TW201736515A - Condensation reaction-type silicone composition and cured product - Google Patents

Condensation reaction-type silicone composition and cured product Download PDF

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TW201736515A
TW201736515A TW106101293A TW106101293A TW201736515A TW 201736515 A TW201736515 A TW 201736515A TW 106101293 A TW106101293 A TW 106101293A TW 106101293 A TW106101293 A TW 106101293A TW 201736515 A TW201736515 A TW 201736515A
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component
group
condensation reaction
composition
cured product
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TWI663215B (en
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Kenichiro Sato
Yuta Yaguchi
Yuji Ogawa
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Pelnox Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

Abstract

The objective of the present invention is to provide a condensation reaction-type silicone composition which has excellent initial curability and provides a cured product that exhibits adhesion with excellent toughness, while having good cracking resistance, void resistance and heat resistance. The present invention is a condensation reaction-type silicone composition that contains (A) a polysilsesquioxane which contains a trisiloxy unit (TA) represented by R1SiO3/2 (wherein R1 represents an alkyl group having 1-15 carbon atoms, or the like) and a hydroxyl group, and which is in a solid state at room temperature, (B) a polysilsesquioxane which contains a trisiloxy unit (TB) represented by R2SiO3/2 (wherein R2 represents an alkyl group having 1-15 carbon atoms, or the like) and an -OR2 group (wherein R2 represents an alkyl group having 1-15 carbon atoms, or the like), and which is in a liquid state at room temperature, and (C) a condensation reaction catalyst.

Description

縮合反應型矽氧烷組成物及硬化物Condensation reaction type oxoxane composition and hardened substance

本發明關於一種縮合反應型矽氧烷組成物及硬化物。The present invention relates to a condensation reaction type oxoxane composition and a cured product.

矽氧烷樹脂一般而言,是使矽氧烷(聚有機矽氧烷)彼此發生硬化反應所得到的硬化物,該硬化反應已知有縮合反應及加成反應。The decane resin is generally a cured product obtained by subjecting a siloxane (polyorganosiloxane) to hardening reaction, and a condensation reaction and an addition reaction are known.

加成反應是使具有Si-CH=CH2 等的烯矽烷基的矽氧烷與具有氫矽基(Si-H)的矽氧烷在鉑系觸媒的存在下發生氫矽烷化的反應。即使在室溫下,加成反應也能夠在較短時間內產生目標之硬化物,因此在生產性這點是有利的。但是,加成反應會因為鉑觸媒的失活、使用環境的濕氣等,而有硬化容易受到阻礙的問題。The addition reaction is a reaction in which a decane having an olefinyl group such as Si-CH=CH 2 and a decane having a hydroquinone group (Si-H) is hydrohalogenated in the presence of a platinum-based catalyst. Even at room temperature, the addition reaction can produce a target cured product in a short period of time, and thus it is advantageous in terms of productivity. However, the addition reaction may cause a problem that the hardening is easily hindered due to deactivation of the platinum catalyst, moisture in the use environment, and the like.

縮合反應是使具有烷氧基(Si-OR)等的有機氧基或矽醇基(Si-OH)的矽氧烷彼此在有機錫系觸媒等的存在下發生脫水縮合及/或脫醇縮合的反應。縮合反應的硬化阻礙問題小,由於不使用鉑觸媒,因此也有成本優勢。但是,縮合反應與加成反應相比,初始硬化性較不足,需要較高溫及較長時間才能達到完全硬化。The condensation reaction is such that deuteration and/or dealcoholation occurs in the presence of an organotin-based catalyst such as an organooxy group having alkoxy group (Si-OR) or a decyl group (Si-OH). Condensation reaction. The problem of hardening inhibition of the condensation reaction is small, and since platinum catalyst is not used, there is also a cost advantage. However, compared with the addition reaction, the condensation reaction is insufficient in initial hardenability, and it takes a relatively high temperature and a long time to achieve complete hardening.

縮合反應型矽氧烷組成物,一直以來都被供應至例如光半導體用的密封劑、黏著劑等的用途。例如在專利文獻1中記載了一種含有丙烯酸樹脂、縮合反應性矽氧烷化合物及/或縮合反應性矽烷化合物、及硬化促進劑的矽氧烷組成物。另外,引用文獻1還記載了該矽氧烷化合物能夠作為發光二極體元件的透明密封劑及黏著劑使用。The condensation reaction type oxoxane composition has been conventionally used for applications such as a sealant for an optical semiconductor, an adhesive, and the like. For example, Patent Document 1 describes a decane composition containing an acrylic resin, a condensation-reactive siloxane compound, a condensation-reactive decane compound, and a curing accelerator. Further, Citation 1 also discloses that the siloxane compound can be used as a transparent sealant and an adhesive for a light-emitting diode element.

另一方面,在專利文獻2中指出,以往的縮合反應型矽氧烷組成物的硬化物,一般而言,在使用作為光半導體用密封劑的情況,對於反光板材或金屬電極的接著性不足。其中一個理由被認為是無法兼顧接著層(硬化物)的強度與柔軟性。On the other hand, in the case of the cured product of the conventional condensation reaction type oxoxane composition, in general, when it is used as a sealing agent for an optical semiconductor, the adhesion to the reflective sheet or the metal electrode is insufficient. . One of the reasons is considered to be that the strength and softness of the adhesive layer (hardened material) cannot be balanced.

為了提高硬化物的柔軟性,有人嘗試將例如由(CH3 )2 SiO2/2 所表示的二矽烷氧基單元導入矽氧烷聚合物的主鏈。但是,隨著前述二矽烷氧基單元的導入量增加,無法避免強度及接著性降低。另一方面,為了提高硬化物的強度,有人嘗試導入例如由CH3 SiO3/2 所表示的三矽烷氧基單元。但是,隨著前述三矽烷氧基單元的導入量增加,無法避免硬化物發生龜裂,而且此情況下接著性也會降低。像這樣,強度與柔軟性通常為互償關係,目前並未達成非常強韌的接著性。In order to increase the softness of the cured product, attempts have been made to introduce a dioxooxy unit represented by, for example, (CH 3 ) 2 SiO 2/2 into the main chain of the siloxane polymer. However, as the amount of introduction of the above-mentioned dioxanyloxy unit increases, the strength and the decrease in adhesion cannot be avoided. On the other hand, in order to increase the strength of the cured product, attempts have been made to introduce a tridecyloxy unit represented by, for example, CH 3 SiO 3/2 . However, as the amount of introduction of the above-mentioned tridecyloxy unit increases, cracking of the cured product cannot be avoided, and in this case, the adhesion is also lowered. As such, strength and softness are usually mutually reciprocal, and there is currently no very strong adherence.

另外,縮合反應型矽氧烷組成物,在反應過程中會釋放水分或低分子醇,因此硬化物會產生微細的氣泡(void)或龜裂。這些缺陷會使硬化物的機械強度降低,而且還會損害外觀,因此尤其在黏著劑及光半導體用密封劑用途被視為問題。Further, the condensation-reactive type oxoxane composition releases moisture or a low-molecular alcohol during the reaction, so that the cured product generates fine voids or cracks. These defects are expected to cause a problem in that the mechanical strength of the cured product is lowered and the appearance is impaired, and thus the use of the sealant for the adhesive and the optical semiconductor is particularly problematic.

另外,光半導體在使用時,由於元件溫度變高的關係,作為密封材的硬化物也需要高度的耐熱性。關於這點,專利文獻1所記載的縮合反應型矽氧烷組成物,是以丙烯酸樹脂為主成分,耐熱性不足。 [先前技術文獻] [專利文獻]Further, when the optical semiconductor is used, a high heat resistance is required as a cured product of the sealing material due to a high temperature of the element. In this regard, the condensation reaction type oxoxane composition described in Patent Document 1 is mainly composed of an acrylic resin and has insufficient heat resistance. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2008-101093號公報 [專利文獻2]日本特開2015-163661號公報[Patent Document 1] JP-A-2008-101093 (Patent Document 2) JP-A-2015-163661

發明所欲解決的課題 本發明的課題在於提供一種縮合反應型矽氧烷組成物,能夠產生初始硬化性優異,同時具有非常強韌的接著性,且耐龜裂性、耐氣泡性及耐熱性良好的硬化物。 用以解決課題的手段DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION An object of the present invention is to provide a condensation reaction type oxoxane composition which is excellent in initial hardenability and has excellent toughness and is resistant to cracking, bubble resistance and heat resistance. Good hardened material. Means to solve the problem

解決前述課題的縮合反應型矽氧烷組成物,必須減少伴隨縮合反應產生的水或醇等的低分子成分、及有機溶劑其他揮發成分的量。另一方面,硬化物本身當然也須要強度。於是,發明人等考慮到這些狀況,結果發現,藉由製作出含有在室溫下為固體的既定聚倍半矽氧烷與在室溫下為液狀既定聚倍半矽氧烷的組成物,可解決前述課題,而完成了本發明。亦即本發明是關於下述縮合反應型矽氧烷組成物及硬化物。In order to solve the above-described condensation reaction type oxoxane composition, it is necessary to reduce the amount of low molecular components such as water or alcohol generated by the condensation reaction and other volatile components of the organic solvent. On the other hand, the hardened material itself certainly needs strength. Then, the inventors and the like have considered these conditions, and as a result, found that a composition containing a predetermined polysilsesquioxane which is solid at room temperature and a predetermined polysilsesquioxane which is liquid at room temperature is produced. The above problems can be solved and the present invention has been completed. That is, the present invention relates to a condensation reaction type oxoxane composition and a cured product.

1. 一種縮合反應型矽氧烷組成物,含有:一種縮合反應型矽氧烷組成物,含有:(A)在室溫下為固體狀的聚倍半矽氧烷,其含有由R1 SiO3/2 (式中,R1 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TA ),且具有羥基;(B)在室溫下為液狀的聚倍半矽氧烷,其含有由R2 SiO3/2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TB ),且具有-OR2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者);及(C)縮合反應觸媒。A condensation reaction type oxoxane composition comprising: a condensation reaction type oxoxane composition comprising: (A) a polysesquioxane which is solid at room temperature, which contains R 1 SiO 3/2 (wherein R 1 represents a trioxooxy unit (T A ) selected from one of the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group and a benzyl group), and (B) a polysilsesquioxane which is liquid at room temperature and which contains R 2 SiO 3/2 (wherein R 2 represents an alkyl group selected from a carbon number of 1 to 15 and a trioxooxy unit (T B ) represented by one of a group consisting of a phenyl group and a benzyl group, and having -OR 2 (wherein R 2 is selected from an alkyl group having 1 to 15 carbon atoms) And one of the group consisting of phenyl and benzyl); and (C) a condensation reaction catalyst.

2. 如前述第1項之縮合反應型矽氧烷組成物,其中(A)成分的軟化點為40~150℃。2. The condensation reaction type azide composition according to the above item 1, wherein the component (A) has a softening point of 40 to 150 °C.

