TW201802481A - Flexible assembly IC handler and flexible assembly IC test system - Google Patents

Abstract

The present invention relates to a flexible assembly IC handler and flexible assembly IC test system. In accordance with various requirements, a IC handler, in which exchanging of IC package conversion and treatment of IC can be automatically performed, is assemblied by freely choosing various load unit, treatment unit, and unload unit from the flexible assembly IC handler. In accordance with various requirements, a IC test system, in which exchanging of IC package conversion, treatment of IC, and test of IC can be automatically performed, is assemblied by freely choosing various load unit, treatment unit, and unload unit from the flexible assembly IC test system.

Description

Elastic combination semiconductor component processing device and semiconductor component classification test system

The present invention relates to a flexible combination of a semiconductor component processing apparatus and a semiconductor component classification test system, and more particularly to a semiconductor component processing apparatus and semiconductor component classification test which can quickly change its composition in response to the requirements of various semiconductor component processing and testing requirements. system.

With the diversification and versatility of semiconductor components (such as ICs, MEMS, etc.), the processing required for semiconductor components (such as heating, flipping, visual inspection, conversion, positioning, classification, laser labeling, label inspection, etc.) ) and testing (electrical testing, radio frequency testing, linear reciprocating testing, flip testing, rotating testing, and aging testing, etc.) have also become diversified. Generally, after the semiconductor fabrication is completed, different processing procedures (such as heating, flipping, visual inspection, conversion, positioning, etc.) are required for different types or specifications of semiconductor components before or after testing the semiconductor components. However, most of the semiconductor component processing devices have only a single processing function, so in order to be able to cope with all the processing procedures, the tester must purchase a processing device of various functions, and these processing devices are not cheap, so that the processing is performed. Cost and test costs are greatly increased, and since not every process is often implemented, many processing devices are used less frequently and waste. Secondly, sometimes it is necessary to carry out a plurality of different processing procedures. At this time, it is often necessary to transport the semiconductor components to a processing device for processing, and after the processing is completed, concentrate them and manually or mechanically The semiconductor component is sent to another processing device for another processing procedure, and all processing procedures cannot be completed in the same processing device, so that time-consuming and low processing efficiency and testing efficiency are reduced, thereby increasing the semiconductor component in the test factory. Time, and the goal of fast delivery cannot be achieved.

An object of the present invention is to provide a flexible combination of semiconductor component processing apparatus that can be flexibly and quickly assembled and modified in accordance with a required processing flow, and that the required in-and-out mode and processing flow can be unified thereon. There is no need to purchase a variety of different conversion devices to meet the various processing procedures required by the customer, thereby reducing the cost of processing devices that require the purchase of various functions and the waste caused by the low frequency of use of certain processing devices. Save the cost and time of conversion and processing, and shorten the time of semiconductor components in the test plant to achieve fast shipping.

Another object of the present invention is to provide a flexible combined semiconductor component classification test system that can freely select a desired input/output mode, a semiconductor component processing mode (or process), and a test mode in accordance with a required processing flow. Flexible and quick assembly and change, and the required input and output modes, semiconductor component processing flow, and testing are unified on the implementation, without the need to manually or mechanically transport semiconductor components to other machines to implement these in and out Material mode, semiconductor component processing mode (or process), and test mode, thereby saving test cost and time, and shortening the time of semiconductor components in the test factory to achieve fast shipping.

According to an aspect of the present invention, there is provided an elastic component semiconductor device processing apparatus. The flexible combination semiconductor component processing apparatus includes a feed module for inputting a semiconductor component, a discharge module for outputting the semiconductor component, and a processing module for processing the semiconductor component. The feeding module comprises several different types of feeding units, the discharging module comprises several different kinds of discharging units, the processing module comprises several processing units, and each processing unit is an independent and separate individual. Each processing unit has two processing unit connection positioning mechanisms, and the two processing unit connection positioning mechanisms are respectively combined with the discharge unit connection positioning mechanism of one discharge unit and the feeding unit connection positioning mechanism of a feeding unit. In order to combine into a semiconductor component processing apparatus, it is possible to freely select different processing units to be overlapped with different feeding units and different discharging units to be combined into semiconductor component processing apparatuses having different functions.

According to another object of the present invention, the present invention provides an elastic combination semiconductor component classification test system. The flexible combination semiconductor component classification test system includes a feed module for inputting a semiconductor component, a test module for testing the semiconductor component, and a discharge module for outputting the semiconductor component. The feed module comprises a plurality of different types of feed units, each of which is an independent and separate individual, and each of the feed units has a feed unit connection positioning mechanism. The test module includes several different types of test units, each of which is an independent and separate individual, and each test unit has at least two test unit joint positioning mechanisms. The discharge module comprises several different types of discharge units, each of which is an independent and separate individual, and each discharge unit has a discharge unit connection positioning mechanism. Each test unit can be connected to the feeding unit of the feeding unit and the discharging unit of the discharging unit by the two testing unit connecting and positioning mechanisms, and the testing unit is disposed on the feeding unit. Between the discharge units, the combination can be quickly combined to implement the required input and output modes and tests on the semiconductor component classification test system unified on the implementation, so that the test factory can freely select different feed units and different The test unit and the different discharge units are lapped and combined into different semiconductor component classification test systems to meet the needs and requirements of the customer.

