TW201724566A - Light emitting diode package structure - Google Patents
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本發明係關於一種發光二極體封裝結構,特別是一種具非對稱光型的發光二極體封裝結構。The invention relates to a light emitting diode package structure, in particular to a light emitting diode package structure with an asymmetric light type.
發光二極體(Light Emitting Diode,LED)由於具有高亮度、反應速度快、體積小、污染低、高可靠度、適合量產等優點,因此發光二極體在照明領域或是消費性電子產品的開發應用亦將越來越多,目前已將發光二極體廣泛地應用在大型看板、交通號誌燈、手機、掃描器、傳真機之光源以及照明裝置等。基於上述可知,發光二極體的發光效率以及亮度需求將會越來越受到重視,是故高亮度發光二極體的研究開發將是固態照明應用上的重要課題。Light Emitting Diode (LED) has high brightness, fast response, small size, low pollution, high reliability, and suitable for mass production. Therefore, LEDs are used in lighting or consumer electronics. The development and application will also be more and more. At present, LEDs have been widely used in large billboards, traffic lights, mobile phones, scanners, fax machine light sources and lighting devices. Based on the above, the luminous efficiency and brightness requirements of the light-emitting diodes will be more and more important. Therefore, the research and development of high-brightness light-emitting diodes will be an important issue in solid-state lighting applications.
此外,以車燈為例,由於車燈除了需符合亮度的規範外,也需符合投射角度的規範,以確保行車人員的行車安全。然而,目前的作法皆是在反射燈杯上作非對稱的設計。當發光二極體搭配非對稱設計之反射燈杯時,則可透過反射燈杯之導引而產生非對稱光型。也就是說,透過非對稱設計之反射燈杯來使車燈之投射角度與亮度符合車輛規範。但目前的作法除了因需採用特製的反射燈杯而導致成本增加外,更易受反射燈杯與發光二極體間之組裝誤差的影響而連帶造成車燈之光型調整的不便,此外過多的一次、二次光學的設計也將造成不必要的光效率損失。In addition, taking the lamp as an example, in addition to the specification of the brightness, the lamp must also meet the specification of the projection angle to ensure the driving safety of the driver. However, the current practice is to make an asymmetric design on the reflector lamp cup. When the light-emitting diode is matched with the asymmetrically designed reflector lamp cup, the asymmetric light pattern can be generated by the guide of the reflector lamp cup. That is to say, through the asymmetric design of the reflector lamp cup, the projection angle and brightness of the lamp are in compliance with the vehicle specifications. However, in addition to the cost increase due to the need to use a special reflector lamp cup, the current practice is more susceptible to the assembly error between the reflector lamp cup and the light-emitting diode, which in turn causes inconvenience in light-type adjustment of the lamp, and excessive The primary and secondary optics design will also cause unnecessary loss of light efficiency.
本發明在於提供一種發光二極體封裝結構,藉以解決發光二極體因需搭配特製的反射燈杯而導致成本增加的問題,與因反射燈杯與發光二極體間仍存在有組裝誤差而連帶造成車燈之光型調整不便的問題。The invention provides a light-emitting diode package structure, thereby solving the problem that the cost of the light-emitting diode is increased by the need of a special reflector lamp cup, and there is still an assembly error between the reflector lamp cup and the light-emitting diode. Along with the problem of inconvenient adjustment of the light type of the lamp.
本發明之一實施例所發光二極體封裝結構,包含凹槽及發光元件。凹槽由一底部與至少一邊牆所形成。底部具有一內表面。邊牆凸出於內表面。發光元件設置於底部之內表面上。底部相對之兩側位置為一非對稱結構。A light emitting diode package structure according to an embodiment of the present invention includes a groove and a light emitting element. The groove is formed by a bottom and at least one side wall. The bottom has an inner surface. The side wall protrudes from the inner surface. The light emitting element is disposed on the inner surface of the bottom. The opposite sides of the bottom are in an asymmetrical structure.
根據上述實施例之發光二極體封裝結構,透過光反射表面之相對兩側部或相鄰兩側部相對於發光元件為非對稱配置,使得發光二極體封裝結構本身即可提供非對稱之光型,故本實施例之發光二極體封裝結構能避免搭配特製之反射燈杯,僅需搭配一般的反射燈杯,進而降低具有本實施例之發光二極體封裝結構之發光二極體燈具的成本。According to the LED package structure of the above embodiment, the opposite side portions or adjacent side portions of the transmitted light reflecting surface are asymmetrically arranged with respect to the light emitting element, so that the LED package structure itself can provide an asymmetrical The light-emitting diode package structure of the present embodiment can avoid the use of a special reflector lamp cup, and only needs to be matched with a general reflector lamp cup, thereby reducing the light-emitting diode body having the light-emitting diode package structure of the embodiment. The cost of the luminaire.
