TW201811153A - Electronic device having loop heat pipe - Google Patents

Abstract

The present invention discloses an electronic device having loop heat pipe. The electronic device having loop heat pipe includes a body, a camera module and a loop heat pipe. The camera module and the loop heat pipe are disposed inside the body, and the camera module is arranged on a top region of the body. The loop heat pipe defines a vapor outlet direction which is flowing toward the top region.

Description

Electronic device with loop type heat pipe

This case relates to an electronic device with a heat pipe, especially an electronic device with a loop type heat pipe.

With the rapid development of computers and various electronic products and the convenience they have brought, modern people have cultivated the habit of using time. However, when computers and various electronic products are operated for a long time, their The shortcoming that the heat cannot be dissipated in time is also accompanied.

Generally speaking, electronic products generally use fan-type heat dissipation, but installing fans will inevitably generate noise, and device fans are very unfavorable for thinner volume requirements. Another heat dissipation method is to use a heat dissipation paste or a heat sink to attach to the heating element of the electronic product to absorb the heat of the heating element to dissipate. However, this method has poor heat dissipation efficiency and limited effect. Therefore, the conventional heat dissipation ring still needs to be improved.

The main purpose of the present invention is to provide a circuit with a heat pipe Electronic device, and the loop type heat pipe has a high and low level difference. By responding to the characteristic that the gas will evaporate upward, no matter whether the electronic device with the loop type heat pipe is used upright or lying down, it can have good heat dissipation efficiency.

A preferred implementation concept of this case is to provide an electronic device with a loop-type heat pipe, including: a body having a top area; a lens module disposed at the top area of the body; and a loop-type heat pipe disposed at In the body, the loop-type heat pipe includes a pipe body and an evaporator, the pipe body and the evaporator together define a closed loop, and the closed loop is for a heat transfer medium to flow therein, and the closed loop defines a gas The outflow direction, the gas outflow direction is the direction in which the heat transfer medium leaves the evaporator toward the top region; and at least one electronic component is connected to the loop heat pipe, so that the loop heat pipe receives from the at least one A thermal energy of electronic components.

In a preferred embodiment, the loop heat pipe and the at least one electronic component are located below the top area.

In a preferred embodiment, the evaporator has a gaseous outlet hole and a liquid inlet hole, and the evaporator receives the heat energy from the at least one electronic component to change the phase of the heat transfer medium from liquid to gaseous state, Then the heat transfer medium leaves the evaporator from the gaseous outlet hole and enters the tube body, and flows in the gas outflow direction, wherein the gas outflow direction faces the lens module.

In a preferred embodiment, the electronic device with a loop-type heat pipe in this case further includes a condenser, the condenser is connected to the loop-type heat pipe, and receives The heat transfer medium of the evaporator, the condenser receives the heat energy of the heat transfer medium and causes the heat transfer medium to change phase from gaseous state to liquid state, and then the heat transfer medium flows back into the evaporator from the liquid inlet hole .

In a preferred embodiment, the tube body includes a first section tube body portion, a second section tube body portion, and two connecting section tube body portions, and each of the connecting section tube body portions The two ends of each are connected to one end of the first section tube body portion and the second section tube body portion, wherein the first section tube body portion has a first height level, the second section tube body The portion has a second height level, the first height level is different from the first height level, and both of the connecting section tube bodies have a slope to connect the first section tube body portion with high and low drop The second section tube body.

In a preferred embodiment, the first section tube body is farther away from the top region than the second section tube body.

In a preferred embodiment, the lens module has a light incident surface, the horizontal height of the light incident surface is higher than the horizontal height of the first section tube body and the horizontal height of the second section tube body And the horizontal height of the first section tube body is lower than that of the second section tube body.

In a preferred embodiment, the condenser is disposed in the tube body of the second section.

In a preferred embodiment, the distance between the lens module and the gaseous outlet hole is smaller than the distance between the lens module and the liquid inlet hole.

