TW201707833A - Optically processing apparatus capable of keeping the flatness of the workpiece in an optically processing apparatus of making a workpiece move to be processed - Google Patents

Optically processing apparatus capable of keeping the flatness of the workpiece in an optically processing apparatus of making a workpiece move to be processed Download PDF

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TW201707833A
TW201707833A TW105124451A TW105124451A TW201707833A TW 201707833 A TW201707833 A TW 201707833A TW 105124451 A TW105124451 A TW 105124451A TW 105124451 A TW105124451 A TW 105124451A TW 201707833 A TW201707833 A TW 201707833A
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processed
workpiece
processing
processing apparatus
optical
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TW105124451A
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Chinese (zh)
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TWI601591B (en
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田村朋則
雜賀聡一
清水健司
中田喜久也
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理光股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H16/00Unwinding, paying-out webs
    • B65H16/02Supporting web roll
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H16/00Unwinding, paying-out webs
    • B65H16/10Arrangements for effecting positive rotation of web roll
    • B65H16/103Arrangements for effecting positive rotation of web roll in which power is applied to web-roll spindle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/02Supporting web roll
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/08Web-winding mechanisms
    • B65H18/10Mechanisms in which power is applied to web-roll spindle
    • B65H18/103Reel-to-reel type web winding and unwinding mechanisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/04Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/24Registering, tensioning, smoothing or guiding webs longitudinally by fluid action, e.g. to retard the running web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)

Abstract

A subject of this invention is that in an optically processing apparatus of making a workpiece move to be processed, the flatness of the workpiece may be kept. A solution of this invention is an optically processing apparatus, comprising a moving means, which makes the workpiece 35 carried on a table surface of a processing table component 53 move; and optically irradiating means 1, 2, which irradiate a portion of the workpiece, which is carried on the table surface of the processing table component, with processing light L. This invention is characterized in having attaching means 57, 58, which make the workpiece attached on the table surface by means of attraction force of attraction holes formed to the table surface of the processing table; and an attachment control means 40, which controls the attaching means to make the workpiece attached on the table surface during predetermined attraction period in moving the workpiece by means of the moving means.

Description

光學加工裝置 Optical processing device

本發明係有關一種光學加工裝置。 The present invention relates to an optical processing apparatus.

習知的光學加工裝置,係輸送加工對象物,在光學加工裝置的加工區域使加工對象物的被加工部份相對移動,對該加工對象物進行加工處理。 In the conventional optical processing apparatus, the object to be processed is conveyed, and the processed portion of the object to be processed is relatively moved in the processing region of the optical processing device, and the object to be processed is processed.

例如,專利文獻1中揭示了一種雷射加工裝置,其係以來自光源的雷射光束(加工光)照射於工件,將工件上的ITO薄膜圖案化加工或切削加工由金屬薄板構成的工件本身。在此雷射加工裝置方面,工件在捲成卷狀的狀態下保持於工件供應部,從該工件供應部拉出工件,使工件的被加工部份向雷射加工裝置的加工區域移動。然後,藉由電鏡(光學掃描手段)向二維方向掃描來自光源的雷射光束,加工處理加工區域內的工件的被加工部份。加工處理後,再拉出工件,使下一個被加工部份向雷射加工裝置的加工區域移動,加工處理該下一個被加工部份。 For example, Patent Document 1 discloses a laser processing apparatus that irradiates a workpiece with a laser beam (machining light) from a light source, and performs patterning or cutting of an ITO film on a workpiece by a workpiece formed of a thin metal plate. . In the laser processing apparatus, the workpiece is held in the workpiece supply portion in a state of being wound into a roll, and the workpiece is pulled out from the workpiece supply portion to move the processed portion of the workpiece to the processing region of the laser processing apparatus. Then, the laser beam from the light source is scanned in a two-dimensional direction by an electron microscope (optical scanning means), and the processed portion of the workpiece in the processing region is processed. After the processing, the workpiece is pulled out, and the next processed portion is moved to the processing area of the laser processing apparatus to process the next processed portion.

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開第2003-205384號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-205384

一般在使用加工光加工加工對象物的光學加工裝置方面,若加工對象物在照射於加工對象物的加工光的光軸方向位移,則加工光對於加工對象物的焦點位置會變動,無法得到穩定的加工精度。因此,必需在進行該光軸方向的加工對象物定位用的平台等加工台構件上確保加工對象物的平坦度。 When the object to be processed is displaced in the optical axis direction of the processed light that is applied to the object to be processed, the focus of the processed light on the object to be processed is changed, and the image processing position is not stable. Processing accuracy. Therefore, it is necessary to ensure the flatness of the object to be processed on the processing table member such as the stage for positioning the object to be processed in the optical axis direction.

然而,在使加工對象物移動而隨時進行加工的光學加工裝置 方面,難以保持加工對象物的平坦度。 However, an optical processing apparatus that moves the object to be processed at any time On the other hand, it is difficult to maintain the flatness of the object to be processed.

為了解決上述的課題,本發明的光學加工裝置具有:移動手段,其使載置於加工台構件台面上的狀態的加工對象物移動;以及光學照射手段,其對載置於前述加工台構件台面上的加工對象物部份照射加工光,其特徵在於,具備:吸附手段,其藉由來自形成於前述加工台構件台面上的吸引孔的吸引力,使前述加工對象物吸附於該台面;以及吸附控制手段,其在藉由前述移動手段移動加工對象物中的預定吸引期間,控制前述吸附手段以使該加工對象物吸附於前述台面。 In order to solve the above problems, an optical processing apparatus according to the present invention includes: a moving means for moving an object to be placed on a surface of a processing table member; and an optical irradiation means for placing the pair of the processing table member The processed object portion is irradiated with the processed light, and is characterized in that: the adsorption means is configured to adsorb the object to be processed by the suction force from the suction hole formed on the surface of the processing table member; The adsorption control means controls the adsorption means to adsorb the object to be applied to the mesa during a predetermined suction period in which the object to be processed is moved by the moving means.

藉由本發明,在使加工對象物移動而進行加工的光學加工裝置,可保持加工對象物的平坦度。 According to the present invention, the flatness of the object to be processed can be maintained in the optical processing apparatus that moves the object to be processed.

1‧‧‧雷射輸出部 1‧‧‧Laser output

2‧‧‧雷射掃描部 2‧‧‧Laser Scanning Department

3‧‧‧工件輸送部 3‧‧‧Workpiece conveying department

4‧‧‧控制部 4‧‧‧Control Department

10‧‧‧雷射驅動器部 10‧‧‧Laser driver

11‧‧‧雷射振盪器 11‧‧‧Laser oscillator

12‧‧‧擴束器 12‧‧‧ Beam expander

14、15、16‧‧‧反射鏡 14, 15, 16‧‧ ‧ mirror

20‧‧‧電掃描器控制部 20‧‧‧Electric scanner control unit

21‧‧‧電掃描器 21‧‧‧Electric scanner

21a‧‧‧電鏡 21a‧‧‧Electronic mirror

21b‧‧‧步進馬達 21b‧‧‧stepper motor

22‧‧‧fθ透鏡 22‧‧‧fθ lens

23‧‧‧監控攝影機 23‧‧‧Monitoring camera

24‧‧‧主掃描控制部 24‧‧‧Main Scan Control Department

25‧‧‧滑架 25‧‧‧Carriage

26‧‧‧步進馬達 26‧‧‧Stepper motor

27‧‧‧時序皮帶 27‧‧‧Timed belt

27a‧‧‧驅動滑輪 27a‧‧‧Drive pulley

27b‧‧‧從動滑輪 27b‧‧‧driven pulley

28‧‧‧線性編碼器 28‧‧‧Linear encoder

29‧‧‧線性導軌 29‧‧‧Linear guide

30‧‧‧副掃描控制部 30‧‧‧Sub Scan Control Department

31‧‧‧對位馬達 31‧‧‧Alignment motor

31a‧‧‧時序皮帶 31a‧‧‧Timed belt

32‧‧‧對位輥對 32‧‧‧Alignment roller pair

32a‧‧‧驅動輥 32a‧‧‧Drive roller

32b‧‧‧從動輥 32b‧‧‧ driven roller

33‧‧‧監控攝影機 33‧‧‧Monitoring camera

34‧‧‧監控攝影機 34‧‧‧Monitoring camera

35‧‧‧工件 35‧‧‧Workpiece

36、36-1、36-2‧‧‧加工區域 36, 36-1, 36-2‧‧‧ processing area

37‧‧‧對準標記 37‧‧‧ alignment mark

38‧‧‧對位制動器 38‧‧‧Alignment brake

39‧‧‧透鏡 39‧‧‧ lens

40‧‧‧控制PC 40‧‧‧Control PC

50‧‧‧卷供應部 50‧‧‧Volume Supply Department

51‧‧‧供應捲軸 51‧‧‧Supply reel

52‧‧‧入口導板 52‧‧‧Inlet guide

53‧‧‧加工台 53‧‧‧Processing table

54‧‧‧切刀 54‧‧‧Cutter

55‧‧‧托盤 55‧‧‧Tray

56‧‧‧捲出馬達 56‧‧‧Roll-out motor

57‧‧‧空洞部 57‧‧‧The Cavity Department

58‧‧‧吸入泵 58‧‧‧Sucking pump

59‧‧‧捲出用粉粒離合器 59‧‧‧Rolling powder clutch

60‧‧‧卷排出部 60‧‧‧Volume discharge department

62‧‧‧捲取馬達 62‧‧‧Winding motor

63‧‧‧捲取用粉粒離合器 63‧‧‧Rolling powder clutch

64‧‧‧清潔輥 64‧‧‧cleaning roller

65‧‧‧黏著輥 65‧‧‧Adhesive roller

66‧‧‧層壓卷 66‧‧‧ laminated rolls

67‧‧‧捲取捲軸 67‧‧‧Reel reel

70‧‧‧脈衝引擎部 70‧‧‧Pulse Engine Division

71‧‧‧輸出光纖 71‧‧‧ Output fiber

72‧‧‧輸出頭部 72‧‧‧ Output head

73‧‧‧脈衝產生器 73‧‧‧Pulse generator

74‧‧‧種子LD 74‧‧‧ Seed LD

75‧‧‧隔離器 75‧‧‧Isolator

76‧‧‧激光器LD 76‧‧‧Laser LD

77‧‧‧耦合器 77‧‧‧ Coupler

78‧‧‧光纖 78‧‧‧Fiber

79‧‧‧帶通濾波器 79‧‧‧Bandpass filter

80‧‧‧激光器LD 80‧‧‧Laser LD

81‧‧‧耦合器 81‧‧‧ Coupler

82‧‧‧光纖 82‧‧‧Fiber

83‧‧‧準直光學系統 83‧‧‧ collimating optical system

91‧‧‧多面鏡掃描器 91‧‧‧Multi-mirror scanner

91a‧‧‧多面鏡 91a‧‧‧Multiface mirror

91b‧‧‧馬達 91b‧‧‧Motor

92‧‧‧透鏡 92‧‧‧ lens

93‧‧‧光學感測器 93‧‧‧ Optical Sensor

L‧‧‧雷射光 L‧‧‧Laser light

第1圖為顯示實施形態之雷射圖案化裝置主要部份的構造的示意圖。 Fig. 1 is a schematic view showing the configuration of a main portion of a laser patterning device of an embodiment.

第2圖為顯示該雷射圖案化裝置的雷射振盪器一構造例的示意圖。 Fig. 2 is a view showing a configuration example of a laser oscillator of the laser patterning device.

第3圖為顯示該雷射圖案化裝置的光學掃描手段一變形例的示意圖。 Fig. 3 is a schematic view showing a modification of the optical scanning means of the laser patterning device.

第4圖為顯示該雷射圖案化裝置的工件輸送部一構造例的示意圖。 Fig. 4 is a schematic view showing a configuration example of a workpiece conveying portion of the laser patterning device.

第5圖為該工件輸送部的俯視圖。 Fig. 5 is a plan view of the workpiece conveying portion.

第6圖為顯示該雷射圖案化裝置的工件輸送部其他構造的示意圖。 Fig. 6 is a schematic view showing another structure of the workpiece conveying portion of the laser patterning device.

第7圖為顯示該雷射圖案化裝置的滑架分別位於主掃描方向不同的位置時的雷射光的光路徑的說明圖。 Fig. 7 is an explanatory view showing a light path of the laser light when the carriages of the laser patterning device are respectively located at different positions in the main scanning direction.

第8圖為顯示實施形態的雷射圖案化裝置的圖案化加工處理的一例的流程圖。 Fig. 8 is a flow chart showing an example of a patterning process of the laser patterning device of the embodiment.

第9圖為顯示實施形態的工件進給處理的流程一例的流程圖。 Fig. 9 is a flow chart showing an example of the flow of the workpiece feeding process of the embodiment.

第10圖為顯示將工件上的被加工區域分割為12個待加工件而依次進行加工處理時的加工順序的說明圖。 Fig. 10 is an explanatory view showing a processing sequence when the processed area on the workpiece is divided into 12 pieces to be processed and processed in order.

第11圖為顯示在待加工件(被加工部份)間應連接的配線圖案一例的說明圖。 Fig. 11 is an explanatory view showing an example of a wiring pattern to be connected between the workpieces to be processed (processed portions).

