyester composition comprising a liquid crystal polyester, a hollow filler, and a fibrous filler having a number average fiber length of 20 μm or more and less than 190 μm. [0012] In one aspect of the invention, it is preferred that the hollow filler material has an average particle diameter of 5 μm or more and 100 μm or less. [0013] In one aspect of the invention, the fibrous filler material has an average fiber diameter of 5 μm or more and 20 μm or less. [0014] In one aspect of the present invention, it is preferred that the liquid crystal polyester contains 30 mol% or more of the following structural units for all repeating units of the liquid crystal polyester: [0015] . [0016] In one aspect of the invention, the specific heat at a volume of preferably 100 J is 1.0 J/cm 3 K or more and 3.0 J/cm 3 K or less. [0017] An aspect of the present invention provides a resin molded body formed by the above liquid crystal polyester composition. [0018] In one aspect of the invention, the resin molded body is preferably a connector. That is, the present invention encompasses the following aspects. [1] A liquid crystal polyester composition comprising a liquid crystal polyester, a hollow filler, and a fibrous filler having a number average fiber length of 20 μm or more and less than 190 μm. [2] The liquid crystal polyester composition according to [1], wherein the hollow filler has a coefficient average particle diameter of 5 μm or more and 100 μm or less. [3] The liquid crystal polyester composition according to [1] or [2], wherein the fibrous filler material has an average fiber diameter of 5 μm or more and 20 μm or less. [4] The liquid crystal polyester composition according to any one of [1] to [3] wherein the liquid crystal polyester contains 30 mol% or more of the total number of moles of all repeating units of the liquid crystal polyester. Construction unit: . [5] The liquid crystal polyester composition according to any one of [1] to [4], wherein the specific heat at 100 ° C is 1.0 J/cm 3 K or more and 3.0 J/cm 3 K or less. [6] A resin molded body formed by the liquid crystal polyester composition according to any one of [1] to [5]. [7] The resin molded body according to [6], which is a connector. [Effect of the Invention] According to one aspect of the present invention, there is provided a liquid crystal polyester composition which can form a resin molded article excellent in crack resistance and warpage resistance, and a resin molded body using the same, particularly a connector.

[0022] <樹脂成形體>   本實施形態之樹脂成形體係由後述之液晶聚酯組成物所形成。作為本實施形態之樹脂成形體舉例為例如連接器、插座、繼電器、繞線管、光擷取器、振盪器、電腦相關零件等之電性.電子零件;IC繼電器等之半導體製造製程相關零件;VTR、電視、電熨斗、空調、收音機、吸塵器、冰箱、電鍋、照明器具等之家庭電氣製品零件;光碟、雷射光碟(註冊商標)、喇叭等之音響製品零件;電話、傳真機、調制解調器等之通訊機器零件;加熱器支架等之影印機、印刷機相關零件;葉輪、風扇齒輪、齒輪、軸承、馬達零件及外殼等之機械零件;微波調理用鍋、耐熱餐具等之調理用器具;地板材、壁材等之隔熱、隔音用材料、樑、柱等之支撐材料、屋頂材等之建築材料、或土木建築用材料;飛機零件、航太機器用零件;原子爐等之放射線設施構件、海洋設施構件、洗淨用治具、軟管類、噴嘴類、感測器類零件、運動用品、休閒娛樂用品等。作為以液晶聚酯組成物形成之樹脂成形體,其中較好為連接器。其理由係由於連接器存在有壁厚非常小的成形部分(參考後述之圖2的最小壁厚部201),故可顯著見到翹曲或龜裂之改善效果。   [0023] <連接器>   以下,針對本發明一實施形態,以連接器為CPU插座之情況為例,參考圖1A、圖1B及圖2加以說明。   例如,本發明一實施形態之連接器,作為一觀點,包含開口部、外框部、內框部、銷插入孔與最小壁厚部。   [0024] 圖1A及圖1B係顯示本實施形態之連接器構造的圖,圖1A係俯視圖,圖1B係圖1A的A-A線剖面圖。且圖2係圖1A中之區域B所示部分之放大圖。   [0025] 如圖1A、圖1B及圖2所示,本實施形態之連接器100係呈俯視正方形之板狀,於中央具有正方形之開口部101。連接器100之外周部分及內周部分係背面形成為凸狀,構成外框部102及內框部103。又,於外框部102及內框部103所包圍之區域,以矩陣狀設有2544個銷插入孔104。銷插入孔104形成為水平剖面為正方形。其結果,區分銷插入孔104彼此之部分亦即最小壁厚部201之形狀全體成為格子狀。   [0026] 連接器100之外形尺寸可根據目的任意設定,但可為例如72mm×72mm,開口部101之尺寸為例如28mm×28mm。連接器100之厚度,於外框部102及內框部103為5mm,外框部102與內框部103所包圍之區域(亦即圖2之放大圖中最小壁厚部201之厚度)為3mm。銷插入孔104之剖面尺寸係0.6mm×0.6mm,間距(亦即銷插入孔104之剖面的寬度與鄰接之銷插入孔104彼此之最短距離的和)為1mm。且,最小壁厚部201之寬度(亦即鄰接之銷插入孔104彼此之最短距離)為0.33mm。   又,此處所示之尺寸為一例,銷插入孔104之數亦可根據目的任意設定。   例如連接器,作為一觀點,外形尺寸可為(30mm~75mm)×(40mm~85mm),開口部之尺寸為(8mm~30mm)×(8mm~30mm)。連接器厚度於外框部及內框部可為3~5mm,由該等所挾持之區域(亦即最小壁厚部之厚度)可為1~4mm。連接器之銷插入孔之剖面尺寸可為0.5~1.5mm,間距可為0.5~1.5mm,最小壁厚部之寬度可為0.1~1.0mm。   [0027] 本實施形態之連接器係上述樹脂成形體之一,係自後述之液晶聚酯組成物藉由射出成形法而形成。以下針對本實施形態之液晶聚酯組成物詳細說明。   [0028] <液晶聚酯組成物> [液晶聚酯]   本實施形態之液晶聚酯組成物包含液晶聚酯。   本實施形態之液晶聚酯係熱致性液晶聚合物之一。熱致性液晶聚合物於270℃以上400℃以下之溫度形成異向性熔融體。液晶聚酯較好為藉由芳香族羥基羧酸、芳香族二羧酸及芳香族二醇聚合而得。   [0029] 又,為了更容易地製造液晶聚酯,亦可藉由使芳香族羥基羧酸、芳香族二羧酸及芳香族二醇等之原料單體的一部分形成酯形成性衍生物後予以聚合。   [0030] 作為酯形成性衍生物可舉例為例如以下者。   [0031] 作為酯形成性衍生物,可舉例為如芳香族羥基羧酸及芳香族二羧酸之分子內具有羧基之化合物。作為此等酯形成性衍生物,有使羧基轉化成高反應性之醯鹵基或酸酐等之基者,或如使羧基藉由酯交換反應生成聚酯般之轉化為酯者等。   [0032] 再者,作為酯形成性衍生物,可舉例為如芳香族羥基羧酸及芳香族二醇般之具有酚性羥基者。作為此等酯形成性衍生物有藉由使酚性羥基轉化為酯,藉由酯交換反應進行聚酯生成者等。   [0033] 關於自此等酯形成性衍生物製造液晶聚酯之方法將於後述。   [0034] 以下,針對本實施形態之液晶聚酯之構造單位說明具體例。   [0035] 作為源自芳香族羥基羧酸之構造單位係如下者。如後述,本實施形態中,針對使用構造單位(A1 )及(A2 )之情況加以說明。   此處所謂「源自」意指用以聚合而自原料單體使化學構造產生變化。   [0036][0037] 該等構造單位亦可為位於芳香環之氫原子之一部分經選自鹵原子、烷基及芳基之至少1個取代基取代。   [0038] 作為源自芳香族二羧酸之構造單位有如下者。如後述,本實施形態中,針對使用構造單位(B1 )、(B2 )及(B3 )之情況加以說明。   [0039][0040] 該等構造單位亦可為位於芳香環之氫原子之一部分經選自鹵原子、烷基及芳基之至少1個取代基取代。   [0041] 作為源自芳香族二醇之構造單位有如下者。如後述,本實施形態中,針對使用構造單位(C1 )及(C3 )之情況加以說明。   [0042][0043] 該等構造單位亦可為位於芳香環之氫原子之一部分經選自鹵原子、烷基及芳基之至少1個取代基取代。   [0044] 又,該等構造單位中,作為取代基之鹵原子舉例為氟原子、氯原子或溴原子。且作為取代基之烷基舉例為甲基、乙基、丁基等之碳數1~4左右之低級烷基。又作為取代基之芳基舉例為苯基等。   [0045] 其次,針對上述構造單位之較佳組合加以說明。   [0046] 本實施形態中,上述液晶聚酯之構造單位較好以下述[a]~[f]之任一者所示之組合使用。   [a]:(A1 )、(B1 )或(B2 )或(B1 )與(B2 )兩者、及(C1 )之組合。   [b]:(A1 )與(A2 )之組合。   [c]:上述[a]之組合中,(A1 )之一部分經(A2 )置換者。   [d]:上述[a]之組合中,(B1 )之一部分經(B3 )置換者。   [e]:上述[a]之組合中,(C1 )之一部分經(C3 )置換者。   [f]:於上述[b]之組合中,加上(B1 )及(C1 )者。   [0047] 該等組合之[a]~[f]中,特佳為組合之[a],即自對羥基苯甲酸衍生之構造單位(對應於上述構造單位(A1 ))、自4,4’-二羥基聯苯衍生之構造單位(對應於上述構造單位(C1 ))、自對苯二甲酸衍生之構造單位、自間苯二甲酸衍生之構造單位或對苯二甲酸衍生之構造單位與自間苯二甲酸衍生之構造單位(對應於上述構造單位(B1 )、上述構造單位(B2 )或上述構造單位(B1 )與(B2 ))之組合所成之液晶聚酯。再者,該組合中,較好構造單位(A1 )與構造單位(C1 )之莫耳比率(C1 )/(A1 )為0.2以上1.0以下,且構造單位(C1 )相對於構造單位(B1 )與構造單位(B2 )之合計的莫耳比率{(B1 )+(B2 )}/(C1 )為0.9以上1.1以下。此外,構造單位(B1 )與構造單位(B2 )之莫耳比率(B2 )/(B1 )較好大於0且1以下,又更好大於0且0.3以下。   [0048] 本實施形態之液晶聚酯較好對於液晶聚酯之全部重複單位之合計莫耳數含有30莫耳%以上80莫耳%以下之上述構造單位(A1 )。   [0049] 本實施形態之液晶聚酯之流動起始溫度較好為270℃~400℃,更好為280℃~380℃。其理由為流動起始溫度落於此等範圍時,液晶聚酯組成物之流動性變良好,同時耐熱性(成形體為插座等之電子零件時,為耐焊接性)變良好。再者,流動起始溫度為上述範圍時,為了自液晶聚酯獲得成形體而進行熔融成形時,難以產生熱劣化。   [0050] 又,本實施形態中,流動起始溫度係定義為「使用具備內徑為1mm長度為10mm之噴嘴的毛細管流變儀,於9.8MPa(100Kg/cm2 )之荷重下以升溫速度4℃/分鐘自噴嘴擠出液晶聚酯之加熱熔融體時,顯示熔融黏度為4800Pa.秒(亦即48000泊)之溫度」。此等定義係作為液晶聚酯之分子量標準,為本技藝者所週知(例如參考小出直之編,「液晶聚合物-合成.成形.應用-」,95-105頁,CMC,1987年6月5日發行)。   [0051] 本實施形態之液晶聚酯由於於高分子鏈導入剛直部位,高分子彼此之絡合少,故黏度低,成形加工時之流動性優異。因此,亦可適用於以往之樹脂難以加工之具有薄壁構造或微細構造之成形品。   [0052] 又,本實施形態之液晶聚酯之耐藥品性、難燃性亦優異,尤其是難燃性即使無難燃劑亦可達成UL94 V-0。   [0053] 上述液晶聚酯含量相對於本實施形態之液晶聚酯組成物總質量,較好為55~75質量%。   [0054] 本實施形態之液晶聚酯組成物,其於100℃之容積比熱較好為1.0J/cm3 K以上3.0J/cm3 K以下,可為1.50J/cm3 K以上2.0J/cm3 K以下,亦可為1.62J/cm3 K以上1.95J/cm3 K以下。   本說明書中,「液晶聚酯組成物之容積比熱」係自針對液晶聚酯組成物依據JIS K7123:2012測定之比熱容量(單位:J/gK)與密度基於下式算出之值。   容積比熱(J/cm3 K)=比熱容量(J/gK)×密度(g/cm3 )   [0055] 又,本說明書中,「液晶聚酯組成物之比熱容量」可採用藉由島津製作所股份有限公司製之示差掃描熱量測定裝置「DSC-50」測定之值。另一方面,液晶聚酯組成物之密度可採用關東測量股份有限公司製之固體比重計「ASG-320K」測定之值。   [0056] 本實施形態中,「液晶聚酯組成物之容積比熱」意指成為冷卻速度指標之每單位體積之熱容量。後述之液晶聚酯組成物之容積比熱與自該液晶聚酯組成物形成之樹脂成形體之容積比熱有相關性,液晶聚酯組成物之容積比熱越小,成形時可有效地冷卻。關於減小液晶聚酯組成物之容積比熱將於後述。   [0057] [中空狀填充材]   本實施形態之液晶聚酯組成物包含中空狀填充材與纖維狀填充材。   [0058] 本實施形態使用之中空狀填充材之材質並未特別限制,但舉例為例如玻璃、氧化矽、氧化鋁等之無機材料;脲樹脂、酚樹脂等之有機材料。   [0059] 中空狀填充材可根據需要為2種以上之混合材料,亦可為2種以上之輕量功能性填充劑。所謂「輕量功能性填充劑」係指以輕量化為目的而於內部具有空間之填充劑。作為輕量功能性填充劑舉例為例如多孔質陶瓷粒子、發泡性粒子、中空粒子等。   該等中,基於耐熱性或強度之觀點,中空狀填充材之材質較好為玻璃。亦即,作為中空狀填充材較好使用所謂稱為玻璃球之中空粒子。   [0060] 藉由添加中空狀填充材,可減小液晶聚酯組成物之容積比熱。以往之液晶聚酯組成物,基於射出成形所用之模具構造上之理由,有可能易冷卻之部分與不易冷卻之部分。藉此,會有先固化之部分因隨後固化之部分收縮而破壞(發生龜裂)之情況。   [0061] 相對於此,本實施形態之液晶聚酯組成物由於容積比熱比以往液晶聚酯組成物小,故射出成形時可使液晶聚酯組成物有效地冷卻。因此,由於液晶聚酯組成物全體均一冷卻,故可減低伴隨液晶聚酯組成物之固化而收縮所引起之龜裂發生。   [0062] 本實施形態使用之中空狀填充材之數平均粒徑較好為5μm以上100μm以下,更好為10μm以上100μm以下。中空狀填充材之數平均粒徑未達5μm時,不僅無法充分抑制液晶聚合物(液晶聚酯)之配向,且樹脂成形體之空隙率降低而無法充分發揮中空狀填充材之降低容積比熱之效果。因此,有使樹脂成形體之翹曲變形量變大之情況。   [0063] 又,中空狀填充材之數平均粒徑大於100μm時,不僅於液晶聚酯組成物中無法均一分散中空狀填充材,且亦有因中空狀填充材之耐壓強度變低故使破碎率變大之情況。中空狀填充材之分佈產生偏置,破碎率變大時,由於無法充分發揮中空狀填充材之降低容積比熱之效果,故有無法充分抑制龜裂發生之情況。   亦即,中空狀填充材之數平均粒徑為上述範圍時,可充分抑制液晶聚合物(液晶聚酯)之配向,由於樹脂成形體之空隙率不會降低,故可充分發揮中空狀填充材之降低容積比熱之效果,可抑制樹脂成形體之翹曲變形量。又,由於液晶聚酯組成物中均一分散中空狀填充材,不會降低中空狀填充材之耐壓強度,故破碎率不會變大。因此,可充分發揮中空狀填充材降低容積比熱之效果,可充分抑制龜裂發生。   本說明書中,所謂「數平均粒徑」係個數基準之算術平均,可藉由雷射繞射法之粒度分佈測定而得。   [0064] 中空狀填充材之厚度只要以使自中空狀填充材之密度換算之空隙率為5/6~3/4左右之方式設為對應於中空狀填充材之數平均粒徑之值即可。中空狀填充材之空隙率為3/4左右時,可維持耐壓強度且可使液晶聚酯組成物之容積比熱充分減小。   中空狀填充材之密度可藉由ASTM D2841之取樣法測定。   [0065] 中空狀填充材之添加量越多,越可減低成形品(樹脂成形體)之翹曲,但相反地,射出成形時液晶聚酯組成物之擠出性或成形性惡化。尤其中空狀填充材之添加量過多時,液晶聚酯組成物之流動性惡化故易產生對模具之填充不良。   [0066] 另一方面,中空狀填充材之添加量過少時,液晶聚酯組成物之容積比熱未充分降低,無法獲得對翹曲或龜裂之充分耐性。   [0067] 因此,本實施形態中,中空狀填充材之添加量相對於液晶聚酯100質量份較好為5質量份以上80質量份以下,更好為10質量份以上50質量份以下。又,亦可超過30質量份,亦可超過30質量份且50質量份以下。   作為另一觀點,中空狀填充材之添加量相對於液晶聚酯組成物總質量較好為10~30質量%,亦可為19~26質量%。   [0068] [纖維狀填充材]   本實施形態使用之纖維狀填充材之材質並未特別限制,舉例為例如玻璃纖維、氧化矽氧化鋁纖維、氧化鋁纖維、碳纖維等。   [0069] 本實施形態使用之纖維狀填充材之數平均纖維徑較好為5μm以上20μm以下。纖維狀填充材之數平均纖維徑為5μm以上時,可對樹脂成形體賦予充分強度。另一方面,若纖維狀填充材之數平均纖維徑變大,則為同質量時之纖維狀填充材之根數變少。若纖維狀填充材之根數變少,則對於液晶聚酯之接觸表面積變小。纖維狀填充材之數平均纖維徑為20μm以下時,與同質量比較時之對液晶聚酯之接觸表面積充分,可對樹脂成形體賦予充分強度。   [0070] 纖維狀填充材之數平均纖維長較好為20μm以上且未達190μm。   纖維狀填充材之數平均纖維長為190μm以上時,有中空填充劑(中空狀填充材)之破碎率上升之情況。此係因為纖維狀填充材之數平均纖維長越長,則熔融混練時摩擦變大,剪切壓力變高之故。該剪切壓力超過中空狀填充材之耐壓強度時,推測中空狀填充材易破碎,而使中空狀填充材之破碎率上升。藉此,不僅液晶聚酯組成物之配向變強,容積比熱亦變高。且後述之樹脂成形體為如CPU插座般之具有格子狀構造之成形體時,纖維長越長成形時有於模具內熔融樹脂成為層流之部位變多之情況。層流部分易使樹脂及纖維狀填充材朝流動方向配向。因此,樹脂成形體之收縮率之異向性.不均一性增大。因此,有無法充分減低樹脂成形體之翹曲之情況。   亦即,纖維狀填充材之數平均纖維長若為上述範圍內,則由於中空填充劑不易破碎,故可防止液晶聚酯組成物之配向過強,亦可防止容積比熱過高。且,樹脂成形體為具有格子狀構造之成形體時,成形時之模具內熔融樹脂成為層流之部分中,樹脂及纖維狀填充材難以於流動方向配向,可防止樹脂成形體之收縮率之異向性.不均一性增大,可充分減低樹脂成形體之翹曲。   [0071] 其中,本實施形態之連接器由於具有成形體之壁厚非常小之成形部分(參考圖2之最小壁厚部201),故有顯著見到翹曲之情況。因此,纖維狀填充材之數平均纖維長較好為20μm以上且未達190μm,更好為20μm以上140μm以下,又更好為20μm以上130μm以下,進而較佳為20μm以上80μm以下。   本說明書中之「數平均纖維長」可藉由例如將液晶聚酯組成物灰化所得之殘渣分散於水中,對其使用動態圖像解析法/粒子分析計PITA-3(SEISHIN股份有限公司企業製)測定而獲得。所謂動態圖像解析法係連續拍攝分散於流體中之粒子等進行解析,求出粒度分佈或形狀分佈之方法。   「數平均纖維徑」可例如藉由動態圖像解析法獲得。   [0072] 又,中空狀填充材之破碎率係如下般算出之值。   使用液晶聚酯、各填充材(包含中空狀填充材及纖維狀填充材)或根據需要添加之添加劑的密度,自液晶聚酯組成物之摻合比率可計算樹脂成形體之理論密度(破碎率為零時之密度)。接著,測定實際樹脂成形體之密度(實密度),求出實密度與理論密度之差,可算出破碎率。   [0073][式中,α表示中空狀填充材之摻合量(相對於液晶聚酯100質量份的質量份),β表示纖維狀填充材之摻合量(相對於液晶聚酯100質量份的質量份),ρ0 表示液晶聚酯之真密度,ρ1 表示中空狀填充材之真密度,ρ2 表示中空狀填充材之材料密度,ρ3 表示纖維狀填充材之真密度,ρ表示將前述液晶聚酯組成物射出成形所得之ASTM4號啞鈴試驗片之實密度]。   [0074] 上述式中,樹脂成形體之理論密度係以(100/ρ0 )+(α/ρ1 )+(β/ρ3 )表示。又,樹脂成形體之實密度係以(100+α+β)/ρ表示。   又樹脂成形體之實密度可藉由ISO 1183試驗方法測定。   [0075] 又,纖維狀填充材之添加量相對於液晶聚酯100質量份較好為5質量份以上80質量份以下,更好為10質量份以上50質量份以下。   [0076] 又,中空狀填充劑與纖維狀填充材之添加量合計,相對於液晶聚酯100質量份較好為10質量份以上100質量份以下,更好為30質量份以上100質量份以下,又更好超過50質量份且95質量份以下。   作為另一觀點,纖維狀填充材之添加量相對於液晶聚酯組成物之總質量,較好為5~25質量%,亦可為14~20質量%。   中空狀填充劑與纖維狀填充材之添加量合計,相對於液晶聚酯組成物之總質量,較好為25~45質量%,亦可為39~41質量%。   [0077] [板狀填充材]   本實施形態之液晶聚酯組成物中,除了中空狀填充材與纖維狀填充材以外,亦可進而添加板狀填充材。本實施形態使用之板狀填充材之材質並未特別限定,舉例為例如滑石、雲母、石墨等。該等中較好為滑石、雲母。   [0078] 板狀填充材之添加量越多,則成形品(樹脂成形體)之翹曲可進而減低,但相反地,液晶聚酯組成物擠出性或成形性惡化。尤其板狀填充材之添加量過多時,液晶聚酯組成物之流動性惡化,故易產生填充不良。且,板狀填充材之添加量過多時,樹脂成形體之機械強度降低,故對耐龜裂性亦造成不良影響。其中,本實施形態之連接器由於具有成形品之壁厚非常小的成形部分,故有顯著見到龜裂之情況。因此,板狀填充材之添加量相對於液晶聚酯100質量份較好為5質量份以上50質量份以下,更好為5質量份以上且未達30質量份。   作為另一觀點,板狀填充材之添加量相對於液晶聚酯組成物之總質量,較好為5~25質量%。   [0079] [其他添加劑]   本實施形態之液晶聚酯組成物中,在不損及本發明效果之範圍內,亦可添加氟樹脂、金屬皂類等之脫模改質劑,或染料、顏料等之著色劑,或抗氧化劑、或熱安定劑、或紫外線吸收劑、或抗靜電劑、或界面活性劑等之射出成形品中一般使用的添加劑。   [0080] 又,亦可添加高級脂肪酸、高級脂肪酸酯、高級脂肪酸金屬鹽、氟碳系界面活性劑等之具有外部滑劑效果者。   [0081] 再者,亦可少量添加上述以外之熱塑性樹脂例如聚醯胺、聚酯、聚苯硫醚、聚醚酮、聚碳酸酯、聚苯醚及其改質物、聚碸、聚醚碸、聚醚醯亞胺等,或熱硬化性樹脂例如酚樹脂、環氧樹脂、聚醯亞胺樹脂等。   亦即,作為一觀點,本實施形態之液晶聚酯組成物包含上述液晶聚酯、中空狀填充材、纖維狀填充材、根據期望之板狀填充材及自上述其他添加劑所成之群選擇之至少一種。   [0082] <樹脂成形體之製造方法>   其次,針對使用本實施形態之液晶聚酯組成物之樹脂成形體的製造方法加以說明。以下,作為樹脂成形體之例舉例為連接器之一的CPU插座,針對其製造方法加以說明,但本實施形態不限定於此。   [0083] [液晶聚酯之製造方法]   以下,針對本實施形態之液晶聚酯之製造方法之一例加以說明。   [0084] 本實施形態之液晶聚酯較好藉由以下醯化步驟及聚合步驟製造。   [醯化步驟]:芳香族二醇及芳香族羥基羧酸之酚性羥基藉由脂肪酸酐(例如乙酸酐等)醯化,而獲得醯化物(亦即芳香族二醇醯化物及芳香族羥基羧酸醯化物)。   [聚合步驟]:醯化步驟所得之醯化物之醯基與芳香族二羧酸及芳香族羥基羧酸之醯化物之羧基藉由酯交換並聚合,獲得液晶聚酯。   [0085] 醯化步驟及聚合步驟可在如下述所示之雜環狀有機鹼化合物之存在下進行。   [0086][0087] 上述構造式中,R1 ~R4 分別獨立表示氫原子、碳數1~4之烷基、羥基甲基、氰基、烷基之碳數為1~4之氰基烷基、烷氧基之碳數為1~4之氰基烷氧基、羧基、胺基、碳數1~4之胺基烷基、碳數1~4之胺基烷氧基、苯基、苄基、苯基丙基或甲醯基。   [0088] 上述之雜環狀有機鹼化合物中,若基於取得容易性,特佳為1-甲基咪唑或1-乙基咪唑或其兩者。   [0089] 雜環狀有機鹼化合物之使用量,於將液晶聚酯之原料單體(亦即芳香族二羧酸、芳香族二醇及芳香族羥基羧酸)之總量設為100質量份時,較好為0.005~1質量份。且,基於提高成形體(該實施形態中為樹脂成形體)之色調或生產性之觀點,相對於原料單體總量100質量份,更好設為0.05~0.5質量份。   [0090] 該雜環狀有機鹼化合物只要於醯化反應及酯交換反應時之一時期存在即可,其添加時期可為醯化反應正要開始前,亦可為醯化反應期間,亦可為醯化反應與酯交換反應之間。如此所得之液晶聚酯具有熔融流動性非常高的優點。   [0091] 脂肪酸酐(例如乙酸酐等)之使用量,係考慮原料單體的芳香族二醇或芳香族羥基羧酸或其兩者之使用量而決定。具體而言,相對於該等原料單體中所含之酚性羥基之合計,較好為1.0~1.2倍當量,更好為1.0~1.15倍當量,又更好為1.03~1.12倍當量,特佳為1.05~1.1倍當量。   [0092] 上述醯化步驟中之醯化反應較好在130℃~180℃之溫度範圍進行30分鐘~20小時,更好在140℃~160℃進行1~5小時。   [0093] 上述聚合步驟所使用之芳香族二羧酸可存在於醯化步驟時之反應系中。亦即,醯化步驟中,芳香族二醇、芳香族羥基羧酸及芳香族二羧酸可存在於相同反應系中。   此係因為位於芳香族二羧酸之羧基及可經任意取代之取代基均不會受到脂肪酸酐任何影響之故。因此,可為將芳香族二醇、芳香族羥基羧酸及芳香族二羧酸饋入反應器後,依序進行醯化步驟及聚合步驟的方法,亦可為將芳香族二醇及芳香族二羧酸饋入反應器進行醯化步驟後,進而將芳香族二羧酸饋入反應器進行聚合步驟之方法。基於使製造步驟簡便化之觀點,以前者方法較佳。   [0094] 上述聚合步驟中之酯交換反應較好以升溫速度0.1~50℃/分鐘邊自130℃升溫至400℃而進行,更好以升溫速度0.3~5℃/分鐘邊自150℃升溫至350℃而進行。   [0095] 又,進行聚合步驟之酯交換反應時,為了使平衡移動,較好將副生之脂肪酸(例如乙酸等)及未反應之脂肪酸酐(例如乙酸酐等)蒸發餾除至系外。此時,亦可藉由使餾出之脂肪酸之一部分回流回到反應器,而使與脂肪酸一起蒸發或昇華之原料單體等凝縮或逆昇華而回到反應器。   [0096] 醯化步驟之醯化反應及聚合步驟之酯交換反應可使用批式裝置作為反應器,亦可使用連續裝置。使用任一反應裝置,均能獲得本實施形態中可使用之液晶聚酯。   [0097] 上述聚合步驟之後,亦可進行用以將該聚合步驟所得之液晶聚酯高分子量化之步驟。例如將聚合步驟所得之液晶聚酯冷卻後粉碎,製作粉體狀之液晶聚酯,進而藉由加熱該粉體,可使液晶聚酯高分子量化。   [0098] 又,藉由使冷卻及粉碎所得之粉體狀液晶聚酯造粒而製作顆粒狀液晶聚酯,隨後,藉由加熱該顆粒狀液晶聚酯,亦可進行液晶聚酯之高分子量化。使用該方法之高分子量化於前述技術領域中稱為固相聚合。固相聚合作為使液晶聚酯高分子量化之方法特別有效。藉由使液晶聚酯高分子量化,可獲得具有上述較佳流動起始溫度之液晶聚酯。   [0099] 固相聚合時之加熱處理較好在惰性氣體(例如氮氣等)環境下或減壓下進行。又,固相聚合時之加熱時間較好設為1~20小時。加熱溫度較好為130~400℃。   再者,作為加熱處理所使用之裝置舉例為已知之乾燥機、反應機、惰性烘箱、混合機、電爐等。   [0100] [液晶聚酯組成物之摻合方法]   摻合本實施形態之液晶聚酯組成物之原料成分之方法並未特別限定。例如可將以上述方法製造之液晶聚酯與中空狀填充材、纖維狀填充材、及根據需要之板狀填充材或上述添加劑(亦即上述脫模材料劑、熱安定劑等)個別供給至熔融混合機。且,亦可將該等原料成分使用乳鉢、亨歇爾混合機、球磨機、肋摻合機等預混合後,供給至熔融混合機。進而亦可藉由使液晶聚酯與纖維狀填充材熔融混合而製作之顆粒,與藉由使液晶聚酯及中空狀填充材熔融混合而製作之顆粒,以期望摻合比混合。   [0101] [樹脂成形體之製造方法]   本實施形態中,自藉由此等摻合方法所得之液晶聚酯組成物製作如圖1所示之樹脂成形體的CPU插座。其製作可使用例如射出成形法。   [0102] 本實施形態中之射出成形可使用習知射出成形機,使液晶聚酯組成物熔融,將熔融之液晶聚酯組成物加熱至適當溫度,並射出至模具內而進行。   [0103] 為了射出而將液晶聚酯組成物加熱熔融之溫度,以所使用之液晶聚酯組成物之流動起始溫度Tp℃為基點,較好為[Tp+10]℃以上、[Tp+50]℃以下。   [0104] 又,模具溫度,基於液晶聚酯組成物之冷卻速度與生產性之觀點,較好自室溫(例如23℃)~180℃之範圍選擇。   [0105] 依據本實施形態,提供可成形耐龜裂性及翹曲耐性優異之樹脂成形體的液晶聚酯組成物。又,藉由使用該等液晶聚酯組成物,而提供耐龜裂性及翹曲耐性優異之樹脂成形體,尤其是連接器。   [0106] 本發明之液晶聚酯組成物之另一觀點,係一種液晶聚酯組成物,其包含液晶聚酯、中空狀填充材、纖維狀填充材、根據期望之板狀填充材及自其他添加劑所成之群選擇之至少一種;   前述液晶聚酯係含有構造單位(A1 )、構造單位(B1 )、構造單位(B2 )及構造單位(C1 ),   構造單位(C1 )與構造單位(A1 )之莫耳比率(C1 )/(A1 )為0.2以上1.0以下,   構造單位(C1 )相對於構造單位(B1 )與構造單位(B2 )之合計的莫耳比率{(B1 )+(B2 )}/(C1 )超過0且1以下,   構造單位(B1 )與構造單位(B2 )之莫耳比率(B2 )/(B1 )為超過0且0.3以下;   前述中空狀填充材係自玻璃、氧化矽、氧化鋁、脲樹脂及酚樹脂所成之群選擇之至少一種,較好為玻璃球,   數平均粒徑為5μm以上且100μm以下,較好為10μm以上且100μm以下,   前述中空狀填充材之含量,相對於前述液晶聚酯100質量份為5質量份以上80質量份以下,較好為10質量份以上50質量份以下,或相對於前述液晶聚酯組成物之總質量為19~26質量%;   前述纖維狀填充材係自玻璃纖維、氧化矽氧化鋁纖維、氧化鋁纖維、碳纖維所成之群選擇之至少一種,較好為玻璃纖維,   數平均纖維長為20μm以上且未達190μm,較好為20μm以上且140μm以下,更好為20μm以上且130μm以下,又更好為20μm以上且80μm以下,   數平均纖維徑為5μm以上且20μm以下,   前述纖維狀填充材之含量,相對於前述液晶聚酯100質量份為5質量份以上80質量份以下,較好為10質量份以上50質量份以下,或相對於前述液晶聚酯組成物之總質量為14~20質量%;   前述中空狀填充劑與前述纖維狀填充材之含量合計,相對於前述液晶聚酯100質量份為10質量份以上100質量份以下,較好為30質量份以上100質量份以下,更好超過50質量份且95質量份以下,或相對於前述液晶聚酯組成物之總質量為39~41質量%。   又本發明之又另一觀點係藉由自上述液晶聚酯射出成形而形成之連接器。 [實施例]   [0107] 以下針對本發明之一實施例加以說明,但本發明不限定於本實施例。液晶聚酯之物性係藉以下方法測定。   [0108] <液晶聚酯之流動起始溫度之測定>   使用流動測試儀(島津製作所公司製,CFT-500型),將液晶聚酯約2g填充於安裝有具有內徑1mm及長10mm之噴嘴的模嘴之氣缸中,於9.8MPa(100kg/cm2 )荷重下,以4℃/分鐘之速度邊升溫,邊使液晶聚酯熔融,自噴嘴擠壓出,測定顯示4800Pa.s(48000泊)之黏度的溫度。   [0109] <製造例(液晶聚酯之製造)>   使用以下方法,製造液晶聚酯。   [0110] 首先,於具備攪拌裝置、扭力計、氮氣導入管、溫度計及回流冷卻器之反應器中,饋入獲得構造單位(A1 )之對羥基苯甲酸994.5g(7.2莫耳)、獲得構造單位(C1 )之4,4’-二羥基聯苯446.9g(2.4莫耳)、獲得構造單位(B1 )之對苯二甲酸299.0g(1.8莫耳)、獲得構造單位(B2 )之間苯二甲酸99.7g(0.6莫耳)及乙酸酐1347.6g(13.2莫耳)。此時,莫耳比率(C1 )/(A1 )約0.3,莫耳比率{(B1 )+(B2 )}/(C1 )為1.0,莫耳比率(B2 )/(B1 )約0.3。   [0111] 其次,反應器內以氮氣充分置換後,添加1-甲基咪唑0.18g,於氮氣氣流下以30分鐘自室溫升溫至150℃,保持該溫度回流30分鐘。進而,添加1-甲基咪唑2.4g後,邊餾除所餾出之副生乙酸或未反應乙酸酐邊以2小時50分自150℃升溫至320℃。隨後將見到扭力上升之時點視為反應結束,取出內容物。   [0112] 接著,將如此獲得之固形分(內容物)冷卻至室溫,以粗粉碎機粉碎。粉碎後之固形分在氮氣環境下,以1小時自室溫升溫至250℃,進而以5小時自250℃升溫至295℃,進而於295℃保持3小時,而進行固相聚合。   [0113] 最後,藉由冷卻固相聚合後之生成物,獲得液晶聚酯。所得液晶聚酯之流動起始溫度為327℃。   [0114] <實施例1~3、比較例1~2(液晶聚酯組成物之摻合及成形)>   使用製造例所得之液晶聚酯,如以下,製作實施例1~3及比較例1~2之CPU插座各3個。   [0115] 以表1所示之質量組成比,摻合液晶聚酯與各種填充材,使用2軸擠出機(池貝鐵工股份有限公司製,「PCM-30」),以汽缸溫度340℃進行造粒,藉此獲得顆粒狀之液晶聚酯組成物(實施例1~3及比較例1~4)。   隨後,所得顆粒狀之液晶聚酯組成物以下述成形條件成形,製作實施例1~3及比較例1~2之連接器(圖1(A)、圖1(B)及圖2所示之2544銷對應之模型CPU插座,以下稱為「CPU插座」)。又,本實施例使用之各種填充材係如下述。各種填充材之數平均纖維長、數平均纖維徑、數平均粒徑為目錄值。   [0116] [填充材] (1)中空狀填充材   玻璃球:S60HS(住友3M股份有限公司製),數平均粒徑20μm (2)纖維填充材   磨碎玻璃纖維:EFH75-01(CENTRALFIBER股份有限公司製),數平均纖維長75μm,數平均纖維徑11μm :EFH150-01(CENTRALFIBER股份有限公司製),數平均纖維長150μm,數平均纖維徑11μm (3)粒狀填充材   玻璃珠:EGB731(POTTERS BALLOTINI股份有限公司製),數平均粒徑20μm   [0117] [成形條件]   成形機:FANUC公司製,「ROBOSHOT S-2000i 30B」   汽缸溫度:360℃   模具溫度:100℃   射出速度:250mm/秒   [0118] <CPU插座之評價>   針對實施例1~3及比較例1~2所得之7種CPU插座進行如以下評價。   [0119] (1)翹曲量(翹曲耐性評價)   將所得CPU插座置於玻璃平面上,使用CORRS股份有限公司製之平坦度測定模組「9030c」,針對前述CPU插座中任意92點求出距離前述玻璃平面之高度。接著,使用前述92點之高度,藉由最小平方法算出前述CPU插座之最小平方平面。自以包含前述92點之高度中最低之點之方式平行移動前述最小平方平面高度時之前述最小平方平面至前述92點高度中最高之點的距離作為翹曲量而算出。   [0120] 其次,針對該CPU插座,實施下之熱處理:以升溫速度2℃/秒自室溫升溫至160℃,於160℃保持1分鐘,進而以升溫速度2℃/秒升溫至250℃,於250℃保持1分鐘,隨後緩冷至50℃。   [0121] 接著,該熱處理後之CPU插座冷卻至室溫後,與上述同樣測定翹曲量。上述操作對於實施例1~3及比較例1~2分別製作之3個不同試驗片(CPU插座)進行,其平均值設為「加熱後翹曲量」。結果示於表1。   [0122] (2)龜裂(耐龜裂性之評價)   熱處理後之CPU插座冷卻至室溫後,使用數位顯微鏡(KYENCE股份有限公司製「VHX-1000」,使用透鏡「VH-Z25」),觀察熱處理後之CPU插座。接著,計測於CPU插座產生之龜裂之個數。對3個CPU插座進行同樣計測,3個計測值之平均值設為龜裂產生數。表1中顯示實施例1~3及比較例1~2之CPU插座之龜裂產生數。   [0123] (3)容積比熱   首先,使用JIS K7123:2012中記載之方法,測定實施例1~3及比較例1~2所用之液晶聚酯組成物之比熱容量(單位:J/gK)。具體而言,針對自實施例1~3及比較例1~2所用之液晶聚酯組成物作成之試驗片(ASTM4號啞鈴試驗片),使用示差掃描熱量測定裝置(島津製作所股份有限公司製,「DSC-50」),測定100℃之比熱容量(J/gK)。   [0124] 其次,針對自實施例1~3及比較例1~2所用之液晶聚酯組成物作成之試驗片(ASTM4號啞鈴試驗片),使用固體比重計(關東測量股份有限公司製,「ASG-320K」)測定密度(g/cm3 )。使用所測定之比熱容量及密度,由下式算出容積比熱。表1中顯示實施例1~3及比較例1~2所用之液晶聚酯組成物之容積比熱。   容積比熱(J/cm3 K)=比熱容量(J/gK)×密度(g/cm3 )   [0125] (4)數平均纖維長(顆粒成形加工後)   以2軸擠出機成形為顆粒狀之實施例1~3及比較例1~2之液晶聚酯組成物採取2g至坩堝中。將其於電爐內以600℃處理4小時予以灰化,獲得殘渣。該殘渣以水分散,使用動態圖像解析法/粒子分析計PITA-3(SEISHIN股份有限公司企業製),測定纖維狀填充材之數平均纖維長。作為過濾條件(解析條件),將長寬比未達2,外切矩形短徑(纖維徑)未達5μm及超過20μm者、細線化像素(纖維長)未達20μm者作為非纖維狀填充材而全部除外。   [0126][0127] 如表1所示,實施例1中,使用相對於樹脂成分(液晶聚酯)100質量份,含有數平均纖維長之實測值為70μm的纖維狀填充材33.3質量份與中空狀填充材33.3質量份之液晶聚酯組成物。該液晶聚酯組成物之容積比熱為1.95(J/cm3 K)。   [0128] 另一方面,比較例2中,使用相對於液晶聚酯100質量份,含有數平均纖維長之實測值未達190μm(實測值:70μm)的纖維狀填充材33.3質量份與粒狀填充材33.3質量份之液晶聚酯組成物。比較例2之CPU插座與實施例1之CPU插座相比,加熱後翹曲量大,龜裂產生數亦多。此認為係起因於比較例2之液晶聚酯組成物之容積比熱與實施例1之液晶聚酯組成物之容積比熱相比較高。由實施例1及比較例2之結果,顯示藉由添加中空狀填充材,可降低CPU插座之容積比熱。   [0129] 又,比較例1中,使用相對於液晶聚酯100質量份,含有數平均纖維長之實測值未達190μm(實測值:70μm)的纖維狀填充材66.7質量份之液晶聚酯組成物。由實施例1及比較例1之結果,顯示藉由添加中空狀填充材,可降低CPU插座之加熱後翹曲量及龜裂產生數。   [0130] 如此,依據本實施例,顯示可提供龜裂之產生受抑制且翹曲量少的連接器。 [產業上之可利用性]   [0131] 依據本發明,由於可提供可成形耐龜裂性及翹曲耐性優異之樹脂成形體的液晶聚酯組成物及使用其之樹脂成形體尤其是連接器,故於產業上極有用。