TW201813805A - 3D printing device with real-time temperature monitoring feature and temperature monitoring method thereof having a temperature sensor held in front of the processing path of the laser beam to sense in advance the temperature change of the surface in front of the processing point - Google Patents

3D printing device with real-time temperature monitoring feature and temperature monitoring method thereof having a temperature sensor held in front of the processing path of the laser beam to sense in advance the temperature change of the surface in front of the processing point Download PDF

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TW201813805A
TW201813805A TW105132423A TW105132423A TW201813805A TW 201813805 A TW201813805 A TW 201813805A TW 105132423 A TW105132423 A TW 105132423A TW 105132423 A TW105132423 A TW 105132423A TW 201813805 A TW201813805 A TW 201813805A
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Taiwan
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laser beam
temperature
temperature sensor
movable ring
printing device
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TW105132423A
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Chinese (zh)
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TWI633994B (en
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李明蒼
陳政雄
陳仕杰
慶昌 高
楊昌儒
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國立中興大學
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Abstract

A 3D printing device includes a printing unit and a sensing unit. The printing unit has a moving base and a laser emitter. The laser emitter is fixed on the moving base for emitting a laser beam onto a workpiece to be processed. The laser beam forms a processing point on the surface of the workpiece to be processed. The sensing unit has a movable ring and a temperature sensor. The movable ring is rotatably in socket joint with the laser emitter, and the temperature sensor is mounted on the movable ring so that the temperature sensor can rotate around the emission point of the laser beam due to the actuation of the movable ring. As such, the temperature sensor is held in front of the processing path of the laser beam, so as to sense in advance the temperature change of the surface of the workpiece to be processed in front of the processing point, and then adjust in real time the process parameters of the laser emitter according to the sensing result.

Description

可即時監控溫度之3D列印裝置及其溫度監控方法3D printing device capable of real-time monitoring temperature and temperature monitoring method thereof

本發明與3D列印技術有關,特別是指一種可即時監控溫度之3D列印裝置及該3D列印裝置之溫度監控方法。The invention relates to 3D printing technology, and particularly to a 3D printing device capable of real-time monitoring of temperature and a temperature monitoring method of the 3D printing device.

一般所謂的3D列印主要是使用粉末狀金屬或其他可黏合材料,藉由逐層累積的方式來完成物體的構造,現今被廣泛運用在許多地方,例如交通工具、服裝、藝術品及醫療用品等不同領域。The so-called 3D printing mainly uses powder metal or other adhesive materials to complete the structure of objects by layer by layer accumulation. Nowadays it is widely used in many places, such as transportation, clothing, art, and medical supplies. And other areas.

雖然3D列印具有高精度及高度客製化的優勢,但是仍然有技術上的限制。舉例來說,當使用雷射光束對工件進行一次的列印燒結之後,在熱能還沒有完全排除之下又在同一點進行一次列印燒結,導致前一次燒結過的材料在尚未完全凝固的情況下又累積新的材料,新累積上去的材料很可能在尺寸形狀方面會出現偏差,造成列印精度的降低。Although 3D printing has the advantages of high precision and high customization, it still has technical limitations. For example, after using the laser beam to print and sinter the workpiece once, the print sintering is performed at the same point before the thermal energy is completely removed, resulting in the situation that the previously sintered material has not yet completely solidified. New materials are accumulated underneath, and the newly accumulated materials are likely to deviate in size and shape, resulting in a reduction in printing accuracy.

為了解決上述問題,目前的做法是在加工過程中對加工點的溫度進行感測,並在加工完成之後針對感測結果進行製程參數的調整,但是事後的分析調整所能改善的效果相當有限,無法有效解決加工區域溫度不穩定的問題。In order to solve the above problems, the current method is to sense the temperature of the processing point during the processing, and adjust the process parameters based on the sensing results after the processing is completed. However, the effect of subsequent analysis and adjustment can be limited, The problem of unstable temperature in the processing area cannot be effectively solved.

