TW201712094A - Adhesive composition, anisotropic conductive adhesive composition, connection material for circuit and connection body preferably free of epoxy resin-based cationic polymerization hardener and having high bonding characteristics - Google Patents

Abstract

The present invention is related to an adhesive composition, comprising (a) a thermoplastic resin, (b) a free radical polymerizing compound, (c) a free radical polymerization initiator, and (d) an epoxy resin having no (meth) acryloyloxy group, and the adhesive composition is substantially free of an epoxy resin-based cationic polymerization hardener.

Description

Subsequent composition, anisotropic conductive adhesive composition, circuit connecting member and connecting body

The present invention relates to an adhesive composition, an anisotropic conductive adhesive composition, a circuit connecting material, and a connector.

In the semiconductor element or the liquid crystal display element, various adhesive compositions have been used as circuit connecting materials from the prior purpose for the purpose of bonding various members in the element. In the adhesive composition, various properties such as heat resistance and reliability in a high-temperature and high-humidity state are required as a representative of the adhesiveness.

The subsequent adherends are an organic material such as a printed wiring board or a polyimide film, a metal such as copper or aluminum, a metal compound such as indium tin oxide (ITO), SiN or SiO ₂ . There are a variety of surfaces formed from a variety of materials. Therefore, the adhesive composition can be designed according to each of the adherends.

In the semiconductor element or the adhesive composition for a liquid crystal display element, a thermosetting resin composition containing a thermosetting resin such as an epoxy resin which exhibits high adhesion and high reliability is known (for example, see Patent Document 1). The adhesive composition usually contains a curing agent such as an epoxy resin, a phenol resin reacted with an epoxy resin, and a thermal latent catalyst that promotes a reaction between the epoxy resin and the curing agent. Among them, the thermal latent catalyst is an important factor determining the hardening temperature and the hardening speed. Therefore, various compounds are used for the thermal latent catalyst from the viewpoint of storage stability at room temperature and curing rate at the time of heating. The adhesive composition is usually cured by heating at a temperature of from 170 ° C to 250 ° C for 1 hour to 3 hours to exhibit desired adhesion.

Further, a radical-curable adhesive comprising a (meth) acrylate derivative and a peroxide has been attracting attention (for example, refer to Patent Document 2). Since the radical hardening type adhesive is reactive with a radical as a reactive species, it is advantageous in terms of short-time hardening.

Further, Patent Document 3 discloses a radical-curable adhesive containing a (meth) acrylate compound having an epoxy group in a molecule. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Laid-Open Patent Publication No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No. No.

[Problems to be solved by the invention]

With the recent increase in the integration of semiconductor elements and the high definition of liquid crystal elements, the pitch between components and between wirings is narrow, and the possibility of heating during hardening of circuit connection adversely affects peripheral components. Increase.

Further, in order to reduce the cost, there is a need to increase the throughput, and it is required to develop an adhesive composition which is cured at a lower temperature and for a short period of time, in other words, a "low temperature fast curing".

In order to achieve low-temperature rapid curing of the adhesive composition, for example, a thermal latent catalyst having a low activation energy is sometimes used in the thermosetting resin composition, but in this case, it is very difficult to maintain at room temperature. Storage stability nearby.

On the other hand, the radical-curable adhesive can achieve low-temperature rapid hardening relatively easily. However, when the connector obtained by using the radical-curable adhesive is exposed to a high-temperature and high-humidity environment, in many cases, the interface between the circuit member and the adhesive is peeled off, and bubbles are generated. One of the reasons is considered to be that the radical-curable adhesive tends to have a large hardening shrinkage as compared with an adhesive containing an epoxy resin.

In the radical-curable adhesive, when the amount of the (meth) acrylate derivative is reduced, the peeling of the interface between the circuit member and the adhesive can be suppressed to some extent. However, in this case, there is a tendency that the bonding strength and the connection reliability are lowered. Further, in particular, when a thin circuit member is connected, in order to prevent breakage of the circuit member, circuit connection under a low voltage condition is required. However, when the circuit is connected under a low voltage condition such as 1 MPa, it is difficult to face the circuit. Since the resin between the electrodes is sufficiently excluded, if it is a conventional radical hardening type adhesive, a satisfactory electrical connection cannot be obtained.

On the other hand, when an epoxy resin and a radically polymerizable compound are used together, radical polymerization is inhibited, and it becomes difficult to harden for a short time.

Patent Document 3 discloses a radical-curable adhesive containing a (meth) acrylate compound having an epoxy group in a molecule, but even if the adhesive is used, for example, under a connection condition at a low temperature such as 140 ° C The adhesion to the adherend was also insufficient, and the generation of bubbles due to the peeling of the interface between the circuit member and the adhesive after the high-temperature and high-humidity test could not be completely suppressed.

The present invention has been made in view of the problems of the prior art, and an object thereof is to provide an adhesive composition which is a radical-curable adhesive and which is at a low temperature (for example, 140 ° C or lower) and a short time (for example, 5) Under the connection conditions of seconds or less, sufficient bonding strength and connection reliability can be maintained, and peeling from the adherend can be suppressed under high temperature and high humidity conditions. [Means for solving the problem]

The present invention provides an adhesive composition comprising (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) having no (meth) acryloxy group An epoxy resin, and the adhesive composition is substantially free of an epoxy resin cationic polymerization hardener. According to such an adhesive composition, sufficient bonding strength and connection reliability can be maintained even under low temperature (for example, 140 ° C or lower) and short time (for example, 5 seconds or less) connection conditions, and under high temperature and high humidity conditions, The peeling from the adherend is suppressed.

The epoxy resin preferably has a biphenyl skeleton. The effect is further increased by containing an epoxy resin having such a skeleton.

The adhesive composition of the present invention may further contain (e) conductive particles. Further, by containing conductive particles, conductivity or anisotropic conductivity can be imparted to the adhesive composition, so that the adhesive composition can be more preferably used as a circuit connecting material. Further, the connection resistance between the circuit electrodes electrically connected via the adhesive composition can be more easily reduced.

Further, the present invention provides an anisotropic conductive adhesive composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound, (c) a radical polymerization initiator, and (d) having no (methyl group) An epoxy resin having an acryloxy group and (e) an electroconductive particle, and the adhesive composition substantially does not contain a cationically polymerizable curing agent of an epoxy resin. Here, the epoxy resin preferably has a biphenyl skeleton.

