TW201805733A - Projection exposure apparatus, and projection exposure method thereof - Google Patents

Projection exposure apparatus, and projection exposure method thereof Download PDF

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Publication number
TW201805733A
TW201805733A TW106117387A TW106117387A TW201805733A TW 201805733 A TW201805733 A TW 201805733A TW 106117387 A TW106117387 A TW 106117387A TW 106117387 A TW106117387 A TW 106117387A TW 201805733 A TW201805733 A TW 201805733A
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Taiwan
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area
workpiece
turntable
projection exposure
region
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TW106117387A
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Chinese (zh)
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小谷秀人
田中良和
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薩瑪精密股份有限公司
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Publication of TW201805733A publication Critical patent/TW201805733A/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Abstract

An projection exposure apparatus of this invention includes a turn table 120 formed with a plurality of areas 110, 111 for carrying workpieces and configured to be able to rotate and temporarily stop at predetermined plural stopping positions, a loader capable of loading and unloading workpieces 510, 511 in the plurality of areas 110, 111, a position detection device 210 disposed at the immediate upper portion of the first area 110, a light source 10, a photomask 20 and a projection optical system 50 such disposed as to perform projection exposure at the immediate upper portion of the second area 111, and a controller 410 for controlling the turn table 120 and the respective sections, wherein the controller 410 performs a parallel processing of detecting the carrying position of the workpiece 510 carried in the first area 110 by the position detection device 210 when the workpiece 511 carried in the second area 111 is performed with projection exposure.

Description

投影曝光裝置及其投影曝光方法 Projection exposure device and projection exposure method

本發明係有關於提升投影曝光裝置的量產率之技術,特別是有關於減少總計的投影曝光時間而提升量產率之相關技術。 The present invention relates to a technique for improving the yield of a projection exposure device, and in particular, a technique for increasing the yield of a quantity by reducing the total projection exposure time.

使用光微影(photolithography)技術,將光罩(標線片)上的圖案轉印於晶圓或基板等之工件上之投影曝光裝置係例如揭示於引用文獻1或引用文獻2。 A projection exposure apparatus that uses a photolithography technology to transfer a pattern on a photomask (reticle) to a workpiece such as a wafer or a substrate is disclosed in, for example, reference 1 or reference 2.

引用文獻1係原板(標線片:光罩)上的圖案以投影透鏡為中介而投影於被載置於能移動於X(橫)-Y(縱)-θ(旋轉)方向的轉盤(或台座)上之一個被曝光體(工件)。被曝光體(工件)之XY各方向的位置係藉由使用雷射干涉計之位置檢測裝置來檢測。引用文獻1係揭示有用以高精度地進行階段曝光之標線片和晶圓的對位之階段移動方向、以及相對於位置檢測裝置的雷射干涉計之晶圓的移動方向。 The pattern on the original plate (reticle: photomask) of the cited reference 1 is projected on a turntable (or One of the exposed bodies (workpieces) on the pedestal). The positions of the exposed body (workpiece) in the XY directions are detected by a position detection device using a laser interferometer. Citation 1 discloses a step moving direction in which alignment of a reticle and a wafer with step exposure can be performed with high accuracy, and a wafer moving direction with respect to a laser interferometer of a position detection device.

引用文獻2係一個工件所載置的轉盤(或台座)為不僅能移動於X(橫)-Y(縱)-θ(旋轉)方向,且光罩 (標線片)所載置的轉盤亦能移動於X(橫)-Y(縱)-θ(旋轉)方向。引用文獻2係揭示能個別設定雙方的轉盤之掃描方向及掃描速度等。 Reference 2 refers to the turntable (or pedestal) on which a workpiece is placed, which can not only move in the X (horizontal) -Y (vertical) -θ (rotation) direction, but also the photomask (Reticle) The turntable can also be moved in the X (horizontal)-Y (vertical)-θ (rotation) direction. Citation 2 discloses that the scanning direction and scanning speed of the turntables of both sides can be individually set.

先前技術文獻: Prior technical literature: 專利文獻: Patent Literature:

專利文獻1:特開2001-203161號 Patent Document 1: JP 2001-203161

專利文獻2:特開平11-260697號 Patent Document 2: Japanese Patent Application Laid-Open No. 11-260697

但是,工件的材料係例如使用如結晶材料之具有脆性的材料、或即使為非結晶也會有使用如玻璃等脆性的材料時,則必需慎重處理,亦即必需以較低速時間而進行。因此,將工件裝載及卸載於台座上的可曝光區域內所必需的時間係例如70秒等極長的時間。 However, if the material of the workpiece is, for example, a brittle material such as a crystalline material or a brittle material such as glass is used even if it is non-crystalline, it must be handled with care, that is, it must be performed at a relatively low time. Therefore, the time required for loading and unloading the workpiece into the exposure area on the pedestal is an extremely long time such as 70 seconds.

此外,由於近年來的轉印圖案之高精細化,有關於投影曝光裝置在將圖案轉印於工件上時之台座上的工件的位置檢測亦被要求高精度,且位置檢測所必需的時間為具有增加之傾向。此外,如階段曝光等之一面移動於複數個位置而一面實施複數次的曝光時,則必需更多的位置檢測時間。 In addition, due to the high definition of transfer patterns in recent years, the position detection of the workpiece on the pedestal when the projection exposure device transfers the pattern to the workpiece is also required to be highly accurate, and the time required for the position detection is Has a tendency to increase. In addition, when one side is moved to a plurality of positions such as a stage exposure and a plurality of exposures are performed at the same time, more position detection time is required.

如專利文獻1及2之習知的投影曝光裝置,首先,將工件裝載於台座上的預定位置,繼而檢測該工件之台座上的位置,更繼而對位於檢測出的位置而將台座或光罩的位置調整於各方向之後實施曝光。亦即,習知的投影曝光裝置及其投影曝光方法係將各處理以各1處理而個 別依序實施,縮短總計的處理時間係僅有縮短個別的各處理所必需的時間、或縮短各處理之間的轉換時間的方法。 As in the conventional projection exposure apparatuses of Patent Documents 1 and 2, first, a workpiece is loaded on a predetermined position on a pedestal, then the position on the pedestal of the workpiece is detected, and then the pedestal or photomask is positioned on the detected position. After adjusting the position in each direction, exposure is performed. That is, the conventional projection exposure device and its projection exposure method are based on each process being processed by each one. Don't implement them sequentially, and shorten the total processing time only by shortening the time required for each individual process or shortening the transition time between processes.

本發明係有鑑於上述之問題點而創作完成者,其目的為提供投影曝光裝置及其投影曝光方法,其係能進行投影曝光工程之工件的裝載/卸載、台座上所載置之工件的位置檢測、以及對應於工件的位置之投影曝光之各處理的至少兩項之並行實施,藉此會較以往之技術更能縮短總計的處理時間。 The present invention was created by the author in view of the above-mentioned problems, and its purpose is to provide a projection exposure device and a projection exposure method thereof, which are the loading / unloading of a workpiece capable of performing projection exposure engineering, and the position of a workpiece placed on a pedestal At least two items of each process of detection and projection exposure corresponding to the position of the workpiece are implemented in parallel, thereby reducing the total processing time more than in the conventional technology.

為達成上述目的,本發明之投影曝光裝置之一個實施形態係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光進行投影曝光,藉此將前述預定圖案形成於前述工件上者,具有:轉盤,係以複數個工件不重疊而能同時載置之方式,形成有複數個區域於用以載置前述工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置;裝載機,係能於前述轉盤之前述複數個區域內進行前述工件之裝載及卸載;位置檢測裝置,係在前述轉盤之前述複數個區域之中之一個第一區域暫時停止於前述預定之各停止位置之中之一個第一停止位置時,以能檢測被載置於該第一區域內之工件的載置位置之方式配置於前述轉盤之前述第一區域的正上部;光源、光罩及投影光學系統,係在前述轉盤之前述第 一區域暫時停止於前述第一停止位置時,以能投影曝光於被載置於該第二區域內之工件之方式配置於前述轉盤之前述複數個區域之中的和第一區域不同之第二區域的正上部;以及控制部,係控制:前述轉盤之旋轉及前述預定之各停止位置的停止、由裝載機對各區域內之複數個工件所進行裝載及卸載、由前述位置檢測裝置對被載置於各區域內之各工件所進行之載置位置的檢測、前述光源、光罩及投影光學系統對被載置於各區域內之各工件所進行之投影曝光的各處理,前述控制部係在對被載置於前述第二區域內之工件,藉由前述光源、光罩及投影光學系統進行投影曝光時,至少實施以前述位置檢測裝置檢測被載置於前述第一區域內之工件的載置位置之並行處理。 In order to achieve the above object, one embodiment of the projection exposure apparatus of the present invention is that a predetermined pattern of a photomask is positioned at a predetermined position on a workpiece, and projection exposure is performed with light from a light source, thereby forming the predetermined pattern on the workpiece. The rotary table has a plurality of areas that can be placed simultaneously without overlapping the workpieces, and has a plurality of areas formed on the top of the part for placing the workpieces, and is configured to be able to rotate and temporarily stop at a predetermined position. A plurality of stop positions; a loader capable of loading and unloading the workpiece in the plurality of areas of the turntable; a position detection device temporarily stopping at one of the first areas of the plurality of areas of the turntable When one of the predetermined stopping positions is a first stopping position, it is arranged on the upper part of the first area of the turntable in a manner capable of detecting the placement position of the workpiece placed in the first area; , Reticle and projection optical system are in the aforementioned section of the aforementioned turntable. When an area is temporarily stopped at the first stop position, a second one that is different from the first area among the plurality of areas of the turntable can be projected and exposed on the workpiece placed in the second area. The upper part of the area; and the control unit, which controls: the rotation of the turntable and the stop of the predetermined stop positions, loading and unloading of a plurality of workpieces in each area by the loader, and the position detection device for the The detection of the placement position of each workpiece placed in each area, the processing of the projection exposure performed by the light source, the mask, and the projection optical system on each workpiece placed in each area, and the aforementioned control unit When projecting and exposing the workpiece placed in the second area through the light source, mask and projection optical system, at least the workpiece placed in the first area is detected by the position detection device. Parallel processing of the placement position.

為達成上述目的,本發明之投影曝光方法之一個實施形態係使用投影曝光裝置之投影曝光方法,該投影曝光裝置係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光而進行投影曝光,藉此將前述預定圖案形成於前述工件上,且具有轉盤,該轉盤係以複數個工件不重疊而能同時載置之方式,形成有複數個區域於載置前述工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置,該投影曝光方法係包含:(A)將前述工件裝載於前述轉盤之前述複數個區域之中之一個第一區域內之步驟; (B)使前述轉盤旋轉而使前述第一區域暫時停止於前述預定之各停止位置之中之一個第一停止位置之步驟;(C)檢測前述第一區域內之前述工件的載置位置之步驟;(D)使前述轉盤再度旋轉而使前述第一區域暫時停止於前述預定之各停止位置之中之和前述第一停止位置不同之第二停止位置之步驟;(E)將光罩上的圖案投影曝光於前述第一區域內之前述工件之步驟;(F)當前述轉盤之和前述第一區域不同之第二區域內有結束投影曝光之前述工件時,則以和前述(E)之投影曝光處理並行之方式,自該第二區域內卸載結束投影曝光之前述工件而結束第一循環之步驟;以及(G)將前述(A)至(F)的第一循環之第一區域置換成第二區域,在具有三個區域以上時將區域置換成第三區域、或在僅具有兩個區域時將區域置換成第一區域而進行第二循環之處理,而關於以後之循環,在具有三個區域以上時係以升序來逐步置換區域而最後回到第一區域之方式而實施、或在僅具有兩個區域時係以交互替換第一區域和第二區域之方式而實施之步驟。 In order to achieve the above object, one embodiment of the projection exposure method of the present invention is a projection exposure method using a projection exposure device that sets a predetermined pattern of a photomask at a predetermined position on a workpiece and uses light from a light source to Projection exposure is performed, whereby the predetermined pattern is formed on the workpiece and a turntable is provided. The turntable is formed in such a manner that a plurality of workpieces can be placed at the same time without overlapping, and a plurality of areas are formed on the part where the workpiece is placed. At the top, and configured to be able to rotate and temporarily stop at a predetermined plurality of stopping positions, the projection exposure method includes: (A) loading the workpiece in a first region of the plurality of regions of the turntable; step; (B) a step of rotating the turntable to temporarily stop the first area at a first stop position among the predetermined stop positions; (C) detecting a placement position of the workpiece in the first area Steps; (D) a step of rotating the turntable again to temporarily stop the first area at a second stop position different from the first stop position among the predetermined stop positions; (E) putting the photomask on The step of projecting and exposing the pattern of the workpiece on the first area; (F) When there is a workpiece on the second area that is different from the first area and the first area and the projected exposure is ended, the same as (E) The projection exposure processing is performed in parallel, the step of unloading the aforementioned workpiece that ends the projection exposure from the second region and ending the first cycle; and (G) the first region of the first cycle of (A) to (F) Replace with the second area, replace the area with the third area when there are more than three areas, or perform the second cycle of processing by replacing the area with the first area when there are only two areas, and for subsequent cycles, In a When three or more areas in ascending order based stepwise manner back to the last area of the substitution area and a first embodiment, or when the system has only two alternative interactive regions and second regions of the first embodiment of the step.