本發明之主要目的在於提供一種3D列印裝置,其能即時監控加工點前方的溫度變化,進而即時調整製程參數來維持加工點的溫度穩定。The main purpose of the present invention is to provide a 3D printing device, which can monitor the temperature change in front of the processing point in real time, and then adjust the process parameters in real time to maintain the temperature stability of the processing point.

為了達成上述目的,本發明之3D列印裝置包含有一列印單元及一感測單元。該列印單元具有一移動座與一雷射光發射器,該雷射光發射器固設於該移動座,用以發射一雷射光束;該感測單元具有一可動環與一溫度感測器,該可動環可轉動地套設於該雷射光發射器,該溫度感測器設於該可動環,使得該溫度感測器能藉由該可動環而以該雷射光束之發射點為中心旋轉。藉此,該溫度感測器可以始終保持在該雷射光束之加工路徑的前方,用以預先感測加工點前方的溫度變化。To achieve the above object, the 3D printing device of the present invention includes a printing unit and a sensing unit. The printing unit has a moving base and a laser light emitter, and the laser light emitter is fixed on the moving base to emit a laser beam; the sensing unit has a movable ring and a temperature sensor, The movable ring is rotatably sleeved on the laser light transmitter, and the temperature sensor is provided on the movable ring, so that the temperature sensor can rotate around the emission point of the laser beam through the movable ring. . Thereby, the temperature sensor can always be kept in front of the processing path of the laser beam to sense the temperature change in front of the processing point in advance.

在本發明中,該感測單元更具有一伺服馬達、一驅動齒輪及一從動齒環,該伺服馬達設於該移動座,該驅動齒輪連接該伺服馬達,該從動齒環同軸地連接該可動環且嚙接於該驅動齒輪。藉此,該伺服馬達會利用該驅動齒輪與該從動齒環之間的嚙接關係來驅動該可動環轉動。In the present invention, the sensing unit further has a servo motor, a driving gear, and a driven gear ring. The servo motor is provided on the moving base. The driving gear is connected to the servo motor, and the driven gear ring is coaxially connected. The movable ring is also engaged with the driving gear. As a result, the servo motor uses the engagement relationship between the driving gear and the driven ring gear to drive the movable ring to rotate.

在本發明中,該3D列印裝置更包含有一微控制器,該微控制器設於該移動座且電性連接該溫度感測器,用以接收該溫度感測器之一感測訊號,並根據該感測訊號來控制該雷射光發射器的製程參數。In the present invention, the 3D printing device further includes a microcontroller, which is disposed on the mobile base and electrically connected to the temperature sensor for receiving a sensing signal from one of the temperature sensors, And controlling process parameters of the laser light transmitter according to the sensing signal.

在本發明中,該列印單元更具有兩相對之X軸極限開關與兩相對之Y軸極限開關,該兩X、Y軸極限開關分別設於該移動座之兩相對側面,用以確保作動過程的安全性。In the present invention, the printing unit further has two opposite X-axis limit switches and two opposite Y-axis limit switches. The two X and Y-axis limit switches are respectively disposed on two opposite sides of the moving base to ensure operation. Process safety.

本發明之次一目的在於提供一種前述3D列印裝置之溫度監控方法,包含有下列幾個步驟:a) 控制該雷射光發射器對一待加工工件發射該雷射光束,使該雷射光束在該待加工工件之表面形成一加工點;b) 控制該移動座帶動該雷射光發射器,使該雷射光發射器之雷射光束沿著一加工路徑移動;c) 控制該可動環帶動該溫度感測器以該雷射光束之發射點為中心旋轉,使該溫度感測器保持在該雷射光束之加工路徑的前方,用以預先感測該待加工工件之表面在該加工點前方的溫度變化。此外,前述溫度監控方法更包含有一步驟d),由該微控制器接收該溫度感測器所感測到的溫度變化,並根據感測結果即時調整該列印單元的製程參數。A second object of the present invention is to provide a temperature monitoring method for the aforementioned 3D printing device, including the following steps: a) controlling the laser light emitter to emit the laser beam to a workpiece to be processed, so that the laser beam Forming a processing point on the surface of the workpiece to be processed; b) controlling the moving base to drive the laser light emitter so that the laser beam of the laser light emitter moves along a processing path; c) controlling the movable ring to drive the The temperature sensor rotates around the emission point of the laser beam, so that the temperature sensor is kept in front of the processing path of the laser beam, and is used to sense in advance that the surface of the workpiece to be processed is in front of the processing point. Temperature change. In addition, the aforementioned temperature monitoring method further includes a step d), the microcontroller receives the temperature change sensed by the temperature sensor, and adjusts the process parameters of the printing unit in real time according to the sensing result.