As shown in the first figure, a schematic diagram of a semiconductor component processing apparatus 1 according to an embodiment of the present invention, wherein the semiconductor component processing apparatus includes a feed module 10, a discharge module 20, and a processing module 30. In the present embodiment, the feeding module 10 comprises a Bowl feeder loader, a Tray loader, a Tube loader, and a Tray loader. ), at least two feeding units of a group consisting of a tape-on-reel loader and a wafer frame feed unit (Wafer frame loader), and a discharge module 20 comprises a boxing unloader, a tray unloader, a tube unloader, a tape-and-reel unloader, and the like. At least two discharge units in the group. Each processing unit 32-32E in the processing module 30 is an independent and separate entity, and each processing unit 32-32E has a transport unit 34~34E for transmitting semiconductor components and two processing unit joint positioning. Mechanisms 31 and 33~31E and 33E. The two processing unit connection positioning mechanisms 31 and 33~31E and 33E are all a snap positioning mechanism, and are respectively disposed on both sides of each processing unit 32~32E. Each of the processing units 32-32E can be coupled to the positioning mechanism 31 and 33~31E and 33E by the two processing units, respectively, and any one of the feeding units 12~12E and the discharging module 20 of the feeding module 10. The discharging units 22 to 22E are snap-fitted, and the processing units 32 to 32E are disposed between the feeding units 12 to 12E and the discharging units 22 to 22E. Furthermore, each of the semiconductor component transfer units 14 to 14E in the feed module 10 includes a transfer unit 16-16E for transporting the carrier and a device for taking out and placing the semiconductor component from the original package. Pickup units 18~18E on the carrier. In this embodiment, each of the semiconductor component transport units 14-14E has only one load shifting unit 16~16E, but it is not limited thereto, but may be increased according to requirements, whereby the user can follow The type (or mode) of the semiconductor component package provided by the customer, the required processing mode (or process), and the type (or mode) of the semiconductor component package required by the customer, freely from the feed module 10 and the discharge The loading unit 12~12E and the discharging unit 22~22E which are selected according to the type (or mode) of the semiconductor component package provided by the customer are selected from the module 20, and are freely selected by the processing module 30 to meet the required processing mode (or The processing units 32 to 32E of the process are quickly assembled into various semiconductor device processing devices by snapping, that is, semiconductor device processing devices having different package switching functions and processing functions.

In these processing units 32 to 32E, if the carrier can be directly used as a semiconductor component carrier for performing a processing flow, such as a heating, visual inspection, etc., the processing unit of the processing unit (for example, the processing unit 32 to 32D) Units 34 to 34D) can directly carry a carrier loaded with semiconductor components for processing by directly carrying a carrier unit carrying the carrier, without the need for semiconductor pick-up and placement. In these conductor element processing units 32 to 32E, if the carrier is not directly used as the semiconductor component carrier (for example, the processing unit 32E), the transport unit (for example, the transport unit 34E of the processing unit 32E) A picking unit (for example, a picking unit 38E) including at least one carrying unit for transporting the carrier (for example, the loading unit 36E) and a semiconductor element for being taken out from the carrier and disposed on the processing unit for processing, Thereby, the pick-and-place of the semiconductor element and the transport of the carrier are performed.

After the required semiconductor component processing apparatus is assembled, the feeding units 12 to 12E will package the semiconductor components from the original packaging (for example, bulk, tray) by the pickup units 18 to 18E and the carrier units 16 to 16E. Take out in a package, tube package, tape-on-reel package, or wafer frame package and place it in the carrier, and place the carrier through the feeding unit 12~12E The transfer units 16-16E are transported to the transport units 34-34E (or the load transfer unit 36E) of the processing units 32-32E. Thereafter, the direct transport trays are transported by the transport units 34-34E (or the load transfer unit 36E). The semiconductor element on the carrier is directly processed in the processing area or in the vicinity of the processing area, or the semiconductor component on the carrier is first taken out by the pickup unit 38E and placed in the processing area for processing. After the processing is completed, the carrier is directly transported to the loading units 26 to 26E in the discharging units 22 to 22E by the conveying units 34 to 34D, or the semiconductor elements in the processing area are first taken out and placed by the picking unit 38E. On the carrier, the carrier is transported to and from the transport unit 34E (or the transport unit 36E). The transfer units 26 to 26E in the material units 22 to 22E. Then, the carrier units 26 to 26E and the pickup units 28 to 28E of the discharge units 22 to 22E move the carrier and take out the semiconductor components from the carrier. The semiconductor component processing package and the package conversion are completed in the semiconductor component package required by the customer. The following second to second G diagrams show the elastic component combination semiconductor component processing apparatus 1 shown in the first figure. Various embodiments of the semiconductor device processing apparatus that can be combined, but not limited thereto, may arbitrarily change the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the processing unit, and The type and quantity of the discharge unit.

Referring to FIG. 2A, the semiconductor element processing apparatus 1A is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32A (ie, a flipping unit), and a discharging unit in the semiconductor component processing apparatus 1 that is elastically combined. 22C (ie, the tray discharge unit) is a combination of a single feed unit, a processing unit, and a discharge unit. By connecting the two processing units to the positioning mechanisms 31A and 33A, respectively, the feeding unit of the feeding unit 12 (ie, the vibrating tray feeding unit) is coupled to the positioning mechanism 11 and the discharging unit 22C (ie, the tray discharging unit). The material unit joint positioning mechanism 21C is snap-fitted, and can be assembled into a desired semiconductor component processing apparatus 1A in a short time to complete the flipping process of the semiconductor component and the package conversion (that is, the semiconductor component is converted from bulk to carrier The semiconductor element processing apparatus 1A of the disk package). Please refer to FIG. 2B, which is a feeding unit 12 (ie, a vibrating tray feeding unit), a processing unit 32D (ie, a positioning unit), and a discharging unit 22D in the semiconductor component processing apparatus 2 of the elastic combination. A schematic view of a semiconductor element processing apparatus 1B assembled by a tape take-up unit, which adopts a design combination similar to that of the semiconductor element processing apparatus 2A. The feeding unit 12 (ie, the vibrating tray feeding unit), the processing unit 32D (ie, the positioning unit), and the discharging unit 22D (ie, the take-up and discharge unit) in the semiconductor component processing apparatus 1B respectively have one for carrying no load. The second loading units 17, 37D and 27D of the disc are used to recover the empty tray and reuse it.

