TW201709805A - Heat conduction structure and heat dissipation device - Google Patents

Abstract

The present invention discloses a heat conduction structure and a heat dissipation device. The heat conduction structure includes a first conduction layer, and a second conduction layer disposed on the first conduction layer. The first conduction layer includes a graphene material, and a plurality of first carbon nanotubes mixed in the graphene material. The second conduction layer includes a porous material, and a plurality of second carbon nanotubes mixed in the porous material.

Description

Thermal structure and heat sink

The invention relates to a heat conducting structure and a heat dissipating device, in particular to a thinned heat conducting structure and a heat dissipating device.

With the development of technology, the design and development of electronic devices are not considered to be thinner and more efficient. In the case where high-speed operation is required, the electronic components of the electronic device inevitably generate more heat than the conventional electronic components, but the high temperature working environment not only affects the characteristics of the electronic components, but the excessive temperature is more likely to cause electrons. Permanent damage to components. Therefore, in order to cope with the trend of thin products of electronic devices, thin heat sinks have become one of the indispensable important devices in current electronic devices.

Conventional heat sinks generally include a heat sink and a fan mounted on an electronic component (such as a CPU), typically aluminum or copper, and including a base and a plurality of heat sink fins. When the thermal energy generated by the electronic component is conducted to the heat sink, the heat energy is transmitted to the heat dissipation fins through the base, and the heat energy generated by the electronic component can be dissipated by the blowing of the fan.

However, for the above-mentioned heat sink, the heat sink is too large to meet the demanding requirements of today's thinned electronic products. Therefore, how to provide a heat-conducting structure and a heat-dissipating device, which has better heat-conducting effect and thinning characteristics, has become one of the important subjects in order to meet the requirements of light and thin electronic products.

In view of the above problems, an object of the present invention is to provide a heat conducting structure and a heat dissipating device which have better heat conducting effects and thinner characteristics in accordance with the requirements of today's electronic products.

In order to achieve the above object, a heat conducting structure according to the present invention includes a first guide a thermal layer and a second thermally conductive layer. The first heat conducting layer comprises a graphene material and a plurality of first carbon nanotubes, and the first carbon nanotubes are mixed in the graphene material. The second heat conduction layer is disposed on the first heat conduction layer, and comprises a porous material and a plurality of second carbon nanotubes, and the second carbon nanotubes are mixed in the porous material.

In an embodiment, the thermally conductive structure has a thickness between 10 microns and 300 microns.

In one embodiment, the thermally conductive structure further includes a plurality of thermally conductive particles mixed in the first thermally conductive layer, or in the second thermally conductive layer, or in the first thermally conductive layer and the second thermally conductive layer.

In an embodiment, the heat conductive structure further includes a functional layer disposed on a surface of the first heat conductive layer away from the second heat conductive layer, or disposed between the first heat conductive layer and the second heat conductive layer, or disposed in the second The heat conducting layer is away from a surface of the first heat conducting layer.

In one embodiment, the material of the functional layer is polyethylene terephthalate, epoxy resin, phenol resin, bismaleimide, scorpion-resistant organism, polystyrene, polycarbonate, polyethylene, Polypropylene, ethylene resin, acrylonitrile-butadiene-styrene copolymer, polyimide, polymethyl methacrylate, thermoplastic polyurethane, polyetheretherketone, polybutylene terephthalate Diester or polyvinyl chloride.

To achieve the above object, another heat conducting structure according to the present invention comprises a heat conducting layer comprising a porous material and a plurality of carbon nanotubes mixed in the porous material.

In an embodiment, the thermally conductive structure further comprises a plurality of thermally conductive particles mixed in the thermally conductive layer.

In an embodiment, the thermally conductive structure further comprises a graphene material mixed in the thermally conductive layer.

In an embodiment, the thermally conductive structure further includes a functional layer disposed on a surface of the thermally conductive layer.

To achieve the above object, a heat dissipating device according to the present invention is coupled to a heat source and includes a heat conducting structure and a heat dissipating structure. The heat conducting structure is in contact with the heat source, and the heat dissipating structure is connected to the heat conducting structure.

In an embodiment, the heat dissipation structure includes a heat dissipation fin, a heat dissipation fan, a heat pipe, or a combination thereof.

According to the above, in the heat conducting structure and the heat dissipating device of the present invention, the heat conducting structure The first heat conducting layer comprises a plurality of first carbon nanotubes mixed in the graphene material, and the second heat conducting layer is disposed on the first heat conducting layer and comprises a plurality of second carbon nanotubes mixed in the porous material. The structure of the first heat-conducting layer and the second heat-conducting layer can quickly guide and dissipate the heat energy generated by the heat source, and the heat-conducting structure and the heat-dissipating device have the characteristics of thinning, which is in line with the thinning and thinning of today's thin-shaped electronic products. Requirements.

1, 1a, 1b, 1c, 3‧‧‧ heat conduction structure

11, 31‧‧‧ first thermal conduction layer

111‧‧‧Graphene materials

112‧‧‧First carbon nanotube

12, 32‧‧‧second thermal layer

121‧‧‧Porous material

122‧‧‧Second carbon nanotube

13‧‧‧ functional layer

2‧‧‧heating device

4‧‧‧heating structure

41‧‧‧ cooling fan

A, B‧‧‧ area

D‧‧‧thickness

G‧‧‧ bubble

1A and 1B are respectively an exploded perspective view and a side view of a heat conducting structure according to a preferred embodiment of the present invention.

1C and 1D are enlarged schematic views of a region A and a region B of FIG. 1B, respectively.

2A-2C are side schematic views of heat conducting structures of different embodiments, respectively.

3 is a schematic diagram of a heat sink according to a preferred embodiment of the present invention.

The heat-conducting structure and the heat-dissipating device according to the preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

FIG. 1A and FIG. 1D are respectively an exploded perspective view and a side view of a heat conducting structure 1 according to a preferred embodiment of the present invention, and FIGS. 1C and 1D are respectively FIG. 1B and FIG. An enlarged schematic view of area A and area B. Here, FIG. 1C and FIG. 1D are only schematic and are not drawn in accordance with the ratio of actual components.

The heat conducting structure 1 can quickly guide the thermal energy generated by the heat source (for example, the electronic component), and includes a first heat conductive layer 11 and a second heat conductive layer 12, and the first heat conductive layer 11 and the second heat conductive layer 12 are mutually connected. Overlay. This embodiment is an example in which the second heat conduction layer 12 is stacked on the first heat conduction layer 11 (the first heat conduction layer 11 is in contact with the heat source). In different implementations, the first heat conductive layer 11 may be stacked on the second heat conductive layer 12 (the second heat conductive layer 12 is in contact with the heat source), and is not limited. The thickness d of the heat-conducting structure 1 can be between 10 micrometers and 300 micrometers. Therefore, the user can fabricate the required thickness into the thin and light electronic device according to actual needs, in order to meet the requirements of light and thin electronic products.

As shown in FIG. 1C, the first heat conductive layer 11 comprises a graphene material 111 and A number of first carbon nanotubes (CNTs) 112 are mixed, and the first carbon nanotubes 112 are mixed in the graphene material 111. Among them, the graphene material 111 is a graphene-based material and may be natural graphite or artificial graphite. The graphene material 111 (graphene particles) may have a purity of 70% to 99.9%, and the graphene particles may have a particle diameter of between 5 nm and 3000 nm. In addition, the carbon nanotube (the first carbon nanotube 112) is a graphite tube having a nanometer diameter and a length to width ratio, and the inner diameter of the carbon tube can be from 0.4 nanometers (nm) to several tens of nanometers. The outer diameter of the carbon tube is from 1 nm to several hundred nanometers, and the length thereof is between several micrometers and several tens of micrometers, and can be curled by a single layer or a plurality of layers of graphite to form a hollow tubular columnar structure. The carbon nanotube is a highly thermally conductive material, and its thermal conductivity is generally greater than 6000 watts/meter-K (the high-purity diamond has a thermal conductivity of about 3320 watts/meter-K), so its thermal conductivity is quite high. In practice, the carbon nanotubes (the first carbon nanotubes 112) may be mixed in the graphene material 111, and an adhesive (not shown) is added, stirred, and solidified according to actual size and thickness to become The first heat conductive layer 11. Since the graphene particles have good thermal conductivity, in particular, excellent thermal conductivity for the plane formed by the X/Y axis, the first heat conducting layer 11 having the graphene material 111 and the first carbon nanotubes 112 is passed through High efficiency heat transfer can be performed to quickly direct thermal energy from the heat source and to the second heat conducting layer 12.

