TW201739592A - Device for controlling the thickness of a ceramic substrate and a preparation method thereof to adjust the thickness of the ceramic substrate by changing the height of the movable track unit - Google Patents
Device for controlling the thickness of a ceramic substrate and a preparation method thereof to adjust the thickness of the ceramic substrate by changing the height of the movable track unit Download PDFInfo
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本發明係關於一種刮刀成型之設備及製備方法,特別是關於一種可調控陶瓷基板厚度之設備及其製備方法。 The invention relates to a device for forming a doctor blade and a preparation method thereof, in particular to an apparatus for regulating the thickness of a ceramic substrate and a preparation method thereof.
刮刀成型設計種類很多,從國際專利查尋可知有:日本專利05347950號發表突起式刮刀,創造具有溝槽之陶瓷基板,以便生產長條型生坯陶瓷基板,日本專利10249824號專利發表具有閘門式的刮刀成型機台,用於生胚固化期便將其切割,以利後續加工,而韓國專利867510B1號專利發表,具有上下震幅轉子的刮刀平台,可以方便控制生胚厚度;另外在提升薄膜表面平坦度方面,如:日本專利2002205303號發表安裝低頻率震動裝置於刮刀成型平台下方,用以使陶瓷漿料混合完全,降低刮塗失敗的風險,日本專利2000334714號專利發表以旋轉攪拌裝置設置於刮刀之前,用以去除氣泡以及減小陶瓷漿料團聚,使得陶瓷生胚結構完整,日本專利2003181814號專利發表以雙層式刮刀結構設計,於第一片刮刀成型時減少陶瓷漿料團聚的現象,第二層刮刀才是將陶瓷漿料刮塗於平台上。 There are many types of blade forming designs. From the international patent search, it is known that Japanese Patent No. 05347950 discloses a protruding blade to create a ceramic substrate with grooves for producing a long green ceramic substrate. Japanese Patent No. 10,224,824 has a gate type. The blade forming machine is used for cutting the green mold to facilitate subsequent processing, and the Korean Patent No. 867510B1 discloses a doctor blade platform with an upper and lower amplitude rotor, which can conveniently control the thickness of the green embryo; In terms of flatness, for example, Japanese Patent No. 2002205303 discloses the installation of a low-frequency vibration device under the blade forming platform for completely mixing the ceramic slurry and reducing the risk of failure of the coating. Japanese Patent No. 2000334714 is issued as a rotary stirring device. Before scraping the blade, it is used to remove bubbles and reduce the agglomeration of the ceramic slurry, so that the ceramic green embryo structure is complete. Japanese Patent No. 2003181814 discloses a double-layer scraper structure design, which reduces the phenomenon of agglomeration of the ceramic slurry during the first blade forming. The second layer of scraper is to scrape the ceramic slurry onto the platform.
目前使用的刮刀成型系統以1.0mm以下為大宗,並利用離型膜收卷系統做連續化生產,雖然可以提高生產速率,但是由於需要快速乾燥去除溶劑,所以無法製備大於1.0mm以上之產品。 The currently used doctor blade forming system is mainly made up of 1.0 mm or less, and is continuously produced by using a release film winding system. Although the production rate can be increased, it is impossible to prepare a product larger than 1.0 mm because of the need for rapid drying to remove the solvent.
