TW201644344A - Flat-type flexible printed circuit board laminating process - Google Patents

Abstract

The present invention relates to a flat-type flexible printed circuit board laminating process. A feeding moving member of a feeder is configured to move and place a plurality of sheet-type flexible printed circuit boards on a top surface of a reel tape formed on a carrier unit. A first material roll of a first attaching unit is attached to a top surface of each flexible printed circuit board. The reel tape, each flexible printed circuit board, and the first material roll are conveyed to the inside of a pressing machine and laminated by the pressing machine. The first material roll is driven to detach from the surface of each flexible printed circuit board. A receiving moving member of a receiving machine is configured to move the plurality of sheet-type flexible printed circuit boards from the top surface of the reel tape of the carrier unit. Accordingly, each flexible circuited board can be laminated in the pressing machine under a vacuum condition, thereby improving the production yield of each flexible printed circuit board.

Description

Flat plate flexible printed circuit board pressing process

The invention relates to a pressing process for a printed circuit board, in particular to a lithographic flexible printed circuit board pressing process.

A general flexible printed circuit board (FPCB) is a circuit board that is formed by circuit designing circuit parts, and is processed by mechanical processing and surface treatment, because it is light and thin and bendable. Features, commonly used in digital cameras, notebook computers or other 3C products, the existing flexible printed circuit boards usually use metal as the substrate, and a plurality of integrated circuits (ICs) are disposed on the surface of the substrate.

In order to protect a plurality of ICs disposed on the flexible printed circuit board, a layer of conductive adhesive is applied on the upper surface of the substrate and a film is attached, and a layer of conductive adhesive is applied on the lower surface of the substrate and another seal is attached. a film, and press-bonding the substrate to the two sealing films by using a printed circuit board pressing unit as shown in FIG. 7, the printed circuit board pressing unit comprising a transmission group 80 and a press machine 90, The transmission group 80 includes an input frame 81, an output frame 82, a carrying unit 83, and four abutting units. The input frame 81 and the output frame 82 are horizontally spaced apart, and the carrying unit 83 is separately fixed to the two. The input frame 81 and the reel of the output frame 82, the carrying unit 83 is wound with a whole roll of flexible printed circuit board between the two reels, so that the two reels on the carrying unit 83 can be used by a plurality of The rollers disposed on the input frame 81 and the output frame 82 are driven to form a roll belt 831 between the input frame 81 and the output frame 82.

The four abutting units are respectively a first abutting unit 84, a second abutting unit 85, a third abutting unit 86 and a fourth abutting unit 87. The first abutting unit 84 is provided with two The first reel is fixed to the first reel of the input frame 81 and the output frame 82. The first abutting unit 84 is provided with a heat-resistant adhesive film roll 841 between the two first reels, and the heat-resistant adhesive located in the input frame 81. The film roll 841 is driven by the at least one roller to be moved against the top surface of the web 831 and moved toward the output frame 82. The second abutting unit 85 is respectively fixed to the input frame 81 and a second reel of the output frame 82, the second abutting unit 85 is provided with a fiberglass roll 851 between the two reels, and the glass fiber roll 851 located in the input frame 81 is driven by at least one roller. The top surface of the heat-resistant film roll 841 is moved toward the output frame 82, and the third abutting unit 86 and the heat-resistant film roll 861 and the first abutting unit 84 and the heat-resistant film roll thereof are disposed. The position of the 841 is different only in the upper and lower intervals, and the rest are the same, and the fourth abutting unit 87 and the Volume glass fibers 871 provided with the abutment means 85 and the second glass fiber bundle 851 goes only the position, corresponding to the interval varies, the rest are the same, capacity will not be repeated.

As shown in FIG. 7 and FIG. 8 , the press machine 90 is located between the input frame 81 and the output frame 82 and is provided with an upper die holder 91 and a lower die holder 92 that is raised and lowered relative to the upper die holder 91. The lower mold base 92 of the machine 90 is provided with a plurality of perforations 93 for allowing the upper and lower mold bases 91, 92 to be vacuumed, and the space between the upper and lower mold bases 91, 92 is evacuated, and Each of the material rolls 841, 851, 861, and 871 of the winding tape 831 of the carrying unit 83 and the respective abutting units 84, 85, 86, 87 passes through the gap between the upper and lower die holders 91, 92.

