TW201803159A - Structure and frame material of LED unit and method of manufacturing LED frame - Google Patents

Abstract

A frame material composition of an LED unit includes at least one kind of organic polysiloxane resin, at least one kind of cross-linking agent, and at least one kind of highly reflective powder material. The at least one kind of organic polysiloxane resin constitutes 55-75wt% of the frame material composition. The at least one kind of cross-linking agent constitutes 15-30wt% of the frame material composition. The at least one kind of highly reflective powder material constitutes 1-20wt% of the frame material composition. The frame material is advantageous in high density, resistance to crack, compatibility with package material, good expansion/contraction ratio, excellent junction to a bonding pad, resistance to high temperature and UV radiation, and good performance in a variety of tests such as light-reflection, anti-sulfur, high-heat high-humidity, and cooling/heating impact.

Description

Light-emitting diode element structure, stent material, and preparation method of stent

The invention relates to a scaffold material for a light-emitting diode (LED) component, in particular to an LED scaffold material based on an organopolyoxyalkylene thermosetting resin. The present invention further relates to a method of manufacturing the aforementioned LED holder, and an LED element comprising the foregoing bracket, which has characteristics of high hardness, resistance to vulcanization, high temperature resistance, light ray resistance and the like.

The LED frame is a pedestal for carrying and fixing the LED chip. After the wafer is fixed and the positive and negative electrodes are soldered, the package is formed by encapsulation. 1 shows a schematic diagram of a generally single LED component in which the stent 11 has a peripheral wall structure 111 and the LED wafer 10 is secured to the inside surface 112 of the stent 11 by a die bond through a die attach process. Next, the gold wire or the alloy wire 12 is welded to complete the electrode wire bonding to form a working area of the LED element. The encapsulation process is then carried out with the encapsulant 13 to protect the work area.

In terms of the material of the stent, in recent years, it has changed from PCT (Polycyclohexylenedimethylene terephthalate), PPA (Polyphthalamide) to EMC (Epoxy molding compound). Although the PCT and PPA stents have good adhesion but are not resistant to high temperatures, the recent EMC stents are composed of epoxy resin. Although they have good temperature resistance, they are used in the market for 1.48~1.54 high-density organic polymerization. The decane-based thermosetting resin easily delaminates with the organic polyoxyalkylene thermosetting resin during packaging, causing moisture and sulfur to enter the wafer, thereby affecting light decay. Due to the characteristics of epoxy resin, the bracket is not resistant to high temperature, UV, and brittle, which makes many new LED processes impossible to continue, so only products below 2W can be used.

Therefore, it is necessary to develop high temperature resistance, UV resistance, high power of 2W or more, good adhesion with the encapsulant, better anti-vulcanization effect, and suitable for high-end lighting, automotive lighting and TV backlighting. Scaffolds.

The object of the present invention is to provide an LED scaffold material based on an organopolyoxane thermosetting resin, which has high density, high temperature resistance, UV resistance, no cracking, good compatibility with packaging materials, and good swelling. The shrink ratio, good bonding with the circuit substrate, and excellent performance in high light reflectivity, good resistance to vulcanization, high temperature and high humidity, and thermal shock test.

Another object of the present invention is to provide a method for manufacturing the aforementioned LED bracket, which utilizes a multiple injection system to provide the shortest gel path distance in the transfer molding process, which is not easy to cure and is advantageous for vacuum evacuation. , greatly reduce the generation of stent bubbles, providing the best efficiency.

Another object of the present invention is to provide an LED component including the foregoing bracket, which further enhances the performance of the overall LED component by the cooperation of the encapsulant and the bracket material.

For the purpose of the present invention, there is provided a scaffold material for a light emitting diode (LED) component, characterized by comprising at least one organopolyoxyalkylene resin, at least one crosslinking agent, and at least one highly reflective powder material, wherein at least An organopolyoxyalkylene resin occupies 55-75 wt% of the total composition, the at least one cross-linking agent comprises 15-30 wt% of the total composition, and the at least one highly reflective powder material comprises 1-20 wt% of the whole composition. .

