TW201800225A - Multilayer resin film and molded container including a resin layer made of an olefin-based resin and serving as a water vapor barrier resin layer and a resin layer made of a styrene-based resin - Google Patents

Multilayer resin film and molded container including a resin layer made of an olefin-based resin and serving as a water vapor barrier resin layer and a resin layer made of a styrene-based resin Download PDF

Info

Publication number
TW201800225A
TW201800225A TW105119422A TW105119422A TW201800225A TW 201800225 A TW201800225 A TW 201800225A TW 105119422 A TW105119422 A TW 105119422A TW 105119422 A TW105119422 A TW 105119422A TW 201800225 A TW201800225 A TW 201800225A
Authority
TW
Taiwan
Prior art keywords
resin layer
water vapor
layer
resin
resin film
Prior art date
Application number
TW105119422A
Other languages
Chinese (zh)
Other versions
TWI736536B (en
Inventor
德永久次
村岡喬梓
Original Assignee
電化股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 電化股份有限公司 filed Critical 電化股份有限公司
Priority to TW105119422A priority Critical patent/TWI736536B/en
Publication of TW201800225A publication Critical patent/TW201800225A/en
Application granted granted Critical
Publication of TWI736536B publication Critical patent/TWI736536B/en

Links

Abstract

The present invention provides a multilayer resin film, in which a resin layer made of an olefin-based resin and serving as a water vapor barrier resin layer is laminated via a bonding layer on both side surfaces of an oxygen barrier resin layer, and a resin layer made of a styrene-based resin is laminated via a bonding layer on one side of the water vapor barrier resin layer. The water vapor barrier resin layer has a total thickness of 50 to 300 [mu]m, the styrene-based resin layer has a thickness of 200 to 900 [mu]m and the difference of the oxygen transmission rates before and after being placed in a high-temperature, high-humidity environment is maintained at 1.0 cc/m2 day or less. This multilayer resin film has excellent thermoformability, oxygen barrier properties, and water vapor barrier properties.

Description

多層樹脂薄膜以及成型容器 Multi-layer resin film and molded container

本發明涉及一種高阻隔性的多層樹脂薄膜以及利用該薄膜進行成型得到的成型容器。 The invention relates to a multilayer resin film with high barrier properties and a molding container obtained by using the film.

傳統清涼飲料、果汁飲料、嗜好性食品等的容器均採用具有優異的熱成型性以及剛性的聚苯乙烯類樹脂。近年來,多層樹脂薄膜以及利用其製造而成的多層容器得到了推廣,該類產品將聚苯乙烯類樹脂層作為最外層,中間隔著改性烯烴類樹脂等的接合層,然後設置乙烯-乙烯醇共聚物樹脂層,以起到阻隔氧氣的作用,從而可避免內容物因氧化而導致品質下降(參見專利文獻1)。 Containers for traditional refreshing beverages, fruit drinks, and foods are made of polystyrene resins with excellent thermoformability and rigidity. In recent years, multilayer resin films and multilayer containers made from them have been promoted. This type of product uses a polystyrene resin layer as the outermost layer, with a bonding layer such as a modified olefin resin interposed therebetween, and then provides ethylene- The vinyl alcohol copolymer resin layer has a function of blocking oxygen, thereby preventing the content from being degraded due to oxidation (see Patent Document 1).

此外,專利文獻2中披露了一種氣體阻隔薄膜,其特點在於使用含有含矽高分子、熱塑性樹脂的氣體阻隔材料,使熱塑性樹脂的玻璃轉化溫度達到100℃以上,同時對氣體阻隔材料實施了等離子注入處理,該含矽高分子為聚矽氮烷化合物,而熱塑性樹脂則是從由聚碳酸酯樹脂、環烯樹脂、聚碸樹脂構成的組中選擇的至少一種。 In addition, Patent Document 2 discloses a gas barrier film, which is characterized by using a gas barrier material containing a silicon-containing polymer and a thermoplastic resin, so that the glass transition temperature of the thermoplastic resin reaches 100 ° C or higher, and a plasma is applied to the gas barrier material. In the injection treatment, the silicon-containing polymer is a polysilazane compound, and the thermoplastic resin is at least one selected from the group consisting of a polycarbonate resin, a cycloolefin resin, and a polyfluorene resin.

此外,還披露過一種對氧氣及水蒸氣等氣體或濕氣具有阻隔性以及耐溶劑性的光學樹脂薄膜(參見專利文獻3)。 In addition, an optical resin film having barrier properties against solvents such as oxygen, water vapor, and moisture, and solvent resistance has also been disclosed (see Patent Document 3).

具體來說,其特點在於,在光學透明樹脂薄膜的至少一側表面上形成以聚矽氮烷無機聚合物為主要成分的塗層膜之後,對其進行加熱 固化處理,從而使其具備厚度約0.02~5μm的氣體阻隔層。 Specifically, it is characterized in that a coating film containing a polysilazane inorganic polymer as a main component is formed on at least one surface of an optically transparent resin film, and then the film is heated. The curing process is performed to provide a gas barrier layer having a thickness of about 0.02 to 5 μm.

一般情況下,在搬運保存有食品的容器時,為了避免因搬運中的振動及外部溫度環境對容器本身造成損壞,同時防止容器內食品品質降低,在包裝中會層疊裝入多個容器進行保護,或通過實施了溫度管理的搬運方式進行。同時,在搬運後多會以同樣的形態在保管倉庫中臨時保管。但能考慮到對濕度也進行管理的包裝或搬運方式卻非常少。 In general, when transporting containers that hold food, in order to avoid damage to the container due to vibration and external temperature environment during transportation, and to prevent the quality of the food in the container from being lowered, multiple containers are stacked in the package for protection. , Or by a temperature-managed transport method. At the same time, they are often temporarily stored in a storage warehouse in the same form after transportation. However, there are very few packaging or handling methods that can also manage humidity.

另一方面,為防止因內容物氧化導致品質下降的情況發生,用作容器結構中設置的氧氣阻隔層的樹脂,由於濕度的影響,使得氧氣阻隔層樹脂吸濕而導致其阻隔性下降的問題。此外,同樣因為氧氣阻隔層樹脂吸濕,在加熱成型為容器時吸收的水分會導致氣泡產生,從而使成型後的容器外觀出現粒狀氣泡等外觀不良的情況,甚至可能導致穿孔等重大問題。 On the other hand, in order to prevent the deterioration of the quality due to the oxidation of the contents, the resin used as the oxygen barrier layer provided in the container structure has a problem that the barrier property of the oxygen barrier layer resin is reduced due to the influence of humidity. . In addition, because the oxygen barrier resin is hygroscopic, the moisture absorbed when it is heated to form a container will cause air bubbles, which will cause the appearance of the container after molding, such as granular bubbles, and other problems such as perforations.

因此,專利文獻1-2中記載的阻隔性薄膜並未考慮到上述搬運與保管時的濕度影響,若使用該薄膜成型的容器長時間放置在高濕度環境下則可能無法維持其原本的阻隔性,從而無法防止因氧化而導致的品質下降問題,或可能產生上述外觀不良的情況。 Therefore, the barrier film described in Patent Documents 1-2 does not take into account the effects of humidity during transportation and storage described above. If a container formed using the film is left in a high humidity environment for a long time, its original barrier properties may not be maintained. Therefore, it is impossible to prevent the problem of quality degradation caused by oxidation, or the above-mentioned appearance defects may occur.

另一方面,在專利文獻3中記載的阻隔性薄膜,是通過在樹脂薄膜的兩面塗覆對氣體或濕氣具有阻隔性的塗膜,來防止由於樹脂薄膜表面一方的濕度影響造成氧氣阻隔層樹脂吸濕所引起的阻隔性降低的。 On the other hand, the barrier film described in Patent Document 3 is to prevent the oxygen barrier layer from being affected by humidity on the surface of the resin film by applying a coating film having gas or moisture barrier properties to both sides of the resin film. The barrier properties of the resin are reduced due to moisture absorption.

但採用具有這樣薄的塗膜的樹脂薄膜來成型用於食品或飲料的容器時,由於通常需要進行深拔衝壓加工,會在深拔熱成型過程中使其塗膜產生裂口(開口部)。一旦這樣成型的容器上存在上述裂口(開口部), 氧氣或濕氣就會從該裂口(開口部)侵入造成阻隔性降低。 However, when a resin film having such a thin coating film is used to mold a container for food or beverage, a deep-draw stamping process is usually required, which causes cracks (openings) in the coating film during the deep-draw thermoforming process. Once the above-mentioned crack (opening) exists in the container thus formed, Oxygen or moisture intrudes through this nick (opening) and decreases the barrier properties.

專利文獻1 日本專利特開平11-58619號公報 Patent Document 1 Japanese Patent Laid-Open No. 11-58619

專利文獻2 PCT國際專利WO2013175911A1號公報 Patent Document 2 PCT International Patent Publication No. WO2013175911A1

專利文獻3 日本專利特開平8-169078號公報 Patent Document 3 Japanese Patent Laid-Open No. 8-169078

本發明是在考慮以上問題之後開發的產品,提供一種高阻隔性的多層樹脂薄膜以及利用該薄膜成型製造的成型容器,其是通過在氧氣阻隔性樹脂層的兩側表面上構成水蒸氣阻隔性樹脂層,使其具有優異的氧氣阻隔性以及水蒸氣阻隔性,同時,即使在高濕度環境下也能維持較高的氧氣阻隔性。 The present invention is a product developed after considering the above problems, and provides a multilayer resin film with high barrier properties and a molding container manufactured by using the film. The water vapor barrier properties are formed on both surfaces of an oxygen barrier resin layer. The resin layer has excellent oxygen barrier properties and water vapor barrier properties. At the same time, it can maintain high oxygen barrier properties even in high humidity environments.