The existing flexible printed circuit board press-bonding process is such that the roll strip 831 is not on the substrate of the take-up tape 831 before the two heat-resistant film rolls 841, 861 on the input frame 81 abut each other. The surface is first coated with a layer of conductive adhesive and then attached with a film, and a layer of conductive adhesive is applied on the lower surface of the substrate and another adhesive film is attached, and the conductive adhesive is vacuum-pressed in the press machine 90. During the process, the sealant film and the web 831 are exuded to the two heat-resistant adhesive film rolls 841, 861, and the two glass fiber rolls 851, 871 provide the press machine 90 to press the roll belt 831. And the mat in the process of sealing the film.

However, as shown in FIG. 8, the existing web 831 forms a long sheet shape from the input frame 81 toward the output frame 82, and during the pressing process of the upper and lower die holders 91, 92 of the press machine 90, Since the web 831 is in the form of a continuous long sheet, the gap between the web 831 and the upper and lower mold bases 91 and 92 of the press machine 90 is likely to cause a gap and the airtight effect is poor, resulting in The upper and lower mold bases 91 and 92 of the press machine 90 have a poor vacuuming effect, and the yield of the conventional printed circuit board press-forming process is lowered. Therefore, the conventional flexible printed circuit board press-fitting process is indispensable for improvement.

In order to solve the existing printed circuit board pressing process, in the press-bonding process of the continuous web and the material rolls in the press, the strip and the upper and lower mold bases of the press The boundary is prone to gaps and the airtight effect is poor, resulting in a poor vacuuming effect of the upper and lower mold bases of the press and a lack of yield reduction of the process. The main object of the present invention is to provide a lithographic flexible printed circuit board. In the process of the invention, the flexible printed circuit board is mainly designed as a sheet type, and in the process of pressing the flexible printed circuit board by the press machine, the whole of the flexible printed circuit board is located inside the press machine. The flexible printed circuit boards are kept vacuum during the pressing process to improve the process yield of each flexible printed circuit board.

The invention solves the lithographic flexible printed circuit board pressing process proposed by the prior art, which comprises: a preparation step: preparing a feeder, a transport group, a press machine and a receiver, the feeder comprising a a feeding rail and a feeding moving member horizontally movable and lifting relative to the feeding rail and disposed on the feeding rail, the transmission group is disposed at one side of the feeder and includes an input frame, an output frame, a carrying unit and At least one abutting unit, the input frame and the output frame are horizontally spaced apart, the carrying unit is formed on the input frame and the output frame, and a roll of tape is formed, the at least one abutting unit is disposed on the input frame and the output The rack is provided with a material roll, and the press machine is located between the input frame and the output frame and is provided with an upper mold base and a lower mold base which is lifted and lowered relative to the upper mold base, and the receiver is fixed to the transport group. The output rack includes a receiving rail and a receiving moving member, the receiving rail is horizontally fixed to the output rack, and the receiving moving member is horizontally movable and lifted relative to the receiving rail. On the material track; a feeding step: moving a plurality of sheet-type flexible printed circuit boards on the top surface of the winding belt of the carrying unit via the feeding moving member of the feeder; a material roll contacting step: the at least a material roll of the abutting unit is brought against the top surface of each of the flexible printed circuit boards; a pressing step: the roll of tape, each of the flexible printed circuit boards and the material roll of the at least one abutting unit enters the pressing Between the upper mold base of the machine and the lower mold base, when the peripheral edge of each flexible printed circuit board is located within the circumference of the upper and lower mold bases, the upper and lower mold bases of the press machine correspond to the winding belt, The flexible printed circuit board and the material roll of the at least one abutting unit are simultaneously pressed; a material roll removing step: the material roll of the at least one abutting unit is driven away from the surface of each flexible printed circuit board; Material step: The receiving moving member of the receiver removes the plurality of sheets of flexible printed circuit boards from the top surface of the winding belt of the carrying unit.

The lithographic flexible printed circuit board press-forming process, wherein the transfer group includes a first abutting unit, and the first abutting unit is provided with a first material roll on the input frame and the output frame In the material roll attaching step, the first material roll of the first abutting unit is driven to abut against the top surface of each flexible printed circuit board.