Another preferred implementation concept of this case is to provide an electronic device with a loop-type heat pipe, including: A body; a lens module, disposed in a top area of the body; a loop-type heat pipe, disposed in the body, the loop-type heat pipe includes a pipe body and an evaporator, the pipe body and the evaporator are jointly defined A closed loop is provided, and the closed loop is provided with a heat transfer medium flowing therein; and at least one electronic component is connected to the loop-type heat pipe, so that the loop-type heat pipe receives a thermal energy from the at least one electronic element.

In a preferred embodiment, the closed loop defines a gas outflow direction, which is the direction in which the heat transfer medium leaves the evaporator toward the top region, or the closed loop defines a gas outflow direction The outflow direction of the gas is the direction in which the heat transfer medium leaves the evaporator and away from the top region.

In a preferred embodiment, the tube body includes a first section tube body portion, a second section tube body portion, and two connecting section tube body portions, and each of the connecting section tube body portions The two ends of each are connected to one end of the first section tube body portion and the second section tube body portion, wherein the first section tube body portion has a first height level, the second section tube body The portion has a second height level, the first height level is different from the first height level, and both of the connecting section tube bodies have a slope to connect the first section tube body portion with high and low drop The second section tube body.

In a preferred embodiment, the first section tube body is farther away from the top region than the second section tube body.

In a preferred embodiment, the lens module has a light incident surface, the The horizontal height of the light incident surface is higher than the horizontal height of the first section tube body and the horizontal height of the second section tube body, and the horizontal height of the first section tube body is lower than the second area The horizontal height of the tube body.

1‧‧‧Electronic device with loop heat pipe

11‧‧‧Body

110‧‧‧Top area

12‧‧‧lens module

120‧‧‧entrance

13‧‧‧loop heat pipe

131‧‧‧tube

131a‧‧‧The first section tube body

131b‧‧‧Second section tube body

131c‧‧‧ Connect the pipe body

132‧‧‧Evaporator

132’‧‧‧evaporator

132a‧‧‧gaseous outlet

132b‧‧‧liquid inlet

14‧‧‧Electronic components

2‧‧‧Electronic device with loop heat pipe

21‧‧‧Body

22‧‧‧lens module

23‧‧‧loop heat pipe

231a‧‧‧The first section tube body

231b‧‧‧Second section tube body

231c‧‧‧ Connect the pipe body

24‧‧‧Electronic components

25‧‧‧Condenser

F1‧‧‧gas outflow direction

F2‧‧‧Liquid inflow direction

F3‧‧‧gas outflow direction

FIG. 1 is a schematic perspective view of a first embodiment of an electronic device with a loop-type heat pipe in this case.

FIG. 2 is a schematic front view of a first embodiment of an electronic device with a loop-type heat pipe in this case.

FIG. 3 is a schematic side view of a first embodiment of an electronic device with a loop-type heat pipe in this case.

4 is a schematic perspective view of a first embodiment of an electronic device with a loop-type heat pipe in this case.

5 is a schematic perspective view of a second embodiment of an electronic device with a loop-type heat pipe in this case.

FIG. 1 is a perspective schematic view of a first embodiment of an electronic device with a loop-type heat pipe in this case, and FIG. 2 is a schematic front view of a first embodiment of an electronic device with a loop-type heat pipe in this case. Please refer to FIG. 1 and FIG. 2. The electronic device 1 with a loop-type heat pipe in this case includes a body 11, a lens module 12, a loop-type heat pipe 13 and at least one electronic component 14, and the lens module 12, the loop-type heat pipe 13 and At least one electronic component 14 is disposed in the body 11. Therefore, it should be noted that the electronic component 14 in this case may be a central processing unit or a display card or other electronic components that will generate waste heat due to the execution of the operation, and the purpose of providing a loop-type heat pipe 13 in this case is to remove waste heat from the electronic component go. In terms of component arrangement, the electronic component 14 directly or indirectly contacts the loop-type heat pipe 13 to conduct waste heat from the electronic component to the loop-type heat pipe 13 through heat conduction. In addition, the lens module 12 in this case may include a single lens or more than two lenses, and the number is not limited.