本發明的一種多層樹脂薄膜,是在氧氣阻隔性樹脂層的兩面上,隔著接合層層疊有用作水蒸氣阻隔性樹脂層的由烯烴樹脂構成的樹脂層,而在一側表面的水蒸氣阻隔性樹脂層上,層疊有由苯乙烯類樹脂構成的樹脂層,其中,所述水蒸氣阻隔性樹脂層厚度合計為50~300μm,且所述苯乙烯類樹脂層厚度為200~900μm。 A multilayer resin film of the present invention has a resin layer composed of an olefin resin serving as a water vapor barrier resin layer laminated on both sides of an oxygen barrier resin layer via a bonding layer, and water vapor barrier on one surface. A resin layer made of a styrenic resin is laminated on the flexible resin layer, wherein the total thickness of the water vapor barrier resin layer is 50 to 300 μm, and the thickness of the styrenic resin layer is 200 to 900 μm.

另外,上述構成的多層樹脂薄膜,其放入高溫高濕環境前後的氧氣透過率差異維持在1.0cc/m2‧day以下。 In addition, in the multilayer resin film having the above-mentioned structure, the difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment is maintained at 1.0 cc / m 2 ‧day or less.

進一步,上述構成的多層樹脂薄膜,所述氧氣透過率差異維持在5.0cc/m2‧day以下,且其水蒸氣透過率維持在3.0g/m2‧day以下。 Further, in the multilayer resin film having the above configuration, the difference in the oxygen transmission rate is maintained below 5.0 cc / m 2 ‧day, and the water vapor transmission rate thereof is maintained below 3.0 g / m 2 ‧day.

因此,採用上述構成的多層樹脂薄膜,具有優異的氧氣阻隔性以及水蒸氣阻隔性,同時,即使在高濕度環境下也能維持較高的氧氣阻隔性。 Therefore, the multilayer resin film having the above-mentioned structure has excellent oxygen barrier properties and water vapor barrier properties, and can maintain high oxygen barrier properties even in a high humidity environment.

另外,在上述構成的多層樹脂薄膜中,所述氧氣阻隔性樹脂層的厚度設定在10~50μm。採用這樣構成的多層樹脂薄膜來成型時,可防止因氧氣阻隔性樹脂層太薄而引起成型容器內物品的氧化造成的品質降低,從而保證氧氣阻隔性能,同時也可防止因氧氣阻隔性樹脂層太厚而引起容器成型時產生的樹脂凹痕。 In addition, in the multilayer resin film having the above configuration, the thickness of the oxygen-barrier resin layer is set to 10 to 50 μm. When the multilayer resin film having such a structure is used for molding, the quality of the oxygen-barrier resin layer can be prevented from being degraded due to the thinness of the oxygen-barrier resin layer, thereby ensuring the oxygen-barrier performance and preventing the oxygen-barrier resin layer. Too thick to cause resin dents during container molding.

另外,在上述構成的多層樹脂薄膜中,各個接合層的厚度分別設定在10~50μm。採用這樣構成的多層樹脂薄膜,可防止因接合層太薄而無法獲得足夠的層間接合強度,同時也可防止因接合層太厚而引起容器成型時產生的樹脂凹痕。 Moreover, in the multilayer resin film of the said structure, the thickness of each bonding layer is set to 10-50 micrometers, respectively. With the multilayer resin film configured in this way, it is possible to prevent insufficient interlayer bonding strength from being obtained because the bonding layer is too thin, and it is also possible to prevent resin dents that are generated when the container is formed because the bonding layer is too thick.

另外,在上述構成的多層樹脂薄膜中,所述苯乙烯類樹脂層由含有品質百分比為4~8%的順丁橡膠成分的苯乙烯類樹脂形成。採用這樣構成的多層樹脂薄膜來成型時,可防止因順丁橡膠成分的含有量過低引起容器無法具有足夠的強度,同時也可防止因順丁橡膠成分的含有量過高引起使用熱板進行熱成型時發生的熱板粘附等不良情況。 In the multilayer resin film having the above-mentioned configuration, the styrene-based resin layer is formed of a styrene-based resin containing a butadiene rubber component in a mass percentage of 4 to 8%. When the multilayer resin film having such a structure is used for molding, it can prevent the container from having insufficient strength due to the low content of the butadiene rubber component, and can also prevent the use of a hot plate due to the excessive content of the butadiene rubber component. Defects such as hot plate adhesion that occur during thermoforming.

更進一步,在上述構成的多層樹脂薄膜中,該多層樹脂薄膜的厚度為500~1200μm。採用這樣構成的多層樹脂薄膜,可防止因多層樹脂薄膜過薄導致的熱成型後容器強度不夠,同時也可防止因多層樹脂薄膜過厚導致的熱成型時薄膜厚度方向難以充分傳導熱量,從而可能發生成型缺陷以及容器的製造成本變高。 Furthermore, in the multilayer resin film having the above configuration, the thickness of the multilayer resin film is 500 to 1200 μm. By adopting the multilayer resin film having such a structure, it is possible to prevent insufficient strength of the container after thermoforming caused by the multilayer resin film being too thin, and it is also possible to prevent heat from being sufficiently transmitted in the thickness direction of the film during thermoforming caused by the multilayer resin film being too thick, which may possibly A molding defect occurs and the manufacturing cost of the container becomes high.

本發明還提供一種採用上述構成的多層樹脂薄膜成型的成型容器。這樣得到的成型容器,由於具有優異的氧氣阻隔性以及水蒸氣阻隔性,同時,即使在高濕度環境下也能維持較高的氧氣阻隔性,因此,可 防止因成型容器內物品的氧化而造成的品質降低,同時成型容器的成型性也很好。 The present invention also provides a molded container formed by using the multilayer resin film configured as described above. The molded container thus obtained has excellent oxygen barrier properties and water vapor barrier properties, and can maintain high oxygen barrier properties even in a high-humidity environment. Prevents the quality degradation caused by the oxidation of the articles in the molded container, and the moldability of the molded container is also good.

10a、10b‧‧‧水蒸氣阻隔性樹脂層 10a, 10b‧‧‧‧Water vapor barrier resin layer

11a、11b、11c‧‧‧接合層 11a, 11b, 11c‧‧‧ bonding layer

12‧‧‧氧氣阻隔性樹脂層 12‧‧‧ oxygen barrier resin layer

13‧‧‧苯乙烯類樹脂層 13‧‧‧styrene resin layer

20‧‧‧成型容器 20‧‧‧formed container

圖1,為本發明一實施例的多層樹脂薄膜的層疊結構的縱向剖視示意圖。 FIG. 1 is a schematic longitudinal sectional view of a multilayer structure of a multilayer resin film according to an embodiment of the present invention.

圖2,為另一實施例的多層樹脂薄膜的層疊結構的縱向剖視示意圖。 FIG. 2 is a schematic longitudinal sectional view of a multilayer structure of a multilayer resin film according to another embodiment.

圖3,為本發明一實施例的成型容器的立體示意圖。 FIG. 3 is a schematic perspective view of a molded container according to an embodiment of the present invention.

以下,就本發明一實施例的多層樹脂薄膜的結構以及將該多層樹脂薄膜成型製成的成型容器進行詳細說明。 Hereinafter, the structure of a multilayer resin film according to an embodiment of the present invention and a molding container formed by molding the multilayer resin film will be described in detail.

如圖1所示,本發明一實施例的多層樹脂薄膜,其結構為在氧氣阻隔性樹脂層12的兩面,分別隔著接合層11a、11b,層疊有作為最表層的水蒸氣阻隔性樹脂層10a以及作為中間層的水蒸氣阻隔性樹脂層10b,在水蒸氣阻隔性樹脂層10b上隔著接合層11c層疊有作為基材層的苯乙烯類樹脂層13。最表層和中間層的水蒸氣阻隔性樹脂層10a、10b的厚度合計設定為50~300μm,且基材層的苯乙烯類樹脂層13的厚度設定為200~900μm。 As shown in FIG. 1, the multilayer resin film according to an embodiment of the present invention has a structure in which a water vapor barrier resin layer as the outermost layer is laminated on both sides of the oxygen barrier resin layer 12 via bonding layers 11 a and 11 b, respectively. 10a and the water vapor barrier resin layer 10b as an intermediate layer, a styrene resin layer 13 as a base material layer is laminated on the water vapor barrier resin layer 10b via a bonding layer 11c. The total thickness of the water vapor barrier resin layers 10a and 10b in the outermost layer and the intermediate layer is set to 50 to 300 μm in total, and the thickness of the styrene-based resin layer 13 in the base layer is set to 200 to 900 μm.

作為所述水蒸氣阻隔性樹脂層10a、10b所用的烯烴類樹脂,包括但不限於乙烯、丙烯、正丁烯等含碳數在2~8左右的烯烴均聚合物。水蒸氣阻隔性樹脂層10a、10b形成為多層樹脂薄膜的最表層與中間層,若無特別說明,最表層設定為與內容物接觸的層,但並不做特別限定。 The olefin-based resin used in the water vapor-barrier resin layers 10a and 10b includes, but is not limited to, olefin homopolymers having a carbon number of about 2 to 8 such as ethylene, propylene, and n-butene. The water vapor barrier resin layers 10a and 10b are formed as the outermost layer and the intermediate layer of the multilayer resin film. Unless otherwise specified, the outermost layer is set to be a layer in contact with the contents, but it is not particularly limited.