The lithographic flexible printed circuit board press-forming process, wherein the transfer group includes a second abutting unit and a third abutting unit, the second abutting unit is disposed on the input frame and the output frame A second material roll is disposed on the input frame and the output frame, and a third material roll is disposed on the input frame and the second material roll of the second abutting unit. After being driven against the top surface of the first material roll, the third material roll of the third abutting unit is driven to abut against the bottom surface of the web.

The lithographic flexible printed circuit board press-bonding process described above, wherein in the preparing step, the second material roll of the second abutting unit and the third material roll of the third abutting unit are made of a glass fiber.

The lithographic flexible printed circuit board press-bonding process described above, wherein in the preparing step, the winding tape of the carrying unit and the first material roll of the first abutting unit are made of a heat-resistant adhesive film.

The lithographic flexible printed circuit board press-bonding process described above, wherein the heat-resistant adhesive film is made of poly-4-methyl-1pentene.

The improvement and advantages obtained by the technical means of the present invention are as follows: 1. The present invention utilizes each flexible printed circuit board to be designed as a single sheet type, and is matched with the delivery of the feeder and the receiver, and is pressed at the press machine. In the process of making each flexible printed circuit board, the whole of the flexible printed circuit board is located in the upper and lower die holders of the press, so that the flexible printed circuit boards maintain the vacuum during the pressing process, thereby improving the soft printing. The process yield of the board. 2. After the completion of the pressing process, the flexible printed circuit boards of the present invention can be directly used without further cutting, and the waste of the material parts of the flexible printed circuit boards can be reduced.

In order to be able to understand in detail the lithographic flexible printed circuit board splicing process of the present invention, and in accordance with the invention, it will be further described in detail with reference to the preferred embodiments shown in the drawings:

As shown in FIG. 1, a preferred embodiment of the lithographic flexible printed circuit board pressing process of the present invention comprises a preparation step, a feeding step, a material roll abutting step, a pressing step, a material roll removing step, and a receiving step, wherein:

Preparation step: as shown in FIG. 2 to FIG. 4, a lithographic flexible printed circuit board press unit is prepared, wherein the lithographic flexible printed circuit board press unit comprises a feeder 10, a transport group 20, and a press machine 30. And a receiver 40, the feeder 10 includes a feeding platform 11, a feeding rail 12 and a feeding moving member 13, and a stack of sheet-type flexible printed circuit boards 50 are placed on the feeding platform of the feeder 10. 11 , wherein, as shown in FIG. 5A , each of the sheet flexible printed circuit boards 50 includes a substrate 51 , a plurality of integrated circuits (ICs) 52 disposed on the top and bottom surfaces of the substrate 51 , and two The sealing film 53 is respectively attached to the top surface and the bottom surface of the substrate 51. The two sealing films 53 are provided with a plurality of receiving holes, so that the plurality of integrated circuits 52 are exposed outside the corresponding sealing film 53. The substrate 51 and the two sealing films 53 are respectively adhered to the substrate 51 through two layers of conductive adhesive 54 disposed horizontally above the feeding platform 11 and provided with two ends. The feeding moving member 13 is horizontally movable relative to the feed rail 12 Feeding the upper rail 12, and the feed member 13 may be moved between the feed rail 12 and elevating the feed platform 11, it preferred that the feed movement of the base member 13 is provided with a suction device.

The transmission group 20 is disposed at one side of the feeder 10 and includes an input frame 21, an output frame 22, a carrying unit 23, and at least one abutting unit. The input frame 21 and the output frame 22 are horizontally spaced apart and On the side of the feeding platform 11, the carrying unit 23 is provided with two reels respectively fixed to the input frame 21 and the output frame 22. The carrying unit 23 is provided with a heat-resistant film roll on the two reels. Preferably, the heat-resistant film roll is made of TPX (poly-4-methyl-1 pentene, ploymethylpentene), so that the two rolls on the carrying unit 23 are driven by the plurality of rollers at the input. A winding belt 231 is formed between the frame 21 and the output frame 22, and the winding belt 231 is provided with a feeding end 232 and a discharging end 233, and one end of the feeding rail 12 of the feeder 10 extends to the inlet Above the material end 232.