In a preferred embodiment of the present case, a heat conducting element 16 is connected between the electronic element 14 and the loop type heat pipe 13 in this case, so as to conduct waste heat to the loop type heat pipe 13 through the heat conducting element 16. Of course, if the electronic component 14 is directly attached to the loop heat pipe 13, that is, the waste heat is directly transmitted to the loop heat pipe 13 without passing through other objects, it is also a feasible arrangement.

Further, the loop heat pipe 13 includes a pipe body 131 and an evaporator 132. The pipe body 131 and the evaporator 132 together define a closed loop, and the closed loop allows a heat transfer medium (not shown) to flow therein. When the heat transfer medium flows to the evaporator 132, it will absorb the waste heat from the electronic component 14. After the heat transfer medium absorbs enough heat energy, the heat transfer medium will undergo a phase change and change from the liquid state to the gas state. In this case, the closed circuit of the electronic device 1 with a loop type heat pipe defines a gas outflow direction F1 and a liquid inflow direction F2. The gas outflow direction F1 is that the heat transfer medium leaves the evaporator 132 and faces a top region 110 of the body 11 Direction. Afterwards, after the heat energy dissipated by the heat transfer medium, a phase change occurs and the gas state is converted into a liquid state, so that the liquid heat transfer medium is away from the top region 110 (liquid flow The flow direction F2) flows into the evaporator 132. Therefore, the gas outflow direction F1 and the liquid inflow direction F2 together form a circulation path.

It should be noted that the lens module 12 of the electronic device 1 with a loop-type heat pipe in this case is disposed in the top region 110 of the body 11, and the loop-type heat pipe 13 and the electronic component 14 are located below the top region 110. Furthermore, the evaporator 132 has a gaseous outlet hole 132a and a liquid inlet hole 132b. The heat transfer medium generates a phase change from the liquid state to the gaseous state after the evaporator 132 absorbs the heat energy, and then leaves the evaporator 132 from the gaseous outlet hole 132a Enters the tube body 131 and flows in the gas outflow direction F1, where the gas outflow direction F1 is toward the top region 110, that is, toward the lens module 12, but this is to design the loop type heat pipe 13 (including the evaporator 132) to be only One-way circulation implementation. In this embodiment, the distance between the lens module 12 and the gaseous outlet hole 132a is smaller than the distance between the lens module 12 and the liquid inlet hole 132b. If in another embodiment, the loop-type heat pipe 13 (including the evaporator 132 ') is designed to be designed to be bidirectionally circulated, then the electronic device 1 with the loop-type heat pipe in this case is placed upright (see FIG. 2), The heat transfer medium leaves the evaporator from the gaseous outlet hole 132a and flows in the gas outflow direction F1; when placed upside down (see FIG. 3), the heat transfer medium leaves the evaporator and flows in the gas outflow direction F3. Of course, whether the loop-type heat pipe 13 is designed to be unidirectional or bidirectional is within the scope claimed in this case.

FIG. 4 is a schematic side view of a first embodiment of an electronic device with a loop-type heat pipe in this case, and please refer to FIGS. 1 to 4 in combination. The pipe body 131 includes a first section pipe body portion 131a, a second section pipe body portion 131b, and two connecting section pipe body portions 131c, and the two ends of each connecting section pipe body portion 131c are respectively connected Tube in the first section One end of the body portion 131a and the second section tube body portion 131b, thereby forming a fluid communication circuit. In a preferred embodiment of this case, the first section tube body portion 131a, the second section tube body portion 131b, and the two connecting section tube body portions 131c are integrally formed. Furthermore, the first segment tube body portion 131a and the second segment tube body portion 131b are U-shaped, and the U-shaped openings of the first segment tube body portion 131a and the second segment tube body portion 131b are opposed. The first section tube body 131a has a first height level, the second section tube body 131b has a second height level, and the first height level is different from the first height level. In other words, in terms of appearance structure, since the first section tube body portion 131a and the second section tube body portion 131b have a height drop, the two connecting tube body portions 131c are provided with a slope to connect The first section tube body portion 131a and the second section tube body portion 131b having a high-low drop.