有關本發明所提供之3D列印裝置的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。The detailed structure, characteristics, assembly or usage of the 3D printing device provided by the present invention will be described in the detailed description of the subsequent embodiments. However, those having ordinary knowledge in the field of the present invention should understand that the detailed descriptions and the specific embodiments listed in the implementation of the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.

請先參閱第1圖,圖中所示之機台10包含有一架體11,架體11之兩相對側邊設有兩條相對之X軸滑軌12及兩條相對之Y軸滑軌16,其中一條X軸滑軌12設有一X軸驅動源13,另外一條X軸滑軌12設有一X軸滑台14,X軸驅動源13與X軸滑台14之間藉由一X軸連桿15連接在一起,使得X軸驅動源13能透過X軸連桿15帶動X軸滑台14一起沿著一X軸方向移動,此外,其中一條Y軸滑軌16設有一Y軸驅動源17,另外一條Y軸滑軌16設有一Y軸滑台18,Y軸驅動源17與Y軸滑台18之間藉由一Y軸連桿19連接在一起,使得Y軸驅動源17能透過Y軸連桿19帶動Y軸滑台18一起沿著一Y軸方向移動。Please refer to FIG. 1 first. The machine 10 shown in the figure includes a frame 11. Two opposite sides of the frame 11 are provided with two opposite X-axis slide rails 12 and two opposite Y-axis slide rails 16. One of the X-axis slide rails 12 is provided with an X-axis drive source 13, the other X-axis slide rail 12 is provided with an X-axis slide stage 14, and the X-axis drive source 13 and the X-axis slide stage 14 are connected by an X-axis. The rods 15 are connected together, so that the X-axis driving source 13 can drive the X-axis slide table 14 to move along an X-axis direction through the X-axis link 15. In addition, one of the Y-axis slide rails 16 is provided with a Y-axis driving source 17. The other Y-axis slide rail 16 is provided with a Y-axis slide table 18, and the Y-axis drive source 17 and the Y-axis slide table 18 are connected by a Y-axis link 19, so that the Y-axis drive source 17 can pass through Y The shaft link 19 drives the Y-axis slide 18 to move along a Y-axis direction.

請再參閱第2及3圖,本發明之3D列印裝置20包含有一列印單元30、一感測單元40及一微控制器50。Please refer to FIGS. 2 and 3 again. The 3D printing device 20 of the present invention includes a printing unit 30, a sensing unit 40 and a microcontroller 50.

列印單元30具有一移動座31,移動座31具有一X軸穿孔32與一Y軸穿孔33,X、Y軸穿孔32、33之間上下錯開,移動座31分別藉由X、Y軸穿孔32、33安裝於X、Y軸連桿15、19,使得移動座31能被X、Y軸連桿15、19所帶動而沿著X軸方向及Y軸方向移動。為了避免移動座31在移動過程中發生撞機意外,移動座31之兩相對側面分別安裝有兩相對之X軸極限開關34與兩相對之Y軸極限開關35,用以確保作動過程的安全性。此外,列印單元30更具有一雷射光發射器36,雷射光發射器36之頂端固定於移動座31,用以對待加工工件60發射一雷射光束L。The printing unit 30 has a moving base 31, the moving base 31 has an X-axis perforation 32 and a Y-axis perforation 33, and the X and Y axis perforations 32 and 33 are staggered up and down. The moving base 31 is perforated by the X and Y axes, respectively. 32 and 33 are mounted on the X and Y axis links 15, 19, so that the moving seat 31 can be driven by the X and Y axis links 15, 19 to move along the X axis direction and the Y axis direction. In order to avoid the collision of the mobile base 31 during the movement, two opposite X-axis limit switches 34 and two opposite Y-axis limit switches 35 are installed on two opposite sides of the mobile base 31 to ensure the safety of the operation process. . In addition, the printing unit 30 further has a laser light emitter 36, and a top end of the laser light emitter 36 is fixed to the moving base 31 for emitting a laser beam L to the workpiece 60 to be processed.