3. 如前述第1或2項之縮合反應型矽氧烷組成物,其中(B)成分的黏度為5~10000mPa・s/25℃。3. The condensation reaction type oxoxane composition according to the above item 1 or 2, wherein the (B) component has a viscosity of 5 to 10000 mPa·s / 25 °C.

4. 如前述第1至3項中任一項之縮合反應型矽氧烷組成物,其中進一步含有(D)無機填料。4. The condensation reaction type oxoxane composition according to any one of the above items 1 to 3, further comprising (D) an inorganic filler.

5. 前述第1至4項中任一項之縮合反應型矽氧烷組成物的硬化物。 發明效果5. The cured product of the condensation reaction type oxoxane composition according to any one of the above items 1 to 4. Effect of the invention

本發明之縮合反應型矽氧烷組成物的操作性及透明性良好,而且保存安定性及初始硬化性優異。另外,其硬化物的耐熱性及透明性良好,因此即使在長時間加熱後,質量減少率低,透明性幾乎不會降低。另外,該硬化物的耐龜裂性及耐氣泡性亦良好,因此即使在長時間加熱後,也不易發生龜裂或微細的氣泡。另外,該硬化物具有強韌的接著性這點也特別值得一提。The condensation reaction type oxoxane composition of the present invention is excellent in handleability and transparency, and is excellent in storage stability and initial hardenability. Further, since the cured product has good heat resistance and transparency, even after heating for a long period of time, the mass reduction rate is low, and the transparency is hardly lowered. Further, since the cured product is also excellent in crack resistance and bubble resistance, cracks or fine bubbles are less likely to occur even after heating for a long period of time. In addition, it is particularly worth mentioning that the cured product has strong adhesion.

本發明之縮合反應型矽氧烷組成物,像這樣具有許多優點,因此可供應至例如黏著劑、密封劑、塗佈劑、密封劑及塗料等廣泛的用途。具體而言,可利用作為用來將矽、鋁、鐵、金、銀、銅等的同種或異種金屬彼此接合的金屬用黏著劑。另外,本發明之縮合反應型矽氧烷組成物亦可利用作為含有UV-LED、雷射及受光元件的光半導體元件,以及電源模組、溫度感測器等的密封劑或阻障劑。此外,本發明的縮合反應型矽氧烷組成物不僅能夠利用作為用來將玻璃或塑膠製的透鏡、透明窗等接合於支持體的光學黏著劑等,還可利用作為電子基板等的防濕塗佈劑、電阻器等的外殼材料等。The condensation-reactive type oxoxane composition of the present invention has many advantages as described above, and thus can be supplied to a wide range of applications such as an adhesive, a sealant, a coating agent, a sealant, and a paint. Specifically, an adhesive for metal used for joining the same or different metals such as bismuth, aluminum, iron, gold, silver, copper, or the like can be used. Further, the condensation reaction type siloxane composition of the present invention can also be used as an optical semiconductor element including a UV-LED, a laser and a light-receiving element, and a sealant or a barrier agent for a power module, a temperature sensor, or the like. In addition, the condensation reaction type oxoxane composition of the present invention can be used not only as an optical adhesive for bonding a lens made of glass or plastic, a transparent window or the like to a support, but also as a moisture barrier for an electronic substrate or the like. A coating material such as a coating agent or a resistor.

本發明之縮合反應型矽氧烷組成物(以下亦簡稱為「本發明的組成物」)是含有既定(A)固體狀聚烷基倍半矽氧烷(以下亦稱為「(A)成分」)、既定(B)液狀聚烷基倍半矽氧烷(以下亦稱為「(B)成分」)、及(C)縮合反應觸媒(以下亦稱為「(C)成分」)的組成物。The condensation reaction type oxoxane composition of the present invention (hereinafter also referred to simply as "the composition of the present invention") contains a predetermined (A) solid polyalkylsesquioxane (hereinafter also referred to as "(A) component). "), (B) liquid polyalkylsesquioxanes (hereinafter also referred to as "(B) components"), and (C) condensation reaction catalysts (hereinafter also referred to as "(C) components") Composition.

上述「室溫」意指20±15℃,「固體狀」意指完全不具有流動性,通常所謂的固體狀態,「液狀」意指具有流動性的狀態,例如黏度在1000000mPa・s/25℃以下的狀態。此外,黏度是使用E型黏度計所測得的值。The above "room temperature" means 20 ± 15 ° C, "solid" means no fluidity at all, usually a so-called solid state, and "liquid" means a state of fluidity, for example, a viscosity of 1,000,000 mPa·s/25. The state below °C. In addition, the viscosity is a value measured using an E-type viscometer.

(A)成分為含有由R1 SiO3/2 (式中,R1 與前述相同)所表示的三矽烷氧基單元(TA ),且具有羥基,在室溫下為固體狀的聚倍半矽氧烷。The component (A) is a polyvalent alkoxy unit (T A ) represented by R 1 SiO 3/2 (wherein R 1 is the same as defined above) and has a hydroxyl group and is solid at room temperature. Semi-oxane.

由R1 所表示的碳數1~15的烷基,可列舉例如甲基、乙基、正丙基、正丁基、正戊基、正己基、正癸基等的直鏈狀烷基;異丙基、異丁基、異戊基、異己基、異癸基等的支鏈狀烷基、及環己基等的環狀烷基。由R1 所表示的苯基及苄基,並且前述環己基等的環狀烷基,各環上的至少一個氫可被前述碳數1~15的烷基取代。但是,R1 不含異氰酸酯基、硫醇基、胺基、環氧基、酸酐基、及乙烯基等的反應性官能基。The alkyl group having 1 to 15 carbon atoms represented by R 1 may, for example, be a linear alkyl group such as a methyl group, an ethyl group, a n-propyl group, a n-butyl group, a n-pentyl group, a n-hexyl group or a n-decyl group; A branched alkyl group such as an isopropyl group, an isobutyl group, an isopentyl group, an isohexyl group or an isodecyl group, or a cyclic alkyl group such as a cyclohexyl group. The phenyl group and the benzyl group represented by R 1 and the cyclic alkyl group such as the above cyclohexyl group may be substituted with at least one hydrogen of each of the carbon atoms of 1 to 15 carbon atoms. However, R 1 does not contain a reactive functional group such as an isocyanate group, a thiol group, an amine group, an epoxy group, an acid anhydride group, or a vinyl group.

TA 可細分成T1構造[R1 O-Si(R1 )(OR1 )-O-]、T2構造[-(R1 )Si(OR1 )(O-)-O-]及T3構造[-(R1 )Si(O-)2 -O-]。這些構造的比率並不受特別限定,以莫耳比而計,通常T1:T2:T3=0~5:10~40:90~60左右,以只含有T2構造及T3構造為佳。此情況下,T2構造與T3構造的比率為T2:T3=20~30:80~70左右。各構造可藉由測定例如(A)成分的29 Si-NMR光譜來鑑定。T A can be subdivided into T1 structures [R 1 O-Si(R 1 )(OR 1 )-O-], T2 structures [-(R 1 )Si(OR 1 )(O-)-O-], and T3 structures [-(R 1 )Si(O-) 2 -O-]. The ratio of these structures is not particularly limited, and is usually in the range of T1: T2: T3 = 0 to 5: 10 to 40: 90 to 60, and it is preferable to include only the T2 structure and the T3 structure. In this case, the ratio of the T2 structure to the T3 structure is T2: T3 = 20 to 30: 80 to 70. Each configuration can be identified by measuring, for example, a 29 Si-NMR spectrum of the component (A).

TA 在(A)成分中所占的比例不受特別限定。若考慮本發明所期望的效果的平衡,尤其本發明的組成物的相溶性及硬化性等,以及硬化物的強度、接著性、耐龜裂性及耐氣泡性等的平衡,則TA 在(A)成分中所占的比例通常為90莫耳%以上,宜為95莫耳%,較佳為100莫耳%。另外,(A)成分中,在保持在室溫下為固體狀的前提之下,亦可含有若干量的其他單元(單矽烷氧基單元(MA )、二矽烷氧基單元(DA )、或四矽烷氧基單元(QA ))。該其他單元的比率並不受特別限定,通常低於10莫耳%,宜為低於5莫耳%。The proportion of T A in the component (A) is not particularly limited. Considering the balance of the desired effects of the present invention, in particular, the compatibility and hardenability of the composition of the present invention, and the balance of strength, adhesion, crack resistance and bubble resistance of the cured product, T A is The proportion of the component (A) is usually 90 mol% or more, preferably 95 mol%, preferably 100 mol%. Further, the component (A) may contain a certain amount of other units (monodecyloxy unit (M A ), dioxooxy unit (D A )) while maintaining a solid state at room temperature. Or a tetradecyloxy unit (Q A )). The ratio of the other units is not particularly limited, and is usually less than 10 mol%, preferably less than 5 mol%.

(A)成分的構造,具體而言,可由下述平均單元式來表示。The structure of the component (A) can be specifically expressed by the following average unit formula.

(R1 SiO3/2 )x [R1 a SiO(4-a)/2 ]y (R 1 SiO 3/2 ) x [R 1 a SiO (4-a)/2 ] y

前述式中,0<a≦3,0<x,0≦y,且x+y=1。宜為x=1,y=0。In the above formula, 0 < a ≦ 3, 0 < x, 0 ≦ y, and x + y = 1. It should be x=1, y=0.

(A)成分的分子末端含有來自矽醇基的羥基。該羥基的含量並不受特別限定,相對於(A)成分總量,通常為1~10wt%左右。藉由使該羥基的含量在1wt%以上,硬化物的強度及接著性等會更加良好,另外藉由在10wt%以下,隨著硬化反應脫離的成分量降低,硬化物的耐龜裂性及耐氣泡性會更加良好。從這樣的觀點看來,該羥基的含量宜為2~5wt%左右。The molecular terminal of the component (A) contains a hydroxyl group derived from a sterol group. The content of the hydroxyl group is not particularly limited, and is usually about 1 to 10% by weight based on the total amount of the component (A). When the content of the hydroxyl group is 1% by weight or more, the strength and adhesion of the cured product are further improved, and the cracking resistance of the cured product is lowered by the amount of the component which is desorbed by the hardening reaction at 10% by weight or less. Bubble resistance will be better. From such a viewpoint, the content of the hydroxyl group is preferably about 2 to 5 wt%.

(A)成分可藉由各種周知的方法來製造。以下揭示(A)成分的製造例的一例。The component (A) can be produced by various well-known methods. An example of the production example of the component (A) is disclosed below.

(A)成分的起始原料,三烷氧基矽烷(a1)(以下亦稱為「(a1)成分」),是以一般式:X1 Si(OX1 )3 (式中,X1 相同或相異,表示碳數1~15的烷基、苯基、苄基、羥基或鹵素原子)來表示。該鹵素原子,可列舉氟原子及氯原子等。該碳數1~15的烷基,可列舉前述的烷基。此外,X1 不含前述反應性官能基。The starting material of the component (A), a trialkoxy decane (a1) (hereinafter also referred to as "(a1) component"), is a general formula: X 1 Si(OX 1 ) 3 (wherein, X 1 is the same Or different, which means an alkyl group having 1 to 15 carbon atoms, a phenyl group, a benzyl group, a hydroxyl group or a halogen atom). Examples of the halogen atom include a fluorine atom and a chlorine atom. The alkyl group having 1 to 15 carbon atoms is exemplified by the above alkyl group. Further, X 1 does not contain the aforementioned reactive functional group.

