TW201705384A - Package structure and shielding member and method for fabricating the same - Google Patents

Abstract

A package structure includes an electronic component, a shielding member engaged with the electronic component, and an encapsulant encapsulating the electronic component and the shield member. The shield member includes a magnetic metal oxide layer, and a protection layer formed on the magnetic metal oxide layer. Through the direct engagement of the shielding member with the electronic component, the shielding member shields the electronic component effectively, and prevents the electronic component from generating erroneous signals. The present invention further provides the shielding member and a method for fabricating the same.

Description

Package structure and shielding member and its manufacturing method

The invention relates to a package structure, in particular to a package structure with a shield and a method for manufacturing the same.

With the rapid development of the electronics industry, electronic products are gradually moving towards multi-functional and high-performance trends. At present, wireless communication technology has been widely used in a variety of consumer electronic products to receive or transmit various wireless signals, and in order to improve electrical quality, a variety of semiconductor products have a shielding function to prevent electromagnetic interference (Electromagnetic Interference, referred to as EMI) is produced.

The current electronic products are all oriented towards the goal of miniaturization and high speed. In particular, the development of the communication industry has been widely used in various electronic products, such as Cell phones and laptops. The above-mentioned electronic products need to use high-frequency RF chips, and the RF chips may be adjacent to a digital integrated circuit, a digital signal processor (DSP) or a baseband chip, thereby causing electromagnetic interference with each other. Therefore, it is necessary to perform electromagnetic shielding (Electromagnetic Shielding) processing.

As shown in FIG. 1 , the conventional RF module 1 electrically connects the plurality of electronic components 11 to a carrier 10 , and then encapsulates the electronic components 11 with a package 13 such as epoxy resin. The package material 13 is covered with a metal film 12. The RF module 1 protects the electronic components 11 from external EMI by the metal film 12.

However, in the conventional RF module 1, the metal film 12 has a long process time and a high cost.

Furthermore, the metal film 12 is formed on the outer surface of the package 13 to prevent EMI, that is, the metal film 12 is separated from the interference source (ie, the electronic component 11) by the package 13, so when the electron When the element 11 is a low frequency component, even if the metal film 12 covers the upper surface and the side surface of the package material 13, the shielding effect of the metal thin film 12 is still poor, and the signal of the low frequency electronic component 11 is prone to error.

Therefore, how to overcome the various problems of the above-mentioned prior art has become a problem that is currently being solved.

In view of the above-mentioned various deficiencies of the prior art, the present invention discloses a package structure including: an electronic component; a shield member coupled to the electronic component, wherein the shield member comprises a magnetic metal oxide layer and is disposed on the magnetic metal a protective layer on the oxide layer; and an encapsulant covering the electronic component and the shield.

In the foregoing package structure, the electronic component is an active component or a passive component.

In the foregoing package structure, the material of the magnetic metal oxide layer is formed Contains manganese-zinc ferrite magnets or nickel-zinc ferrite magnets.

In the above package structure, the material forming the protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass.

In the foregoing package structure, the protective layer is disposed on opposite sides of the magnetic metal oxide layer; or the protective layer is disposed on one side of the magnetic metal oxide layer.

In the above package structure, the shielding member is bonded to the electronic component by a bonding layer, and the bonding layer is formed between the shielding component and the electronic component.

In the aforementioned package structure, the shield completely or partially covers the electronic component.

In the above package structure, a part of the surface of the shield is exposed to the package.

In the foregoing package structure, the carrier member is further included to carry the electronic component and is electrically connected to the electronic component.

The invention also provides a method for manufacturing a shielding member, comprising: forming a magnetic metal oxide layer on a protective layer; and pressing the magnetic metal oxide layer and the protective layer.

In the above method, before the pressing, the bonding layer is stacked on the magnetic metal oxide layer such that the magnetic metal oxide layer is located between the protective layer and the bonding layer.

In the above method, the magnetic metal oxide layer is formed on the protective layer by means of offset printing.

In the above-mentioned preparation method, the composite is included after pressing, and is sintered or cured. Cheng.