如第2及3圖所示,感測單元40具有一伺服馬達41、一驅動齒輪42、一從動齒環43及一可動環44。伺服馬達41設於移動座31,驅動齒輪42連接伺服馬達41,從動齒環43可轉動地套設於雷射光發射器36且嚙接於驅動齒輪42,可動環44可轉動地套設於雷射光發射器36之底端且同軸地連接從動齒環43。藉此,伺服馬達41會利用驅動齒輪42與從動齒環43之間的嚙接關係來驅動可動環44相對雷射光發射器36轉動。此外,感測單元40更具有一溫度感測器45,溫度感測器45設於可動環44,使得溫度感測器45能藉由可動環44而以雷射光束L之發射點為中心旋轉。As shown in FIGS. 2 and 3, the sensing unit 40 includes a servo motor 41, a driving gear 42, a driven ring gear 43, and a movable ring 44. The servo motor 41 is provided on the moving base 31. The driving gear 42 is connected to the servo motor 41. The driven gear ring 43 is rotatably sleeved on the laser light transmitter 36 and is engaged with the driving gear 42. The movable ring 44 is rotatably sleeved on The bottom end of the laser light emitter 36 is coaxially connected to the driven ring gear 43. Accordingly, the servo motor 41 uses the engagement relationship between the driving gear 42 and the driven ring gear 43 to drive the movable ring 44 to rotate relative to the laser light emitter 36. In addition, the sensing unit 40 further has a temperature sensor 45. The temperature sensor 45 is disposed on the movable ring 44 so that the temperature sensor 45 can rotate around the emission point of the laser beam L through the movable ring 44. .

微控制器50設於移動座31且電性連接溫度感測器45,用以接收溫度感測器45之一感測訊號,並根據感測訊號來控制列印單元30的製程參數,例如移動座31的移動速度、雷射光發射器36的發射功率及雷射光發射器36的送粉速率等。The microcontroller 50 is disposed on the mobile base 31 and is electrically connected to the temperature sensor 45 to receive a sensing signal from one of the temperature sensors 45 and control the process parameters of the printing unit 30 according to the sensing signal, such as mobile The moving speed of the pedestal 31, the transmission power of the laser light emitter 36, and the powder feeding rate of the laser light emitter 36, and the like.

以上為本發明之3D列印裝置20的結構,以下再就本發明之溫度監控方法進行敘述,請參閱第4圖:The above is the structure of the 3D printing device 20 of the present invention. The temperature monitoring method of the present invention is described below, please refer to FIG. 4:

a) :由微控制器50控制雷射光發射器36對待加工工件60發射雷射光束L,使雷射光束L在待加工工件60之表面形成一加工點W。a): The microcontroller 50 controls the laser light emitter 36 to emit a laser beam L to the workpiece 60 to be processed, so that the laser beam L forms a processing point W on the surface of the workpiece 60 to be processed.

b) :由微控制器50控制移動座31帶動雷射光發射器36,使雷射光發射器36之雷射光束L沿著一加工路徑P移動。b): The micro-controller 50 controls the moving base 31 to drive the laser light emitter 36 so that the laser beam L of the laser light emitter 36 moves along a processing path P.

c):由微控制器50控制可動環帶動溫度感測器45以雷射光束L之發射點為中心旋轉,讓溫度感測器45始終保持在雷射光束L之加工路徑P的前方,用以感測待加工工件60之表面在加工點W前方的溫度變化。c): The micro-controller 50 controls the movable ring to drive the temperature sensor 45 to rotate around the emission point of the laser beam L, so that the temperature sensor 45 is always kept in front of the processing path P of the laser beam L. The temperature change of the surface of the workpiece 60 to be processed in front of the processing point W is sensed.

d):由微控制器50接收溫度感測器45所感測到的溫度變化,並根據感測結果即時調整列印單元30的製程參數,例如前述所提及的移動座31的移動速度、雷射光發射器36的發射功率及雷射光發射器36的送粉速率等。d): The microcontroller 50 receives the temperature change sensed by the temperature sensor 45, and adjusts the process parameters of the printing unit 30 in real time according to the sensing results, such as the aforementioned moving speed of the mobile base 31, lightning The transmission power of the laser light emitter 36 and the powder feed rate of the laser light emitter 36 are provided.