(a1)成分的具體例子,可列舉例如甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、正丙基三甲氧基矽烷、正丙基三乙氧基矽烷、正己基三甲氧基矽烷、正己基三乙氧基矽烷、正辛基三乙氧基矽烷、正癸基三甲氧基矽烷、苯基三甲氧基矽烷、苯基三乙氧基矽烷、3-羥丙基三乙氧基矽烷、三氯甲氧基矽烷、三氯乙氧基矽烷、(3,3,3-三氟丙基)三甲氧基矽烷等。尤其以甲基三甲氧基矽烷為佳,藉由使用甲基三甲氧基矽烷,(A)成分與(B) 一種縮合反應型矽氧烷組成物,含有:(A)在室溫下為固體狀的聚倍半矽氧烷,其含有由R1 SiO3/2 (式中,R1 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TA ),且具有羥基;(B)在室溫下為液狀的聚倍半矽氧烷,其含有由R2 SiO3/2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TB ),且具有-OR2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者);及(C)縮合反應觸媒。成分的反應性良好,本發明所期望的效果的平衡、耐熱性、透明性及耐氣泡性的平衡特別良好。Specific examples of the component (a1) include methyltrimethoxydecane, methyltriethoxydecane, ethyltrimethoxydecane, ethyltriethoxydecane, n-propyltrimethoxydecane, and positive Propyltriethoxydecane, n-hexyltrimethoxydecane, n-hexyltriethoxydecane, n-octyltriethoxydecane, n-decyltrimethoxydecane,phenyltrimethoxydecane,phenyl three Ethoxy decane, 3-hydroxypropyltriethoxy decane, trichloromethoxy decane, trichloroethoxy decane, (3,3,3-trifluoropropyl)trimethoxydecane, and the like. In particular, methyltrimethoxydecane is preferably used, by using methyltrimethoxydecane, (A) component and (B) a condensation-reactive type oxoxane composition containing: (A) solid at room temperature a polysilsesquioxane containing R 1 SiO 3/2 (wherein R 1 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group, and a benzyl group) a trioxooxy unit (T A ) having a hydroxyl group; (B) a polysilsesquioxane which is liquid at room temperature and which contains R 2 SiO 3/2 (wherein R 2 represents a trioxooxy unit (T B ) selected from one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group and a benzyl group, and having -OR 2 (wherein R 2 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group and a benzyl group; and (C) a condensation reaction catalyst. The reactivity of the component is good, and the balance of the desired effect of the present invention, the balance of heat resistance, transparency, and bubble resistance is particularly good.

(A)成分可藉由使(a1)成分發生水解反應及縮合反應而得到。The component (A) can be obtained by subjecting the component (a1) to a hydrolysis reaction and a condensation reaction.

水解反應的條件並不受特別限定,反應溫度通常為25~90℃左右、及反應時間通常為30分鐘~10小時左右。添加至反應系統中的水的使用量並不受特別限定,通常[水的莫耳數/(a1)成分所含的OX1 基的莫耳數]是在0.3~1左右的範圍。The conditions of the hydrolysis reaction are not particularly limited, and the reaction temperature is usually about 25 to 90 ° C, and the reaction time is usually about 30 minutes to 10 hours. The amount of water to be added to the reaction system is not particularly limited, and usually [the number of moles of water/the number of moles of the OX 1 group contained in the component (a1)) is in the range of about 0.3 to 1.

水解反應時,可使用各種周知的觸媒。觸媒具體而言,可列舉蟻酸、醋酸、鹽酸、硫酸、硝酸、對甲苯磺酸、磷酸及陽離子交換樹脂等的酸性觸媒;氫氧化鈉、氫氧化鉀、氫氧化鈣、1,8-二氮雜雙環[5.4.0]十一-7-烯、1,5-二氮雜雙環[4.3.0]壬-5-烯、四甲基氫氧化銨、四丁基氫氧化銨、吡啶等的鹼性觸媒。觸媒的使用量並不受特別限定,通常相對於(a1)成分100質量份為0.001~1質量份左右。In the case of the hydrolysis reaction, various well-known catalysts can be used. Specific examples of the catalyst include acidic catalysts such as formic acid, acetic acid, hydrochloric acid, sulfuric acid, nitric acid, p-toluenesulfonic acid, phosphoric acid, and cation exchange resins; sodium hydroxide, potassium hydroxide, calcium hydroxide, 1,8- Diazabicyclo[5.4.0]undec-7-ene, 1,5-diazabicyclo[4.3.0]non-5-ene, tetramethylammonium hydroxide, tetrabutylammonium hydroxide, pyridine Alkaline catalyst. The amount of the catalyst to be used is not particularly limited, and is usually about 0.001 to 1 part by mass based on 100 parts by mass of the component (a1).

水解反應時,可使用各種周知的溶劑。溶劑具體而言,可列舉苯、甲苯、二甲苯、正己烷、正庚烷等的烴系溶劑;甲醇、乙醇、正丙醇、異丙醇等的醇系溶劑;乙二醇二甲醚、二乙二醇二甲醚、三乙二醇二甲醚、二乙二醇甲基乙基醚、二乙二醇二乙醚、四氫呋喃、1,4-二噁烷等的醚系溶劑;醋酸甲酯、醋酸乙酯、醋酸丁酯等的酯系溶劑;丙酮、2-丁酮、甲基-異丁基酮等的酮系溶劑;乙腈、二甲亞碸、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯烷酮等。In the hydrolysis reaction, various well-known solvents can be used. Specific examples of the solvent include hydrocarbon solvents such as benzene, toluene, xylene, n-hexane, and n-heptane; alcohol solvents such as methanol, ethanol, n-propanol, and isopropanol; and ethylene glycol dimethyl ether; An ether solvent such as diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran or 1,4-dioxane; An ester solvent such as ester, ethyl acetate or butyl acetate; a ketone solvent such as acetone, 2-butanone or methyl-isobutyl ketone; acetonitrile, dimethyl hydrazine, N,N-dimethylmethyl Indoleamine, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, and the like.

水解反應所得到的水解物,藉由進一步進行縮合反應,可在羥基彼此之間或羥基與殘存-OX1 基之間產生矽氧烷鍵結,而產生目標的(A)成分。縮合反應條件並不受特別限定,反應溫度通常為40~150℃左右、反應時間通常為1~12小時左右。該縮合反應可在前述溶劑中進行。此外,本發明的組成物宜為無溶劑型,因此希望在水解及縮合反應之後藉由各種周知的手段將前述溶劑由(A)成分除去。The hydrolyzate obtained by the hydrolysis reaction can be subjected to a condensation reaction to produce a siloxane coupling between the hydroxyl groups or the hydroxyl group and the remaining -OX 1 group to produce the target component (A). The condensation reaction conditions are not particularly limited, and the reaction temperature is usually about 40 to 150 ° C, and the reaction time is usually about 1 to 12 hours. This condensation reaction can be carried out in the aforementioned solvent. Further, the composition of the present invention is preferably a solventless type, and therefore it is desirable to remove the solvent from the component (A) by various well-known means after the hydrolysis and condensation reaction.

(A)成分的物性不受特別限定。若考慮本發明所期望的效果的平衡,則軟化點(在JIS K5903所規定的條件下測得的軟化點,以下提到軟化點時也同樣)通常在40~150℃左右即可,宜為50~130℃左右,較佳為60~120℃左右。若(A)成分的軟化點在這樣的範圍,則本發明所關連的硬化物的機械物性更加良好。其重量平均分子量亦不受特別限定,通常為2000~10000左右,宜為3000~7000左右。藉由使(A)成分的重量平均分子量在2000以上,在使本發明所關連的組成物加熱硬化時,可更進一步抑制低分子量成分的揮發或滲出。另外,藉由使(A)成分的重量平均分子量在10000以下,本發明的組成物的相溶性會更良好,另外還可抑制牽絲等現象,作業性也更加良好。The physical properties of the component (A) are not particularly limited. In consideration of the balance of the desired effect of the present invention, the softening point (the softening point measured under the conditions specified in JIS K5903, the same applies to the softening point hereinafter) is usually about 40 to 150 ° C, preferably It is about 50 to 130 ° C, preferably about 60 to 120 ° C. When the softening point of the component (A) is in such a range, the mechanical properties of the cured product associated with the present invention are further improved. The weight average molecular weight is not particularly limited, but is usually about 2,000 to 10,000, preferably about 3,000 to 7,000. When the weight average molecular weight of the component (A) is 2,000 or more, when the composition to which the present invention is applied is heat-cured, volatilization or bleeding of the low molecular weight component can be further suppressed. In addition, when the weight average molecular weight of the component (A) is 10,000 or less, the compatibility of the composition of the present invention is further improved, and the phenomenon such as wire drawing can be suppressed, and the workability is further improved.

(A)成分的形狀並不受特別限定,可為碎片狀、粉狀、半固體狀等。(A)成分的市售品,可列舉例如信越化學工業股份有限公司製的KR-220L及KR-220LP、Momentive Performance Materials Japan製的YR3370等。The shape of the component (A) is not particularly limited, and may be in the form of a chip, a powder, a semi-solid or the like. For the commercial product of the component (A), for example, KR-220L and KR-220LP manufactured by Shin-Etsu Chemical Co., Ltd., and YR3370 manufactured by Momentive Performance Materials Japan, etc., may be mentioned.

(B)成分為含有由R2 SiO3/2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所表示的三矽烷氧基單元(TB ),且具有-OR2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者),在室溫下為液狀的聚倍半矽氧烷。此外,前述R2 SiO3/2 的R2 與前述-OR2 的R2 可相同或相異。The component (B) is represented by R 2 SiO 3/2 (wherein R 2 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group, and a benzyl group). a trioxooxy unit (T B ) having -OR 2 (wherein R 2 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group, and a benzyl group), A liquid sesquioxane at room temperature. In addition, the R R 2 SiO 3/2 and R 2 is -OR 2 2 may be the same or different.

構成各R2 之碳數1~15的烷基、苯基及苄基,與構成R1 的這些基同樣,任一者皆不含前述反應性官能基。The alkyl group having 1 to 15 carbon atoms and the phenyl group and the benzyl group constituting each R 2 are the same as those constituting R 1 , and none of them contains the reactive functional group.

TB 與前述TA 同樣地,可細分成T1構造[R2 O-Si(R2 )(OR2 )-O-]、T2構造[-(R2 )Si(OR2 )(O-)-O-]及T3構造[-(R2 )Si(O-)2 -O-],這些構造的比率亦不受特別限定。各構造可藉由測定例如(B)成分的29 Si-NMR光譜來鑑定。T B can be subdivided into T1 structure [R 2 O-Si(R 2 )(OR 2 )-O-], T2 structure [-(R 2 )Si(OR 2 )(O-), similarly to T A described above. -O-] and T3 structure [-(R 2 )Si(O-) 2 -O-], and the ratio of these structures is also not particularly limited. Each configuration can be identified by measuring, for example, a 29 Si-NMR spectrum of the component (B).

