TW201738654A - Photosensitive resin composition, dry film, cured product, and printed wiring board - Google Patents

Photosensitive resin composition, dry film, cured product, and printed wiring board Download PDF

Info

Publication number
TW201738654A
TW201738654A TW106101241A TW106101241A TW201738654A TW 201738654 A TW201738654 A TW 201738654A TW 106101241 A TW106101241 A TW 106101241A TW 106101241 A TW106101241 A TW 106101241A TW 201738654 A TW201738654 A TW 201738654A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
formula
organic group
Prior art date
Application number
TW106101241A
Other languages
Chinese (zh)
Other versions
TWI735508B (en
Inventor
Yang-Mei Guo
Takao Miwa
Katsuki OKAYASU
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of TW201738654A publication Critical patent/TW201738654A/en
Application granted granted Critical
Publication of TWI735508B publication Critical patent/TWI735508B/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075Partially aromatic polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Provided are a photosensitive resin composition having excellent resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and a printed wiring board having the cured product. The photosensitive resin composition contains (A) a polyamic acid ester and (B) a photobase generator, the photosensitive resin composition, etc. being characterized in that the (A) a polyamic acid ester has a structure represented by general formula (1). (In formula (1), R1 is a tetravalent organic group; R2 is either a group having an alicyclic skeleton, a phenylene group, a group having a bisphenylene skeleton bonded with an alkylene group, or an alkylene group; X is a bivalent organic group; R3 and R4 may be the same or different from each other and are each either a monovalent organic group or a functional group having silicon; m is an integer of 1 or greater; and n is 0 or an integer of 1 or greater).

Description

感光性樹脂組成物,乾薄膜,硬化物及印刷電路板 Photosensitive resin composition, dry film, cured product and printed circuit board

本發明係有關感光性樹脂組成物、乾薄膜、硬化物及印刷電路板。 The present invention relates to a photosensitive resin composition, a dry film, a cured product, and a printed circuit board.

聚醯亞胺係因高的絕緣性、耐熱性、高機械強度等之優異的特性而被廣泛應用於各種領域。例如不止於最初所應用的航空宇宙領域,而進一步適用於半導體元件之塗佈膜或可撓性的印刷電路板、耐熱絕緣性層間材。 Polyimine is widely used in various fields due to its excellent properties such as high insulation properties, heat resistance, and high mechanical strength. For example, it is not limited to the aerospace field originally applied, but is further applicable to a coating film of a semiconductor element or a flexible printed circuit board or a heat-resistant insulating interlayer.

聚醯亞胺為熱可塑性、及對於有機溶劑之溶解性缺乏,有加工困難之一面。因此,聚醯亞胺係對於調配有聚醯胺酸或聚醯胺酸酯等之聚醯亞胺前驅物與光反應性之化合物所得之感光性樹脂組成物,藉由照射活性光線後進行顯影,形成所期望之圖型膜後,施加高溫使閉環形成醯亞胺化的手法被廣泛使用(例如專利文獻1、2)。 Polyimine is one of the most difficult to process because of its thermoplasticity and lack of solubility in organic solvents. Therefore, the polyimide resin is prepared by irradiating active light rays with a photosensitive resin composition obtained by mixing a polyimide intermediate having a polyimide or a polyphthalamide precursor and a photoreactive compound. After the formation of a desired pattern film, a technique of applying a high temperature to form a ring closure to form a ruthenium is widely used (for example, Patent Documents 1 and 2).

例如專利文獻1記載含有聚醯胺酸酯與感光性鹼產生劑的感光性樹脂組成物。又,專利文獻2記載含有醯胺酸部分及醯胺酸酯部分之兩者的聚醯胺酸衍生物與藉由輻射線照射產生鹼性物質之化合物的負型感光性樹脂 組成物。 For example, Patent Document 1 describes a photosensitive resin composition containing a polyphthalate and a photosensitive alkali generator. Further, Patent Document 2 describes a negative-type photosensitive resin containing a poly-proline derivative having both a proline moiety and a valinate moiety and a compound which generates a basic substance by irradiation with radiation. Composition.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本特開平5-197148號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 5-119148

專利文獻2:日本特開2003-084435號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2003-084435

發明之概要 Summary of invention

近年,伴隨著半導體實裝技術之高度化或高密度化,而要求聚醯亞胺之圖型膜更微細化。 In recent years, with the increase in the size and density of semiconductor mounting technology, the pattern film of polyimine has been required to be finer.

因此,本發明之目的係提供解析性優異之感光性樹脂組成物、具有由該組成物所得之樹脂層的乾薄膜、該組成物或該乾薄膜之樹脂層的硬化物、及具有該硬化物之印刷電路板。 Accordingly, an object of the present invention is to provide a photosensitive resin composition excellent in resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or a resin layer of the dry film, and the cured product. Printed circuit board.

本發明人等有鑑於上述而精心檢討的結果,發現藉由使用具有特定結構的聚醯胺酸酯,可解決上述課題,而完成本發明。 As a result of careful examination of the above, the present inventors have found that the above problems can be solved by using a polyamidoate having a specific structure, and the present invention has been completed.

亦即,本發明之感光性樹脂組成物,其係含有(A)聚醯胺酸酯及(B)光鹼產生劑之感光性樹脂組成物,其中前述(A)聚醯胺酸酯為具有下述通式(1)表 示之結構者。 That is, the photosensitive resin composition of the present invention contains a photosensitive resin composition of (A) polyphthalate and (B) a photobase generator, wherein the (A) polyphthalamide has The following general formula (1) The structure of the show.

(式(1)中,R1係4價有機基,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數)。 (In the formula (1), R 1 is a tetravalent organic group, and R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded by an alkyl group, and an alkyl group. Any one, X is a divalent organic group, and R 3 and R 4 are a monovalent organic group which may be the same or different from each other or a functional group having a fluorene, m is an integer of 1 or more, and n is an integer of 0 or more) .

又,本發明之感光性樹脂組成物中之(A)聚醯胺酸酯,實質上不含醯胺酸部分。亦即、本發明之感光性樹脂組成物中之(A)聚醯胺酸酯係與如日本特開2003-084435號公報所記載之包含醯胺酸部分及醯胺酸酯部分之兩者的聚醯胺酸衍生物不同。 Further, the (A) polyphthalate in the photosensitive resin composition of the present invention does not substantially contain a proline moiety. In other words, the (A) polyphthalate ester of the photosensitive resin composition of the present invention has both a proline moiety and a valinate moiety as described in JP-A-2003-084435. Poly-proline derivatives are different.

本發明之感光性樹脂組成物係前述通式(1)中之R1為含有芳香族環與脂肪族烴環之縮合環的4價有機基、含有芳香族基與脂環式烴基之4價有機基、或含氟原子之4價有機基為佳。 In the photosensitive resin composition of the present invention, R 1 in the above formula (1) is a tetravalent organic group containing a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring, and a tetravalent group containing an aromatic group and an alicyclic hydrocarbon group. The organic group or the tetravalent organic group of the fluorine atom is preferred.

本發明之感光性樹脂組成物,其中前述(A)聚醯胺酸酯為具有以下述通式(1-1)及(1-2)之至少任一表示之結構者。 In the photosensitive resin composition of the present invention, the (A) polyphthalate is a structure having at least one of the following general formulae (1-1) and (1-2).

(式(1-1)中,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數) (In the formula (1-1), R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded to an alkyl group, and an alkyl group, and X is 2 a valence organic group, R 3 and R 4 are a monovalent organic group which may be the same or different from each other or a functional group having a fluorene, m is an integer of 1 or more, and n is an integer of 0 or more)

(式(1-2)中,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數)。 (In the formula (1-2), R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded to an alkyl group, and an alkyl group, and X is 2 The valence organic group, R 3 and R 4 are a monovalent organic group or a functional group having a fluorene which may be the same or different from each other, m is an integer of 1 or more, and n is an integer of 0 or more).

本發明之感光性樹脂組成物,其中前述(B)光鹼產生劑為離子型光鹼產生劑為佳。 In the photosensitive resin composition of the present invention, the (B) photobase generator is preferably an ionic photobase generator.

本發明之乾薄膜,其係具有將前述感光性樹脂組成物塗佈於薄膜,經乾燥所得的樹脂層。 The dry film of the present invention has a resin layer obtained by applying the photosensitive resin composition to a film and drying it.

本發明之硬化物,其係將前述感光性樹脂組成物或前述乾薄膜的樹脂層進行硬化所得者。 The cured product of the present invention is obtained by curing the photosensitive resin composition or the resin layer of the dry film.

本發明之印刷電路板,其係具有前述硬化物者。 The printed circuit board of the present invention has the aforementioned hardened material.

依據本發明時,可提供解析性優異之感光性樹脂組成物、具有由該組成物所得之樹脂層的乾薄膜、該組成物或該乾薄膜之樹脂層之硬化物、及具有該硬化物的印刷電路板。 According to the present invention, it is possible to provide a photosensitive resin composition excellent in resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of the dry film, and a cured product having the cured product. A printed circuit board.

實施發明之形態 Form of implementing the invention

以下,詳述本發明之感光性樹脂組成物所含有的成分。 Hereinafter, the components contained in the photosensitive resin composition of the present invention will be described in detail.

[(A)聚醯胺酸酯] [(A) Polyurethane]

本發明所使用之(A)聚醯胺酸酯係具有下述通式(1)表示之結構者。 The (A) polyphthalate used in the present invention has a structure represented by the following formula (1).

(式(1)中,R1係4價有機基,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之 基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數)。 (In the formula (1), R 1 is a tetravalent organic group, and R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded by an alkyl group, and an alkyl group. Any one, X is a divalent organic group, and R 3 and R 4 are a monovalent organic group which may be the same or different from each other or a functional group having a fluorene, m is an integer of 1 or more, and n is an integer of 0 or more) .

(A)聚醯胺酸酯之較佳之數平均分子量為1000~100萬,更佳為5000~50萬,又更佳為1萬~20萬。 (A) The preferred number average molecular weight of the polyglycolate is from 1,000 to 1,000,000, more preferably from 5,000 to 500,000, and even more preferably from 10,000 to 200,000.

式(1)中,R1表示之4價有機基無特別限定,可依據用途選擇即可。可列舉例如芳香族基,較佳為碳原子數6~32之芳香族基,或脂肪族基,較佳為碳原子數4~20之脂肪族基。R1係在製造(A)聚醯胺酸酯所使用之後述酸二酐所含有的取代基R1為佳。 In the formula (1), the tetravalent organic group represented by R 1 is not particularly limited and may be selected depending on the use. For example, an aromatic group is preferable, and an aromatic group having 6 to 32 carbon atoms or an aliphatic group is preferable, and an aliphatic group having 4 to 20 carbon atoms is preferable. R 1 is preferably a substituent R 1 contained in the acid dianhydride after the production of the (A) polyphthalate.

又,藉由短波長光,使用感光性樹脂組成物形成圖型膜的情形時,從聚合物之吸收特性的觀點,使用脂肪族基作為R1為佳。 Further, when a pattern film is formed using a photosensitive resin composition by short-wavelength light, it is preferable to use an aliphatic group as R 1 from the viewpoint of absorption characteristics of the polymer.

本發明中,特別是從解析性的觀點,R1為含有芳香族環與脂肪族烴環之縮合環的4價有機基、含有芳香族基與脂環式烴基之4價有機基、或含氟原子之4價有機基為佳。 In the present invention, in particular, from the viewpoint of analytical properties, R 1 is a tetravalent organic group containing a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring, a tetravalent organic group containing an aromatic group and an alicyclic hydrocarbon group, or The tetravalent organic group of the fluorine atom is preferred.

R1中之前述含有芳香族環與脂肪族烴環之縮合環的4價有機基,較佳為 The tetravalent organic group containing a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring in R 1 is preferably

中之任一種表示者。 Any one of the presenters.

式(1-1): Formula (1-1):

Z1係與Z2共同之伸乙基一同形成芳香族環(較佳為苯環、萘環、特別是苯環)之碳原子數4~12個的不飽和烴基,芳香族環也可具有作為取代基之至少1個的烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。 The Z 1 group and the Z 2 coexisting ethyl group together form an aromatic hydrocarbon ring (preferably a benzene ring, a naphthalene ring, particularly a benzene ring) having 4 to 12 carbon atoms, and the aromatic ring may have At least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), an aryl group (having 6 to 10 carbon atoms), a hydroxyl group, and a halogen atom.

Z2係與Z1共同之伸乙基一同形成脂肪族烴環 (脂環式烴)之碳原子數3~10個(較佳為4~6個、特別是4個)之脂肪族烴基,脂肪族烴環也可具有作為取代基之至少1個的烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。2個「-」表示之1價連結鍵(bonding hand)(亦即,一組之連結鍵,Z2之右側的連結鍵)係鍵結於相互鄰接的碳上,但是以「=CR6-」表示之2價連結鍵係鍵結於2個「-」之連結鍵所鍵結之鄰接之碳原子之相鄰的碳原子或其相鄰之碳原子為佳。特別是後者為佳。例如脂肪族烴環為環己烷環的情形,3,4位上鍵結2個「-」之連結鍵,在2或1位(較佳為1位)鍵結「=CR6-」為佳。R6一般為氫原子、烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、羥基、鹵素原子,較佳為氫原子。 The Z 2 system and the Z 1 coexisting ethyl group together form an aliphatic hydrocarbon group having an aliphatic hydrocarbon ring (alicyclic hydrocarbon) having 3 to 10 carbon atoms (preferably 4 to 6, especially 4). The aliphatic hydrocarbon ring may have at least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), and an aryl group (having 6 to 10 carbon atoms) as a substituent. ), hydroxyl, halogen atom. Two "-" indicates that a bonding hand (that is, a set of bonding keys, a connecting key on the right side of Z 2 ) is bonded to carbon adjacent to each other, but with "=CR 6 - The two-valent linking bond is preferably bonded to an adjacent carbon atom adjacent to a carbon atom to which two "-" linkages are bonded, or an adjacent carbon atom. Especially the latter is better. For example, in the case where the aliphatic hydrocarbon ring is a cyclohexane ring, two "-" linkages are bonded to the 3, 4 positions, and "=CR 6 -" is bonded at 2 or 1 position (preferably 1 position). good. R 6 is usually a hydrogen atom, an alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), a hydroxyl group or a halogen atom, and preferably a hydrogen atom.

式(1-2): Equation (1-2):

Z3係與Z4共同之伸乙基一同形成芳香族環(較佳為苯環、萘環、特別是苯環)之碳原子數4~12個的不飽和烴基,芳香族環也可具有作為取代基之至少1個的烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。 The Z 3 group and the Z 4 coexisting ethyl group together form an aromatic hydrocarbon ring (preferably a benzene ring, a naphthalene ring, particularly a benzene ring) having 4 to 12 carbon atoms, and the aromatic ring may have At least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), an aryl group (having 6 to 10 carbon atoms), a hydroxyl group, and a halogen atom.