Furthermore, considering that the difference between the feed rate of the feed unit, the processing speed of the processing unit, and the discharge speed of the discharge unit may not be continuously processed by the semiconductor processing apparatus, there may be an idling. It is possible that the semiconductor component processing apparatus of the present invention can also adopt a design in which a plurality of charging units, a single processing unit, and a single discharging unit are assembled, a plurality of discharging units, a single processing unit, and a single feeding unit. Design, multiple processing units, single feed unit, and single discharge unit assembly design, multiple processing units, multiple feed units, and single discharge unit assembly design, multiple processing units, single feed unit And the design of multiple discharge unit assembly, or the design of multiple processing units, multiple feeding units, and multiple discharge units. The semiconductor element processing apparatus 1C shown in FIG. 2C is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a discharge unit in the semiconductor component processing apparatus 1 that is elastically combined. The design of a plurality of feed units, a single processing unit, and a single discharge unit assembled by the material unit 22C (ie, the tray discharge unit). The two feeding units 12 (ie, the vibrating tray feeding unit) are alternately rotated to the conveying unit 34B of the processing unit 32B (ie, the visual inspection unit) to avoid the speed of one or some units being relatively fast. Waiting or stagnating. Although in the present embodiment, the two feeding units 12 are vibrating tray feeding units and are connected in parallel with each other, they can be connected in series according to the requirements and space constraints, increasing the number of feeding units, and according to the semiconductors entering the factory. The type of packaging that the component takes, and two or more feeding units with different feeding modes.

The semiconductor element processing apparatus 1D shown in FIG. 2D is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a discharge unit in the semiconductor component processing apparatus 1 that is elastically combined. The unit 22C (ie, the tray discharge unit) combines a plurality of discharge units, a single processing unit, and a design assembled with a single feed unit. By means of the transport unit 34B of the processing unit 32B (ie, the visual inspection unit), the carrier and the semiconductor elements thereon are alternately alternately transported to the two discharge units 22C (ie, the trays are discharged in an alternate manner). The material unit) on each of the load-carrying units 26A avoids waiting or stagnation caused by the difference in speed between the units. Although in the present embodiment, the two discharge units 22C are all the tray discharge units and are connected in parallel with each other, the number of the discharge units can be increased in series according to the requirements and space constraints, and at the same time, A discharge unit with two or more different discharge modes.

The semiconductor element processing apparatus 1E shown in FIG. E is a feeding unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a processing unit in the semiconductor component processing apparatus 2 that is elastically combined. 32C (conversion unit), and a design of a plurality of processing units, a single feeding unit, and a single discharging unit assembled by the discharging unit 22C (ie, the tray discharging unit). With this design, multiple processes can be performed on the same device and package conversion can be completed. Of course, considering the difference in speed between the various units, it is also possible to adopt a design such as a plurality of feeding units, for example, the feeding unit 12 in the semiconductor component processing apparatus 1 of the elastic combination is selected as shown in the second F diagram (ie, the vibration input a semiconductor unit processing apparatus 1F in which a processing unit 32B (ie, an appearance inspection unit), a processing unit 32C (conversion unit), and a discharge unit 22C (ie, a tray discharge unit) are combined, or a plurality of The design of the material unit, for example, the feeding unit 12 (ie, the vibrating tray feeding unit), the processing unit 32B (ie, the visual inspection unit), and the processing unit 32C in the semiconductor component processing apparatus 1 of the elastic combination are selected as shown in FIG. The conversion unit) and the discharge unit 22C (that is, the tray discharge unit) are semiconductor element processing apparatuses 1G in which the semiconductor element processing apparatuses are combined. Of course, in the above design, a plurality of different feeding unit designs or a plurality of different discharging unit designs may be employed. Thereby, a plurality of package conversions and various processes can be performed in the same semiconductor component processing apparatus.

The feeding unit, the processing unit, and the discharging unit in the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments may each be a feeding module in the semiconductor component processing apparatus 1 of the elastic combination shown in the first figure. Any one of the feeding units, any one of the processing modules 30, and one of the discharging units 20 of the discharging module 20 are replaced, thereby being elastically assembled into various feeding modes, processing modes, And a semiconductor component processing apparatus in combination with a discharge mode to meet the needs of various semiconductor component package conversion and processing flows. In addition, the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments may adopt a design similar to that of the semiconductor element processing apparatus 2B shown in FIG. 2B, and the feeding unit, the processing unit, and the discharging unit are provided with The second carrier unit constitutes an empty disk transport mechanism for transporting the empty tray from the discharge unit back to the feed unit for reuse in the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments.

According to the above embodiment, the elastic component semiconductor device processing apparatus 1 of the present invention can be in accordance with the packaging form (or type) of the semiconductor component, the required processing requirements or flow, and the packaging form (or type) of the semiconductor component. Freely selecting a feeding unit having a packaging form (or type) conforming to the semiconductor component provided by the customer, a processing unit capable of implementing the required processing flow, and a packaging form (or type) of the semiconductor component required to meet the customer's requirements The material unit is easily and quickly assembled into various semiconductor component processing devices having different packaging modes, processing modes, and discharging modes by snap-in or other simple bonding methods, that is, having different conversion functions and processing functions. Semiconductor component processing device. By this semiconductor device processing apparatus, it is possible to unify the conversion of various semiconductor element packages thereon and the processing of the semiconductor elements, so that it is not necessary to purchase semiconductor element conversion devices (ie, semiconductor element processing devices) of various package conversion functions, and It is necessary to purchase a variety of different processing functions, that is, a semiconductor component processing device, in order to meet various packaging conversion and processing requirements required by the customer, thereby saving the semiconductor component conversion device (ie, semiconductor component) for purchasing various packaging conversion functions. The cost of the processing device) and the various processing functions, ie, the semiconductor component processing device, and the waste caused by the low frequency of use of some semiconductor component processing devices, thereby saving the cost and time of the conversion (or processing) process, and Shorten the time of semiconductor components in the test plant, and achieve the purpose of fast shipment.

In addition, the present invention also provides an elastic combination semiconductor component classification test system. Referring to the third figure, it is a schematic diagram of a flexible combination of semiconductor component classification test system 2. The flexible combination semiconductor component classification test system 2 includes a feed module 10 for inputting semiconductor components, a test module 40 for testing semiconductor components, and a discharge module 20 for outputting semiconductor components. The utility model is composed of a feeding module 10, a testing module 40, and a discharging module 20. The test module 40 includes several different types of test units 42-42E, meaning that the test units 42-42E have different test functions (or test modes). For example, the test units 42 to 42E may be dynamic test units such as an electrical test unit, a radio frequency test unit (RF tester), a linear reciprocating test unit, a flip test unit, and a rotary test unit, but are not the above test units. The type and sequence are limited, but the type of the test unit and the sequence of changes can be arbitrarily increased or decreased according to requirements.

As shown in the third figure, each of the test units 42-42E is an independent and separate individual, and each of the test units 42-42E has a transport unit 44-44E for transporting the semiconductor component and the carrier, and at least The two test units are coupled to the positioning mechanism 41 and 43 to 41E and 43E. Thereby, a test unit 42~42E and any of the feeding units 12~12E and any of the discharging units 22~22E can be quickly assembled into various feeding modes, test modes (or functions), and Semiconductor component classification test system with material mode combination.

In these test units 42 to 42E, if the carrier can be directly used as a semiconductor component carrier during the test flow, such as a linear reciprocating test, a flip test, and a rotation test, the test unit's transport unit (for example, a test unit) The transport units 44B-44E) of 42B~42E can directly carry the test plate for carrying the carrier, and directly carry the carrier loaded with the semiconductor component for testing, without the need for semiconductor pick-and-place. In these test units 42 to 42E, if the carrier is not directly used as the semiconductor component carrier (for example, the test unit 42, 42A), the transport unit (for example, the transport unit 44 of the test unit 42, 42A, 44A) will include at least one carrier unit (eg, carrier unit 46, 46A) for transporting the carrier and a pick-up unit for placing the semiconductor component on the test unit for testing on the test unit ( For example, the pickup unit 48, 48A) is used to carry out the pick-and-place of the semiconductor element and the transport of the carrier. Although the semiconductor component classification test system shown in the third figure is used for the test flow, and the semiconductor component processing apparatus shown in the first figure, the operation modes of the two are similar, and will not be described again, but the third diagram The semiconductor component classification test system shown will classify the semiconductor components according to the test results and then package them when the semiconductor components are transported to the discharge unit. 4A to 4G, the various embodiments of the semiconductor component classification test system that can be combined by the elastic combination semiconductor component classification test system 2 shown in the third figure are exemplified, but are not limited thereto. Rather, the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the testing unit, and the type and quantity of the discharging unit can be arbitrarily changed according to requirements.

Referring to FIG. 4A, the semiconductor component classification test system 2A selects the feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the out-of-load in the semiconductor component classification test system 2 of the elastic combination. The material unit 22C (ie, the tray discharge unit) is combined to adopt a design combination of a feeding unit, a testing unit, and a discharging unit. By connecting the two test units to the positioning mechanisms 41 and 43, respectively, the feeding unit of the feeding unit 12B (ie, the carrier feeding unit) is coupled to the positioning mechanism 11B and the discharging unit 22C (ie, the tray discharging unit). The material unit joint positioning mechanism 21C is snap-fitted, and can be easily assembled in a short time (for example, 10 minutes or less) to perform electrical testing on the semiconductor element and package conversion (ie, semiconductor component). The semiconductor element classification test system 2A is converted into a carrier package by bulk. Referring to FIG. 4B, it is a feeding unit 12B (ie, a carrier feeding unit), a testing unit 42 (ie, an electrical testing unit), and a discharging unit 22C in the semiconductor component classification test system 2 of the elastic combination. That is, a schematic diagram of the semiconductor element classification test system 2B combined by the carrier discharge unit, which employs a design combination similar to that of the semiconductor element classification test system 2A shown in FIG. The feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22C (ie, the tray discharging unit) of the semiconductor component sorting test system 2B each have a second The loading unit 17B, the second loading unit 47, and the second loading unit 27C are configured to pass the empty tray from the discharging unit 22C (ie, the tray discharging unit) back to the feeding unit 12B (ie, The empty tray transport mechanism of the second load carrying unit 17B of the carrier feed unit.

Furthermore, considering the drop between the feed rate of the feed unit, the test speed of the test unit, and the discharge speed of the discharge unit, the semiconductor component classification test system may not be continuously tested and may be stagnant ( Idle), so the semiconductor component processing apparatus of the present invention can also adopt a design in which a plurality of feeding units, a single testing unit, and a single discharging unit are assembled, for example, the semiconductor component classification of the selected elastic combination shown in FIG. Semiconductor component classification test of the combination of the feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22D (ie, the tape discharging unit) in the test system 2 System 2C, a plurality of discharge units, a single test unit, and a design assembled with a single feed unit, such as the feed unit 12B in the semiconductor component classification test system 2 of the elastic combination shown in FIG. 4D (ie, The semiconductor component classification test system 2D combined with the tube feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22D (ie, the tape discharging unit), a test unit, a single feed unit, and a single discharge unit assembly design, such as the feed unit 12B (ie, the load tube feed unit) in the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. The test unit 42 (ie, the electrical test unit), the test unit 42A (radio frequency test unit), and the discharge unit 22D (ie, the tape take-up unit) are assembled into a combined semiconductor component classification test system 2E, multiple The design of the test unit, the plurality of feed units, and the single discharge unit assembly, such as the feed unit 12B (ie, the load tube feed unit) in the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. , a test unit 42 (ie, an electrical test unit), a test unit 42A (radio frequency test unit), and a discharge unit 22D (ie, a tape take-up unit) are combined into a semiconductor component classification test system 2F, a plurality of test units, The design of the single feeding unit and the assembly of the plurality of discharging units, for example, the feeding unit 12B (ie, the feeding unit) of the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. Unit 42 (ie, electrical test unit), test unit 42A (radio frequency test unit), and discharge unit 22D (ie, take-up and discharge unit) are combined into a semiconductor component classification test system 2G, or a plurality of test units, Design of multiple feed units and multiple discharge units assembled. These semiconductor element classification test systems 2C-2G have similar structures and operation modes as the semiconductor element processing apparatuses 1C-1G shown in the second CG diagram, and can adopt a similar assembly design, and only need to process the semiconductor element processing apparatus 1C-1G. The processing unit in the process can be replaced by the test unit, so these parts will not be described again. The difference between the two modes of operation is also detailed in the related description of the third figure, and will not be repeated here.