由上述可知,本發明之3D列印裝置20由溫度感測器45感測雷射光束L之加工路徑P前方的溫度,並經過微控制器50的分析之後即時調整製程參數,例如前方的溫度若高於微控制器50所設定之一基準溫度時,微控制器50會控制雷射光發射器36降低發射功率,反之則升高發射功率,或者是前方遇到需要轉彎時,微控制器50會控制移動座31進行加速或減速,同時搭配調整雷射光發射器的發射功率,原則上減速時降低發射功率,加速時則升高發射功率,如此可以使每一個加工點W的溫度保持在穩定狀態,以解決習用技術因溫度不固定所造成的精度不佳問題。It can be known from the above that the 3D printing device 20 of the present invention senses the temperature in front of the processing path P of the laser beam L by the temperature sensor 45 and adjusts the process parameters, such as the temperature in front, after the analysis by the microcontroller 50 If it is higher than one of the reference temperatures set by the microcontroller 50, the microcontroller 50 will control the laser light transmitter 36 to reduce the transmission power, otherwise it will increase the transmission power, or when it needs to turn in front, the microcontroller 50 It will control the mobile seat 31 to accelerate or decelerate, and adjust the transmission power of the laser light transmitter at the same time. In principle, reduce the transmission power when decelerating and increase the transmission power when accelerating. This can keep the temperature of each processing point W stable. State to solve the problem of poor accuracy caused by temperature irregularity in conventional technology.

10‧‧‧機台10‧‧‧machine

11‧‧‧架體11‧‧‧frame

12‧‧‧X軸滑軌12‧‧‧X-axis slide

13‧‧‧X軸驅動源13‧‧‧X-axis drive source

14‧‧‧X軸滑台14‧‧‧X-axis slide table

15‧‧‧X軸連桿15‧‧‧X-axis link

16‧‧‧Y軸滑軌16‧‧‧Y-axis slide

17‧‧‧Y軸驅動源17‧‧‧Y-axis drive source

18‧‧‧Y軸滑台18‧‧‧Y-axis slide table

19‧‧‧Y軸連桿19‧‧‧Y-axis link

20‧‧‧3D列印裝置20‧‧‧3D printing device

30‧‧‧列印單元30‧‧‧Printing Unit

31‧‧‧移動座31‧‧‧mobile seat

32‧‧‧X軸穿孔32‧‧‧X-axis perforation

33‧‧‧Y軸穿孔33‧‧‧Y-axis perforation

34‧‧‧X軸極限開關34‧‧‧X-axis limit switch

35‧‧‧Y軸極限開關35‧‧‧Y-axis limit switch

36‧‧‧雷射光發射器36‧‧‧laser light transmitter

L‧‧‧雷射光束L‧‧‧laser beam

P‧‧‧加工路徑P‧‧‧Processing path

40‧‧‧感測單元40‧‧‧sensing unit

41‧‧‧伺服馬達41‧‧‧Servo motor

42‧‧‧驅動齒輪42‧‧‧Drive gear

43‧‧‧從動齒環43‧‧‧ driven gear ring

44‧‧‧可動環44‧‧‧ Movable ring

45‧‧‧溫度感測器45‧‧‧Temperature sensor

50‧‧‧微控制器50‧‧‧Microcontroller

60‧‧‧待加工工件60‧‧‧Work piece to be processed

第1圖為本發明之3D列印裝置配合機台的外觀立體圖。 第2圖為本發明之3D列印裝置的外觀立體圖。 第3圖為本發明之3D列印裝置的底視圖。 第4圖為本發明之3D列印裝置的作動示意圖。FIG. 1 is an external perspective view of a 3D printing device cooperating with a machine according to the present invention. FIG. 2 is an external perspective view of a 3D printing device according to the present invention. FIG. 3 is a bottom view of the 3D printing device of the present invention. FIG. 4 is a schematic diagram of the operation of the 3D printing device of the present invention.