作為最表層的水蒸氣阻隔性樹脂層10a,其厚度設定為與作為中間層的水蒸氣阻隔性樹脂層10b相同,或設定為比作為中間層的水蒸氣阻隔性樹脂層10b厚。另外,中間層的水蒸氣阻隔性樹脂層10b的厚度設定在200μm以上,最表層與中間層的水蒸氣阻隔性樹脂層10a、10b的厚度合計設定在50~300μm(優選為70~200μm)。若該厚度合計不到50μm則成型後會出現厚度過薄的部分,從而無法充分發揮水蒸氣阻隔性,另外,若該厚度合計超過300μm,則熱成型時的最佳溫度範圍將會縮小,從而可能無法進行穩定的成型。 The thickness of the water vapor barrier resin layer 10a as the outermost layer is set to be the same as that of the water vapor barrier resin layer 10b as the intermediate layer, or it is set to be thicker than the water vapor barrier resin layer 10b as the intermediate layer. The thickness of the water vapor barrier resin layer 10b in the intermediate layer is set to 200 μm or more, and the total thickness of the water vapor barrier resin layers 10a and 10b in the outermost layer and the intermediate layer is set to 50 to 300 μm (preferably 70 to 200 μm). If the total thickness is less than 50 μm, an excessively thin portion may appear after molding, so that the water vapor barrier property cannot be fully exerted. If the total thickness exceeds 300 μm, the optimal temperature range during thermoforming will be reduced, and Stable molding may not be possible.

作為構成接合層11a、11b、11c的樹脂以改性烯烴聚合物為宜。作為構成接合層的改性烯烴聚合物的代表性物質可以列舉下面一些:即,乙烯、丙烯、正丁烯等含碳數在2~8左右的烯烴均聚物;以及這些烯烴與乙烯、丙烯、正丁烯、異戊烯、正戊烯、4-甲基戊烯-1、1-己烯、1-辛烯、正癸烯等含碳數在2~20左右的其他烯烴或乙酸乙烯酯、氯乙烯、丙烯酸、2-甲基丙烯酸、丙烯酸酯、甲基丙烯酸甲酯、苯乙烯等乙烯化合物的共聚物等的烯烴類樹脂;或將乙丙共聚物、乙烯-丙烯-二烯三元共聚物、乙烯-1-丁烯共聚物、丙烯-1-丁烯共聚物等烯烴橡膠通過與丙烯酸、甲基丙烯酸、巴豆酸、異巴豆酸、馬來酸、富馬酸、衣康酸、檸康酸、四氫鄰苯二甲酸等不飽和羧酸、或者羧酸鹵化物、醯胺、醯亞胺、無水物、酯等衍生物(具體有丙二醯氯、馬來醯亞胺、無水馬來酸、無水檸康酸、馬來酸單甲酯、順丁烯二酸二甲酯、馬來酸縮水甘油酯等)在接枝反應條件下改性而得到的物質。 The resin constituting the bonding layers 11a, 11b, and 11c is preferably a modified olefin polymer. Representative examples of the modified olefin polymer constituting the bonding layer include the following: namely, olefin homopolymers having a carbon number of about 2 to 8 such as ethylene, propylene, and n-butene; and these olefins and ethylene and propylene Other olefins or vinyl acetates with a carbon number of about 2 to 20, such as n-butene, isopentene, n-pentene, 4-methylpentene-1, 1-hexene, 1-octene, n-decene, etc. Olefin resins such as esters, vinyl chloride, acrylic acid, 2-methacrylic acid, acrylate, methyl methacrylate, and copolymers of ethylene compounds such as styrene; or ethylene-propylene copolymers, ethylene-propylene-diene trienes Olefin rubbers such as meta-copolymers, ethylene-1-butene copolymers, and propylene-1-butene copolymers are compatible with acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, maleic acid, fumaric acid, and itaconic acid Unsaturated carboxylic acids such as citraconic acid, tetrahydrophthalic acid, or derivatives of carboxylic acid halides, fluorenamines, fluorenimines, anhydrous substances, esters, etc. (specifically, malondichloride, maleimide , Anhydrous maleic acid, anhydrous citraconic acid, monomethyl maleate, dimethyl maleate, maleic acid shrinkage ) Modifying substance under graft reaction conditions to give the ester oil and the like.

作為改性烯烴聚合物,則以用不飽和羧酸或其無水物,特別 是馬來酸或其無水物進行改性而成的乙烯類樹脂、丙烯類樹脂、乙烯-丙烯或正丁烯共聚物橡膠為宜。 As the modified olefin polymer, an unsaturated carboxylic acid or an anhydride thereof is used, and in particular It is preferably an ethylene-based resin, propylene-based resin, ethylene-propylene, or n-butene copolymer rubber modified by maleic acid or its anhydrous substance.

由改性烯烴聚合物構成的接合層11a、11b、11c,其厚度分別設定為10~50μm(優選為20~40μm)。若該厚度不到10μm,則可能無法得到足夠的層間接合強度,此外,若該厚度超過50μm,則可能在熱成型容器的衝壓時發生樹脂凹痕。 The thicknesses of the bonding layers 11a, 11b, and 11c made of a modified olefin polymer are set to 10 to 50 μm (preferably 20 to 40 μm). When the thickness is less than 10 μm, sufficient interlayer bonding strength may not be obtained. In addition, when the thickness is more than 50 μm, resin dents may occur when the thermoformed container is pressed.

作為構成氧氣阻隔性樹脂層12的氧氣阻隔性樹脂,其代表性物質包括但不限於乙烯-乙烯醇共聚物樹脂、聚醯胺樹脂等。其中,從加工性及成型性方面考慮,以乙烯-乙烯醇共聚物樹脂為宜。 As the oxygen-barrier resin constituting the oxygen-barrier resin layer 12, representative materials include, but are not limited to, ethylene-vinyl alcohol copolymer resin, polyamide resin, and the like. Among these, an ethylene-vinyl alcohol copolymer resin is preferable from the viewpoint of processability and moldability.

乙烯-乙烯醇共聚物樹脂通常是將乙烯-乙酸乙烯共聚物皂化後得到的物質,為使其兼備氧氣阻隔性、加工性、成型性,乙烯含量應在10~65mol%(優選為20~50mol%),且皂化度應在90%以上(優選為95%以上)。 The ethylene-vinyl alcohol copolymer resin is usually obtained by saponifying an ethylene-vinyl acetate copolymer. In order to have oxygen barrier properties, processability, and moldability, the ethylene content should be 10 to 65 mol% (preferably 20 to 50 mol). %), And the degree of saponification should be above 90% (preferably above 95%).

此外,作為聚醯胺樹脂可以列舉以下這些:即,己內醯胺、氮雜環十三烷-2-酮等的內醯胺聚合物;6-氨基己酸、11-氨基十一酸、12-氨基十二酸等的氨基酸酯聚合物;1,6-已烷二胺、1,10-二氨基癸烷、十二烷二元胺、2,2,4-或2,4,4-三甲基己二胺等的脂肪二胺,1,3-或1,4-雙(氨基甲基)環己烷、4,4’-二氨基二環己基甲烷等的脂環胺,間苯二甲胺或對苯二甲胺等芳香族二胺等的二胺單位,與己二酸、辛二酸、癸二酸等的脂肪族羧酸、環己烷二甲酸等的脂環羧酸、對苯二甲酸、異酞酸等芳香族羧酸等的羧酸單位形成的縮聚物;以及上述物質的共聚物等。 Examples of the polyamidoresin resin include: caprolactam, azatridecane-2-one, and the like; and 6-aminohexanoic acid, 11-aminoundecanoic acid, Amino acid ester polymers such as 12-aminododecanoic acid; 1,6-hexanediamine, 1,10-diaminodecane, dodecane diamine, 2,2,4- or 2,4,4 -Fatty diamines such as trimethylhexadiamine, alicyclic amines such as 1,3- or 1,4-bis (aminomethyl) cyclohexane, 4,4'-diaminodicyclohexylmethane, etc. Diamine units such as aromatic diamines such as xylylenediamine and p-xylylenediamine, and alicyclic carboxylic acids such as aliphatic carboxylic acids such as adipic acid, suberic acid, and sebacic acid, and cyclohexanedicarboxylic acid. Polycondensates formed from carboxylic acid units such as aromatic carboxylic acids such as acids, terephthalic acid, and isophthalic acid; and copolymers of the foregoing.

作為聚醯胺樹脂,具體有尼龍6、尼龍9、尼龍11、尼龍12、 尼龍66、尼龍610、尼龍611、尼龍612、尼龍6T、尼龍6I、尼龍MXD6、尼龍6/66、尼龍6/610、尼龍6/6T、尼龍6I/6T等,其中尼龍6、尼龍MXD6為最佳。 Specific examples of the polyamide resin include nylon 6, nylon 9, nylon 11, nylon 12, Nylon 66, nylon 610, nylon 611, nylon 612, nylon 6T, nylon 6I, nylon MXD6, nylon 6/66, nylon 6/610, nylon 6 / 6T, nylon 6I / 6T, etc., among which nylon 6, nylon MXD6 are the most popular good.