The at least one abutting unit is provided with two reels respectively fixed to the input frame 21 and the output frame 22, and the at least one abutting unit is provided with a material roll on the two reels and is driven by at least one roller. The preferred embodiment includes three abutting units, which are a first abutting unit 24, a second abutting unit 25 and a third abutting unit 26, which are respectively disposed above the top surface of the web 231. The first abutting unit 24 is provided with two reels respectively fixed to the input frame 21 and the output frame 22, and the two reels of the first abutting unit 24 are located between the two reels of the carrying unit 23, The first abutting unit 24 is provided with a first material roll 241 on the two rolls, the first material roll 241 is a heat-resistant film roll, and the heat-resistant film roll is TPX (poly-4-methyl-1). The first material roll 241 of the first abutting unit 24 is disposed above the top surface of the web 231 by at least one roller, and the second abutting unit 25 is provided with two The reels are respectively fixed to the input frame 21 and the output frame 22, and the two reels of the second abutting unit 25 are located at two of the first abutting units 24 Between the reels, the second abutting unit 25 is provided with a second material roll 251 on the two reels, the second material roll 251 is a glass fiber roll, and the second material roll 251 is driven by at least one roller. On the top surface of the first material roll 241, the third abutting unit 26 is provided with two reels respectively fixed to the input frame 21 and the output frame 22, and the third abutting unit 26 is on the two reels. A third material roll 261 is provided. The third material roll 261 is a glass fiber roll. The third material roll 261 is driven against the bottom surface of the roll belt 231 by at least one roller.

The press machine 30 is located between the input frame 21 and the output frame 22 and is provided with an upper die holder 31 and a lower die holder 32 that is raised and lowered relative to the upper die holder 31. Referring to FIG. 6, the press machine 30 The lower mold base 32 is provided with a plurality of perforations 33. When the upper and lower mold bases 31, 32 are attached to each other, the space between the upper and lower mold bases 31, 32 can be evacuated, and the load of the load bearing unit 23 is wound. The material rolls 241, 251, 261 of the belt 231 and the respective abutting units 24, 25, 26 pass through the gap between the upper and lower die holders 31, 32.

The receiving machine 40 is fixed to the output frame 22 of the transmission group 20 and different from the side of the feeder 10 and includes a receiving track 41 and a receiving moving member 42. The receiving track 41 is horizontally fixed. The output frame 22 is provided with two ends, one end of the receiving rail 41 is located above the discharging end 233 of the web 231, and the receiving moving member 42 is horizontally movable relative to the receiving rail 41. On the receiving rail 41, the receiving moving member 42 can be raised and lowered between the winding belt 231 and the receiving rail 41. Preferably, the bottom of the receiving moving member 42 is provided with a suction cup device.

Feeding step: As shown in FIG. 3 and FIG. 4, the feeding moving member 13 of the feeder 10 is lowered relative to the feeding rail 12 and moved toward the flexible printed circuit board 50, and the feeding moving member 13 is sucked by the suction device at the bottom thereof. After the uppermost flexible printed circuit board 50, the feed moving member 13 is horizontally moved relative to the feed rail 12 and lowered above the feeding end 232 of the web 231, so that the sucked flexible printed circuit board 50 is placed on The top surface of the web 231, the feed moving member 13 repeats the aforementioned operation, so that the plurality of flexible printed circuit boards 50 are placed on the top surface of the web 231 at intervals.

The material roll abutting step: the web 231 of the carrying unit 23 is driven by a plurality of rollers, and is moved by the input frame 21 toward the output frame 22, and simultaneously drives the tops of the roll belt 231 The flexible printed circuit board 50 is moved. The first material roll 241 of the first abutting unit 24 is driven by at least one roller to abut the top surface of each flexible printed circuit board 50, as shown in FIG. 5B, so that the first material is made. The roll 241 and the web 231 are respectively abutted against the outer surfaces of the two sealing films 53 of the flexible printed circuit boards 50, and then the second and third material rolls 251 of the second and third abutting units 25 and 26. And 261 are respectively abutted against the outer surface of the first material roll 241 and the web 231 by at least one roller.