<Resin Molded Body> The resin molded system of the present embodiment is formed of a liquid crystal polyester composition to be described later. The resin molded body of the present embodiment is exemplified by electrical properties such as a connector, a socket, a relay, a bobbin, a light extractor, an oscillator, and a computer-related component. Electronic parts; semiconductor manufacturing process related parts such as IC relays; home electrical parts such as VTRs, televisions, electric irons, air conditioners, radios, vacuum cleaners, refrigerators, electric cookers, lighting fixtures, etc.; optical discs, laser discs (registered trademark), Audio equipment parts such as speakers; communication equipment parts such as telephones, fax machines, modems; photocopying machines such as heater brackets, printing machine related parts; mechanical parts such as impellers, fan gears, gears, bearings, motor parts and casings; Microwave conditioning pots, heat-resistant tableware and other conditioning equipment; floor boards, wall materials, etc., heat insulating, sound-insulating materials, beam, column and other supporting materials, roofing materials, etc., or civil engineering materials; aircraft parts , aerospace machine parts; atomic furnace and other radiation facilities components, marine facilities components, cleaning fixtures, hoses, nozzles, sensor parts, sporting goods, leisure and entertainment products. As the resin molded body formed of the liquid crystal polyester composition, a connector is preferred. The reason for this is that the connector has a molded portion having a very small wall thickness (refer to the minimum thickness portion 201 of Fig. 2 to be described later), so that the effect of improving warpage or cracking can be remarkably observed. <Connector> Hereinafter, a case where the connector is a CPU socket will be described with reference to FIGS. 1A, 1B, and 2 as an embodiment of the present invention. For example, the connector according to the embodiment of the present invention includes, as one viewpoint, an opening, an outer frame portion, an inner frame portion, a pin insertion hole, and a minimum thickness portion. 1A and 1B are views showing a structure of a connector according to the present embodiment, and FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A. 2 is an enlarged view of a portion indicated by a region B in FIG. 1A. As shown in FIG. 1A, FIG. 1B and FIG. 2, the connector 100 of the present embodiment has a square plate shape in plan view and has a square opening portion 101 at the center. The outer peripheral portion and the inner peripheral portion of the connector 100 are formed in a convex shape on the back surface, and constitute the outer frame portion 102 and the inner frame portion 103. Further, in the area surrounded by the outer frame portion 102 and the inner frame portion 103, 2544 pin insertion holes 104 are provided in a matrix. The pin insertion hole 104 is formed in a horizontal cross section in a square shape. As a result, the entire shape of the portion of the area distribution insertion holes 104, that is, the minimum thickness portion 201 is formed in a lattice shape. The outer shape of the connector 100 can be arbitrarily set according to the purpose, but may be, for example, 72 mm × 72 mm, and the size of the opening portion 101 is, for example, 28 mm × 28 mm. The thickness of the connector 100 is 5 mm in the outer frame portion 102 and the inner frame portion 103, and the region surrounded by the outer frame portion 102 and the inner frame portion 103 (that is, the thickness of the minimum thickness portion 201 in the enlarged view of Fig. 2) is 3mm. The cross-sectional dimension of the pin insertion hole 104 is 0.6 mm × 0.6 mm, and the pitch (that is, the sum of the width of the cross section of the pin insertion hole 104 and the shortest distance between the adjacent pin insertion holes 104) is 1 mm. Further, the width of the minimum thickness portion 201 (that is, the shortest distance between the adjacent pin insertion holes 104) is 0.33 mm. Further, the size shown here is an example, and the number of the pin insertion holes 104 can be arbitrarily set according to the purpose. For example, the connector may have an outer dimension of (30 mm to 75 mm) × (40 mm to 85 mm) and a size of the opening (8 mm to 30 mm) × (8 mm to 30 mm). The thickness of the connector may be 3 to 5 mm in the outer frame portion and the inner frame portion, and the region held by the electrodes (that is, the thickness of the minimum thickness portion) may be 1 to 4 mm. The pin insertion hole of the connector may have a cross-sectional dimension of 0.5 to 1.5 mm, a pitch of 0.5 to 1.5 mm, and a minimum thickness of 0.1 to 1.0 mm. [0027] The connector of the present embodiment is one of the resin molded bodies described above, and is formed by an injection molding method from a liquid crystal polyester composition to be described later. The liquid crystal polyester composition of this embodiment will be described in detail below. <Liquid Crystal Polyester Composition> [Liquid Crystal Polyester] The liquid crystal polyester composition of the present embodiment contains a liquid crystal polyester. One of the liquid crystal polyester-based thermotropic liquid crystal polymers of the present embodiment. The thermotropic liquid crystal polymer forms an anisotropic melt at a temperature of from 270 ° C to 400 ° C. The liquid crystal polyester is preferably obtained by polymerizing an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, and an aromatic diol. Further, in order to more easily produce the liquid crystal polyester, a part of the raw material monomers such as an aromatic hydroxycarboxylic acid, an aromatic dicarboxylic acid, and an aromatic diol may be formed into an ester-forming derivative. polymerization. [0030] The ester-forming derivative can be exemplified by, for example, the following. The ester-forming derivative may, for example, be a compound having a carboxyl group in the molecule of an aromatic hydroxycarboxylic acid or an aromatic dicarboxylic acid. Examples of such ester-forming derivatives include those in which a carboxyl group is converted into a highly reactive oxime halide or an acid anhydride, or a carboxyl group is converted into an ester by a transesterification reaction to form a polyester. Further, examples of the ester-forming derivative include those having a phenolic hydroxyl group like an aromatic hydroxycarboxylic acid and an aromatic diol. As such an ester-forming derivative, a polyester generator is produced by a transesterification reaction by converting a phenolic hydroxyl group into an ester. The method for producing a liquid crystal polyester from such an ester-forming derivative will be described later. [0034] Hereinafter, a specific example will be described with respect to the structural unit of the liquid crystal polyester of the present embodiment. [0035] The structural unit derived from the aromatic hydroxycarboxylic acid is as follows. As will be described later, in the present embodiment, the structural unit is used (A) 1 ) and (A 2 The situation is explained. By "derived from" herein is meant a change in the chemical structure from the starting monomer used for polymerization. [0036] [0037] The structural units may also be substituted with at least one substituent selected from the group consisting of a halogen atom, an alkyl group, and an aryl group, a portion of a hydrogen atom located in the aromatic ring. [0038] The structural unit derived from the aromatic dicarboxylic acid has the following ones. As will be described later, in the present embodiment, the structural unit is used (B). 1 ), (B 2 ) and (B 3 The situation is explained. [0039] [0040] The structural units may also be substituted with at least one substituent selected from a halogen atom, an alkyl group, and an aryl group in a portion of a hydrogen atom located in the aromatic ring. [0041] The structural unit derived from the aromatic diol is as follows. As will be described later, in the present embodiment, the structural unit is used (C) 1 ) and (C 3 The situation is explained. [0042] [0043] The structural units may also be substituted with at least one substituent selected from a halogen atom, an alkyl group, and an aryl group in a portion of a hydrogen atom located in the aromatic ring. Further, in the structural units, the halogen atom as a substituent is exemplified by a fluorine atom, a chlorine atom or a bromine atom. Further, the alkyl group as a substituent is exemplified by a lower alkyl group having a carbon number of about 1 to 4 such as a methyl group, an ethyl group or a butyl group. Further, the aryl group as a substituent is exemplified by a phenyl group or the like. [0045] Next, a preferred combination of the above structural units will be described. In the present embodiment, the structural unit of the liquid crystal polyester is preferably used in combination as shown in any one of the following [a] to [f]. [a]: (A 1 ), (B 1 ) or (B 2 ) or (B 1 ) and (B 2 Both, and (C 1 a combination of). [b]:(A 1 ) and (A 2 a combination of). [c]: In the combination of the above [a], (A 1 One part of the passage (A 2 ) Replacer. [d]: In the combination of the above [a], (B 1 One part of the passage (B 3 ) Replacer. [e]: In the combination of the above [a], (C 1 One part of the passage (C 3 ) Replacer. [f]: in the combination of the above [b], plus (B 1 ) and (C 1 )By. [00] In the combinations [a] to [f], it is particularly preferred to combine [a], that is, a structural unit derived from p-hydroxybenzoic acid (corresponding to the above structural unit (A) 1 )), a structural unit derived from 4,4'-dihydroxybiphenyl (corresponding to the above structural unit (C 1 )), a structural unit derived from terephthalic acid, a structural unit derived from isophthalic acid or a structural unit derived from terephthalic acid and a structural unit derived from isophthalic acid (corresponding to the above structural unit (B) 1 ), the above structural unit (B 2 ) or the above structural unit (B 1 ) and (B 2 )) A combination of liquid crystal polyesters. Furthermore, in this combination, a better structural unit (A 1 ) and structural units (C 1 Mo ratio (C 1 )/(A 1 ) is 0.2 or more and 1.0 or less, and the structural unit (C) 1 Relative to the structural unit (B 1 ) and structural units (B 2 The total molar ratio {(B 1 )+(B 2 )}/(C 1 ) is 0.9 or more and 1.1 or less. In addition, the structural unit (B 1 ) and structural units (B 2 Mo ratio (B 2 )/(B 1 It is preferably greater than 0 and 1 or less, and more preferably greater than 0 and 0.3 or less. The liquid crystal polyester of the present embodiment preferably contains 30 mol% or more and 80 mol% or less of the above structural unit for the total number of moles of all repeating units of the liquid crystal polyester (A). 