以下,將進行說明有關本發明的光學加工裝置適用於雷射圖案化裝置的一實施形態。 Hereinafter, an embodiment in which the optical processing apparatus according to the present invention is applied to a laser patterning apparatus will be described.

本實施形態的雷射圖案化裝置的加工對象物為在基材上形成有ITO薄膜的工件,藉由對此工件上的ITO薄膜照射雷射光(加工光)而部份地去除ITO薄膜,以圖案化加工ITO薄膜。然而,有關本發明的光學加工裝置並不受有關本實施形態的雷射圖案化裝置限定,也可以適用於進行其他圖案化加工的裝置、進行切削加工等其他加工處理的裝置以及將非雷射光用作加工光而進行加工的裝置等。 The object to be processed in the laser patterning apparatus of the present embodiment is a workpiece having an ITO thin film formed on a substrate, and the ITO thin film is partially removed by irradiating the ITO thin film on the workpiece with laser light (processed light). Patterned ITO film. However, the optical processing apparatus according to the present invention is not limited to the laser patterning apparatus according to the present embodiment, and may be applied to an apparatus for performing other patterning processing, an apparatus for performing other processing such as cutting processing, and a non-laser light. It is used as a device for processing light and processing.

第1圖為顯示本實施形態之雷射圖案化裝置主要部份的構造的示意圖。 Fig. 1 is a schematic view showing the configuration of a main portion of a laser patterning device of the present embodiment.

本實施形態的雷射圖案化裝置具備雷射輸出部1、雷射掃描部2、工件輸送部3、以及控制部4。 The laser patterning device of the present embodiment includes a laser output unit 1, a laser scanning unit 2, a workpiece transport unit 3, and a control unit 4.

雷射輸出部1具有作為光源的雷射振盪器11、以及將從雷射振盪器11輸出之作為加工光的雷射光L的光束直徑擴大的擴束器12。 The laser output unit 1 has a laser oscillator 11 as a light source, and a beam expander 12 that expands the beam diameter of the laser beam L as the processed light output from the laser oscillator 11.

雷射掃描部2具有:電掃描器21,其係使反射雷射光L的X軸方向掃描用及Y軸方向掃描用的兩個電鏡21a以步進馬達21b轉動而在X軸方向及Y軸方向使雷射光L掃描的光學掃描手段、以及fθ透鏡22,其係使以電掃描器21掃描的雷射光L聚集於工件35的表面(被加工面)或基材與ITO膜的界面等工件內部(從工件表面僅偏移預定深度之處)的聚光手段。 The laser scanning unit 2 includes an electric scanner 21 that rotates the two electron microscopes 21a for scanning the X-axis direction and the Y-axis direction of the reflected laser light L by the stepping motor 21b in the X-axis direction and the Y-axis. An optical scanning means for scanning the laser beam L in the direction, and an fθ lens 22 for collecting the laser light L scanned by the electric scanner 21 on the surface of the workpiece 35 (the surface to be processed) or the interface between the substrate and the ITO film. A concentrating means of the interior (where the workpiece surface is only offset by a predetermined depth).

雷射輸出部1的雷射振盪器11為雷射驅動器部10所控制。具體而言,雷射驅動器部10與雷射掃描部2的電掃描器21的掃描動作連動而控制雷射振盪器11的發光。雷射振盪器11可以使用例如對基材因熱影響而造成損害較小的100〔ns〕以下之藉由脈衝振盪的脈衝光纖雷射,但也可以使用其他的光源。 The laser oscillator 11 of the laser output unit 1 is controlled by the laser driver unit 10. Specifically, the laser driver unit 10 controls the light emission of the laser oscillator 11 in conjunction with the scanning operation of the electric scanner 21 of the laser scanning unit 2. The laser oscillator 11 can use, for example, a pulsed fiber laser which is pulse-oscillated by 100 [ns] or less which is less damaged by the influence of heat on the substrate, but other light sources can also be used.

第2圖為顯示本實施形態之雷射振盪器11一構造例的示意圖。 Fig. 2 is a schematic view showing a configuration example of the laser oscillator 11 of the embodiment.

本實施形態的雷射振盪器11係稱為MOPA(Master Oscillator Power Amplifier;主振式功率放大器)的脈衝光纖雷射。此雷射振盪器11包含:脈 衝引擎部70,其使種子LD74以脈衝產生器73進行脈衝振盪而產生種子光,以光纖放大器多階段放大;輸出光纖71,其引導從脈衝引擎部70輸出的雷射光L;以及輸出頭部72,其藉由作為平行光束化手段的準直光學系統83形成略平行光束而射出雷射光L。在本實施形態中,僅輸出頭部72設於雷射輸出部1上。 The laser oscillator 11 of the present embodiment is called a pulsed fiber laser of a MOPA (Master Oscillator Power Amplifier). The laser oscillator 11 includes: a pulse The engine unit 70 causes the seed LD 74 to be pulse-oscillated by the pulse generator 73 to generate seed light, and is amplified in multiple stages by the fiber amplifier; the output fiber 71 guides the laser light L output from the pulse engine unit 70; and the output head 72, which emits the laser light L by forming a substantially parallel beam by the collimating optical system 83 as a parallel beaming means. In the present embodiment, only the output head portion 72 is provided on the laser output unit 1.

脈衝引擎部70包含:前置放大器部,其具有光纖78、激光器LD76及耦合器77;以及主要放大器部,其具有光纖82、激光器LD80及耦合器81。光纖使用核心中摻入稀土族元素的雙重包覆構造的光纖,藉由吸收來自激光器LD76的激光,在設於光纖的輸出端、射入端的反射鏡間反覆反射,到達雷射振盪。第2圖中的符號75為遮斷逆向光的隔離器,第2圖中的符號79為去除ASE光的帶通濾波器。 The pulse engine unit 70 includes a preamplifier unit having an optical fiber 78, a laser LD 76, and a coupler 77, and a main amplifier unit having an optical fiber 82, a laser LD 80, and a coupler 81. The optical fiber uses a double-clad structure in which a rare earth element is doped in the core, and by absorbing the laser light from the laser LD 76, it is reflected and reflected between the mirrors disposed at the output end and the incident end of the optical fiber to reach the laser oscillation. Reference numeral 75 in Fig. 2 denotes an isolator for blocking reverse light, and reference numeral 79 in Fig. 2 denotes a band pass filter for removing ASE light.

在本實施形態中,以種子LD74的波長為近紅外光的1064〔nm〕,但可以以第二高諧波的532〔nm〕、第三高諧波的355〔nm〕為首,按照工件材質選擇適當的波長。再者,雷射振盪器11也可以使用對由釩酸釔結晶構成的雷射介質照射激光而產生雷射振盪的YVO4雷射等固體雷射。 In the present embodiment, the wavelength of the seed LD 74 is 1064 [nm] of near-infrared light, but it may be based on the workpiece material of 532 [nm] of the second harmonic and 355 [nm] of the third harmonic. Choose the appropriate wavelength. Further, the laser oscillator 11 may use a solid laser such as a YVO 4 laser that irradiates laser light to a laser medium composed of yttrium vanadate crystal to generate laser oscillation.

雷射掃描部2的電掃描器21的各步進馬達21b為電掃描器控制部20所控制,該各步進馬達21b係使X軸方向掃描用及Y軸方向掃描用的各電鏡21a分別轉動。電掃描器控制部20按照構成加工圖案的線段要素資料(線段起點座標與線段終點座標),控制各步進馬達21b以使電鏡21a的反射面的傾斜角度(對於射入反射面而射來的雷射光的光軸的反射面的傾斜角度)向對應於X軸方向的方向或對應於Y軸方向的方向變化。藉此,可與線段要素的起點及終點的X-Y座標對應,使各電鏡21a從掃描開始傾斜角度轉動到掃描結束傾斜角度。 Each of the stepping motors 21b of the electric scanner 21 of the laser scanning unit 2 is controlled by an electric scanner control unit 20, and each of the stepping motors 21b is configured to scan the respective electron microscopes 21a for X-axis direction scanning and Y-axis direction scanning, respectively. Turn. The electric scanner control unit 20 controls the stepping motor 21b such that the angle of inclination of the reflecting surface of the electron microscope 21a (for the incident reflection surface) in accordance with the line segment element data (the line start point coordinate and the line end point coordinate) constituting the machining pattern. The inclination angle of the reflection surface of the optical axis of the laser light changes in a direction corresponding to the X-axis direction or a direction corresponding to the Y-axis direction. Thereby, the respective electron beams 21a can be rotated from the scanning start tilt angle to the scan end tilt angle in accordance with the X-Y coordinates of the start point and the end point of the line element.

再者,在本實施形態中,作為光學掃描手段,X軸方向掃描與Y軸方向掃描皆由電掃描器構成,但不限於此,可使用廣為人知的光學掃描手段。此外,X軸方向掃描用的光學掃描手段與Y軸方向掃描用的光學掃描手段可以是不同構造的光學掃描手段。例如,如第3圖所示,Y軸方向掃描用的掃描手段可以使用電掃描器21,X軸方向掃描用的掃描手段可以使用以馬達91b使多面鏡91a旋轉的多面鏡掃描器91。如第3圖所示,X軸方向 的光學掃描控制可基於受光時序來進行,該受光時序係經由透鏡92而以光學感測器93接收以多面鏡91a反射的雷射光L。 Further, in the present embodiment, the X-axis direction scanning and the Y-axis direction scanning are both constituted by an electric scanner as an optical scanning means. However, the present invention is not limited thereto, and a well-known optical scanning means can be used. Further, the optical scanning means for scanning in the X-axis direction and the optical scanning means for scanning in the Y-axis direction may be optical scanning means having different structures. For example, as shown in Fig. 3, the scanning means for scanning in the Y-axis direction can use the electric scanner 21, and the scanning means for scanning in the X-axis direction can use the polygon mirror scanner 91 which rotates the polygon mirror 91a with the motor 91b. As shown in Figure 3, the X-axis direction The optical scanning control can be performed based on the light receiving timing, which receives the laser light L reflected by the polygon mirror 91a via the lens 92 via the optical sensor 93.

雷射掃描部2裝載於可在主掃描方向(X軸方向)移動的滑架25上。滑架25安裝於驅動滑輪27a及從動滑輪27b上所架設的時序皮帶27上。時序皮帶27藉由使連接於驅動滑輪27a的步進馬達26驅動而移動,時序皮帶27上的滑架25沿著延伸於主掃描方向的線性導軌29(參照第4圖)而向主掃描方向(X軸方向)移動。滑架25的主掃描方向位置可基於來自線性編碼器28的輸出信號(位址信號)而檢測出來。步進馬達26藉由主掃描控制部24來控制。 The laser scanning unit 2 is mounted on a carriage 25 that is movable in the main scanning direction (X-axis direction). The carriage 25 is attached to the timing belt 27 which is mounted on the drive pulley 27a and the driven pulley 27b. The timing belt 27 is moved by driving the stepping motor 26 connected to the driving pulley 27a, and the carriage 25 on the timing belt 27 is oriented in the main scanning direction along the linear guide 29 (refer to FIG. 4) extending in the main scanning direction. (X-axis direction) moves. The position of the main scanning direction of the carriage 25 can be detected based on the output signal (address signal) from the linear encoder 28. The stepping motor 26 is controlled by the main scanning control unit 24.

再者,在本實施形態中,作為裝載雷射掃描部2的滑架25的移動手段,採用藉由時序皮帶的移動手段,但不限於此,線性架等可直線移動的手段也可以代用,也可以藉由使其向二維方向移動的移動手段。 In the present embodiment, the moving means of the carriage 25 on which the laser scanning unit 2 is mounted is a moving means by a time-series belt. However, the present invention is not limited thereto, and a linearly movable means such as a linear frame may be used instead. It is also possible to move by moving it in a two-dimensional direction.

工件輸送部3具備由驅動輥32a與從動輥32b構成的對位輥對32,而驅動輥32a經由時序皮帶31a藉由步進馬達構成的對位馬達31來驅動。對位馬達31為副掃描控制部30所控制,可使由對位輥對32夾持的工件35向副掃描方向(Y軸方向)的目標進給位置移動。藉此,將工件上的被加工部份依次送到從雷射掃描部2照射的雷射光L的掃描範圍的加工區域36。 The workpiece transport unit 3 includes a registration roller pair 32 composed of a drive roller 32a and a driven roller 32b, and the drive roller 32a is driven by a registration motor 31 constituted by a stepping motor via a timing belt 31a. The registration motor 31 is controlled by the sub-scanning control unit 30, and can move the workpiece 35 held by the registration roller pair 32 to the target feeding position in the sub-scanning direction (Y-axis direction). Thereby, the processed portion on the workpiece is sequentially sent to the processing region 36 of the scanning range of the laser light L irradiated from the laser scanning portion 2.

具體而言,工件輸送部3具備監控攝影機33、34,該監控攝影機33、34係拍攝形成於工件35的主掃描方向兩端附近的工件表面的對準標記37(基準位置)。副掃描控制部30一面藉由對位馬達31將工件35微量地向工件進給方向B(副掃描方向)步進進給,一面依次擷取從監控攝影機33、34輸出的圖像資料。然後,藉由圖案匹配處理等檢測對準標記37,運算到目標進給位置的工件移動量,基於所運算的結果控制對位馬達31,使工件35的副掃描方向位置移動到目標進給位置。 Specifically, the workpiece transport unit 3 includes monitoring cameras 33 and 34 that capture alignment marks 37 (reference positions) formed on the surface of the workpiece in the vicinity of both ends in the main scanning direction of the workpiece 35. The sub-scanning control unit 30 sequentially feeds the image data output from the monitoring cameras 33 and 34 while the workpiece 35 is stepwise fed in the workpiece feeding direction B (sub-scanning direction) by the registration motor 31. Then, the alignment mark 37 is detected by pattern matching processing or the like, the workpiece movement amount to the target feeding position is calculated, and the registration motor 31 is controlled based on the calculated result to move the sub-scanning direction position of the workpiece 35 to the target feeding position. .

