TW201712815A - Component carrier tape and manufacturing method thereof - Google Patents

Component carrier tape and manufacturing method thereof

Info

Publication number
TW201712815A
TW201712815A TW105118194A TW105118194A TW201712815A TW 201712815 A TW201712815 A TW 201712815A TW 105118194 A TW105118194 A TW 105118194A TW 105118194 A TW105118194 A TW 105118194A TW 201712815 A TW201712815 A TW 201712815A
Authority
TW
Taiwan
Prior art keywords
carrier tape
component carrier
manufacturing
pockets
flexible strip
Prior art date
Application number
TW105118194A
Other languages
Chinese (zh)
Other versions
TWI715590B (en
Inventor
Zheng Liu
shi-jun Shen
Heng-Yuan Zhou
xue-jing Qi
Ying-Yu Wang
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201712815A publication Critical patent/TW201712815A/en
Application granted granted Critical
Publication of TWI715590B publication Critical patent/TWI715590B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/18Thermoforming apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention relates to a component carrier tape, comprising a longitudinal flexible strip, and a plurality of pockets longitudinally arranged on the longitudinal flexible strip and configured to receive a component therein, each of the pockets being separated from an adjacent pocket by a crossbar; wherein at least one crossbar comprises at least one longitudinal rib.
TW105118194A 2015-06-10 2016-06-08 Component carrier tape and manufacturing method thereof TWI715590B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/CN2015/081161 WO2016197342A1 (en) 2015-06-10 2015-06-10 Component carrier tape and manufacturing method thereof
WOPCT/CN2015/081161 2015-06-10

Publications (2)

Publication Number Publication Date
TW201712815A true TW201712815A (en) 2017-04-01
TWI715590B TWI715590B (en) 2021-01-11

Family

ID=57502869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105118194A TWI715590B (en) 2015-06-10 2016-06-08 Component carrier tape and manufacturing method thereof

Country Status (2)

Country Link
TW (1) TWI715590B (en)
WO (1) WO2016197342A1 (en)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5115911A (en) * 1991-02-04 1992-05-26 Illinois Tool Works Inc. Carrier tape system
JP3564971B2 (en) * 1997-02-17 2004-09-15 セイコーエプソン株式会社 Tape carrier package
EP1437301A1 (en) * 1997-09-10 2004-07-14 Yayoi Corporation Tape-shaped package
JP3482850B2 (en) * 1997-12-08 2004-01-06 セイコーエプソン株式会社 Semiconductor device and its manufacturing method, circuit board, and electronic equipment
JP2000185766A (en) * 1998-12-22 2000-07-04 Nec Corp Embossed carrier tape
JP2002211680A (en) * 2001-01-18 2002-07-31 Sony Corp Semiconductor storing member
CN2522363Y (en) * 2001-12-08 2002-11-27 富士康(昆山)电脑接插件有限公司 Package carrying belt
JP3957553B2 (en) * 2002-04-19 2007-08-15 株式会社リコー Carrier tape for storing small articles, storage device and transport method
JP4755410B2 (en) * 2003-11-18 2011-08-24 ルネサスエレクトロニクス株式会社 Tape-shaped component packaging
US20060157381A1 (en) * 2005-01-20 2006-07-20 Adams James T Component carrier and method for making
US9090403B2 (en) * 2011-12-16 2015-07-28 3M Innovative Properties Company Carrier tape
JP6195784B2 (en) * 2013-11-22 2017-09-13 株式会社 東京ウエルズ Carrier tape take-up and storage device and carrier tape take-up and storage method

Also Published As

Publication number Publication date
WO2016197342A1 (en) 2016-12-15
TWI715590B (en) 2021-01-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees