TW201717329A - Package structure - Google Patents
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- TW201717329A TW201717329A TW105127369A TW105127369A TW201717329A TW 201717329 A TW201717329 A TW 201717329A TW 105127369 A TW105127369 A TW 105127369A TW 105127369 A TW105127369 A TW 105127369A TW 201717329 A TW201717329 A TW 201717329A
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Abstract
Description
本發明有關於一種封裝結構,特別為利用至少一強化結構以加強殼體與基板間黏著強度之封裝結構。The invention relates to a package structure, in particular to a package structure which utilizes at least one reinforcing structure to strengthen the adhesion strength between the casing and the substrate.
圖1顯示一習知封裝結構10,包含:一基板11、至少一晶片模組12、一殼體13、以及一黏著材料14。晶片模組12配置於基板11上,而黏著材料14將殼體13與基板11黏合連接。1 shows a conventional package structure 10 comprising: a substrate 11, at least one wafer module 12, a housing 13, and an adhesive material 14. The wafer module 12 is disposed on the substrate 11 , and the adhesive material 14 adhesively connects the housing 13 and the substrate 11 .
習知封裝結構10藉由黏著材料14,黏著圍繞晶片模組之殼體13於基板11,此結構之黏著強度不穩定,如黏著材料14施加過多則可能會影響外觀、如黏著材料14施加過少則可能會出現脫離(Peeling),造成品質不良。The conventional package structure 10 is adhered to the substrate 11 around the wafer module 13 by the adhesive material 14. The adhesion strength of the structure is unstable. If the adhesive material 14 is applied too much, the appearance may be affected, and if the adhesive material 14 is applied too little. Peeling may occur, resulting in poor quality.
就其中一個觀點言,本發明提供了一種封裝結構,包含:一基板;至少一晶片模組,配置於基板上;以及一殼體,包含一頂部、連接於該頂部而圍繞該晶片模組之一外壁、以及至少一強化結構,該外壁和該至少一強化結構藉由一黏著材料而與該基板連接,其中該強化結構具有一封閉或半封閉之通孔。In one aspect, the present invention provides a package structure comprising: a substrate; at least one wafer module disposed on the substrate; and a housing including a top portion connected to the top portion and surrounding the wafer module An outer wall and at least one reinforcing structure, the outer wall and the at least one reinforcing structure being joined to the substrate by an adhesive material, wherein the reinforcing structure has a closed or semi-closed through hole.
本發明之一實施例中,該基板包含一上表面,該至少一晶片模組配置於於該基板之該上表面,該至少一強化結構間接或直接連接於該殼體之該頂部,以及該外壁和該至少一強化結構藉由該黏著材料而黏結於該基板之該上表面,其中該強化結構非用以圍繞該晶片模組。In one embodiment of the present invention, the substrate includes an upper surface, the at least one wafer module is disposed on the upper surface of the substrate, and the at least one reinforcing structure is indirectly or directly connected to the top of the housing, and the The outer wall and the at least one reinforcing structure are adhered to the upper surface of the substrate by the adhesive material, wherein the reinforcing structure is not used to surround the wafer module.
一實施例中,該強化結構具有一底部,用以黏著於該上表面,該底部具有該封閉或半封閉之通孔。In one embodiment, the reinforcing structure has a bottom for adhering to the upper surface, the bottom having the closed or semi-closed through hole.
一實施例中,該強化結構更具有一壁部,該壁部下方與該底部連接,其中該壁部在該上表面之投影面積小於該底部在該上表面之投影面積,且該壁部在該上表面之投影面積至少一部分重疊於該底部在該上表面之投影面積。。In one embodiment, the reinforcing structure further has a wall portion connected to the bottom portion, wherein a projected area of the wall portion on the upper surface is smaller than a projected area of the bottom portion on the upper surface, and the wall portion is At least a portion of the projected area of the upper surface overlaps the projected area of the bottom portion on the upper surface. .
一實施例中,該通孔之內徑小於該壁部之內徑。In one embodiment, the inner diameter of the through hole is smaller than the inner diameter of the wall portion.
一實施例中,強化結構藉由黏著材料而黏著於上表面,黏著材料之一部分被擠出於該通孔內。In one embodiment, the reinforcing structure is adhered to the upper surface by an adhesive material, and a portion of the adhesive material is extruded into the through hole.
一實施例中,當強化結構藉由黏著材料而黏著於上表面,黏著材料之一部分被擠出於底部之上方。In one embodiment, when the reinforcing structure is adhered to the upper surface by the adhesive material, a portion of the adhesive material is extruded above the bottom.
一實施例中,強化結構之底部或壁部在上表面之投影形狀包含以下形狀之一:封閉或半封閉之矩形、封閉或半封閉之圓形或橢圓形、L形、U形、E形、以上形狀兩者以上之組合。In one embodiment, the projected shape of the bottom or wall portion of the reinforcing structure on the upper surface comprises one of the following shapes: closed or semi-closed rectangular, closed or semi-closed circular or elliptical, L-shaped, U-shaped, E-shaped A combination of two or more of the above shapes.
一實施例中,殼體為塑膠材質所製作。In one embodiment, the housing is made of a plastic material.
就其中一個觀點言,本發明提供了一種封裝結構,包含:一基板;至少一晶片模組,配置於基板上;以及一殼體,包含一頂部、以及連接於該頂部的至少一強化結構,該強化結構具有一底部和一壁部,該底部藉由一黏著材料而與該基板連接,該壁部下方與該底部連接、該壁部上方與該頂部連接,該壁部在該基板之投影面積至少一部分重疊於該底部在該基板之投影面積。In one aspect, the present invention provides a package structure comprising: a substrate; at least one wafer module disposed on the substrate; and a housing including a top portion and at least one reinforcing structure coupled to the top portion The reinforcing structure has a bottom portion and a wall portion connected to the substrate by an adhesive material, the wall portion is connected to the bottom portion, and the wall portion is connected to the top portion, and the wall portion is projected on the substrate At least a portion of the area overlaps the projected area of the substrate at the bottom.
就其中一個觀點言,本發明提供了一種封裝結構,包含:一基板,包含一上表面;至少一晶片模組,配置於基板的上表面上;以及一殼體,用以包覆該晶片模組,該殼體包含一強化結構,該強化結構具有一下表面和一與該下表面相對的上表面,其中該強化結構的下表面藉由一黏著材料而黏著於該基板的上表面,又該強化結構的上表面至少部分與該黏著材料直接黏合。In one aspect, the present invention provides a package structure comprising: a substrate including an upper surface; at least one wafer module disposed on an upper surface of the substrate; and a housing for covering the wafer mold The housing includes a reinforcing structure having a lower surface and an upper surface opposite to the lower surface, wherein a lower surface of the reinforcing structure is adhered to an upper surface of the substrate by an adhesive material, and The upper surface of the reinforcing structure is at least partially bonded directly to the adhesive material.
底下藉由具體實施例詳加說明,當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。本發明中的圖式均屬示意,主要意在表示各組成部分之間之相對關係,至於形狀、厚度與寬度則可在實施時依需要而調整。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. The drawings in the present invention are schematic and are mainly intended to indicate the relative relationship between the various components, and the shape, thickness and width can be adjusted as needed during implementation.
請參閱第2、3A-3D、4、5A-5C圖,顯示本發明的第一個實施例。其中,第2圖顯示殼體23與基板21未黏著前之上視狀態,第4圖顯示殼體23與基板21藉由黏著材料24黏著後構成封裝結構20之上視狀態。第3A-3C圖分別為根據第2圖中剖面線AA、BB、CC之剖視圖;第3D圖為第3C圖的局部放大圖;第5A-5C圖分別為根據第4圖中剖面線AA、BB、CC之剖視圖。Referring to Figures 2, 3A-3D, 4, 5A-5C, a first embodiment of the present invention is shown. 2 shows the state in which the casing 23 and the substrate 21 are not adhered to the front view, and FIG. 4 shows the state in which the casing 23 and the substrate 21 are adhered by the adhesive material 24 to form the package structure 20. 3A-3C are cross-sectional views according to section lines AA, BB, and CC in FIG. 2; FIG. 3D is a partial enlarged view of FIG. 3C; and FIGS. 5A-5C are respectively a section line AA according to FIG. Cutaway view of BB and CC.
如第2、3A-3C圖所示,封裝結構20包含:一基板21,包含一上表面211;至少一晶片模組22,配置於基板21的上表面211;以及一殼體23,包含一頂部231、至少一外壁232(連接於頂部231而圍繞晶片模組)、以及間接或直接連接於頂部231之至少一強化結構233。外壁232和至少一強化結構233藉由一黏著材料24而黏著於上表面211,其中強化結構233係為強化黏著而設,亦即,外壁232是用以圍繞晶片模組22,但強化結構233並非用以圍繞晶片模組22(意指強化結構233並未完全包圍晶片模組22)。As shown in FIGS. 2 and 3A-3C, the package structure 20 includes a substrate 21 including an upper surface 211, at least one wafer module 22 disposed on the upper surface 211 of the substrate 21, and a housing 23 including a The top portion 231, at least one outer wall 232 (attached to the top portion 231 to surround the wafer module), and at least one reinforcing structure 233 indirectly or directly connected to the top portion 231. The outer wall 232 and the at least one reinforcing structure 233 are adhered to the upper surface 211 by an adhesive material 24, wherein the reinforcing structure 233 is provided for adhesive bonding, that is, the outer wall 232 is used to surround the wafer module 22, but the reinforcing structure 233 It is not intended to surround the wafer module 22 (meaning that the reinforcing structure 233 does not completely surround the wafer module 22).
參照第3C圖,強化結構233具有一底部2331,且在底部2331中具有一通孔2333。本實施例中,通孔2333為封閉之通孔,但在另一實施例中,通孔可為半封閉之通孔(容後說明)。對照第3C與5C圖,通孔2333設置的目的為:當強化結構233藉由黏著材料24而黏著於上表面211時,黏著材料24之一部分可經由通孔2333而被擠出於底部2331之上方,此被擠出之部分形成一倒勾結構,可強化殼體23與基板21的黏著效果。在黏著材料24之一部分被擠出而形成倒勾結構的情況下,強化結構233的下表面藉由黏著材料24而黏著於該基板的上表面,又強化結構的上表面(底部2331之上表面)至少部分與黏著材料24直接黏合。因此,與先前技術相較,本發明的黏著面積增加,且具有兩相反方向的黏著力,強化了殼體23與基板21的黏著效果。需說明的是,第5C圖顯示黏著材料24之一部分被擠出於底部2331之上方而形成倒勾結構,此僅為較佳而非必須,若黏著材料24之施加量較少,以致黏著材料24僅擠出至通孔2333內部而並未到達底部2331之上方,則由於黏著材料24黏合了通孔2333內部的側壁,因此相對於先前技術而言,也仍然可強化殼體23與基板21的黏著效果。Referring to FIG. 3C, the reinforcing structure 233 has a bottom portion 2331 and a through hole 2333 in the bottom portion 2331. In this embodiment, the through hole 2333 is a closed through hole, but in another embodiment, the through hole may be a semi-closed through hole (described later). Referring to FIGS. 3C and 5C, the through hole 2333 is provided for the purpose that when the reinforcing structure 233 is adhered to the upper surface 211 by the adhesive material 24, a portion of the adhesive material 24 can be extruded through the through hole 2333 to the bottom 2331. Above, the extruded portion forms a barb structure, which enhances the adhesion of the casing 23 to the substrate 21. In a case where a portion of the adhesive material 24 is extruded to form an undercut structure, the lower surface of the reinforcing structure 233 is adhered to the upper surface of the substrate by the adhesive material 24, and the upper surface of the structure is strengthened (the upper surface of the bottom portion 2331) At least partially bonded directly to the adhesive material 24. Therefore, compared with the prior art, the adhesive area of the present invention is increased, and the adhesive force in the opposite direction is enhanced, and the adhesion effect of the casing 23 and the substrate 21 is enhanced. It should be noted that FIG. 5C shows that a part of the adhesive material 24 is extruded above the bottom portion 2331 to form a barb structure, which is only preferred but not necessary, if the adhesive material 24 is applied in a small amount, so that the adhesive material is adhered. 24 is only extruded into the interior of the through hole 2333 without reaching above the bottom portion 2331. Since the adhesive material 24 adheres to the inner side wall of the through hole 2333, the housing 23 and the substrate 21 can still be reinforced relative to the prior art. Adhesive effect.
第2、3A-3C圖所顯示之強化結構233,係連接於外壁232,並經由外壁232而間接連接於頂部231。在另一實施例中(容後說明),強化結構233可部分或全部直接連接於頂部231。The reinforcing structure 233 shown in Figures 2, 3A-3C is attached to the outer wall 232 and indirectly connected to the top 231 via the outer wall 232. In another embodiment (described later), the reinforcing structure 233 may be partially or fully attached directly to the top 231.
參照第3C圖,在一較佳實施方式中,強化結構233具有一底部2331和一壁部2332,壁部2332下方與底部2331連接;底部2331藉由黏著材料24而黏著於上表面211。參照第3D圖,強化結構233之壁部2332在上表面211具有一投影面積P1,底部2331在上表面211具有另一投影面積P2。從垂直方向觀之,投影面積P1小於投影面積P2、且投影面積P1至少一部分重疊於投影面積P2。藉此,通孔2333的內徑D1小於壁部2332的內徑D2。設置壁部2332的作用是:當黏著材料24之施加量較多時,可以限制黏著材料24之延伸範圍,不致影響到晶片模組22。需說明的是,壁部2332的設置僅為較佳而非必須,若是僅有底部2331而無壁部2332,已經可以達成較先前為佳的黏著效果。此外,底部2331和壁部2332的剖面並不必須為圖示的矩形,亦可為其他形狀,例如但不限於梯形。Referring to FIG. 3C, in a preferred embodiment, the reinforcing structure 233 has a bottom portion 2331 and a wall portion 2332. The wall portion 2332 is connected below the bottom portion 2331; the bottom portion 2331 is adhered to the upper surface 211 by the adhesive material 24. Referring to FIG. 3D, the wall portion 2332 of the reinforcing structure 233 has a projected area P1 on the upper surface 211, and the bottom portion 2331 has another projected area P2 on the upper surface 211. Viewed from the vertical direction, the projected area P1 is smaller than the projected area P2, and at least a part of the projected area P1 overlaps the projected area P2. Thereby, the inner diameter D1 of the through hole 2333 is smaller than the inner diameter D2 of the wall portion 2332. The function of the wall portion 2332 is to limit the extent of the adhesive material 24 when the amount of the adhesive material 24 is applied, so as not to affect the wafer module 22. It should be noted that the arrangement of the wall portion 2332 is only preferred but not necessary. If there is only the bottom portion 2331 and no wall portion 2332, it is possible to achieve a better adhesion effect than before. Further, the cross-sections of the bottom portion 2331 and the wall portion 2332 are not necessarily rectangular as shown, but may be other shapes such as, but not limited to, a trapezoid.
請參閱第6、7A-7C、8、9A-9C圖,顯示本發明的另一個實施例。其中,第6圖顯示殼體33與基板21未黏著前之上視狀態,第8圖顯示殼體33與基板21藉由黏著材料24黏著後構成封裝結構30之上視狀態。第7A-7C圖分別為根據第6圖中剖面線DD、EE、FF之剖視圖;第9A-9C圖分別為根據第8圖中剖面線DD、EE、FF之剖視圖。其中,為使圖面簡潔,第7A-7C圖中省略繪示基板21而僅繪示殼體33。Referring to Figures 6, 7A-7C, 8, 9A-9C, another embodiment of the present invention is shown. 6 shows the state in which the casing 33 and the substrate 21 are not adhered to the front view, and FIG. 8 shows the state in which the casing 33 and the substrate 21 are adhered by the adhesive material 24 to form the package structure 30. 7A-7C are cross-sectional views taken along line DD, EE, and FF in Fig. 6, respectively; and Figs. 9A-9C are cross-sectional views taken along line DD, EE, and FF in Fig. 8, respectively. In order to simplify the drawing, the substrate 31 is omitted from the drawing in FIGS. 7A-7C, and only the housing 33 is shown.
參閱第6、7A-7C圖,本實施例顯示:強化結構333之底部所具有的通孔,可以是封閉通孔3330、也可以是半封閉通孔3333。所謂封閉是指通孔3330完全被強化結構333之底部圍繞,而半封閉通孔3333是指強化結構333之底部僅部分圍繞通孔3333。在半封閉通孔3333的情況下,較佳地,此外,強化結構333之底部圍繞通孔3333的外周一半以上。又,綜合本實施例與前一實施例,顯示根據本發明,強化結構333之底部或壁部在基板上表面之投影形狀可包含以下形狀:封閉或半封閉之矩形、封閉或半封閉之圓形或橢圓形、L形、U形、E形、或以上形狀兩者以上之組合。Referring to FIGS. 6 and 7A-7C, the embodiment shows that the through hole at the bottom of the reinforcing structure 333 may be a closed through hole 3330 or a semi-closed through hole 3333. By closed is meant that the through hole 3330 is completely surrounded by the bottom of the reinforcing structure 333, and the semi-closed through hole 3333 means that the bottom of the reinforcing structure 333 only partially surrounds the through hole 3333. In the case of the semi-closed through hole 3333, preferably, in addition, the bottom of the reinforcing structure 333 surrounds more than half of the outer circumference of the through hole 3333. Further, in combination with the present embodiment and the previous embodiment, it is shown that according to the present invention, the projected shape of the bottom or wall portion of the reinforcing structure 333 on the upper surface of the substrate may include the following shapes: a closed or semi-closed rectangular, closed or semi-closed circle A combination of two or more of a shape or an ellipse, an L shape, a U shape, an E shape, or a shape.
參照第7A圖,本圖中顯示在另一實施例中,強化結構333的壁部3332可以直接連接於頂部231,而非經由外壁332間接連接於頂部231。本實施例中,壁部3332可以全部直接連接於頂部231,或僅有一部分直接連接於頂部231。又,本實施例可視為:強化結構333並不包含外壁332,但與外壁共同構成了封閉的通孔3330,或是,也可視為強化結構333包含外壁332的一部分,強化結構333的其中一側邊由外壁332所構成,但是強化結構333的此側邊並不設有前述定義的底部和壁部。亦即,本發明所述「強化結構具有一底部」,其實施方式包括在強化結構的整個內周邊設置底部、也包括僅在強化結構的一部分內周邊設置底部。Referring to Figure 7A, it is shown in this figure that in another embodiment, the wall portion 3332 of the reinforcing structure 333 can be directly attached to the top portion 231 rather than indirectly connected to the top portion 231 via the outer wall 332. In this embodiment, the wall portion 3332 may all be directly connected to the top portion 231, or only a portion may be directly connected to the top portion 231. Moreover, the present embodiment can be regarded as that the reinforcing structure 333 does not include the outer wall 332, but forms a closed through hole 3330 together with the outer wall, or can also be regarded as the reinforcing structure 333 including a part of the outer wall 332, one of the reinforcing structures 333. The side edges are formed by the outer wall 332, but this side of the reinforcing structure 333 is not provided with the bottom and wall portions defined above. That is, the "reinforcing structure has a bottom" according to the present invention, and the embodiment includes providing a bottom portion over the entire inner periphery of the reinforcing structure, and also including providing a bottom portion only in a portion of the inner periphery of the reinforcing structure.