1‧‧‧投影曝光裝置 1‧‧‧ projection exposure device

10‧‧‧光源部 10‧‧‧Light source department

20‧‧‧光罩(標線片) 20‧‧‧Photomask (Reticle)

30‧‧‧遮罩用XYθ台座 30‧‧‧Mask XYθ stage

40‧‧‧遮罩用擺動台座 40‧‧‧Masking swing stand

50‧‧‧投影光學系統 50‧‧‧ projection optical system

60‧‧‧遮罩用XYθ台座驅動部 60‧‧‧Mask XYθ Stage Driver

70‧‧‧遮罩用擺動台座驅動部 70‧‧‧Masking swing stand drive unit

110‧‧‧工件載置用第一區域 110‧‧‧First area for workpiece placement

111‧‧‧工件載置用第二區域 111‧‧‧Second area for workpiece placement

112‧‧‧工件載置用第三區域 112‧‧‧Third area for workpiece placement

120‧‧‧工件用轉盤 120‧‧‧ Turntable for workpiece

130‧‧‧工件用轉盤軸 130‧‧‧Turntable shaft for workpiece

140‧‧‧工件用Z台座 140‧‧‧Z base for workpiece

150‧‧‧工件用轉盤驅動部 150‧‧‧Workpiece turntable drive unit

160‧‧‧工件用Z台座驅動部 160‧‧‧Z stage drive for workpiece

210‧‧‧位置檢測部 210‧‧‧Position detection section

310‧‧‧裝載機 310‧‧‧Loader

410‧‧‧控制部 410‧‧‧Control Department

510‧‧‧第一工件 510‧‧‧First Workpiece

511‧‧‧第二工件 511‧‧‧Second workpiece

512‧‧‧第三工件 512‧‧‧Third Artifact

610‧‧‧第一停止位置 610‧‧‧First stop position

611‧‧‧第二停止位置 611‧‧‧Second stop position

612‧‧‧第三停止位置 612‧‧‧Third stop position

第1圖(a)及(b)係表示本發明之第一實施形態之曝光裝置的轉盤停止於第一停止位置時的概略構成的圖,(a)係 側面圖,(b)係上面圖。 Figures 1 (a) and (b) are diagrams showing a schematic configuration when the turntable of the exposure apparatus according to the first embodiment of the present invention is stopped at the first stop position, and (a) is Side view, (b) is the top view.

第2圖係本發明之第一實施形態之曝光裝置的動作流程圖。 Fig. 2 is an operation flowchart of the exposure apparatus according to the first embodiment of the present invention.

第3圖(a)及(b)係表示本發明之第二實施形態之曝光裝置的轉盤停止於第一停止位置時的概略構成的圖,(a)係側面圖,(b)係上面圖。 3 (a) and (b) are diagrams showing a schematic configuration when the turntable of the exposure apparatus of the second embodiment of the present invention is stopped at the first stop position, (a) is a side view, and (b) is a top view .

第4圖係本發明之第二實施形態之曝光裝置的動作流程之前半部。 FIG. 4 is the first half of the operation flow of the exposure apparatus according to the second embodiment of the present invention.

第5圖係本發明之第二實施形態之曝光裝置的動作流程之後半部。 Fig. 5 is the second half of the operation flow of the exposure apparatus according to the second embodiment of the present invention.

大略的說明: Rough description:

本發明之投影曝光裝置之一個實施形態為,本發明之投影曝光裝置係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光進行投影曝光,藉此將預定圖案形成於工件上者,係具有:轉盤,係以複數個工件不重疊而能同時載置之方式,形成有複數個區域於用以載置工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置;裝載機,係能於轉盤之複數個區域內進行工件裝載及卸載;位置檢測裝置,係在轉盤之複數個區域之中之一個第一區域在暫時停止於預定之各停止位置之中之一個第一停止位置時,以能檢測被載置於該第一區域內之工件的載置 位置之方式配置於轉盤之第一區域的正上部;光源、光罩及投影光學系統,係在轉盤之第一區域暫時停止於第一停止位置時,以能投影曝光於被載置於該第二區域內之工件之方式配置於轉盤之複數個區域之中的和第一區域不同之第二區域的正上部;以及控制部,係控制:轉盤之旋轉及預定之各停止位置的停止、由裝載機對各區域內之複數個工件所進行之裝載及卸載、由位置檢測裝置對被載置於各區域內之各工件所進行之載置位置的檢測、光源、光罩及投影光學系統對被載置於各區域內之各工件所進行之投影曝光的各處理,控制部係在對被載置於第二區域內之工件,藉由光源、光罩及投影光學系統進行投影曝光時,至少實施以位置檢測裝置檢測被載置於第一區域內之工件的載置位置之並行處理。 One embodiment of the projection exposure apparatus of the present invention is that the projection exposure apparatus of the present invention is configured to form a predetermined pattern on a workpiece by projecting and exposing the predetermined pattern of the photomask to a predetermined position on the workpiece with light from a light source. The former includes: a turntable, which is capable of being placed simultaneously without overlapping a plurality of workpieces, and has a plurality of areas formed on the top of the part for placing the workpieces, and is configured to be rotatable and temporarily stopped at a predetermined time. A plurality of stop positions; a loader capable of loading and unloading workpieces in a plurality of areas of the turntable; a position detecting device which temporarily stops at a predetermined stop in a first area among the plurality of areas of the turntable When one of the positions is the first stop position, it can detect the placement of the workpiece placed in the first area. The position method is arranged directly above the first area of the turntable; the light source, the mask and the projection optical system are temporarily exposed to the first stop position in the first area of the turntable so as to be able to project and be exposed on the first area. The way of the workpieces in the two areas is arranged on the upper part of the second area which is different from the first area among the plurality of areas of the turntable; and the control part is for controlling: the rotation of the turntable and the stopping of the predetermined stop positions. Loading and unloading of a plurality of workpieces in each area by a loader, detection of the placement position of each workpiece placed in each area by a position detection device, pairing of light sources, masks and projection optical systems For each process of projection exposure performed by each workpiece placed in each area, the control unit performs projection exposure on the workpiece placed in the second area by using a light source, a mask, and a projection optical system. At least parallel processing for detecting the placement position of the workpiece placed in the first area by the position detection device is performed.

本發明之投影曝光裝置之另外的實施形態為,轉盤係具有屬於複數個區域之中之一個且與第一區域及第二區域不同之第三區域,裝載機係配置成,在轉盤之第一區域暫時停止於第一停止位置時,於轉盤之第三區域內進行工件之卸載及/或裝載,控制部係以在檢測被載置於第一區域內之工件的載置位置並且對被載置於第二區域內之工件進行投影曝光時,卸載結束被載置於第三區域內的投影曝光之工件之後裝載未曝光之工件的方式實施並行處理。 According to another embodiment of the projection exposure apparatus of the present invention, the turntable has a third area that is one of the plurality of areas and is different from the first area and the second area. The loader is configured to be located on the first of the turntable. When the area is temporarily stopped at the first stop position, the workpiece is unloaded and / or loaded in the third area of the turntable, and the control unit detects the placement position of the workpiece placed in the first area and detects the loading of the workpiece. When the workpieces placed in the second area are subjected to projection exposure, the unexposed workpieces are loaded in parallel after the unloaded workpieces are loaded after the projected exposed workpieces placed in the third area are unloaded.

本發明之投影曝光裝置之另外的實施形態 為,轉盤係具有n個之區域(n係n≧4的整數)作為複數個區域,位置檢測裝置係轉盤之第一區域在暫時停止於第一停止位置時,以能檢測被載置於該第一區域的內之工件的載置位置之方式配置於轉盤之n個區域之中之一個第一區域的正上部,光源、光罩及投影光學系統係在轉盤之第一區域暫時停止於第一停止位置時,以能投影曝光被載置於該第二區域內之工件之方式而配置於屬於轉盤之n個區域之中之一個且與第一區域不同之第二區域的正上部,裝載機係在轉盤之第一區域暫時停止於第一停止位置時,以能在屬於轉盤之n個的區域之中之一個且與第一區域及第二區域不同之第三區域裝載及卸載工件的方式配置,控制部係以在檢測被載置於第一區域內之工件的載置位置並且對被載置於第二區域內之工件進行投影曝光時,卸載被載置於第三區域內的結束投影曝光之工件之後能裝載未曝光之工件的方式實施並行處理。 Another embodiment of the projection exposure apparatus of the present invention For the turntable, there are n areas (n is an integer of n ≧ 4) as a plurality of areas. When the first area of the turntable is temporarily stopped at the first stop position, the turntable can be detected to be placed in the area. The way of placing the workpieces in the first area is arranged directly above one of the n areas of the turntable. The light source, mask and projection optical system are temporarily stopped in the first area of the turntable. At the stop position, it is arranged on the upper part of the second area which belongs to one of the n areas of the turntable and is different from the first area so as to project and expose the workpiece placed in the second area. When the first area of the turntable is temporarily stopped at the first stop position, the machine can load and unload workpieces in a third area that belongs to one of the n areas of the turntable and is different from the first area and the second area. It is configured in such a manner that the control unit is configured to unload the workpiece placed in the third area when detecting the placement position of the workpiece placed in the first area and performing projection exposure on the workpiece placed in the second area. End projection exposure Embodiment of the parallel processing of a workpiece can be loaded unexposed after the manner of the workpiece.

本發明之投影曝光裝置之另外的實施形態為,以能夠在屬於轉盤之n個的區域之一個且與第一區域至第三區域不同之第四區域至第n區域裝載及卸載工件之方式配置有複數個裝載機,控制部係以在卸載被載置於第四區域至第n區域內的結束投影曝光之工件之後裝載未曝光之工件的方式實施並行處理。 Another embodiment of the projection exposure apparatus of the present invention is configured to be able to load and unload workpieces in a fourth region to an n-th region that is one of the n regions of the turntable and is different from the first region to the third region. There are a plurality of loaders, and the control unit performs parallel processing by unloading unexposed workpieces after unloading the unexposed workpieces that have been placed in the fourth to nth regions after unloading.

本發明之投影曝光裝置之另外的實施形態為,投影曝光裝置為對一個之工件,以一次照射而將投影曝光之圖案進行曝光之曝光裝置。 Another embodiment of the projection exposure apparatus of the present invention is that the projection exposure apparatus is an exposure apparatus that exposes a pattern of projection exposure to one workpiece with one shot.

本發明之投影曝光裝置之另外的實施形態為,將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為包含使光罩移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 According to another embodiment of the projection exposure device of the present invention, the device that positions the position of the pattern to be projected and exposed to the position of the position-detected workpiece includes moving the mask in the vertical (Y), horizontal (X), and high ( Z), and at least one of the rotation (θ) directions.

本發明之投影曝光裝置之另外的實施形態為,將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為包含將光罩相對於曝光光自垂直面變更角度之擺動驅動裝置。 According to another embodiment of the projection exposure device of the present invention, the device that positions the position of the pattern to be exposed to the position of the position-detected workpiece is a swing driving device that includes changing the angle of the mask from the vertical plane with respect to the exposure light.

