TW201817717A - Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic element - Google Patents

Abstract

To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

Description

Hydrogen barrier agent, composition for forming hydrogen barrier film, hydrogen barrier film, method for producing hydrogen barrier film, and electronic component

The present invention relates to a hydrogen barrier agent, a composition for forming a hydrogen barrier film, a hydrogen barrier film, a method for manufacturing a hydrogen barrier film, and an electronic component.

Since the past, various functional films have been formed in various electronic components. With the development of conductive organic materials or organic semiconductors in electronic components, the development of organic electronic components has also progressed accordingly. As a representative example of the organic electronic device, an organic EL (Electroluminescence) device can be cited. When the electronic device is an organic EL device, examples of the functional film include a passivation film, a transparent electrode film, a transparent insulating layer, a planarization film, an organic light-emitting film, and a protective film. Electronic devices are often equipped with thin-film transistors (TFTs) for driving the devices, such as organic EL devices. In addition, electronic components often include wirings including metals such as copper. Here, the TFT may cause reduction in function due to reduction reaction caused by contact with hydrogen, and the metal wiring may also cause changes in electrical characteristics due to reduction caused by hydrogen. On the other hand, among materials for functional films in electronic components, there are materials that cause hydrogen to be released due to a method of manufacturing the materials. For example, SiN, which is used as a material for a passivation film, may contain ammonia gas depending on the manufacturing method. Therefore, there is a case where hydrogen generated from the decomposition of ammonia is generated from SiN. As described above, in electronic components such as organic EL devices, members such as TFTs and metal wiring may be adversely affected due to the internal generation of hydrogen. Based on this problem, for example, a method of including a metal thin film as a hydrogen absorbing substance in an organic electric field light emitting element (organic EL element) has been proposed (see Patent Document 1). [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent Laid-Open No. 2015-79755

[Problems to be Solved by the Invention] However, the method described in Patent Document 1 is difficult to apply to a part where transparency is required, and the step of making the electronic component contain a hydrogen-absorbing substance is added to the method of manufacturing the electronic component, not only making the electronic component The manufacturing steps become complicated, and become the main cause of rising manufacturing costs of electronic components. Therefore, there is a need for a hydrogen barrier agent that can impart hydrogen barrier properties to a functional layer by blending in a functional layer originally provided in an electronic component, or a hydrogen barrier film formed using the hydrogen barrier agent. The present invention has been made in view of the above problems, and an object thereof is to provide a hydrogen barrier agent capable of imparting hydrogen barrier properties to various materials, a composition for forming a hydrogen barrier film containing the hydrogen barrier agent, and a hydrogen barrier containing the hydrogen barrier agent. A film, a method for producing a hydrogen barrier film using the composition for forming a hydrogen barrier film, and an electronic component provided with the hydrogen barrier film. [Technical means to solve the problem] The present inventors have found that a compound for forming hydrogen barrier film is prepared by using a compound having a specific structure of an imidazolyl group as a hydrogen barrier agent, and formulating the above-mentioned hydrogen barrier agent in a substrate component, The above-mentioned problem can be solved by forming a hydrogen barrier film using the composition for forming a hydrogen barrier film, and the present invention has been completed. Specifically, the present invention provides the following. Furthermore, the "hydrogen" which is the object of the "hydrogen barrier" performance of the present invention refers to both the H ₂ molecule, the H radical, the various components of H ⁺ (proton), and the entire mixed component including a combination of each component. A first aspect of the present invention is a hydrogen barrier agent comprising a compound represented by the following formula (0): [化 1] (In formula (0), R ² is an aromatic group which may have a substituent, R ³⁰ represents a hydrogen atom or a monovalent substituent having 1 to 40 carbon atoms; R ⁴ is a halogen atom, a hydroxyl group, a mercapto group, Thio group, silyl group, silanol group, nitro group, nitroso group, sulfonato group, phosphine group, oxyphosphino group, phosphonato group or organic group, n is 0 or more and An integer less than 3). A second aspect of the present invention is a composition for forming a hydrogen barrier film, which contains a substrate component (A) and a hydrogen barrier agent (B) in the first aspect. A third aspect of the present invention is a hydrogen barrier film containing the hydrogen barrier agent of the first aspect. A fourth aspect of the present invention is a hydrogen barrier film comprising a hardened material of a composition for forming a hydrogen barrier film, and the composition for forming a hydrogen barrier film is a composition for forming a hydrogen barrier film according to a second aspect, and The material component (A) contains an alkali-soluble resin (A1) and a photopolymerizable compound (A2), and further contains a photopolymerization initiator (C). A fifth aspect of the present invention is a method for manufacturing a hydrogen barrier film, comprising: applying a composition for forming a hydrogen barrier film on a substrate to form a coating film; and the composition for forming a hydrogen barrier film is a second aspect. The composition for forming a hydrogen barrier film, and the base material component (A) contains an alkali-soluble resin (A1) and a photopolymerizable compound (A2), and further contains a photopolymerization initiator (C); the coating film is exposed. A sixth aspect of the present invention is an electronic component including a passivation film and a hydrogen barrier film of the third aspect or the fourth aspect. [Effects of the Invention] According to the present invention, it is possible to provide a hydrogen barrier agent capable of imparting hydrogen barrier properties to various materials, a composition for forming a hydrogen barrier film containing the hydrogen barrier agent, a hydrogen barrier film containing the hydrogen barrier agent, and use thereof. A method for producing a hydrogen barrier film of the composition for forming a hydrogen barrier film, and an electronic component including the hydrogen barrier film.

≪Hydrogen barrier agent≫ The hydrogen barrier agent contains a compound represented by the following formula (0). The hydrogen barrier agent can be formulated into various materials to impart hydrogen barrier properties to various articles. [Chemical 2] (In formula (0), R ² Is an aromatic group which may have a substituent, R ³⁰ A hydrogen atom or a monovalent substituent having 1 to 40 carbon atoms; R ⁴ Is a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonate group, a phosphine group, an phosphine group, a phosphonate group, or an organic group, and n is 0 or more and (Integer 3 or less) In formula (0), R ² It is an aromatic group which may have a substituent. The aromatic group which may have a substituent may be an aromatic hydrocarbon group which may have a substituent, or an aromatic heterocyclic group which may have a substituent. The type of the aromatic hydrocarbon group is not particularly limited as long as the object of the present invention is not hindered. The aromatic hydrocarbon group may be a monocyclic aromatic group, or a group formed by condensing two or more aromatic hydrocarbon groups, or a group formed by bonding two or more aromatic hydrocarbon groups through a single bond. The aromatic hydrocarbon group is preferably a phenyl group, a naphthyl group, a biphenyl group, an anthracenyl group, or a phenanthryl group. The type of the aromatic heterocyclic group is not particularly limited as long as it does not hinder the object of the present invention. The aromatic heterocyclic group may be a monocyclic group or a polycyclic group. The aromatic heterocyclic group is preferably pyridyl, furyl, thienyl, imidazolyl, pyrazolyl, oxazolyl, thiazolyl, isoxazolyl, isothiazolyl, benzoxazolyl, benzo Thiazolyl and benzimidazolyl. Examples of the substituent which the phenyl, polycyclic aromatic hydrocarbon group, or aromatic heterocyclic group may have include a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, a nitroso group, and a sulfinyl group. Acid, sulfo, sulfonate, phosphine, phosphinyl, phosphino, phosphonate, amine, ammonium and organic groups. When a phenyl group, a polycyclic aromatic hydrocarbon group, or an aromatic heterocyclic group has a plurality of substituents, the plurality of substituents may be the same or different. When the substituent of the aromatic group is an organic group, examples of the organic group include an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an aralkyl group. The organic group may contain a bond or a substituent other than a hydrocarbon group such as a hetero atom in the organic group. The organic group may be any of linear, branched, and cyclic. The organic group is usually monovalent, and when the cyclic structure is formed, the organic group may be an organic group having a divalent or higher valence. When the aromatic group has a substituent on an adjacent carbon atom, the two substituents bonded to the adjacent carbon atom may be bonded to form a cyclic structure. Examples of the cyclic structure include an aliphatic hydrocarbon ring or an aliphatic ring containing a hetero atom. When the substituent of the aromatic group is an organic group, the bond contained in the organic group is not particularly limited as long as the effect of the present invention is not hindered. The organic group may include an oxygen atom, a nitrogen atom, and a silicon atom. And other heteroatomic bonds. Specific examples of the heteroatom-containing bond include an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, an amido bond, a urethane bond, and an imine bond (-N = C ( -R)-, -C (= NR)-: R represents a hydrogen atom or an organic group), a carbonate bond, a sulfonium bond, a sulfinium bond, an azo bond, and the like. As the bond containing a hetero atom that an organic group may have, from the viewpoint of heat resistance of the compound represented by formula (0), an ether bond, a thioether bond, a carbonyl bond, a thiocarbonyl bond, an ester bond, and fluorene are preferred. Amine bond, amine bond (-NR-: R represents a hydrogen atom or a monovalent organic group), urethane bond, imine bond (-N = C (-R)-, -C (= NR)- : R represents a hydrogen atom or a monovalent organic group), a carbonate bond, a sulfonium bond, and a sulfinium bond. When the organic group is a substituent other than a hydrocarbon group, the kind of the substituent other than the hydrocarbon group is not particularly limited as long as it does not hinder the object of the present invention. Specific examples of the substituent other than the hydrocarbon group include a halogen atom, a hydroxyl group, a mercapto group, a thio group, a cyano group, an isocyano group, a cyanate group, an isocyanate group, a thiocyanate group, an isothiocyanate group, a silicon group, Silanol, alkoxy, alkoxycarbonyl, amine, monoalkylamino, dialkylaluminum, monoarylamino, diarylamino, carbamoyl, thiocarbamidine Base, nitro, nitroso, carboxylate, fluorenyl, fluorenyl, sulfinyl, sulfonate, phosphine, phosphine, phosphonate, alkyl ether, alkenyl Ether group, alkyl sulfide group, alkenyl sulfide group, aryl ether group, aryl sulfide group, and the like. The hydrogen atom contained in the substituent may be substituted by a hydrocarbon group. Moreover, the hydrocarbon group contained in the said substituent may be any of linear, branched, and cyclic. As a substituent of a phenyl group, a polycyclic aromatic hydrocarbon group or an aromatic heterocyclic group, an alkyl group having 1 to 12 carbon atoms, an aryl group having 1 to 12 carbon atoms, and a carbon atom are preferred. An alkoxy group having 1 or more and 12 or less, an aryloxy group having 1 or more and 12 or less carbon atoms, an arylamino group having 1 or more and 12 or less carbon atoms, and a halogen atom. As R ² In terms of the effect of the present invention, a phenyl group, a furyl group, and a thienyl group which may each have a substituent are preferred. In formula (0), R ³⁰ A hydrogen atom or a monovalent substituent having 1 to 40 carbon atoms. In R ³⁰ When it is a monovalent substituent having 1 to 40 carbon atoms, it is regarded as R ³⁰ The monovalent substituent is not particularly limited, and examples thereof include an alkyl group having 1 to 40 carbon atoms which may have a substituent or a π conjugate group having 4 to 40 carbon atoms which may have a substituent. Examples of the substituent which the alkyl group or the π conjugate group may have include a carboxyl group, an alkoxycarbonyl group, an alkyl group, an aryl group, a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, and a nitrate. Group, nitroso group, sulfonate group, phosphine group, phosphine group, phosphonate group and the like. As R ³⁰ Is preferably an alkyl group which may have a substituent, and is preferably a monovalent group represented by the following formula (0-1). [Chemical 3] (In formula (0-1), R ¹ Is a hydrogen atom or an alkyl group, R ³ Is an alkylene group which may have a substituent; * is a bonding bond) In formula (0-1), R ¹ Is a hydrogen atom or an alkyl group. In R ¹ In the case of an alkyl group, the alkyl group may be a linear alkyl group or a branched alkyl group. The number of carbon atoms of the alkyl group is not particularly limited, but is preferably 1 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 1 or more and 5 or less. As for R ¹ Specific examples of preferred alkyl groups include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, n-pentyl, and isopentyl. Base, third pentyl, n-hexyl, n-heptyl, n-octyl, 2-ethyl-n-hexyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl , N-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl, n-nonadecyl and n-icosyl. In formula (0-1), R ³ It is an alkylene group which may have a substituent. The substitution that the alkylene group may have is not particularly limited as long as it does not hinder the object of the present invention. Specific examples of the substituent which the alkylene group may have include a hydroxyl group, an alkoxy group, an amine group, a cyano group, and a halogen atom. The alkylene group may be a linear alkylene group or a branched alkylene group, and is preferably a linear alkylene group. The number of carbon atoms of the alkylene group is not particularly limited, but is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, still more preferably 1 or more and 5 or less, and particularly preferably methylene. The number of carbon atoms of the alkylene group does not include the carbon atoms of the substituents bonded to the alkylene group. The alkoxy group as a substituent bonded to an alkylene group may be a linear alkoxy group or a branched alkoxy group. The number of carbon atoms of the alkoxy group as a substituent is not particularly limited, but is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and even more preferably 1 or more and 3 or less. The amine group as a substituent bonded to an alkylene group may be a monoalkylamine group or a dialkylamine group. The alkyl group contained in the monoalkylamino group or the dialkylamino group may be a linear alkyl group or a branched alkyl group. The number of carbon atoms of the alkyl group contained in the monoalkylamino group or the dialkylamino group is not particularly limited, but is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, particularly preferably 1 or more and 3 or less. As for R ³ Specific examples of preferred alkylene groups include methylene, ethane-1,2-diyl, n-propane-1,3-diyl, n-propane-2,2-diyl, and n-butane. -1,4-diyl, n-pentane-1,5-diyl, n-hexane-1,6-diyl, n-heptane-1,7-diyl, n-octane-1,8-diyl , N-nonane-1,9-diyl, n-decane-1,10-diyl, n-undecane-1,11-diyl, n-dodecane-1,12-diyl, n-tridecane Alkan-1,13-diyl, n-tetradecane-1,14-diyl, n-pentadecan-1,15-diyl, n-hexadecane-1,16-diyl, n-heptadecane- 1,17-diyl, n-octadecane-1,18-diyl, n-nonadecane-1,19-diyl, and n-icosane-1,20-diyl. In formula (0), R ⁴ Is a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonate group, a phosphine group, an phosphine group, a phosphonate group, or an organic group, and n is 0 or more and An integer of 3 or less. When n is an integer of 2 or more and 3 or less, plural Rs ⁴ They may be the same or different. In R ⁴ In the case of an organic group, the organic group is related to R ² The aromatic group may have the same organic group as a substituent. In R ⁴ When it is an organic group, as an organic group, an alkyl group, an aromatic hydrocarbon group, and an aromatic heterocyclic group are preferable. The alkyl group is preferably a linear or branched alkyl group having 1 to 8 carbon atoms, and more preferably a methyl group, an ethyl group, an n-propyl group, and an isopropyl group. The aromatic hydrocarbon group is preferably a phenyl group, a naphthyl group, a biphenyl group, an anthracenyl group, and a phenanthryl group, more preferably a phenyl group and a naphthyl group, and particularly preferably a phenyl group. The aromatic heterocyclic group is preferably pyridyl, furyl, thienyl, imidazolyl, pyrazolyl, oxazolyl, thiazolyl, isoxazolyl, isothiazolyl, benzoxazolyl, benzo Thiazolyl and benzimidazolyl are more preferably furyl and thienyl. In R ⁴ In the case of an alkyl group, the bonding position of the alkyl group on the imidazole ring is preferably any of the 2-, 4-, and 5-positions, and more preferably the 2-position. In R ⁴ In the case of an aromatic hydrocarbon group and an aromatic heterocyclic group, the bonding position based on these imidazoles is preferably the 2-position. Among the compounds represented by the formula (0), in terms of excellent effects of the present invention, the compounds represented by the following formula (0-1-1) are preferred, and the compounds represented by the formula (0-1- 1) and R ³⁰ Is a compound of the above formula (0-1). [Chemical 4] (In formula (0-1-1), R ³⁰ , R ⁴ And n are the same as in formula (0), R ⁵ , R ⁶ , R ⁷ , R ⁸ And R ⁹ They are independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a thio group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfinyl group, a sulfonate group, a sulfonate group, a phosphine group, an phosphine group, (Phosphonium, phosphonate, amine, ammonium or organic) In formula (0-1-1), R is preferred ⁵ , R ⁶ , R ⁷ , R ⁸ And R ⁹ At least one of them is a group other than a hydrogen atom. It is preferable in terms of solvent solubility and the like. In R ⁵ , R ⁶ , R ⁷ , R ⁸ And R ⁹ When it is an organic group, the organic group and R in the formula (0) ² The organic groups as the substituents are the same. In terms of solubility in solvents for imidazole compounds, R ⁵ , R ⁶ , R ⁷ And R ⁸ A hydrogen atom is preferred. Among them, R is preferred ⁵ , R ⁶ , R ⁷ , R ⁸ And R ⁹ At least one of the following substituents, particularly preferably R ⁹ Are the following substituents. In R ⁹ In the case of the following substituents, R ⁵ , R ⁶ , R ⁷ And R ⁸ Is a hydrogen atom. -OR ¹⁰ (R ¹⁰ Hydrogen atom or organic group) in R ¹⁰ When it is an organic group, the organic group and R in the formula (0) ² The organic groups as the substituents are the same. As R ¹⁰ Is preferably an alkyl group, more preferably an alkyl group having 1 to 8 carbon atoms, particularly preferably an alkyl group having 1 to 3 carbon atoms, and most preferably a methyl group. Among the compounds represented by the formula (0-1-1), preferred are compounds represented by the following formula (0-1-1-1). [Chemical 5] (In formula (0-1-1-1), R ³⁰ , R ⁴ And n are the same as in formula (0), R ¹¹ , R ¹² , R ¹³ , R ¹⁴ And R ¹⁵ They are independently hydrogen atom, hydroxyl group, mercapto group, thio group, silyl group, silanol group, nitro group, nitroso group, sulfinyl group, sulfo group, sulfonate group, phosphine group, phosphinyl group, phosphino group , Phosphonate group, amine group, ammonium group or organic group) In formula (0-1-1-1), R is preferred ¹¹ , R ¹² , R ¹³ , R ¹⁴ And R ¹⁵ At least one of them is a group other than a hydrogen atom. Among the compounds represented by the formula (0-1-1-1), R is preferred ¹¹ , R ¹² , R ¹³ , R ¹⁴ And R ¹⁵ At least one of the above is -OR ¹⁰ The indicated base, particularly preferably R ¹⁵ For -OR ¹⁰ The indicated base. In R ¹⁵ For -OR ¹⁰ In the case of the indicated base, R is preferred ¹¹ , R ¹² , R ¹³ And R ¹⁴ Is a hydrogen atom. The method for synthesizing the compound represented by the formula (0) is not particularly limited. For example, a halogen-containing carboxylic acid derivative represented by the following formula (I) is reacted with an imidazole compound represented by the following formula (II) to perform imidazolylation according to a conventional method, whereby the compound represented by the above formula (0) can be synthesized. Of compounds. [Chemical 6] (In formula (I) and formula (II), R ² , R ³⁰ , R ⁴ And n are the same as the formula (0); in the formula (I), Hal is a halogen atom) As preferable specific examples of the compound represented by the formula (0), the following compounds may be mentioned. [Chemical 7] 组合 Composition for forming a hydrogen barrier film≫ The composition for forming a hydrogen barrier film contains a base material component (A) and the above-mentioned hydrogen barrier agent (B). Hereinafter, components which can be contained in the composition for forming a hydrogen barrier film and a preferred composition as a composition for forming a hydrogen barrier film will be described. <Base material component (A)> The base material component (A) is a component that imparts film-forming properties to the composition for forming a hydrogen barrier film, that is, it imparts a desired shape that can be produced directly by a well-known method such as a melt processing method. The film forming property of the film, or the film forming property of a film having a desired shape by processing such as exposure, heating, and reaction with water. The base material component (A) is not particularly limited as long as it can provide a desired film-forming property to the composition for forming a hydrogen barrier film. As the base material component (A), typically, a resin material containing a polymer compound, heat generated by crosslinking by heating to generate a polymer compound, or heat generated by chemical modification such as intramolecular cyclization and curing can be used. A hardenable material, a photopolymerizable compound that can be hardened by exposure, a hydrolytic-condensable silane compound that hydrolyzes and condenses by moisture in the composition or the environment, and the like. Examples of the hydrolyzable and condensable silane compound include tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, methyltriethoxysilane, and ethyltriethoxy Silane, phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, diethyldimethoxysilane, dimethyldiethoxysilane, diethyldiethyl Alkoxysilane compounds such as oxysilane, diphenyldimethoxysilane, and diphenyldiethoxysilane. The hydrolytically condensable silane compound may be a partially hydrolyzed condensate of these silane compounds. [Resin Material] Examples of the resin material in the base material component (A) include polyacetal resin, polyamide resin, polycarbonate resin, and polyester resin (polybutylene terephthalate, polymer Ethylene terephthalate, polyethylene naphthalate, polyarylate, etc.), FR-AS (flame retardant acrylonitrile-styrene) resin, FR-ABS (flame retardant acrylonitrile- butadiene-styrene, flame retardant acrylonitrile-butadiene-styrene) resin, AS (acrylonitrile-styrene) resin, ABS (acrylonitrile-butadiene-styrene, acrylonitrile-butadiene-styrene) Resin, polyphenylene ether resin, polyphenylene sulfide resin, polyfluorene resin, polyether resin, polyether ether ketone resin, fluorine resin, polyimide resin, polyimide resin, polyimide resin Maleicimide resin, polyetherimide resin, polybenzoxazole resin, polybenzothiazole resin, polybenzimidazole resin, silicone resin, BT (Bismaleimide Triazine, bismaleimide醯 imine tri &#134116;) resin, polymethylpentene, ultra high molecular weight polyethylene, FR-poly Propylene, (meth) acrylic resin (for example, polymethyl methacrylate, etc.), polystyrene, and the like. In the case where a resin material is used as the base material component (A), a film is prepared from a previously known film-forming method using a desired method, and a resin material prepared with a specific amount of the above-mentioned hydrogen barrier agent (B) with respect to the resin material is filmed. Is formed, thereby manufacturing a hydrogen barrier film. Examples of the film forming method include a melt processing method such as a T-die method (casting method), an inflation method, and a pressing method, or a casting method using a solution. In the casting method, a solution containing a resin material and a hydrogen barrier agent (B) is coated or cast on a substrate to form a film containing the solution, and then the solvent is removed from the film by heating or the like to form a hydrogen barrier film. If necessary, the hydrogen barrier film obtained by using a resin material may be subjected to a stretching treatment such as uniaxial stretching or biaxial stretching. When the above-mentioned resin material is used as the base material component (A), the composition for forming a hydrogen barrier film may contain an antioxidant, an ultraviolet absorber, a flame retardant, a mold release agent, a plasticizer, a filler, and a reinforcement as necessary. Additives such as wood or reinforcing materials. When the composition for forming a hydrogen barrier film is a composition for casting, the composition for forming a hydrogen barrier film may contain a solvent. The type of the solvent can be appropriately selected according to the type of the resin material. When the composition for forming a hydrogen barrier film contains the resin material and the hydrogen barrier agent (B), the content of the hydrogen barrier agent is preferably 0.01% by mass or more relative to the mass of the resin material of the composition for forming a hydrogen barrier film. It is 30% by mass or less, more preferably 0.05% by mass or more and 20% by mass or less, and particularly preferably 0.1% by mass or more and 10% by mass or less. [Thermosetting material] Examples of the thermosetting material include various thermosetting resin precursor materials which have been widely used in the past. Specific examples of the thermosetting resin include phenol resin, epoxy resin, oxetane resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, polyurethane resin, Polyimide resin, polybenzoxazole resin, polybenzimidazole resin, and the like. Further, a resin that generates an aromatic ring formation reaction in the molecule and / or a cross-linking reaction between the molecules by heating can also be preferably used as the thermosetting material. Hereinafter, a resin that generates an aromatic ring formation reaction in a molecule and / or a crosslinking reaction between molecules by heating is also referred to as a precursor resin. Among these, an epoxy resin precursor and a precursor resin are particularly preferable in terms of easy formation of a hydrogen barrier film having excellent heat resistance, chemical resistance, and mechanical properties. Hereinafter, the precursor material which is especially preferable as a base material component (A) about a thermosetting material is demonstrated. (Epoxy resin precursor) As the epoxy resin precursor, various conventionally known epoxy compounds can be used. The molecular weight of the epoxy compound is not particularly limited. Among the epoxy compounds, a polyfunctional epoxy compound having two or more epoxy groups in a molecule is preferable in terms of easy formation of a hydrogen barrier film having excellent heat resistance, chemical resistance, and mechanical properties. The polyfunctional epoxy compound is not particularly limited as long as it is a bifunctional or more epoxy compound. Examples of the polyfunctional epoxy compound include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, naphthalene type epoxy resin, and Bifunctional epoxy resins such as biphenyl epoxy resins; glycidyl ester epoxy resins such as dimer acid glycidyl esters and triglycidyl esters; tetraglycidylamino diphenylmethane, triglycidyl p-amine Glycidylamine type epoxy resins such as phenol, tetraglycidyl metaxylylenediamine and tetraglycidyl bisaminomethylcyclohexane; heterocyclic epoxy resins such as triglycidyl isocyanurate ; Resorcinol triglycidyl ether, trihydroxybiphenyl triglycidyl ether, trihydroxyphenylmethane triglycidyl ether, glycerol triglycidyl ether, 2- [4- (2,3-glycidoxy) ) Phenyl] -2- [4- [1,1-bis [4- (2,3-glycidoxy) phenyl] ethyl] phenyl] propane and 1,3-bis [4- [ 1- [4- (2,3-glycidoxy) phenyl] -1- [4- [1- [4- (2,3-glycidoxy) phenyl] -1-methyl Ethyl] phenyl] ethyl] phenoxy] -2-propanol and other trifunctional epoxy resins; tetrahydroxyphenylethane tetraglycidyl ether, Glycidyl benzophenone, bisresorcinol tetraglycidyl ether and tetraglycidyl biphenyl tetrafunctional type epoxy resins and the like. Moreover, an alicyclic epoxy compound is also preferable as a polyfunctional epoxy compound from the point which can provide a hardened | cured material with high hardness. Specific examples of the alicyclic epoxy compound include 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-m-dioxane and hexanedioxane. Bis (3,4-epoxycyclohexylmethyl) acid ester, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4-epoxy-6-methyl Cyclohexyl-3 ', 4'-epoxy-6'-methylcyclohexanecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl-3', 4'-epoxy Cyclohexanecarboxylate, trimethylcaprolactone modified 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, β-methyl-δ-pentene Ester-modified 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, methylenebis (3,4-epoxycyclohexane), ethylene glycol (3,4-epoxycyclohexylmethyl) ether, ethylene bis (3,4-epoxycyclohexanecarboxylate), epoxycyclohexahydrophthalate dioctyl and epoxycyclohexa Di-2-ethylhexyl hydrophthalate, epoxy resin having tricyclodecenyl oxide, or compounds represented by the following formulae (a01-1) to (a01-5). Among the specific examples of these alicyclic epoxy compounds, in terms of providing a hardened hardened product, the alicyclic epoxy represented by the following formulae (a01-1) to (a01-5) is preferable Compound. [Chemical 8] (In formula (a01-1), Z ⁰¹ Represents a single bond or a linking group (a divalent group having more than one atom); R ^a01 ~ R ^a018 Each independently a group selected from the group consisting of a hydrogen atom, a halogen atom, and an organic group) as the linking group Z ⁰¹ For example, it may be selected from the group consisting of divalent hydrocarbon groups, -O-, -O-CO-, -S-, -SO-, -SO ₂ -, -CBr ₂ -, -C (CBr ₃ ) ₂ -, -C (CF ₃ ) ₂ -And-R ^a019 The divalent base in the group consisting of -O-CO- and the bases formed by a plurality of bonds and the like. Examples of the divalent hydrocarbon group as the linking group Z include a linear or branched alkylene group having 1 to 18 carbon atoms, a divalent alicyclic hydrocarbon group, and the like. Examples of the linear or branched alkylene group having 1 to 18 carbon atoms include methylene, methylmethylene, dimethylmethylene, dimethylene, and trimethylene. Base etc. Examples of the divalent alicyclic hydrocarbon group include 1,2-cyclopentyl, 1,3-cyclopentyl, cyclopentylene, 1,2-cyclohexyl, and 1,3-cyclopentyl. Cyclohexyl, 1,4-cyclohexyl, cyclohexylene, and other cycloalkylenes (including cycloalkylene) and the like. R ^a019 It is an alkylene group having 1 to 8 carbon atoms, and is preferably a methylene group or an ethylidene group. [Chemical 9] (In formula (a01-2), R ^a01 ~ R ^a012 Is a group selected from the group consisting of a hydrogen atom, a halogen atom, and an organic group) [Chem. 10] (In formula (a01-3), R ^a01 ~ R ^a010 Is a group selected from the group consisting of a hydrogen atom, a halogen atom, and an organic group; R ^a02 And R ^a08 Can be bonded to each other) [化 11] (In formula (a01-4), R ^a01 ~ R ^a012 Is a group selected from the group consisting of a hydrogen atom, a halogen atom, and an organic group; R ^a02 And R ^a010 Can be bonded to each other) [化 12] (In formula (a01-5), R ^a01 ~ R ^a012 Is a group selected from the group consisting of a hydrogen atom, a halogen atom, and an organic group) In formulae (a01-1) to (a01-5), in R ^a01 ~ R ^a018 In the case of an organic group, the organic group is not particularly limited as long as it does not hinder the object of the present invention. The organic group may be a hydrocarbon group, a group containing a carbon atom and a halogen atom, or may be contained together with a carbon atom and a hydrogen atom. Such as halogen atom, oxygen atom, sulfur atom, nitrogen atom, silicon atom and other heteroatoms. Examples of the halogen atom include a chlorine atom, a bromine atom, an iodine atom, and a fluorine atom. The organic group is preferably a hydrocarbon group, a group containing a carbon atom, a hydrogen atom, and an oxygen atom, a halogenated hydrocarbon group, a group containing a carbon atom, an oxygen atom, and a halogen atom, and a group containing a carbon atom, a hydrogen atom, an oxygen atom, and a halogen atom. . When the organic group is a hydrocarbon group, the hydrocarbon group may be an aromatic hydrocarbon group, an aliphatic hydrocarbon group, or a group including an aromatic skeleton and an aliphatic skeleton. The number of carbon atoms of the organic group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and even more preferably 1 or more and 5 or less. Specific examples of the hydrocarbon group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, n-pentyl, n-hexyl, and n-heptyl , N-octyl, 2-ethylhexyl, n-nonyl, n-decyl, n-undecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, Chain alkyl groups such as n-heptadecanyl, n-octadecyl, n-nonadecyl and n-icosyl; vinyl, 1-propenyl, 2-n-propenyl (allyl), 1- Alkenyl alkenyl such as n-butenyl, 2-n-butenyl, and 3-n-butenyl; cycloalkyl such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, and cycloheptyl; phenyl, O-tolyl, m-tolyl, p-tolyl, α-naphthyl, β-naphthyl, biphenyl-4-yl, biphenyl-3-yl, biphenyl-2-yl, anthryl and phenanthryl Aryl groups such as benzyl, phenethyl, α-naphthylmethyl, β-naphthylmethyl, α-naphthylethyl, and β-naphthylethyl. Specific examples of the halogenated hydrocarbon group are: chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, fluoromethyl, difluoromethyl, trifluoromethyl, 2 , 2,2-trifluoroethyl, pentafluoroethyl, heptafluoropropyl, perfluorobutyl and perfluoropentyl, perfluorohexyl, perfluoroheptyl, perfluorooctyl, perfluorononyl and perfluoro Halogenated chain alkyl groups such as fluorodecyl; 2-chlorocyclohexyl, 3-chlorocyclohexyl, 4-chlorocyclohexyl, 2,4-dichlorocyclohexyl, 2-bromocyclohexyl, 3-bromocyclohexyl and 4 -Halogenated cycloalkyl such as bromocyclohexyl; 2-chlorophenyl, 3-chlorophenyl, 4-chlorophenyl, 2,3-dichlorophenyl, 2,4-dichlorophenyl, 2,5- Dichlorophenyl, 2,6-dichlorophenyl, 3,4-dichlorophenyl, 3,5-dichlorophenyl, 2-bromophenyl, 3-bromophenyl, 4-bromophenyl, Halogenated aryl groups such as 2-fluorophenyl, 3-fluorophenyl, 4-fluorophenyl; 2-chlorophenylmethyl, 3-chlorophenylmethyl, 4-chlorophenylmethyl, 2-bromobenzene Halogenated aralkyl groups such as methylmethyl, 3-bromophenylmethyl, 4-bromophenylmethyl, 2-fluorophenylmethyl, 3-fluorophenylmethyl, 4-fluorophenylmethyl. Specific examples of the group containing a carbon atom, a hydrogen atom, and an oxygen atom include a hydroxy chain alkyl group such as a hydroxymethyl group, a 2-hydroxyethyl group, a 3-hydroxyn-propyl group, and a 4-hydroxyn-butyl group; a 2-hydroxy ring Hexyl, 3-hydroxycyclohexyl and 4-hydroxycyclohexyl and other halogenated cycloalkyl groups; 2-hydroxyphenyl, 3-hydroxyphenyl, 4-hydroxyphenyl, 2,3-dihydroxyphenyl, 2,4- Hydroxyaryl groups such as dihydroxyphenyl, 2,5-dihydroxyphenyl, 2,6-dihydroxyphenyl, 3,4-dihydroxyphenyl, and 3,5-dihydroxyphenyl; 2-hydroxyphenyl Hydroxyaralkyl groups such as methyl, 3-hydroxyphenylmethyl and 4-hydroxyphenylmethyl; methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy Base, second butoxy, third butoxy, n-pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, 2-ethylhexyloxy, n-nonoxy, n-decoxy , N-undecyloxy, n-tridecyloxy, n-tetradecyloxy, n-pentadecyloxy, n-hexadecyloxy, n-heptadecyloxy, n-octadecyloxy, Chain alkoxy groups such as n-nonadecanyloxy and n-icocosyloxy; vinyloxy, 1-propenyloxy, 2-n-propene Alkenyl (allyloxy), 1-n-butenyloxy, 2-n-butenyloxy, and 3-n-butenyloxy; alkenyloxy; phenoxy, o-tolyloxy, m-tolyloxy , P-tolyloxy, α-naphthyloxy, β-naphthyloxy, biphenyl-4-yloxy, biphenyl-3-yloxy, biphenyl-2-yloxy, anthracenoxy and Aryloxy such as phenanthryloxy; aromatics such as benzyloxy, phenethyloxy, α-naphthylmethoxy, β-naphthylmethoxy, α-naphthylethoxy and β-naphthylethoxy Alkoxy; methoxymethyl, ethoxymethyl, n-propoxymethyl, 2-methoxyethyl, 2-ethoxyethyl, 2-n-propoxyethyl, 3- Methoxy-n-propyl, 3-ethoxy-n-propyl, 3-n-propoxy-n-propyl, 4-methoxy-n-butyl, 4-ethoxy-n-butyl and 4-n-propoxy Alkoxyalkyl such as n-butyl; methoxymethoxy, ethoxymethoxy, n-propoxymethoxy, 2-methoxyethoxy, 2-ethoxyethoxy, 2-n-propoxyethoxy, 3-methoxy-n-propoxy, 3-ethoxy-n-propoxy, 3-n-propoxy-n-propoxy, 4-methoxy-n-butoxy , 4-ethoxy-n-butoxy and 4-n-propoxy-n-butoxy Alkoxy alkoxy groups, etc .; Alkoxy aryl groups such as 2-methoxyphenyl, 3-methoxyphenyl, and 4-methoxyphenyl groups; 2-methoxyphenoxy, 3-methyl Alkoxyaryloxy groups such as oxyphenoxy and 4-methoxyphenoxy; formamyl, ethylamyl, propylamyl, butylamyl, pentamyl, hexyl, heptyl, octyl, Non-fluorenyl and decylfluorenyl aliphatic fluorenyl groups; benzylfluorenyl, α-naphthylmethylfluorenyl and β-naphthylmethylfluorenyl aromatic fluorenyl groups; methoxycarbonyl, ethoxycarbonyl, n-propoxy Chain alkoxycarbonyl groups such as carbonyl, n-butoxycarbonyl, n-pentoxycarbonyl, n-hexylcarbonyl, n-heptyloxycarbonyl, n-octyloxycarbonyl, n-nonoxycarbonyl and n-decoxycarbonyl; Aryloxycarbonyl groups such as phenoxycarbonyl, α-naphthyloxycarbonyl, and β-naphthyloxycarbonyl; methylmethoxy, ethoxy, propyloxy, butyloxy, pentyloxy, hexane Aliphatic alkoxy groups such as fluorenyloxy, heptyloxy, octyloxy, nonyloxy, and decyloxy; benzyloxy, α-naphthyloxy, and β-naphthyloxy And other aromatic fluorenyl groups. R ^a01 ~ R ^a018 It is preferably a group independently selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms and an alkoxy group having 1 to 5 carbon atoms, which is particularly easy to form In terms of cured film with excellent mechanical properties, R is more preferred ^a01 ~ R ^a018 All are hydrogen atoms. In the formulae (a01-2) to (a01-5), R ^a01 ~ R ^a012 And R in formula (a01-1) ^a01 ~ R ^a012 the same. In formula (a01-2) and formula (a01-4), as R ^a02 And R ^a010 Divalent bases formed in the case of mutual bonding, for example -CH ₂ -, -C (CH ₃ ) ₂ -. In formula (a01-3), as R ^a02 And R ^a08 Divalent bases formed in the case of mutual bonding, for example -CH ₂ -, -C (CH ₃ ) ₂ -. Among the alicyclic epoxy compounds represented by formula (a01-1), specific examples of preferred compounds include the following formula (a01-1a), formula (a01-1b), and formula (a01-1c) The represented alicyclic epoxy compound or 2,2-bis (3,4-epoxycyclohexane-1-yl) propane [= 2,2-bis (3,4-epoxycyclohexyl) propane] Wait. [Chemical 13] Among the alicyclic epoxy compounds represented by the formula (a01-2), specific examples of preferred compounds include the bicyclononadiene diepoxide or bicyclic ring represented by the following formula (a01-2a). Nonadiene diepoxide and the like. [Chemical 14] Among the alicyclic epoxy compounds represented by the formula (a01-3), as specific examples of preferable compounds, S-spiro [3-oxatricyclo [3.2.1.0] ^2,4 ] Octane-6,2'-ethylene oxide] and the like. Among the alicyclic epoxy compounds represented by the formula (a01-4), specific examples of preferred compounds include 4-vinylcyclohexene dioxide, dipentene dioxide, limonene dioxide, 1- Methyl-4- (3-methyloxiran-2-yl) -7-oxabicyclo [4.1.0] heptane and the like. Among the alicyclic epoxy compounds represented by the formula (a01-5), specific examples of preferred compounds include 1,2,5,6-diepoxycyclooctane and the like. [Precursor resin] As the base material component (A), a resin precursor resin is preferably used as a resin that generates an aromatic ring formation reaction in a molecule and / or a cross-linking reaction between molecules by heating. Through the formation of an aromatic ring in the molecule, the structure of the molecular chain constituting the resin is rigidified, and a hydrogen barrier film having excellent heat resistance and mechanical properties can be formed. Preferred reactions among the aromatic ring formation reactions in the molecule include reactions represented by the following formulae (I) to (VI). In addition, the reaction in the following formula is only an example of an aromatic ring formation reaction, and the structure of the resin used as the base material component (A) to generate an aromatic ring formation reaction in the molecule by heating is not limited to the following formula Shows the structure of the precursor polymer. [Chemical 15] (A resin having a group selected from a hydroxyl group, a carboxylic acid anhydride group, a carboxyl group, and an epoxy group in the molecule) Through molecular cross-linking reactions, the molecular chains constituting the resin are cross-linked with each other to form a three-dimensional cross-linked structure. Therefore, if a resin having a group selected from a hydroxyl group, a carboxylic acid anhydride group, a carboxyl group, and an epoxy group in a molecule that causes a crosslinking reaction by heating is used as the base material component (A), heat resistance and mechanical properties are obtained. Hydrogen barrier film with excellent characteristics. When a resin having a hydroxyl group is used, by the action of a dehydrating condensation agent, crosslinking between the molecules contained in the resin is caused by the dehydration condensation between the hydroxyl groups. In addition, since a hydroxyl group contains an active hydrogen atom and is rich in reactivity, it can provide a cured product containing a crosslinked resin by reacting with various crosslinking agents. In the case of using a resin having a carboxylic acid anhydride group, the carboxyl groups generated by the hydrolysis of the acid anhydride group are dehydrated and condensed with each other by the action of a dehydration condensation agent to crosslink. In addition, since the acid anhydride group itself is also highly reactive, for example, by using a crosslinking agent such as a polyhydric alcohol having two or more hydroxyl groups and a polyamine having two or more amine groups, a cured product containing a crosslinked resin can be provided. . When a resin having a carboxyl group is used, by the action of a dehydrating condensation agent, crosslinking between the molecules contained in the resin is caused by the dehydrating condensation between the carboxyl groups. Moreover, you may crosslink using the crosslinking agent which has a functional group which can react with a carboxyl group, such as an isocyanate group. When a resin having an epoxy group is used, if necessary, a well-known hardening accelerator or the like is used to cause crosslinking between the molecules contained in the resin caused by the addition polymerization reaction between the epoxy groups. Examples of the resin having a hydroxyl group in the molecule include a novolac resin. The novolak resin is not particularly limited, but it is preferably carried out by using a condensing agent such as formaldehyde or paraformaldehyde at a ratio of 0.5 mol to 1.0 mol relative to 1 mol of phenols under an acidic catalyst. Resin obtained by condensation reaction. Examples of the phenols include cresols such as phenol, o-cresol, m-cresol, and p-cresol; 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, Dimethylphenols such as 2,6-xylenol, 3,4-xylenol, 3,5-xylenol; ethylphenols such as o-ethylphenol, m-ethylphenol, and p-ethylphenol, 2 -Isopropylphenol, 3-isopropylphenol, 4-isopropylphenol, o-butylphenol, m-butylphenol, p-butylphenol, p-third-butylphenol and other alkylphenols; 2, Trialkylphenols such as 3,5-trimethylphenol, 3,4,5-trimethylphenol; resorcinol, catechol, hydroquinone, hydroquinone monomethyl ether, o- Polyphenols such as hydroquinone and resorcinol; alkyl polyphenols such as alkylresorcinol, alkylcatechol, and alkylhydroquinone (alkanes contained in alkylpolyphenols) The number of carbon atoms of the group is 1 or more and 4 or less), α-naphthol, β-naphthol, hydroxybiphenyl, bisphenol A, and the like. These phenols can be used alone or in combination of two or more. Among the phenols, m-cresol and p-cresol are preferred, and m-cresol and p-cresol are used in combination. By adjusting the blending ratio of the two, various characteristics such as sensitivity and heat resistance of the photoresist can be adjusted. The blending ratio of m-cresol and p-cresol is not particularly limited, but it is preferably m-cresol / p-cresol = 3/7 or more and 8/2 or less (mass ratio). If the ratio of m-cresol does not reach the above-mentioned lower limit value, the sensitivity may decrease. If it exceeds the above-mentioned upper limit value, the heat resistance may decrease. Examples of acidic catalysts used in the production of novolac resins include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid, and organic acids such as formic acid, oxalic acid, acetic acid, diethyl sulfuric acid, and p-toluenesulfonic acid. , Zinc acetate and other metal salts. These acid catalysts can be used alone or in combination of two or more. The mass average molecular weight of the polystyrene-equivalent novolak resin measured by gel permeation chromatography (GPC) is preferably 1,000 or more and 50,000 or less. As the resin having a carboxylic acid anhydride group in the molecule, a mixture of monomers having one or more monomers selected from maleic anhydride, methyl maleic anhydride, and itaconic anhydride and having an unsaturated double bond is used. Copolymer obtained by polymerization. As such a polymer, a styrene-maleic acid copolymer is preferable. The resin having a carboxyl group in the molecule is preferably a resin obtained by hydrolyzing an acid anhydride group in the resin having a carboxylic acid anhydride group in the molecule, or containing a resin selected from (meth) acrylic acid, butenoic acid, and maleic acid. It is obtained by polymerizing a mixture of one or more monomers of diacid, fumaric acid, methyl maleic acid, methyl fumaric acid, and itaconic acid and monomers having unsaturated double bonds. Copolymer. The epoxy-containing resin having an epoxy group in the molecule will be described in detail later. Among such compounds that generate an aromatic ring formation reaction or a cross-linking reaction between molecules by heating, from the viewpoint of easily forming a hydrogen barrier film having excellent heat resistance, polyamic acid, poly Benzoxazole precursor, polybenzothiazole precursor, polybenzimidazole precursor, styrene-maleic acid copolymer and epoxy-containing resin. These resins are described below. [Polyimide resin precursor] Examples of the polyimide resin precursor include polyamic acid, and after forming a film for a hydrogen barrier film forming composition containing polyamic acid as a base component (A), If necessary, the formed film is heated in the presence of a fluorene imidating agent to form a hydrogen barrier film containing a polyfluorene resin which is excellent in heat resistance. The molecular weight of the polyamic acid is preferably 5,000 or more and 30,000 or less, and more preferably 10,000 or more and 20,000 or less as the mass average molecular weight. When a polyamic acid having a mass average molecular weight within this range is used, a hydrogen barrier film having excellent heat resistance is easily formed. As a preferable polyamic acid, the polyamic acid containing the structural unit represented by following formula (A1) is mentioned, for example. [Chemical 16] (In formula (A1), R ^a020 Is a 4-valent organic group, R ^a021 Is a divalent organic group, n ^a Is the repeating number of the structural unit represented by formula (A1)) In formula (A1), R ^a020 And R ^a021 The number of carbon atoms is preferably 2 or more and 50 or less, and more preferably 2 or more and 30 or less. R ^a020 And R ^a021 Each may be an aliphatic group, an aromatic group, or a combination of these structures. A tetravalent aromatic group and the following R ^a022 the same. R ^a020 And R ^a021 In addition to carbon and hydrogen atoms, it may contain a halogen atom, an oxygen atom, and a sulfur atom. In R ^a020 And R ^a021 When an oxygen atom, a nitrogen atom, or a sulfur atom is contained, the oxygen atom, nitrogen atom, or sulfur atom may be selected from a nitrogen-containing heterocyclic group, , -COO-, -O-, -CO-, -SO-, -SO ₂ The bases in-, -S- and -SS- are contained in R ^a020 And R ^a021 Among them, it is more preferably selected from -O-, -CO-, -SO-, -SO ₂ The bases in-, -S- and -SS- are contained in R ^a020 And R ^a021 in. Polyamic acid is generally prepared by reacting a tetracarboxylic dianhydride component with a diamine component. Hereinafter, a tetracarboxylic dianhydride component, a diamine component, and a production method of polyamic acid used in the preparation of polyamic acid will be described. (Tetracarboxylic dianhydride component) The tetracarboxylic dianhydride component which is a synthetic raw material of a polyamic acid is not specifically limited if it can form a polyamino acid by reaction with a diamine component. The tetracarboxylic dianhydride component can be appropriately selected from tetracarboxylic dianhydrides previously used as a synthetic raw material of polyamic acid. The tetracarboxylic dianhydride component may be an aromatic tetracarboxylic dianhydride or an aliphatic tetracarboxylic dianhydride. For example, a tetracarboxylic dianhydride represented by the following formula (a1-1) may be mentioned. Aromatic tetracarboxylic dianhydride. A tetracarboxylic dianhydride component can be used in combination of 2 or more types. [Chemical 17] (In formula (a1-1), R ^a020 And R of formula (A1) ^a020 The same) As preferable specific examples of the aromatic tetracarboxylic dianhydride, pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,3,3' , 4'-biphenyltetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic anhydride, and 3,3', 4,4'-diphenylphosphonium tetracarboxylic dianhydride and the like. Among them, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride are preferred in terms of price and availability. Others may be selected from the photosensitive composition in the fifth aspect. (Diamine component) The diamine component which becomes the synthetic raw material of a polyamic acid is not specifically limited if it can form a polyamino acid by reaction with a tetracarboxylic dianhydride component. The diamine component can be appropriately selected from the diamines previously used as a synthetic raw material of polyamic acid. For example, a diamine component represented by the following formula (a1-2) can be enumerated or the following Y can be provided. ^d Of the diamine. The diamine component may be an aromatic diamine or an aliphatic diamine, and is preferably an aromatic diamine. A diamine component can be used in combination of 2 or more types. [Chemical 18] (In formula (a1-2), R ^a021 And R of formula (A1) ^a021 The same) As preferable specific examples of the aromatic diamine, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, 4,4'-diaminobiphenyl, 4,4 '-Diamino-2,2'-bis (trifluoromethyl) biphenyl, 3,3'-diaminodiphenylphosphonium, 4,4'-diaminodiphenylphosphonium, 4,4 ' -Diaminodiphenyl sulfide, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3 '-Diaminodiphenyl ether, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-amine Phenylphenoxy) benzene, 4,4'-bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] fluorene, bis [4- (3- Aminophenoxy) phenyl] fluorene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) Phenyl] hexafluoropropane, 9,9-bis (4-aminophenyl) -9H-fluorene, 9,9-bis (4-amino-3-methylphenyl) -9H-fluorene, 4, 4 '-[1,4-phenylenebis (1-methylethane-1,1-diyl)] diphenylamine and the like. Among them, in terms of price and availability, p-phenylenediamine, m-phenylenediamine, 2,4-diaminotoluene, and 4,4'-diaminodiphenyl ether are preferred. Others may be selected from the photosensitive composition in the fifth aspect. (Manufacturing method of polyamic acid) A polyamic acid is obtained by reacting the tetracarboxylic dianhydride component and diamine component demonstrated above in the solvent which can melt | dissolve both. The amount of the tetracarboxylic dianhydride component and the diamine component used in synthesizing the polyamidic acid is not particularly limited. With respect to 1 mol of the tetracarboxylic dianhydride component, it is preferable to use a diamine component of 0.50 mol or more and 1.50 mol or less, more preferably 0.60 mol or more and 1.30 mol or less, and even more preferably 0.70 mol Above and below 1.20 moles. Examples of solvents that can be used in the synthesis of polyamic acid include N, N, N ', N'-tetramethylurea, N-methyl-2-pyrrolidone, and N, N-dimethyl Aprotic polar organic solvents such as formamidine, N, N-dimethylacetamide, hexamethylphosphamide, 1,3-dimethyl-2-imidazolidinone, and γ-butyrolactone, or Ethylene glycol dialkyl ether, ethylene glycol monoalkyl ether acetate, diethylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether acetate, and propylene glycol monoalkyl ether propionate. Alcohol ethers. These solvents can be used in combination of two or more. Among these, N, N, N ', N'-tetramethylurea is preferably used. The amount of the solvent used in the synthesis of the polyamic acid is not particularly limited as long as the polyamino acid of a desired molecular weight can be synthesized. Typically, the amount of the solvent used is 100 parts by mass with respect to the total amount of the tetracarboxylic dianhydride component and the amount of the diamine component, preferably 100 parts by mass or more and 4,000 parts by mass or less, more preferably 150 parts by mass or more and 2000 parts by mass or less. The temperature at which the tetracarboxylic dianhydride component and the diamine component are reacted is not particularly limited as long as the reaction proceeds well. Typically, the reaction temperature of the tetracarboxylic dianhydride component and the diamine component is preferably -5 ° C to 150 ° C, more preferably 0 ° C to 120 ° C, and even more preferably 0 ° C to 70 ° C. In addition, the time for reacting the tetracarboxylic dianhydride component and the diamine component varies depending on the reaction temperature. Typically, it is preferably from 1 hour to 50 hours, more preferably from 2 hours to 40 hours. Especially preferably, it is 5 hours or more and 30 hours or less. According to the above method, a solution or slurry of polyamic acid is obtained. This solution or slurry can be directly used in the preparation of a composition for forming a hydrogen barrier film. In addition, a solid polyamic acid obtained by removing a solvent from a solution or slurry of polyamic acid may be used for the preparation of a composition for forming a hydrogen barrier film. [Polybenzoxazole precursor] A polybenzoxazole precursor is typically produced by reacting an aromatic diamine diphenol with a dicarbonyl compound having a specific structure. Hereinafter, a solvent used in the synthesis of an aromatic diamine diphenol, a dicarbonyl compound, a polybenzoxazole precursor, and a method for producing a polybenzoxazole precursor will be described. (Aromatic Diamine Diphenol) As the aromatic diamine diphenol, a user previously used in the synthesis of polybenzoxazole can be used without particular limitation. As the aromatic diamine diphenol, a compound represented by the following formula (a02) is preferably used. The aromatic diamine diphenols may be used singly or in combination of two or more kinds. [Chemical 19] (In formula (a02), R ^a022 It is a tetravalent organic group containing one or more aromatic rings. Regarding the combination of two groups of amine groups and hydroxyl groups contained in the aromatic diamine diphenol represented by formula (a02), in each combination, the amine group and Hydroxyl and R ^a022 Adjacent two carbon atoms on the aromatic ring contained in the bond) In formula (a02), R ^a022 It is a tetravalent organic group containing one or more aromatic rings, and the number of carbon atoms thereof is preferably 6 or more and 50 or less, and more preferably 6 or more and 30 or less. R ^a022 It may be an aromatic group, or two or more aromatic groups may be bonded via an aliphatic hydrocarbon group and a halogenated aliphatic hydrocarbon group or a bond containing a hetero atom such as an oxygen atom, a sulfur atom, and a nitrogen atom. As R ^a022 Examples of bonds containing heteroatoms such as oxygen, sulfur, and nitrogen atoms include -CONH-, -NH-, -N = N-, -CH = N-, -COO-, -O-, -CO-, -SO-, -SO ₂ -, -S- and -SS-, etc., preferably -O-, -CO-, -SO-, -SO ₂ -, -S- and -SS-. R ^a022 The aromatic ring contained in it may be an aromatic heterocyclic ring. R ^a022 Among them, the aromatic ring bonded to an amine group and a hydroxyl group is preferably a benzene ring. In R ^a022 In the case where the ring bonded to the amine group and the hydroxyl group is a condensed ring containing two or more rings, the ring bonded to the amino group and the hydroxyl group in the condensed ring is preferably a benzene ring. As R ^a022 Preferable examples include the groups represented by the following formulae (a02-1) to (a02-9). [Chemical 20] (In formula (a02-1), X ⁰¹ It is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms, a fluorinated alkylene group having 1 to 10 carbon atoms, -O-, -S-, -SO-, -SO ₂ -, -CO-, -COO-, -CONH-, and a single bond. In the formulae (a02-2) to (a02-5), Y ⁰¹ They may be the same or different, and are selected from -CH ₂ -, -O-, -S-, -SO-, -SO ₂ One of the groups consisting of-, -CO- and a single bond) The group represented by the formulae (a02-1) to (a02-9) may have one or a plurality of substituents on an aromatic ring. Preferred examples of the substituent are a fluorine atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and a fluorination having 1 to 6 carbon atoms. Alkyl, fluorinated alkoxy having 1 to 6 carbon atoms. When the substituent is a fluorinated alkyl group or a fluorinated alkoxy group, a perfluoroalkyl group or a perfluoroalkoxy group is preferred. Specific examples of the compound represented by the formula (a02) include 2,4-diamino-1,5-benzenediol, 2,5-diamino-1,4-benzenediol, 2 1,5-diamino-3-fluoro-1,4-benzenediol, 2,5-diamino-3,6-difluoro-1,4-benzenediol, 2,6-diamino- 1,5-dihydroxynaphthalene, 1,5-diamino-2,6-dihydroxynaphthalene, 2,6-diamino-3,7-dihydroxynaphthalene, 1,6-diamino-2, 5-dihydroxynaphthalene, 4,4'-diamino-3,3'-dihydroxybiphenyl, 3,3'-diamino-4,4'-dihydroxybiphenyl, 2,3'-di Amino-3,2'-dihydroxybiphenyl, 3,4'-diamino-4,3'-dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxy-6 , 6'-bis (trifluoromethyl) biphenyl, 3,3'-diamino-4,4'-dihydroxy-6,6'-bis (trifluoromethyl) biphenyl, 2,3 '-Diamino-3,2'-dihydroxy-6,6'-bis (trifluoromethyl) biphenyl, 3,4'-diamino-4,3'-dihydroxy-6,6'- Bis (trifluoromethyl) biphenyl, 4,4'-diamino-3,3'-dihydroxy-5,5'-bis (trifluoromethyl) biphenyl, 3,3'-diamine -4,4'-dihydroxy-5,5'-bis (trifluoromethyl) biphenyl, 2,3'-diamino-3,2'-dihydroxy-5,5'-bis (trifluoro (Methyl) biphenyl, 3,4'-diamino-4,3'-dihydroxy-5,5'-bis (trifluoromethyl) biphenyl, bis (4-amino-3-hydroxy Methyl), bis (3-amino-4-hydroxyphenyl) methane, 3,4'-diamino-4,3'-dihydroxydiphenylmethane, bis (4-amino-3-hydroxy -6-trifluoromethylphenyl) methane, bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) methane, 3,4'-diamino-4,3'-dihydroxy -6,6'-bis (trifluoromethyl) diphenylmethane, bis (4-amino-3-hydroxyphenyl) difluoromethane, bis (3-amino-4-hydroxyphenyl) difluoro Methane, 3,4'-diamino-4,3'-dihydroxydiphenyldifluoromethane, bis (4-amino-3-hydroxy-6-trifluoromethylphenyl) difluoromethane, bis (3-Amino-4-hydroxy-6-trifluoromethylphenyl) difluoromethane, 3,4'-diamino-4,3'-dihydroxy-6,6'-bis (trifluoromethyl) Group) diphenyldifluoromethane, bis (4-amino-3-hydroxyphenyl) ether, bis (3-amino-4-hydroxyphenyl) ether, 3,4'-diamino-4, 3'-dihydroxydiphenyl ether, bis (4-amino-3-hydroxy-6-trifluoromethylphenyl) ether, bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) ) Ether, 3,4'-diamino-4,3'-dihydroxy-6,6'-bis (trifluoromethyl) diphenyl ether, bis (4-amino-3-hydroxyphenyl) ketone , Bis (3-amino-4-hydroxyphenyl) ketone, 3,4'-diamino-4,3'-dihydroxydiphenyl ketone, bis (4-amino-3 -Hydroxy-6-trifluoromethylphenyl) ketone, bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) ketone, 3,4'-diamino-4,3'- Dihydroxy-6,6'-bis (trifluoromethyl) diphenyl ketone, 2,2-bis (4-amino-3-hydroxyphenyl) propane, 2,2-bis (3-amino- 4-hydroxyphenyl) propane, 2- (3-amino-4-hydroxyphenyl) -2- (4'-amino-3'-hydroxyphenyl) propane, 2,2-bis (4-amine Methyl-3-hydroxy-6-trifluoromethylphenyl) propane, 2,2-bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) propane, 2- (3-amino 4-hydroxy-6-trifluoromethylphenyl) -2- (4'-amino-3'-hydroxy-6'-trifluoromethylphenyl) propane, 2,2-bis (3-amine 4-hydroxy-5-trifluoromethylphenyl) propane, 2,2-bis (4-amino-3-hydroxyphenyl) hexafluoropropane, 2,2-bis (3-amino-4 -Hydroxyphenyl) hexafluoropropane, 2- (3-amino-4-hydroxyphenyl) -2- (4'-amino-3'-hydroxyphenyl) hexafluoropropane, 2,2-bis ( 4-amino-3-hydroxy-6-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) hexafluoropropane, 2- (3-amino-4-hydroxy-6-trifluoromethylphenyl) -2- (4'-amino-3'-hydroxy-6'-trifluoromethylphenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxy-5-trifluoromethylbenzene Hexafluoropropane, bis (4-amino-3-hydroxyphenyl) fluorene, bis (3-amino-4-hydroxyphenyl) fluorene, 3,4'-diamino-4,3'- Dihydroxydiphenylfluorene, bis (4-amino-3-hydroxy-6-trifluoromethylphenyl) fluorene, bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) fluorene 3,4'-diamino-4,3'-dihydroxy-6,6'-bis (trifluoromethyl) diphenylphosphonium, bis (4-amino-3-hydroxyphenyl) sulfide , Bis (3-amino-4-hydroxyphenyl) sulfide, 3,4'-diamino-4,3'-dihydroxydiphenyl sulfide, bis (4-amino-3-hydroxy- 6-trifluoromethylphenyl) sulfide, bis (3-amino-4-hydroxy-6-trifluoromethylphenyl) sulfide, 3,4'-diamino-4,3'-di Hydroxy-6,6'-bis (trifluoromethyl) diphenyl sulfide, (4-amino-3-hydroxyphenyl) 4-amino-3-hydroxyphenylbenzoate, (3- (Amino-4-hydroxyphenyl) 3-amino 4-hydroxyphenylbenzoate, (3-amino-4-hydroxyphenyl) 4-amino-3-hydroxyphenylbenzoate, (4-Amino-3-hydroxyphenyl) 3-amino-4-hydroxyphenyl benzoate, N- (4-amino-3-hydroxyphenyl) 4-amino-3-hydroxybenzene Formamidine, N- (3-amino-4-hydroxyphenyl) 3-amino 4-hydroxyphenylbenzamide, N- (3-amino-4-hydroxyphenyl) 4-amino 3-hydroxyphenylbenzamide, N- (4-amino-3-hydroxyphenyl) 3-amino-4-hydroxyphenylbenzamide, 2,4'-bis (4-amine Phenyl-3-hydroxyphenoxy) biphenyl, 2,4'-bis (3-amino-4-hydroxyphenoxy) biphenyl, 4,4'-bis (4-amino-3-hydroxybenzene Oxy) biphenyl, 4,4'-bis (3-amino-4-hydroxyphenoxy) biphenyl, bis [4- (4-amino-3-hydroxyphenoxy) phenyl] ether, Bis [4- (3-amino-4-hydroxyphenoxy) phenyl] ether, 2,4'-bis (4-amino-3-hydroxyphenoxy) benzophenone, 2,4 ' -Bis (3-amino-4-hydroxyphenoxy) benzophenone, 4,4'-bis (4-amino-3-hydroxyphenoxy) benzophenone, 4,4'-bis (3-Amino-4-hydroxyphenoxy) benzophenone, 2,4'-bis (4-amino-3-hydroxyphenoxy) octafluorobiphenyl, 2,4'-bis (3 -Amine-4-hydroxyphenoxy) octafluorobiphenyl, 4,4'-bis (4-amino-3-hydroxyphenoxy) octafluorobiphenyl, 4,4'-bis (3-amine 4-hydroxyphenoxy) octafluorobiphenyl, 2,4'-bis (4-amino-3-hydroxyphenoxy) octafluorobenzophenone, 2,4'-bis (3-amine 4-hydroxyphenoxy) octafluorobenzophenone, 4,4'-bis (4-amino-3-hydroxyphenoxy) octafluorobenzophenone, 4,4'-bis (3 -Amino-4-hydroxyphenoxy) octafluorodibenzoyl , 2,2-bis [4- (4-amino-3-hydroxyphenoxy) phenyl] propane, 2,2-bis [4- (3-amino-4-hydroxyphenoxy) phenyl ] Propane, 2,2-bis [4- (4-amino-3-hydroxyphenoxy) phenyl] hexafluoropropane, 2,2-bis [4- (3-amino-4-hydroxyphenoxy Phenyl) phenyl] hexafluoropropane, 2,8-diamino-3,7-dihydroxydibenzofuran, 2,8-diamino-3,7-dihydroxyfluorene, 2,6-diamine -3,7-dihydroxydibenzopyran, 9,9-bis- (4-amino-3-hydroxyphenyl) fluorene and 9,9-bis- (3-amino-4-hydroxybenzene Base) 茀. Among these, 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane is preferred. (Dicarbonyl compound) As a synthetic raw material of the polybenzoxazole precursor, a dicarbonyl compound represented by the following formula (a03) is used together with the aromatic diamine diphenol described above. A polybenzoxazole precursor is obtained by condensing the aromatic diamine diphenol and a dicarbonyl compound represented by the following formula (a03). [Chemical 21] (In formula (a03), R ^a023 Is a divalent organic group, A ⁰ (Represents a hydrogen atom or a halogen atom) R in the formula (a03) ^a023 It may be an aromatic group, an aliphatic group, or a combination of an aromatic group and an aliphatic group. In terms of good heat resistance, mechanical properties, and chemical resistance of the obtained polybenzoxazole resin, R ^a023 A group containing an aromatic group and / or an alicyclic group is preferred. R ^a023 The aromatic group contained in the aromatic hydrocarbon group may be an aromatic hydrocarbon group or an aromatic heterocyclic group. R ^a023 In addition to carbon and hydrogen atoms, it may contain a halogen atom, an oxygen atom, and a sulfur atom. In R ^a023 When an oxygen atom, a nitrogen atom, or a sulfur atom is contained, the oxygen atom, nitrogen atom, or sulfur atom may be selected from a nitrogen-containing heterocyclic group, , -COO-, -O-, -CO-, -SO-, -SO ₂ -, -S- and -SS- are contained in R ^a023 Among them, it is more preferably selected from -O-, -CO-, -SO-, -SO ₂ -, -S- and -SS- are contained in R ^a023 in. In formula (a03), two A's may be used. ⁰ When one is a hydrogen atom and the other is a halogen atom, two A's are preferred ⁰ Both hydrogen atoms or 2 A ⁰ All are halogen atoms. With A ⁰ In the case of a halogen atom, as A ⁰ , Chlorine, bromine and iodine are preferred, and chlorine is more preferred. For using 2 A ⁰ When a dialdehyde compound which is a hydrogen atom is used as the dicarbonyl compound represented by the formula (a03), a polybenzoxazole precursor represented by the following formula (A2) is produced. [Chemical 22] (In formula (A2), R ^a022 And R ^a023 Same as formula (a02) and formula (a03), n ¹ Is the number of repetitions of the unit represented by formula (A2)) ⁰ In the case where a dicarboxylic acid dihalide, which is a halogen atom, is used as the dicarbonyl compound represented by formula (a03), a polybenzoxazole precursor represented by the following formula (A3) is produced. [Chemical 23] (In formula (A3), R ^a022 And R ^a023 Same as formula (a02) and formula (a03), n ² Is the number of repetitions of the unit represented by formula (A3)) Hereinafter, dialdehyde compounds and dicarboxylic acid dihalides which are preferable as dicarbonyl compounds are described. (Dialdehyde compound) The dialdehyde compound used as a raw material of the polybenzoxazole precursor is a compound represented by the following formula (a02-I). The dialdehyde compounds may be used alone or in combination of two or more. [Chemical 24] (In formula (a2-I), R ^a023 (Same as formula (a03)) As for R in formula (a2-I) ^a203 Preferred aromatic groups or aromatic ring-containing groups include the following groups. [Chemical 25] (In the above formula, X ⁰² It is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms, a fluorinated alkylene group having 1 to 10 carbon atoms, -O-, -S-, -SO-, -SO ₂ -, -CO-, -COO-, -CONH-, and a single bond group; in X ⁰² In the case of plural, plural X ⁰² Can be the same or different; Y ⁰² They may be the same or different, and are selected from -CH ₂ -, -O-, -S-, -SO-, -SO ₂ One of the groups consisting of-, -CO- and single bond; p ⁰ And q ⁰ (Integers from 0 to 3, respectively.) As for R in formula (a2-I) ^a023 Preferred examples of the alicyclic group or the alicyclic group-containing group include the following groups. [Chemical 26] (In the above formula, X ⁰² It is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms, a fluorinated alkylene group having 1 to 10 carbon atoms, -O-, -S-, -SO-, -SO ₂ -, -CO-, -COO-, -CONH-, and a single bond group; in X ⁰² In the case of plural, plural X ⁰² Can be the same or different; Y ⁰² They may be the same or different, and are selected from -CH ₂ -, -O-, -S-, -SO-, -SO ₂ One of the groups consisting of-, -CO- and a single bond; Z ⁰ Is selected from -CH ₂ -, -CH ₂ CH ₂ -And -CH = CH- is one of the group; p ⁰ (Integers from 0 to 3, respectively) as the above R ^a023 The aromatic or alicyclic ring contained in the preferred group may have one or a plurality of substituents on the ring. Preferred examples of the substituent include a fluorine atom, an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, and fluorination having 1 to 6 carbon atoms. Alkyl, fluorinated alkoxy having 1 to 6 carbon atoms. When the substituent is a fluorinated alkyl group or a fluorinated alkoxy group, a perfluoroalkyl group or a perfluoroalkoxy group is preferred. In the case where the dialdehyde compound represented by the formula (a2-I) is an aromatic dialdehyde, as preferred examples thereof, benzaldehydes, pyridinedialdehydes, pyridine &#134116; dialdehydes, Pyrimidine dialdehydes, naphthalenedialdehydes, biphenyl dialdehydes, diphenyl ether dialdehydes, diphenylsulfonium dialdehydes, diphenylsulfide dialdehydes, bis (methylfluorenylphenoxy) benzene Type, [1,4-phenylenebis (1-methylethylene)] benzaldehyde, 2,2-bis [4- (methylaminophenoxy) phenyl] propane, bis [ 4- (methylaminophenoxy) phenyl] thioethers, bis [4- (methylaminophenoxy) phenyl] fluorenes, and fluorene-containing dialdehydes. Specific examples of benzaldehydes include benzaldehyde, isophthalaldehyde, terephthalaldehyde, 3-fluorobenzaldehyde, 4-fluorobenzaldehyde, 2-fluoroisophthalaldehyde, 4- Fluoroisophthalaldehyde, 5-fluoroisophthalaldehyde, 2-fluoroterephthalaldehyde, 3-trifluoromethylbenzaldehyde, 4-trifluoromethylbenzaldehyde, 2-trifluoromethylisobenzene Diformaldehyde, 4-trifluoromethylisophthalaldehyde, 5-trifluoromethylisophthalaldehyde, 2-trifluoromethylterephthalaldehyde, 3,4,5,6-tetrafluorobenzenedialdehyde, 2,4,5,6-tetrafluoroisophthalaldehyde and 2,3,5,6-tetrafluoroterephthalaldehyde. Specific examples of pyridinedialdehydes include pyridine-2,3-dialdehyde, pyridine-3,4-dialdehyde, and pyridine-3,5-dialdehyde. Specific examples of pyridine &#134116; dialdehydes include pyridine &#134116; -2,3-dialdehyde, pyridine &#134116; -2,5-dialdehyde, and pyridine &#134116; -2, 6-dialdehyde and so on. Specific examples of the pyrimidinedialdehydes include pyrimidine-2,4-dialdehyde, pyrimidine-4,5-dialdehyde, and pyrimidine-4,6-dialdehyde. Specific examples of naphthalenedialdehydes include naphthalene-1,5-dialdehyde, naphthalene-1,6-dialdehyde, naphthalene-2,6-dialdehyde, naphthalene-3,7-dialdehyde, 2, 3,4,6,7,8-hexafluoronaphthalene-1,5-dialdehyde, 2,3,4,5,6,8-hexafluoronaphthalene-1,6-dialdehyde, 1,3,4, 5,7,8-hexafluoronaphthalene-2,6-dialdehyde, 1-trifluoromethylnaphthalene-2,6-dialdehyde, 1,5-bis (trifluoromethyl) naphthalene-2,6-di Aldehyde, 1-trifluoromethylnaphthalene-3,7-dialdehyde, 1,5-bis (trifluoromethyl) naphthalene-3,7-dialdehyde, 1-trifluoromethyl-2,4,5, 6,8-pentafluoronaphthalene-3,7-dialdehyde, 1-bis (trifluoromethyl) methoxy-2,4,5,6,8-pentafluoronaphthalene-3,7-dialdehyde, 1 , 5-bis (trifluoromethyl) -2,4,6,8-tetrafluoronaphthalene-3,7-dialdehyde and 1,5-bis [bis (trifluoromethyl) methoxy] -2, 4,6,8-tetrafluoronaphthalene-3,7-dialdehyde, etc. Specific examples of biphenyldialdehydes include biphenyl-2,2'-dialdehyde, biphenyl-2,4'-dialdehyde, biphenyl-3,3'-dialdehyde, and biphenyl-4 , 4'-dialdehyde, 6,6'-difluorobiphenyl-3,4'-dialdehyde, 6,6'-difluorobiphenyl-2,4'-dialdehyde, 6,6'-difluoro Biphenyl-3,3'-dialdehyde, 6,6'-difluorobiphenyl-3,4'-dialdehyde, 6,6'-difluorobiphenyl-4,4'-dialdehyde, 6,6 '-Bis (trifluoromethyl) biphenyl-2,2'-dialdehyde, 6,6'-bis (trifluoromethyl) biphenyl-2,4'-dialdehyde, 6,6'-bis ( Trifluoromethyl) biphenyl-3,3'-dialdehyde, 6,6'-bis (trifluoromethyl) biphenyl-3,4'-dialdehyde, and 6,6'-bis (trifluoromethyl) ) Biphenyl-4,4'-dialdehyde and the like. Specific examples of diphenyl ether dialdehydes include diphenyl ether-2,4'-dialdehyde, diphenyl ether-3,3'-dialdehyde, diphenyl ether-3,4'-dialdehyde, and Diphenyl ether-4,4'-dialdehyde, etc. Specific examples of diphenylfluorene dialdehydes include diphenylfluorene-3,3'-dialdehyde, diphenylfluorene-3,4'-dialdehyde, and diphenylfluorene-4,4 ' -Dialdehydes and the like. Specific examples of the diphenyl sulfide dialdehydes include diphenyl sulfide-3,3'-dialdehyde, diphenyl sulfide-3,4'-dialdehyde, and diphenyl sulfide- 4,4'-dialdehyde and the like. Specific examples of the diphenyl ketone dialdehydes include diphenyl ketone-3,3'-dialdehyde, diphenyl ketone-3,4'-dialdehyde, and diphenyl ketone-4,4 '. -Dialdehydes and the like. Specific examples of the bis (methylmethylphenoxy) benzenes include 1,3-bis (3-methylmethylphenoxy) benzene and 1,4-bis (3-methylmethylphenoxy) ) Benzene and 1,4-bis (4-methylfluorenylphenoxy) benzene. Specific examples of [1,4-phenylenebis (1-methylethylene)] benzaldehydes include 3,3 '-[1,4-phenylenebis (1-methyl Ethylene)] dibenzaldehyde, 3,4 '-[1,4-phenylenebis (1-methylethylene)] dibenzaldehyde, and 4,4'-[1,4-phenylene Bis (1-methylethylene)] benzaldehyde and the like. Specific examples of 2,2-bis [4- (methylaminophenoxy) phenyl] propanes include 2,2-bis [4- (2-methylaminophenoxy) phenyl] Propane, 2,2-bis [4- (3-methylfluorenylphenoxy) phenyl] propane, 2,2-bis [4- (4-methylfluorenylphenoxy) phenyl] propane, 2, 2-bis [4- (3-methylfluorenylphenoxy) phenyl] hexafluoropropane and 2,2-bis [4- (4-methylfluorenylphenoxy) phenyl] hexafluoropropane and the like. Specific examples of the bis [4- (methylaminophenoxy) phenyl] thioethers include bis [4- (3-methylaminophenoxy) phenyl] thioether and bis [4- (4-methylfluorenylphenoxy) phenyl] sulfide and the like. Specific examples of the bis [4- (methylfluorenylphenoxy) phenyl] fluorenes include bis [4- (3-methylfluorenylphenoxy) phenyl] fluorene and bis [4- (4 -Methylaminophenoxy) phenyl] fluorene and the like. Specific examples of fluorene-containing dialdehydes include fluorene-2,6-dialdehyde, fluorene-2,7-dialdehyde, dibenzofuran-3,7-dialdehyde, and 9,9-bis (4- Formamylphenyl) fluorene, 9,9-bis (3-methylfluorenylphenyl) fluorene and 9- (3-methylfluorenylphenyl) -9- (4'-methylmethylphenyl) fluorene, etc. . In addition, a diphenylalkanedialdehyde or a diphenylfluoroalkanedialdehyde represented by the following formula is also preferably used as the aromatic dialdehyde compound. [Chemical 27] Furthermore, the compound which has a fluorene imine bond represented by a following formula can also be used suitably as an aromatic dialdehyde compound. [Chemical 28] When the dicarbonyl compound represented by the formula (a2-I) is an alicyclic dialdehyde containing an alicyclic group, as a preferable example thereof, cyclohexane-1,4-dialdehyde, cyclic Hexane-1,3-dialdehyde, bicyclic [2.2.1] heptane-2,5-dialdehyde, bicyclic [2.2.2] octane-2,5-dialdehyde, bicyclic [2.2.2] octane- 7-ene-2,5-dialdehyde, bicyclic [2.2.1] heptane-2,3-dialdehyde, bicyclic [2.2.1] hept-5-ene-2,3-dialdehyde, tricyclic [5.2 .1.0 ^2,6 ] Decane-3,4-dialdehyde, tricyclic [5.2.1.0 ^2,6 ] Dec-4-ene-8,9-dialdehyde, perhydronaphthalene-2,3-dialdehyde, perhydronaphthalene-1,4-dialdehyde, perhydronaphthalene-1,6-dialdehyde, perhydro- 1,4-methylenenaphthalene-2,3-dialdehyde, perhydro-1,4-methylenenaphthalene-2,7-dialdehyde, perhydro-1,4-methylenenaphthalene-7,8 -Dialdehyde, perhydro-1,4: 5,8-dimethylene naphthalene-2,3-dialdehyde, perhydro-1,4: 5,8-dimethylene naphthalene-2,7-di Aldehyde, perhydro-1,4: 5,8: 9,10-trimethylene anthracene-2,3-dialdehyde, dicyclohexyl-4,4'-dialdehyde, dicyclohexyl ether-3,4'- Dialdehyde, dicyclohexylmethane-3,3'-dialdehyde, dicyclohexylmethane-3,4'-dialdehyde, dicyclohexylmethane-4,4'-dialdehyde, dicyclohexyldifluoromethane-3 , 3'-dialdehyde, dicyclohexyldifluoromethane-3,4'-dialdehyde, dicyclohexyldifluoromethane-4,4'-dialdehyde, dicyclohexylfluorene-3,3'-dialdehyde, Dicyclohexylfluorene-3,4'-dialdehyde, dicyclohexylfluorene-4,4'-dialdehyde, dicyclohexylsulfide-3,3'-dialdehyde, dicyclohexylsulfide-3,4 ' -Dialdehyde, dicyclohexyl sulfide-4,4'-dialdehyde, dicyclohexanone-3,3'-dialdehyde, dicyclohexanone-3,4'-dialdehyde, dicyclohexanone-4 , 4'-Dialdehyde, 2,2-bis (3-methylfluorenylcyclohexyl) propane, 2,2-bis (4-methylfluorenylcyclohexyl) propane, 2,2-bis (3-methylfluorenyl (Cyclohexyl) hexafluoropropane 2,2-bis (4-methylfluorenylcyclohexyl) hexafluoropropane, 1,3-bis (3-methylfluorenylcyclohexyl) benzene, 1,4-bis (3-methylfluorenylcyclohexyl) benzene, 1,4-bis (4-methylfluorenylcyclohexyl) benzene, 3,3 '-[1,4-cyclohexylbis (1-methylethylene)] bicyclohexane formaldehyde, 3,4'- [1,4-cyclohexylbis (1-methylethylene)] bicyclohexane formaldehyde, 4,4 '-[1,4-cyclohexylbis (1-methylethylene)] dicyclohexyl Alkaldehyde, 2,2-bis [4- (3-methylfluorenylcyclohexyl) cyclohexyl] propane, 2,2-bis [4- (4-methylfluorenylcyclohexyl) cyclohexyl] propane, 2,2 -Bis [4- (3-methylfluorenylcyclohexyl) cyclohexyl] hexafluoropropane, 2,2-bis [4- (4-methylfluorenylphenoxy) cyclohexyl] hexafluoropropane, bis [4- (3-formamylcyclohexyloxy) cyclohexyl] sulfide, bis [4- (4-formamylcyclohexyloxy) cyclohexyl] sulfide, bis [4- (3-formamylcyclohexyl) (Oxy) cyclohexyl] fluorene, bis [4- (4-methylfluorenylcyclohexyloxy) cyclohexyl] fluorene, 2,2'-bicyclo [2.2.1] heptane-5,6'-dialdehyde, 2,2'-bicyclo [2.2.1] heptane-6,6'-dialdehyde and 1,3-dimethylformamidine, etc. Among the dialdehyde compounds described above, isobenzene is preferred in terms of ease of synthesis or availability or availability of a polybenzoxazole precursor that provides a polybenzoxazole resin with excellent heat resistance and mechanical properties. Diformaldehyde. (Dicarboxyfluorene dihalide) The dicarboxylic acid dihalide used as a raw material of the polybenzoxazole precursor is a compound represented by the following formula (a2-II). Dicarboxylic acid dihalides can be used alone or in combination of two or more. [Chemical 29] (In formula (a2-II), R ^a023 (Same as formula (a03), Hal is a halogen atom) In formula (a2-II), as Hal, chlorine, bromine and iodine are preferred, and chlorine is more preferred. As a preferable compound as a compound represented by the formula (a2-II), a compound in which two aldehyde groups of the above-mentioned compound which are the preferred examples of a dialdehyde compound are substituted with a halocarbonyl group, and a chlorocarbonyl group is preferable . Among the dicarboxylic acid dihalides described above, it is preferable in terms of easy synthesis or availability, or easy availability of polybenzoxazole precursors that provide polybenzoxazole resins excellent in heat resistance and mechanical properties. For p-xylylenedichloride. (Solvent) The solvent used in the preparation of the polyimide resin precursor or the polybenzoxazole precursor is not particularly limited, and may be obtained from the polyimide resin precursor or the polybenzoxazole precursor. The solvent used in the preparation is appropriately selected. As the solvent used in the preparation of the polyimide resin precursor or the polybenzoxazole precursor, a solvent containing a compound represented by the following formula (a04) is preferably used. [Chemical 30] (In formula (a04), R ^a024 And R ^a025 Are each independently an alkyl group having 1 to 3 carbon atoms, and R ^a026 Is a base represented by the following formula (a04-1) or (a04-2): [化 31] In formula (a04-1), R ^a027 Is a hydrogen atom or a hydroxyl group, R ^a028 And R ^a029 Each is independently an alkyl group having 1 to 3 carbon atoms; in the formula (a04-2), R ^a030 And R ^a031 Each independently a hydrogen atom or an alkyl group having 1 or more and 3 or less carbon atoms) When synthesizing a polybenzoxazole precursor using a solvent containing a compound represented by the above formula (a04), the polybenzene is reacted at a low temperature. In the case where the benzoxazole precursor is heat-treated, it is also possible to suppress the decrease in transparency caused by the coloring of the resin when the polybenzoxazole precursor is heated, and to produce excellent mechanical properties such as tensile elongation or chemical resistance. Polybenzoxazole resin. In addition, in the case where a polybenzoxazole resin is produced by heating a polybenzoxazole precursor synthesized using a solvent containing a compound represented by the above formula (a04), the polybenzoxazole resin can be suppressed. Surface defects such as bulging, cracking, and foaming. Therefore, when a film containing a polybenzoxazole precursor synthesized using a solvent containing the compound represented by the formula (a04) is heated to produce a polybenzoxazole resin film, it is easy to produce a non-cracked, Films with defects such as foaming and pinholes, and excellent appearance. In the compound represented by formula (a04), as R ^a026 Specific examples in the case where it is a base represented by formula (a04-1) include N, N, 2-trimethylpropanamide, N-ethyl, N, 2-dimethylpropanamide, N, N-diethyl-2-methylpropanamide, N, N, 2-trimethyl-2-hydroxypropanamine, N-ethyl-N, 2-dimethyl-2-hydroxypropyl Ammonium and N, N-diethyl-2-hydroxy-2-methylpropanamide and the like. In the compound represented by formula (a04), as R ^a026 Specific examples when the base is represented by formula (a04-2) include N, N, N ', N'-tetramethylurea, N, N, N', N'-tetraethylurea Wait. Particularly preferred examples of the compound represented by the formula (a4) include N, N, 2-trimethylpropanamide and N, N, N ', N'-tetramethylurea. The boiling point of N, N, 2-trimethylpropanamide at atmospheric pressure is 175 ° C, and the boiling point of N, N, N ', N'-tetramethylurea at atmospheric pressure is 177 ° C. In this way, N, N, 2-trimethylpropanamide and N, N, N ', N'-tetramethyl urea are soluble in the aromatic diamine diphenol, dicarbonyl compound, and the resulting polybenzoxazole The precursor has a lower boiling point in the solvent. Therefore, if a polybenzoxazole precursor synthesized using a solvent containing at least one selected from the group consisting of N, N, 2-trimethylpropylamine and N, N, N ', N'-tetramethylurea is used, When the polybenzoxazole resin is heated, it is difficult to have a solvent in the generated polybenzoxazole resin when the polybenzoxazole precursor is heated, and it is difficult to cause the tensile elongation of the obtained polybenzoxazole resin to decrease. Wait. Furthermore, N, N, 2-trimethylpropanamide and N, N, N ', N'-tetramethylurea have not been designated as substances suspected of being hazardous under the EU (EU) REACH regulations, That is, SVHC (Substance of Very High Concern, Substance of Very High Concern), which is a less harmful substance, is also useful in this respect. In the case where the solvent used in the preparation of the polybenzoxazole precursor contains a compound represented by the formula (a04), the content of the compound represented by the formula (a04) in the solvent is preferably 70% by mass or more, more It is preferably 80% by mass or more, particularly preferably 90% by mass or more, and most preferably 100% by mass. When the solvent contains a compound represented by the formula (a04), examples of the organic solvent that can be used with the compound represented by the formula (a04) include N, N-dimethylformamide, N, N- Nitrogen-containing polar solvents such as dimethylacetamide, N-methyl-2-pyrrolidone, hexamethylphosphoramidone, 1,3-dimethyl-2-imidazolidone; methyl ethyl ketone, Ketones such as methyl isobutanone, cyclohexanone and isophorone; γ-butyrolactone, γ-valerolactone, δ-valerolactone, γ-caprolactone, ε-caprolactone, α-formyl -Γ-butyrolactone, ethyl lactate, methyl acetate, ethyl acetate and n-butyl acetate; cyclic ethers such as dioxane and tetrahydrofuran; rings such as ethylene carbonate and propylene carbonate Esters; aromatic hydrocarbons such as toluene and xylene; fluorenes such as dimethyl sulfene. (Manufacturing method of polybenzoxazole precursor) A polybenzoxazole precursor can be manufactured by making the said aromatic diamine diphenol and a dicarbonyl compound react in a solvent according to a well-known method. Hereinafter, as a representative example of the production method of the polybenzoxazole precursor, a production method when the dicarbonyl compound is a dialdehyde compound and a production method when the dicarbonyl compound is a dicarboxyfluoride halide will be described.・ Reaction of aromatic diamine diphenol and dialdehyde compound The reaction of aromatic diamine diphenol and dialdehyde compound is a Schiff base formation reaction, and it can be performed according to a well-known method. The reaction temperature is not particularly limited, but is usually preferably 20 ° C or higher and 200 ° C or lower, more preferably 20 ° C or higher and 160 ° C or lower, and particularly preferably 100 ° C or higher and 160 ° C or lower. The reaction of the aromatic diamine diphenol and the dialdehyde compound can be performed by adding an azeotropic additive (entrainer) to the solvent while refluxing and dehydrating. The azeotropic additive is not particularly limited, and is appropriately selected from organic solvents that form an azeotropic mixture with water and form a two-layer system with water at room temperature. Preferred examples of the azeotropic additive include esters such as isobutyl acetate, allyl acetate, n-propyl propionate, isopropyl propionate, n-butyl propionate, and isobutyl propionate; dichloro Ethers such as methyl ether and ethyl isoamyl ether; ketones such as ethylpropyl ketone; aromatic hydrocarbons such as toluene. The reaction time of the aromatic diamine diphenol and the dialdehyde compound is not particularly limited, but it is typically preferably about 2 hours to 72 hours. The amount of the dialdehyde compound used in the production of the polybenzoxazole precursor is preferably 1 mol or more and 1.5 mol or less, more preferably 0.7 mol or more and 1.3 mols relative to the aromatic diamine diphenol. Moore below. The amount of the solvent used is not particularly limited as long as the reaction between the aromatic diamine diphenol and the dialdehyde compound can proceed well. Typically, a solvent having a mass of 1 to 40 times, preferably 1.5 to 20 times the mass of the total amount of the aromatic diamine diphenol and the mass of the dialdehyde compound is used. The reaction of the aromatic diamine diphenol and the dialdehyde compound is preferably performed until the number average molecular weight of the generated polybenzoxazole precursor becomes 1,000 or more and 20,000 or less, preferably 1200 or more and 5,000 or less.・ Reaction between aromatic diamine diphenol and dicarboxylic acid dihalide The reaction temperature of the reaction between aromatic diamine diphenol and dicarboxylic acid dihalide is not particularly limited, but it is usually preferably -20 ° C or higher and 150 ° C or lower. The temperature is preferably -10 ° C or higher and 150 ° C or lower, and particularly preferably -5 ° C or higher and 70 ° C or lower. In the reaction of aromatic diamine diphenol and dicarboxylic acid dihalide, hydrogen halide is produced as a by-product. To neutralize the hydrogen halide, a small amount of organic bases such as triethylamine, pyridine, and N, N-dimethyl-4-aminopyridine, or alkali metal hydroxides such as sodium hydroxide and potassium hydroxide can be added to the reaction solution in small amounts. Thing. The reaction time between the aromatic diamine diphenol and the dicarboxylic acid dihalide is not particularly limited, but it is preferably about 2 hours to 72 hours. The amount of dicarboxylic acid dihalide used in the manufacture of the polybenzoxazole precursor is 1 mole, preferably 0.5 mole or more and 1.5 mole or less, more preferably 0.7 mole or more, relative to the aromatic diamine diphenol. And less than 1.3 mol. The amount of the solvent used is not particularly limited as long as the reaction between the aromatic diamine diphenol and the dicarboxylic acid dihalide can proceed well. Typically, a solvent having a mass of 1 to 40 times, preferably 1.5 to 20 times the mass of the total of the mass of the aromatic diamine diphenol and the mass of the dicarboxylic acid dihalide is used. The reaction of the aromatic diamine diphenol and the dicarboxylic acid dihalide is preferably performed until the number average molecular weight of the generated polybenzoxazole precursor becomes 1,000 or more and 20,000 or less, preferably 1200 or more and 5,000 or less. A solution of the polybenzoxazole precursor is obtained by the method described above. In preparing the composition for forming a hydrogen barrier film, a solution of a polybenzoxazole precursor may be directly used. In addition, at least a portion of the solvent may be removed from the solution of the polybenzoxazole precursor at a low temperature to the extent that it will not be converted from the polybenzoxazole precursor to the polybenzoxazole resin under reduced pressure. The obtained slurry or solid of the polybenzoxazole precursor is used for the preparation of a composition for forming a hydrogen barrier film. [Polybenzothiazole precursor] A polybenzothiazole precursor is typically produced by reacting an aromatic diamine dithiophenol with a dicarbonyl compound having a specific structure. As the aromatic diamine dithiophenol, a compound in which the hydroxyl group of the aromatic diamine diphenol used in the synthesis of the polybenzoxazole precursor is substituted with a mercapto group can be used. As the dicarbonyl compound, the same compound as that used in the synthesis of the polybenzoxazole precursor can be used. Reaction method, reaction conditions, and the like for reacting an aromatic diamine dithiophenol with a dicarbonyl compound to synthesize a polybenzothiazole precursor and reacting an aromatic diamine diphenol with a dicarbonyl compound to synthesize a polybenzoxazole precursor Things are the same. [Polybenzimidazole precursor] The polybenzimidazole precursor is typically produced by reacting an aromatic tetramine with a dicarboxylic acid dihalide. As the aromatic tetramine, a compound in which the hydroxyl group of the aromatic diamine diphenol used in the synthesis of the polybenzoxazole precursor is substituted with an amine group can be used. As the dicarboxylic acid dihalide, the same compound as that used in the synthesis of the polybenzoxazole precursor can be used. Reaction method, reaction conditions, etc. when an aromatic tetramine is reacted with dicarboxylic acid dihalide to synthesize a polybenzimidazole precursor, and a polybenzoxazole is synthesized by reacting an aromatic diamine diphenol with a dicarboxylic acid dihalide The situation of the precursor is the same. [Styrene-maleic acid copolymer] The type of the styrene-maleic acid copolymer is not particularly limited as long as it does not hinder the object of the present invention. The copolymerization ratio (mass ratio) of styrene / maleic acid in the styrene-maleic acid copolymer is preferably 1/9 or more and 9/1 or less, and more preferably 2/8 or more and 8 / 1 or less, particularly preferably 1/1 or more and 8/1 or less. The molecular weight of the styrene-maleic acid copolymer is not particularly limited. The mass average molecular weight in terms of polystyrene is preferably 1,000 or more and 100,000 or less, and more preferably 5,000 or more and 12,000 or less. [Epoxy-containing resin] When an epoxy-containing resin is used as the base material component (A), the epoxy-containing resin is heated by heating in the presence of a hardener or a hardening accelerator as necessary. The epoxy groups possessed are crosslinked with each other. As a result, a hardened body excellent in heat resistance or mechanical properties can be obtained. The epoxy group-containing resin is not particularly limited as long as it is a resin containing a molecule having an epoxy group. The epoxy group-containing resin may be a polymer obtained by polymerizing a monomer having an epoxy group or a monomer mixture containing a monomer having an epoxy group. The epoxy group-containing resin may be a polymer having a reactive functional group such as a hydroxyl group, a carboxyl group, or an amine group. For example, a resin having an epoxy group such as epichlorohydrin may be used to introduce the epoxy group. In terms of easiness in obtaining, preparing, and adjusting the amount of epoxy groups in the polymer, as the polymer having an epoxy group, a monomer having an epoxy group or a monomer containing an epoxy group is preferably used. A polymer obtained by polymerizing a monomer mixture of a polymer. Preferred examples of the epoxy-containing resin include phenol novolac epoxy resin, brominated phenol novolac epoxy resin, o-cresol novolac epoxy resin, and bisphenol A novolac ring Epoxy resins and novolac epoxy resins such as bisphenol AD novolac epoxy resins; cycloaliphatic epoxy resins such as epoxides of dicyclopentadiene phenol resins; aromatics such as naphthalene phenol resins Family epoxy resin. Among the epoxy group-containing resins, a homopolymer of an (meth) acrylate having an epoxy group or an epoxy group is preferred in terms of ease of preparation or adjustment of physical properties of the hydrogen barrier film. Copolymer of (meth) acrylate with other monomers. The (meth) acrylate having an epoxy group may be a (meth) acrylate having a chain aliphatic epoxy group, or may be a (meth) acrylate having an alicyclic epoxy group as described below. The (meth) acrylate having an epoxy group may contain an aromatic group. Among the (meth) acrylates having an epoxy group, an aliphatic (meth) acrylate having a chain aliphatic epoxy group or an aliphatic (meth) acrylic acid having an alicyclic epoxy group is preferred. The ester is more preferably an aliphatic (meth) acrylate having an alicyclic epoxy group, and from the viewpoint of patterning characteristics, it is more preferable that the ring structure in the alicyclic epoxy group contains more Aliphatic (meth) acrylates of alicyclic epoxy groups with cyclic structure. Examples of the (meth) acrylate containing an aromatic group and having an epoxy group include 4-glycidoxyphenyl (meth) acrylate and 3-glycidoxyphenyl (meth) acrylate , 2-glycidyloxyphenyl (meth) acrylate, 4-glycidyloxyphenyl (meth) acrylate, 3-glycidyloxyphenyl (meth) acrylate, and (methyl) ) 2-glycidyloxyphenyl methyl acrylate and the like. Examples of the aliphatic (meth) acrylate having a chain aliphatic epoxy group include an alkylene oxide (meth) acrylate and an alkylene oxide alkyl (meth) acrylate. A (meth) acrylic acid ester in which a chain aliphatic epoxy group is bonded to an oxy group (-O-) in an ester group (-O-CO-). Such a (meth) acrylic acid ester may have one or more oxygen groups (-O-) in a chain in the chain-like aliphatic epoxy group. The number of carbon atoms of the chain aliphatic epoxy group is not particularly limited, but is preferably 3 or more and 20 or less, more preferably 3 or more and 15 or less, and even more preferably 3 or more and 10 or less. Specific examples of the aliphatic (meth) acrylate having a chain aliphatic epoxy group include glycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, and (methyl) ) Epoxy alkyl (meth) acrylates such as 3,4-epoxybutyl acrylate, 6,7-epoxyheptyl (meth) acrylate; 2-glycidyloxyethyl (meth) acrylate, 3-glycidyloxy-n-propyl (meth) acrylate, 4-glycidoxy-n-butyl (meth) acrylate, 5-glycidyloxy-n-hexyl (meth) acrylate, (meth) acrylic acid (Meth) acrylic alkylene oxide alkyl esters such as 6-glycidyloxyn-hexyl ester. Specific examples of the aliphatic (meth) acrylate having an alicyclic epoxy group include compounds represented by the following formulae (a05-1) to (a05-15). Among these, compounds represented by the following formulae (a05-1) to (a05-5) are preferred, and compounds represented by the following formulae (a05-1) to (a05-2) are more preferred. In addition, with respect to each of these compounds, the bonding site of the oxygen atom of the ester group to the alicyclic ring is not limited to the positions exemplified here, and a positional isomer may be contained. [Chemical 32] [Chemical 33] [Chem 34] In the above formula, R ^a032 Represents a hydrogen atom or a methyl group, R ^a033 Represents a divalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R ^a034 A divalent hydrocarbon group having 1 to 10 carbon atoms, t ⁰ Represents an integer from 0 to 10. As R ^a033 It is preferably a linear or branched alkylene group, such as methylene, ethylidene, propylidene, tetramethylene, ethylidene, pentamethylene, and hexamethylene. As R ^a034 For example, methylene, ethylidene, propylidene, tetramethylene, ethylidene, pentamethylene, hexamethylene, phenylene, and cyclohexyl are preferred. As the polymer having an epoxy group, any of a homopolymer of a (meth) acrylate having an epoxy group and a copolymer of a (meth) acrylate having an epoxy group and other monomers can be used. The content of the unit derived from the (meth) acrylate having an epoxy group in the polymer having an epoxy group is, for example, 1 to 100% by mass, preferably 10% by mass to 90% by mass, and more preferably It is 30% by mass or more and 80% by mass or less, particularly preferably 50% by mass or more and 75% by mass or less. In the case where the polymer having an epoxy group is a copolymer of a (meth) acrylate having an epoxy group and another monomer, examples of the other monomer include unsaturated carboxylic acids and those having no epoxy group. (Meth) acrylates, (meth) acrylamides, allyl compounds, vinyl ethers, vinyl esters, styrenes, and the like. These compounds may be used alone or in combination of two or more. In terms of the storage stability of the hydrogen barrier film-forming composition or the chemical resistance to alkali and the like of the hydrogen barrier film formed using the hydrogen barrier film-forming composition, the (meth) group having an epoxy group The copolymer of acrylate and other monomers is preferably free of units derived from an unsaturated carboxylic acid. Examples of unsaturated carboxylic acids include (meth) acrylic acid; (meth) acrylamide; butenoic acid; maleic acid, fumaric acid, methyl maleic acid, methyl Fumaric acid, itaconic acid, anhydrides of these dicarboxylic acids. Examples of the (meth) acrylate having no epoxy group include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and amyl (meth) acrylate Linear or branched alkyl (meth) acrylates, such as the third octyl (meth) acrylate, chloroethyl (meth) acrylate, 2,2-dimethylhydroxy (meth) acrylate Propyl ester, 2-hydroxyethyl (meth) acrylate, trimethylolpropane mono (meth) acrylate, benzyl (meth) acrylate, and furfuryl (meth) acrylate; (Meth) acrylate. Among the (meth) acrylates which do not have an epoxy group, a (meth) acrylate which has a group which has an alicyclic skeleton is preferable. In the (meth) acrylate having a group having an alicyclic skeleton, the alicyclic group constituting the alicyclic skeleton may be a monocyclic ring or a polycyclic ring. Examples of the monocyclic alicyclic group include a cyclopentyl group and a cyclohexyl group. Examples of the polycyclic alicyclic group include a noryl group, a isopropyl group, a tricyclononyl group, a tricyclodecyl group, and a tetracyclododecyl group. Examples of the (meth) acrylate having a group having an alicyclic skeleton include compounds represented by the following formulae (a06-1) to (a06-8). Among these, compounds represented by the following formulae (a06-3) to (a06-8) are preferred, and compounds represented by the following formulae (a06-3) or (a06-4) are more preferred. [Chemical 35] [Chemical 36] In the above formula, R ^a035 Represents a hydrogen atom or a methyl group, R ^a036 Represents a single bond or a divalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R ^a037 Represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. As R ^a036 , Preferably a single bond, linear or branched alkylene, such as methylene, ethylidene, propylidene, tetramethylene, ethylidene, pentamethylene, hexamethylene base. As R ^a037 Is preferably methyl or ethyl. Examples of (meth) acrylamide include (meth) acrylamide, N-alkyl (meth) acrylamide, N-aryl (meth) acrylamide, N, N -Dialkyl (meth) acrylamide, N, N-aryl (meth) acrylamide, N-methyl-N-phenyl (meth) acrylamide, N-hydroxyethyl-N -Meth (meth) acrylamide and the like. Examples of allyl compounds include allyl acetate, allyl hexanoate, allyl octoate, allyl laurate, allyl palmitate, allyl stearate, and allyl benzoate. Esters, allyl acetoacetate, allyl lactate and other allyl esters; allyloxyethanol; etc. Examples of vinyl ethers include hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, and chloroethyl vinyl. Ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether, dimethylamino ethyl vinyl ether, Aliphatic vinyl ethers such as diethylaminoethyl vinyl ether, butylaminoethyl vinyl ether, benzyl vinyl ether, tetrahydrofurfuryl vinyl ether; vinyl phenyl ether, vinyl toluene ether, vinyl chlorophenyl ether, Vinyl aromatic ethers such as vinyl-2,4-dichlorophenyl ether, vinyl naphthyl ether, vinyl o-phenylamino ether; etc. Examples of vinyl esters include vinyl butyrate, vinyl isobutyrate, trimethyl vinyl acetate, diethyl vinyl acetate, vinyl borate, vinyl hexanoate, vinyl chloroacetate, and Vinyl chloroacetate, vinyl methoxy acetate, butoxy vinyl acetate, phenyl vinyl acetate, ethyl acetate, vinyl lactate, β-phenyl butyrate, vinyl benzoate, water Vinyl salicylate, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthalate and the like. Examples of styrenes include styrene; methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, isopropylstyrene, and butylbenzene Ethylene, hexylstyrene, cyclohexylstyrene, decylstyrene, benzylstyrene, chloromethylstyrene, trifluoromethylstyrene, ethoxymethylstyrene, ethoxymethylstyrene Isoalkylstyrene; alkoxystyrene such as methoxystyrene, 4-methoxy-3-methylstyrene, and dimethoxystyrene; chlorostyrene, dichlorostyrene, and trichlorobenzene Ethylene, tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4-fluoro Halostyrene such as -3-trifluoromethylstyrene; etc. The molecular weight of the epoxy-containing resin is not particularly limited so long as it does not hinder the object of the present invention. The mass average molecular weight in terms of polystyrene is preferably 3,000 or more and 30,000 or less, more preferably 5,000 or more and 15,000 or less. . When the above thermosetting material is used as the base material component (A), the composition for forming a hydrogen barrier film may contain a hardener, a hardening accelerator, a dehydration condensation agent, an antioxidant, an ultraviolet absorber, and a flame retardant, if necessary. , Release agents, plasticizers, fillers and reinforcements and other additives or reinforcements. In order to facilitate film formation, the composition for forming a hydrogen barrier film may contain a solvent. The type of the solvent can be appropriately selected according to the type of the thermosetting material. When the composition for forming a hydrogen barrier film contains the above-mentioned thermosetting material and the hydrogen barrier agent (B), the content of the hydrogen barrier agent is preferably relative to the mass of the thermosetting material of the composition for forming a hydrogen barrier film. 0.01 mass% or more and 30 mass% or less, more preferably 0.05 mass% or more and 20 mass% or less, and particularly preferably 0.1 mass% or more and 10 mass% or less. As the composition for forming a hydrogen barrier film, in addition to the composition containing the substrate component (A) described above, a photosensitive composition known as a so-called photoresist composition is also preferable. By adding a specific amount of the above-mentioned hydrogen barrier agent (B) to various previously known photosensitive compositions, a photosensitive hydrogen barrier film-forming composition can be obtained. Conventionally known photosensitive compositions contain various photo-curable compounds or alkali-soluble resins, and resins that increase the solubility in alkali by exposure, etc., as the base material component (A). The composition for forming a photosensitive hydrogen barrier film may be a negative-type photosensitive composition which does not dissolve a developing solution by exposure, or may be a positive-type photosensitive composition which dissolves a developing solution by exposure. Hereinafter, a preferable photosensitive composition is demonstrated. (1) Photosensitive composition of the first aspect The photosensitive composition of the first aspect contains a hydrogen barrier along with the alkali-soluble resin (A1), the photopolymerizable compound (A2), and the photopolymerization initiator (C). Negative photosensitive composition of the agent (B) and the organic solvent. In the photosensitive composition of the first aspect, the alkali-soluble resin (A1) and the photopolymerizable compound (A2) correspond to the base material component (A). The alkali-soluble resin (A1) in the photosensitive composition of the first aspect is not particularly limited, and a conventionally known alkali-soluble resin can be used. The alkali-soluble resin (A1) may have an ethylenically unsaturated group or may not have an ethylenically unsaturated group. In addition, in this specification, the alkali-soluble resin means a resin film having a film thickness of 1 μm on a substrate by a resin solution (solvent: propylene glycol monomethyl ether acetate) having a resin concentration of 20% by mass, at 2.38 When immersed in a mass% tetramethylammonium hydroxide (TMAH) aqueous solution for 1 minute, a resin having a film thickness of 0.01 μm or more was dissolved. As the alkali-soluble resin (A1) having an ethylenically unsaturated group, for example, a resin obtained by reacting an epoxy compound with an unsaturated carboxylic acid reactant and a polybasic acid anhydride can be used. Among them, a resin represented by the following formula (a-1) is preferred. The resin represented by the formula (a-1) is preferable in terms of its high photocurability. [Chemical 37] In the above formula (a-1), X ^a A base represented by the following formula (a-2). [Chemical 38] In the above formula (a-2), R ^a1 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen atom, R ^a2 Each independently represents a hydrogen atom or a methyl group, W ^a A single bond or a group represented by the following formula (a-3). [Chemical 39] In the above formula (a-1), Y ^a Represents a residue in which an acid anhydride group (-CO-O-CO-) is removed from a dicarboxylic anhydride. Examples of the dicarboxylic anhydride include maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylidene. Tetrahydrophthalic anhydride, chloric anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, etc. In the above formula (a-1), Z ^a Represents the removal of two residues of acid anhydride groups from tetracarboxylic dianhydride. Examples of the tetracarboxylic dianhydride include pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, and diphenyl ether tetracarboxylic dianhydride. In the formula (a-1), m represents an integer of 0 to 20. Further, as the alkali-soluble resin (A1) having an ethylenically unsaturated group, a polymer obtained by reacting a polyester prepolymer obtained by condensing a polyhydric alcohol with a monobasic acid or a polybasic acid with (meth) acrylic acid can also be used. Ester (meth) acrylate; poly (meth) acrylate urethane obtained by reacting a polyol with a compound having two isocyanate groups and reacting with (meth) acrylic acid; making a bisphenol A ring Oxygen resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol or cresol novolac epoxy resin, soluble phenolic epoxy resin, triphenol methane epoxy resin, polycarboxylic acid Epoxy resin (glycidyl ester, polyglycidyl alcohol, aliphatic or alicyclic epoxy resin, amine epoxy resin, dihydroxy benzene type epoxy resin and epoxy resin obtained by reacting with (meth) acrylic acid ( (Meth) acrylate resin and the like. In addition, in this specification, "(meth) acrylic acid" means both acrylic acid and methacrylic acid. Similarly, "(meth) acrylate" means both acrylate and methacrylate. On the other hand, as the alkali-soluble resin (A1) having no ethylenically unsaturated group, a resin obtained by copolymerizing an unsaturated carboxylic acid with another unsaturated compound can be used. As the other unsaturated compound, it is preferable to use at least one selected from the group consisting of an epoxy-containing unsaturated compound and an alicyclic group-containing unsaturated compound. Examples of the unsaturated carboxylic acid include: monocarboxylic acids such as (meth) acrylic acid and butylene acid; maleic acid, fumaric acid, methyl maleic acid, and methyl fumaric acid Dicarboxylic acids such as Iconic acid; anhydrides of these dicarboxylic acids; etc. Among these, (meth) acrylic acid and maleic anhydride are preferable in terms of copolymerization reactivity, alkali solubility of the obtained resin, and ease of acquisition. These unsaturated carboxylic acids may be used singly or in combination of two or more kinds. Examples of the epoxy-containing unsaturated compound include an epoxy-containing unsaturated compound having no alicyclic group, and an epoxy-containing unsaturated compound having an alicyclic group. Examples of the epoxy group-containing unsaturated compound having an alicyclic group include compounds represented by the above formulae (a05-1) to (a05-15). Examples of the epoxy-containing unsaturated compound having no alicyclic group include glycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, and 3,4 (meth) acrylic acid. -Alkylene oxide (meth) acrylates such as butyl oxide, 6,7-epoxyheptyl (meth) acrylate; 2-glycidyloxyethyl (meth) acrylate, (meth) acrylic acid 3-glycidyloxyn-propyl, 4-glycidyloxy-n-butyl (meth) acrylate, 5-glycidyloxy-n-pentyl (meth) acrylate, 6-glycidyloxy (meth) acrylate Alkyl n-hexyl, and other (meth) acrylic acid alkylene oxide alkyl esters; glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, α-ethyl Α-alkyl acrylates such as 6,7-epoxyheptyl acrylate; o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, etc. Glycidyl ethers; etc. Among these, in terms of copolymerization reactivity and strength of the cured resin, glycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, and (meth) are preferred. 6,7-epoxyheptyl acrylate, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether and p-vinyl benzyl glycidyl ether. These epoxy group-containing unsaturated compounds may be used singly or in combination of two or more kinds. The unsaturated compound containing an alicyclic group is not particularly limited as long as it is an unsaturated compound having an alicyclic group. The alicyclic group may be monocyclic or polycyclic. Examples of the monocyclic alicyclic group include cyclopentyl and cyclohexyl. In addition, examples of the polycyclic alicyclic group include adamantyl, noxyl, isopropyl, tricyclononyl, tricyclodecyl, and tetracyclododecyl. Specifically, as an alicyclic group-containing unsaturated compound, the compound represented by said formula (a06-1)-(a06-8) is mentioned, for example. It is also preferable to polymerize an unsaturated carboxylic acid with a compound other than the above. Examples of such other compounds include (meth) acrylates, (meth) acrylamides, allyl compounds, vinyl ethers, vinyl esters, styrenes, and maleimide Class, etc. These compounds may be used alone or in combination of two or more. Examples of (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, amyl (meth) acrylate, and (meth) acrylic acid. Linear or branched alkyl (meth) acrylates such as trioctyl ester; chloroethyl (meth) acrylate, 2,2-dimethylhydroxypropyl (meth) acrylate, (methyl) 2-hydroxyethyl acrylate, trimethylolpropane mono (meth) acrylate, benzyl (meth) acrylate, furfuryl (meth) acrylate; etc. Examples of (meth) acrylamide include (meth) acrylamide, N-alkyl (meth) acrylamide, N-aryl (meth) acrylamide, N, N-diamine Alkyl (meth) acrylamide, N, N-aryl (meth) acrylamide, N-methyl-N-phenyl (meth) acrylamide, N-hydroxyethyl-N-formyl (Meth) acrylamide and the like. Examples of the allyl compound include allyl acetate, allyl hexanoate, allyl octoate, allyl laurate, allyl palmitate, allyl stearate, allyl benzoate, Allyl acetate such as allyl acetate, allyl lactate; allyloxyethanol; etc. Examples of vinyl ethers include hexyl vinyl ether, octyl vinyl ether, decyl vinyl ether, ethylhexyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, chloroethyl vinyl ether, 1-methyl-2,2-dimethylpropyl vinyl ether, 2-ethylbutyl vinyl ether, hydroxyethyl vinyl ether, diethylene glycol vinyl ether, dimethylamino ethyl vinyl ether, diethyl Alkyl vinyl ethers such as amino ethyl vinyl ether, butyl amino ethyl vinyl ether, benzyl vinyl ether, tetrahydrofurfuryl vinyl ether; vinyl phenyl ether, vinyl toluene, vinyl chlorophenyl ether, vinyl -2,4-Dichlorophenyl ether, vinyl naphthyl ether, vinyl o-phenylamino ether and other vinyl aromatic ethers; etc. Examples of vinyl esters include vinyl butyrate, vinyl isobutyrate, trimethyl vinyl acetate, diethyl vinyl acetate, vinyl borate, vinyl hexanoate, vinyl chloroacetate, and dichloroacetic acid. Vinyl Ester, Vinyl Methoxy Acetate, Vinyl Butoxy Ethyl Acetate, Vinyl Phenyl Acetate, Vinyl Acetate, Vinyl Lactate, Vinyl β-Phenyl Butyrate, Vinyl Benzoate, Salicylic Acid Vinyl ester, vinyl chlorobenzoate, vinyl tetrachlorobenzoate, vinyl naphthalate and the like. Examples of the styrenes include styrene; methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, diethylstyrene, isopropylstyrene, butylstyrene, Alkyl such as hexylstyrene, cyclohexylstyrene, decylstyrene, benzylstyrene, chloromethylstyrene, trifluoromethylstyrene, ethoxymethylstyrene, ethoxymethylstyrene, etc. Styrene; alkoxystyrene such as methoxystyrene, 4-methoxy-3-methylstyrene, dimethoxystyrene; chlorostyrene, dichlorostyrene, trichlorostyrene, Tetrachlorostyrene, pentachlorostyrene, bromostyrene, dibromostyrene, iodostyrene, fluorostyrene, trifluorostyrene, 2-bromo-4-trifluoromethylstyrene, 4-fluoro-3 -Halostyrene such as trifluoromethylstyrene; etc. Examples of the cis-butene diimines include N-methyl-cis-butene diimide, N-ethyl-cis-butene di-imide, N-n-propyl-cis-butene diimide, N-isopropyl cis butene difluorene imine, N-n-butyl cis butene difluorene imine, N-n-pentyl cis butene difluorene imine, N-n-hexyl cis butene difluorene imine, etc. N-substituted cis-butenedifluorene imine having an alkyl group having 1 to 10 carbon atoms; N-cyclopentylcis-butenedifluoreneimine, N-cyclohexylcis-butenedifluoreneimine, N- Cyclopeptyl cis-butene diimide and other cis-butene diimide having N-substituted alicyclic groups having 3 to 20 carbon atoms: N-phenylcis-butene diimide, N -α-naphthyl maleimide, N-β-naphthyl maleimide, and N-aryl maleimide substituted with aryl groups having 6 to 20 carbon atoms N-arylimine; N-benzyl-cis-butene-diimide, N-phenethyl-cis-butene-diimide, etc. N-aryl substituted with an aralkyl group having 7 or more and 20 or less carbon atoms Alkyl maleimide. Further, a copolymer having at least a structural unit derived from an unsaturated carboxylic acid and a structural unit having a polymerizable site with a photopolymerizable compound (A2) described below, or at least a structural unit derived from an unsaturated carboxylic acid, A copolymer derived from a structural unit derived from an epoxy-containing unsaturated compound and a structural unit having a polymerizable site with a photopolymerizable compound (A2) described below can also be preferably used as the alkali-soluble resin (A1). When these alkali-soluble resins are used, a hydrogen barrier film having excellent mechanical strength and excellent adhesion to a substrate can be formed. The above-mentioned copolymer having a structural unit having a polymerizable site with the photopolymerizable compound (A2) may further have the above-mentioned (meth) acrylates, (meth) acrylamides, allyl compounds, ethylene One or more kinds of structural units such as ethers, vinyl esters, styrenes, and maleimides. The structural unit having a polymerizable site with the photopolymerizable compound (A2) preferably has an ethylenically unsaturated group as the polymerizable site with the photopolymerizable compound (A2). A copolymer having such a structural unit can be prepared by reacting at least a part of a carboxyl group contained in a homopolymer of an unsaturated carboxylic acid with an unsaturated compound containing an epoxy group. Further, by reacting at least a part of an epoxy group in a copolymer having a structural unit derived from an unsaturated carboxylic acid and a structural unit derived from an unsaturated compound containing an epoxy group with an unsaturated carboxylic acid, A copolymer having a structural unit having a polymerizable site with the photopolymerizable compound (A2) is prepared. The ratio of the structural unit derived from the unsaturated carboxylic acid in the alkali-soluble resin (A1) is preferably 3% by mass or more and 25% by mass or less, and more preferably 5% by mass or more and 25% by mass or less. The ratio of the structural unit derived from the epoxy-containing unsaturated compound is preferably 30% by mass or more and 95% by mass or less, and more preferably 50% by mass or more and 90% by mass or less. The ratio of the structural units derived from the alicyclic group-containing unsaturated compound is preferably 1% by mass or more and 30% by mass or less, more preferably 3% by mass or more and 25% by mass or less, and further preferably 5 Above mass% and below 20 mass%. By setting it as the said range, alkali solubility of the obtained resin can be made moderate, and the adhesiveness of the photosensitive composition with respect to a board | substrate, and the intensity | strength after hardening of a photosensitive composition can be improved. The mass average molecular weight of the alkali-soluble resin (A1) is preferably 1,000 or more and 40,000 or less, and more preferably 2,000 or more and 30,000 or less. By setting it as the said range, favorable developability can be obtained, and sufficient heat resistance and film strength can be obtained. The content of the alkali-soluble resin (A1) is preferably 5 mass% or more and 80 mass% or less, more preferably 15 mass% or more and 50 mass% or less with respect to the solid content of the photosensitive composition of the first aspect. By setting it as the said range, there exists a tendency for the balance of developability to be easily acquired. The photopolymerizable compound (A2) in the photosensitive composition of the first aspect includes a monofunctional monomer and a polyfunctional monomer. Examples of the monofunctional monomer include (meth) acrylamide, hydroxymethyl (meth) acrylamide, methoxymethyl (meth) acrylamide, and ethoxymethyl (methyl) Acrylamide, propoxymethyl (meth) acrylamide, butoxymethoxymethyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-hydroxymethyl (Meth) acrylamide, (meth) acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, methyl maleic acid, methyl Maleic anhydride, butenoic acid, 2-acrylamido-2-methylpropanesulfonic acid, tertiary butylacrylamidosulfonic acid, methyl (meth) acrylate, ethyl (meth) acrylate , Butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate Ester, 2-hydroxybutyl (meth) acrylate, 2-phenoxy-2-hydroxypropyl (meth) acrylate, 2- (meth) acryloxy-2-hydroxypropyl phthalate , Glycerol mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylamine (meth) acrylate Glycidyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, phthalic acid derivatives Semi (meth) acrylates and the like. These monofunctional monomers can be used alone or in combination of two or more. On the other hand, examples of the polyfunctional monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and propylene glycol di (Meth) acrylate, polypropylene glycol di (meth) acrylate, butanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate Base) acrylate, trimethylolpropane tri (meth) acrylate, glycerol di (meth) acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol Di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 2,2- Bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis (4- (meth) acryloxypolyethoxyphenyl) propane, (methyl) 2-hydroxy-3- (meth) acrylic acid oxypropyl acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglylation Glyceryl ether di (meth) acrylate, diglycidyl phthalate di (meth) acrylate, glycerol triacrylate, glycerol polyglycidyl ether poly (meth) acrylate, (meth) acrylate Carbamates (i.e., toluene diisocyanate), reactants of trimethylhexamethylene diisocyanate and hexamethylene diisocyanate with 2-hydroxyethyl (meth) acrylate, methylenebis (methyl) ) Polyfunctional monomers such as acrylamide, (meth) acrylamide methylene ether, polycondensates of polyhydric alcohols and N-methylol (meth) acrylamide, or triacrylacetal. These polyfunctional monomers can be used alone or in combination of two or more. The content of the photopolymerizable compound (A2) is preferably 1% by mass or more and 30% by mass or less, more preferably 5% by mass or more and 20% by mass or less with respect to the solid content of the photosensitive composition of the first aspect. By setting it as the said range, there exists a tendency for the balance of sensitivity, developability, and resolution to be easily acquired. The photopolymerization initiator (C) in the photosensitive composition of the first aspect is not particularly limited, and a conventionally known photopolymerization initiator can be used. Specific examples of the photopolymerization initiator (C) include 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, and 1- [4- (2- Hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane-1- Ketone, 1- (4-dodecylphenyl) -2-hydroxy-2-methylpropane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1- Ketone, bis (4-dimethylaminophenyl) ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-&#134156; phosphonopropane-1-one, 2- Benzyl-2-dimethylamino-1- (4-&#134156; phenylphenyl) -butane-1-one, 1- [9-ethyl-6- (2-methylbenzylhydrazone) ) -9H-carbazol-3-yl] ethanone 1- (O-acetamoxime), (9-ethyl-6-nitro-9H-carbazol-3-yl) [4- (2- Methoxy-1-methylethoxy) -2-methylphenyl] methanone O-acetamoxime, 2- (benzyloxyimino) -1- [4- (phenylthio ) Phenyl] -1-octanone, 2,4,6-trimethylbenzylidenediphenylphosphine oxide, 4-benzylidene-4'-methyldimethylsulfide, 4-bis Methylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 4-dimethylamino-2-ethyl Hexylbenzoic acid , 4-dimethylamino-2-isoamylbenzoic acid, benzyl-β-methoxyethyl acetal, benzophenone dimethyl ketal, 1-phenyl-1,2-propanedione 2- (O-ethoxycarbonyl) oxime, methyl o-benzoyl benzoate, 2,4-diethyl-9-oxysulfide , 2-chloro-9-oxysulfur 2,4-dimethyl-9-oxysulfur , 1-chloro-4-propoxy-9-oxysulfur ,sulfur 2-chlorosulfur 2,4-diethylsulfur 2-methylsulfur 2-isopropylsulfur , 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzoanthraquinone, 2,3-diphenylanthraquinone, azobisisobutyronitrile, benzamidine peroxide, isoperhydroperoxide Propylbenzene, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, 2- (o-chlorophenyl) -4,5-bis (m-methoxyphenyl) -imidazolyl Dimer, benzophenone, 2-chlorobenzophenone, p, p'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone , 4,4'-Dichlorobenzophenone, 3,3-dimethyl-4-methoxybenzophenone, benzoin, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin N-butyl ether, benzoin isobutyl ether, benzoin butyl ether, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminoacetophenone, dichloroacetophenone , Trichloroacetophenone, p-third butyl acetophenone, p-dimethylaminoacetophenone, p-third butyl trichloroacetophenone, p-third butyl dichloroacetophenone, α, α -Dichloro-4-phenoxyacetophenone, 9-oxysulfur 2-methyl-9-oxysulfur , 2-isopropyl-9-oxysulfur , Dibenzocycloheptanone, amyl 4-dimethylaminobenzoate, 9-phenylacridine, 1,7-bis- (9-acridyl) heptane, 1,5-bis- (9 -Acridyl) pentane, 1,3-bis- (9-acridyl) propane, p-methoxytri &#134116;, 2,4,6-tris (trichloromethyl) -mesatriene # 134116 ;, 2-methyl-4,6-bis (trichloromethyl) -tritris &#134116;, 2- [2- (5-methylfuran-2-yl) vinyl] -4, 6-bis (trichloromethyl) -mesityl &#134116;, 2- [2- (furan-2-yl) vinyl] -4,6-bis (trichloromethyl) -mesityl &#134116;, 2- [2- (4-Diethylamino-2-methylphenyl) vinyl] -4,6-bis (trichloromethyl) -mesa &#134116;, 2- [2- (3,4-dimethoxyphenyl) vinyl] -4,6-bis (trichloromethyl) -mesa &#134116;, 2- (4-methoxyphenyl) -4,6 -Bis (trichloromethyl) -mesityl &#134116;, 2- (4-ethoxystyryl) -4,6-bis (trichloromethyl) -mesityl &#134116;, 2- (4-n-butoxyphenyl) -4,6-bis (trichloromethyl) -tristriene &#134116;, 2,4-bis-trichloromethyl-6- (3-bromo-4- (Methoxy) phenyl-mesityl &#134116;, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy) phenyl-mesityl &#134116;, 2, 4-bis-trichloromethyl-6- (3-bromo-4-methoxy) styrylphenyl-mesityl &#134116;, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy) styrylphenyl-mesityl &#134116; and the like. These photopolymerization initiators can be used alone or in combination of two or more. Among these, in terms of sensitivity, it is particularly preferable to use an oxime-based photopolymerization initiator. Among the oxime-based photopolymerization initiators, particularly preferred ones include O-ethylfluorenyl-1- [6- (2-methylbenzylidene) -9-ethyl-9H-carbazole -3-yl] ethanone oxime, 1- [9-ethyl-6- (pyrrole-2-ylcarbonyl) -9H-carbazol-3-yl] ethanone 1- (O-acetamoxime) and 1 -[4- (phenylthio) -1,2-octanedione 2- (O-benzidine oxime)]. As the photopolymerization initiator, an oxime-based compound represented by the following formula (c1) can also be preferably used. [Chemical 40] (R ^c1 Is a group selected from the group consisting of a monovalent organic group, an amine group, a halogen, a nitro group, and a cyano group, n1 is an integer of 0 to 4 and n2 is 0 or 1, R ^c2 Is a phenyl group which may have a substituent or a carbazolyl group which may have a substituent, R ^c3 Is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms) In formula (c1), R ^c1 It does not specifically limit as long as it does not inhibit the objective of this invention, It can select suitably from various organic groups. As R ^c1 Preferable examples in the case of an organic group include alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic fluorenyl, saturated aliphatic fluorenyl, alkoxycarbonyl, and optionally substituted A phenyl group, a phenoxy group which may have a substituent, a benzamyl group which may have a substituent, a phenoxycarbonyl group which may have a substituent, a benzamyloxy group which may have a substituent, Phenylalkyl, naphthyl which may have a substituent, naphthyloxy which may have a substituent, naphthylmethyl group which may have a substituent, naphthyloxycarbonyl group which may have a substituent, naphthylmethane which may have a substituent Oxy group, naphthylalkyl group which may have a substituent, heterocyclic group which may have a substituent, amine group, amine group substituted with 1 or 2 organic groups, &#134156;#134116; -1-yl, halogen, nitro and cyano. When n1 is an integer of 2 or more and 4 or less, R ^c1 It can be the same or different. The number of carbon atoms of the substituent does not include the number of carbon atoms of the substituent. In R ^c1 In the case of an alkyl group, the number of carbon atoms is preferably 1 or more and 20 or less, and more preferably the number of carbon atoms is 1 or more and 6 or less. Again, in R ^c1 In the case of an alkyl group, it may be a straight chain or a branched chain. As R ^c1 Specific examples in the case of an alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, n-pentyl, iso Pentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl and Isodecyl and so on. Again, in R ^c1 In the case of an alkyl group, the alkyl group may contain an ether bond (-O-) in the carbon chain. Examples of the alkyl group having an ether bond in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl and methoxypropyl. In R ^c1 When it is an alkoxy group, it is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. Again, in R ^c1 When it is an alkoxy group, it may be straight chain or branched. As R ^c1 Specific examples in the case of an alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, second butoxy, and third Butoxy, n-pentyloxy, isopentyloxy, second pentyloxy, third pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, second octyloxy , Third octyloxy, n-nonyloxy, isononyloxy, n-decyloxy, isodecyloxy and the like. Again, in R ^c1 In the case of an alkoxy group, the alkoxy group may contain an ether bond (-O-) in the carbon chain. Examples of the alkoxy group having an ether bond in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, and ethoxyethoxyethoxy Groups, propoxyethoxyethoxy and methoxypropoxy. In R ^c1 When it is a cycloalkyl group or a cycloalkoxy group, 3 or more and 10 or less carbon atoms are preferable, and 3 or more and 6 or less carbon atoms are more preferable. As R ^c1 In the case of a cycloalkyl group, specific examples include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl. As R ^c1 Specific examples in the case of a cycloalkoxy group include cyclopropoxy, cyclobutoxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, and cyclooctyloxy. In R ^c1 In the case of a saturated aliphatic fluorenyl group or a saturated aliphatic fluorenyl group, the number of carbon atoms is preferably 2 or more and 20 or less, and more preferably the number of carbon atoms is 2 or more and 7 or less. As R ^c1 Specific examples in the case of a saturated aliphatic fluorenyl group include ethyl fluorenyl, propyl fluorenyl, n-butyl fluorenyl, 2-methylpropyl fluorenyl, n-pentyl fluorenyl, and 2,2-dimethylpropanyl , N-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-dodecyl, n-tetradecyl N-pentadecafluorenyl and n-hexadecylfluorenyl. As R ^c1 Specific examples in the case of saturated aliphatic fluorenyloxy include ethoxyl, propylfluorenyl, n-butylfluorenyloxy, 2-methylpropylfluorenyloxy, n-pentylfluorenyloxy, 2, 2-dimethylpropoxyl, n-hexylfluorenyloxy, n-heptylfluorenyloxy, n-octylfluorenyloxy, n-nonylfluorenyloxy, n-decylfluorenyloxy, n-undecylfluorenyloxy, n-dodecyloxy Carbofluorenyloxy, n-tridecylfluorenyloxy, n-tetradecylfluorenyloxy, n-pentadecafluorenyloxy, n-hexadecylfluorenyloxy, etc. In R ^c1 When it is an alkoxycarbonyl group, it is preferably 2 or more and 20 or less, and more preferably 2 or more and 7 or less. As R ^c1 Specific examples in the case of an alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, isobutoxycarbonyl, and Dibutoxycarbonyl, third butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, second pentoxycarbonyl, third pentoxycarbonyl, n-hexyloxycarbonyl, n-heptyloxycarbonyl, N-octyloxycarbonyl, isooctyloxycarbonyl, second octyloxycarbonyl, third octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, isodenoxycarbonyl, etc. . In R ^c1 When it is a phenylalkyl group, 7 or more and 20 or less carbon atoms are preferable, and 7 or more and 10 or less carbon atoms are more preferable. Again, in R ^c1 When it is a naphthylalkyl group, it is preferably 11 or more and 20 or less, and more preferably 11 or more and 14 or less. As R ^c1 Specific examples in the case of phenylalkyl include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. As R ^c1 Specific examples in the case of a naphthylalkyl group include α-naphthylmethyl, β-naphthylmethyl, 2- (α-naphthyl) ethyl, and 2- (β-naphthyl) ethyl . In R ^c1 In the case of phenylalkyl or naphthylalkyl, R ^c1 It may further have a substituent on phenyl or naphthyl. In R ^c1 In the case of a heterocyclic group, the heterocyclic group is a monocyclic ring containing 5 or 6 members of one or more N, S, and O, or a heterocyclic ring formed by condensing the monocyclic rings with each other or the monocyclic ring with a benzene ring. base. In the case where the heterocyclic group is a condensed ring, the number of rings is at most three. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, and pyridine. , Pyrimidine, da &#134116;, benzofuran, benzothiophene, indole, isoindole, indole , Benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoquinoline, quinazoline, pyrene &#134116; In R ^c1 In the case of a heterocyclic group, the heterocyclic group may further have a substituent. In R ^c1 In the case of an amine group substituted with one or two organic groups, preferable examples of the organic group include an alkyl group having 1 to 20 carbon atoms, and a cycloalkyl group having 3 to 10 carbon atoms. Saturated aliphatic fluorenyl group having 2 or more and 20 carbon atoms, phenyl group which may have a substituent, benzamidine group which may have a substituent, phenyl group which may have a carbon number of 7 or more and 20 or less An alkyl group, a naphthyl group which may have a substituent, a naphthylmethyl group which may have a substituent, a naphthylalkyl group and a heterocyclic group which may have a carbon number of 11 or more and 20 or less, and the like. Specific examples of these preferred organic groups and R ^c1 the same. Specific examples of the amine group substituted with one or two organic groups include methylamine, ethylamine, diethylamine, n-propylamine, di-n-propylamine, isopropylamine, and n-butylamino groups. , Di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamino, aniline, naphthylamine, acetamidoamine, propylamidine Amine, n-Butylamino, n-pentamidine, n-hexamidine, n-heptazone, n-octylamine, n-decylamidine, benzamidine, α-naphthylamidine And β-naphthylamino group. As R ^c1 Examples of the substituent in the case where the phenyl, naphthyl and heterocyclic group contained in the substituent further have a substituent include an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. Group, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, alkoxycarbonyl group having 2 or more and 7 carbon atoms, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, having a carbon atom A monoalkylamino group having an alkyl group having 1 or more and 6 or less, a dialkylamino group having an alkyl group having 1 or more and 6 or less carbon atoms, &#134156; olin-1-yl, piper &#134116; -1-yl, halogen, nitro and cyano. In R ^c1 When the phenyl, naphthyl, and heterocyclic group contained in the compound further has a substituent, the number of the substituent is not limited as long as it does not hinder the object of the present invention, and is preferably 1 or more and 4 or less. In R ^c1 When a phenyl group, a naphthyl group and a heterocyclic group contained in the formula have a plurality of substituents, the plurality of substituents may be the same or different. R ^c1 Among them, in terms of chemical stability, less steric hindrance, and easy synthesis of oxime ester compounds, it is preferably selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, and an alkyl group having 1 to 6 carbon atoms. The group in the group consisting of an alkoxy group and a saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms is more preferably an alkyl group having 1 or more and 6 carbon atoms, and particularly preferably a methyl group. As R ^c1 The position of bonding with phenyl ^c1 When the phenyl group is bonded, the position of the bonding bond between the phenyl group and the main skeleton of the oxime ester compound is set to the 1 position, and the position of the methyl group is set to the 2 position, preferably the 4 or 5 position. It is more preferably 5 places. In addition, n1 is preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and even more preferably 0 or 1. R ^c2 A phenyl group which may have a substituent or a carbazolyl group which may have a substituent. Again, in R ^c2 In the case of a carbazolyl group which may have a substituent, the nitrogen atom on the carbazolyl group may be substituted with an alkyl group having 1 to 6 carbon atoms. In R ^c2 The substitution of the phenyl or carbazolyl group is not particularly limited as long as it does not hinder the object of the present invention. Examples of preferable substituents which the phenyl or carbazolyl group may have on a carbon atom include an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, and carbon. Cycloalkyl having 3 or more and 10 or less, cycloalkoxy having 3 or more and 10 or less carbon, saturated aliphatic fluorenyl group having 2 or more and 20 or less carbon, 2 or more and 20 or less as carbon Alkoxycarbonyl group, saturated aliphatic fluorenyl group having 2 or more and 20 carbon atoms, phenyl group which may have a substituent, phenoxy group which may have a substituent, phenylthio group which may have a substituent, may have a substituent A benzamidine group, a phenoxycarbonyl group which may have a substituent, a benzamyloxy group which may have a substituent, a phenylalkyl group having 7 or more and 20 or less carbon atoms, which may have a substituent Naphthyl group, naphthyloxy group which may have a substituent, naphthylmethyl group which may have a substituent, naphthyloxycarbonyl group which may have a substituent, naphthylmethyloxy group which may have a substituent, A naphthylalkyl group having 11 to 20 carbon atoms, a heterocyclic group which may have a substituent, and Substituted heterocyclic carbonyl, amine, amine substituted with 1 or 2 organic groups, &#134156; olin-1-yl and pipe &#134116; -1-yl, halogen, nitro and Cyano, etc. In R ^c2 In the case of a carbazolyl group, examples of a preferable substituent which the carbazolyl group may have on a nitrogen atom include an alkyl group having 1 to 20 carbon atoms, and an alkyl group having 3 to 10 carbon atoms. A cycloalkyl group, a saturated aliphatic fluorenyl group having 2 or more and 20 carbon atoms, an alkoxycarbonyl group having 2 or more and 20 carbon atoms, a phenyl group which may have a substituent, and a benzamidine group which may have a substituent , A phenoxycarbonyl group which may have a substituent, a phenylalkyl group having 7 to 20 carbon atoms which may have a substituent, a naphthyl group which may have a substituent, a naphthylmethyl group which may have a substituent, may have A naphthyloxycarbonyl group having a substituent, a naphthylalkyl group having 11 to 20 carbon atoms which may have a substituent, a heterocyclic group which may have a substituent, a heterocyclic carbonyl group which may have a substituent, and the like. Among these substituents, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 6 carbon atoms is more preferred, and an ethyl group is particularly preferred. Specific examples of the substituent which the phenyl or carbazolyl group may have include alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic fluorenyl, alkoxycarbonyl, and saturated aliphatic fluorenyl , A phenylalkyl group which may have a substituent, a naphthylalkyl group which may have a substituent, a heterocyclic group which may have a substituent, and an amine group substituted with one or two organic groups, and R ^c1 the same. In R ^c2 Examples of the substituent in the case where a phenyl group, a naphthyl group, and a heterocyclic group contained in a substituent group included in a phenyl group or a carbazolyl group have a substituent group include carbon atoms of 1 or more and 6 The following alkyl groups; alkoxy groups having 1 or more and 6 carbon atoms; saturated aliphatic fluorenyl groups having 2 or more and 7 carbon atoms; alkoxycarbonyl groups having 2 or more and 7 carbon atoms; carbon number Saturated aliphatic fluorenyloxy groups of 2 to 7; phenyl; naphthyl; benzamidine; naphthylmethyl; selected from alkyl groups having 1 to 6 carbon atoms, &#134156; A benzamidine group substituted with a group in a group consisting of 1-yl, piperidin-1-yl and phenyl groups; a monoalkylamino group having an alkyl group having 1 to 6 carbon atoms; having A dialkylamino group of an alkyl group having 1 to 6 carbon atoms; &#134156;line-1-yl; piper &#134116;-1-yl;halogen;nitro; cyano. When a phenyl group, a naphthyl group, and a heterocyclic group contained in a substituent group included in a phenyl group or a carbazolyl group further have a substituent group, the number of the substituent groups is within a range that does not hinder the object of the present invention and Although it is not limited, it is preferably 1 or more and 4 or less. When a phenyl group, a naphthyl group and a heterocyclic group have a plurality of substituents, the plurality of substituents may be the same or different. R ^c2 Among them, from the viewpoint of easily obtaining a photopolymerization initiator having excellent sensitivity, the base represented by the following formula (c2) or (c3) is preferred, and the base represented by the following formula (c2) is more preferred Is particularly preferably a base represented by the following formula (c2) and A is S. [Chemical 41] (R ^c4 Is a group selected from the group consisting of a monovalent organic group, an amine group, a halogen, a nitro group, and a cyano group, A is S or O, and n3 is an integer of 0 to 4) [Chem. 42] (R ^c5 And R ^c6 (A monovalent organic group respectively) R in the formula (c2) ^c4 When it is an organic group, it can select from various organic groups within the range which does not prevent the objective of this invention. As R in formula (c2) ^c4 In the case of an organic group, preferable examples include an alkyl group having 1 to 6 carbon atoms; an alkoxy group having 1 to 6 carbon atoms; and a saturated fat having 2 to 7 carbon atoms. Group fluorenyl groups; alkoxycarbonyl groups having 2 or more and 7 carbon atoms; saturated aliphatic fluorenyl groups having 2 or more and 7 carbon atoms; phenyl; naphthyl; benzamyl; naphthylmethyl; A benzamidine group substituted by a group selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, &#134156; olin-1-yl, piper &#134116; -1-yl, and phenyl ; A monoalkylamino group having an alkyl group having 1 to 6 carbon atoms; a dialkylamino group having an alkyl group to 1 to 6 carbon atoms; &#134156;&#134116;-1-yl;halogen;nitro; cyano. R ^c4 Among them, a benzamidine group is preferred; a naphthylmethyl group is selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, &#134156; line-1-yl group, and pipe &#134116; -1-yl group And a phenyl group-substituted benzamidine group; a nitro group, more preferably a benzamidine group; a naphthylmethyl group; a 2-methylphenylcarbonyl group; 4- (pipe &#134116;- 1-yl) phenylcarbonyl; 4- (phenyl) phenylcarbonyl. In formula (c2), n3 is preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and even more preferably 0 or 1. When n3 is 1, R ^c4 The bond position is preferably relative to R ^c4 The bond between the bonded phenyl and the oxygen or sulfur atom is para. R in formula (c3) ^c5 It can be selected from various organic groups within a range that does not hinder the object of the present invention. As R ^c5 Preferable examples include an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a saturated aliphatic fluorenyl group having 2 to 20 carbon atoms, and a carbon atom. Alkoxycarbonyl group of 2 or more and 20 or less, phenyl group which may have a substituent, benzamidine group which may have a substituent, phenoxycarbonyl group which may have a substituent, carbon number 7 which may have a substituent And a phenylalkyl group of 20 or less, a naphthyl group which may have a substituent, a naphthylmethyl group which may have a substituent, a naphthyloxycarbonyl group which may have a substituent, 11 or more and 20 or less carbon atoms which may have a substituent A naphthylalkyl group, a heterocyclic group which may have a substituent, a heterocyclic carbonyl group which may have a substituent, and the like. R ^c5 Among these, an alkyl group having 1 to 20 carbon atoms is preferred, an alkyl group having 1 to 6 carbon atoms is more preferred, and an ethyl group is particularly preferred. R in formula (c3) ^c6 It does not specifically limit as long as it does not inhibit the objective of this invention, It can select from various organic groups. As for R ^c6 Specific examples of the preferable group include an alkyl group having 1 to 20 carbon atoms, a phenyl group which may have a substituent, a naphthyl group which may have a substituent, and a heterocyclic group which may have a substituent. As R ^c6 Among these groups, a phenyl group which may have a substituent is more preferable, and a 2-methylphenyl group is particularly preferable. As R ^c4 , R ^c5 Or R ^c6 Examples of the substituent in the case where the phenyl, naphthyl and heterocyclic group contained in the substituent further have a substituent include an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. Group, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, alkoxycarbonyl group having 2 or more and 7 carbon atoms, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, having a carbon atom A monoalkylamino group having an alkyl group having 1 or more and 6 or less, a dialkylamino group having an alkyl group having 1 or more and 6 or less carbon atoms, &#134156; olin-1-yl, piper &#134116; -1-yl, halogen, nitro and cyano. In R ^c4 , R ^c5 Or R ^c6 When a phenyl group, a naphthyl group and a heterocyclic group contained in it further have a substituent, the number of the substituent is not limited as long as it does not hinder the object of the present invention, and is preferably 1 or more and 4 or less. In R ^c4 , R ^c5 Or R ^c6 When a phenyl group, a naphthyl group and a heterocyclic group contained in the formula have a plurality of substituents, the plurality of substituents may be the same or different. R in formula (c1) ^c3 It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. As R ^c3 Is preferably methyl or ethyl, and more preferably methyl. As the oxime ester compound represented by formula (c1), when p is 0, it can be synthesized, for example, according to the following scheme 1. Specifically, an aromatic compound represented by the following formula (c1-1) is reacted by a Friedel-Crafts reaction using a halocarbonyl compound represented by the following formula (c1-2). The ketone compound represented by the following formula (c1-3) is obtained by tritiation, and the obtained ketone compound (c1-3) is oxidized with hydroxylamine to obtain the oxime compound represented by the following formula (c1-4). An oxime ester compound represented by the following formula (c1-7) can be obtained by hydroxylating a hydroxyl group in an oxime compound of the formula (c1-4). As the halogenating agent, an acid anhydride ((R) represented by the following formula (c1-5) is preferably used ^c3 CO) ₂ O) or a halogen (R) represented by the following formula (c1-6) ^c3 COHal, Hal is halogen). In the following formula (c1-2), Hal is halogen, and the following formulae (c1-1), (c1-2), (c1-3), (c1-4), and (c1-7) Medium, R ^c1 , R ^c2 , R ^c3 And n1 are the same as in formula (c1). <Process 1> [Chemical 43] As the oxime ester compound represented by formula (c1), when n2 is 1, for example, it can be synthesized according to the following scheme 2. Specifically, the ketone compound represented by the following formula (c2-1) is reacted with a nitrite ester (RONO, R is represented by the following formula (c2-2) in the presence of hydrochloric acid, R is 1 or more and 6 carbon atoms) The following alkyl group) is reacted to obtain a ketoxime compound represented by the following formula (c2-3), and then the hydroxyl group in the ketoxime compound represented by the following formula (c2-3) is halogenated to obtain the following formula The oxime ester compound represented by (c2-6). As the halogenating agent, an acid anhydride ((R) represented by the following formula (c2-4) is preferably used ^c3 CO) ₂ O) or a halogen (R) represented by the following formula (c2-5) ^c3 COHal, Hal is halogen). In the following formulae (c2-1), (c2-3), (c2-4), (c2-5), and (c2-6), R ^c1 , R ^c2 , R ^c3 And n1 are the same as in formula (c1). ＜ Process 2 ＞ [Chem. 44] In addition, as the oxime ester compound represented by formula (c1), n2 is 1, and R is ^c1 Is methyl and relative to R ^c1 Methyl group bonded to the benzene ring to be bonded, R ^c1 In the case of para-bonding, for example, the same method as in Scheme 1 can be used to synthesize the compound represented by the following formula (c2-7) by oximation and tritiation. In the following formula (c2-7), R ^c2 This is the same as the formula (c1). [Chemical 45] Examples of particularly preferred compounds among the oxime ester compounds represented by formula (c1) include the following PI-1 to PI-42. [Chemical 46] [Chemical 47] [Chemical 48] [Chemical 49] [Chemical 50] [Chemical 51] The oxime ester compound represented by the following formula (c4) is also preferred as a photopolymerization initiator. [Chemical 52] (R ^c7 A hydrogen atom, a nitro group or a monovalent organic group, R ^c8 And R ^c9 Are a linear alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom, R ^c8 With R ^c9 Can be bonded to each other to form a ring, R ^c10 Is a monovalent organic group, R ^c11 Is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms that may have a substituent, or an aryl group that may have substituents, n4 is an integer of 0 to 4 and n5 is 0 or 1) Here, it is used as The oxime compound for producing an oxime ester compound of the formula (c4) is preferably a compound represented by the following formula (c5). [Chem 53] (R ^c7 , R ^c8 , R ^c9 , R ^c10 , N4 and n5 are the same as in formula (c4)) In formulas (c4) and (c5), R ^c7 It is a hydrogen atom, a nitro group, or a monovalent organic group. R ^c7 On the 茀 ring in formula (c4), bonded to-(CO) _n5 -The 6-membered aromatic ring to which the indicated base is bonded is different from the 6-membered aromatic ring. In formula (c4), R ^c7 There is no particular limitation on the bonding position of the ring. The compound represented by formula (c4) has one or more R ^c7 In this case, in terms of easy synthesis of the compound represented by formula (c4), one or more R's are preferred. ^c7 One of them is bonded to two of the rings. In R ^c7 In case of plural, plural R ^c7 It can be the same or different. In R ^c7 In the case of an organic group, R ^c7 It does not specifically limit as long as it does not inhibit the objective of this invention, It can select suitably from various organic groups. As R ^c7 In the case of an organic group, examples include alkyl, alkoxy, cycloalkyl, cycloalkoxy, saturated aliphatic fluorenyl, saturated aliphatic fluorenyl, alkoxycarbonyl, and Substituent phenyl, phenoxy which may have a substituent, benzamidine which may have a substituent, phenoxycarbonyl which may have a substituent, benzamyloxy which may have a substituent, may have a substituent Phenylalkyl, naphthyl which may have a substituent, naphthyloxy which may have a substituent, naphthylmethyl which may have a substituent, naphthyloxycarbonyl which may have a substituent, naphthyl which may have a substituent Fluorenyloxy, naphthylalkyl which may have a substituent, heterocyclyl which may have a substituent, heterocyclylcarbonyl which may have a substituent, amine substituted with one or two organic groups, &#134156; Phenyl-1-yl and piperidin-1-yl etc. In R ^c7 In the case of an alkyl group, the number of carbon atoms in the alkyl group is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. Again, in R ^c7 In the case of an alkyl group, it may be a straight chain or a branched chain. As R ^c7 Specific examples in the case of an alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, n-pentyl, iso Pentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl and Isodecyl and so on. Again, in R ^c7 In the case of an alkyl group, the alkyl group may contain an ether bond (-O-) in the carbon chain. Examples of the alkyl group having an ether bond in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl and methoxypropyl. In R ^c7 In the case of an alkoxy group, the number of carbon atoms in the alkoxy group is preferably 1 or more and 20 or less, and more preferably 1 or more and 6 or less. Again, in R ^c7 When it is an alkoxy group, it may be straight chain or branched. As R ^c7 Specific examples in the case of an alkoxy group include methoxy, ethoxy, n-propoxy, isopropoxy, n-butoxy, isobutoxy, second butoxy, and third Butoxy, n-pentyloxy, isopentyloxy, second pentyloxy, third pentyloxy, n-hexyloxy, n-heptyloxy, n-octyloxy, isooctyloxy, second octyloxy , Third octyloxy, n-nonyloxy, isononyloxy, n-decyloxy, isodecyloxy and the like. Again, in R ^c7 In the case of an alkoxy group, the alkoxy group may contain an ether bond (-O-) in the carbon chain. Examples of the alkoxy group having an ether bond in the carbon chain include methoxyethoxy, ethoxyethoxy, methoxyethoxyethoxy, and ethoxyethoxyethoxy Groups, propoxyethoxyethoxy and methoxypropoxy. In R ^c7 In the case of a cycloalkyl group or a cycloalkoxy group, the number of carbon atoms of the cycloalkyl group or the cycloalkoxy group is preferably 3 or more and 10 or less, and more preferably 3 or more and 6 or less. As R ^c7 In the case of a cycloalkyl group, specific examples include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl. As R ^c7 Specific examples in the case of a cycloalkoxy group include cyclopropoxy, cyclobutoxy, cyclopentyloxy, cyclohexyloxy, cycloheptyloxy, and cyclooctyloxy. In R ^c7 In the case of a saturated aliphatic fluorenyl group or a saturated aliphatic fluorenyl group, the number of carbon atoms of the saturated aliphatic fluorenyl group or the saturated aliphatic fluorenyl group is preferably 2 or more and 21 or less, and more preferably 2 or more and 7 or less. . As R ^c7 Specific examples in the case of a saturated aliphatic fluorenyl group include ethyl fluorenyl, propyl fluorenyl, n-butyl fluorenyl, 2-methylpropyl fluorenyl, n-pentyl fluorenyl, and 2,2-dimethylpropanyl , N-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-dodecyl, n-tetradecyl , N-fifteen carbon fluorenyl, n-hexadecyl fluorenyl and the like. As R ^c7 Specific examples in the case of saturated aliphatic fluorenyloxy include ethoxyl, propylfluorenyl, n-butylfluorenyloxy, 2-methylpropylfluorenyloxy, n-pentylfluorenyloxy, 2, 2-dimethylpropoxyl, n-hexylfluorenyloxy, n-heptylfluorenyloxy, n-octylfluorenyloxy, n-nonylfluorenyloxy, n-decylfluorenyloxy, n-undecylfluorenyloxy, n-dodecyloxy Carbofluorenyloxy, n-tridecylfluorenyloxy, n-tetradecylfluorenyloxy, n-pentadecafluorenyloxy, n-hexadecylfluorenyloxy, etc. In R ^c7 When it is an alkoxycarbonyl group, the carbon number of the alkoxycarbonyl group is preferably 2 or more and 20 or less, and more preferably 2 or more and 7 or less. As R ^c7 Specific examples in the case of an alkoxycarbonyl group include methoxycarbonyl, ethoxycarbonyl, n-propoxycarbonyl, isopropoxycarbonyl, n-butoxycarbonyl, isobutoxycarbonyl, and Dibutoxycarbonyl, third butoxycarbonyl, n-pentoxycarbonyl, isopentoxycarbonyl, second pentoxycarbonyl, third pentoxycarbonyl, n-hexyloxycarbonyl, n-heptyloxycarbonyl, N-octyloxycarbonyl, isooctyloxycarbonyl, second octyloxycarbonyl, third octyloxycarbonyl, n-nonyloxycarbonyl, isononyloxycarbonyl, n-decyloxycarbonyl, isodenoxycarbonyl, etc. . In R ^c7 In the case of a phenylalkyl group, the number of carbon atoms of the phenylalkyl group is preferably 7 or more and 20 or less, and more preferably 7 or more and 10 or less. Again, in R ^c7 In the case of a naphthylalkyl group, the number of carbon atoms of the naphthylalkyl group is preferably 11 or more and 20 or less, and more preferably 11 or more and 14 or less. As R ^c7 Specific examples in the case of phenylalkyl include benzyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl. As R ^c7 Specific examples in the case of a naphthylalkyl group include α-naphthylmethyl, β-naphthylmethyl, 2- (α-naphthyl) ethyl, and 2- (β-naphthyl) ethyl . In R ^c7 In the case of phenylalkyl or naphthylalkyl, R ^c7 It may further have a substituent on phenyl or naphthyl. In R ^c7 In the case of a heterocyclic group, the heterocyclic group is a monocyclic ring containing 5 or 6 members of one or more N, S, and O, or a heterocyclic ring formed by condensing the monocyclic rings with each other or the monocyclic ring with a benzene ring. base. In the case where the heterocyclic group is a condensed ring, the number of rings is at most three. The heterocyclic group may be an aromatic group (heteroaryl group) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, and pyridine. , Pyrimidine, da &#134116;, benzofuran, benzothiophene, indole, isoindole, indole , Benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoquinoline, quinazoline, pyrene &#134116;, oxoline, quinoline, piperidine , Piper &#134116;,&#134156; Porphyrin, piperidine, tetrahydropyran and tetrahydrofuran. In R ^c7 In the case of a heterocyclic group, the heterocyclic group may further have a substituent. In R ^c7 In the case of a heterocyclylcarbonyl group, the heterocyclic group contained in the heterocyclylcarbonyl group and R ^c7 The same applies to the case of a heterocyclic group. In R ^c7 In the case of an amine group substituted with one or two organic groups, preferable examples of the organic group include an alkyl group having 1 to 20 carbon atoms, and a cycloalkyl group having 3 to 10 carbon atoms. Saturated aliphatic fluorenyl group having 2 or more and 21 carbon atoms, phenyl group which may have a substituent, benzamidine group which may have a substituent, phenyl group which may have a carbon number of 7 or more and 20 or less An alkyl group, a naphthyl group which may have a substituent, a naphthylmethyl group which may have a substituent, a naphthylalkyl group and a heterocyclic group which may have a carbon number of 11 or more and 20 or less, and the like. Specific examples of these preferred organic groups and R ^c7 the same. Specific examples of the amine group substituted with one or two organic groups include methylamine, ethylamine, diethylamine, n-propylamine, di-n-propylamine, isopropylamine, and n-butylamino groups. , Di-n-butylamino, n-pentylamino, n-hexylamino, n-heptylamino, n-octylamino, n-nonylamino, n-decylamino, aniline, naphthylamine, acetamidoamine, propylamidine Amine, n-Butylamino, n-pentamidine, n-hexamidine, n-heptazone, n-octylamine, n-decylamidine, benzamidine, α-naphthylamidine And β-naphthylamino group. As R ^c7 Examples of the substituent in the case where the phenyl, naphthyl and heterocyclic group contained in the substituent further have a substituent include an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms. Group, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, alkoxycarbonyl group having 2 or more and 7 carbon atoms, saturated aliphatic fluorenyl group having 2 or more and 7 carbon atoms, having a carbon atom A monoalkylamino group having an alkyl group having 1 or more and 6 or less, a dialkylamino group having an alkyl group having 1 or more and 6 or less carbon atoms, &#134156; olin-1-yl, piper &#134116; -1-yl, halogen, nitro and cyano. In R ^c7 When the phenyl, naphthyl, and heterocyclic group contained in the compound further has a substituent, the number of the substituent is not limited as long as it does not hinder the object of the present invention, and is preferably 1 or more and 4 or less. In R ^c7 When a phenyl group, a naphthyl group and a heterocyclic group contained in the formula have a plurality of substituents, the plurality of substituents may be the same or different. In the above description, if R is ^c7 , For nitro or R ^c12 The base represented by -CO- is preferred because it has a tendency to increase sensitivity. R ^c12 It does not specifically limit as long as it does not inhibit the objective of this invention, It can select from various organic groups. As for R ^c12 Examples of preferable groups include an alkyl group having 1 to 20 carbon atoms, a phenyl group which may have a substituent, a naphthyl group which may have a substituent, and a heterocyclic group which may have a substituent. As R ^c12 Among these groups, 2-methylphenyl, thien-2-yl, and α-naphthyl are particularly preferred. Also, if R ^c7 A hydrogen atom is preferred because it tends to have good transparency. Furthermore, if R ^c7 Is a hydrogen atom and R ^c10 It is a base represented by the following formula (c4a) or (c4b), and there exists a tendency for transparency to become better. In formula (c4), R ^c8 And R ^c9 They are a linear alkyl group which may have a substituent, a cyclic organic group which may have a substituent, or a hydrogen atom, respectively. R ^c8 With R ^c9 They can be bonded to each other to form a ring. Among these bases, as R ^c8 And R ^c9 Is preferably a linear alkyl group which may have a substituent. In R ^c8 And R ^c9 In the case of a linear alkyl group which may have a substituent, the linear alkyl group may be a linear alkyl group or a branched alkyl group. In R ^c8 And R ^c9 In the case of a linear alkyl group having no substituent, the number of carbon atoms of the linear alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and even more preferably 1 or more and 6 or less. As R ^c8 And R ^c9 Specific examples in the case of a linear alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, and n-pentyl , Isopentyl, second pentyl, third pentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, second octyl, third octyl, n-nonyl, isononyl, n-decyl And isodecyl. Again, in R ^c8 And R ^c9 In the case of an alkyl group, the alkyl group may contain an ether bond (-O-) in the carbon chain. Examples of the alkyl group having an ether bond in the carbon chain include methoxyethyl, ethoxyethyl, methoxyethoxyethyl, ethoxyethoxyethyl, and propoxy Ethoxyethyl and methoxypropyl. In R ^c8 And R ^c9 In the case of a linear alkyl group having a substituent, the number of carbon atoms of the linear alkyl group is preferably 1 or more and 20 or less, more preferably 1 or more and 10 or less, and even more preferably 1 or more and 6 or less. In this case, the number of carbon atoms of the substituent is not included in the number of carbon atoms of the chain alkyl group. The linear alkyl group having a substituent is preferably linear. The substitution which an alkyl group may have is not specifically limited in the range which does not prevent the objective of this invention. Preferred examples of the substituent include a cyano group, a halogen atom, a cyclic organic group, and an alkoxycarbonyl group. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, a fluorine atom, a chlorine atom, and a bromine atom are preferred. Examples of the cyclic organic group include a cycloalkyl group, an aromatic hydrocarbon group, and a heterocyclic group. As a specific example of a cycloalkyl group, R is ^c7 In the case of a cycloalkyl group, a preferable example is the same. Specific examples of the aromatic hydrocarbon group include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl. Specific examples of heterocyclic groups ^c7 In the case of a heterocyclic group, preferable examples are the same. In R ^c7 In the case of an alkoxycarbonyl group, the alkoxy group contained in the alkoxycarbonyl group may be linear or linear, and is preferably linear. The number of carbon atoms of the alkoxy group contained in the alkoxycarbonyl group is preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. When the linear alkyl group has a substituent, the number of the substituent is not particularly limited. The number of preferred substituents varies depending on the number of carbon atoms in the chain alkyl group. The number of substituents is typically 1 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. In R ^c8 And R ^c9 In the case of a cyclic organic group, the cyclic organic group may be an alicyclic group or an aromatic group. Examples of the cyclic organic group include an aliphatic cyclic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group. In R ^c8 And R ^c9 In the case of a cyclic organic group, the substituent which the cyclic organic group may have and R ^c8 And R ^c9 The same is true for a linear alkyl group. In R ^c8 And R ^c9 In the case of an aromatic hydrocarbon group, the aromatic hydrocarbon group is preferably a phenyl group, a group in which a plurality of benzene rings are bonded via a carbon-carbon bond, or a group in which a plurality of benzene rings are condensed. In the case where the aromatic hydrocarbon group is a phenyl group or a group formed by bonding or condensation of a plurality of benzene rings, the number of rings of the benzene ring contained in the aromatic hydrocarbon group is not particularly limited, but is preferably 3 or less, more preferably 2 or less, particularly preferably 1. Preferred specific examples of the aromatic hydrocarbon group include phenyl, naphthyl, biphenyl, anthracenyl, and phenanthryl. In R ^c8 And R ^c9 In the case of an aliphatic cyclic hydrocarbon group, the aliphatic cyclic hydrocarbon group may be monocyclic or polycyclic. The number of carbon atoms of the aliphatic cyclic hydrocarbon group is not particularly limited, but is preferably 3 or more and 20 or less, and more preferably 3 or more and 10 or less. Examples of the monocyclic cyclic hydrocarbon group include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, noble &#158665; , Tricyclononyl, tricyclodecyl, tetracyclododecyl and adamantyl. In R ^c8 And R ^c9 In the case of a heterocyclic group, the heterocyclic group is a monocyclic ring containing 5 or 6 members of one or more N, S, and O, or a heterocyclic ring formed by condensing the monocyclic rings with each other or the monocyclic ring with a benzene ring. base. In the case where the heterocyclic group is a condensed ring, the number of rings is at most three. The heterocyclic group may be an aromatic group (heteroaryl group) or a non-aromatic group. Examples of the heterocyclic ring constituting the heterocyclic group include furan, thiophene, pyrrole, oxazole, isoxazole, thiazole, thiadiazole, isothiazole, imidazole, pyrazole, triazole, pyridine, and pyridine. , Pyrimidine, da &#134116;, benzofuran, benzothiophene, indole, isoindole, indole , Benzimidazole, benzotriazole, benzoxazole, benzothiazole, carbazole, purine, quinoline, isoquinoline, quinazoline, pyrene &#134116;, oxoline, quinoline, piperidine , Piper &#134116;,&#134156; Porphyrin, piperidine, tetrahydropyran and tetrahydrofuran. R ^c8 With R ^c9 They can be bonded to each other to form a ring. Contains R ^c8 With R ^c9 The ring group to be formed is preferably a cycloalkylene group. In R ^c8 With R ^c9 In the case of bonding to form a cycloalkylene group, the ring constituting the cycloalkylene group is preferably a 5-membered ring to a 6-membered ring, and more preferably a 5-membered ring. In R ^c8 With R ^c9 When the bond-forming group is a cycloalkylene group, the cycloalkylene group may be condensed with one or more other rings. Examples of the ring condensable with a cycloalkylene group include a benzene ring, a naphthalene ring, a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a furan ring, Thiophene ring, pyrrole ring, pyridine ring, pyridine ring, pyrimidine ring and the like. As R described above ^c8 And R ^c9 Examples of preferred bases include Formula -A ¹ -A ² The indicated base. Where A ¹ For straight chain alkylene, A ² It is an alkoxy group, a cyano group, a halogen atom, a halogenated alkyl group, a cyclic organic group, or an alkoxycarbonyl group. A ¹ The number of carbon atoms of the straight chain alkylene group is preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. At A ² In the case of an alkoxy group, the alkoxy group may be linear or branched, and is preferably linear. The number of carbon atoms of the alkoxy group is preferably 1 or more and 10 or less, and more preferably 1 or more and 6 or less. At A ² When it is a halogen atom, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom are preferable, and a fluorine atom, a chlorine atom, and a bromine atom are more preferable. At A ² In the case of a halogenated alkyl group, the halogen atom contained in the halogenated alkyl group is preferably a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and more preferably a fluorine atom, a chlorine atom, or a bromine atom. The halogenated alkyl group may be linear or branched, and is preferably linear. At A ² In the case of a cyclic organic group, examples of cyclic organic groups and R ^c8 And R ^c9 The cyclic organic group possessed as a substituent is the same. At A ² In the case of an alkoxycarbonyl group, examples of the alkoxycarbonyl group and R ^c8 And R ^c9 The alkoxycarbonyl group having the same substituent is the same. As R ^c8 And R ^c9 Preferred specific examples include: alkyl groups such as ethyl, n-propyl, n-butyl, n-hexyl, n-heptyl, and n-octyl; 2-methoxyethyl, 3-methoxy-n-propyl , 4-methoxy-n-butyl, 5-methoxy-n-pentyl, 6-methoxy-n-hexyl, 7-methoxy-n-heptyl, 8-methoxy-n-octyl, 2-ethoxy Ethyl, 3-ethoxy-n-propyl, 4-ethoxy-n-butyl, 5-ethoxy-n-pentyl, 6-ethoxy-n-hexyl, 7-ethoxy-n-heptyl and 8-ethyl Alkoxyalkyl such as oxy-n-octyl; 2-cyanoethyl, 3-cyano-n-propyl, 4-cyano-n-butyl, 5-cyano-n-pentyl, 6-cyano-n-hexyl, 7-cyano-n-heptyl and 8-cyano-n-octyl, and other cyanoalkyl groups; 2-phenylethyl, 3-phenyl-n-propyl, 4-phenyl-n-butyl, 5-phenyl-n-pentyl Phenyl alkyls such as phenyl, 6-phenyl-n-hexyl, 7-phenyl-n-heptyl and 8-phenyl-n-octyl; 2-cyclohexylethyl, 3-cyclohexyl-n-propyl, 4-cyclohexyl-n Butyl, 5-cyclohexyl-n-pentyl, 6-cyclohexyl-n-hexyl, 7-cyclohexyl-n-heptyl, 8-cyclohexyl-n-octyl, 2-cyclopentylethyl, 3-cyclopentyl-n-propyl , 4-cyclopentyl-n-butyl, 5-cyclopentyl-n-pentyl, 6- Cycloalkylalkyl such as pentyl-n-hexyl, 7-cyclopentyl-n-heptyl and 8-cyclopentyl-n-octyl; 2-methoxycarbonylethyl, 3-methoxycarbonyl n-propyl, 4- Methoxycarbonyl n-butyl, 5-methoxycarbonyl n-pentyl, 6-methoxycarbonyl n-hexyl, 7-methoxycarbonyl n-heptyl, 8-methoxycarbonyl n-octyl, 2-ethyl Oxycarbonylethyl, 3-ethoxycarbonyl-n-propyl, 4-ethoxycarbonyl-n-butyl, 5-ethoxycarbonyl-n-pentyl, 6-ethoxycarbonyl-n-hexyl, 7-ethoxy Alkoxycarbonyl alkyl groups such as carbonyl n-heptyl and 8-ethoxycarbonyl n-octyl; 2-chloroethyl, 3-chloro-n-propyl, 4-chloro-n-butyl, 5-chloro-n-pentyl, 6 -Chloro-n-hexyl, 7-chloro-n-heptyl, 8-chloro-n-octyl, 2-bromoethyl, 3-bromo-n-propyl, 4-bromo-n-butyl, 5-bromo-n-pentyl, 6-bromo-n-hexyl Halogenated alkyl such as 7-bromo-n-heptyl, 8-bromo-n-octyl, 3,3,3-trifluoropropyl, and 3,3,4,4,5,5,5-heptafluoro-n-pentyl . As R ^c8 And R ^c9 In the above, the preferred groups are ethyl, n-propyl, n-butyl, n-pentyl, 2-methoxyethyl, 2-cyanoethyl, 2-phenylethyl, 2-cyclohexylethyl , 2-methoxycarbonylethyl, 2-chloroethyl, 2-bromoethyl, 3,3,3-trifluoropropyl and 3,3,4,4,5,5,5-heptafluoron Amyl. As R ^c10 Examples of preferred organic groups, with R ^c7 Similarly, an alkyl group, an alkoxy group, a cycloalkyl group, a cycloalkoxy group, a saturated aliphatic fluorenyl group, an alkoxycarbonyl group, a saturated aliphatic fluorenyl group, a phenyl group which may have a substituent, and a substituent which may have a substituent Phenoxy group, benzophenoxy group which may have substituent, phenoxycarbonyl group which may have substituent, benzophenoxy group which may have substituent, phenylalkyl group which may have substituent, may have substituent Naphthyl group, naphthyloxy group which may have a substituent, naphthylmethyl group which may have a substituent, naphthyloxycarbonyl group which may have a substituent, naphthylmethyloxy group which may have a substituent, Naphthylalkyl, heterocyclic group which may have a substituent, heterocyclic carbonyl group which may have a substituent, amine group substituted with one or two organic groups, &#134156; olin-1-yl and piper &#134116; -1-yl and the like. Specific examples of these bases and about R ^c7 The bases explained are the same. Again, as R ^c10 It is also preferably a cycloalkylalkyl group, a phenoxyalkyl group which may have a substituent on the aromatic ring, and a phenylthioalkyl group which may have a substituent on the aromatic ring. Substituents which phenoxyalkyl and phenylthioalkyl can have and R ^c7 The phenyl group contained therein may have the same substituent. Among organic groups, as R ^c10 Is preferably an alkyl group, a cycloalkyl group, a phenyl group or a cycloalkylalkyl group which may have a substituent, and a phenylthioalkyl group which may have a substituent on the aromatic ring. The alkyl group is preferably an alkyl group having 1 to 20 carbon atoms, more preferably an alkyl group having 1 to 8 carbon atoms, and particularly preferably an alkyl group having 1 to 4 carbon atoms. Preferred is methyl. Among the phenyl groups which may have a substituent, a methylphenyl group is preferable, and a 2-methylphenyl group is more preferable. The number of carbon atoms of the cycloalkyl group contained in the cycloalkylalkyl group is preferably 5 or more and 10 or less, more preferably 5 or more and 8 or less, and even more preferably 5 or 6. The number of carbon atoms of the alkylene group contained in the cycloalkylalkyl group is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and even more preferably 2. Among the cycloalkylalkyl groups, cyclopentylethyl is preferred. The number of carbon atoms of the alkylene group contained in the phenylthioalkyl group which may have a substituent on the aromatic ring is preferably 1 or more and 8 or less, more preferably 1 or more and 4 or less, and even more preferably 2. Among the phenylthioalkyl groups which may have a substituent on the aromatic ring, 2- (4-chlorophenylthio) ethyl is preferred. Again, as R ^c10 , -A ³ -CO-OA ⁴ The bases indicated are also better. A ³ It is a divalent organic group, preferably a divalent hydrocarbon group, and more preferably an alkylene group. A ⁴ It is a monovalent organic group, and a monovalent hydrocarbon group is preferable. At A ³ In the case of an alkylene group, the alkylene group may be linear or branched, and is preferably linear. At A ³ In the case of an alkylene group, the number of carbon atoms of the alkylene group is preferably 1 or more and 10 or less, more preferably 1 or more and 6 or less, and even more preferably 1 or more and 4 or less. As A ⁴ Preferable examples include an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 20 carbon atoms and an aromatic hydrocarbon group having 6 to 20 carbon atoms. As A ⁴ Preferred specific examples include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, second butyl, third butyl, n-pentyl, n-hexyl, phenyl , Naphthyl, benzyl, phenethyl, α-naphthylmethyl and β-naphthylmethyl. As-A ³ -CO-OA ⁴ Preferable specific examples of the represented group include 2-methoxycarbonylethyl, 2-ethoxycarbonylethyl, 2-n-propoxycarbonylethyl, 2-n-butoxycarbonylethyl , 2-n-pentyloxycarbonylethyl, 2-n-hexyloxycarbonylethyl, 2-benzyloxycarbonylethyl, 2-phenoxycarbonylethyl, 3-methoxycarbonyl n-propyl, 3- Ethoxycarbonyl n-propyl, 3-n-propoxycarbonyl-n-propyl, 3-n-butoxycarbonyl-n-propyl, 3-n-pentoxycarbonyl-n-propyl, 3-n-hexyloxycarbonyl-n-propyl , 3-benzyloxycarbonyl-n-propyl and 3-phenoxycarbonyl-n-propyl. Above, about R ^c10 Clarified as R ^c10 Is preferably a base represented by the following formula (c4a) or (c4b). [Chemical 54] (In formulae (c4a) and (c4b), R ^c13 And R ^c14 Are organic groups, n6 is an integer from 0 to 4 ^c13 And R ^c14 In the case of adjacent positions on the benzene ring, R ^c13 With R ^c14 Can be bonded to each other to form a ring, n7 is an integer of 1 or less and 8 or less, n8 is an integer of 1 or more and 5 or less, n9 is an integer of 0 or more and (n8 + 3) or less, R ^c15 Is an organic group) About R in formula (c4a) ^c13 And R ^c14 Examples of organic radicals, with R ^c7 the same. As R ^c13 Is preferably an alkyl group or a phenyl group. In R ^c13 In the case of an alkyl group, the number of carbon atoms is preferably 1 or less and 10 or more, more preferably 1 or more and 5 or less, even more preferably 1 or more and 3 or less, and most preferably 1. That is, R ^c13 Most preferred is methyl. In R ^c13 With R ^c14 In the case of bonding to form a ring, the ring may be an aromatic ring or an aliphatic ring. As represented by formula (c4a) and R ^c13 With R ^c14 Preferred examples of the ring-forming group include naphthalen-1-yl or 1,2,3,4-tetrahydronaphthalen-5-yl. In the formula (c4a), n6 is an integer of 0 or more and 4 or less, preferably 0 or 1, and more preferably 0. In the above formula (c4b), R ^c15 Is organic. Examples of the organic group include those related to R ^c7 The illustrated organic groups are the same. Among the organic groups, an alkyl group is preferred. The alkyl group may be linear or branched. The number of carbon atoms of the alkyl group is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and even more preferably 1 or more and 3 or less. As R ^c15 As methyl, ethyl, propyl, isopropyl, butyl and the like can be preferably exemplified, and among them, methyl is more preferable. In the formula (c4b), n8 is an integer of 1 or more and 5 or less, preferably an integer of 1 or more and 3 or less, and more preferably 1 or 2. In the formula (c4b), n9 is 0 or more and (n8 + 3) or less, preferably an integer of 0 or more and 3 or less, more preferably an integer of 0 or more and 2 or less, and even more preferably 0. In the formula (c4b), n7 is an integer of 1 or more and 8 or less, preferably an integer of 1 or more and 5 or less, more preferably an integer of 1 or more and 3 or less, and particularly preferably 1 or 2. In formula (c4), R ^c11 It is a hydrogen atom, an alkyl group having 1 to 11 carbon atoms which may have a substituent, or an aryl group which may have a substituent. As R ^c11 In the case of an alkyl group, a substituent which may be possessed, and a phenyl group, a naphthyl group and the like can be preferably exemplified. Again, as R ^c7 In the case of an aryl group, a substituent which may be possessed, and examples thereof include an alkyl group having 1 to 5 carbon atoms, an alkoxy group, and a halogen atom. In formula (c4), as R ^c11 A hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a phenyl group, a benzyl group, a methylphenyl group, a naphthyl group, etc. can be preferably exemplified. Or phenyl. The compound represented by the formula (c4) is obtained by converting the oxime group (> C = N-OH) contained in the compound represented by the above formula (c5) into> C = NO-COR. ^c11 It is produced by the method shown for the oxime ester group. R ^c11 And R in formula (c4) ^c11 the same. Oxime group (＞ C = N-OH) to ＞ C = NO-COR ^c11 The conversion of the indicated oxime ester group is performed by reacting the compound represented by the above formula (c5) with a halogenating agent. Available as -COR ^c11 Examples of the sulfonating agents represented by fluorenyl groups include: (R ^c11 CO) ₂ Anhydride represented by O or R ^c11 Halogen represented by COHal (Hal is a halogen atom). When n5 is 0 as a compound represented by general formula (c4), it can synthesize according to the following scheme 3, for example. In Scheme 3, a fluorene derivative represented by the following formula (c3-1) is used as a raw material. In R ^c7 When it is a nitro group or a monovalent organic group, the fluorene derivative represented by the formula (c3-1) can be converted to R by a well-known method. ^c8 And R ^c9 Substitute R into the fluorene derivative at position 9 ^c7 And get. Taking R ^c8 And R ^c9 Derivatives of fluorene substituted at position 9 such as R ^c8 And R ^c9 When it is an alkyl group, it can be obtained as described in Japanese Patent Laid-Open No. 06-234668 by the following method: in the presence of an alkali metal hydroxide, in a non-protonic polar organic solvent, fluorene and an alkyl group化 剂 反应。 Chemical agent reaction. In addition, it can be carried out by adding an alkylating agent such as a halogenated alkyl group, an aqueous solution of an alkali metal hydroxide, and an interphase transfer catalyst such as tetrabutylammonium iodide or potassium third butoxide to an organic solvent solution of rhenium. Alkylation reaction to obtain 9,9-alkyl substituted fluorene. By the Friedel-Craft reaction, a -CO-R is introduced into the europium derivative represented by formula (c3-1) ^c10 The fluorenyl group represented is obtained as a fluorene derivative represented by formula (c3-3). Used to import -CO-R ^c10 The halogenating agent may be a halocarbonyl compound or an acid anhydride. The halogenating agent is preferably a halocarbonyl compound represented by the formula (c3-2). In formula (c3-2), Hal is a halogen atom. The position of introducing the base on the ring can be selected by appropriately changing the conditions of the Frederick-Crafts reaction or by protecting and deprotecting the other positions of the base. Next, -CO-R in the obtained fluorene derivative represented by the formula (c3-3) ^c10 The indicated group is converted to -C (= N-OH) -R ^c10 The represented group is an oxime compound represented by formula (c3-4). Will-CO-R ^c10 The indicated group is converted to -C (= N-OH) -R ^c10 The method of the indicated base is not particularly limited, but is preferably oxidized by hydroxylamine. The oxime compound of formula (c3-4) and the acid anhydride ((R ^c11 CO) ₂ O) or a halogen (R) represented by the following formula (c3-6) ^c11 COHal, Hal is a halogen atom), and a compound represented by the following formula (c3-7) can be obtained. Furthermore, in the formulae (c3-1), (c3-2), (c3-3), (c3-4), (c3-5), (c3-6), and (c3-7), R ^c7 , R ^c8 , R ^c9 , R ^c10 And R ^c11 This is the same as the formula (c4). In Scheme 3, R contained in Formula (c3-2), Formula (c3-3), and Formula (c3-4) respectively ^c10 It can be the same or different. That is, R in formula (c3-2), formula (c3-3), and formula (c3-4) ^c10 During the synthesis shown in Scheme 3, chemical modification is acceptable. Examples of the chemical modification include esterification, etherification, halogenation, halogenation, halogenation, substitution of a hydrogen atom in an amine group with an organic group, and the like. R ^c10 Acceptable chemical modifications are not limited to these. ＜ Process 3 ＞ [Chem 55] As a compound represented by formula (c4), when n5 is 1, it can be synthesized according to the following scheme 4, for example. In Scheme 4, a fluorene derivative represented by the following formula (c4-1) is used as a raw material. The europium derivative represented by formula (c4-1) is introduced into -CO-CH by a Friedel-Crafts reaction to the compound represented by formula (c3-1) by the same method as in Scheme 3. ₂ -R ^c10 Obtained by the indicated base. As the halogenating agent, the formula (c3-8): Hal-CO-CH is preferred ₂ -R ^c10 The carboxyphosphonium halide represented. Next, R in the compound represented by formula (c4-1) ^c10 The methylene oxime existing between the carbonyl group and the carbonyl group yields a ketoxime compound represented by the following formula (c4-3). The method for oximizing the methylene group is not particularly limited, and it is preferable to make a nitrite ester (RONO, R represented by the following general formula (c4-2) in the presence of hydrochloric acid, R is 1 or more and 6 or less carbon atoms) Alkyl) reaction method. Next, the ketoxime compound represented by the following formula (c4-3) and the acid anhydride (R) represented by the following formula (c4-4) ^c11 CO) ₂ O) or a halogen (R) represented by the following formula (c4-5) ^c11 COHal, Hal is a halogen atom), and a compound represented by the following formula (c4-6) can be obtained. In the following formulae (c4-1), (c4-3), (c4-4), (c4-5), and (c4-6), R ^c7 , R ^c8 , R ^c9 , R ^c10 And R ^c11 This is the same as the formula (c4). When n5 is 1, there is a tendency that the generation of foreign matter in a pattern formed by using a photosensitive composition containing a compound represented by formula (c4) can be further reduced. In Scheme 4, R contained in Formula (c3-8), Formula (c4-1), and Formula (c4-3) respectively ^c10 It can be the same or different. That is, R in formula (c3-8), formula (c4-1), and formula (c4-3) ^c10 Chemical modification is possible during the synthesis shown in Scheme 4. Examples of the chemical modification include esterification, etherification, halogenation, halogenation, halogenation, substitution of a hydrogen atom in an amine group with an organic group, and the like. R ^c10 Acceptable chemical modifications are not limited to these. ＜ Process 4 ＞ [Chem. 56] Preferred specific examples of the compound represented by formula (c4) include PI-43 to PI-83 below. [Chemical 57] [Chem 58] The content of the photopolymerization initiator is preferably 0.5 parts by mass or more and 20 parts by mass or less based on 100 parts by mass of the solid content of the photosensitive composition in the first aspect. By setting it as the said range, sufficient heat resistance and chemical resistance can be obtained, and coating-film formation ability can be improved and a hardening defect can be suppressed. The photosensitive composition of the first aspect contains the hydrogen barrier agent (B) as described above. When the compound is contained in the photosensitive composition, a pattern having hydrogen barrier properties can be formed. The content of the hydrogen barrier agent (B) is preferably 0.5 parts by mass or more and 95 parts by mass or less, more preferably 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the photopolymerization initiator. By setting it as the said range, the hydrogen barrier film which is excellent in hydrogen barrier property can be formed, and favorable micro-patterning characteristics can be obtained, while obtaining favorable developability. The photosensitive composition of the first aspect may further contain a colorant. By containing a colorant, it can be preferably used as a color filter forming application of an image display device such as a liquid crystal display or an organic EL display. The photosensitive composition of the first aspect contains a light-shielding agent as a coloring agent, and is preferably used as a black matrix forming application in a color filter, for example. The colorant is not particularly limited. For example, it is preferable to use a compound classified as a pigment in the color index (issued by The Society of Dyers and Colourists). Specifically, the color index (CI) number is as follows. Of pigment. CI Pigment Yellow 1 (hereinafter also referred to as "CI Pigment Yellow", only numbers are described), 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185; CI Pigment Orange 1 (Hereinafter, the same is "CI Pigment Orange", only the number is described), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55, 59, 61, 63, 64, 71, 73; CI Pigment Violet 1 (hereinafter also referred to as "CI Pigment Violet", only the number is described), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50; CI Pigment Red 1 (hereinafter also referred to as "CI Pigment Red", only the number is described), 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2 50: 1, 52: 1, 53 1, 57, 57: 1, 57: 2, 58: 2, 58: 4, 60: 1, 63: 1, 63: 2, 64: 1, 81: 1, 83, 88, 90: 1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168, 170, 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265; CI Pigment Blue 1 (hereinafter, also referred to as "CI Pigment Blue", only the number is described), 2, 15, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66; CI Pigment Green 7, CI Pigment Green 36, CI Pigment Green 37; CI Pigment Brown 23, CI Pigment Brown 25, CI Pigment Brown 26, CI Pigment Brown 28; CI Pigment Black 1. CI Pigment Black 7. When the colorant is a light-shielding agent, a black pigment is preferably used as the light-shielding agent. Examples of the black pigment include carbon black, titanium black, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, and other metal oxides, composite oxides, metal sulfides, metal sulfates, and metal carbonates. Various pigments including organic and inorganic substances such as salts. Among these, it is preferable to use carbon black having a high light-shielding property. As the carbon black, known carbon blacks such as chimney black, furnace black, thermal carbon black, and lamp black can be used, and it is preferable to use chimney black excellent in light-shielding property. Alternatively, a resin-coated carbon black may be used. Resin-coated carbon black has lower electrical conductivity than carbon black without resin. Therefore, when used as a black matrix for liquid crystal displays, low-power consumption displays with less leakage and higher reliability can be manufactured. Moreover, in order to adjust the hue of carbon black, the above-mentioned organic pigment can be suitably added as an auxiliary pigment. In order to uniformly disperse the colorant in the photosensitive composition, a dispersant may be further used. As such a dispersant, a polymer dispersant based on polyethylenimine, urethane resin, or acrylic resin is preferably used. In particular, when carbon black is used as the colorant, it is preferable to use an acrylic resin-based dispersant as the dispersant. In addition, the inorganic pigment and the organic pigment may be used alone or in combination. When used in combination, it is preferably 10 parts by mass or more and 80 parts by mass or less based on the total amount of the inorganic pigment and the organic pigment. The organic pigment is used within the range, and more preferably within the range of 20 parts by mass to 40 parts by mass. The content of the colorant may be appropriately determined according to the use of the photosensitive composition of the first aspect, and as an example, it is preferably 5 parts by mass relative to 100 parts by mass of the solid content of the photosensitive composition of the first aspect. The amount is more than 70 parts by mass, and more preferably 25 parts by mass or more and 60 parts by mass or less. In particular, when the black matrix is formed by using the photosensitive composition of the first aspect, it is preferable to adjust the photosensitivity so that the OD (optical density) value of the film thickness per 1 μm of the black matrix becomes 4 or more. The amount of sunscreen in the composition. If the OD value of the black matrix per 1 μm film thickness is 4 or more, a sufficient display contrast can be obtained in the case of the black matrix of a liquid crystal display. The colorant is preferably added to the photosensitive composition after using a dispersant to prepare a dispersion liquid dispersed at an appropriate concentration. Examples of the organic solvent in the photosensitive composition of the first aspect include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol n-propyl ether, ethylene glycol mono-n-butyl ether, and diethylene glycol. Monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol Monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether Iso (poly) alkanediol monoalkyl ethers; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether ethyl (Poly) alkanediol monoalkyl ether acetates such as acid esters, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; diethylene glycol dimethyl ether, diethylene glycol methyl ether, diethyl ether Glycol diethyl ether, tetrahydrofuran and other ethers; methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone and other ketones; methyl 2-hydroxypropionate Alkyl lactates such as ethyl 2-hydroxypropionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3-ethyl Methyloxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutyrate, 3-methyl-3-acetate Methoxybutyl, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, Isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, n-propyl pyruvate, Other esters, such as ethyl acetate, ethyl acetate, ethyl 2-oxobutyrate; aromatic hydrocarbons, such as toluene and xylene; N-methylpyrrolidone, N, N-dimethyl Formamide, N, N-dimethylacetamide, and other amines such as a solvent represented by the formula (a04). These organic solvents may be used alone or in combination of two or more. Among the above organic solvents, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, and diethylene glycol methyl ester Diethyl ether, cyclohexanone, 3-methoxybutyl acetate, N-methylpyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, the above formula (a04) The amines, such as the solvents shown, are superior in solubility to the alkali-soluble resin (A1), the photopolymerizable compound (A2), the photopolymerization initiator (C), and hydrogen barrier agent (B). good. The content of the organic solvent is preferably an amount in which the solid component concentration of the photosensitive composition of the first aspect is 1% by mass or more and 50% by mass or less, and more preferably an amount of 5% by mass or more and 30% by mass or less. The photosensitive composition of the first aspect may contain various additives as necessary. Examples of the additives include sensitizers, hardening accelerators, fillers, adhesion promoters, antioxidants, ultraviolet absorbers, anticoagulants, thermal polymerization inhibitors, defoamers, and surfactants. Also, 1- (N, N-bis (2-ethylhexyl) amino) methyl-1H-benzotriazole, 1- (N, N-bis (2-ethyl Hexyl) amino) methyl-1H-methylbenzotriazole, carboxybenzotriazole, benzotriazole, methylbenzotriazole, dihydroxypropylbenzotriazole, bisaminomethyl Benzotriazole derivatives such as benzotriazole and the like are used as optional additives. The addition amounts of various additives may be appropriately adjusted, for example, in a range of 0.001% by mass or more and 10% by mass or less with respect to the entire composition, and preferably 0.1% by mass or more and 5% by mass or less. (2) Photosensitive composition in the second aspect The photosensitive composition in the second aspect is a positive-type photosensitive composition. In the case where the photosensitive composition of the second aspect is a chemically amplified positive photosensitive composition, it contains an acid generator (hereinafter also referred to as a photoacid generator) that generates an acid by irradiation with active light or radiation. And a resin (hereinafter also referred to as a photosensitive resin) which increases the solubility in alkali by the action of an acid. The photosensitive resin composition may contain components, such as an alkali-soluble resin, an acid diffusion inhibitor, and an organic solvent, as needed. As another second aspect of the photosensitive composition, a positive photosensitive composition containing an alkali-soluble resin such as a diazide quinone group-containing compound and a novolac phenol resin (for example, the following novolac resin (C1), etc.) is mentioned. Thing. The film thickness of the photoresist pattern formed using the photosensitive composition of the second aspect is not particularly limited. The photosensitive composition of the second aspect can be preferably used for forming a thick film photoresist pattern. The film thickness of the photoresist pattern formed by using the photosensitive composition of the second aspect is specifically preferably 10 μm or more, more preferably 10 μm or more and 150 μm or less, particularly preferably 20 μm or more and 120 μm or less. It is particularly preferably at least 20 μm and at most 80 μm. Hereinafter, an essential or arbitrary component contained in the second aspect of the photosensitive composition and a method for producing the photosensitive resin composition will be described. The photoacid generator is a compound that generates an acid by irradiation with active light or radiation, and is not particularly limited as long as it is a compound that directly or indirectly generates an acid by light. Hereinafter, preferred examples of the photoacid generator preferably used in the photosensitive composition of the second aspect will be described. As a first example of a preferred photoacid generator, a compound represented by the following formula (a1) can be mentioned. [Chemical 59] In the above formula (a1), X ^1a A sulfur atom or an iodine atom having an atomic value of g, and g is 1 or 2. h is the number of repeating units of the structure in parentheses. R ^1a For X ^1a The bonded organic group means an aryl group having 6 to 30 carbon atoms, a heterocyclic group having 4 to 30 carbon atoms, an alkyl group having 1 to 30 carbon atoms, and 2 to 2 Alkenyl group of 30 or less or alkynyl group of 2 or more and 30 carbon atoms, R ^1a May be selected from the group consisting of alkyl, hydroxyl, alkoxy, alkylcarbonyl, arylcarbonyl, alkoxycarbonyl, aryloxycarbonyl, arylthiocarbonyl, fluorenyl, arylthio, alkylthio, aryl , Heterocyclic, aryloxy, alkylsulfinyl, arylsulfinyl, alkylsulfinyl, arylsulfinyl, alkoxy, amino, cyano, nitro And at least one of the groups consisting of halogen. R ^1a The number is g + h (g-1) +1, R ^1a They may be the same or different from each other. Also, two or more R ^1a Can be directly with each other or via -O-, -S-, -SO-, -SO ₂ -, -NH-, -NR ^2a -, -CO-, -COO-, -CONH-, alkylene group or phenylene group having 1 to 3 carbon atoms and bonded to form X containing X ^1a Ring structure. R ^2a It is an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 10 carbon atoms. X ^2a It is a structure represented by following formula (a2). [Chemical 60] In the above formula (a2), X ^4a X represents an alkylene group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms or a divalent group of a heterocyclic compound having 8 to 20 carbon atoms, X ^4a It may be selected from the group consisting of an alkyl group having 1 to 8 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, a hydroxyl group, a cyano group, and a nitro group. And at least one of the groups consisting of halogen and halogen. X ^5a Means -O-, -S-, -SO-, -SO ₂ -, -NH-, -NR ^2a -, -CO-, -COO-, -CONH-, an alkylene group or a phenylene group having 1 to 3 carbon atoms. h is the number of repeating units of the structure in parentheses. h + 1 of X ^4a And h X ^5a They can be the same or different. R ^2a Same definition as above. X ^3a- Examples of the onium counter ion include a fluorinated alkylfluorophosphate anion represented by the following formula (a17) or a borate anion represented by the following formula (a18). [Chem 61] In the above formula (a17), R ^3a An alkyl group in which more than 80% of hydrogen atoms are replaced with fluorine atoms. j represents the number, and is an integer of 1 or more and 5 or less. j R ^3a They can be the same or different. [Chem 62] In the above formula (a18), R ^4a ~ R ^7a Each independently represents a fluorine atom or a phenyl group, and a part or all of a hydrogen atom of the phenyl group may be substituted with at least one selected from the group consisting of a fluorine atom and a trifluoromethyl group. Examples of the onium ion in the compound represented by the formula (a1) include triphenylphosphonium, tri-p-tolylphosphonium, 4- (phenylthio) phenyldiphenylphosphonium, and bis [4- (di Phenylfluorenyl) phenyl] sulfide, bis [4- {bis [4- (2-hydroxyethoxy) phenyl] fluorenyl} phenyl] sulfide, bis {4- [bis (4-fluoro Phenyl) fluorenyl] phenyl} sulfide, 4- (4-benzylidene-2-chlorophenylthio) phenylbis (4-fluorophenyl) fluorene, 7-isopropyl-9-oxyl -10-thia-9,10-dihydroanthracen-2-yldi-p-tolylfluorene, 7-isopropyl-9-oxo-10-thio-9,10-dihydroanthracen-2-yl Diphenylfluorene, 2-[(diphenyl) fluorenyl] -9-oxosulfur , 4- [4- (4-Third-butylbenzylidene) phenylthio] phenyldi-p-tolylfluorene, 4- (4-benzylidenephenylthio) phenyldiphenylfluorene , Diphenylbenzylmethylfluorene, 4-hydroxyphenylmethylbenzylfluorene, 2-naphthylmethyl (1-ethoxycarbonyl) ethylfluorene, 4-hydroxyphenylmethylbenzylfluorene Methylfluorene, phenyl [4- (4-biphenylthio) phenyl] 4-biphenylfluorene, phenyl [4- (4-biphenylthio) phenyl] 3-biphenylfluorene, [4 -(4-ethylfluorenylphenylthio) phenyl] diphenylfluorene, octadecylmethylbenzylmethylfluorene, diphenylfluorene, di-p-tolylfluorene, bis (4-dodecane) Phenyl) fluorene, bis (4-methoxyphenyl) fluorene, (4-octyloxyphenyl) phenylfluorene, bis (4-decoxy) phenylfluorene, 4- (2-hydroxydeca Tetraalkoxy) phenylphenylfluorene, 4-isopropylphenyl (p-tolyl) fluorene or 4-isobutylphenyl (p-tolyl) fluorene and the like. Among the onium ions in the compound represented by the formula (a1), preferred onium ions include the sulfonium ions represented by the following formula (a19). [Chem 63] In the above formula (a19), R ^8a Each independently represents a group selected from the group consisting of a hydrogen atom, an alkyl group, a hydroxyl group, an alkoxy group, an alkylcarbonyl group, an alkylcarbonyloxy group, an alkoxycarbonyl group, a halogen atom, an aryl group which may have a substituent, and an arylcarbonyl group In the base. X ^2a And X in the above formula (a1) ^2a The same meaning. Specific examples of the europium ion represented by the above formula (a19) include 4- (phenylthio) phenyldiphenylsulfonium and 4- (4-benzylidene-2-chlorophenylthio) benzene. Bis (4-fluorophenyl) fluorene, 4- (4-benzylidenephenylthio) phenyldiphenylfluorene, phenyl [4- (4-biphenylthio) phenyl] 4-biphenyl Phenylhydrazone, phenyl [4- (4-biphenylthio) phenyl] 3-biphenylhydrazone, [4- (4-ethylsulfanylphenyl) phenyl] diphenylphosphonium, diphenyl [4 -(P-terphenyltriphenylthio) phenyl] diphenylphosphonium. In the fluorinated alkylfluorophosphate anion represented by the above formula (a17), R ^3a Represents an alkyl group substituted with a fluorine atom, and preferably has a carbon number of 1 or more and 8 or less, and further preferably a carbon number of 1 or more and 4 or less. Specific examples of the alkyl group include linear alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, and octyl; isopropyl, isobutyl, second butyl, and third butyl Iso-branched alkyl groups; further cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, etc., the ratio of the hydrogen atom of the alkyl group to the fluorine atom is usually 80% or more, preferably 90% or more , And more preferably 100%. When the substitution rate of the fluorine atom is less than 80%, the acid strength of the fluorinated alkylfluorophosphonium salt represented by the formula (a1) decreases. Eugene R ^3a A linear or branched perfluoroalkyl group having 1 to 4 carbon atoms and a fluorine atom substitution rate of 100%. Specific examples include CF. ₃ CF ₃ CF ₂ , (CF ₃ ) ₂ CF, CF ₃ CF ₂ CF ₂ CF ₃ CF ₂ CF ₂ CF ₂ , (CF ₃ ) ₂ CFCF ₂ CF ₃ CF ₂ (CF ₃ ) CF, (CF ₃ ) ₃ C. R ^3a The number j is an integer of 1 or more and 5 or less, preferably 2 or more and 4 or less, and particularly preferably 2 or 3. As a specific example of a preferred fluorinated alkyl fluorophosphate anion, [(CF ₃ CF ₂ ) ₂ PF ₄ ] ^- , [(CF ₃ CF ₂ ) ₃ PF ₃ ] ^- , [((CF ₃ ) ₂ CF) ₂ PF ₄ ] ^- , [((CF ₃ ) ₂ CF) ₃ PF ₃ ] ^- , [(CF ₃ CF ₂ CF ₂ ) ₂ PF ₄ ] ^- , [(CF ₃ CF ₂ CF ₂ ) ₃ PF ₃ ] ^- , [((CF ₃ ) ₂ CFCF ₂ ) ₂ PF ₄ ] ^- , [((CF ₃ ) ₂ CFCF ₂ ) ₃ PF ₃ ] ^- , [(CF ₃ CF ₂ CF ₂ CF ₂ ) ₂ PF ₄ ] ^- Or [(CF ₃ CF ₂ CF ₂ ) ₃ PF ₃ ] ^- Among them, especially good is [(CF ₃ CF ₂ ) ₃ PF ₃ ] ^- , [(CF ₃ CF ₂ CF ₂ ) ₃ PF ₃ ] ^- , [((CF ₃ ) ₂ CF) ₃ PF ₃ ] ^- , [((CF ₃ ) ₂ CF) ₂ PF ₄ ] ^- , [((CF ₃ ) ₂ CFCF ₂ ) ₃ PF ₃ ] ^- Or [((CF ₃ ) ₂ CFCF ₂ ) ₂ PF ₄ ] ^- . As a preferable specific example of the borate anion represented by the above formula (a18), tetrakis (pentafluorophenyl) borate ([B (C ₆ F ₅ ) ₄ ] ^- ), Tetra [(trifluoromethyl) phenyl] borate ((B (C ₆ H ₄ CF ₃ ) ₄ ] ^- ), Difluorobis (pentafluorophenyl) borate (((C ₆ F ₅ ) ₂ BF ₂ ] ^- ), Trifluoro (pentafluorophenyl) borate (((C ₆ F ₅ BF ₃ ] ^- ), Tetrakis (difluorophenyl) borate ((B (C ₆ H ₃ F ₂ ) ₄ ] ^- )Wait. Among them, tetrakis (pentafluorophenyl) borate ([B (C ₆ F ₅ ) ₄ ] ^- ). As a second example of a preferred photoacid generator, 2,4-bis (trichloromethyl) -6-sunfloweryl-1,3,5-tri &#134116;, 2,4-bis ( Trichloromethyl) -6- [2- (2-furanyl) vinyl] -mesatriene &#134116;, 2,4-bis (trichloromethyl) -6- [2- (5-methyl 2-furanyl) vinyl] -mesantris &#134116;, 2,4-bis (trichloromethyl) -6- [2- (5-ethyl-2-furanyl) vinyl] -mesan Tris &#134116;, 2,4-bis (trichloromethyl) -6- [2- (5-propyl-2-furanyl) vinyl] -mesa &#134116;, 2,4-bis (Trichloromethyl) -6- [2- (3,5-dimethoxyphenyl) vinyl] -mesa &#134116;, 2,4-bis (trichloromethyl) -6- [ 2- (3,5-diethoxyphenyl) vinyl] -messan &#134116;, 2,4-bis (trichloromethyl) -6- [2- (3,5-dipropoxy Phenyl) vinyl] -mesityl &#134116;, 2,4-bis (trichloromethyl) -6- [2- (3-methoxy-5-ethoxyphenyl) vinyl] -Mesquite &#134116;, 2,4-bis (trichloromethyl) -6- [2- (3-methoxy-5-propoxyphenyl) vinyl] -meseme &#134116; , 2,4-bis (trichloromethyl) -6- [2- (3,4-methylenedioxyphenyl) vinyl] -mesa &#134116;, 2,4-bis (tri (Chloromethyl) -6- (3,4-methylenedioxyphenyl) -tritris &#134116;, 2,4-bis-tri Chloromethyl-6- (3-bromo-4-methoxy) phenyl-mesityl &#134116;, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy ) Phenyl-mesityl &#134116;, 2,4-bis-trichloromethyl-6- (2-bromo-4-methoxy) styrylphenyl-mesityl &#134116;, 2, 4-bis-trichloromethyl-6- (3-bromo-4-methoxy) styrylphenyl-mesane &#134116;, 2- (4-methoxyphenyl) -4,6 -Bis (trichloromethyl) -1,3,5-tri &#134116;, 2- (4-methoxynaphthyl) -4,6-bis (trichloromethyl) -1,3,5 -Tris &#134116;, 2- [2- (2-furanyl) vinyl] -4,6-bis (trichloromethyl) -1,3,5-tris &#134116;, 2- [2 -(5-methyl-2-furanyl) vinyl] -4,6-bis (trichloromethyl) -1,3,5-tri &#134116;, 2- [2- (3,5- Dimethoxyphenyl) vinyl] -4,6-bis (trichloromethyl) -1,3,5-tri &#134116;, 2- [2- (3,4-dimethoxybenzene (Alkyl) vinyl) -4,6-bis (trichloromethyl) -1,3,5-tri &#134116;, 2- (3,4-methylenedioxyphenyl) -4,6 -Bis (trichloromethyl) -1,3,5-tri &#134116;, tris (1,3-dibromopropyl) -1,3,5-tri &#134116;, tris (2,3 -Dibromopropyl) -1,3,5-tri &#134116; and other halogen-containing tri &#134116; compounds and tris (2,3-dibromopropyl) isocyanurate and the following formula (a3 Halogenated Three &#134116; compound. [Chemical 64] In the above formula (a3), R ^9a , R ^10a , R ^11a Each independently represents a halogenated alkyl group. As a third example of a preferred photoacid generator, α- (p-toluenesulfonyloxyimino) -phenylacetonitrile, α- (benzenesulfonyloxyimino) -2,4- Dichlorophenylacetonitrile, α- (benzenesulfonyloxyimino) -2,6-dichlorophenylacetonitrile, α- (2-chlorobenzenesulfonyloxyimino) -4-methoxy Phenylacetonitrile, α- (ethylsulfonyloxyimino) -1-cyclopentenylacetonitrile and a compound represented by the following formula (a4) containing an oxime sulfonate group. [Chem 65] In the above formula (a4), R ^12a Represents a monovalent, divalent, or trivalent organic group, R ^13a Represents a substituted or unsubstituted saturated hydrocarbon group, an unsaturated hydrocarbon group, or an aromatic compound group, and n represents the number of repeating units of the structure in parentheses. In the above formula (a4), the term "aromatic compound group" refers to a group of compounds exhibiting physical and chemical properties peculiar to aromatic compounds, and examples thereof include aryl groups such as phenyl and naphthyl, furanyl, and thienyl Heteroaryl. These may have one or more appropriate substituents on the ring, such as a halogen atom, an alkyl group, an alkoxy group, a nitro group, and the like. Again, R ^13a The alkyl group having 1 to 6 carbon atoms is particularly preferred, and examples thereof include methyl, ethyl, propyl, and butyl. Especially good for R ^12a Is an aromatic compound group, R ^13a A compound having an alkyl group having 1 to 4 carbon atoms. As the photoacid generator represented by the above formula (a4), when n = 1, R may be listed. ^12a Is any one of phenyl, methylphenyl, and methoxyphenyl and R ^13a Compounds which are methyl, specifically, α- (methylsulfonyloxyimino) -1-phenylacetonitrile, α- (methylsulfonyloxyimino) -1- (p-methylbenzene Group) acetonitrile, α- (methylsulfonyloxyimino) -1- (p-methoxyphenyl) acetonitrile, [2- (propylsulfonyloxyimino) -2,3-di Hydroxythiophene-3-ylidene] (o-tolyl) acetonitrile and the like. When n = 2, as the photoacid generator represented by the formula (a4), specifically, a photoacid generator represented by the following formula can be mentioned. [Chemical 66] As a fourth example of a preferred photoacid generator, an onium salt having a naphthalene ring in the cation part can be mentioned. The term "having a naphthalene ring" means having a structure derived from naphthalene, and means maintaining a structure of at least two rings and their aromaticity. The naphthalene ring may have a substituent such as a linear or branched alkyl group having 1 to 6 carbon atoms, a hydroxyl group, and a linear or branched alkoxy group having 1 to 6 carbon atoms. . The structure derived from the naphthalene ring may be a monovalent group (one free atomic valence), or a divalent group (two free atomic valences) or more. A monovalent group (where Except for the substituent-bonded portion, the free atomic valence is calculated). The number of naphthalene rings is preferably 1 or more and 3 or less. The cation part having such an onium salt having a naphthalene ring in the cation part is preferably a structure represented by the following formula (a5). [Chemical 67] In the above formula (a5), R ^14a , R ^15a , R ^16a At least one of them represents a group represented by the following formula (a6), and the remainder represents a linear or branched alkyl group having 1 to 6 carbon atoms, a phenyl group, a hydroxyl group, or a carbon atom which may have a substituent A linear or branched alkoxy group having a number of 1 or more and 6 or less. Or, R ^14a , R ^15a , R ^16a One of them is a group represented by the following formula (a6), and the remaining two are independently linear or branched alkylene groups having 1 or more and 6 or less carbon atoms, and the ends thereof may be bonded And become a ring. [Chemical 68] In the above formula (a6), R ^17a , R ^18a Each independently represents a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms or a linear or branched alkyl group having 1 to 6 carbon atoms, R ^19a A single bond or a linear or branched alkylene group having 1 to 6 carbon atoms which may have a substituent. l and m each independently represent an integer of 0 or more and 2 or less, and l + m is 3 or less. Among them, there exists a plurality of R ^17a In this case, they may be the same as or different from each other. In the presence of a plurality of R ^18a In this case, they may be the same as or different from each other. Above R ^14a , R ^15a , R ^16a Among them, the number of the bases represented by the formula (a6) is preferably one in terms of the stability of the compound, and the remainder is a linear or branched chain having 1 or more and 6 or less carbon atoms. In the case of an alkylene group, the ends thereof may be bonded to form a ring. In this case, the above-mentioned two alkylene groups include a sulfur atom and constitute a 3- to 9-membered ring. The number of atoms (including sulfur atoms) constituting the ring is preferably 5 or more and 6 or less. Examples of the substituent which the above-mentioned alkylene group may have include an oxygen atom (in this case, a carbonyl group is formed together with a carbon atom constituting the alkylene group), a hydroxyl group, and the like. Examples of the substituent which the phenyl group may have include a hydroxyl group, a linear or branched alkoxy group having 1 to 6 carbon atoms, a linear or branching group having 1 to 6 carbon atoms, or Branched alkyl groups and the like. As a preferable one of these cation parts, the structure represented by following formula (a7), (a8), etc. are mentioned, and the structure represented by following formula (a8) is especially preferable. [Chemical 69] As such a cationic moiety, a sulfonium salt or a sulfonium salt may be used. A sulfonium salt is preferred in terms of acid generation efficiency and the like. Therefore, as the anion part having an onium salt having a naphthalene ring in the cation part, an anion capable of forming a sulfonium salt is more preferable. As the anion part of such a photoacid generator, a part or all of the hydrogen atoms are fluorinated halothanesulfonate ions or aromatic sulfonate ions. The alkyl group in the halothanesulfonate ion may be a linear chain having 1 or more and 20 carbon atoms, or may be branched or cyclic. In terms of the volume of the acid generated and its diffusion distance, It is preferably 1 or more and 10 or less. In particular, a branched or cyclic one has a shorter diffusion distance, which is preferable. Further, in terms of low-cost synthesis, methyl, ethyl, propyl, butyl, and octyl are preferred. The aryl group in the aromatic sulfonate ion is an aryl group having 6 to 20 carbon atoms, and examples thereof include a phenyl group and a naphthyl group which may be substituted with an alkyl group or a halogen atom. In particular, an aryl group having 6 or more and 10 or less carbon atoms is preferred in terms of low-cost synthesis. Specific preferred examples include phenyl, tosyl, ethylphenyl, naphthyl, and methylnaphthyl. In the case where a part or all of the hydrogen atoms in the above-mentioned fluoroalkanesulfonate ion or aromatic sulfonate ion are fluorinated, the fluorination rate is preferably 10% or more and 100% or less, and more preferably 50% or more and 100% or less. In particular, for those in which all hydrogen atoms are replaced by fluorine atoms, the strength of the acid becomes stronger, which is preferable. Specific examples of such compounds include trifluoromethanesulfonate, perfluorobutanesulfonate, perfluorooctanesulfonate, and perfluorobenzenesulfonate. Among these, as a preferable anion part, the thing represented by following formula (a9) is mentioned. [Chem 70] In the above formula (a9), R ^20a It is a base represented by following formula (a10), (a11), and (a12). [Chemical 71] In the formula (a10), x represents an integer of 1 or more and 4 or less. In the above formula (a11), R ^21a Represents a hydrogen atom, a hydroxyl group, a linear or branched alkyl group having 1 to 6 carbon atoms or a linear or branched alkoxy group having 1 to 6 carbon atoms, and y represents 1 An integer from 3 to 3. Among these, trifluoromethanesulfonate and perfluorobutanesulfonate are preferred from the viewpoint of safety. In addition, as the anion part, a nitrogen-containing one represented by the following formulae (a13) and (a14) may be used. [Chemical 72] In the formulae (a13) and (a14), X ^a A linear or branched alkylene group having at least one hydrogen atom replaced by a fluorine atom. The number of carbon atoms of the alkylene group is 2 or more and 6 or less, preferably 3 or more and 5 or less, and most preferably Number of carbon atoms 3. Also, Y ^a ,Z ^a Each independently represents a linear or branched alkyl group having at least one hydrogen atom replaced by a fluorine atom, and the number of carbon atoms of the alkyl group is 1 or more and 10 or less, preferably 1 or more and 7 or less, and more preferably 1 or more and 3 or less. X ^a Carbon number of alkylene or Y ^a ,Z ^a The smaller the number of carbon atoms of the alkyl group, the better the solubility in the organic solvent is, so the better it is. Again, X ^a Alkylene or Y ^a ,Z ^a The larger the number of hydrogen atoms substituted by fluorine atoms in the alkyl group, the stronger the strength of the acid is, so it is more preferable. The ratio of the fluorine atom in the alkylene group or the alkyl group, that is, the fluorination ratio is preferably 70% to 100%, more preferably 90% to 100%, and most preferably all hydrogen atoms are replaced by fluorine atoms. Perfluoroalkyl or perfluoroalkyl. As such an onium salt having a naphthalene ring in the cation part, compounds represented by the following formulae (a15) and (a16) are mentioned. [Chemical 73] As a sixth example of a preferred photoacid generator, bis (p-toluenesulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, and bis (cyclohexyl) Disulfonyl) diazomethane, bis (2,4-dimethylphenylsulfonyl) diazomethane and other bissulfonyldiazomethanes; 2-nitrobenzyl p-toluenesulfonate, p-toluenesulfonate Acid 2,6-dinitrobenzyl ester, nitrobenzyl tosylate, dinitrobenzyl tosylate, nitrobenzyl sulfonate, nitrobenzyl carbonate, dinitrobenzyl carbonate, etc. Benzyl Derivatives; Pyrogallol Trimethanesulfonate, Pyrogallol Trimethylsulfonate, Benzyl Toluenesulfonate, Benzylsulfonate, N-Methylsulfonyloxysuccinimide, N- Sulfonium trichloromethylsulfonyloxysuccinimide, N-phenylsulfonyloxy maleimide, and N-methylsulfonyloxyphthalimide; and other sulfonates; Trifluoromethanesulfonates such as N-hydroxyphthalimide, N-hydroxynaphthylimide; diphenylphosphonium hexafluorophosphate, trifluoromethanesulfonic acid (4-methoxybenzene Phenyl) phosphonium salt, bis (p-tert-butylphenyl) phosphonium triflate, triphenylphosphonium hexafluorophosphate Onium salts such as trifluoromethanesulfonic acid (4-methoxyphenyl) diphenylphosphonium salt, trifluoromethanesulfonic acid (p-third butylphenyl) diphenylphosphonium salt; benzoin tosylate, α-methyl benzoin tosylate and other benzoin tosylate; other diphenylphosphonium salts, triphenylphosphonium salts, phenyldiazonium salts, benzyl carbonate and the like. When used in combination with the hydrogen barrier agent (B), a particularly preferred photoacid generator includes a naphthalenedicarboxylic acid derivative represented by the following formula (c-5). [Chemical 74] (In formula (c-5), R ^22a Is a monovalent organic group, R ^23a , R ^24a , R ^25a And R ^26a Each independently a hydrogen atom or a monovalent organic group, R ^23a With R ^24a , R ^24a With R ^25a Or R ^25a With R ^26a Can be bonded to each other to form a ring) as R ^22a The organic group is not particularly limited as long as it does not hinder the object of the present invention. The organic group may be a hydrocarbon group or may contain heteroatoms such as O, N, S, P, and halogen atoms. The structure of the organic group may be linear, branched, or cyclic, or a combination of these structures. As for R ^22a Preferred organic groups include aliphatic hydrocarbon groups having 1 to 18 carbon atoms, which may be substituted with halogen atoms and / or alkylthio groups, and aromatic groups having 6 to 20 carbon atoms which may have a substituent. Aralkyl having 7 or more and 20 or less carbon atoms which may have a substituent, alkylaryl having 7 or more and 20 or less carbon atoms which may have a substituent, camphor-10-yl and the following formula (c-5a The base represented by): -R ^27a -(O) _a -R ^28a -(O) _b -Y ¹ -R ^29a (C-5a) (In the formula (c-5a), Y ¹ Is a single bond or an alkanediyl group having 1 to 4 carbon atoms; R ^27a And R ^28a Alkyl groups having 2 or more and 6 or less carbon atoms which may be substituted by halogen atoms or aryl groups having 6 or more and 20 carbon atoms which may be substituted by halogen atoms; R ^29a It is an alkyl group having 1 or more and 18 carbon atoms which can be substituted with a halogen atom, an alicyclic hydrocarbon group having 3 or more and 12 carbon atoms or less, and an aryl group having 6 or more and 20 carbon atoms which can be substituted with a halogen atom An aralkyl group having 7 or more and 20 or less carbon atoms which may be substituted by a halogen atom; a and b are 0 or 1, respectively, and at least one of a and b is 1). As R ^22a When the organic group has a halogen atom as a substituent, examples of the halogen atom include a chlorine atom, a bromine atom, an iodine atom, and a fluorine atom. As R ^22a When the organic group is an alkyl group having 1 to 18 carbon atoms substituted with an alkylthio group, the carbon number of the alkylthio group is preferably 1 to 18. Examples of the alkylthio group having 1 to 18 carbon atoms include methylthio, ethylthio, n-propylthio, isopropylthio, n-butylthio, second butylthio, and third butylthio. , Isobutylthio, n-pentylthio, isopentylthio, third pentylthio, n-hexylthio, n-heptylthio, isoheptylthio, third heptylthio, n-octylthio, isooctylthio Base, third octylthio, 2-ethylhexylthio, n-nonylthio, n-decylthio, n-undecylthio, n-dodecylthio, n-tridecylthio, n-tetradecyl Alkylthio, n-pentadecanylthio, n-hexadecylthio, n-heptadecanylthio and n-octadecylthio. As R ^22a When the organic group is an aliphatic hydrocarbon group having 1 to 18 carbon atoms which may be substituted with a halogen atom and / or an alkylthio group, the aliphatic hydrocarbon group may contain an unsaturated double bond. The structure of the aliphatic hydrocarbon group is not particularly limited, and may be linear, branched, or cyclic, or a combination of these structures. As for R ^22a When the organic group is an alkenyl group, a preferable example is an allyl group, 2-methyl-2-propenyl group. As for R ^22a Preferred examples when the organic group is an alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, second butyl, third butyl, isobutyl, n- Pentyl, isopentyl, third pentyl, n-hexyl, n-hexane-2-yl, n-hexane-3-yl, n-heptyl, n-heptane-2-yl, n-heptane-3-yl, iso Heptyl, third heptyl, n-octyl, isooctyl, third octyl, 2-ethylhexyl, n-nonyl, isononyl, n-decyl, n-undecyl, n-dodecyl , N-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl and n-octadecyl. As R ^22a When the organic group is an alicyclic hydrocarbon group, examples of the alicyclic hydrocarbon constituting the main skeleton of the alicyclic hydrocarbon group include cyclopropane, cyclobutane, cyclopentane, cyclohexane, and cycloheptane. Alkane, cyclooctane, cyclodecane, bicyclo [2.1.1] hexane, bicyclo [2.2.1] heptane, bicyclo [3.2.1] octane, bicyclo [2.2.2] octane and adamantane. The alicyclic hydrocarbon group is preferably a group obtained by removing one hydrogen atom from these alicyclic hydrocarbons. As for R ^22a Preferred examples when the organic group is an aliphatic hydrocarbon group substituted with a halogen atom include trifluoromethyl, pentafluoroethyl, 2-chloroethyl, 2-bromoethyl, and heptafluoron-propyl , 3-bromopropyl, nonafluoro-n-butyl, tridecyl-n-hexyl, heptafluoro-n-octyl, 2,2,2-trifluoroethyl, 1,1-difluoroethyl, 1,1- Difluoro-n-propyl, 1,1,2,2-tetrafluoro-n-propyl, 3,3,3-trifluoro-n-propyl, 2,2,3,3,3-pentafluoro-n-propyl, 2- Noryl-1,1-difluoroethyl, 2-noryl tetrafluoroethyl, and 3-adamantyl-1,1,2,2-tetrafluoropropyl. As for R ^22a Preferred examples when the organic group is an aliphatic hydrocarbon group substituted with an alkylthio group include 2-methylthioethyl, 4-methylthio-n-butyl, and 2-n-butylthioethyl. As for R ^22a Preferable examples when the organic group is an aliphatic hydrocarbon group substituted with a halogen atom and an alkylthio group include 3-methylthio-1,1,2,2-tetrafluoro-n-propyl group. As for R ^22a Preferred examples when the organic group is an aryl group include phenyl, naphthyl, and biphenyl. As for R ^22a Preferred examples when the organic group is an aryl group substituted with a halogen atom include pentafluorophenyl, chlorophenyl, dichlorophenyl, and trichlorophenyl. As for R ^22a Preferred examples when the organic group is an aryl group substituted with an alkylthio group include 4-methylthiophenyl, 4-n-butylthiophenyl, 4-n-octylthiophenyl, 4 -N-dodecylthiophenyl. As for R ^22a Preferable examples when the organic group is an aryl group substituted with a halogen atom and an alkylthio group include 1,2,5,6-tetrafluoro-4-methylthiophenyl, 1,2,5 1,6-tetrafluoro-4-n-butylthiophenyl, 1,2,5,6-tetrafluoro-4-n-dodecylthiophenyl. As for R ^22a Preferred examples when the organic group is an aralkyl group include benzyl, phenethyl, 2-phenylpropane-2-yl, diphenylmethyl, and triphenylmethyl. As for R ^22a Preferred examples when the organic group is an aralkyl group substituted with a halogen atom include pentafluorophenylmethyl, phenyldifluoromethyl, 2-phenyltetrafluoroethyl, 2- (penta Fluorophenyl) ethyl. As for R ^22a A preferable example when the organic group is an aralkyl group substituted with an alkylthio group includes p-methylthiobenzyl. As for R ^22a Preferred examples when the organic group is an aralkyl group substituted with a halogen atom and an alkylthio group include 