TB 在(B)成分中所占的比例不受特別限定。若考慮本發明所期望的效果的平衡,尤其本發明的組成物的相溶性、操作性及硬化性等,以及硬化物的強度、接著性、耐龜裂性及耐氣泡性等的平衡,則TB 在(B)成分中所占的比例通常為65~100莫耳%左右,宜為95~100莫耳%。The proportion of T B in the component (B) is not particularly limited. Considering the balance of the effects desired by the present invention, in particular, the compatibility, workability, hardenability, and the like of the composition of the present invention, and the balance of strength, adhesion, crack resistance, and bubble resistance of the cured product, etc. The proportion of T B in the component (B) is usually about 65 to 100 mol%, preferably 95 to 100 mol%.

(B)成分中,在保持在室溫下為液狀的前提之下,亦可含有其他單元(單矽烷氧基單元(MB )、二矽烷氧基單元(DB )、或四矽烷氧基單元(QB ))。這些其他單元的比率通常為0~35莫耳%左右,宜為0~5莫耳%。The component (B) may contain other units (monodecyloxy unit (M B ), dioxooxy unit (D B ), or tetradecyloxy) while maintaining a liquid state at room temperature. Base unit (Q B )). The ratio of these other units is usually from 0 to 35 mol%, preferably from 0 to 5 mol%.

(B)成分的構造,具體而言,可由下述平均單元式來表示。The structure of the component (B) can be specifically expressed by the following average unit formula.

(R2 SiO3/2 )x' [R2 b SiO(4-b)/2 ]y' (R 2 SiO 3/2 ) x' [R 2 b SiO (4-b)/2 ] y'

前述式中,0<b≦3,0<x',0≦y',且x'+y'=1。宜為x'=1,y'=0。In the above formula, 0<b≦3, 0<x', 0≦y', and x'+y'=1. It should be x'=1, y'=0.

此外,(B)成分中羥基的含量,實質上為0wt%。-OR2 的含量可藉由例如1 H-NMR光譜求得,相對於(B)成分總量,通常為15~45wt%左右。Further, the content of the hydroxyl group in the component (B) is substantially 0% by weight. The content of -OR 2 can be determined, for example, by 1 H-NMR spectroscopy, and is usually about 15 to 45 wt% based on the total amount of the component (B).

(B)成分可藉由各種周知的方法來製造。以下揭示(B)成分的製造例的一例。The component (B) can be produced by various well-known methods. An example of the production example of the component (B) is disclosed below.

(B)成分的其中一個起始原料,三烷氧基矽烷(b1)(以下亦稱為「(b1)成分」),是以一般式:X2 Si(OX2 )3 (式中,X2 相同或相異,表示碳數1~15的烷基、苯基、苄基、羥基或鹵素原子)來表示。該鹵素原子、及該碳數1~15的烷基,可列舉前述的烷基。(b1)成分,可例示前述(a1)成分所列舉的物質。(b1)成分係以甲基三甲氧基矽烷為佳。藉由使用甲基三甲氧基矽烷作為(b1)成分,(A)成分與(B)成分的反應性更加良好,能夠保持本發明所期望的效果的平衡,尤其耐熱性、透明性及耐氣泡性更加良好。One of the starting materials of the component (B), a trialkoxy decane (b1) (hereinafter also referred to as "(b1) component"), is a general formula: X 2 Si(OX 2 ) 3 (wherein, X 2 is the same or different and represents an alkyl group having 1 to 15 carbon atoms, a phenyl group, a benzyl group, a hydroxyl group or a halogen atom). The halogen atom and the alkyl group having 1 to 15 carbon atoms include the above-mentioned alkyl group. The component (b1) can be exemplified by the above-mentioned (a1) component. The component (b1) is preferably methyltrimethoxydecane. By using methyltrimethoxydecane as the component (b1), the reactivity of the component (A) and the component (B) is further improved, and the balance of the desired effect of the present invention can be maintained, particularly heat resistance, transparency, and bubble resistance. Sex is better.

(B)成分的起始原料,在保持(B)成分在室溫下為液狀的前提之下,其他還可併用產生前述DB 單元的二烷氧基矽烷(以下亦稱為「(b2)成分」)、產生前述MB 單元的單烷氧基矽烷(以下亦稱為「(b3)成分」)、或產生前述QB 單元的四烷氧基矽烷(以下亦稱為「(b4)成分」)。The starting material of the component (B) can be used in combination with the dialkoxy decane which produces the aforementioned D B unit (hereinafter also referred to as "(b2)", while maintaining the component (B) in a liquid state at room temperature. "Component"), a monoalkoxy decane (hereinafter also referred to as "(b3) component)) of the above M B unit, or a tetraalkoxy decane which produces the Q B unit (hereinafter also referred to as "(b4) ingredient").

(b2)成分是以一般式:(X2 )2 Si(OX2 )2 (式中,X2 與前述同樣地,可相同或相異)來表示。其具體例子可列舉例如二甲基二甲氧基矽烷、苯基甲基二甲氧基矽烷、二甲基二乙氧基矽烷、苯基甲基甲氧基乙氧基矽烷等。(b2)成分相對於(b1)成分的使用量並不受特別限定,以莫耳比而計,通常在(b1):(b2)=65~95:5~35左右的範圍。The component (b2) is represented by the general formula: (X 2 ) 2 Si(OX 2 ) 2 (wherein X 2 may be the same or different in the same manner as described above). Specific examples thereof include dimethyl dimethoxy decane, phenylmethyl dimethoxy decane, dimethyl diethoxy decane, and phenyl methyl methoxy ethoxy decane. The amount of the component (b2) to be used in the component (b1) is not particularly limited, and is usually in the range of (b1):(b2)=65 to 95:5 to 35 in terms of a molar ratio.

(b3)成分是以一般式:(X2 )3 SiOX2 (式中,X2 與前述同樣地,可相同或相異)來表示。其具體例子可列舉例如三甲基甲氧基矽烷、三甲基乙氧基矽烷、三乙基甲氧基矽烷、三乙基乙氧基矽烷、三(正丙基)甲氧基矽烷、三(異丙基)甲氧基矽烷、三(正丙基)乙氧基矽烷、三(正丁基)甲氧基矽烷、三(異丁基)甲氧基矽烷、三(異丁基)乙氧基矽烷、二甲基第三丁基甲氧基矽烷、二甲基異丁基甲氧基矽烷、二甲基環戊基甲氧基矽烷、二甲基環己基乙氧基矽烷等。(b3)成分相對於(b1)成分的使用量並不受特別限定,以莫耳比而計,通常在(b1):(b3)=65~95:5~35左右的範圍。The component (b3) is represented by the general formula: (X 2 ) 3 SiOX 2 (wherein X 2 may be the same or different in the same manner as described above). Specific examples thereof include trimethyl methoxy decane, trimethyl ethoxy decane, triethyl methoxy decane, triethyl ethoxy decane, tri(n-propyl) methoxy decane, and three. (isopropyl)methoxy decane, tri(n-propyl)ethoxy decane, tri(n-butyl)methoxydecane, tris(isobutyl)methoxydecane, tris(isobutyl)B Oxydecane, dimethyl tert-butyl methoxy decane, dimethyl isobutyl methoxy decane, dimethyl cyclopentyl methoxy decane, dimethyl cyclohexyl ethoxy decane, and the like. The amount of the component (b3) to be used in the component (b1) is not particularly limited, and is usually in the range of (b1):(b3)=65 to 95:5 to 35 in terms of the molar ratio.

(b4)成分是以一般式:Si(OX2 )4 (式中,X2 與前述同樣地,可相同或相異)來表示。其具體例子可列舉例如四乙氧基矽烷、四異丙氧基矽烷、四正丙氧基矽烷、四正丁氧基矽烷、四甲氧基矽烷、二甲氧基二乙氧基矽烷等的四烷氧基矽烷等。(b4)成分相對於(b1)成分的使用量並不受特別限定,以莫耳比而計,通常在(b1):(b4)=65~95:5~35的範圍。The component (b4) is represented by a general formula: Si(OX 2 ) 4 (wherein X 2 may be the same or different in the same manner as described above). Specific examples thereof include tetraethoxysilane, tetraisopropoxy decane, tetra-n-propoxy decane, tetra-n-butoxy decane, tetramethoxy decane, dimethoxydiethoxy decane, and the like. Tetraalkoxydecane, and the like. The amount of the component (b4) to be used in the component (b1) is not particularly limited, and is usually in the range of (b1):(b4)=65 to 95:5 to 35 in terms of a molar ratio.

(B)成分可藉由使(b1)成分,以及因應必要選自(b2)成分、(b3)成分及(b4)成分所構成的群組中的至少一種進行水解反應及縮合反應而得到。The component (B) can be obtained by subjecting the component (b1) and at least one selected from the group consisting of the component (b2), the component (b3) and the component (b4) to a hydrolysis reaction and a condensation reaction.

水解反應的條件並不受特別限定,反應溫度通常為25~90℃左右,及反應時間通常為30分鐘~10小時左右。添加至反應系統中的水的使用量亦不受特別限定,[水的莫耳數/[(b1)成分~(b4)成分所含的-OX2 的總莫耳數]是在0.1~1左右的範圍。The conditions of the hydrolysis reaction are not particularly limited, and the reaction temperature is usually about 25 to 90 ° C, and the reaction time is usually about 30 minutes to 10 hours. The amount of water to be added to the reaction system is not particularly limited, and [the number of moles of water / the total number of moles of -OX 2 contained in the components (b1) to (b4)] is 0.1 to 1 The range around.

水解反應時,前述(a1)成分的水解反應所使用的觸媒及溶劑任一者皆可使用。In the hydrolysis reaction, any of the catalyst and solvent used in the hydrolysis reaction of the component (a1) described above can be used.

水解反應所得到的水解物,藉由進一步進行縮合,可在該分解物中之羥基與殘存-OX2 基之間產生矽氧烷鍵結,而產生目標的(B)成分。縮合反應條件並不受特別限定,反應溫度通常為40~150℃左右,反應時間通常為1~12小時左右。該縮合反應可在前述溶劑中進行。此外,本發明之縮合反應型矽氧烷組成物宜為無溶劑型,因此希望在水解及縮合反應後藉由各種周知的手段將前述溶劑由(B)成分除去。By further condensing the hydrolyzate obtained by the hydrolysis reaction, a siloxane coupling can be generated between the hydroxyl group in the decomposition product and the remaining -OX 2 group to produce the target component (B). The condensation reaction conditions are not particularly limited, and the reaction temperature is usually about 40 to 150 ° C, and the reaction time is usually about 1 to 12 hours. This condensation reaction can be carried out in the aforementioned solvent. Further, the condensation reaction type oxoxane composition of the present invention is preferably a solventless type, and therefore it is desirable to remove the solvent from the component (B) by various well-known means after the hydrolysis and condensation reaction.

