TW201733417A - Printed circuit board and method manufacturing same - Google Patents

Abstract

The present invention relates to a method of manufacturing a printed circuit board. The method comprises: forming a first through hole, a second through hole and a third through hole in a substrate; removing part of the first layer by etching the copper foil selectively, to form a first inductance coil, a second inductance coil and a third inductance coil. The first inductance coil and the second inductance coil are connected electrically by the through first hole and the second through hole. The second inductance coil and the third inductance coil are connected electrically by wires of end of the coils. The first inductance coil surrounds the first through hole, and gradually leads to the first through hole. The second inductance coil surrounds the second through hole, and gradually leads to the second through hole. The third inductance coil surrounds the third through hole, and gradually leads to the third through hole.

Description

Circuit board and circuit board manufacturing method

The present invention relates to a circuit board and a circuit board manufacturing method, and more particularly to a circuit board having an inductor unit and a circuit board having the inductor unit.

Currently, various types of antennas, such as Wireless Fidelity (Wi-Fi), Blue teeth, Global Positioning System (GPS), Near Field Communication (NFC), Code Division Multiple Access (CDMA), Long Term Evolution (LTE), etc. For the function, it is necessary to install the inductance component on the corresponding circuit board. At present, the required inductance components are usually soldered to the circuit board by soldering. However, the welding method of the welding component makes the process lengthy and the production efficiency is low, and the noise of the solder paste is larger than that of the wire material of the circuit board. In addition, the inductive component is soldered in a flashing manner, and the inductive component generally protrudes from the circuit board, which is disadvantageous in reducing the size of the final product.

In view of the above, it is necessary to provide a circuit board and a circuit board manufacturing method that overcome the above problems.

A circuit board includes a substrate, the substrate includes a first surface and a second surface disposed opposite to each other, the first surface is provided with an inductance unit, and the inductance unit includes a first inductor coil, a second inductor coil, and a third An inductor, a first via hole is disposed in a center of the first inductor coil, a second via hole is disposed in a center of the second inductor coil, and a third via hole is disposed in a center of the third inductor coil, the first inductor The coil surrounds the first via hole and is led to the first via hole in a circle, and the second inductor coil surrounds the second via hole and is led to the second via hole in a circle. The third inductor coil surrounds the third via hole and is led to the third via hole in a circle, and the first inductor coil is spaced apart from the second inductor coil on the first surface. The second inductive coil is electrically connected to the third inductive coil on the first surface, and the first through hole, the second through hole and the third through hole respectively penetrate the first surface and the a second surface, the first via and the second The through holes are electrically connected to the second surface.

A circuit board manufacturing method includes the steps of: forming a first via hole, a second via hole, and a third via hole in a substrate, wherein the first via hole, the second via hole, and the third via hole are opposite to the substrate a first copper layer on the side is turned on; a portion of the first copper layer is selectively etched away, and the first via hole and the second via hole are communicated on the other side of the substrate to obtain the above Circuit board.

Compared with the prior art, the circuit board and the circuit board manufacturing method provided by the invention directly integrate the inductance component into the circuit board, and the welding inductance component is not required to be soldered, and on the one hand, the process can be shortened and the production efficiency can be improved; In one aspect, since the inductive component is directly integrated in the circuit board in the form of an inductor coil, solder paste soldering is not required, and noise of the final product can be reduced. In addition, the integration of the inductive component into the board also reduces the size of the final product and increases the resonant frequency.

1 is a perspective view of a circuit board integrated with an inductor unit according to a preferred embodiment of the present invention.

2 is a bottom plan view of the circuit board shown in FIG. 1.

Figure 3 is a cross-sectional view taken along line III-III of Figure 1.

FIG. 4 is a cross-sectional view showing the first, second, third, and fourth via holes in the first and second surfaces of the first and second surfaces of the substrate provided in the preferred embodiment of the present invention.

The circuit board and the circuit board manufacturing method provided by the present invention will be described in detail below with reference to specific embodiments.

Please refer to FIG. 1 , a circuit board 100 provided by an embodiment of the present invention. The circuit board 100 includes a substrate 10. The substrate 10 includes a first surface 12 and a second surface 14. The first surface 12 and the second surface 14 are located on opposite sides of the substrate 10. The first surface is provided with an inductance unit 20.

The inductor unit 20 includes a first inductor coil 21, a second inductor coil 22, and a third inductor coil 23. In the present embodiment, the first inductive coil 21, the second inductive coil 22, and the third inductive coil 23 are arranged side by side on the first surface 12. The first inductive coil 21 is spaced apart from the second inductive coil 22, and the second inductive coil 22 is electrically connected to the third inductive coil 23.