Furthermore, the second section tube body portion 131b is closer to the top region 110, and the first section tube body portion 131a is further away from the top region 110. On the other hand, if a light incident surface 120 of the lens module 12 is used as a comparison reference, the horizontal height of the light incident surface 120 is higher than the horizontal height of the second section tube body portion 131b, and the second section tube body The horizontal height of the portion 131b is higher than the horizontal height of the first section tube body portion 131a. In this case, the first section tube body portion 131a and the second section tube body portion 131b are provided with a height difference, so that the electronic device 1 with a loop-type heat pipe in this case is suitable to evaporate upwards in response to gas when it is lying down The heat transfer medium leaves the evaporator 132 to flow toward the second-level tube body portion 131b at a higher level (ie, the gas outflow direction F1) and the electronic device 1 with a loop-type heat pipe in this case is used upright (ie When being used by the user), because the loop-type heat pipe 13 itself also has a part of the loop in the vertical direction, it is suitable for the gas to escape upwards The property of the heat transfer medium leaves the evaporator 132 flowing in the direction of the top region 110 (that is, the gas flowing direction F1). Therefore, the high-low undulating structure of the loop heat pipe 13 in this case is the characteristic of the upward vaporization of the gas state and the downward flow of the liquid state, which helps the flow of the heat transfer medium in the loop heat pipe 13 to improve the heat dissipation efficiency.

5 is a schematic perspective view of a second embodiment of an electronic device with a loop-type heat pipe in this case. The second embodiment is similar to the first embodiment. The electronic device 2 with a loop heat pipe in this case includes a body 21, a lens module 22, a loop heat pipe 23, and at least one electronic component 24, and the loop heat pipe 23 includes a The evaporator 232, a first section tube body 231a, a second section tube body 231b, and two connecting section tube bodies 231c. The second embodiment differs from the first embodiment in that the electronic device 2 with a loop heat pipe in the second embodiment further includes a condenser 25 to receive the heat transfer medium from the evaporator 25, and the condenser 25 accepts The heat energy of the heat transfer medium then changes the phase of the heat transfer medium from gas to liquid, and then the heat transfer medium flows back into the evaporator 25. The second embodiment is different from the first embodiment in that the position of the evaporator 232 and the condenser 25 are opposite to each other. The condenser 25 is connected to the second section tube body 231b of the loop heat pipe and evaporates. The device 232 is located in the tube body portion 231a of the first section, so as to achieve the best heat dissipation efficiency.

In summary, the electronic device with a loop-type heat pipe in this case includes a loop-type heat pipe with a height difference, so that the electronic device with a loop-type heat pipe can be made thinner. Moreover, regardless of whether the electronic device with a loop-type heat pipe is used upright or lying down, it can achieve good heat dissipation benefits due to the material characteristics of the heat transfer medium.

The above-mentioned embodiments are merely illustrative for explaining the principle and effect of the present invention, and explaining the technical features of the present invention, rather than limiting the protection scope of the present invention. Anyone who is familiar with this technology can easily complete the changes or equal arrangements without violating the technical principles and spirit of the present invention, which are within the scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the scope of patent application mentioned later.

1‧‧‧Electronic device with loop heat pipe

11‧‧‧Body

110‧‧‧Top area

12‧‧‧lens module

13‧‧‧loop heat pipe

131‧‧‧tube

131a‧‧‧The first section tube body

131b‧‧‧Second section tube body

131c‧‧‧ Connect the pipe body

132‧‧‧Evaporator

132a‧‧‧gaseous outlet

132b‧‧‧liquid inlet

14‧‧‧Electronic components

15‧‧‧Condenser

F1‧‧‧gas outflow direction

F2‧‧‧Liquid inflow direction

Claims (14)