1 ). The flow initiation temperature of the liquid crystal polyester of the present embodiment is preferably from 270 to 400 ° C, more preferably from 280 to 380 ° C. When the flow initiation temperature falls within the range, the fluidity of the liquid crystal polyester composition is improved, and the heat resistance (the soldering property when the molded article is an electronic component such as a socket) is improved. In addition, when the flow initiation temperature is in the above range, it is difficult to cause thermal deterioration in order to obtain a molded body from the liquid crystal polyester and perform melt molding. [0050] In the present embodiment, the flow initiation temperature is defined as "using a capillary rheometer having a nozzle having an inner diameter of 1 mm and a length of 10 mm, at 9.8 MPa (100 kg/cm). 2 When the heating melt of the liquid crystal polyester is extruded from the nozzle at a heating rate of 4 ° C / min, the melt viscosity is 4800 Pa. The temperature of seconds (ie 48,000 poise). These definitions are used as molecular weight standards for liquid crystal polyesters and are well known to those skilled in the art (for example, refer to Komori Naoto, "Liquid Crystal Polymers - Synthesis, Forming, Applications -", pp. 95-105, CMC, 1987 6 Issued on the 5th of May). In the liquid crystal polyester of the present embodiment, since the polymer chain is introduced into the rigid portion, the complexation of the polymers is small, so the viscosity is low, and the fluidity at the time of molding processing is excellent. Therefore, it can also be applied to a molded article having a thin-walled structure or a fine structure which is difficult to process by conventional resins. Further, the liquid crystal polyester of the present embodiment is also excellent in chemical resistance and flame retardancy, and particularly in flame retardancy, UL94 V-0 can be achieved even without a flame retardant. The content of the liquid crystal polyester is preferably from 55 to 75% by mass based on the total mass of the liquid crystal polyester composition of the present embodiment. [0054] The liquid crystal polyester composition of the present embodiment preferably has a volume specific heat of 1.0 J/cm at 100 ° C. 3 K above 3.0J/cm 3 Below K, it can be 1.50J/cm 3 K above 2.0J/cm 3 Below K, it can also be 1.62J/cm 3 K above 1.95J/cm 3 Below K. In the present specification, the "volume specific heat of the liquid crystal polyester composition" is a value calculated from the specific heat capacity (unit: J/gK) and density measured according to JIS K7123:2012 for the liquid crystal polyester composition based on the following formula. Volume specific heat (J/cm 3 K) = specific heat capacity (J / gK) × density (g / cm 3 In the present specification, the "specific heat capacity of the liquid crystal polyester composition" can be measured by a differential scanning calorimeter "DSC-50" manufactured by Shimadzu Corporation. On the other hand, the density of the liquid crystal polyester composition can be measured by a solid hydrometer "ASG-320K" manufactured by Kanto Measurement Co., Ltd. In the present embodiment, the "volume specific heat of the liquid crystal polyester composition" means the heat capacity per unit volume which is the index of the cooling rate. The volume specific heat of the liquid crystal polyester composition to be described later is related to the volume specific heat of the resin molded body formed from the liquid crystal polyester composition, and the liquid crystal polyester composition has a smaller volume specific heat and can be effectively cooled during molding. The reduction of the specific heat of the liquid crystal polyester composition will be described later. [Hollow Filler] The liquid crystal polyester composition of the present embodiment includes a hollow filler and a fibrous filler. The material of the hollow filler used in the embodiment is not particularly limited, and examples thereof include inorganic materials such as glass, cerium oxide, and aluminum oxide; and organic materials such as urea resin and phenol resin. [0059] The hollow filler may be a mixture of two or more kinds as needed, or two or more lightweight functional fillers. The "lightweight functional filler" refers to a filler having a space inside for the purpose of weight reduction. Examples of the lightweight functional filler include porous ceramic particles, expandable particles, and hollow particles. Among these, the material of the hollow filler is preferably glass based on heat resistance or strength. That is, as the hollow filler, hollow particles called glass spheres are preferably used. [0060] By adding a hollow filler, the volume specific heat of the liquid crystal polyester composition can be reduced. In the conventional liquid crystal polyester composition, it is possible to cool the portion and the portion which is not easily cooled, for the reason of the structure of the mold used for injection molding. Thereby, there is a case where the portion to be solidified is broken (cracking) due to partial shrinkage of the subsequent solidification. On the other hand, in the liquid crystal polyester composition of the present embodiment, since the volume specific heat is smaller than that of the conventional liquid crystal polyester composition, the liquid crystal polyester composition can be effectively cooled at the time of injection molding. Therefore, since the liquid crystal polyester composition is uniformly cooled as a whole, cracking caused by shrinkage due to curing of the liquid crystal polyester composition can be reduced. The number average particle diameter of the hollow filler used in the embodiment is preferably from 5 μm to 100 μm, more preferably from 10 μm to 100 μm. When the number average particle diameter of the hollow filler is less than 5 μm, the alignment of the liquid crystal polymer (liquid crystal polyester) cannot be sufficiently suppressed, and the void ratio of the resin molded body is lowered, and the volume reduction ratio of the hollow filler cannot be sufficiently exhibited. effect. Therefore, there is a case where the amount of warping deformation of the resin molded body is increased. When the number average particle diameter of the hollow filler is more than 100 μm, the hollow filler is not uniformly dispersed in the liquid crystal polyester composition, and the pressure resistance of the hollow filler is also lowered. The situation that the breaking rate becomes larger. When the distribution of the hollow filler is offset, and the crushing rate is increased, the effect of reducing the volume ratio heat of the hollow filler cannot be sufficiently exhibited, so that the occurrence of cracks cannot be sufficiently suppressed. In other words, when the number average particle diameter of the hollow filler is within the above range, the alignment of the liquid crystal polymer (liquid crystal polyester) can be sufficiently suppressed, and the void ratio of the resin molded body is not lowered, so that the hollow filler can be sufficiently exhibited. The effect of reducing the volume ratio heat can suppress the amount of warping deformation of the resin molded body. Further, since the hollow filler is uniformly dispersed in the liquid crystal polyester composition, the pressure resistance of the hollow filler is not lowered, so that the fracture rate does not become large. Therefore, the effect of reducing the volume specific heat of the hollow filler can be sufficiently exhibited, and the occurrence of cracks can be sufficiently suppressed. In the present specification, the "number average particle diameter" is an arithmetic mean of the number basis and can be measured by the particle size distribution of the laser diffraction method. [0064] The thickness of the hollow filler is set to a value corresponding to the number average particle diameter of the hollow filler so that the porosity is from about 5/6 to 3/4 in terms of the density of the hollow filler. can. When the void ratio of the hollow filler is about 3/4, the pressure resistance can be maintained and the volume specific heat of the liquid crystal polyester composition can be sufficiently reduced. The density of the hollow filler can be determined by the sampling method of ASTM D2841. The larger the amount of the hollow filler to be added, the more the warpage of the molded article (resin molded body) can be reduced, but conversely, the extrudability or formability of the liquid crystal polyester composition at the time of injection molding is deteriorated. In particular, when the amount of the hollow filler is too large, the fluidity of the liquid crystal polyester composition is deteriorated, so that the filling failure of the mold is liable to occur. On the other hand, when the amount of the hollow filler to be added is too small, the volume specific gravity of the liquid crystal polyester composition is not sufficiently lowered, and sufficient resistance to warpage or cracking cannot be obtained. In the present embodiment, the amount of the hollow filler to be added is preferably 5 parts by mass or more and 80 parts by mass or less, more preferably 10 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the liquid crystal polyester. Further, it may be more than 30 parts by mass, or may be more than 30 parts by mass and 50 parts by mass or less. In another aspect, the amount of the hollow filler to be added is preferably from 10 to 30% by mass, and may be from 19 to 26% by mass based on the total mass of the liquid crystal polyester composition. [Fibrous filler] The material of the fibrous filler used in the embodiment is not particularly limited, and examples thereof include glass fiber, cerium oxide alumina fiber, alumina fiber, and carbon fiber. The number average fiber diameter of the fibrous filler used in the embodiment is preferably 5 μm or more and 20 μm or less. When the number average fiber diameter of the fibrous filler is 5 μm or more, sufficient strength can be imparted to the resin molded body. On the other hand, when the number average fiber diameter of the fibrous filler becomes large, the number of the fibrous fillers at the same mass is small. When the number of the fibrous fillers is small, the contact surface area with respect to the liquid crystal polyester becomes small. When the number average fiber diameter of the fibrous filler is 20 μm or less, the contact surface area with respect to the liquid crystal polyester when compared with the same mass is sufficient, and sufficient strength can be imparted to the resin molded body. [0070] The number average fiber length of the fibrous filler is preferably 20 μm or more and less than 190 μm. When the number average fiber length of the fibrous filler is 190 μm or more, the crushing ratio of the hollow filler (hollow filler) may increase. In this case, the longer the average fiber length of the fibrous filler, the larger the friction during the melt kneading, and the higher the shear pressure. When the shear pressure exceeds the compressive strength of the hollow filler, it is presumed that the hollow filler is easily broken, and the crushing ratio of the hollow filler is increased. Thereby, not only the alignment of the liquid crystal polyester composition becomes strong, but also the volume specific heat becomes high. When the resin molded body to be described later is a molded body having a lattice-like structure like a CPU socket, the longer the fiber length is, the more the molten resin becomes a laminar flow in the mold. The laminar flow portion tends to align the resin and the fibrous filler in the flow direction. Therefore, the shrinkage of the resin molded body is anisotropic. Increasing heterogeneity. Therefore, there is a case where the warpage of the resin molded body cannot be sufficiently reduced. In other words, when the number average fiber length of the fibrous filler is within the above range, the hollow filler is less likely to be broken, so that the alignment of the liquid crystal polyester composition can be prevented from being excessively strong, and the volume specific heat can be prevented from being excessively high. In the case where the resin molded body is a molded body having a lattice structure, in the portion where the molten resin in the mold is formed as a laminar flow during molding, the resin and the fibrous filler are difficult to be aligned in the flow direction, and the shrinkage ratio of the resin molded body can be prevented. Anisotropy. The unevenness is increased, and the warpage of the resin molded body can be sufficiently reduced. In the connector of the present embodiment, since the molded portion having a very small wall thickness of the molded body (refer to the minimum thickness portion 201 of FIG. 2) is provided, warpage is remarkably observed. Therefore, the number average fiber length of the fibrous filler is preferably 20 μm or more and less than 190 μm, more preferably 20 μm or more and 140 μm or less, still more preferably 20 μm or more and 130 μm or less, and still more preferably 20 μm or more and 80 μm or less. In the present specification, the "number average fiber length" can be obtained by, for example, dispersing a residue obtained by ashing a liquid crystal polyester composition in water, using a dynamic image analysis method/particle analyzer PITA-3 (SEISHIN Co., Ltd. Obtained by measurement. The moving image analysis method is a method of continuously photographing particles or the like dispersed in a fluid to analyze a particle size distribution or a shape distribution. The "number average fiber diameter" can be obtained, for example, by dynamic image analysis. Further, the breaking rate of the hollow filler is a value calculated as follows. Using the density of the liquid crystal polyester, each filler (including the hollow filler and the fibrous filler) or the additive added as needed, the theoretical ratio of the resin molded body can be calculated from the blend ratio of the liquid crystal polyester composition (breakage ratio) Density at zero time). Next, the density (solid density) of the actual resin molded body was measured, and the difference between the real density and the theoretical density was determined, and the breaking rate was calculated. [0073] [wherein, α represents a blending amount of the hollow filler (parts by mass relative to 100 parts by mass of the liquid crystal polyester), and β represents a blending amount of the fibrous filler (parts by mass relative to 100 parts by mass of the liquid crystal polyester) ), ρ 0 Indicates the true density of liquid crystal polyester, ρ 1 Indicates the true density of the hollow filler, ρ 2 Indicates the material density of the hollow filler, ρ 3 The true density of the fibrous filler is shown, and ρ is the actual density of the ASTM No. 4 dumbbell test piece obtained by injection molding the liquid crystal polyester composition. [0074] In the above formula, the theoretical density of the resin molded body is (100/ρ 0 )+(α/ρ 1 )+(β/ρ 3 ) said. Further, the solid density of the resin molded body is represented by (100 + α + β) / ρ. Further, the solid density of the resin molded body can be measured by the ISO 1183 test method. In addition, the amount of the fibrous filler to be added is preferably 5 parts by mass or more and 80 parts by mass or less, more preferably 10 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the liquid crystal polyester. In addition, the total amount of the hollow filler and the fibrous filler is preferably from 10 parts by mass to 100 parts by mass, more preferably from 30 parts by mass to 100 parts by mass, per 100 parts by mass of the liquid crystal polyester. More preferably, it is more than 50 parts by mass and 95 parts by mass or less. In another aspect, the amount of the fibrous filler to be added is preferably from 5 to 25% by mass, and may be from 14 to 20% by mass based on the total mass of the liquid crystal polyester composition. The total amount of the hollow filler and the fibrous filler to be added is preferably from 25 to 45% by mass, and may be from 39 to 41% by mass based on the total mass of the liquid crystal polyester composition. [Plate Filler] In the liquid crystal polyester composition of the present embodiment, in addition to the hollow filler and the fibrous filler, a plate-shaped filler may be further added. The material of the plate-shaped filler used in the embodiment is not particularly limited, and examples thereof include talc, mica, and graphite. Among these, talc and mica are preferred. When the amount of the plate-shaped filler to be added is increased, the warpage of the molded article (resin molded body) can be further reduced, but conversely, the liquid crystal polyester composition is deteriorated in extrusion property or formability. In particular, when the amount of the plate-shaped filler is too large, the fluidity of the liquid crystal polyester composition is deteriorated, so that filling failure is likely to occur. Further, when the amount of the plate-shaped filler is too large, the mechanical strength of the resin molded body is lowered, so that the crack resistance is also adversely affected. In the connector of the present embodiment, since the molded portion having a very small thickness is formed, the crack is remarkably observed. Therefore, the amount of the plate-shaped filler to be added is preferably 5 parts by mass or more and 50 parts by mass or less, more preferably 5 parts by mass or more and less than 30 parts by mass, per 100 parts by mass of the liquid crystal polyester. As another viewpoint, the amount of the plate-shaped filler added is preferably from 5 to 25% by mass based on the total mass of the liquid crystal polyester composition. [Other Additives] In the liquid crystal polyester composition of the present embodiment, a mold release modifier such as a fluororesin or a metal soap, or a dye or a pigment may be added to the extent that the effects of the present invention are not impaired. An additive commonly used in injection moldings such as coloring agents, or antioxidants, or thermal stabilizers, or ultraviolet absorbers, or antistatic agents, or surfactants. Further, those having an external slip effect such as a higher fatty acid, a higher fatty acid ester, a higher fatty acid metal salt, or a fluorocarbon surfactant may be added. Further, a thermoplastic resin other than the above may be added in a small amount, such as polyamine, polyester, polyphenylene sulfide, polyether ketone, polycarbonate, polyphenylene ether, and modified substances thereof, polyfluorene, polyether oxime. A polyether quinone or the like, or a thermosetting resin such as a phenol resin, an epoxy resin, a polyimide resin, or the like. In other words, the liquid crystal polyester composition of the present embodiment includes the liquid crystal polyester, the hollow filler, the fibrous filler, the desired plate-shaped filler, and a group selected from the other additives. At least one. <Method for Producing Resin Molded Body> Next, a method for producing a resin molded body using the liquid crystal polyester composition of the present embodiment will be described. Hereinafter, a CPU socket which is one of the connectors is exemplified as a resin molded body, and a manufacturing method thereof will be described. However, the present embodiment is not limited thereto. [Method for Producing Liquid Crystal Polyester] Hereinafter, an example of a method for producing a liquid crystal polyester according to the present embodiment will be described. The liquid crystal polyester of the present embodiment is preferably produced by the following deuteration step and polymerization step. [Deuteration step]: the phenolic hydroxyl group of the aromatic diol and the aromatic hydroxycarboxylic acid is deuterated by a fatty acid anhydride (for example, acetic anhydride or the like) to obtain a hydrazine compound (that is, an aromatic diol oxime compound and an aromatic hydroxy group). Carboxylic acid halide). [Polymerization step]: The mercapto group of the telluride obtained in the deuteration step is transesterified with a carboxyl group of an aromatic dicarboxylic acid and a halide of an aromatic hydroxycarboxylic acid to obtain a liquid crystal polyester. The deuteration step and the polymerization step can be carried out in the presence of a heterocyclic organic base compound as shown below. [0086] [0087] In the above structural formula, R 1 ~R 4 Each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a hydroxymethyl group, a cyano group, a cyano group having 1 to 4 carbon atoms, and a cyano group having 1 to 4 carbon atoms in the alkoxy group. Alkoxy group, carboxyl group, amine group, aminoalkyl group having 1 to 4 carbon atoms, amino alkoxy group having 1 to 4 carbon atoms, phenyl group, benzyl group, phenylpropyl group or decyl group. Among the above heterocyclic organic base compounds, 1-methylimidazole or 1-ethylimidazole or both thereof are particularly preferred because of ease of availability. The amount of the heterocyclic organic base compound used is set to 100 parts by mass based on the total amount of the raw material monomers (that is, the aromatic dicarboxylic acid, the aromatic diol, and the aromatic hydroxycarboxylic acid) of the liquid crystal polyester. It is preferably 0.005 to 1 part by mass. In addition, from the viewpoint of improving the color tone or productivity of the molded article (the resin molded article in the embodiment), it is preferably 0.05 to 0.5 parts by mass based on 100 parts by mass of the total amount of the raw material monomers. The heterocyclic organic base compound may be present in one period of the deuteration reaction and the transesterification reaction, and the addition period may be before the start of the deuteration reaction, or during the deuteration reaction, or Between the deuteration reaction and the transesterification reaction. The liquid crystal polyester thus obtained has an advantage that the melt fluidity is very high. The amount of the fatty acid anhydride (for example, acetic anhydride or the like) used is determined in consideration of the amount of the aromatic diol or the aromatic hydroxycarboxylic acid of the raw material monomer or both. Specifically, the total amount of the phenolic hydroxyl groups contained in the raw material monomers is preferably 1.0 to 1.2 equivalents, more preferably 1.0 to 1.15 equivalents, and still more preferably 1.03 to 1.12 equivalents. Preferably, it is 1.05 to 1.1 times equivalent. The deuteration reaction in the above deuteration step is preferably carried out at a temperature ranging from 130 ° C to 180 ° C for 30 minutes to 20 hours, more preferably at 140 ° C to 160 ° C for 1 to 5 hours. The aromatic dicarboxylic acid used in the above polymerization step may be present in the reaction system at the deuteration step. That is, in the deuteration step, the aromatic diol, the aromatic hydroxycarboxylic acid, and the aromatic dicarboxylic acid may be present in the same reaction system. This is because the carboxyl group of the aromatic dicarboxylic acid and the optionally substituted substituent are not affected by the fatty acid anhydride. Therefore, the aromatic diol, the aromatic hydroxycarboxylic acid, and the aromatic dicarboxylic acid may be fed to the reactor, and then the deuteration step and the polymerization step may be sequentially performed, or the aromatic diol and the aromatic group may be used. After the dicarboxylic acid is fed to the reactor for the deuteration step, the aromatic dicarboxylic acid is further fed to the reactor for the polymerization step. The former method is preferred based on the viewpoint of simplifying the manufacturing steps. The transesterification reaction in the above polymerization step is preferably carried out at a temperature increase rate of 0.1 to 50 ° C /min from 130 ° C to 400 ° C, and more preferably from 150 ° C at a temperature increase rate of 0.3 to 5 ° C / min. Performed at 350 ° C. Further, in the transesterification reaction in the polymerization step, in order to shift the equilibrium, it is preferred to evaporate and remove the by-produced fatty acid (for example, acetic acid or the like) and unreacted fatty acid anhydride (for example, acetic anhydride) to the outside of the system. At this time, it is also possible to return to the reactor by condensing or subliming the raw material monomer or the like which is evaporated or sublimated together with the fatty acid by refluxing a part of the distilled fatty acid back to the reactor. The deuteration reaction of the deuteration step and the transesterification of the polymerization step may use a batch apparatus as a reactor, or a continuous apparatus may be used. The liquid crystal polyester usable in the present embodiment can be obtained by using any of the reaction devices. [0097] After the polymerization step, a step of polymerizing the liquid crystal polyester obtained by the polymerization step may be performed. For example, the liquid crystal polyester obtained by the polymerization step is cooled and pulverized to prepare a powdery liquid crystal polyester, and by heating the powder, the liquid crystal polyester can be polymerized. Further, the particulate liquid crystal polyester is granulated by cooling and pulverizing the powdery liquid crystal polyester, and then the high molecular weight of the liquid crystal polyester can be obtained by heating the particulate liquid crystal polyester. Chemical. The high molecular weight using this method is referred to as solid phase polymerization in the aforementioned technical field. Solid phase polymerization is particularly effective as a method for polymerizing a liquid crystal polyester. By polymerizing the liquid crystal polyester, a liquid crystal polyester having the above preferred flow initiation temperature can be obtained. The heat treatment in the solid phase polymerization is preferably carried out under an atmosphere of an inert gas such as nitrogen or under a reduced pressure. Further, the heating time in the solid phase polymerization