TW201821207A - Processing vehicle with composite processes and laser spectroscopic means thereof - Google Patents

Abstract

A processing vehicle with composite processes and a laser spectroscopic means thereof are provided. The processing vehicle has a processing platform, a machining device and a laser spectroscopic means. The time of a workpiece processed by composite processes can be reduced effectively by producing a plurality of light beams to the workpiece from the laser spectroscopic means, and by assembling a tool head or a feeding head to the machining device.

Description

 Composite processing machine and laser beam splitting device  

The present invention relates to a processing machine and a laser beam splitting device thereof, and more particularly to a composite processing machine and a laser beam splitting device thereof for use in a computer numerical control machine tool.

The traditional machine tool mainly controls the mechanical feed to complete the processing according to the operator's operation technology. Therefore, the product is not affected by human factors, and has the disadvantages of high cost and low production efficiency. With the advent of the Computer Numerical Control (CNC) machine tool, it offers higher processing accuracy, lower cost and higher productivity than traditional machine tools.

The general computer numerical control machine tool can perform various cutting operations by replacing different tool heads, and in the process of cutting, other processing machines must be used in the process of welding or heat treatment. In particular, for laser processing, for example, when laser cladding is used, it must be handled using a dedicated laser machine.

However, when these laser processing machine tools are used in the entire metal processing process, the workpiece to be processed needs to be moved, fixed, processed in different machine tools, and then repeatedly disassembled, moved, fixed, and Processing, resulting in a significant increase in the time required for processing. In addition, the above-mentioned computer numerical control machine tool needs to have a tool change action and time when using laser processing, and the mechanical subtraction processing and the laser addition processing and the laser subtraction processing cannot be simultaneously performed, thereby limiting the computer. Numerical control of the machining efficiency of the machine tool.

Therefore, it is necessary to provide an improved processing machine for composite processing to solve the problems of the conventional technology.

The main object of the present invention is to provide a processing machine for composite processing, which can generate a plurality of light beams for a workpiece by using a laser beam splitting device, and can be combined with a machining device to combine a cutter head or a feed head, thereby effectively shortening the implementation of the workpiece. The time of compound processing.

In order to achieve the above object, the present invention provides a processing machine for composite processing, the processing machine comprising a processing platform, a machining device and a laser beam splitting device; wherein the processing platform is for placing a workpiece; The machining device has a body and a main shaft mounted on the base body and configured to combine a cutter head or a feed head; the laser beam splitting device is disposed on one side of the main shaft and has a split mode The light splitting module is configured to divide a laser into at least two light beams, and the light output ports are respectively used to output the light beams to the workpiece, wherein the light beams can be general light beams or Complex coupled beams.

In an embodiment of the invention, the beam splitting module has an incident mirror, a beam splitter box and at least two conductive tubes, wherein the incident mirror is used to join the laser, and the beam splitter box is used to divide the laser beam. For the beams, the conductive conduits are used to respectively direct the beams to the light exits.

In an embodiment of the invention, the beam splitting module further has a plurality of mirrors disposed on the conductive lines for reflecting the light beams to the corresponding light exit ports.

In an embodiment of the invention, the laser beam splitting device further has two positioning modules respectively disposed on the conductive lines for adjusting a heat affected zone of each light exit port.

In an embodiment of the present invention, the composite processing machine further has a moving unit including an X-axis slide rail and a Y-axis slide rail, and the processing platform is movably combined on the X-axis slide rail, the X A shaft slide is movably combined on the Y-axis slide.

In an embodiment of the invention, the moving unit further has a Z-axis slide, and the seat of the machining device is movably combined on the Z-axis slide.

In order to achieve the above object, the present invention further provides a laser beam splitting device mounted on a side of a spindle of a processing machine, the laser beam splitting device comprising a beam splitting module and two light exiting openings; wherein the beam splitting module is surrounded by The laser beam is divided into a plurality of light beams, wherein the light splitting module has an incident mirror and a light splitting box, and the incident mirror is used to join the laser. The light splitting box is disposed. On one side of the incident mirror, the conductive conduits are disposed on opposite sides of the beam splitter box for respectively guiding the light beams; the light exit ports are respectively disposed on the conductive pipelines for The beam output has a diffractive element and a dichroic mirror for splitting the laser into two beams, and the dichroic mirror respectively reflects the two beams to the conductive lines.

In an embodiment of the invention, the light exit ports are respectively located on opposite sides of the main shaft, and a focusing mirror is disposed before each of the light exit ports.

In an embodiment of the invention, the laser beam splitting device further has two positioning modules respectively disposed on the conductive lines for adjusting a heat affected zone of each light exit port.

In an embodiment of the invention, each positioning module has a telescopic portion and a rotating portion, wherein the telescopic portion is used for linearly adjusting a heat-affected zone of the corresponding light-emitting port, and the rotating portion is configured to rotate and adjust the corresponding light-emitting portion. The heat affected zone of the mouth.

As described above, the laser beam splitting device can generate a plurality of light beams to process the workpiece, and the spindle can be used to combine the tool head or the feed head to perform mechanical subtractive processing, laser subtraction processing, and Laser processing, by means of subtractive processing of hybrid machinery, laser subtractive processing and laser processing to achieve the purpose of composite processing, while reducing the loading and unloading of multiple processing tools, can effectively shorten the processing The time for implementing the composite processing and improving the processing efficiency.

100‧‧‧Composite processing machine

101‧‧‧Processed parts

102‧‧‧Tool head

103‧‧‧Feeding head

104‧‧‧ Beam

105‧‧‧heat affected zone

106‧‧‧Materials

2‧‧‧Processing platform

3‧‧‧Mechanical processing equipment

31‧‧‧

32‧‧‧ Spindle

4‧‧‧Laser spectroscopic device

41‧‧‧Distribution Module

411‧‧‧Injection mirror

412‧‧ ‧ splitter box

413‧‧‧Transmission pipeline

414‧‧‧Mirror

414’‧‧·Mirror

415‧‧‧diffractive components

416‧‧‧Splitting mirror

417‧‧‧ focusing mirror

42‧‧‧Light outlet

43‧‧‧ Positioning Module

431‧‧‧Flexing Department

432‧‧‧Rotating Department

5‧‧‧Mobile unit

51‧‧‧X-axis slide

52‧‧‧Y-axis slide

53‧‧‧Z-axis slide

1 is a perspective view of a preferred embodiment of a processing machine for composite processing according to the present invention; and FIG. 2 is a perspective view of a laser beam splitting device according to a preferred embodiment of the processing machine of the composite processing of the present invention; 3 is a top view of a laser beam splitting device according to a preferred embodiment of the processing machine of the composite processing of the present invention; and FIG. 4 is a perspective view of another preferred embodiment of the processing machine for composite processing according to the present invention; And Figures 5 and 6 are perspective views of still another preferred embodiment of the processing machine for composite processing according to the present invention.

The above and other objects, features and advantages of the present invention will become more <RTIgt; Furthermore, the directional terms mentioned in the present invention, such as upper, lower, top, bottom, front, rear, left, right, inner, outer, side, surrounding, central, horizontal, horizontal, vertical, longitudinal, axial, Radial, uppermost or lowermost, etc., only refer to the direction of the additional schema. Therefore, the directional terminology used is for the purpose of illustration and understanding of the invention.

Referring to FIG. 1 , a preferred embodiment of the composite processing machine 100 of the present invention can be applied to a computer numerical control (CNC) machine tool, wherein the composite processing machine 100 is The composite processing device 100 includes a processing platform 2, a machining device 3, a laser beam splitting device 4, and a mobile unit 5, The invention will be described in detail below for the detailed construction, assembly relationship and operation principle of each component.

Referring to FIG. 1 , the processing platform 2 is used to place the workpiece 101 , wherein the processing platform 2 is disposed under the machining device 3 , and the processing platform 2 and the machining device 3 are spaced apart from each other. .