此外,由於單靠發光二極體封裝結構本身即可提供非對稱之光型,不需要額外加入一次或二次光學,故能夠將發光二極體封裝結構與相關反射杯與透鏡間之組裝誤差的影響以及在效率上的損耗降至最低。藉此,讓具有本實施例之發光二極體封裝結構之發光二極體燈具所產生之光型更容易符合所需之規格。In addition, since the light-emitting diode package structure itself can provide an asymmetric light type, and no additional primary or secondary optics is required, the assembly error between the light-emitting diode package structure and the related reflector cup and the lens can be eliminated. The impact and loss of efficiency are minimized. Thereby, the light pattern produced by the light-emitting diode lamp having the light-emitting diode package structure of the present embodiment is more easily conformed to the required specifications.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the principles of the invention, and to provide a further explanation of the scope of the invention.
請參閱圖1至圖3。圖1為根據本發明第一實施例所述之發光二極體封裝結構的上視示意圖。圖2為沿圖1之A-A割面線所繪示的剖面示意圖。圖3為沿圖1之B-B割面線所繪示的剖面示意圖。Please refer to Figure 1 to Figure 3. 1 is a top plan view of a light emitting diode package structure according to a first embodiment of the present invention. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1. 3 is a schematic cross-sectional view taken along line B-B of FIG. 1.
如圖1所示,本實施例之發光二極體封裝結構10包含一凹槽100、一發光元件200、及一封裝膠300。As shown in FIG. 1 , the LED package structure 10 of the present embodiment includes a recess 100 , a light emitting component 200 , and an encapsulant 300 .
如圖2與圖3所示,凹槽100包含一底部110、一第一邊牆120、一第二邊牆130、一第三邊牆140及一第四邊牆150。底部110具有相對的一內表面111及一內表面112。第一邊牆120、第二邊牆130、第三邊牆140及第四邊牆150分別位於底部110之各側。各邊牆120、130、140、150皆凸出於底部110之內表面111,且相鄰之邊牆相連而令第一邊牆120、第二邊牆130、第三邊牆140及第四邊牆150共構成一環狀邊牆(如圖1所示)。底部110相對之兩側位置為一非對稱結構。舉例來說,底部110相對兩側上之第一邊牆120與第二邊牆130為非對稱結構(如圖2所示)。詳細描述容後一併說明。As shown in FIG. 2 and FIG. 3 , the groove 100 includes a bottom portion 110 , a first side wall 120 , a second side wall 130 , a third side wall 140 , and a fourth side wall 150 . The bottom portion 110 has an opposite inner surface 111 and an inner surface 112. The first side wall 120, the second side wall 130, the third side wall 140, and the fourth side wall 150 are respectively located on each side of the bottom portion 110. Each of the side walls 120, 130, 140, 150 protrudes from the inner surface 111 of the bottom portion 110, and the adjacent side walls are connected to make the first side wall 120, the second side wall 130, the third side wall 140 and the fourth side The side walls 150 collectively form an annular side wall (as shown in Figure 1). The opposite sides of the bottom portion 110 are in an asymmetrical structure. For example, the first side wall 120 and the second side wall 130 on opposite sides of the bottom portion 110 have an asymmetrical structure (as shown in FIG. 2). A detailed description will be given later.
此外,第一邊牆120具有一第一反射面121。第二邊牆130具有一第二反射面131。第三邊牆140具有一第三反射面141。第四邊牆150具有一第四反射面151。各反射面121、131、141、151的形式容後一併說明。In addition, the first side wall 120 has a first reflecting surface 121. The second side wall 130 has a second reflecting surface 131. The third side wall 140 has a third reflecting surface 141. The fourth side wall 150 has a fourth reflecting surface 151. The form of each of the reflecting surfaces 121, 131, 141, and 151 will be described later.
