TW201641203A - Ceramic plating - Google Patents

Ceramic plating Download PDF

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TW201641203A
TW201641203A TW104116589A TW104116589A TW201641203A TW 201641203 A TW201641203 A TW 201641203A TW 104116589 A TW104116589 A TW 104116589A TW 104116589 A TW104116589 A TW 104116589A TW 201641203 A TW201641203 A TW 201641203A
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composite member
members
transparent
ceramic
pressure
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TW104116589A
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Chinese (zh)
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拉斯 施內特
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製陶技術 Etec公司
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Abstract

Composite member of material bonding, manufacturing method thereof and its application are disclosed. The present invention particularly relates to a transparent ceramic composite member of material bonding, manufacturing method of such ceramic composite member and its application. The composite member is made of two members fastened to each other. At least one member is an engineering ceramic. The members are fastened to each other without using bonding materials.

Description

陶瓷的噴鍍 Ceramic spraying

本發明係有關於材料接合之複合構件、其製造方法及其應用。本發明特別是關於材料接合之透明的陶瓷複合構件、此類陶瓷複合構件的製造方法及其應用。 The present invention relates to a composite member for material joining, a method of manufacturing the same, and applications thereof. More particularly, the present invention relates to transparent ceramic composite members joined by materials, methods of making such ceramic composite members, and applications thereof.

工程陶瓷較各種其他材料之優點是在化學、熱及/或機械方面的穩定性更高。因而擴大陶瓷之應用範圍係有利之舉。 The advantage of engineering ceramics over a variety of other materials is their greater chemical, thermal and/or mechanical stability. Therefore, it is advantageous to expand the application range of ceramics.

特別是在腐蝕較強的領域,透明陶瓷可優於塑膠或玻璃等透明材料。透明陶瓷因其在化學、熱及/或機械方面的耐受性而適用於腐蝕程度較大的場合。 Especially in areas with strong corrosion, transparent ceramics are superior to transparent materials such as plastic or glass. Transparent ceramics are suitable for applications where corrosion is high due to their chemical, thermal and/or mechanical resistance.

但工程陶瓷亦具某些缺點。例如在許多場合下,較薄的陶瓷-基材之斷裂強度有所不足。透明陶瓷例如可用作移動電子設備的顯示盤。但用陶瓷盤很難達到厚度及重量方面的標準,因為此等標準必須具有一定厚度以便確保足夠的斷裂強度。 However, engineering ceramics also have certain shortcomings. For example, in many cases, the fracture strength of thinner ceramic-substrates is insufficient. Transparent ceramics, for example, can be used as display panels for mobile electronic devices. However, it is difficult to achieve thickness and weight standards with ceramic disks because these standards must have a certain thickness in order to ensure sufficient breaking strength.

一種解決上述難題的方案在於,提供陶瓷-基材複合體或層疊物,其陶瓷可採用超薄方案且提供功能表面。基材用作陶瓷之載體且可實現更多功能,如使複合體具有足夠的斷裂強度。但必須以牢固(較佳材料接合)的方式將陶瓷與載體材料相連。 One solution to the above problems is to provide a ceramic-substrate composite or laminate whose ceramics can be ultra-thin and provide a functional surface. The substrate acts as a carrier for the ceramic and can perform more functions, such as providing the composite with sufficient breaking strength. However, the ceramic must be attached to the carrier material in a strong (preferably material bonded) manner.

先前技術中公開過藉由黏接層而相連的陶瓷-基材層疊物。但此種黏接層尤其是難以將整個層疊物之極高強度與極強的層間附著力相結合。 Ceramic-substrate laminates joined by an adhesive layer are disclosed in the prior art. However, such an adhesive layer is particularly difficult to combine the extremely high strength of the entire laminate with the extremely strong interlayer adhesion.

特別是在光學領域中公開過由玻璃等非晶材料構成的材料接合之複合體,此類複合體係透過對兩個單個構件進行噴鍍而製成。該項操作係為兩個表面品質極佳且表面形狀彼此形狀配合的構件建立連接。可透過彼此抵靠來使得此等構件上的對應表面密切接觸,從而為該二構件建立固定連接。依據當前之理論,保持此種連接的作用力為該二構件之各原子或分子間的凡得瓦力。 In particular, in the field of optics, a composite of materials joined by an amorphous material such as glass is disclosed, and such a composite system is produced by sputtering two individual members. This operation establishes a connection between two members whose surface quality is excellent and whose surface shapes are shaped to each other. The corresponding surfaces on the members can be brought into close contact by abutting each other to establish a fixed connection for the two members. According to current theories, the force that sustains such a connection is the van der Waals force between the atoms or molecules of the two members.

實施噴鍍之優點在於,毋需使用連接材料(如黏接劑)便能將此等構件連接在一起。經推測,此等構件主要因附著力而聚合在一起。矽晶圓與石英晶圓之接合機制建立在高溫下(>100℃)形成之Si-O-Si連接物的基礎上(Gösele,Tong:Semiconductor wafer bonding,Annual Review of Materials Science 28(1),1998,215-241)。有必要對該表面進行充分的親水化處理,以便形成Si-O-Si連接物。該連接之牢固性的前提條件在於乾淨、非常光滑且精確配合的表面。 The advantage of performing a spray coating is that it is not necessary to use a joining material such as an adhesive to join the components together. It is speculated that these components are mainly aggregated by adhesion. The bonding mechanism between the germanium wafer and the quartz wafer is based on a Si-O-Si bond formed at a high temperature (>100 ° C) (Gösele, Tong: Semiconductor wafer bonding, Annual Review of Materials Science 28 (1), 1998, 215-241). It is necessary to sufficiently hydrophilize the surface to form a Si-O-Si bond. A prerequisite for the robustness of the connection is a clean, very smooth and precisely mated surface.

DE102011012835 A1描述一種將玻璃與晶體陶瓷接合在一起的方法,係在氧低壓電漿中進行預處理,再於負壓條件下(<10mbar)以至少100℃進行熱處理。毋需額外地(例如用SiO2)實施塗佈工藝。可透過施加20kPa至5MPa的壓緊力來實現此點。 DE 10 2011 012 835 A1 describes a method of joining glass to a crystalline ceramic by pretreatment in an oxygen low pressure plasma and heat treatment at at least 100 ° C under vacuum (<10 mbar). It is not necessary to carry out the coating process additionally (for example with SiO 2 ). This can be achieved by applying a pressing force of 20 kPa to 5 MPa.

本發明之目的在於提供一種由一工程陶瓷與另一構件構成 之固定連接。特別是在涉及透明陶瓷的情況下,本發明之連接亦不對該複合體之透明度造成負面影響。本發明係提供陶瓷與陶瓷或者陶瓷與其他材料的複合構件,如包含(固化)玻璃的陶瓷或者包含塑膠的陶瓷。 The object of the present invention is to provide an engineering ceramic and another component Fixed connection. Especially in the case of transparent ceramics, the connection of the invention does not adversely affect the transparency of the composite. The present invention provides composite members of ceramics and ceramics or ceramics and other materials, such as ceramics containing (cured) glass or ceramics containing plastic.

唯有在研發了多晶之透明陶瓷(如WO 2013/068418 A1所描述之多晶之透明陶瓷,其在600nm波長條件下之RIT值>75%(厚度:2nm))後,本發明首次藉由噴鍍來製造具有至少一陶瓷組分的透明之材料複合體。該透明度係透過測量 Only after the development of polycrystalline transparent ceramics (such as the polycrystalline transparent ceramic described in WO 2013/068418 A1, whose RIT value is >75% (thickness: 2 nm) at a wavelength of 600 nm), the present invention is the first to borrow A transparent material composite having at least one ceramic component is produced by sputtering. The transparency is measured

- 直線透射率(RIT)及<0.5º之較窄孔徑角 - Linear transmittance (RIT) and narrower aperture angles <0.5o

- 斑點頻率 - Spot frequency

- Haze(渾濁度) - Haze (turbidity)

來可靠地量化。 To reliably quantify.

本發明用以達成上述目的之解決方案為一種具有獨立項之特徵的複合構件。較佳設計方案參閱附屬項。本發明之製造本發明之複合構件的方法由獨立方法請求項之特徵定義。因此,本發明之方法透過噴鍍來為一陶瓷構件與另一構件建立連接。本發明之方法的較佳設計方案參閱附屬方法請求項。 The solution of the present invention to achieve the above object is a composite member having the characteristics of a separate item. The preferred design is referred to the attached item. The method of the present invention for making a composite component of the present invention is defined by the features of the independent method request. Thus, the method of the present invention establishes a connection between a ceramic component and another component by sputtering. A preferred design of the method of the present invention is described in the accompanying method request.

根據本發明的一種較佳實施方式,將該二構件直接地,即毋需助黏劑地接合在一起。為此而需要某個接合壓力。 According to a preferred embodiment of the invention, the two members are joined together directly, i.e., without the aid of an adhesive. A certain joint pressure is required for this purpose.

根據本發明的另一實施方式,亦可在一或兩個構件上鍍覆助黏劑再透過該或該等助黏劑將該等構件噴鍍在一起。本發明尤佳採用金屬或金屬氧化物為助黏劑,可透過不同的工藝將該等金屬或金屬氧化物鍍覆在相應構件上。尤佳採用塗佈法,特別是PVD法(如濺鍍、電子束蒸發、 離子輔助沈積)、CVD法或者溶膠-凝膠法。PVD法尤其適用,因其能夠實現實施噴鍍所需之平坦度。層厚較佳為1nm至10μm。當然亦可藉由網版印刷或移印或者類似工藝將該等層鍍覆在構件上。 According to another embodiment of the present invention, the adhesion promoter may be plated on one or both members and the members may be sprayed together through the or the adhesion promoter. In particular, the present invention preferably employs a metal or metal oxide as an adhesion promoter, which can be plated on the respective members through different processes. It is especially preferred to use coating methods, especially PVD methods (such as sputtering, electron beam evaporation, Ion assisted deposition), CVD or sol-gel methods. The PVD method is particularly suitable because it enables the flatness required to perform the sputtering. The layer thickness is preferably from 1 nm to 10 μm. It is of course also possible to plate the layers onto the component by screen printing or pad printing or the like.