The circuit board 100 further includes a first via hole 31, a second via hole 32, a third via hole 33, a first ground copper foil 41, and a second ground copper foil 42.

The first via hole 31 is located at the center of the first inductor coil 21 . The second via hole 32 is located at the center of the second inductor coil 22 . The third via hole 33 is located at the center of the third inductor coil 23. The first via hole 31 , the second via hole 32 , and the third via hole 33 penetrate through the first surface 12 and the second surface 14 .

The inductive unit 20 is located within an area of 1.79 mm * 4 mm. In this embodiment, the inductance of the inductive unit 20 ranges from 49.21 to 49.67 nanohenry. The DC resistance range of the inductor unit 20 is 0.273 to 0.386 ohms. The quality factor of the inductor unit ranges from 47.36 to 55.23. The self-resonant frequency range of the inductor unit is 2~3 GHz.

The first inductive coil 21 surrounds the first via hole 31 and is led to the first via hole 31 in a circle. In the embodiment, the first inductor coil 21 includes a first connection pad 211 , a first connection segment 212 , a first winding body 213 , and a first ground segment 214 . The first connection pads 211 correspond to the first via holes 31 and are electrically connected to each other. The first connecting segment 212 is electrically connected between the first connecting pad 211 and the first winding body 213. In this embodiment, the first connecting segment 212 is vertically connected between the first connecting pad 211 and the first winding main body 213. The first grounding segment 214 is electrically connected to an end of the first winding body 213 away from the first connecting segment 212. In this embodiment, the first grounding section 214 is perpendicularly connected to the end of the first winding body 213 away from the first connecting section 212. The first winding body 213 is centered on the first connection pad 211 and is led out from the first connection segment 212 around the first connection pad 211 to the first ground segment 214. In this embodiment, the first winding main body 213 is substantially ring-shaped around the circle. In this embodiment, the vertical distance between the first connection pad 211 and the inner ring wire of the first winding body 213 ranges from 0.05 to 0.4 mm.

The second inductive coil 22 surrounds the second via hole 32 and is led to the second via hole 32 in a circle. In this embodiment, the second inductive coil 22 includes a second connection pad 221 , a second connection segment 222 , a second winding body 223 , and a second conduction segment 224 . The second connection pad 221 corresponds to the shape and size of the first connection pad 211. The second connecting segment 222 is electrically connected between the second connecting pad 221 and the second winding body 223. In this embodiment, the second connecting segment 222 is vertically connected between the second connecting pad 221 and the second winding main body 223. The extending direction of the second connecting section 222 is perpendicular to the extending direction of the first connecting section 212. The second conductive segment 224 is electrically connected to an end of the second winding body 223 away from the second connecting segment 222 .

The third inductive coil 23 surrounds the third via hole 33 and is led to the third via hole 33 in a circle. In the embodiment, the third inductor coil 23 includes a third connection pad 231 , a third connection segment 232 , a third winding body 233 , and a third conduction segment 234 . The third connection pad 231 corresponds to the shape and size of the first connection pad 211 and the second connection pad 221 . The third connecting segment 232 is electrically connected between the third connecting pad 231 and the third winding body 233. In this embodiment, the third connecting segment 232 is vertically connected between the third connecting pad 231 and the third winding main body 233. The extending direction of the third connecting section 232 is the same as and parallel to the extending direction of the first connecting section 212. The third conductive segment 234 is electrically connected to an end of the third winding body 233 away from the third connecting segment 232. In this embodiment, the third conductive segment 234 is electrically connected to the second conductive segment 224 , and the third conductive segment 234 is collinear with the second conductive segment 224 .

In the present embodiment, the number of turns of the second winding main body 223 is the same as the number of turns of the third winding main body 233. The shape and size of the first winding main body 213 and the second winding main body 223 and the third winding main body 233 are substantially the same.

Referring to FIG. 2 together, in the embodiment, the first ground copper foil 41 and the second ground copper foil 42 are located on the first surface 12 and are located in the same layer. The first inductive coil 21 , the second inductive coil 22 , and the second inductive coil 22 are located between the first ground copper foil 41 and the second ground copper foil 42 . In the present embodiment, the extending direction of the first grounding copper foil 41 is opposite to the extending direction of the second grounding copper foil 42 , and the first inductive coil 21 is adjacent to the first grounding copper foil 41 . The third inductive coil 23 is adjacent to the second ground copper foil 42. The second inductive coil 22 is located between the first inductive coil 21 and the second inductive coil 22 . The first grounding segment 214 of the first inductive coil 21 is electrically connected to the first grounding copper foil 41. The second conductive segment 224 of the second inductive coil 22 is electrically connected to the third conductive segment 234 of the third inductive coil 23 .