本發明之投影曝光裝置之另外的實施形態為,將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為包含將配置於轉盤的下方之台座移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 According to another embodiment of the projection exposure apparatus of the present invention, the apparatus that positions the position of the pattern to be projected and exposed to the position of the position-detected workpiece includes moving a pedestal disposed below the turntable to the vertical (Y) and horizontal (Y) X), high (Z), and rotation (θ) directions in at least one of the driving means.

本發明之投影曝光裝置之另外的實施形態為,將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為包含將投影光學系統移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 In another embodiment of the projection exposure device of the present invention, the device that positions the position of the pattern to be projected and exposed on the position-detected workpiece includes moving the projection optical system in the vertical (Y), horizontal (X), and high positions. (Z) and at least one of the rotation (θ) directions.

使用本發明之投影曝光裝置之投影曝光方法之一個實施形態,係使用投影曝光裝置,該投影曝光裝置係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光進行投影曝光,藉此將預定圖案形成於工件上,且具有轉盤,該轉盤係以複數個工件不重疊而能同時載置之方式,形成有複數個區域於載置工件之部位的最上面, 且構成為能旋轉及暫時停止於預定之複數個停止位置,該投影曝光方法係包含:(A)將工件裝載於轉盤之複數個區域之中之一個第一區域內之步驟;(B)使轉盤旋轉而使第一區域暫時停止於預定之各停止位置之中之一個第一停止位置之步驟;(C)檢測第一區域內之工件的載置位置之步驟;(D)使轉盤再度旋轉而使第一區域暫時停止於預定之各停止位置之中之和第一停止位置不同之第二停止位置之步驟;(E)將光罩上的圖案投影曝光於第一區域內之工件之步驟;(F)當轉盤之和第一區域不同之第二區域內有結束投影曝光之工件時,則以和(E)之投影曝光處理並行的方式,自該第二區域內卸載結束投影曝光之工件而結束第一循環之步驟;以及(G)將(A)至(F)的第一循環之第一區域置換成第二區域,且在具有三個區域以上時將第二區域置換成第三區域、或在僅具有兩個區域時將第二區域置換成第一區域而進行第二循環之處理,而關於以後之循環,在具有三個區域以上時係以升序來逐步置換區域而最後回到第一區域之方式實施、或在僅具有兩個區域時係以交互替換之第一區域和第二區域之方式而實施之步驟。 One embodiment of the projection exposure method using the projection exposure device of the present invention uses a projection exposure device which sets a predetermined pattern of a photomask to a predetermined position on a workpiece and performs projection exposure with light from a light source. In this way, a predetermined pattern is formed on the workpiece, and a turntable is formed, and the plurality of workpieces can be placed at the same time without overlapping the workpieces, and a plurality of areas are formed on the top of the part on which the workpieces are placed. And is configured to be able to rotate and temporarily stop at a predetermined plurality of stopping positions, the projection exposure method includes: (A) a step of loading a workpiece in a first region among a plurality of regions of the turntable; (B) making The step of rotating the turntable to temporarily stop the first area at one of the predetermined stopping positions; (C) the step of detecting the placement position of the workpiece in the first area; (D) rotating the turntable again And the step of temporarily stopping the first region at a second stopping position which is different from the first stopping position among the predetermined stopping positions; (E) the step of exposing the pattern on the photomask to the workpiece in the first region; ; (F) When there is a workpiece that ends the projection exposure in a second area that is different from the first area of the turntable, then the projection exposure processing is unloaded from the second area in parallel with the projection exposure processing of (E). And (G) replace the first region of the first cycle of (A) to (F) with the second region, and replace the second region with the first region when there are three or more regions. Three zones, or only two zones The second region is replaced by the first region and the second cycle is processed. For subsequent cycles, when there are more than three regions, the regions are gradually replaced in ascending order and finally returned to the first region. When there are only two regions, the steps are implemented by alternately replacing the first region and the second region.

發明之功效: Effects of the invention:

根據本發明之曝光裝置,即能設置下述轉盤:以複數個工件不重疊而能同時載置的方式形成有複數個區域於用以載置工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置之循環裝置型的轉盤;並且,亦能分別對應於轉盤上之不同的區域而配置工件的裝載機、轉盤上之工件的位置檢測裝置、以及將光罩上的圖案投影於工件的投影光學系統,藉此而能進行各處理之並列實施。據此,即能提供較習知之技術更能縮短朝工件之總計的曝光時間之投影曝光裝置及其投影曝光方法。 According to the exposure device of the present invention, the following turntable can be provided: a plurality of areas are formed on the uppermost part of the portion for placing the workpiece in such a manner that a plurality of workpieces can not be placed at the same time, and can be rotated and A rotary device-type turntable temporarily stopped at a predetermined plurality of stopping positions; and, a loader for workpieces, a position detection device for the workpiece on the turntable, and a photomask can be arranged corresponding to different areas on the turntable, respectively. The projected pattern is projected onto the projection optical system of the workpiece, so that each process can be performed in parallel. Accordingly, it is possible to provide a projection exposure device and a projection exposure method capable of reducing the total exposure time toward the workpiece more than conventional techniques.

圖示之實施形態的說明: Explanation of the illustrated embodiment: <第一實施形態> <First Embodiment>

以下,參考圖示而說明有關於本發明之第一實施形態。第1圖(a)、(b)係表示本發明之第一實施形態之曝光裝置1的概略構成,工件用轉盤軸130係配置於工件用Z台座140的上方,工件用轉盤120係設置於工件用轉盤軸130的上方。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Figures 1 (a) and (b) show the schematic configuration of the exposure apparatus 1 according to the first embodiment of the present invention. The worktable turntable shaft 130 is disposed above the worktable Z stage 140, and the worktable turntable 120 is provided on Above the worktable turntable shaft 130.

工件用轉盤120的上方係配置有兩個工件載置用第一區域110、以及工件載置用第二區域111於該轉盤120之一個直徑的兩端部。直徑的兩端部係指例如自該轉盤120的中心向一方的端部之區域拉出直線,且自該直線向180度相反側拉出連續的直線,另一方之區域係配置於該相反側的端部。工件載置用第一區域110、以及工 件載置用第二區域111係較第一工件510、以及第二工件511的各表面積更大,分別具有載置該各工件所必需之充分的面積,此外,各區域係可設置位置的辨識標章(ID)或表示位置測定的基準點之標記(未圖示)於不干涉各工件的場所。 Above the workpiece turntable 120, two workpiece placement first regions 110 and a workpiece placement second region 111 are arranged at both ends of one diameter of the turntable 120. Both end portions of the diameter refer to, for example, a straight line drawn from the center of the turntable 120 to an area of one end portion, and a continuous straight line drawn from the straight line to the opposite side of 180 degrees, and the other area is arranged on the opposite side. Of the end. First area 110 for workpiece placement, and The second region 111 for component placement is larger than the surface area of each of the first workpiece 510 and the second workpiece 511, and each has a sufficient area necessary to mount the respective workpieces. In addition, each region is capable of identifying a position for installation. A mark (ID) or a mark (not shown) indicating a reference point for position measurement is placed at a place that does not interfere with each workpiece.

工件用轉盤軸130係設置於工件用轉盤120之下部的中央,且以工件用轉盤驅動部150為中介者而連接於包含微電腦或中央演算單元(CPU)之控制部410。根據來自控制部410的命令,驅動用信號係自工件用轉盤驅動部150傳送至工件用轉盤軸130。工件用轉盤軸130係能藉由未圖示之步進馬達等,精密地控制轉盤的旋轉角度及平面上的停止位置。此外,工件用轉盤軸130係和未圖示之電源連接而供應旋轉所必需之電力。 The worktable turntable shaft 130 is provided in the center of the lower portion of the worktable turntable 120, and is connected to a control unit 410 including a microcomputer or a central computing unit (CPU) with the worktable drive unit 150 as an intermediary. In response to a command from the control unit 410, a driving signal is transmitted from the worktable turntable driving unit 150 to the worktable turntable shaft 130. The worktable turntable shaft 130 can precisely control the rotation angle of the turntable and the stop position on the plane by a stepping motor or the like, which is not shown. In addition, the worktable turntable shaft 130 is connected to a power source (not shown) and supplies power necessary for rotation.

工件用Z台座140係以工件用Z台座驅動部160為中介而連接於包含微電腦或中央演算單元(CPU)之控制部410。根據來自控制部410的命令,驅動用信號係自工件用Z台座驅動部160傳送至工件用Z台座140。工件用Z台座140係能藉由未圖示之上下移動機構(油壓機構或電動機構等),精密地控制Z(上下)方向及上下的停止位置。此外,工件用Z台座140係和未圖示之電源連接而供應旋轉所必需之電力。 The workpiece Z stage 140 is connected to a control unit 410 including a microcomputer or a central processing unit (CPU) with the workpiece Z stage driving unit 160 as an intermediary. In response to a command from the control unit 410, the driving signal is transmitted from the workpiece Z stage driving unit 160 to the workpiece Z stage 140. The Z stage 140 for workpieces can precisely control the Z (up and down) direction and the up and down stop position by an unillustrated up and down movement mechanism (hydraulic mechanism or electric mechanism, etc.). In addition, the Z stage 140 for the work is connected to a power source (not shown) to supply power necessary for rotation.

工件載置用第一區域110係使藉由控制部410所控制的工件用轉盤120旋轉,藉此即能移動至第一停止位置610或第二停止位置611,且停止於該位置。曝 光之預定圖案愈形成詳細的圖案,則愈必需有精密的控制提高旋轉精度、以及停止精度。第一停止位置610的正上部係例如配置有位置檢測部210。此外,第1圖(a)係裝載機310為配置於停止在第一停止位置610之區域的上部或近旁。裝載機310係能自暫時停止於第一停止位置610之工件載置用第一區域110或工件載置用第二區域111卸載已曝光之工件,且能自該區域裝載未曝光之工件。將自工件用轉盤120的上方下降之已曝光之工件傳送至續接的工程,並將未曝光之工件移動至裝載機310的近旁,其係例如可使用未圖示之輸送帶等。此外,第二停止位置611的正上部係配置有曝光用之投影光學系統50。 The first region 110 for workpiece placement is such that the workpiece turntable 120 controlled by the control unit 410 is rotated to move to the first stop position 610 or the second stop position 611 and stop at the position. Expose The more detailed the predetermined pattern of light is, the more precise control is required to improve the rotation accuracy and stop accuracy. A position detection unit 210 is disposed directly above the first stop position 610, for example. In addition, FIG. 1 (a) shows that the loader 310 is disposed above or near the area stopped at the first stop position 610. The loader 310 is capable of unloading the exposed workpiece from the first region 110 for workpiece placement or the second region 111 for workpiece placement temporarily stopped at the first stop position 610, and can load unexposed workpieces from this region. The exposed workpiece descending from above the workpiece turntable 120 is transferred to the subsequent process, and the unexposed workpiece is moved to the vicinity of the loader 310. For example, a conveyor (not shown) may be used. A projection optical system 50 for exposure is disposed directly above the second stop position 611.

工件載置用第二區域111亦使藉由控制部410所控制的工件用轉盤120旋轉,藉此即能移動至第一停止位置610或第二停止位置611,且停止於該位置。由於第一停止位置610及第二停止位置611係配置於工件用轉盤120的一個直徑的兩端部,故當工件載置用第一區域110係暫時停止於第一停止位置610時,則工件載置用第二區域111係暫時停止於第二停止位置611。相反的,當工件載置用第二區域111係暫時停止於第一停止位置610時,則工件載置用第一區域110係暫時停止於投影光學系統50。 The second area 111 for placing work also rotates the turntable 120 for work controlled by the control unit 410, whereby the first stop position 610 or the second stop position 611 can be moved and stopped at this position. Since the first stop position 610 and the second stop position 611 are disposed at both ends of one diameter of the worktable turntable 120, when the first area 110 for workpiece placement temporarily stops at the first stop position 610, the workpiece The second region 111 for placement is temporarily stopped at the second stop position 611. In contrast, when the second region 111 for workpiece placement is temporarily stopped at the first stop position 610, the first region 110 for workpiece placement is temporarily stopped at the projection optical system 50.

曝光用之投影光學系統50的更上部係配置有光源部10、光罩20、遮罩用XYθ台座30、以及遮罩用擺動台座40。第1圖(a)之情形係來自光源部10的曝光光 源透過光罩20、以及投影光學系統50,將載置於第二停止位置611上之工件載置用第二區域111的第二工件511進行曝光,藉此而將光罩20上的預定圖案轉印於第二工件511上。 Further above, the projection optical system 50 for exposure is provided with a light source section 10, a mask 20, a mask XYθ stage 30, and a mask swing stage 40. The situation in FIG. 1 (a) is the exposure light from the light source section 10. The source passes through the mask 20 and the projection optical system 50, and exposes the second workpiece 511 of the workpiece mounting second area 111 placed on the second stop position 611, thereby exposing a predetermined pattern on the mask 20. Transfer onto the second workpiece 511.

遮罩用XYθ台座30係以遮罩用XYθ台座驅動部60為中介者而連接於包含微電腦或中央演算單元(CPU)之控制部410。根據來自控制部410的命令,驅動用信號係自遮罩用XYθ台座驅動部60傳送至遮罩用XYθ台座30。遮罩用XYθ台座30係藉由能在未圖示之台座平面上,移動於X方向(橫方向)、Y方向(縱方向)、以及θ(旋轉)方向之遮罩用XYθ台座驅動部60,精密地控制台座平面上的XYθ(縱、橫、旋轉)方向的停止位置。此外,遮罩用XYθ台座30亦和未圖示之電源連接而供應XYθ(縱、橫、旋轉)方向的移動所必需之電力。 The mask XYθ pedestal 30 is connected to a control unit 410 including a microcomputer or a central processing unit (CPU) with the mask XYθ pedestal driving unit 60 as an intermediary. According to a command from the control unit 410, the driving signal is transmitted from the mask XYθ pedestal driving unit 60 to the mask XYθ pedestal 30. The mask XYθ pedestal 30 is a mask XYθ pedestal driving unit 60 capable of moving in the X direction (horizontal direction), Y direction (longitudinal direction), and θ (rotation) direction on a pedestal plane (not shown). , Precisely the stop position in the XYθ (vertical, horizontal, rotational) direction on the plane of the console seat. In addition, the mask XYθ stage 30 is also connected to a power source (not shown) to supply power necessary for movement in the XYθ (vertical, horizontal, and rotational) direction.

遮罩用擺動台座40係以遮罩用擺動台座驅動部70為中介者而連接於包含微電腦或中央演算單元(CPU)之控制部410。根據來自控制部410的命令,驅動用信號係自遮罩用擺動台座驅動部70傳送至遮罩用擺動台座40。遮罩用擺動台座40係藉由能將未圖示之台座平面自垂直的角度傾斜於光軸而擺動之遮罩用擺動台座驅動部70,精密的控制台座平面為傾斜(擺動)之狀態的停止位置。此外,遮罩用擺動台座40亦和未圖示之電源連接而供應擺動台座平面所必需之電力。 The mask swing base 40 is connected to a control unit 410 including a microcomputer or a central processing unit (CPU) with the mask swing base drive unit 70 as an intermediary. In response to a command from the control unit 410, a driving signal is transmitted from the mask swing base driving unit 70 to the mask swing base 40. The mask swing base 40 is a mask swing base drive unit 70 that can swing by tilting a plane of a base (not shown) from a vertical angle to the optical axis. The precise console base is tilted (swing). Stop position. In addition, the mask swing base 40 is also connected to a power source (not shown) to supply power necessary for the plane of the swing base.

控制部410係以光罩20上的預定圖案能正 確的轉印於第二工件511上的預定位置之方式,控制工件用轉盤軸130、工件用Z台座140、遮罩用XYθ台座30、以及遮罩用擺動台座40之平面上的位置、平面上的角度及擺動角度。此時,例如使用未圖示之光罩用顯微鏡、以及工件用顯微鏡等,即能進行未圖示之光罩上的遮罩對位標記能符合工件上的工件對位標記之控制。此外,因應於需求,投影光學系統50亦設置驅動部,進行將光罩上的預定圖案投影至工件上的預定位置之控制。 The control unit 410 is capable of correcting a predetermined pattern on the mask 20. The method of accurately transferring to a predetermined position on the second workpiece 511 controls the position and plane of the rotary table shaft 130 for the workpiece, the Z stage 140 for the workpiece, the XYθ stage 30 for the mask, and the swing stage 40 for the mask. And swing angle. At this time, for example, using a mask microscope (not shown) and a microscope for workpieces, the mask registration mark on the mask (not shown) can be controlled to match the workpiece registration mark on the workpiece. In addition, in response to demand, the projection optical system 50 is also provided with a driving unit to perform control of projecting a predetermined pattern on the photomask to a predetermined position on the workpiece.

繼而使用第2圖而說明本實施形態的動作。首先,當控制部410開始處理時,則確認轉盤120上的工件載置用第一區域110是否暫時停止於第一停止位置610中(S1)。若工件載置用第一區域110為暫時停止於第一停止位置610中(S1:Yes),則確認是否有未曝光的工件載置於工件載置用第一區域110(S2)。若工件載置用第一區域110為未暫時停止於第一停止位置610中(S1:No),則由於工件載置用第一區域110係形成暫時停止於第二停止位置611中,故進入步驟S7。 Next, the operation of this embodiment will be described using FIG. 2. First, when the control unit 410 starts processing, it is confirmed whether the first area 110 for placing a workpiece on the turntable 120 is temporarily stopped at the first stop position 610 (S1). When the first region 110 for workpiece placement is temporarily stopped in the first stop position 610 (S1: Yes), it is confirmed whether or not an unexposed workpiece is placed in the first region 110 for workpiece placement (S2). If the first area 110 for workpiece placement is not temporarily stopped in the first stop position 610 (S1: No), the first area 110 for workpiece placement is temporarily stopped in the second stop position 611, so it enters Step S7.

若未曝光的工件未載置於工件載置用第一區域110時(S2:Yes),則控制部410係以能將未曝光的工件裝載於工件載置用第一區域110內而將命令輸出至裝載機310(S3)。若未曝光的工件係載置於工件載置用第一區域110時(S2:No),則由於不需要裝載未曝光的工件,故進入步驟S4,根據控制部410的命令,以位置檢測部210檢測工件載置用第一區域110的第一工件510的位置(S4)。此 時,例如亦可使用工件用顯微鏡而檢測台座上之台座對位標記、以及工件上之工件對位標記。 When an unexposed workpiece is not placed in the first area 110 for workpiece placement (S2: Yes), the control unit 410 orders the unexposed workpiece into the first area 110 for workpiece placement and orders Output to the loader 310 (S3). When the unexposed workpiece is placed in the first area 110 for workpiece placement (S2: No), since it is not necessary to load the unexposed workpiece, the process proceeds to step S4, and the position detection unit is instructed by the command of the control unit 410. 210 detects the position of the first workpiece 510 in the workpiece placement first region 110 (S4). this In this case, for example, it is also possible to detect the pedestal alignment mark on the pedestal and the work alignment mark on the work using a work microscope.

檢測出工件載置用第一區域110的第一工件510的位置之後,控制部410係將旋轉之命令輸出至轉盤驅動部150(S5),當轉盤120上的工件載置用第一區域110到達第二停止位置611之後,則輸出暫時停止的命令(S6)。 After detecting the position of the first workpiece 510 of the first region 110 for workpiece placement, the control unit 410 outputs a rotation command to the turntable driving unit 150 (S5). When the first region 110 for workpiece placement on the turntable 120 is rotated, After reaching the second stop position 611, a temporary stop command is output (S6).

工件載置用第一區域110在第二停止位置611暫時停止之後,則確認第一停止位置610的工件載置用第二區域111內是否有曝光結束的工件(S7)。若工件載置用第二區域111內有曝光結束的工件時(S7:Yes),則控制部410係對裝載機310輸出自工件載置用第二區域111卸載該曝光結束的工件(S8),且輸出將未曝光的工件裝載於工件載置用第二區域111的命令(S9)。若工件載置用第二區域111內無曝光結束的工件時(S7:No),則由於不需要卸載工件,故進入步驟S9,將未曝光的工件裝載於工件載置用第二區域111(S9)。 After the work placement first area 110 is temporarily stopped at the second stop position 611, it is confirmed whether or not there is an exposed work in the work placement second area 111 at the first stop position 610 (S7). If there is an exposed workpiece in the second region 111 for workpiece placement (S7: Yes), the control unit 410 outputs to the loader 310 and unloads the exposed workpiece from the second region 111 for workpiece placement (S8). A command to load an unexposed workpiece in the workpiece placement second area 111 is output (S9). If there are no exposed workpieces in the second region 111 for workpiece placement (S7: No), since there is no need to unload the workpieces, the process proceeds to step S9, and the unexposed workpieces are loaded in the second region 111 for workpiece placement ( S9).

步驟S7的處理之後,和將工件裝載於工件載置用第二區域111內的同時並行,對工件載置用第一區域110內的已進行位置檢測之第一工件510,在第二停止位置611實施光罩20之預定圖案的投影曝光所為之往第一工件510上的轉印(S10)。結束該預定圖案的轉印時,控制部410係將再度旋轉的命令輸出至工件用轉盤驅動部150(S11),當轉盤120上的工件載置用第一區域110到達第一 停止位置610之後,則輸出暫時停止的命令(S12)。 After the processing of step S7, in parallel with the loading of the workpiece in the second region 111 for workpiece placement, the first workpiece 510 that has been position-detected in the first region 110 for workpiece placement is in the second stop position. 611 performs the transfer of the projection exposure of the predetermined pattern of the photomask 20 onto the first workpiece 510 (S10). When the transfer of the predetermined pattern is completed, the control unit 410 outputs a command for re-rotation to the workpiece turntable driving unit 150 (S11), and when the workpiece loading first area 110 on the turntable 120 reaches the first After the stop position 610, a temporary stop command is output (S12).

工件載置用第一區域110在第一停止位置610暫時停止之後,則確認第一停止位置610的工件載置用第一區域110內是否有曝光結束的工件(S13)。若工件載置用第一區域110內有曝光結束的工件時(S13:Yes),則控制部410係對裝載機310輸出命令以使自工件載置用第一區域110卸載該已曝光的工件(S14),且進入步驟S16確認是否殘留未曝光的工件(S16)。若工件載置用第一區域110內無曝光結束的工件時(S13:No),則由於不需要卸載工件,故進入步驟S16而確認是否殘留未曝光的工件(S16)。 After the work placement first area 110 is temporarily stopped at the first stop position 610, it is confirmed whether or not there is an exposed work in the work placement first area 110 at the first stop position 610 (S13). When there is an exposed workpiece in the first region 110 for workpiece placement (S13: Yes), the control unit 410 outputs a command to the loader 310 to unload the exposed workpiece from the first region 110 for workpiece placement. (S14), and it progresses to step S16 and confirms whether an unexposed workpiece | work remains (S16). If there are no exposed workpieces in the first area 110 for workpiece placement (S13: No), the workpiece does not need to be unloaded, so it proceeds to step S16 to check whether unexposed workpieces remain (S16).

和確認步驟S12之後的第一停止位置610的工件載置用第一區域110內是否有曝光結束的工件同時並行,對工件載置用第二區域111內的進行位置檢測結束之第二工件511,在第二停止位置611實施光罩20之預定圖案的投影曝光所為之往第二工件511上的轉印(S15),且進入步驟S16,控制部410係確認是否殘留未曝光的工件(S16)。 Simultaneously with the confirmation of whether or not there is a workpiece in which the exposure has ended in the workpiece placement first region 110 at the first stop position 610 after step S12, the second workpiece 511 whose position detection is completed in the workpiece placement second region 111 At the second stop position 611, the projection exposure of the predetermined pattern of the mask 20 is performed on the second workpiece 511 (S15), and the process proceeds to step S16, and the control unit 410 checks whether an unexposed workpiece remains (S16) ).

若無殘留未曝光的工件時(S16:Yes),則結束處理,若有殘留未曝光的工件時(S16:No),則回到步驟S1,確認工件載置用第一區域110是否暫時停止於第一停止位置610(S1),且反覆進行以下的處理。 If there are no unexposed workpieces remaining (S16: Yes), the process is terminated. If there are remaining unexposed workpieces (S16: No), the process returns to step S1, and it is confirmed whether the first region 110 for workpiece placement is temporarily stopped At the first stop position 610 (S1), the following processing is repeatedly performed.