The feeding unit, the testing unit, and the discharging unit in the semiconductor component sorting test systems 2A to 2G of the above respective embodiments can respectively classify the feeding in the test system 2 by the elastic combination of the semiconductor elements shown in the third figure. Any one of the feeding unit of the module 10, any one of the testing modules 40, and one of the discharging unit 20 is replaced, so as to be elastically assembled into various feeding modes and tested. A semiconductor component classification test system combining mode and discharge mode to meet the needs of various semiconductor component package conversion and testing. In addition, the semiconductor element classification test systems 2A to 2G of the above respective embodiments may adopt a design similar to the semiconductor element classification test system 2B shown in FIG. 4B, and are loaded into the material unit, the test unit, and the discharge unit. Each of the semiconductor element sorting test systems 2A to 2G of each of the above-described embodiments constitutes an empty disc transport mechanism that transports the empty tray from the discharge unit back to the feed unit for reuse. In the above embodiment, the loading unit and the transport unit for transporting the carrier, and the second loading unit for transporting the empty tray, may be carried by a carrier rail, a carrier platform, or a transport platform capable of transporting the carrier or the empty carrier. It is another mechanism that can transport pallets or empty pallets.

According to the above embodiment, the elastic component semiconductor component classification test system 2 of the present invention can be tested according to the package form (or type) of the semiconductor component provided by the customer, that is, the package form (or type) of the semiconductor component into the factory. The requirements or processes, and the packaging form (or type) of the semiconductor components required by the customer, that is, the packaging form (or type) of the semiconductor component, are freely selected to have a packaging form (or type) conforming to the semiconductor component provided by the customer. The feeding unit, the testing unit that can implement the required testing process, and the discharging unit of the packaging form (or type) of the semiconductor component required by the customer, and are easily combined by snapping or other simple bonding methods. Quickly assembled into various semiconductor component classification test systems with different packaging modes, test modes, and discharge modes, that is, semiconductor component classification test systems having different conversion functions and processing functions. The semiconductor component classification test system can unify the conversion of various semiconductor component packages and the testing of the semiconductor components thereon, so that it is not necessary to purchase semiconductor component conversion devices (ie, semiconductor component processing devices) of various package conversion functions. And the semiconductor component processing device that does not need to purchase various processing functions is spared, in order to meet the requirements of various packaging conversion and processing processes required by the customer, and does not need to manually or mechanically transport the semiconductor components to the testing machine and convert Since the device (or the processing device) can save the cost of the semiconductor component conversion device (ie, the semiconductor component processing device) that purchases various package conversion functions and the semiconductor component processing device of various processing functions, and These semiconductor component processing devices use waste caused by low frequency, and reduce the time required for semiconductor components to transfer between different machines, thereby saving the cost and time of the conversion (or processing) process and shortening the testing of semiconductor components. In-plant Room, and you can achieve rapid shipment.

The invention further provides a semiconductor component classification test system which combines packaging conversion, other processing functions (such as heating, flipping, visual inspection, conversion, positioning, classification, laser labeling, label inspection, etc.) and elastic combination of testing functions. . Referring to the fifth figure, it is a schematic diagram of a semiconductor component classification test system 3 which can simultaneously combine the packaging conversion, the processing function, and the elastic combination of the test functions. The flexible combination semiconductor component classification test system 3 includes a feed module 10 for inputting a semiconductor component, a processing module 30 for processing the semiconductor component, and a test module 40 for testing the semiconductor component. And a discharge module 20 for outputting a semiconductor component, and comprising a feed module 10, a processing module 30, a test module 40, and a discharge module 20. The processing module 10, the test module 40, and the feed module, processing module, test module, and the same as disclosed in the foregoing embodiments are used in the flexible component semiconductor component classification test system 3 The discharging module is the same, so it will not be described here.

As shown in the fifth figure, the user can freely select the corresponding feeding unit from the feeding module 10 according to the packaging form (or type) of the semiconductor component entering the factory, and freely according to the processing flow required by the semiconductor component. The corresponding processing unit of the processing module 30 is freely available from the corresponding test unit of the test module 40 according to the test required by the semiconductor component, according to the packaging form (or type) of the semiconductor component required by the customer. The corresponding discharging unit of the material module 20 is connected to the positioning mechanism by the feeding unit of the feeding unit, the two processing unit connecting positioning mechanism of the processing unit, the two testing unit connecting positioning mechanism of the testing unit, and the discharging unit. The discharging unit is coupled with the positioning mechanism, and the four are easily and quickly snap-fitted, and combined into a semiconductor component classification test system capable of performing semiconductor component package conversion, semiconductor component processing flow, and semiconductor component testing process unified thereon. , enabling automated implementation of semiconductor component packaging in a unified semiconductor component classification test system In other words, the process flow of the semiconductor element, and a semiconductor device testing process. 6 to 6 F show various embodiments of the semiconductor component classification test system that can be combined by the elastic combination semiconductor component classification test system 3 shown in FIG. 5, but are not limited thereto. Rather, the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the processing unit, the type and quantity of the testing unit, and the type and quantity of the discharging unit can be arbitrarily changed according to requirements.