An electronic device with a loop-type heat pipe includes: a body with a top area; a lens module disposed at the top area of the body; a loop-type heat pipe disposed within the body, the loop-type heat pipe including a A tube body and an evaporator, the tube body and the evaporator together define a closed circuit, and the closed circuit for a heat transfer medium to flow therein, the closed circuit defines a gas outflow direction, the gas outflow direction is the The heat transfer medium leaves the evaporator and flows toward the top region; and at least one electronic component is connected to the loop-type heat pipe, so that the loop-type heat pipe receives a thermal energy from the at least one electronic element. The electronic device with a loop type heat pipe as described in item 1 of the application scope, wherein the loop type heat pipe and the at least one electronic component are located below the top area. The electronic device with a loop-type heat pipe as described in item 2 of the application scope, wherein the evaporator has a gaseous outlet hole and a liquid inlet hole, and the evaporator receives the heat energy from the at least one electronic component to cause the heat transfer The phase change of the medium changes from the liquid state to the gas state, and then the heat transfer medium leaves the evaporator from the gas state outlet hole and enters the tube body, and flows in the gas outflow direction, wherein the gas outflow direction faces the lens module. The electronic device with a loop-type heat pipe as described in item 3 of the scope of application further includes a condenser connected to the loop-type heat pipe and receiving the heat transfer medium from the evaporator, the condenser receiving the The heat energy of the heat transfer medium then changes the phase of the heat transfer medium from gas to liquid, and then the heat transfer medium comes from the liquid inlet The holes flow back into the evaporator. The electronic device with a loop type heat pipe as described in item 4 of the application scope, wherein the pipe body includes a first section pipe body portion, a second section pipe body portion, and two connecting section pipe body portions, and The two ends of each connecting section tube body are respectively connected to one ends of the first section tube body and the second section tube body, wherein the first section tube body has a first Height level, the second section tube body has a second height level, the first height level is different from the first height level, and the two connection section tube bodies have a slope to connect with a high and low drop The first section tube body and the second section tube body. The electronic device with a loop-type heat pipe as described in item 5 of the application scope, wherein the first section tube body is farther from the top area than the second section tube body. The electronic device with a loop type heat pipe as described in item 6 of the application scope, wherein the lens module has a light incident surface, the horizontal height of the light incident surface is higher than the horizontal height of the tube body of the first section and the The horizontal height of the second section tube body, and the horizontal height of the first section tube body is lower than the horizontal height of the second section tube body. The electronic device with a loop-type heat pipe as described in item 7 of the application scope, wherein the condenser is provided in the tube body of the second section. The electronic device with a loop type heat pipe as described in item 3 of the application scope, wherein the distance between the lens module and the gaseous outlet hole is smaller than the distance between the lens module and the liquid inlet hole. An electronic device with a loop-type heat pipe includes: a body; A lens module is arranged in a top area of the body; a loop type heat pipe is arranged in the body, the loop type heat pipe includes a pipe body and an evaporator, the pipe body and the evaporator jointly define a closed A loop, and the closed loop allows a heat transfer medium to flow therein; and at least one electronic component connected to the loop-type heat pipe so that the loop-type heat pipe receives a thermal energy from the at least one electronic element. The electronic device with a loop-type heat pipe as described in item 10 of the application scope, wherein the closed loop defines a gas outflow direction, which is the direction in which the heat transfer medium leaves the evaporator and flows toward the top region, Or, the closed loop defines a gas outflow direction, which is the direction in which the heat transfer medium leaves the evaporator and away from the top region. The electronic device with a loop-type heat pipe as described in item 11 of the application scope, wherein the pipe body includes a first section pipe body portion, a second section pipe body portion, and two connecting section pipe body portions, and The two ends of each connecting section tube body are respectively connected to one ends of the first section tube body and the second section tube body, wherein the first section tube body has a first Height level, the second section tube body has a second height level, the first height level is different from the first height level, and the two connection section tube bodies have a slope to connect with a high and low drop The first section tube body and the second section tube body. The electronic device with a loop-type heat pipe as described in item 12 of the application scope, wherein the first section tube body is farther from the top area than the second section tube body. The electronic device with a loop type heat pipe as described in item 13 of the application scope, wherein the lens module has a light incident surface, and the light incident surface has a higher level than the first section tube The horizontal height of the body portion and the horizontal height of the second section tube body portion, and the horizontal height of the first section tube body portion is lower than the horizontal height of the second section tube body portion.