Z4係與Z3共同之伸乙基一同形成脂肪族烴環(脂環式烴)之碳原子數3~10個(較佳為4~6個、特別是4個)的脂肪族烴基,脂肪族烴環也可具有作為取代基之至少1個之烷基(碳原子數1~4個)、烷氧基(碳原子 數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。2個「-」表示之1價連結鍵(一組連結鍵,Z4之右側的一組連結鍵或左側之一組連結鍵)係鍵結於各自鄰接的碳上,但是一組連結鍵可彼此鄰接配置或環較大時,相互間也可置入至少1個碳原子來配置。 The Z 4 group and the Z 3 coexisting ethyl group together form an aliphatic hydrocarbon group having an aliphatic hydrocarbon ring (alicyclic hydrocarbon) having 3 to 10 carbon atoms (preferably 4 to 6, especially 4). The aliphatic hydrocarbon ring may have at least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), and an aryl group (having 6 to 10 carbon atoms) as a substituent. ), hydroxyl, halogen atom. Two "-" indicates that the 1-valent link key (a set of link keys, a set of link keys on the right side of Z 4 or a set of link keys on the left side) is bonded to each adjacent carbon, but a set of link keys can be When they are arranged adjacent to each other or the ring is large, at least one carbon atom may be placed in the mutual arrangement.

式(1-3): Formula (1-3):

Z5係與Z6共同之伸乙基一同形成芳香族環(較佳為苯環、萘環、特別是苯環)之碳原子數4~12個的不飽和烴基,芳香族環也可具有作為取代基之至少1個的烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。以2個「-」表示之1價連結鍵係鍵結於鄰接的碳上,但是以2個「-」表示之1價連結鍵之組合彼此也可鄰接配置或環較大時,相互間也可置入至少1個碳原子來配置。2個之「-」表示之1價之連結鍵係鍵結於鄰接之碳上,但是以「=CR7-」表示之2價連結鍵係鍵結於「-」之連結鍵所鍵結之碳之置入至少1個碳原子,且相鄰的碳原子為佳。R7一般為氫原子、烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、羥基、鹵素原子,較佳為氫原子。 The Z 5 group and the Z 6 coexisting ethyl group together form an aromatic hydrocarbon ring (preferably a benzene ring, a naphthalene ring, particularly a benzene ring) having 4 to 12 carbon atoms, and the aromatic ring may have At least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), an aryl group (having 6 to 10 carbon atoms), a hydroxyl group, and a halogen atom. The one-valent link key represented by two "-"s is bonded to the adjacent carbon, but the combination of the one-valent bond keys represented by two "-"s may be adjacent to each other or the ring may be large. It can be placed by placing at least one carbon atom. The two "-"s indicate that the one-valent link key is bonded to the adjacent carbon, but the two-valent link key represented by "=CR 7- " is bonded to the "-" link key. At least one carbon atom is placed in the carbon, and adjacent carbon atoms are preferred. R 7 is usually a hydrogen atom, an alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), a hydroxyl group or a halogen atom, and preferably a hydrogen atom.

Z6係與Z5共同之伸乙基一同形成脂肪族烴環(脂環式烴環)之碳原子數3~10個(較佳為4~6個、特別是4個)之脂肪族烴基,飽和烴環也可具有作為取代基之至少1個之烷基(碳原子數1~4個)、烷氧基(碳原子 數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。 An aliphatic hydrocarbon group having 3 to 10 (preferably 4 to 6, especially 4) carbon atoms of the aliphatic hydrocarbon ring (alicyclic hydrocarbon ring) formed by the Z 6 system and the Z 5 coexisting ethyl group together The saturated hydrocarbon ring may have at least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), and an aryl group (having 6 to 10 carbon atoms) as a substituent. ), hydroxyl, halogen atom.

式(1-4): Formula (1-4):

Z7係與Z8共同之伸乙基一同形成芳香族環(較佳為苯環、萘環、特別是苯環)之碳原子數4~12個之不飽和烴基,芳香族環也可具有作為取代基之至少1個烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。2個「-」表示之1價連結鍵(Z7之右側之連結鍵、或Z7之左側之連結鍵)係鍵結於各自鄰接之碳上,但是一組之連結鍵彼此可鄰接配置,環較大時,相互間也可置入至少1個碳原子來配置。 The Z 7 system and the Z 8 coexisting ethyl group together form an aromatic ring (preferably a benzene ring, a naphthalene ring, particularly a benzene ring) having 4 to 12 carbon atoms in an unsaturated hydrocarbon group, and the aromatic ring may have At least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), an aryl group (having 6 to 10 carbon atoms), a hydroxyl group, and a halogen atom as a substituent. 2 "-" represents the monovalent connecting bond (Z link key on the right of 7 of, or Z linked keys to the left of of 7) based bonded to the adjacent to the respective carbon, but the link key set it may be arranged adjacent to each other, When the ring is large, at least one carbon atom may be placed in the mutual arrangement.

Z8係與Z7共同之伸乙基一同形成脂肪族烴環(脂環式烴環)之碳原子數3~10個(較佳為4~6個、特別是4個)之飽和烴基,飽和烴環也可具有作為取代基之至少1個之烷基(碳原子數1~4個)、烷氧基(碳原子數1~4個)、芳基(碳原子數6~10個)、羥基、鹵素原子。 The Z 8 group and the Z 7 coexisting ethyl group together form an aliphatic hydrocarbon ring (alicyclic hydrocarbon ring) having 3 to 10 (preferably 4 to 6, especially 4) saturated hydrocarbon groups. The saturated hydrocarbon ring may have at least one alkyl group (having 1 to 4 carbon atoms), an alkoxy group (having 1 to 4 carbon atoms), and an aryl group (having 6 to 10 carbon atoms) as a substituent. , hydroxyl, halogen atom.

式(1-1)~(1-4)之中,較佳為式(1-1)及(1-2)表示之有機基,特佳為式(1-1)表示之有機基。 Among the formulae (1-1) to (1-4), an organic group represented by the formulae (1-1) and (1-2) is preferred, and an organic group represented by the formula (1-1) is particularly preferred.

前述含有氟原子的4價有機基,較佳為具有芳香族基(較佳為苯基、萘基、特別是苯基),更佳為具有三氟甲基與芳香族基。 The tetravalent organic group containing a fluorine atom preferably has an aromatic group (preferably a phenyl group, a naphthyl group, particularly a phenyl group), and more preferably has a trifluoromethyl group and an aromatic group.

前述(A)聚醯胺酸酯具有下述通式(1-1)及(1-2)之至少任一表示之結構為佳。 The (A) polyphthalate ester preferably has a structure represented by at least one of the following general formulae (1-1) and (1-2).

(式(1-1)中,R2~R4、X、m及n係與式(1)同樣) (In the formula (1-1), R 2 to R 4 , X, m and n are the same as in the formula (1))

(式(1-2)中,R2~R4、X、m及n係與式(1)同樣) (In the formula (1-2), R 2 to R 4 , X, m and n are the same as in the formula (1))

本發明中,式(1)中之R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一。前述伸苯基及伸烷基係各自在式(1)中,與R2鍵結之2個氮原子直接鍵結。另外,前述脂環式骨架、及以前述伸烷基鍵結之聯伸二苯骨架,在式(1)中,也可與R2鍵結之2個氮原子直接鍵結,也可不鍵結。R2係(A)聚醯胺酸酯之製造中所用之後述之二胺或二異氰酸酯中所含的取代基R2為佳。 In the present invention, R 2 in the formula (1) has an alicyclic skeleton group, a phenyl group, a group having a stretched diphenyl skeleton bonded to an alkyl group, and an alkyl group. Each of the above-mentioned phenylene and alkylene groups is directly bonded to the two nitrogen atoms bonded to R 2 in the formula (1). Further, the alicyclic skeleton and the extended diphenyl skeleton bonded by the above alkyl group may be directly bonded to the two nitrogen atoms bonded to R 2 in the formula (1), or may not be bonded. The substituent R 2 contained in the diamine or diisocyanate described later for use in the production of the R 2 -based (A) polyphthalate is preferred.

R2中之具有前述脂環式骨架之基,也可具有取代基,也可形成縮合環。具有前述脂環式骨架之基,較 佳為下述通式(2-1)表示者。 The group having the aforementioned alicyclic skeleton in R 2 may have a substituent or may form a condensed ring. The group having the alicyclic skeleton is preferably represented by the following formula (2-1).

(式(2-1)中,n1表示0~10之整數,R10為脂肪族基,較佳為碳數1~5之伸烷基,更佳為表示亞甲基,R11各自獨立為脂肪族基或芳香族基,較佳為表示甲基、乙基等之脂肪族基。) (In the formula (2-1), n1 represents an integer of 0 to 10, R 10 is an aliphatic group, preferably an alkylene group having 1 to 5 carbon atoms, more preferably a methylene group, and each of R 11 is independently The aliphatic group or the aromatic group preferably represents an aliphatic group such as a methyl group or an ethyl group.

R2中之前述伸苯基也可具有取代基,也可形成縮合環。前述伸苯基較佳為下述通式(2-2)表示者。 The aforementioned phenyl group in R 2 may have a substituent or may form a condensed ring. The above-mentioned stretched phenyl group is preferably represented by the following formula (2-2).

(式(2-2)中,n2表示0~4之整數,R12各自獨立為脂肪族基或芳香族基,較佳為表示甲基、乙基等之脂肪族基。) (In the formula (2-2), n2 represents an integer of 0 to 4, and each of R 12 is independently an aliphatic group or an aromatic group, and preferably an aliphatic group such as a methyl group or an ethyl group.)

R2中之具有以前述伸烷基鍵結之聯伸二苯骨架的基,也可具有取代基,也可形成縮合環。具有以前述伸烷基鍵結之聯伸二苯骨架的基,較佳為以下述通式(2-3)表示者。 The group having a coextruded diphenyl skeleton bonded to the above alkyl group in R 2 may have a substituent or may form a condensed ring. The group having a stretched diphenyl skeleton bonded to the above alkyl group is preferably represented by the following formula (2-3).

(式(2-3)中,n3及n4各自獨立表示0~4之整數,R13及R14各自獨立為脂肪族基或芳香族基,較佳為表示 甲基、乙基等之脂肪族基,R15表示碳數1~5之伸烷基。) (In the formula (2-3), n3 and n4 each independently represent an integer of 0 to 4, and R 13 and R 14 are each independently an aliphatic group or an aromatic group, and preferably an aliphatic group such as a methyl group or an ethyl group. Base, R 15 represents an alkylene group having 1 to 5 carbon atoms.)

式(2-3)中之R15之伸烷基係脂肪族基或芳香族基等之也可具有取代基。 The alkylene aliphatic group or the aromatic group of R 15 in the formula (2-3) may have a substituent.

R2中之前述伸烷基,較佳為碳數1~10之伸烷基,更佳為碳數2~8之伸烷基。又,R2中之前述伸烷基係脂肪族基或芳香族基等之也可具有取代基。 The alkylene group in R 2 is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 2 to 8 carbon atoms. Further, the alkylene-based aliphatic group or the aromatic group in R 2 may have a substituent.

R2係因解析性優異,具有脂環式骨架之基為佳,具有脂環式骨架,而不具有芳香族骨架之基更佳。 R 2 is excellent in analytic properties, preferably has an alicyclic skeleton, and has an alicyclic skeleton, and is more preferably a group having no aromatic skeleton.

本發明中,式(1)中之R3及R4各自獨立為1價有機基或具有矽之官能基。R3及R4中之前述1價有機基,可列舉例如烷基、烯基、炔基、芳基等。R3及R4中之前述1價之具有矽之官能基,可列舉例如矽氧烷基、矽烷基、矽烷醇基等。 In the present invention, R 3 and R 4 in the formula (1) are each independently a monovalent organic group or a functional group having a fluorene. Examples of the monovalent organic group in R 3 and R 4 include an alkyl group, an alkenyl group, an alkynyl group, and an aryl group. Examples of the monovalent functional group having a fluorene in R 3 and R 4 include a decyloxyalkyl group, a decylalkyl group, and a decyl alcohol group.

式(1)中之R3及R4,從聚醯胺酸酯之合成時之溶解性的觀點,較佳為烷基。烷基可列舉例如甲基、乙基、丙基、丁基、戊基、己基等。在此,烷基較佳為丁基、戊基、或己基。 R 3 and R 4 in the formula (1) are preferably an alkyl group from the viewpoint of solubility in the synthesis of the polyphthalate. The alkyl group may, for example, be a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group. Here, the alkyl group is preferably a butyl group, a pentyl group or a hexyl group.

本發明中,式(1)中之X為2價有機基,可列舉例如包含以芳香族或脂肪族酯基、醯胺基、醯胺醯亞胺基、矽氧烷基、環氧基、氧環丁基等作為至少一部分之構成之基。 In the present invention, X in the formula (1) is a divalent organic group, and examples thereof include an aromatic or aliphatic ester group, a guanamine group, an amidoxime group, a decyloxy group, an epoxy group, An oxocyclobutyl group or the like is a constituent of at least a part.

(A)聚醯胺酸酯可單獨使用1種,也可併用2種以上。又,R1及R2之至少任一也可為由複數之結構所 成的共聚物。 (A) Polyacetamide may be used singly or in combination of two or more. Further, at least one of R 1 and R 2 may be a copolymer composed of a plurality of structures.

(A)聚醯胺酸酯之調配量,例如依據塗佈膜厚或黏度,以組成物全量基準,在5~30質量%之範圍內使用即可。 (A) The amount of the polyamidite to be used may be, for example, in the range of 5 to 30% by mass based on the total thickness of the coating film depending on the thickness or viscosity of the coating film.

(A)聚醯胺酸酯可使用以往習知的方法來合成。例如使3,3’-二苯甲酮四羧酸二酐等之酸酐與乙醇等之醇反應作為半酯。將該半酯使用亞硫醯氯作為二酯二酸氯化物。藉由使該二酯二酸氯化物與3,5-二胺基苯甲酸等之二胺反應,可得到(A)聚醯胺酸酯。 (A) Polyphthalate can be synthesized by a conventional method. For example, an acid anhydride such as 3,3'-benzophenonetetracarboxylic dianhydride is reacted with an alcohol such as ethanol as a half ester. The half ester was ruthenium chloride as the diester diacid chloride. The (A) polyphthalate ester can be obtained by reacting the diester diacid chloride with a diamine such as 3,5-diaminobenzoic acid.

又,藉由使上述酸酐與醇反應所得之半酯與二異氰酸異佛爾酮等之二異氰酸酯反應,也可得到(A)聚醯胺酸酯。又,相較於使用上述二胺之合成方法,使用二異氰酸酯之合成方法可較簡便合成(A)聚醯胺酸酯。 Further, (A) a polyphthalamide can also be obtained by reacting a half ester obtained by reacting the above acid anhydride with an alcohol with a diisocyanate such as isophorone diisocyanate. Further, compared with the synthesis method using the above diamine, the synthesis method of the diisocyanate can be used to synthesize (A) polyphthalate.

(A)聚醯胺酸酯之合成可使用的前述酸酐,較佳為羧酸二酐,更佳為四羧酸二酐。可列舉下述通式(3)表示者。 (A) The above-mentioned acid anhydride which can be used for the synthesis of polyphthalate is preferably a carboxylic acid dianhydride, more preferably a tetracarboxylic dianhydride. The following general formula (3) is shown.

(式中之R1係如式(1)所述。) (wherein R 1 is as described in the formula (1).)

藉由使用通式(3)之酸酐,作為(A)聚醯胺酸酯之合成原料,可容易導入前述通式(1)之聚醯胺酸酯中之重複單位中的R1基。 By using the acid anhydride of the formula (3), as the synthetic raw material of the (A) polyphthalate, the R 1 group in the repeating unit in the polyphthalate of the above formula (1) can be easily introduced.

