CN107343357B - Circuit board and circuit board manufacturing method - Google Patents
Circuit board and circuit board manufacturing method Download PDFInfo
- Publication number
- CN107343357B CN107343357B CN201610059255.4A CN201610059255A CN107343357B CN 107343357 B CN107343357 B CN 107343357B CN 201610059255 A CN201610059255 A CN 201610059255A CN 107343357 B CN107343357 B CN 107343357B
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- via hole
- coil
- main body
- coiling main
- inductance coil
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
Abstract
A kind of circuit board manufacturing method, comprising steps of forming the first via hole, the second via hole and third via hole in a substrate；Selective etch removes part first copper foil layer, to form the first inductance coil, second inductance coil and third inductance coil, first inductance coil is electrically connected with second inductance coil by the first via hole and the second via hole for running through the substrate, second inductance coil is electrically connected with the third inductance coil by the conducting wire of coil end, first inductance coil is around first via hole, and first via hole is led in from coil to coil, second inductance coil is around second via hole, and second via hole is led in from coil to coil, the third inductance coil is around the third via hole, and the third via hole is led in from coil to coil.
Description
Technical field
The present invention relates to a kind of circuit board and circuit board manufacturing method more particularly to a kind of circuit boards with inductance unit
And the production method of the circuit board with inductance unit.
Background technique
Currently, all kinds of antennas, such as Wireless Fidelity(Wi-Fi), Blue teeth, Global
Positioning System(GPS), Near Field Communication (NFC), Code Division Multiple
Access (CDMA), Long Term Evolution (LTE) etc. is to realize its function, is required to pacify on corresponding circuit board
Fill inductance element.Piece mode is generallyd use at present to be welded to required inductance element on circuit board by tin cream.However, beating
Part mode welds inductance element and makes processing procedure tediously long, and production efficiency is lower, and the conducting wire material due to the resistance value of tin cream compared with circuit board
The resistance value of material is big, so that the noise of final products increases.In addition, piece mode welds inductance element, the inductance element is usual
The circuit board is protruded from, is unfavorable for reducing the size of final products.
Summary of the invention
In view of this, it is necessary to provide a kind of a kind of circuit boards and circuit board manufacturing method for overcoming the above problem.
A kind of circuit board, including substrate, the substrate include the first surface and second surface being disposed opposite to each other, and described first
Surface is provided with inductance unit, and the inductance unit includes the first inductance coil, the second inductance coil and third inductance coil, institute
The first inductance coil center is stated equipped with the first via hole, second inductance coil center is equipped with the second via hole, the third
Inductance coil center is equipped with third via hole, and first inductance coil leads to institute around first via hole in from coil to coil
The first via hole is stated, second inductance coil leads to second via hole, institute around second via hole in from coil to coil
Third inductance coil is stated around the third via hole, and leads to the third via hole in from coil to coil, first inductance coil
On the first surface separately with second inductance coil, second inductance coil on the first surface with institute
The electrical connection of third inductance coil is stated, first via hole, second via hole and third via hole run through described first
Surface and the second surface, first via hole are electrically connected to each other on the second surface with second via hole.
A kind of circuit board manufacturing method, comprising steps of forming the first via hole, the second via hole and third in a substrate
Via hole, first via hole, the second via hole, third via hole are connected with the first layers of copper of the substrate side；Selection
Property etching remove part first layers of copper, be connected to first via hole and second conducting in the other side of the substrate
Hole, to obtain circuit board as described above.
Compared to the prior art, circuit board and circuit board manufacturing method provided by the invention, directly integrate inductance element
Into the circuit board, inductance element is welded without piece, on the one hand, can be shortened processing procedure, be improved production efficiency；On the other hand,
Since the inductance element is directly incorporated into the circuit board in the form of inductance coil, without tin cream welding, can subtract
The noise of few final products.In addition, the inductance element is integrated into the circuit board, the ruler of final products can also be reduced
It is very little, increase resonance frequency.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram for the circuit board for being integrated with inductance unit that better embodiment of the present invention provides.
Fig. 2 is the elevational schematic view of circuit board shown in FIG. 1.
Fig. 3 is schematic cross-sectional view of the Fig. 1 along III-III line.
