TW201641613A - A method for fabricating a chip scale light-emitting device - Google Patents

Abstract

The invention provides a method for fabricating a chip scale light-emitting device. The method comprises: providing a surface modified light-emitting powder which contain at least one light-emitting powder and at least one solid or liquid and performing a setting process to have the surface modified light-emitting powder on a substrate to form a chip scale light-emitting device, wherein surfaces of the chip scale light-emitting device have a light-emitting powder layer.

Description

Method for preparing chip-level light-emitting element

The invention relates to a method for preparing a chip-level light-emitting element, in particular to a method for preparing a chip-level light-emitting element having a surface or five-layered luminescent powder layer having a thickness of micron.

At present, commonly used light-emitting components, such as white-lighted LED devices, use a potting and packaging process technology, that is, a mixture of phosphor powder and glue is injected into a wafer holder that has been bonded with a solid crystal and a gold wire to complete the surface of the LED wafer. Light powder coating. The phosphor coating obtained by this method has a non-uniform structure from the center to the edge.

The potting and packaging process is to inject a powder mixture of the same phosphor powder concentration and weight into each die at a time, but in actual production, between the same batch of LED tubes, each time the powder mixture is poured Fluorescent powder concentration cannot be precisely controlled, so the phosphor powder layer will have a certain difference in shape, which makes it difficult to control the brightness uniformity and color temperature uniformity of the exit spot, resulting in a large chromaticity difference between devices.

Moreover, since the actual microscopic surface of the coating glue droplet is uneven, when the light is emitted, white color unevenness may be formed, resulting in local yellowish or bluish unevenness flare.

In summary, in the current lighting industry, the development of chip-level light-emitting components with high light efficiency, no color difference, and average surface light-emitting layer distribution is still an important issue to be solved and developed.

In view of the above-mentioned background of the invention, in order to meet the requirements of the industry, the present invention provides a method for preparing a chip-level light-emitting element to solve the above-mentioned insurmountable problems and achieve the desired purpose of the industry.

An object of the present invention is to provide a method for preparing a chip-scale light-emitting device, the method comprising: providing a surface-modified luminescent powder, the surface-modified luminescent powder comprising at least one luminescent powder and at least one covering the luminescent powder a granule or a liquid film; and fixing the surface-modified luminescent powder on a substrate by a fixing process to form a chip-level illuminating element, wherein the surface of the chip-level illuminating element or the fifth The mask has a layer of luminescent powder.

In one embodiment, the luminescent powder is a phosphor or any light-conducting powder.

In one embodiment, wherein the particle system is selected from the group consisting of And any combination thereof: glass powder, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin or powder, paraffin hydrocarbon and ceramic powder.

In one embodiment, the surface-modified luminescent powder has a particle size of less than 100 microns.

In one embodiment, the liquid film system described above is selected from one of the following groups and any combination thereof: glass powder, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin or powder, paraffin hydrocarbon And ceramic powder

In one embodiment, the above fixed procedure includes: a vacuum coating process, an ultrasonic oscillation program, an ultraviolet irradiation program, and a heating program.

In one embodiment, the appropriate temperature of the heating procedure described above is between 50 and 200 degrees Celsius.

In one embodiment, wherein the thickness of the luminescent powder layer is less than 120 micrometers, preferably, the thickness of the luminescent powder layer is less than 50 micrometers.

Another object of the present invention is to provide a method for producing a surface-modified luminescent powder, the method comprising: providing a polymer comprising epoxy resin or silicone or other viscous material; performing a mixing procedure The above polymer is mixed, the mixing process comprises grinding, stirring and shaking; and a covering procedure is performed to attach the above polymer to a luminescent powder to form a surface-modified luminescent powder.

In one embodiment, the luminescent powder is a phosphor or any light-conducting powder.

In one embodiment, the luminescent powder has a particle size of less than 100 microns.

According to the method for preparing a chip-scale light-emitting element and the method for producing a surface-modified luminescent powder provided by the present invention, the above method can efficiently prepare a chip-level light-emitting element having a surface or a five-sided luminescent powder layer having a uniform thickness, which can solve both The problem that the surface structure of the chip-level light-emitting component caused by the technology is uneven causes the component quality and the light-emitting efficiency to be low, and at the same time, the chip-level light-emitting component having a thickness of the light-emitting powder layer of less than 120 μm can be manufactured, and the light effect can be effectively improved. Therefore, it can be widely used in the light lighting industry.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. In order to thoroughly understand the present invention, detailed steps and compositions thereof will be set forth in the following description. Obviously, the practice of the invention is not limited to the specific details that are apparent to those skilled in the art. On the other hand, well-known components or steps are not described in detail to avoid unnecessarily limiting the invention. The preferred embodiments of the present invention are described in detail below, but the present invention may be widely practiced in other embodiments, and the scope of the present invention is not limited by the scope of the following patents. .