(B)成分的物性不受特別限定。為了發揮出本發明所期望的效果,通常使黏度在5~10000mPa・s/25℃左右即可,宜為5~5000mPa・s/25℃左右,較佳為5~2000mPa・s/25℃左右。此外,本發明的組成物為加熱硬化型,然而室溫硬化型矽氧烷組成物也會在23℃下測定黏度的情形。此情況下,在一個實施形態之中,黏度宜為在501~10000mPa・s/23℃以上。藉由使(B)成分的黏度在該範圍,本發明的組成物的塗佈作業性及形狀維持性的平衡更加良好。另外,其重量平均分子量也不受特別限定。從與前述同樣的觀點看來,(B)成分的重量平均分子量通常為500~9000左右,宜為700~8000左右。藉由使(B)成分的重量平均分子量在500以上,在使本發明的組成物加熱硬化時,能夠更進一步抑制低分子量成分的揮發或滲出。另外,藉由使(B)成分的數量平均分子量在9000以下,本發明的組成物的相溶性更良好,另外還能夠抑制牽絲等現象,作業性也更加良好。The physical properties of the component (B) are not particularly limited. In order to exhibit the desired effect of the present invention, the viscosity is usually about 5 to 10,000 mPa·s / 25 ° C, preferably about 5 to 5,000 mPa·s / 25 ° C, preferably about 5 to 2,000 mPa·s / 25 ° C. . Further, the composition of the present invention is a heat curing type, but the room temperature curing type siloxane composition also measures the viscosity at 23 °C. In this case, in one embodiment, the viscosity is preferably 501 to 10000 mPa·s / 23 ° C or more. When the viscosity of the component (B) is in this range, the balance between the coating workability and the shape maintainability of the composition of the present invention is further improved. Further, the weight average molecular weight thereof is also not particularly limited. From the same viewpoint as described above, the weight average molecular weight of the component (B) is usually from about 500 to 9,000, preferably from about 700 to 8,000. When the weight average molecular weight of the component (B) is 500 or more, when the composition of the present invention is heat-cured, volatilization or bleeding of the low molecular weight component can be further suppressed. In addition, when the number average molecular weight of the component (B) is 9000 or less, the compatibility of the composition of the present invention is further improved, and the phenomenon such as the drawing can be suppressed, and the workability is further improved.

(B)成分的市售品,可列舉例如旭化成Wacker Silicone股份有限公司製的MSE100、信越化學工業股份有限公司製的KC-89S及KR-500、多摩化學工業股份有限公司製的MTMS-A等。The commercially available product of the component (B), for example, MSE100 manufactured by Asahi Kasei Wacker Silicone Co., Ltd., KC-89S and KR-500 manufactured by Shin-Etsu Chemical Co., Ltd., and MTMS-A manufactured by Tama Chemical Industry Co., Ltd., etc. .

(A)成分與(B)成分的摻合比率不受特別限定。從本發明的組成物的操作性、本發明之硬化物的硬度、強韌性及耐氣泡性等的觀點看來,通常將(A)成分與(B)成分摻合成(A)成分所含的羥基的莫耳數(MOH )與(A)成分所含的-OR1 及(B)成分所含的-OR2 的合計莫耳數(MOR )之比(MOR /MOH )在0.1~20左右的範圍,宜為5~20左右,較佳為8~15左右。若該比率在0.1以上,則使本發明的組成物硬化時的脫泡性會更良好,而且將其塗佈時不易發生牽絲等現象,作業性也更加良好。另外,若該比率在20以下,則本發明的組成物的接著性會更良好,另外,硬化物也更不易發生龜裂或氣泡。The blending ratio of the component (A) and the component (B) is not particularly limited. From the viewpoints of the workability of the composition of the present invention, the hardness, toughness, and bubble resistance of the cured product of the present invention, the components (A) and (B) are usually blended into the component (A). The ratio of the molar number of the hydroxyl group (M OH ) to the total number of moles (M OR ) of the -OR 2 contained in the -OR 1 and (B) components of the component (A) is (M OR /M OH ) The range of about 0.1 to 20 is preferably about 5 to 20, preferably about 8 to 15. When the ratio is 0.1 or more, the defoaming property at the time of curing the composition of the present invention is further improved, and the phenomenon such as wire drawing is less likely to occur during coating, and the workability is further improved. Further, when the ratio is 20 or less, the composition of the present invention is more excellent in adhesion, and the cured product is less likely to be cracked or bubbled.

(A)成分與(B)成分的固體成分質量比亦不受特別限定。從本發明的組成物的操作性、本發明的組成物的相溶性及塗佈作業性等,以及硬化物的硬度、強韌性及耐氣泡性等的觀點看來,固體成分質量比,相對於(A)成分100質量份,(B)成分通常在30~120質量份左右的範圍,宜為40~110質量份左右。The solid content mass ratio of the component (A) and the component (B) is also not particularly limited. From the viewpoints of the workability of the composition of the present invention, the compatibility of the composition of the present invention, the coating workability, and the hardness, toughness, and bubble resistance of the cured product, the mass ratio of the solid component is relative to The component (A) is 100 parts by mass, and the component (B) is usually in the range of about 30 to 120 parts by mass, preferably about 40 to 110 parts by mass.

(C)成分可使用各種周知的縮合反應觸媒。縮合反應觸媒具體而言,可列舉鎂、鋁、錫、鋅、鐵、鈷、鎳、鋯、鈰及鈦等的金屬的化合物。若考慮本發明的組成物的使用期限、本發明的硬化物的色調或透明性等,則該化合物宜為選自於由鈦化合物、錫化合物、鋅化合物及鋯化合物所構成群組中之一者,尤其以錫化合物及/或鋯化合物為佳。As the component (C), various well-known condensation reaction catalysts can be used. Specific examples of the condensation reaction catalyst include compounds of metals such as magnesium, aluminum, tin, zinc, iron, cobalt, nickel, zirconium, hafnium, and titanium. When considering the lifespan of the composition of the present invention, the color tone or transparency of the cured product of the present invention, etc., the compound is preferably selected from the group consisting of a titanium compound, a tin compound, a zinc compound, and a zirconium compound. In particular, tin compounds and/or zirconium compounds are preferred.

前述鈦化合物,可列舉例如二異丙氧基雙(乙基乙醯醋酸)鈦、四乙氧基鈦、四正丙氧基鈦、四正丁氧基鈦、二異丙氧基-雙(乙醯醋酸乙酯)鈦、二異丙氧基-雙(乙醯醋酸甲酯)鈦、二異丙氧基-雙(乙醯丙酮)鈦、二正丁氧基-雙(乙醯醋酸乙酯)鈦、二甲氧基-雙(乙醯醋酸乙酯)鈦等。The titanium compound may, for example, be diisopropoxy bis(ethylacetamidineacetic acid) titanium, tetraethoxytitanium, tetra-n-propoxytitanium, tetra-n-butoxytitanium, diisopropoxy-bis ( Ethyl acetate ethyl acetate) titanium, diisopropoxy-bis(ethyl acetoxyacetate) titanium, diisopropoxy-bis(acetoxime) titanium, di-n-butoxy-bis(acetonitrile acetate B Ester) titanium, dimethoxy-bis(acetic acid ethyl acetate) titanium, and the like.

前述錫化合物,可列舉例如二正丁基甲氧基錫、二正丁基二醋酸錫、二正丁基二辛酸錫、二正丁基二月桂酸錫、二正辛基二醋酸錫、二正辛基馬來酸錫、二正丁基氧基醋酸錫、二正丁基氧基辛酸錫、二正丁基氧基月桂酸錫、二正丁基雙甲基蘋果酸錫、二正丁基氧基油酸錫、或正二丁基蘋果酸錫聚合物、二正辛基蘋果酸錫聚合物、單正丁基參(2-己酸乙酯)錫及二正丁基雙(乙醯丙酮)錫等。Examples of the tin compound include di-n-butyl methoxy tin, di-n-butyl diacetate, tin di-n-butyl dioctoate, di-n-butyl dilaurate, di-n-octyl diacetate, and di-n-octane. Tin methinate, tin di-n-butyloxyacetate, tin di-n-butyloxyoctanoate, tin di-n-butyloxylaurate, tin di-n-butyl dimethyl malate, di-n-butyloxy Tin oleate, or n-dibutyl malate polymer, di-n-octyltin malate polymer, mono-n-butyl succinate (2-ethylhexanoate) tin and di-n-butyl bis(acetonitrile) Tin and so on.

前述鋅化合物,可列舉例如醋酸鋅、乙醯基醋酸鋅、2-乙基己酸鋅、辛酸鋅、新癸酸鋅、月桂酸鋅、硬脂酸鋅、環烷酸鋅、安息香酸鋅、對第三丁基安息香酸鋅、水楊酸鋅、(甲基)丙烯酸鋅、乙醯丙酮鋅及2,2,6,6-四甲基-3,5-庚二酮酸鋅等。Examples of the zinc compound include zinc acetate, zinc acetylacetate, zinc 2-ethylhexanoate, zinc octoate, zinc neodecanoate, zinc laurate, zinc stearate, zinc naphthenate, and zinc benzoate. Zirconium tert-butyl benzoate, zinc salicylate, zinc (meth)acrylate, zinc acetylacetonate, and zinc 2,2,6,6-tetramethyl-3,5-heptanedionate.

前述鋯化合物,可列舉例如四烷基鋯酸鹽、三烷氧基單萘甲酸鋯、三烷氧基單環丙烷羧酸鋯、三烷氧基環丁烷羧酸鋯、三烷氧基單環戊烷羧酸鋯、三烷氧基單環己烷羧酸鋯及三烷氧基單金剛烷羧酸鋯等。此處,烷基合適的例子,可列舉碳數1~18之直鏈狀或支鏈狀烷基,烷氧基合適的例子,可列舉碳數1~18的直鏈狀或支鏈狀烷基氧基。The zirconium compound may, for example, be a tetraalkyl zirconate, a trialkoxy zirconium mononaphthalate, a trialkoxy monocyclopropanecarboxylate, a trialkoxycyclobutanecarboxylate or a trialkoxy group. Zirconium cyclopentanecarboxylate, zirconium dialkoxy monocyclohexanecarboxylate, zirconium trialkoxymonoadamantanecarboxylate, and the like. Here, a suitable example of the alkyl group is a linear or branched alkyl group having 1 to 18 carbon atoms, and a suitable alkoxy group is a linear or branched alkane having 1 to 18 carbon atoms. Baseoxy.