氧氣阻隔性樹脂層12的厚度,設定在10~50μm(優選為20~40μm)。若該厚度不到10μm,則可能無法達到防止成型容器內容物因氧化導致品質降低的氧氣阻隔性能,此外,若該厚度超過50μm,則可能在熱成型容器的衝壓時發生樹脂凹痕。 The thickness of the oxygen-barrier resin layer 12 is set to 10 to 50 μm (preferably 20 to 40 μm). If the thickness is less than 10 μm, the oxygen barrier performance of preventing the quality of the contents of the molded container from being deteriorated due to oxidation may not be achieved. In addition, if the thickness is more than 50 μm, resin dents may occur when the thermoformed container is pressed.

作為構成苯乙烯類樹脂層13的苯乙烯類樹脂可以列舉以下這些:即,苯乙烯、2-苯基-1-丙烯、4-甲基苯乙烯、二甲基苯乙烯、對叔丁基苯乙烯、氯苯乙烯等苯乙烯類單體的均聚物或共聚物;如苯乙烯-丙烯腈共聚物(AS樹脂)等這些苯乙烯類單體與其他單體的共聚物,或前述苯乙烯類單體與其他聚合物,例如在存在聚丁二烯、聚苯乙烯丁二烯共聚物、聚異戊二烯、聚氯丁二烯等二烯類橡膠聚合物的情況下進行接枝聚合的接枝聚合物,例如高抗沖聚苯乙烯(HIPS樹脂)、苯乙烯-丙烯腈接枝聚合物(ABS樹脂)等。 Examples of the styrene-based resin constituting the styrene-based resin layer 13 include styrene, 2-phenyl-1-propene, 4-methylstyrene, dimethylstyrene, and p-tert-butylbenzene. Homopolymers or copolymers of styrenic monomers such as ethylene and chlorostyrene; copolymers of these styrenic monomers and other monomers such as styrene-acrylonitrile copolymer (AS resin), or the aforementioned styrene Monomers and other polymers, such as graft polymerization in the presence of polybutadiene, polystyrene butadiene copolymer, polyisoprene, polychloroprene and other diene rubber polymers Graft polymers such as high impact polystyrene (HIPS resin), styrene-acrylonitrile graft polymer (ABS resin), and the like.

若從剛性、成型性角度來看,苯乙烯類樹脂中以聚苯乙烯(GPPS樹脂)、高抗沖聚苯乙烯(HIPS樹脂)為宜。 From the viewpoint of rigidity and moldability, polystyrene (GPPS resin) and high-impact polystyrene (HIPS resin) are preferred among the styrene resins.

苯乙烯類樹脂,以順丁橡膠成分的含有品質百分比在4~8%為宜。順丁橡膠成分含量可通過混合GPPS與HIPS的簡單方法進行調整,但也可在製造HIPS的階段進行調整。若上述品質百分比不到4%,則可能無法達到足夠的容器強度,若上述品質百分比超過8%,則在使用熱板進行熱成型時尤其可能發生熱板粘附等不良情況。 The styrene-based resin preferably contains 4 to 8% by mass of the butadiene rubber component. The content of the butadiene rubber component can be adjusted by a simple method of mixing GPPS and HIPS, but it can also be adjusted at the stage of manufacturing HIPS. If the above-mentioned quality percentage is less than 4%, sufficient container strength may not be achieved. If the above-mentioned quality percentage is more than 8%, inconveniences such as hot-plate adhesion may occur especially when using hot-plate for thermoforming.

所述苯乙烯類樹脂層13中可根據需要在不妨礙本發明效果的範圍內添加顏料、染料等著色劑,矽油或烷基酯類脫模劑,玻璃纖維等纖維狀強化劑,滑石、高嶺土、方石英等粒狀潤滑劑,磺酸與鹼金屬等的鹽化合物或聚二醇等帶電防止劑,紫外線吸收劑與抗菌劑等添加劑。同時,也可混合使用本發明的多層樹脂薄膜及成型容器的製造工序中產生的廢料樹脂。 The styrene-based resin layer 13 may be added with colorants such as pigments and dyes, silicone oil or alkyl ester-based release agents, fiber-like reinforcing agents such as glass fiber, talc, kaolin, and the like, as long as they do not hinder the effects of the present invention. Granular lubricants such as cristobalite, salt compounds such as sulfonic acids and alkali metals, or antistatic agents such as polyglycols, ultraviolet absorbers and antibacterial agents. At the same time, the multilayer resin film of the present invention and the waste resin generated in the manufacturing process of the molded container may be mixed and used.

所述苯乙烯類樹脂層13的厚度,設定為200~900μm(優選為300~700μm)。若該厚度不到200μm,則可能導致成型後容器各部分無法達到均等厚度,且無法達到優異的熱成型性,同時,若該厚度超過900μm,則熱成型時薄膜厚度方向難以充分傳導熱量,從而可能發生成型缺陷。 The thickness of the styrene-based resin layer 13 is set to 200 to 900 μm (preferably 300 to 700 μm). If the thickness is less than 200 μm, it may not be possible to achieve uniform thickness of each part of the container after molding, and excellent thermoformability may not be achieved. At the same time, if the thickness exceeds 900 μm, it is difficult to conduct heat sufficiently in the thickness direction of the film during thermoforming. Molding defects may occur.

因此,本發明一實施例中,多層樹脂薄膜的層結構如前所述,為水蒸氣阻隔性樹脂層/接合層/氧氣阻隔性樹脂層/接合層/水蒸氣阻隔性樹脂層/接合層/苯乙烯類樹脂層的結構,簡單來說為最表層/接合層/氧氣阻隔層/接合層/中間層/接合層/基材層。同時,作為由苯乙烯類樹脂構成的基材層也可由混合了本發明的多層樹脂薄膜,或成型容器製造工序中產生的廢料樹脂構成的層與僅有苯乙烯類樹脂的層進行層疊來構成。 Therefore, in one embodiment of the present invention, the layer structure of the multilayer resin film is the water vapor barrier resin layer / bonding layer / oxygen barrier resin layer / bonding layer / water vapor barrier resin layer / bonding layer / The structure of the styrenic resin layer is simply the outermost layer / bonding layer / oxygen barrier layer / bonding layer / intermediate layer / bonding layer / base material layer. At the same time, the base material layer composed of a styrenic resin may be formed by laminating a layer composed of the multilayer resin film of the present invention or a waste resin generated in the manufacturing process of a molding container and a layer of only a styrenic resin. .

本發明的多層樹脂薄膜的厚度,設定為500~1200μm(優選為700~1000μm)。若該厚度不到500μm,則可能導致熱成型後容器強度不夠,若該厚度超過1200μm,則熱成型時薄膜厚度方向難以充分傳導熱量,從而可能發生成型缺陷。同時,容器的製造成本可能變高。 The thickness of the multilayer resin film of the present invention is set to 500 to 1200 μm (preferably 700 to 1000 μm). If the thickness is less than 500 μm, the strength of the container after thermoforming may be insufficient. If the thickness exceeds 1200 μm, it is difficult to sufficiently conduct heat in the thickness direction of the film during thermoforming, and molding defects may occur. At the same time, the manufacturing cost of the container may become high.

作為本發明的多層樹脂薄膜的成型方法,無特別限定,可使 用常規方法。例如,使用4台或更多的單軸擠出機,熔融擠出各原料樹脂,並通過餵料塊(Feed-block)與T型口模得到多層樹脂薄膜的方法,或通過多流道模頭得到多層樹脂薄膜的方法等。 The method for forming the multilayer resin film of the present invention is not particularly limited, and can be Use conventional methods. For example, a method of using four or more uniaxial extruders to melt extrude each raw resin and obtain a multilayer resin film through a feed-block and a T-die, or through a multi-runner die Method for obtaining a multilayer resin film and the like.

本發明一實施例的成型容器20,如圖3所示,是由本發明的多層樹脂薄膜熱成型加工而成的。作為熱成型的方法,可以列舉通常的真空成型、壓力成型,或使柱塞接觸薄膜的一面進行成型的柱塞助壓法,或使一對公母模接觸薄膜兩面進行成型,即被稱為對模成型的成型方法等。但方法不僅限於此。同時,作為在成型前將薄膜加熱軟化的方法,可使用通過紅外線加熱器進行輻射加熱的非接觸加熱,或直接使薄膜與加熱完成的熱板進行接觸使其軟化的熱板加熱等眾所周知的薄膜加熱方式。 As shown in FIG. 3, a molded container 20 according to an embodiment of the present invention is formed by thermoforming a multilayer resin film of the present invention. Examples of the thermoforming method include a common vacuum forming method, a pressure forming method, a plunger assisting method in which a plunger is brought into contact with one side of a film, or a pair of male and female dies are brought into contact with both sides of a film to be formed. Counter-molding molding methods. But the method is not limited to this. Meanwhile, as a method of heating and softening the film before molding, non-contact heating using radiant heating by an infrared heater, or hot plate heating in which the film is brought into contact with the heated hot plate to soften it, can be used. heating method.

另外,熱成型時的成型溫度,會考慮樹脂的熔點等情況進行合理設置,但薄膜加熱溫度過低會造成加熱成型後容器的賦形狀態不充分,若薄膜加熱溫度過高則會導致發生附著在熱板上等不良情況,因此需要設置為適宜溫度。 In addition, the molding temperature during thermoforming is reasonably set in consideration of the melting point of the resin, etc. However, if the film heating temperature is too low, the shape of the container after heating molding is insufficient, and if the film heating temperature is too high, it will cause adhesion. In the case of a hot plate or the like, it is necessary to set an appropriate temperature.