Preferably, the scaffolding material further comprises 0.05 wt% of a catalyst, 1.5-3 wt% of a diluent, and 0.35-2 wt% of a stabilizer.

The at least one organopolyoxane resin may be a single resin composition or a combination of two or more resins.

Preferably, the at least one organopolyoxane resin is a polyorganosiloxane containing a vinyl group.

Preferably, the at least one crosslinking agent comprises a polyfluorene oxide resin containing a hydrogen halide group. The at least one crosslinking agent may additionally include a polyfluorene oxide resin containing a vinyl group.

Preferably, the at least one highly reflective powder material comprises a supporting powder material having a particle diameter of 0.1 um to 15 um, and a mixture of a reflective powder material having a particle diameter of 0.1 um to 15 um. The supporting powder material is selected from the group consisting of barium sulfate (BaSO4), cerium oxide (SiO2), calcium carbonate (CaCO3), boron nitride (BN) and one or a mixture of talc; and the above-mentioned reflective powder material is selected from the group consisting of One or more mixtures of titanium white (TiO2), zinc white (ZnO2), lead white (Pb3(OH)4CO3).

For the purpose of the present invention, a light emitting diode (LED) element structure is provided, comprising: a bracket made of the bracket material according to claim 1 and shaped to have a bottom structure and a peripheral wall structure, The peripheral wall structure surrounds the bottom structure; a wafer is fixed on an inner side surface of the bottom structure of the bracket; and an encapsulant is filled in a space between the peripheral wall structure and the bottom structure of the bracket to protect the above Wafer.

Preferably, the encapsulant comprises at least one organopolyoxane resin, and the at least one organopolyoxane resin is the same material as the at least one organopolyoxane resin contained in the stent.

For the purpose of the present invention, a method for preparing a light-emitting diode (LED) element holder is provided, characterized in that it comprises the steps of separately preparing a first reactant and a second reactant, wherein the first reactant comprises a vinyl functional group. An organopolyoxyalkylene compound, the second reactant comprising an organopolyoxyalkylene compound having a hydrazine hydrogen functional group, having ethylene when the first reactant and the second reactant are different from either or both a functional group and a hydrazine hydrogen functional group and additionally comprising a crosslinking catalyst; mixing the first reactant and the second reactant according to a specific hydrazine group to vinyl equivalent ratio, and setting appropriate reaction conditions to make the first reactant and the first reactant The two reactants are subjected to a crosslinking reaction; the two-liquid type organopolysiloxane resin after the crosslinking reaction is placed in a multiple injection system (MIS), injected into a rubber passage of the transfer cylinder, and then the multi-head injection molding system is Mold clamping; and using the transfer rod to turn from bottom to top, the two-liquid organic polyoxymethane resin composition is sent into the mold rubber channel, and enters the mold of the multi-head injection molding system along the rubber channel. The two-liquid type organopolysiloxane resin is solidified by a certain mold clamping pressure and temperature.

Preferably, the two-liquid organopolyoxane resin after the crosslinking reaction is subjected to centrifugal vacuum defoaming before being placed in a multiple injection system (MIS).

Preferably, the viscosity of the first reactant is controlled between 4500 and 5500 pa.s, and the viscosity of the second reactant is controlled between 1500 and 2500 pa.s, and the viscosity of the two-liquid organic polyoxyalkylene resin mixture is controlled. Between 2500 and 3500 pa.s.

Since the stent material, the manufacturing method, and the LED component disclosed in the present invention can improve the conventional disadvantages of using EMC materials and fabrication, it can be applied to products with high current, high power, and large size illumination.

The present application will be further described in detail below in conjunction with the embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention, rather than the invention.

It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.