The present invention provides a shield comprising: a magnetic metal oxide layer; and a protective layer formed on a surface of the magnetic metal oxide layer.

In the above shielding member and the method of manufacturing the same, the material of the magnetic metal oxide layer comprises a manganese zinc ferrite magnet or a nickel zinc ferrite magnet.

In the foregoing shielding member and the manufacturing method thereof, the material of the protective layer comprises a low-temperature co-fired multilayer ceramic, a high-temperature co-fired multilayer ceramic, a metal or a glass.

In the foregoing shielding member and the manufacturing method thereof, before the pressing, another protective layer is stacked on the magnetic metal oxide layer such that the magnetic metal oxide layer is located between the protective layers. For example, the material forming the other protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass.

As can be seen from the above, in the package structure of the present invention, the shield member is directly bonded to the electronic component, and the shield member can be effectively disposed on the outside of the package. The electronic component is shielded to avoid an error in the signal of the electronic component.

Moreover, by providing the shielding member inside the packaging material, problems such as long process time and high cost caused by forming a metal thin film outside the packaging material can be avoided.

1‧‧‧RF Module

10, 20‧‧‧ Carrying parts

11, 21, 21' ‧ ‧ electronic components

12‧‧‧Metal film

13,23,23’‧‧‧Package

2,2’, 3, 3’‧‧‧ package structure

21a‧‧‧Upper surface

21b‧‧‧ lower surface

210, 210'‧‧‧ conductive elements

22, 22', 32, 32' ‧ ‧ shields

22a‧‧‧ first surface

22b‧‧‧ second surface

220‧‧‧Magnetic metal oxide layer

221, 221’ ‧ ‧ protective layer

24‧‧‧Combination layer

S‧‧‧ cutting path

1 is a schematic cross-sectional view of a conventional radio frequency module; FIG. 2 is a cross-sectional view showing a first embodiment of the package structure of the present invention; wherein the 2' and 2" drawings are other implementations of FIG. 2A to 2C are perspective views of a method of manufacturing a shield of the package structure of the present invention; wherein the 2C' is a partial section of FIG. 2C BRIEF DESCRIPTION OF THE DRAWINGS Fig. 3 is a cross-sectional view showing a second embodiment of the package structure of the present invention; wherein the 3' is another embodiment of Fig. 3.

The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "lower", "first", "second", "two" and "one" as used in this specification are also for convenience of description, not for The scope of the invention can be implemented, and the relative changes or adjustments of the invention are considered to be within the scope of the invention.

2 is a schematic cross-sectional view showing a first embodiment of the package structure 2 of the present invention. In this embodiment, the package structure 2 is a system-in-package (SiP) radio frequency (RF) module.

As shown in FIG. 2, the package structure 2 includes: a plurality of electronic components 21, 21', a shield 22 coupled to a portion of the electronic component 21, And encapsulating the electronic components 21, 21' and the package 23 of the shield 22.

In the present embodiment, the package structure 2 is formed by first bonding a shield member 22 to a portion of the electronic component 21, and then encapsulating the electronic components 21, 21' and the shield member 22 with a package member 23.

The electronic components 21, 21' are active components such as semiconductor wafers or passive components such as resistors, capacitors and inductors.

In the present embodiment, part of the electronic component 21 is a low frequency active component, and the low frequency means 3 megahertz (MHz) or less, and part of the electronic component 21' is a passive component.

The shielding member 22 has an opposite first surface 22a and a second surface 22b, and the first surface 22a of the shielding member 22 is contact-bonded to the upper surface 21a of the electronic component 21 by a bonding layer 24. The bonding layer 24 is formed between the first surface 22a of the shield 22 and the electronic component 21.

In this embodiment, the shielding member 22 includes a magnetic metal oxide layer 220 and two protective layers 221, 221' sandwiching the magnetic metal oxide layer 220. Specifically, the material forming the magnetic metal oxide layer 220 includes a manganese zinc (Mn-Zn) ferrite or nickel-zinc (Ni-Zn) ferrite magnet, and the material forming the protective layer 221, 221' includes Low Temperature Co-fired Ceramic (LTCC), High Temperature Co-fired Ceramic (HTCC), metal or glass.

Furthermore, the shield 22 completely covers the electronic component 21 as shown in FIG. Alternatively, the shield 22' may partially cover the electronic component 21, as shown in Figure 2'.

Further, the material forming the bonding layer 24 is an epoxy or a film.

The package material 23 is not formed between the first surface 22a of the shield member 22 and the electronic components 21, 21'.

In this embodiment, the second surface 22b of the shield 22 is not exposed to the package 23. In other embodiments, the second surface 22b of the shield 22 can be exposed to the package 23' by removing part of the material of the package 23, as shown in FIG.

In addition, the package structure 2 further includes a carrier 20 for carrying the electronic components 21, 21', such as the electronic component 21 being bonded to the carrier 20 with its lower surface 21b. For example, the carrier 20 is a circuit board or a ceramic board having a circuit layer (not shown) electrically connected to the electronic components 21, 21'. Specifically, as in the flip chip mode shown in FIG. 2, the electronic component 21 is electrically connected to the circuit layer by a plurality of conductive elements 210 such as conductive bumps. Alternatively, as shown in Fig. 2, the electronic component 21 is electrically connected to the wiring layer by a plurality of conductive elements 210' such as bonding wires.

In addition, the carrier 20 can also have an internal circuit layer (not shown), and the carrier 20 can be externally connected to other electronic devices such as a circuit board by a plurality of solder balls (not shown). However, the variety of the carrier 20 is not limited to the illustration.

2A to 2C are perspective views showing the manufacturing method of the shield member 22 of the present invention.

As shown in Figure 2A, by means of paste printing A magnetic metal oxide layer 220 is formed on a protective layer 221.

As shown in FIG. 2B, another protective layer 221' is stacked on the magnetic metal oxide layer 220 such that the magnetic metal oxide layer 220 is located between the protective layers 221, 221'.

As shown in FIGS. 2C and 2C', the magnetic metal oxide layer 220 and the protective layers 221, 221' are pressed to planarize the shield 22, and then cofired or cured. The structure of the shield 22 is tightly coupled. Thereafter, a singulation process is performed along a cutting path S as shown in FIG. 2C in a saw or laser scribing manner to obtain a plurality of shields 22.

In another embodiment, when the process shown in FIG. 2B is performed, the bonding layer 24 may be stacked on the magnetic metal oxide layer 220, that is, the bonding layer 24 is substituted for the other protective layer 221', such as As shown in FIG. 3, the magnetic metal oxide layer 220 is placed between the protective layer 221 and the bonding layer 24. Therefore, in the second embodiment of the package structure 3 shown in FIG. 3, the shield member 32 has the protective layer 221 only on the upper side of the magnetic metal oxide layer 220, and the protective layer 221 is selectively exposed to the package. Material 23'.

In addition, as shown in FIG. 3', the shielding member 32' of the package structure 3' may have the protective layer 221 only on the lower side of the magnetic metal oxide layer 220, but the magnetic metal oxide layer 220 is not exposed. The package material 23.

The present invention further provides a shield member 22, 32 comprising: a magnetic metal oxide layer 220, and a protective layer 221 formed on a surface of the magnetic metal oxide layer 220.

The magnetic metal oxide layer 220 is made of manganese zinc ferrite. Body or nickel-zinc ferrite magnet.

The material of the protective layer 221 is a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, metal or glass.

In one embodiment, the shielding member 22 further includes another protective layer 221' formed on the other surface of the magnetic metal oxide layer 220 such that the magnetic metal oxide layer 220 is located on the protective layers 221, 221' The material between the other protective layer 221' is formed by a low-temperature co-fired multilayer ceramic, a high-temperature co-fired multilayer ceramic, a metal or a glass.

In summary, in the package structure of the present invention, the shielding member is directly disposed on the electronic component by the design of the shielding member directly disposed on the electronic component, instead of the shielding member being disposed on the packaging material. Outside, the distance between the shielding and the interference source is shortened to optimize the low-frequency electromagnetic field isolation effect, so that the shielding member can effectively shield the low-frequency electronic components, and the signal of the low-frequency electronic components is prevented from being wrong.

Moreover, since the shield is directly bonded to the low frequency electronic component, the low frequency electronic component can be provided with a complete good low frequency magnetic field shield.

Moreover, the shielding member is disposed inside the packaging material to avoid the problems of long process time and high cost caused by the formation of a metal thin film outside the packaging material.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

2‧‧‧Package structure

20‧‧‧Carrier

21, 21'‧‧‧ Electronic components

21a‧‧‧Upper surface

21b‧‧‧ lower surface

210‧‧‧Conductive components

22‧‧‧Shield

22a‧‧‧ first surface

22b‧‧‧ second surface

220‧‧‧Magnetic metal oxide layer

221, 221’ ‧ ‧ protective layer

23‧‧‧Package

24‧‧‧Combination layer

Claims (23)

A package structure includes: an electronic component; a shield member coupled to the electronic component, wherein the shield member comprises a magnetic metal oxide layer and a protective layer disposed on the magnetic metal oxide layer; and the package material is covered The electronic component and the shield. The package structure of claim 1, wherein the electronic component is an active component or a passive component. The package structure according to claim 1, wherein the material for forming the magnetic metal oxide layer comprises a manganese zinc ferrite magnet or a nickel zinc ferrite magnet. The package structure according to claim 1, wherein the material forming the protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass. The package structure according to claim 1, wherein the protective layer is provided on opposite sides of the magnetic metal oxide layer. The package structure of claim 1, wherein the protective layer is provided on one side of the magnetic metal oxide layer. The package structure of claim 1, wherein the shield is bonded to the electronic component by a bonding layer, and the bonding layer is formed between the shielding component and the electronic component. The package structure of claim 1, wherein the shield completely or partially covers the electronic component. The package structure of claim 1, wherein a part of the surface of the shield is exposed to the package. The package structure as claimed in claim 1, further comprising a carrier that carries the electronic component and is electrically connected to the electronic component. A method of fabricating a shield includes: forming a magnetic metal oxide layer on a protective layer; and pressing the magnetic metal oxide layer and the protective layer. The method for manufacturing a shield according to claim 11, wherein the material for forming the magnetic metal oxide layer comprises a manganese zinc ferrite magnet or a nickel zinc ferrite magnet. The method for manufacturing a shield according to claim 11, wherein the material forming the protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass. The method of fabricating a shield according to claim 11, wherein the magnetic metal oxide layer is formed on the protective layer by a gluing printing method. The method for preparing the shield member according to claim 11 of the patent application is included in the sintering or curing process after the pressing. The method for manufacturing the shielding member according to claim 11, wherein before the pressing, another protective layer is stacked on the magnetic metal oxide layer such that the magnetic metal oxide layer is located between the protective layers. The method for manufacturing a shield according to claim 16, wherein the material forming the other protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass. The method for manufacturing the shielding member according to claim 11, wherein before the pressing, the bonding layer is stacked on the magnetic metal oxide layer such that the magnetic metal oxide layer is located between the protective layer and the bonding layer. A shielding member comprising: a magnetic metal oxide layer; and a protective layer formed on a surface of the magnetic metal oxide layer. The shielding member according to claim 19, wherein the material forming the magnetic metal oxide layer comprises a manganese zinc ferrite magnet or a nickel zinc ferrite magnet. The shielding member according to claim 19, wherein the material forming the protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass. The shielding member according to claim 19, further comprising another protective layer formed on the other surface of the magnetic metal oxide layer such that the magnetic metal oxide layer is located between the protective layers. The shielding member according to claim 22, wherein the material forming the other protective layer comprises a low temperature co-fired multilayer ceramic, a high temperature co-fired multilayer ceramic, a metal or a glass.