以下將列舉實施例以及比較例,以進一步對本發明進行具體說明,但本發明不限定在實施例等內容的範圍內。 Examples and comparative examples will be listed below to further specifically describe the present invention, but the present invention is not limited to the scope of the examples and the like.

實施例中使用的樹脂原料如下所示。 The resin raw materials used in the examples are shown below.

(1)水蒸氣阻隔性樹脂層 (1) Water vapor barrier resin layer

HDPE樹脂:“8050”(台塑公司(Formosa Polypropylene Co.,Ltd.)生產,MI:6.0g/10min.(190℃,2.16kgf)) HDPE resin: "8050" (produced by Formosa Polypropylene Co., Ltd., MI: 6.0g / 10min. (190 ° C, 2.16kgf))

PP樹脂:“HJ730L”(Samsung Total公司生產,MI:5.0g/10min(190℃,2.16kgf),IsotacticHomoPP) PP resin: "HJ730L" (produced by Samsung Total, MI: 5.0g / 10min (190 ° C, 2.16kgf), IsotacticHomoPP)

(2)氧氣阻隔性樹脂層 (2) Oxygen-barrier resin layer

乙烯-乙烯醇共聚物(EVOH)“EVAL J171B” (Kuraray公司生產,MI:1.7g/10min(190℃,2.16kgf),乙烯含量32mol%) Ethylene-vinyl alcohol copolymer (EVOH) "EVAL J171B" (Produced by Kuraray, MI: 1.7g / 10min (190 ° C, 2.16kgf), ethylene content 32mol%)

(3)接合層 (3) Joint layer

改性烯烴聚合物(改性PO)“MODIC F502C” (三菱化學公司生產,MI:1.3g/10min(190℃,2.16kgf))) Modified olefin polymer (modified PO) "MODIC F502C" (Mitsubishi Chemical Corporation, MI: 1.3g / 10min (190 ° C, 2.16kgf))

(4)苯乙烯類樹脂層 (4) Styrene resin layer

HIPS樹脂:“4241”(Total Petrochemicals公司產,MI:4.0g/10min.(200℃,5.0kgf)) HIPS resin: "4241" (manufactured by Total Petrochemicals, MI: 4.0g / 10min. (200 ° C, 5.0kgf))

另外,在實施例中,多層樹脂薄膜在以下條件下加熱成型,得到圖3所示的優酪乳用容器。 Moreover, in the Example, the multilayer resin film was heat-molded under the following conditions, and the container for buttermilk shown in FIG. 3 was obtained.

(1)使用設備:淺野研究所生產的真空壓空成型機 (1) Equipment: Vacuum pressure molding machine produced by Asano Research Institute

(2)加熱器:非接觸式遠紅外加熱器 (2) Heater: Non-contact far-infrared heater

(3)薄膜表面溫度:根據薄膜的構成調整為適宜的薄膜表面溫度 (3) Film surface temperature: Adjusted to an appropriate film surface temperature according to the composition of the film

對得到的多層樹脂薄膜以及容器,採用以下方法進行評價。評價結果表示在表1及表2中。 The obtained multilayer resin film and container were evaluated by the following methods. The evaluation results are shown in Tables 1 and 2.

(1)水蒸氣透過率測定 (1) Measurement of water vapor transmission rate

通過以下方法對薄膜的水蒸氣透過率進行測定。 The water vapor transmission rate of the film was measured by the following method.

〔測定方法〕根據GB/T 1037標準 [Measurement method] According to GB / T 1037 standard

使用設備:Labthink公司生產的W3/031檢測裝置 Equipment: W3 / 031 detection device produced by Labthink

測定條件:40℃×90%R.H. Measurement conditions: 40 ℃ × 90% R.H.

另外,採用以下標準對水蒸氣透過率進行評價。 The water vapor transmission rate was evaluated using the following criteria.

水蒸氣透過率若在3.0g/m2‧day以下,那麼多層樹脂薄膜的水蒸氣阻隔性合格,水蒸氣透過率高於3.0g/m2‧day時,則多層樹脂薄膜的水蒸氣阻隔性不合格。 If the water vapor permeability of 3.0g / m 2 ‧day less, the water vapor barrier property of the multilayer resin film passing water vapor transmission rate greater than 3.0g / m 2 ‧day, the water vapor barrier multilayer resin film Failed.

(2)氧氣透過率測定 (2) Measurement of oxygen transmission rate

通過以下方法對薄膜的氧氣透過率進行測定。對放置于以下高溫高濕環境中前後的氧氣透過率進行測定。 The oxygen transmission rate of the film was measured by the following method. The oxygen transmission rate before and after being placed in the following high temperature and high humidity environment was measured.

〔測定方法〕根據GB/T 1038標準 [Measurement method] According to GB / T 1038 standard

使用設備:Labthink公司生產的VAC-V1檢測裝置 Equipment: VAC-V1 detection device produced by Labthink

測定條件:23℃×65%R.H. Measurement conditions: 23 ℃ × 65% R.H.

樣品設置:鑒於容器成型後的實用性,在設置樣品時,確保朝向能夠使氧氣從薄膜樣品的基材層側透過。 Sample setting: In view of the practicality of the container after molding, when setting the sample, make sure to face it so that oxygen can pass through the substrate layer side of the thin film sample.

〔放入高溫高濕環境〕 〔Placed in high temperature and high humidity environment〕

於薄膜端部粘貼鋁制膠帶,消除因薄膜端部水蒸氣滲透的影響,並在端部無法接觸高溫高濕環境的狀態下,在40℃×90%R.H.環境下放置6小時。對放置於該環境前後的氧氣透過率進行測定。 Attach aluminum tape to the end of the film to eliminate the influence of water vapor permeation at the end of the film, and leave the end for 6 hours at 40 ℃ × 90% R.H. In a state where the end cannot contact the high temperature and high humidity environment. The oxygen transmission rate before and after being left in this environment was measured.

另外,採用以下標準對氧氣透過率進行評價。 In addition, the following criteria were used to evaluate the oxygen transmission rate.

氧氣透過率若在5.0cc/m2‧day以下,那麼多層樹脂薄膜的氧氣阻隔性合格,氧氣透過率高於5.0cc/m2‧day時,則多層樹脂薄膜的氧氣阻隔性不合格。 If the oxygen transmission rate is below 5.0 cc / m 2 ‧day, the oxygen barrier properties of the multilayer resin film are acceptable. If the oxygen transmission rate is higher than 5.0 cc / m 2 ‧day, the oxygen barrier properties of the multilayer resin film are unacceptable.

另外,採用以下標準對放入高溫高濕環境前後的氧氣透過率差異進行評價。 In addition, the following criteria were used to evaluate the difference in oxygen transmission rate before and after exposure to a high temperature and high humidity environment.

放入高溫高濕環境前後的氧氣透過率差異若在1.0cc/m2‧day以下,那麼多層樹脂薄膜的氧氣阻隔性合格,放入高溫高濕環境前後的氧氣透過率差異高於1.0cc/m2‧day時,則多層樹脂薄膜的氧氣阻隔性不合格。 If the difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment is less than 1.0cc / m 2 ‧day, then the oxygen barrier properties of the multilayer resin film are qualified. The difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment is higher than 1.0cc / At m 2 ‧day, the oxygen barrier property of the multilayer resin film is unsatisfactory.

(3)成型性 (3) Moldability

使用成型圖3所示容器的成型模具,通過以下標準對熱成型時的成型性進行評估。 Using the mold for molding the container shown in FIG. 3, the moldability at the time of thermoforming was evaluated by the following criteria.

A:成型性良好 A: Good moldability

B:成型後容器的部分部位存在厚度較薄的情況 B: Some parts of the container are thin after molding

C:未得到如成型模具的賦形性。或發現成型外觀缺陷。 C: No formability such as a molding die was obtained. Or found the appearance defect.