Fig. 4 is the first layers of copper and the second table that its two sides of conducting are formed in substrate that better embodiment of the present invention provides
The first, second, third of face and the 4th schematic cross-sectional view after via hole.
Main element symbol description
| Circuit board | 100 |
| Substrate | 10 |
| First surface | 12 |
| Second surface | 14 |
| Inductance unit | 20 |
| First inductance coil | 21 |
| First connection gasket | 211 |
| First linkage section | 212 |
| First coiling main body | 213 |
| First ground section | 214 |
| Second inductance coil | 22 |
| Second connection gasket | 221 |
| Second linkage section | 222 |
| Second coiling main body | 223 |
| Second conduction period | 224 |
| Third inductance coil | 23 |
| Third connection gasket | 231 |
| Third linkage section | 232 |
| Third coiling main body | 233 |
| Third conduction period | 234 |
| First layers of copper | 301 |
| First via hole | 31 |
| Second via hole | 32 |
| Third via hole | 33 |
| 4th via hole | 34 |
| First ground connection copper foil | 41 |
| Second ground connection copper foil | 42 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Circuit board provided by the invention and circuit board manufacturing method are described in detail With reference to embodiment.
Referring to Fig. 1, the circuit board 100 that embodiment of the present invention provides.The circuit board 100 includes substrate 10.It is described
Substrate 10 includes a first surface 12 and a second surface 14.The first surface 12 and the second surface 14 are located at institute
State the opposite two sides of substrate 10.The first surface is provided with inductance unit 20.
The inductance unit 20 includes the first inductance coil 21, the second inductance coil 22 and third inductance coil 23.This reality
Apply in mode, first inductance coil 21, the second inductance coil 22 and third inductance coil 23 the first surface 12 simultaneously
Row's setting.Wherein, first inductance coil 21 with second inductance coil 22 separately, second inductance coil 22 with
The third inductance coil 23 is electrically connected.
The circuit board 100 further includes the first via hole 31, the second via hole 32, third via hole 33, the first grounding copper
Foil 41 and the second ground connection copper foil 42.
First via hole 31 is located at 21 center of the first inductance coil.Second via hole 32 is located at described the
Two inductance coils, 22 center.The third via hole 33 is located at 23 center of third inductance coil.First via hole 31,
Second via hole 32 and the third via hole 33 run through the first surface 12 and the second surface 14.
The inductance unit 20 is in 1.79 millimeters * 4 millimeters of area.In present embodiment, the inductance unit 20
Inductance range are as follows: 49.21 ~ 49.67 nanohenrys.The D.C. resistance range of the inductance unit 20 are as follows: 0.273 ~ 0.386 ohm.
The quality factor range of the inductance unit are as follows: 47.36 ~ 55.23.The self-resonant frequency range of the inductance unit are as follows: 2 ~ 3,000
Megahertz.
First inductance coil 21 leads to first via hole 31 around first via hole 31 in from coil to coil.
In present embodiment, first inductance coil 21 includes the first connection gasket 211, the first linkage section 212, the first coiling main body
213 and first ground section 214.First connection gasket 211 is corresponding with first via hole 31, and is electrically connected to each other.It is described
First linkage section 212 is connected electrically between first connection gasket 211 and the first coiling main body 213.In present embodiment,
First linkage section 212 is vertically connected between first connection gasket 211 and the first coiling main body 213.Described
One ground section 214 is connected electrically in the end of the first coiling main body 213 far from first linkage section 212.Present embodiment
In, first ground section 214 is connect with the first coiling main body 213 far from the end vertical of first linkage section 212.
The first coiling main body 213 is centered on first connection gasket 211, and from first linkage section 212 around described the
First ground section 214 is led to outside one connection gasket, 211 from coil to coil.In present embodiment, 213 from coil to coils of the first coiling main body are big
It causes to surround in hollow.In present embodiment, the inner ring conducting wire of first connection gasket 211 and the first coiling main body 213
Vertical distance range be 0.05-0.4 millimeters.
Second inductance coil 22 leads to second via hole 32 around second via hole 32 in from coil to coil.