Further, the present invention provides a circuit connecting material comprising the adhesive composition or an anisotropic conductive adhesive composition, and the circuit connecting material is for using circuit members having circuit electrodes with each other as respective circuit members The manner in which the circuit electrodes are electrically connected to each other is followed.

In addition, the present invention provides a connector including: a first circuit member having a first circuit electrode formed on a main surface of the first circuit substrate; and a second circuit member having a first surface formed on the main surface of the second circuit substrate a second circuit electrode, wherein the second circuit electrode and the first circuit electrode are disposed opposite to each other; and a connecting member disposed between the first circuit member and the second circuit member, the first circuit member and the second The circuit member is electrically connected; and the connecting member is a cured composition of the adhesive composition or the anisotropic conductive adhesive composition of the present invention. Further, here, preferably, one of the first circuit substrate and the second circuit substrate is a glass substrate.

In the connector of the present invention, since the connecting member electrically connecting the first circuit member and the second circuit member is composed of the adhesive composition of the present invention or the cured product of the anisotropic conductive adhesive composition, it is maintained. It has sufficient bonding strength and connection reliability, and sufficiently suppresses peeling of the adhesive under high temperature and high humidity conditions. [Effects of the Invention]

According to the present invention, it is possible to provide an adhesive composition which is a radical-curable adhesive and which maintains sufficient adhesion even under low-temperature (for example, 140 ° C or lower) and short-time (for example, 5 seconds or less) connection conditions. Strength and connection reliability, and peeling from the adherend can be suppressed under high temperature and high humidity conditions.

Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In the drawings, the same or corresponding portions are designated by the same reference numerals, and the repeated description is omitted as appropriate. Further, in the present specification, (meth)acrylic means acrylic acid or methacrylic acid corresponding thereto. Other similar performances such as (meth) acrylate are also the same.

The adhesive composition of the present embodiment contains (a) a thermoplastic resin, (b) a radical polymerizable compound, (c) a radical polymerization initiator, and (d) an epoxy having no (meth) acryloxy group. Resin.

The adhesive composition is preferably a cationically polymerized hardener substantially free of epoxy resin. Here, the cationically polymerizable curing agent which does not substantially contain an epoxy resin means that the content of the cationically polymerizable curing agent of the epoxy resin is less than 1.5 parts by mass based on 100 parts by mass of the total of the components (a) and (b). It is preferably less than 1.0 part by mass, more preferably less than 0.5 part by mass, and further preferably a cationically polymerized hardener which does not contain an epoxy resin.

The cationic polymerization hardening agent of the epoxy resin means a Bronsted acid, a Lewis acid, and a compound which can generate these acids by energy such as heat or light. Examples of the cationically polymerizable curing agent of the epoxy resin include an onium salt and the like.

The (a) thermoplastic resin may, for example, be selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a poly(meth)acrylic resin, a polyester resin, a polyurethane resin, and a polyester. One or two or more resins of a urethane resin and a polyvinyl butyral resin.

The lower limit of the weight average molecular weight of the thermoplastic resin may be 5,000 or more, or may be 10,000 or more. When the weight average molecular weight of the thermoplastic resin is 5,000 or more, the adhesive strength of the adhesive composition tends to increase. On the other hand, the upper limit of the weight average molecular weight of the thermoplastic resin may be 400,000 or less, may be 200,000 or less, or may be 150,000 or less. When the weight average molecular weight of the thermoplastic resin is 400,000 or less, good compatibility with other components tends to be easily obtained, and the fluidity of the adhesive tends to be easily obtained. The weight average molecular weight of the thermoplastic resin is preferably from 5,000 to 400,000, more preferably from 5,000 to 200,000, still more preferably from 10,000 to 150,000.

For the purpose of stress relaxation and adhesion improvement, a thermoplastic resin may also be used as the thermoplastic resin.

The content of the thermoplastic resin is preferably 20 parts by mass to 80 parts by mass, more preferably 30 parts by mass to 70 parts by mass, even more preferably 35 parts by mass based on 100 parts by mass of the total of the components (a) and (b). Parts to 65 parts by mass. When the content of the thermoplastic resin is 20 parts by mass or more, the adhesive strength tends to be improved or the film formability of the adhesive composition tends to be improved. When the content is 80 parts by mass or less, the fluidity of the adhesive tends to be easily obtained.

The adhesive composition of the present embodiment may contain any compound as (b) a radically polymerizable compound. The radical polymerizable compound may be, for example, any of a monomer and an oligomer of a compound described later, or both.

The compound is preferably one or two or more polyfunctional (meth) acrylate compounds having two or more (meth) acryloxy groups. Examples of such a (meth) acrylate compound include epoxy (meth) acrylate, (meth) acrylate urethane, polyether (meth) acrylate, and polyester (meth) acrylate. , polyalkylene glycol di(meth)acrylate such as trimethylolpropane tri(meth)acrylate or polyethylene glycol di(meth)acrylate, dicyclopentenyl (meth)acrylate, Dicyclopentenyloxyethyl methacrylate, neopentyl glycol di(meth) acrylate, dipentaerythritol hexa(meth) acrylate, iso-cyanuric acid modified difunctional (meth) acrylate And iso-cyanuric acid modified trifunctional (meth) acrylate. Examples of the epoxy (meth) acrylate include epoxy (meth) acrylate obtained by adding (meth)acrylic acid to two glycidyl groups of bisphenol hydrazine diglycidyl ether, and p-bisphenol. A compound in which a (meth)acryloxy group is introduced into a compound in which two glycidyl groups of hydrazine glycidyl ether are added to ethylene glycol and/or propylene glycol is introduced. These compounds may be used alone or in combination of two or more.

Further, for the purpose of adjusting the fluidity and the like, the adhesive composition may also contain a monofunctional (meth) acrylate compound as the (b) radically polymerizable compound. Examples of the monofunctional (meth) acrylate compound include pentaerythritol (meth) acrylate, 2-cyanoethyl (meth) acrylate, cyclohexyl (meth) acrylate, and dicyclopentyl (meth) acrylate. Ester ester, dicyclopentenyloxyethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-hexyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, isobornyl (meth)acrylate, ( Isodecyl methacrylate, isooctyl (meth)acrylate, n-lauryl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate Ester, tetrahydrofurfuryl (meth) acrylate, 2-(methyl) propylene methoxyethyl phosphate, N, N-dimethylaminoethyl (meth) acrylate, (meth) acrylate N, N-dimethylaminopropyl acrylate, a glycidyl group-containing (meth) acrylate obtained by reacting a glycidyl group of an epoxy resin having a plurality of glycidyl groups with (meth)acrylic acid, and (Meth)propenyl morpholine. These compounds may be used alone or in combination of two or more.