In one embodiment, the LED scaffold material according to the present invention is formed from a composition based on an organopolyoxane thermosetting resin, the composition of the composition mainly comprising at least one organopolyoxane resin, at least one a binder, and at least one highly reflective powder material. The at least one organopolyoxane resin comprises from about 55 to 75 wt% of the total composition, the at least one crosslinker comprises from about 15 to 30 wt% of the total composition, and the at least one highly reflective powder material comprises the entire composition. About 1-20% by weight. Additionally, about 0.05 wt% catalyst, about 1.5-3 wt% diluent, about 0.35-2 wt% stabilizer, and other additives may be added as a practical requirement for different embodiments.

The above organic polyoxyalkylene resin may be a single resin composition, and may be a combination of two or more resins depending on characteristics, cost, and process requirements. According to the present invention, the above-mentioned organic polyoxyalkylene resin is cured by crosslinking reaction with a crosslinking agent at a specific range of temperature, for example, 60 ° C or higher, and the curing time is shortened as the temperature is increased. The above crosslinking reaction is preferably carried out in the presence of a catalyst. The type of crosslinking agent and catalyst may vary depending on the type of resin. The following examples are given.

Synthesis Example 1: Polyorganosiloxane Oxide A

A four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer was charged with 50.2 g of 1,3-divinyl-1,1,3,3-tetramethyldioxane, 114 g of water, 14 g of citric acid, 52.6 g of ethanol and 500 g of toluene. The components were mixed and stirred, and 500.7 g of phenyltrimethoxydecane was added dropwise over 1 hour. After the addition was completed, the product was refluxed under heating for 1 hour. After cooling, the lower layer was separated, and the toluene solution layer was washed 3 to 12 times with water. Next, 0. 40 g of potassium hydroxide was added to the washed toluene solution layer, and the solution was refluxed, and water was removed through a water separator. After the water separation was completed, the product was concentrated until the solid concentration reached 41% by weight, and refluxed for 5 hours. After cooling, 0.5 g of acetic acid was added to neutralize the product, and the resulting filtered toluene solution was washed 3 to 12 times with water. After concentrating the product under reduced pressure, 243 g of a polyorganomethoxy oxirane resin product (polyorganomethoxy decane resin A) containing a vinyl group was obtained, and the weight average of the obtained product with respect to polystyrene recalibration was measured by gel permeation chromatography. The molecular weight was 2,300, and the total acid value determined according to JIS K2501 (1992) was equal to 0.001 mg/g.

Synthesis Example 2: Polyorganosiloxane oxide resin B

A four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer was charged with 225.5 g of phenyltrimethoxydecane and 14 g of citric acid. The components were mixed and stirred, and 13.3 g of water and 52.6 g of ethanol were added dropwise over 15 minutes. After the addition was completed, the product was refluxed under heating for 1 hour. After cooling to room temperature, 50.2 g of 1,1,3,3-tetramethyldioxane was added, and while the mixture was stirred, and heated to 50 ° C, the reaction was carried out for 3 hours. After cooling to room temperature, the mixture was mixed with toluene and water, and the aqueous layer was allowed to stand and separate. After washing the toluene solution layer with water for 3 to 12 times, the product was concentrated under reduced pressure to obtain 55 g of a polyorganomethoxy oxirane resin product (polyorganomethoxysiloxane resin B) containing a vinyl group, and the obtained product was determined by gel permeation chromatography. 01重量/克。 The weight average molecular weight of the re-corrected polystyrene, the value of 2300, and the total acid value measured according to JIS K2501 (1992) is equal to 0. 01mg / g.