is preferably from 1 to 20 hours. The heating temperature is preferably from 130 to 400 °C. Further, examples of the apparatus used for the heat treatment are known dryers, reactors, inert ovens, mixers, electric furnaces and the like. [Method of Blending Liquid Crystal Polyester Composition] The method of blending the raw material components of the liquid crystal polyester composition of the present embodiment is not particularly limited. For example, the liquid crystal polyester produced by the above method, the hollow filler, the fibrous filler, and the plate filler as needed or the above additives (that is, the above-mentioned release agent, heat stabilizer, etc.) can be individually supplied to Melt the mixer. Further, the raw material components may be premixed using a mortar, a Henschel mixer, a ball mill, a rib blender, or the like, and then supplied to a melt mixer. Further, particles prepared by melt-mixing the liquid crystal polyester and the fibrous filler may be mixed with the particles produced by melt-mixing the liquid crystal polyester and the hollow filler, and mixed at a desired blend ratio. [Manufacturing Method of Resin Molded Body] In the present embodiment, a CPU socket of the resin molded body shown in Fig. 1 is produced from the liquid crystal polyester composition obtained by the above-described blending method. For the production, for example, an injection molding method can be used. The injection molding in the present embodiment can be carried out by melting a liquid crystal polyester composition using a conventional injection molding machine, heating the molten liquid crystal polyester composition to an appropriate temperature, and ejecting it into a mold. The temperature at which the liquid crystal polyester composition is heated and melted for the injection is based on the flow initiation temperature Tp ° C of the liquid crystal polyester composition to be used, preferably [Tp+10] ° C or more, [Tp+ 50] below °C. Further, the mold temperature is preferably selected from the range of room temperature (for example, 23 ° C) to 180 ° C from the viewpoint of the cooling rate and productivity of the liquid crystal polyester composition. According to the present embodiment, a liquid crystal polyester composition capable of forming a resin molded article excellent in crack resistance and warpage resistance is provided. Moreover, by using these liquid crystal polyester compositions, a resin molded body excellent in crack resistance and warpage resistance, in particular, a connector is provided. Another viewpoint of the liquid crystal polyester composition of the present invention is a liquid crystal polyester composition comprising a liquid crystal polyester, a hollow filler, a fibrous filler, a desired plate filler, and other At least one selected from the group consisting of: the liquid crystal polyester contains structural units (A) 1 ), structural unit (B 1 ), structural unit (B 2 And structural units (C 1 ), construction unit (C 1 ) and structural unit (A 1 Mo ratio (C 1 )/(A 1 ) is 0.2 or more and 1.0 or less, and the structural unit (C) 1 Relative to the structural unit (B 1 ) and structural units (B 2 The total molar ratio {(B 1 )+(B 2 )}/(C 1 ) more than 0 and 1 or less, structural unit (B 1 ) and structural units (B 2 Mo ratio (B 2 )/(B 1 The hollow filler is at least one selected from the group consisting of glass, cerium oxide, aluminum oxide, urea resin, and phenol resin, preferably a glass sphere, and has a number average particle diameter of 5 μm or more. In the case of 100 μm or less, preferably 10 μm or more and 100 μm or less, the content of the hollow filler is 5 parts by mass or more and 80 parts by mass or less, preferably 10 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of the liquid crystal polyester. Hereinafter, the total mass of the liquid crystal polyester composition is 19 to 26% by mass; and the fibrous filler is at least one selected from the group consisting of glass fibers, cerium oxide alumina fibers, alumina fibers, and carbon fibers. Preferably, it is a glass fiber, and the number average fiber length is 20 μm or more and less than 190 μm, preferably 20 μm or more and 140 μm or less, more preferably 20 μm or more and 130 μm or less, and more preferably 20 μm or more and 80 μm or less. The content of the fibrous filler is 5 parts by mass or more and 80 parts by mass or less, preferably 1 or less, based on 100 parts by mass of the liquid crystal polyester. 0 parts by mass or more and 50 parts by mass or less, or 14 to 20% by mass based on the total mass of the liquid crystal polyester composition; the total content of the hollow filler and the fibrous filler described above, relative to the liquid crystal polyester 100 described above The mass part is 10 parts by mass or more and 100 parts by mass or less, preferably 30 parts by mass or more and 100 parts by mass or less, more preferably 50 parts by mass or more and 95 parts by mass or less, or 39 or less based on the total mass of the liquid crystal polyester composition. ~41% by mass. Still another aspect of the present invention is a connector formed by injection molding from the above liquid crystal polyester. [Embodiment] Hereinafter, an embodiment of the present invention will be described, but the present invention is not limited to the embodiment. The physical properties of the liquid crystal polyester were measured by the following methods. <Measurement of the flow initiation temperature of the liquid crystal polyester> A flow tester (manufactured by Shimadzu Corporation, model CFT-500) was used, and about 2 g of the liquid crystal polyester was filled in a nozzle having an inner diameter of 1 mm and a length of 10 mm. In the cylinder of the nozzle, at 9.8 MPa (100 kg/cm) 2 Under the load, the temperature is raised at a rate of 4 ° C / min, while the liquid crystal polyester is melted and extruded from the nozzle, the measurement shows 4800 Pa. The temperature of the viscosity of s (48000 poise). <Production Example (Production of Liquid Crystal Polyester)> A liquid crystal polyester was produced by the following method. [0110] First, in a reactor equipped with a stirring device, a torque meter, a nitrogen gas introduction tube, a thermometer, and a reflux cooler, the feed is obtained to obtain a structural unit (A) 1 ) p-hydroxybenzoic acid 994.5 g (7.2 mol), to obtain structural units (C 1 4,4'-dihydroxybiphenyl 446.9g (2.4m), obtained structural unit (B 1 ) terephthalic acid 299.0g (1.8 m), obtained structural unit (B 2 99.7 g (0.6 mol) of phthalic acid and 1347.6 g (13.2 mol) of acetic anhydride. At this time, the molar ratio (C 1 )/(A 1 ) about 0.3, molar ratio {(B 1 )+(B 2 )}/(C 1 ) is 1.0, molar ratio (B 2 )/(B 1 ) about 0.3. Next, after the reactor was sufficiently substituted with nitrogen, 0.18 g of 1-methylimidazole was added, and the temperature was raised from room temperature to 150 ° C under a nitrogen gas stream for 30 minutes, and the temperature was maintained at reflux for 30 minutes. Further, after 2.4 g of 1-methylimidazole was added, the distillate acetic acid or unreacted acetic anhydride was distilled off, and the temperature was raised from 150 ° C to 320 ° C at 2 hours and 50 minutes. Then, the point at which the torque rise is seen is regarded as the end of the reaction, and the contents are taken out. Next, the solid content (content) thus obtained was cooled to room temperature, and pulverized by a coarse pulverizer. The solid content after the pulverization was heated to room temperature from room temperature to 250 ° C in 1 hour under nitrogen atmosphere, and further heated to 250 ° C for 5 hours to 295 ° C, and further maintained at 295 ° C for 3 hours to carry out solid phase polymerization. Finally, a liquid crystal polyester is obtained by cooling the product obtained by solid phase polymerization. The resulting liquid crystal polyester had a flow initiation temperature of 327 °C. <Examples 1 to 3 and Comparative Examples 1 and 2 (Mixed and formed of liquid crystal polyester composition)> Using the liquid crystal polyester obtained in the production example, Examples 1 to 3 and Comparative Example 1 were produced as follows. ~2 CPU sockets each. [0115] The liquid crystal polyester and various fillers were blended in a mass composition ratio shown in Table 1, and a 2-axis extruder ("PCM-30" manufactured by Chiba Iron Works Co., Ltd.) was used at a cylinder temperature of 340 ° C. Granulation was carried out to obtain a particulate liquid crystal polyester composition (Examples 1 to 3 and Comparative Examples 1 to 4). Subsequently, the obtained particulate liquid crystal polyester composition was molded under the following molding conditions, and the connectors of Examples 1 to 3 and Comparative Examples 1 and 2 were produced (Fig. 1 (A), Fig. 1 (B), and Fig. 2). 