因此,本實施形態之投影曝光裝置1係將光罩20的預定圖案對位於工件510及511上的預定位置,以來自光源10的光而進行投影曝光,藉此而將預定圖案形成 於工件510及511上之投影曝光裝置1,其係具有:轉盤120,其係以複數個工件510及511不重疊而能同時載置之方式,形成有複數個區域110及111於用以載置工件510及511之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置610及611;裝載機310,其係能將於轉盤120之複數個區域110及111內進行工件510及511之裝載及卸載;位置檢測裝置210,在轉盤120暫時停止於預定之各停止位置610及611之中之一個第一停止位置610時,以能檢測載置於該第一區域110內之工件510的載置位置之方式而配置於轉盤120之複數個區域110及111之中之一個第一區域110的正上部;光源10、光罩20及投影光學系統50,在轉盤120之第一區域110暫時停止於第一停止位置610時,以能投影曝光於被載置在該第二區域111內之工件511的方式而配置於轉盤120之複數個區域110及111之中的和第一區域110不同之第二區域111的正上部;以及控制部410,其係控制轉盤120之旋轉及在預定之各停止位置610及611的停止、裝載機310所為之各區域110及111內之複數個工件510及511之裝載及卸載、位置檢測裝置210所為之被載置於各區域110及111內之各工件510及511之載置位置的檢測、光源10、光罩20及投影光學系統50所為之往各區域110及111內之各工件510及511之投影曝光的各處理, 控制部410係在對載置於第二區域111內之工件511,藉由光源10、光罩20及投影光學系統50而進行投影曝光時,至少實施以位置檢測裝置210檢測被載置於第一區域110內之工件510的載置位置之並行處理。 Therefore, the projection exposure apparatus 1 according to this embodiment sets a predetermined pattern of the mask 20 to a predetermined position on the workpieces 510 and 511, and performs projection exposure with light from the light source 10, thereby forming the predetermined pattern. The projection exposure device 1 on the workpieces 510 and 511 includes a turntable 120, which is formed in a manner that a plurality of workpieces 510 and 511 can be placed at the same time without overlapping, and a plurality of areas 110 and 111 are formed for loading. The workpieces 510 and 511 are placed at the uppermost part, and can be rotated and temporarily stopped at a predetermined plurality of stop positions 610 and 611; the loader 310 can be performed in a plurality of areas 110 and 111 of the turntable 120 Loading and unloading of the workpieces 510 and 511; the position detection device 210 is capable of detecting the loading on the first area 110 when the turntable 120 temporarily stops at one of the predetermined stopping positions 610 and 611. The position of the workpiece 510 inside is arranged directly above one of the first regions 110 of the plurality of regions 110 and 111 of the turntable 120; the light source 10, the mask 20 and the projection optical system 50 are located on the turntable 120. When the first region 110 is temporarily stopped at the first stop position 610, the sum of the plurality of regions 110 and 111 disposed on the turntable 120 is projected and exposed on the workpiece 511 placed in the second region 111. The first area 110 is different The upper part of the two areas 111; and the control unit 410, which controls the rotation of the turntable 120 and the stop at predetermined stop positions 610 and 611, and a plurality of workpieces 510 and 511 in each area 110 and 111 where the loader 310 is. Loading and unloading, position detection by the position detection device 210 for each workpiece 510 and 511 placed in each of the areas 110 and 111, detection of the placement position of the light source 10, the mask 20, and the projection optical system 50 toward each area Each process of projection exposure of each workpiece 510 and 511 in 110 and 111, When the control unit 410 performs projection exposure on the workpiece 511 placed in the second area 111 by the light source 10, the mask 20, and the projection optical system 50, at least the position detection device 210 is used to detect the placement on the first Parallel processing of placement positions of workpieces 510 in a region 110.

此外,本實施形態之投影曝光裝置1係能對1個的工件,以一次照射將要投影曝光之圖案進行曝光之曝光裝置。此外,上述之各實施形態之投影曝光裝置1係將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為包含將光罩20移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或包含將光罩20對曝光光源而自垂直面變更角度之擺動驅動裝置,及/或包含將配置於轉盤120的下方之台座移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或包含將投影光學系統50移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 In addition, the projection exposure apparatus 1 of this embodiment is an exposure apparatus capable of exposing one workpiece to a pattern that is to be projected and exposed in one shot. In addition, the projection exposure device 1 of each of the above-mentioned embodiments is a device including a position where a pattern to be projected is exposed to a position of a position-detected workpiece, and the mask 20 is moved in the vertical (Y), horizontal (X), and high positions. (Z) and at least one of the rotation (θ) directions of the driving device, and / or includes a swing driving device that changes the angle of the photomask 20 to the exposure light source from a vertical plane, and / or includes a rotating device A driving device that moves the lower stage of 120 in at least one of the vertical (Y), horizontal (X), high (Z), and rotational (θ) directions, and / or includes moving the projection optical system 50 in the vertical direction. A driving device in at least one of (Y), horizontal (X), high (Z), and rotational (θ) directions.

此外,本實施形態之投影曝光裝置1的投影曝光方法係使用投影曝光裝置1,該投影曝光裝置1係將光罩20的預定圖案對位於工件510及511上的預定位置,以來自光源10的光進行投影曝光,藉此將預定圖案形成於工件510及511上,且具有轉盤120,該轉盤120係以複數個工件510及511不重疊而能同時載置之方式,形成複數個的區域110及區域111於載置工件510及511之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止 位置610及611,該投影曝光方法係包含:(A)將工件510及511裝載於轉盤120之複數個區域110及111之中之一個第一區域110內之步驟;(B)使轉盤120旋轉而使第一區域110暫時停止於預定之各停止位置610及611之中之一個第一停止位置610之步驟;(C)檢測第一區域110內之工件510及511的載置位置之步驟;(D)使轉盤120再度旋轉而使第一區域110暫時停止於預定之各停止位置610及611之中之和第一停止位置610不同之第二停止位置611之步驟;(E)將光罩20上的圖案投影曝光至第一區域110內之工件510之步驟;(F)當轉盤120之和第一區域110不同之第二區域111內有結束投影曝光之工件511時,則以和(E)之投影曝光處理並行的方式,自該第二區域111內卸載結束投影曝光之工件511而結束第一循環之步驟;以及(G)將前述(A)至(F)的第一循環之第一區域110置換成第二區域111,且將區域置換成在僅具有2區域時之第一區域110而進行第二循環之處理,而關於以後之循環,係以交互替換僅具有兩個區域時之第一區域110和第二區域111之方式而實施之步驟。 In addition, the projection exposure method of the projection exposure apparatus 1 of this embodiment uses the projection exposure apparatus 1 which sets a predetermined pattern of the mask 20 at a predetermined position on the workpieces 510 and 511, and The light is subjected to projection exposure, thereby forming a predetermined pattern on the workpieces 510 and 511, and having a turntable 120, which forms a plurality of areas 110 in such a manner that a plurality of workpieces 510 and 511 can be placed at the same time without overlapping. The area 111 is at the top of the part on which the workpieces 510 and 511 are placed, and is configured to be rotatable and temporarily stopped at a predetermined plurality of stops. At positions 610 and 611, the projection exposure method includes: (A) loading the workpieces 510 and 511 in one of the plurality of regions 110 and 111 of the turntable 120 in the first region 110; (B) rotating the turntable 120 And step of temporarily stopping the first region 110 at one of the predetermined stopping positions 610 and 611; (C) detecting the placement positions of the workpieces 510 and 511 in the first region 110; (D) a step of rotating the turntable 120 again to temporarily stop the first region 110 at a predetermined second stop position 610 and a second stop position 611 which is different from the first stop position 610; (E) a mask The step of projecting and exposing the pattern on 20 to the workpiece 510 in the first region 110; (F) When there is a workpiece 511 in the second region 111 that is different from the first region 110 in the turntable 120, the sum ( E) The projection exposure processing is performed in parallel, and the first cycle is completed by unloading the workpiece 511 that has completed the projection exposure from the second area 111; and (G) the steps of the first cycle (A) to (F) described above. The first region 110 is replaced with the second region 111, and the region is replaced with only two regions. The first region 110 and a second cycle of processing, and on the subsequent cycles, the interactive system to replace only the first step region 110 and the region 111 of the second embodiment of the embodiment when the two regions.

如上述之第一實施形態,投影光學系統50、位置檢測部210、以及裝載機310在第一或第二之各 停止位置暫時停止時,對工件載置用第一或第二之不同的區域上之不同的工件,能同時並列實施工件之裝載/卸載及位置檢測、或投影曝光之不同的處理。因此,相較於在相同的場所而連續系列式地實施各處理之習知的技術,則本實施形態由於能實施並行處理,故更能縮短處理時間。 As in the first embodiment described above, the projection optical system 50, the position detection unit 210, and the loader 310 are each in the first or second position. When the stop position is temporarily stopped, it is possible to perform different processes of loading / unloading, position detection, or projection exposure of different workpieces in different areas on the first or second area for workpiece placement simultaneously. Therefore, compared with the conventional technique of continuously performing each process serially in the same place, this embodiment can perform parallel processing, which can further shorten the processing time.

<第二實施形態> <Second Embodiment>

第3圖至第5圖所示之第二實施形態係和第1圖至第2圖所示之第一實施形態相比較,停止位置係由兩個增加為三個(第一停止位置610至第三停止位置612),伴隨於此,工件用轉盤120上之工件載置用的區域亦由兩個增加為三個(工件載置用第一區域110至工件載置用第三區域112)。同時能使三個的工件(第一工件510至第三工件512)不重疊而載置於工件用轉盤120上。關於另外之構成,由於和第一實施形態相同,故省略其重覆的記載。 Compared to the second embodiment shown in FIGS. 3 to 5 and the first embodiment shown in FIGS. 1 to 2, the stop position is increased from two to three (the first stop position 610 to (Third stop position 612), and along with this, the area for placing workpieces on the workpiece turntable 120 has also been increased from two to three (the first region 110 for workpiece placement to the third region 112 for workpiece placement) . At the same time, three workpieces (the first workpiece 510 to the third workpiece 512) can be placed on the workpiece turntable 120 without overlapping. The other configuration is the same as that of the first embodiment, so the repeated description is omitted.

工件用轉盤120上之工件載置用的各區域係分別以來自工件用轉盤120的中心的角度為形成360度的1/3的120度而配置。因此,將第一工件510載置於工件載置用第一區域110而暫時停止於第一停止位置610時,則工件載置用第二區域111上的第二工件511係暫時停止於第二停止位置611,工件載置用第三區域112上的第三工件512係暫時停止於第三停止位置612。 Each area for placing a workpiece on the workpiece turntable 120 is arranged so that an angle from the center of the workpiece turntable 120 is 120 degrees which is 1/3 of 360 degrees. Therefore, when the first workpiece 510 is placed in the first region 110 for workpiece placement and temporarily stopped at the first stop position 610, the second workpiece 511 in the second region 111 for workpiece placement is temporarily stopped at the second In the stop position 611, the third workpiece 512 on the workpiece placing third region 112 is temporarily stopped at the third stop position 612.

此外,第3圖(a)中,裝載機310並非在停止於第一停止位置610的區域的上部或近旁,而係配置於 停止於第三停止位置612的區域的上部或近旁,且配置於和設置於停止於第一停止位置610的區域的上部之位置檢測部210不同的停止位置。此外,裝載機310係能自暫時停止於第三停止位置612的工件載置用第一區域110至工件載置用第三區域112,自該區域卸載曝光結束的工件,且能將未曝光的工件裝載於該區域。 In addition, in FIG. 3 (a), the loader 310 is not located above or near the area stopped at the first stop position 610 but is disposed at The position detection unit 210 stopped at an upper portion of or near the area stopped at the third stop position 612 is disposed at a position different from the position detection unit 210 provided at an upper portion of the area stopped at the first stop position 610. In addition, the loader 310 is capable of unloading the exposed workpiece from the first region 110 for workpiece placement to the third region 112 for workpiece placement temporarily stopped at the third stop position 612, and can unload the unexposed workpiece. The workpiece is loaded in this area.