2- (2,3,5,6-tetrafluoro-4-methylthiophenyl) ethyl base. As for R ^22a Preferred examples when the organic group is an alkylaryl group include 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 3-isopropylphenyl, 4- Isopropylphenyl, 4-n-butylphenyl, 4-isobutylphenyl, 4-tert-butylphenyl, 4-n-hexylphenyl, 4-cyclohexylphenyl, 4-n-octyl Phenyl, 4- (2-ethyl-n-hexyl) phenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6- Dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, 2,4-di-third-butylphenyl, 2,5-di-third-butylbenzene Base, 2,6-di-third-butylphenyl, 2,4-di-third-pentylphenyl, 2,5-di-third-pentylphenyl, 2,5-di-third-octyl Phenyl, 2-cyclohexylphenyl, 3-cyclohexylphenyl, 4-cyclohexylphenyl, 2,4,5-trimethylphenyl, 2,4,6-trimethylphenyl, 2 , 4,6-triisopropylphenyl. The group represented by formula (c-5a) is an ether group-containing group. In formula (c-5a), as Y ¹ Examples of the alkanediyl group having 1 to 4 carbon atoms include methylene, ethane-1,2-diyl, ethane-1,1-diyl, and propane-1,3-diyl. Base, propane-1,2-diyl, butane-1,4-diyl, butane-1,3-diyl, butane-2,3-diyl, butane-1,2-diyl . In formula (c-5a), as R ^27a Or R ^28a Examples of the alkanediyl group having 2 or more and 6 or less carbon atoms include ethane-1,2-diyl, propane-1,3-diyl, propane-1,2-diyl, and butane- 1,4-diyl, butane-1,3-diyl, butane-2,3-diyl, butane-1,2-diyl, pentane-1,5-diyl, pentane- 1,3-diyl, pentane-1,4-diyl, pentane-2,3-diyl, hexane-1,6-diyl, hexane-1,2-diyl, hexane- 1,3-diyl, hexane-1,4-diyl, hexane-2,5-diyl, hexane-2,4-diyl, hexane-3,4-diyl. In formula (c-5a), at R ^27a Or R ^28a In the case of an alkanediyl group having 2 to 6 carbon atoms substituted with a halogen atom, examples of the halogen atom include a chlorine atom, a bromine atom, an iodine atom and a fluorine atom. Examples of the alkanediyl group substituted with a halogen atom include tetrafluoroethane-1,2-diyl, 1,1-difluoroethane-1,2-diyl, and 1-fluoroethane-1 2,2-diyl, 1,2-difluoroethane-1,2-diyl, hexafluoropropane-1,3-diyl, 1,1,2,2, -tetrafluoropropane-1,3- Diyl, 1,1,2,2, -tetrafluoropentane-1,5-diyl. In formula (c-5a), as R ^27a Or R ^28a Examples of the case of arylene include 1,2-phenylene, 1,3-phenylene, 1,4-phenylene, 2,5-dimethyl-1,4-phenylene Phenyl, biphenyl-4,4'-diyl, diphenylmethane-4,4'-diyl, 2,2, -diphenylpropane-4,4'-diyl, naphthalene-1,2 -Diyl, naphthalene-1,3-diyl, naphthalene-1,4-diyl, naphthalene-1,5-diyl, naphthalene-1,6-diyl, naphthalene-1,7-diyl, naphthalene -1,8-diyl, naphthalene-2,3-diyl, naphthalene-2,6-diyl, naphthalene-2,7-diyl. In formula (c-5a), at R ^27a Or R ^28a In the case of an arylene group substituted with a halogen atom, examples of the halogen atom include a chlorine atom, a bromine atom, an iodine atom and a fluorine atom. Examples of the arylene group substituted with a halogen atom include 2,3,5,6-tetrafluoro-1,4-phenylene. In formula (c-5a), as R ^29a Examples of the alkyl group having 1 to 18 carbon atoms which may have a branched chain include methyl, ethyl, n-propyl, isopropyl, n-butyl, second butyl, and third butyl , Isobutyl, n-pentyl, isopentyl, third pentyl, n-hexyl, n-hexane-2-yl, n-hexane-3-yl, n-heptyl, n-heptane-2-yl, n-heptane -3-yl, isoheptyl, third heptyl, n-octyl, isooctyl, third octyl, 2-ethylhexyl, n-nonyl, isononyl, n-decyl, n-undecyl , N-dodecyl, n-tridecyl, n-tetradecyl, n-pentadecyl, n-hexadecyl, n-heptadecyl, n-octadecyl. In formula (c-5a), at R ^29a In the case of an alkyl group having 1 to 18 carbon atoms substituted with a halogen atom, examples of the halogen atom include a chlorine atom, a bromine atom, an iodine atom and a fluorine atom. Examples of the alkyl group substituted with a halogen atom include trifluoromethyl, pentafluoroethyl, heptafluoro-n-propyl, nonafluoro-n-butyl, tridecyl-n-hexyl, heptafluoro-n-octyl, 2 , 2,2-trifluoroethyl, 1,1-difluoroethyl, 1,1-difluoro-n-propyl, 1,1,2,2-tetrafluoro-n-propyl, 3,3,3-tri Fluoro-n-propyl, 2,2,3,3,3-pentafluoro-n-propyl, 1,1,2,2-tetrafluorotetradecyl. In formula (c-5a), at R ^29a In the case of an alicyclic hydrocarbon group having 3 to 12 carbon atoms, examples of the alicyclic hydrocarbon constituting the main skeleton of the alicyclic hydrocarbon group include cyclopropane, cyclobutane, cyclopentane, Cyclohexane, cycloheptane, cyclooctane, cyclodecane, bicyclo [2.1.1] hexane, bicyclo [2.2.1] heptane, bicyclo [3.2.1] octane, bicyclo [2.2.2] octane And adamantane. The alicyclic hydrocarbon group is preferably a group obtained by removing one hydrogen atom from these alicyclic hydrocarbons. In formula (c-5a), at R ^29a In the case of an aryl group, a halogenated aryl group, an aralkyl group, or a halogenated aralkyl group, preferred examples of these groups are as follows: ^22a The situation is the same for these bases. The preferred group among the groups represented by formula (c-5a) is R ^27a In the represented group, a carbon atom to which a sulfur atom is bonded is substituted with a fluorine atom. The number of carbon atoms in the preferred group is preferably 2 or more and 18 or less. As R ^22a Is preferably a perfluoroalkyl group having 1 to 8 carbon atoms. In addition, in terms of easy formation of a high-definition photoresist pattern, camphor-10-based is used as R ^22a Also better. In formula (c-5), R ^23a ~ R ^26a It is a hydrogen atom or a monovalent organic group. Again, R ^23a With R ^24a , R ^24a With R ^25a Or R ^25a With R ^26a They can be bonded to each other to form a ring. For example, R ^25a With R ^26a By bonding to form a 5-membered ring with the naphthalene ring, a fluorene skeleton can be formed. As the monovalent organic group, an alkoxy group which may be substituted with an alicyclic hydrocarbon group, a heterocyclic group (heterocyclyl) or a halogen atom and which may have a branched carbon atom number of 4 or more and 18 or less is preferred; Oxygen; an alkylthio group which may be substituted with an alicyclic hydrocarbon group, a heterocyclic group (heterocyclyl group) or a halogen atom and which may have a branched carbon number of 4 or more and 18 or less; a heterocyclic thio group. It is also preferable that the methylene group which is not adjacent to the oxygen atom of the alkoxy group is substituted with -CO-. A group in which the alkoxy group is interrupted by an -O-CO- bond or an -O-CO-NH- bond is also preferred. The left end of the -O-CO- bond and the -O-CO-NH- bond is the side of the alkoxy group which is close to the naphthalenedicarboxylic acid mother core. Further, an alkylthio group which may be substituted with an alicyclic hydrocarbon group, a heterocyclic group, or a halogen atom and which may have a branched carbon number of 4 or more and 18 or less is used as R ^23a ~ R ^26a Also better. It is also preferable that a methylene group which is not adjacent to a sulfur atom of the alkylthio group is substituted with -CO-. A group in which the alkylthio group is interrupted by an -O-CO- bond or an -O-CO-NH- bond is also preferred. The left end of the -O-CO- bond and the -O-CO-NH- bond is the side of the alkylthio group that is close to the naphthalenedicarboxylic acid mother core. As R ^23a ~ R ^26a , Preferably R ^23a Is organic and R ^24a ~ R ^26a Is a hydrogen atom, or R ^24a Is organic and R ^23a , R ^25a And R ^26a Is a hydrogen atom. Again, R ^23a ~ R ^26a It may be all hydrogen atoms. As R ^23a ~ R ^26a In the case of an unsubstituted alkoxy group, examples include n-butoxy, second butoxy, third butoxy, isobutoxy, n-pentyloxy, isopentyloxy, Tripentyloxy, n-hexyloxy, n-heptyloxy, isoheptyloxy, third heptyloxy, n-octyloxy, isooctyloxy, third octyloxy, 2-ethylhexyl, n-nonyloxy N-decyloxy, n-undecyloxy, n-dodecyloxy, n-tridecyloxy, n-tetradecyloxy, n-pentadecyloxy, n-hexadecyloxy, n Heptadecyloxy, n-octadecyloxy. As R ^23a ~ R ^26a In the case of an unsubstituted alkylthio group, examples include n-butylthio, second butylthio, third butylthio, isobutylthio, n-pentylthio, isopentylthio, and Tripentylthio, n-hexylthio, n-heptylthio, isoheptylthio, third heptylthio, n-octylthio, isooctylthio, third octylthio, 2-ethylhexylthio, n- Nonylthio, n-decylthio, n-undecylthio, n-dodecylthio, n-tridecylthio, n-tetradecanylthio, n-pentadecanylthio, n-hexadecylthio , N-heptadecanylthio, n-octadecylthio. In R ^23a ~ R ^26a In the case of an alkoxy group or an alkylthio group substituted with an alicyclic hydrocarbon group, examples of the alicyclic hydrocarbon constituting the main skeleton of the alicyclic hydrocarbon group include cyclopropane, cyclobutane, cyclopentane, Cyclohexane, cycloheptane, cyclooctane, cyclodecane, bicyclo [2.1.1] hexane, bicyclo [2.2.1] heptane, bicyclo [3.2.1] octane, bicyclo [2.2.2] octane And adamantane. The alicyclic hydrocarbon group is preferably a group obtained by removing one hydrogen atom from these alicyclic hydrocarbons. In R ^23a ~ R ^26a In the case of a heterocyclic-substituted alkoxy or alkylthio group or R ^23a ~ R ^26a In the case of a heterocyclic oxy group, examples of the heterocyclic ring constituting the heterocyclic group or the main skeleton of the heterocyclic oxy group include pyrrole, thiophene, furan, pyran, thioan, imidazole, pyrazole, thiazole, Isothiazole, oxazole, isoxazole, pyridine, pyridine, pyrimidine, da &#134116;, pyrrolidine, pyrazidine, imidazole, isoxazoline, isothiazoline, piperidine, piperidine # 134116 ;, &#134156; morpholine, thio &#134156; phthaloline, benzodihydropiran, thiobenzodihydropiran, isobenzodihydropiran, isothiobenzodihydropiper Ran, indolin, isoindolin, 4-pyrindine, ind , Indole, indazole, purine, quinoline, isoquinoline, quinoline, naphthyridine, hydrazone, quinoline, quinazoline, oxoline, pyrimidine, acridine, pyridine , Phenanthroline, carbazole, carbophylline, phenanthrene, anthyridine, thiadiazole, oxadiazole, triazole, triazole, tetrazole, benzimidazole, benzopyrene Azole, benzothiazole, benzothiadiazole, Benzofuroxan, naphthoimidazole, benzotriazole, tetrazindene. Among these heterocycles, a saturated heterocycle in which a ring having a conjugate bond is hydrogenated is also preferred. As the heterocyclic group substituted for the alkoxy group or the alkylthio group, or the heterocyclic group contained in the heterocyclicoxy group, a group in which one hydrogen atom is removed from the heterocyclic ring is preferred. As R ^23a ~ R ^26a In the case of an alkoxy group containing an alicyclic hydrocarbon group, examples include cyclopentyloxy, methylcyclopentyloxy, cyclohexyloxy, fluorocyclohexyloxy, chlorocyclohexyloxy, and cyclohexyl Methoxy, methylcyclohexyloxy, oxo &#158665; oxy, ethylcyclohexyloxy, cyclohexylethoxy, dimethylcyclohexyloxy, methylcyclohexylmethoxy, oxo # 158665; methylmethoxy, trimethylcyclohexyloxy, 1-cyclohexylbutoxy, adamantyloxy, mentholoxy, n-butylcyclohexyloxy, third butylcyclohexyloxy, &#158665; oxy, iso &#158665; oxy, decahydronaphthyloxy, dicyclopentadienyloxy, 1-cyclohexylpentyloxy, methyladamantyloxy, adamantylmethoxy , 4-pentylcyclohexyloxy, cyclohexylcyclohexyloxy, adamantylethoxy, dimethyladamantyloxy. As R ^23a ~ R ^26a Examples of the case where it is a heterocyclooxy group include tetrahydrofuranoxy, furfuryloxy, tetrahydrofurfuryloxy, tetrahydropyranyloxy, butyrolactoneoxy, and indoxy. As R ^23a ~ R ^26a In the case of an alkylthio group containing an alicyclic hydrocarbon group, examples include cyclopentylthio group, cyclohexylthio group, cyclohexylmethylthio group, thio group, thio group, iso-lower group, and thio group. base. As R ^23a ~ R ^26a In the case of a heterocyclic thio group, examples thereof include a furfuryl group and a tetrahydrofuranthio group. As R ^23a ~ R ^26a Examples of the case where a methylene group at any position which is not adjacent to the oxygen atom of the alkoxy group is substituted with a -CO- group include 2-oxobutyl-1-oxy, 2-oxo Amyl-1-oxy, 2-oxohexyl-1-oxy, 2-oxoheptyl-1-oxy, 2-oxoctyl-1-oxy, 3-oxobutyl- 1-oxy, 4-oxopentyl-1-oxy, 5-oxohexyl-1-oxy, 6-oxoheptyl-1-oxy, 7-oxoctyl-1-ox Methyl, 3-methyl-2-oxopentane-4-oxy, 2-oxopentane-4-oxy, 2-methyl-2-oxopentane-4-oxy, 3- Oxoheptane-5-oxy, 2-adamantan-5-oxy. As R ^23a ~ R ^26a Examples of the case where the methylene group at any position not adjacent to the sulfur atom of the alkylthio group is substituted with a -CO- group include 2-oxobutyl-1-thio group and 2-oxo group Amyl-1-thio, 2-oxohexyl-1-thio, 2-oxoheptyl-1-thio, 2-oxoctyl-1-thio, 3-oxobutyl- 1-thio, 4-oxopentyl-1-thio, 5-oxohexyl-1-thio, 6-oxoheptyl-1-thio, 7-oxooctyl-1-thio Methyl, 3-methyl-2-oxopentane-4-thio, 2-oxopentane-4-thio, 2-methyl-2-oxopentane-4-thio, 3- Oxoheptane-5-thio. Preferred examples of the naphthalenedicarboxylic acid derivative represented by the formula (c-5) include the following compounds. [Chemical 75] [Chemical 76] [Chemical 77] [Chem. 78] [Chem. 79] [Chemical 80] [Chemical 81] [Chem 82] [Chemical 83] Examples of other photoacid generators include bis (p-toluenesulfonyl) diazomethane, methylsulfonyl p-toluenesulfonyldiazomethane, and 1-cyclohexylsulfonyl-1- (1 1,1-dimethylethylsulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, bis (1-methylethylsulfonyl) diazomethane , Bis (cyclohexylsulfonyl) diazomethane, bis (2,4-dimethylphenylsulfonyl) diazomethane, bis (4-ethylphenylsulfonyl) diazomethane, bis ( 3-methylphenylsulfonyl) diazomethane, bis (4-methoxyphenylsulfonyl) diazomethane, bis (4-fluorophenylsulfonyl) diazomethane, bis (4- Disulfonyldiazomethanes such as chlorophenylsulfonyl) diazomethane and bis (4-thirdbutylphenylsulfonyl) diazomethane; 2-methyl-2- (p-toluenesulfonyl) Phenyl) acetone, 2- (cyclohexylcarbonyl) -2- (p-toluenesulfonyl) propane, 2-methylsulfonyl-2-methyl- (p-methylthio) phenylacetone, 2,4-bis Sulfonylcarbonyl alkanes such as methyl-2- (p-toluenesulfonyl) pentane-3-one; 1-p-toluenesulfonyl-1-cyclohexylcarbonyldiazomethane, 1-diazo-1- Methanesulfonyl-4-phenyl-2-butanone, 1-cyclohexyl Sulfosulfanyl-1-cyclohexylcarbonyldiazomethane, 1-diazo-1-cyclohexylsulfonyl-3,3-dimethyl-2-butanone, 1-diazo-1- (1, 1-dimethylethylsulfonyl) -3,3-dimethyl-2-butanone, 1-ethylfluorenyl-1- (1-methylethylsulfonyl) diazomethane, 1- Diazo-1- (p-toluenesulfonyl) -3,3-dimethyl-2-butanone, 1-diazo-1-benzenesulfonyl-3,3-dimethyl-2-butanone 1-diazo-1- (p-toluenesulfonyl) -3-methyl-2-butanone, 2-diazo-2- (p-toluenesulfonyl) cyclohexyl acetate, 2-diazo- Tert-butyl 2-benzenesulfonylacetate, isopropyl 2-diazo-2-methanesulfonylacetate, cyclohexyl 2-diazol-2-benzenesulfonylacetate, 2-diazo-2 -(P-toluenesulfonyl) sulfonyl carbonyl diazomethanes such as tert-butyl acetate; p-toluenesulfonic acid-2-nitrobenzyl ester, p-toluenesulfonic acid-2,6-dinitrobenzyl ester, Nitrobenzyl derivatives such as p-trifluoromethylbenzenesulfonic acid-2,4-dinitrobenzyl ester; mesylate of catechol, benzenesulfonate of catechol, catechol P-toluenesulfonate, p-trisylbenzenesulfonate, pyrogallol mesyltoluenesulfonate, pyrogallol benzylsulfonate, gallic Methanesulfonate of alkyl acid ester, benzenesulfonate of alkyl gallate, p-toluenesulfonate of alkyl gallate, alkyl gallate (carbon atom of alkyl Polyhydroxy compounds such as p-methoxybenzene sulfonate, mesitylene sulfonate of alkyl gallate, benzyl sulfonate of alkyl gallate, etc. With aliphatic or aromatic sulfonic acid esters. These photoacid generators can be used alone or in combination of two or more. The photoacid generator may be used alone or in combination of two or more. The content of the photoacid generator is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.5% by mass or more and 3% by mass relative to the total mass of the photosensitive composition in the second aspect. %the following. By making the usage-amount of a photoacid generator into the said range, it is easy to prepare the photosensitive composition of the 2nd aspect which has a favorable sensitivity, a uniform solution, and the outstanding storage stability. There is no particular limitation on the resin that increases the solubility in alkali by the action of acid, and any resin that increases the solubility in alkali by the action of acid can be used. Among them, it is preferable to contain at least one resin selected from the group consisting of a novolac resin (B1), a polyhydroxystyrene resin (B2), and an acrylic resin (B3). [Novolak Resin (B1)] As the novolak resin (B1), a resin containing a structural unit represented by the following formula (b1) can be used. [Chemical 84] In the above formula (b1), R ^1b Represents an acid dissociation dissolution inhibitor, R ^2b , R ^3b Each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. As the above R ^1b The acid dissociation dissolution inhibiting group represented is preferably a group represented by the following formulae (b2) and (b3), a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms , Vinyloxyethyl, tetrahydropyranyl, tetrafuryl or trialkylsilyl. [Chemical 85] In the formulae (b2) and (b3), R ^4b , R ^5b Each independently represents a hydrogen atom or a linear or branched alkyl group having 1 to 6 carbon atoms, R ^6b Represents a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms, R ^7b It represents a linear, branched or cyclic alkyl group having 1 to 6 carbon atoms, and o represents 0 or 1. Examples of the linear or branched alkyl group include methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, third butyl, pentyl, isopentyl, and neo Amyl and others. Examples of the cyclic alkyl group include cyclopentyl and cyclohexyl. Here, specific examples of the acid dissociative dissolution inhibiting group represented by the formula (b2) include methoxyethyl, ethoxyethyl, n-propoxyethyl, isopropoxyethyl, and n- Butoxyethyl, isobutoxyethyl, tertiary butoxyethyl, cyclohexyloxyethyl, methoxypropyl, ethoxypropyl, 1-methoxy-1-methyl -Ethyl, 1-ethoxy-1-methylethyl, and the like. Specific examples of the acid-dissociative dissolution inhibiting group represented by the formula (b3) include a third butoxycarbonyl group and a third butoxycarbonylmethyl group. Further, examples of the trialkylsilyl group include those in which each alkyl group has a carbon number of 1 or more and 6 or less, such as a trimethylsilyl group and a tritert-butyldimethylsilyl group. [Polyhydroxystyrene resin (B2)] As the polyhydroxystyrene resin (B2), a resin containing a structural unit represented by the following formula (b4) can be used. [Chem. 86] In the above formula (b4), R ^8b Represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R ^9b Represents an acid dissociative dissolution inhibitor. The alkyl group having 1 to 6 carbon atoms is, for example, a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms. Examples of the linear or branched alkyl group include methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, third butyl, pentyl, isopentyl, and neopentyl. Examples of the cyclic alkyl group include cyclopentyl and cyclohexyl. As the above R ^9b As the acid-dissociative dissolution inhibiting group shown, the same acid-dissociative dissolution inhibiting groups as those exemplified in the formulae (b2) and (b3) can be used. Furthermore, the polyhydroxystyrene resin (B2) can contain other polymerizable compounds as structural units for the purpose of moderately controlling physical and chemical properties. Examples of such polymerizable compounds include known radical polymerizable compounds and anionic polymerizable compounds. Examples of such polymerizable compounds include monocarboxylic acids such as acrylic acid, methacrylic acid, and butenoic acid; dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; and succinic acid 2 -Methacrylic acid ethyl ester, maleic acid 2-methacrylic acid ethyl ester, 2-methacrylic acid ethyl phthalate, 2-methyl hexahydrophthalic acid Methacrylic acid derivatives with carboxyl and ester bonds, such as methacrylic acid ethyl ester; (meth) acrylic acid, such as methyl (meth) acrylate, ethyl (meth) acrylate, and butyl (meth) acrylate Alkyl esters; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and other hydroxyalkyl (meth) acrylates; phenyl (meth) acrylate, (meth) Aryl (meth) acrylates such as benzyl acrylate; dicarboxylic acid diesters such as diethyl maleate and dibutyl fumarate; styrene, α-methylstyrene, chlorine Vinyl-containing aromatic compounds such as styrene, chloromethylstyrene, vinyltoluene, hydroxystyrene, α-methylhydroxystyrene, α-ethylhydroxystyrene; acetic acid Aliphatic compounds containing vinyl groups such as alkenyl esters; conjugated dienes such as butadiene and isoprene; polymerizable compounds containing nitrile groups such as acrylonitrile and methacrylonitrile; vinyl chloride and vinylidene chloride Polymerizable compounds containing chlorine, such as ethylene; polymerizable compounds containing amidine bonds, such as acrylamide, methacrylamide; etc. [Acrylic resin (B3)] As the acrylic resin (B3), a resin containing a structural unit represented by the following formulae (b5) to (b7) can be used. [Chemical 87] In the formulae (b5) to (b7), R ^10b And R ^14b ~ R ^19b Each independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, a fluorine atom or a linear or branched fluorinated alkyl group having 1 to 6 carbon atoms , R ^11b ~ R ^13b Each independently represents a linear or branched alkyl group having 1 to 6 carbon atoms, a linear or branched fluorinated alkyl group having 1 to 6 carbon atoms or 5 or more carbon atoms And aliphatic cyclic group below 20, R ^12b And R ^13b Can be bonded to each other to form a hydrocarbon ring with 5 or more and 20 or less carbon atoms with the carbon atoms to which they are bonded, Y ^b Represents an aliphatic cyclic group or an alkyl group which may have a substituent, p represents an integer of 0 or more and 4 or less, and q represents 0 or 1. Examples of the linear or branched alkyl group include methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, third butyl, pentyl, and isopentyl. Base, neopentyl, etc. The fluorinated alkyl group refers to a group in which a part or all of hydrogen atoms of the alkyl group are substituted with fluorine atoms. Specific examples of the aliphatic cyclic group include a group obtained by removing one or more hydrogen atoms from a polycycloalkane such as a monocycloalkane, a bicycloalkane, a tricycloalkane, and a tetracycloalkane. Specific examples include monocycloalkanes or adamantane such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, norbornene, isocyclopentane, isocyclopentane, and tetracyclododecane. Polycycloalkanes such as alkanes remove one hydrogen atom. Particularly preferred is a group (which may further have a substituent) by removing one hydrogen atom from cyclohexane and adamantane. In the above R ^12b And R ^13b In the case where hydrocarbon rings are not bonded to each other, as R ^11b , R ^12b And R ^13b In terms of high contrast, good resolution, and depth of focus, a linear or branched alkyl group having 2 or more and 4 or less carbon atoms is preferred. As the above R ^15b , R ^16b , R ^18b , R ^19b Is preferably a hydrogen atom or a methyl group. Above R ^12b And R ^13b It can form an aliphatic cyclic group having 5 or more and 20 or less carbon atoms together with the carbon atoms to which they are bonded. Specific examples of such an aliphatic cyclic group include a group obtained by removing one or more hydrogen atoms from a polycycloalkane such as a monocycloalkane, a bicycloalkane, a tricycloalkane, and a tetracycloalkane. Specific examples include monocycloalkanes or adamantane such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, norbornene, isocyclopentane, isocyclopentane, tetracyclododecane Polycycloalkanes such as alkanes remove one or more hydrogen atom groups. Particularly preferred is a group (which may further have a substituent) for removing one or more hydrogen atoms from cyclohexane and adamantane. Furthermore, at the above R ^12b And R ^13b When the formed aliphatic ring is based on the case where there is a substituent on the ring skeleton, examples of the substituent include a polar group such as a hydroxyl group, a carboxyl group, a cyano group, and an oxygen atom (= O) or a carbon number of 1 A linear or branched alkyl group of 4 or more. The polar group is particularly preferably an oxygen atom (= O). Above Y ^b It is an aliphatic cyclic group or an alkyl group, and examples thereof include a group obtained by removing one or more hydrogen atoms from a polycycloalkane such as a monocycloalkane, a bicycloalkane, a tricycloalkane, and a tetracycloalkane. Specific examples include monocycloalkanes or adamantane such as cyclopentane, cyclohexane, cycloheptane, and cyclooctane, norbornene, isocyclopentane, isocyclopentane, and tetracyclododecane. Polycycloalkanes such as alkanes remove one or more groups of hydrogen atoms. Particularly preferred is a group (which may further have a substituent) for removing one or more hydrogen atoms from adamantane. Furthermore, in the above Y ^b When the aliphatic cyclic type is based on the case where there is a substituent on the ring skeleton, examples of the substituent include a polar group such as a hydroxyl group, a carboxyl group, a cyano group, an oxygen atom (= O), or 1 or more carbon atoms 4 or less linear or branched alkyl groups. The polar group is particularly preferably an oxygen atom (= O). Also, in Y ^b In the case of an alkyl group, a linear or branched alkyl group having 1 or more and 20 or less carbon atoms, and preferably 6 or more and 15 or less is preferable. Such an alkyl group is particularly preferably an alkoxyalkyl group. Examples of such an alkoxyalkyl group include 1-methoxyethyl, 1-ethoxyethyl, 1-n-propoxyethyl, 1-isopropoxyethyl, 1-n-butoxyethyl, 1-isobutoxyethyl, 1-third butoxyethyl, 1-methoxypropyl, 1-ethoxy Propyl, 1-methoxy-1-methyl-ethyl, 1-ethoxy-1-methylethyl, and the like. As a preferable specific example of the structural unit represented by the said formula (b5), the structural unit represented by the following formula (b5-1)-(b5-33) is mentioned. [Chem 88] In the formulae (b5-1) to (b5-33), R ^20b Represents a hydrogen atom or a methyl group. As a preferable specific example of the structural unit represented by the said formula (b6), the structural unit represented by the following formula (b6-1)-(b6-25) is mentioned. [Chem 89] In the formulae (b6-1) to (b6-25), R ^20b Represents a hydrogen atom or a methyl group. As a preferable specific example of the structural unit represented by the said formula (b7), the structural unit represented by the following formula (b7-1)-(b7-15) is mentioned. [Chemical 90] In the formulae (b7-1) to (b7-15), R ^20b Represents a hydrogen atom or a methyl group. Furthermore, the acrylic resin (B3) is preferably a resin containing a copolymer represented by the structural units represented by the formulae (b5) to (b7) and further containing a structural unit derived from a polymerizable compound having an ether bond. Examples of the polymerizable compound having an ether bond include radical polymerizable compounds such as a (meth) acrylic acid derivative having an ether bond and an ester bond, and specific examples include 2-methoxy (meth) acrylate Ethyl ester, 2-ethoxyethyl (meth) acrylate, methoxytriethylene glycol (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethyl (meth) acrylate Carbitol, phenoxy polyethylene glycol (meth) acrylate, methoxy polyethylene glycol (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, (meth) acrylic acid Tetrahydrofurfuryl ester, etc. The polymerizable compound having an ether bond is preferably 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, or methoxytriethylene (meth) acrylate. Alcohol ester. These polymerizable compounds may be used alone or in combination of two or more. Furthermore, the acrylic resin (B3) can contain other polymerizable compounds as structural units for the purpose of moderately controlling physical and chemical properties. Examples of such polymerizable compounds include known radical polymerizable compounds and anionic polymerizable compounds. Examples of such polymerizable compounds include: monocarboxylic acids such as acrylic acid, methacrylic acid, and butenoic acid; dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; 2-methacrylic acid Ethoxyethyl succinic acid, 2-methacryl ethoxyethyl maleic acid, 2-methacryl ethoxy ethyl phthalic acid, 2-methacryl ethoxy ethyl hexa Hydrophthalic acid and other methacrylic acid derivatives having a carboxyl group and an ester bond; methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate (Meth) acrylic acid alkyl esters such as esters; 2-hydroxyethyl (meth) acrylic acid, 2-hydroxypropyl (meth) acrylic acid (hydroxy) (meth) acrylic acid alkyl esters; (meth) acrylic acid Aryl (meth) acrylates such as phenyl esters and benzyl (meth) acrylates; dicarboxylic acid diesters such as diethyl maleate and dibutyl fumarate; styrene, α -Methylstyrene, chlorostyrene, chloromethylstyrene, vinyltoluene, hydroxystyrene, α-methylhydroxystyrene, α-ethylhydroxystyrene, etc. Compounds; vinyl-containing aliphatic compounds such as vinyl acetate; conjugated dienes such as butadiene and isoprene; polymerizable compounds containing nitrile groups such as acrylonitrile and methacrylonitrile; chlorine Chlorine-containing polymerizable compounds such as ethylene and vinylidene chloride; polymerizable compounds containing amidine bonds such as acrylamide and methacrylamide; and the like. Examples of the polymerizable compound include (meth) acrylic acid esters of aliphatic polycyclic groups having acid non-dissociation properties, and aromatic compounds containing vinyl groups. As the acid non-dissociable aliphatic polycyclic group, in terms of industrial availability, tricyclodecyl, adamantyl, tetracyclododecyl, iso &#158665; Drop &#158665; The aliphatic polycyclic group may have a linear or branched alkyl group having 1 to 5 carbon atoms as a substituent. Specific examples of the (meth) acrylic acid esters having an acid non-dissociable aliphatic polycyclic group include (meth) acrylic acid esters that provide structural units of the following formulae (b8-1) to (b8-5) class. [Chemical 91] In the formulae (b8-1) to (b8-5), R ^21b Represents a hydrogen atom or a methyl group. Among the photosensitive resins, an acrylic resin (B3) is preferably used. In this acrylic resin (B3), it is preferable to have a structural unit represented by the above formula (b5), a structural unit derived from (meth) acrylic acid, and a structural unit derived from an alkyl (meth) acrylate. And copolymers of structural units derived from aryl (meth) acrylates. As such a copolymer, a copolymer represented by the following formula (b9) is preferable. [Chemical 92] In the above formula (b9), R ^22b Represents a hydrogen atom or a methyl group, R ^23b Represents a linear or branched alkyl group having 2 or more and 4 or less carbon atoms, X ^b Represents a hydrocarbon ring having 5 or more and 20 or less carbon atoms formed with the carbon atom to which it is bonded, R ^24b Represents a linear or branched alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 1 to 6 carbon atoms, R ^25b Represents an aryl group having 6 to 12 carbon atoms. Furthermore, in the copolymer represented by the above formula (b9), s, t, u, and v represent the molar ratio of each structural unit, s is 8 mol% or more and 45 mol% or less, and t is 10 mol. % To 65 mol%, u is 3 mol% to 25 mol%, and v is 6 mol% to 25 mol%. The polystyrene equivalent mass average molecular weight of the photosensitive resin is preferably 10,000 or more and 600,000 or less, more preferably 20,000 or more and 400,000 or less, and still more preferably 30,000 or more and 300,000 or less. By setting such a mass average molecular weight, the sufficient strength of the photosensitive resin layer can be maintained without reducing the peelability from the substrate surface, and the occurrence of bulging or cracking of the contour during plating can be prevented. The photosensitive resin is preferably a resin having a degree of dispersion of 1.05 or more. Here, the degree of dispersion means a value obtained by dividing the mass average molecular weight by the number average molecular weight. By setting such a degree of dispersion, it is possible to avoid problems that the desired stress resistance to the plating cannot be obtained, or that the metal layer obtained by the plating treatment is easily bulged. The content of the resin is preferably 5 mass% or more and 60 mass% or less with respect to the total mass of the photosensitive composition in the second aspect. In the second aspect, the photosensitive composition preferably further contains an alkali-soluble resin in order to improve crack resistance. The alkali-soluble resin is preferably at least one resin selected from the group consisting of a novolac resin (C1), a polyhydroxystyrene resin (C2), and an acrylic resin (C3). [Novolak Resin (C1)] The novolak resin is obtained, for example, by addition-condensation of an aromatic compound having a phenolic hydroxyl group (hereinafter simply referred to as "phenols") and an aldehyde under an acid catalyst. Examples of the phenols include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, m-ethylphenol, p-ethylphenol, o-butylphenol, m-butylphenol, and p-butylphenol. Phenol, 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol , 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, p-phenylphenol, resorcinol, hydroquinone, hydroquinone monomethyl ether, catechol , Resorcinol, hydroxybiphenyl, bisphenol A, gallic acid, gallic acid ester, α-naphthol, β-naphthol and the like. Examples of the aldehydes include formaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. The catalyst used in the addition condensation reaction is not particularly limited. For example, hydrochloric acid, nitric acid, sulfuric acid, formic acid, oxalic acid, and acetic acid can be used in the acid catalyst. Furthermore, by using o-cresol, replacing the hydrogen atom of the hydroxyl group in the resin with other substituents, and using a large volume of aldehydes, the flexibility of the novolac resin can be further improved. The mass average molecular weight of the novolak resin (C1) is not particularly limited as long as it does not hinder the object of the present invention, and is preferably 1,000 or more and 50,000 or less. [Polyhydroxystyrene resin (C2)] Examples of the hydroxystyrene resin constituting the polyhydroxystyrene resin (C2) include p-hydroxystyrene, α-methylhydroxystyrene, and α-ethylhydroxystyrene. Wait. Furthermore, the polyhydroxystyrene resin (C2) is preferably a copolymer with a styrene resin. Examples of the styrene-based compound constituting such a styrene resin include styrene, chlorostyrene, chloromethylstyrene, vinyltoluene, and α-methylstyrene. The mass average molecular weight of the polyhydroxystyrene resin (C2) is not particularly limited as long as it does not hinder the object of the present invention, and is preferably 1,000 or more and 50,000 or less. [Acrylic resin (C3)] As the acrylic resin (C3), it is preferable to include a structural unit derived from a polymerizable compound having an ether bond and a structural unit derived from a polymerizable compound having a carboxyl group. Examples of the polymerizable compound having an ether bond include 2-methoxyethyl (meth) acrylate, methoxytriethylene glycol (meth) acrylate, and 3-methoxy (meth) acrylate. Butyl ester, ethyl carbitol (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, tetrahydrofurfuryl (meth) acrylate (Meth) acrylic acid derivatives having an ether bond and an ester bond. The polymerizable compound having an ether bond is preferably 2-methoxyethyl acrylate or methoxytriethylene glycol acrylate. These polymerizable compounds may be used alone or in combination of two or more. Examples of the polymerizable compound having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid, and butenoic acid; dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid; 2-methyl Acrylic ethoxyethyl succinic acid, 2-methacrylic ethoxyethyl maleic acid, 2-methacrylic ethoxy ethyl phthalic acid, 2-methacrylic ethoxy ethyl Compounds having a carboxyl group and an ester bond, such as hexahydrophthalic acid; etc. The polymerizable compound having a carboxyl group is preferably acrylic acid or methacrylic acid. These polymerizable compounds may be used alone or in combination of two or more. The mass average molecular weight of the acrylic resin (C3) is not particularly limited as long as it does not hinder the object of the present invention, and is preferably 50,000 or more and 800,000 or less. When the total content of the alkali-soluble resin is 100 parts by mass as the content of the alkali-soluble resin, it is preferably 0 parts by mass or more and 80 parts by mass, more preferably 0 parts by mass or more and 60 Mass parts or less. When the content of the alkali-soluble resin is in the above range, there is a tendency that the crack resistance can be improved and the film reduction during development can be prevented. As the second aspect of the photosensitive resin composition, in order to improve the storage stability and the like of a film containing the photosensitive composition, it is preferable to further contain an acid diffusion control agent. As the acid diffusion control agent, a nitrogen-containing compound (D1) is preferred, and if necessary, an carboxylic acid or a phosphoric acid or a derivative (D2) thereof may be contained. [Nitrogen-containing compound (D1)] Examples of the nitrogen-containing compound (D1) include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, tri-n-pentylamine, tribenzylamine, diethanolamine, Triethanolamine, n-hexylamine, n-heptylamine, n-octylamine, n-nonamine, ethylenediamine, N, N, N ', N'-tetramethylethylenediamine, tetramethylenediamine, hexamethylene Diamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone, 4,4'-diaminediamine Aniline, formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, propylamidine Amine, benzamidine, pyrrolidone, N-methylpyrrolidone, methylurea, 1,1-dimethylurea, 1,3-dimethylurea, 1,1,3,3,- Tetramethylurea, 1,3-diphenylurea, imidazole, benzimidazole, 4-methylimidazole, 8-hydroxyquinoline, acridine, purine, pyrrolidine, piperidine, 2,4,6-tri (2-pyridyl) -mesytris &#134116;,&#134156; line, 4-methyl &#134156; line, piper &#134116;, 1,4-dimethylpipe &#134116;, 1 , 4-diazabicyclo [2.2.2] octane, pyridine, etc. These can be used alone or in combination of two or more. The nitrogen-containing compound (D1) is usually used in the range of 0 parts by mass or more and 5 parts by mass or less based on 100 parts by mass of the total mass of the photosensitive resin and the alkali-soluble resin, and more preferably 0 parts by mass or more and 3 parts by mass Use within the range below. [Organic carboxylic acid or phosphorus oxo acid or its derivative (D2)] Among the organic carboxylic acid or phosphorus oxo acid or its derivative (D2), as the organic carboxylic acid, specifically, malonic acid and lemon are preferable. Acid, malic acid, succinic acid, benzoic acid, salicylic acid, etc., and particularly preferred is salicylic acid. Examples of phosphorous oxyacids or derivatives thereof include phosphoric acids such as phosphoric acid, di-n-butyl phosphate, diphenyl phosphate, and derivatives thereof; phosphonic acid, dimethyl phosphonic acid, and di-n-phosphonic acid Phosphonic acid such as butyl ester, phenylphosphonic acid, diphenyl phosphonic acid, dibenzyl phosphonic acid, and derivatives thereof, and derivatives thereof; phosphinic acid such as phosphinic acid, phenylphosphinic acid, and derivatives thereof Derivatives of the kind; etc. Among these, phosphonic acid is particularly preferred. These can be used alone or in combination of two or more. The organic carboxylic acid or phosphorus oxyacid or its derivative (D2) is usually used in an amount of 0 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of the total mass of the photosensitive resin and the alkali-soluble resin. It is preferably used in a range of 0 parts by mass or more and 3 parts by mass or less. In order to form and stabilize a salt, it is preferable to use the same amount of the organic carboxylic acid or phosphorus oxyacid or its derivative (D2) as the nitrogen-containing compound (D1). The photosensitive composition of a 2nd aspect contains an organic solvent. The type of the organic solvent is not particularly limited as long as it does not hinder the object of the present invention, and it can be appropriately selected and used from the organic solvents previously used in the positive photosensitive resin composition. Specific examples of the organic solvent include, in addition to the solvents listed in the photosensitive composition of the first aspect, acetone, methyl ethyl ketone, cyclohexanone, methyl isopentanone, 2-heptanone, and the like. Ketones; monomethyl ether of ethylene glycol, ethylene glycol monoacetate, diethylene glycol, diethylene glycol monoacetate, propylene glycol, propylene glycol monoacetate, dipropylene glycol, dipropylene glycol monoacetate , Monoethyl ether, monopropyl ether, monobutyl ether, monophenyl ether and other polyols and their derivatives; cyclic ethers such as dioxane; ethyl formate, methyl lactate, ethyl lactate, methyl acetate, acetic acid Ethyl acetate, butyl acetate, methyl pyruvate, methyl acetate, ethyl acetate, ethyl pyruvate, ethyl ethoxyacetate, methyl methoxypropionate, ethyl ethoxypropionate Ester, methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, methyl 2-hydroxy-3-methylbutyrate, 3-methoxybutyrate Esters such as methyl acetate, 3-methyl-3-methoxybutyl acetate; aromatic hydrocarbons such as toluene and xylene; etc. These can be used alone or in combination of two or more. The content of the organic solvent is not particularly limited as long as it does not hinder the object of the present invention. When the photosensitive composition is used for a thick film application in which the film thickness of the photosensitive resin layer obtained by a spin coating method or the like is 10 μm or more, it is preferably at the solid component concentration of the photosensitive resin composition. An organic solvent is used in the range of 30 mass% or more and 55 mass% or less. In the second aspect, the photosensitive composition may further contain a polyethylene-based resin in order to improve plasticity. Specific examples of the polyvinyl resin include polyvinyl chloride, polystyrene, polyhydroxystyrene, polyvinyl acetate, polyvinyl benzoic acid, polyvinyl methyl ether, polyvinyl ether, and polyvinyl alcohol. , Polyvinylpyrrolidone, polyvinylphenol and copolymers thereof. As a polyvinyl resin, since a glass transition point is low, polyvinyl methyl ether is preferable. Moreover, as a photosensitive composition of a 2nd aspect, in order to improve the adhesiveness of the hydrogen barrier film formed with the photosensitive composition, and a board | substrate, especially a metal board | substrate, you may further contain a bonding aid. In addition, as the second aspect of the photosensitive composition, a surfactant may be further contained in order to improve coating properties, defoaming properties, leveling properties, and the like. Specific examples of the surfactant include BM-1000, BM-1100 (both manufactured by BM CHEMIE), MEGAFAC F142D, MEGAFAC F172, MEGAFAC F173, and MEGAFAC F183 (both manufactured by Dainippon Ink Chemical Industry Co., Ltd.), Fluorad FC-135, Fluorad FC-170C, Fluorad FC-430, Fluorad FC-431 (all manufactured by Sumitomo 3M), Surflon S-112, Surflon S-113, Surflon S-131, Surflon S-141, Surflon S -145 (all manufactured by Asahi Glass Co., Ltd.), SH-28PA, SH-190, SH-193, SZ-6032, SF-8428 (all manufactured by Toray silicone) and other commercially available fluorine-based surfactants, but not limited Wait for it. The second photosensitive composition may further contain an acid, an acid anhydride, or a high-boiling point solvent in order to finely adjust the solubility of the developer. Specific examples of the acid and the acid anhydride include monocarboxylic acids such as acetic acid, propionic acid, n-butyric acid, isobutyric acid, n-valeric acid, isovaleric acid, benzoic acid, and cinnamic acid; lactic acid, 2-hydroxybutyric acid, 3-hydroxybutyric acid, salicylic acid, m-hydroxybenzoic acid, p-hydroxybenzoic acid, 2-hydroxycinnamic acid, 3-hydroxycinnamic acid, 4-hydroxycinnamic acid, 5-hydroxyisophthalic acid, syringic acid Isohydroxy monocarboxylic acids; oxalic acid, succinic acid, glutaric acid, adipic acid, maleic acid, itaconic acid, hexahydrophthalic acid, phthalic acid, isophthalic acid, terephthalic acid Formic acid, 1,2-cyclohexanedicarboxylic acid, 1,2-4-cyclohexanetricarboxylic acid, butanetetracarboxylic acid, trimellitic acid, pyromellitic acid, cyclopentanetetracarboxylic acid, butane Polycarboxylic acids such as alkanetetracarboxylic acid, 1,2,5,8-naphthalenetetracarboxylic acid; Iconic anhydride, succinic anhydride, methyl maleic anhydride, dodecenyl succinic anhydride, triphenylamine anhydride, cis Butadiene anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, dicycloheptenedicarboxylic anhydride, 1,2,3,4-butanetetracarboxylic anhydride, cyclopentanetetracarboxylic acid Dianhydride, phthalic acid Pyromellitic anhydride, trimellitic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bis dehydration trimellitate, glycerol tris dehydration trimellitate anhydride and the like; and the like. Specific examples of the high-boiling-point solvent include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamidamine, N-methylpyrrolidone, dimethyl sulfene, benzyl ether, dihexyl ether, acetone acetone, isophorone, hexanoic acid, caprylic acid, 1-octanol, 1 -Nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl acetate Fiber agent and so on. As the second aspect, the photosensitive composition may further include a sensitizer in order to increase sensitivity. The content of the hydrogen barrier agent (B) is preferably 0.01 mass% or more and 30 mass% or less with respect to the mass of the resin equivalent to the substrate component (A) in the photosensitive composition of the second aspect, and more preferably 0.05% by mass or more and 20% by mass or less, particularly preferably 0.1% by mass or more and 10% by mass or less. By setting it as the said range, a favorable developability can be obtained and the pattern which has hydrogen barrier performance can be obtained. (3) Photosensitive composition of the third aspect The photosensitive composition of the third aspect contains an alkali-soluble resin having a phenolic hydroxyl group, an acid-crosslinkable substance, a photoacid generator, a hydrogen barrier agent (B), and An organic solvent-based negative photosensitive composition. As the alkali-soluble resin having a phenolic hydroxyl group in the photosensitive composition of the third aspect, for example, a polyhydroxystyrene resin can be used. The polyhydroxystyrene resin has at least a structural unit derived from hydroxystyrene. Here, the "hydroxystyrene" refers to a group including a hydroxystyrene and a hydrogen atom bonded to the α-position of the hydroxystyrene and substituted with a halogen atom, an alkyl group, a halogenated alkyl group and other substituents, and the like. Derivative concept of hydroxystyrene derivative (monomer). "Hydroxystyrene derivative" maintains at least a benzene ring and a hydroxyl group bonded thereto, for example, a hydrogen atom bonded to the α-position of hydroxystyrene is substituted with a halogen atom, and an alkyl group having 1 to 5 carbon atoms And other substituents such as halogenated alkyl groups, and those having an alkyl group having 1 to 5 carbon atoms bonded to a benzene ring bonded to a hydroxyl group of hydroxystyrene, or a benzene bonded to the hydroxyl group One or more and two or less hydroxyl groups are further bonded to the ring (in this case, the total number of hydroxyl groups is 2 or more and 3 or less) and the like. Examples of the halogen atom include a chlorine atom, a fluorine atom, and a bromine atom. A fluorine atom is preferred. In addition, the "alpha position of hydroxystyrene" means a carbon atom to which a benzene ring is bonded unless otherwise specified. The structural unit derived from hydroxystyrene is represented by the following formula (b-1), for example. [Chemical 93] In the above formula (b-1), R ^b1 Represents a hydrogen atom, an alkyl group, a halogen atom or a halogenated alkyl group, R ^b2 Represents an alkyl group having 1 or more and 5 or less carbon atoms, p represents an integer of 1 or more and 3 or less, and q represents an integer of 0 or more and 2 or less. R ^b1 The alkyl group is preferably from 1 to 5 carbon atoms. Moreover, a linear or branched alkyl group is preferable, and examples thereof include methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, third butyl, pentyl, and isopentyl. Base, neopentyl, etc. Among these, methyl is industrially preferable. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is preferred. The halogenated alkyl group is a group in which a part or all of the hydrogen atoms of the alkyl group having 1 to 5 carbon atoms are substituted with a halogen atom. Among these, an alkyl group in which all hydrogen atoms are replaced with fluorine atoms is preferred. Further, a linear or branched fluorinated alkyl group is preferred, trifluoromethyl, hexafluoroethyl, heptafluoropropyl, nonafluorobutyl, and the like are more preferred, and trifluoromethyl ( -CF ₃ ). As R ^b1 Is preferably a hydrogen atom or a methyl group, and more preferably a hydrogen atom. As R ^b2 Examples of the alkyl group having 1 to 5 carbon atoms include R and R. ^b1 The situation is the same. q is an integer of 0 or more and 2 or less. Among these, 0 or 1 is preferable, and 0 is industrially preferable. As R ^b2 The substitution position can be any of the adjacent, meta, and para positions when q is 1, and can be combined with any substitution position when q is 2. p is an integer of 1 or more and 3 or less, and 1 is preferable. As the substitution position of the hydroxyl group, when p is 1, it may be any of the ortho, meta, and para positions. In terms of easy availability and low price, para positions are preferred. Furthermore, when p is 2 or 3, arbitrary substitution positions can be combined. The structural unit represented by the formula (b-1) may be used alone or in combination of two or more kinds. In the polyhydroxystyrene resin, the ratio of the structural units derived from the hydroxystyrene is preferably 60 mol% or more and 100 mol% or less, and more preferably 70 mol% or more and 100 mol% or less, and more preferably 80 mol% or more and 100 mol% or less. By setting it as the said range, moderate alkali solubility can be obtained when it is set as a photosensitive composition. The polyhydroxystyrene resin preferably has a structural unit derived from styrene. Here, the "structural unit derived from styrene" is defined as a structural unit including styrene and a styrene derivative (which does not include hydroxystyrene) by breaking an ethylenic double bond. The definition of "styrene derivative" is a derivative in which a hydrogen atom contained in the α-position bond of styrene is substituted with a halogen atom, an alkyl group, a halogenated alkyl group and other substituents, and a hydrogen atom of a phenyl group of styrene Derivatives and the like substituted with a substituent such as an alkyl group having 1 to 5 carbon atoms. Examples of the halogen atom include a chlorine atom, a fluorine atom, and a bromine atom. A fluorine atom is preferred. In addition, the so-called "alpha position of styrene" refers to a carbon atom to which a benzene ring is bonded unless otherwise specified. The structural unit derived from styrene is represented by the following formula (b-2), for example. Where R ^b1 , R ^b2 And q have the same meanings as in the above formula (b-1). [Chemical 94] As R ^b1 And R ^b2 Can be exemplified by R and the above formula (b-1) ^b1 And R ^b2 The same foundation. q is an integer of 0 or more and 2 or less. Among these, 0 or 1 is preferable, and industrially, 0 is more preferable. As R ^b2 The substitution position can be any of the adjacent, meta, and para positions when q is 1, and can be combined with any substitution position when q is 2. The structural unit represented by the formula (b-2) may be used alone or in combination of two or more kinds. In the polyhydroxystyrene resin, the ratio of the structural units derived from styrene is preferably 40 mol% or less, more preferably 30 mol% or less, relative to the total structural units constituting the polyhydroxystyrene resin. It is preferably 20 mol% or less. By setting it as the said range, moderate alkali solubility can be obtained when it is set as a photosensitive composition, and the balance with another structural unit is also favorable. The polyhydroxystyrene resin may have structural units derived from hydroxystyrene or structural units other than structural units derived from styrene. More preferably, the polyhydroxystyrene resin is a polymer containing only structural units derived from hydroxystyrene, or a copolymer containing structural units derived from hydroxystyrene and structural units derived from styrene. The mass average molecular weight of the polyhydroxystyrene resin is not particularly limited, but is preferably 1,500 or more and 40,000 or less, and more preferably 2,000 or more and 8,000 or less. Also, as the alkali-soluble resin having a phenolic hydroxyl group, a novolak resin may be used. The novolak resin can be obtained by addition condensation of phenols and aldehydes in the presence of an acid catalyst. Examples of the phenols include cresols such as phenol, o-cresol, m-cresol, and p-cresol; 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2 Dimethylphenols such as 1,6-xylenol, 3,4-xylenol, 3,5-xylenol; o-ethylphenol, m-ethylphenol, p-ethylphenol, 2-isopropylphenol, Alkyl phenols such as 3-isopropylphenol, 4-isopropylphenol, o-butylphenol, m-butylphenol, p-butylphenol, and p-thirdbutylphenol; 2,3,5-trimethyl Trialkylphenols such as phenol and 3,4,5-trimethylphenol; resorcinol, catechol, hydroquinone, hydroquinone monomethyl ether, catechol, resorcinol Polyphenols such as phenols; alkyl polyphenols such as alkyl resorcinol, alkyl catechol and alkyl hydroquinone (the number of carbon atoms of alkyl groups in alkyl polyphenols is 1 Above and below 4); α-naphthol, β-naphthol, hydroxybiphenyl, bisphenol A, and the like. These phenols can be used alone or in combination of two or more. Among these phenols, m-cresol and p-cresol are preferred, and m-cresol and p-cresol are used in combination. In this case, by adjusting the blending ratio of the two, various characteristics such as sensitivity can be adjusted. Examples of the aldehydes include formaldehyde, paraformaldehyde, furfural, benzaldehyde, nitrobenzaldehyde, and acetaldehyde. These aldehydes can be used alone or in combination of two or more. Examples of the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, and phosphorous acid; organic acids such as formic acid, oxalic acid, acetic acid, diethyl sulfuric acid, and p-toluenesulfonic acid; and metal salts such as zinc acetate. These acid catalysts can be used alone or in combination of two or more. Specific examples of the novolak resin thus obtained include phenol / formaldehyde condensation novolac resin, cresol / formaldehyde condensation novolac resin, phenol-naphthol / formaldehyde condensation novolac resin, and the like. The mass average molecular weight of the novolak resin is not particularly limited, but is preferably 1,000 or more and 30,000 or less, and more preferably 3,000 or more and 25,000 or less. In addition, as the alkali-soluble resin having a phenolic hydroxyl group, a phenol-xylylene glycol condensation resin, a cresol-xylylene glycol condensation resin, a phenol-dicyclopentadiene condensation resin, and the like can also be used. The content of the alkali-soluble resin having a phenolic hydroxyl group is preferably 20% by mass or more and 80% by mass or less, more preferably 35% by mass or more and 65% by mass or less relative to the solid content of the photosensitive composition in the third aspect. the following. By setting it as the said range, there exists a tendency for the balance of developability to be easily acquired. The acid-crosslinkable substance in the third aspect of the photosensitive composition is not particularly limited, and a conventionally known acid-crosslinkable substance can be used. Specific examples of the acid-crosslinkable substance include amine-based resins having a hydroxyl group or an alkoxy group, and examples thereof include melamine resin, urea resin, guanamine resin, ethylguanidine &#134116; resin, benzoguanamine resin, glycine Urea-formaldehyde resin, succinamide-formaldehyde resin, ethenyl urea-formaldehyde resin, etc. These acid-crosslinkable substances can be easily obtained by making melamine, guanamine, ethylguanidine, benzoguanamine, glycoluril, succinamide, and ethymidine in boiling water with formalin. It is methylolated by reaction, or it is further alkoxylated by reaction with a lower alcohol. In practice, it can be obtained as melamine resins such as NIKALAC MX-750, NIKALAC MW-30, and NIKALAC MW100LM, and urea resins such as NIKALAC MX-290 (all manufactured by Sanwa Chemical Co., Ltd.). Benzoguanamine resins such as Cymel 1123 and Cymel 1128 (manufactured by Mitsui Cyanamid) can also be obtained as commercially available products. It is also possible to use 1,3,5-tris (methoxymethoxy) benzene, 1,2,4-tris (isopropoxymethoxy) benzene, 1,4-bis (second butoxy) A benzene compound having an alkoxy group such as methylmethoxy) benzene, a phenol compound having a hydroxyl group or an alkoxy group, such as 2,6-dihydroxymethyl-p-tert-butylphenol, and the like. These acid-crosslinkable substances can be used alone or in combination of two or more. The content of the acid-crosslinkable substance is preferably 5 parts by mass or more and 50 parts by mass or less, more preferably 10 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the alkali-soluble resin having a phenolic hydroxyl group. By setting it as the said range, the curability and patterning characteristic of a photosensitive composition become favorable. The photoacid generator in the third aspect of the photosensitive composition is not particularly limited, and a conventionally known photoacid generator can be used. As a preferable photo-acid generator, the photo-acid generator demonstrated with respect to the 2nd photosensitive composition is mentioned. The content of the photoacid generator is preferably from 0.05 parts by mass to 30 parts by mass with respect to 100 parts by mass of the alkali-soluble resin having a phenolic hydroxyl group, and more preferably from 0.1 to 10 parts by mass. By setting it as the said range, the curability of a photosensitive composition becomes favorable. The third aspect of the photosensitive composition contains a hydrogen barrier agent (B) as described above. When the compound is contained in the photosensitive composition, a pattern having hydrogen barrier properties can be formed. The content of the hydrogen barrier agent (B) is preferably 0.01 mass% or more and 30 mass% or less with respect to the mass of the resin equivalent to the substrate component (A) in the photosensitive composition of the third aspect, and more preferably 0.05% by mass or more and 20% by mass or less, particularly preferably 0.1% by mass or more and 10% by mass or less. By setting it as the said range, a favorable developability can be obtained and the pattern which has hydrogen barrier performance can be obtained. The third aspect of the photosensitive composition may further contain a compound having a molecular weight of less than 2000 having four or more phenolic hydroxyl groups. As such a compound, specifically, in addition to various benzophenone compounds such as tetrahydroxybenzophenone, pentahydroxybenzophenone, hexahydroxybenzophenone, and heptahydroxybenzophenone, there are also listed: Bis [2-hydroxy-3- (2'-hydroxy-5'-methylbenzyl) -5-methylphenyl] methane, bis (4-hydroxy-3,5-dimethylphenyl) -3 , 4-Dihydroxyphenylmethane, bis (4-hydroxy-2,5-dimethylphenyl) -3,4-dihydroxyphenylmethane, bis (4-hydroxy-3,5-dimethylbenzene Phenyl) -2,4-dihydroxyphenylmethane, bis (4-hydroxy-2,5-dimethylphenyl) -2,4-dihydroxyphenylmethane, bis (3-cyclohexyl-4-hydroxyl -6-methylphenyl) -3,4-dihydroxyphenylmethane, bis (3-cyclohexyl-6-hydroxy-4-methylphenyl) -3,4-dihydroxyphenylmethane, bis ( 4-hydroxy-2,3,5-trimethylphenyl) -3,4-dihydroxyphenylmethane and other hydroxyaryl compounds; 2- (2,3,4-trihydroxyphenyl) -2- Bis (hydroxybenzene) such as (2 ', 3', 4'-trihydroxyphenyl) propane, 2- (2,4-dihydroxyphenyl) -2- (2 ', 4'-dihydroxyphenyl) propane Alkane-based compounds; poly (o-hydroxystyrene), poly (m-hydroxystyrene), poly (p-hydroxystyrene), poly (α-methyl) P-hydroxystyrene), poly (4-hydroxy-3-methyl styrene) styrene polyhydroxy compound; and the like. The benzophenone-based compound, hydroxyaryl-based compound, bis (hydroxyphenyl) alkane-based compound, and polyhydroxystyrene-based compound may have a substituent other than a hydroxyl group. These compounds may be used alone or in combination of two or more. The content of the compound having 4 or more phenolic hydroxyl groups and having a molecular weight of less than 2000 is preferably 0.5 to 5 parts by mass based on 100 parts by mass of the alkali-soluble resin having phenolic hydroxyl groups. By setting it as the said range, it becomes possible to suppress the front-end thinning phenomenon at the time of patterning a photosensitive composition. Examples of the organic solvent in the photosensitive composition in the third aspect include the organic solvents exemplified in the photosensitive composition in the first aspect. The content of the organic solvent is preferably an amount such that the solid component concentration of the third aspect of the photosensitive composition is 1% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 30% by mass or less. . The photosensitive composition in the third aspect may contain the various additives described above, as necessary, in the same manner as the photosensitive composition in the first aspect. (4) Photosensitive composition of the fourth aspect The photosensitive composition of the fourth aspect contains a photosensitive polyimide precursor, a photopolymerizable compound, a photopolymerization initiator, a hydrogen barrier agent (B), and An organic solvent-based negative photosensitive composition. As the photosensitive polyfluorene imide precursor in the fourth aspect of the photosensitive composition, for example, a structural unit represented by the following formula (d-1) can be used, and an acid functional group and a photosensitive group can be used in the molecule. The resin. [Chem 95] In the above formula (d-1), X ^d Indicates link with X ^d The two fluorenamine groups bonded to each other do not contain a tetravalent organic group having an atom having an unshared electron pair, Y ^d Indicates link with Y ^d The two fluorenamine groups bonded to each other do not contain a divalent organic group having an atom that does not share an electron pair. R ^d1 And R ^d2 Each independently represents a hydroxyl group or a monovalent organic group. In X ^d And Y ^d In the definition, "a skeleton linking two amido groups" refers to a skeleton containing only atoms constituting a chain linking two amido bonds. Therefore, a hydrogen atom, a fluorine atom, etc. exist as a terminal, and the atom of the chain which does not bond the two amido bond is not included in the said "skeleton." However, when the skeleton contains atoms constituting a ring (aromatic ring or aliphatic ring), it is defined that all the atoms constituting the ring are included in the aforementioned "skeleton". For example, when the chain connecting two amine bonds includes a benzene ring or a cyclohexyl ring, the 6 carbon atoms constituting the benzene ring or the cyclohexyl ring itself are included in the above-mentioned "backbone". Furthermore, substituents or hydrogen atoms bonded to a benzene ring or a cyclohexyl ring are not included in the "backbone" herein. Therefore, when there is a carbonyl bond on the skeleton, the atoms constituting the chain linking the two amido groups are only the carbon atoms in the carbonyl group, so the oxygen atoms in the carbonyl group do not constitute the "skeleton". In addition, with respect to a 2,2-propylene bond or a hexafluoro-2,2-propylene bond, only carbon atoms existing at the center (position 2) constitute a skeleton, and carbon atoms at both ends (position 1 or 3) Does not constitute the "skeleton" described above. Examples of the "atom having an unshared electron pair" include an oxygen atom, a nitrogen atom, and a sulfur atom. On the other hand, as the "atom having no unshared electron pair", a carbon atom and a silicon atom are listed. Wait. In photosensitive polyimide precursors, if X ^d As described above, since an atom having an unshared electron pair is not included in the skeleton, it is preferable that the swelling during alkali development is less. For the same reason, Y ^d It is also preferable that an atom having an unshared electron pair is not contained in the skeleton. In addition, in the case of the photosensitive polyfluorene imide precursor, if it is Y instead of Y in the structural unit, ^d Part of it has Y containing silicon atoms ^d2 For example, those containing a siloxane bond are preferred because they can provide higher substrate adhesion. In this case, the ratio is preferably 1 mol% or more and 20 mol% or less in all the diamine residues forming the photosensitive polyfluorene imide precursor. As X in the above formula (d-1) ^d And Y ^d Examples include an alkyl group, a cycloalkyl group having 4 or more and 20 carbon atoms, or an aromatic ring such as a benzene ring or a naphthalene ring having 6 or more and 20 carbon atoms. Single bonds, alkylene groups, fluorinated alkylene groups, carbonyl groups and the like are preferred. In addition, it is equivalent to having a substituent such as a hydrocarbon group, a halogenated hydrocarbon group, or a halogen atom on the aromatic ring. Furthermore, these X ^d And Y ^d Among them, if the atom directly bonded to the atom constituting the above-mentioned skeleton is also an "atom having no unshared electron pair", the effect is higher, and therefore it is better. In addition, the definition does not include those in which an oxygen atom is directly bonded to a carbon atom constituting a skeleton like a carbonyl group, or a fluorine atom is bonded to a carbon atom constituting a skeleton. Further, X ^d And Y ^d Preferably, it does not contain a fluorine atom. The acid functional group contained in the molecule of the photosensitive polyfluorene imide precursor is preferably a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, or the like, and among these, a carboxyl group is preferred. The photosensitive group is preferably a vinyl group, an allyl group, an allyl group, a methacryl group, a methacryl group, a methacryl group, or a methacryl group containing an ethylenically unsaturated bond, and more preferably Acrylic fluorenyl, methacryl fluorenyl, propylene fluorenyl oxy, methacryl fluorenyl oxy. In the photosensitive polyfluorene imide precursor, the acid functional group is preferably R as the structural unit of the formula (d-1). ^d1 Or make R ^d1 Existing as a hydroxyl group (ie, forming a carboxyl group), or ^d Present in the indicated diamine residue. The photosensitive group is preferably R in the formula (d-1). ^d1 Or R ^d2 The indicated side chain or Y ^d The indicated diamine residue exists as a group bonded to an aromatic ring of a diamine residue having an aromatic ring, for example. In R ^d1 And R ^d2 Here, as the monovalent organic group having a photosensitive group, one represented by the following formula can be mentioned. [Chem 96] In the above formula, R ^d3 And R ^d4 Each independently represents a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R ^d5 A divalent hydrocarbon group having 1 to 10 carbon atoms, R ^d6 Represents a hydrogen atom or a methyl group. Again, in R ^d1 And R ^d2 In the above, examples of the monovalent organic group having no photosensitive group include an alkoxy group or an alkylamino group having 1 to 15 carbon atoms. The photosensitive polyfluorene imide precursor is preferably one having the structural unit represented by the above-mentioned formula (d-1) of 50 mol% or more and 100 mol% or less, and more preferably only having the above-mentioned formula (d- 1) the structural unit represented by the formula (d-1) and the structural unit represented by the formula (d-1) and Y in the formula (d-1) ^d A structural unit containing a divalent organic group containing a silicon atom. The photosensitive polyfluorene imide precursor can be obtained using tetracarboxylic dianhydride, diamine, and a compound having a photosensitive group as materials, and various known manufacturing methods can be applied. As tetracarboxylic dianhydride, as X ^d Examples thereof include pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 2,3, 6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 3,4,9,10-fluorenetetracarboxylic dianhydride, m-triphenyl-3,3 ', 4,4'-tetracarboxylic dianhydride, p-triphenyl-3,3', 4,4'-tetracarboxylic dianhydride, 4,4'-hexafluoroisopropylidene diphthalic acid Dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, etc. These tetracarboxylic dianhydrides can be used alone or in combination of two or more kinds. Provided as Y ^d Examples of the diamine include 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2, 2 ', 6,6'-tetramethyl-4,4'-diaminobiphenyl, 3,3', 5,5'-tetramethyl-4,4'-diaminobiphenyl, 4, 4 '-(or 3,4-, 3,3'-, 2,4-, 2,2'-) diaminodiphenylmethane, p-xylylenediamine, m-xylylenediamine, 4,4 '-Methylene-bis- (2,6-diethylaniline), 4,4'-methylene-bis- (2,6-diisopropylaniline), 1,5, -diamine group Naphthalene, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, 3,3 ', 5,5'-tetramethyl-4,4'-diaminodiphenylmethane , 2,2-bis (4-aminophenyl) propane, 2,2'-hexafluorodimethyl-4,4'-diaminobiphenyl, 3,3'-hexafluorodimethyl-4 4,4'-diaminobiphenyl, 4,4'-hexafluoroisopropylidene diphenylamine, 1,1,1,3,3,3-hexafluoro-2,2-bis (4-aminobenzene Group) propane, 2,3,5,6-tetramethyl-1,4-phenylenediamine, 2,5-dimethyl-1,4-phenylenediamine, 2,4-diaminotoluene, 2 2,6-diaminotoluene, 2,4,6-trimethyl-1,3-phenylenediamine, 2,7-diaminofluorene, 4,4-diaminooctafluorobiphenyl and 2,2 -Hexafluorodimethyl-4,4'-diaminobiphenyl and the like are preferred. These diamines can be used alone or in combination of two or more. Also, Y ^d If the amine-linked skeleton does not contain a bifunctional amine having an atom that does not share an electron pair, it may have at least one phenolic hydroxyl or carboxyl group as an acid functional group. Examples include: 2,5-diaminobenzoic acid, 3,4-diaminobenzoic acid, 3,5-diaminobenzoic acid, 2,5-diaminoterephthalic acid, bis (4- Amino-3-carboxyphenyl) methylene, 4,4'-diamino-3,3'-dicarboxybiphenyl, 4,4'-diamino-5,5'-dicarboxy-2 2,2'-dimethylbiphenyl, 1,3-diamino-4-hydroxybenzene, 1,3-diamino-5-hydroxybenzene, 3,3'-diamino-4,4'- Dihydroxybiphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, bis (3-amino-4-hydroxyphenyl) hexafluoropropane, bis (4-amino-3- Hydroxyphenyl) hexafluoropropane, bis (4-amino-3-carboxyphenyl) methane, 4,4'-diamino-2,2'-dicarboxybiphenyl, and the like are preferred examples. These can be used alone or in combination with two or more diamines. Furthermore, as a Y-containing silicon atom, ^2d Examples of the diamine include aliphatic diamines such as a diamine polysiloxane represented by the following formula (d-2). [Chem 97] In the formula (d-2), s, t, and u each independently represent an integer of 1 to 10. In the case of using the aliphatic diamine, in terms of less swelling during development and heat resistance of the formed film, it is preferable that the blending amount thereof is 20 mol% or less in the total diamine. In order to prepare a polyimide precursor having a photosensitive group, for example, a compound having an ethylenically unsaturated bond and an amine group or a quaternary salt thereof is prepared as a carboxyl group and a polyamino acid. Method for preparing polyimide precursors in the form of partial ionic bonding of amine groups or the bases of their quaternary salts, a method of introducing ethylenically unsaturated bonds to side chains via covalent bonds such as ester bonds and fluorene amine bonds Wait. Among these, a photosensitive polyfluorene imide precursor (polyamidate) in the form of an ethylenically unsaturated bond introduced by an ester bond is particularly suitable for alkali development. When an ethylenically unsaturated bond is introduced by an ester bond, the amount of the compound having an ethylenically unsaturated bond to be introduced is preferably in consideration of alkali solubility, hardenability, heat resistance, and reactivity. With respect to the total amount of the carboxyl groups of the polyamic acid being 85 mol% or more and 25 mol% or less, the remainder is still a carboxyl group (that is, a polyamic acid partial ester). Examples of the compound in which an ethylenically unsaturated bond is introduced through an ester bond include 2-hydroxyethyl acrylate, 3-hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, pentaerythritol diacrylate monostearate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, caprolactone 2- (methacrylic acid) ) Ethyl ester, 2-caprolactone 2- (methacryloxy) ethyl, caprolactone 2- (propylene-propoxy) ethyl, dicaprolactone 2- (propylene-propoxy) ethyl, etc. . The mass average molecular weight of the photosensitive polyfluorene imide precursor is preferably 5,000 or more and 80,000 or less. The content of the photosensitive polyfluorene imide precursor is preferably 40% by mass or more and 95% by mass or less, more preferably 55% by mass or more and 90% by mass or less relative to the solid content of the photosensitive composition of the fourth aspect. the following. By setting it as the said range, there exists a tendency for the balance of developability to be easily acquired. Examples of the photopolymerizable compound in the photosensitive composition in the fourth aspect include the photopolymerizable compounds exemplified in the photosensitive composition in the first aspect. The content of the photopolymerizable compound is preferably 5 parts by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the photosensitive polyfluorene imide precursor. By setting it as the said range, there exists a tendency for the balance of sensitivity, developability, and resolution to be easily acquired. Examples of the photopolymerization initiator in the fourth aspect of the photosensitive composition include the photopolymerization initiators exemplified in the first aspect of the photosensitive composition. The content of the photopolymerization initiator is preferably 0.01 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the photosensitive polyfluorene imide precursor. By setting it as the said range, sufficient heat resistance and chemical resistance can be obtained, and coating film formation ability can be improved and hardening defect can be suppressed. As described above, the photosensitive composition of the fourth aspect contains a hydrogen barrier agent (B). When the compound is contained in the photosensitive composition, a pattern having hydrogen barrier properties can be formed. The content of the hydrogen barrier agent (B) is preferably 0.01 mass% or more and 30 mass% or less with respect to the mass of the resin equivalent to the substrate component (A) in the photosensitive composition of the fourth aspect, and more preferably 0.05% by mass or more and 20% by mass or less, particularly preferably 0.1% by mass or more and 10% by mass or less. By setting it as the said range, a favorable developability can be obtained and the pattern which has hydrogen barrier performance can be obtained. Examples of the organic solvent in the photosensitive composition in the fourth aspect include the organic solvents exemplified in the photosensitive composition in the first aspect. Among them, a solvent containing the compound represented by the formula (a04) or a polar solvent that completely dissolves the produced polyimide is preferable, and examples include N-methyl-2-pyrrolidone and N, N-dimethylformate. Ethylacetamide, N, N-dimethylformamide, dimethylmethylene, tetramethylurea, hexamethylphosphonium triamine, γ-butyrolactone, and the like. The content of the organic solvent is preferably an amount such that the solid component concentration of the fourth aspect of the photosensitive composition is 1% by mass or more and 50% by mass or less, and more preferably 5% by mass or more and 30% by mass or less. . The photosensitive composition of the fourth aspect may contain the above-mentioned various additives as necessary, similarly to the photosensitive composition of the first aspect. (5) Photosensitive composition of the fifth aspect The photosensitive composition of the fifth aspect contains a polyimide precursor, a hydrogen barrier agent (B), and an organic solvent. It is preferable to further contain a photosensitizer. As the polyimide precursor in the photosensitive composition of the fifth aspect, for example, a polyamic acid having a structural unit represented by the following formula (e-1) can be used. [Chemical 98] In the above formula (e-1), R ^e1 Represents a 4-valent organic group, R ^e2 Represents a divalent organic group, R ^e3 And R ^e4 A hydrogen atom or a monovalent organic group. As R ^e3 And R ^e4 When it is a monovalent organic group, for example, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, and C containing an ether bond among them _x H _2x OC _y H _{2y + 1} Structure indicated by etc. As the polyimide precursor, in terms of alkali developability, it can be preferably used such as R ^e3 And R ^e4 Polyamines are hydrogen atoms. Furthermore, R ^e1 The valence of 4 represents only the number of valences for bonding with an acid, and may further have other substituents. Similarly, R ^e2 The bivalence only represents the valence for bonding with an amine, and may further have other substituents. Polyfluorinated acid is obtained by the reaction of tetracarboxylic dianhydride and diamine. From the viewpoint of imparting excellent heat resistance and dimensional stability to the finally obtained polyimide, in the formula (e-1 ), R ^e1 Or R ^e2 Aromatic group is preferred, R ^e1 And R ^e2 More preferably, it is an aromatic group. At this time, in R of the above formula (e-1) ^e1 , With this R ^e1 4 bases ((-CO-) ₂ (-COOH) ₂ ) Can be bonded to the same aromatic ring, or to different aromatic rings. Similarly, for R in the above formula (e-1) ^e2 , With this R ^e2 Two bases bonded ((-NH-) ₂ ) Can be bonded to the same aromatic ring, or to different aromatic rings. The polyamic acid represented by the formula (e-1) may include a single structural unit, or may include two or more structural units. As a method for producing a polyimide precursor, a conventionally known method can be applied. Examples include: (1) a method for synthesizing polyamic acid as a precursor from tetracarboxylic dianhydride and diamine, (2) tetracarboxylic dianhydride and monohydric alcohol, amine compound, epoxy compound, etc. A method of synthesizing a carboxylic acid of an ester acid or amidine monomer by reaction, and a method of reacting the carboxylic acid with a diamine compound or a derivative thereof to synthesize a polyimide precursor, and the like are not limited thereto. Examples of the tetracarboxylic dianhydride that can be used in the reaction to obtain a polyimide precursor include, for example, ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, and cyclobutane tetracarboxylic dianhydride. Anhydrides, aliphatic cyclocarboxylic dianhydrides such as methylcyclobutanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride; pyromellitic dianhydride, 3,3 ', 4,4'-dibenzoyl Ketone tetracarboxylic dianhydride, 2,2 ', 3,3'-benzophenone tetracarboxylic dianhydride, 2,3', 3,4'-benzophenone tetracarboxylic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,2', 3,3'-biphenyltetracarboxylic dianhydride, 2,3 ', 3,4'-biphenyltetracarboxylic dianhydride , 2,2 ', 6,6'-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyl Phenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl) fluorene dianhydride, 1,1-bis (2,3-dicarboxybenzene Group) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 2,2-bis (3,4-dicarboxybenzene ) -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) -1,1,1,3,3,3-hexa Fluoropropane dianhydride, 1,3-bis [(3,4-dicarboxy) benzylidene] benzene dianhydride, 1,4- [(3,4-Dicarboxy) benzylidene] phthalic anhydride, 2,2-bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} propane dianhydride, 2, 2-bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} propane dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy] phenyl} Ketone dianhydride, bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride, 4,4'-bis [4- (1,2-dicarboxy) phenoxy ] Biphenyl dianhydride, 4,4'-bis [3- (1,2-dicarboxy) phenoxy] biphenyl dianhydride, bis {4- [4- (1,2-dicarboxy) phenoxy ] Phenyl} ketone dianhydride, bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} ketone dianhydride, bis {4- [4- (1,2-dicarboxy) benzene Oxy] phenyl} fluorene dianhydride, bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} fluorene dianhydride, bis {4- [4- (1,2-dicarboxyl ) Phenoxy] phenyl} sulfide dianhydride, bis {4- [3- (1,2-dicarboxy) phenoxy] phenyl} sulfide dianhydride, 2,2-bis {4- [4 -(1,2-dicarboxy) phenoxy] phenyl} -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis {4- [3- (1,2 -Dicarboxy) phenoxy] phenyl} -1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,1,1 , 3,3,3-hexafluoro-2,2-bis (2,3- or 3,4-dicarboxyphenyl) propane dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1 , 2,5,6-naphthalenetetracarboxylic acid Dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-fluorenetetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, 1, 2,7,8-phenanthrenetetracarboxylic dianhydride, pyridinetetracarboxylic dianhydride, sulfofluorenyldiphthalic anhydride, m-triphenyl-3,3 ', 4,4'-tetracarboxylic acid di Aromatic tetracarboxylic dianhydrides such as anhydrides, para-triphenyl-3,3 ', 4,4'-tetracarboxylic dianhydrides and the like. These acid dianhydrides can be used alone or in combination of two or more. Examples of the diamine which can be used in the reaction for obtaining a polyimide precursor include, for example, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenylsulfide, 3,4'-diaminodiphenylsulfide Ether, 4,4'-diaminodiphenylsulfide, 3,3'-diaminodiphenylphosphonium, 3,4'-diaminodiphenylphosphonium, 4,4'-diamine Diphenylphosphonium, 3,3'-diaminobenzophenone, 4,4'-diaminobenzophenone, 3,4'-diaminobenzophenone, 3,3'-di Aminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 2,2-bis (3-aminophenyl) propane, 2, 2-bis (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 2,2-bis (3-aminophenyl)- 1,1,1,3,3,3-hexafluoropropane, 2,2-bis (4-aminophenyl) -1,1,1,3,3,3-hexafluoropropane, 2- (3 -Aminophenyl) -2- (4-aminophenyl) -1,1,1,3,3,3-hexafluoropropane, 1,1-bis (3-aminophenyl) -1- Phenylethane, 1,1-bis (4-aminophenyl) -1-phenylethane, 1- (3-aminophenyl) -1- (4-aminophenyl) -1- Phenylethane, 1,3-bis (3-Aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4 -Aminophenoxy) benzene, 1,3-bis (3-aminobenzylidene) benzene, 1,3-bis (4-aminobenzylidene) benzene, 1,4-bis (3 -Aminobenzyl) benzene, 1,4-bis (4-aminobenzyl) benzene, 1,3-bis (3-amino-α, α-dimethylbenzyl) benzene, 1,3-bis (4-amino-α, α-dimethylbenzyl) benzene, 1,4-bis (3-amino-α, α-dimethylbenzyl) benzene, 1,4- Bis (4-amino-α, α-dimethylbenzyl) benzene, 1,3-bis (3-amino-α, α-bis (trifluoromethyl) benzyl) benzene, 1,3- Bis (4-amino-α, α-bis (trifluoromethyl) benzyl) benzene, 1,4-bis (3-amino-α, α-bis (trifluoromethyl) benzyl) benzene, 1,4-bis (4-amino-α, α-bis (trifluoromethyl) benzyl) benzene, 2,6-bis (3-aminophenoxy) benzonitrile, 2,6-bis (3-aminophenoxy) pyridine, 4,4'-bis (3-aminophenoxy) biphenyl, 4,4'-bis (4-aminophenoxy) biphenyl, bis [4 -(3-aminophenoxy) phenyl] one, bis [4- (4-aminophenoxy) phenyl] one, bis [4- (3-aminophenoxy) phenyl] sulfur Ether, bis [4- (4-aminophenoxy) phenyl] sulfide, bis [4- (3-aminophenoxy) phenyl] fluorene, bis [4- (4-aminophenoxy) phenyl] fluorene, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ether, 2,2-bis [4- (3-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [ 3- (3-aminophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl ] -1,1,1,3,3,3-hexafluoropropane, 1,3-bis [4- (3-aminophenoxy) benzylidene] benzene, 1,3-bis [4- (4-Aminophenoxy) benzylidene] benzene, 1,4-bis [4- (3-aminophenoxy) benzylidene] benzene, 1,4-bis [4- (4 -Aminophenoxy) benzylidene] benzene, 1,3-bis [4- (3-aminophenoxy) -α, α-dimethylbenzyl] benzene, 1,3-bis [ 4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 1,4-bis [4- (3-aminophenoxy) -α, α-dimethylbenzyl Phenyl] benzene, 1,4-bis [4- (4-aminophenoxy) -α, α-dimethylbenzyl] benzene, 4,4'-bis [4- (4-aminophenoxy) Group) benzamyl] diphenyl ether, 4,4'-bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] benzophenone, 4,4'- Bis [4- (4-amino-α, α-dimethylbenzyl) phenoxy] diphenylphosphonium, 4,4'-bis [4- (4-aminophenoxy) phenoxy ] Diphenylphosphonium, 3,3 '-Diamino-4,4'-diphenoxybenzophenone,3,3'-diamino-4,4'-diphenoxybenzophenone,3,3'-diamine Methyl-4-phenoxybenzophenone, 3,3'-diamino-4-biphenoxybenzophenone, 6,6'-bis (3-aminophenoxy) -3, 3,3 ', 3'-tetramethyl-1,1'-spirobisindane, 6,6'-bis (4-aminophenoxy) -3,3,3', 3'-tetramethyl Aromatic diamines such as 1, -1'-spirobisindane; 1,3-bis (3-aminopropyl) tetramethyldisilazane, 1,3-bis (4-aminobutyl) ) Tetramethyldisilazane, α, ω-bis (3-aminopropyl) polydimethylsiloxane, α, ω-bis (4-aminobutyl) polydimethylsiloxane , Bis (aminomethyl) ether, bis (2-aminoethyl) ether, bis (3-aminopropyl) ether, bis [2- (aminomethoxy) ethyl] ether, bis [ 2- (2-aminoethoxy) ethyl] ether, bis [2- (3-aminopropyloxy) ethyl] ether, 1,2-bis (aminomethoxy) ethane, 1 , 2-bis (2-aminoethoxy) ethane, 1,2-bis [2- (aminomethoxy) ethoxy] ethane, 1,2-bis [2- (2-amine Ethoxy) ethoxy] ethane, ethylene glycol bis (3-aminopropyl) ether, diethylene glycol bis (3-aminopropyl) ether, triethylene glycol bis (3-amine Propyl) ether, ethylenediamine, 1,3-di Propane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diamino Aliphatic amines such as octane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane; 1 1,2-diaminocyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,2-bis (2-aminoethyl) cyclohexane, 1 , 3-bis (2-aminoethyl) cyclohexane, 1,4-bis (2-aminoethyl) cyclohexane, bis (4-aminocyclohexyl) methane, 2,6-bis ( Alicyclic diamines such as aminomethyl) bicyclo [2.2.1] heptane, 2,5-bis (aminomethyl) bicyclo [2.2.1] heptane; etc. In addition, part or all of the hydrogen atoms on the aromatic ring of the diamine may be substituted by a substituent selected from the group consisting of a fluoro group, a methyl group, a methoxy group, a trifluoromethyl group, and a trifluoromethoxy group. Of the diamine. These diamines can be used alone or in combination of two or more. The content of the polyimide precursor is preferably 50% by mass or more and 99% by mass or less, and more preferably 70% by mass or more and 95% by mass or less based on the solid content of the photosensitive composition in the fifth aspect. By setting it as the said range, a coating-film formation ability can be improved. As described above, the photosensitive composition of the fifth aspect contains a hydrogen barrier agent (B). When the compound is contained in the photosensitive composition, a pattern having hydrogen barrier properties can be formed. The content of the hydrogen barrier agent (B) is preferably 0.01 part by mass or more and 40 parts by mass or less, more preferably 0.05 part by mass or more and 30 parts by mass or less, and more preferably 0.1 part by mass relative to 100 parts by mass of the polyimide precursor. Part by mass or more and 20 parts by mass or less, more preferably 0.2 part by mass or more and 10 parts by mass or less. By setting it as the said range, favorable developability can be acquired, and favorable micropatterning characteristics can be acquired. Examples of the organic solvent in the photosensitive composition in the fifth aspect include the organic solvents exemplified in the photosensitive composition in the first aspect. Of these, propylene glycol monomethyl ether, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl acetate, propylene glycol monomethyl ether acetate, N, N-dimethylacetamide, and N-methyl are preferred. Polar solvents such as methyl-2-pyrrolidone, γ-butyrolactone, aromatic hydrocarbons such as toluene, and mixed solvents thereof. The content of the organic solvent is preferably an amount such that the solid component concentration of the photosensitive composition of the fifth aspect is 1 mass% or more and 50 mass% or less, and more preferably an amount of 5 mass% or more and 30 mass% or less. . When the photosensitive composition of a 5th aspect is a positive type photosensitive composition, it is preferable to further contain a photoacid generator as a photosensitizer. As the photoacid generator, in addition to the above-mentioned compounds in the photosensitive composition of the second aspect, compounds containing a diazidoquinone group can also be mentioned. Examples of the diazidequinone-containing compound include an o-diazidequinone compound and a diazonaphthoquinone compound. For example, a phenol compound (also referred to as a compound containing a phenolic hydroxyl group) and a diazonaphthoquinonesulfonate Complete or partial esterification of acid compounds; o-diazidequinone compounds obtained by condensation reaction of o-diazidequinone sulfonium chloride with hydroxyl compounds or amine compounds equal to dehydrochlorinating agents (wherein, Preferably, by using 1,1-bis (4-hydroxyphenyl) -1- [4- {1- (4-hydroxyphenyl) -1-methylethyl} phenyl] ethane and 1-naphthoquinone Ester compounds obtained by the reaction of -2-diazide-5-sulfonyl chloride) and the like. Others may contain thermal cross-linking agents, silicon-containing compounds, non-polymerizable adhesive polymers, solvents, elastomers, dissolution accelerators, dissolution inhibitors, surfactants or leveling agents, thermal acid generators, etc. as needed ingredient. The thermal cross-linking agent is not particularly limited except for a compound which is cross-linked or polymerized in a heat treatment step after development, and preferably has a methylol group, an alkoxymethyl group, an epoxy group or a vinyl ether in the molecule. Of the compound. Examples include: 1,2-benzenedimethanol, 1,3-benzenedimethanol, 1,4-benzenedimethanol, 1,3,5-benzenetrimethanol, 4,4'-biphenyldimethanol, 2, Compounds with methylol groups such as 6-pyridyldimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 4,4'-methylenebis (2,6-dialkoxymethylphenol) ; 1,4-bis (methoxymethyl) benzene, 1,3-bis (methoxymethyl) benzene, 4,4'-bis (methoxymethyl) biphenyl, 3,4'- Bis (methoxymethyl) biphenyl, 3,3'-bis (methoxymethyl) biphenyl, methyl 2,6-naphthalenedicarboxylic acid, 4,4'-methylenebis (2, 6-dimethoxymethylphenol) and other compounds having an alkoxymethyl group; hydroxymethylmelamine compounds such as hexamethylolmelamine, hexabutanolmelamine, alkoxymelamine compounds such as hexamethoxymelamine, tetramethyl Alkoxymethyl glycoluril compounds such as oxymethyl glycoluril, hydroxymethyl benzoguanamine compounds, hydroxymethyl urea compounds such as dimethylol diethylurea; dicyanoaniline, dicyanophenol, Cyano compounds such as cyanophenylsulfonic acid; isocyanate compounds such as 1,4-benzene diisocyanate, 3,3'-dimethyldiphenylmethane-4,4'-diisocyanate; ethylene dioxane Diglycidyl ether, Bisphenol A diglycidyl ether, Triglycidyl isocyanurate, Bisphenol A epoxy resin, Bisphenol F epoxy resin, Naphthalene epoxy resin, Biphenyl epoxy resin Epoxy resin-containing compounds such as resins, phenol novolac resin epoxy resins; N, N'-1,3-phenylene dicis butylene diimide, N, N'-methylene dicis butylene A maleimide compound, such as a melamine, etc., is not limited to these. These thermal crosslinking agents may be used singly or in combination of two or more kinds. Examples of the silicon-containing compound include a silicon-containing resin, a silicon-containing resin precursor, and a silane coupling agent. A silane coupling agent is preferred, and 1- (2-pyridyl) -3- [3- (trimethoxy) is more preferred. Silyl) propyl] urea, 1- (3-pyridyl) -3- [3- (triethoxysilyl) propyl] urea and other urea-containing silane coupling agents. In the case where the photosensitive composition of the fifth aspect is a negative photosensitive composition, it is preferable to further contain a photobase generator as a photosensitizer. Although it does not specifically limit as a photobase generator, The same thing as the said oxime ester compound in the photosensitive composition of a 1st aspect is mentioned preferably. The negative-type photosensitive composition may contain other components similar to the above-mentioned positive-type photosensitive composition, if necessary. The ratio of each component other than the hydrogen barrier agent (B) in the photosensitive composition of the 5th aspect is as follows. The content of the polyimide precursor is preferably 50% by mass or more, more preferably 60% by mass or more and 90% by mass or less with respect to the entire solid component of the photosensitive composition. The content of the photosensitizer is preferably 3 parts by mass or more and 50 parts by mass or less, and more preferably 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the polyimide precursor in terms of sensitivity and the like. . When the thermal crosslinking agent is contained, the content is preferably 1 part by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the polyimide precursor. When the silane compound is contained, the content is preferably 0.1 parts by mass or more and 20 parts by mass or less, and more preferably 1 part by mass or more and 10 parts by mass or less based on 100 parts by mass of the polyimide precursor. The solid content component concentration of the photosensitive composition is preferably 30% by mass or less, more preferably 1% by mass or more and 20% by mass, and still more preferably 5% by mass or more and 15% by mass or less. The photosensitive composition of the 5th aspect can contain the various additives mentioned above as needed similarly to the photosensitive composition of the 1st aspect. (6) Photosensitive composition of a sixth aspect The photosensitive composition of the sixth aspect contains an epoxy compound, a hydrogen barrier agent (B), and an organic solvent. Examples of the epoxy compound in the photosensitive composition of the sixth aspect include bisphenol A type epoxy resin derived from bisphenol A and epichlorohydrin, and bisphenol derived from bisphenol F and epichlorohydrin. F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F novolac type epoxy resin , Alicyclic epoxy resin, diphenyl ether epoxy resin, hydroquinone epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, fluorene epoxy resin, trifunctional epoxy resin Or multifunctional epoxy resins such as tetrafunctional epoxy resins, glycidyl ester epoxy resins, glycidylamine epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, Aliphatic chain epoxy resin and the like. These epoxy compounds may be halogenated or hydrogenated. Examples of commercially available epoxy compounds include: JER Coat 828, 1001, 801N, 806, 807, 152, 604, 630, 871, YX8000, YX8034, YX4000 manufactured by Japan Epoxy Resins, and EPICLON 830 manufactured by DIC Corporation. , EXA835LV, HP4032D, HP820, EP4100 series, EP4000 series, EPU series manufactured by ADEKA Co., Ltd., Celloxide series (2021, 2021P, 2083, 2085, 3000, etc.) manufactured by Daicel, Epolead series, EHPE series, Nippon Steel YD series, YDF series, YDCN series, YDB series, phenoxy resin (with epoxy groups at both ends of polyhydroxy polyether synthesized from bisphenols and epichlorohydrin; YP series, etc.) manufactured by chemical company, Nagase The DENACOL series manufactured by chemteX, the Epolight series manufactured by Kyoeisha Chemical Co., etc. are not limited to these. These epoxy compounds can be used individually or in combination of 2 or more types. The content of the epoxy compound is preferably 55% by mass or more and 99% by mass or less, more preferably 70% by mass or more and 95% by mass or less based on the solid content of the photosensitive composition of the sixth aspect. By setting it as the said range, a coating-film formation ability can be improved. The photosensitive composition of a 6th aspect contains the said hydrogen barrier agent (B). The hydrogen barrier agent (B) is a compound containing an imidazole ring. Therefore, it promotes hardening of the epoxy compound during exposure, and imparts good patterning characteristics and hydrogen barrier properties to the photosensitive composition. The content of the hydrogen barrier agent (B) is preferably 0.01 parts by mass or more and 30 parts by mass or less, more preferably 0.05 parts by mass or more and 20 parts by mass or less, and more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the epoxy compound. In addition, it is 10 parts by mass or less. By setting it as the said range, a patterning characteristic and hydrogen barrier performance can be obtained. Examples of the organic solvent in the photosensitive composition in the sixth aspect include the organic solvents exemplified in the photosensitive composition in the first aspect. Of these, propylene glycol monomethyl ether, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl acetate, propylene glycol monomethyl ether acetate, N, N-dimethylacetamide, and N-methyl are preferred. Polar solvents such as 2--2-pyrrolidone, γ-butyrolactone, aromatic hydrocarbons such as toluene, and mixed solvents thereof. The content of the organic solvent is preferably an amount such that the solid component concentration of the photosensitive composition of the sixth aspect is 1 mass% or more and 50 mass% or less, and more preferably 5 mass% or more and 30 mass% or less. . The photosensitive composition of the 6th aspect can contain the various additives mentioned above as needed like the photosensitive composition of the 1st aspect. Furthermore, not all epoxy-containing polycarboxylic acid resins in the sixth aspect described below are necessarily consumed by reaction with "monocarboxylic acids having alcoholic hydroxyl groups" and "polyacid anhydrides" It usually has a residual epoxy group, which is also equivalent to the epoxy resin in the photosensitive composition of the sixth aspect in this respect. In this respect, the epoxy group-containing polycarboxylic acid resin in the photosensitive composition in the sixth aspect may be used as the epoxy resin in the photosensitive composition in the sixth aspect. In this specification, among epoxy resins in the photosensitive composition of the sixth aspect, resins other than the epoxy group-containing polycarboxylic acid resin in the photosensitive composition of the sixth aspect may be referred to as non- Carboxylic acid modified epoxy resin. (7) Photosensitive composition of the seventh aspect The photosensitive composition of the seventh aspect is a negative type containing a polycarboxylic acid resin containing an epoxy group, a photoacid generator, a hydrogen barrier agent (B), and an organic solvent. Photosensitive composition. As the epoxy group-containing polycarboxylic acid resin in the photosensitive composition of the seventh aspect, for example, an epoxy compound having two or more epoxy groups in one molecule and one or more epoxy compounds having one molecule can be used. Resin obtained by reacting a monocarboxylic acid of an alcoholic hydroxyl group with a polybasic acid anhydride. Examples of the epoxy compound having two or more epoxy groups in one molecule include novolac epoxy resin, bisphenol epoxy resin, triphenol methane epoxy resin, and tris (2,3- Glycidyl) isocyanurate, biphenyl diglycidyl ether, alicyclic epoxy resin, copolymer epoxy resin and the like. Examples of the novolak-type epoxy resin include phenols such as phenol, cresol, halogenated phenol, and alkylphenol and formaldehyde under an acidic catalyst, and the obtained novolacs and epichlorohydrin or methyl alcohol may be reacted. An epoxy resin or the like obtained by the reaction of a base epichlorohydrin. Examples of commercially available products include EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1027, EPPN-201, and BREN-S (all manufactured by Nippon Kayaku Co., Ltd.); DEN-431, DEN-439 (all (Manufactured by Dow Chemical); N-730, N-770, N-865, N-665, N-673, VH-4150 (all manufactured by Dainippon Ink Chemical Industry Co., Ltd.) and the like. Examples of the bisphenol-type epoxy resin include a ring obtained by reacting bisphenols such as bisphenol A, bisphenol F, bisphenol S, and tetrabromobisphenol A with epichlorohydrin or methyl epichlorohydrin. Oxygen resin, or epoxy resin obtained by reacting the diglycidyl ether of bisphenol A or bisphenol F with the condensate of the above bisphenols and epichlorohydrin or methylepichlorohydrin. Examples of commercially available products include Epikote 1004, Epikote 1002, Epikote 4002, and Epikote 4004 (all manufactured by Yuka Shell Epoxy Corporation). Examples of the triphenolmethane type epoxy resin include epoxy resins obtained by reacting triphenolmethane or tricresolmethane with epichlorohydrin or methylepichlorohydrin. Examples of commercially available products include EPPN-501 and EPPN-502 (both manufactured by Nippon Kayaku Co., Ltd.). Examples of the alicyclic epoxy resin include Celloxide 2021 manufactured by Daicel Chemical Industry Co., Ltd .; Epomic VG-3101 manufactured by Mitsui Petrochemical Industry Co., Ltd .; E-1031S manufactured by Yuka Shell Epoxy Corporation; EPB-13 manufactured by Soda Corporation of Japan. , EPB-27 and so on. In addition, examples of the copolymer epoxy resin include CP-50M, CP-50S, or methacrylic acid produced by Nippon Oil and Fats Co., Ltd. as a copolymer of glycidyl methacrylate and styrene and α-methylstyrene. Copolymers of glyceride and cyclohexyl-cis-butene diimide, etc. Particularly preferred examples of the epoxy resin having two or more epoxy groups in one molecule include, for example, cresol novolac epoxy resin, phenol novolac epoxy resin, and bisphenol epoxy resin. , Triphenol methane epoxy resin, etc. Particularly preferred are polycondensates of α-hydroxyphenyl-ω-hydrogenated poly (biphenylmethylene-hydroxyphenylene) and 1-chloro-2,3-propylene oxide, and α-2,3-cyclo Oxypropoxyphenyl-ω-hydrogenated poly {2- (2,3-glycidoxy) -benzylidene-2,3-glycidoxyphenylene}. Examples of the monocarboxylic acid having one or more alcoholic hydroxyl groups in one molecule include dimethylolpropionic acid, dimethylolacetic acid, dimethylolbutanoic acid, dimethylolvaleric acid, and dihydroxyol. Hydroxy monocarboxylic acids such as methylhexanoic acid and hydroxypivalic acid. Among these, a monocarboxylic acid having one or more and five or less alcoholic hydroxyl groups in one molecule is preferred. Examples of the polybasic acid anhydride include succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and methylmethylenetetrahydrophthalic acid. Formic anhydride, trimellitic anhydride, pyromellitic anhydride, etc. Regarding the reaction between the above-mentioned epoxy compound and the above-mentioned monocarboxylic acid, the monocarboxylic acid is preferably 0.1 mol or more and 0.7 mol or less, more preferably 0.2 mol or more and 0.5 with respect to 1 equivalent of the epoxy group's epoxy group. Moore below. In this reaction, it is preferable to use an organic solvent which does not react with an epoxy compound or a polybasic acid anhydride and does not have a hydroxyl group or a carboxyl group. Furthermore, in order to promote the reaction, a catalyst (for example, triphenylphosphine, benzyldimethylamine, trialkylammonium chloride, triphenylantimony, etc.) can be used. In the case where the catalyst is used, especially when the catalyst is made inert by using an organic peroxide or the like after the reaction is completed, it is stable and has good storage properties, so it is preferable. The use amount of the reaction catalyst is preferably 0.1% by mass or more and 10% by mass or less with respect to the reaction mixture, and the reaction temperature is preferably 60 ° C or more and 150 ° C or less. Thereby, the reaction product of the said epoxy compound and the said monocarboxylic acid can be obtained. In the reaction between the reactant and the polybasic acid anhydride, the polybasic acid anhydride in which the acid value of the epoxy group-containing polycarboxylic acid resin finally obtained is preferably 50 mgKOH / g or more and 150 mgKOH / g or less is reacted. The reaction temperature is preferably 60 ° C or higher and 150 ° C or lower. In this way, an epoxy-containing polycarboxylic acid resin can be obtained. These epoxy group-containing polycarboxylic acid resins can be used alone or in combination of two or more kinds. The content of the epoxy group-containing polycarboxylic acid resin is preferably 30% by mass or more and 80% by mass or less, more preferably 40% by mass or more and 70% by mass relative to the solid content of the photosensitive composition of the seventh aspect. %the following. By setting it as the said range, a coating-film formation ability can be improved. Examples of the photoacid generator in the photosensitive composition of the seventh aspect include the photoacid generators exemplified in the photosensitive composition of the second aspect. The content of the photoacid generator is preferably 0.5% by mass or more and 30% by mass or less, and more preferably 1% by mass or more and 20% by mass or less based on the solid content of the photosensitive composition of the seventh aspect. By setting it as the said range, the curability of a photosensitive composition can be made favorable. The photosensitive composition of the seventh aspect contains the hydrogen barrier agent (B) as described above. When the compound is contained in the photosensitive composition, a pattern having hydrogen barrier properties can be formed. The content of the hydrogen barrier agent (B) is preferably 0.01 mass% or more and 30 mass% or less with respect to the mass of the resin equivalent to the substrate component (A) in the photosensitive composition of the seventh aspect, and more preferably 0.05% by mass or more and 20% by mass or less, particularly preferably 0.1% by mass or more and 10% by mass or less. By setting it as the said range, a favorable developability can be obtained and the pattern which has hydrogen barrier performance can be obtained. The photosensitive composition of the seventh aspect may further contain a sensitizer. As the sensitizer, for example, an anthracene compound (9,10-dialkoxy-anthracene derivative) having an alkoxy group at the 9-position and the 10-position is preferable. Examples of the alkoxy group include an alkoxy group having 1 to 4 carbon atoms. The 9,10-dialkoxy-anthracene derivative may further have a substituent. Examples of the substituent include a halogen atom, an alkyl group having 1 to 4 carbon atoms, an alkyl sulfonate group, an alkyl carboxylate group, and the like. Examples of the alkyl group in the sulfonic acid alkyl ester group or the carboxylic acid alkyl ester group include an alkyl group having 1 to 4 carbon atoms. The substitution position of these substituents is preferably a 2-position. Examples of the 9,10-dialkoxy-anthracene derivative include 9,10-dimethoxy-anthracene, 9,10-diethoxy-anthracene, and 9,10-dipropoxy-anthracene , 9,10-dimethoxy-2-ethyl-anthracene, 9,10-diethoxy-2-ethyl-anthracene, 9,10-dipropoxy-2-ethyl-anthracene, 9 , 10-Dimethoxy-2-chloro-anthracene, 9,10-dimethoxyanthracene-2-sulfonic acid methyl ester, 9,10-diethoxyanthracene-2-sulfonic acid methyl ester, 9, 10-dimethoxyanthracene-2-carboxylic acid methyl ester and the like. These compounds can be obtained by treating an anthraquinone derivative with a reducing agent such as zinc powder, hydrogen sulfite, palladium carbon, sodium borohydride in an alkaline aqueous solution to prepare 9,10-dihydroxyanthracene. After the derivative, tosylate such as sulfonic acid such as dimethyl sulfuric acid and diethyl sulfuric acid, methyl tosylate, ethyl tosylate, propyl tosylate, monoethylene glycol tosylate or the like These compounds are obtained by alkoxylating the 9,10-position of benzenesulfonic acid esters such as methyl benzenesulfonate, ethyl benzenesulfonate, and propyl benzenesulfonate. These sensitizers can be used alone or in combination of two or more. The content of the sensitizer is preferably 0.1 or more and 6 or less, and more preferably 0.2 or more and 4 or less, in terms of mole ratios, relative to the photoacid generator. By setting it as the said range, the sensitivity and curability of a photosensitive composition will become favorable. The photosensitive composition according to the seventh aspect may further contain a modifying component for adjusting moisture resistance, heat resistance, adhesion and the like. The modified component may be a component that is hardened by heat or ultraviolet rays, or a component that reacts with residual hydroxyl or carboxyl groups of an epoxy-containing polycarboxylic acid resin by heat or ultraviolet rays. Specific examples include epoxy compounds having one or more epoxy groups in one molecule, melamine derivatives (such as hexamethoxymelamine, hexabutoxylated melamine, condensed hexamethoxymelamine, etc.), and bisphenol A compounds (E.g., tetramethylolbisphenol A, etc.), oxazoline compounds, and the like. Examples of the epoxy compound having one or more epoxy groups in one molecule include Epikote 1009, 1031 (both manufactured by Yuka Shell), EPICLON N-3050, and N-7050 (both Dainippon Ink Chemical Industry Corporation) (Manufactured), DER-642U, DER-673MF (all manufactured by Dow Chemical) and other bisphenol A epoxy resins; ST-2004, ST-2007 (both manufactured by Totsu Kasei) and other hydrogenated bisphenol A epoxy resins Resin; YDF-2004, YDF-2007 (both manufactured by Toto Chemical Co., Ltd.) and other bisphenol F-type epoxy resins; SR-BBS, SR-TBA-400 (both manufactured by Sakamoto Pharmaceutical Co., Ltd.), YDB-600, YDB -715 (both manufactured by Tohto Kasei Corporation) and other brominated bisphenol A epoxy resins; EPPN-201, EOCN-103, EOCN-1020, BREN (both manufactured by Nippon Kayaku Co., Ltd.) and other novolac epoxy resins ; Novolac type epoxy resins of bisphenol A such as EPICLON N-880 manufactured by Dainippon Ink Chemical Industry Company; rubber modification such as EPICLON TSR-601 manufactured by Dainippon Ink Chemical Industry Company or R-1415-1 manufactured by ACR Company Epoxy resin; EBPS-200 manufactured by Nippon Kayaku Co. or EPICLON EXA-1514 manufactured by Dainippon Ink Chemical Industry Co., Ltd. Bisphenol S type epoxy resin; diglycidyl terephthalate such as Blenmer DGT manufactured by Japan Oil Corporation; triglycidyl isocyanurate such as TEPIC manufactured by Nissan Chemical Company; YX-4000 manufactured by Yuka Shell etc. Dixylenol type epoxy resin; bisphenol type epoxy resin such as YL-6056 manufactured by Yuka Shell; alicyclic epoxy resin such as Celloxide 2021 manufactured by Daicel Chemical Industry Company; etc. The content of the modified component is preferably 50% by mass or less, and more preferably 30% by mass or less, relative to the solid content of the photosensitive composition of the seventh aspect. In order to improve the properties such as adhesion and hardness, the photosensitive composition of the seventh aspect may further contain a known filler such as barium sulfate, barium titanate, silicon dioxide, talc, clay, magnesium carbonate, calcium carbonate, alumina, mica, and the like. Agent. The content of the filler is preferably 60% by mass or less, and more preferably 5% by mass or more and 40% by mass or less based on the solid content of the photosensitive composition in the sixth aspect. The photosensitive composition of the seventh aspect may further contain coloring agents such as phthalocyanine blue, phthalocyanine green, disazo yellow, crystal violet, titanium oxide, and carbon black, and ultra-fine powders such as silicon dioxide and montmorillonite. Additives such as defoamers such as polysiloxane-based polymers and fluorine-based polymers, and / or adhesives such as leveling agents and silane coupling agents. Examples of the organic solvent in the photosensitive composition of the seventh aspect include the organic solvents exemplified in the photosensitive composition of the first aspect. The content of the organic solvent is preferably an amount such that the solid component concentration of the photosensitive composition of the seventh aspect is 1 mass% or more and 50 mass% or less, and more preferably 5 mass% or more and 30 mass% or less. The photosensitive composition of the seventh aspect may contain the above-mentioned various additives, as necessary, similarly to the photosensitive composition of the first aspect. <The preparation method of a photosensitive composition> The photosensitive composition can be prepared by mixing the said each component with a stirrer. In addition, filtration can be performed using a membrane filter or the like to make the prepared photosensitive composition uniform. ≫Method for producing hydrogen barrier film≫ By using the composition for forming a hydrogen barrier film containing the hydrogen barrier agent (B) described above, a hydrogen barrier film containing the hydrogen barrier agent (B) can be formed. The composition for forming a hydrogen barrier film contains polyacetal resin, polyamide resin, polycarbonate resin, polyester resin (polybutylene terephthalate, polyethylene terephthalate, and polyethylene naphthalate) (Ethylene glycol, polyarylate, etc.), FR-AS resin, FR-ABS resin, AS resin, ABS resin, polyphenylene ether resin, polyphenylene sulfide resin, polyfluorene resin, polyether resin, polyetheretherketone Resin, fluororesin, polyimide resin, polyimide resin, polyimide biscis butylene diimide resin, polyetherimide resin, polybenzoxazole resin, polybenzo Thiazole resin, polybenzimidazole resin, silicone resin, BT resin, polymethylpentene, ultra-high molecular weight polyethylene, FR-polypropylene, (meth) acrylic resin (such as polymethyl methacrylate, etc.) When resin materials such as) and polystyrene are used as the base material component (A), the method for forming the hydrogen barrier film is as described above. When the composition for forming a hydrogen barrier film contains a thermosetting material as the base component (A), after the composition for forming a hydrogen barrier film is formed by a method such as coating, the formed film is formed according to the curability. The hydrogen barrier film is formed by heating and hardening the temperature of the type of material. In the case where the composition for forming a hydrogen barrier film is the above-mentioned various photosensitive compositions, the hydrogen barrier film is typically manufactured by a method including the following: The composition for forming a hydrogen barrier film is coated on a substrate and formed The coating film is applied, and the coating film is exposed. More specifically, first, a coating film is formed by an appropriate coating method. For example, a non-contact coating method such as a roll coater, a reverse coater, a bar coater, or a contact transfer type coating device, a spinner (rotary coating device), or a curtain type flat coater is used. The coating device can form a coating film by applying the photosensitive composition on a substrate and drying it. The drying method is not particularly limited. For example, (1) a heating plate is prepared at a temperature of 80 ° C. or higher and 120 ° C. or lower, preferably 90 ° C. or higher and 100 ° C. or lower for 60 seconds to 120 seconds Method of baking; (2) Method of leaving at room temperature for more than several hours and less than several days; (3) Place in hot air heater or infrared heater for more than tens of minutes and less than several hours, remove Solvent method. Then, the position of the coating film is selectively irradiated with an electromagnetic wave to perform exposure. When the photosensitive composition is a negative-type photosensitive composition that is hardened by exposure, the entire surface of the coating film is exposed. When the position is selectively exposed, the electromagnetic wave may be irradiated through a positive or negative mask, or may be directly irradiated. The amount of exposure varies depending on the composition of the photosensitive composition, for example, 5 mJ / cm is preferred. ² Above 500 mJ / cm ² About the following. When the entire surface of the coating film is exposed, the exposed coating film can be directly used as a hydrogen barrier film. When the position-selective exposure is performed, a hydrogen barrier film patterned into a desired shape is obtained by developing the exposed coating film with a developing solution. The development method is not particularly limited, and for example, a dipping method, a spray method, or the like can be used. Examples of the developing solution include organic developing solutions such as monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. It is preferable to bake the patterned hydrogen barrier film after development at about 200 ° C to 250 ° C. The hydrogen barrier film formed as described above can be used in various applications requiring shielding of hydrogen without particular limitation, and is particularly preferably used in the following electronic components. Furthermore, the hydrogen barrier film can suppress the permeation of hydrogen with a small molecular weight and a small molecular size, so it can also suppress the permeation of a gas with a molecular size larger than that of hydrogen. Examples of the gas include nitrogen, oxygen, ozone gas, water vapor, carbon monoxide gas, carbon dioxide gas, nitrogen oxide gas, and sulfur oxide gas. ≪Electronic component≫ The hydrogen barrier film formed using the composition for forming a hydrogen barrier film described above can be preferably used for an electronic device having a passivation film. The passivation film is a film provided to protect a functional layer such as a semiconductor layer from contact with ions, gases, or physical damage. The electronic device is not particularly limited, and an organic electronic device including an organic conductive layer, an organic semiconductor layer, an organic light-emitting layer, and the like is preferable. Preferred specific examples of the electronic device include light-emitting devices such as LED devices and organic EL devices, semiconductor devices, solar cell devices, and solid-state imaging devices. The passivation film contains, for example, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, or a metal oxycarbide. More specifically, an oxide, nitride, carbide, oxynitride, or carbon containing one or more metals selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce, and Ta can be preferably used. Oxides, etc. Among these materials, oxides, nitrides, or oxynitrides of metals selected from Si, Al, In, Sn, Zn, and Ti are preferred, and oxides or nitrides of Si or Al are more preferred, especially It is preferably silicon nitride (Si nitride). They may contain other elements as minor components. For example, silicon nitride may contain hydrogen to form hydrogenated silicon nitride, and may further contain oxygen to form silicon oxynitride. The oxide film or nitride film of Si can be obtained by calcining a coating film of a composition containing a silicon-containing polymer such as polysilazane, polysiloxane, polysiloxasilazane, or polysilane. Oxide film or nitride film. In terms of the protective performance of the passivation film, the passivation film is preferably one containing silicon nitride (SiN). The passivation film described above may contain hydrogen, or ammonia or amines and other compounds that can generate hydrogen due to its raw materials and manufacturing methods. Passivation films containing silicon nitride are particularly prone to hydrogen generation. On the other hand, as an electronic element, there are many cases in which a TFT is provided for driving the element like an organic EL element. In addition, electronic devices often include wirings including metals such as copper. The TFT may be damaged due to a reduction reaction caused by contact with hydrogen, and the metal wiring may be changed in electrical characteristics due to reduction caused by hydrogen. However, in the case where the electronic component is provided with a hydrogen barrier film together with the passivation film, the hydrogen barrier film can be used to shield the hydrogen generated from the passivation film, and the adverse effects in the components affected by the hydrogen can be suppressed. The hydrogen barrier film is preferably provided, for example, between an object to be protected from hydrogen, such as a TFT, and a source of hydrogen generation. When the hydrogen existing in the external environment of the electronic component may invade the protection object in the electronic component, a hydrogen barrier agent may be formulated on a hard coating layer provided on the surface of the electronic component in contact with the external environment as Hydrogen barrier membrane. When protecting a protection object such as a TFT in an electronic device from hydrogen generated from a film that becomes a hydrogen generation source such as a passivation film, it is preferable to form between the film that becomes a hydrogen generation source and the protection object. Hydrogen barrier membrane. In this case, for example, a planarizing film can be used as the hydrogen barrier film. As described above, in the case of an electronic component provided with a passivation film, if a hydrogen barrier film is provided, it can protect components such as TFTs and metal wirings that may be adversely affected by hydrogen, and can produce highly reliable electronics. element. [Examples] Hereinafter, the present invention will be specifically described to explain the present invention, but the scope of the present invention is not limited to these examples. [Example 1] 12 parts by mass of an alkali-soluble resin having the following structure, 6 parts by mass of dipentaerythritol hexaacrylate, 1.0 part by mass of a photopolymerization initiator having the following structure, and a surface modifier (BYK-310, polyester modified Polydimethylsiloxane (manufactured by BYK-Chemie Japan Co., Ltd.) 0.04 parts by mass and 2.0 parts by mass of a hydrogen barrier agent having the following structure are dissolved in a mixed solvent to obtain a processable composition. As the mixed solvent, a mixed solvent containing 45 parts by mass of propylene glycol monomethyl ether, 30 parts by mass of diethylene glycol monomethyl ether, and N, N, N ', N'-tetramethylurea was used. The structure of the alkali-soluble resin, the structure of the photopolymerization initiator, and the structure of the hydrogen barrier agent are described below. Regarding the alkali-soluble resin, the number at the bottom right of each structural unit is the content (% by mass) of each structural unit in the resin. [Chemical 99] The obtained photosensitive composition was applied on a SiN substrate (a laminated body having a SiN layer on a silicon wafer) by a spin coater, and then the coating film was pre-baked at 105 ° C for 100 seconds. Use UV curing machine with an exposure of 50 mJ / cm ² The entire surface of the pre-baked coating film is exposed (ghi light broadband) to harden the coating film. By post-baking the coated film after exposure at 230 ° C. for 20 minutes, a cured film having a film thickness of 2.0 μm was obtained. For a SiN substrate provided with a cured film, the silicon wafer side is heated, and the component of molecular weight 1 (hydrogen radical or hydrogen ion) and the component of molecular weight 2 generated from the surface of the cured film are measured by thermal deposition spectroscopy (TDS) method. (Hydrogen) and the component (water vapor) with a molecular weight of 18. The heating at the time of measuring the amount of gas generated was performed at a temperature of 10 ° C / min from 50 ° C to 280 ° C. Stop heating when it reaches 280 ° C. The amount of generated gas (peak intensity) is shown in Table 1. [Comparative Example 1] For a SiN substrate without a cured film, the component (hydrogen radical or hydrogen ion) with a molecular weight of 1 and the component (hydrogen) with a molecular weight of 2 and a component with a molecular weight of 18 were measured in the same manner as in Example 1. Water vapor). The amount of generated gas (peak intensity) is shown in Table 1. The amount of gas generated is the amount of gas generated from the surface of SiN. [Comparative Example 2] A photosensitive composition was obtained in the same manner as in Example 1 except that a hydrogen barrier agent was not used. Using the obtained photosensitive composition, a cured film was formed on a SiN substrate in the same manner as in Example 1. Regarding the SiN substrate provided with a cured film, in the same manner as in Example 1, the amounts of components of molecular weight 1 (hydrogen radicals or hydrogen ions), components of molecular weight 2 (hydrogen), and components of molecular weight 18 (water vapor) were measured. . The amount of generated gas (peak intensity) is shown in Table 1. [Comparative Example 3] It was the same as Example 1 except that a commercially available molecular sieve powder was added to the photosensitive composition so that the ratio in the solid content component was 20% by mass, and dispersed to make it uniform. Way to obtain a photosensitive composition. Using the obtained photosensitive composition, a cured film was formed on a SiN substrate in the same manner as in Example 1. Regarding the SiN substrate provided with a cured film, in the same manner as in Example 1, the amounts of components of molecular weight 1 (hydrogen radicals or hydrogen ions), components of molecular weight 2 (hydrogen), and components of molecular weight 18 (water vapor) were measured. . The amount of generated gas (peak intensity) is shown in Table 1. [Table 1] The comparison between Example 1 and Comparative Examples 1 and 2 shows that when a photosensitive composition containing a hydrogen barrier agent having a specific structure is used to form a cured film on a SiN substrate, the cured film can effectively suppress the generation of SiN. Gas transmission. On the other hand, according to the comparison between Comparative Example 3 and Comparative Examples 1 and 2, it can be seen that even if a material capable of adsorbing hydrogen or water such as molecular sieve is added to a hardened film formed using a photosensitive composition, it is almost impossible to suppress the Permeation of gas generated by SiN. <Examples 2 to 4, Comparative Examples 4 to 5> [Example 2] Except that the epoxy-containing structural unit of the alkali-soluble resin of Example 1 was replaced with a structural unit derived from glycidyl methacrylate A composition for forming a hydrogen barrier film was obtained in the same manner as in Example 1 except for the resin. [Comparative Example 4] A film-forming composition for comparison was obtained in the same manner as in Example 2 except that the hydrogen barrier agent having the above-mentioned structure was not used. [Example 3] Except that the epoxy-containing structural unit of the alkali-soluble resin of Example 1 was replaced with a resin derived from a structural unit derived from 3,4-epoxycyclohexyl methyl methacrylate, A composition for forming a hydrogen barrier film was obtained in the same manner as in Example 1. [Comparative Example 5] A film-forming composition for comparison was obtained in the same manner as in Example 3 except that the hydrogen barrier agent having the above-mentioned structure was not used. [Example 4] A composition for forming a hydrogen barrier film was obtained in the same manner as in Example 1 except that the addition amount of the hydrogen barrier agent in Example 1 was 0.6 parts by mass. After each obtained composition was made into a coating film on a SiN substrate (a multilayer body having a SiN layer on a silicon wafer), the coating film was pre-baked at 80 ° C for 100 seconds. Use UV curing machine with an exposure of 50 mJ / cm ² The entire surface of the pre-baked coating film is exposed (ghi light broadband) to harden the coating film. By post-baking the coated film after exposure at 230 ° C. for 20 minutes, a cured film having a film thickness of 2.0 μm was obtained. The hardened films 2 to 4 and the comparative hardened films 4 to 5 were respectively used. Regarding the SiN substrate provided with each of the obtained cured films, the amount of each gas was compared in the same manner as in Example 1. As a result, the cured films 2 to 3 of the example were more effective than the corresponding comparative cured films 4 to 5, which were more effective Inhibit gas transmission. Moreover, the hardened film 4 of an Example can suppress gas permeation more effectively than the comparative example 2. <Examples 5 to 6, Comparative Examples 6 to 7> [Example 5] 100 parts by mass of a compound represented by the following formula (A-2) as a base material component, and 1 part by mass of the following formula (a1- The hardening agent represented by 2-1) and 10 parts by mass of the hydrogen barrier agent having the above-mentioned structure provided a composition for forming a hydrogen barrier film. [Chemical 100] [Chemical 101] [Comparative Example 6] A film-forming composition for comparison was obtained in the same manner as in Example 5 except that the hydrogen barrier agent having the above-mentioned structure was not used. [Example 6] A hydrogen barrier film formation was obtained in the same manner as in Example 5 except that 100 parts by mass of the compound represented by the following formula (A-3) was used instead of the compound represented by the above formula (A-2). combination. [Chemical 102] [Comparative Example 7] A film-forming composition for comparison was obtained in the same manner as in Example 6 except that the hydrogen barrier agent having the above-mentioned structure was not used. Each of the obtained compositions was made into a coating film on a SiN substrate (a laminated body having a SiN layer on a silicon wafer), and then an ultraviolet curing machine was used at an exposure of 50 mJ / cm. ² The entire surface was exposed (ghi light broadband) to obtain a hardened film having a film thickness of about 2.0 μm. The hardened films 5 to 6 and the comparative hardened films 6 to 7 were respectively used. Regarding the SiN substrate provided with the respective cured films, the amount of each gas was compared in the same manner as in Example 1. As a result, the cured films 5 to 6 of the example were more effective than the corresponding comparative cured films 6 to 7, which could be more effective. Inhibit gas transmission. <Examples 7 to 8 and Comparative Examples 8 to 9> [Example 7] A mixed resin component represented by the following formula (A-3) and the following formula (A-4) as a base material component was used and mixed ( Mass ratio (A-3): (A-4) = 70: 30) 100 parts by mass, 5 parts by mass of a hardener (naphthalenedicarboxylic acid derivative) represented by the following formula (a1-2-2), and the above structure 15 parts by mass of hydrogen barrier agent and 700 parts by mass of propylene glycol monomethyl ether acetate to obtain a composition for forming a hydrogen barrier film. [Chemical 103] [Chemical 104] [Chem. 105] [Comparative Example 8] A film-forming composition for comparison was obtained in the same manner as in Example 7 except that the hydrogen barrier agent having the above-mentioned structure was not used. [Example 8] Except that the mixed resin component was a mixed resin component represented by the following formula (A-5) and the following formula (A-6) (mass ratio (A-5): (A-6) = 70:30) A composition for forming a hydrogen barrier film was obtained in the same manner as in Example 7 except that 100 parts by mass was used as the base material component. [Chem. 106] [Chemical 107] [Comparative Example 9] A film-forming composition for comparison was obtained in the same manner as in Example 8 except that the hydrogen barrier agent having the above-mentioned structure was not used. After each obtained composition was made into a coating film on a SiN substrate (a multilayer body having a SiN layer on a silicon wafer), the coating film was pre-baked at 80 ° C. for 120 seconds. Use UV curing machine with an exposure of 50 mJ / cm ² The entire surface of the pre-baked coating film is exposed (ghi light broadband) to harden the coating film. By post-baking the coated film after exposure at 100 ° C. for 20 minutes, a cured film having a film thickness of 2.0 μm was obtained. The hardened films 7 to 8 and the comparative hardened films 8 to 9 were respectively used. Regarding the SiN substrate provided with each of the cured films, the amount of each gas was compared in the same manner as in Example 1. As a result, the cured films 7 to 8 of the example were more effective than the corresponding comparative cured films 8 to 9, which were more effective. Inhibited gas transmission.

Claims (8)

A hydrogen barrier agent comprising a compound represented by the following formula (0): [化 1] (In formula (0), R ² is an aromatic group which may have a substituent, R ³⁰ represents a hydrogen atom or a monovalent substituent having 1 to 40 carbon atoms; R ⁴ is a halogen atom, a hydroxyl group, a mercapto group, A thio group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonate group, a phosphine group, an phosphine group, a phosphonate group, or an organic group, and n is an integer of 0 or more and 3 or less). A composition for forming a hydrogen barrier film, comprising a base material component (A) and the hydrogen barrier agent (B) according to claim 1. The composition for forming a hydrogen barrier film according to claim 2, wherein the base material component (A) contains an alkali-soluble resin (A1) and a photopolymerizable compound (A2), and further contains a photopolymerization initiator (C). A hydrogen barrier film containing the hydrogen barrier agent (B) as claimed in claim 1. A hydrogen barrier film comprising a cured product of the composition for forming a hydrogen barrier film according to claim 3. A method for manufacturing a hydrogen barrier film, comprising: applying the composition for forming a hydrogen barrier film according to claim 3 on a substrate to form a coating film; and exposing the coating film. An electronic component comprising a passivation film and a hydrogen barrier film as claimed in claim 4 or 5. The electronic component as claimed in claim 7, which further comprises a TFT.