一實施例中,殼體23、33為塑膠材質所製作,此塑膠材質可為LCP (Liquid Crystal Plastic)。此外,殼體23、33也可為其他材質所製作,例如陶瓷材料等。In one embodiment, the housings 23 and 33 are made of a plastic material, and the plastic material may be LCP (Liquid Crystal Plastic). Further, the casings 23, 33 may be made of other materials, such as ceramic materials.
一實施例中,上述強化結構233、333可以為凸起結構或凹陷結構或二者組合。In an embodiment, the reinforcing structures 233, 333 may be a convex structure or a concave structure or a combination of the two.
以上已針對較佳實施例來說明本發明,唯以上所述者,僅係為使熟悉本技術者易於了解本發明的內容而已,並非用來限定本發明之權利範圍。在本發明之相同精神下,熟悉本技術者可以思及各種等效變化。凡此種種,皆可根據本發明的教示類推而得,因此,本發明的範圍應涵蓋上述及其他所有等效變化。The present invention has been described with reference to the preferred embodiments thereof, and the present invention is not intended to limit the scope of the present invention. In the same spirit of the invention, various equivalent changes can be conceived by those skilled in the art. All such modifications may be made in accordance with the teachings of the present invention, and the scope of the present invention should be construed to cover the above and other equivalents.
10‧‧‧習知封裝結構
11‧‧‧基板
12‧‧‧晶片模組
13‧‧‧殼體
14‧‧‧黏著材料
20‧‧‧封裝結構
21‧‧‧基板
211‧‧‧上表面
22‧‧‧晶片模組
23‧‧‧殼體
231‧‧‧頂部
232‧‧‧外壁
233‧‧‧強化結構
2331‧‧‧底部
2332‧‧‧壁部
2333‧‧‧通孔
234‧‧‧下表面
235‧‧‧上表面
24‧‧‧黏著材料
30‧‧‧封裝結構
33‧‧‧殼體
332‧‧‧外壁
333‧‧‧強化結構
3330‧‧‧封閉通孔
3332‧‧‧壁部
3333‧‧‧半封閉通孔
AA、BB、CC、DD、EE、FF‧‧‧剖面線
D1、D2‧‧‧內徑
P1、P2‧‧‧投影面積10‧‧‧Learning package structure
11‧‧‧Substrate
12‧‧‧ wafer module
13‧‧‧Shell
14‧‧‧Adhesive materials
20‧‧‧Package structure
21‧‧‧Substrate
211‧‧‧ upper surface
22‧‧‧ wafer module
23‧‧‧ housing
231‧‧‧ top
232‧‧‧ outer wall
233‧‧‧Strengthened structure
2331‧‧‧ bottom
2332‧‧‧ wall
2333‧‧‧through hole
234‧‧‧ lower surface
235‧‧‧ upper surface
24‧‧‧Adhesive materials
30‧‧‧Package structure
33‧‧‧Shell
332‧‧‧ outer wall
333‧‧‧Strengthen structure
3330‧‧‧Closed through hole
3332‧‧‧ wall
3333‧‧‧Semi-closed through hole
AA, BB, CC, DD, EE, FF‧‧ ‧ hatching
D1, D2‧‧‧ inside diameter
P1, P2‧‧‧ projected area
[第1圖]顯示根據先前技術之封裝結構; [第2、3A-3D、4、5A-5C圖]顯示根據本發明一實施例之封裝結構; [第6、7A-7C、8、9A-9C圖]顯示根據本發明另一實施例之封裝結構。[Fig. 1] shows a package structure according to the prior art; [Fig. 2, 3A-3D, 4, 5A-5C] shows a package structure according to an embodiment of the present invention; [6, 7A-7C, 8, 9A] -9C] shows a package structure in accordance with another embodiment of the present invention.
20‧‧‧封裝結構 20‧‧‧Package structure
21‧‧‧基板 21‧‧‧Substrate
23‧‧‧殼體 23‧‧‧ housing
233‧‧‧強化結構 233‧‧‧Strengthened structure
2333‧‧‧通孔 2333‧‧‧through hole
24‧‧‧黏著材料 24‧‧‧Adhesive materials
Claims (1)
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