<實施例1> <Example 1>

使用3台45mm單軸擠出機、1台65mm單軸擠出機、1台105mm單軸擠出機,通過餵料塊(Feed-block)法,在烯烴類樹脂中使用HDPE樹脂“8050”,得到具有水蒸氣阻隔性樹脂層10a為100μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為35μm/接合層11c為15μm/苯乙烯類樹脂層13為880μm的層結構,總厚度為1100μm(水蒸氣阻隔性樹脂層合計厚度為135μm)的多層樹脂薄膜。 HDPE resin "8050" was used in the olefin resin by the feed-block method using three 45mm uniaxial extruder, one 65mm uniaxial extruder, and one 105mm uniaxial extruder. 100 μm of water vapor barrier resin layer 10/15 μm of bonding layer 11 a / 40 μm of oxygen barrier resin layer 12/15 μm of bonding layer 11 b / 35 μm of water vapor barrier resin layer 10 b / 15 μm of bonding layer 11 c / The styrene-based resin layer 13 is a multilayer resin film having a layer structure of 880 μm and a total thickness of 1100 μm (the total thickness of the water vapor barrier resin layer is 135 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為0.8g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.12cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.32cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.20cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 0.8 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.12cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.32cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.20cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例2> <Example 2>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為80μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為35μm/接合層11c為15μm/苯乙烯類樹脂層13為900μm的層結構,總厚度為1100μm(水蒸氣阻隔性樹脂層合 計厚度為115μm)的多層樹脂薄膜。 In the same manner as in Example 1, 80 μm of the water vapor barrier resin layer 10/15 μm of the bonding layer 11 a / 15 μm of the oxygen barrier resin layer 12/15 μm of the bonding layer 11 b / 35 μm of the water vapor barrier resin layer 10 b / The bonding layer 11c is 15 μm / The styrene-based resin layer 13 has a layer structure of 900 μm, and the total thickness is 1100 μm (water vapor barrier resin laminate Multilayer resin film with a thickness of 115 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為1.1g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.21cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.35cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.14cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 1.1 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.21cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.35cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.14cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例3> <Example 3>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為65μm/接合層11a為15μm/氧氣阻隔性樹脂層12為30μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為20μm/接合層11c為15μm/苯乙烯類樹脂層13為740μm的層結構,總厚度為900μm(水蒸氣阻隔性樹脂層合計厚度為85μm)的多層樹脂薄膜。 In the same manner as in Example 1, a water vapor barrier resin layer 10a was 65 μm / bonding layer 11a was 15 μm / oxygen barrier resin layer 12 was 30 μm / bonding layer 11 b was 15 μm / water vapor barrier resin layer 10b was 20 μm A multilayer resin film having a layer structure of 15 μm / the styrenic resin layer 13 and a bonding layer 11c of 740 μm and a total thickness of 900 μm (the total thickness of the water vapor barrier resin layer is 85 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為1.1g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.22cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.52cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.30cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 1.1 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.22cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.52cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.30cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例4> <Example 4>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為80μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為35μm/接合層11c為15μm/苯乙烯類樹脂層13為200μm的層結構,總厚度為400μm(水蒸氣阻隔性樹脂層合計厚度為115μm)的多層樹脂薄膜。 In the same manner as in Example 1, 80 μm of the water vapor barrier resin layer 10/15 μm of the bonding layer 11 a / 15 μm of the oxygen barrier resin layer 12/15 μm of the bonding layer 11 b / 35 μm of the water vapor barrier resin layer 10 b The multi-layer resin film having a layer structure of 15 μm / the bonding layer 11c and a 200 μm layer of the styrene resin layer 13 and a total thickness of 400 μm (the total thickness of the water vapor barrier resin layer is 115 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為1.0g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.18cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.30cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.12cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 1.0 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.18cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.30cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.12cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例5> <Example 5>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為30μm/接合層11a為15μm/氧氣阻隔性樹脂層12為30μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為20μm/接合層11c為15μm/苯乙烯類樹脂層13為775μm的層結構,總厚度為900μm(水蒸氣阻隔性樹脂層合計厚度為50μm)的多層樹脂薄膜。 In the same manner as in Example 1, 30 μm of water vapor barrier resin layer 10/15 μm of bonding layer 11a / 15 μm of oxygen barrier resin layer 12/15 μm of bonding layer 11b / 20 μm of water vapor barrier resin layer were obtained The / bonding layer 11c has a multilayer structure of 15 μm / the styrene resin layer 13 has a layer structure of 775 μm and a total thickness of 900 μm (the total thickness of the water vapor barrier resin layer is 50 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為1.5g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.22cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.58cc/m2‧day, 其放入高溫高濕環境前後的氧氣透過率差異為0.36cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 1.5 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.22cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.58cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.36cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例6> <Example 6>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為200μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為100μm/接合層11c為15μm/苯乙烯類樹脂層13為715μm的層結構,總厚度為1100μm(水蒸氣阻隔性樹脂層合計厚度為300μm)的多層樹脂薄膜。 In the same manner as in Example 1, 200 μm of water vapor barrier resin layer 10 a / 15 μm of bonding layer 11 a / oxygen barrier resin layer 12 of 40 μm / 15 μm of bonding layer 11 b / 100 μm of water vapor barrier resin layer 10 b The / bonding layer 11c has a multilayer structure of 15 μm / the styrene-based resin layer 13 has a layer structure of 715 μm and a total thickness of 1100 μm (the total thickness of the water vapor barrier resin layer is 300 μm).

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為0.8g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為0.11cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.23cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.12cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 0.8 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.11cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.23cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.12cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

<實施例7> <Example 7>

烯烴類樹脂使用PP樹脂“HJ730L”,其他方法與實施例1相同。得到層結構與實施例1相同的多層樹脂薄膜。 For the olefin resin, a PP resin "HJ730L" was used, and other methods were the same as those in Example 1. A multilayer resin film having the same layer structure as in Example 1 was obtained.

對於上述得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表1所示,其水蒸氣透過率為0.6g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表1所示,其放入高溫高濕環境前的氧氣透過率為 0.15cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.18cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.03cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 The water vapor transmission rate of the multilayer resin film obtained above was measured. As shown in Table 1, the water vapor transmission rate was 0.6 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 1, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.15 cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.18cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.03cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

另一方面,與實施例1相比,將水蒸氣阻隔性樹脂層的合計厚度或作為基材層的苯乙烯類樹脂層的厚度變小,或用苯乙烯類樹脂層來形成水蒸氣阻隔層等的變形例作為比較例,分別對其性能進行了以下的評價。 On the other hand, compared with Example 1, the total thickness of the water vapor barrier resin layer or the thickness of the styrene-based resin layer as the base material layer is reduced, or the water vapor barrier layer is formed by using a styrene-based resin layer. As a comparative example, the following modified examples were evaluated for their performance.

<比較例1> <Comparative example 1>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為30μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為100μm/接合層11c為15μm/苯乙烯類樹脂層13為975μm的層結構,總厚度為1100μm(水蒸氣阻隔性樹脂層合計厚度為40μm)的多層樹脂薄膜。 In the same manner as in Example 1, a water vapor barrier resin layer 10a was 30 μm / bonding layer 11a was 15 μm / oxygen barrier resin layer 12 was 40 μm / bonding layer 11b was 15 μm / water vapor barrier resin layer 10b was 100 μm The / bonding layer 11c has a multilayer structure of 15 μm / the styrene-based resin layer 13 has a layer structure of 975 μm and a total thickness of 1100 μm (the total thickness of the water vapor barrier resin layer is 40 μm).

與實施例1相比,本比較例的特徵在於將烯烴類樹脂層的合計厚度變小了。 Compared with Example 1, this comparative example is characterized by reducing the total thickness of the olefin-based resin layer.

對於由該比較例得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表2所示,其水蒸氣透過率為0.8g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表2所示,其放入高溫高濕環境前的氧氣透過率為0.26cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為1.68cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為1.42cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型 性被評價為A。 As a result of measuring the water vapor transmission rate of the multilayer resin film obtained in this comparative example, as shown in Table 2, the water vapor transmission rate was 0.8 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 2, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.26cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 1.68cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 1.42cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

與各評價標準對照的結果,其放入高溫高濕環境前後的氧氣透過率差異超過1.0cc/m2‧day,因此不合格,即不能適用于高溫高濕環境。 As a result of comparison with each evaluation standard, the difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment exceeds 1.0 cc / m 2 ‧day, so it is unqualified, that is, it cannot be applied to a high-temperature and high-humidity environment.

<比較例2> <Comparative example 2>

與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為100μm/接合層11a為15μm/氧氣阻隔性樹脂層12為40μm/接合層11b為15μm/水蒸氣阻隔性樹脂層10b為35μm/接合層11c為15μm/苯乙烯類樹脂層13為180μm的層結構,總厚度為400μm(水蒸氣阻隔性樹脂層合計厚度為135μm)的多層樹脂薄膜。 In the same manner as in Example 1, 100 μm of water vapor barrier resin layer 10a / 15 μm of bonding layer 11a / 40 μm of oxygen barrier resin layer 12/15 μm of bonding layer 11b / 35 μm of water vapor barrier resin layer were obtained A multilayer resin film having a layer structure of 15 μm / the bonding layer 11c and a 180 μm layer of the styrene-based resin layer 13 and a total thickness of 400 μm (the total thickness of the water vapor barrier resin layer is 135 μm).

與實施例1相比,本比較例的特徵在於將作為基材層的苯乙烯類樹脂層的厚度變小了。 Compared with Example 1, this comparative example is characterized in that the thickness of the styrene-based resin layer as the base material layer is reduced.

對於由該比較例得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表2所示,其水蒸氣透過率為1.1g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表2所示,其放入高溫高濕環境前的氧氣透過率為0.25cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為0.43cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為0.18cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為B。 As a result of measuring the water vapor transmission rate of the multilayer resin film obtained in this comparative example, as shown in Table 2, the water vapor transmission rate was 1.1 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 2, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.25 cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 0.43cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 0.18cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as B.

與各評價標準對照的結果,其成型性被評價為B,使用中,會因成型後的容器厚度較薄的地方開裂,從而水蒸氣或氧氣容易侵入造成阻隔性降低。 As a result of comparison with each evaluation standard, the moldability was evaluated as B, and during use, cracks occurred in the thinned part of the container after molding, so that water vapor or oxygen easily penetrated and reduced the barrier properties.

<比較例3> <Comparative example 3>

與實施例1同樣的方法,得到具有苯乙烯類樹脂層10a為65μm/接合層11a為15μm/氧氣阻隔性樹脂層12為30μm/接合層11b為15μm/苯乙烯類樹脂層10b為20μm/接合層11c為15μm/苯乙烯類樹脂層13為740μm的層結構,總厚度為900μm的多層樹脂薄膜。 In the same manner as in Example 1, 65 μm of styrene-based resin layer 10/15 μm of bonding layer 11a / 15 μm of oxygen-barrier resin layer 12/15 μm of bonding layer 11b / 20 μm of styrene-based resin layer 10 / bond The layer 11c has a multilayer structure of 15 μm / styrene-based resin layer 13 having a layer structure of 740 μm and a total thickness of 900 μm.