In present embodiment, second inductance coil 22 includes the second connection gasket 221, the second linkage section 222, the second coiling main body
223 and second conduction period 224.Second connection gasket 221 is corresponding with 211 form and dimension of the first connection gasket.It is described
Second linkage section 222 is connected electrically between second connection gasket 221 and the second coiling main body 223.In present embodiment,
Second linkage section 222 is vertically connected between second connection gasket 221 and the second coiling main body 223.Described
The extending direction of two linkage sections 222 and the extending direction of first linkage section 212 are perpendicular.Second conduction period, 224 electricity
It is connected to the end of the second coiling main body 223 far from second linkage section 222.
The third inductance coil 23 leads to the third via hole 33 around the third via hole 33 in from coil to coil.
In present embodiment, the third inductance coil 23 includes third connection gasket 231, third linkage section 232, third coiling main body
233 and third conduction period 234.The third connection gasket 231 and first connection gasket 211 and 221 shape of the second connection gasket
Shape and size are corresponding.The third linkage section 232 is connected electrically in the third connection gasket 231 and the third coiling main body
Between 233.In present embodiment, the third linkage section 232 be vertically connected on the third connection gasket 231 and the third around
Between line main body 233.The extending direction of the third linkage section 232 it is identical as the extending direction of first linkage section 212 and
In parallel.The third conduction period 234 is connected electrically in the end of the third coiling main body 233 far from the third linkage section 232.
In present embodiment, the third conduction period 234 is electrically connected with second conduction period 224, and the third conduction period 234 with
Second conduction period 224 is conllinear.
In present embodiment, the coil of the coil turn of the second coiling main body 223 and the third coiling main body 233
The number of turns is identical.The shape of the first coiling main body 213 and the second coiling main body 223 and the third coiling main body 233,
Size is roughly the same.
Referring to Figure 2 together, in present embodiment, the first ground connection copper foil 41 and the second ground connection equal position of copper foil 42
In the first surface 12, and it is located on the same floor.First inductance coil 21, second inductance coil 22 and described second
Inductance coil 22 is located between the first ground connection copper foil 41 and the second ground connection copper foil 42.In present embodiment, described
The extending direction of one ground connection copper foil 41 is grounded the extending direction of copper foil 42 on the contrary, first inductance coil 21 leans on described second
The nearly first ground connection copper foil 41.The third inductance coil 23 is close to the second ground connection copper foil 42.Second inductor wire
Circle 22 is between first inductance coil 21 and second inductance coil 22.The first of first inductance coil 21 connects
Location 214 and the first ground connection copper foil 41 are electrically connected.Second conduction period 224 of second inductance coil 22 and third electricity
The third conduction period 234 for feeling coil 23 is electrically connected.
The 4th via hole 34 is provided on the second ground connection copper foil 42.4th via hole 34 connects through described second
Ground copper foil 42 and the substrate 10.
Referring to Fig. 2, first via hole 31 is electrically connected on the second surface 14 with second via hole 32,
First inductance coil 21 is set to be connected in series with second inductance coil 22.The third via hole 33 and the 4th conducting
Hole 34 is electrically connected on the second surface 14, and the second ground connection copper foil 42 described in the third inductance coil 23 is made to be connected in series.
It is understood that first engagement pad can be set on the second surface 14 in other embodiments
141,142, third engagement pads 143 of second engagement pad and the 4th engagement pad 144.First engagement pad 141
It is electrically connected on first via hole 31, and with first connection gasket 211.Second engagement pad 142 is located at described
On second via hole 32, and it is electrically connected with second connection gasket 221.The third engagement pad 143 is located at third conducting
On hole 33, and it is electrically connected with second connection gasket 221.4th engagement pad 144 is located on the 4th via hole 34.Institute
It states the first engagement pad 141 to be electrically connected with second engagement pad 142, makes first inductance coil 21 and second inductor wire
Circle 22 is connected in series.The third engagement pad 143 is electrically connected with the 4th engagement pad 144, make the third inductance coil 23 with
The second ground connection copper foil 42 is connected in series.
It is understood that in other embodiments, the second coiling main body 223 and the third coiling main body 233
There can also be different coil turns.
It is understood that in other embodiments, first connection gasket 211, second connection gasket 221 and described
Third connection gasket 231 can save.
It after tested, can be by changing first ground section 214 relative to institute in the state of keeping other conditions constant
State the position of the first connection gasket 211, or by change the first coiling main body 213 or the second coiling main body 223 or third around
The coil turn of line main body 233, or by changing the first coiling main body 213 or the second coiling main body 223 or third coiling
The line width line-spacing of main body 233 realizes the fine tuning of each parameter to the inductance unit 20, the inductance unit 20 after fine tuning
Inductance range, D.C. resistance range, quality factor range and self-resonant frequency range still meet above-mentioned corresponding parameter area.
The present invention is due to making each inductance using three inductance coils of design series winding in certain area in the same plane
Spacing between winding wire and conducting wire becomes larger, and makes between the inductance coil inside conductor and conducting wire that capacitor is opposite to become smaller, thus
Make resonance frequency is opposite to become larger.In present embodiment, resonance frequency Frst, wherein Frsf≤3GHz.
Embodiment of the present invention also provides a kind of circuit board manufacturing method, includes the following steps.
The first step, referring to Fig. 4, formed in a substrate 10 with the conducting of the first layers of copper 301 of 10 side of substrate and
Through the first via hole 31 of the substrate 10, the second via hole 32, third via hole 33 and the 4th via hole 34.
First via hole 31, second via hole 32, the third via hole 33 and the 4th via hole 34
It can be obtained by way of drilling and filling perforation is electroplated.
Second step, referring to Fig. 1-3, selectivity removes part first layers of copper 301 and forms first inductance
Coil 21, second inductance coil 22, the third inductance coil 23, the first ground connection copper foil 41 and second ground connection
Copper foil 42；Make first via hole 31 and second via hole 32, described the by other any modes such as plating, article patches
In the second surface opposite with first layers of copper 301 of the substrate 10 between three via holes 33 and the 4th via hole 34
Electrical connection is realized on 14.
First inductance coil 21 passes through first via hole 31 and described second with second inductance coil 22
Via hole 32 realizes electrical connection.Second inductance coil 22 passes through on two coil end with the third inductance coil 23
Conducting wire realize electrical connection.First inductance coil 21 is grounded copper foil around first via hole 31, and from described first
First via hole 31 is led in 41 from coil to coils.Second inductance coil 22 is around second via hole 32 and from described the
Second via hole 32 is led in three inductance coils, 23 from coil to coil.The third inductance coil 23 is around the third via hole 33
And the third via hole 33 is led to from 22 from coil to coil of the second inductance coil.
In present embodiment, first inductance coil 21 include the first connection gasket 211, the first linkage section 212, first around
Line main body 213 and the first ground section 214.First connection gasket 211 is corresponding with first via hole 31, and is electrically connected.Institute
The first linkage section 212 is stated to be connected electrically between first connection gasket 211 and the first coiling main body 213.Present embodiment
In, first linkage section 212 is vertically connected between first connection gasket 211 and the first coiling main body 213.It is described
First ground section 214 is connected electrically in the end of the first coiling main body 213 far from first linkage section 212, and is connected to
Between the first coiling main body 213 and the first ground connection copper foil 41.In present embodiment, first ground section 214 with
The first coiling main body 213 is connected far from the end vertical of first linkage section 212.The first coiling main body 213 with
Centered on first connection gasket 211, and led in 211 from coil to coil of the first connection gasket from first ground section 214
First linkage section 212.In present embodiment, 213 from coil to coil of the first coiling main body is substantially surround in hollow.This implementation
In mode, the vertical distance range of first connection gasket 211 and the inner ring conducting wire of the first coiling main body 213 is 0.05-
0.4 millimeter.
In present embodiment, second inductance coil 22 include the second connection gasket 221, the second linkage section 222, second around
Line main body 223 and the second conduction period 224.Second connection gasket 221 is electrically connected with second via hole 32.Described second connects
Section 222 is connect to be connected electrically between second connection gasket 221 and the second coiling main body 223.In present embodiment, described
Two linkage sections 222 are vertically connected between second connection gasket 221 and the second coiling main body 223.Second connection
The extending direction of section 222 is opposite and parallel with the extending direction of first linkage section 212.Second conduction period 224 is electrically connected
It connects in the end of the second coiling main body 223 far from second linkage section 222, and is connected electrically in the second coiling main body
Between 223 and the second ground connection copper foil 42.In present embodiment, second conduction period 224 is vertically connected on described second
Between coiling main body 223 and the second ground connection copper foil 42.The second coiling main body 223 is with second connection gasket 221
Center, and second conduction period 224 is led to outside 221 from coil to coil of the second connection gasket from second linkage section 222.This
In embodiment, 223 from coil to coil of the second coiling main body is substantially surround in hollow.
The third inductance coil 23 includes a third connection gasket 231, third linkage section 232, third coiling main body 233
And third conduction period 234.The third connection gasket 231 is corresponding with the third via hole 33, and is electrically connected to each other.The third
Linkage section 232 is connected electrically between the third connection gasket 231 and the third coiling main body 233.It is described in present embodiment
Third linkage section 232 is vertically connected between the third connection gasket 231 and the third coiling main body 233.The third is led
Logical section 234 is connected electrically in the end of the second coiling main body 223 far from second linkage section 222.In present embodiment, institute
It states third conduction period 234 and is connect with the third coiling main body 233 far from the end vertical of the third linkage section 232.It is described
Third coiling main body 233 connects centered on the third connection gasket 231, and from the third linkage section 232 around the third
The third conduction period 234 is led to outside 231 from coil to coil of connection pad.The third conduction period 234 is electrically connected with second conduction period 224
It connects.In present embodiment, 233 from coil to coil of third coiling main body is substantially surround in hollow.
Referring to Fig. 3, the 4th via hole 34 setting is on the second ground connection copper foil 42.4th via hole 34
Run through and the second ground connection copper foil 42 and the substrate 10 is connected.The third inductance coil 23 passes through the third via hole
33 and the 4th via hole 34 and it is described second ground connection copper foil 42 be electrically connected.
In present embodiment, part first layers of copper 301 is selectively removed by image transfer and etching mode and is formed
First inductance coil 21, second inductance coil 22, the third inductance coil 23, it is described first ground connection copper foil 41 and
The second ground connection copper foil 42.
Compared to the prior art, circuit board and circuit board manufacturing method provided by the invention, directly integrate Inductive component
Into the circuit board, Inductive component is welded without piece, on the one hand, can be shortened processing procedure, be improved production efficiency；On the other hand,
Since the Inductive component is directly incorporated into the circuit board in the form of inductance coil, without tin cream welding, can subtract
The noise of few final products.In addition, the Inductive component is integrated into the circuit board, the ruler of final products can also be reduced
It is very little, increase resonance frequency.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (10)
1. a kind of circuit board, including substrate, the substrate includes the first surface and second surface being disposed opposite to each other, first table
Face is provided with inductance unit, and the inductance unit includes the first inductance coil, the second inductance coil and third inductance coil, described
First inductance coil center is equipped with the first via hole, and second inductance coil center is equipped with the second via hole, the third electricity
Feel coil center and be equipped with third via hole, first inductance coil is led to described around first via hole in from coil to coil
First via hole, second inductance coil leads to second via hole around second via hole in from coil to coil, described
Third inductance coil leads to the third via hole around the third via hole in from coil to coil, first inductance coil exists
On the first surface separately with second inductance coil, second inductance coil on the first surface with it is described
The electrical connection of third inductance coil, first via hole, second via hole and third via hole run through first table
Face and the second surface, first via hole are electrically connected to each other on the second surface with second via hole.
2. circuit board as described in claim 1, which is characterized in that the circuit board further includes that the first ground connection copper foil and second connect
Ground copper foil, the first ground connection copper foil and the second ground connection copper foil are respectively positioned on the first surface；The first ground connection copper foil
It is electrically connected with first inductance coil；The second ground connection copper foil includes the 4th via hole, and the 4th via hole runs through institute
The second ground connection copper foil and the substrate are stated, and is electrically connected on the second surface with the third via hole, to be electrically connected
The second ground connection copper foil and the third inductance coil.
3. circuit board as claimed in claim 2, which is characterized in that first inductance coil includes the first connection gasket, first
Linkage section, the first coiling main body and the first ground section, first connection gasket are connect with first via hole, and described first connects
It connects section to be connected between first connection gasket and the first coiling main body, first ground section is located at the coiling main body
End far from first linkage section, and be connected between the first coiling main body and the first ground connection copper foil, it is described
First coiling main body is drawn outside the first connection gasket from coil to coil centered on first connection gasket, from first linkage section
To first ground section, first ground section is electrically connected with the first ground connection copper foil.
4. circuit board as claimed in claim 3, which is characterized in that second inductance coil includes the second connection gasket, second
Linkage section, the second coiling main body and the second conduction period, second connection gasket are connect with second via hole, and described second connects
It connects section to be connected between second connection gasket and the second coiling main body, second conduction period is located at second coiling
End of the main body far from second linkage section, the second coiling main body is centered on second connection gasket, from described
Two linkage sections lead to second conduction period outside the second connection gasket from coil to coil, and second conduction period is connected electrically in described
Between second coiling main body and the second ground connection copper foil.
5. circuit board as claimed in claim 4, which is characterized in that the third inductance coil includes third connection gasket, third
Linkage section, third coiling main body and third conduction period, the third connection gasket are connect with the third via hole, and the third connects
It connects section to be connected between the third connection gasket and the third coiling main body, the third conduction period is located at the third coiling
End of the main body far from the third linkage section, the third coiling main body is centered on the third connection gasket, from described
Three linkage sections lead to the third conduction period outside the second connection gasket from coil to coil, and the third conduction period is led with described second
Logical section electrical connection.
6. circuit board as claimed in claim 5, which is characterized in that the first coiling main body, the second coiling main body and
The width of the third coiling main body inside conductor is all the same, the first coiling main body, the second coiling main body and described
The distance between adjacent wires are all the same in three coiling main bodys.
7. circuit board as claimed in claim 6, which is characterized in that the first coiling main body, the second coiling main body and
The width of the inner ring conducting wire of the third coiling main body is respectively less than the distance between its any two adjacent wires.
8. circuit board as claimed in claim 5, which is characterized in that the second coiling main body and the third coiling main body have
There is identical coil turn.
9. a kind of circuit board manufacturing method, comprising steps of
The first via hole, the second via hole and third via hole, first via hole, the second conducting are formed in a substrate
Hole, third via hole are connected with the first layers of copper of the substrate side；
Selective etch removes part first layers of copper, is connected to first via hole and described in the other side of the substrate
Second via hole, to obtain circuit board as described in claim 1.
10. circuit board manufacturing method as claimed in claim 9, it is characterised in that: led in formation first via hole, second
When through-hole, third via hole, the 4th via hole, the 4th via hole and first layers of copper are also formed in the substrate
Conducting；While being connected to first via hole and second via hole, also it is connected in the other side of the substrate
The third via hole and the 4th via hole, to obtain such as the described in any item circuit boards of claim 2-8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610059255.4A CN107343357B (en) | 2016-01-28 | 2016-01-28 | Circuit board and circuit board manufacturing method |
| TW105108172A TW201733417A (en) | 2016-01-28 | 2016-03-16 | Printed circuit board and method manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610059255.4A CN107343357B (en) | 2016-01-28 | 2016-01-28 | Circuit board and circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107343357A CN107343357A (en) | 2017-11-10 |
| CN107343357B true CN107343357B (en) | 2019-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610059255.4A Active CN107343357B (en) | 2016-01-28 | 2016-01-28 | Circuit board and circuit board manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107343357B (en) |
| TW (1) | TW201733417A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102081089B1 (en) | 2018-08-10 | 2020-02-25 | 삼성전자주식회사 | Semiconductor package |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7688160B2 (en) * | 2007-04-12 | 2010-03-30 | Stats Chippac, Ltd. | Compact coils for high performance filters |
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| GB9702010D0 (en) * | 1997-01-31 | 1997-03-19 | Nokia Mobile Phones Ltd | A PCB having an inductor and a method of manufacturing the same |
| US6996892B1 (en) * | 2005-03-24 | 2006-02-14 | Rf Micro Devices, Inc. | Circuit board embedded inductor |
| CN105163489A (en) * | 2015-06-18 | 2015-12-16 | 旭利电子股份有限公司 | Induction coil assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107343357A (en) | 2017-11-10 |
| TW201733417A (en) | 2017-09-16 |
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