Further, for the purpose of improving the crosslinking ratio, etc., the adhesive composition may further contain a compound having a radical polymerizable functional group such as an allyl group, a maleimide group, or a vinyl group as (b) a radical. Polymeric compound.

For the purpose of improving the adhesion strength, the adhesive composition preferably contains a radically polymerizable compound having a phosphoric acid group as (b) a radically polymerizable compound. The radically polymerizable compound having a phosphoric acid group may, for example, be a compound represented by the following formula (1), formula (2) or formula (3).

[Chemical 1] In the formula (1), R ⁵ represents a hydrogen atom or a methyl group, R ⁶ represents a (meth)acryloxy group, and w and x each independently represent an integer of 1 to 8. Further, a plurality of R ⁵ , R ⁶ , w and x in the same molecule may be the same or different.

[Chemical 2] In the formula (2), R ⁷ represents a (meth)acryloxy group, and y and z each independently represent an integer of 1 to 8. A plurality of R ⁷ , y and z in the same molecule may be the same or different.

[Chemical 3] In the formula (3), R ⁸ represents a hydrogen atom or a methyl group, R ⁹ represents a (meth)acryloxy group, and b and c each independently represent an integer of 1 to 8. A plurality of R ⁸ and b in the same molecule may be the same or different.

Examples of the radically polymerizable compound having a phosphoric acid group include acid phosphonium oxyethyl (meth) acrylate, acid phosphonoxy propyl (meth) acrylate, and acid phosphonium oxy group. Oxyethylene glycol mono(meth)acrylate, acid phosphoniumoxypolyoxypropylene glycol mono(meth)acrylate, 2,2'-di(methyl)propenyloxydiethyl phosphate, EO ( Ethylene oxide) modified phosphoric acid di(meth)acrylate, phosphoric acid modified epoxy (meth) acrylate and vinyl phosphate. These compounds may be used alone or in combination of two or more.

The content of the radically polymerizable compound having a phosphate group is preferably from 0.1 part by mass to 15 parts by mass, more preferably from 0.5 part by mass to 10 parts by mass, per 100 parts by mass of the total of the component (a) and the component (b). Further, it is preferably 1 part by mass to 5 parts by mass. When the content of the radically polymerizable compound having a phosphate group is 0.1 part by mass or more, high adhesion strength tends to be easily obtained, and when it is 15 parts by mass or less, physical properties of the adhesive composition after curing are less likely to be lowered, and it is reliable. The effect of improving the sex becomes good.

The total content of the (b) radically polymerizable compound contained in the adhesive composition is preferably 20 parts by mass to 80 parts by mass, more preferably 100 parts by mass based on the total amount of the component (a) and the component (b). It is 30 parts by mass to 70 parts by mass, and more preferably 35 parts by mass to 65 parts by mass. When the total content is 20 parts by mass or more, the heat resistance tends to be improved. When the total content is 80 parts by mass or less, the effect of suppressing the peeling after standing in a high-temperature and high-humidity environment tends to increase.

(c) The radical polymerization initiator can be arbitrarily selected from compounds such as peroxides and azo compounds. From the viewpoint of stability, reactivity, and compatibility, a peroxide having a one-minute half-life temperature of from 90 ° C to 175 ° C and a molecular weight of from 180 to 1,000 is preferred. The "1 minute half-life temperature" means a temperature at which the half life of the peroxide is 1 minute. The "half-life" refers to the time until the concentration of the compound decreases to half of the initial value at a specific temperature.

The radical polymerization initiator is, for example, one or more compounds selected from the group consisting of perylene neodecanoic acid 1,1,3,3-tetramethylbutyl ester, and di(4-tert-butyl peroxydicarbonate). Cyclohexyl)ester, di(2-ethylhexyl)peroxydicarbonate, cumyl peroxy neodecanoate, 1,1,3,3-tetramethylbutyl peroxy neodecanoate, dilaurate peroxide醯, 1-cyclohexyl-1-methylethyl peroxy neodecanoate, third hexyl peroxy neodecanoate, tert-butyl peroxy neodecanoate, tert-butyl peroxypivalate, 1,1,3,3-tetramethylbutyl oxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2-ethylhexylperoxy)hexane, Third hexyl oxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxy neoheptanoate, third amyl peroxy-2-ethylhexanoate , di-tert-butyl hexahydroterephthalate, triamyl peroxy-3,5,5-trimethylhexanoate, 3-hydroxy-1,1-dimethyl peroxy neodecanoate Butyl ester, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, third amyl peroxy neodecanoate, third amyl peroxy-2-ethylhexanoate, Peroxidation 3 -methyl benzamidine, 4-methylbenzhydryl peroxide, bis(3-methylbenzhydryl) peroxide, dibenzoyl peroxide, bis(4-methylbenzhydrazide), 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobis(1-acetoxy-1-phenylethane), 2,2'-azo Biisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), dimethyl-2,2'-azobisisobutyronitrile, 4,4'-azobis(4-cyano Valeric acid), 1,1'-azobis(1-cyclohexanecarbonitrile), hexyl isopropyl monocarbonate, tert-butyl peroxy maleate, peroxidation 3,5,5-trimethylhexanoic acid tert-butyl ester, butyl laurate tributyl acrylate, 2,5-dimethyl-2,5-bis(3-methylbenzhydryl peroxide) Hexane, tert-butyl peroxy-2-ethylhexyl monocarbonate, third hexyl peroxybenzoate, 2,5-dimethyl-2,5-bis(benzimidyl peroxy)hexane Third butyl peroxybenzoate, dibutyl trimethyl adipate, third amyl peroxyoctanoate, third amyl peroxyisophthalate and third amyl peroxybenzoate.

The content of the radical polymerization initiator is preferably from 1 part by mass to 15 parts by mass, more preferably from 2.5 part by mass to 10 parts by mass, based on 100 parts by mass of the total of the components (a) and (b). It is preferably from 3 parts by mass to 8 parts by mass.