According to a first embodiment of the present invention, the present invention provides a method of fabricating a chip-scale light-emitting device, the method comprising: providing a surface-modified luminescent powder, the surface-modified luminescent powder comprising at least one luminescent powder and at least one Covering a granule or a liquid film on the luminescent powder; and fixing the surface-modified luminescent powder to a substrate by a fixing process to form a chip-level illuminating element, wherein the chip-level illuminating The surface or five masks of the component have a layer of luminescent powder.

In one embodiment, the luminescent powder is a phosphor or any light-conducting powder.

In one embodiment, the above particle system is selected from one of the following groups and any combination thereof: glass powder, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin glue or powder and paraffin hydrocarbon and Ceramic powder.

In one embodiment, the surface-modified luminescent powder has a particle size of less than 100 microns.

In one embodiment, the liquid film system described above is selected from one of the following groups and any combination thereof: glass frit, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin gum or powder and paraffin hydrocarbon And ceramic powder.

In one embodiment, the above fixed procedure includes: a vacuum coating process, an ultrasonic oscillation program, an ultraviolet irradiation program, and a heating program.

In one embodiment, the appropriate temperature of the heating procedure described above is between 50 and 200 degrees Celsius.

In one embodiment, wherein the thickness of the luminescent powder layer is less than 120 micrometers, preferably, the thickness of the luminescent powder layer is less than 50 micrometers.

According to a second embodiment of the present invention, there is provided a method of producing a surface-modified luminescent powder, the method comprising: providing a polymer comprising an epoxy resin or silicone or other viscous material A mixing procedure involves mixing the above-described polymer, which comprises grinding, stirring and shaking; and performing a coating procedure to attach the polymer to a luminescent powder to form a surface-modified luminescent powder.

In one embodiment, the luminescent powder is a phosphor or any light-conducting powder.

In one embodiment, the luminescent powder has a particle size of less than 100 microns.

In a specific embodiment, please refer to the first figure. The first figure is a surface-modified luminescent powder prepared by the second embodiment of the present invention, and the luminescent powder can be used as a luminescent powder layer of a chip-level illuminating element.

In a second embodiment, the method for preparing a chip-scale light-emitting device having a surface or five-sided luminescent powder layer according to the present invention comprises: providing a surface modification Luminescent powder, the surface-modified luminescent powder comprising at least one luminescent powder 1 and at least one granule 2 or a liquid film body 3 overlying the luminescent powder; and modifying the surface by a fixing procedure The luminescent powder 31 is fixed on a substrate to form a chip-level illuminating element, wherein the surface of the chip-level illuminating element or the five masks has a luminescent powder layer, wherein the luminescent powder 1 can be a fluorescent powder or any The luminescent body 2, which may be glass powder, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin or powder, and paraffin hydrocarbon and ceramic powder, or a combination thereof.

According to the second figure, the flow steps of the second embodiment are as follows:

Step 1: Spread the luminescent powder 1 evenly on the workbench.

In the second step, the granule 2 is uniformly attached to the luminescent powder 1 by a mixing process to form a surface-modified luminescent powder 31. The mixing procedure is to use a stirring method to make particles having a smaller particle size. The body is uniformly attached to the luminescent powder having a large particle size, and the surface-modified luminescent powder 31 can be used as a luminescent powder layer of a chip-level illuminating element.

Step 2 bis: the liquid film body 3 is uniformly attached to the luminescent powder 1 by an ultraviolet or ultrasonic oscillating process to form a surface-modified luminescent powder 31. The surface-modified luminescent powder 31 can be As a luminescent powder layer of chip-level light-emitting elements.

Step 3: Fixing the surface-modified luminescent powder of step two on a substrate by a fixing process to form the surface of the invention or having five luminescent powders The chip-level illuminating element of the layer, the above fixed procedure includes an ultrasonic oscillating program, an ultraviolet ray irradiation program and a heating program.

The raw material of the liquid film body 3 described in the above step 2 is any one or a combination of glass powder, graphene powder, cerium oxide powder, silicone rubber or powder, epoxy resin glue or powder, paraffin hydrocarbon and ceramic powder.

The fixing procedure described in the above step 3 further comprises a vacuum coating method.

The optimum temperature for the above heating procedure is between 50 and 200 degrees Celsius.