The pressing step: when each flexible printed circuit board 50 is attached to the inside of the press machine 30 by the transfer of the material roll 241, 251, 261, and then the vacuum pressing process is performed. The upper and lower die holders 31, 32 of the machine 30 are correspondingly pressed together for the flexible printed circuit board 50, the web of tape 231, and the respective material rolls 241, 251, and 261, as shown in FIG. 5C, through the press-fitted The conductive paste 54 between the substrate 51 and the two sealing films 53 is respectively adhered to the inner side of the web 231 and the first material roll 241, and the second material roll 251 and the third material roll 261 is made of glass fiber, and can be used as a mat material for the upper and lower die holders 31, 32 of the press machine 30 during the pressing process, wherein, as shown in FIG. 6, each of the flexible printed circuit boards 50 is The sheet-like design allows the peripheral edges of the flexible printed circuit boards 50 to be located within the circumference of the upper and lower die holders 31, 32, so that the upper and lower die holders 31, 32 of the press machine 30 can be completely closed. Each of the flexible printed circuit boards 50 maintains the tightness of each of the flexible printed circuit boards 50 during the pressing process, so that the pressing 30, the lower die 31, 32 to enhance the vacuum effect in the nip process.

Material roll removal step: Please refer to FIG. 2, after the flexible printed circuit board 50 is pressed, the roll belt 231 continues to drive the flexible printed circuit boards 50, and is fixed on the output frame 22. The cloth rolls of the first, second and third abutting units 24, 25, 26 can respectively recover the first, second and third material rolls 241, 251, 261 to form a flexible printed circuit board as shown in FIG. 5D. 50.

Receiving step: Referring to FIG. 2, the receiving moving member 42 of the receiver 40 is lowered relative to the receiving rail 41, and the receiving moving member 42 sucks the web 231 by the suction device at the bottom thereof. After one of the flexible printed circuit boards 50 above the discharge end 233, the receiving moving member 42 moves horizontally and rises relative to the receiving track 41, and moves the flexible printed circuit board 50 to a subsequent working unit 60. The receiving moving member 13 repeats the foregoing actions, and moves the flexible printed circuit boards 50 that have completed the pressing process to the subsequent working unit 60, and sends the flexible printed circuit boards 50 that have completed the pressing process to the lower portion. The subsequent steps are performed in a unit of the process, wherein the plurality of flexible printed circuit boards 50 can also be stacked into a plurality of sheets by the receiver 40, and after being stacked to a certain number, the receiver is manually taken out.

According to the foregoing technical features, the present invention utilizes the design of the feeder 10, the receiver 40 and the work unit 60, and is matched with the sheet-type flexible printed circuit boards 50, so that the flexible printed circuit boards 50 are subjected to During the pressing process of the press machine 30, the entire flexible printed circuit board 50 is located within the range of the upper and lower die holders 31, 32 of the press machine 30, so that the flexible printed circuit boards 50 are provided. The vacuum is maintained during the pressing process to improve the process yield of each of the flexible printed circuit boards 50. Further, the flexible printed circuit boards 50 of the present invention can be directly utilized without being cut again, and the material portions of the flexible printed circuit boards 50 can be reduced. Waste, in order to provide a lithographic soft printed circuit board pressing process that can improve yield.

10‧‧‧Feeder
11‧‧‧Feeding platform
12‧‧‧Feed Track
13‧‧‧Feed moving parts
20‧‧‧Transport Group
21‧‧‧ input rack
22‧‧‧ Output rack
23‧‧‧Loading unit
231‧‧‧Roll tape
232‧‧‧ Feeding end
233‧‧‧ discharge end
24‧‧‧First abutment unit
241‧‧‧First Volume
25‧‧‧Second snap unit
251‧‧‧Second material roll
26‧‧‧ third unit
261‧‧‧ Third material volume
30‧‧‧Compression machine
31‧‧‧Upper mold base
32‧‧‧ lower mold base
33‧‧‧Perforation
40‧‧‧ Receiver
41‧‧‧ Receiving track
42‧‧‧Receipt moving parts
50‧‧‧Soft printed circuit board
51‧‧‧Substrate
52‧‧‧IC
53‧‧‧ Sealing film
54‧‧‧ conductive adhesive
60‧‧‧Working crew
80‧‧‧Transport Group
81‧‧‧ input rack
82‧‧‧ Output rack
83‧‧‧Loading unit
831‧‧‧Roll tape
84‧‧‧First abutment unit
841‧‧‧First Volume
85‧‧‧Second affixing unit
851‧‧‧Second material roll
86‧‧‧ third unit
861‧‧‧ Third material volume
87‧‧‧fourth snap unit
871‧‧‧Fourth Volume
90‧‧‧Compression machine
91‧‧‧Upper mold base
92‧‧‧ lower mold base
93‧‧‧Perforation

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a manufacturing process in accordance with a preferred embodiment of the present invention. Figure 2 is a front elevational view of a preferred embodiment of the present invention. 3 and 4 are schematic front elevational views, partially enlarged, of a preferred embodiment of the present invention. 5A, 5B, 5C and 5D are schematic side views showing the operation of a flexible printed circuit board in accordance with a preferred embodiment of the present invention. 6 is a partially enlarged plan view showing the operation of the second material roll, the upper mold base, and the respective flexible printed circuit boards according to the preferred embodiment of the present invention. Figure 7 is a front elevational view of a prior art flexible printed circuit board press assembly. Fig. 8 is a partially enlarged plan view showing the operation of the coil belt, the upper mold base and the second material roll of the conventional flexible printed circuit board press unit.

Claims (6)

A lithographic flexible printed circuit board pressing process comprising: a preparation step of: preparing a feeder, a transport group, a press machine and a receiver, the feeder comprising a feed rail and a feedable relative to the feed a feeding moving member that moves horizontally and vertically and is disposed on the feeding rail, the transmission group is disposed at one side of the feeding machine and includes an input frame, an output frame, a carrying unit and at least one abutting unit, the input The rack is disposed at a horizontal interval from the output rack, and the carrying unit is formed on the input rack and the output rack to form a roll of tape. The at least one abutting unit is provided with a material roll on the input frame and the output frame. The press machine is located between the input frame and the output frame and is provided with an upper die holder and a lower die holder that is raised and lowered relative to the upper die base. The receiver is fixed to the output frame of the transmission group and includes a receiving frame. a material track and a receiving moving piece, the receiving track is horizontally fixed to the output frame, and the receiving moving piece is horizontally movable and lifted relative to the receiving track on the receiving track; a feeding step Moving a plurality of sheet-type flexible printed circuit boards on the top surface of the winding tape of the carrying unit via the feeding moving member of the feeder; a material roll contacting step: the material of the at least one abutting unit is wound Driving and abutting against the top surface of each flexible printed circuit board; a pressing step: the winding tape, each flexible printed circuit board and the material roll of the at least one abutting unit enter the upper mold base and the lower mold of the press machine Between the seats, when the periphery of each of the flexible printed circuit boards is located within the periphery of the upper and lower die holders, the upper and lower die holders of the presser correspond to the web, the flexible printed circuit boards, and the at least a material roll of the abutting unit is simultaneously pressed; a material roll removing step: the material roll of the at least one abutting unit is driven away from the surface of each of the flexible printed circuit boards; and a receiving step: the receiving machine The receiving moving member moves the plurality of sheet-type flexible printed circuit boards away from the top surface of the winding belt of the carrying unit. The lithographic flexible printed circuit board splicing process of claim 1, wherein the transmission group includes a first affixing unit, and the first affixing unit is disposed on the input frame and the output frame There is a first roll of material in which the first material roll of the first abutment unit is driven against the top surface of each flexible printed circuit board. The lithographic flexible printed circuit board pressing process as claimed in claim 2, wherein in the preparing step, the transmission group includes a second abutting unit and a third abutting unit, the second abutting unit is at the input a second material roll is disposed on the frame and the output frame, and the third abutting unit is provided with a third material roll on the input frame and the output frame. In the material roll contacting step, the second abutting unit The second material roll is driven to abut against the top surface of the first material roll, and the third material roll of the third abutting unit is driven to abut against the bottom surface of the roll. The lithographic flexible printed circuit board pressing process of claim 3, wherein in the preparing step, the second material roll of the second abutting unit and the third material roll of the third abutting unit are each a glass Made of fiber. The lithographic flexible printed circuit board pressing process according to any one of claims 2 to 4, wherein in the preparing step, the winding tape of the carrying unit and the first material roll of the first abutting unit are one Made of heat-resistant film. The lithographic flexible printed circuit board press-bonding process according to claim 5, wherein the heat-resistant adhesive film is made of poly-4-methyl-1pentene.