Referring to FIG. 1 , the machining device 3 has a body 31 and a spindle 32. The spindle 32 is mounted on the base 31, and a bottom of the spindle 32 can be combined with a cutter head 102. The head 102 can be used to mount a milling tool or a turning tool.

Referring to FIGS. 1 to 3, the laser beam splitting device 4 is disposed on one side of the main shaft 32 of the machining device 3. The laser beam splitting device 4 has a beam splitting module 41, two light exit ports 42 and two. The locating module 43 is configured to divide a laser (not shown) of a laser source into two beams 104, and the light exit ports 42 are respectively located on opposite sides of the main shaft 32, and the light is emitted. The port 42 is configured to output the light beams 104 to the workpiece 101, and the positioning modules 43 are disposed on the beam splitting module 41 for adjusting a heat affected zone 105 of each light exit port 42, wherein The beams 104 can be either general or complex coupled beams.

Referring to FIG. 2 and FIG. 3 , in particular, the beam splitting module 41 has an incident mirror 411 , a beam splitter 412 , two conductive conduits 413 , and a plurality of mirrors 414 . a laser beam entering the laser source, the beam splitter 412 is disposed on one side of the incident mirror 411 for dividing the laser of the laser source into the light beams 104, wherein the light splitter box 412 has a diffraction The element 415 and a dichroic mirror 416 are used to split the laser into two beams. The dichroic mirror 416 reflects the two beams to the conductive lines 413, respectively. The opposite sides of the beam splitter box 412 are disposed to respectively guide the light beams 104 to the light exit ports 42. The mirrors 414 are disposed on the conductive lines 413 for reflecting the light beams 104 to the corresponding light exits 42. In addition, each of the light exit ports 42 is provided with a focusing mirror 417 for making the light beams 104 After focusing, the light exiting openings 42 are projected from the light exiting openings 42 to the heat affected zone 105.

Referring to FIGS. 2 to 3, further, each positioning module 43 has a telescopic portion 431 and a rotating portion 432. As shown in FIG. 2, the telescopic portion 431 is sleeved in a corresponding conductive conduit. In the 413, the heat-affected zone 105 of the corresponding light-emitting port 42 can be linearly adjusted in the direction of the arrow; and the rotating part 432 is pivotally connected to the telescopic part 431, and can rotate back and forth in the direction of the arrow and pass through the other The mirror 414' adjusts the heat affected zone 105 of the corresponding light exit 42.

Referring to FIG. 1 , the moving unit 5 includes an X-axis slide rail 51 , a Y-axis slide rail 52 and a Z-axis slide rail 53 , wherein the processing platform 2 is combined on the X-axis slide rail 51 , and Moving on the X-axis slide rail 51 along an X-axis direction, the X-axis slide rail 51 is combined on the Y-axis slide rail 52, and moves along the Y-axis direction on the Y-axis slide rail 52; The seat body 31 of the machining device 3 is combined on the Z-axis slide rail 53 and moves on the Z-axis slide rail 53 in a Z-axis direction, that is, through the above-described movement, enabling the spindle 32 to be in the workpiece. Move anywhere above 101.

According to the above structure, as shown in FIG. 1 , the mobile unit 5 is first controlled by a controller (not shown) to adjust the position of the spindle 32 above the workpiece 101, and then the positioning module 43 is controlled. The expansion and contraction portion 431 and the rotating portion 432 move the heat-affected zone 105 of the light beams 104 on the workpiece 101, and remove the material portion of the workpiece 101 by laser. In addition, the tool head 102 mounted on the spindle 32 can also perform mechanical subtractive processing such as cutting, drilling and milling through a milling tool or a turning tool, thereby achieving various subtractive processing purposes while reducing multiple processing tools. Attachment and replacement.

Referring to FIG. 4, in another embodiment, the processing machine 100 of the composite processing apparatus can also pass through the laser beam splitting device 4 to the workpiece 101, that is, the expansion and contraction portion 431 that controls the positioning module 43. And the rotating portion 432 moves the heat-affected zone 105 of the light beams 104 on the workpiece 101, and performs laser subtraction processing on the workpiece 101, such as drilling, cutting, marking, and surface treatment.