發光元件200設置於底部110之內表面111,且發光元件200位於內表面111相對於外表面112之中心點C1的位置,且第一反射面121、第二反射面131、第三反射面141及第四反射面151將發光元件200圍繞於內。發光元件200於遠離底部110之一側具有一出光面210。在本實施例中,發光元件200是位於內表面111相對於外表面112之中心點C1的位置,而不是位於內表面111之中心點C,但並不以此為限,在其他實施例中,發光元件200也可以是位於內表面111之中心點C。The light emitting element 200 is disposed on the inner surface 111 of the bottom portion 110, and the light emitting element 200 is located at a position of the inner surface 111 with respect to the center point C1 of the outer surface 112, and the first reflecting surface 121, the second reflecting surface 131, and the third reflecting surface 141 And the fourth reflecting surface 151 surrounds the light emitting element 200. The light emitting element 200 has a light emitting surface 210 on a side away from the bottom portion 110. In the present embodiment, the light-emitting element 200 is located at a position C1 of the inner surface 111 with respect to the center point C1 of the outer surface 112, and is not located at the center point C of the inner surface 111, but is not limited thereto. In other embodiments, The light emitting element 200 may also be located at a center point C of the inner surface 111.
封裝膠300疊設於凹槽100,並覆蓋發光元件200。封裝膠300摻雜有至少一種螢光材料。The encapsulant 300 is stacked on the recess 100 and covers the light emitting element 200. The encapsulant 300 is doped with at least one phosphor material.
請繼續參閱圖2。在本實施例中,第一反射面121為曲面,且第一反射面121凸出內表面111一第一高度H1。第二反射面131為直立面,且第二反射面131凸出內表面111一第二高度H2。第一高度H1等於第二高度H2。但由於第一反射面121與第二反射面131分別為曲面與直立面,故使得底部110相對之兩側位置的第一反射面121與第二反射面131為非對稱結構。Please continue to see Figure 2. In this embodiment, the first reflective surface 121 is a curved surface, and the first reflective surface 121 protrudes from the inner surface 111 by a first height H1. The second reflecting surface 131 is an upright surface, and the second reflecting surface 131 protrudes from the inner surface 111 by a second height H2. The first height H1 is equal to the second height H2. However, since the first reflecting surface 121 and the second reflecting surface 131 are respectively a curved surface and an upright surface, the first reflecting surface 121 and the second reflecting surface 131 at the opposite sides of the bottom portion 110 have an asymmetrical structure.
請參閱圖3所示,在本實施例中,第三反射面141為曲面,且第三反射面141凸出內表面111一第三高度H3。第四反射面151為直立面,且第四反射面151凸出內表面111一第四高度H4。第三高度H3等於第四高度H4。由於第三反射面141與第四反射面151分別為曲面與直立面,故使得底部110相對之兩側位置的第三反射面141與第四反射面151為非對稱結構。Referring to FIG. 3, in the embodiment, the third reflecting surface 141 is a curved surface, and the third reflecting surface 141 protrudes from the inner surface 111 by a third height H3. The fourth reflecting surface 151 is an upright surface, and the fourth reflecting surface 151 protrudes from the inner surface 111 by a fourth height H4. The third height H3 is equal to the fourth height H4. Since the third reflecting surface 141 and the fourth reflecting surface 151 are respectively a curved surface and an upright surface, the third reflecting surface 141 and the fourth reflecting surface 151 at the opposite sides of the bottom portion 110 have an asymmetrical structure.
值得注意的是,在本實施例中,第一反射面121與第二反射面131以及第三反射面141與第四反射面151皆為非對稱結構,但並不以此為限,在其他實施例中,也可僅第一反射面121與第二反射面131為非對稱結構或是僅第三反射面141與第四反射面151為非對稱結構。It should be noted that, in this embodiment, the first reflective surface 121 and the second reflective surface 131, and the third reflective surface 141 and the fourth reflective surface 151 are both asymmetric structures, but not limited thereto. In the embodiment, only the first reflective surface 121 and the second reflective surface 131 may have an asymmetrical structure or only the third reflective surface 141 and the fourth reflective surface 151 may have an asymmetrical structure.
請參閱圖1至圖3。在本實施例中,第一反射面121與第三反射面141皆為曲面,且曲面之曲率相同,但因第一反射面121與發光元件200所保持的一第一距離D1相異於第三反射面141與發光元件200所保持的一第三距離D3,故相對於通過發光元件200之中心點C2的一平面S1來說,相鄰的第一反射面121與第三反射面141為非對稱結構。Please refer to Figure 1 to Figure 3. In this embodiment, the first reflective surface 121 and the third reflective surface 141 are both curved surfaces, and the curvature of the curved surface is the same, but the first reflective surface 121 is different from the first distance D1 held by the light-emitting element 200. The third reflecting surface 141 and the third distance D3 held by the light emitting element 200, so that the adjacent first reflecting surface 121 and third reflecting surface 141 are opposite to a plane S1 passing through the center point C2 of the light emitting element 200 Asymmetrical structure.
因第二反射面131與第三反射面141為相異形式之表面(即直立面與曲面),且第二反射面131與發光元件200所保持的一第二距離D2相異於第三反射面141與發光元件200所保持的一第三距離D3,故相對於通過發光元件200之中心點C2的平面S2來說,相鄰的第二反射面131與第三反射面141為非對稱結構。Since the second reflective surface 131 and the third reflective surface 141 are surfaces of different forms (ie, an upright surface and a curved surface), and the second reflective surface 131 and the second distance D2 held by the light emitting element 200 are different from the third reflection The surface 141 is at a third distance D3 maintained by the light-emitting element 200. Therefore, the adjacent second reflective surface 131 and the third reflective surface 141 are asymmetric with respect to the plane S2 passing through the center point C2 of the light-emitting element 200. .
因第一反射面121與第四反射面151為相異形式之表面(即曲面與直立面),且第一反射面121與發光元件200所保持的一第一距離D1相異於第四反射面151與發光元件200所保持的一第四距離D4,故相對於通過發光元件200之中心點C2的平面S2來說,相鄰的第一反射面121與第四反射面151為非對稱結構。Since the first reflective surface 121 and the fourth reflective surface 151 are surfaces of different forms (ie, a curved surface and an upright surface), and the first reflective surface 121 and the first distance D1 held by the light emitting element 200 are different from the fourth reflection The surface 151 is at a fourth distance D4 maintained by the light-emitting element 200. Therefore, the adjacent first reflective surface 121 and fourth reflective surface 151 are asymmetric with respect to the plane S2 passing through the center point C2 of the light-emitting element 200. .
因第二反射面131與發光元件200所保持的一第二距離D2相異於第四反射面151與發光元件200所保持的一第四距離D4,故相對於通過發光元件200之中心點C2的平面S1來說,相鄰的第二反射面131與第四反射面151為非對稱配置結構。Since the second reflecting surface 131 and the second distance D2 held by the light emitting element 200 are different from the fourth reflecting surface 151 and a fourth distance D4 held by the light emitting element 200, the center point C2 of the light emitting element 200 is passed. For the plane S1, the adjacent second reflecting surface 131 and fourth reflecting surface 151 have an asymmetric arrangement.
值得注意的是,在本實施例中,發光二極體封裝結構10之任一組相鄰之反射面相對於發光元件200皆為非對稱結構,但並不以此為限,在其他實施例中,也可以是發光二極體封裝結構10之其中一組或兩組相鄰之反射面對對於發光元件200為非對稱結構。It is to be noted that, in this embodiment, the adjacent reflective surfaces of the LED assembly 10 are asymmetric with respect to the illuminating element 200, but are not limited thereto. In other embodiments, One or two sets of adjacent reflective faces of the light emitting diode package structure 10 may also have an asymmetrical structure for the light emitting element 200.
此外,在本實施例中,第一反射面121、第二反射面131、第三反射面141及第四反射面151的形式僅為舉例說明,並不以此為限,在其他實施例中,第一反射面、第二反射面、第三反射面及第四反射面皆為選自由曲面、傾斜面及直立面所組成之群組。舉例來說,第一反射面可以為曲面與直立面之組合,或是直立面與傾斜面之組合。In addition, in the embodiment, the forms of the first reflective surface 121, the second reflective surface 131, the third reflective surface 141, and the fourth reflective surface 151 are merely illustrative, and are not limited thereto. In other embodiments, The first reflecting surface, the second reflecting surface, the third reflecting surface and the fourth reflecting surface are all selected from the group consisting of a curved surface, an inclined surface and an upright surface. For example, the first reflecting surface may be a combination of a curved surface and an upright surface, or a combination of an upright surface and an inclined surface.
請參閱圖4。圖4為圖1之發光二極體封裝結構之光型示意圖。透過上述凹槽100為非對稱結構。使得發光二極體封裝結構10之光型從傳統之對稱形式(如虛線所示)轉變成非對稱形式(如實線所示)。從前述光型示意圖可知,由於單靠發光二極體封裝結構10本身即可提供非對稱之光型,故本實施例之發光二極體封裝結構10能避免搭配特製之反射燈杯,僅需搭配一般的反射燈杯,進而降低具有本實施例之發光二極體封裝結構10之發光二極體燈具(未繪示)的成本。Please refer to Figure 4. 4 is a schematic view showing the light pattern of the light emitting diode package structure of FIG. 1. The groove 100 is an asymmetrical structure. The light pattern of the LED package structure 10 is converted from a conventional symmetrical form (as indicated by the dashed line) to an asymmetrical form (as indicated by the solid line). It can be seen from the above-mentioned light pattern that the light-emitting diode package structure 10 of the present embodiment can be used to provide a non-symmetrical light type. Therefore, the light-emitting diode package structure 10 of the present embodiment can avoid the special reflective light cup. The cost of the light-emitting diode lamp (not shown) having the light-emitting diode package structure 10 of the embodiment is reduced by using a common reflector lamp cup.