(d) Examples of the epoxy resin having no (meth) propylene fluorenyloxy group include a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, and a phenol novolak type ring. Oxygen resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidylamine Epoxy resin, intramethylene urea resin, isocyanurate epoxy resin, aromatic polycyclic epoxy resin, aliphatic chain epoxy resin, aliphatic polycyclic epoxy resin, An epoxy resin or the like having a biphenyl skeleton. The epoxy resins may be halogenated or hydrogenated. Among these, from the viewpoint of further improving the connection reliability, an aromatic polycyclic epoxy resin and an epoxy resin having a biphenyl skeleton are preferable, and an epoxy resin having a biphenyl skeleton is more preferable. These may be used alone or in combination of two or more.

The lower limit of the molecular weight of the epoxy resin having no (meth) acryloxy group may be 250 or more, 300 or more, or 350 or more. When the molecular weight is 250 or more, when the adhesive composition is used as a film-like adhesive, the amount of evaporation of the epoxy resin in the drying step is small. On the other hand, the upper limit of the molecular weight of the epoxy resin having no (meth) acryloxy group may be 5,000 or less, may be 3,000 or less, or may be 1,000 or less. When the molecular weight is 5,000 or less, the fluidity of the adhesive tends to be sufficiently obtained. From the above viewpoint, the molecular weight of the epoxy resin having no (meth) propylene fluorenyloxy group is preferably from 250 to 5,000, more preferably from 300 to 3,000, still more preferably from 350 to 1,000.

The lower limit of the epoxy equivalent of the epoxy resin having no (meth) acryloxy group may be 100 or more, 150 or more, or 180 or more. When the epoxy equivalent is 100 or more, the connection reliability of the adhesive composition tends to be further improved. On the other hand, the upper limit of the epoxy equivalent of the epoxy resin having no (meth) acryloxy group may be 300 or less, may be 275 or less, or may be 270 or less. When the epoxy equivalent is 300 or less, the adhesion to the glass tends to increase. From the above viewpoint, the epoxy resin having no (meth) propylene fluorenyloxy group preferably has an epoxy equivalent of from 100 to 300, more preferably from 150 to 275, still more preferably from 180 to 270.

The lower limit of the content of the epoxy resin having no (meth) acryloxy group may be 1 part by mass or more, or 2.5 mass, based on 100 parts by mass of the total of the components (a) and (b). In parts or more, it may be 3 parts by mass or more. When the content is 1 part by mass or more, the effect of the present invention tends to be obtained at a higher level. On the other hand, the upper limit of the content of the epoxy resin having no (meth) propylene fluorenyl group may be 15 parts by mass or less based on 100 parts by mass of the total of the components (a) and (b). It can be 10 parts by mass or less. When the content is 15 parts by mass or less, it tends to be less likely to inhibit radical polymerization when it is used under conditions of low temperature and short time. In view of the above, the content of the epoxy resin having no (meth) acryloxy group is preferably from 1 part by mass to 15 parts by mass based on 100 parts by mass of the total of the components (a) and (b). The portion is more preferably 2.5 parts by mass to 10 parts by mass, still more preferably 3 parts by mass to 10 parts by mass.

The adhesive composition of the present embodiment may also contain a silane coupling agent. The decane coupling agent is preferably a compound represented by the following formula (4).

[Chemical 4] In the formula (4), R ¹ , R ² and R ³ each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkoxycarbonyl group having 1 to 5 carbon atoms. Or aryl. At least one of R ¹ , R ² and R ³ is an alkoxy group. R ⁴ represents a (meth) acrylonitrile group, a (meth) propylene fluorenyl group, a vinyl group, an isocyanato group, an imidazolyl group, a fluorenyl group, an amine group which may be substituted with an amino group, a methylamino group, and Methylamino, benzylamino, phenylamino, cyclohexylamino, morpholinyl, piperazinyl, ureido, glycidyl or glycidoxy. a represents an integer of 0 to 10.

Examples of the decane coupling agent of the formula (4) include vinyltrimethoxydecane, vinyltriethoxydecane, 3-glycidoxypropyltrimethoxydecane, and 3-glycidoxypropylmethyl. Diethoxydecane, 3-(meth)acryloxypropylmethyldimethoxydecane, 3-(methyl)propenyloxypropyltrimethoxydecane, 3-(methyl)propene醯oxypropylmethyldiethoxydecane, 3-(methyl)propenyloxypropyltriethoxydecane, N-2-(aminoethyl)-3-aminopropylmethyl Dimethoxydecane, N-phenyl-3-aminopropyltrimethoxydecane, 3-ureidopropyltriethoxydecane, 3-mercaptopropyltrimethoxydecane, and 3-isocyanatepropyl Triethoxydecane. These compounds may be used alone or in combination of two or more.

The content of the decane coupling agent is preferably from 0.1 part by mass to 10 parts by mass, more preferably from 0.25 part by mass to 5 parts by mass, per 100 parts by mass of the total of the component (a) and the component (b). When the content of the decane coupling agent is 0.1 parts by mass or more, the effect of suppressing the peeling of the interface between the circuit member and the circuit connecting material and the generation of bubbles tends to be further increased. When the content of the decane coupling agent is 10 parts by mass or less, There is a tendency that the pot life of the adhesive composition becomes long. Further, when the decane coupling agent has a radical polymerizable functional group such as an acrylonitrile group (acryloxy group), the radical polymerizable compound is contained in the component (b).

The adhesive composition of the present embodiment may further contain (e) conductive particles. The adhesive composition containing conductive particles can be particularly preferably used as an anisotropic conductive adhesive composition.

Examples of the conductive particles include metal particles such as Au, Ag, Pd, Ni, Cu, and solder, and carbon particles. Further, the conductive particles may be composite particles having a core particle including a non-conductive material such as glass, ceramic, or plastic, and a conductive layer such as a metal, a metal particle, or a carbon coated with the core particle. . The metal particles may be particles having copper particles and a silver layer covering the copper particles. The core particles of the composite particles are preferably plastic particles.

The composite particles in which the plastic particles are used as the core particles have deformability which is deformed by heating and pressurization. Therefore, when the circuit members are connected to each other, the circuit electrodes of the circuit member can be brought into contact with the conductive particles. The area has increased. Therefore, according to the adhesive composition containing these composite particles as the conductive particles, a linker which is more excellent in connection reliability can be obtained.