Referring to FIGS. 5 and 6, in another embodiment, a bottom portion of the main shaft 32 can be combined with a supply head 103, wherein the supply head 103 can powder the material processed to the workpiece 101. It is discharged into the workpiece 101 in a shape, a gel shape or a line shape. As shown in FIG. 5, the controller controls the expansion and contraction portion 431 and the rotation portion 432 of the positioning module 43 to move the heat-affected zone 105 of the light beams 104 on the workpiece 101, and synchronously feed the material. The material 106 of the head 103 is melted or sintered to effect laser processing, such as laminate manufacturing, soldering, and repair, wherein the material 106 is fed in a manner that outputs a powder, gel, or wire. As shown in Fig. 6, by adjusting the heat-affected zone 105 of the beams 104, the beams 104 are subjected to laser subtraction processing and laser addition processing, respectively.

As described above, the laser beam splitting device 4 can be used to generate a plurality of light beams 104 for processing the workpiece 101, and at the same time, the spindle 32 can be used to combine the tool head 102 or the feed head 103 to perform mechanical subtractive processing. Laser subtraction processing and laser addition processing, thereby achieving the purpose of composite processing by subtractive processing of hybrid machinery, laser subtractive processing, and laser addition processing, while reducing the loading and unloading of multiple processing tools It can effectively shorten the processing time and improve the processing efficiency.

The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

Claims (10)

 A processing machine for composite machining, comprising: a processing platform for placing a workpiece; a machining device having: a body; and a spindle mounted on the body and combining a cutter head or a a supply head; and a laser beam splitting device disposed on one side of the spindle, and having: a beam splitting module for dividing a laser into at least two beams; and at least two light exit ports for respectively respectively The equal beam is output to the workpiece.    The processing machine of the composite processing according to claim 1, wherein the beam splitting module has: an incident mirror for merging the laser; and a beam splitter for dividing the laser into the beams And at least two conductive lines for respectively guiding the light beams to the light exit ports.    The processing machine of the composite processing according to claim 2, wherein the beam splitting module further has a plurality of mirrors disposed on the conductive lines for reflecting the light beams to the corresponding light exit ports.    The processing machine of the composite processing according to claim 2, wherein the laser beam splitting device further has two positioning modules respectively disposed on the conductive pipes for adjusting a heat affected zone of each light exit port. .    The processing machine of the composite processing according to claim 1, wherein the composite processing machine further has a moving unit comprising an X-axis slide rail and a Y-axis slide rail, wherein the processing platform is movably combined On the X-axis slide, the X-axis slide is movably combined on the Y-axis slide.    The processing machine of the composite machining of claim 5, wherein the moving unit further has a Z-axis slide, and the seat of the machining device is movably combined on the Z-axis slide.    A laser beam splitting device is mounted on one side of a spindle of a processing machine, the laser beam splitting device comprising: a beam splitting module surrounding the spindle for splitting the laser into two beams, wherein The beam splitting module has: an incident mirror for merging the laser; a beam splitter disposed on one side of the incident mirror; and two conductive conduits disposed on opposite sides of the splitter box for respectively Directing the beams, the beam splitter has: a diffractive element for splitting the laser into two beams; and a beam splitting mirror that reflects the two beams to the conductive lines; and two light exits They are respectively disposed on the conductive pipes for outputting the beams.    The laser beam splitting device of claim 7, wherein the light exit ports are respectively located on opposite sides of the main shaft, and a focusing mirror is disposed before each of the light exit ports.    The laser beam splitting device of claim 7, further comprising two positioning modules respectively disposed on the conductive lines for adjusting a heat affected zone of each light exit port.    The laser beam splitting device of claim 9, wherein each positioning module has: a telescopic portion for linearly adjusting a heat-affected zone of the corresponding light-emitting port; and a rotating portion for rotating and adjusting the corresponding The heat affected zone of the light exit.