此外,由於單靠發光二極體封裝結構10本身即可提供非對稱之光型,故能夠將發光二極體封裝結構10與反射燈杯(未繪示)間之組裝誤差的影響降至最低。藉此,讓具有本實施例之發光二極體封裝結構10之發光二極體燈具所產生之光型更容易符合所需之規格。In addition, since the light-emitting diode package 10 itself can provide an asymmetric light type, the influence of assembly error between the light-emitting diode package structure 10 and the reflector cup (not shown) can be minimized. . Thereby, the light pattern produced by the light-emitting diode lamp having the light-emitting diode package structure 10 of the present embodiment is more easily conformed to the required specifications.
在上述實施例中,第一邊牆120之第一反射面121為曲面,以及第二邊牆130之第二反射面131為直立面,使得第一反射面121與第二反射面131相對於發光元件200為非對稱配置,但並不以此為限。請參閱圖5。圖5為根據本發明第二實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖5之剖切位置與圖2之剖切位置相同。In the above embodiment, the first reflective surface 121 of the first sidewall 120 is a curved surface, and the second reflective surface 131 of the second sidewall 130 is an upright surface such that the first reflective surface 121 and the second reflective surface 131 are opposite to each other. The light-emitting element 200 is asymmetrically arranged, but is not limited thereto. Please refer to Figure 5. FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention. Here, the cutting position of FIG. 5 is the same as the cutting position of FIG. 2.
在本實施例之發光二極體封裝結構10a中,第一邊牆120a與第二邊牆130a位於底部110之相對兩側,並凸出於底部110之內表面111。第一邊牆120a之第一反射面121a遮蓋發光元件200之至少部分發光面210,以及第二邊牆130a之第二反射面131a為直立面,使得底部110相對之兩側位置的第一反射面121a與第二反射面131a相對於發光元件200為非對稱配置。In the LED package structure 10a of the present embodiment, the first sidewall 120a and the second sidewall 130a are located on opposite sides of the bottom portion 110 and protrude from the inner surface 111 of the bottom portion 110. The first reflecting surface 121a of the first side wall 120a covers at least a part of the light emitting surface 210 of the light emitting element 200, and the second reflecting surface 131a of the second side wall 130a is an upright surface, so that the first reflection of the bottom side 110 opposite to the two sides The surface 121a and the second reflection surface 131a are arranged asymmetrically with respect to the light-emitting element 200.
請參閱圖6。圖6為根據本發明第三實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖6之剖切位置與圖2之剖切位置相同。Please refer to Figure 6. FIG. 6 is a cross-sectional view showing a light emitting diode package structure according to a third embodiment of the present invention. Here, the cutting position of FIG. 6 is the same as the cutting position of FIG. 2.
在本實施例之發光二極體封裝結構10b中,第一邊牆120b與第二邊牆130b位於底部110之相對兩側,並凸出於底部110之內表面111。第一邊牆120b之第一反射面121b凸出底部110之內表面111的一第一高度H1小於第二邊牆130b之第二反射面131b凸出底部110之內表面111的一第二高度H2,使得底部110相對之兩側位置的第一反射面121a與第二反射面131a相對於發光元件200為非對稱配置。In the LED package structure 10b of the present embodiment, the first sidewall 120b and the second sidewall 130b are located on opposite sides of the bottom portion 110 and protrude from the inner surface 111 of the bottom portion 110. A first height H1 of the first reflective surface 121b of the first side wall 120b protruding from the inner surface 111 of the bottom portion 110 is smaller than a second height of the inner surface 111 of the bottom portion 110 of the second reflective surface 131b of the second side wall 130b. H2 is such that the first reflecting surface 121a and the second reflecting surface 131a at the opposite sides of the bottom portion 110 are asymmetrically arranged with respect to the light emitting element 200.
