TW201717329A - Package structure - Google Patents

Abstract

A package structure includes: a substrate; at least one chip module, located on the substrate; and a housing, including a top portion, a wall connected to the top portion and encompassing the chip module, and an adhesion enhancement structure, wherein the wall and the adhesion enhancement structure are bonded to the substrate by an adhesive; and wherein the adhesion enhancement structure includes a sealed or semi-sealed opening.

Description

Package structure

The invention relates to a package structure, in particular to a package structure which utilizes at least one reinforcing structure to strengthen the adhesion strength between the casing and the substrate.

1 shows a conventional package structure 10 comprising: a substrate 11, at least one wafer module 12, a housing 13, and an adhesive material 14. The wafer module 12 is disposed on the substrate 11 , and the adhesive material 14 adhesively connects the housing 13 and the substrate 11 .

The conventional package structure 10 is adhered to the substrate 11 around the wafer module 13 by the adhesive material 14. The adhesion strength of the structure is unstable. If the adhesive material 14 is applied too much, the appearance may be affected, and if the adhesive material 14 is applied too little. Peeling may occur, resulting in poor quality.

In one aspect, the present invention provides a package structure comprising: a substrate; at least one wafer module disposed on the substrate; and a housing including a top portion connected to the top portion and surrounding the wafer module An outer wall and at least one reinforcing structure, the outer wall and the at least one reinforcing structure being joined to the substrate by an adhesive material, wherein the reinforcing structure has a closed or semi-closed through hole.

In one embodiment of the present invention, the substrate includes an upper surface, the at least one wafer module is disposed on the upper surface of the substrate, and the at least one reinforcing structure is indirectly or directly connected to the top of the housing, and the The outer wall and the at least one reinforcing structure are adhered to the upper surface of the substrate by the adhesive material, wherein the reinforcing structure is not used to surround the wafer module.

In one embodiment, the reinforcing structure has a bottom for adhering to the upper surface, the bottom having the closed or semi-closed through hole.

In one embodiment, the reinforcing structure further has a wall portion connected to the bottom portion, wherein a projected area of the wall portion on the upper surface is smaller than a projected area of the bottom portion on the upper surface, and the wall portion is At least a portion of the projected area of the upper surface overlaps the projected area of the bottom portion on the upper surface. .

In one embodiment, the inner diameter of the through hole is smaller than the inner diameter of the wall portion.

In one embodiment, the reinforcing structure is adhered to the upper surface by an adhesive material, and a portion of the adhesive material is extruded into the through hole.

In one embodiment, when the reinforcing structure is adhered to the upper surface by the adhesive material, a portion of the adhesive material is extruded above the bottom.

In one embodiment, the projected shape of the bottom or wall portion of the reinforcing structure on the upper surface comprises one of the following shapes: closed or semi-closed rectangular, closed or semi-closed circular or elliptical, L-shaped, U-shaped, E-shaped A combination of two or more of the above shapes.

In one embodiment, the housing is made of a plastic material.

In one aspect, the present invention provides a package structure comprising: a substrate; at least one wafer module disposed on the substrate; and a housing including a top portion and at least one reinforcing structure coupled to the top portion The reinforcing structure has a bottom portion and a wall portion connected to the substrate by an adhesive material, the wall portion is connected to the bottom portion, and the wall portion is connected to the top portion, and the wall portion is projected on the substrate At least a portion of the area overlaps the projected area of the substrate at the bottom.

In one aspect, the present invention provides a package structure comprising: a substrate including an upper surface; at least one wafer module disposed on an upper surface of the substrate; and a housing for covering the wafer mold The housing includes a reinforcing structure having a lower surface and an upper surface opposite to the lower surface, wherein a lower surface of the reinforcing structure is adhered to an upper surface of the substrate by an adhesive material, and The upper surface of the reinforcing structure is at least partially bonded directly to the adhesive material.

The purpose, technical content, features and effects achieved by the present invention will be more readily understood by the detailed description of the embodiments.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. The drawings in the present invention are schematic and are mainly intended to indicate the relative relationship between the various components, and the shape, thickness and width can be adjusted as needed during implementation.

Referring to Figures 2, 3A-3D, 4, 5A-5C, a first embodiment of the present invention is shown. 2 shows the state in which the casing 23 and the substrate 21 are not adhered to the front view, and FIG. 4 shows the state in which the casing 23 and the substrate 21 are adhered by the adhesive material 24 to form the package structure 20. 3A-3C are cross-sectional views according to section lines AA, BB, and CC in FIG. 2; FIG. 3D is a partial enlarged view of FIG. 3C; and FIGS. 5A-5C are respectively a section line AA according to FIG. Cutaway view of BB and CC.