(C)成分的使用量不受特別限定。本發明的組成物的貯藏安定性及硬化性,以及硬化物的耐黃變性等的觀點看來,(C)成分的使用量,相對於(A)成分及(B)成分的合計100質量份,通常在0.001~10質量份左右的範圍,宜為0.01~5質量份左右,較佳為0.1~1質量份左右。此外,在本發明的組成物之中,即使(C)成分的使用量低於0.1質量份,亦即0.001~0.099質量份的情況,也能夠達成所期望的效果。The amount of the component (C) used is not particularly limited. The storage stability and the curability of the composition of the present invention, and the yellowing resistance of the cured product, etc., the amount of the component (C) used is 100 parts by mass based on the total of the components (A) and (B). The amount is usually in the range of about 0.001 to 10 parts by mass, preferably about 0.01 to 5 parts by mass, preferably about 0.1 to 1 part by mass. Further, among the compositions of the present invention, even when the amount of the component (C) used is less than 0.1 part by mass, that is, 0.001 to 0.099 parts by mass, the desired effect can be achieved.

在本發明的組成物中,例如為了提升本發明之硬化物的耐龜裂性,可含有各種周知的(D)無機填料(以下亦稱為「(D)成分」)。(D)成分,可列舉例如二氧化矽(膠狀二氧化矽、發煙二氧化矽等)、鈦酸鋇、氧化鈦、氧化鋯、氧化鈮、氧化鋁、氧化鈰及氧化釔等。尤其以二氧化矽為佳,特別是以發煙二氧化矽為佳。(D)成分的平均一次粒徑不受特別限定。從本發明的組成物的分散安定性、塗佈作業性、搖變性(塗佈後的防滴垂性),以及硬化物的耐龜裂性及透明性等的觀點看來,(D)成分的平均一次粒徑通常為100μm以下,宜為5~100nm左右,較佳為5~30nm左右。In the composition of the present invention, for example, in order to improve the crack resistance of the cured product of the present invention, various well-known (D) inorganic fillers (hereinafter also referred to as "(D) component") may be contained. Examples of the component (D) include cerium oxide (colloidal cerium oxide, fumed cerium oxide, etc.), barium titanate, titanium oxide, zirconium oxide, cerium oxide, aluminum oxide, cerium oxide, and cerium oxide. In particular, cerium oxide is preferred, especially fuming cerium oxide. The average primary particle diameter of the component (D) is not particularly limited. (D) component from the viewpoints of dispersion stability, coating workability, shaking property (anti-dripping property after coating), crack resistance and transparency of a cured product, and the like The average primary particle diameter is usually 100 μm or less, preferably about 5 to 100 nm, preferably about 5 to 30 nm.

(D)成分的使用量不受特別限定。從本發明的組成物的塗佈作業性及搖變性,以及硬化物的透明性及耐龜裂性等的觀點看來,(D)成分的使用量,相對於(A)成分及(B)成分的合計100質量份,通常在0.1~20質量份左右的範圍,宜為0.5~10質量份。The amount of the component (D) used is not particularly limited. The amount of the component (D) used is relative to the component (A) and (B) from the viewpoints of the coating workability and the shakeability of the composition of the present invention, and the transparency and crack resistance of the cured product. The total amount of the components is usually from 0.1 to 20 parts by mass, preferably from 0.5 to 10 parts by mass, based on 100 parts by mass.

在本發明的組成物中可因應必要進一步摻合可塑劑、耐候劑、抗氧化劑、熱安定劑、潤滑劑、抗靜電劑、增白劑、著色劑、導電性高分子、導電性填料、脫模劑、表面處理劑、黏度調節劑及矽烷偶合劑等的添加劑。另外,本發明的組成物宜為無溶劑型,因此在一個實施形態中,本發明的組成物不含溶劑。In the composition of the present invention, a plasticizer, a weathering agent, an antioxidant, a thermal stabilizer, a lubricant, an antistatic agent, a whitening agent, a coloring agent, a conductive polymer, a conductive filler, and a stripping agent may be further blended as necessary. Additives such as a molding agent, a surface treatment agent, a viscosity modifier, and a decane coupling agent. Further, the composition of the present invention is preferably a solventless type, and therefore, in one embodiment, the composition of the present invention contains no solvent.

本發明的組成物的製造法不受特別限定。通常可藉由將固體狀的前述(A)成分、及(C)成分添加至液狀的前述(B)成分,依照必要進一步摻合前述(D)成分及添加劑,並且將該等混合至均質為止來得到本發明的組成物。混合可藉由周知的手段來進行。The method for producing the composition of the present invention is not particularly limited. Usually, the solid component (A) and the component (C) are added to the liquid component (B), and the component (D) and the additive are further blended as necessary, and the mixture is mixed to homogeneity. The composition of the present invention has been obtained up to now. Mixing can be carried out by well-known means.

以這樣的方式得到的組成物的物性不受特別限定。若考慮操作性、作為密封劑使用時的鑄型性等,則黏度通常為5~1000000mPa・s/25℃左右,宜s為500~500000mPa・s/25℃左右,較佳為1000~200000mPa・s/25℃左右。The physical properties of the composition obtained in such a manner are not particularly limited. When considering the operability, the moldability when used as a sealant, etc., the viscosity is usually about 5 to 1,000,000 mPa·s / 25 ° C, and preferably s is about 500 to 500,000 mPa·s / 25 ° C, preferably about 1,000 to 200,000 mPa. s / 25 ° C or so.

本發明的硬化物為本發明的組成物的縮合反應物。硬化條件並不受特別限定,只要因應用途適當地設定即可。硬化溫度通常為25~200℃左右,硬化時間通常為30分鐘~5小時左右。 實施例The cured product of the present invention is a condensation reactant of the composition of the present invention. The curing conditions are not particularly limited as long as they are appropriately set depending on the intended use. The hardening temperature is usually about 25 to 200 ° C, and the hardening time is usually about 30 minutes to 5 hours. Example

以下透過實施例及比較例來詳細說明本發明,然而本發明的範圍不受這些例子限定。另外,各例中,只要沒有特別記載,份是以質量為基準。Hereinafter, the present invention will be specifically described by way of Examples and Comparative Examples, however, the scope of the present invention is not limited by these examples. In addition, in each case, unless otherwise indicated, a part is based on mass.

製造例中,重量平均分子量是利用凝膠滲透層析法(使用裝置: 東曹股份有限公司製HLC-8220、管柱:東曹股份有限公司製TSKgel α-M、展開溶劑:四氫呋喃)所得到的聚苯乙烯標準物質的換算值。In the production example, the weight average molecular weight is obtained by gel permeation chromatography (using apparatus: HLC-8220 manufactured by Tosoh Corporation, TSKgel α-M manufactured by Tosoh Corporation, developing solvent: tetrahydrofuran). The converted value of the polystyrene standard substance.

製造例中,1 H-NMR的位移值是使用VARIAN製400-MR(400MHz,CDCl3 )所得到的測定值。In the production example, the displacement value of 1 H-NMR was a value obtained by using 400-MR (400 MHz, CDCl 3 ) manufactured by VARIAN.

實施例中,黏度是使用E型黏度計(製品名「RE-80U」、東機產業股份有限公司製,轉子No.1°34′×R24、轉子轉速5rpm)所得到的測定值。In the examples, the viscosity was measured using an E-type viscometer (product name "RE-80U", manufactured by Toki Sangyo Co., Ltd., rotor No. 1° 34' × R24, rotor rotation speed: 5 rpm).

<(B)成分的製造> 製造例1 在具備攪拌機、冷凝管、溫度計及氮氣導入管的反應裝置中裝入甲基三甲氧基矽烷136.2份及水10.8份,使反應系統昇溫至40℃。接下來裝入蟻酸0.14份,開始水解反應。反應開始後,因為反應熱,反應系統的溫度達到62℃,後來降溫至40℃,因此保持在同溫度下30分鐘。然後,將副生成的甲醇移除至系統外,同時花費3小時使反應系統昇溫至120℃。接下來,在相同溫度下進行縮合反應1小時,得到具有由CH3 SiO3/2 所表示的三矽烷氧基單元(x=1、y=0)的液狀聚倍半矽氧烷(B-1)。(B-1)成分的黏度為20mPa・s/25℃、重量平均分子量為900。另外,由1 H-NMR測得的殘存甲氧基(δ3.2-3.8)的峰強度所計算出的含量(以下簡記為「殘存甲氧基含量」)為約32wt%。<Production of component (B)> Production Example 1 In a reaction apparatus equipped with a stirrer, a condenser, a thermometer, and a nitrogen gas introduction tube, 136.2 parts of methyltrimethoxydecane and 10.8 parts of water were placed, and the reaction system was heated to 40 °C. Next, 0.14 parts of formic acid was charged to start the hydrolysis reaction. After the start of the reaction, the temperature of the reaction system reached 62 ° C due to the heat of reaction, and then the temperature was lowered to 40 ° C, so that it was kept at the same temperature for 30 minutes. Then, the by-produced methanol was removed to the outside of the system while taking 3 hours to raise the temperature of the reaction system to 120 °C. Next, the condensation reaction was carried out at the same temperature for 1 hour to obtain a liquid polysesquioxane having a trioxomethoxy unit (x = 1, y = 0) represented by CH 3 SiO 3/2 (B) -1). The (B-1) component had a viscosity of 20 mPa·s / 25 ° C and a weight average molecular weight of 900. Further, the content (hereinafter abbreviated as "residual methoxy group content") calculated from the peak intensity of the residual methoxy group (δ 3.2 - 3.8) measured by 1 H-NMR was about 32% by weight.

製造例2 將水的裝入量定為16.2份,除此之外,與製造例1同樣地,得到具有由CH3 SiO3/2 所表示的三矽烷氧基單元(x=1、y=0)的液狀聚倍半矽氧烷(B-2)。(B-2)成分的黏度為350mPa・s/25℃、重量平均分子量為2500、殘存甲氧基含量為約24wt%,並未觀察到殘存羥基的峰。Production Example 2 A tridecyloxy unit represented by CH 3 SiO 3/2 was obtained in the same manner as in Production Example 1 except that the amount of water charged was 16.2 parts (x=1, y=). 0) Liquid polysesquioxane (B-2). The (B-2) component had a viscosity of 350 mPa·s/25 ° C, a weight average molecular weight of 2,500, and a residual methoxy group content of about 24% by weight, and no peak of residual hydroxyl groups was observed.

製造例3 將甲基三甲氧基矽烷定為136.2份,二甲基二甲氧基矽烷定為51.5份、及水27.8份,除此之外,與製造例1同樣地,得到平均矽烷氧基單元為(CH3 )1.3 SiO1.35 (x'=0.7、y'=0.3、b=2)的聚倍半矽氧烷(B-3)。(B-3)成分的黏度為1600mPa・s/25℃、重量平均分子量為7000、殘存甲氧基含量為約19wt%,並未觀察到殘存羥基的峰。Production Example 3 An average decyloxy group was obtained in the same manner as in Production Example 1 except that the methyltrimethoxy decane was determined to be 136.2 parts, and the dimethyldimethoxy decane was determined to be 51.5 parts of water and 27.8 parts of water. The unit is (CH 3 ) 1.3 SiO 1.35 (x'=0.7, y'=0.3, b=2) polysilsesquioxane (B-3). The (B-3) component had a viscosity of 1600 mPa·s/25 ° C, a weight average molecular weight of 7,000, and a residual methoxy group content of about 19% by weight, and no peak of residual hydroxyl groups was observed.