請參閱圖7。圖7為根據本發明第四實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖7之剖切位置與圖2之剖切位置相同。Please refer to Figure 7. FIG. 7 is a cross-sectional view showing a light emitting diode package structure according to a fourth embodiment of the present invention. Here, the cutting position of FIG. 7 is the same as the cutting position of FIG. 2.
在本實施例之發光二極體封裝結構10c中,第一邊牆120c與第二邊牆130c位於底部110之相對兩側,並凸出於底部110之內表面111。第一邊牆120c之第一反射面121c與第二邊牆130c之第二反射面131c皆為斜面。第一反射面121c與內表面111保持的一第一夾角θ1,以及第二反射面130c與內表面111保持一第二夾角θ2,且第一夾角θ1小於第二夾角θ2。藉此,使得底部110相對之兩側位置的第一反射面121c與第二反射面131c相對於發光元件200為非對稱配置。In the LED package 10c of the present embodiment, the first sidewall 120c and the second sidewall 130c are located on opposite sides of the bottom portion 110 and protrude from the inner surface 111 of the bottom portion 110. The first reflecting surface 121c of the first side wall 120c and the second reflecting surface 131c of the second side wall 130c are both inclined surfaces. A first angle θ1 of the first reflecting surface 121c and the inner surface 111 are maintained, and the second reflecting surface 130c and the inner surface 111 maintain a second angle θ2, and the first angle θ1 is smaller than the second angle θ2. Thereby, the first reflecting surface 121c and the second reflecting surface 131c at the opposite sides of the bottom portion 110 are arranged asymmetrically with respect to the light emitting element 200.
請參閱圖8。圖8為根據本發明第五實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖8之剖切位置與圖2之剖切位置相同。Please refer to Figure 8. FIG. 8 is a cross-sectional view showing a light emitting diode package structure according to a fifth embodiment of the present invention. Here, the cutting position of FIG. 8 is the same as the cutting position of FIG. 2.
在本實施例之發光二極體封裝結構10d中,第一邊牆120d與第二邊牆130d位於底部110之相對兩側,並凸出於底部110之內表面111。第一邊牆120d之第一反射面121d與第二邊牆130d之第二反射面131d皆為曲面,且第一反射面121d之曲率異於第二反射面131d之曲率。藉此,使得底部110相對之兩側位置的第一反射面121d與第二反射面131d相對於發光元件200為非對稱配置。In the LED package 10d of the present embodiment, the first sidewall 120d and the second sidewall 130d are located on opposite sides of the bottom portion 110 and protrude from the inner surface 111 of the bottom portion 110. The first reflecting surface 121d of the first side wall 120d and the second reflecting surface 131d of the second side wall 130d are both curved surfaces, and the curvature of the first reflecting surface 121d is different from the curvature of the second reflecting surface 131d. Thereby, the first reflecting surface 121d and the second reflecting surface 131d at the opposite sides of the bottom portion 110 are arranged asymmetrically with respect to the light emitting element 200.
請參閱圖9。圖9為根據本發明第六實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖9之剖切位置與圖2之剖切位置相同。Please refer to Figure 9. FIG. 9 is a cross-sectional view showing a light emitting diode package structure according to a sixth embodiment of the present invention. Here, the cutting position of Fig. 9 is the same as the cutting position of Fig. 2.
在本實施例之發光二極體封裝結構10e中,第一邊牆120e位於底部110之其中一側,並凸出於底部110之內表面111。也就是說,僅底部110之單側具有邊牆。第一邊牆120e之第一反射面121e為曲面,使得底部110相對之兩側位置為非對稱配置,即位於底部110一側之第一反射面121e與底部110相對一側之上方空間相對於發光元件200為非對稱配置。In the LED package structure 10e of the present embodiment, the first sidewall 120e is located on one side of the bottom portion 110 and protrudes from the inner surface 111 of the bottom portion 110. That is, only one side of the bottom 110 has a side wall. The first reflective surface 121e of the first side wall 120e is a curved surface such that the positions of the bottom portion 110 opposite to each other are asymmetrically arranged, that is, the space above the opposite side of the first reflecting surface 121e and the bottom portion 110 on the side of the bottom portion 110 is opposite to The light emitting element 200 is in an asymmetric configuration.
請參閱圖10。圖10為根據本發明第七實施例所述之發光二極體封裝結構的剖面示意圖。其中,圖10之剖切位置與圖2之剖切位置相同。Please refer to Figure 10. FIG. 10 is a cross-sectional view showing a light emitting diode package structure according to a seventh embodiment of the present invention. Here, the cutting position of FIG. 10 is the same as the cutting position of FIG.
在本實施例之發光二極體封裝結構10f中,第一邊牆120f位於底部110之其中一側,並凸出於底部110之內表面111。也就是說,僅底部110之單側具有邊牆。第一邊牆120f之第一反射面121f遮蓋發光元件200之至少部分發光面210。藉此,使得底部110相對之兩側位置為非對稱配置,即位於底部110一側之第一反射面121f與底部110相對一側之上方空間相對於發光元件200為非對稱配置。In the LED package structure 10f of the present embodiment, the first sidewall 120f is located on one side of the bottom portion 110 and protrudes from the inner surface 111 of the bottom portion 110. That is, only one side of the bottom 110 has a side wall. The first reflective surface 121f of the first side wall 120f covers at least a portion of the light emitting surface 210 of the light emitting element 200. Thereby, the positions of the opposite sides of the bottom portion 110 are asymmetrically arranged, that is, the space above the first reflecting surface 121f on the side of the bottom portion 110 and the side opposite to the bottom portion 110 is asymmetrically arranged with respect to the light emitting element 200.
值得注意的是,上述圖5至圖10之實施例是以發光元件之相對兩側之反射面為非對稱配置來進行說明。但並不以此為限,在其他實施例中,圖5至圖10之概念也可以套用於發光元件之相鄰兩側之反射面。It should be noted that the above embodiments of FIGS. 5 to 10 are described in which the reflecting surfaces on opposite sides of the light-emitting element are arranged asymmetrically. However, it is not limited thereto. In other embodiments, the concepts of FIGS. 5 to 10 can also be applied to the reflective surfaces of adjacent sides of the light-emitting element.
根據上述實施例之發光二極體封裝結構,透過凹槽相對於發光元件為非對稱配置,使得發光二極體封裝結構本身即可提供非對稱之光型,故本實施例之發光二極體封裝結構能避免搭配特製之反射燈杯,僅需搭配一般的反射燈杯,進而降低具有本實施例之發光二極體封裝結構之發光二極體燈具的成本。According to the LED package structure of the above embodiment, the through-groove is asymmetrically arranged with respect to the light-emitting element, so that the LED package structure itself can provide an asymmetric light type, so the light-emitting diode of the embodiment The package structure can avoid the special reflector lamp cup, and only needs to be matched with a general reflector lamp cup, thereby reducing the cost of the LED package having the LED package structure of the embodiment.
此外,由於單靠發光二極體封裝結構本身即可提供非對稱之光型,故能夠將發光二極體封裝結構與反射燈杯間之組裝誤差的影響降至最低。藉此,讓具有本實施例之發光二極體封裝結構之發光二極體燈具所產生之光型更容易符合所需之規格。In addition, since the light-emitting diode package structure itself can provide an asymmetric light type, the influence of the assembly error between the light-emitting diode package structure and the reflector lamp cup can be minimized. Thereby, the light pattern produced by the light-emitting diode lamp having the light-emitting diode package structure of the present embodiment is more easily conformed to the required specifications.
再者,反射面之部分遮蓋發光元件之至少部分出光面,使得發光二極體封裝結構可更容易地在出光量需求低的位置減少出光量,以及在出光量需求高的位置增加出光量,進而更容易地讓發光二極體封裝結構之光型符合所需之規範。Furthermore, the portion of the reflective surface covers at least a portion of the light-emitting surface of the light-emitting element, so that the light-emitting diode package structure can more easily reduce the amount of light emitted at a position where the amount of light output is low, and increase the amount of light at a position where the amount of light output is high. It is thus easier to conform the light pattern of the LED package structure to the required specifications.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
10、10a、10b、10c、10d、10e、10f‧‧‧發光二極體封裝結構
100‧‧‧凹槽
110‧‧‧底部
111‧‧‧內表面
112‧‧‧外表面
120、120a、120b、120c、120d、120e、120f‧‧‧第一邊牆
121、121a、121b、121c、121d、121e、121f‧‧‧第一反射面
130、130a、130b、130c、130d‧‧‧第二邊牆
131、131a、131b、131c、131d‧‧‧第二反射面
140‧‧‧第三邊牆
141‧‧‧第三反射面
150‧‧‧第四邊牆
151‧‧‧第四反射面
200‧‧‧發光元件
210‧‧‧出光面