As shown in FIGS. 2 and 3A-3C, the package structure 20 includes a substrate 21 including an upper surface 211, at least one wafer module 22 disposed on the upper surface 211 of the substrate 21, and a housing 23 including a The top portion 231, at least one outer wall 232 (attached to the top portion 231 to surround the wafer module), and at least one reinforcing structure 233 indirectly or directly connected to the top portion 231. The outer wall 232 and the at least one reinforcing structure 233 are adhered to the upper surface 211 by an adhesive material 24, wherein the reinforcing structure 233 is provided for adhesive bonding, that is, the outer wall 232 is used to surround the wafer module 22, but the reinforcing structure 233 It is not intended to surround the wafer module 22 (meaning that the reinforcing structure 233 does not completely surround the wafer module 22).

Referring to FIG. 3C, the reinforcing structure 233 has a bottom portion 2331 and a through hole 2333 in the bottom portion 2331. In this embodiment, the through hole 2333 is a closed through hole, but in another embodiment, the through hole may be a semi-closed through hole (described later). Referring to FIGS. 3C and 5C, the through hole 2333 is provided for the purpose that when the reinforcing structure 233 is adhered to the upper surface 211 by the adhesive material 24, a portion of the adhesive material 24 can be extruded through the through hole 2333 to the bottom 2331. Above, the extruded portion forms a barb structure, which enhances the adhesion of the casing 23 to the substrate 21. In a case where a portion of the adhesive material 24 is extruded to form an undercut structure, the lower surface of the reinforcing structure 233 is adhered to the upper surface of the substrate by the adhesive material 24, and the upper surface of the structure is strengthened (the upper surface of the bottom portion 2331) At least partially bonded directly to the adhesive material 24. Therefore, compared with the prior art, the adhesive area of the present invention is increased, and the adhesive force in the opposite direction is enhanced, and the adhesion effect of the casing 23 and the substrate 21 is enhanced. It should be noted that FIG. 5C shows that a part of the adhesive material 24 is extruded above the bottom portion 2331 to form a barb structure, which is only preferred but not necessary, if the adhesive material 24 is applied in a small amount, so that the adhesive material is adhered. 24 is only extruded into the interior of the through hole 2333 without reaching above the bottom portion 2331. Since the adhesive material 24 adheres to the inner side wall of the through hole 2333, the housing 23 and the substrate 21 can still be reinforced relative to the prior art. Adhesive effect.

The reinforcing structure 233 shown in Figures 2, 3A-3C is attached to the outer wall 232 and indirectly connected to the top 231 via the outer wall 232. In another embodiment (described later), the reinforcing structure 233 may be partially or fully attached directly to the top 231.

Referring to FIG. 3C, in a preferred embodiment, the reinforcing structure 233 has a bottom portion 2331 and a wall portion 2332. The wall portion 2332 is connected below the bottom portion 2331; the bottom portion 2331 is adhered to the upper surface 211 by the adhesive material 24. Referring to FIG. 3D, the wall portion 2332 of the reinforcing structure 233 has a projected area P1 on the upper surface 211, and the bottom portion 2331 has another projected area P2 on the upper surface 211. Viewed from the vertical direction, the projected area P1 is smaller than the projected area P2, and at least a part of the projected area P1 overlaps the projected area P2. Thereby, the inner diameter D1 of the through hole 2333 is smaller than the inner diameter D2 of the wall portion 2332. The function of the wall portion 2332 is to limit the extent of the adhesive material 24 when the amount of the adhesive material 24 is applied, so as not to affect the wafer module 22. It should be noted that the arrangement of the wall portion 2332 is only preferred but not necessary. If there is only the bottom portion 2331 and no wall portion 2332, it is possible to achieve a better adhesion effect than before. Further, the cross-sections of the bottom portion 2331 and the wall portion 2332 are not necessarily rectangular as shown, but may be other shapes such as, but not limited to, a trapezoid.

Referring to Figures 6, 7A-7C, 8, 9A-9C, another embodiment of the present invention is shown. 6 shows the state in which the casing 33 and the substrate 21 are not adhered to the front view, and FIG. 8 shows the state in which the casing 33 and the substrate 21 are adhered by the adhesive material 24 to form the package structure 30. 7A-7C are cross-sectional views taken along line DD, EE, and FF in Fig. 6, respectively; and Figs. 9A-9C are cross-sectional views taken along line DD, EE, and FF in Fig. 8, respectively. In order to simplify the drawing, the substrate 31 is omitted from the drawing in FIGS. 7A-7C, and only the housing 33 is shown.

Referring to FIGS. 6 and 7A-7C, the embodiment shows that the through hole at the bottom of the reinforcing structure 333 may be a closed through hole 3330 or a semi-closed through hole 3333. By closed is meant that the through hole 3330 is completely surrounded by the bottom of the reinforcing structure 333, and the semi-closed through hole 3333 means that the bottom of the reinforcing structure 333 only partially surrounds the through hole 3333. In the case of the semi-closed through hole 3333, preferably, in addition, the bottom of the reinforcing structure 333 surrounds more than half of the outer circumference of the through hole 3333. Further, in combination with the present embodiment and the previous embodiment, it is shown that according to the present invention, the projected shape of the bottom or wall portion of the reinforcing structure 333 on the upper surface of the substrate may include the following shapes: a closed or semi-closed rectangular, closed or semi-closed circle A combination of two or more of a shape or an ellipse, an L shape, a U shape, an E shape, or a shape.

Referring to Figure 7A, it is shown in this figure that in another embodiment, the wall portion 3332 of the reinforcing structure 333 can be directly attached to the top portion 231 rather than indirectly connected to the top portion 231 via the outer wall 332. In this embodiment, the wall portion 3332 may all be directly connected to the top portion 231, or only a portion may be directly connected to the top portion 231. Moreover, the present embodiment can be regarded as that the reinforcing structure 333 does not include the outer wall 332, but forms a closed through hole 3330 together with the outer wall, or can also be regarded as the reinforcing structure 333 including a part of the outer wall 332, one of the reinforcing structures 333. The side edges are formed by the outer wall 332, but this side of the reinforcing structure 333 is not provided with the bottom and wall portions defined above. That is, the "reinforcing structure has a bottom" according to the present invention, and the embodiment includes providing a bottom portion over the entire inner periphery of the reinforcing structure, and also including providing a bottom portion only in a portion of the inner periphery of the reinforcing structure.

In one embodiment, the housings 23 and 33 are made of a plastic material, and the plastic material may be LCP (Liquid Crystal Plastic). Further, the casings 23, 33 may be made of other materials, such as ceramic materials.

In an embodiment, the reinforcing structures 233, 333 may be a convex structure or a concave structure or a combination of the two.

The present invention has been described with reference to the preferred embodiments thereof, and the present invention is not intended to limit the scope of the present invention. In the same spirit of the invention, various equivalent changes can be conceived by those skilled in the art. All such modifications may be made in accordance with the teachings of the present invention, and the scope of the present invention should be construed to cover the above and other equivalents.

10‧‧‧Learning package structure
11‧‧‧Substrate
12‧‧‧ wafer module
13‧‧‧Shell
14‧‧‧Adhesive materials
20‧‧‧Package structure
21‧‧‧Substrate
211‧‧‧ upper surface
22‧‧‧ wafer module
23‧‧‧ housing
231‧‧‧ top
232‧‧‧ outer wall
233‧‧‧Strengthened structure
2331‧‧‧ bottom
2332‧‧‧ wall
2333‧‧‧through hole
234‧‧‧ lower surface
235‧‧‧ upper surface
24‧‧‧Adhesive materials
30‧‧‧Package structure
33‧‧‧Shell
332‧‧‧ outer wall
333‧‧‧Strengthen structure
3330‧‧‧Closed through hole
3332‧‧‧ wall
3333‧‧‧Semi-closed through hole
AA, BB, CC, DD, EE, FF‧‧ ‧ hatching
D1, D2‧‧‧ inside diameter
P1, P2‧‧‧ projected area

[Fig. 1] shows a package structure according to the prior art; [Fig. 2, 3A-3D, 4, 5A-5C] shows a package structure according to an embodiment of the present invention; [6, 7A-7C, 8, 9A] -9C] shows a package structure in accordance with another embodiment of the present invention.

20‧‧‧Package structure

21‧‧‧Substrate

23‧‧‧ housing

233‧‧‧Strengthened structure

2333‧‧‧through hole

24‧‧‧Adhesive materials

Claims (1)

A package structure comprising: a substrate including an upper surface; at least one wafer module on the upper surface of the substrate; and a cover for covering the wafer module, the cover comprising a reinforcing structure, the reinforcing structure Having a lower surface and an upper surface opposite to the lower surface, wherein a lower surface of the reinforcing structure is adhered to an upper surface of the substrate by an adhesive material, and an upper surface of the reinforcing structure is at least partially bonded to the adhesive material Wherein the adhesive material of the lower surface of the reinforcing structure and the adhesive material of the upper surface of the reinforcing structure are a connected barb structure.