與實施例1相比,本比較例的特徵在於水蒸氣阻隔層是用苯乙烯類樹脂層來形成的。 Compared with Example 1, this comparative example is characterized in that the water vapor barrier layer is formed of a styrene-based resin layer.

對於由該比較例得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表2所示,其水蒸氣透過率為4.5g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表2所示,其放入高溫高濕環境前的氧氣透過率為0.22cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為2.56cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為2.34cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 As a result of measuring the water vapor transmission rate of the multilayer resin film obtained in this comparative example, as shown in Table 2, the water vapor transmission rate was 4.5 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 2, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.22cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 2.56cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 2.34cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

與各評價標準對照的結果,,其水蒸氣透過率超過3.0g/m2‧day,而且其放入高溫高濕環境前後的氧氣透過率差異超過1.0cc/m2‧day,因此不合格,即不能適用于高溫高濕環境。 As a result of comparison with various evaluation standards, its water vapor transmission rate exceeded 3.0g / m 2 ‧day, and its difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment exceeded 1.0cc / m 2 ‧day. That is not suitable for high temperature and high humidity environments.

<比較例4> <Comparative Example 4>

如圖2所示,與實施例1同樣的方法,得到具有水蒸氣阻隔性樹脂層10a為90μm/接合層11a為15μm/氧氣阻隔性樹脂層12為30μm/接合層11b為15μm/苯乙烯類樹脂層13為750μm的層結構,總厚度為900μm(水蒸氣阻隔性樹脂層合計厚度為90μm)的多層樹脂薄膜。 As shown in FIG. 2, in the same manner as in Example 1, 90 μm of water vapor barrier resin layer 10 a / 15 μm of bonding layer 11 a / 30 μm of oxygen barrier resin layer 12/15 μm of bonding layer 11 b / styrene The resin layer 13 is a multilayer resin film having a layer structure of 750 μm and a total thickness of 900 μm (the total thickness of the water vapor barrier resin layer is 90 μm).

與實施例1相比,本比較例的特徵在於只在氧氣阻隔性樹脂層的單面隔著接合層層疊有作為水蒸氣阻隔性樹脂層的烯烴類樹脂層。 Compared with Example 1, this comparative example is characterized in that an olefin-based resin layer as a water vapor-barrier resin layer is laminated on only one side of the oxygen-barrier resin layer with a bonding layer interposed therebetween.

對於由該比較例得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表2所示,其水蒸氣透過率為1.2g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表2所示,其放入高溫高濕環境前的氧氣透過率為0.19cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為1.45cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為1.26cc/m2‧day。另外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 As a result of measuring the water vapor transmission rate of the multilayer resin film obtained in this comparative example, as shown in Table 2, the water vapor transmission rate was 1.2 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 2, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 0.19cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. The rate is 1.45cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 1.26cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

與各評價標準對照的結果,,其放入高溫高濕環境前後的氧氣透過率差異超過1.0cc/m2‧day,因此不合格,即不能適用于高溫高濕環境。 As a result of comparison with various evaluation standards, the difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment exceeds 1.0 cc / m 2 ‧day, so it is unqualified, that is, it cannot be applied to a high-temperature and high-humidity environment.

<比較例5> <Comparative example 5>

與實施例1同樣的方法,得到僅有苯乙烯類樹脂層單層為900μm的樹脂薄膜。 In the same manner as in Example 1, a resin film having only a single layer of a styrene-based resin layer having a thickness of 900 μm was obtained.

與實施例1相比,本比較例的特徵在於僅由苯乙烯類樹脂層的單層構成。 Compared with Example 1, this comparative example is characterized by being composed of only a single layer of a styrene-based resin layer.

對於由該比較例得到的多層樹脂薄膜,進行水蒸氣透過率測定的結果,如表2所示,其水蒸氣透過率為6.5g/m2‧day。另外,對其進行氧氣透過率測定的結果,如表2所示,其放入高溫高濕環境前的氧氣透過率為335cc/m2‧day,其放入高溫高濕環境後的氧氣透過率為357cc/m2‧day,其放入高溫高濕環境前後的氧氣透過率差異為22cc/m2‧day。另 外,對採用該多層樹脂薄膜成型的容器的成型性也進行了評價,其成型性被評價為A。 As a result of measuring the water vapor transmission rate of the multilayer resin film obtained in this comparative example, as shown in Table 2, the water vapor transmission rate was 6.5 g / m 2 ‧day. In addition, as a result of measuring the oxygen transmission rate, as shown in Table 2, the oxygen transmission rate before being placed in a high-temperature and high-humidity environment was 335 cc / m 2 ‧day, and the oxygen transmission rate after being placed in a high-temperature and high-humidity environment. It is 357cc / m 2 ‧day, and the difference in oxygen transmission rate before and after being placed in a high temperature and high humidity environment is 22cc / m 2 ‧day. In addition, the moldability of a container molded using the multilayer resin film was also evaluated, and the moldability was evaluated as A.

與各評價標準對照的結果,,其水蒸氣透過率超過3.0g/m2‧day,其氧氣透過率大大超過5.0cc/m2‧day,而且其放入高溫高濕環境前後的氧氣透過率差異超過1.0cc/m2‧day,因此不合格,即不能適用于高溫高濕環境,且在一般環境下對水蒸氣以及氧氣的阻隔性也幾乎沒有。 As a result of comparison with various evaluation standards, its water vapor transmission rate exceeds 3.0g / m 2 ‧day, its oxygen transmission rate greatly exceeds 5.0cc / m 2 ‧day, and its oxygen transmission rate before and after being placed in a high temperature and high humidity environment The difference exceeds 1.0cc / m 2 ‧day, so it is unqualified, that is, it cannot be applied to high-temperature and high-humidity environments, and it has almost no barrier to water vapor and oxygen under normal circumstances.

Figure TW201800225AD00001
Figure TW201800225AD00001
Figure TW201800225AD00002
Figure TW201800225AD00002

Figure TW201800225AD00003
Figure TW201800225AD00003
Figure TW201800225AD00004
Figure TW201800225AD00004

根據上述實施例1-7以及比較例1-5的結果,具有在氧氣阻隔性樹脂層的兩側表面上,隔著接合層層疊上用作水蒸氣阻隔性樹脂層的由烯烴類樹脂構成的樹脂層,而在一側的烯烴類樹脂層表面上,層疊由苯乙烯類樹脂構成的樹脂層,在氧氣阻隔性樹脂層的兩側層疊的水蒸氣阻隔性樹脂層的厚度合計為50~300μm,且所述苯乙烯類樹脂層厚度為200~900μm這樣結構的多層樹脂薄膜,具有對水蒸氣以及氧氣較高的阻隔性,同時採用多層樹脂薄膜進行成型容器的成型時其成型性也很好。 According to the results of Examples 1-7 and Comparative Examples 1-5 described above, olefin-based resins which are used as water vapor-barrier resin layers are laminated on both surfaces of the oxygen-barrier resin layer through the bonding layer. A resin layer, and a resin layer made of a styrene resin is laminated on one surface of the olefin resin layer, and the total thickness of the water vapor barrier resin layer laminated on both sides of the oxygen barrier resin layer is 50 to 300 μm In addition, the multilayer resin film having a structure such that the thickness of the styrenic resin layer is 200 to 900 μm has a high barrier property against water vapor and oxygen. At the same time, the multilayer resin film is also used to form a molding container, and its moldability is also very good. .

而且,具有上述結構的多層樹脂薄膜,其放入高溫高濕環境前後的氧氣透過率差異維持在1.0cc/m2‧day以下。 Moreover, the multilayer resin film having the above-mentioned structure has a difference in oxygen transmission rate before and after being placed in a high-temperature and high-humidity environment of less than 1.0 cc / m 2 ‧day.

而且,具有上述結構的多層樹脂薄膜,其氧氣透過率維持在5.0cc/m2‧day以下,其水蒸氣透過率維持在3.0g/m2‧day以下。 Moreover, the multilayer resin film having the above structure has an oxygen transmission rate of 5.0 cc / m 2 ‧day or less and a water vapor transmission rate of 3.0 g / m 2 ‧ day or less.

因此,具有上述結構的多層樹脂薄膜,具備優異的氧氣阻隔性和水蒸氣阻隔性,即使在高濕環境下也能維持較高的氧氣阻隔性。 Therefore, the multilayer resin film having the above-mentioned structure has excellent oxygen barrier properties and water vapor barrier properties, and can maintain high oxygen barrier properties even in a high-humidity environment.

另外,具有上述結構的多層樹脂薄膜,所述氧氣阻隔性樹脂層的厚度設定在10~50μm。採用這樣構成的多層樹脂薄膜來成型時,可防止因氧氣阻隔性樹脂層太薄而引起成型容器內物品的氧化造成的品質降低,從而保證氧氣阻隔性能,同時也可防止因氧氣阻隔性樹脂層太厚而引起容器成型時產生的樹脂凹痕。 In the multilayer resin film having the above structure, the thickness of the oxygen-barrier resin layer is set to 10 to 50 μm. When the multilayer resin film having such a structure is used for molding, the quality of the oxygen-barrier resin layer can be prevented from being degraded due to the thinness of the oxygen-barrier resin layer, thereby ensuring the oxygen-barrier performance and preventing the oxygen-barrier resin layer. Too thick to cause resin dents during container molding.