A fourth via hole 34 is disposed on the second ground copper foil 42. The fourth via hole 34 penetrates the second ground copper foil 42 and the substrate 10 .

Referring to FIG. 2 , the first via hole 31 and the second via hole 32 are electrically connected to the second surface 14 to connect the first inductor 21 and the second inductor 22 in series. The third via hole 33 and the fourth via hole 34 are electrically connected to the second surface 14 to connect the second ground copper foil 42 of the third inductor coil 23 in series.

It can be understood that in other embodiments, a first contact pad 141, a second contact pad 142, a third contact pad 143 and a fourth contact pad 144 may be disposed on the second surface 14. The first contact pad 141 is located on the first via hole 31 and electrically connected to the first connection pad 211. The second contact pad 142 is located on the second via hole 32 and electrically connected to the second connection pad 221 . The third contact pad 143 is located on the third via hole 33 and electrically connected to the second connection pad 221 . The fourth contact pad 144 is located on the fourth via hole 34. The first contact pad 141 is electrically connected to the second contact pad 142 such that the first inductor 21 and the second inductor 22 are connected in series. The third contact pad 143 is electrically connected to the fourth contact pad 144 such that the third inductive coil 23 is connected in series with the second ground copper foil 42.

It can be understood that in other embodiments, the second winding body 223 and the third winding body 233 may also have different number of coil turns.

It can be understood that in other embodiments, the first connection pad 211, the second connection pad 221, and the third connection pad 231 may be omitted.

After testing, the position of the first ground segment 214 relative to the first connection pad 211 may be changed, or by changing the first winding body 213 or the first state, while maintaining other conditions. The number of turns of the two winding main body 223 or the third winding main body 233, or by changing the line width of the first winding main body 213 or the second winding main body 223 or the third winding main body 233 For the fine adjustment of each parameter of the inductance unit 20, the inductance range, the DC resistance range, the quality factor range, and the self-resonance frequency range of the fine-tuned inductor unit 20 still satisfy the above-mentioned corresponding parameter range.

In the invention, since three inductor coils are designed in series in a certain area on the same plane, the spacing between the wires and the wires of each inductor coil is increased, and the capacitance between the wires and the wires in the inductor coil is relatively small. Therefore, the resonance frequency is relatively large. In the present embodiment, the resonant frequency is Frst, where Frsf ≧ 3 GHz.

Embodiments of the present invention also provide a circuit board manufacturing method, including the following steps.

In the first step, referring to FIG. 4, a first via hole 31, a second via hole 32, and a third portion which are electrically connected to the first copper layer 301 on one side of the substrate 10 and penetrate the substrate 10 are formed in a substrate 10. The via hole 33 and the fourth via hole 34.

The first via hole 31, the second via hole 32, the third via hole 33, and the fourth via hole 34 can be obtained by drilling and plating holes.

In the second step, referring again to FIG. 1-3, the first copper layer 301 is selectively removed to form the first inductor 21, the second inductor 22, the third inductor 23, and the The first grounding copper foil 41 and the second grounding copper foil 42; the first via hole 31 and the second via hole 32, the third via hole by any other means such as plating, stripping, or the like An electrical connection is made between the 33 and the fourth via 34 on the second surface 14 of the substrate 10 opposite the first copper layer 301.

The first inductive coil 21 and the second inductive coil 22 are electrically connected by the first via hole 31 and the second via hole 32. The second inductive coil 22 and the third inductive coil 23 are electrically connected by wires on the ends of the two coils. The first inductive coil 21 surrounds the first via hole 31 and is led from the first ground copper foil 41 to the first via hole 31 in a circle. The second inductive coil 22 surrounds the second via 32 and is led from the third inductive coil 23 to the second via 32 in a turn. The third inductive coil 23 surrounds the third via hole 33 and is led from the second inductive coil 22 to the third via hole 33 in a circle.

In the embodiment, the first inductor coil 21 includes a first connection pad 211 , a first connection segment 212 , a first winding body 213 , and a first ground segment 214 . The first connection pad 211 corresponds to the first via hole 31 and is electrically connected. The first connecting segment 212 is electrically connected between the first connecting pad 211 and the first winding body 213. In this embodiment, the first connecting segment 212 is vertically connected between the first connecting pad 211 and the first winding main body 213. The first grounding segment 214 is electrically connected to an end of the first winding body 213 away from the first connecting segment 212, and is connected to the first winding body 213 and the first grounding copper foil 41. between. In this embodiment, the first grounding section 214 is perpendicularly connected to the end of the first winding body 213 away from the first connecting section 212. The first winding body 213 is centered on the first connection pad 211 and is led from the first ground segment 214 around the first connection pad 211 to the first connection segment 212. In this embodiment, the first winding main body 213 is substantially ring-shaped around the circle. In this embodiment, the vertical distance between the first connection pad 211 and the inner ring wire of the first winding body 213 ranges from 0.05 to 0.4 mm.