因此,若是產品端需求為大於1.0mm以上的陶瓷厚基板時,現今的主要採用以下兩種方法:(1)於刮刀成型製程後,再以冷壓法或熱壓法進行基板的疊壓成型,但透過疊壓成型法會造成成本與時間的浪費,並會降低厚膜基板的強度與特性。(2)於刮刀成型製程中,透過可調式移動刮刀來作厚度的微調,例如:日本專利1159204號於刮刀成型機加裝膜厚偵測裝置,對刮刀高度之升降作一補償控制,使膜厚厚度驅於一致,而中國專利203863801號藉由調節刮刀架上的微調螺母,可對氮化鋁的成膜厚度作調整。但對於膜厚大於1.0mm時,仍無法有效控制膜厚並成型,在邊緣處會有較薄面產生,中心至邊緣處膜厚分布不均,造成後續燒結條件控制以及平坦化製程作業上的困難。 Therefore, in the case of a ceramic thick substrate having a product end requirement of more than 1.0 mm, the following two methods are mainly used: (1) After the doctor blade forming process, the substrate is laminated by cold pressing or hot pressing. However, the lamination molding method wastes cost and time and reduces the strength and characteristics of the thick film substrate. (2) In the blade forming process, the thickness is finely adjusted by an adjustable moving blade. For example, Japanese Patent No. 1159204 adds a film thickness detecting device to the blade forming machine, and compensates for the lifting height of the blade to make a film. The thickness is driven to the same level, and Chinese Patent No. 203863801 can adjust the film thickness of aluminum nitride by adjusting the trimming nut on the doctor blade holder. However, when the film thickness is more than 1.0 mm, the film thickness cannot be effectively controlled and formed, and a thin surface is generated at the edge, and the film thickness distribution at the center to the edge is uneven, which causes difficulty in controlling subsequent sintering conditions and flattening process. .
此外,現有的刮刀成型系統一般用於高黏度及高固含量的漿料,但是若生胚厚度大於1.0mm時,從漿料盒中流下往往會造成厚度及均勻性不一致的情形,原因為漿料的內聚力小於重力作用,並往周圍延流,使得邊緣厚度較薄,進而影響生胚平整度。而傳統解決方式則是使用切片器將邊緣較薄面作切割處理,但是會產生原料浪費及製程成本上的問 題。 In addition, the existing blade forming system is generally used for high viscosity and high solid content slurry, but if the thickness of the raw embryo is more than 1.0 mm, the thickness and uniformity tend to be inconsistent when flowing down from the slurry box, because the slurry is The cohesive force is less than the action of gravity, and the flow is extended to the periphery, so that the thickness of the edge is thin, thereby affecting the flatness of the green embryo. The traditional solution is to use a slicer to cut the thinner side of the edge, but it will cause material waste and process cost. question.
為解決上述問題,本發明發展出一種調控陶瓷基板厚度之設備及其製備方法,可直接用於生產厚膜陶瓷基板,並且藉此解決生胚厚度不一致的問題。由於生胚基版厚度分布較均一,因此不易在後續製程中過程中產生缺陷,以製備出厚度均一的厚膜陶瓷基板。 In order to solve the above problems, the present invention develops an apparatus for regulating the thickness of a ceramic substrate and a preparation method thereof, which can be directly used for producing a thick film ceramic substrate, and thereby solves the problem of inconsistent thickness of the green embryo. Since the thickness distribution of the green plate is relatively uniform, it is not easy to produce defects in the subsequent process to prepare a thick-film ceramic substrate having a uniform thickness.
鑒於上述悉知技術之缺點,本發明發展出一種調控陶瓷基板厚度之製備方法,並藉由活動式軌道單元,可直接用於生產厚膜陶瓷基板,並調控生胚基板的厚度與改善其平整度。 In view of the above-mentioned shortcomings of the prior art, the present invention develops a preparation method for regulating the thickness of a ceramic substrate, and can be directly used for producing a thick film ceramic substrate by a movable track unit, and regulates the thickness of the green substrate and improves the leveling thereof. degree.
為了達上述目的,根據本發明所提出的方案,提供一種調控陶瓷基板厚度之設備,包括:一刮刀成型塗佈機基板;一活動式軌道單元,設置於該刮刀成型塗佈機基板上,其係具有一軌道,用以承載一刮刀;一頂端擋板,其係用以與該活動式軌道單元組合而形成一容置空間;一離型膜,其係設置於該容置空間底部。其中活動式軌道單元的設計,可包含二個活動式軌道,可依陶瓷生胚厚度需求不同,更換高度不同的活動式軌道。 In order to achieve the above object, according to the solution of the present invention, an apparatus for regulating the thickness of a ceramic substrate is provided, comprising: a blade forming coater substrate; and a movable track unit disposed on the blade forming coater substrate, The utility model has a track for carrying a scraper; a top baffle for combining with the movable track unit to form an accommodating space; and a release film disposed at the bottom of the accommodating space. The design of the movable track unit can include two movable tracks, which can change the movable track with different height depending on the thickness of the ceramic raw embryo.