上述(A)聚醯胺酸酯之合成可使用之酸二酐之具體的例,可列舉乙烯四羧酸二酐、丁烷四羧酸二酐、環丁烷四羧酸二酐、甲基環丁烷四羧酸二酐、環戊烷四羧酸二酐等之脂肪族四羧酸二酐;均苯四甲酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、2,2’,3,3’-二苯甲酮四羧酸二酐、2,3’,3,4’-二苯甲酮四羧酸二酐、3,3’,4,4’-聯苯基四羧酸二酐、2,2’,3,3’-聯苯基四羧酸二酐、2,3’,3,4’-聯苯基四羧酸二酐、2,2’,6,6’-聯苯基四羧酸二酐、2,2-雙(3,4-二羧基苯基)丙烷二酐(dianhydride)、2,2-雙(2,3-二羧基苯基)丙烷二酐、雙(3,4-二羧基苯基)醚二酐、雙(3,4-二羧基苯基)碸二酐、1,1-雙(2,3-二羧基苯基)乙烷二酐、雙(2,3-二羧基苯基)甲烷二酐、雙(3,4-二羧基苯基)甲烷二酐、2,2-雙(3,4-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、2,2-雙(2,3-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、1,3-雙[(3,4-二羧基)苯甲醯基]苯二酐、1,4-雙[(3,4-二羧基)苯甲醯基]苯二酐、2,2-雙{4-[4-(1,2-二羧基)苯氧基]苯基}丙烷二酐、2,2-雙{4-[3-(1,2-二羧基)苯氧基]苯基}丙烷二酐、雙{4-[4-(1,2-二羧基)苯氧基]苯基}酮二酐、雙{4-[3-(1,2-二羧基)苯氧基]苯基}酮二酐、4,4’-雙[4-(1,2-二羧基)苯氧基]聯苯基二酐、4,4’-雙[3-(1,2-二羧基)苯氧基]聯苯基二酐、雙{4-[4-(1,2-二羧基)苯氧基]苯基}酮二酐、雙{4-[3-(1,2-二羧基)苯氧基]苯基}酮二酐、雙{4-[4-(1,2-二羧基)苯氧基]苯基}碸二酐、雙{4-[3-(1,2-二羧基)苯氧 基]苯基}碸二酐、雙{4-[4-(1,2-二羧基)苯氧基]苯基}硫(sulfide)二酐、雙{4-[3-(1,2-二羧基)苯氧基]苯基}硫二酐、2,2-雙{4-[4-(1,2-二羧基)苯氧基]苯基}-1,1,1,3,3,3-六氟丙烷二酐、2,2-雙{4-[3-(1,2-二羧基)苯氧基]苯基}-1,1,1,3,3,3-六氟丙烷二酐、2,3,6,7-萘四羧酸二酐、1,1,1,3,3,3-六氟-2,2-雙(2,3-或3,4-二羧基苯基)丙烷二酐、1,4,5,8-萘四羧酸二酐、1,2,5,6-萘四羧酸二酐、1,2,3,4-苯四羧酸二酐、1,2,4,5-苯四羧酸二酐、3,4,9,10-苝(perylene)四羧酸二酐、2,3,6,7-蒽四羧酸二酐、1,2,7,8-菲四羧酸二酐、吡啶四羧酸二酐、磺醯基二苯二甲酸酐、m-三聯苯基-3,3’,4,4’-四羧酸二酐、p-三聯苯基-3,3’,4,4’-四羧酸二酐等之芳香族四羧酸二酐、1,3,3a,4,5,9b-六氫化-5(四氫-2,5-二氧-3-呋喃基)萘[1,2-c]呋喃-1,3-二酮等。 Specific examples of the acid dianhydride which can be used for the synthesis of the above (A) polyphthalate include ethylene tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, cyclobutane tetracarboxylic dianhydride, and methyl group. An aliphatic tetracarboxylic dianhydride such as cyclobutane tetracarboxylic dianhydride or cyclopentane tetracarboxylic dianhydride; pyromellitic dianhydride, 3,3',4,4'-benzophenone tetracarboxylic acid Acid dianhydride, 2,2',3,3'-benzophenone tetracarboxylic dianhydride, 2,3',3,4'-benzophenone tetracarboxylic dianhydride, 3,3',4 , 4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,3',3,4'-biphenyltetracarboxylic dianhydride , 2,2',6,6'-biphenyltetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride ( dianhydride ), 2,2-bis (2, 3-Dicarboxyphenyl)propane dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, bis(3,4-dicarboxyphenyl)ruthenic anhydride, 1,1-bis (2,3 -dicarboxyphenyl)ethane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, 2,2-bis (3,4 -dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-bis(2,3-dicarboxyphenyl)-1,1,1,3,3 , 3-hexafluoropropane dianhydride, 1,3-bis[(3,4-dicarboxy)benzylidene]benzene , 1,4-bis[(3,4-dicarboxy)benzimidyl]phthalic anhydride, 2,2-bis{4-[4-(1,2-dicarboxy)phenoxy]phenyl} Propane dianhydride, 2,2-bis{4-[3-(1,2-dicarboxy)phenoxy]phenyl}propane dianhydride, bis{4-[4-(1,2-dicarboxy)benzene Oxy]phenyl}one dianhydride, bis{4-[3-(1,2-dicarboxy)phenoxy]phenyl}one dianhydride, 4,4'-bis[4-(1,2- Dicarboxy)phenoxy]biphenyl dianhydride, 4,4'-bis[3-(1,2-dicarboxy)phenoxy]biphenyl dianhydride, double {4-[4-(1, 2-Dicarboxy)phenoxy]phenyl}one dianhydride, bis{4-[3-(1,2-dicarboxy)phenoxy]phenyl}one dianhydride, double {4-[4-( 1,2-dicarboxy)phenoxy]phenyl}ruthenic anhydride, bis{4-[3-(1,2-dicarboxy)phenoxy]phenyl}phosphinic anhydride, double {4-[4 -(1,2-dicarboxy)phenoxy]phenyl}sulfide dianhydride, bis{4-[3-(1,2-dicarboxy)phenoxy]phenyl}thio dianhydride, 2 ,2-bis{4-[4-(1,2-dicarboxy)phenoxy]phenyl}-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,2-double { 4-[3-(1,2-dicarboxy)phenoxy]phenyl}-1,1,1,3,3,3-hexafluoropropane dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid Acid dianhydride, 1,1,1,3,3,3-hexafluoro-2,2-bis(2,3- or 3,4-dicarboxyphenyl)propane dianhydride, 1,4,5,8 -naphthalenetetracarboxylic dianhydride, 1, 2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 1,2,4,5-benzenetetracarboxylic dianhydride, 3,4,9,10 - perylene tetracarboxylic dianhydride, 2,3,6,7-nonanetetracarboxylic dianhydride, 1,2,7,8-phenanthrenetetracarboxylic dianhydride, pyridinetetracarboxylic dianhydride, sulfonium sulfonate Diphthalic anhydride, m-terphenyl--3,3',4,4'-tetracarboxylic dianhydride, p-terphenyl-3,3',4,4'-tetracarboxylic dianhydride Aromatic tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)naphthalene [1,2-c] Furan-1,3-dione and the like.

上述酸二酐之中,作為四羧酸二酐,較佳為均苯四甲酸二酐、3,3’,4,4’-二苯甲酮四羧酸二酐、3,3’,4,4’-聯苯基四羧酸二酐、2,2’,6,6’-聯苯基四羧酸二酐、雙(3,4-二羧基苯基)醚二酐、2,2-雙(3,4-二羧基苯基)-1,1,1,3,3,3-六氟丙烷二酐、1,2,4,5-苯四羧酸二酐、1,3,3a,4,5,9b-六氫化-5(四氫-2,5-二氧-3-呋喃基)萘[1,2-c]呋喃-1,3-二酮。 Among the above acid dianhydrides, tetracarboxylic dianhydride is preferably pyromellitic dianhydride, 3,3', 4,4'-benzophenone tetracarboxylic dianhydride, 3,3', 4 , 4'-biphenyltetracarboxylic dianhydride, 2,2',6,6'-biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, 2,2 - bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride, 1,2,4,5-benzenetetracarboxylic dianhydride, 1,3, 3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)naphthalene [1,2-c]furan-1,3-dione.

又,式(3)中之R1為含有芳香族環與脂肪族烴環之縮合環的4價有機基、或含有芳香族基與脂環式烴基的4價有機基的酸二酐中,前述環狀脂肪族骨架較佳 為環己烷骨架。前述酸酐係在芳香族骨架上不具有烷基(例如t-丁基)者為佳。 Further, in the formula (3), R 1 is a tetravalent organic group containing a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring, or an acid dianhydride containing a tetravalent organic group of an aromatic group and an alicyclic hydrocarbon group. The cyclic aliphatic skeleton is preferably a cyclohexane skeleton. The acid anhydride is preferably one having no alkyl group (for example, t-butyl group) on the aromatic skeleton.

前述酸酐係具有含有琥珀酸酐結構之酸酐基為佳。具有琥珀酸酐結構的酸酐基,可列舉如下述的酸酐基。 The above acid anhydride is preferably an acid anhydride group having a succinic anhydride structure. The acid anhydride group having a succinic anhydride structure may, for example, be an acid anhydride group as described below.

前述酸酐之中,較佳為下述的化合物。 Among the above acid anhydrides, the following compounds are preferred.

前述酸酐之分子量,較佳為600以下,更佳為500以下,又更佳為400以下。分子量之下限較佳為250以上。 The molecular weight of the acid anhydride is preferably 600 or less, more preferably 500 or less, still more preferably 400 or less. The lower limit of the molecular weight is preferably 250 or more.

(A)聚醯胺酸酯之合成中,酸酐可單獨使用1種或併用2種以上。 In the synthesis of the (A) polyglycolate, the acid anhydride may be used alone or in combination of two or more.

併用之酸二酐為使用導入有氟的酸二酐或具有脂環骨架之酸二酐時,不太會損及透明性,可調整溶解 性或熱膨脹率等的物性。又,使用均苯四甲酸酐、3,3’,4,4’-聯苯基四羧酸二酐、1,4,5,8-萘四羧酸二酐等之剛直的酸二酐時,最終所得之聚醯亞胺之線熱膨脹係數變小,但是有阻礙提高透明性的傾向,故可注意共聚合比例來併用。 When the acid dianhydride used is an acid dianhydride introduced with fluorine or an acid dianhydride having an alicyclic skeleton, the transparency is less likely to be impaired, and the dissolution can be adjusted. Physical properties such as sex or thermal expansion rate. Further, when a straight acid dianhydride such as pyromellitic anhydride, 3,3', 4,4'-biphenyltetracarboxylic dianhydride or 1,4,5,8-naphthalenetetracarboxylic dianhydride is used, The linear thermal expansion coefficient of the finally obtained polyimine is small, but there is a tendency to hinder the improvement of transparency, so that the copolymerization ratio can be used in combination.

為了得到(A)聚醯胺酸酯可用的前述二胺,可列舉下述通式(4)表示之二胺。但是下述者為一例,不違反本發明之目的時,可使用習知者。 In order to obtain the above-mentioned diamine which is useful for the (A) polyphthalate, a diamine represented by the following formula (4) can be mentioned. However, the following is an example, and a conventional person can be used without violating the object of the present invention.

H2N-R2-NH2 (4) H 2 NR 2 -NH 2 (4)

(式中,R2係如式(1)所述者。) (wherein R 2 is as described in the formula (1).)

前述二胺可列舉二胺基異佛爾酮(3-胺基甲基-3,5,5-三甲基環己基胺)、甲苯二胺、4,4’-亞甲基二苯基二胺、己二胺等。 The diamine may, for example, be diaminoisophorone (3-aminomethyl-3,5,5-trimethylcyclohexylamine), toluenediamine or 4,4'-methylenediphenyldiene. Amine, hexamethylene diamine, and the like.

為了得到(A)聚醯胺酸酯可用的前述二異氰酸酯,可列舉下述通式(5)表示之二異氰酸酯。但是下述者為一例,不違反本發明之目的時,可使用習知者。 The diisocyanate represented by the following general formula (5) is exemplified as the diisocyanate which can be used for the (A) polyphthalate. However, the following is an example, and a conventional person can be used without violating the object of the present invention.

OCN-R2-NCO (5) OCN-R 2 -NCO (5)

(式中,R2係如式(1)所述者。) (wherein R 2 is as described in the formula (1).)

前述二異氰酸酯可列舉二異氰酸異佛爾酮(ITI)、甲苯二異氰酸酯(TDI)、4,4’-二異氰酸亞甲基二苯酯(MDI)、2,2-雙(4-異氰酸酯基苯基)六氟丙烷、六亞甲基二異氰酸酯(HMDI)等。 Examples of the aforementioned diisocyanate include isophorone diisocyanate (ITI), toluene diisocyanate (TDI), methylene diphenyl 4,4'-diisocyanate (MDI), and 2,2-bis (4). - Isocyanate phenyl) hexafluoropropane, hexamethylene diisocyanate (HMDI), and the like.

[(B)光鹼產生劑] [(B) Photobase generator]

光鹼產生劑係藉由紫外線或可見光等之光照射而使分子結構變化,或藉由分子開裂,而生成能發揮作為聚醯胺酸酯之閉環反應之觸媒產生功能的1種以上之鹼性物質的化合物。(B)光鹼產生劑可為離子型光鹼產生劑,也可為非離子型光鹼產生劑,但是離子型光鹼產生劑因組成物之感度高,有利於形成解析性優異圖型膜,故較佳。鹼性物質可列舉例如2級胺、3級胺。 The photobase generator is formed by irradiating light such as ultraviolet light or visible light to change the molecular structure or by molecular cracking to form one or more bases capable of exhibiting a catalytic activity as a ring closure reaction of polyglycolate. a compound of a substance. (B) The photobase generator may be an ionic photobase generator or a nonionic photobase generator, but the ionic photobase generator has a high sensitivity to the composition, and is advantageous for forming an analytically excellent pattern film. Therefore, it is better. Examples of the basic substance include a secondary amine and a tertiary amine.

(非離子型光鹼產生劑) (non-ionic photobase generator)

非離子型之(B)光鹼產生劑可列舉例如α-胺基苯乙酮化合物、肟酯化合物、或具有N-甲醯基化芳香族胺基、N-醯化芳香族胺基、硝基苄基胺基甲酸酯基、烷氧基苄基胺基甲酸酯基等之取代基的化合物等。 The nonionic (B) photobase generator may, for example, be an α-aminoacetophenone compound, an oxime ester compound, or an N-methylated aromatic amine group, an N-deuterated aromatic amine group, or a nitrate. A compound such as a substituent such as a benzyl carbamic acid ester group or an alkoxybenzyl urethane group.

其他之光鹼產生劑可使用WPBG-018(商品名:9-anthrylmethylN,N’-diethylcarbamate)、WPBG-027(商品名:(E)-1-[3-(2-hydroxyphenyl)-2-propenoyl]piperidine)、WPBG-140(商品名:1-(anthraquinon-2-yl)ethyl imidazolecarboxylate)、WPBG-165等。 Other photobase generators can be used WPBG-018 (trade name: 9-anthrylmethylN, N'-diethylcarbamate), WPBG-027 (trade name: (E)-1-[3-(2-hydroxyphenyl)-2-propenoyl ]piperidine), WPBG-140 (trade name: 1-(anthraquinon-2-yl)ethyl imidazolecarboxylate), WPBG-165, and the like.