另外,在上述構成的多層樹脂薄膜中,各個接合層的厚度分別設定在10~50μm。採用這樣構成的多層樹脂薄膜,可防止因接合層太薄而無法獲得足夠的層間接合強度,同時也可防止因接合層太厚而引起容器 成型時產生的樹脂凹痕。 Moreover, in the multilayer resin film of the said structure, the thickness of each bonding layer is set to 10-50 micrometers, respectively. With the multilayer resin film configured in this way, it is possible to prevent insufficient interlayer bonding strength due to the too thin bonding layer, and to prevent the container from being caused by the bonding layer being too thick. Resin dents generated during molding.

另外,在上述構成的多層樹脂薄膜中,所述苯乙烯類樹脂層由含有品質百分比為4~8%的順丁橡膠成分的苯乙烯類樹脂形成。採用這樣構成的多層樹脂薄膜來成型時,可防止因順丁橡膠成分的含有量過低引起容器無法具有足夠的強度,同時也可防止因順丁橡膠成分的含有量過高引起使用熱板進行熱成型時發生的熱板粘附等不良情況。 In the multilayer resin film having the above-mentioned configuration, the styrene-based resin layer is formed of a styrene-based resin containing a butadiene rubber component in a mass percentage of 4 to 8%. When the multilayer resin film having such a structure is used for molding, it can prevent the container from having insufficient strength due to the low content of the butadiene rubber component, and can also prevent the use of a hot plate due to the excessive content of the butadiene rubber component. Defects such as hot plate adhesion that occur during thermoforming.

更進一步,在上述構成的多層樹脂薄膜中,該多層樹脂薄膜的厚度為500~1200μm。採用這樣構成的多層樹脂薄膜,可防止因多層樹脂薄膜過薄導致的熱成型後容器強度不夠,同時也可防止因多層樹脂薄膜過厚導致的熱成型時薄膜厚度方向難以充分傳導熱量,從而可能發生成型缺陷以及容器的製造成本變高。 Furthermore, in the multilayer resin film having the above configuration, the thickness of the multilayer resin film is 500 to 1200 μm. By adopting the multilayer resin film having such a structure, it is possible to prevent insufficient strength of the container after thermoforming caused by the multilayer resin film being too thin, and it is also possible to prevent heat from being sufficiently transmitted in the thickness direction of the film during thermoforming caused by the multilayer resin film being too thick, which may possibly A molding defect occurs and the manufacturing cost of the container becomes high.

10a、10b‧‧‧水蒸氣阻隔性樹脂層 10a, 10b‧‧‧‧Water vapor barrier resin layer

11a、11b、11c‧‧‧接合層 11a, 11b, 11c‧‧‧ bonding layer

12‧‧‧氧氣阻隔性樹脂層 12‧‧‧ oxygen barrier resin layer

13‧‧‧苯乙烯類樹脂層 13‧‧‧styrene resin layer

Claims (8)

一種多層樹脂薄膜,在氧氣阻隔性樹脂層的兩面上隔著接合層,層疊有水蒸氣阻隔性樹脂層,而在一側的水蒸氣阻隔性樹脂層上,層疊有苯乙烯類樹脂層,其特徵在於:該水蒸氣阻隔性樹脂層為由烯烴類樹脂構成的層,在其氧氣阻隔性樹脂層的兩面層疊的水蒸氣阻隔性樹脂層的厚度合計為50~300μm,該苯乙烯類樹脂層厚度為200~900μm。 A multilayer resin film in which a water vapor barrier resin layer is laminated on both sides of an oxygen barrier resin layer with a bonding layer interposed therebetween, and a styrenic resin layer is laminated on one side of the water vapor barrier resin layer. The water vapor barrier resin layer is a layer composed of an olefin resin, and the total thickness of the water vapor barrier resin layer laminated on both sides of the oxygen barrier resin layer is 50 to 300 μm. The styrene resin layer The thickness is 200 to 900 μm. 如申請專利範圍第1項所述之多層樹脂薄膜,其中,該多層樹脂薄膜,其放入高溫高濕環境前後的氧氣透過率差異維持在1.0cc/m2‧day以下。 The multilayer resin film according to item 1 of the scope of the patent application, wherein the difference in oxygen transmission rate before and after the multilayer resin film is placed in a high-temperature and high-humidity environment is maintained below 1.0 cc / m 2 ‧day. 如申請專利範圍第1或2項所述之多層樹脂薄膜,其中,該多層樹脂薄膜,其氧氣透過率維持在5.0cc/m2‧day以下,且其水蒸氣透過率維持在3.0g/m2‧day以下。 The multilayer resin film according to item 1 or 2 of the scope of the patent application, wherein the multilayer resin film has an oxygen transmission rate of less than 5.0 cc / m 2 ‧day and a water vapor transmission rate of 3.0 g / m 2 Less than ‧day. 如申請專利範圍第1或2項所述之多層樹脂薄膜,其中,該氧氣阻隔性樹脂層的厚度設定為10~50μm。 The multilayer resin film according to item 1 or 2 of the scope of patent application, wherein the thickness of the oxygen-barrier resin layer is set to 10 to 50 μm. 如申請專利範圍第1或2項所述之多層樹脂薄膜,其中,各接合層的厚度設定為10~50μm。烯烴類樹脂層的厚度合計為10μm以上且不到50μm。 The multilayer resin film according to item 1 or 2 of the scope of patent application, wherein the thickness of each bonding layer is set to 10 to 50 μm. The total thickness of the olefin-based resin layer is 10 μm or more and less than 50 μm. 如申請專利範圍第1或2項所述之多層樹脂薄膜,其中,該苯乙烯類樹脂層由含有品質百分比為4~8%的順丁橡膠成分的苯乙烯類樹脂形成。 The multilayer resin film according to item 1 or 2 of the scope of the patent application, wherein the styrene-based resin layer is formed of a styrene-based resin containing a butadiene rubber component with a mass percentage of 4 to 8%. 如申請專利範圍第1或2項所述之多層樹脂薄膜,其中,該多層樹脂薄膜的厚度設定為500~1000μm。 The multilayer resin film according to item 1 or 2 of the scope of patent application, wherein the thickness of the multilayer resin film is set to 500 to 1000 μm. 一種成型容器,其為將如申請專利範圍第1至7項中任一項所述之多層樹脂薄膜進行熱成型而得到的。 A molded container obtained by thermoforming the multilayer resin film according to any one of claims 1 to 7 of the scope of patent application.
TW105119422A 2016-06-21 2016-06-21 Multilayer resin film and molded container TWI736536B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105119422A TWI736536B (en) 2016-06-21 2016-06-21 Multilayer resin film and molded container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105119422A TWI736536B (en) 2016-06-21 2016-06-21 Multilayer resin film and molded container

Publications (2)

Publication Number Publication Date
TW201800225A true TW201800225A (en) 2018-01-01
TWI736536B TWI736536B (en) 2021-08-21

Family

ID=61725058

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105119422A TWI736536B (en) 2016-06-21 2016-06-21 Multilayer resin film and molded container

Country Status (1)

Country Link
TW (1) TWI736536B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3967899B2 (en) * 2001-10-04 2007-08-29 ダイセルパックシステムズ株式会社 Laminated sheet for containers
CN104002509A (en) * 2013-02-22 2014-08-27 电气化学工业株式会社 Multilayer resin sheet for deep drawing molding, and molded container
WO2015012012A1 (en) * 2013-07-25 2015-01-29 電気化学工業株式会社 Thermoplastic resin sheet, and container produced from same

Also Published As

Publication number Publication date
TWI736536B (en) 2021-08-21

Similar Documents

Publication Publication Date Title
US9908311B2 (en) Water-repellent, thermoplastic resin sheet, and molded article
EP3439874B1 (en) Thermoplastic film for vacuum skin packaging, method of packaging and uses thereof
AU2008207514B2 (en) Gas-barrier shrink films for use in deep-drawing applications
WO2009128411A1 (en) Resin composition and multi-layered construct using the resin composition
JPH0458382B2 (en)
AU2007200812A1 (en) Gas-barrier shrink films and their use in deep-drawing applications
US11559972B2 (en) Multilayer structure and use of same
US20200180281A1 (en) Vacuum skin packages for soft products and vacuum skin method of packaging
JP6800972B2 (en) Multi-layer resin sheet and molding container
EP3446870A1 (en) Steam-stable semi-rigid multilayer structures
TWI736536B (en) Multilayer resin film and molded container
JP6261330B2 (en) Resin composition for packaging film for retort treatment and laminate for packaging film for retort treatment
JP5604021B1 (en) Molded body and manufacturing method thereof
JP6800971B2 (en) Multi-layer resin sheet and molding container
TWI712501B (en) Multilayer resin film and molded container
WO2021111815A1 (en) Multilayer resin sheet and molding container
WO2018110639A1 (en) Multilayer structure
TWI605941B (en) Multi-layer resin sheet for deep drawing and forming container
US20080131675A1 (en) Thermoformable Multilayer Film
JP7073638B2 (en) Multilayer film manufacturing method
WO2023042753A1 (en) Resin sheet and formed container
KR101578320B1 (en) Molded article and production method thereof
TW202222574A (en) Multilayer resin sheet and molded container
JP2022026118A (en) Laminate film and package
JP2022036164A (en) Laminate, blister container, and press-through package