Synthesis Example 3: Crosslinker A

A four-necked flask equipped with a stirrer, a reflux condenser, an inlet and a thermometer was charged with 171.4 g of phenyltrimethoxydecane and 4.7 g of citric acid. The components were mixed and stirred, and 403 g of water and 59.4 g of ethanol were added dropwise over 15 minutes. After the addition was completed, the product was refluxed under heating for 1 hour. After cooling to room temperature, 193.4 g of 1,1,3,3-tetramethyldioxane was added while stirring the mixture, and heating to 50 ° C, and the reaction was carried out for 3 hours. After cooling to room temperature, the mixture was mixed with toluene and water, and the aqueous layer was allowed to stand and separate. After washing the toluene solution layer with water for 3 to 12 times, the product was distilled under reduced pressure, and a distillate of 130 ° C to 170 ° C was collected to obtain 92 g of triphenylhydrogenpolyoxyalkylene (crosslinking agent A) containing a hydrogen group. The viscosity of the obtained product was 8 mPa·s.

Synthesis Example 4: Crosslinker B

A four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer was charged with 480 g of diphenyldimethoxydecane and 14.2 g of citric acid. The components were mixed and stirred, and 290 g of 1,1,3,3-tetramethyldioxane was added while stirring the components, and 120 g of water and 18 g of ethanol were added dropwise over 30 minutes while stirring. The mixture was heated to 50 ° C and reacted for 3 hours. After cooling to room temperature, the mixture was mixed with toluene and water, and the aqueous layer was allowed to stand and separate. After washing the toluene solution layer with water for 3 to 12 times, the product was distilled under reduced pressure, and a distillate of 130 ° C to 170 ° C was collected to obtain 554 g of diphenylhydrogenpolyoxyalkylene containing a hydrazine group (crosslinking agent B). . The viscosity of the obtained product was 20 mPa.s.

Synthesis Example 5: Crosslinker C

A four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer was filled with 123.2 g of 1,3-divinyl-1,1,3,3-tetramethyldioxane and 8.6 g. Tannic acid. The components were mixed and stirred, and 420 g of water and 55.6 g of ethanol were added dropwise over 15 minutes. After the addition was completed, the product was refluxed under heating for 1 hour. 78.8 g of phenyltrimethoxydecane was added dropwise over 3 hours while the mixture was stirred and heated to 50 ° C for 4 hours. After cooling to room temperature, the mixture was mixed with toluene and water, and the aqueous layer was allowed to stand and separate. After washing the toluene solution layer with water for 3 to 12 times, the product was distilled under reduced pressure, and a distillate of 150 ° C to 190 ° C was collected to obtain 92 g of trivinylphenyl polyoxyalkylene (crosslinking agent C) containing a vinyl group. The viscosity of the obtained product was 8 mPa·s.

[stabilizer]

Cyclotetramethyltetravinyltetraoxane

[Platinum catalyst]

Chromium complex of 1,3-divinyl-1,1,3,3-tetramethyldioxane with platinum (metal platinum content 0.4 wt%)

[Thipe A]

Diphenyl bis(dimethylvinylformyloxy)decane

[additive]

Blocking with a stanol group gives the product of a condensation reaction between a copolymer of glycidoxypropyltrimethoxydecane and methylvinyloxane and dimethyloxane with a viscosity of 75 mPa.s.

[Highly reflective powder material]

The highly reflective powder material used in the present invention has a function similar to that of the aggregate material, and can improve the hardness and shielding property after the gel body is molded. Such powder materials may be inorganic solid materials such as barium sulfate (BaSO4), cerium oxide (SiO2), calcium carbonate (CaCO3), boron nitride (BN), talc, etc.; the particle size of such materials should be controlled at 10 um. In the following, it is preferably 5 um or less; and in order to avoid the floc phenomenon caused by the excessive van der Waals force, the material should be a true round shape, and it is preferable to use a special material for coating. Another main function of the powder material is to impart a certain light reflectivity to the present invention. Such materials include reflective materials such as titanium white (TiO2), zinc white (ZnO2), and lead white (Pb3(OH)4CO3). Among them, titanium dioxide (TiO2) is classified into an anatase type and a rutile type, and a rutile type is particularly preferable. In order to achieve the effect of uniform distribution and filling, the particle size of the powder should be 10 um or less, preferably 5 um or less. In other words, the highly reflective powder material used in the present invention may comprise a mixture of these two types of powder materials.