The subsequent composition may further include insulating-coated conductive particles having the conductive particles and at least a part of an insulating layer or insulating particles covering a surface of the conductive particles. The insulating layer can be provided by a method such as hybridization. The insulating layer or the insulating particles are formed of an insulating material such as a polymer resin. By coating the conductive particles with such insulation, it is less likely to cause a short circuit caused by the adjacent conductive particles.

The average particle diameter of the conductive particles is preferably from 1 μm to 18 μm from the viewpoint of obtaining good dispersibility and conductivity.

The content of the conductive particles is preferably from 0.1% by volume to 30% by volume, more preferably from 0.1% by volume to 10% by volume, even more preferably from 0.5% by volume to 7.5% by volume, based on the total volume of the adhesive composition. When the content of the conductive particles is 0.1% by volume or more, the conductivity tends to be improved. When the content of the conductive particles is 30% by volume or less, there is a tendency that a short circuit between the circuit electrodes is less likely to occur. The content (% by volume) of the conductive particles is determined based on the volume of each component constituting the adhesive composition before curing at 23 ° C. The volume of each component can be obtained by converting mass into volume by specific gravity. In addition, a suitable solvent (water, alcohol, or the like) which can sufficiently wet the component to be dissolved or swelled can be added to a measuring cylinder or the like, and a component to be measured can be introduced thereinto. The increased volume is taken as the volume of the component.

The subsequent composition may contain insulating organic fine particles or inorganic fine particles in addition to the conductive particles. Examples of the inorganic fine particles include metal oxide fine particles such as silica fine particles, alumina fine particles, cerium oxide-alumina fine particles, titania fine particles, and zirconia fine particles, and nitride fine particles. . Examples of the organic fine particles include fluorenone fine particles, methacrylate-butadiene-styrene fine particles, acrylic acid-fluorenone fine particles, polyamidamide fine particles, and polyimine fine particles. The microparticles may have a uniform structure or a core-shell type structure.

The content of the organic fine particles and the inorganic fine particles is preferably 5 parts by mass to 30 parts by mass, and more preferably 7.5 parts by mass to 20 parts by mass, per 100 parts by mass of the total of the components (a) and (b). When the content of the organic fine particles and the inorganic fine particles is 5 parts by mass or more, the electrical connection between the electrodes is relatively easy to maintain. When the content is 30 parts by mass or less, the fluidity of the adhesive composition tends to be improved. . The subsequent composition may also contain various additives.

When the adhesive composition of the present embodiment is liquid at normal temperature (25 ° C), it can be used in the form of a paste-like adhesive. When the adhesive composition is a solid at normal temperature, it can be used by heating, and it can also be used by gelatinization by adding a solvent. The solvent used for the gelatinization is not particularly limited as long as it does not substantially have reactivity with the adhesive composition (including an additive) and can sufficiently dissolve the adhesive composition.

The adhesive composition of the present embodiment may be formed into a film shape and used as a film-like adhesive. The film-like adhesive can be obtained, for example, by adding a solvent or the like to the adhesive composition or the like as needed to obtain a solution, and applying the solution to a fluororesin film, a polyethylene terephthalate film, or On a release support such as a molded paper, a solvent or the like is removed. A film-like adhesive is more convenient in terms of handling and the like.

FIG. 1 is a schematic cross-sectional view showing an embodiment of a film-like adhesive including the adhesive composition of the present embodiment. The laminated film 100 shown in FIG. 1 includes a support 8 and a film-like adhesive 40 which is peelably laminated on the support 8. The film-like adhesive 40 includes an insulating adhesive layer 5 and conductive particles 7 dispersed in the insulating adhesive layer 5 . The insulating adhesive layer 5 contains components other than the conductive particles in the adhesive composition. According to the film-like adhesive, the operation is easy, and it can be easily provided in the object to be attached, and the connection work can be easily performed. The film-like adhesive may also have a multilayer structure including two or more layers. When the film-like adhesive contains conductive particles, a film-like adhesive can be preferably used as the anisotropic conductive film.

According to the adhesive composition and the film-like adhesive of the present embodiment, the adherends can be usually joined to each other by heating and pressurization. The heating temperature is preferably from 100 ° C to 250 ° C. The pressure is not particularly limited as long as it does not cause damage to the adherend, and is usually preferably 0.1 MPa to 10 MPa. These heating and pressurization are preferably carried out in the range of 0.5 second to 120 seconds. According to the adhesive composition and the film-like adhesive of the present embodiment, for example, under the conditions of 140 ° C and 1 MPa, the adherends can be sufficiently adhered to each other by heating and pressurization for a short time of 5 seconds.

The adhesive composition and the film-like adhesive of the present embodiment can be used as an adhesive for a different type of adherend having a different thermal expansion coefficient. Specifically, the adhesive composition and the film-like adhesive of the present embodiment can be used as a circuit connecting material such as a silver paste or a silver film in addition to the anisotropic conductive adhesive, and the elasticity of a chip scale package (CSP). A semiconductor element such as an elastomer, a CSP underfill material, or a lead on chip (LOC) tape.

The circuit connecting material of the present embodiment contains the above-described adhesive composition or an anisotropic conductive adhesive composition. Such a circuit connecting material can be used to connect circuit members having circuit electrodes to each other in such a manner that circuit electrodes of the respective circuit members are electrically connected to each other.

In the following, an example of the production of the connecting body is described. In this example, the film-like adhesive of the present embodiment is used as the anisotropic conductive film, and the circuit members having the circuit board and the circuit electrodes formed on the main surface of the circuit board are mutually connected. The joined body is connected as a joined body.

FIG. 2 is a schematic cross-sectional view showing an embodiment of a connecting body including a connecting member including a cured product of the adhesive composition of the present embodiment. The connector 1 shown in FIG. 2 includes a first circuit member 20 and a second circuit member 30 that are disposed opposite each other. A connecting member 10 that connects and connects the first circuit member 20 and the second circuit member 30 is provided.

The first circuit member 20 includes a first circuit substrate 21 and a first circuit electrode 22 formed on the main surface 21a of the first circuit substrate 21. An insulating layer may also be formed on the main surface 21a of the first circuit substrate 21.

The second circuit member 30 includes a second circuit substrate 31 and a second circuit electrode 32 formed on the main surface 31a of the second circuit substrate 31. An insulating layer may also be formed on the main surface 31a of the second circuit substrate 31.

The first circuit member 20 and the second circuit member 30 are not particularly limited as long as they have circuit electrodes that are required to be electrically connected. Examples of the first circuit board 21 and the second circuit board 31 include a substrate made of an inorganic material such as a semiconductor, glass, or ceramic, a substrate of an organic material such as polyimide or polycarbonate, and an inorganic substance or an organic substance such as glass/epoxy resin. The substrate. The first circuit board 21 may be a glass substrate, and the second circuit board 31 may be a flexible substrate (preferably a resin film such as a polyimide film).

Specific examples of the circuit member to be connected include a glass or plastic substrate on which an electrode such as an indium tin oxide (ITO) film is formed for a liquid crystal display, a printed wiring board, a ceramic wiring board, and a soft one. Wiring board, semiconductor germanium wafer, etc. These visual needs need to be combined. As described above, the adhesive composition according to the present embodiment can be used for, for example, a metal such as copper or aluminum, ITO or nitrogen, in addition to a member having a surface formed of an organic material such as a printed wiring board or a polyimide film. A circuit member having a variety of surface states like a member formed of an inorganic material such as bismuth (SiN _x ) or cerium oxide (SiO ₂ ) is bonded.

For example, when one of the circuit members is a solar battery cell having electrodes such as a finger electrode, a bus bar electrode, and the other circuit member is a tab wire, The connector obtained by connecting these is a solar battery module including a solar cell unit, a bonding wire, and a connecting member (the cured product of the adhesive composition).

The connecting member 10 contains a cured product of the adhesive composition of the present embodiment. The connection member 10 includes an insulating layer 11 and conductive particles 7 dispersed in the insulating layer 11. The conductive particles 7 are disposed not only between the opposing first circuit electrode 22 and the second circuit electrode 32 but also between the main surface 21a and the main surface 31a. Since the first circuit electrode 22 and the second circuit electrode 32 are electrically connected via the conductive particles 7, the connection resistance between the first circuit electrode 22 and the second circuit electrode 32 can be sufficiently reduced. Therefore, the flow of current between the first circuit electrode 22 and the second circuit electrode 32 can be smoothly performed, and the function of the circuit can be sufficiently exhibited. When the connecting member does not contain conductive particles, the first circuit electrode 22 is electrically connected to the second circuit electrode 32.

Since the connecting member 10 is formed of the cured product of the adhesive composition of the present embodiment, the bonding strength of the connecting member 10 with respect to the first circuit member 20 and the second circuit member 30 is sufficiently high. Therefore, after the reliability test (high temperature and high humidity test), the decrease in the bonding strength and the increase in the connection resistance can be sufficiently suppressed.

The connecting body 1 can be manufactured, for example, by a method comprising the steps of: arranging a pair of circuit members having circuit electrodes and facing each other with a film-like adhesive containing an adhesive composition therebetween; And a step of heating a pair of circuit members and a film-like adhesive while pressing them in the thickness direction of the film-like adhesive, thereby curing the pair of circuit members via the cured product of the adhesive composition (formal connection step).

3(a) to 3(c) are process diagrams showing an embodiment of manufacturing a connector from the adhesive composition of the present embodiment by a schematic cross-sectional view. As shown in FIG. 3(a), the film-like adhesive 40 is placed on the main surface of the first circuit member 20 on the side of the first circuit electrode 22. When the film-like adhesive 40 is provided on the support, the film-like adhesive and the laminate of the support are placed on the circuit member in such a manner that the film-like adhesive 40 is located on the side of the first circuit member 20. The film-like adhesive 40 is easy to handle because it is in the form of a film. Therefore, the film-like adhesive 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the connection work of the first circuit member 20 and the second circuit member 30 can be easily performed.

The film-like adhesive 40 is the above-described adhesive composition (circuit connecting material) formed into a film shape, and has conductive particles 7 and an insulating adhesive layer 5. In the case where the adhesive composition does not contain conductive particles, it can also be used as a circuit connecting material for electrical connection by directly connecting the circuit electrodes to each other. Circuit connection materials that do not contain conductive particles are sometimes referred to as Non-Conductive-FILM (NCF) or Non-Conductive-Paste (NCP). In the case where the adhesive composition has conductive particles, the circuit connecting material using the same is sometimes referred to as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP). .

The thickness of the film-like adhesive 40 is preferably from 10 μm to 50 μm. When the thickness of the film-like adhesive 40 is 10 μm or more, the first circuit electrode 22 and the second circuit electrode 32 tend to be easily filled with an adhesive. When the thickness of the film-like adhesive is 50 μm or less, the adhesive composition between the first circuit electrode 22 and the second circuit electrode 32 can be sufficiently completely eliminated, so that the first circuit electrode 22 and the second circuit can be easily ensured. Conduction between the electrodes 32.

The film-like adhesive 40 is temporarily connected to the first circuit member 20 by applying a pressure A and a pressure B as shown in FIG. 3(a) in the thickness direction of the film-like adhesive 40 (see FIG. 3(b)). At this time, it is possible to press while heating. Here, the heating temperature is set to a temperature at which the adhesive composition in the film-like adhesive 40 is not cured, that is, a temperature sufficiently lower than a temperature at which the radical polymerization initiator rapidly generates radicals.

Then, as shown in FIG. 3(c), the second circuit member 30 is placed on the film-like adhesive 40 with the second circuit electrode positioned on the side of the first circuit member 20. When the film-like adhesive 40 is provided on the support, the second circuit member 30 is placed on the film-like adhesive 40 after the support is peeled off.

Thereafter, the film-like adhesive 40 is heated while applying pressure A and pressure B in the thickness direction thereof. The heating temperature at this time is a temperature set so that the radical polymerization initiator sufficiently generates radicals. Thereby, a radical is generated from the radical polymerization initiator, and polymerization of the radically polymerizable compound is started. The connector shown in Fig. 2 is obtained by a formal connection. By heating the film-like adhesive 40, the insulating adhesive is cured by sufficiently reducing the distance between the first circuit electrode 22 and the second circuit electrode 32 to form the insulating layer 11. As a result, the first circuit member 20 and the second circuit member 30 are firmly connected via the connection member 10 including the insulating layer 11.

The main connection is preferably carried out under the conditions of a heating temperature of 100 ° C to 250 ° C, a pressure of 0.1 MPa to 10 MPa, and a pressurization time of 0.5 second to 120 seconds. These conditions can be appropriately selected depending on the intended use, the adhesive composition, and the circuit member. According to the adhesive composition of the present embodiment, a connector having sufficient reliability can be obtained even under a low temperature condition of, for example, 140 ° C or lower. After the formal connection, post-hardening can also be performed as needed. [Examples]

Hereinafter, the present invention will be more specifically described by way of examples and comparative examples. However, the invention is not limited to the following examples.

<Synthesis of Polyurethane Resin> Polypropylene glycol (number average molecular weight Mn = 2000) 1000 as a diol having an ether bond was added to a separable flask equipped with a reflux condenser, a thermometer, and a stirrer. The mass part and 4000 parts by mass of methyl ethyl ketone as a solvent were stirred at 40 ° C for 30 minutes. After the solution was heated to 70 ° C, 12.7 mg of dimethyltin laurate as a catalyst was added. Next, a solution prepared by dissolving 125 parts by mass of 4,4'-diphenylmethane diisocyanate in 125 parts by mass of methyl ethyl ketone was added dropwise to the solution over 1 hour. Thereafter, stirring was continued at this temperature until a peak of absorption of NCO could not be confirmed by an infrared spectrophotometer, and a methyl ethyl ketone solution of a polyurethane resin was obtained. The solid content concentration (concentration of the polyurethane resin) of the solution was adjusted to be 30% by mass. The weight average molecular weight of the obtained polyurethane resin was measured by gel permeation chromatography (GPC) and found to be 320,000 (standard polystyrene equivalent). Hereinafter, the analysis conditions of GPC are shown in Table 1.

[Table 1]

<Synthesis of urethane acrylate> A polycarbonate diol was added to a 2 liter four-flask flask (flask with four necks) equipped with a thermometer, a stirrer, an inert gas introduction port, and a reflux cooler ( Manufactured by Aldrich, Mn=2000) 4000 parts by mass, 238 parts by mass of 2-hydroxyethyl acrylate, 0.49 parts by mass of hydroquinone monomethyl ether, and 4.9 parts by mass of tin-based catalyst . To the reaction liquid heated to 70 ° C, 666 parts by mass of isophorone diisocyanate (IPDI) was uniformly added dropwise over 3 hours to cause a reaction. After the completion of the dropwise addition, the reaction was continued for 15 hours, and when the NCO content was 0.2% by mass, the reaction was terminated by the potentiometric automatic titration apparatus (trade name: AT-510, manufactured by Kyoto Electronics Co., Ltd.) to obtain an acrylamide carboxylic acid. ester. As a result of analysis by GPC, the weight average molecular weight of the urethane amide was 8,500 (standard polystyrene equivalent). Further, the analysis by GPC was carried out under the same conditions as the analysis of the weight average molecular weight of the polyurethane resin.

<Synthesis of acrylate compound A having an epoxy group> To a reactor equipped with a stirring device, a reflux condenser, and a thermometer, a bisphenol F-type epoxy resin (trade name JER806, manufactured by Mitsubishi Chemical Corporation: bisphenol) was added. Fg diglycidyl ether of F, epoxide equivalent 165) 330 parts by mass, 72 parts by mass of acrylic acid (ratio to 2 moles of epoxy based on 2 moles of epoxy in epoxy resin), benzyltriethyl chloride A reaction liquid was prepared by using 1 part by mass of ammonium chloride and 0.1 part by mass of tert-butyl catechol. The reaction mixture was stirred at 100 ° C for 3 hours to carry out a reaction between an epoxy group and acrylic acid. After completion of the reaction, the reaction solution was returned to room temperature, and then 300 parts by mass of benzene was added to dissolve the product. Then, an aqueous sodium carbonate solution and distilled water were sequentially added thereto, and the solutions were each washed three times. Thereafter, benzene was sufficiently distilled off to obtain a crude product. The crude product was analyzed by liquid chromatography. As a result, it was found that in addition to the acrylate compound having one epoxy group as the target compound, the crude product also contained a difunctional acrylate compound having no epoxy group and a raw material. Bisphenol F type epoxy resin. Therefore, the crude product was purified to obtain an acrylate compound A having a basic skeleton of one of an epoxy group and an acryloxy group and having a bisphenol F type.

<Preparation of Conductive Particles> A nickel layer having a thickness of 0.2 μm was formed on the surface of the polystyrene particles, and a gold layer having a thickness of 0.04 μm was formed on the outside of the nickel layer. Conductive particles having an average particle diameter of 4 μm were produced in this manner.

<Preparation of Film-Forming Adhesive> The raw materials shown in Table 2 were mixed at a mass ratio shown in Table 2. The conductive particles were dispersed therein at a ratio of 1.5% by volume to obtain a coating liquid for forming a film-like adhesive. This coating liquid was applied to a polyethylene terephthalate (PET) film having a thickness of 50 μm using a coating device. The coating film was dried by hot air at 70 ° C for 10 minutes to form a film-like adhesive having a thickness of 18 μm.

Each numerical value shown in Table 2 represents a part by mass of a solid component. The specific materials of the respective raw materials described in Table 2 are as follows. Polyurethane resin, urethane acrylate, and acrylate compound A having an epoxy group: as described above, phenoxy resin: PKHC (Union Carbide) Manufactured, trade name: average molecular weight 45000) 40 g of 40% by mass solution prepared by dissolving in 60 g of methyl ethyl ketone, epoxy resin A: YX4000 (manufactured by Mitsubishi Chemical Corporation, trade name: molecular weight 384 , epoxy equivalent 192, biphenyl type epoxy resin), epoxy resin B: YX7399 (manufactured by Mitsubishi Chemical Corporation, trade name: molecular weight 528, epoxy equivalent 264, biphenyl type epoxy resin), Epoxy resin C: JER806 (manufactured by Mitsubishi Chemical Corporation, trade name: molecular weight 330, epoxy equivalent 165, bisphenol F-type epoxy resin), · Phosphate ester: 2-methylpropenyloxy acid phosphate Ethyl ester (trade name: LIGHT ESTER P-2M, manufactured by Kyoeisha Chemical Co., Ltd.), · decane coupling agent: 3-methacryloxypropyltrimethoxydecane (trade name KBM) -503, Shin-Etsu Chemical Industry Co., Ltd. Manufactured by the company), ·Peroxide: Peroxidized Laurel (trade name: PAROYL L, manufactured by Nippon Oil Co., Ltd.: molecular weight 398.6), · Cationic polymerization hardener of epoxy resin: aliphatic strontium salt A latent cationic polymerization hardener (trade name: Adeka Optomer CP-66, manufactured by ADEKA Co., Ltd.) · Inorganic microparticles: cerium oxide particles (trade name R104, Japan Ai 10 g of a dispersion liquid prepared by dispersing a mixed solvent of 45 g of toluene and 45 g of ethyl acetate in a mixed solvent of Nippon Aerosil Co., Ltd.

[Table 2] (Unit: parts by mass)

<Production of Connector> Using the film-like adhesive as a circuit connecting material, a flexible circuit board (FPC) having 2,200 copper lines having a line width of 75 μm, a pitch of 150 μm, and a thickness of 18 μm, and a glass substrate and A thin layer of ITO substrate (thickness: 1.1 mm, surface resistance: 20 Ω/□) of 0.2 μm indium oxide (ITO) formed on a glass substrate was connected. The connection was carried out by using a thermocompression bonding apparatus (heating method: constant heat type, manufactured by Toray Engineering Co., Ltd.) at 140 ° C and 1 MPa by heating and pressurization for 5 seconds. Thereby, a connector in which the FPC and the ITO substrate were joined by a cured product of a film-like adhesive over a width of 1.5 mm was produced.

Further, a SiN substrate (thickness: 0.7 mm) having a glass substrate and a thin layer of 0.2 μm of tantalum nitride (SiN) formed on the glass substrate was used instead of the ITO substrate, and heating was performed at 140 ° C and 3 MPa for 5 seconds. And a connector for manufacturing the FPC and the SiN substrate by pressurization.

<Measurement of Connection Resistance and Adhesive Strength> The resistance value (connection resistance) between the adjacent circuits of the obtained connection body of the FPC and the ITO substrate was measured by a multimeter. The resistance value is expressed as an average of 37 points of resistance between adjacent circuits. Further, the joint strength of the joined body was measured by a 90-degree peeling method in accordance with Japanese Industrial Standards (JIS)-Z0237. Next, the strength measuring device was Tensilon UTM-4 (manufactured by Toyo BALDWIN Co., Ltd., trade name, peel strength: 50 mm/min, 25 ° C). The connection resistance and the subsequent strength were measured after the connection was continued for 250 hours in a constant temperature and humidity chamber at 85 ° C and 85% RH. The evaluation results are shown in Table 3.

<Observation of the appearance of the connector> Using a microscope (trade name: ECLIPSE L200, manufactured by Nikon Co., Ltd.), the connection between the ITO substrate and the SiN substrate was investigated after the high-temperature and high-humidity test. Whether the interface between the cured product and the FPC and the interface between the cured product and the glass are peeled off. In the case where the peeling was not determined, it was judged as "A", and it was judged as "B" when it was confirmed that there was no problem in practical use, and it was judged as "C" when the peeling was confirmed to be practically problematic. The evaluation results are shown in Table 3. If the evaluation is "A" or "B", it can be said that the peeling is a practically problem-free range.

[table 3]

According to the film-like adhesive of each of the examples, it was confirmed that a good connection resistance (5 Ω or less) was observed immediately after the connection and after the high-temperature and high-humidity test by the low-temperature and short-time curing conditions. And the subsequent strength (8 N/cm or more), and the connection appearance is also good in that it is practically problem-free.

On the other hand, in Comparative Example 2 containing no epoxy resin and Comparative Example 2 containing 1 part by mass or more of the epoxy resin, the adhesion strength after the high-temperature and high-humidity test was not higher than that of the respective examples. In addition, in the case of using a SiN substrate, the occurrence of peeling was confirmed after the high-temperature and high-humidity test, and it was confirmed that there was a problem in practical use in connection appearance.

1‧‧‧Connector
5‧‧‧Insulating adhesive layer
7‧‧‧Electrical particles
8‧‧‧Support
10‧‧‧Connecting components
11‧‧‧Insulation
20‧‧‧First circuit component
21‧‧‧First circuit board
21a, 31a‧‧‧ main faces
22‧‧‧First circuit electrode
30‧‧‧Second circuit components
31‧‧‧Second circuit substrate
32‧‧‧Second circuit electrode
40‧‧‧membranous adhesive
100‧‧‧ laminated film
A, B‧‧‧ pressure

FIG. 1 is a schematic cross-sectional view showing an embodiment of a film-like adhesive including the adhesive composition of the present embodiment. FIG. 2 is a schematic cross-sectional view showing an embodiment of a connecting body including a connecting member including a cured product of the adhesive composition of the present embodiment. 3(a) to 3(c) are process diagrams showing an embodiment of manufacturing a connector from the adhesive composition of the present embodiment by a schematic cross-sectional view.

no

Claims (8)

An adhesive composition comprising: (a) a thermoplastic resin; (b) a radical polymerizable compound; (c) a radical polymerization initiator; and (d) a ring having no (meth) acryloxy group An oxy-resin; and the adhesive composition is substantially free of a cationically polymerizable hardener of an epoxy resin. The adhesive composition according to claim 1, wherein the epoxy resin has a biphenyl skeleton. The adhesive composition according to claim 1 or 2, further comprising (e) conductive particles. An anisotropic conductive adhesive composition comprising: (a) a thermoplastic resin; (b) a radical polymerizable compound; (c) a radical polymerization initiator; (d) having no (meth) propylene oxide a base epoxy resin; and (e) conductive particles; and the anisotropic conductive adhesive composition is substantially free of an epoxy resin cationic polymerization hardener. The anisotropic conductive adhesive composition according to claim 4, wherein the epoxy resin has a biphenyl skeleton. A circuit connecting material comprising the adhesive composition according to any one of claims 1 to 3, or the anisotropic conductivity as described in claim 4 or 5 And a circuit connecting material for sequentially connecting the circuit members having the circuit electrodes to each other with the circuit electrodes of the respective circuit members electrically connected to each other. A connector comprising: a first circuit member having a first circuit electrode formed on a main surface of the first circuit substrate; a second circuit member having a second circuit electrode formed on a main surface of the second circuit substrate, and Configuring the second circuit electrode and the first circuit electrode to face each other; and connecting a member disposed between the first circuit member and the second circuit member, the first The circuit member is electrically connected to the second circuit member; and the connecting member is a cured product of the adhesive composition according to any one of claims 1 to 3, or as claimed in the patent application The cured product of the anisotropic conductive adhesive composition according to item 4 or 5. The connector of claim 7, wherein one of the first circuit substrate and the second circuit substrate is a glass substrate.