2544 pin corresponds to the model CPU socket, hereinafter referred to as "CPU socket"). Further, various fillers used in the present embodiment are as follows. The number average fiber length, the number average fiber diameter, and the number average particle diameter of various filler materials are catalog values. [Filling material] (1) Hollow filler glass ball: S60HS (manufactured by Sumitomo 3M Co., Ltd.), number average particle size 20 μm (2) Fiber filler, ground glass fiber: EFH75-01 (limited by CENTRALFIBER) Company system), number average fiber length 75 μm, number average fiber diameter 11 μm: EFH150-01 (manufactured by CENTRALFIBER Co., Ltd.), number average fiber length 150 μm, number average fiber diameter 11 μm (3) granular filler glass beads: EGB731 ( POTTERS BALLOTINI CO., LTD., number average particle diameter 20 μm [0117] [Molding conditions] Molding machine: FANUC company, "ROBOSHOT S-2000i 30B" Cylinder temperature: 360 ° C Mold temperature: 100 ° C Injection speed: 250 mm / sec <Evaluation of CPU Sockets> The following seven types of CPU sockets obtained in Examples 1 to 3 and Comparative Examples 1 and 2 were evaluated as follows. (1) Warpage amount (evaluation of warpage resistance) The obtained CPU socket was placed on a glass plane, and the flatness measurement module "9030c" manufactured by CORRS Co., Ltd. was used to find any 92 points in the CPU socket. The height from the aforementioned glass plane. Next, using the aforementioned height of 92 points, the least square plane of the aforementioned CPU socket is calculated by the least square method. The distance from the least square plane to the highest point of the 92-point height when the minimum square plane height is moved in parallel so as to include the lowest point among the 92 points is calculated as the amount of warpage. [0120] Next, the CPU socket is subjected to heat treatment: heating from room temperature to 160 ° C at a temperature increase rate of 2 ° C / sec, holding at 160 ° C for 1 minute, and further increasing the temperature to 250 ° C at a temperature increase rate of 2 ° C / sec. Hold at 250 ° C for 1 minute, then slowly cool to 50 ° C. Next, after the heat-treated CPU socket was cooled to room temperature, the amount of warpage was measured in the same manner as above. The above operation was performed on three different test pieces (CPU sockets) produced in each of Examples 1 to 3 and Comparative Examples 1 and 2, and the average value thereof was "the amount of warpage after heating". The results are shown in Table 1. (2) Cracking (Evaluation of Crack Resistance) After the heat treatment, the CPU socket was cooled to room temperature, and a digital microscope ("VHX-1000" manufactured by KYENCE Co., Ltd., using the lens "VH-Z25") was used. Observe the CPU socket after heat treatment. Next, the number of cracks generated in the CPU socket is measured. The same measurement was performed on the three CPU sockets, and the average of the three measured values was set as the number of crack generations. Table 1 shows the number of occurrences of cracks in the CPU sockets of Examples 1 to 3 and Comparative Examples 1 and 2. (3) Volume specific heat First, the specific heat capacity (unit: J/gK) of the liquid crystal polyester compositions used in Examples 1 to 3 and Comparative Examples 1 and 2 was measured by the method described in JIS K7123:2012. Specifically, a test piece (ASTM No. 4 dumbbell test piece) prepared from the liquid crystal polyester compositions used in Examples 1 to 3 and Comparative Examples 1 and 2 was used, and a differential scanning calorimeter (manufactured by Shimadzu Corporation) was used. "DSC-50"), the specific heat capacity (J/gK) at 100 ° C was measured. [0124] Next, a test piece (ASTM No. 4 dumbbell test piece) prepared from the liquid crystal polyester compositions used in Examples 1 to 3 and Comparative Examples 1 and 2 was used, and a solid specific gravity meter (manufactured by Kanto Measurement Co., Ltd., ASG-320K") Determination of density (g/cm 3 ). Using the measured specific heat capacity and density, the volume specific heat was calculated from the following formula. Table 1 shows the volume specific heat of the liquid crystal polyester compositions used in Examples 1 to 3 and Comparative Examples 1 and 2. Volume specific heat (J/cm 3 K) = specific heat capacity (J / gK) × density (g / cm 3 (4) Number average fiber length (after particle forming process) The liquid crystal polyester compositions of Examples 1 to 3 and Comparative Examples 1 and 2 which were formed into pellets by a 2-axis extruder were taken from 2 g to 坩埚. This was ashed in an electric furnace at 600 ° C for 4 hours to obtain a residue. The residue was dispersed in water, and the number average fiber length of the fibrous filler was measured using a moving image analysis method/particle analyzer PITA-3 (manufactured by SEISHIN Co., Ltd.). As the filtration conditions (analysis conditions), the aspect ratio is less than 2, and the circumscribed rectangular short diameter (fiber diameter) is less than 5 μm and exceeds 20 μm, and the thinned pixels (fiber length) are less than 20 μm as non-fibrous filler. Except for all. [0126] As shown in Table 1, in Example 1, 33.3 parts by mass of the fibrous filler having a measured value of the average fiber length of 70 μm and a hollow filler were used with respect to 100 parts by mass of the resin component (liquid crystal polyester). 33.3 parts by mass of the liquid crystal polyester composition. The liquid crystal polyester composition has a volume specific heat of 1.95 (J/cm). 3 K). On the other hand, in Comparative Example 2, 33.3 parts by mass and granular content of the fibrous filler having a measured value of the number average fiber length of less than 190 μm (measured value: 70 μm) was used with respect to 100 parts by mass of the liquid crystal polyester. 33.3 parts by mass of the liquid crystal polyester composition of the filler. The CPU socket of Comparative Example 2 has a larger amount of warpage after heating and a larger number of cracks than the CPU socket of the first embodiment. It is considered that the volume specific heat of the liquid crystal polyester composition of Comparative Example 2 is higher than that of the liquid crystal polyester composition of Example 1. From the results of Example 1 and Comparative Example 2, it was revealed that the volume specific heat of the CPU socket can be reduced by adding a hollow filler. Further, in Comparative Example 1, a liquid crystal polyester composition containing 66.7 parts by mass of a fibrous filler having a measured average number of fiber lengths of less than 190 μm (measured value: 70 μm) was used with respect to 100 parts by mass of the liquid crystal polyester. Things. As a result of the first embodiment and the comparative example 1, it was revealed that the amount of warpage and the number of occurrences of cracks in the CPU socket after heating can be reduced by adding the hollow filler. As described above, according to the present embodiment, it is shown that a connector capable of suppressing generation of cracks and having a small amount of warpage can be provided. [Industrial Applicability] According to the present invention, a liquid crystal polyester composition capable of forming a resin molded article excellent in crack resistance and warpage resistance, and a resin molded body using the same, particularly a connector Therefore, it is extremely useful in the industry.

[0132][0132]

100‧‧‧連接器(CPU插座)100‧‧‧Connector (CPU socket)

101‧‧‧開口部101‧‧‧ openings

102‧‧‧外框部102‧‧‧Outer frame

103‧‧‧內框部103‧‧‧Inside frame

104‧‧‧銷插入孔104‧‧‧ pin insertion hole

201‧‧‧最小壁厚部201‧‧‧Minimum wall thickness

[0021]   圖1A係顯示本發明實施形態之連接器的構造之俯視圖。   圖1B係圖1A的A-A線剖面圖。   圖2係圖1A之部分放大圖。1A is a plan view showing the structure of a connector according to an embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line A-A of Fig. 1A. Figure 2 is a partial enlarged view of Figure 1A.

Claims (7)

一種液晶聚酯組成物,其包含液晶聚酯、中空狀填充材、數平均纖維長為20μm以上且未達190μm之纖維狀填充材。A liquid crystal polyester composition comprising a liquid crystal polyester, a hollow filler, and a fibrous filler having a number average fiber length of 20 μm or more and less than 190 μm. 如請求項1之液晶聚酯組成物,其中前述中空狀填充材係數平均粒徑為5μm以上且100μm以下。The liquid crystal polyester composition of claim 1, wherein the hollow filler has a coefficient average particle diameter of 5 μm or more and 100 μm or less. 如請求項1或2之液晶聚酯組成物,其中前述纖維狀填充材係數平均纖維徑為5μm以上且20μm以下。The liquid crystal polyester composition according to claim 1 or 2, wherein the fibrous filler has an average fiber diameter of 5 μm or more and 20 μm or less. 如請求項1~3中任一項之液晶聚酯組成物,其中前述液晶聚酯係對於前述液晶聚酯之全部重複單位之合計含有30莫耳%以上之下述構造單位:The liquid crystal polyester composition according to any one of claims 1 to 3, wherein the liquid crystal polyester contains 30 mol% or more of the following structural units for the total of all repeating units of the liquid crystal polyester: . 如請求項1~4中任一項之液晶聚酯組成物,其於100℃之容積比熱為1.0J/cm3 K以上3.0J/cm3 K以下。The liquid crystal polyester composition according to any one of claims 1 to 4, which has a volume specific heat at 100 ° C of 1.0 J/cm 3 K or more and 3.0 J/cm 3 K or less. 一種樹脂成形體,其係以如請求項1~5中任一項之液晶聚酯組成物所形成。A resin molded body formed by the liquid crystal polyester composition according to any one of claims 1 to 5. 如請求項6之樹脂成形體,其係連接器。The resin molded body of claim 6, which is a connector.
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