The above components are mixed according to the parts by weight listed in Table 1, to prepare application examples of various scaffold materials, wherein two kinds of cross-linking agents are used in each of application examples 1-5, and two kinds of poly-polymers are used in application example 3. An organic rhodium oxide resin to increase the activity of ethylene.

The test results of the properties associated with each application example as an LED holder use are listed in Table 2 below.

In Application Example 3 of the above table, the polyorganosiloxane oxide resin A obtained in Synthesis Example 1 was added to the polyorganosiloxane oxide resin B obtained in Synthesis Example 2, and the components were uniformly mixed to form Viscous liquid.

In the test conducted in the above Table 2, the composition was cured at 150 ° C for 4 hours under a pressure of 10 MPa. The hardness of the obtained cured body was measured. Further, in order to evaluate the adhesion of the obtained composition to a silver plated steel sheet, a PPA (polyphthalamide) resin sheet, and a BT resin (bismaleimide-triazine resin) sheet, the composition was The molded product was subjected to a wafer shear test and the surface of the molded product was observed. From the results of Table 2, it is understood that the performance of the stent composition of the present invention meets the requirements.

The inventors of the present invention simultaneously devised a method of manufacturing a stent having the above-described excellent characteristics in a highly efficient manner. To this end, the method of the present invention employs a multi-head injection molding system to transfer the molding process. On the other hand, in order to cooperate with the multi-head injection molding system transfer molding process, the composition of the invention has the characteristics of low viscosity in the process and high hardness after forming, low viscosity makes the product easy to flow, and high hardness can ensure the firmness of the product.

The LED bracket manufacturing method according to the present invention is as shown in the flow chart of FIG. 2, and includes the following steps:

Step S101: preparing a first reactant and a second reactant, respectively, wherein the first reactant comprises an organic polyoxyalkylene compound having an ethylene functional group, and the second reactant comprises an organic polyoxygen having a hydrogen functional group. The alkane compound, having either or both of the first reactant and the second reactant, has an ethylene functional group and a hydrazine hydrogen functional group and additionally comprises a crosslinking catalyst. Of course, if the first reactant and the second reactant have different ethylene functional groups and hydrazine hydrogen functional groups, the same or different catalysts may be provided in both the first reactant and the second reactant. In addition, the viscosity of the first reactant and the second reactant may be controlled between 100 and 8000 pa.s. Preferably, the viscosity of the first reactant is controlled between 4500 and 5500 pa.s, and the second The viscosity of the reactants is controlled between 1500 and 2500 pa.s.

Step S102: mixing the first reactant and the second reactant according to a specific hydrogen group-to-vinyl equivalent ratio, and setting appropriate reaction conditions to crosslink the first reactant and the second reactant to obtain a two-liquid type. The viscosity of the organic polyoxyalkylene resin mixture is between 100 and 8000 pa.s, preferably between 2,500 and 3,500 pa.s.

Step S103: The mixed two-component organopolyoxane resin composition is placed in a centrifugal vacuum defoaming machine for 3 to 5 minutes.

Step S104: The defoamed two-liquid organopolyoxane resin is placed in a multiple injection system (MIS), and the system is filled into the propulsion chamber of the injection molding machine to clamp the mold. The use of multi-head injection molding has the advantages of balanced flow path, close-in filling, high resin utilization, stable manufacturing process and good finished product quality. The MIS system adopts a multi-barrel injection molding design from bottom to top, and the injection molding is performed by pushing the injection head driving plate by a high temperature and leakproof hydraulic cylinder installed in the mold. The transfer system adopts the X-Y direction U-shaped slider and the self-lubricating guide post guide to double guide to ensure the smooth operation of the system. In one embodiment, the two-liquid organopolyoxane resin composition can be injected into the transfer barrel through a syringe. At this time, the syringe can be used for manual injection, and the syringe with the driver can be used to automatically inject the glue with a certain voltage regulation, the operation is convenient, the construction is safe, and the syringe is easy to clean, and can be repeatedly used. Reduce the waste of costs. Further, the upper and lower dies of the MIS mold were closed by a hydraulic press and evacuated. Vacuuming the cavity of the mold can reduce the bubbles deposited during the process, improve the reliability of the package, and reduce the occurrence of package failure. Of course, it is also possible to drive the upper and lower mold clamping operations of the MIS mold using a cylinder or other driving device.