Referring to FIG. 6A, the charging unit 12B (ie, the carrier feeding unit), the processing unit 32 (ie, the heating unit), and the testing unit 42 (ie, electrical) in the semiconductor component classification test system 3 of the elastic combination are selected. A schematic diagram of a semiconductor component classification test system 3A in which a test unit) and a discharge unit 22C (ie, a tray discharge unit) are combined. By snapping the feeding unit coupling positioning mechanism 11B, the two processing unit coupling positioning mechanisms 31 and 33, the two testing unit coupling positioning mechanisms 41 and 43 , and the discharging unit coupling positioning mechanism 21C, it is easy to be short. The semiconductor component classification test system 3A is assembled in time (for example, 10 minutes or less). Operation of the feeding unit 12B (ie, the tube feeding unit), the processing unit 32 (ie, the heating unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22C (ie, the tray discharging unit) The method is as described above and will not be described here. Thereby, the processing flow, the test, and the package conversion of the semiconductor element can be uniformly performed in the semiconductor element classification test system 3A (that is, the semiconductor element is converted into a carrier package by the carrier package). The semiconductor component classification test system 3B shown in FIG. 6B and the semiconductor component classification test system 3A adopt a similar composition design, but the charging unit 12B (ie, the carrier feeding unit) of the semiconductor component classification test system 3B, and the processing unit 32 (ie, heating test unit), test unit 42 (ie, electrical test unit), and discharge unit 22C (ie, tray discharge unit) respectively have a second load unit 17B, a second load unit 37, The second loading unit 47 and the second loading unit 27C, so that the empty tray can be transported back to the feeding unit 12B (ie, the carrier feeding unit) by the discharging unit 22C (ie, the tray discharging unit). The second loading unit 17B is reused. In addition, the design of the semiconductor unit after the processing unit is disposed after the test unit (ie, the processing unit is disposed between the test unit and the discharge unit) may be modified according to requirements. For example, the semiconductor component classification of the selective combination shown in FIG. Feed unit 12B (ie, tube feed unit), test unit 42 (ie, electrical test unit), processing unit 32B (ie, visual inspection unit), and discharge unit 22C in test system 3 (ie, tray discharge) Unit) The semiconductor component classification test system 3C combined.

Furthermore, considering the drop between the feed rate of the feed unit, the processing speed of the processing unit, the test speed of the test unit, and the discharge speed of the discharge unit, the semiconductor processing unit may not be processed continuously. The possibility of having an idle, and considering various combinations of requirements, the semiconductor component classification test system of the present invention can also be assembled by a plurality of semiconductor processing units, a single semiconductor charging unit, a single test unit, and a single discharge unit. Design, for example, the feeding unit 12B (ie, the carrier feeding unit), the processing unit 32 (ie, the heating unit), and the testing unit 42 in the semiconductor component classification test system 3 of the selected elastic combination shown in FIG. Electrical component test unit), processing unit 32B (ie, visual inspection unit), and discharge unit 22C (ie, tray discharge unit) combined semiconductor component classification test system 3D; multiple feed units, single processing unit, Single test unit, and single discharge unit assembly design, such as the selected elastic combination of semiconductor component classification test system shown in Figure 6E Feed unit 12B (ie, carrier feed unit), processing unit 32 (ie, heating test unit), test unit 42 (ie, electrical test unit), and discharge unit 22C (ie, tray discharge unit) The combined semiconductor component classification test system 3E, a plurality of discharge units, a single processing unit, a single test unit, and a design assembled with a single feed unit, such as the semiconductor component classification selected by the elastic combination shown in FIG. Feed unit 12B (ie, tube feed unit), processing unit 32 (ie, heating unit), test unit 42 (ie, electrical test unit), and discharge unit 22C in test system 3 (ie, tray discharge) Unit) a semiconductor component classification test system 3F, or various numbers of discharge units, various numbers of processing units, various numbers of test units, and assembly designs combined with various numbers of input units, wherein The overlapping manners and operation modes of the respective constituent units in the semiconductor component classification test system are similar to those of the foregoing embodiments, and will not be described herein. Thereby, the semiconductor component, the test, the processing flow, and the package conversion can be completed uniformly on the semiconductor component classification test system. In the semiconductor component classification test system in which the elastic component semiconductor component classification test system 3 is combined, two or more combinations of the feed cells having the same or different feed modes and two or more of the same can be simultaneously used. Or a combination of discharge units of different discharge modes overlaps the design of a plurality of test units.

The feeding unit, the testing unit, and the discharging unit in the semiconductor component sorting test systems 3A to 3F of the above respective embodiments can be respectively classified by the elastic component of the semiconductor component classification test system 3 shown in FIG. Any one of the feeding unit of the module 10, any processing unit of the processing module 30, any one of the testing modules 40, and any one of the discharging unit units 20, thereby elastically Semiconductor component classification test systems assembled into a variety of different feed modes, processing modes, test modes, and discharge modes to accommodate a variety of different semiconductor component package conversion, processing flows, and testing needs. In addition, the semiconductor element classification test systems 3A to 3F of the above respective embodiments may adopt a design similar to the semiconductor element classification test system 3B shown in FIG. B, and have a carrier capable of transporting the empty tray from the discharge unit. An empty disk transport mechanism that returns to the feed unit for reuse.

According to the above embodiment, the flexible component semiconductor component classification test system of the present invention can be processed according to the packaging form (or type) of the semiconductor component provided by the customer, that is, the packaging form (or type) of the semiconductor component into the factory, and the required processing flow. , the required test requirements or processes, and the packaging form (or type) of the semiconductor components required by the customer, that is, the packaging form (or type) of the semiconductor component, freely selected to have a packaging form conforming to the semiconductor component provided by the customer. a (or type) feed unit, a processing unit that can perform the required process flow, a test unit that can perform the required test flow, and a discharge unit that conforms to the packaging form (or type) of the semiconductor component required by the customer, and Quickly and quickly assemble into various semiconductor component classification test systems with different packaging modes, processing modes, test modes, and discharge modes by snap-fit or other simple bonding methods, that is, semiconductor components having different processing functions Classification test system. By this semiconductor component classification test system, it is possible to unify the conversion of various semiconductor component packages and the processing and testing of the semiconductor components thereon, so that it is not necessary to purchase semiconductor component conversion devices (ie, semiconductor component processing devices) having various package conversion functions. Standby, as well as the need to purchase a variety of different processing functions (ie, semiconductor component processing equipment), in order to meet the needs of various packaging conversion and processing procedures required by customers, and do not need to manually or mechanically transport semiconductor components to the test. The machine and the conversion device (or the processing device) can save the added cost of the semiconductor component conversion device (ie, the semiconductor component processing device) and various semiconductor processing devices that are required to purchase various package conversion functions. And the waste caused by the low frequency of use of some semiconductor component processing devices, and reducing the time required for the transfer of semiconductor components between different machines, thereby saving the cost and time of the conversion (or processing) process, and Achieve fast shipments of.