<縮合反應型矽氧烷組成物的製造> 實施例1 將50份作為(A)成分且在室溫下為固體狀的聚倍半矽氧烷(商品名「KR220L」、信越化學工業股份有限公司製,碎片狀、R1 =甲基、來自矽醇基的羥基的含量為3wt%、TA 單元100莫耳%、軟化點67℃);50份作為(B)成分的(B-1)成分;0.3份作為(C)成分的鋯螯合物(Matsumoto Fine Chemical股份有限公司製,ZC-700(四乙醯丙酮鋯20%溶液));5.5份作為(D)成分的市售發煙二氧化矽(商品名「AEROSIL RX200」、日本Aerosil股份有限公司製,平均一次粒徑12nm)在室溫下充分混合,得到均質且透明的縮合反應型矽氧烷組成物1(6000mPa・s/25℃)。<Production of Condensation-Reactive Type Oxetane Composition> Example 1 50 parts of polysilsesquioxane which is a component (A) and is solid at room temperature (trade name "KR220L", Shin-Etsu Chemical Co., Ltd. Company made, fragmented, R 1 = methyl, content of hydroxyl group derived from sterol group is 3 wt%, T A unit 100 mol %, softening point 67 ° C); 50 parts as component (B) (B-1) ) Component: 0.3 part of a zirconium chelate compound (C) (Zatsuki Fine Chemical Co., Ltd., ZC-700 (tetrazincacetone zirconium 20% solution)); 5.5 parts of a commercially available product as component (D) Tobacco dioxide (trade name "AEROSIL RX200", manufactured by Nippon Aerosil Co., Ltd., average primary particle diameter: 12 nm) was sufficiently mixed at room temperature to obtain a homogeneous and transparent condensation reaction type siloxane composition 1 (6000 mPa·s). /25 ° C).

實施例2 使用50份前述(B-2)成分作為(B)成分,除此之外,與實施例1同樣地,得到均質且透明的縮合反應型矽氧烷組成物2(8000mPa・s/25℃)。Example 2 A homogeneous and transparent condensation reaction type oxoxane composition 2 (8000 mPa·s/) was obtained in the same manner as in Example 1 except that the component (B-2) was used as the component (B). 25 ° C).

實施例3 使用50份前述(B-3)成分作為(B)成分,除此之外,與實施例1同樣地,得到均質且透明的縮合反應型矽氧烷組成物3(5000mPa・s/25℃)。Example 3 A homogeneous and transparent condensation reaction type azide composition 3 (5000 mPa·s/) was obtained in the same manner as in Example 1 except that the component (B-3) was used as the component (B). 25 ° C).

實施例4 使用0.1份二正辛基錫作為(C)成分,除此之外,與實施例1同樣地,得到均質且透明的縮合反應型矽氧烷組成物4(6000mPa・s/25℃)。Example 4 A homogenous and transparent condensation reaction type oxoxane composition 4 (6000 mPa·s / 25 ° C) was obtained in the same manner as in Example 1 except that 0.1 part of di-n-octyltin was used as the component (C). ).

實施例5 使用0.1份鈦螯合物(Matsumoto Fine Chemical股份有限公司製,TC-710 二異丙氧基雙(乙基乙醯醋酸)鈦63%溶液)作為(C)成分,除此之外,與實施例1同樣地,得到均質且透明的縮合反應型矽氧烷組成物5(6000mPa・s/25℃)。Example 5 0.1 part of a titanium chelate compound (manufactured by Matsumoto Fine Chemical Co., Ltd., TC-710 diisopropoxy bis(ethylacetonitrile acetate) titanium 63% solution) was used as the component (C), and In the same manner as in Example 1, a homogeneous and transparent condensation reaction type oxoxane composition 5 (6000 mPa·s / 25 ° C) was obtained.

實施例6 不使用(D)成分,除此之外,與實施例1同樣地,得到均質且透明的縮合反應型矽氧烷組成物6(1000mPa・s/25℃)。Example 6 A homogeneous and transparent condensation reaction type oxoxane composition 6 (1000 mPa·s / 25 ° C) was obtained in the same manner as in Example 1 except that the component (D) was not used.

實施例7 將40份作為(A)成分且在室溫下為固體狀的聚倍半矽氧烷(商品名「Z-6018」、Dow Corning Corp.製,碎片狀、R1 =苯基及正丙基、來自矽醇基的羥基的含量為6wt%、TA 單位100莫耳%、軟化點40℃);60份作為(B)成分且在室溫下為液體狀聚倍半矽氧烷(商品名「MSE-100」、Wacker Chemie AG製,R1 =甲基、黏度30mPa・s/25℃、烷氧基含量32wt%)在130℃下充分混合,得到均質且無色透明的液體。接下來於其中添加0.3份作為(C)成分的ZC-700,在室溫下充分混合,得到均質且透明的晶粒黏著劑7(2300mPa・s/25℃)。Example 7 40 parts of polysilsesquioxane (product name "Z-6018", manufactured by Dow Corning Corp., which is a component (A) and which is solid at room temperature, has a fragment shape, R 1 = phenyl group and N-propyl, content of hydroxyl group derived from sterol group is 6 wt%, unit of T A 100 mol%, softening point 40 ° C); 60 parts as component (B) and liquid at room temperature Alkane (trade name "MSE-100", manufactured by Wacker Chemie AG, R 1 = methyl group, viscosity 30 mPa·s / 25 ° C, alkoxy group content 32 wt%) was thoroughly mixed at 130 ° C to obtain a homogeneous and colorless transparent liquid. . Next, 0.3 part of ZC-700 as the component (C) was added thereto, and the mixture was sufficiently mixed at room temperature to obtain a homogeneous and transparent crystal grain adhesive 7 (2300 mPa·s / 25 ° C).

實施例8 將50份作為(A)成分的KR-220L與50份作為(B)成分且在室溫下為液體狀聚倍半矽氧烷(商品名「X-40-9227」、信越化學工業股份有限公司製,R1 =甲基及苯基、黏度20mPa・s/25℃、烷氧基含量15wt%)在130℃下充分混合,得到均質且無色透明的液體。接下來於其中添加0.8份作為(C)成分的ZC-700;及3.0份作為(D)成分的AEROSIL RX200,在室溫下充分混合,得到均質且透明的晶粒黏著劑8(8000mPa・s/25℃)。Example 8 50 parts of KR-220L as component (A) and 50 parts of liquid polysesquioxane as a component (B) at room temperature (trade name "X-40-9227", Shin-Etsu Chemical Co., Ltd. Industrial Co., Ltd., R 1 = methyl and phenyl, viscosity 20 mPa·s / 25 ° C, alkoxy group content 15 wt%) was thoroughly mixed at 130 ° C to obtain a homogeneous and colorless transparent liquid. Next, 0.8 part of ZC-700 as the component (C); and 3.0 parts of AEROSIL RX200 as the component (D) were added thereto, and sufficiently mixed at room temperature to obtain a homogeneous and transparent die attaching agent 8 (8000 mPa·s). /25 ° C).

實施例9 將60份作為(A)成分的Z-6018與40份作為(B)成分的X-40-9227在130℃下充分混合,得到均質且無色透明的液體。接下來於其中添加3.0份作為(C)成分的ZC-700,在室溫下充分混合,得到均質且透明的晶粒黏著劑9(4100mPa・s/25℃)。Example 9 60 parts of Z-6018 as the component (A) and 40 parts of X-40-9227 as the component (B) were sufficiently mixed at 130 ° C to obtain a homogeneous and colorless transparent liquid. Next, 3.0 parts of ZC-700 as the component (C) was added thereto, and the mixture was thoroughly mixed at room temperature to obtain a homogeneous and transparent die attaching agent 9 (4100 mPa·s / 25 ° C).

比較例1 將50份作為(A)成分且在室溫下為固體狀的聚倍半矽氧烷(商品名「SILRES MK」、旭化成Wacker Silicone股份有限公司製,R1 =甲基、來自矽醇基的羥基的含量為0wt%)、50份前述(B-1)成分、0.3份鋯螯合物(Matsumoto Fine Chemical股份有限公司製,ZC-700(四乙醯丙酮鋯20%溶液))、及5.5份AEROSIL RX200在室溫下充分混合,得到均質且透明的縮合反應型矽氧烷組成物A(5000mPa・s/25℃)。Comparative Example 1 50 parts of polysilsesquioxane which is a component (A) and which is solid at room temperature (trade name "SILRES MK", manufactured by Asahi Kasei Wacker Silicone Co., Ltd., R 1 = methyl group, from 矽The content of the hydroxyl group of the alcohol group is 0% by weight), 50 parts of the above (B-1) component, and 0.3 part of the zirconium chelate compound (manufactured by Matsumoto Fine Chemical Co., Ltd., ZC-700 (tetraethylguanidinium zirconium 20% solution)) And 5.5 parts of AEROSIL RX200 were thoroughly mixed at room temperature to obtain a homogeneous and transparent condensation reaction type azide composition A (5000 mPa·s / 25 ° C).

比較例2 將100份(B-1)成分、0.3份鋯螯合物、及5.5份AEROSIL RX200在室溫下充分混合,得到均質且透明的縮合反應型矽氧烷組成物B(4000mPa・s/25℃)。Comparative Example 2 100 parts of the component (B-1), 0.3 part of the zirconium chelate compound, and 5.5 parts of AEROSIL RX200 were thoroughly mixed at room temperature to obtain a homogeneous and transparent condensation reaction type oxoxane composition B (4000 mPa·s). /25 ° C).

比較例3 將50份作為(A)成分的KR220L與50份作為(B)成分的(B-1)成分、5.5份作為(D)成分的AEROSIL RX200在室溫下充分混合,得到均質且透明的縮合反應型矽氧烷組成物C(6000mPa・s/25℃)。Comparative Example 3 50 parts of KR220L as the component (A) and 50 parts of the component (B-1) as the component (B) and 5.5 parts of the AEROSIL RX200 as the component (D) were sufficiently mixed at room temperature to obtain a homogeneous and transparent Condensation-reactive type oxoxane composition C (6000 mPa·s / 25 ° C).

<硬化物的製作1> 將實施例1所得到的縮合反應型矽氧烷組成物1注入塗佈有鐵氟龍(註冊商標)的圓形金屬框(直徑5cm、高度2mm),使其在120℃的乾燥爐中硬化1小時,然後在150℃的乾燥爐中硬化3小時,而製作出硬化物1(測試片)。<Preparation 1 of cured product> The condensation reaction type azide composition 1 obtained in Example 1 was poured into a circular metal frame (diameter: 5 cm, height: 2 mm) coated with Teflon (registered trademark) to make it It was hardened in a drying oven at 120 ° C for 1 hour, and then hardened in a drying oven at 150 ° C for 3 hours to prepare a cured product 1 (test piece).