α-胺基苯乙酮化合物係分子中具有苯偶因醚鍵,接受光照射時,分子內產生開裂,生成具有硬化觸媒作用的鹼性物質(胺)。α-胺基苯乙酮化合物之具體例,可使用(4-嗎啉基苯甲醯基)-1-苄基-1-二甲基胺基丙烷 (IRGACURE369、商品名、BASF JAPAN公司製)或4-(甲基硫代苯甲醯基)-1-甲基-1-嗎啉基乙烷(IRGACURE907、商品名、BASF JAPAN公司製)、2-(二甲基胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-嗎啉基)苯基]-1-丁酮(IRGACURE379、商品名、BASF JAPAN公司製)等之市售的化合物或其溶液。 The α-aminoacetophenone compound has a benzoin ether bond in the molecule, and when exposed to light, cracks occur in the molecule to form a basic substance (amine) having a hardening catalyst action. As a specific example of the α-aminoacetophenone compound, (4-morpholinylbenzylidene)-1-benzyl-1-dimethylaminopropane can be used. (IRGACURE 369, trade name, manufactured by BASF JAPAN Co., Ltd.) or 4-(methylthiobenzimidyl)-1-methyl-1-morpholinylethane (IRGACURE 907, trade name, manufactured by BASF JAPAN Co., Ltd.), 2 -(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (IRGACURE 379, trade name, A commercially available compound such as BASF JAPAN Co., Ltd. or a solution thereof.

肟酯化合物只要是藉由光照射而會生成鹼性物質的化合物時均可使用。此肟酯化合物係下述通式(6)表示之基者為佳。 The oxime ester compound can be used as long as it is a compound which generates a basic substance by light irradiation. The oxime ester compound is preferably a group represented by the following formula (6).

(式中,R16表示氫原子、無取代或經碳數1~6之烷基、苯基或鹵素原子取代的苯基、無取代或經1個以上之羥基取代之碳數1~20之烷基、經1個以上的氧原子中斷的該烷基、無取代或經碳數1~6之烷基或苯基取代之碳數5~8之環烷基、無取代或經碳數1~6之烷基或苯基取代之碳數2~20之烷醯基或苯甲醯基,R17表示無取代或經碳數1~6之烷基、苯基或鹵素原子取代之苯基、無取代或經1個以上之羥基取代之碳數1~20之烷基、經1個以上之氧原子中斷之該烷基、無取代或經碳數1~6之烷基或苯基取代之碳數5~8之環烷基、無取代或經碳數1~6之烷基或苯基取代之碳數2~20之烷醯基或苯甲醯基。) (wherein R 16 represents a hydrogen atom, a phenyl group which is unsubstituted or substituted with an alkyl group having 1 to 6 carbon atoms, a phenyl group or a halogen atom, an unsubstituted or substituted carbon group having 1 or more hydroxyl groups of 1 to 20; An alkyl group, the alkyl group interrupted by one or more oxygen atoms, an unsubstituted or substituted alkyl group having a carbon number of 1 to 6 or a phenyl group, a cycloalkyl group having 5 to 8 carbon atoms, an unsubstituted or carbon number ~ alkyl or phenyl substituted with 2 to 20 carbon alkyl or benzhydryl groups, and R 17 represents unsubstituted or substituted with a C 1 to 6 alkyl group, a phenyl group or a halogen atom. An alkyl group having 1 to 20 carbon atoms which is unsubstituted or substituted with one or more hydroxyl groups, which is interrupted by one or more oxygen atoms, or is substituted or substituted with an alkyl group having 1 to 6 carbon atoms or a phenyl group. a cycloalkyl group having 5 to 8 carbon atoms, an unsubstituted or substituted alkyl group having 1 to 6 carbon atoms or a phenyl group, and a 2 to 20 carbon alkyl group or a benzamidine group.

又,肟酯化合物可為具有下述式(7)表示之基者。 Further, the oxime ester compound may be a group having the following formula (7).

(式中,R18及R19各自獨立為氫或1價有機基,彼等可相同或相異。又,彼等2個鍵結可形成環狀結構。) (wherein R 18 and R 19 are each independently hydrogen or a monovalent organic group, and they may be the same or different. Further, these two bonds may form a cyclic structure.)

肟酯系光鹼產生劑之市售品,可列舉BASF JAPAN公司製之CGI-325、Irgacure OXE01、Irgacure OXE02、ADEKA公司製N-1919、NCI-831等。又,亦可適合使用專利第4344400號公報所記載之分子內具有2個肟酯基的化合物。 Commercial products of the oxime ester-based photobase generator include CGI-325, Irgacure OXE01, Irgacure OXE02 manufactured by BASF JAPAN Co., Ltd., N-1919 manufactured by ADEKA Co., Ltd., and NCI-831. Further, a compound having two oxime ester groups in the molecule described in Japanese Patent No. 4344400 can also be suitably used.

其他,可列舉日本特開2004-359639號公報、日本特開2005-097141號公報、日本特開2005-220097號公報、日本特開2006-160634號公報、日本特開2008-094770號公報、日本特表2008-509967號公報、日本特表2009-040762號公報、日本特開2011-80036號公報記載的咔唑肟酯化合物等。 Others, Japanese Laid-Open Patent Publication No. 2004-359639, JP-A-2005-097141, JP-A-2005-220097, JP-A-2006-160634, JP-A-2008-094770, and Japan The carbazole oxime ester compound described in JP-A-2008-80036, JP-A-2009-80036, and JP-A-2011-80036.

又,(B)光鹼產生劑為具有下述通式(8)之胺基甲酸酯結構的光鹼產生劑,也可使用下述通式(9)、(10)表示之光鹼產生劑。 Further, (B) the photobase generator is a photobase generator having a urethane structure of the following formula (8), and photobase generation represented by the following formulas (9) and (10) may be used. Agent.

(式中,R20、R21、R22及R23各自獨立表示氫、可具有取代基之碳數1~6之烷基、可具有取代基之碳數3~8之環烷基、可具有取代基之碳數1~6之烷氧基、可具有取代基之碳數1~6之烯基、可具有取代基之碳數1~6之炔基、可具有取代基之芳基、或可具有取代基之雜環基(但是R20、R21、R22及R23之中之至少1個不為氫),R24及R25各自獨立表示氫、可具有取代基之碳數1~6之烷基、可具有取代基之碳數3~8環烷基、可具有取代基之碳數1~6之烷氧基、可具有取代基之碳數1~6之烯基、可具有取代基之碳數1~6之炔基、可具有取代基之芳基、可具有取代基之雜環基、彼此鍵結形成之可具有取代基之單環、或彼此鍵結形成之可具有取代基之多環,式中,R26表示可具有取代基之硝基苯基,R27及R28各自獨立表示氫、或可具有取代基之碳數1~6之烷基。) (wherein R 20 , R 21 , R 22 and R 23 each independently represent hydrogen, an alkyl group having 1 to 6 carbon atoms which may have a substituent, a cycloalkyl group having 3 to 8 carbon atoms which may have a substituent, Alkoxy group having 1 to 6 carbon atoms having a substituent, an alkenyl group having 1 to 6 carbon atoms which may have a substituent, an alkynyl group having 1 to 6 carbon atoms which may have a substituent, an aryl group having a substituent, Or a heterocyclic group which may have a substituent (but at least one of R 20 , R 21 , R 22 and R 23 is not hydrogen), and R 24 and R 25 each independently represent a hydrogen, a carbon number which may have a substituent An alkyl group of 1 to 6, an alkyl group having 3 to 8 carbon atoms which may have a substituent, an alkoxy group having 1 to 6 carbon atoms which may have a substituent, an alkenyl group having 1 to 6 carbon atoms which may have a substituent, An alkynyl group having 1 to 6 carbon atoms which may have a substituent, an aryl group which may have a substituent, a heterocyclic group which may have a substituent, a monocyclic ring which may be bonded to each other and which may have a substituent, or which are bonded to each other a polycyclic ring which may have a substituent, wherein R 26 represents a nitrophenyl group which may have a substituent, and R 27 and R 28 each independently represent hydrogen or an alkyl group having 1 to 6 carbon atoms which may have a substituent.

(式中,R29及R30各自獨立為氫或1價有機基,可相同或相異。R29及R30彼等可鍵結形成環狀結構,也可含有雜原子之鍵結。但是R29及R30之至少1個為1價有機基。R31、R32、R33及R34各自獨立為氫、鹵素、羥基、硝基、亞硝基、巰基、甲矽烷基、矽烷醇基或1價有機基,可相同或相異。R31、R32、R33及R34彼等之2個以上 可鍵結形成環狀結構,也可含有雜原子之鍵結。) (wherein R 29 and R 30 are each independently hydrogen or a monovalent organic group, and may be the same or different. R 29 and R 30 may be bonded to form a cyclic structure or may contain a hetero atom bond. At least one of R 29 and R 30 is a monovalent organic group. R 31 , R 32 , R 33 and R 34 are each independently hydrogen, halogen, hydroxy, nitro, nitroso, decyl, decyl, stanol The group or the monovalent organic group may be the same or different. Two or more of R 31 , R 32 , R 33 and R 34 may be bonded to form a cyclic structure or may contain a hetero atom bond.

(式(10)中,R35為非取代或經1個以上之烷基、烯基、炔基、鹵烷基、NR42R43、CN、OR44、SR45、COR46、COOR47、鹵素或式(11) (In the formula (10), R 35 is unsubstituted or has one or more alkyl groups, alkenyl groups, alkynyl groups, haloalkyl groups, NR 42 R 43 , CN, OR 44 , SR 45 , COR 46 , COOR 47 , Halogen or formula (11)

所取代之芳香族或雜芳香族基;或R35係式(12) Substituted aromatic or heteroaromatic group; or R 35 system (12)

表示之基;R36及R37互相獨立為氫、烷基、烯基、炔基或非取代或經1個以上之烷基、CN、OR44、SR45、鹵素或鹵烷基取代之苯基;R39為烷基或NR44AR45A;R44A及R45A均為非取代或形成經1個以上之烷基取代之亞烷基橋(Alkylene Bridge);R38、R40、R41、R42及R43互相獨立為氫或烷基;或R38及R40均為非取代或形成經1個以上之烷基取代之亞烷基橋;或R39及R41係由R38及 R40獨立均為非取代或形成經1個以上之烷基取代之亞烷基橋;R44、R45及R47互相獨立為氫或烷基;R46係氫或烷基;或非取代或經1個以上之烷基、烯基、炔基、鹵烷基、NR42R43、CN、OR44、SR45、COR44、COOR47、或鹵素取代之芳香族或雜芳香族基;R48係非取代或經1個以上之烷基、烯基、炔基、鹵烷基、NR42R43、CN、OR44、SR45、COR46、COOR47、或鹵素取代之芳香族或雜芳香族基;R49為氫或烷基;R50為氫、烷基、或非取代或經1個以上之烷基、乙烯基、烯基、炔基、鹵烷基、苯基、NR42R43、CN、OR44、SR45、COR46、COOR47或鹵素取代的苯基。) a group represented by R 36 and R 37 independently of hydrogen, alkyl, alkenyl, alkynyl or unsubstituted or substituted with one or more alkyl groups, CN, OR 44 , SR 45 , halogen or haloalkyl R 39 is alkyl or NR 44A R 45A ; R 44A and R 45A are all unsubstituted or form an alkylene bridge substituted by one or more alkyl groups; R 38 , R 40 , R 41 , R 42 and R 43 are each independently hydrogen or alkyl; or R 38 and R 40 are both unsubstituted or formed into an alkylene bridge substituted with one or more alkyl groups; or R 39 and R 41 are from R 38 And R 40 are independently unsubstituted or form an alkylene bridge substituted by one or more alkyl groups; R 44 , R 45 and R 47 are each independently hydrogen or alkyl; R 46 is hydrogen or alkyl; An aromatic or heteroaromatic group substituted or substituted with one or more alkyl, alkenyl, alkynyl, haloalkyl, NR 42 R 43 , CN, OR 44 , SR 45 , COR 44 , COOR 47 , or halogen R 48 is an aromatic which is unsubstituted or substituted by more than one alkyl, alkenyl, alkynyl, haloalkyl, NR 42 R 43 , CN, OR 44 , SR 45 , COR 46 , COOR 47 , or halogen an aromatic or heteroaromatic group; R 49 is hydrogen or Group; R 50 is hydrogen, alkyl, or unsubstituted or with one or more of alkyl, vinyl, alkenyl, alkynyl, haloalkyl, phenyl, NR 42 R 43, CN, OR 44, SR 45 , COR 46 , COOR 47 or halogen substituted phenyl. )

(離子型光鹼產生劑) (ion type photobase generator)

離子型之(B)光鹼產生劑可使用例如下述通式(13)表示之含有芳香族成分之羧酸與3級胺之鹽、下述通式(14)~(18)、(23)及(24)表示之光鹼產生劑、下述構造式表示之和光純藥公司製離子型PBG之WPBG-082、WPBG-167、WPBG-168、WPBG-266、WPBG-300等。 For the ionic (B) photobase generator, for example, a salt of an aromatic component-containing carboxylic acid and a tertiary amine represented by the following formula (13), and the following formulas (14) to (18) and (23) can be used. And the photobase generator represented by (24), the WPBG-082, WPBG-167, WPBG-168, WPBG-266, WPBG-300, etc. of the ionic type PBG by the Wako Pure Chemical Company.

(式中,R51~R60各自獨立為氫或1價有機基。) (wherein R 51 to R 60 are each independently hydrogen or a monovalent organic group.)

(式(14)中,Ar表示選自由下述通式[I]表示之香豆素基(coumarinyl)、及下述通式[II]表示之二氫苊基(acenaphthenyl group)所成群之任一之基,Y+表示選自由下述通式[III]表示之基、下述通式[IV]表示之基、下述式[V]表示之基、下述式[VI]表示之基、及下述通式[VII]表示之基所成群之任一之基,Z-表示鹵素陰離子、硼酸鹽陰離子、N,N-二甲基胺基甲酸酯陰離子、N,N-二甲基二硫代胺基甲酸鹽類(Dithiocarbamates)陰離子、硫氰酸鹽陰離子、氰酸鹽陰離子、苯甲酸陰離子、或苯甲醯基甲酸陰離子,R61及R62各自獨立表示氫原子、碳數1~10之直鏈狀、分枝狀或環狀之烷基或可具有取代基之苯基。) (In the formula (14), Ar represents a group selected from the group consisting of a coumarinyl group represented by the following formula [I] and an acenaphthenyl group represented by the following formula [II]. Any one of Y + represents a group represented by the following formula [III], a group represented by the following formula [IV], a group represented by the following formula [V], and a formula represented by the following formula [VI]. And a group of any of the groups represented by the following formula [VII], Z - represents a halogen anion, a borate anion, an N,N-dimethylcarbamate anion, N,N- dimethyldithiocarbamate amino acid salts (dithiocarbamates) anion, thiocyanate anion, a cyanate anion, benzoic acid anion, carboxylate anion, or benzoyl group, R 61 and R 62 each independently represent a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms or a phenyl group which may have a substituent.

(式[I]及式[II]中,m個R63及n個R64各自獨立表示鹵素原子、碳數2~10之直鏈狀、分枝狀或環狀之烷基羰基或碳數1~10之直鏈狀、分枝狀或環狀之烷基。m表示0~5之整數,n表示0~7之整數。) (In the formula [I] and the formula [II], m R 63 and n R 64 each independently represent a halogen atom, a linear, branched or cyclic alkylcarbonyl group having 2 to 10 carbon atoms or a carbon number. a linear, branched or cyclic alkyl group of 1 to 10. m represents an integer from 0 to 5, and n represents an integer from 0 to 7.

(式[III]中,R65~R67各自獨立表示碳數1~10之直鏈狀、分枝狀或環狀之烷基。式[IV]中,A表示氮原子或次甲基(CH基),R68表示氫原子或羥基。通式[VII]中,R69及R70各自獨立表示氫原子或碳數1~10之直鏈狀、分枝狀或環狀之烷基。) (In the formula [III], R 65 to R 67 each independently represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms. In the formula [IV], A represents a nitrogen atom or a methine group ( CH group), R 68 represents a hydrogen atom or a hydroxyl group of the general formula [VII] in, R 69 and R 70 each independently represent a hydrogen atom or 1 to 10 carbon atoms of straight-chain, branched, or cyclic alkyl group of. )

(式(15)及式(16)中,R71、R72及R73各自獨立為氫原子或有機基,可相同或相異。R71、R72及R73彼等鍵結可形成環狀結構,也可含有雜原子之鍵結。但是R71、R72及R73之至少1個為有機基。R74、R76及R77各自獨立為氫原子或有機基,可相同或相異。R75為氫原子、鹵素原子、羥基、巰基、硫離子基、甲矽烷基、矽烷醇基、硝基、亞硝基、膦基、氧膦基、磷醯基、膦醯基、 胺基、銨基或有機基。R74、R75、R76及R77彼等鍵結可形成環狀結構,也可含有雜原子之鍵結。R78及R79各自獨立為氫原子、鹵素原子、羥基、巰基、硫離子基、甲矽烷基、矽烷醇基、硝基、亞硝基、亞磺基、磺基、磺酸基、膦基、氧膦基、磷醯基、膦醯基、或有機基,可相同或相異。R80、R81、R82及R83各自獨立為氫原子、鹵素原子、羥基、巰基、硫離子基、甲矽烷基、矽烷醇基、硝基、亞硝基、亞磺基、磺基、磺酸基、膦基、氧膦基、磷醯基、膦醯基、胺基、銨基或有機基,可相同或相異。R80、R81、R82及R83彼等2個以上鍵結可形成環狀結構,也可含有雜原子之鍵結。R84為氫原子、或藉由加熱及電磁波之照射之至少任一者可脫保護的保護基。) (In the formulae (15) and (16), R 71 , R 72 and R 73 each independently represent a hydrogen atom or an organic group, and may be the same or different. R 71 , R 72 and R 73 may form a ring. The structure may also contain a hetero atom bond. However, at least one of R 71 , R 72 and R 73 is an organic group. R 74 , R 76 and R 77 are each independently a hydrogen atom or an organic group, and may be the same or phase. R 75 is a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide ion group, a methyl group, a decyl group, a nitro group, a nitroso group, a phosphino group, a phosphinyl group, a phosphonium group, a phosphonium group, an amine. a group, an ammonium group or an organic group. R 74 , R 75 , R 76 and R 77 may be bonded to each other to form a cyclic structure or a bond of a hetero atom. R 78 and R 79 are each independently a hydrogen atom or a halogen. Atom, hydroxyl, sulfhydryl, thiol, methoxyalkyl, stanol, nitro, nitroso, sulfinyl, sulfo, sulfonate, phosphino, phosphinyl, phosphonium, phosphino , or an organic group, may be the same or different .R 80, R 81, R 82 and R 83 are each independently a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a methyl group silicon, silicon alkoxide group, a nitro , Nitroso, sulfinyl group, a sulfo group, a sulfonic acid group, a phosphino group, a phosphinyl group, a phosphorus acyl, acyl phosphine, an amine, an ammonium group or an organic group, may be the same or different .R 80, R 81 , R 82 and R 83 may form a cyclic structure or a hetero atom bond, and R 84 may be a hydrogen atom or may be removed by heating or electromagnetic wave irradiation. Protected protection base.)

(式(17)及式(18)中,R85及R86為碳數1~18之烷基、碳數2~18之烯基、碳數2~18之炔基、碳數6~14之芳基、硝基、羥基、氰基、OR87表示之烷氧基、NR88R89表示之胺基、R90CO表示之醯基、R91COO表示之 醯氧基、SR92表示之烷基硫基或芳基硫基、或鹵素原子,R87、R90、R91及R92為碳數1~8之烷基或碳數6~12之芳基,R88及R89為氫原子、碳數1~8之烷基或碳數6~12之芳基,n為0~7之整數,m為0~9之整數。Y+為下述式(19)~(22)之任一表示之第4級銨基,Q為氮原子或次甲基(CH),t及u為2或3,w為0~2之整數,A為氫原子、羥基或鹵素原子,R93~R95為碳數1~18之烷基、碳數2~18之烯基或碳數6~14之芳基。R85或R86與CH2-Y+X-可鍵結於相同苯環,或鍵結於不同苯環。X-為選自硼酸鹽陰離子、苯氧化物(Phenolate)陰離子及羧酸酯陰離子之平衡陰離子(counter anion)。) (In the formulae (17) and (18), R 85 and R 86 are an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, an alkynyl group having 2 to 18 carbon atoms, and a carbon number of 6 to 14 An aryl group, a nitro group, a hydroxyl group, a cyano group, an alkoxy group represented by OR 87 , an amine group represented by NR 88 R 89 , a fluorenyl group represented by R 90 CO, a decyl group represented by R 91 COO, and SR 92 An alkylthio or arylthio group or a halogen atom, R 87 , R 90 , R 91 and R 92 are an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 12 carbon atoms, and R 88 and R 89 are A hydrogen atom, an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 12 carbon atoms, n is an integer of 0 to 7, and m is an integer of 0 to 9. Y + is a formula (19) to (22) Any of the fourth-order ammonium groups represented by Q, Q is a nitrogen atom or a methine group (CH), t and u are 2 or 3, w is an integer of 0 to 2, and A is a hydrogen atom, a hydroxyl group or a halogen atom, R 93 to R 95 are an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms or an aryl group having 6 to 14 carbon atoms. R 85 or R 86 may be bonded to the same as CH 2 -Y + X - The benzene ring is bonded to a different benzene ring. X - is a counter anion selected from the group consisting of a borate anion, a Phenolate anion, and a carboxylate anion.

(式(23)中,X1、X2獨立表示氧原子或硫原子。R96~R104獨立表示氫原子、鹵素原子、羥基、巰基、硝基、甲矽烷基、矽烷醇基、或1價有機基。R105、R106、R107表示氫原子、或1價有機基。但是R105、R106、R107之至少1個為1價有機基。) (In the formula (23), X 1 and X 2 each independently represent an oxygen atom or a sulfur atom. R 96 to R 104 independently represent a hydrogen atom, a halogen atom, a hydroxyl group, a thiol group, a nitro group, a decyl group, a decyl group, or 1 The valent organic group: R 105 , R 106 and R 107 represent a hydrogen atom or a monovalent organic group, but at least one of R 105 , R 106 and R 107 is a monovalent organic group.

(式(24)中,R108~R117各自獨立為氫或1價有機基,彼等之2個以上可相同或全部不同。又,彼等之2個以上可鍵結形成環狀結構。R118~R120各自獨立為氫或1價有機基,彼等之2個以上可相同或不同。又,彼等之2個以上可鍵結形成環狀結構。R121為氫或1價有機基。A係可成為陰離子之化合物或元素。) (In the formula (24), R 108 to R 117 are each independently hydrogen or a monovalent organic group, and two or more of them may be the same or all different. Further, two or more of them may be bonded to form a cyclic structure. R 118 to R 120 are each independently hydrogen or a monovalent organic group, and two or more of them may be the same or different. Further, two or more of them may be bonded to form a cyclic structure. R 121 is hydrogen or a monovalent organic group. A. A system can be an anionic compound or element.)

可使用下述結構式表示之和光純藥公司製離子型PBG之WPBG-082、WPBG-167、WPBG-168、WPBG-266、WPBG-300等。 WPBG-082, WPBG-167, WPBG-168, WPBG-266, WPBG-300, etc. of the ionic PBG manufactured by Wako Pure Chemical Industries, Ltd. can be used.

(B)光鹼產生劑可單獨使用1種或併用2種以上。(B)光鹼產生劑之調配量係以組成物全量基準,較佳為5~50質量%。5~50質量%時,解析性更優異。 (B) The photobase generator may be used alone or in combination of two or more. (B) The amount of the photobase generator is preferably from 5 to 50% by mass based on the total amount of the composition. When it is 5 to 50% by mass, the resolution is more excellent.

將(A)聚醯胺酸酯與(B)光鹼產生劑之組合或添加量配合塗佈膜厚等適宜選擇,使活性光線照射於感光性樹脂組成物之塗膜時,在厚度方向(B)光鹼產生劑均勻地進行分解。為了達成低曝光量化,也可厚膜化,(A)聚醯胺酸酯係使用對於活性光線之波長,吸收小者為佳。藉由(A)聚醯胺酸酯之分子設計,可適宜變更吸 收特性。例如為了使吸收區域位移至短波長時,使用具有芳香族基之(A)聚醯胺酸酯,有利於縮短上述R1及/或R2等之共軛系,或妨礙電荷移動錯合物之形成。 When the combination of the (A) polyphthalate and the (B) photobase generator is added, the coating film thickness is appropriately selected, and the active light is applied to the coating film of the photosensitive resin composition in the thickness direction ( B) The photobase generator is uniformly decomposed. In order to achieve low exposure quantification, it is also possible to thicken the film. (A) Polyphthalate is preferably used for the wavelength of the active light, and the absorption is small. The absorption characteristics can be suitably changed by the molecular design of (A) polyphthalate. For example, in order to shift the absorption region to a short wavelength, the (A) polyphthalate having an aromatic group is used, which is advantageous for shortening the above-mentioned conjugated system of R 1 and/or R 2 or the like, or hinders the charge shifting complex. Formation.

以下說明可調配於本發明之感光性樹脂組成物之其他的成分。 The other components which can be blended in the photosensitive resin composition of the present invention will be described below.

可用於本發明之感光性樹脂組成物的溶劑,只要是溶解(A)聚醯胺酸酯、(B)光鹼產生劑、及其他的添加劑者,即無特別限制。可列舉例如N,N’-二甲基甲醯胺、N-甲基吡咯烷酮、N-乙基-2-吡咯烷酮、N,N’-二甲基乙醯胺、二乙二醇二甲基醚、環戊酮、γ-丁內酯、α-乙醯基-γ-丁內酯、四甲基脲、1,3-二甲基-2-咪唑啉酮、N-環己基-2-吡咯烷酮、二甲基亞碸、六甲基磷醯胺、吡啶、γ-丁內酯、二乙二醇單甲基醚。此等可單獨使用或混合2種以上使用。使用之溶劑的量無特別限定,例如配合塗佈膜厚或黏度,相對於(A)聚醯胺酸酯100質量份,在50~9000質量份之範圍內使用即可。 The solvent which can be used in the photosensitive resin composition of the present invention is not particularly limited as long as it dissolves (A) polyphthalate, (B) photobase generator, and other additives. For example, N,N'-dimethylformamide, N-methylpyrrolidone, N-ethyl-2-pyrrolidone, N,N'-dimethylacetamide, diethylene glycol dimethyl ether , cyclopentanone, γ-butyrolactone, α-ethinyl-γ-butyrolactone, tetramethylurea, 1,3-dimethyl-2-imidazolidinone, N-cyclohexyl-2-pyrrolidone , dimethyl hydrazine, hexamethyl phosphoniumamine, pyridine, γ-butyrolactone, diethylene glycol monomethyl ether. These may be used alone or in combination of two or more. The amount of the solvent to be used is not particularly limited. For example, the coating film thickness or viscosity may be used in an amount of 50 to 9000 parts by mass based on 100 parts by mass of the (A) polyphthalate.

本發明之感光性樹脂組成物中,為了進一步提高光感度,也可添加增感劑。增感劑可列舉例如米希勒酮、4,4’-雙(二乙基胺基)二苯甲酮、2,5-雙(4’-二乙基胺基亞苄基(Benzal))環戊烷、2,6-雙(4’-二乙基胺基亞苄基)環己酮、2,6-雙(4’-二甲基胺基亞苄基)-4-甲基環己酮、2,6-雙(4’-二乙基胺基亞苄基)-4-甲基環己酮、4,4’-雙(二甲基胺基)查耳酮、4,4’-雙(二乙基胺基)查耳酮、p-二甲基胺基亞肉桂基二氫節酮(cinnamylidene indanone)、p-二甲基胺基亞肉桂基二氫節酮、2-(p-二甲基胺基苯基亞聯苯基)-苯並噻唑、2-(p-二甲基胺基苯基亞乙烯基(vinylene))苯並噻唑、2-(p-二甲基胺基苯基亞乙烯基)異萘并噻唑、1,3-雙(4’-二甲基胺基亞苄基)丙酮、1,3-雙(4’-二乙基胺基亞苄基)丙酮、3,3’-羰基-雙(7-二乙基胺基香豆素)、3-乙醯基-7-二甲基胺基香豆素、3-乙氧基羰基-7-二甲基胺基香豆素、3-芐氧羰基-7-二甲基胺基香豆素、3-甲氧基羰基-7-二乙基胺基香豆素、3-乙氧基羰基-7-二乙基胺基香豆素、N-苯基-N’-乙基乙醇胺、N-苯基二乙醇胺、N-p-甲苯基二乙醇胺、N-苯基乙醇胺、4-嗎啉基二苯甲酮、二甲基胺基苯甲酸異戊基、二乙基胺基苯甲酸異戊基、2-巰基苯並咪唑、1-苯基-5-巰基四唑、2-巰基苯並噻唑、2-(p-二甲基胺基苯乙烯基)苯並噁唑(Benzoxazole)、2-(p-二甲基胺基苯乙烯基)苯並噻唑、2-(p-二甲基胺基苯乙烯基)萘並(1,2-d)噻唑、2-(p-二甲基胺基苯甲醯基)苯乙烯等,從感度的觀點,使用4-(1-甲基乙基)-9H-噻噸-9-酮等之噻噸酮類為佳。此等可單獨使用或以2~5種類之組合使用。增感劑係相對於(A)聚醯胺酸酯100質量份,使用0.1~10質量份為佳。 In the photosensitive resin composition of the present invention, a sensitizer may be added in order to further improve the light sensitivity. Examples of the sensitizer include michelone, 4,4'-bis(diethylamino)benzophenone, and 2,5-bis(4'-diethylaminobenzylidene). Cyclopentane, 2,6-bis(4'-diethylaminobenzylidene)cyclohexanone, 2,6-bis(4'-dimethylaminobenzylidene)-4-methylcyclo Hexanone, 2,6-bis(4'-diethylaminobenzylidene)-4-methylcyclohexanone, 4,4'-bis(dimethylamino)chalcone, 4,4 '-Bis(diethylamino)chalcone, p-dimethylamino cinnamyl dihydrogen ketone (cinnamylidene) Indanone), p-dimethylamino cinnamyl dihydrogen ketone, 2-(p-dimethylaminophenylbiphenylene)-benzothiazole, 2-(p-dimethylamino Phenylvinylene)benzothiazole, 2-(p-dimethylaminophenylvinylidene)isonaphthylthiazole, 1,3-bis(4'-dimethylaminobenzylidene Acetone, 1,3-bis(4'-diethylaminobenzylidene)acetone, 3,3'-carbonyl-bis(7-diethylaminocoumarin), 3-ethylhydrazine -7-dimethylamino coumarin, 3-ethoxycarbonyl-7-dimethylamino coumarin, 3-benzyloxycarbonyl-7-dimethylamino coumarin, 3-methyl Oxycarbonyl-7-diethylamino coumarin, 3-ethoxycarbonyl-7-diethylaminocoumarin, N-phenyl-N'-ethylethanolamine, N-phenyl di Ethanolamine, Np-tolyldiethanolamine, N-phenylethanolamine, 4-morpholinylbenzophenone, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 2-mercapto Benzimidazole, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzothiazole, 2-(p-dimethylaminostyryl)benzoxazole, 2-(p-di Methylaminostyryl)benzothiazole, 2-(p-dimethylamine Styryl)naphtho(1,2-d)thiazole, 2-(p-dimethylaminobenzimidyl)styrene, etc., from the viewpoint of sensitivity, 4-(1-methylethyl) is used. Preferably, thioxanthone such as -9H-thioxan-9-one is preferred. These can be used alone or in combination of 2 to 5 types. The sensitizer is preferably used in an amount of 0.1 to 10 parts by mass based on 100 parts by mass of the (A) polyphthalate.

又,本發明之感光性樹脂組成物中,為了提高與基材之接著性,也可調配接著助劑。接著助劑在不違反本發明之要旨的範圍內可使用習知者。可列舉例如γ-胺基丙基二甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基甲基 二甲氧基矽烷、γ-環氧丙氧基丙基甲基二甲氧基矽烷、γ-巰基丙基甲基二甲氧基矽烷、N-[3-(三乙氧基甲矽烷基)丙基]鄰胺甲醯苯甲酸(phthalamic acid)、二苯甲酮四羧酸二酐與(三乙氧基甲矽烷基)丙胺之反應產物等。接著助劑之調配量係相對於(A)聚醯胺酸酯100質量份,較佳為0.5~10質量份之範圍。 Further, in the photosensitive resin composition of the present invention, in order to improve the adhesion to the substrate, a bonding aid may be added. The auxiliaries can then be used without departing from the spirit of the invention. For example, γ-aminopropyl dimethoxydecane, N-(β-aminoethyl)-γ-aminopropylmethyl group Dimethoxydecane, γ-glycidoxypropylmethyldimethoxydecane, γ-mercaptopropylmethyldimethoxydecane, N-[3-(triethoxycarbenyl) A reaction product of propyl] o-amine phthalamic acid, benzophenone tetracarboxylic dianhydride and (triethoxymethane alkyl) propylamine. The amount of the auxiliary agent is preferably in the range of 0.5 to 10 parts by mass based on 100 parts by mass of the (A) polyphthalate.

又,本發明之感光性樹脂組成物中可添加鹼增殖劑。形成厚膜之圖型時,需要從表面至下方為相同程度之(B)光鹼產生劑的分解率。此時,為了提高感度,較佳為添加鹼增殖劑。可使用例如日本特開2012-237776號公報、日本特開2006-282657號公報等所揭示之鹼增殖劑。 Further, a base multiplying agent can be added to the photosensitive resin composition of the present invention. When a thick film pattern is formed, it is necessary to have the same degree of decomposition rate of the photobase generator from the surface to the lower side. At this time, in order to improve the sensitivity, it is preferred to add a base multiplying agent. A base multiplying agent disclosed in, for example, JP-A-2012-237776, JP-A-2006-282657, and the like can be used.

又,本發明之感光性樹脂組成物中,在不會大損及硬化後之膜特性的範圍內,也可添加因光而產生酸之其他的感光性成分。本發明之感光性樹脂組成物中加入具有1個或2個以上之乙烯性不飽和鍵的化合物的情形,也可添加光自由基發生劑。 Further, in the photosensitive resin composition of the present invention, other photosensitive components which generate an acid due to light may be added in a range which does not greatly impair the film properties after curing. When a compound having one or two or more ethylenically unsaturated bonds is added to the photosensitive resin composition of the present invention, a photoradical generator may be added.

為了將加工特性或各種機能性賦予本發明之感光性樹脂組成物時,其他也可調配各種有機或無機之低分子或高分子化合物。例如可使用染料、界面活性劑、平坦劑、可塑劑、微粒子等。微粒子中可含有聚苯乙烯、聚四氟乙烯等之有機微粒子、矽溶膠、碳、層狀矽酸鹽等之無機微粒子等,彼等也可為多孔質或中空構造。為了得到多孔質形狀或中空構造之具體的材料,例如有各種顏料、 填料、及纖維等。 In order to impart processing characteristics or various functional properties to the photosensitive resin composition of the present invention, various organic or inorganic low molecular or high molecular compounds may be blended. For example, a dye, a surfactant, a flat agent, a plasticizer, fine particles, or the like can be used. The fine particles may contain organic fine particles such as polystyrene or polytetrafluoroethylene, inorganic fine particles such as cerium sol, carbon, or layered silicate, and the like may be porous or hollow. In order to obtain a specific material of a porous shape or a hollow structure, for example, various pigments, Fillers, fibers, etc.

本發明之乾薄膜係具有藉由在載體薄膜(支撐體)上塗佈本發明之感光性樹脂組成物,經乾燥所得之樹脂層。乾薄膜之形成係將本發明之感光性樹脂組成物以上述有機溶劑稀釋調整為適當的黏度,然後以缺角輪塗佈機、刮刀塗佈機、唇模塗佈機、桿塗佈機、擠壓塗佈機、逆輥塗佈機、轉移輥塗佈機、凹版塗佈機、噴霧塗佈機等,於載體膜上塗佈成均勻的厚度。然後,使塗佈後之感光性樹脂組成物通常在50~130℃之溫度下乾燥1~30分鐘,可形成樹脂層。關於塗佈膜厚並未特別限制,但一般乾燥後之膜厚為10~150μm,較佳為20~60μm之範圍內適宜選擇。 The dry film of the present invention has a resin layer obtained by applying the photosensitive resin composition of the present invention to a carrier film (support) and drying it. The formation of a dry film is carried out by diluting the photosensitive resin composition of the present invention to an appropriate viscosity with the above-mentioned organic solvent, and then using a notch wheel coater, a knife coater, a lip coater, a rod coater, An extrusion coater, a reverse roll coater, a transfer roll coater, a gravure coater, a spray coater, or the like is applied to a carrier film to have a uniform thickness. Then, the photosensitive resin composition after coating is usually dried at a temperature of 50 to 130 ° C for 1 to 30 minutes to form a resin layer. The coating film thickness is not particularly limited, but is generally suitably selected in the range of 10 to 150 μm, preferably 20 to 60 μm after drying.

載體薄膜可使用塑膠薄膜,較佳為使用聚對苯二甲酸乙二酯等之聚酯薄膜、聚醯亞胺薄膜、聚醯胺醯亞胺薄膜、聚丙烯薄膜、聚苯乙烯薄膜等之塑膠薄膜。關於載體薄膜之厚度,無特別限制,一般在10~150μm之範圍內適宜選擇。 The carrier film may be a plastic film, preferably a polyester film such as polyethylene terephthalate, a polyimide film, a polyimide film, a polypropylene film, a polystyrene film or the like. film. The thickness of the carrier film is not particularly limited, and is generally suitably selected in the range of 10 to 150 μm.

在載體薄膜上形成由本發明之感光性樹脂組成物所成之樹脂層後,為了避免在膜表面附著塵埃等之目的,進一步在膜表面層合可剝離之覆蓋薄膜(cover film)為佳。可剝離之覆蓋薄膜,可使用例如聚乙烯薄膜、聚四氟乙烯薄膜、聚丙烯薄膜、經表面處理後的紙等。覆蓋薄膜係當剝離覆蓋薄膜時,比樹脂層與載體薄膜之接著力小者即可。 After the resin layer formed of the photosensitive resin composition of the present invention is formed on the carrier film, it is preferable to further laminate a peelable cover film on the surface of the film in order to avoid adhesion of dust or the like to the surface of the film. As the peelable cover film, for example, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, a surface-treated paper, or the like can be used. When the cover film is peeled off, the adhesion of the resin layer to the carrier film is small.

其次,說明使用本發明之感光性樹脂組成物作為硬化物之圖型膜之製造方法。 Next, a method of producing a pattern film using the photosensitive resin composition of the present invention as a cured product will be described.

首先,步驟1:將感光性樹脂組成物塗佈於基材上,藉由乾燥得到塗膜。將感光性樹脂組成物塗佈於基材上的方法,可使用以往用於塗佈感光性樹脂組成物的方法,例如以旋轉塗佈機、塗佈棒、刮刀塗佈機、淋幕式塗佈機(curtain coater)、網版印刷機等進行塗佈的方法、以噴塗塗佈機進行噴霧塗佈的方法及噴墨法等。塗膜之乾燥方法,可使用風乾、藉由烤箱或加熱板之加熱乾燥、真空乾燥等的方法。又,塗膜之乾燥係在感光性樹脂組成物中之(A)聚醯胺酸酯不會產生醯亞胺化的條件下進行為佳。具體而言,可在20~140℃下,以1分鐘~1小時的條件下進行自然乾燥、送風乾燥、或加熱乾燥。較佳為在加熱板上進行1~20分鐘乾燥。又,也可真空乾燥,此時,可在室溫下、1分鐘~1小時的條件下進行。 First, in step 1, a photosensitive resin composition is applied onto a substrate, and a coating film is obtained by drying. A method of applying a photosensitive resin composition to a substrate can be carried out by a conventional method for applying a photosensitive resin composition, for example, a spin coater, a coating bar, a knife coater, or a curtain coating. A coating method such as a curtain coater or a screen printing machine, a method of spray coating by a spray coater, an inkjet method, and the like. The drying method of the coating film can be carried out by air drying, drying by heating in an oven or a hot plate, vacuum drying, or the like. Further, it is preferred that the drying of the coating film is carried out under conditions in which the (A) polyphthalamide is not produced by imidization in the photosensitive resin composition. Specifically, natural drying, air drying, or heat drying can be carried out at 20 to 140 ° C for 1 minute to 1 hour. It is preferred to dry on a hot plate for 1 to 20 minutes. Further, it may be dried in a vacuum, and in this case, it may be carried out at room temperature for 1 minute to 1 hour.

基材無特別限限制,可廣泛適用矽晶圓、配線基板、各種樹脂、金屬、半導體裝置之鈍化保護膜等。 The substrate is not particularly limited, and can be widely applied to wafers, wiring boards, various resins, metals, passivation protective films for semiconductor devices, and the like.

又,因可低溫下之醯亞胺化,可廣泛適用於印刷電路板之基板等之高溫處理的構件、材料為特徵。 Moreover, it can be widely applied to members and materials for high-temperature treatment of substrates such as printed circuit boards because of imidization at low temperatures.

其次,步驟2:將上述塗膜介於具有圖型之光罩,或直接曝光。曝光光線係使用可使(B)光鹼產生劑活性化,產生鹼之波長者。如上述,適宜使用增感劑時,可調製光感度。作為曝光裝置可使用接觸對準器(contact aligner)、鏡面投影(mirror projection)、步進機、雷射 直接曝光裝置等。 Next, step 2: the above coating film is placed between the masks having the pattern, or directly exposed. The exposure light is used to activate (B) a photobase generator to generate a wavelength of a base. As described above, when a sensitizer is suitably used, the light sensitivity can be modulated. As an exposure device, a contact aligner, a mirror projection, a stepper, and a laser can be used. Direct exposure device, etc.

接著,步驟3:藉由塗膜中產生之鹼促進塗膜之醯亞胺化來加熱。藉此,上述步驟2中,曝光部所產生之鹼成為觸媒,(A)聚醯胺酸酯局部進行醯亞胺化。加熱時間及加熱溫度係因使用之(A)聚醯胺酸酯、塗佈膜厚、(B)光鹼產生劑之種類而適宜變更。典型上,10μm左右之塗佈膜厚的情形,在110~200℃下為2~10分鐘左右。加熱溫度過低時,無法有效地達成局部的醯亞胺化。此外,加熱溫度過高時,未曝光部進行醯亞胺化,曝光部與未曝光部之溶解性差縮小,在圖型形成上有產生障礙的疑慮。 Next, step 3: heating by promoting the imidization of the coating film by the alkali generated in the coating film. Thereby, in the above step 2, the alkali generated in the exposed portion serves as a catalyst, and (A) the polyphthalate is partially imidized. The heating time and the heating temperature are appropriately changed depending on the type of (A) polyphthalate, the coating film thickness, and (B) the photobase generator. Typically, the coating film thickness of about 10 μm is about 2 to 10 minutes at 110 to 200 °C. When the heating temperature is too low, local oxime imidization cannot be effectively achieved. Further, when the heating temperature is too high, the unexposed portion is imidized, and the solubility of the exposed portion and the unexposed portion is inferior, and there is a concern that the pattern is formed.

其次,步驟4:以顯影液處理塗膜。藉此,在基材上可形成(A)聚醯胺酸酯及經局部醯亞胺化之聚醯亞胺所成的圖型膜。 Next, step 4: treating the coating film with a developing solution. Thereby, a patterned film of (A) polyphthalate and a partially quinned imidized polyimide can be formed on the substrate.

顯影用的方法,可選自以往所知之光阻的顯影方法,例如旋轉噴霧法、槳式法、伴隨超音波處理之浸漬法等中任意的方法。顯影液可列舉氫氧化鈉、碳酸鈉、矽酸鈉、氨水等之無機鹼類、乙胺、二乙胺、三乙胺、三乙醇胺等之有機胺類、氫氧化四甲基銨、氫氧化四丁基銨等之四級銨鹽類等之水溶液。又,必要時可使用在此等中添加適當量之甲醇、乙醇、異丙醇等之水溶性有機溶劑或界面活性劑的水溶液。然後,必要時藉由清洗液洗淨塗膜得到圖型膜。清洗液可單獨或組合使用蒸餾水、甲醇、乙醇、異丙醇等。又,顯影液可使用例如N-甲基-2-吡咯烷 酮、N-乙醯基-2-吡咯烷酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、二甲基亞碸、γ-丁內酯、六甲基磷三醯胺、甲醇、乙醇、異丙醇、甲基卡必醇、乙基卡必醇、甲苯、二甲苯、乳酸乙酯、丙酮酸乙酯、丙二醇單甲醚乙酸酯、甲基-3-甲氧基丙酸酯、乙基-3-乙氧基丙酸酯、2-庚酮、乙酸乙酯、二丙酮醇等有機溶劑。 The method for development may be selected from a conventional development method of a photoresist, such as a rotary spray method, a paddle method, or a dipping method accompanying ultrasonic treatment. Examples of the developer include inorganic bases such as sodium hydroxide, sodium carbonate, sodium citrate, and aqueous ammonia, organic amines such as ethylamine, diethylamine, triethylamine, and triethanolamine, tetramethylammonium hydroxide, and hydrogen hydroxide. An aqueous solution of a quaternary ammonium salt such as tetrabutylammonium. Further, if necessary, an aqueous solution in which an appropriate amount of a water-soluble organic solvent such as methanol, ethanol or isopropyl alcohol or a surfactant is added may be used. Then, if necessary, the coating film is washed by a cleaning liquid to obtain a pattern film. The washing liquid may be distilled water, methanol, ethanol, isopropanol or the like, alone or in combination. Further, for the developer, for example, N-methyl-2-pyrrolidine can be used. Ketone, N-ethinyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethyl hydrazine, γ-butyrolactone, hexamethylphosphorus Tridecylamine, methanol, ethanol, isopropanol, methyl carbitol, ethyl carbitol, toluene, xylene, ethyl lactate, ethyl pyruvate, propylene glycol monomethyl ether acetate, methyl-3 An organic solvent such as methoxypropionate, ethyl-3-ethoxypropionate, 2-heptanone, ethyl acetate or diacetone alcohol.

