TW201712163A - Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank - Google Patents
Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank Download PDFInfo
- Publication number
- TW201712163A TW201712163A TW104131168A TW104131168A TW201712163A TW 201712163 A TW201712163 A TW 201712163A TW 104131168 A TW104131168 A TW 104131168A TW 104131168 A TW104131168 A TW 104131168A TW 201712163 A TW201712163 A TW 201712163A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- flexible circuit
- roll
- cathode roller
- copper plating
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims abstract description 86
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 55
- 239000010949 copper Substances 0.000 title claims abstract description 55
- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 30
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910001431 copper ion Inorganic materials 0.000 title claims abstract description 25
- 238000003491 array Methods 0.000 title claims abstract description 14
- 238000000354 decomposition reaction Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- 229910003455 mixed metal oxide Inorganic materials 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 238000001223 reverse osmosis Methods 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 4
- 229910000431 copper oxide Inorganic materials 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- 229940116318 copper carbonate Drugs 0.000 claims description 3
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 18
- 230000005484 gravity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本發明涉及一種電解鍍銅裝置及其鍍銅方法，尤指一種用於軟性電路板的捲對捲雙面電解鍍銅裝置及其鍍銅方法。 The invention relates to an electrolytic copper plating device and a copper plating method thereof, in particular to a roll-to-roll double-sided electrolytic copper plating device for a flexible circuit board and a copper plating method thereof.
19世紀中期，世界各國經濟與工業呈高速發展，於機械、汽車、造船、飛機等工業的製造發展過程中，對於產品表面的各種改善機械強度、裝飾或其他特殊性能處理的需求逐漸浮現檯面，於是，英國人與俄羅斯人分別獨立地設計出金屬電鍍方法，且隨著電化學(electrochemistry)理論的成熟，電鍍原理與方法逐漸被世人理解並推廣至全世界。十九世紀末期，人們發現硝酸銀溶液與氫氧化鈉、氨水及醛基物質反應之後，可於玻璃容器內壁上形成一層薄薄的金屬銀，而構成一鏡面，即銀鏡效應(silver mirror reaction)，引發人們開始探討於非金屬材質上進行金屬鍍膜的方法與技術。 In the mid-19th century, the economies and industries of the world developed rapidly. In the manufacturing and development of machinery, automobiles, shipbuilding, aircraft and other industries, the demand for various mechanical strength, decoration or other special performance treatment on the surface of the product gradually emerged. Therefore, the British and the Russians independently designed the metal plating method, and with the maturity of the electrochemistry theory, the principle and method of electroplating have gradually been understood and promoted to the whole world. At the end of the 19th century, it was found that after reacting silver nitrate solution with sodium hydroxide, ammonia water and aldehyde-based substances, a thin layer of metallic silver was formed on the inner wall of the glass container to form a mirror surface, ie silver mirror reaction. It has led people to explore ways and techniques for metal coating on non-metallic materials.
至二十世紀初期，石化與塑膠工業的發展帶動各式塑膠產品的誕生，人們對於在塑膠材料上進行金屬鍍亦膜發展出業界標準。例如電子產品應用領域經常使用的軟排線以及顯示器上的可撓式光電板，其上的金屬指狀電極通常是以化學電解電鍍銅質等導電良好之金屬的方式完成，最傳統的可撓式光電板之電鍍方式是採用垂直式電鍍法，成本低且速度快，然而隨著所需的光電板尺寸越來越大，使用垂直式電鍍法會受到地球之地心引力的影響，而使得光電板上所鍍上的電極厚度均勻性不佳，後來人們發展出水平式的電鍍法，其以水平方式輸送故不受地心引力的影響。 By the early 20th century, the development of the petrochemical and plastics industry led to the birth of various types of plastic products. People have developed industry standards for metal plating on plastic materials. For example, the flexible cable used in the field of electronic products and the flexible photovoltaic panel on the display, the metal finger electrode on the metal finger electrode is usually made by electroless plating of copper and other conductive metal, the most traditional flexible The photoelectric plating method adopts vertical plating method, which is low in cost and fast in speed. However, as the required photoelectric plate size becomes larger and larger, the use of vertical plating method is affected by the gravity of the earth, which makes The thickness of the electrode plated on the photovoltaic panel was not uniform. Later, a horizontal plating method was developed, which was transported in a horizontal manner and was not affected by gravity.
然而，由於大尺寸具有表面張力不均勻等其他問題，因此維護水平式電鍍法的電鍍設備需要較高的成本，此外，水平式電鍍法難以確保光電板之相對兩面上的鍍膜厚度皆相同，且對於需進行雙面鍍膜時，鍍膜速度與品質將難以提升。 However, since the large size has other problems such as uneven surface tension, the electroplating apparatus for maintaining the horizontal plating method requires a high cost, and in addition, it is difficult to ensure that the plating thicknesses on the opposite sides of the photovoltaic panel are the same, and When double-sided coating is required, the coating speed and quality will be difficult to increase.
因此，提出一種用於軟性電路板的捲對捲雙面電解鍍銅裝置及 其鍍膜方法，其以全程捲對捲(roll-to-roll)的傳送方式，提升軟性電路板於雙面電解鍍銅製程的速度，且製程期間能夠確保鍍膜具有均勻的鍍膜厚度以及良好的品質，實為目前各界亟欲解決之技術問題。 Therefore, a roll-to-roll double-sided electrolytic copper plating device for a flexible circuit board is proposed and The coating method adopts a full roll-to-roll transfer method to increase the speed of the flexible circuit board in the double-sided electrolytic copper plating process, and ensures uniform coating thickness and good quality during the process. It is a technical problem that everyone is trying to solve at present.
鑒於前述之習知技術的缺點，本發明之主要目的係提供一種用於軟性電路板的捲對捲雙面電解鍍銅裝置，其能以全程捲對捲(roll-to-roll)的傳送方式，提升軟性電路板於雙面電解鍍銅製程的速度，且製程期間能夠確保鍍膜具有均勻的鍍膜厚度，以達到快速生產且鍍膜品質佳的目的。 In view of the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board capable of full-roll-to-roll transfer. The speed of the flexible circuit board in the double-sided electrolytic copper plating process is improved, and the coating film can be ensured to have a uniform coating thickness during the process, so as to achieve rapid production and good coating quality.
為了達到前述目的及其他目的，本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置包括：一電鍍模組，係包括：一U型槽，係設置於該電鍍模組內，且具有一入料口及一出料口；複數滾筒，係設置於該U型槽中，且移動一軟性電路板；複數非可溶性陽極，係設置於該U型槽的內壁上；複數噴嘴陣列，係設置於該複數非可溶性陽極上；以及一銅離子感測器，係設置於該U型槽中，且產生一感測值；一入料潔淨槽，係設置於該U型槽的入料口，且具有一第一陰極滾輪以及與該第一陰極滾輪之滾動方向相反的一第二陰極滾輪，其中，該第一陰極滾輪與該第二陰極滾輪並列設置於該入料潔淨槽中，且沿水平方向移動該軟性電路板至該入料口內，其中，該第一陰極滾輪接觸該軟性電路板的上表面，該第二陰極滾輪接觸該軟性電路板的下表面；以及一出料潔淨槽，係設置於該U型槽的出料口，且具有一第三陰極滾輪以及與該第三陰極滾輪之滾動方向相反的一第四陰極滾輪，其中，該第三陰極滾輪與該第四陰極滾輪並列設置於該出料潔淨槽中，且由該出料口沿水平方向移出該軟性電路板，該第三陰極滾輪接觸該軟性電路板的上表面，該第四陰極滾輪接觸該軟性電路板的下表面。 In order to achieve the foregoing and other objects, the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention comprises: a plating module comprising: a U-shaped groove disposed in the plating module; And having a feed port and a discharge port; the plurality of rollers are disposed in the U-shaped groove and moving a flexible circuit board; the plurality of non-soluble anodes are disposed on the inner wall of the U-shaped groove; the plurality of nozzles An array is disposed on the plurality of non-soluble anodes; and a copper ion sensor is disposed in the U-shaped groove and generates a sensing value; a feed cleaning groove is disposed in the U-shaped groove a feed port having a first cathode roller and a second cathode roller opposite to a rolling direction of the first cathode roller, wherein the first cathode roller and the second cathode roller are juxtaposed in the feed cleaning tank And moving the flexible circuit board into the inlet port in a horizontal direction, wherein the first cathode roller contacts an upper surface of the flexible circuit board, the second cathode roller contacts a lower surface of the flexible circuit board; Discharge clean tank, a discharge port disposed in the U-shaped groove, and having a third cathode roller and a fourth cathode roller opposite to a rolling direction of the third cathode roller, wherein the third cathode roller is juxtaposed with the fourth cathode roller Provided in the discharge cleaning tank, and the discharge circuit port is horizontally removed from the flexible circuit board, the third cathode roller contacts the upper surface of the flexible circuit board, and the fourth cathode roller contacts the flexible circuit board surface.
較佳地，各該複數非可溶性陽極為一混合金屬氧化物(mixed metal oxide,MMO)，其由一鈦金屬芯表面塗覆銥氧化物而構成。 Preferably, each of the plurality of non-soluble anodes is a mixed metal oxide (MMO) composed of a surface of a titanium metal core coated with cerium oxide.
較佳地，本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置復包括一逆滲透(reverse osmosis,RO)純水裝置，係連接至該入料潔淨槽及/ 或該出料潔淨槽。 Preferably, the roll-to-roll double-sided electrolytic copper plating device for a flexible circuit board of the present invention comprises a reverse osmosis (RO) pure water device connected to the feed cleaning tank and/or Or the discharge clean tank.
較佳地，本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置復包括一銅離子產生器，係連接至該銅離子感測器，且依據該感測值輸入至少一銅離子至該U型槽中。 Preferably, the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention further comprises a copper ion generator connected to the copper ion sensor, and inputting at least one copper according to the sensing value. Ions into the U-shaped groove.
較佳地，該銅離子產生器包括一氧化銅分解裝置、一碳酸銅分解裝置、一硫酸銅分解裝置之其中一者及其組合。 Preferably, the copper ion generator comprises one of a copper oxide decomposition device, a copper carbonate decomposition device, and a copper sulfate decomposition device, and a combination thereof.
較佳地，該軟性電路板為聚醯亞胺(polyimide,PI)及/或聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)所構成。 Preferably, the flexible circuit board is made of polyimide (PI) and/or polyethylene terephthalate (PET).
較佳地，本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置復包括至少一伺服馬達，係設置於該電鍍膜組之該入料口及/或該出料口，以移動該軟性電路板。 Preferably, the roll-to-roll double-sided electrolytic copper plating device for a flexible circuit board of the present invention comprises at least one servo motor disposed at the inlet and/or the discharge port of the plating film group to Move the flexible board.
較佳地，該U型槽中設置有硫酸銅溶液，該入料潔淨槽及/或該出料潔淨槽設置有去離子水。 Preferably, the U-shaped tank is provided with a copper sulfate solution, and the feed cleaning tank and/or the discharge cleaning tank is provided with deionized water.
較佳地，該U型槽的底部設置有二幫浦。 Preferably, the bottom of the U-shaped groove is provided with two pumps.
在使用本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置時，是藉由該入料潔淨槽的該第一陰極滾輪及該第二陰極滾輪沿水平方向移動該軟性電路板，以潔淨該軟性電路板的上表面及下表面；接著，將該軟性電路板由該入料潔淨槽移動至該U型槽的該入料口內，使該軟性電路板沿垂直方向向下移動，且藉由設置於該U型槽內之該複數非可溶性陽極上的複數噴嘴陣列對該軟性電路板進行鍍銅步驟；該軟性電路板於進入該U型槽之後，係使該軟性電路板沿垂直方向向上移動，藉由設置於該U型槽內之該複數非可溶性陽極上的該複數噴嘴陣列對該軟性電路板進行鍍銅步驟，且將該軟性電路板由該U型槽的該出料口移動至該出料潔淨槽內；最後，藉由該出料潔淨槽的該第三陰極滾輪及該第四陰極滾輪沿水平方向移動該軟性電路板，以潔淨該軟性電路板的上表面及下表面。 When the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention is used, the first cathode roller and the second cathode roller of the feed cleaning tank are horizontally moved to move the flexible circuit board To clean the upper surface and the lower surface of the flexible circuit board; then, moving the flexible circuit board from the feed cleaning groove into the inlet of the U-shaped groove, so that the flexible circuit board is vertically downward Moving, and performing a copper plating step on the flexible circuit board by a plurality of nozzle arrays disposed on the plurality of insoluble anodes in the U-shaped groove; after the flexible circuit board enters the U-shaped groove, the flexible circuit is Moving the plate upward in a vertical direction, performing a copper plating step on the flexible circuit board by the plurality of nozzle arrays disposed on the plurality of non-soluble anodes in the U-shaped groove, and the flexible circuit board is formed by the U-shaped groove The discharge port moves into the discharge cleaning tank; finally, the third cathode roller and the fourth cathode roller of the discharge cleaning tank move the flexible circuit board in a horizontal direction to clean the flexible circuit board. Upper surface lower surface.
由於本發明是採用結合水平式與垂直式的複合式(hybrid)製程設備，該複數噴嘴陣列與該U型槽的設計可在兼顧製程速度的同時，讓鍍膜受地心引力的影響降到最低，而可兼顧鍍膜厚度的均勻性，此外，陰極的電極性是以入、出料潔淨槽的複數陰極滾輪進行接配，可簡化並縮小電鍍裝置的體積；因此，本發明可達到快速生產且鍍膜品質佳的目的。 Since the present invention adopts a hybrid process device combining horizontal and vertical, the multi-nozzle array and the U-shaped groove are designed to minimize the influence of the gravity of the coating while balancing the process speed. Moreover, the uniformity of the thickness of the coating can be achieved. In addition, the polarity of the cathode is matched by a plurality of cathode rollers of the inlet and outlet cleaning tanks, which can simplify and reduce the volume of the plating apparatus; therefore, the invention can achieve rapid production and The purpose of coating quality is good.
鑒於前述之習知技術的缺點，本發明之另一目的係提供一種用於軟性電路板的捲對捲雙面電解鍍銅方法，其能以全程捲對捲(roll-to-roll)的傳送方式，提升軟性電路板於雙面電解鍍銅製程的速度，且製程期間能夠確保鍍膜具有均勻的鍍膜厚度，以達到低成本、快速且環保的目的。 In view of the above-mentioned disadvantages of the prior art, another object of the present invention is to provide a roll-to-roll double-sided electrolytic copper plating method for a flexible circuit board capable of full-roll-to-roll transfer. The method improves the speed of the flexible circuit board in the double-sided electrolytic copper plating process, and ensures uniform coating thickness of the coating during the process, so as to achieve low cost, fast and environmental protection.
為了達到前述目的及其他目的，本發明之用於軟性電路板的捲對捲雙面電解鍍銅方法包括下列步驟：一入料潔淨步驟，係藉由一入料潔淨槽的一第一陰極滾輪及一第二陰極滾輪沿水平方向移動一軟性電路板，以潔淨該軟性電路板的上表面及下表面；一向下電鍍步驟，係將該軟性電路板由該入料潔淨槽移動至一U型槽的一入料口內，使該軟性電路板沿垂直方向向下移動，且藉由設置於該U型槽內之複數非可溶性陽極上的複數噴嘴陣列對該軟性電路板進行鍍銅步驟；一向上電鍍步驟，係使該軟性電路板沿垂直方向向上移動，藉由設置於該U型槽內之該複數非可溶性陽極上的該複數噴嘴陣列對該軟性電路板進行鍍銅步驟，且將該軟性電路板由該U型槽的一出料口移動至一出料潔淨槽內；以及一出料潔淨步驟，係藉由該出料潔淨槽的一第三陰極滾輪及一第四陰極滾輪沿水平方向移動該軟性電路板，以潔淨該軟性電路板的上表面及下表面。 In order to achieve the foregoing and other objects, the roll-to-roll double-sided electrolytic copper plating method for a flexible circuit board of the present invention comprises the following steps: a feed cleaning step by a first cathode roller through a feed cleaning tank And a second cathode roller moves a flexible circuit board in a horizontal direction to clean the upper surface and the lower surface of the flexible circuit board; and a downward plating step moves the flexible circuit board from the feeding cleaning slot to a U-shaped a flexible circuit board is moved downward in a vertical direction in a receiving port of the slot, and the flexible circuit board is subjected to a copper plating step by a plurality of nozzle arrays disposed on the plurality of non-soluble anodes in the U-shaped groove; An upward plating step of moving the flexible circuit board upward in a vertical direction, and performing a copper plating step on the flexible circuit board by the plurality of nozzle arrays disposed on the plurality of non-soluble anodes in the U-shaped groove, and The flexible circuit board is moved from a discharge port of the U-shaped groove to a discharge cleaning tank; and a discharge cleaning step is performed by a third cathode roller and a fourth cathode of the discharge cleaning tank. The roller moves the flexible circuit board in a horizontal direction to clean the upper surface and the lower surface of the flexible circuit board.
10‧‧‧電鍍模組 10‧‧‧ plating module
11‧‧‧U型槽 11‧‧‧U-shaped slot
111‧‧‧入料口 111‧‧‧Inlet
112‧‧‧出料口 112‧‧‧Outlet
12‧‧‧滾筒 12‧‧‧Roller
120‧‧‧軟性電路板 120‧‧‧Soft circuit board
13‧‧‧非可溶性陽極 13‧‧‧Non-soluble anode
131‧‧‧陽極網狀過濾器 131‧‧‧Anode mesh filter
14‧‧‧噴嘴陣列 14‧‧‧Nozzle array
15‧‧‧銅離子感測器 15‧‧‧Copper ion sensor
150‧‧‧銅離子產生器 150‧‧‧Copper ion generator
16‧‧‧幫浦 16‧‧‧
20‧‧‧入料潔淨槽 20‧‧‧Incoming clean tank
21‧‧‧第一陰極滾輪 21‧‧‧First cathode roller
22‧‧‧第二陰極滾輪 22‧‧‧Second cathode roller
30‧‧‧出料潔淨槽 30‧‧‧Output clean tank
31‧‧‧第三陰極滾輪 31‧‧‧ Third cathode roller
32‧‧‧第四陰極滾輪 32‧‧‧fourth cathode roller
40‧‧‧伺服馬達 40‧‧‧Servo motor
50‧‧‧逆滲透純水裝置 50‧‧‧ reverse osmosis pure water device
圖1係依據本發明用於軟性電路板的捲對捲雙面電解鍍銅裝置之一實施例，顯示該捲對捲雙面電解鍍銅裝置之一電鍍模組的結構示意圖；圖2係依據本發明用於軟性電路板的捲對捲雙面電解鍍銅裝置之該實施例，顯示該捲對捲雙面電解鍍銅裝置之多組串接時的使用示意圖；圖3係依據本發明用於軟性電路板的捲對捲雙面電解鍍銅裝置之該實施例，顯示該捲對捲雙面電解鍍銅裝置之俯視結構示意圖；圖4係依據本發明用於軟性電路板的捲對捲雙面電解鍍銅裝置之該實施例，顯示該捲對捲雙面電解鍍銅裝置的外部電路連接示意圖；以及圖5係依據本發明用於軟性電路板的捲對捲雙面電解鍍銅方法之一實施例，顯示該捲對捲雙面電解鍍銅方法之流程步驟示意圖。 1 is an embodiment of a roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board according to the present invention, showing a structural schematic diagram of a plating module of the roll-to-roll double-sided electrolytic copper plating apparatus; FIG. 2 is based on The embodiment of the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention shows a schematic view of the use of the plurality of sets of the double-sided electrolytic copper plating apparatus of the roll-to-roll type; FIG. 3 is used according to the present invention. This embodiment of the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board shows a schematic top view of the roll-to-roll double-sided electrolytic copper plating apparatus; and FIG. 4 is a roll-to-roll for a flexible circuit board according to the present invention. The embodiment of the double-sided electrolytic copper plating apparatus shows an external circuit connection diagram of the roll-to-roll double-sided electrolytic copper plating apparatus; and FIG. 5 is a roll-to-roll double-sided electrolytic copper plating method for a flexible circuit board according to the present invention. In one embodiment, a schematic diagram of the flow steps of the roll-to-roll double-sided electrolytic copper plating method is shown.
以下係藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。本發明亦可藉由其他不同的具體實例加以施行或應用，本發明說明書中的各項細節亦可基於不同觀點與應用在不悖離本發明之精神下進行各種修飾與變更。 The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The invention may be embodied or applied in various other specific embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention.
須知，本說明書所附圖式繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應落在本發明所揭示之技術內容得能涵蓋之範圍內。 It is to be understood that the structure, the proportions, the size and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the scope of the invention. The conditions are not technically meaningful, and any modification of the structure, change of the proportional relationship or adjustment of the size should be disclosed in the present invention without affecting the effects and achievable effects of the present invention. The technical content can be covered.
以下依據本發明之一實施例，描述一用於軟性電路板的捲對捲雙面電解鍍銅裝置及其鍍銅方法。 Hereinafter, a roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board and a copper plating method thereof will be described in accordance with an embodiment of the present invention.
請參閱圖1至圖4所示，本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置包括：一電鍍膜組10、一入料潔淨槽20及一出料潔淨槽30。 Referring to FIG. 1 to FIG. 4, the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention comprises: a plating film group 10, a feed cleaning tank 20, and a discharge cleaning tank 30.
電鍍模組10包括一U型槽11、複數滾筒12、複數非可溶性陽極13、複數噴嘴陣列14及一銅離子感測器15。其中，U型槽11設置於電鍍模組10內，且具有一入料口111及一出料口112，入料口111用以將欲鍍物料輸送至電鍍模組10中，出料口112用以將已鍍成品輸出於電鍍模組10外；依據本發明之實施例，U型槽11中設置有硫酸銅溶液。 The electroplating module 10 includes a U-shaped groove 11, a plurality of rollers 12, a plurality of non-soluble anodes 13, a plurality of nozzle arrays 14, and a copper ion sensor 15. The U-shaped slot 11 is disposed in the plating module 10 and has a receiving port 111 and a discharging port 112 for feeding the material to be plated into the plating module 10, and the discharging port 112 The utility model is used for outputting the plated product outside the electroplating module 10; according to an embodiment of the invention, a copper sulfate solution is disposed in the U-shaped groove 11.
複數滾筒12設置於U型槽11中，且移動一軟性電路板120，依據本發明之實施例，軟性電路板120為聚醯亞胺(polyimide,PI)及/或聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)所構成，軟性電路板120受複數滾筒12之轉動。而於U型槽中移動。 The plurality of rollers 12 are disposed in the U-shaped groove 11 and move a flexible circuit board 120. According to an embodiment of the present invention, the flexible circuit board 120 is polyimide (PI) and/or polyethylene terephthalate. A polyester terephthalate (PET) is formed, and the flexible circuit board 120 is rotated by the plurality of rollers 12. And move in the U-shaped slot.
複數非可溶性陽極13設置於U型槽11的內壁上；依據本發明之實施例，各複數非可溶性陽極13為一混合金屬氧化物(mixed metal oxide,MMO)，其由一鈦金屬芯(titanium)表面塗覆10~12g/m2的銥氧化物(IrO2)而構成，在本發明之實施例中，各複數非可溶性陽極13復包括一陽極網狀過 濾器(anode mask filter)131，其可由至少一鈦金屬籃(titanium baskets)所構成，用以防止電鍍時複數非可溶性陽極13之氧化物等微粒汙染軟性電路板120產生之氧化物等微粒汙染軟性電路板120。 A plurality of non-soluble anodes 13 are disposed on the inner wall of the U-shaped groove 11; in accordance with an embodiment of the present invention, each of the plurality of non-soluble anodes 13 is a mixed metal oxide (MMO) composed of a titanium metal core ( Titanium) is coated with 10 to 12 g/m 2 of cerium oxide (IrO 2 ). In the embodiment of the present invention, each of the plurality of non-soluble anodes 13 includes an anode mask filter 131. It may be composed of at least one titanium metal basket to prevent particulates such as oxides of the non-soluble anode 13 from contaminating the soft circuit board 120 by particles such as oxide generated by the flexible circuit board 120 during plating.
複數噴嘴陣列14設置於複數非可溶性陽極13上，使其與複數非可溶性陽極13有同樣的電極性；依據本發明之實施例，複數噴嘴陣列14由200個戟狀噴嘴所構成，是在軟性電路板120輸入U型槽11與輸出U型槽時呈垂直方向的期間，複數噴嘴陣列14對軟性電路板120進行雙面含銅物質噴鍍。 The plurality of nozzle arrays 14 are disposed on the plurality of non-soluble anodes 13 to have the same polarity as the plurality of non-soluble anodes 13. According to an embodiment of the present invention, the plurality of nozzle arrays 14 are composed of 200 dome-shaped nozzles, which are soft. While the circuit board 120 is input in the vertical direction when the U-shaped groove 11 and the output U-shaped groove are output, the complex nozzle array 14 performs double-sided copper-containing substance sputtering on the flexible circuit board 120.
銅離子感測器15設置於U型槽11中，用以感測U型槽11中的銅離子濃度是否落於正常數值的範疇之內，且產生一感測值；依據本發明之實施例，復包括一銅離子產生器150，銅離子產生器150連接至銅離子感測器15，且依據銅離子感測器15的感測值輸入至少一銅離子至U型槽11中，用以補充電鍍時電鍍液耗損的銅離子，使U型槽11中的銅離子濃度穩定，以維護連續鍍膜期間的品質；其中，銅離子產生器150可包括一氧化銅分解裝置、一碳酸銅分解裝置、一硫酸銅分解裝置之其中一者及其組合，在本發明之實施例中，銅離子產生器150為氧化銅(CuOx)分解裝置。 The copper ion sensor 15 is disposed in the U-shaped groove 11 for sensing whether the concentration of copper ions in the U-shaped groove 11 falls within a range of normal values, and generates a sensing value; according to an embodiment of the present invention The copper ion generator 150 is connected to the copper ion sensor 15 and the at least one copper ion is input into the U-shaped groove 11 according to the sensed value of the copper ion sensor 15 for The copper ions consumed by the plating solution during the plating are supplemented to stabilize the copper ion concentration in the U-shaped groove 11 to maintain the quality during continuous coating; wherein the copper ion generator 150 may include a copper oxide decomposition device and a copper carbonate decomposition device. One of the copper sulfate decomposition apparatuses and combinations thereof, in the embodiment of the invention, the copper ion generator 150 is a copper oxide (CuO x ) decomposition apparatus.
依據本發明之實施例，U型槽11的底部設置有二幫浦16，二幫浦16分別設置於U型槽11底部的相對角落，用以防止電鍍時複數非可溶性陽極13之氧化物等微粒汙染軟性電路板120。 According to an embodiment of the present invention, the bottom of the U-shaped groove 11 is provided with two pumps 16, and the two pumps 16 are respectively disposed at opposite corners of the bottom of the U-shaped groove 11 to prevent oxides of the plurality of non-soluble anodes 13 during plating. The particles contaminate the flexible circuit board 120.
依據本發明之實施例，入料潔淨槽20設置於U型槽11的入料口111，且具有一第一陰極滾輪21以及與第一陰極滾輪21之滾動方向相反的一第二陰極滾輪22，其中，第一陰極滾輪21與第二陰極滾輪22並列設置於入料潔淨槽20中，且沿水平方向移動軟性電路板120至入料口111內，其中，第一陰極滾輪21接觸軟性電路板120的上表面，第二陰極滾輪22接觸軟性電路板120的下表面，用以潔淨未鍍銅之軟性電路板120的上、下表面，且使軟性電路板120帶有與第一陰極滾輪21、第二陰極滾輪22相同的電極性。 According to an embodiment of the present invention, the feed cleaning tank 20 is disposed at the inlet 111 of the U-shaped groove 11 and has a first cathode roller 21 and a second cathode roller 22 opposite to the rolling direction of the first cathode roller 21. The first cathode roller 21 and the second cathode roller 22 are juxtaposed in the feed cleaning tank 20, and move the flexible circuit board 120 into the inlet port 111 in the horizontal direction, wherein the first cathode roller 21 contacts the flexible circuit. On the upper surface of the board 120, the second cathode roller 22 contacts the lower surface of the flexible circuit board 120 for cleaning the upper and lower surfaces of the unplated flexible circuit board 120, and the flexible circuit board 120 is provided with the first cathode roller 21. The second cathode roller 22 has the same polarity.
依據本發明之實施例，出料潔淨槽30設置於U型槽11的出料口112，且具有一第三陰極滾輪31以及與第三陰極滾輪31之滾動方向相反的一第四陰極滾輪42，其中，第三陰極滾輪31與第四陰極滾輪32並列設 置於出料潔淨槽30中，且由出料口112沿水平方向移出軟性電路板120，其中，第三陰極滾輪31接觸軟性電路板120的上表面，第四陰極滾輪32接觸軟性電路板120的下表面，用以潔淨已鍍銅之軟性電路板120的上、下表面，且使軟性電路板120帶有與第三陰極滾輪31、第四陰極滾輪32相同的電極性。 According to an embodiment of the present invention, the discharge cleaning tank 30 is disposed at the discharge port 112 of the U-shaped groove 11 and has a third cathode roller 31 and a fourth cathode roller 42 opposite to the rolling direction of the third cathode roller 31. Wherein the third cathode roller 31 and the fourth cathode roller 32 are juxtaposed It is placed in the discharge cleaning tank 30, and is removed from the flexible circuit board 120 in the horizontal direction by the discharge port 112, wherein the third cathode roller 31 contacts the upper surface of the flexible circuit board 120, and the fourth cathode roller 32 contacts the flexible circuit board 120. The lower surface is used to clean the upper and lower surfaces of the copper-plated flexible circuit board 120, and the flexible circuit board 120 has the same electrical polarity as the third cathode roller 31 and the fourth cathode roller 32.
依據本發明之實施例，復包括至少一伺服馬達40及一逆滲透(reverse osmosis,RO)純水裝置50，至少一伺服馬達40設置於電鍍膜組10之入料口111及/或出料口112，且用以移動軟性電路板120；逆滲透純水裝置50連接至入料潔淨槽20及/或出料潔淨槽30，在本發明之實施例中，入料潔淨槽20及/或出料潔淨槽30設置有去離子水，逆滲透純水裝置50用以持續對入料潔淨槽20及/或出料潔淨槽30供應去離子水，以維護潔淨效能與鍍膜品質。 According to an embodiment of the present invention, at least one servo motor 40 and a reverse osmosis (RO) pure water device 50 are included, and at least one servo motor 40 is disposed at the inlet port 111 of the plating film group 10 and/or discharged. The port 112 is used to move the flexible circuit board 120; the reverse osmosis pure water device 50 is connected to the feed cleaning tank 20 and/or the discharge cleaning tank 30. In the embodiment of the present invention, the feed cleaning tank 20 and/or The discharge clean tank 30 is provided with deionized water, and the reverse osmosis pure water device 50 is used to continuously supply deionized water to the feed clean tank 20 and/or the discharge clean tank 30 to maintain clean performance and coating quality.
請參閱圖5所示，在使用本發明之用於軟性電路板的捲對捲雙面電解鍍銅裝置時，係包括下列步驟：一入料潔淨步驟(S1)，係藉由入料潔淨槽的第一陰極滾輪及第二陰極滾輪沿水平方向移動軟性電路板，以潔淨軟性電路板的上表面及下表面；一向下電鍍步驟(S2)，係將軟性電路板由入料潔淨槽移動至U型槽的入料口內，使軟性電路板沿垂直方向向下移動，且藉由設置於U型槽內之複數非可溶性陽極上的複數噴嘴陣列對軟性電路板進行鍍銅步驟；一向上電鍍步驟(S3)，係使軟性電路板沿垂直方向向上移動，藉由設置於U型槽內之複數非可溶性陽極上的複數噴嘴陣列對軟性電路板進行鍍銅步驟，且將軟性電路板由U型槽的出料口移動至出料潔淨槽內；以及一出料潔淨步驟(S4)，係藉由出料潔淨槽的第三陰極滾輪及第四陰極滾輪沿水平方向移動軟性電路板，以潔淨軟性電路板的上表面及下表面。 Referring to FIG. 5, when the roll-to-roll double-sided electrolytic copper plating apparatus for a flexible circuit board of the present invention is used, the following steps are included: a feed cleaning step (S1), which is performed by a feed cleaning tank. The first cathode roller and the second cathode roller move the flexible circuit board in the horizontal direction to clean the upper surface and the lower surface of the flexible circuit board; a downward plating step (S2) moves the flexible circuit board from the feed cleaning slot to The flexible circuit board is moved downward in the vertical direction in the inlet of the U-shaped groove, and the flexible circuit board is subjected to a copper plating step by a plurality of nozzle arrays disposed on the plurality of non-soluble anodes in the U-shaped groove; The electroplating step (S3) moves the flexible circuit board upward in the vertical direction, and the soft circuit board is subjected to a copper plating step by a plurality of nozzle arrays disposed on the plurality of non-soluble anodes in the U-shaped groove, and the flexible circuit board is The discharge port of the U-shaped groove moves into the discharge cleaning tank; and a discharge cleaning step (S4) moves the flexible circuit board horizontally by the third cathode roller and the fourth cathode roller of the discharge cleaning tank. Clean and soft Upper and lower surfaces of the circuit board.
在實際操作本發明時，係可依需求連續串接多組設備以進行連續鍍膜操作，請參閱圖2所示。 In the actual operation of the present invention, a plurality of sets of equipment can be continuously connected in series for continuous coating operation as required, as shown in FIG.
由於本發明是採用結合水平式與垂直式的複合式(hybrid)製程設備，複數噴嘴陣列14與U型槽11的設計可在兼顧製程速度的同時，讓鍍膜受地心引力的影響降到最低，而可兼顧鍍膜厚度的均勻性，此外，陰極的電極性是以入、出料潔淨槽20、30的複數陰極滾輪進行接配，可簡化並縮小電鍍裝置的體積；以及，U型槽11底部設置的二幫浦16及各複數 非可溶性陽極13復包括一陽極網狀過濾器131可防止電鍍時複數非可溶性陽極13之氧化物等微粒汙染軟性電路板120產生之氧化物等微粒汙染軟性電路板120；因此，本發明可達到快速生產且鍍膜品質佳的目的。 Since the present invention employs a combination of horizontal and vertical hybrid process equipment, the complex nozzle array 14 and the U-shaped groove 11 are designed to minimize the influence of the gravity of the coating while balancing the process speed. Moreover, the uniformity of the thickness of the coating can be achieved, and the polarity of the cathode is matched by a plurality of cathode rollers of the inlet and outlet cleaning tanks 20, 30, which can simplify and reduce the volume of the plating apparatus; and, the U-shaped groove 11 The second set of 16 and the plural The non-soluble anode 13 includes an anode mesh filter 131 to prevent particles such as oxides of the non-soluble anode 13 from contaminating the flexible circuit board 120 by particles such as oxides generated by the flexible circuit board 120 during plating; therefore, the present invention can attain Rapid production and good coating quality.
儘管已參考本申請的許多說明性實施例描述了實施方式，但應瞭解的是，本領域技術人員能夠想到多種其他改變及實施例，這些改變及實施例將落入本公開原理的精神與範圍內。尤其是，在本公開、圖式以及所附申請專利範圍的範圍內，對主題結合設置的組成部分及/或設置可作出各種變化與修飾。除對組成部分及/或設置做出的變化與修飾之外，可替代的用途對本領域技術人員而言將是顯而易見的。 Although the embodiments have been described with reference to the embodiments of the present invention, it will be understood that Inside. In particular, various changes and modifications can be made in the components and/or arrangements of the subject combination. Alternative uses will be apparent to those skilled in the art, in addition to variations and modifications in the component parts and/or arrangements.
10‧‧‧電鍍模組 10‧‧‧ plating module
11‧‧‧U型槽 11‧‧‧U-shaped slot
111‧‧‧入料口 111‧‧‧Inlet
112‧‧‧出料口 112‧‧‧Outlet
12‧‧‧滾筒 12‧‧‧Roller
120‧‧‧軟性電路板 120‧‧‧Soft circuit board
13‧‧‧非可溶性陽極 13‧‧‧Non-soluble anode
131‧‧‧陽極網狀過濾器 131‧‧‧Anode mesh filter
14‧‧‧噴嘴陣列 14‧‧‧Nozzle array
15‧‧‧銅離子感測器 15‧‧‧Copper ion sensor
16‧‧‧幫浦 16‧‧‧
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104131168A TW201712163A (en) | 2015-09-21 | 2015-09-21 | Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104131168A TW201712163A (en) | 2015-09-21 | 2015-09-21 | Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI563130B TWI563130B (en) | 2016-12-21 |
| TW201712163A true TW201712163A (en) | 2017-04-01 |
Family
ID=58227429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104131168A TW201712163A (en) | 2015-09-21 | 2015-09-21 | Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201712163A (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4957906B2 (en) * | 2007-07-27 | 2012-06-20 | 上村工業株式会社 | Continuous electrolytic copper plating method |
| TWI513859B (en) * | 2013-08-30 | 2015-12-21 | Flex Tek Co Ltd | Electroplating apparatus for manufacturing flexible printed circuit board |
| CN104775146A (en) * | 2015-03-06 | 2015-07-15 | 东莞宇宙电路板设备有限公司 | Reel-to-reel continuous horizontal high-current electroplating system |
-
2015
- 2015-09-21 TW TW104131168A patent/TW201712163A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI563130B (en) | 2016-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104109848A (en) | Environmentally-friendly chemical gilding liquid | |
| CN1982503B (en) | Metallization of dielectrics | |
| CN104342746A (en) | Electrolytic copper foil, cleaning liquid composition and method for cleaning copper foil | |
| JP5673582B2 (en) | Pretreatment method for electroplating and method for producing copper clad laminated resin film by electroplating method including the pretreatment method | |
| CN107268050A (en) | A kind of method of the nickel plating on aluminium and aluminum alloy coiled materials | |
| CN107723766A (en) | The two-sided electrolytic copper plating device of volume to volume and its copper electroplating method for flexible circuit board | |
| JP5774669B2 (en) | Plating equipment for manufacturing flexible printed circuit boards | |
| JP2012057191A (en) | Method for electroplating long conductive substrate, method for manufacturing copper-coated long conductive substrate using the method and roll-to-roll type electroplating apparatus | |
| CN203923419U (en) | A kind of electroplating device that is applicable to the anti-upper copper crystallization of RTR negative electrode conductive casters | |
| TWM517500U (en) | Roll-to-roll double-sided electrolysis copper device for flexible printed circuit board | |
| CN104775146A (en) | Reel-to-reel continuous horizontal high-current electroplating system | |
| TWI359215B (en) | Device and method for electrolytically treating fl | |
| TW201712163A (en) | Roll-to-roll double-sided electrolytic copper plating device for flexible circuit board and copper plating method thereof which comprises a U-shaped tank, a plurality of rollers, a plurality of non-soluble anodes, a plurality of nozzle arrays, a copper ion sensor; a feed port cleaning tank and a discharge port cleaning tank | |
| CN101513632A (en) | Method for coating Teflon on metal sheet | |
| CN1174249A (en) | Jet electroplating method | |
| CN102776495A (en) | Chemical nickel-plating method for capacitive touch screen indium tin oxide (ITO) wiring | |
| CN206970715U (en) | A kind of chemical nickel and gold production line | |
| WO2023040116A1 (en) | Circuit board processing method and circuit board | |
| CN202465928U (en) | Anode baffling plate | |
| JP5304664B2 (en) | Continuous electrolytic plating apparatus, continuous electrolytic plating method and metallized resin film manufacturing method | |
| CN101967672A (en) | Plating tank liquid medicine filtering system | |
| KR101681663B1 (en) | Conductive Pattern Laminate and Producing Method Thereof | |
| CN212864969U (en) | Jet flow device for IC carrier plate chemical plating | |
| CN114900980A (en) | Flexible circuit board and method and system for removing inner layer glue residue of flexible circuit board | |
| JP2017222907A (en) | Plating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |