TW201812369A - Camera lens module - Google Patents

Abstract

The disclosure provides a camera lens module, including a carrier, a circuit, and an optical lens. The carrier is formed in one piece and forms an accommodation space. The circuit is disposed on the carrier. The optical lens is disposed in the accommodation space and in contact with an inner surface of the carrier.

Description

 Photo lens module  

The present invention relates to a photographic lens module, and more particularly to a miniaturized photographic lens module.

With the rapid development of communication technology, camera units have been widely used in portable electronic devices such as mobile phones and tablet computers. In order to improve the quality of the picture taken by the camera unit, it is usually matched with an electromagnetic control unit to adjust the position of the camera lens module to achieve autofocus and/or zoom function, thereby enabling the camera lens to be molded. The group presents a clear image on the photosensitive element.

Since the camera module tends to be miniaturized in recent years, it is necessary to reduce the overall volume of the camera lens module, resulting in insufficient circuit setting space. In addition, when assembling the camera lens module, it is usually necessary to glue the lens frame (Lens Barrel) with the optical lens inside and the lens holder (Lens Holder) with the circuit on the outside, but the space is insufficient. In this case, the glue is often exposed to the circuit. As a result, once the camera lens module is affected by environmental stress (such as temperature and humidity changes) or external stress (rolling or impact), the glue between the frame and the lens carrier may fall off and the circuit may be damaged. Therefore, how to reduce the overall volume of the camera lens module and reduce the risk of circuit damage has become an important issue.

In view of the above, an object of the present invention is to provide a photographic lens module including a carrier member integrally formed and formed with an accommodating space, a circuit disposed on the carrier member, and an optical lens. The utility model is disposed in the accommodating space and contacts the inner side surface of the carrier.

In one embodiment, an optical axis of one of the aforementioned photographic lens modules passes through the center of the optical lens and is perpendicular to a reference surface, and the circuit and the projection area of the optical lens on the reference surface overlap.

In one embodiment, a top surface or a side surface of one of the aforementioned carriers is formed with a recess for receiving the circuit.

In one embodiment, the aforementioned circuit is directly formed by laser (Laser

Direct structuring, insert molding or Molded interconnect device is provided on the carrier.

In one embodiment, the aforementioned circuit is disposed on the surface or inside of the carrier.

In one embodiment, the photographic lens module further includes an elastic member disposed on the carrier and electrically connected to the circuit.

In an embodiment, the aforementioned camera lens module further includes an elastic member, and the circuit extends on an opposite side of the elastic member.

In one embodiment, the carrier has a recess for providing a sensing component or an integrated circuit.

In one embodiment, the groove is formed on one side of the carrier, and the depth of the groove on the side is greater than the height of the sensing element or the integrated circuit on the side.

In one embodiment, the groove is formed on a top surface of the carrier, and the depth of the groove on the top surface is greater than the sensing element or the height of the integrated circuit on the top surface. .

1‧‧‧Photo lens module

20‧‧‧Carrier

20U‧‧‧ top surface

20S‧‧‧ side

21‧‧‧through hole

22‧‧‧ accommodating space

20R‧‧‧ Groove

30‧‧‧ Circuitry

40‧‧‧Optical lenses

50‧‧‧Flexible components

60‧‧‧Electronic components

H1‧‧‧depth

H2‧‧‧ height

C‧‧‧ optical axis

Fig. 1A is a cross-sectional view showing a photographic lens module according to an embodiment of the present invention.

FIG. 1B is a top view of a photographic lens module according to an embodiment of the present invention.

2 is a cross-sectional view of a photographic lens module according to another embodiment of the present invention.

Figure 3 is a cross-sectional view showing a photographic lens module according to another embodiment of the present invention.

Figure 4 is a cross-sectional view showing a photographic lens module according to another embodiment of the present invention.

In the following, a number of specific preferred embodiments will be described in detail with reference to the accompanying drawings, which illustrate several embodiments. However, the present invention may be embodied in many different forms and is not limited to the embodiments described below. The embodiments provided herein may be made to provide a more complete and complete disclosure of the scope of the present invention. By.

First, please refer to FIGS. 1A and 1B, wherein FIGS. 1A and 1B are respectively a cross-sectional view and a top view of a photographic lens module 1 according to an embodiment of the present invention. The camera lens module 1 can be disposed in a portable electronic device (such as a mobile phone or a tablet), and can be combined with an electromagnetic control unit (not shown) to adjust the position of the camera lens module 1 to thereby wear The light from the photographic lens module 1 can present a clear image on a photosensitive element (not shown), thereby achieving autofocus and/or zoom, and the motor of the electromagnetic control unit is For example, it can be a voice coil motor (VCM, Voice Coil Motor) or a stepping motor.

As shown in FIGS. 1A and 1B , the photographic lens module 1 of the present embodiment mainly includes a carrier 20 , a circuit 30 , at least one optical lens 40 , and at least one elastic member 50 . The carrier 20 is formed with a through hole 21 . And an accommodating space 22, the circuit 30 and the elastic member 50 are disposed on the carrier 20, wherein the elastic member 50 is connected to the carrier 20 to a casing (not shown), so that the photographic lens module 1 can be inside the casing The optical lens 40 is disposed in the accommodating space 22 and contacts the inner side surface of the carrier 20 . It should be particularly noted that the number of the circuit 30, the optical lens 40, and the elastic member 50 in the photographic lens module 1 may be appropriately increased or decreased, and not limited thereto, and the elastic member 50 may be replaced by other movable mechanisms (for example, Ball mechanism) to connect the carrier 20 and the outer casing.

In this embodiment, the carrier 20 has a substantially cylindrical structure. The through hole 21 has a circular structure and penetrates the carrier 20 to connect the accommodating space 22. The aperture and shape of the through hole 21 can be changed according to design requirements. . For example, the carrier 20 may have a thermosetting plastic material, such as diallyl phthalate (DAP, Diallyl Phthalate Plastics), thermoplastic plastic polyphthalamide (PPA, Polyphthalamide), liquid crystal. High Performance Polymer (LCP), Polyamide (PA, Polyamide), Polycarbonate (PC, Polycarbonate) or Polycarbonate Resin and Acrylic Butadiene-Styrene Copolymer (PC/ ABS, Polycarbonate/Acrylonitrile-Butadene-Stvrene), and the carrier 20 can be produced by injection molding or hot press molding. It should be understood that the appearance and material of the carrier 20 are not limited by the above embodiments. In an embodiment, the carrier 20 can also have a square structure or a metal material.

As shown in FIGS. 1A and 1B, the circuit 30 of the present embodiment extends over the top surface 20U and the side surface 20S of the carrier 20, wherein the circuit 30 can be integrally formed by laser direct structuring (LDS, Laser Direct Structuring). On the 20th. In an embodiment, the circuit 30 can also be integrally formed on the carrier 20 by means of Insert Molding or Molded Interconnect Device. It should be understood that the present invention does not limit the circuit 30 to only the top surface 20U and the side surface 20S. In an embodiment, the circuit 30 can also be embedded inside the carrier 20 .

Please refer to FIGS. 1A and 1B. The elastic member 50 is, for example, a spring piece having a circular structure and disposed around the upper half of the carrier 20 for supporting the carrier 20 and making it vertical. The direction (Y direction) movement is suspended in a casing (not shown). In addition, an elastic member 50 may be separately disposed on the upper half and the lower half of the carrier 20, and may be electrically connected to the circuit board outside the camera lens module 1 through the elastic member 50.

As shown in FIG. 1A, the plurality of optical lenses 40 may have different sizes and are sequentially arranged in the accommodating space 22, wherein the optical lens 40 may have a glass or plastic material, and the optical axis C of the photographic lens module 1 It passes through the center of the through hole 21 and the optical lens 40, and is perpendicular to the XZ plane (reference surface). It should be understood that since a part of the circuit 30 is disposed on the top surface 20U of the carrier 20 to make full use of the space, it can be found from the upper viewing angle that at least a portion of the circuit 30 and the optical lens 40 are on the XZ plane. The projection areas overlap each other.

Please refer to FIG. 2, which is a cross-sectional view of the photographic lens module 1 according to another embodiment of the present invention. As shown in FIG. 2, the photographic lens module 1 of another embodiment of the present invention mainly includes a carrier 20, a circuit 30, at least one optical lens 40, and at least one elastic member 50. It should be noted that the main difference between the embodiment and the embodiment of FIGS. 1A and 1B is that the carrier 20 of the embodiment has a recess 20R formed on the side surface 20S of the carrier 20 for receiving The circuit 30 prevents damage to the circuit 30 from collision with other external components, wherein the height of the circuit 30 is less than the depth of the recess 20R. In addition, in the embodiment, the circuit 30 located on the top surface 20U of the carrier 20 is embedded in the carrier 20, thereby preventing the circuit 30 from being damaged by collision with other external components, wherein the circuit 30 can directly pass through the laser. It is integrally formed inside the carrier 20 by means of a laser direct structuring, an insert molding or a molded interconnect device.

Please refer to FIG. 3, which is a cross-sectional view of the photographic lens module 1 according to another embodiment of the present invention. As shown in FIG. 3, the photographic lens module 1 of the present embodiment mainly includes a carrier 20, a circuit 30, at least one optical lens 40, and at least one elastic member 50. It should be noted that the main difference between the embodiment and the embodiment of FIGS. 1A and 1B is that the carrier 20 of the embodiment has a recess 20R formed on the side surface 20S for accommodating an electronic device. The component 60 extends from the opposite side of the resilient component 50 and is electrically coupled to the resilient component 50. The electronic component 60 can be, for example, a sensing component or an integrated circuit, and the electronic signal generated by the electronic component 60 can be transmitted to the control system (not shown) outside the camera lens module 1 via the circuit 30 and the elastic component 50. The system can further adjust the driving current supplied to the electromagnetic control unit according to the electronic signal to quickly drive the camera lens module 1 to move to an appropriate position relative to the outer casing to achieve the function of focusing.

It should be noted that the groove 20R has a depth h1 in the direction of the vertical side surface 20S (ie, the X direction), and the electronic component 60 has a height h2 in the X direction, wherein the depth h1 is greater than the height h2, that is, the electronic component 60 It does not protrude from the recess 20R, whereby damage of the electronic component 60 due to collision with other parts can be avoided. Further, the present invention does not limit the groove 20R to be formed on the side surface 20S. In an embodiment, the groove 20R may also be formed on the top surface 20U, wherein the depth of the groove 20R in the vertical top surface 20U direction (Y-axis direction) is greater than the electronic component 60 in the vertical top surface 20U direction (Y-axis direction). The height of the upper side can also prevent the electronic component 60 from being damaged by collision with other parts.

Referring to FIG. 4, a cross-sectional view of a photographic lens module 1 according to another embodiment of the present invention is shown. As shown in FIG. 4, the photographic lens module 1 of the present embodiment mainly includes a carrier 20, a circuit 30, at least one optical lens 40, and at least one elastic member 50. It should be noted that the main difference between the embodiment and the embodiment of FIG. 2 is that the groove 20R of the carrier 20 in the embodiment is disposed on the top surface 20U of the carrier 20 for receiving the top portion. Circuit 30 on face 20U, wherein the height of circuit 30 is less than the depth of groove 20R to avoid damage to circuit 30 from colliding with other parts.

In summary, the present invention provides a photographic lens module including a carrier member, a circuit, at least one optical lens, and an elastic member, wherein the optical lens is disposed in an accommodating space of the carrier member and contacts the carrier member. The inside surface. When one of the optical lens modules passes through the center of the optical lens and is perpendicular to a reference surface, the circuit and the optical lens are projected onto the reference surface, and the projected areas of the two overlap each other. The invention integrates the conventional lens and the lens carrier into a photographic lens module, so that the photographic lens module can save manufacturing cost compared with the prior art, and has ample space for configuring circuits and electronic components, and It avoids damage to circuits and electronic components caused by collision with other parts, which can greatly reduce the overall volume and effectively improve product reliability.

Although the present invention has been disclosed in its preferred embodiments, it is not intended to limit the invention, and the invention may be modified by those skilled in the art without departing from the spirit and scope of the invention. The scope of the present invention is defined by the scope of the appended claims.

Claims (10)

 A photographic lens module includes: a carrier member integrally formed and formed with an accommodating space; a circuit disposed on the carrier member; and an optical lens disposed in the accommodating space and contacting The inside surface of the carrier.    The photographic lens module of claim 1, wherein an optical axis of the photographic lens module passes through a center of the optical lens and is perpendicular to a reference surface, and the circuit and the optical lens are on the reference surface The projected areas overlap.    The photographic lens module of claim 1, wherein a top surface or a side surface of the carrier is formed with a recess for receiving the circuit.    The photographic lens module of claim 1, wherein the circuit is integrally formed on the carrier by laser direct molding, insert molding or molding of the interconnection member.    The photographic lens module of claim 1, wherein the circuit is disposed on a surface or an interior of the carrier.    The photographic lens module of claim 1, wherein the photographic lens module further comprises an elastic member disposed on the carrier and electrically connected to the circuit.    The photographic lens module of claim 1, wherein the photographic lens module further comprises an elastic member, and the circuit extends on an opposite side of the elastic member.    The photographic lens module of claim 1, wherein the carrier has a recess for providing a sensing component or an integrated circuit.    The photographic lens module of claim 8, wherein the groove is formed on a side of the carrier, and the depth of the groove is greater than a height of the sensing element or the integrated circuit.    The photographic lens module of claim 8, wherein the groove is formed on a top surface of the carrier, and the depth of the groove is greater than a height of the sensing element or the integrated circuit.