In this embodiment, the second inductive coil 22 includes a second connection pad 221 , a second connection segment 222 , a second winding body 223 , and a second conduction segment 224 . The second connection pad 221 is electrically connected to the second via hole 32. The second connecting segment 222 is electrically connected between the second connecting pad 221 and the second winding body 223. In this embodiment, the second connecting segment 222 is vertically connected between the second connecting pad 221 and the second winding main body 223. The extending direction of the second connecting section 222 is opposite to and parallel to the extending direction of the first connecting section 212. The second conductive segment 224 is electrically connected to an end of the second winding body 223 away from the second connecting segment 222 , and is electrically connected to the second winding body 223 and the second ground copper foil Between 42. In this embodiment, the second conductive segment 224 is vertically connected between the second winding body 223 and the second ground copper foil 42. The second winding body 223 is centered on the second connection pad 221 and is led out from the second connection segment 222 around the second connection pad 221 to the second conduction segment 224. In this embodiment, the second winding main body 223 is substantially ring-shaped around the circle.

The third inductive coil 23 includes a third connection pad 231 , a third connection segment 232 , a third winding body 233 , and a third conduction segment 234 . The third connection pads 231 correspond to the third via holes 33 and are electrically connected to each other. The third connecting segment 232 is electrically connected between the third connecting pad 231 and the third winding body 233. In this embodiment, the third connecting segment 232 is vertically connected between the third connecting pad 231 and the third winding main body 233. The third conductive segment 234 is electrically connected to an end of the second winding body 223 away from the second connecting segment 222 . In this embodiment, the third conductive segment 234 is perpendicularly connected to an end of the third winding body 233 away from the third connecting segment 232 . The third winding body 233 is centered on the third connection pad 231 and is led out from the third connection section 232 around the third connection pad 231 to the third conduction section 234. The third conductive segment 234 is electrically connected to the second conductive segment 224 . In this embodiment, the third winding main body 233 is substantially ring-shaped around the circle.

Referring to FIG. 3 , the fourth via hole 34 is disposed on the second ground copper foil 42 . The fourth via hole 34 penetrates and turns on the second ground copper foil 42 and the substrate 10 . The third inductor coil 23 is electrically connected to the second ground copper foil 42 via the third via hole 33 and the fourth via hole 34 .

In this embodiment, a portion of the first copper layer 301 is selectively removed by image transfer and etching to form the first inductor 21, the second inductor 22, the third inductor 23, and the The first ground copper foil 41 and the second ground copper foil 42 are described.

Compared with the prior art, the circuit board and the circuit board manufacturing method provided by the invention directly integrate the inductance component into the circuit board, and the welding inductance component is not required to be soldered, and on the one hand, the process can be shortened and the production efficiency can be improved; In one aspect, since the inductive component is directly integrated in the circuit board in the form of an inductor coil, solder paste soldering is not required, and noise of the final product can be reduced. In addition, the integration of the inductive component into the board also reduces the size of the final product and increases the resonant frequency.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧ boards

10‧‧‧Base

12‧‧‧ first surface

14‧‧‧ second surface

20‧‧‧Inductance unit

21‧‧‧First Inductor Coil

211‧‧‧First connection pad

212‧‧‧First connection segment

213‧‧‧First winding body

214‧‧‧First grounding section

22‧‧‧second inductor coil

221‧‧‧Second connection pad

222‧‧‧Second connection

223‧‧‧Second winding body

224‧‧‧second conduction section

23‧‧‧ Third Inductor Coil

231‧‧‧ Third connection pad

232‧‧‧ third connection

233‧‧‧ Third winding body

234‧‧‧3rd conduction section

301‧‧‧First copper layer

31‧‧‧First via

32‧‧‧Second via

33‧‧‧3rd via

34‧‧‧fourth through hole

41‧‧‧First ground copper foil

42‧‧‧Second ground copper foil

no

100‧‧‧ boards

10‧‧‧Base

12‧‧‧ first surface

14‧‧‧ second surface

20‧‧‧Inductance unit

21‧‧‧First Inductor Coil

211‧‧‧First connection pad

212‧‧‧First connection segment

213‧‧‧First winding body

214‧‧‧First grounding section

22‧‧‧second inductor coil

221‧‧‧Second connection pad

222‧‧‧Second connection

223‧‧‧Second winding body

224‧‧‧second conduction section

23‧‧‧ Third Inductor Coil

231‧‧‧ Third connection pad

232‧‧‧ third connection

233‧‧‧ Third winding body

234‧‧‧3rd conduction section

31‧‧‧First via

32‧‧‧Second via

33‧‧‧3rd via

34‧‧‧fourth through hole

41‧‧‧First ground copper foil

42‧‧‧Second ground copper foil

Claims (10)