然後,步驟5:將圖型膜進行加熱。加熱溫度可適宜設定使聚醯亞胺之圖型膜硬化。例如在惰性氣體中,在150~300℃下加熱5~120分鐘左右。加熱溫度更佳的範圍係150~250℃,又更佳的範圍係180~220℃。例如藉由使用加熱板、烤箱、溫度可程式設定的昇溫式烤箱進行加熱。此時之環境(氣體)可使用空氣,也可使用氮、氬等之惰性氣體。 Then, step 5: heating the pattern film. The heating temperature can be suitably set to harden the patterned film of polyimine. For example, in an inert gas, heat at 150 to 300 ° C for about 5 to 120 minutes. The preferred range of heating temperature is 150 to 250 ° C, and the preferred range is 180 to 220 ° C. Heating is performed, for example, by using a hot plate, an oven, and a temperature-programmable oven. In this case, air (air) may be used, or an inert gas such as nitrogen or argon may be used.

本發明之感光性樹脂組成物之用途無特別限定,可列舉例如印刷油墨、接著劑、填充劑、電子材料、光電路零件、成形材料、阻劑材料、建築材料、3次元造形、光學構件等、樹脂材料所使用之習知各種領域.製品等。特別是適合作為聚醯亞胺膜之耐熱性、尺寸安定性、絕緣性等之特性為有效的廣泛領域.製品,例如塗料或印刷油墨、或彩色濾光片、可撓性的顯示器用薄膜、半導體裝置、電子零件、層間絕緣膜、阻焊劑等之配線被覆膜、光電路、光電路零件、抗反射膜、全息照片、光學構件或建築材料之形成材料使用。 The use of the photosensitive resin composition of the present invention is not particularly limited, and examples thereof include printing inks, adhesives, fillers, electronic materials, optical circuit parts, molding materials, resist materials, building materials, ternary shapes, optical members, and the like. , the various fields used in the use of resin materials. Products, etc. In particular, it is suitable for a wide range of fields in which the properties of the polyimide film are excellent in heat resistance, dimensional stability, and insulation properties. Products such as paints or printing inks, or color filters, flexible films for displays, semiconductor devices, electronic parts, interlayer insulating films, solder resists, etc., wiring films, optical circuits, optical circuit parts, anti-reflection The use of films, holograms, optical components or building materials.

特別是含有(A)聚醯胺酸酯之本發明之感光 性樹脂組成物,主要是作為圖型形成材料(阻劑)使用,藉此形成之圖型膜係作為由聚醯亞胺所成之永久膜,而賦予耐熱性或絕緣性的成分產生功能,例如可適用於形成彩色濾光片、可撓性的顯示器用薄膜、電子零件、半導體裝置、層間絕緣膜、阻焊劑或覆蓋薄膜等之配線被覆膜、錫堤、光電路、光電路零件、抗反射膜、其他之光學構件或電子構件。 In particular, the sensitization of the present invention containing (A) polyphthalate The resin composition is mainly used as a pattern forming material (resistance), whereby the patterned film is formed as a permanent film made of polyimide, and functions to impart heat resistance or insulation properties. For example, it can be applied to a wiring film, a tin bank, an optical circuit, an optical circuit component, or the like, which is a color filter, a flexible display film, an electronic component, a semiconductor device, an interlayer insulating film, a solder resist, or a cover film. Antireflective film, other optical components or electronic components.

實施例 Example

以下,使用實施例更詳細說明本發明,但是本發明不限定於下述實施例者。又,以下中,「份」及「%」無特別聲明時,均為質量基準。 Hereinafter, the present invention will be described in more detail by way of examples, but the invention should not be construed as limited. In addition, in the following, when "parts" and "%" are not specifically stated, they are all quality standards.

[合成例1:聚醯胺酸酯A-1之合成] [Synthesis Example 1: Synthesis of Polyurethane A-1]

在作為酸二酐之6FDA(4,4’-(六氟異亞丙基)二苯二甲酸酐)5g中,加入乾燥MeOH約25g,進行迴流。迴流開始後約30分鐘,可得到大致透明的液體。進一步約5小時迴流,經冷卻以孔尺寸0.7μm之過濾器過濾除去雜質。減壓乾燥後,完全除去MeOH,得到白結晶之表1所記載之酸酐的半酯。 To 5 g of 6FDA (4,4'-(hexafluoroisopropylidene)diphthalic anhydride) as an acid dianhydride, about 25 g of dry MeOH was added and refluxed. Approximately 30 minutes after the start of reflux, a substantially clear liquid is obtained. Further, the mixture was refluxed for about 5 hours, and filtered by a filter having a pore size of 0.7 μm to remove impurities. After drying under reduced pressure, MeOH was completely removed to obtain a half ester of an acid anhydride as described in Table 1 of white crystals.

在容量100ml之三口燒瓶中,投入表1所記載之酸酐的半酯5mmol及無水3-甲基-1-苯基-2-磷烯(phosphorene)1-氧化物0.0125mmol後,氮氣流下,以 10ml之脫水環丁碸使溶解。將作為二異氰酸酯之無水ITI(二異氰酸異佛爾酮)5mmol以5ml脫水環丁碸使溶解,以約5分鐘滴下至燒瓶中。使混合溶液以200℃、反應3小時,在MeOH 500ml中沉澱。將含有沉澱的溶液過濾進行乾燥得到高分子前驅物聚合物。將所得之聚合物溶解於DMAc(N,N-二甲基乙醯胺)中,以MeOH再沉澱。進行過濾、乾燥,製作以脫水DMAc作為溶劑之15質量%的聚醯胺酸酯A-1溶液。 Three-necked flask of 100ml in capacity, into an acid anhydride half esters described in the table and anhydrous 5mmol 3- methyl-1-phenyl-2-phospholene post-ene (phosphorene) 1- oxide 0.0125 mmol, nitrogen flow 10 ml of the dehydrated guanidine was dissolved. 5 mmol of anhydrous ITI (isophorone diisocyanate) as a diisocyanate was dissolved in 5 ml of dehydrated cyclobutyl hydrazine, and dropped into the flask over about 5 minutes. The mixed solution was allowed to react at 200 ° C for 3 hours, and precipitated in 500 ml of MeOH. The solution containing the precipitate was filtered and dried to obtain a polymer precursor polymer. The resulting polymer was dissolved in DMAc (N,N-dimethylacetamide) and reprecipitated with MeOH. Filtration and drying were carried out to prepare a 15% by mass polyglycolate A-1 solution using dehydrated DMAc as a solvent.

[合成例2:聚醯胺酸酯A-2之合成] [Synthesis Example 2: Synthesis of Polyurethane A-2]

除了將作為酸二酐之6FDA變更為PMDA(均苯四甲酸酐)外,與合成例1同樣製作聚醯胺酸酯A-2溶液。 A polyphthalate A-2 solution was prepared in the same manner as in Synthesis Example 1, except that 6FDA which is an acid dianhydride was changed to PMDA (pyromellitic anhydride).

[合成例3:聚醯胺酸酯A-3之合成] [Synthesis Example 3: Synthesis of Polyurethane A-3]

除了將作為二異氰酸酯之無水ITI變更為下述表所記載之無水MDI(4,4’-二異氰酸亞甲基二苯酯)外,與合成例1同樣製作聚醯胺酸酯A-3溶液。 A polyperurate A- was produced in the same manner as in Synthesis Example 1, except that the anhydrous ITI as a diisocyanate was changed to anhydrous MDI (methylene diphenyl 4,4'-diisocyanate) described in the following Table. 3 solution.

[合成例4:聚醯胺酸酯A-4之合成] [Synthesis Example 4: Synthesis of Polyamine A-4]

除了將作為酸二酐之6FDA變更為PMDA,將作為二異氰酸酯之無水ITI變更為下述表所記載之無水MDI外,與合成例1同樣製作聚醯胺酸酯A-4溶液。 The polyphthalate A-4 solution was prepared in the same manner as in Synthesis Example 1, except that the 6FDA as the acid dianhydride was changed to PMDA, and the anhydrous ITI as the diisocyanate was changed to the anhydrous MDI described in the following Table.

[合成例5:聚醯胺酸酯A-5之合成] [Synthesis Example 5: Synthesis of Polyurethane A-5]

除了將作為二異氰酸酯之無水ITI變更為下述表所記載之無水TDI-1(2,4-甲苯二異氰酸酯)外,與合成例1同樣製作聚醯胺酸酯A-5溶液。 A polyphthalate A-5 solution was prepared in the same manner as in Synthesis Example 1, except that the anhydrous ITI as the diisocyanate was changed to the anhydrous TDI-1 (2,4-toluene diisocyanate) described in the following Table.

[合成例6:聚醯胺酸酯A-6之合成] [Synthesis Example 6: Synthesis of Polyurethane A-6]

除了將作為酸二酐之6FDA變更為PMDA,將作為二異氰酸酯之無水ITI變更為下述表所記載之無水TDI-1外,與合成例1同樣製作聚醯胺酸酯A-6溶液。 A polyphthalate A-6 solution was prepared in the same manner as in Synthesis Example 1, except that the 6FDA as the acid dianhydride was changed to PMDA, and the anhydrous ITI as the diisocyanate was changed to the anhydrous TDI-1 described in the following Table.

[合成例7:聚醯胺酸酯A-7之合成] [Synthesis Example 7: Synthesis of Polyurethane A-7]

除了將作為酸二酐之6FDA變更為TDA(1,3,3a,4,5,9b-六氫化-5(四氫-2,5-二氧-3-呋喃基)萘[1,2- c]呋喃-1,3-二酮),將作為二異氰酸酯之無水ITI變更為下述表所記載之無水TDI-2(2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之混合物(80:20)外,與合成例1同樣製作聚醯胺酸酯A-7溶液。 In addition to changing the 6FDA as an acid dianhydride to TDA (1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)naphthalene [1,2- c] furan-1,3-dione), the anhydrous ITI as a diisocyanate was changed to the anhydrous TDI-2 (mixture of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate described in the following table ( Polyacetate A-7 solution was prepared in the same manner as in Synthesis Example 1 except for 80:20.

[合成例8:聚醯胺酸酯A-8之合成] [Synthesis Example 8: Synthesis of polyphthalate A-8]

除了將作為酸二酐之6FDA變更為TDA,將作為二異氰酸酯之無水ITI變更為下述表所記載之無水MDI外,與合成例1同樣製作聚醯胺酸酯A-8溶液。 A polyphthalate A-8 solution was prepared in the same manner as in Synthesis Example 1, except that the 6FDA as the acid dianhydride was changed to TDA, and the anhydrous ITI as the diisocyanate was changed to the anhydrous MDI described in the following table.

[合成例9:聚醯胺酸酯A-9之合成] [Synthesis Example 9: Synthesis of Polyurethane A-9]

除了將作為酸二酐之6FDA變更為TDA外,與合成 例1同樣製作聚醯胺酸酯A-9溶液。 In addition to changing the 6FDA as acid dianhydride to TDA, and synthesis Example 1 A polyphthalate A-9 solution was also prepared.

[合成例10:聚醯胺酸酯A-10之合成] [Synthesis Example 10: Synthesis of Polyurethane A-10]

除了將作為酸二酐之6FDA變更為PMDA,將作為二異氰酸酯之無水ITI變更為下述表所記載之無水HMDI(六亞甲基二異氰酸酯)外,與合成例1同樣製作聚醯胺酸酯A-10溶液。 In the same manner as in Synthesis Example 1, except that the 6 FDA as the acid dianhydride was changed to PMDA, and the anhydrous ITI as the diisocyanate was changed to the anhydrous HMDI (hexamethylene diisocyanate) described in the following Table. A-10 solution.

[合成例11:聚醯胺酸酯A-11之合成] [Synthesis Example 11: Synthesis of polyphthalate A-11]

除了在合成例1中,將MeOH變更為tert-丁醇外,與合成例1同樣製作聚醯胺酸酯A-11溶液。 A polyphthalate A-11 solution was prepared in the same manner as in Synthesis Example 1, except that in MeOH, MeOH was changed to tert-butanol.

[合成例12:聚醯胺酸酯A-12之合成] [Synthesis Example 12: Synthesis of Polyurethane A-12]

除了在合成例2中,將MeOH變更為tert-丁醇外,與合成例2同樣製作聚醯胺酸酯A-12溶液。 A polyphthalate A-12 solution was prepared in the same manner as in Synthesis Example 2 except that in MeOH, MeOH was changed to tert-butanol.

[合成例13:聚醯胺酸酯A-13之合成] [Synthesis Example 13: Synthesis of Polyurethane A-13]

除了在合成例3中,將MeOH變更為tert-丁醇外,與合成例3同樣製作聚醯胺酸酯A-13溶液。 A polyphthalate A-13 solution was prepared in the same manner as in Synthesis Example 3 except that in MeOH, MeOH was changed to tert-butanol.

[合成例14:聚醯胺酸酯A-14之合成] [Synthesis Example 14: Synthesis of Polyurethane A-14]

除了在合成例4中,將MeOH變更為tert-丁醇外,與合成例4同樣製作聚醯胺酸酯A-14溶液。 A polyphthalate A-14 solution was prepared in the same manner as in Synthesis Example 4 except that in MeOH, MeOH was changed to tert-butanol.

[合成例15:聚醯胺酸酯A-15之合成] [Synthesis Example 15: Synthesis of Polyurethane A-15]

除了在合成例5中,將MeOH變更為tert-丁醇外,與合成例5同樣製作聚醯胺酸酯A-15溶液。 A polyphthalate A-15 solution was prepared in the same manner as in Synthesis Example 5 except that in MeOH, MeOH was changed to tert-butanol.

[合成例16:聚醯胺酸酯A-16之合成] [Synthesis Example 16: Synthesis of Polyurethane A-16]

除了在合成例6中,將MeOH變更為tert-丁醇外,與合成例6同樣製作聚醯胺酸酯A-16溶液。 A polyphthalate A-16 solution was prepared in the same manner as in Synthesis Example 6, except that in MeOH, MeOH was changed to tert-butanol.

[合成例17:聚醯胺酸酯A-17之合成] [Synthesis Example 17: Synthesis of Polyurethane A-17]

除了在合成例7中,將MeOH變更為tert-丁醇外,與合成例7同樣製作聚醯胺酸酯A-17溶液。 A polyphthalate A-17 solution was prepared in the same manner as in Synthesis Example 7, except that in MeOH, MeOH was changed to tert-butanol.

[合成例18:聚醯胺酸酯A-18之合成] [Synthesis Example 18: Synthesis of Polyurethane A-18]

除了在合成例8中,將MeOH變更為tert-丁醇外,與合成例8同樣製作聚醯胺酸酯A-18溶液。 A polyphthalate A-18 solution was prepared in the same manner as in Synthesis Example 8, except that in MeOH, MeOH was changed to tert-butanol.

[合成例19:聚醯胺酸酯A-19之合成] [Synthesis Example 19: Synthesis of Polyurethane A-19]

除了在合成例9中,將MeOH變更為tert-丁醇外,與合成例9同樣製作聚醯胺酸酯A-19溶液。 A polyphthalate A-19 solution was prepared in the same manner as in Synthesis Example 9, except that in MeOH, MeOH was changed to tert-butanol.

[合成例20:聚醯胺酸酯A-20之合成] [Synthesis Example 20: Synthesis of Polyurethane A-20]

除了在合成例10中,將MeOH變更為tert-丁醇外,與合成例10同樣製作聚醯胺酸酯A-20溶液。 A polyphthalate A-20 solution was prepared in the same manner as in Synthesis Example 10 except that in MeOH, MeOH was changed to tert-butanol.