300‧‧‧封裝膠
C1、C2‧‧‧中心點
H1~H4‧‧‧高度
D1~D4‧‧‧距離
S1、S2‧‧‧平面10, 10a, 10b, 10c, 10d, 10e, 10f‧‧‧Light emitting diode package structure
100‧‧‧ Groove
110‧‧‧ bottom
111‧‧‧ inner surface
112‧‧‧ outer surface
120, 120a, 120b, 120c, 120d, 120e, 120f‧‧‧ first side wall
121, 121a, 121b, 121c, 121d, 121e, 121f‧‧‧ first reflective surface
130, 130a, 130b, 130c, 130d‧‧‧ second side wall
131, 131a, 131b, 131c, 131d‧‧‧ second reflecting surface
140‧‧‧The third side wall
141‧‧‧ third reflecting surface
150‧‧‧fourth wall
151‧‧‧fourth reflecting surface
200‧‧‧Lighting elements
210‧‧‧Glossy surface
300‧‧‧Package
C1, C2‧‧‧ center point
H1~H4‧‧‧ Height
D1~D4‧‧‧Distance
S1, S2‧‧ plane
圖1為根據本發明第一實施例所述之發光二極體封裝結構的上視示意圖。 圖2為沿圖1之A-A割面線所繪示的剖面示意圖。 圖3為沿圖1之B-B割面線所繪示的剖面示意圖。 圖4為圖1之發光二極體封裝結構之光型示意圖。 圖5為根據本發明第二實施例所述之發光二極體封裝結構的剖面示意圖。 圖6為根據本發明第三實施例所述之發光二極體封裝結構的剖面示意圖。 圖7為根據本發明第四實施例所述之發光二極體封裝結構的剖面示意圖。 圖8為根據本發明第五實施例所述之發光二極體封裝結構的剖面示意圖。 圖9為根據本發明第六實施例所述之發光二極體封裝結構的剖面示意圖。 圖10為根據本發明第七實施例所述之發光二極體封裝結構的剖面示意圖。1 is a top plan view of a light emitting diode package structure according to a first embodiment of the present invention. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1. 3 is a schematic cross-sectional view taken along line B-B of FIG. 1. 4 is a schematic view showing the light pattern of the light emitting diode package structure of FIG. 1. FIG. 5 is a cross-sectional view showing a light emitting diode package structure according to a second embodiment of the present invention. FIG. 6 is a cross-sectional view showing a light emitting diode package structure according to a third embodiment of the present invention. FIG. 7 is a cross-sectional view showing a light emitting diode package structure according to a fourth embodiment of the present invention. FIG. 8 is a cross-sectional view showing a light emitting diode package structure according to a fifth embodiment of the present invention. FIG. 9 is a cross-sectional view showing a light emitting diode package structure according to a sixth embodiment of the present invention. FIG. 10 is a cross-sectional view showing a light emitting diode package structure according to a seventh embodiment of the present invention.
10‧‧‧發光二極體封裝結構 10‧‧‧Light emitting diode package structure
100‧‧‧凹槽 100‧‧‧ Groove
110‧‧‧底部 110‧‧‧ bottom
111‧‧‧內表面 111‧‧‧ inner surface
112‧‧‧外表面 112‧‧‧ outer surface
120‧‧‧第一邊牆 120‧‧‧First wall
121‧‧‧第一反射面 121‧‧‧First reflecting surface
130‧‧‧第二邊牆 130‧‧‧Second side wall
131‧‧‧第二反射面 131‧‧‧Second reflective surface
200‧‧‧發光元件 200‧‧‧Lighting elements
210‧‧‧出光面 210‧‧‧Glossy surface
300‧‧‧封裝膠 300‧‧‧Package
C、C1、C2‧‧‧中心點 C, C1, C2‧‧‧ center point
H1~H2‧‧‧高度 H1~H2‧‧‧ Height
D1~D2‧‧‧距離 D1~D2‧‧‧Distance
Claims (19)
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111554792A (en) * | 2019-02-11 | 2020-08-18 | 陈在彦 | Light emitting element package with adjusted pointing angle and light emitting device using the same |
US11313519B2 (en) | 2020-06-30 | 2022-04-26 | Eosopto Technology Co., Ltd | Light source module |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111554792A (en) * | 2019-02-11 | 2020-08-18 | 陈在彦 | Light emitting element package with adjusted pointing angle and light emitting device using the same |
CN111554792B (en) * | 2019-02-11 | 2023-08-18 | 陈在彦 | Light emitting element package with adjusted pointing angle and light emitting device using the same |
US11313519B2 (en) | 2020-06-30 | 2022-04-26 | Eosopto Technology Co., Ltd | Light source module |
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