第4圖為顯示工件輸送部3的一構造例的示意圖,第5圖為其俯視圖。 Fig. 4 is a schematic view showing a structural example of the workpiece conveying unit 3, and Fig. 5 is a plan view thereof.

本實施形態的工件35在供應捲軸51上被捲成卷狀的狀態保持於作為捲出保持部的卷供應部50,由該處捲出的工件部份沿著入口導板52而被對位 輥對32的輥隙所夾持,藉由對位輥對32的驅動,而被設定在作為加工台構件的加工台53上。供應捲軸51經由作為傳達扭矩變更手段的捲出用粉粒離合器59而連接於由DC馬達構成的捲出馬達56,並構成為以捲出馬達56的驅動力可向捲出工件35的方向旋轉驅動。 The workpiece 35 of the present embodiment is held in a roll shape on the supply reel 51 in a roll supply portion 50 as a take-up holding portion, and the workpiece portion rolled up there is aligned along the inlet guide 52. The nip of the roller pair 32 is nipped, and is driven by the registration roller pair 32 to be set on the processing table 53 as a processing table member. The supply reel 51 is connected to the unwinding motor 56 composed of a DC motor via a winding-out particle clutch 59 as a transmission torque changing means, and is configured to be rotatable in a direction in which the workpiece 35 is wound by the driving force of the winding-out motor 56. drive.

加工台53以穿透雷射光L的透光構件形成。藉此,可抑制雷射光L對加工台53的損害,並可延長加工台53的壽命。 The processing table 53 is formed with a light transmitting member that penetrates the laser light L. Thereby, damage of the processing light 53 by the laser light L can be suppressed, and the life of the processing stage 53 can be lengthened.

此外,加工台53的表面(台面)上形成有無數個細孔(吸引孔),藉由吸入泵58抽吸形成於加工台53背面的空洞部57的空氣,使工件35吸附於加工台53的表面,確保工件35在加工區域36的平坦性。在本實施形態中,對於吸附於加工台53表面上的狀態的工件35進行加工處理時,藉由由作為制動手段的電磁制動器構成的對位制動器38使對位輥對32成為不能旋轉,以免工件35因對位輥對32而移動。藉此,可在加工處理中禁止工件35因對位輥對32而移動,可實現穩定的加工處理。 Further, an innumerable number of pores (suction holes) are formed in the surface (stage) of the processing table 53, and the air formed in the cavity portion 57 formed on the back surface of the processing table 53 is sucked by the suction pump 58 to adsorb the workpiece 35 to the processing table 53. The surface ensures the flatness of the workpiece 35 in the processing zone 36. In the present embodiment, when the workpiece 35 in the state of being adsorbed on the surface of the processing table 53 is processed, the registration roller pair 32 is prevented from rotating by the registration brake 38 composed of the electromagnetic brake serving as the braking means, thereby preventing the workpiece roller 32 from rotating. The workpiece 35 is moved by the registration roller pair 32. Thereby, the workpiece 35 can be prevented from moving by the registration roller pair 32 during the processing, and stable processing can be realized.

加工後的工件在捲取捲軸67上捲取成卷狀,保持於作為捲取保持部的卷排出部60。捲取捲軸67經由作為傳達扭矩變更手段的捲取用粉粒離合器63而連接於由DC馬達構成的捲取馬達62,構成為可以以捲取馬達62的驅動力向捲取工件35的方向旋轉驅動。 The processed workpiece is wound up in a roll shape on the take-up reel 67 and held in the roll discharge portion 60 as a take-up holding portion. The take-up reel 67 is connected to a take-up motor 62 composed of a DC motor via a take-up toner clutch 63 as a torque transmission means, and is configured to be rotatable in a direction in which the workpiece 35 is wound by the driving force of the take-up motor 62. drive.

在本實施形態中,加工後的工件構成為藉由一對清潔輥64清除附著於其表面的加工塵埃後,被捲取於捲取捲軸67上。吸附於清潔輥64的加工塵埃被轉印於黏著輥65後被回收。此外,為了保護加工後的工件表面以防止磨擦等傷痕,在加工後的工件35的表裡貼上層壓薄膜後再捲取於捲取捲軸67上。層壓薄膜係從層壓卷66捲出,與加工後的工件一起被捲入捲取捲軸67。 In the present embodiment, the processed workpiece is configured such that the processed dust adhering to the surface thereof is removed by the pair of cleaning rollers 64, and then wound up on the take-up reel 67. The processed dust adsorbed on the cleaning roller 64 is transferred to the adhesive roller 65 and recovered. Further, in order to protect the surface of the workpiece after processing to prevent scratches such as abrasion, a laminated film is attached to the front surface of the processed workpiece 35, and then wound up on the take-up reel 67. The laminated film is taken up from the laminated roll 66 and taken up into the take-up reel 67 together with the processed workpiece.

再者,在本實施形態中,係將加工後的工件捲取成卷狀的卷對卷(roll to roll)方式,但也可以如第6圖所示,採用將加工後的工件形成切片而排出的卷對片(roll to sheet)方式。在第6圖所例示的構造方面,加工後的工件藉由使切刀54向主掃描方向移動,裁斷成各個預定尺寸,排出到托盤55。 Further, in the present embodiment, the processed workpiece is wound into a roll-to-roll roll-to-roll method, but as shown in Fig. 6, the processed workpiece may be sliced. The roll to sheet method of discharge. In the configuration exemplified in Fig. 6, the processed workpiece is cut into individual predetermined sizes by moving the cutter 54 in the main scanning direction, and is discharged to the tray 55.

控制部4具備將整個本雷射圖案化裝置統一而進行管理、控 制的控制PC40。控制PC40連接於雷射驅動器部10、電掃描器控制部20、主掃描控制部24、副掃描控制部30等,管理各個狀態或控制加工順序。 The control unit 4 includes a unified management and control of the entire laser patterning device. Control system PC40. The control PC 40 is connected to the laser driver unit 10, the electric scanner control unit 20, the main scanning control unit 24, the sub-scanning control unit 30, and the like, and manages each state or controls the processing sequence.

雷射輸出部1的擴束器12以由複數片組成的透鏡構成,構成為在雷射光路徑上最接近雷射掃描部2的fθ透鏡22的透鏡39的位置可向雷射光的光軸方向移動。裝載雷射掃描部2的滑架在停止於主掃描方向的各停止目標位置時藉由使透鏡39的位置移動可微調聚光距離為一致。即,擴束器12具備將射入電掃描器21的雷射光L微調成平行光束的聚焦功能。 The beam expander 12 of the laser output unit 1 is constituted by a lens composed of a plurality of sheets, and is configured such that the position of the lens 39 of the fθ lens 22 closest to the laser scanning unit 2 on the laser light path can be directed to the optical axis of the laser light. mobile. When the carriage on which the laser scanning unit 2 is mounted stops at the respective stop target positions in the main scanning direction, the position of the lens 39 is moved to finely adjust the condensing distance. That is, the beam expander 12 has a focusing function of finely adjusting the laser light L incident on the electric scanner 21 into a parallel beam.

在本實施形態中,雷射光L對於工件35的掃描範圍即加工區域36的X軸方向及Y軸方向的各最大長度L,若設fθ透鏡22的焦距為f,則使用各電鏡21a的最大傾斜角度θ(例如±20°),由下式(1)得到:L=f×θ…(1) In the present embodiment, when the scanning range of the laser light L to the workpiece 35, that is, the maximum length L in the X-axis direction and the Y-axis direction of the processing region 36, the focal length of the fθ lens 22 is f, the maximum of each electron microscope 21a is used. The inclination angle θ (for example, ±20°) is obtained by the following formula (1): L = f × θ (1)

如此式(1)所示,加工區域36的寬度會受到電掃描器21的掃描範圍(電鏡21a的最大傾斜角度)限制。此處,由於電掃描器21的掃描範圍越擴大,越難在工件35上適當地聚光,所以難以維持加工區域36內的加工均勻性。因此,要擴大電掃描器21的掃描範圍即電鏡21a的最大傾斜角度θ也有限。因而,要擴大電掃描器21的掃描範圍(電鏡21a的最大傾斜角度θ)來擴大加工區域36的寬度有限。 As shown in the equation (1), the width of the processing region 36 is limited by the scanning range of the electric scanner 21 (the maximum inclination angle of the electron microscope 21a). Here, since the scanning range of the electric scanner 21 is larger, it is more difficult to appropriately condense on the workpiece 35, so that it is difficult to maintain the processing uniformity in the processing region 36. Therefore, it is also limited to enlarge the scanning range of the electric scanner 21, that is, the maximum inclination angle θ of the electron microscope 21a. Therefore, the scanning range of the electric scanner 21 (the maximum inclination angle θ of the electron microscope 21a) is enlarged to expand the width of the processing region 36 to be limited.

另一方面,根據前述式(1),若加長fθ透鏡22的焦距f,則可擴大加工區域36的寬度。然而,越加長此焦距f,越需要從工件35使fθ透鏡22遠離來配置,也就產生了雷射圖案化裝置大型化的問題。 On the other hand, according to the above formula (1), if the focal length f of the fθ lens 22 is lengthened, the width of the processed region 36 can be enlarged. However, as the focal length f is increased, the more the fθ lens 22 needs to be disposed away from the workpiece 35, the problem arises in that the size of the laser patterning device is increased.

此外,X軸方向及Y軸方向的各加工解析度σ,若設步進馬達21b的脈衝數為P,則由下式(2)得到:σ=f×(2π/P)…(2) Further, the machining resolution σ in the X-axis direction and the Y-axis direction is obtained by the following equation (2) when the number of pulses of the stepping motor 21b is P: σ = f × (2π / P) (2)

如此式(2)所示,越加長fθ透鏡22的焦距f,加工解析度σ越低。因此,實現高加工解析度σ的高精細加工與實現更寬的加工區域在於有折衷取捨(trade-off)的關係。因而,若考慮加工解析度σ時,則要加長焦距f來擴大加工區域36的寬度也有限。 As shown in the equation (2), as the focal length f of the fθ lens 22 is lengthened, the processing resolution σ is lower. Therefore, high-precision processing that achieves high processing resolution σ and realization of a wider processing area are in a trade-off relationship. Therefore, when the machining resolution σ is considered, the length of the machining region 36 is limited by lengthening the focal length f.

另一方面,也考慮設置移動機構的方法,該移動機構係使工件35藉由工件輸送部3不僅向副掃描方向(Y軸方向)移動,而且也向主掃描 方向(X軸方向)移動。若是此方法,則可一面對於加工區域36在主掃描方向依次變換工件35的被加工部份,一面對於各被加工部份進行加工處理,所以對於具有超過加工區域36的主掃描方向長度的工件也可以進行加工處理。 On the other hand, a method of providing a moving mechanism for moving the workpiece 35 not only in the sub-scanning direction (Y-axis direction) but also to the main scanning by the workpiece conveying portion 3 is also considered. The direction (X-axis direction) moves. According to this method, the processed portion of the workpiece 35 can be sequentially changed in the main scanning direction with respect to the processing region 36, and the processed portion can be processed. Therefore, the workpiece having the length exceeding the main scanning direction of the processing region 36 can be processed. It can also be processed.

然而,設置使工件不僅向副掃描方向(Y軸方向)而且也向主掃描方向(X軸方向)移動的移動機構會招致雷射圖案化裝置的大型化。特別是在本實施形態中,由於是具有副掃描方向的工件長度超過加工區域36的長度的較大工件35,所以要使這種較大的工件35進一步也向主掃描方向(X軸方向)移動,需要大型的移動機構。而且,這種較大的工件35的重量也大,所以慣性力大,高速的移動難以實現,也產生生產性低的問題。 However, providing a moving mechanism that moves the workpiece not only in the sub-scanning direction (Y-axis direction) but also in the main scanning direction (X-axis direction) causes an increase in size of the laser patterning device. In particular, in the present embodiment, since the workpiece having the length of the workpiece in the sub-scanning direction exceeds the length of the processing region 36, the larger workpiece 35 is further moved in the main scanning direction (X-axis direction). Moving requires a large mobile mechanism. Further, such a large workpiece 35 has a large weight, so that the inertial force is large, high-speed movement is difficult to achieve, and the problem of low productivity is also generated.

於是,在本實施形態中,有關主掃描方向(X軸方向),採用使雷射光L的掃描範圍向主掃描方向移動,而不是使工件35移動的構造。詳細而言,在滑架25上裝載雷射掃描部2,構成為可向主掃描方向移動雷射掃描部2。藉此,可不使工件35向主掃描方向(X軸方向)移動,而使由電掃描器21掃描的雷射光L掃描工件表面的範圍(即加工區域36)可對於工件35向主掃描方向相對移動。藉此,可使工件35的被加工部份向加工區域36依次移動而進行加工處理,即使主掃描方向(X軸方向)的加工區域36的寬度狹窄,也可以對於超過其寬度的較大工件35進行加工處理。 Therefore, in the present embodiment, the main scanning direction (X-axis direction) is configured such that the scanning range of the laser light L is moved in the main scanning direction instead of moving the workpiece 35. Specifically, the laser scanning unit 2 is mounted on the carriage 25, and is configured to be able to move the laser scanning unit 2 in the main scanning direction. Thereby, the range in which the laser light scanned by the electric scanner 21 is scanned on the surface of the workpiece (that is, the processing region 36) can be made to be opposite to the main scanning direction of the workpiece 35 without moving the workpiece 35 in the main scanning direction (X-axis direction). mobile. Thereby, the processed portion of the workpiece 35 can be sequentially moved to the processing region 36 for processing, and even if the width of the processing region 36 in the main scanning direction (X-axis direction) is narrow, a large workpiece exceeding the width can be used. 35 processing.

其結果,可無需勉強擴大加工區域36而可對於超過加工區域36的較大工件35進行加工處理,並可維持高的加工解析度σ,所以對於較大的工件35可實現高精細的加工。而且,裝載於向主掃描方向(X軸方向)移動的作為移動手段的滑架25上的裝載物在本實施形態中,實質上只是雷射掃描部2,即實質上只是電掃描器21與fθ透鏡22。此裝載物的重量比工件35輕得多,所以可實現滑架25向主掃描方向的高速移動,可得到高的生產性。 As a result, the processing of the large workpiece 35 exceeding the processing region 36 can be performed without forcibly expanding the processing region 36, and the high machining resolution σ can be maintained, so that high-precision machining can be realized for the large workpiece 35. Further, in the present embodiment, the load placed on the carriage 25 as a moving means that moves in the main scanning direction (X-axis direction) is substantially only the laser scanning unit 2, that is, substantially only the electric scanner 21 and Fθ lens 22. Since the weight of the load is much lighter than that of the workpiece 35, high-speed movement of the carriage 25 in the main scanning direction can be achieved, and high productivity can be obtained.

再者,裝載於滑架25上的裝載物至少裝載作為聚光手段的fθ透鏡22即可。因此,最輕量的構造是只將fθ透鏡22裝載於滑架25上的構造。另一方面,只要是相對於工件35是輕的零件,則其他的零件也可以隨著fθ透鏡22一起裝載於滑架25上。例如,如本實施形態,可以將電掃描器21等光學掃描手段裝載於滑架上,也可以將雷射輸出部1的一部份或 全部裝載於滑架上。 Further, the load placed on the carriage 25 may be loaded with at least the fθ lens 22 as a light collecting means. Therefore, the lightest weight configuration is a configuration in which only the fθ lens 22 is mounted on the carriage 25. On the other hand, as long as it is a light component with respect to the workpiece 35, other components may be mounted on the carriage 25 along with the fθ lens 22. For example, in the present embodiment, an optical scanning means such as an electric scanner 21 may be mounted on the carriage, or a part of the laser output unit 1 may be All loaded on the carriage.

此外,在本實施形態中,向主掃描方向移動的滑架25射入雷射光L的光路徑、即從雷射輸出部1輸出的雷射光L的光路徑與X軸方向平行。因此,如第7圖所示,即使滑架25移動到主掃描方向(X軸方向)的任何位置,從雷射輸出部1輸出的雷射光L也會從滑架25的相同地方射入。因而,即使滑架25在主掃描方向(X軸方向)移動,射入滑架25後的雷射光L的光路徑也相同,即使是在主掃描方向互相不同的加工區域36-1、36-2進行加工處理的情況,也可以實現相同的加工處理。 Further, in the present embodiment, the optical path through which the carriage 25 moving in the main scanning direction enters the laser light L, that is, the optical path of the laser light L output from the laser output unit 1 is parallel to the X-axis direction. Therefore, as shown in Fig. 7, even if the carriage 25 is moved to any position in the main scanning direction (X-axis direction), the laser light L output from the laser output unit 1 is incident from the same place of the carriage 25. Therefore, even if the carriage 25 moves in the main scanning direction (X-axis direction), the light path of the laser light L incident on the carriage 25 is the same, even in the processing areas 36-1, 36 which are different from each other in the main scanning direction. 2 In the case of processing, the same processing can be realized.

然而,在本實施形態中,若滑架25移動,則到射入滑架25的雷射光L的光路徑長度會變化。因此,若射入滑架25的雷射光L為非平行收斂,則隨著滑架25的主掃描方向位置,照射於工件35的雷射光L的焦點會變化,工件35上的雷射光L的光點直徑會變化等,對加工精度發生影響。 However, in the present embodiment, when the carriage 25 moves, the length of the optical path of the laser light L incident on the carriage 25 changes. Therefore, if the laser light L incident on the carriage 25 is non-parallel convergence, the focus of the laser light L irradiated to the workpiece 35 changes with the position of the carriage 25 in the main scanning direction, and the laser light L on the workpiece 35 The spot diameter changes, etc., which affects the machining accuracy.

在本實施形態中,從雷射振盪器11輸出的雷射光L為略平行光束,經由兩個反射鏡14、15而從擴束器12射出,以反射鏡16反射而從雷射輸出部1輸出的雷射光L也是略平行光束。因此,若射入滑架25的雷射光L為略平行收斂,則即使滑架25移動而主掃描方向位置改變,照射於工件35的雷射光L的焦點實質上也不變化,不發生工件35上的雷射光L的光點直徑變化等的影響。因此,即使是在主掃描方向互相不同的加工區域36-1、36-2進行加工處理的情況,也可以不進行焦點調整等作業,而以相同的加工精度進行加工處理,可實現更高的生產性。 In the present embodiment, the laser light L output from the laser oscillator 11 is a substantially parallel light beam, is emitted from the beam expander 12 via the two mirrors 14 and 15, and is reflected by the mirror 16 from the laser output unit 1. The output laser light L is also a slightly parallel beam. Therefore, if the laser light L incident on the carriage 25 converges slightly parallel, even if the carriage 25 moves and the position in the main scanning direction changes, the focus of the laser light L irradiated to the workpiece 35 does not substantially change, and the workpiece 35 does not occur. The influence of the change in the spot diameter of the laser light L on the top. Therefore, even in the case where the processing regions 36-1 and 36-2 having different main scanning directions are processed, it is possible to perform processing with the same machining accuracy without performing operations such as focus adjustment, thereby achieving higher processing. Productive.

然而,若形成為除雷射掃描部2外,雷射輸出部1的全部構件也裝載於滑架25上的構造,亦即,若形成為將雷射振盪器11等光源本身裝載於滑架25上的構造,則即使滑架25移動,也不會產生照射於工件35的雷射光L的焦點有變化之類的情形。然而,由於滑架25上的裝載物的重量變大,所以需考慮難以實現滑架25高速移動這一點。 However, if it is formed in addition to the laser scanning unit 2, all the members of the laser output unit 1 are also mounted on the carriage 25, that is, if the light source itself such as the laser oscillator 11 is formed on the carriage. With the structure of 25, even if the carriage 25 moves, the focus of the laser light L irradiated to the workpiece 35 does not change. However, since the weight of the load on the carriage 25 becomes large, it is considered that it is difficult to realize the high speed movement of the carriage 25.

第8圖為顯示本實施形態之雷射圖案化裝置的圖案化加工處理一例的流程圖。 Fig. 8 is a flow chart showing an example of a patterning process of the laser patterning device of the embodiment.

控制PC40首先使工件35沿著副掃描方向向工件輸送方向B移動,執 行使其在目標進給位置停止的工件進給處理(S2),但在該工件進給處理之前,開始吸入泵58的驅動(S1),形成使工件35吸附於加工台53上的狀態。因此,在本實施形態中,對於藉由吸入泵58的吸引力吸附於加工台53上的狀態的工件35,執行工件進給處理。工件35藉由工件進給處理而在目標進給位置停止時,由於在藉由吸入泵58的吸引力於加工台53上來吸附工件35的狀態,所以工件35的位置被保持成不容易移動。工件進給處理的具體說明,後述之。 The control PC 40 first moves the workpiece 35 in the sub-scanning direction to the workpiece conveying direction B, The workpiece feeding process (S2) is stopped at the target feeding position, but before the workpiece feeding process, the driving of the suction pump 58 is started (S1), and the workpiece 35 is attracted to the processing table 53. Therefore, in the present embodiment, the workpiece feeding process is performed on the workpiece 35 in a state of being attracted to the processing table 53 by the suction force of the suction pump 58. When the workpiece 35 is stopped at the target feeding position by the workpiece feeding process, the state of the workpiece 35 is held so as not to easily move due to the state in which the workpiece 35 is sucked by the suction force of the suction pump 58 on the processing table 53. The specific description of the workpiece feeding process will be described later.

其後,控制PC40將用人特別指定工件35上的被加工部份的被加工部份號碼N設定為0之後(S3),藉由主掃描控制部24控制步進馬達26,進行滑架位置的初始化處理:使在待命位置待命的滑架25沿著主掃描方向而向滑架進給方向A(離開雷射輸出部1的方向)移動,使其在預定的起始位置停止(S4)。 Thereafter, the control PC 40 sets the number N of the processed portion of the workpiece to be processed on the workpiece 35 to 0 (S3), and the stepping motor 26 is controlled by the main scanning control unit 24 to perform the carriage position. Initialization processing: The carriage 25 that stands by at the standby position is moved in the main scanning direction toward the carriage feeding direction A (the direction away from the laser output portion 1) to stop at the predetermined starting position (S4).

在此初始化處理中,控制PC40基於來自線性編碼器28的位址信號取得在起始位置停止的滑架25的主掃描方向位置。具體而言,控制PC40基於來自線性編碼器28的位址信號,檢測所管理的起始位置與實際停止的滑架25的位置的差異,以此差異為偏移值,用於控制其後的滑架25的主掃描方向位置。 In this initialization processing, the control PC 40 acquires the position of the main scanning direction of the carriage 25 stopped at the home position based on the address signal from the linear encoder 28. Specifically, the control PC 40 detects the difference between the managed start position and the position of the actually stopped carriage 25 based on the address signal from the linear encoder 28, and the difference is an offset value for controlling the subsequent The position of the carriage 25 in the main scanning direction.

其次,控制PC40將工件35的被加工部份號碼N設定為1(S5)。其後,控制PC40藉由主掃描控制部24控制步進馬達26,使位於起始位置的滑架25向滑架進給方向A移動,使其停止在用以加工進行最初加工處理的處理工件35上的第一被加工部份N=1的第一加工位置(S6)。 Next, the control PC 40 sets the processed portion number N of the workpiece 35 to 1 (S5). Thereafter, the control PC 40 controls the stepping motor 26 by the main scanning control unit 24 to move the carriage 25 at the home position to the carriage feeding direction A to stop the processing of the workpiece for processing the initial processing. A first processing position of the first processed portion N = 1 on 35 (S6).

此處,在本實施形態中,為了實現位置精度5μm以下的高加工解析度,將由電掃描器21掃描的工件上的雷射光掃描範圍(即加工區域36)的尺寸設定為150〔mm〕×150〔mm〕。因此,對於被加工區域為例如450〔mm〕(主掃描方向)×600〔mm〕(副掃描方向)的工件35進行加工處理時,將該被加工區域向主掃描方向分割為3個待加工件,向副掃描方向分割為4個待加工件。然後,依次加工處理此等12個待加工件(被加工部份N=1~12),藉此進行整個被加工區域的加工處理。 Here, in the present embodiment, in order to achieve a high processing resolution of a positional accuracy of 5 μm or less, the size of the laser light scanning range (that is, the processing region 36) on the workpiece scanned by the electric scanner 21 is set to 150 [mm] × 150 [mm]. Therefore, when the workpiece 35 having a processed region of, for example, 450 [mm] (main scanning direction) × 600 [mm] (sub-scanning direction) is processed, the processed region is divided into three to be processed in the main scanning direction. The piece is divided into four pieces to be processed in the sub-scanning direction. Then, the 12 workpieces to be processed (the processed portions N = 1 to 12) are processed in order, whereby the processing of the entire processed region is performed.

即,反覆下述動作:使滑架25從起始位置依次移動到第一 加工位置、第二加工位置、第三加工位置,在各加工位置進行工件35上之對應的被加工部份的加工處理,第三加工位置的加工處理結束之後,回到起始位置(S5~S8)。另一方面,有關副掃描方向,滑架25向第三加工位置移動並結束加工處理之後(S8的“是”),在其次開始第一加工位置的加工處理之前,控制PC40和處理步驟S2同樣,執行使工件35向工件輸送方向B只移動150〔mm〕並保持的工件進給處理(S10)。然後,再使滑架25依次移動到第一加工位置、第二加工位置、第三加工位置,進行加工處理(S4~S8)。反覆這種動作4次之後(S9的“是”)則450〔mm〕×600〔mm〕的整個被加工區域的加工處理完畢。 That is, the following actions are repeated: moving the carriage 25 from the starting position to the first The machining position, the second machining position, and the third machining position are processed at the respective machining positions by the corresponding machining portions on the workpiece 35, and after the machining processing at the third machining position is completed, the machining position is returned to the starting position (S5~) S8). On the other hand, in the sub-scanning direction, after the carriage 25 moves to the third machining position and ends the machining process (Yes in S8), the control PC 40 and the process step S2 are the same before the machining process of the first machining position is started next. The workpiece feeding process (S10) of moving the workpiece 35 to the workpiece conveying direction B by only 150 [mm] is performed. Then, the carriage 25 is sequentially moved to the first processing position, the second processing position, and the third processing position, and processing is performed (S4 to S8). After repeating this operation four times (Yes in S9), the processing of the entire processed region of 450 [mm] × 600 [mm] is completed.

如本實施形態,在將卷狀的工件35部份地捲出而進行加工時,將下述動作反覆進行到卷終端(S2~S11):使滑架25依次移動到第一加工位置、第二加工位置、第三加工位置並進行加工處理後,使工件35向工件輸送方向B移動150〔mm〕。然後,到達卷終端之後(S11的“是”),停止吸入泵58的驅動(S12),結束處理。 In the present embodiment, when the roll-shaped workpiece 35 is partially unwound and processed, the following operations are repeated to the winding end (S2 to S11): the carriage 25 is sequentially moved to the first machining position, and After the second processing position and the third processing position are processed, the workpiece 35 is moved by 150 [mm] in the workpiece conveying direction B. Then, after reaching the volume terminal (YES in S11), the driving of the suction pump 58 is stopped (S12), and the processing is terminated.

其次,就向副掃描方向使工件35移動的工件進給處理進行說明。 Next, the workpiece feeding process for moving the workpiece 35 in the sub-scanning direction will be described.

第9圖為顯示本實施形態之工件進給處理的流程一例的流程圖。 Fig. 9 is a flow chart showing an example of the flow of the workpiece feeding process of the embodiment.

在本實施形態的工件進給處理中,控制PC40首先通電於由步進馬達構成的對位馬達31而形成勵磁狀態後(S21),開始捲取馬達62的驅動(S22)。此時,使捲取用粉粒離合器63以預定的電流值成為通電狀態,因被控制而得到所要的傳達扭矩,所以捲取捲軸67藉由捲取馬達62的驅動扭矩而旋轉驅動,在捲取捲軸67上捲取工件35。藉由此工件捲取動作,從將工件35保持成卷狀的卷供應部50拉出工件35,向副掃描方向輸送加工台53上的工件35。 In the workpiece feeding process of the present embodiment, the control PC 40 first energizes the registration motor 31 composed of the stepping motor to form an exciting state (S21), and starts driving of the winding motor 62 (S22). At this time, the winding clutch 63 is brought into a current state with a predetermined current value, and the desired transmission torque is obtained by the control. Therefore, the winding reel 67 is rotationally driven by the driving torque of the winding motor 62. The workpiece 35 is taken up on the take-up reel 67. By the workpiece winding operation, the workpiece 35 is pulled out from the roll supply unit 50 that holds the workpiece 35 in a roll shape, and the workpiece 35 on the processing table 53 is conveyed in the sub-scanning direction.

此處,在本實施形態中,如上述,在工件進給處理之前,吸入泵58已經驅動,成為在加工台53上吸附工件35的狀態。因此,流至捲取用粉粒離合器63的電流值被設定成抗拒其吸附的輸送負荷而可得到以下傳達扭矩:即可確保能向副掃描方向輸送工件35的輸送力的傳達扭矩。 Here, in the present embodiment, as described above, the suction pump 58 is already driven before the workpiece feeding process, and the workpiece 35 is sucked on the processing table 53. Therefore, the current value of the flow-to-coil-pulp clutch 63 is set to a conveyance load that resists adsorption, and the following transmission torque can be obtained: a transmission torque that can convey the conveyance force of the workpiece 35 in the sub-scanning direction can be ensured.

此外,在捲取馬達62捲取工件的動作中,對位制動器38成為OFF,勵 磁狀態的對位馬達31的負荷成為輸送負荷。因此,流至捲取用粉粒離合器63的電流值被設定成即使有對位馬達31的輸送負荷,也得到可確保可輸送工件35的輸送力的傳達扭矩。 Further, in the operation of winding up the workpiece by the winding motor 62, the registration brake 38 is turned OFF, and the excitation is performed. The load of the registration motor 31 in the magnetic state becomes a conveyance load. Therefore, the current value flowing to the take-up fine particle clutch 63 is set to a transmission torque that ensures the transporting force of the transportable workpiece 35 even if the transport load of the registration motor 31 is present.

此外,藉由捲取馬達62捲取工件的動作中,捲出用粉粒離合器59也以預定的電流值形成通電狀態,被控制成得到所要的傳達扭矩,並且捲出馬達56也驅動。在只以捲取馬達62捲取工件的動作而從卷供應部50捲出工件35時,作用於卷供應部50與卷排出部60之間的工件35的張力可能會因在卷供應部50產生的輸送負荷而變得過大。然而,即使有在卷供應部50產生的輸送負荷,只要作用於工件35的張力不要變得過大,則也不一定要進行捲出馬達56捲出工件的動作。 Further, in the operation of winding up the workpiece by the take-up motor 62, the winding-out particle clutch 59 is also energized at a predetermined current value, controlled to obtain a desired transmission torque, and the unwinding motor 56 is also driven. When the workpiece 35 is unwound from the winding supply unit 50 by the operation of winding the workpiece by the winding motor 62, the tension of the workpiece 35 acting between the winding supply unit 50 and the roll discharge unit 60 may be caused by the roll supply unit 50. The resulting conveying load becomes too large. However, even if there is a conveyance load generated in the roll supply unit 50, as long as the tension acting on the workpiece 35 does not become excessively large, the operation of the unwinding motor 56 to unwind the workpiece is not necessarily required.

一面不僅進行捲取馬達62捲取工件的動作,而且也進行捲出馬達56捲出工件的動作,一面從卷供應部50捲出工件35時,捲出馬達56與捲取馬達62的轉數設定成:藉由捲取馬達62捲取工件的動作而向卷排出部60捲取工件35的速度比藉由捲出馬達56捲出工件的動作而從卷供應部50捲出工件35的速度稍快。藉此,可防止卷供應部50與卷排出部60之間的工件35在副掃描方向成為鬆弛的狀態。此時,適當設定流至捲出用粉粒離合器59及捲取用粉粒離合器63的電流值,以免在卷供應部50與卷排出部60之間的工件35產生向副掃描方向的過大的張力。藉由本實施形態,可將作用於工件35的張力維持在適當的張力,其結果可抑制因工件鬆弛或伸展而致加工精度的惡化。 The number of revolutions of the unwinding motor 56 and the winding motor 62 is performed not only when the winding motor 62 is wound up by the winding motor 56 but also when the winding motor 56 is wound out of the workpiece, and the workpiece 35 is unwound from the winding supply unit 50. The speed at which the workpiece 35 is taken up by the winding motor 62 by the winding motor 62 is wound at a speed higher than the speed at which the workpiece 35 is unwound from the winding supply unit 50 by the operation of winding the workpiece by the winding motor 56. Slightly faster. Thereby, the workpiece 35 between the roll supply unit 50 and the roll discharge unit 60 can be prevented from being slack in the sub-scanning direction. At this time, the current value flowing to the take-up fine particle clutch 59 and the take-up fine particle clutch 63 is appropriately set so as not to cause excessive occurrence of the workpiece 35 between the roll supply portion 50 and the roll discharge portion 60 in the sub-scanning direction. tension. According to this embodiment, the tension acting on the workpiece 35 can be maintained at an appropriate tension, and as a result, the deterioration of the machining accuracy due to the slack or stretch of the workpiece can be suppressed.

如此一來,從卷供應部50捲出工件35,將加工台53上的工件35向副掃描方向僅輸送規定量之後,接通對位制動器38(S23),使對位輥對32成為不能旋轉。藉此,夾持於對位輥對32的工件35禁止向副掃描方向移動,形成於工件35表面的對準標記37位於監控攝影機33、34的拍攝區域內。此時,藉由控制對位制動器38使工件35的輸送停止,可立刻且確實停止工件35的輸送,可精度良好地控制工件35的輸送停止位置。 In this manner, the workpiece 35 is taken up from the roll supply unit 50, and the workpiece 35 on the processing table 53 is conveyed only by a predetermined amount in the sub-scanning direction, and then the registration brake 38 is turned on (S23), so that the registration roller pair 32 cannot be made. Rotate. Thereby, the workpiece 35 held by the registration roller pair 32 is prohibited from moving in the sub-scanning direction, and the alignment marks 37 formed on the surface of the workpiece 35 are located in the imaging regions of the monitoring cameras 33 and 34. At this time, by stopping the conveyance of the workpiece 35 by the registration brake 38, the conveyance of the workpiece 35 can be stopped immediately and surely, and the conveyance stop position of the workpiece 35 can be accurately controlled.

工件35停止之後,控制PC40從拍攝加工台53上的工件35的監控攝影機33、34的圖像資料檢測工件35上的對準標記37(S24)。然後,從對準標記37的檢測結果運算工件到目標進給位置的移動量(S25),基於其 運算結果使副掃描控制部30控制對位馬達31(S26)。此時,斷開對位制動器38。藉此,工件35藉由對位輥對32輸送到目標進給位置,將工件35就輸送所運算出的工件移動量之後(S27),接通對位制動器38(S28),使工件35的輸送停止。其結果,工件35被高精度地定位在朝目標進給的位置。使工件35的輸送停止後,使對位馬達31和捲取馬達62都停止(S29、S30)。此外,按照需要,也使捲出馬達56停止。 After the workpiece 35 is stopped, the control PC 40 detects the alignment mark 37 on the workpiece 35 from the image data of the monitoring cameras 33, 34 of the workpiece 35 on the processing table 53, (S24). Then, the amount of movement of the workpiece to the target feed position is calculated from the detection result of the alignment mark 37 (S25), based on As a result of the calculation, the sub-scanning control unit 30 controls the registration motor 31 (S26). At this time, the registration brake 38 is turned off. Thereby, the workpiece 35 is conveyed to the target feeding position by the registration roller pair 32, and after the workpiece 35 is conveyed by the calculated workpiece movement amount (S27), the registration brake 38 is turned on (S28), so that the workpiece 35 is The delivery stops. As a result, the workpiece 35 is positioned with high precision at a position to be fed toward the target. After the conveyance of the workpiece 35 is stopped, both the registration motor 31 and the winding motor 62 are stopped (S29, S30). Further, the unwinding motor 56 is also stopped as needed.

此處,在本實施形態中,從監控攝影機33、34的圖像資料檢測工件35上的對準標記37,進行工件35的位置檢測。在這種位置檢測方面,若工件35的Z軸方向位置,即加工台53表面的法線方向的工件35的位置變化時,則會產生工件35的位置檢測誤差,無法檢測工件35的正確位置。此情況,會產生工件到目標進給位置的工件移動量與運算結果的誤差,無法將工件35向目標進給位置高精度地定位。特別是如本實施形態,由於是從捲成卷狀的狀態的工件來捲出的構造,所以捲成卷狀時的彎曲或撓曲會留在加工台53上的工件35上,工件35的Z軸方向位置容易變化。 Here, in the present embodiment, the alignment marks 37 on the workpiece 35 are detected from the image data of the monitoring cameras 33 and 34, and the position detection of the workpiece 35 is performed. In the position detection, if the position of the workpiece 35 in the Z-axis direction, that is, the position of the workpiece 35 in the normal direction of the surface of the processing table 53, changes the position detection error of the workpiece 35, the correct position of the workpiece 35 cannot be detected. . In this case, an error in the amount of movement of the workpiece from the workpiece to the target feed position and the calculation result are generated, and the workpiece 35 cannot be accurately positioned to the target feed position. In particular, according to the present embodiment, since the structure is wound out from the workpiece wound in a roll state, the bending or deflection when wound into a roll shape remains on the workpiece 35 on the processing table 53, and the workpiece 35 is The position in the Z-axis direction is easily changed.

在本實施形態中,吸入泵58在工件進給處理之前已經驅動,成為在加工台53上吸附工件35的狀態。因此,藉由監控攝影機33、34拍攝工件35上的對準標記37時,也成為在加工台53上吸附工件35的狀態,其拍攝區域內的工件35經常確保平坦性。藉此,拍攝區域內的工件35的Z軸方向位置不變化,所以基於監控攝影機33、34的圖像資料可檢測工件35的正確位置,可將工件35向目標進給位置高精度地定位。 In the present embodiment, the suction pump 58 is already driven before the workpiece feeding process, and the workpiece 35 is sucked on the processing table 53. Therefore, when the alignment marks 37 on the workpiece 35 are imaged by the monitoring cameras 33 and 34, the workpiece 35 is attracted to the processing table 53, and the workpiece 35 in the imaging region often ensures flatness. Thereby, the position of the workpiece 35 in the imaging region in the Z-axis direction does not change. Therefore, the correct position of the workpiece 35 can be detected based on the image data of the monitoring cameras 33 and 34, and the workpiece 35 can be positioned with high precision at the target feeding position.

再者,在本實施形態中,係從監控攝影機33、34的圖像資料檢測工件35的位置的檢測之例,但也可以藉由其他的手段進行工件35的位置檢測。例如,也可以藉由以電氣、磁性或光學的感測器檢測工件上的標記的手段。即使在藉由其他的手段進行工件35的位置檢測時,由於可能會因工件35的Z軸方向位置變化而產生位置檢測誤差,所以在工件移動中使工件吸附於加工台上並確保平坦性是有效的。 Further, in the present embodiment, the detection of the position of the workpiece 35 is detected from the image data of the monitoring cameras 33 and 34. However, the position detection of the workpiece 35 may be performed by another means. For example, means for detecting marks on a workpiece by means of an electrical, magnetic or optical sensor can also be used. Even when the position detection of the workpiece 35 is performed by other means, since the position detection error may occur due to the positional change of the workpiece 35 in the Z-axis direction, the workpiece is attracted to the processing table during the movement of the workpiece and the flatness is ensured. Effective.

第10圖為顯示將工件上的被加工區域分割為12個待加工件而依次進行加工處理時的加工順序的說明圖。 Fig. 10 is an explanatory view showing a processing sequence when the processed area on the workpiece is divided into 12 pieces to be processed and processed in order.

在第10圖中,各被加工部份36-1~36-24所圖示的數字表示加工順 序。 In Fig. 10, the numbers shown in the processed parts 36-1 to 36-24 indicate the processing order. sequence.

若工件上的被加工部份為分別獨立者,則滑架25的各加工位置可以是在各加工區域36為隔開的位置。然而,若被加工部份不是獨立者,而由複數個被加工部份形成一個加工對象時,需使滑架25的各加工位置設在各加工區域36為鄰接或部份重疊的位置。特別是如本實施形態,進行在被加工部份間使配線圖案連接的圖案化加工時,要避免在被加工部份間應連接的配線圖案形成偏移而呈不連接的情形。 If the machined portions on the workpiece are separate, the respective machining positions of the carriage 25 may be spaced apart at each of the machining regions 36. However, if the processed portion is not an individual and a plurality of processed portions are formed into one processing object, the processing positions of the carriage 25 are set such that the respective processing regions 36 are adjacent or partially overlapped. In particular, in the case of the patterning process in which the wiring patterns are connected between the processed portions, the wiring patterns to be connected between the processed portions are prevented from being shifted and are not connected.

在本實施形態中,滑架25伴隨往復移動,有時因與移動方向(主掃描方向)正交的繞軸旋轉的位向誤差,所謂的縱搖誤差,每當滑架25停止時主掃描方向的加工位置都會偏移。此外,工件35的副掃描方向位置也有產生誤差之虞。若在產生這種誤差的狀態下進行加工處理,則在被加工部份間應連接的配線圖案恐會有偏移而致不連接。 In the present embodiment, the carriage 25 is reciprocated, and there is a case where the carriage direction is orthogonal to the movement direction (main scanning direction), and the so-called pitch error is generated every time the carriage 25 is stopped. The machining position of the direction is offset. Further, the position of the workpiece 35 in the sub-scanning direction also has an error. If the processing is performed in a state in which such an error occurs, the wiring pattern to be connected between the processed portions may be offset and may not be connected.

因此,在本實施形態中,於12個待加工件(被加工部份)間設置幾十〔μm〕的重疊區域,將各待加工件(被加工部份)設定成鄰接的被加工部份彼此部份地重疊。藉由設置這種重疊區域,即使產生一些誤差,也可以抑制配線圖案成為不連接。 Therefore, in the present embodiment, an overlapping area of several tens [μm] is set between 12 workpieces (processed portions), and each workpiece to be processed (processed portion) is set to an adjacent processed portion. Partially overlapping each other. By providing such an overlapping region, even if some error occurs, it is possible to suppress the wiring pattern from becoming disconnected.

再者,在本實施形態中,如第1圖所示,在滑架25上配備監控攝影機23,可觀察待加工件(被加工部份)間的重疊區域的加工後的圖案。在本實施形態中,藉由監控攝影機23拍攝重疊區域的加工後的圖案,比較其拍攝圖像資料與目標加工資料來檢測加工後圖案對於目標加工位置的偏移。藉由此檢測結果,微調加工被加工部份時的X-Y座標偏移值,該被加工部份為包含與該加工後的圖案連接的圖案。藉由這種微調,除了修正滑架25的停止目標的位置偏移之外,也修正伴隨滑架25的位向誤差的加工位置偏移,可實現高的加工精度。 Further, in the present embodiment, as shown in Fig. 1, the monitor camera 23 is provided on the carriage 25, and the processed pattern of the overlap region between the workpieces (the processed portions) can be observed. In the present embodiment, the monitor camera 23 captures the processed pattern of the overlap region, compares the captured image data with the target processed material, and detects the offset of the processed pattern from the target processing position. By the result of the detection, the X-Y coordinate offset value at the time of processing the processed portion is finely adjusted, and the processed portion is a pattern including the pattern connected to the processed portion. By such fine adjustment, in addition to correcting the positional shift of the stop target of the carriage 25, the machining position shift accompanying the positional error of the carriage 25 is also corrected, and high machining accuracy can be realized.

第11圖為顯示應在待加工件(被加工部份)間連接的配線圖案一例的說明圖。 Fig. 11 is an explanatory view showing an example of a wiring pattern to be connected between the workpieces to be processed (processed portions).

第11圖中例示跨越被加工部份號碼N=1、N=2、N=4的各待加工件的配線圖案。第11圖中以斜線表示的區域為重疊區域,第11圖中的虛線係表示基於目標加工資料的理想加工位置,第11圖中的實線為加工處理被加 工部份號碼N=1的待加工件(被加工部份)後之實際的配線圖案。 Fig. 11 illustrates a wiring pattern of each workpiece to be processed across the processed portion numbers N = 1, N = 2, and N = 4. The area indicated by oblique lines in Fig. 11 is an overlapping area, and the broken line in Fig. 11 indicates an ideal processing position based on the target processing data, and the solid line in Fig. 11 is added for processing. The actual wiring pattern after the workpiece (processed portion) of the work part number N=1.

如第11圖所示,有關對於待加工件N=1鄰接於主掃描方向(X軸方向)的待加工件N=2及對於待加工件N=2鄰接於主掃描方向(X軸方向)的待加工件N=3,設定Y軸座標的偏移,修正工件35的副掃描方向位置。另一方面,有關對於待加工件N=1鄰接於副掃描方向(Y軸方向)的待加工件N=4及與待加工件N=4並排的待加工件N=7、10,設定X軸座標的偏移,修正滑架25的主掃描方向位置。此等偏移值預先寫入控制PC40的記憶體,於各待加工件的加工處理時讀出,使加工資料的座標原點偏移。 As shown in Fig. 11, the workpiece N = 1 adjacent to the main scanning direction (X-axis direction) for the workpiece to be machined N = 2 and the workpiece to be machined N = 2 adjacent to the main scanning direction (X-axis direction) The workpiece to be processed N=3, the offset of the Y-axis coordinate is set, and the position of the sub-scanning direction of the workpiece 35 is corrected. On the other hand, regarding the workpiece N=1 adjacent to the sub-scanning direction (Y-axis direction) to be processed N=4 and the workpiece N=7, 10 to be processed side by side with the workpiece N=4, set X The offset of the axis coordinates corrects the position of the main scanning direction of the carriage 25. These offset values are written in advance to the memory of the control PC 40, and are read out during the processing of each workpiece to offset the coordinate origin of the processed material.

再者,排列於主掃描方向的待加工件,換言之,由同一滑架進給加工的待加工件,由於藉由線性導軌29的平直度確保平直地直線前進,所以Y軸座標的偏移成為一樣。另一方面,有關排列於副掃描方向的待加工件,由於如上述滑架25的位向產生偏移,所以最好藉由監控攝影機23拍攝鄰接於副掃描方向的待加工件加工後的圖案,以基於其拍攝圖像而新得到的偏移值將已寫入記憶體的X軸座標的偏移更新為最新值。 Furthermore, the workpiece to be processed arranged in the main scanning direction, in other words, the workpiece to be processed which is fed by the same carriage, is ensured to straight straight by the straightness of the linear guide 29, so the deviation of the Y-axis coordinate Move to the same. On the other hand, regarding the workpiece to be processed arranged in the sub-scanning direction, since the orientation of the carriage 25 is shifted, it is preferable to capture the processed pattern of the workpiece to be processed adjacent to the sub-scanning direction by the monitor camera 23. Updates the offset of the X-axis coordinates written to the memory to the latest value based on the offset value newly obtained based on the captured image.

如此,在本實施形態中,藉由滑架25上的監控攝影機23拍攝待加工件(被加工部份)間的重疊區域的加工後的圖案(基準位置),檢測加工後圖案對於目標加工位置的偏移。因此,若監控攝影機23的拍攝區域內的工件35的Z軸方向位置,即加工台53表面的法線方向的工件35的位置變化時,則無法正確地檢測加工後圖案的位置。此情況,無法設定用來修正工件35的副掃描方向位置或主掃描方向位置的適當的偏移值,難以實現高的加工精度。特別是如本實施形態,捲成卷狀時的彎曲或撓曲留在加工台53上的工件35上時,工件35的Z軸方向位置容易變化,實現高的加工精度更加困難。 As described above, in the present embodiment, the processed pattern (reference position) of the overlapping area between the workpieces (the processed portions) is captured by the monitor camera 23 on the carriage 25, and the processed pattern is detected for the target processing position. Offset. Therefore, when the position of the workpiece 35 in the imaging region of the monitoring camera 23 in the Z-axis direction, that is, the position of the workpiece 35 in the normal direction of the surface of the processing table 53, is changed, the position of the processed pattern cannot be accurately detected. In this case, it is not possible to set an appropriate offset value for correcting the position in the sub-scanning direction or the position in the main scanning direction of the workpiece 35, and it is difficult to achieve high machining accuracy. In particular, according to the present embodiment, when the bending or deflection at the time of winding in a roll shape is left on the workpiece 35 on the processing table 53, the position of the workpiece 35 in the Z-axis direction is easily changed, and it is more difficult to achieve high machining accuracy.

在本實施形態中,藉由監控攝影機23拍攝重疊區域的加工後的圖案時,也成為在加工台53上吸附工件35的狀態,其拍攝區域內的工件35經常確保平坦性。藉此,由於拍攝區域內的工件35的Z軸方向位置不變化,所以基於監控攝影機23的圖像資料可檢測加工後圖案的正確位置,可實現高的加工精度。 In the present embodiment, when the monitoring camera 23 captures the processed pattern of the overlap region, the workpiece 35 is attracted to the processing table 53, and the workpiece 35 in the imaging region often ensures flatness. Thereby, since the position of the workpiece 35 in the Z-axis direction in the imaging region does not change, the correct position of the processed pattern can be detected based on the image data of the monitoring camera 23, and high machining accuracy can be realized.

說明本實施形態的例子如下,係藉由雷射光L掃描圖案化加 工工件35的各被加工部份時,工件35及滑架25在停止的狀態進行加工處理。然而,也可以對於向副掃描方向移動中的工件35進行加工處理,並且也可以一面向主掃描方向移動滑架25,一面對於工件35進行加工處理。 An example of the present embodiment is as follows, which is patterned by laser light scanning. When each of the processed portions of the workpiece 35 is processed, the workpiece 35 and the carriage 25 are processed in a stopped state. However, the workpiece 35 that is moving in the sub-scanning direction may be processed, and the workpiece 25 may be processed while moving the carriage 25 in the main scanning direction.

對於向副掃描方向移動中的工件35進行加工處理時,若其加工區域內的工件35的Z軸方向位置變化,則加工光對於加工對象物的焦點位置會變動,無法得到穩定的加工精度。在本實施形態中說明的工件輸送部3,即使在藉由吸入泵使工件35吸附於加工台53上的狀態,也可以實現工件35向副掃描方向的移動。因此,對於向副掃描方向移動中的工件35進行加工處理時,也可以不使加工區域內的工件35的Z軸方向位置變化而進行加工處理,而可以得到穩定的加工精度。 When the workpiece 35 that is moving in the sub-scanning direction is processed, if the position of the workpiece 35 in the Z-axis direction in the processing region changes, the focus position of the machining light on the object to be processed fluctuates, and stable machining accuracy cannot be obtained. In the workpiece transport unit 3 described in the present embodiment, even when the workpiece 35 is sucked onto the processing table 53 by the suction pump, the movement of the workpiece 35 in the sub-scanning direction can be realized. Therefore, when the workpiece 35 that is moving in the sub-scanning direction is processed, the machining process can be performed without changing the position of the workpiece 35 in the Z-axis direction in the machining region, and stable machining accuracy can be obtained.

此外,在本實施形態中,要使工件35穩定地吸附於加工台53上,最好按照工件35的種類(厚度、材質、剛性等)的不同來控制吸入泵58的吸引力。例如,工件35的厚度越厚者或剛性越強大者,要使其穩定地吸附於加工台53上,越需要較大的吸引力。然而,若吸引力過大,則反而有無法確保薄的工件35等的平坦性之虞。因此,最好按照工件35的種類,將吸入泵58控制成適當的吸引力。 Further, in the present embodiment, in order to stably adsorb the workpiece 35 on the processing table 53, it is preferable to control the suction force of the suction pump 58 in accordance with the type (thickness, material, rigidity, and the like) of the workpiece 35. For example, the thicker the workpiece 35 or the stronger the rigidity, the more attractive it is to be stably adsorbed on the processing table 53. However, if the suction force is too large, the flatness of the thin workpiece 35 or the like cannot be ensured. Therefore, it is preferable to control the suction pump 58 to an appropriate suction force in accordance with the type of the workpiece 35.

另一方面,若吸入泵58的吸引力變化,則輸送工件35時的輸送負荷也會變化,所以可穩定輸送工件35,並且將工件35的張力維持在適當範圍所需的扭矩也會隨著變化。因此,在控制吸入泵58的吸引力時,最好按照吸引力也控制捲出用粉粒離合器59或捲取用粉粒離合器63的電流值。 On the other hand, if the suction force of the suction pump 58 changes, the conveying load when the workpiece 35 is conveyed also changes, so that the workpiece 35 can be stably conveyed, and the torque required to maintain the tension of the workpiece 35 in an appropriate range is also Variety. Therefore, when controlling the suction force of the suction pump 58, it is preferable to control the current value of the take-up fine particle clutch 59 or the take-up fine particle clutch 63 in accordance with the suction force.

此外,越輸送工件35,保持於卷供應部50的工件35的卷徑會越來越小,同時保持於卷排出部60的工件35的卷徑會越來越大。若卷徑變化,則工件35輸送中的負荷會變化,所以將工件35的張力維持在適當範圍所需的扭矩會隨著變化。因此,最好按照保持於卷供應部50的工件35的卷徑或按照保持於卷排出部60的工件35的卷徑的變化,來控制捲出用粉粒離合器59或捲取用粉粒離合器63的電流值。 Further, as the workpiece 35 is conveyed, the winding diameter of the workpiece 35 held by the winding supply portion 50 becomes smaller and smaller, and the winding diameter of the workpiece 35 held by the winding discharge portion 60 becomes larger and larger. If the winding diameter changes, the load during the conveyance of the workpiece 35 changes, so the torque required to maintain the tension of the workpiece 35 in an appropriate range changes. Therefore, it is preferable to control the take-up fine particle clutch 59 or the take-up fine particle clutch in accordance with the winding diameter of the workpiece 35 held by the roll supply portion 50 or the change in the winding diameter of the workpiece 35 held by the roll discharge portion 60. The current value of 63.

以上所說明的為一例,以下的各形態都取得特有的效果。 The above description is an example, and each of the following aspects has a unique effect.

(形態A) (Form A)

雷射圖案化裝置等光學加工裝置,具有:使載置於加工台53等的加工台構件台面上的狀態的工件35等之加工對象物移動的工件輸送部3等的移動手段;以及對載置於前述加工台構件台面上的加工對象物部份照射雷射光L等加工光的雷射輸出部1與雷射掃描部2等的光學照射手段,其特徵在於,具有:藉由來自形成於前述加工台構件台面上的細孔等吸引孔的吸引力,使前述加工對象物吸附於該台面的空洞部57與吸入泵58等的吸附手段;以及在藉由前述移動手段移動加工對象物中的預定吸引期間,控制前述吸附手段以使該加工對象物吸附於前述台面的控制PC40等的吸附控制手段。 The optical processing device such as the laser patterning device has a moving means such as a workpiece transporting unit 3 that moves an object to be processed such as a workpiece 35 placed on the surface of the processing table member such as the processing table 53; An optical irradiation means for irradiating the laser output unit 1 such as laser light L or the like and the laser scanning unit 2, which is disposed on the surface of the processing table member, and having an optical irradiation means such as The attraction force of the suction hole such as the pores on the surface of the processing table member, the adsorption means for adsorbing the object to be processed on the cavity portion 57 of the table surface, the suction pump 58, and the like; and moving the object to be processed by the moving means In the predetermined suction period, the adsorption control means for controlling the adsorption means to adsorb the object to be processed on the table surface, such as the control PC 40.

藉由本形態,可在藉由移動手段移動加工對象物中的預定吸引期間,使加工對象物吸附於加工台構件台面上。因此,在使加工對象物移動而進行加工的光學加工裝置,可保持加工對象物的平坦度。 According to this aspect, the object to be processed can be adsorbed on the table member table surface during the predetermined suction period in which the object to be processed is moved by the moving means. Therefore, the optical processing apparatus that moves the object to be processed can maintain the flatness of the object to be processed.

此外,也可以解決在加工對象物的移動中因為不預先使加工對象物吸附於加工台構件上而產生的各種問題。 Further, various problems caused by not adhering the object to be processed to the processing table member in advance in the movement of the object to be processed can be solved.

再者,就各種問題而言,可舉例如如下的問題。 Further, regarding various problems, for example, the following problems can be mentioned.

在對於照射於加工對象物的加工光的光軸方向正交的方向(本實施形態中的X軸方向、Y軸方向),為了將加工對象物對於加工區域以高精度定位,有時會基於檢測加工對象物位置的結果而使加工對象物移動,將加工對象物定位於目標位置。此情況,檢測加工對象物位置的地方希望是盡量接近加工區域的地方。因為進行加工對象物位置檢測的地方越遠離加工區域,則在該地方與加工區域之間因產生加工對象物的伸縮、撓曲等會造成定位誤差越大。因此,最好在接近加工區域的加工台構件上進行加工對象物的位置檢測。然而,在此情況亦是,若加工對象物在照射於加工對象物的加工光的光軸方向位移,則對位置檢測會產生誤差,加工對象物的定位精度會惡化。因此,在接近加工區域的加工台構件上進行加工對象物的位置檢測而使加工對象物移動,將加工對象物定位於目標位置時,若在移動中也不預先使加工對象物吸附於加工台構件上時,則會產生加工對象物的定位精度惡化的問題。 In the direction orthogonal to the optical axis direction of the processed light irradiated to the object to be processed (the X-axis direction and the Y-axis direction in the present embodiment), in order to accurately position the object to be processed in the processing region, it may be based on As a result of detecting the position of the object to be processed, the object to be processed is moved, and the object to be processed is positioned at the target position. In this case, it is desirable to detect the position of the object to be processed as close as possible to the processing area. The position where the position of the object to be processed is detected is farther away from the processing area, and the positioning error is caused by the expansion and contraction of the object to be processed between the place and the processing area. Therefore, it is preferable to perform position detection of the object to be processed on the processing table member close to the processing region. However, in this case, when the object to be processed is displaced in the optical axis direction of the processed light that is irradiated onto the object to be processed, an error occurs in the position detection, and the positioning accuracy of the object to be processed is deteriorated. Therefore, when the position of the object to be processed is detected on the processing table member close to the processing region, and the object to be processed is moved, and the object to be processed is positioned at the target position, the object to be processed is not adsorbed to the processing table beforehand. When the member is placed on the member, there is a problem that the positioning accuracy of the object to be processed is deteriorated.

此外,在一面使加工對象物移動一面進行加工處理的光學加工裝置,若其移動中不預先使加工對象物吸附於加工台構件上,則會產生無法得到穩定的加工精度的問題。 In addition, in the optical processing apparatus which performs the processing while moving the object to be processed, if the object to be processed is not adsorbed to the processing table member in advance during the movement, the problem of stable processing accuracy cannot be obtained.

此外,在從捲成卷狀的加工對象物的卷送出加工對象物並輸送到加工區域的光學加工裝置,如第6圖所示的卷對片方式,有時會實質上不給予加工對象物的輸送方向前端側輸送力,而以送出加工對象物之力輸送加工對象物。此情況,捲成卷狀時的彎曲或撓曲會殘留在由卷送出的加工對象物部份,因為這個原因而容易產生加工對象物的輸送異常。因此,若加工對象物的輸送中也不預先使加工對象物吸附於加工台構件上,則會因加工對象物的彎曲或撓曲而容易產生加工對象物的輸送異常的問題。 In addition, the optical processing apparatus that feeds the object to be processed from the roll of the object to be wound into a roll and transports it to the processing area may not substantially give the object to be processed in the roll-to-roll method as shown in Fig. 6 In the conveyance direction, the front end side transmits the force, and the object to be processed is conveyed by the force of the object to be processed. In this case, the bending or the deflection when the roll is wound is left in the portion to be processed which is fed by the roll, and for this reason, the conveyance abnormality of the object to be processed is likely to occur. Therefore, when the object to be processed is not adsorbed to the processing table member in advance during the conveyance of the object to be processed, the problem of abnormal conveyance of the object to be processed is likely to occur due to bending or deflection of the object to be processed.

本形態也可以解決這樣的各種問題。 This form can also solve such various problems.

(形態B) (Form B)

在前述形態A,其特徵在於,具有:沿著與前述加工台構件台面平行的方向檢測載置於該台面上的加工對象物部份的位置的監控攝影機23、33、34等的位置檢測手段;以及基於前述位置檢測手段的檢測結果來控制前述移動手段的副掃描控制部30與控制PC40等的移動控制手段。 In the above aspect A, the position detecting means of the monitoring cameras 23, 33, 34 and the like for detecting the position of the object to be processed placed on the table surface in a direction parallel to the table surface of the processing table member is provided. And the sub-scanning control unit 30 of the moving means and the movement control means such as the control PC 40 are controlled based on the detection result of the position detecting means.

藉此,可解決加工對象物的移動中因不預先使加工對象物吸附於加工台構件上而產生的問題之中,加工對象物的移動控制的精度惡化的問題。 With this, it is possible to solve the problem that the accuracy of the movement control of the object to be processed is deteriorated among the problems caused by the fact that the object to be processed is not adsorbed on the processing table member in advance during the movement of the object to be processed.

(形態C) (Form C)

在前述形態B,其特徵在於,前述位置檢測手段藉由監控攝影機23、33、34等拍攝手段拍攝載置於前述台面上的加工對象物部份的對準標記37或加工後圖案等的基準位置,從所得到的拍攝圖像資料檢測前述加工對象物部份的位置。 In the above-described aspect B, the position detecting means captures the reference mark of the alignment mark 37 or the processed pattern of the object to be processed placed on the table surface by the imaging means such as the monitoring cameras 23, 33, 34, and the like. The position is used to detect the position of the object to be processed from the obtained captured image data.

藉此,可高精度地檢測加工對象物的位置。 Thereby, the position of the object to be processed can be detected with high precision.

(形態D) (Form D)

在前述形態A~C中任一形態,其特徵在於,前述吸附控制手段進行變更前述吸附手段的吸引力大小的控制。 In any one of the above aspects A to C, the adsorption control means performs control for changing the magnitude of the attraction force of the adsorption means.

若加工對象物的種類(厚度、材質、剛性等)變化,則使其加工對象物穩定地吸附於加工台構件上所需的吸引力一直在變化。藉由本形態,即使加工對象物的種類(厚度、材質、剛性等)變化,也可以使加工對象物穩定地吸附於加工台構件上。 When the type (thickness, material, rigidity, and the like) of the object to be processed changes, the attractive force required to stably adsorb the object to be processed on the table member is always changed. According to this aspect, even if the type (thickness, material, rigidity, and the like) of the object to be processed changes, the object to be processed can be stably adsorbed on the processing table member.

(形態E) (Form E)

在前述形態A~D中任一形態,其特徵在於,前述移動手段含有:捲出馬達56或捲取馬達62等,其輸送前述加工對象物以使前述加工對象物的被加工部份依次在前述加工台構件台面上移動。 In any one of the above aspects, the moving means includes a winding motor 56, a winding motor 62, and the like, and conveys the object to be processed so that the processed portion of the object is sequentially The processing table member moves on the table top.

藉此,輸送加工對象物以使加工對象物的被加工部份依次在加工台構件台面上移動時,可解決因不預先使加工對象物吸附於加工台構件上所產生的問題。 Thereby, when the object to be processed is conveyed so that the processed portion of the object to be processed is sequentially moved on the table member table surface, the problem that the object to be processed is not adsorbed to the table member can be solved.

(形態F) (Form F)

在前述形態E,其特徵在於,前述輸送手段具備:將前述加工對象物以捲成滾筒狀的狀態保持的卷供應部50等的捲出保持部;使保持於該捲出保持部的卷狀的加工對象物向捲出方向旋轉驅動的捲出馬達56及捲出用粉粒離合器59等的第一驅動手段;將從該捲出保持部捲出並通過前述加工台構件台面上的加工對象物部份以捲成卷狀的狀態保持的卷排出部60等的捲取保持部;使捲取於前述捲取保持部的加工對象物向捲取方向旋轉驅動的捲取馬達62及捲取用粉粒離合器63等的第二驅動手段;以及控制該第一驅動手段及該第二驅動手段的副掃描控制部30等的驅動控制手段。 In the above-described aspect E, the transporting means includes a take-up holding portion such as a roll supply portion 50 that holds the object to be processed in a roll-like state, and a roll that is held by the take-up holding portion The first driving means such as the winding-out motor 56 and the winding-out powder clutch 59 that are rotationally driven in the winding-out direction; the processing object that is unwound from the winding-out holding portion and passes through the processing table member The take-up holding portion of the roll discharge portion 60 and the like held in a roll-like state, and the take-up motor 62 and the take-up that rotationally drive the object to be wound in the take-up holding portion in the winding direction A second driving means such as the powder clutch 63; and a driving control means for controlling the first driving means and the sub-scanning control unit 30 of the second driving means.

藉此,可將加工前後的加工對象物保持成卷狀,所以可謀求包含加工前後的加工對象物的光學加工裝置的設置空間的省空間化。 With this configuration, the object to be processed before and after the processing can be held in a roll shape, so that it is possible to save space in the installation space of the optical processing apparatus including the object to be processed before and after the processing.

(形態G) (Form G)

在前述形態F,其特徵在於,前述第一驅動手段及前述第二驅動手段之中的至少一個的驅動手段具備:可變更傳達扭矩的捲出用粉粒離合器59或捲取用粉粒離合器63等的傳達扭矩變更手段,而前述驅動控制手段係控制前述傳達扭矩變更手段以使前述捲出保持部與前述捲取保持部之間的加工對象物的張力維持在目標範圍。 In the above-described aspect F, the driving means for at least one of the first driving means and the second driving means includes a winding-out particle clutch 59 or a winding-up particle clutch 63 that can change the transmission torque. In the transmission torque changing means, the drive control means controls the transmission torque changing means to maintain the tension of the object to be processed between the winding-out holding portion and the winding-up holding portion within the target range.

藉此,可將捲出保持部與捲取保持部之間的加工對象物的張力穩定地維持在目標範圍,並可抑制加工對象物的撓曲或伸展,實現穩定的加工精度。 Thereby, the tension of the object to be processed between the take-up holding portion and the take-up holding portion can be stably maintained in the target range, and the deflection or stretching of the object to be processed can be suppressed, and stable machining accuracy can be achieved.

(形態H) (Form H)

在前述形態G,其特徵在於,前述驅動控制手段係按照藉由前述至少一個的驅動手段轉動驅動的卷狀的加工對象物的卷徑,控制前述傳達扭矩變更手段。 In the above-described aspect G, the drive control means controls the transmission torque changing means in accordance with the winding diameter of the rolled object to be rotationally driven by the driving means of the at least one of the driving means.

保持於捲出保持部或捲取保持部的加工對象物的卷徑會伴隨加工對象物的輸送而逐漸變化。若此卷徑變化,則加工對象物輸送中的負荷會變化,所以將加工對象物的張力維持在適當的範圍所需的扭矩一直在變化。藉由本形態,按照保持於捲出保持部或捲取保持部的加工對象物的卷徑來控制傳達扭矩變更手段,因此即使卷徑變化,也可以將加工對象物的張力維持在適當的範圍。因此,可抑制加工對象物的撓曲或伸展,實現穩定的加工精度。 The winding diameter of the object to be processed held by the take-up holding portion or the take-up holding portion gradually changes in accordance with the conveyance of the object to be processed. When the winding diameter changes, the load during the conveyance of the object is changed. Therefore, the torque required to maintain the tension of the object in an appropriate range is always changed. According to this aspect, the torque change means is controlled in accordance with the winding diameter of the object to be processed held by the take-up holding portion or the take-up holding portion. Therefore, even if the winding diameter changes, the tension of the object to be processed can be maintained in an appropriate range. Therefore, it is possible to suppress the deflection or stretching of the object to be processed, and to achieve stable processing accuracy.

(形態I) (Form I)

在前述形態G或H中,其特徵在於,前述吸附控制手段係進行變更前述吸附手段的吸引力大小的控制,前述驅動控制手段按照前述吸附手段的吸引力大小,控制前述傳達扭矩變更手段。 In the above-described aspect G or H, the adsorption control means controls the magnitude of the attraction force of the adsorption means, and the drive control means controls the transmission torque changing means in accordance with the magnitude of the suction force of the adsorption means.

若吸附手段的吸引力大小變化,則輸送加工對象物時的輸送負荷也會變化,所以實現加工對象物的穩定輸送並且實現將加工對象物的張力維持在適當的範圍所需的扭矩一直在變化。藉由本形態,按照吸附手段的吸引力大小來控制傳達扭矩變更手段,即使吸附手段的吸引力大小變化,也可以將加工對象物的張力維持在適當的範圍。因此,可抑制加工對象物的撓曲或伸展,實現穩定的加工精度。 When the magnitude of the suction force of the adsorption means is changed, the conveyance load when the object to be processed is transported also changes. Therefore, the torque required to achieve stable conveyance of the object to be processed and the tension of the object to be processed is maintained in an appropriate range is always changing. . According to this aspect, the transmission torque changing means is controlled in accordance with the magnitude of the attraction force of the adsorption means, and the tension of the object to be processed can be maintained in an appropriate range even if the attraction force of the adsorption means changes. Therefore, it is possible to suppress the deflection or stretching of the object to be processed, and to achieve stable processing accuracy.

(形態J) (Form J)

在前述形態F~I中的任一形態,其特徵在於,前述吸附控制手段在藉由前述光學照射手段對加工對象物照射加工光的光照射期間,控制前述吸附手段以使該加工對象物吸附於前述台面,前述驅動控制手段係在前述光照射期間,使前述第一驅動手段及前述第二驅動手段停止旋轉驅動加工對象物。 In any one of the above aspects, the adsorption control means controls the adsorption means to adsorb the object to be processed while irradiating the object to be irradiated with the processed light by the optical irradiation means. In the above-described mesa, the driving control means stops the first driving means and the second driving means from rotating the object to be processed during the light irradiation period.

藉此,在對加工對象物照射加工光的光照射期間(加工處理中),可防止加工對象物由於第一驅動手段或第二驅動手段而移動,可實現穩定的加工精度。 With this, it is possible to prevent the object to be processed from being moved by the first driving means or the second driving means during the light irradiation period (during processing) of irradiating the processed object with the processed light, thereby achieving stable processing accuracy.

(形態K) (Form K)

在前述形態A~J中任一形態中,其特徵在於,前述加工台構件以穿透前述加工光的透光構件形成。 In any one of the above aspects A to J, the processing table member is formed of a light transmitting member that penetrates the processed light.

藉此,可抑制加工光對加工台構件的損害,可延長加工台構件的壽命。 Thereby, damage to the processing table member by the processing light can be suppressed, and the life of the processing table member can be extended.

21‧‧‧電掃描器 21‧‧‧Electric scanner

22‧‧‧fθ透鏡 22‧‧‧fθ lens

25‧‧‧滑架 25‧‧‧Carriage

29‧‧‧線性導軌 29‧‧‧Linear guide

31‧‧‧對位馬達 31‧‧‧Alignment motor

32‧‧‧對位輥對 32‧‧‧Alignment roller pair

33‧‧‧監控攝影機 33‧‧‧Monitoring camera

34‧‧‧監控攝影機 34‧‧‧Monitoring camera

35‧‧‧工件 35‧‧‧Workpiece

38‧‧‧對位制動器 38‧‧‧Alignment brake

50‧‧‧卷供應部 50‧‧‧Volume Supply Department

51‧‧‧供應捲軸 51‧‧‧Supply reel

52‧‧‧入口導板 52‧‧‧Inlet guide

56‧‧‧捲出馬達 56‧‧‧Roll-out motor

57‧‧‧空洞部 57‧‧‧The Cavity Department

58‧‧‧吸入泵 58‧‧‧Sucking pump

59‧‧‧捲出用粉粒離合器 59‧‧‧Rolling powder clutch

60‧‧‧卷排出部 60‧‧‧Volume discharge department

62‧‧‧捲取馬達 62‧‧‧Winding motor

63‧‧‧捲取用粉粒離合器 63‧‧‧Rolling powder clutch

64‧‧‧清潔輥 64‧‧‧cleaning roller

65‧‧‧黏著輥 65‧‧‧Adhesive roller

66‧‧‧層壓卷 66‧‧‧ laminated rolls

67‧‧‧捲取捲軸 67‧‧‧Reel reel

Claims (11)

一種光學加工裝置,具有:移動手段,其使載置於加工台構件台面上的狀態的加工對象物移動;以及光學照射手段,其對載置於前述加工台構件台面上的加工對象物部份照射加工光;其特徵在於,具備:吸附手段,其藉由來自形成於前述加工台構件台面上的吸引孔的吸引力,使前述加工對象物吸附於該台面;以及吸附控制手段,其在藉由前述移動手段移動加工對象物中的預定吸引期間,控制前述吸附手段以使該加工對象物吸附於前述台面。 An optical processing apparatus comprising: a moving means for moving an object to be placed on a surface of a processing table member; and an optical irradiation means for a part of the object to be placed on the surface of the processing table member Irradiating the processed light, comprising: an adsorption means for adsorbing the object to be processed by the suction force from the suction hole formed on the surface of the processing table member; and the adsorption control means The predetermined suction period in the object to be processed is moved by the moving means, and the adsorption means is controlled to adsorb the object to be applied to the table. 如申請專利範圍第1項所述之光學加工裝置,其中,具有:位置檢測手段,其係沿著與前述加工台構件台面平行的方向檢測載置於該台面上的加工對象物部份的位置;以及移動控制手段,其基於前述位置檢測手段的檢測結果控制前述移動手段。 The optical processing apparatus according to claim 1, further comprising: a position detecting means for detecting a position of the object to be processed placed on the table surface in a direction parallel to the table surface of the processing table member And a movement control means that controls the movement means based on the detection result of the position detecting means. 如申請專利範圍第2項所述之光學加工裝置,其中前述位置檢測手段藉由拍攝手段拍攝載置於前述台面上的加工對象物部份的基準位置,從所得到的拍攝圖像資料檢測前述加工對象物部份的位置。 The optical processing apparatus according to claim 2, wherein the position detecting means detects a reference position of the processing target portion placed on the table surface by a photographing means, and detects the aforementioned photographed image data. The position of the object to be processed. 如申請專利範圍第1項至3項中任一項所述之光學加工裝置,其中前述吸附控制手段進行變更前述吸附手段的吸引力大小的控制。 The optical processing apparatus according to any one of claims 1 to 3, wherein the adsorption control means performs control for changing the magnitude of attraction of the adsorption means. 如申請專利範圍第1項至4項中任一項所述之光學加工裝置,其中前述移動手段含有輸送手段,其以前述加工對象物的被加工部份依次移動到前述加工台構件台面上的方式輸送前述加工對象物。 The optical processing apparatus according to any one of claims 1 to 4, wherein the moving means includes a conveying means for sequentially moving the processed portion of the processing object to the surface of the processing table member. The object to be processed is conveyed in a manner. 如申請專利範圍第5項所述之光學加工裝置,其中前述輸送手段具備:捲出保持部,其將前述加工對象物以捲成滾筒狀的狀態保持;第一驅動手段,其使保持於該捲出保持部的卷狀的加工對象物向捲出方向旋轉驅動;捲取保持部,其將從該捲出保持部捲出並通過前述加工台構件台面上的加工對象物部份以捲成卷狀的狀態保持;第二驅動手段,其使捲取於前述捲取保 持部的加工對象物向捲取方向旋轉驅動;以及驅動控制手段,其控制該第一驅動手段及該第二驅動手段。 The optical processing apparatus according to claim 5, wherein the conveying means includes a winding-out holding portion that holds the object to be processed in a roll-like state, and the first driving means holds the same The object to be wound in the roll-out holding portion is rotationally driven in the unwinding direction, and the take-up holding portion is wound up from the take-up holding portion and passed through the object to be processed on the table member surface of the processing table member. a roll-like state is maintained; a second driving means that causes the roll to be taken in the aforementioned roll The object to be processed of the holding portion is rotationally driven in the winding direction; and a drive control means that controls the first driving means and the second driving means. 如申請專利範圍第6項所述之光學加工裝置,其中前述第一驅動手段及前述第二驅動手段之中至少一個的驅動手段具備可變更傳達扭矩的傳達扭矩變更手段,前述驅動控制手段控制前述傳達扭矩變更手段以使前述捲出保持部與前述捲取保持部之間的加工對象物的張力維持在目標範圍。 The optical processing apparatus according to claim 6, wherein the driving means of at least one of the first driving means and the second driving means includes a transmission torque changing means capable of changing a transmission torque, and the driving control means controls the The torque changing means is transmitted so that the tension of the object to be processed between the winding-out holding portion and the winding-up holding portion is maintained within the target range. 如申請專利範圍第7項所述之光學加工裝置,其中前述驅動控制手段按照藉由前述至少一個的驅動手段轉動驅動的卷狀的加工對象物的卷徑,控制前述傳達扭矩變更手段。 The optical processing apparatus according to claim 7, wherein the drive control means controls the transmission torque changing means in accordance with a winding diameter of a roll-shaped object to be rotationally driven by at least one of the driving means. 如申請專利範圍第7項或第8項所述之光學加工裝置,其中前述吸附控制手段進行變更前述吸附手段的吸引力大小的控制,前述驅動控制手段按照前述吸附手段的吸引力大小,控制前述傳達扭矩變更手段。 The optical processing apparatus according to claim 7 or 8, wherein the adsorption control means controls the magnitude of the attraction force of the adsorption means, and the drive control means controls the amount of the suction force of the adsorption means. Communicate the torque change means. 如申請專利範圍第6項至第9項中任一項所述之光學加工裝置,其中前述吸附控制手段在藉由前述光學照射手段對加工對象物照射加工光的光照射期間,控制前述吸附手段以使該加工對象物吸附於前述台面,前述驅動控制手段係在前述光照射期間,使前述第一驅動手段及前述第二驅動手段停止旋轉驅動加工對象物。 The optical processing apparatus according to any one of the sixth aspect, wherein the adsorption control means controls the adsorption means during irradiation of light that irradiates the processing object with the processing light by the optical irradiation means. The driving control means stops the first driving means and the second driving means from rotating the object to be processed in the light irradiation period in order to adsorb the object to be processed on the mesa. 如申請專利範圍第1項至第10項中任一項所述之光學加工裝置,其中前述加工台構件以穿透前述加工光的透光構件形成。 The optical processing apparatus according to any one of claims 1 to 10, wherein the processing table member is formed of a light transmitting member that penetrates the processed light.
TW105124451A 2015-08-31 2016-08-02 Optically processing apparatus TWI601591B (en)

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