[比較合成例1:聚醯胺酸R-1之合成] [Comparative Synthesis Example 1: Synthesis of Polylysine R-1]

在容量300ml之可分離燒瓶中,投入下述表所記載之二胺30mmol後,氮氣流下,以脫水DMAc(N,N-二甲基乙醯胺)使二胺溶解。使二胺全部溶解後,徐徐添加作為酸酐之下述表所記載之6FDA 30mmol。以少量的DMAc使附著於燒瓶壁的6FDA流入反應溶液後,在室溫下攪拌24小時使反應,得到15質量%之聚醯胺酸溶液。脫水DMAc之投入量係聚醯胺酸溶液量的75質量%。 In a separable flask having a capacity of 300 ml, 30 mmol of the diamine described in the following table was charged, and then the diamine was dissolved by dehydrating DMAc (N,N-dimethylacetamide) under a nitrogen stream. After all the diamine was dissolved, 6 FDA 30 mmol described in the following table as an acid anhydride was slowly added. After 6 FDA adhering to the wall of the flask was poured into the reaction solution with a small amount of DMAc, the mixture was stirred at room temperature for 24 hours to obtain a 15 mass% polyamine acid solution. The amount of the dehydrated DMAc charged was 75% by mass based on the amount of the polyamic acid solution.

[比較合成例2:聚醯胺酸R-2之合成] [Comparative Synthesis Example 2: Synthesis of Polylysine R-2]

除了將作為酸酐之6FDA變更為PMDA外,與比較合成例1同樣製作聚醯胺酸R-2溶液。 A poly-proline R-2 solution was prepared in the same manner as in Comparative Synthesis Example 1, except that 6FDA as an acid anhydride was changed to PMDA.

[比較合成例3] [Comparative Synthesis Example 3]

依據日本特開2003-084435號公報之比較例2所記載的合成步驟,使用3,3’,4,4’-二苯基醚四羧酸二酐(ODPA)、4,4’-二胺基二苯基醚(DDE,ODA)及乙醇(EtOH),合成經100%酯化的聚醯胺酸酯,製作聚醯胺酸酯R-3溶液。 According to the synthesis procedure described in Comparative Example 2 of JP-A-2003-084435, 3,3',4,4'-diphenylether tetracarboxylic dianhydride (ODPA), 4,4'-diamine is used. Polydidecylate R-3 solution was prepared by synthesizing 100% esterified polyphthalate by using diphenyl ether (DDE, ODA) and ethanol (EtOH).

(實施例1~28、比較例1~3) (Examples 1 to 28, Comparative Examples 1 to 3)

以下述表23、24所記載之調配比(質量比),相對於上述所得之聚醯胺酸酯、聚醯胺酸溶液,調配光鹼產生劑,使溶解得到實施例及比較例之感光性樹脂組成物。光鹼產生劑係以感光性樹脂組成物全量基準,添加10質量%。又,表中之聚醯胺酸酯、聚醯胺酸之調配量表示固體成分量。 With the blending ratio (mass ratio) described in the following Tables 23 and 24, a photobase generator was prepared with respect to the polyphthalate or polylysine solution obtained above, and the photosensitivity of the examples and the comparative examples was obtained by dissolution. Resin composition. The photobase generator was added in an amount of 10% by mass based on the total amount of the photosensitive resin composition. Further, the amount of the polyamidomate and the polyaminic acid in the table indicates the amount of the solid component.

[圖型膜之形成方法] [Formation method of pattern film]

將實施例及比較例之各感光性樹脂組成物旋轉塗佈於晶圓上,在80℃之加熱板上乾燥20分鐘,使乾燥後之膜厚成為5μm。在所得之乾燥膜上配置圖型遮罩,使用桌上型曝光裝置(三永電機公司製),以表23、24中所記載的曝光量進行寬廣(broad)曝光。將該晶圓於150℃之加熱板上加熱6分鐘後,浸漬於有機溶劑顯影液(DMAc(二甲基乙醯胺))、或鹼顯影液(2.38質量%TMAH(氫氧化四甲基銨)水溶液與2-丙醇之1:1重量比混合溶液)中進行顯影。 Each of the photosensitive resin compositions of the examples and the comparative examples was spin-coated on a wafer, and dried on a hot plate at 80 ° C for 20 minutes to have a film thickness after drying of 5 μm. A pattern mask was placed on the obtained dried film, and a broad exposure was performed using the exposure amount described in Tables 23 and 24 using a desktop exposure apparatus (manufactured by Sanyo Electric Co., Ltd.). The wafer was heated on a hot plate at 150 ° C for 6 minutes, and then immersed in an organic solvent developing solution (DMAc (dimethylacetamide)) or an alkali developing solution (2.38 mass% TMAH (tetramethylammonium hydroxide) Development was carried out in a mixed solution of an aqueous solution and 2-propanol in a 1:1 weight ratio.

[解析度之評價] [Evaluation of resolution]

解析度之評價係以電子顯微鏡觀察上述顯影後的圖型,評價形成圖型中,良好解析之最小形狀之大小。 The evaluation of the resolution was performed by observing the pattern after development by an electron microscope, and the size of the smallest shape which was well analyzed in the pattern formation was evaluated.

數值:最小圖型尺寸(μm) Value: Minimum graphic size (μm)

×:無法形成圖型 ×: Cannot form a pattern

由表23,24所示的結果得知本發明之感光性樹脂組成物可得到圖型膜。又,相較於非離子型光鹼產生劑,含有離子型光鹼產生劑之組成物者,感度較高,且更良好的解析度。此外,藉由使用聚醯胺酸Tert-丁酯,進 行鹼顯影,對於未曝光部之溶解有促進效果,可形成更佳的圖型。另外,取代本發明中之特定之聚醯胺酸酯,而調配有其他聚醯胺酸或聚醯胺酸酯之比較例的感光性樹脂組成物係圖型膜之形成困難。 From the results shown in Tables 23 and 24, it was found that the photosensitive resin composition of the present invention can obtain a pattern film. Further, compared with the nonionic photobase generator, the composition containing the ionic photobase generator has a higher sensitivity and a better resolution. In addition, by using poly-telluric acid Tert-butyl ester, Alkaline development has a promoting effect on the dissolution of the unexposed portion, and a better pattern can be formed. Further, in place of the specific polyphthalate ester of the present invention, the photosensitive resin composition of the comparative example in which another polyglycolic acid or polyglycolate is blended is difficult to form.

Claims (7)

一種感光性樹脂組成物,其係含有(A)聚醯胺酸酯及(B)光鹼產生劑之感光性樹脂組成物,其中前述(A)聚醯胺酸酯為具有下述通式(1)表示之結構者, (式(1)中,R1係4價有機基,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數)。 A photosensitive resin composition comprising (A) a polyphthalate and (B) a photobase generator, wherein the (A) polyphthalamide has the following formula ( 1) the structure of the representation, (In the formula (1), R 1 is a tetravalent organic group, and R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded by an alkyl group, and an alkyl group. Any one, X is a divalent organic group, and R 3 and R 4 are a monovalent organic group which may be the same or different from each other or a functional group having a fluorene, m is an integer of 1 or more, and n is an integer of 0 or more) . 如申請專利範圍第1項之感光性樹脂組成物,其中前述通式(1)中之R1為含有芳香族環與脂肪族烴環之縮合環的4價有機基、含有芳香族基與脂環式烴基之4價有機基、或含氟原子之4價有機基。 The photosensitive resin composition of the first aspect of the invention, wherein R 1 in the above formula (1) is a tetravalent organic group containing a condensed ring of an aromatic ring and an aliphatic hydrocarbon ring, and contains an aromatic group and a fat. a tetravalent organic group of a cyclic hydrocarbon group or a tetravalent organic group of a fluorine atom. 如申請專利範圍第1項之感光性樹脂組成物,其中前述(A)聚醯胺酸酯為具有以下述通式(1-1)及(1-2)之至少任一表示之結構者, (式(1-1)中,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數) (式(1-2)中,R2係具有脂環式骨架之基、伸苯基、具有以伸烷基鍵結之聯伸二苯骨架之基、及伸烷基之任一,X為2價有機基,R3及R4為可彼此相同或相異之1價有機基或具有矽之官能基,m為1以上之整數,n為0或1以上之整數)。 The photosensitive resin composition of the first aspect of the invention, wherein the (A) polyphthalate is a structure having at least one of the following general formulae (1-1) and (1-2), (In the formula (1-1), R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded to an alkyl group, and an alkyl group, and X is 2 a valence organic group, R 3 and R 4 are a monovalent organic group which may be the same or different from each other or a functional group having a fluorene, m is an integer of 1 or more, and n is an integer of 0 or more) (In the formula (1-2), R 2 is a group having an alicyclic skeleton, a phenyl group, a group having a stretching diphenyl skeleton bonded to an alkyl group, and an alkyl group, and X is 2 The valence organic group, R 3 and R 4 are a monovalent organic group or a functional group having a fluorene which may be the same or different from each other, m is an integer of 1 or more, and n is an integer of 0 or more). 如申請專利範圍第1項之感光性樹脂組成物,其中前述(B)光鹼產生劑為離子型光鹼產生劑。 The photosensitive resin composition of claim 1, wherein the (B) photobase generator is an ionic photobase generator. 一種乾薄膜,其係具有將如申請專利範圍第1項之感光性樹脂組成物塗佈於薄膜,經乾燥所得的樹脂層。 A dry film obtained by applying a photosensitive resin composition according to claim 1 of the patent application to a film and drying the resin layer. 一種硬化物,其係將如申請專利範圍第1~4項中任一項之感光性樹脂組成物或如申請專利範圍第5項之乾薄膜的樹脂層進行硬化所得者。 A cured product obtained by hardening a photosensitive resin composition according to any one of claims 1 to 4 or a resin layer of a dry film according to claim 5 of the patent application. 一種印刷電路板,其係具有如申請專利範圍第6項之硬化物者。 A printed circuit board having a cured product as in claim 6 of the patent application.
TW106101241A 2016-01-13 2017-01-13 Photosensitive resin composition, dry film, cured product and printed circuit board TWI735508B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-004824 2016-01-13
JP2016004824 2016-01-13

Publications (2)

Publication Number Publication Date
TW201738654A true TW201738654A (en) 2017-11-01
TWI735508B TWI735508B (en) 2021-08-11

Family

ID=59311070

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101241A TWI735508B (en) 2016-01-13 2017-01-13 Photosensitive resin composition, dry film, cured product and printed circuit board

Country Status (5)

Country Link
JP (1) JP6738353B2 (en)
KR (1) KR102674122B1 (en)
CN (1) CN108475023B (en)
TW (1) TWI735508B (en)
WO (1) WO2017122744A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7233189B2 (en) * 2018-09-21 2023-03-06 太陽ホールディングス株式会社 Photosensitive resin composition, dry film, cured product and electronic parts

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206117A (en) * 1991-08-14 1993-04-27 Labadie Jeffrey W Photosensitive polyamic alkyl ester composition and process for its use
JP2001019847A (en) * 1999-07-09 2001-01-23 Toray Ind Inc Photosensitive polyimide precursor composition and metal foil/polyimide composite material
JP4687938B2 (en) 2001-09-13 2011-05-25 日立化成デュポンマイクロシステムズ株式会社 Negative photosensitive resin composition, pattern manufacturing method, and electronic component
JP4154955B2 (en) * 2002-08-09 2008-09-24 日立化成デュポンマイクロシステムズ株式会社 Photosensitive resin composition, relief pattern using the same, heat-resistant coating film, method for producing heat-resistant insulating pattern, and electronic component having them
JP4830435B2 (en) * 2005-09-30 2011-12-07 大日本印刷株式会社 Photosensitive resin composition and article
JP5321188B2 (en) * 2008-03-31 2013-10-23 大日本印刷株式会社 Photosensitive resin composition, article, and pattern forming method
US8071273B2 (en) * 2008-03-31 2011-12-06 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
JP5197148B2 (en) 2008-05-16 2013-05-15 キヤノン株式会社 toner
JP5201155B2 (en) * 2009-01-27 2013-06-05 新日本理化株式会社 Poly (amide acid-imide) resin
JP2010186134A (en) * 2009-02-13 2010-08-26 Asahi Kasei E-Materials Corp Photosensitive resin composition and circuit board using the same
WO2010104082A1 (en) * 2009-03-10 2010-09-16 日産化学工業株式会社 Polyimide precursor, polyimide, and liquid-crystal alignment material
KR102229343B1 (en) * 2013-04-18 2021-03-19 다이요 잉키 세이조 가부시키가이샤 Laminate structure, flexible printed wiring board and method for manufacturing same
JP6138943B2 (en) * 2013-08-09 2017-05-31 太陽ホールディングス株式会社 Photosensitive resin composition, relief pattern film thereof, method for producing relief pattern film, electronic component or optical product including relief pattern film, and adhesive including photosensitive resin composition
WO2015064280A1 (en) * 2013-10-30 2015-05-07 太陽インキ製造株式会社 Photosensitive heat-curable resin composition and flexible printed wiring board
JP6462983B2 (en) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 Photosensitive thermosetting resin composition and flexible printed wiring board
JP6538509B2 (en) * 2015-01-13 2019-07-03 太陽ホールディングス株式会社 Photosensitive resin composition, dry film and cured product thereof, electronic component or optical product containing cured product, and adhesive containing photosensitive resin composition

Also Published As

Publication number Publication date
KR102674122B1 (en) 2024-06-12
KR20180102622A (en) 2018-09-17
WO2017122744A1 (en) 2017-07-20
TWI735508B (en) 2021-08-11
JP6738353B2 (en) 2020-08-12
JPWO2017122744A1 (en) 2018-11-01
CN108475023A (en) 2018-08-31
CN108475023B (en) 2022-02-25

Similar Documents

Publication Publication Date Title
TWI384015B (en) A polyimide precursor, a photosensitive polyimide precursor composition, a photosensitive dry film, and a flexible printed circuit board using the same
TWI662368B (en) Photosensitive resin composition, its dry film and cured product, electronic parts or optical products containing cured product, and adhesive containing photosensitive resin composition
TW201106105A (en) Photosensitive resin composition and cured film
JP2019045735A (en) Positive photosensitive resin composition and cured product thereof
TW201704876A (en) Positive-tone photosensitive resin composition, dry film, cured product, and printed wiring board
CN108700805B (en) Photosensitive resin composition, dry film, cured product, printed wiring board, and photobase generator
TWI735508B (en) Photosensitive resin composition, dry film, cured product and printed circuit board
TWI629311B (en) Embossed pattern film, method for producing embossed pattern film, electronic component or optical article containing embossed pattern film, and adhesive containing photosensitive resin composition
TWI834824B (en) Polybenzoxazole precursors, photosensitive resin compositions, dry films, cured products and electronic parts containing ester diamines
JP7071205B2 (en) Positive photosensitive resin compositions, dry films, patterned coatings and electronic components
TW202022494A (en) Photosensitive resin composition, dry film, cured product, and electronic component
JP2020160338A (en) Photosensitive resin composition, dry film, cured product, and electronic component
WO2024071380A1 (en) Resin composition, cured object, layered product, method for producing cured object, method for producing layered product, method for producing semiconductor device, and semiconductor device
WO2024053655A1 (en) Photosensitive resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device
WO2020195804A1 (en) Photosensitive resin composition, dry film, cured object, and electronic component
TW202335837A (en) Laminate, device, resin composition, method for manufacturing cured product, method for manufacturing laminate, and method for manufacturing device