[表1] [Table 1]

(1)保存安定性 將上述縮合反應型矽氧烷組成物1靜置在25±1℃、50±10%RH的條件下,依照以下的基準評估使用期限。 5:黏度到達初始值的125%以上的時間為48小時以上 3:黏度到達初始值的125%以上的時間為12小時以上低於48小時 1:黏度到達初始值的125%以上的時間低於12小時(1) Preservation stability The above condensation reaction type azide composition 1 was allowed to stand at 25 ± 1 ° C and 50 ± 10% RH, and the service life was evaluated according to the following criteria. 5: The time when the viscosity reaches 125% of the initial value is 48 hours or more. 3: The time when the viscosity reaches 125% or more of the initial value is 12 hours or more and less than 48 hours. 1: The time when the viscosity reaches 125% or more of the initial value is lower than the time. 12 hours

(2)初始硬化性 使用高分子計器股份有限公司製的蕭耳硬度計D型測定上述硬化物1的硬度,依照以下的基準評估實施例1所關連的縮合反應型矽氧烷組成物1的初始硬化性。(2) Initial hardening property The hardness of the cured product 1 was measured using a Durometer D model manufactured by Kobunshi Co., Ltd., and the condensation reaction type siloxane composition 1 related to Example 1 was evaluated according to the following criteria. Initial hardenability.

5:40以上 3:20以上低於40 1:低於205:40 or more 3:20 or more is lower than 40 1: lower than 20

(3)耐熱性 <初始耐熱性> 藉由下述計算式計算出上述硬化物1的質量減少率,依照以下揭示的基準再度評估初始耐熱性。(3) Heat resistance <Initial heat resistance> The mass reduction rate of the cured product 1 was calculated by the following calculation formula, and the initial heat resistance was evaluated again in accordance with the basis disclosed below.

(式) 加熱後的質量減少率(%)=100-(硬化物1的質量/縮合反應型矽氧烷組成物1的質量)×100(Formula) Mass reduction rate after heating (%) = 100 - (mass of hardened material 1 / mass of condensation-reactive type helium oxide composition 1) × 100

5:低於15% 3:15%以上低於25% 1:25%以上5: less than 15% 3:15% or more is less than 25% 1:25% or more

<加熱後的耐熱性> 將上述硬化物1進一步在200℃的乾燥爐中加熱1000小時,而得到硬化物2。接下來,藉由下述計算式計算其質量減少率,依照以下的基準再度評估耐熱性。<Heat resistance after heating> The cured product 1 was further heated in a drying oven at 200 ° C for 1,000 hours to obtain a cured product 2 . Next, the mass reduction rate was calculated by the following calculation formula, and the heat resistance was evaluated again in accordance with the following criteria.

(式) 加熱後的質量減少率(%)=100-(硬化物2的質量/硬化物1的質量)×100(Formula) Mass reduction rate after heating (%) = 100 - (mass of hardened material 2 / mass of hardened material 1) × 100

5:低於5% 3:5%以上低於7.5% 1:7.5%以上5: less than 5% 3:5% or more is less than 7.5% 1:7.5% or more

(4)透明性 使用島津製作所股份有限公司製分光光度計UV-MINI-1240,測定上述硬化物1在波長400nm的平行光線透過率,依照以下的基準評估透明性。(4) Transparency The parallel light transmittance of the cured product 1 at a wavelength of 400 nm was measured using a spectrophotometer UV-MINI-1240 manufactured by Shimadzu Corporation, and the transparency was evaluated in accordance with the following criteria.

5:75%以上 3:65%以上低於75% 1:低於65%5:75% or more 3:65% or more is less than 75% 1: less than 65%

(5)耐龜裂性 對於上述硬化物1,依照以下的基準,以目視評估耐龜裂性。(5) Crack resistance The crack resistance was visually evaluated on the cured product 1 in accordance with the following criteria.

5:無龜裂 1:有龜裂5: no cracks 1: cracked

(6)耐氣泡性 對於上述硬化物1,依照以下的基準,以目視評估耐氣泡性。 5:無氣泡 1:有氣泡(6) Bubble resistance The above-mentioned cured product 1 was visually evaluated for bubble resistance in accordance with the following criteria. 5: no bubbles 1: bubbles

(7)彎曲強度 使用島津製作所股份有限公司製的Autograph AGS-10kND,測定上述硬化物1的彎曲強度,依照以下的基準評估柔軟性與強度的平衡。(7) Bending strength The bending strength of the cured product 1 was measured using an Autograph AGS-10kND manufactured by Shimadzu Corporation, and the balance between softness and strength was evaluated in accordance with the following criteria.

5:20MPa以上 3:10MPa以上低於20MPa 1:低於10MPa5: 20 MPa or more 3: 10 MPa or more and less than 20 MPa 1: less than 10 MPa

(8)剪切強度 使用實施例1所得到的縮合反應型矽氧烷組成物1,將矽晶片(2mm×2mm×1mm)黏接至鋁板,在乾燥爐中以120℃、1小時的條件加熱,然後進一步以150℃、3小時的條件加熱。接下來,使用市售的黏結強度試驗機(製品名「DAGE-SERIES-4000PXY)、Dage公司製),在室溫(25℃)下進行測定接著層(硬化物)的剪切強度,並依照以下的基準進行評估。(8) Shear strength Using the condensation reaction type azide composition 1 obtained in Example 1, a tantalum wafer (2 mm × 2 mm × 1 mm) was bonded to an aluminum plate at 120 ° C for 1 hour in a drying furnace. It was heated and then further heated at 150 ° C for 3 hours. Next, using a commercially available bond strength tester (product name "DAGE-SERIES-4000PXY", manufactured by Dage Co., Ltd.), the shear strength of the adhesive layer (cured material) was measured at room temperature (25 ° C), and The following benchmarks are evaluated.

5:30N以上 3:15N以上低於30N 1:低於15N5:30N or more 3:15N or more is less than 30N 1: less than 15N

對於其他實施例、及比較例之各縮合反應型矽氧烷組成物或其硬化物也同樣地實施上述測試。The above test was carried out in the same manner for each of the condensation reaction type oxoxane compositions of the other examples and the comparative examples or the cured products thereof.

[表2] [Table 2]

(產業上的可利用性) 如表2所示般,可知本發明之縮合反應型矽氧烷組成物的保存安定性及初始硬化性優異,所得到的硬化物的耐熱性、透明性、耐龜裂性、耐氣泡性、彎曲強度及剪切強度優異。尤其該組成物為縮合反應型組成物,儘管在反應過程中副生成水或低分子醇,其硬化物的耐氣泡性依然良好,這點特別值得一提。(Industrial Applicability) As shown in Table 2, it is understood that the condensation-reactive type azide composition of the present invention is excellent in storage stability and initial hardenability, and heat resistance, transparency, and resistance of the obtained cured product. Excellent in cracking, bubble resistance, bending strength and shear strength. In particular, the composition is a condensation-reactive composition, and although the water-repellent or low-molecular-weight alcohol is formed by the by-product during the reaction, the bubble resistance of the cured product is still good, which is particularly worth mentioning.

本發明之縮合反應型矽氧烷組成物,像這樣具有許多優點,因此可供應至例如黏著劑、密封劑、塗佈劑、密封劑及塗料等的廣泛用途。The condensation reaction type oxoxane composition of the present invention has many advantages as described above, and thus can be supplied to a wide range of applications such as an adhesive, a sealant, a coating agent, a sealant, and a coating material.

具體而言,從上述初始硬化性、耐龜裂性、彎曲強度及剪切強度的結果看來,該組成物可利用作為用來將矽、鋁、鐵、金、銀及銅等的同種或異種金屬彼此接合的金屬用黏著劑,以及電阻器等的外殼材料。Specifically, from the results of the initial hardenability, crack resistance, flexural strength, and shear strength, the composition can be used as the same species for bismuth, aluminum, iron, gold, silver, copper, or the like. Adhesives for metals in which dissimilar metals are bonded to each other, and outer casing materials such as resistors.

另外,從上述初始硬化性、耐熱性、透明性、耐龜裂性及耐氣泡性的結果看來,該組成物亦可利用作為電源模組及溫度感測器的密封劑、電子基板等的防濕塗劑。Moreover, from the results of the initial hardenability, heat resistance, transparency, crack resistance, and bubble resistance, the composition can also be used as a sealing agent for a power module and a temperature sensor, an electronic substrate, or the like. Moisture-proof paint.

另外,從上述初始硬化性、耐熱性、透明性、耐龜裂性、耐氣泡性、彎曲強度及剪切強度的結果看來,該組成物亦可利用作為用來將玻璃或塑膠製的透鏡、透明窗等接合於支持體的光學黏著劑、LED等的光學元件的封裝材料、含有UV-LED、雷射、受光元件的光半導體元件的密封劑或阻障材料。Further, from the results of the initial hardenability, heat resistance, transparency, crack resistance, bubble resistance, bending strength, and shear strength, the composition can also be used as a lens for glass or plastic. A transparent adhesive or the like, an optical adhesive bonded to a support, an encapsulant of an optical element such as an LED, or a sealant or a barrier material of an optical semiconductor element including a UV-LED, a laser, and a light-receiving element.

no

Claims (5)

一種縮合反應型矽氧烷組成物,含有: (A)在室溫下為固體狀的聚倍半矽氧烷,其含有由R1 SiO3/2 (式中,R1 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TA ),且具有羥基; (B)在室溫下為液狀的聚倍半矽氧烷,其含有由R2 SiO3/2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者)所示三矽烷氧基單元(TB ),且具有-OR2 (式中,R2 表示選自於由碳數1~15的烷基、苯基及苄基所構成群組中之一者);及 (C)縮合反應觸媒。A condensation reaction type oxoxane composition comprising: (A) a polysesquioxane which is solid at room temperature, which contains R 1 SiO 3/2 (wherein R 1 is selected from the group consisting of a trioxooxy unit (T A ) having one carbon group of 1 to 15 carbon atoms, one of a group consisting of a phenyl group and a benzyl group, and having a hydroxyl group; (B) being liquid at room temperature a polysesquioxane containing R 2 SiO 3/2 (wherein R 2 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group, and a benzyl group) a trioxooxy unit (T B ), and having -OR 2 (wherein R 2 represents one selected from the group consisting of an alkyl group having 1 to 15 carbon atoms, a phenyl group, and a benzyl group) And; (C) condensation reaction catalyst. 如請求項1之縮合反應型矽氧烷組成物,其中(A)成分的軟化點為40~150℃。The condensation reaction type oxoxane composition of claim 1, wherein the component (A) has a softening point of 40 to 150 °C. 如請求項1或2之縮合反應型矽氧烷組成物,其中(B)成分的黏度為5~10000mPa・s/25℃。The condensation reaction type oxoxane composition of claim 1 or 2, wherein the (B) component has a viscosity of 5 to 10000 mPa·s / 25 °C. 如請求項1至3中任一項之縮合反應型矽氧烷組成物,其進一步含有(D)無機填料。The condensation reaction type oxoxane composition according to any one of claims 1 to 3, which further contains (D) an inorganic filler. 一種如請求項1至4中任一項之縮合反應型矽氧烷組成物的硬化物。A cured product of the condensation reaction type oxoxane composition according to any one of claims 1 to 4.
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