In addition, as shown in FIG. 1D, the second heat conducting layer 12 includes a porous material 121 and a plurality of second carbon nanotubes 122 mixed in the porous material 121. Wherein, the porous material 121 may be a foamed plastic, for example, a thermoplastic plastic such as polystyrene (PS), polyethylene (PE), polyvinyl chloride (PVC), ABS, PC, polyester, nylon (Nylon) or poly Materials such as formaldehyde, adding carbon dioxide blowing agent, hydrogenated hydrochlorofluorocarbon (HCFC), hydrocarbons (such as cyclopentane), hydrogenated fluorine, ADC foaming agent (such as N-nitroso compound) or OBSH foaming agent (for example) A foaming material such as 4,4'-disulfonyl diphenyl ether) is stirred; or a thermosetting plastic such as PU, polytrim isocyanate, phenolic resin, urea resin, epoxy resin A material such as a polyorganosiloxane or a polyimide (PI) is added to the above foaming material and stirred. Porous plastic (porous material 121) is based on plastic and contains a large amount of bubbles G. Therefore, porous plastic can be said to be a composite plastic with gas as a filler. In addition, the second carbon nanotube 122 has the high thermal conductivity of the first carbon nanotube 112 described above, and will not be described again.

In practice, the second carbon nanotubes 122 may be first mixed into the liquid porous material 121 and solidified according to actual size and thickness to form the second heat conductive layer 12. when When the thermal energy is transmitted to the second heat conducting layer 12, the high thermal conductivity of the second carbon nanotube 122 is transmitted, and the thermal energy is guided by the second carbon nanotube 122 to the bubble G (the air inside the bubble G) and is guided upward. The porous material 121 also transfers thermal energy upward through the second carbon nanotubes 122 and the porous material 121.

In addition, please refer to FIG. 2A to FIG. 2C, which are respectively different implementation manners. A schematic side view of the thermally conductive structures 1a, 1b, 1c.

As shown in FIG. 2A, the heat conducting structure 1a is different from the heat conducting structure 1 in that heat conduction is performed. The structure 1a further includes a functional layer 13 disposed on a surface of the second heat conductive layer 12 away from the first heat conductive layer 11 (the upper surface of the second heat conductive layer 12). The material of the functional layer 13 may be a thermosetting plastic such as, but not limited to, epoxy resin, phenol resin (Phenolic) or Bismaleimide (BMI); or the material of the functional layer 13 It may be a thermoplastic plastic such as, but not limited to, polyethylene terephthalate (PET), Nylon, Polystyrene, polycarbonate, polyethylene ( Polyethylene), Polypropylene, Vinyl, Acrylonitrile-butadine-styrene (ABS), Polyimine (PI), Polymethylmethacrylate Polymethylmethacrylate (PMMA), Thermoplastic Polyurethane (TPU), Polyaryletherketone (PEEK), Polybutylene terephthalate (PBT) or Polyvinyl Chloride (Polybutylene terephthalate (PBT)) Polyvinyl chloride (PVC), to assist in conducting the thermal energy conducted to the upper surface of the second heat conducting layer 12 (enhancing the heat transfer capability of the interface), thereby improving the heat transfer efficiency.

In addition, as shown in FIG. 2B, the heat conducting structure 1b is different from the heat conducting structure 1a in that The functional layer 13 of the heat conducting structure 1b is disposed between the first heat conducting layer 11 and the second heat conducting layer 12 to assist heat conduction between the interface of the first heat conducting layer 11 and the second heat conducting layer 12 to enhance the thermal conductivity of the interface.

In addition, as shown in FIG. 2C, the heat conducting structure 1c is different from the heat conducting structure 1a in that The functional layer 13 of the heat conducting structure 1c is disposed on a surface of the first heat conducting layer 11 away from the second heat conducting layer 12 (the lower surface of the first heat conducting layer 11 , that is, between the first heat conducting layer 11 and the heat source) to assist The thermal energy outside the heat conducting structure 1c is quickly conducted to the first heat conducting layer 11 to enhance the heat of the interface Conductivity improves heat transfer efficiency.

In addition, other technical features of the heat conducting structure 1a, 1b, 1c can refer to the thermal junction The same components of the structure 1 will not be described again.

It is added that, in different embodiments, depending on different needs, A plurality of thermally conductive particles (not shown) are mixed in the first thermally conductive layer 11 in the above embodiment, or in the second thermally conductive layer 12, or in the first thermally conductive layer 11 and the second thermally conductive layer 12. Wherein, the thermal conductivity (w/mk) of the thermally conductive particles is greater than 20, and the material thereof may be, for example, silver, copper, gold, aluminum, iron, tin, lead, antimony, niobium carbide, gallium antimonide, aluminum nitride. , cerium oxide, magnesium oxide or its alloy, or ceramic materials such as alumina or boron nitride. Since the second heat conducting layer has a better longitudinal axis (Z-axis) heat guiding capability, the heat conducting effect of the heat conducting structure can be further enhanced by the first heat conducting layer 11 and/or the second heat conducting layer 12 having the heat conductive particles; The graphene material may also be added to the second heat conducting layer 12, so that the second heat conducting layer 12 includes a graphene material in addition to the porous material 121 and the second carbon nanotube 122, thereby raising the second heat conducting layer 12. Thermal conductivity.

In addition, in some embodiments, the heat conducting structure may also be only one layer of heat conducting layer, for example. For example, the first heat conduction layer 11 or the second heat conduction layer 12 of a single layer, and a plurality of heat conductive particles (not shown) may be mixed in the first heat conduction layer 11 or the second heat conduction layer 12 of the single layer to strengthen Its heat conduction effect. In addition, in some embodiments, the graphene material may also be added to the heat conducting structure of the second heat conducting layer 12 including only a single layer, which is not limited in the present invention.

Please refer to FIG. 3, which is a heat dissipating device 2 according to a preferred embodiment of the present invention. Schematic diagram. The heat sink 2 can be used with power components, display cards, motherboards, lamps, other electronic components or electronic products to assist in directing and dissipating the heat generated by the heat source.

The heat sink 2 includes a heat conducting structure 3 and a heat dissipating structure 4. Among them, heat conduction The structure 3 is in contact with the heat source (for example, directly disposed on the heat source and contacts the heat source), and includes a first heat conductive layer 31 and a second heat conductive layer 32, and the heat dissipation structure 4 is connected to the heat conductive structure 3. The heat source can be, for example but not limited to, a central processing unit (CPU), and the heat conducting structure 3 can be the above-mentioned heat conducting structure 1, 1a, 1b, 1c and its variants, and the specific technical features can be referred to the above, and no more Description.

The heat conducting structure 3 of the embodiment is disposed on the heat source, and the first heat conducting layer 31 is straight The patch is attached to a heat source (such as a CPU) that needs to dissipate heat to quickly direct the heat generated by the heat source. In addition, the heat dissipation structure 4 may include a heat dissipation fin, a heat dissipation fan or a heat pipe, or Its combination. The heat dissipation structure 4 of the embodiment is a heat dissipation fan 41. After the heat energy generated by the heat source is transmitted to the heat conduction structure 3, the heat energy can be quickly dissipated by the blowing of the heat dissipation fan 41, thereby reducing the temperature of the heat source.

In summary, in the heat conduction structure and the heat dissipation device of the present invention, the first heat conduction layer of the heat conduction structure includes a plurality of first carbon nanotubes mixed in the graphene material, and the second heat conduction layer is disposed on the first heat conduction layer. And comprising a plurality of second carbon nanotubes mixed in the porous material. The structure of the first heat-conducting layer and the second heat-conducting layer can quickly guide and dissipate the heat energy generated by the heat source, and the heat-conducting structure and the heat-dissipating device have the characteristics of thinning, which is in line with the thinning and thinning of today's thin-shaped electronic products. Requirements.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧thermal structure

11‧‧‧First thermal conduction layer

12‧‧‧Second thermal layer

Claims (13)

A heat conducting structure comprising: a first heat conducting layer comprising a graphene material and a plurality of first carbon nanotubes, wherein the first carbon nanotubes are mixed in the graphene material; and a second heat conducting layer, a stack The first heat conducting layer is disposed on the first heat conducting layer and comprises a porous material and a plurality of second carbon nanotubes, and the second carbon nanotubes are mixed in the porous material. The thermally conductive structure of claim 1, wherein the thickness is between 10 microns and 300 microns. The thermally conductive structure of claim 1, further comprising: a plurality of thermally conductive particles mixed in the first thermally conductive layer, or in the second thermally conductive layer, or in the first thermally conductive layer and the second thermally conductive layer . The heat-conducting structure of claim 1, further comprising: a functional layer disposed on a surface of the first heat-conducting layer away from the second heat-conducting layer, or disposed on the first heat-conducting layer and the second heat-conducting layer Between the layers, or disposed on the surface of the second thermally conductive layer away from the first thermally conductive layer. The thermally conductive structure according to claim 4, wherein the functional layer is made of polyethylene terephthalate, epoxy resin, phenol resin, bismaleimide, scorpion-resistant organism, polyphenylene. Ethylene, polycarbonate, polyethylene, polypropylene, vinyl resin, acrylonitrile-butadiene-styrene copolymer, polyimine, polymethyl methacrylate, thermoplastic polyurethane, polyether Ether ketone, polybutylene terephthalate or polyvinyl chloride. A thermally conductive structure comprising: a thermally conductive layer comprising a porous material and a plurality of carbon nanotubes, the carbon nanotubes being mixed in the porous material. The thermally conductive structure of claim 6, further comprising: a plurality of thermally conductive particles mixed in the thermally conductive layer. The thermally conductive structure of claim 6, further comprising: a graphene material mixed in the thermally conductive layer. The heat conducting structure according to claim 6 of the patent application, the thickness of which is between 10 micrometers and 300 micrometers Between meters. The thermally conductive structure of claim 6, further comprising: a functional layer disposed on a surface of the thermally conductive layer. The heat conductive structure according to claim 10, wherein the functional layer is made of polyethylene terephthalate, epoxy resin, phenol resin, bismaleimide, scorpion-resistant organism, polyphenylene. Ethylene, polycarbonate, polyethylene, polypropylene, vinyl resin, acrylonitrile-butadiene-styrene copolymer, polyimine, polymethyl methacrylate, thermoplastic polyurethane, polyether Ether ketone, polybutylene terephthalate or polyvinyl chloride. A heat dissipating device, cooperates with a heat source, and includes: a heat conducting structure according to any one of claims 1 to 11, wherein the heat conducting structure is in contact with the heat source; and a heat dissipating structure, and the heat conducting structure connection. The heat dissipation device of claim 12, wherein the heat dissipation structure comprises a heat dissipation fin, a heat dissipation fan, a heat pipe, or a combination thereof.