Step S105: using the transfer rod to push the resin in the propulsion chamber from bottom to top into the mold rubber passage, and perform preliminary cross-linking reaction molding on the two-liquid type organic polydecane resin with a certain mold clamping pressure and temperature. Since the transfer rod of the MIS mold can be turned from bottom to top, the two-liquid type organic polyoxymethane resin composition can be squeezed into the rubber channel from bottom to top, so that the MIS mold can be filled smoothly and efficiently, and the liquid is to be filled. The stent can be completed after the organic polypyroxy resin composition is cured and molded. In addition, the turning rod is driven from the bottom up by the cylinder drive of the MIS mold, so that the turning rod is driven by the MIS mold's own cylinder to facilitate the control of the turning speed of the turning rod, so that the organic polyoxygen The alkane resin composition is more smoothly squeezed into the mold colloid, thereby allowing the organopolyoxane resin composition to smoothly enter the cavity of the MIS mold, thereby improving the uniformity of the mixture and thereby improving the quality of the LED package. In addition, the aforementioned advancement lever can also be driven to move from bottom to top by a cylinder or other driving means. The clamping pressure in this step can be about 10 MPa and the temperature is about 120 to 180 °C. At this time, the organopolysiloxane resin composition in the MIS mold is cured at a pressure of 10 MPa and a temperature of 120 to 180 ° C to ensure good molding quality. The above clamping pressure can be slightly fluctuated, and the clamping temperature can be maintained in the range of 120 to 180 °C. Of course, in this embodiment, the mold clamping pressure, temperature, and curing time of the MIS mold are not specifically limited, as long as the solidification molding of the organic polyoxyalkylene resin composition can be completed.

According to the composition formula of the present invention, especially, but not limited to, the LED bracket prepared by the method of the invention has superior high and low temperature performance, and the temperature range thereof is -60 ° C to 260 ° C, and aging resistance is not easy to yellow, light decay The small, two-liquid organic polyoxyalkylene resin composition is an elastomer after curing, has low hardness, and has substantially no internal stress, so the LED bracket can improve the reliability of the LED and improve the LED. Service life.

The invention further provides an LED component structure similar to that shown in FIG. 1 , comprising a bracket, an LED chip, an electrode bonding wire, and an encapsulant fixed to the bottom surface of the inner side of the bracket by using an organic glue or a solder through a die bonding process. The structure of the LED element of the present invention is different from the structure of the LED element shown in FIG. 1 in that the above-mentioned encapsulant of the present invention and the above-mentioned stent comprise the same organic polyoxyalkylene thermosetting resin cross-linked product, so that the expansion-contraction ratio is uniform and can be tightly combined. The delamination is not formed, and the wafer having the best protection effect can be obtained. In addition, the highly reflective powder material contained in the stent of the present invention can improve the reflection and strength, so that the performance of the obtained LED element is more excellent. The following is an example of the test results of the LED material used in the application example 2 and the LED element characteristics of the same organic polyoxyalkylene thermosetting resin crosslinked product as in Application Example 2, including Reflow light decay test, sulfurization resistance test, high temperature high Wet test and TS hot and cold test, and compared with the prior art, wherein SMC represents the technology of the present invention using an organopolyoxane thermosetting resin, and EMC represents the existing technology using epoxy resin.

[Reflux light decay test]

The 3030SMC and 3030EMC were subjected to a 260 ° C reflow fading test to test the degree of brightness decay before and after reflow. The results are shown in Table 3. It is thus known that the brightness of the 3030SMC is reduced by -0.23% after two reflows; the brightness of the 3030 EMC after two reflows is -1.49%.

[Anti-vulcanization test]

In this experiment, Sanan 2630 wafer and 8855 anti-vulcanization special silicone rubber were used, and then the anti-vulcanization test was carried out, and the degree of light decay after the experiment was detected. The steps to resist the vulcanization test are as follows:

Step 1: Place 1 g of sulfur powder on the bottom of the 750 ml sealed box and gently shake them to spread the sulfur powder evenly at the bottom of the box.

Step 2: The sample is suspended in a sealed box and sealed with a wrap film.

Step 3: Store in an oven at 75 ° C, and stand for 8 hours to confirm the appearance and electrical properties.

Judging criteria: The appearance of the microscope confirmed whether there was blackening of the silver surface inside the particles, and the difference between the light intensity before and after the electrical static test was <-20%.

Because EMC is composed of epoxy resin, its characteristics are different from that of encapsulant, it can not be tightly combined, and it is easy to form delamination, which leads to perfect protection in vulcanization test. From this experiment, the brightness of EMC3030 is reduced by -42.17%. In contrast, SMC is composed of silicone rubber, which has the same characteristics as the encapsulant, and has the same expansion and contraction ratio. It has perfect welding with the encapsulant to provide effective protection. In the vulcanization test, the brightness of SMC3030 is only reduced by -7.3%.

[High temperature and high humidity test]

This experiment is carried out for different temperature and humidity light decay tests for 3030EMC and 3030SMC. From the figure below, it can be found that under the same current condition, 3030 EMC has a great decline in light decay in high temperature and high humidity environment; and 3030SMC has good heat resistance in high temperature and high humidity environment due to its characteristics, and the degree of light decay is very high. small.

[TS hot and cold test]

This implementation performs 300 rounds of -40 ° C ~ 100 ° CTS hot and cold test for 3030 EMC and 3030 SMC, and performs red ink test on the particles after the hot and cold test. The 3030 EMC and the encapsulant cannot be closely combined, and the layer is easily formed with the encapsulant, which causes red ink to penetrate. The 3030SMC is tightly integrated with the encapsulant, which can effectively protect the working area, so the red ink cannot penetrate.

The invention is mainly composed of a high-density organic fluorine-based thermosetting resin with good sulfur resistance and a powder filler with high light-reflecting properties, and is a special organic material which can be applied to the peripheral wall structure of the light-emitting device. This material is mainly for the shortcomings of the characteristics of traditional EMC brackets. For example, epoxy resin is the main material, which causes easy decay under high temperature and UV light, high TG point and easy cracking, incompatibility with packaging materials, and poor bonding. , the middle is easy to produce stratification, can not resist the vulcanization and high temperature and high humidity, leading to serious light failure under long-term lighting ... and other issues to improve. Therefore, it has high temperature resistance, UV resistance, no cracking, good compatibility with packaging materials, good expansion and contraction ratio, good bonding with circuit substrates, high light reflectivity, good resistance to vulcanization, high temperature and high humidity. There is perfect performance in the thermal shock test. In an embodiment of the present material, the colloid material exhibits a uniform white non-transparent body after being thermally cured, and the hardness is greater than Shore D65; and the reflectivity of the light source having a wavelength of 400 nm to 750 nm is more than 80%; The light-emitting device made of the material can be effectively prevented from being discolored by vulcanization after being packaged with a suitable packaging material.

While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the appended claims.

10‧‧‧LED chip
11‧‧‧ bracket
111‧‧‧ Peripheral wall structure
112‧‧‧ bracket inner surface
12‧‧‧ Gold wire or alloy wire
13‧‧‧Package
14‧‧‧Silver glue

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only Some of the embodiments of the invention may be obtained by those of ordinary skill in the art in view of the drawings without departing from the scope of the invention. 1 is a schematic longitudinal cross-sectional view of a conventional LED element. 2 is a flow chart of a method of fabricating an LED bracket in accordance with an embodiment of the present invention.