1‧‧‧Flexible combination of semiconductor component processing devices
1A, 1B, 1C, 1D, 1E, 1F, 1G‧‧‧ semiconductor device processing device
2‧‧‧Flexible combination of semiconductor component classification test system
2A, 2B, 2C, 2D, 2E, 2F, 2G‧‧‧ semiconductor component classification test system
3‧‧‧Flexible combination of semiconductor component classification test system
3A, 3B, 3C, 3D, 3E, 3F, 3G‧‧‧ semiconductor component classification test system
10‧‧‧ Feeding module
11, 11A, 11B, 11C, 11D, 11E‧‧‧ feeding unit connection positioning mechanism
12, 12A, 12B, 12C, 12D, 12E‧‧‧ Feeding unit
14, 14A, 14B, 14C, 14D, 14E‧‧‧ delivery unit
16, 16A, 16B, 16C, 16D, 16E‧‧‧loading unit
17, 17B‧‧‧Second loading unit
18, 18A, 18B, 18C, 18D, 18E‧‧‧ picking unit
20‧‧‧Drawing module
21, 21A, 21B, 21C, 21D, 21E‧‧‧ discharge unit connection positioning mechanism
22, 22A, 22B, 22C, 22D, 22E‧‧‧ discharge unit
24, 24A, 24B, 24C, 24D, 24E‧‧‧ delivery unit
26, 26A, 26B, 26C, 26D, 26E‧‧‧loading unit
27C, 27D‧‧‧Second loading unit
28, 28A, 28B, 28C, 28D, 28E‧‧‧ picking unit
30‧‧‧Processing module
31, 31A, 31B, 31C, 31D, 31E‧‧‧ processing unit connection positioning mechanism
32, 32A, 32B, 32C, 32D, 32E‧‧‧ processing unit
33, 33A, 33B, 33C, 33D, 33E‧‧‧ processing unit connection positioning mechanism
34, 34A, 34B, 34C, 34D, 34E‧‧‧ delivery unit
36E‧‧‧Loading unit
37D‧‧‧Second loading unit
37D‧‧‧Second loading unit
38E‧‧‧ picking unit
40‧‧‧Test module
41, 41A, 41B, 41C, 41D, 41E‧‧‧ test unit connection positioning mechanism
42, 42A, 42B, 42C, 42D, 42E‧‧‧ test units
43, 43A, 43B, 43C, 43D, 43E‧‧‧ test unit connection positioning mechanism
44, 44A, 44B, 44C, 44D, 44E transport unit ‧ ‧ 46, 46A ‧ ‧ loading unit
47‧‧‧Second loading unit
48, 48A‧‧‧ picking unit

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a schematic view of a flexible combination semiconductor device processing apparatus according to another embodiment of the present invention.

2A to 2G are schematic views of various embodiments of the elastic component semiconductor device processing apparatus shown in the fourth embodiment of the present invention.

The third figure is a schematic diagram of a flexible combined semiconductor component classification test system according to an embodiment of the present invention.

4A to 4G are schematic views of various embodiments of the elastic component semiconductor component classification test system shown in the sixth embodiment of the present invention.

FIG. 5 is a schematic diagram of a semiconductor component classification test system of an elastic combination according to another embodiment of the present invention.

6A to 6F are schematic views of various embodiments of the elastic component semiconductor component classification test system shown in Fig. 6 of the present invention.

1‧‧‧Flexible combination of semiconductor component processing devices

10‧‧‧ Feeding module

11, 11A, 11B, 11C, 11D, 11E‧‧‧ feeding unit connection positioning mechanism

12, 12A, 12B, 12C, 12D, 12E‧‧‧ Feeding unit

14, 14A, 14B, 14C, 14D, 14E‧‧‧ delivery unit

16, 16A, 16B, 16C, 16D, 16E‧‧‧loading unit

18, 18A, 18B, 18C, 18D, 18E‧‧‧ picking unit

20‧‧‧Drawing module

21, 21A, 21B, 21C, 21D, 21E‧‧‧ discharge unit connection positioning mechanism

22, 22A, 22B, 22C, 22D, 22E‧‧‧ discharge unit

24, 24A, 24B, 24C, 24D, 24E‧‧‧ delivery unit

26, 26A, 26B, 26C, 26D, 26E‧‧‧loading unit

28, 28A, 28B, 28C, 28D, 28E‧‧‧ picking unit

30‧‧‧Processing module

31, 31A, 31B, 31C, 31D, 31E‧‧‧ processing unit connection positioning mechanism

32, 32A, 32B, 32C, 32D, 32E‧‧‧ processing unit

33, 33A, 33B, 33C, 33D, 33E‧‧‧ processing unit connection positioning mechanism

34, 34A, 34B, 34C, 34D, 34E‧‧‧ delivery unit

36E‧‧‧Loading unit

38E‧‧‧ picking unit

Claims (21)