A circuit board includes a substrate, the substrate includes a first surface and a second surface disposed opposite to each other, the first surface is provided with an inductance unit, and the inductance unit includes a first inductor coil, a second inductor coil, and a third An inductor, a first via hole is disposed in a center of the first inductor coil, a second via hole is disposed in a center of the second inductor coil, and a third via hole is disposed in a center of the third inductor coil, the first inductor The coil surrounds the first via hole and is led to the first via hole in a circle, and the second inductor coil surrounds the second via hole and is led to the second via hole in a circle. The third inductor coil surrounds the third via hole and is led to the third via hole in a circle, and the first inductor coil is spaced apart from the second inductor coil on the first surface. The second inductive coil is electrically connected to the third inductive coil on the first surface, and the first through hole, the second through hole and the third through hole respectively penetrate the first surface and the a second surface, the first via and the second The through holes are electrically connected to the second surface. The circuit board of claim 1, wherein the circuit board further includes a first grounding copper foil and a second grounding copper foil, wherein the first grounding copper foil and the second grounding copper foil are both located a first ground copper foil electrically connected to the first inductive coil; the second ground copper foil includes a fourth via hole, the fourth via hole penetrating the second ground copper foil and the a substrate and electrically connected to the third via hole on the second surface to electrically connect the second ground copper foil and the third inductor coil. The circuit board of claim 2, wherein the first inductive coil comprises a first connection pad, a first connection segment, a first winding body and a first ground segment, the first connection pad and the first a via connection, the first connection segment is connected between the first connection pad and the first winding body, and the first ground segment is located at the winding body away from the first connection segment An end portion connected between the first winding body and the first ground copper foil, the first winding body being centered on the first connection pad, surrounding the first connection segment The first connection pad is externally led to the first ground segment, and the first ground segment is electrically connected to the first ground copper foil. The circuit board of claim 2, wherein the second inductive coil comprises a second connection pad, a second connection segment, a second winding body and a second ground segment, the second connection pad and the second a second via segment connected between the second connection pad and the second wire bobbin, wherein the second ground segment is located at the second bobbin body away from the second connection An end of the segment, the second winding body is centered on the second connection pad, and is externally led from the second connection segment around the second connection pad to the second ground segment. The second connection pad is electrically connected to the second ground copper foil. The circuit board of claim 2, wherein the third inductive coil comprises a third connection pad, a third connection segment, a third winding body, and a third ground segment, the third connection pad and the third a third via connecting between the third connection pad and the third winding body, the third ground segment being located at the third winding body away from the third connection An end portion of the segment, the third winding body is centered on the third connection pad, and is externally led from the third connection segment around the second connection pad to the third ground segment. The third grounding segment is electrically connected to the second grounding segment. The circuit board of claim 5, wherein widths of the wires in the first winding body, the second winding body, and the third winding body are the same, the first winding body, The distance between the second winding body and the adjacent wires in the third winding body is the same. The circuit board of claim 6, wherein the widths of the inner winding wires of the first winding body, the second winding body, and the third winding body are smaller than any two adjacent wires thereof the distance between. The circuit board of claim 5, wherein the second bobbin body and the third bobbin body have the same number of turns of the coil. A circuit board manufacturing method includes the steps of:
Forming a first via hole, a second via hole, and a third via hole in a substrate, wherein the first via hole, the second via hole, and the third via hole are electrically connected to the first copper layer on one side of the substrate;
Selective etching removes a portion of the first copper layer, and connects the first via hole and the second via hole on the other side of the substrate to obtain a circuit board as claimed in claim 1. The method of fabricating a circuit board according to claim 9, wherein: when the first via hole, the second via hole, and the third via hole are formed, a fourth via hole is further formed in the substrate, The fourth via hole is electrically connected to the first copper layer; while the first via hole and the second via hole are connected, the third via hole and the ground are also connected to the other side of the substrate The fourth via hole is described to obtain the circuit board according to any one of claims 2-8.