Claims (14)

A scaffolding material for a light emitting diode (LED) component, characterized by comprising at least one organopolyoxyalkylene resin, at least one crosslinking agent, and at least one highly reflective powder material, wherein the at least one organopolyoxyalkylene resin Between 55 and 75 wt% of the total composition, the at least one cross-linking agent comprises from 15 to 30% by weight of the total composition, and the at least one highly reflective powder material comprises from 1 to 20% by weight of the total composition. The stent material of claim 1 further comprising 0.05 wt% catalyst, 1.5-3 wt% diluent, and 0.35-2 wt% stabilizer. The stent material according to claim 1, wherein said at least one organopolyoxane resin is a single resin composition. The stent material according to claim 1, wherein said at least one organopolyoxane resin is a combination of two or more resins. The stent material according to claim 1, wherein said at least one organopolyoxane resin comprises a polyorganosiloxane containing a vinyl group. The stent material of claim 1 wherein said at least one crosslinking agent comprises a polyfluorene oxide resin comprising a hydrazine group. The stent material of claim 6 wherein said at least one crosslinking agent additionally comprises a polyoxymethane resin comprising a vinyl group. The stent material according to claim 1, wherein said at least one highly reflective powder material comprises a supporting powder material having a particle diameter of 0.1 um to 15 um, and a reflective powder material having a particle diameter of 0.1 um to 15 um. mixture. The stent material according to claim 8, wherein said supporting powder material is selected from the group consisting of barium sulfate (BaSO4), cerium oxide (SiO2), calcium carbonate (CaCO3), boron nitride (BN) and talc. Or a mixture; and the above reflective powder material is selected from one or a mixture of titanium white (TiO2), zinc white (ZnO2), and lead white (Pb3(OH)4CO3). A light emitting diode (LED) element structure comprising: a bracket made of the bracket material of claim 1 and shaped to have a bottom structure and a peripheral wall structure, wherein the peripheral wall structure is surrounded by The bottom structure; a wafer fixed to the inner side surface of the bottom structure; and a potting compound filling a space between the peripheral wall structure and the bottom structure of the bracket to protect the wafer. The device structure according to claim 10, wherein said encapsulant comprises at least one organopolyoxane resin, and wherein said at least one organopolyoxane resin and said at least one organopolyoxyalkylene resin contained in said scaffold are One or more of the same functional groups. A method of preparing a light-emitting diode (LED) element holder, characterized by comprising the steps of: preparing a first reactant and a second reactant, respectively, wherein the first reactant comprises an organic polyoxyalkylene compound having an ethylene functional group The second reactant comprises an organopolyoxyalkylene compound having a hydrazine hydrogen functional group, and the first reactant and the second reactant have either an ethylene functional group and a hydrazine hydrogen functional group when they are different from either or both of the second reactants. And additionally comprising a crosslinking catalyst; mixing the first reactant and the second reactant according to a specific rhodium hydrogen group to vinyl equivalent ratio, and setting appropriate reaction conditions to mix the first reactant with the second reactant; The uniformly mixed two-component organopolyoxane resin is placed in a multiple injection system (MIS), and the resin is filled into the injection chamber by the system, and the mold is closed, and then the product is transferred. The rod pushes the resin in the propelling chamber from bottom to top into the mold rubber channel, and performs preliminary cross-linking reaction of the two-liquid type organic polydecane resin with a certain mold clamping pressure and temperature. type. The method according to claim 12, wherein the uniformly mixed two-component organopolyoxane resin is subjected to centrifugal vacuum defoaming before being placed in a multiple injection system (MIS). The method according to claim 12, wherein the viscosity of the first reactant is controlled between 4500 and 5500 pa.s, and the viscosity of the second reactant is controlled between 1500 and 2500 pa.s. The viscosity of the oxyalkylene resin mixture is controlled between 2,500 and 3,500 pa.s.