上述中,該容置空間可用以容納陶瓷漿料,該離型膜可為PET膜,而該刮刀可選自可調式單片狹縫型刮刀、可調式供料狹縫型刮刀其中之一;此外,該活動式軌道單元可 彌補陶瓷漿料內聚力的不足,以阻止陶瓷漿料的延流重力,防止漿料延流至刮刀邊界之外,有效提高提陶瓷生胚厚度及平整度。 In the above, the accommodating space may be used to accommodate the ceramic slurry, and the release film may be a PET film, and the squeegee may be selected from one of an adjustable single-slice slit type blade and an adjustable feed slit type blade; In addition, the movable track unit can Make up for the lack of cohesive force of the ceramic slurry to prevent the flow of gravity of the ceramic slurry, prevent the slurry from flowing out of the blade boundary, and effectively improve the thickness and flatness of the ceramic green.
此發明的製備方法,步驟包括:(A)提供一活動式軌道單元、一離型膜,設置於一具有頂端擋板之刮刀成型塗佈機基板上,利用該活動式軌道單元與該頂端擋板形成一容置空間,其中該離型膜係位於該容置空間底部;(B)將一陶瓷漿料注入該容置空間內,使該陶瓷漿料高度超過該活動式軌道單元中之軌道高度;(C)提供一刮刀利用該活動式軌道單元之軌道,以刮除超過該活動式軌道單元之軌道高度的陶瓷漿料;(D)待該陶瓷漿料固化後,拆除該活動式軌道單元及該離型膜,並進行一熱處理,以獲得一陶瓷基板,其中,該活動式軌道係依該陶瓷基板成膜厚度以變動該活動式軌道高度。 The preparation method of the invention comprises the following steps: (A) providing a movable track unit and a release film, which are disposed on a blade forming coater substrate having a top end plate, and the movable track unit and the top end block are used. Forming an accommodating space, wherein the release film is located at the bottom of the accommodating space; (B) injecting a ceramic slurry into the accommodating space, so that the ceramic slurry height exceeds the track in the movable track unit (C) providing a scraper to utilize the track of the movable track unit to scrape the ceramic slurry exceeding the track height of the movable track unit; (D) after the ceramic slurry is solidified, the movable track is removed The unit and the release film are subjected to a heat treatment to obtain a ceramic substrate, wherein the movable track is formed according to a thickness of the ceramic substrate to change the height of the movable track.
以上之概述與接下來的詳細說明及附圖,皆是為了能進一步說明本創作達到預定目的所採取的方式、手段及功效。而有關本創作的其他目的及優點,將在後續的說明及圖式中加以闡述。 The above summary and the following detailed description and drawings are intended to further illustrate the manner, means and effects of the present invention in achieving its intended purpose. Other purposes and advantages of this creation will be explained in the following description and drawings.
1‧‧‧活動軌道單元 1‧‧‧Active track unit
2‧‧‧陶瓷漿料 2‧‧‧Ceramic slurry
3‧‧‧離型膜 3‧‧‧ release film
4‧‧‧刮刀成型塗佈機基板 4‧‧‧Scraper forming coater substrate
5‧‧‧頂端擋板 5‧‧‧ top baffle
6‧‧‧刮刀 6‧‧‧Scraper
S101-S104‧‧‧步驟 S101-S104‧‧‧Steps
第一圖係為本發明一種調控陶瓷基板厚度之設備示意圖;第二圖係為本發明一種調控陶瓷基板厚度之設備剖面示意圖; 第三圖係為本發明一種調控陶瓷基板厚度之製備方法流程圖。 The first figure is a schematic diagram of a device for regulating the thickness of a ceramic substrate according to the present invention; the second figure is a schematic cross-sectional view of a device for regulating the thickness of a ceramic substrate; The third figure is a flow chart of a preparation method for regulating the thickness of a ceramic substrate according to the present invention.
以下係藉由特定的具體實例說明本創作之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地了解本創作之優點及功效。 The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily understand the advantages and effects of the present invention from the disclosure of the present disclosure.
現有的刮刀成型機在製作大於1mm以上之厚膜陶瓷基板時,由於漿料易延流至刮刀邊界之外,造成邊緣厚度較薄,往往會造成厚度及均勻性不一致的情形。本發明發展出一種調控陶瓷基板厚度之設備及其製備方法,係將陶瓷粉末與溶劑、塑化劑等混合,製作成陶瓷漿料,接著將漿料溶液置於該設備製備陶瓷生胚基板;本發明可直接用於生產厚膜基板,不需額外的製程,並且可藉此解決生胚厚度不一致的問題。 In the conventional doctor blade forming machine, when a thick-film ceramic substrate larger than 1 mm is produced, since the slurry is easily spread to the boundary of the blade, the thickness of the edge is thin, which tends to cause inconsistency in thickness and uniformity. The invention develops a device for regulating the thickness of a ceramic substrate and a preparation method thereof, the ceramic powder is mixed with a solvent, a plasticizer and the like to prepare a ceramic slurry, and then the slurry solution is placed in the device to prepare a ceramic green germ substrate; The invention can be directly used for producing a thick film substrate without an additional process, and can thereby solve the problem of inconsistent thickness of the raw embryo.
請參閱第一圖及第二圖,為本發明一種調控陶瓷基板厚度之設備示意圖及其剖面示意圖。如圖所示,一種軌道活動式刮刀成型技術及裝置,它包含了活動式軌道單元1、離型膜3、刮刀成型塗佈機基板4、頂端檔板5、刮刀6,其中該活動式軌道單元1為二個長型軌道,可依陶瓷生胚厚度需求不同,更換不同的高度;此外,該活動式軌道單元1具有一承載刮刀的凹槽(軌道),使刮刀可放置於該凹槽(軌道)上,以利於刮刀水平推移;其中離型膜3主要採用PET膜作為成型底 膜,其目的在於陶瓷漿料2固化後,利用離型膜3與陶瓷(生胚)漿料2之間不易鍵結的原理,進而方便在後續加工前,加速單獨取出生胚;刮刀6可為可調式單片狹縫型刮刀、可調式供料狹縫型刮刀、線棒型刮刀或其他種類型式的刮刀。 Please refer to the first figure and the second figure, which are schematic diagrams of a device for regulating the thickness of a ceramic substrate and a cross-sectional view thereof. As shown in the figure, a track movable blade forming technology and device comprises a movable track unit 1, a release film 3, a blade forming coater substrate 4, a top baffle 5, and a scraper 6, wherein the movable track The unit 1 is two long rails, which can be replaced with different heights according to the thickness requirements of the ceramic green embryo; in addition, the movable rail unit 1 has a groove (track) for carrying the scraper so that the scraper can be placed in the groove (track) to facilitate the horizontal shift of the scraper; wherein the release film 3 mainly uses PET film as the forming bottom The purpose of the film is that after the ceramic slurry 2 is solidified, the principle of difficulty in bonding between the release film 3 and the ceramic (green) slurry 2 is utilized, thereby facilitating the accelerated removal of the green embryo separately after the subsequent processing; the scraper 6 can be It is an adjustable single-piece slit type scraper, an adjustable feed slit type scraper, a wire bar type scraper or other types of scrapers.
請參閱第三圖,為本發明一種調控陶瓷基板厚度之製備方法流程圖。如圖所示,本發明所提供一種調控陶瓷基板厚度之製備方法,步驟包括:(A)提供一活動式軌道單元1、一離型膜3,設置於一具有頂端擋板5之刮刀成型塗佈機基板4上,利用該活動式軌道單元1與該頂端擋板5形成一容置空間,其中該離型膜3係位於該容置空間底部S101;(B)將一陶瓷漿料2注入該容置空間內,使該陶瓷漿料2高度超過該活動式軌道單元1中之軌道高度S102;(C)提供一刮刀6利用該活動式軌道單元1之軌道,以刮除超過該活動式軌道單元1之軌道高度的陶瓷漿料S103;(D)待該陶瓷漿料2固化後,拆除該活動式軌道單元1及該離型膜3,並進行一熱處理,以獲得一陶瓷基板S104;其中,該活動式軌道係依該陶瓷基板成膜厚度以變動該活動式軌道高度。 Please refer to the third figure, which is a flow chart of a method for preparing a thickness of a ceramic substrate according to the present invention. As shown in the figure, the present invention provides a method for preparing a thickness of a ceramic substrate, the steps comprising: (A) providing a movable track unit 1, a release film 3, and a blade forming coating having a top end plate 5. The movable track unit 1 and the top end baffle 5 form an accommodating space, wherein the release film 3 is located at the bottom of the accommodating space S101; (B) injecting a ceramic slurry 2 In the accommodating space, the height of the ceramic slurry 2 exceeds the track height S102 in the movable track unit 1; (C) provides a scraper 6 using the track of the movable track unit 1 to scrape off the movable type The ceramic slurry S103 of the track height of the track unit 1; (D) after the ceramic slurry 2 is solidified, the movable track unit 1 and the release film 3 are removed, and a heat treatment is performed to obtain a ceramic substrate S104; Wherein, the movable track changes the height of the movable track according to the film thickness of the ceramic substrate.
本實施例中成膜之陶瓷基板以氮化鋁為例,在實施例的步驟(A)中,將離型膜3完整平鋪於刮刀成型塗佈機基板4上,並保持平整;將活動式軌道單元1及頂端檔板5置於離型膜3上,形成一氮化鋁漿料的容置空間,該容置空間可依需求不同,採用開放式或封閉式,若採用開放式容置空 間,可增加生胚塗佈的長度,利於自動化的生產製程;其中活動式軌道單元1依照不同氮化鋁陶瓷漿料2需求的成膜寬度放置於刮刀成型塗佈機基板4左右兩側,左右兩側之活動式軌道可替換為不同高度,用以改變氮化鋁陶瓷漿料2的成型厚度;而在實施例的步驟(B)中,將一氮化鋁陶瓷漿料2注入該容置空間內,使該氮化鋁陶瓷漿料2高度超過該活動式軌道單元1之高度;另外在步驟(C)中,本實施例將氮化鋁陶瓷漿料2經由刮刀6水平等速刮塗於離型膜3上,同時刮除超過該活動式軌道單元1之高度的氮化鋁陶瓷漿料2,以使氮化鋁陶瓷漿料2與活動式軌道單元1之高度一致,形成氮化鋁厚膜生胚,其中刮塗方式可採手動或自動控制;而步驟(D)中,實施例待該氮化鋁陶瓷漿料2固化後,拆除活動式軌道單元1及離型膜3,並進行一熱處理。該熱處理的製程,包括脫酯與燒結,脫酯係將氮化鋁陶瓷生胚基板置於脫酯爐內,由室溫加熱至500至600℃以上,持溫1至2小時後取出氮化鋁脫酯生胚;燒結係將氮化鋁脫酯生胚置於高溫爐內,燒結溫度在1700℃以上,持溫數小時後取出冷卻,以獲得一高緻密度、膜厚均一、厚度大於1mm的氮化鋁陶瓷厚膜基板。 In the ceramic substrate formed in this embodiment, aluminum nitride is taken as an example. In the step (A) of the embodiment, the release film 3 is completely spread on the blade forming coater substrate 4, and is kept flat; The rail unit 1 and the top baffle plate 5 are placed on the release film 3 to form an accommodating space of the aluminum nitride slurry. The accommodating space can be open or closed according to requirements, and the open capacity is adopted. Blanking In the meantime, the length of the green coating can be increased to facilitate the automated production process; wherein the movable track unit 1 is placed on the left and right sides of the substrate 4 of the blade forming coater according to the film forming width required by the different aluminum nitride ceramic slurry 2 The movable rails on the left and right sides can be replaced with different heights to change the forming thickness of the aluminum nitride ceramic slurry 2; and in the step (B) of the embodiment, an aluminum nitride ceramic slurry 2 is injected into the volume. The height of the aluminum nitride ceramic slurry 2 is higher than the height of the movable track unit 1 in the space; in addition, in the step (C), the aluminum nitride ceramic slurry 2 is scraped horizontally by the scraper 6 in this embodiment. Applying to the release film 3 while scraping the aluminum nitride ceramic slurry 2 exceeding the height of the movable track unit 1 so that the aluminum nitride ceramic slurry 2 and the movable track unit 1 are in the same height to form nitrogen. The aluminum thick film green embryo, wherein the scraping method can be manually or automatically controlled; and in the step (D), the embodiment is to remove the movable rail unit 1 and the release film 3 after the aluminum nitride ceramic slurry 2 is solidified. And carry out a heat treatment. The heat treatment process includes de-esterification and sintering, and the de-esterification system places the aluminum nitride ceramic green germ substrate in a de-esterification furnace, and is heated from room temperature to 500 to 600 ° C or higher, and is taken out after aging for 1 to 2 hours. Aluminum deesterification raw embryo; sintering system delaminates the aluminum nitride deproteinized raw embryos in a high temperature furnace, the sintering temperature is above 1700 ° C, and after taking a few hours of cooling, the cooling is taken out to obtain a high density, uniform film thickness and thickness greater than 1mm aluminum nitride ceramic thick film substrate.
上述之實施例僅為例示性說明本創作之特點及功效,非用以限制本創作之實質技術內容的範圍。任何熟悉此技藝之人士均可在不違背創作之精神及範疇下,對上述實施例進行修飾與變化。因此,本創作之權利保護範圍,應如 後述之申請專利範圍所列。 The above-described embodiments are merely illustrative of the features and functions of the present invention and are not intended to limit the scope of the technical content of the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the creation. Therefore, the scope of protection of this creation should be as The scope of the patent application described later is listed.
1‧‧‧活動式軌道單元 1‧‧‧Active track unit
2‧‧‧陶瓷漿料 2‧‧‧Ceramic slurry
3‧‧‧離型膜 3‧‧‧ release film
4‧‧‧刮刀成型塗佈機基板 4‧‧‧Scraper forming coater substrate
5‧‧‧頂端擋板 5‧‧‧ top baffle
6‧‧‧刮刀 6‧‧‧Scraper
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CN112776130A (en) * | 2020-12-31 | 2021-05-11 | 中国建筑材料科学研究总院有限公司 | Ceramic substrate green tape and method and apparatus for manufacturing the same |
CN114311936A (en) * | 2021-12-28 | 2022-04-12 | 北新建材(天津)有限公司 | High-strength gypsum board substrate and preparation system thereof |
CN118123990A (en) * | 2024-03-19 | 2024-06-04 | 江苏三责新材料科技股份有限公司 | Preparation method of thickness-adjustable pressureless silicon carbide ceramic sheet |
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CN112776130A (en) * | 2020-12-31 | 2021-05-11 | 中国建筑材料科学研究总院有限公司 | Ceramic substrate green tape and method and apparatus for manufacturing the same |
CN114311936A (en) * | 2021-12-28 | 2022-04-12 | 北新建材(天津)有限公司 | High-strength gypsum board substrate and preparation system thereof |
CN118123990A (en) * | 2024-03-19 | 2024-06-04 | 江苏三责新材料科技股份有限公司 | Preparation method of thickness-adjustable pressureless silicon carbide ceramic sheet |
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