繼而使用第4圖至第5圖而說明本實施形態的動作。首先,當控制部410開始處理時,則確認轉盤120上的工件載置用第一區域110是否暫時停止於第三停止位置612(S21)。若工件載置用第一區域110為暫時停止於第三停止位置612(S21:Yes),則確認是否有未曝光的工件載置於工件載置用第一區域110(S22)。若工件載置用第一區域110為未暫時停止於第三停止位置612(S21:No),則由於工件載置用第一區域110係形成暫時停止於第一停止位置610或第二停止位置611,故進入步驟S40。 Next, the operation of this embodiment will be described using FIGS. 4 to 5. First, when the control unit 410 starts processing, it is confirmed whether the first area 110 for placing a workpiece on the turntable 120 is temporarily stopped at the third stop position 612 (S21). When the first region 110 for workpiece placement is temporarily stopped at the third stop position 612 (S21: Yes), it is confirmed whether or not an unexposed workpiece is placed in the first region 110 for workpiece placement (S22). If the first area 110 for workpiece placement is not temporarily stopped at the third stop position 612 (S21: No), the first area 110 for workpiece placement is temporarily stopped at the first stop position 610 or the second stop position. 611, the process proceeds to step S40.

若未曝光的工件未載置於工件載置用第一區域110時(S22:Yes),則控制部410係以能將未曝光的工件載置於工件載置用第一區域110內而將命令輸出於裝載機310(S23)。若未曝光的工件係載置於工件載置用第一區域110時(S22:No),則由於不需要裝載未曝光的工件,故進入步驟S24,使轉盤旋轉(S24)。當轉盤120上的工件載置用第一區域110到達第一停止位置610之後,則輸出暫時停止的命令(S25)。 When an unexposed workpiece is not placed in the first region 110 for workpiece placement (S22: Yes), the control unit 410 is configured to place the unexposed workpiece in the first region 110 for workpiece placement and place the unexposed workpiece in the first region 110 for workpiece placement. The command is output to the loader 310 (S23). When an unexposed workpiece is placed in the first area 110 for workpiece placement (S22: No), since it is not necessary to load an unexposed workpiece, the process proceeds to step S24 and the turntable is rotated (S24). When the first area 110 for workpiece placement on the turntable 120 reaches the first stop position 610, a temporary stop command is output (S25).

工件載置用第一區域110在第一停止位置 610暫時停止之後,則確認第二停止位置611的工件載置用第二區域111內是否有結束位置檢測的工件(S26)。若工件載置用第二區域111內有結束位置檢測的工件時(S26:Yes),則控制部410係對工件載置用第二區域111內的結束位置檢測之第一工件,在第二停止位置611實施以光罩20之圖案的投影曝光所為之往工件的轉印(S27),並進入步驟S32(S32)。若工件載置用第二區域111內無結束位置檢測的工件時(S26:No),則進入步驟S32(S32)。 The first area 110 for workpiece placement is at the first stop position After 610 is temporarily stopped, it is confirmed whether there is a work for detecting the end position in the work placement second area 111 at the second stop position 611 (S26). If there is a workpiece with the end position detection in the second region 111 for workpiece placement (S26: Yes), the control unit 410 detects the first workpiece with the end position in the second region 111 for workpiece placement in the second region. The stop position 611 performs transfer to the workpiece by the projection exposure of the pattern of the mask 20 (S27), and proceeds to step S32 (S32). If there is no work for detecting the end position in the work placement second area 111 (S26: No), the process proceeds to step S32 (S32).

步驟S26的處理之後,和對工件載置用第二區域111內之結束位置檢測之工件實施轉印同時並行,確認第三停止位置612之工件載置用第三區域112內是否有結束曝光的工件(S28)。若工件載置用第三區域112內有結束曝光的工件時(S28:Yes),則控制部410係對裝載機310,自工件載置用第三區域112卸載該結束曝光的工件(S29),且以能將未曝光的工件裝載於工件載置用第三區域112而輸出命令(S30)。若工件載置用第三區域112內無結束曝光的工件時(S28:No),則由於不需要裝載工件,故進入步驟S30,將未曝光的工件裝載於工件載置用第三區域112(S30),且進入步驟S32(S32)。 After the processing in step S26, the transfer of the workpiece in which the end position is detected in the second region 111 for workpiece placement is performed simultaneously with the transfer, and it is confirmed whether there is an end of exposure in the third region 112 for workpiece placement in the third stop position 612. Work (S28). If there is a workpiece whose exposure has ended in the third area 112 for workpiece placement (S28: Yes), the control unit 410 unloads the workpiece which has been exposed from the third area 112 for loading of the workpiece to the loader 310 (S29) Then, an unexposed workpiece can be loaded into the third region 112 for workpiece placement, and a command is output (S30). If there are no exposed workpieces in the third region 112 for workpiece placement (S28: No), since there is no need to load the workpiece, the process proceeds to step S30, and the unexposed workpiece is loaded in the third region 112 for workpiece placement ( S30), and the process proceeds to step S32 (S32).

進而在步驟S26的處理之後,和對工件載置用第二區域111內之結束位置檢測之工件實施轉印同時並行,檢測第一停止位置610之工件載置用第一區域110內的未曝光的工件載置位置,且進入步驟S32(S32)。上述之步驟S27、S30、以及S31的各同時並行處理全部結束之後, 則控制部410係再度使轉盤旋轉(S32)。當轉盤120上的工件載置用第一區域110到達第二停止位置611之後,則輸出暫時停止的命令(S33)。 Further, after the processing in step S26, the unexposed in the first region 110 for the workpiece placement of the first stop position 610 is detected in parallel with the transfer of the workpiece detected at the end position in the second region 111 for the workpiece placement. And the workpiece is placed at the position, and the process proceeds to step S32 (S32). After all the simultaneous and parallel processes of steps S27, S30, and S31 described above are completed, Then, the control unit 410 rotates the turntable again (S32). When the workpiece loading first area 110 on the turntable 120 reaches the second stop position 611, a temporary stop command is output (S33).

工件載置用第一區域110在第二停止位置611暫時停止之後,則確認第三停止位置612的工件載置用第三區域112內是否有未曝光的工件(S34)。若工件載置用第三區域112內有未曝光的工件時(S34:Yes),則控制部410係使用位置檢測裝置210檢測工件載置用第三區域112內之未曝光的工件512的位置(S35),並進入步驟S40(S40)。若工件載置用第三區域112內無未曝光的工件時(S34:No),則進入步驟S40(S40)。 After the work placement first area 110 is temporarily stopped at the second stop position 611, it is confirmed whether there is an unexposed work in the work placement third area 112 at the third stop position 612 (S34). If there is an unexposed workpiece in the third region 112 for workpiece placement (S34: Yes), the control unit 410 uses the position detection device 210 to detect the position of the unexposed workpiece 512 in the third region 112 for workpiece placement. (S35), and it progresses to step S40 (S40). If there are no unexposed workpieces in the third region 112 for workpiece placement (S34: No), the process proceeds to step S40 (S40).

步驟S34的處理之後,和實施工件載置用第三區域112內之未曝光的工件的位置檢測處理同時並行,確認第三停止位置612的工件載置用第二區域111內是否有結束曝光的工件(S36)。若工件載置用第二區域111內有結束曝光的工件時(S36:Yes),則控制部410係對裝載機310,自工件載置用第二區域111卸載該已曝光的工件(S37),且以能將未曝光的工件裝載於工件載置用第二區域111的方式輸出命令(S38)。若工件載置用第二區域111內無結束曝光的工件時(S36:No),則由於不需要裝載工件,故進入步驟S38,將未曝光的工件裝載於工件載置用第二區域111(S38),且進入步驟S40(S40)。 After the processing of step S34, the position detection processing of the unexposed workpiece in the third region 112 for workpiece placement is performed in parallel with that of the third region 111, and it is confirmed whether or not there is an end of exposure in the second region 111 for workpiece placement at the third stop position 612. Work (S36). If there is an exposed workpiece in the second area 111 for workpiece placement (S36: Yes), the control unit 410 unloads the exposed workpiece from the second area 111 for workpiece placement to the loader 310 (S37) A command is output so that an unexposed workpiece can be loaded into the second region 111 for workpiece placement (S38). If there are no exposed workpieces in the second region 111 for workpiece placement (S36: No), since there is no need to load a workpiece, the process proceeds to step S38, and the unexposed workpiece is loaded in the second region 111 for workpiece placement ( S38), and the process proceeds to step S40 (S40).

此外,步驟S34的處理之後,和實施工件載置用第三區域112內之未曝光的工件之位置檢測處理同時 並行,控制部410係對工件載置用第一區域110內的結束位置檢測之工件,在第二停止位置611實施以光罩20之預定圖案的投影曝光所為之往工件的轉印(S39),並進入步驟S40(S40)。上述之步驟S35、S38、及S39的各同時並行處理全部結束之後,則控制部410係再度使轉盤旋轉(S40)。當轉盤120上的工件載置用第一區域110到達第一停止位置610之後,則輸出暫時停止的命令(S41)。控制部410係對裝載機310,自工件載置用第一區域110卸載該結束曝光之工件(S42),控制部410係確認有無殘留未曝光的工件(S43)。 In addition, after the processing of step S34, the position detection processing of the unexposed workpiece in the third workpiece mounting area 112 is performed at the same time In parallel, the control unit 410 detects the workpiece at the end position in the first region 110 for workpiece placement, and transfers the workpiece to the workpiece at the second stop position 611 by projecting exposure with a predetermined pattern of the mask 20 (S39). And proceed to step S40 (S40). After all the simultaneous and parallel processes of steps S35, S38, and S39 described above are completed, the control unit 410 rotates the turntable again (S40). When the first area 110 for workpiece placement on the turntable 120 reaches the first stop position 610, a temporary stop command is output (S41). The control unit 410 unloads the exposed workpiece from the loader first area 110 to the loader 310 (S42), and the control unit 410 confirms whether or not there is an unexposed workpiece remaining (S43).

若無殘留未曝光的工件時(S43:Yes),則結束處理,若有殘留未曝光的工件時(S43:No),則回到步驟S21,確認工件載置用第一區域110是否暫時停止於第三停止位置612中(S21),且重覆以下的處理。 If there are no unexposed workpieces remaining (S43: Yes), the processing is terminated. If there are remaining unexposed workpieces (S43: No), the process returns to step S21 to check whether the first area 110 for workpiece placement is temporarily stopped. In the third stop position 612 (S21), the following processing is repeated.

因此,本實施形態之投影曝光裝置1係轉盤120為具有和複數個區域110及111之中之一個第一區域110及第二區域111不同之第三區域112,裝載機310係轉盤120之第一區域110為暫時停止於第一停止位置610時,以能往轉盤120之第三區域112內裝載及/或卸載工件512的方式配置,控制部410係在檢測被載置於第一區域110內之工件510的載置位置的同時,能對載置於第二區域111內之工件511投影曝光時,在卸載結束載置於第三區域112內的投影曝光之工件512之後,以能裝載未曝光之工件之方式實施並行處理。 Therefore, the projection exposure device 1 of the present embodiment 1 is a turntable 120 having a third area 112 which is different from one of the first area 110 and the second area 111 of the plurality of areas 110 and 111, and the loader 310 is the first of the turntable 120. When an area 110 is temporarily stopped at the first stop position 610, it is arranged in such a manner that workpieces 512 can be loaded and / or unloaded into the third area 112 of the turntable 120, and the control unit 410 detects that it is placed in the first area 110 At the same time as the placement position of the workpiece 510 inside, when the workpiece 511 placed in the second area 111 can be projected and exposed, the projected exposure workpiece 512 placed in the third area 112 can be loaded after the unloading is completed. Unexposed workpieces are processed in parallel.

此外,本實施形態之投影曝光裝置1的投影曝光方法係使用投影曝光裝置1,該投影曝光裝置1係將光罩20的預定圖案對位於工件510及511上的預定位置,以來自光源10的光進行投影曝光,藉此而將預定圖案形成於工件510及511上,且具有轉盤120,該轉盤120係以複數個工件510及511不重疊而能同時載置的方式,形成有複數個區域110及111於載置工件510及511之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置610及611,該投影曝光方法係具有:(A)使工件510及511裝載於轉盤120之複數個區域110及111之中之一個第一區域110內之步驟;(B)使轉盤120旋轉而將第一區域110暫時停止於預定之各停止位置610及611之中之一個第一停止位置610之步驟;(C)檢測第一區域110內之工件510及511的載置位置之步驟;(D)再度使轉盤120旋轉而將第一區域110暫時停止於預定之各停止位置610及611之中之和第一停止位置610不同之第二停止位置611之步驟;(E)將光罩20上的預定圖案投影曝光於第一區域110內之工件510之步驟;(F)當轉盤120之和第一區域110不同之第二區域111內有結束投影曝光之工件511時,則以和(E)之投影曝光處理並行的方式,自該第二區域111內卸載結束投影曝光之 工件511而結束第一循環之步驟;以及(G)將前述(A)至(F)的第一循環之第一區域110置換成第二區域111,且將區域置換成在具有三個區域以上時之第三區域112而進行第二循環之處理,而關於以後之循環,係以具有三個區域以上時之升順而置換區域,最後回到第一區域110而實施之步驟。 In addition, the projection exposure method of the projection exposure apparatus 1 of this embodiment uses the projection exposure apparatus 1 which sets a predetermined pattern of the mask 20 at a predetermined position on the workpieces 510 and 511, and The light is subjected to projection exposure to thereby form a predetermined pattern on the workpieces 510 and 511, and has a turntable 120. The turntable 120 is formed with a plurality of areas in such a manner that a plurality of workpieces 510 and 511 can be placed simultaneously without overlapping. 110 and 111 are on the top of the part on which the workpieces 510 and 511 are placed, and are configured to be rotatable and temporarily stopped at a predetermined plurality of stopping positions 610 and 611. The projection exposure method has: (A) the workpieces 510 and 511 A step of loading in one of the plurality of regions 110 and 111 of the turntable 120 in the first region 110; (B) rotating the turntable 120 to temporarily stop the first region 110 in each of the predetermined stopping positions 610 and 611; A step of a first stop position 610; (C) a step of detecting the placement positions of the workpieces 510 and 511 in the first region 110; (D) a turn of the turntable 120 again to temporarily stop the first region 110 at a predetermined position Stop position 610 And (611) a step of the second stop position 611 that is different from the first stop position 610; (E) a step of projecting a predetermined pattern on the photomask 20 onto the workpiece 510 in the first area 110; (F) when When there is a workpiece 511 in the second region 111 that is different from the first region 110 in the turntable 120 and the projection exposure is ended, the projection exposure end of the second region 111 is unloaded from the second region 111 in parallel with the projection exposure processing of (E). And (G) replacing the first region 110 in the first cycle of (A) to (F) with the second region 111, and replacing the region with three or more regions. In the third region 112 of the present time, the second cycle of processing is performed, and in the subsequent cycle, the steps are performed by replacing the regions with ascending order when there are three or more regions, and finally returning to the first region 110 to implement.

此外,本實施形態之投影曝光裝置1係能對一個工件,以一次照射將要投影曝光之圖案進行曝光之曝光裝置。此外,上述之各實施形態之投影曝光裝置1係將要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為可包含使光罩20移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或可包含將光罩20對曝光光源而自垂直面變更角度之擺動驅動裝置,及/或可包含使配置於轉盤120的下方之台座移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或可包含使投影光學系統50移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 In addition, the projection exposure apparatus 1 of this embodiment is an exposure apparatus capable of exposing a workpiece to a pattern to be projected and exposed in one shot. In addition, the projection exposure apparatus 1 of each of the embodiments described above may include a device that moves the position of the pattern to be projected to the position of the position-detected workpiece, and may include moving the mask 20 in the vertical (Y), horizontal (X), A driving device in at least one of the high (Z) and rotation (θ) directions, and / or may include a swing driving device that changes the angle of the mask 20 to the exposure light source from a vertical plane, and / or may include A driving device that is arranged below the turntable 120 and moves in at least one of the vertical (Y), horizontal (X), high (Z), and rotational (θ) directions, and / or may include a projection optical system. 50 is a driving device that moves in at least one of the vertical (Y), horizontal (X), high (Z), and rotational (θ) directions.

如上述之第二實施形態,投影光學系統50、位置檢測部210、以及裝載機310係在各停止位置暫時停止時,對不同的區域上之不同的工件,能同時並列實施工件之裝載/卸載、工件之位置檢測、或投影曝光之各不同的處理。因此,相較於在相同的場所而連續系列式地實施各處理之習知技術,則本實施形態由於能實施並行處 理,故能縮短處理時間。 As in the second embodiment described above, when the projection optical system 50, the position detection unit 210, and the loader 310 are temporarily stopped at each stop position, loading / unloading of different workpieces in different areas can be performed in parallel at the same time. , Different detection of the position of the workpiece, or projection exposure. Therefore, compared with the conventional technique of successively performing each process in the same place, this embodiment can implement parallel processing. It can shorten the processing time.

<第三實施形態> <Third Embodiment>

此外,將工件用轉盤120上的工件載置用的區域及其停止位置作成四個以上,藉由比較花費時間的處理,例如追加設置裝載機310,以一次的裝載動作而裝載複數個工件,依序實施較不花費時間的位置檢測或曝光處理之實施形態,進而更能縮短處理時間。此外,此時可因應需求而追加位置檢測部210。 In addition, the workpiece placing area on the workpiece turntable 120 and its stopping position are made four or more, and it takes time-consuming processing, such as adding a loader 310 to load a plurality of workpieces in a single loading operation. The sequential implementation of position detection or exposure processing that takes less time can further reduce processing time. In addition, in this case, a position detection unit 210 may be added in accordance with a demand.

因此,本實施形態之投影曝光裝置1係轉盤120為具有複數個區域之n個的區域110、111、112…(n為n≧4的整數),位置檢測裝置210係轉盤120之第一區域暫時停止於第一停止位置610時,以能檢測被載置於該第一區域110內之工件510的載置位置之方式配置於轉盤120之n個的區域之中之一個第一區域110的正上部,光源10、光罩20及投影光學系統50係轉盤120之第一區域110暫時停止於第一停止位置610時,以能投影曝光於被載置於該第二區域111內之工件511的方式配置於轉盤120之n個的區域之中之一個且與第一區域110不同之第二區域111的正上部,裝載機310係第一區域110為暫時停止於第一停止位置610時,在轉盤120之n個的區域之中之一個且與第一區域110及第二區域111不同之第三區域112,能裝載及卸載工件512而配置,控制部410係在檢測被載置於第一區域110內之工件510的載置位置的同時,能實 施對載置於第二區域111內之工件511投影曝光時,在卸載被載置於第三區域112內的結束投影曝光之工件512之後裝載未曝光之工件的並行處理。 Therefore, the projection exposure device 1 of the present embodiment 1 is a turntable 120 having n areas 110, 111, 112 ... (n is an integer of n ≧ 4), and the position detection device 210 is a first area of the turntable 120. When temporarily stopped at the first stop position 610, it is arranged in one of the first areas 110 of the n areas of the turntable 120 so that the placement position of the workpiece 510 placed in the first area 110 can be detected. Directly above, when the light source 10, the mask 20, and the first area 110 of the turntable 120 of the projection optical system 50 temporarily stop at the first stop position 610, the workpiece 511 placed in the second area 111 can be projected and exposed. The method is arranged in the upper part of the second area 111 which is one of the n areas of the turntable 120 and is different from the first area 110. When the loader 310 is temporarily stopped at the first stop position 610, The third area 112, which is one of the n areas of the turntable 120 and is different from the first area 110 and the second area 111, can be configured to load and unload the workpiece 512, and the control unit 410 detects whether it is placed on the first area. While placing the workpiece 510 in a region 110 Can When performing projection exposure on the workpiece 511 placed in the second area 111, parallel processing of unexposed workpieces is loaded after unloading the workpiece 512 placed in the third area 112 and ending the projection exposure.

此外,本實施形態之投影曝光裝置1係以在轉盤120之n個的區域之中之一個且與第一區域110至第三區域112不同之第四區域至第n區域,能裝載及卸載工件的方式配置複數個裝載機310,控制部410係以能在卸載被載置於第四區域至第n區域內的結束投影曝光之工件之後,裝載未曝光之工件的方式實施並行處理。 In addition, the projection exposure apparatus 1 of this embodiment is capable of loading and unloading a workpiece in one of the n regions of the turntable 120 and a fourth region to an n-th region different from the first region 110 to the third region 112. A plurality of loaders 310 are configured in the manner described above, and the control unit 410 performs parallel processing in such a manner that unloaded workpieces can be loaded after unloading the workpieces that have been placed in the fourth region to the n-th region and have completed projection exposure.

此外,本實施形態之投影曝光裝置1係能對一個工件,以一次照射將要投影曝光之圖案進行曝光之曝光裝置。此外,上述之各實施形態之投影曝光裝置1係使要投影曝光之圖案的位置對位於經位置檢測之工件的位置的裝置為可包含將光罩20移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或可包含將光罩20對曝光光源而自垂直面變更角度之擺動驅動裝置,及/或可包含使配置於轉盤120的下方之台座移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置,及/或可包含使投影光學系統50移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 In addition, the projection exposure apparatus 1 of this embodiment is an exposure apparatus capable of exposing a workpiece to a pattern to be projected and exposed in one shot. In addition, the projection exposure apparatus 1 of each of the above-described embodiments is an apparatus that can move the position of the pattern to be projected to the position of the position-detected workpiece, which may include moving the mask 20 in the vertical (Y) and horizontal (X) directions. A driving device in at least one of the high (Z) and rotation (θ) directions, and / or may include a swing driving device that changes the angle of the mask 20 to the exposure light source from a vertical plane, and / or may include A driving device for moving the pedestal disposed below the turntable 120 in at least one of the vertical (Y), horizontal (X), high (Z), and rotational (θ) directions, and / or may include a projection optical The system 50 moves the driving device in at least one of the longitudinal (Y), lateral (X), high (Z), and rotational (θ) directions.

1‧‧‧投影曝光裝置 1‧‧‧ projection exposure device

10‧‧‧光源部 10‧‧‧Light source department

20‧‧‧光罩(標線片) 20‧‧‧Photomask (Reticle)

30‧‧‧遮罩用XYθ台座 30‧‧‧Mask XYθ stage

40‧‧‧遮罩用擺動台座 40‧‧‧Masking swing stand

50‧‧‧投影光學系統 50‧‧‧ projection optical system

60‧‧‧遮罩用XYθ台座驅動部 60‧‧‧Mask XYθ Stage Driver

70‧‧‧遮罩用擺動台座驅動部 70‧‧‧Masking swing stand drive unit

110‧‧‧工件載置用第一區域 110‧‧‧First area for workpiece placement

111‧‧‧工件載置用第二區域 111‧‧‧Second area for workpiece placement

120‧‧‧工件用轉盤 120‧‧‧ Turntable for workpiece

130‧‧‧工件用轉盤軸 130‧‧‧Turntable shaft for workpiece

140‧‧‧工件用Z台座 140‧‧‧Z base for workpiece

150‧‧‧工件用轉盤驅動部 150‧‧‧Workpiece turntable drive unit

160‧‧‧工件用Z台座驅動部 160‧‧‧Z stage drive for workpiece

210‧‧‧位置檢測部 210‧‧‧Position detection section

310‧‧‧裝載機 310‧‧‧Loader

410‧‧‧控制部 410‧‧‧Control Department

510‧‧‧第一工件 510‧‧‧First Workpiece

511‧‧‧第二工件 511‧‧‧Second workpiece

610‧‧‧第一停止位置 610‧‧‧First stop position

611‧‧‧第二停止位置 611‧‧‧Second stop position

Claims (10)

一種投影曝光裝置,係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光進行投影曝光,藉此將前述預定圖案形成於前述工件上者,具有:轉盤,係以複數個工件不重疊而能同時載置之方式,形成有複數個區域於用以載置前述工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置;裝載機,係能於前述轉盤之前述複數個區域內進行前述工件之裝載及卸載;位置檢測裝置,係在前述轉盤之前述複數個區域之中之一個第一區域暫時停止於前述預定之各停止位置之中之一個第一停止位置時,以能檢測被載置於該第一區域內之工件的載置位置之方式配置於前述轉盤之前述第一區域的正上部;光源、光罩及投影光學系統,係在前述轉盤之前述第一區域暫時停止於前述第一停止位置時,以能投影曝光於被載置於該第二區域內之工件之方式配置於前述轉盤之前述複數個區域之中的和第一區域不同之第二區域的正上部;以及控制部,係控制:前述轉盤之旋轉及前述預定之各停止位置的停止、由裝載機對各區域內之複數個工件所進行之裝載及卸載、由前述位置檢測裝置對被載置於各區域內之各工件所進行之載置位置的檢測、前述光 源、光罩及投影光學系統對被載置於各區域內之各工件所進行之投影曝光的各處理,前述控制部係在對被載置於前述第二區域內之工件,藉由前述光源、光罩及投影光學系統進行投影曝光時,至少實施以前述位置檢測裝置檢測被載置於前述第一區域內之工件的載置位置之並行處理。 A projection exposure device is a method of projecting and exposing a predetermined pattern of a photomask to a predetermined position on a workpiece with light from a light source, thereby forming the predetermined pattern on the workpiece, including a turntable and a plurality of The workpieces can be placed at the same time without overlapping the workpieces. A plurality of areas are formed on the top of the part on which the workpieces are placed, and they are configured to be able to rotate and temporarily stop at predetermined stopping positions. Loading and unloading of the workpiece in the plurality of areas of the turntable; a position detection device, which temporarily stops one of the first areas of the plurality of areas of the turntable in one of the predetermined stopping positions At the first stop position, it is arranged directly above the first area of the turntable in a manner that can detect the placement position of the workpiece placed in the first area; the light source, mask and projection optical system are attached to When the first area of the turntable is temporarily stopped at the first stop position, it can be projected and exposed to the work carried in the second area. The method is arranged on the upper part of the plurality of areas of the turntable directly above the second area which is different from the first area; and the control section controls: the rotation of the turntable and the stopping of the predetermined stop positions, loading The loading and unloading of a plurality of workpieces in each area by the machine, the detection of the placement position of each workpiece placed in each area by the aforementioned position detection device, the aforementioned light The source, the reticle, and the projection optical system perform various processes of projection exposure on each workpiece placed in each area. The aforementioned control unit is for the workpiece placed in the second area through the light source. When the photomask and the projection optical system perform projection exposure, at least parallel processing for detecting the placement position of the workpiece placed in the first area by the aforementioned position detection device is performed. 如申請專利範圍第1項所述之投影曝光裝置,其中前述轉盤係具有屬於前述複數個區域之中之一個且與前述第一區域及第二區域不同之第三區域,前述裝載機係配置成,在前述轉盤之前述第一區域暫時停止於前述第一停止位置時,於前述轉盤之前述第三區域內進行工件之卸載及/或裝載,前述控制部係以在檢測被載置於前述第一區域內之工件的載置位置並且對被載置於前述第二區域內之工件進行投影曝光時,卸載被載置於前述第三區域內的結束投影曝光之工件之後裝載未曝光之工件的方式實施並行處理。 The projection exposure device according to item 1 of the scope of patent application, wherein the turntable has a third area that belongs to one of the plurality of areas and is different from the first area and the second area, and the loader is configured to When the first area of the turntable is temporarily stopped at the first stop position, the workpiece is unloaded and / or loaded in the third area of the turntable, and the control unit is configured to be placed on the first When a workpiece is placed in an area and projection exposure is performed on the workpiece placed in the second area, the unexposed workpiece is loaded after unloading the workpiece exposed in the third area and ending the projection exposure. Way to implement parallel processing. 如申請專利範圍第1項或第2項所述之投影曝光裝置,其中前述轉盤係具有n個區域(n係n≧4的整數)作為前述複數個區域,前述位置檢測裝置係在前述轉盤之前述第一區域暫時停止於前述第一停止位置時,以能檢測被載置於該第一區域內之工件的載置位置之方式配置於前述轉盤 之前述n個區域之中之一個第一區域的正上部,前述光源、光罩及投影光學系統係在前述轉盤之前述第一區域暫時停止於前述第一停止位置時,以能投影曝光被載置於該第二區域內之工件之方式配置於屬於前述轉盤之前述n個區域之中之一個且與前述第一區域不同之第二區域的正上部,前述裝載機係在前述轉盤之前述第一區域暫時停止於前述第一停止位置時,以能在屬於前述轉盤之前述n個區域之中之一個且與前述第一區域及第二區域不同之第三區域裝載及卸載前述工件的方式配置,前述控制部係以在檢測被載置於前述第一區域內之工件的載置位置,並且對被載置於前述第二區域內之工件進行投影曝光時,卸載被載置於前述第三區域內的結束投影曝光之工件之後裝載未曝光之工件的方式實施並行處理。 The projection exposure device according to item 1 or item 2 of the scope of patent application, wherein the aforementioned turntable has n regions (n is an integer of n ≧ 4) as the aforementioned plurality of regions, and the aforementioned position detection device is provided on the aforementioned dial When the first area is temporarily stopped at the first stop position, it is disposed on the turntable in a manner capable of detecting a placement position of a workpiece placed in the first area. Directly above one of the n areas, the light source, mask, and projection optical system are loaded with projection exposure when the first area of the turntable temporarily stops at the first stop position. The way of placing the workpiece in the second area is arranged on the upper part of the second area which belongs to one of the n areas of the turntable and is different from the first area. The loader is on the first section of the turntable. When an area is temporarily stopped at the first stop position, it is configured in such a way that the workpiece can be loaded and unloaded in a third area that belongs to one of the n areas of the turntable and is different from the first area and the second area. The control unit is configured to unload the workpiece placed in the third area when detecting the placement position of the workpiece placed in the first area and performing projection exposure on the workpiece placed in the second area. Parallel processing is performed by loading unexposed workpieces after projecting exposed workpieces in the area. 如申請專利範圍第3項所述之投影曝光裝置,其中以能夠在屬於前述轉盤之前述n個的區域之一個且與前述第一區域至第三區域不同之第四區域至第n區域裝載及卸載前述工件之方式配置有複數個裝載機,前述控制部係以在卸載被載置於前述第四區域至第n區域內的結束投影曝光之工件之後裝載未曝光之工件的方式實施並行處理。 The projection exposure device according to item 3 of the scope of patent application, wherein a fourth area to an nth area capable of being loaded in one of the n areas belonging to the aforementioned turntable and different from the first area to the third area and The loader is unloaded by a plurality of loaders, and the control unit performs parallel processing by unloading the unexposed work piece after unloading the projected work piece that has been placed in the fourth area to the n-th area. 如申請專利範圍第1項至第4項中任一項所述之投影曝光裝置,其中 前述投影曝光裝置係對一個工件,以一次照射而將要投影曝光之圖案進行曝光之曝光裝置。 The projection exposure device as described in any one of claims 1 to 4 of the scope of patent application, wherein The aforementioned projection exposure device is an exposure device that exposes a workpiece to a pattern to be projected and exposed in one shot. 如申請專利範圍第1項至第4項中任一項所述之投影曝光裝置,其中將要投影曝光之圖案的位置對位於前述經位置檢測之工件的位置的裝置係包含使光罩移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 The projection exposure device according to any one of claims 1 to 4, wherein the device for positioning the position of the pattern to be projected and exposed to the position of the position-detected workpiece includes moving the photomask to a vertical position. A driving device in at least one of (Y), horizontal (X), high (Z), and rotational (θ) directions. 如申請專利範圍第1項至第4項中任一項所述之投影曝光裝置,其中將要投影曝光之圖案的位置對位於前述經位置檢測之工件的位置的裝置係包含將光罩相對於曝光光而自垂直面變更角度之擺動驅動裝置。 The projection exposure device according to any one of claims 1 to 4, wherein the device that positions the position of the pattern to be projected against the position of the aforementioned position-detected workpiece includes a mask relative to the exposure A swing driving device that changes the angle of light from a vertical plane. 如申請專利範圍第1項至第4項中任一項所述之投影曝光裝置,其中將要投影曝光之圖案的位置對位於前述經位置檢測之工件的位置的裝置係包含使配置於前述轉盤的下方之台座移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至少一個方向之驅動裝置。 The projection exposure device according to any one of claims 1 to 4, wherein the device for positioning the pattern to be projected and exposed to the position of the position-detected workpiece includes a device disposed on the turntable. The lower base is a driving device that moves in at least one of the vertical (Y), horizontal (X), high (Z), and rotational (θ) directions. 如申請專利範圍第1項至第4項中任一項所述之投影曝光裝置,其中將要投影曝光之圖案的位置對位於前述經位置檢測之工件的位置的裝置係包含使前述投影光學系統移動於縱(Y)、橫(X)、高(Z)、以及旋轉(θ)方向之中之至 少一個方向之驅動裝置。 The projection exposure device according to any one of claims 1 to 4, wherein the device for positioning the position of the pattern to be projected against the position of the position-detected workpiece includes moving the projection optical system. Between vertical (Y), horizontal (X), high (Z), and rotational (θ) directions Drive device with one less direction. 一種投影曝光方法,係使用投影曝光裝置,該投影曝光裝置係將光罩的預定圖案對位於工件上的預定位置,以來自光源的光而進行投影曝光,藉此將前述預定圖案形成於前述工件上,且具有轉盤,該轉盤係以複數個工件不重疊而能同時載置之方式形成有複數個區域於用以載置前述工件之部位的最上面,且構成為能旋轉及暫時停止於預定之複數個停止位置,該投影曝光方法係包含:(A)將前述工件裝載於前述轉盤之前述複數個區域之中之一個第一區域內之步驟;(B)使前述轉盤旋轉而使前述第一區域暫時停止於前述預定之各停止位置之中之一個第一停止位置之步驟;(C)檢測前述第一區域內之前述工件的載置位置之步驟;(D)使前述轉盤再度旋轉而使前述第一區域暫時停止於前述預定之各停止位置之中之和前述第一停止位置不同之第二停止位置之步驟;(E)將光罩上的圖案投影曝光於前述第一區域內之前述工件之步驟;(F)當前述轉盤之和前述第一區域不同之第二區域內有結束投影曝光之前述工件時,則以和前述(E)之投影曝光處理並行之方式,自該第二區域內卸載結束投 影曝光之前述工件而結束第一循環之步驟;以及(G)將前述(A)至(F)的第一循環之第一區域置換成第二區域,且在具有三個區域以上時將區域置換成第三區域、或在僅具有兩個區域時將區域置換成之第一區域而進行第二循環之處理,而關於以後之循環,在具有三個區域以上時係以升序來逐步置換區域而最後回到第一區域之方式而實施、或在僅具有兩個區域時係以交互替換第一區域和第二區域之方式而實施之步驟。 A projection exposure method uses a projection exposure device that sets a predetermined pattern of a photomask at a predetermined position on a workpiece and performs projection exposure with light from a light source, thereby forming the predetermined pattern on the workpiece. And has a turntable, which is formed on the top of the part for placing the workpiece in such a manner that a plurality of workpieces do not overlap and can be placed at the same time, and is configured to be able to rotate and temporarily stop at a predetermined time. The projection exposure method includes: (A) a step of loading the workpiece in a first region of the plurality of regions of the turntable; (B) rotating the turntable to cause the first A step of temporarily stopping an area at a first stop position among the predetermined stop positions; (C) a step of detecting the placement position of the workpiece in the first area; (D) rotating the turntable again and A step of temporarily stopping the first region at a second stop position different from the first stop position among the predetermined stop positions; (E) The step of exposing the pattern on the mask to the aforementioned workpiece in the first region; (F) when there is the aforementioned workpiece in the second region that is different from the first region and the first region, the projected exposure is terminated, and the aforementioned ( E) Parallel projection exposure processing, unloading from the second area and ending the projection And (G) replacing the first region of the first cycle of the aforementioned (A) to (F) with the second region, and when there are three or more regions, Replace with the third area, or perform the second cycle with the first area when there are only two areas. For subsequent cycles, when there are more than three areas, the areas are gradually replaced in ascending order. And finally, it is implemented by returning to the first region, or when there are only two regions, it is implemented by alternately replacing the first region and the second region.
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