Claims (6)

一種3D列印裝置,包含有: 一列印單元,具有一移動座與一雷射光發射器,該雷射光發射器固設於該移動座,用以發射一雷射光束;以及 一感測單元,具有一可動環與一溫度感測器,該可動環可轉動地套設於該雷射光發射器,該溫度感測器設於該可動環,使得該溫度感測器能藉由該可動環而以該雷射光束之發射點為中心旋轉。A 3D printing device includes: a printing unit having a mobile base and a laser light emitter, the laser light emitter is fixed on the mobile base to emit a laser beam; and a sensing unit, There is a movable ring and a temperature sensor, the movable ring is rotatably sleeved on the laser light transmitter, and the temperature sensor is provided on the movable ring, so that the temperature sensor can be passed through the movable ring. Rotate around the emission point of the laser beam. 如請求項1所述之3D列印裝置,其中該感測單元更具有一伺服馬達、一驅動齒輪及一從動齒環,該伺服馬達設於該移動座,該驅動齒輪連接該伺服馬達,該從動齒環同軸地連接該可動環且嚙接於該驅動齒輪。The 3D printing device according to claim 1, wherein the sensing unit further includes a servo motor, a driving gear and a driven ring gear, the servo motor is disposed on the moving base, and the driving gear is connected to the servo motor. The driven toothed ring is coaxially connected to the movable ring and is engaged with the driving gear. 如請求項1所述之3D列印裝置,更包含有一微控制器,該微控制器設於該移動座且電性連接該溫度感測器,用以接收該溫度感測器之一感測訊號,並根據該感測訊號來控制該列印單元的製程參數。The 3D printing device according to claim 1, further comprising a microcontroller, which is disposed on the mobile base and is electrically connected to the temperature sensor for receiving one of the temperature sensors. Signals, and control the process parameters of the printing unit according to the sensing signals. 如請求項1所述之3D列印裝置,其中該列印單元更具有兩相對之X軸極限開關與兩相對之Y軸極限開關,該兩X、Y軸極限開關分別設於該移動座之兩相對側面。The 3D printing device according to claim 1, wherein the printing unit further has two opposite X-axis limit switches and two opposite Y-axis limit switches, and the two X and Y-axis limit switches are respectively disposed on the moving seat. Two opposite sides. 一種如請求項1所述之3D列印裝置的溫度監控方法,包含有下列步驟: a) 控制該雷射光發射器對一待加工工件發射該雷射光束,使該雷射光束在該待加工工件之表面形成一加工點; b) 控制該移動座帶動該雷射光發射器,使該雷射光發射器之雷射光束沿著一加工路徑移動;以及 c) 控制該可動環帶動該溫度感測器以該雷射光束之發射點為中心旋轉,使該溫度感測器保持在該雷射光束之加工路徑的前方,用以預先感測該待加工工件之表面在該加工點前方的溫度變化。A temperature monitoring method for a 3D printing device according to claim 1, comprising the following steps: a) controlling the laser light emitter to emit the laser beam to a workpiece to be processed, so that the laser beam is at the to-be-processed A processing point is formed on the surface of the workpiece; b) controlling the moving base to drive the laser light transmitter so that the laser beam of the laser light transmitter moves along a processing path; and c) controlling the movable ring to drive the temperature sensing The device rotates around the emission point of the laser beam, so that the temperature sensor is kept in front of the processing path of the laser beam, and is used for pre-sensing the temperature change of the surface of the workpiece to be processed in front of the processing point. . 如請求項5所述之溫度監控方法,更包含有一步驟d),由一微控制器接收該溫度感測器所感測到的溫度變化,並根據感測結果即時調整該列印單元的製程參數。The temperature monitoring method according to claim 5, further comprising a step d), a microcontroller receives the temperature change sensed by the temperature sensor, and adjusts the process parameters of the printing unit in real time according to the sensing result. .
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