An elastic combination semiconductor component processing apparatus, comprising: at least one feeding module for inputting a semiconductor component, wherein the feeding module comprises several different kinds of feeding units, each of the feeding units is one Independent and separate individuals, and each of the feeding units has a feeding unit connecting positioning mechanism; at least one discharging module, the discharging module comprises several different kinds of discharging units, each of the discharging units The unit is an independent and separate entity, and each of the discharging units has a discharging unit connecting positioning mechanism; and at least one processing module for processing the semiconductor component, wherein the processing module includes Processing units, each of which is an independent and separate entity, and each processing unit has two processing unit connection positioning mechanisms, wherein the two processing units are coupled to the positioning mechanism and the one of the discharging units respectively The discharging unit connecting positioning mechanism and the feeding unit connecting positioning mechanism of the feeding unit are combined to form a semiconductor component processing device, thereby The semiconductor device processing element is free to select a different lap processing unit with a different feed unit and a discharge unit composition different to have different functions. The semiconductor component processing apparatus according to the elastic combination of claim 1, wherein the feeding module comprises a vibrating tray feeding unit, a tray feeding unit, a carrier feeding unit, a tape feeding unit, And at least one of the group of the wafer frame feed feeding unit and the like. The flexible component semiconductor device processing apparatus according to claim 1, wherein each of the feeding unit, each of the discharging unit and each of the processing modules includes a conveying unit for transmitting the semiconductor component . The elastic component combination semiconductor component processing apparatus according to claim 3, wherein the transport unit comprises at least one carrier unit for transporting a carrier. The elastic component combination semiconductor component processing apparatus according to claim 4, wherein the transport unit further comprises a pickup unit for taking out and placing the semiconductor component on the carrier. The semiconductor component processing apparatus according to the elastic combination of claim 1, wherein the discharge module comprises a box discharge unit, a carrier discharge unit, a tray discharge unit, a tape discharge unit, and the like. At least one of the output units of the group formed. The semiconductor component processing apparatus of the flexible combination according to claim 3, wherein the conveying unit of the feeding unit further comprises a second loading unit, and the conveying unit of the discharging unit further comprises a second loading Moving the unit, and the conveying unit of the processing unit further comprises a second loading unit, wherein the second loading unit of the feeding unit, the second loading unit of the processing unit and the discharging unit The second loading unit is combined into an empty tray transport unit for carrying the empty tray. The semiconductor component processing apparatus according to the elastic combination of claim 1, wherein the processing module comprises a processing unit such as a heating unit, a flipping unit, an appearance inspection unit, a conversion unit, a positioning unit, and a classification unit. At least one processing unit in the group. The semiconductor component processing apparatus of the elastic combination of claim 4, wherein the conveying unit of the feeding unit further comprises a second loading unit, and the conveying unit of the discharging unit further comprises a second loading Moving the unit, and the conveying unit of the processing unit further comprises a second loading unit, the second loading unit of the feeding unit, the second loading unit of the processing unit, and the discharging unit The second carrier unit is combined into an empty tray transport unit for carrying the empty tray. A flexible combination semiconductor component classification test system comprising: a feed module for inputting a semiconductor component, wherein the feed module comprises a plurality of different types of feed units, each of the feed units being one Independent and separate individuals, each of which has a feeding unit connection positioning mechanism; a test module for testing semiconductor components, wherein the test module comprises several different types of test units Each of the test units is an independent and separate individual, and each of the test units has at least two test unit connection positioning mechanisms; and a discharge module for outputting semiconductor components, wherein the discharge mold The group comprises a plurality of different types of discharge units, each of which is an independent and separate individual, and each of the discharge units has a discharge unit connection positioning mechanism; each of the test units can be borrowed The two test unit connecting positioning mechanisms are respectively connected to a feeding unit connecting positioning mechanism of a feeding unit and a discharging unit connecting positioning mechanism of a discharging unit, The test unit is disposed between the feeding unit and the discharging unit to be combined into a semiconductor component classification test system, so that different feeding units, different testing units, and different discharging units can be freely selected. They are combined to form different semiconductor component classification test systems. The flexible component semiconductor component classification test system according to claim 10, wherein the feed module comprises a vibration disk feeding unit, a tray feeding unit, a carrier feeding unit, and a tape feeding unit. And at least one of the feeding units of the group consisting of the wafer frame feed feeding unit and the like. The flexible component semiconductor component classification test system according to claim 10, wherein each of the feeding unit, each of the discharging unit and each of the testing modules includes a conveying for transmitting the semiconductor component. unit. The elastic component semiconductor component classification test system according to claim 13, wherein the transport unit further comprises a pickup unit for taking out and placing the semiconductor component on the carrier. The semiconductor component classification test system according to the elastic combination of claim 10, wherein the test module comprises an electrical test unit, an RF test unit, a linear reciprocating test unit, a flip test unit, and a rotation test unit. At least one of the test units formed by the group. The semiconductor component classification test system according to the elastic combination of claim 10, wherein the discharge module comprises a box discharge unit, a tray discharge unit, a carrier discharge unit, and a tape discharge unit. At least one of the output units of the group formed by the class. The semiconductor component classification test system according to the elastic combination of claim 13, wherein the conveying unit of the feeding unit further comprises a second loading unit, and the conveying unit of the discharging unit further comprises a second Loading the unit, and the conveying unit of the testing unit further comprises a second loading unit, the second loading unit of the feeding unit, the second loading unit of the testing unit, and the discharging The second carrier unit of the unit is combined into an empty tray transport unit for carrying the empty tray. The semiconductor component classification test system according to the elastic combination of claim 10, wherein the elastic combination semiconductor component classification test system further comprises a processing module for processing the semiconductor component, wherein the processing module The processing unit includes a plurality of semiconductor component processing units, each of the semiconductor component processing units is an independent and separate entity, and each of the semiconductor component processing units has two processing unit connection positioning mechanisms, and the two processing units are coupled to the positioning mechanism respectively. Combining with other units in the flexible combination semiconductor component classification test system to form a semiconductor component classification test system, thereby freely selecting different semiconductor component processing units and different input units, different test units, and different The material units are lapped to form a semiconductor component classification test system having different functions. The semiconductor component classification test system according to the elastic combination of claim 18, wherein the processing module comprises a processing unit such as a heating unit, a flipping unit, an appearance inspection unit, a conversion unit, a positioning unit, and a classification unit. At least one processing unit of the group formed. The elastic component semiconductor component classification test system according to claim 19, wherein each of the processing units includes a transport unit for transferring the semiconductor component. The elastic component semiconductor component classification test system according to claim 20, wherein the transport unit comprises at least one carrier unit for transporting the carrier. The semiconductor component processing apparatus of the flexible combination according to claim 21, wherein the conveying unit of the feeding unit further comprises a second loading unit, and the conveying unit of the discharging unit further comprises a second loading a transfer unit, the transport unit of the test unit further includes a second load transfer unit, and the transport unit of the processing unit further includes a second load transfer unit, wherein the second load transfer unit of the feed unit The second loading unit of the testing unit, the second loading unit of the discharging unit, and the second loading unit of the processing unit are combined into an empty tray conveying unit for carrying an empty tray.