The chip-level light-emitting element having the luminescent powder layer prepared on the surface according to the specific embodiment is subjected to surface structure analysis by a scanning electron microscope, and the analysis map is as shown in the third, fourth, and fifth figures, according to the third figure. As shown, the surface of the chip-scale light-emitting element produced by the preparation step of the present invention has a uniform thickness of the luminescent powder layer, and the thickness of the luminescent powder layer is between 30 and 35 microns. Compared with the chip-level light-emitting element fabricated by the conventional potting and packaging technology, the optical microscope and the electron microscope analysis image are as shown in the sixth and seventh figures, and the surface of the chip-level light-emitting element is in the luminescent powder layer. The luminescent powder is unevenly dispersed and cannot completely cover all surfaces or five sides of the element. It is thus proved that the preparation method of the chip-level luminescent element provided by the invention has unpredictable effects, and the thickness of the luminescent powder layer can be less than 120 micrometers. And the chip-level light-emitting element with stable light effect.

In summary, according to the method for preparing a chip-scale light-emitting element and the method for manufacturing a surface-modified luminescent powder provided by the present invention, the above method can efficiently prepare a chip-level luminescence having a surface or a five-sided luminescent powder layer having a uniform thickness. The component can solve the problem that the surface structure of the light-emitting component caused by the prior art is uneven, and the quality of the chip-level light-emitting component and the light-emitting performance are low, and at the same time, because the chip-level light-emitting component having a thickness of the light-emitting layer of less than 120 μm can be manufactured, Effectively improve light efficiency, so it can be widely used in the light lighting industry.

The present invention has been described by way of example only, and the scope of the invention is not to be construed as limited by the scope of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

The first figure shows a schematic view of a surface-modified luminescent powder according to a second embodiment of the present invention; the second figure shows a flow chart of the second step of the second embodiment of the present invention; and the third figure is according to the present invention. Scanning electron micrograph A of the chip-scale light-emitting element produced by the preparation method; the fourth figure is a scanning electron microscope image B of the chip-scale light-emitting element prepared according to the preparation method of the present invention; The surface scanning electron microscope image C of the chip-scale light-emitting element produced by the preparation method according to the present invention; the sixth figure is the optical microscope and scanning type of the chip-level light-emitting element made by potting and packaging technology The electron micrograph; and the seventh figure are scanning electron micrograph (SEM) images of chip-scale light-emitting elements prepared by adhering the phosphor powder to the glue in a conventional technique.

1‧‧‧Light powder

2‧‧‧ granules

3‧‧‧Liquid membrane body

31‧‧‧ Surface-modified luminescent powder

Claims (11)

A method for preparing a chip-level light-emitting device, the method comprising: providing a surface-modified luminescent powder, the surface-modified luminescent powder comprising at least one luminescent powder and at least one granule or one covering the luminescent powder a liquid film body; and a surface-light-emitting element formed by fixing the surface-modified luminescent powder on a substrate by a fixing process, wherein the surface of the chip-level light-emitting element or the five masks has a luminescent powder layer. The method for preparing a chip-scale light-emitting device according to claim 1, wherein the luminescent powder is a phosphor powder or any light-conducting powder. The method for preparing a chip-scale light-emitting device according to claim 1, wherein the particle system is selected from one of the following groups and any combination thereof: glass powder, graphene powder, cerium oxide powder, silicone rubber or Powder, epoxy resin or powder, paraffin and ceramic powder. The method for producing a chip-scale light-emitting device according to claim 1, wherein the surface-modified luminescent powder has a particle diameter of less than 100 μm. The method for preparing a chip-scale light-emitting device according to claim 1, wherein the liquid film system is selected from one of the following groups and any combination thereof: glass powder, graphene powder, cerium oxide powder, silicone rubber Or powder, epoxy resin or powder, paraffin and ceramic powder. The method for preparing a chip-scale light-emitting device according to claim 1, wherein the fixing program comprises: a vacuum coating program, a ultrasonic oscillation program, an ultraviolet irradiation program, and a heating program. The method for preparing a chip-scale light-emitting device according to claim 6, wherein the heating temperature is between 50 and 200 degrees Celsius. The method for preparing a chip-scale light-emitting device according to claim 1, wherein the luminescent powder layer has a thickness of less than 120 μm. A method for producing a surface-modified luminescent powder, the method comprising: providing a polymer comprising epoxy resin or silicone or other viscous material; performing a mixing process to mix the polymer The mixing procedure comprises grinding, agitation and shaking; and a coating procedure is performed to attach the polymer to a luminescent powder to form a surface-modified luminescent powder. The method for producing a surface-modified luminescent powder according to claim 9, wherein the luminescent powder is a phosphor or any light-conducting powder. The method for producing a surface-modified luminescent powder according to claim 9, wherein the luminescent powder has a particle diameter of less than 100 μm.