該等金屬可實施為金屬層或氧化層。例如在氧化條件下(如氧化氣氛下)實施接合時,氧化層較佳亦可於該等構件之接合過程中產生。 The metals can be implemented as a metal layer or an oxide layer. For example, when bonding is performed under oxidizing conditions (e.g., under an oxidizing atmosphere), the oxide layer is preferably produced during the bonding of the members.

較佳採用透明的Si及Ti,尤佳採用透明的SiO2、TiO2或ITO(氧化銦錫)為助黏劑。根據本發明,其他金屬或金屬氧化物,特別是透明的金屬或金屬氧化物,同樣適於用作助黏劑。就毋需透明的構件而言,當然亦可採用不透明的金屬或金屬氧化物。替代方案係藉由熱解沈積一矽前驅體來實施表面矽化。此種方案係透過燃燒單矽烷(SiH4)來為表面塗佈SiO2。尤佳(如藉由電漿清洗)對該表面進行預清洗。 Transparent Si and Ti are preferably used, and transparent SiO 2 , TiO 2 or ITO (indium tin oxide) is preferably used as an adhesion promoter. According to the invention, other metals or metal oxides, in particular transparent metals or metal oxides, are likewise suitable as adhesion promoters. For components that do not require transparency, it is of course also possible to use opaque metals or metal oxides. An alternative is to perform surface deuteration by pyrolytic deposition of a precursor. This solution coats the surface with SiO 2 by burning monodecane (SiH 4 ). It is especially preferred to pre-clean the surface (eg by plasma cleaning).

為對該等構件進行噴鍍,待噴鍍表面的平坦度應<10μm,較佳<1μm,尤佳<100nm。 For the spraying of the members, the flatness of the surface to be sprayed should be <10 μm, preferably <1 μm, and particularly preferably <100 nm.

根據本發明,在接合過程中,待連接之構件的表面之距離非常小,根據本發明的尤佳方案,使得待連接之構件的表面發生緊密接觸,亦即,該等表面之距離在本發明中等於零,待連接之構件的表面儘可能整面地發生接觸。為確保此種緊密接觸,本發明尤佳採用前述之表面平坦度。根據本發明的另一較佳方案,該等待連接之表面彼此精確配合。特別是在不採用助黏劑的情況下對該等構件進行噴鍍時,對配合精確度的要求特別高。 According to the invention, the distance of the surface of the component to be joined is very small during the joining process, and according to a preferred embodiment of the invention, the surfaces of the components to be joined are brought into intimate contact, ie the distance of the surfaces is in accordance with the invention The middle is equal to zero, and the surface of the member to be joined is brought into contact as completely as possible. In order to ensure such close contact, the present invention particularly preferably employs the aforementioned surface flatness. According to another preferred embodiment of the invention, the surfaces awaiting connection are precisely matched to each other. In particular, when the members are sprayed without using an adhesion promoter, the accuracy of the fitting is particularly high.

根據本發明,在接合完畢後或者在接合過程中可能有必要施加壓力及/或溫度,視待連接之材料而定。 According to the invention, it may be necessary to apply pressure and/or temperature after joining or during joining, depending on the material to be joined.

本發明之較佳壓力介於大氣壓力與2000MPa之間。例如可在熱均壓機(HIP)中藉由氣壓(氬氣、氮氣、空氣)來產生較大的壓力。 The preferred pressure of the present invention is between atmospheric pressure and 2000 MPa. For example, a large pressure can be generated by a gas pressure (argon, nitrogen, air) in a hot press (HIP).

實施接合過程之較佳溫度範圍介於室溫與低於該構件之熔化溫度/軟化溫度之間,其具有更低的熔化溫度/軟化溫度。 A preferred temperature range for performing the joining process is between room temperature and below the melting/softening temperature of the member, which has a lower melting/softening temperature.

在HIP設備中實施本發明之接合過程的優點在於,能夠同時進行溫度施加及壓力施加,視需要甚至可在某個氣氛下進行。 An advantage of implementing the joining process of the present invention in a HIP device is that temperature application and pressure application can be performed simultaneously, even under an atmosphere, as desired.

亦可在能夠以壓力及/或溫度進行處理的真空爐、壓力燒結爐或其他機組中進行處理。亦可採用機械式壓力組件,如壓力機,並在爐子中進行熱處理。 It can also be processed in vacuum furnaces, pressure sintering furnaces or other units that can be treated at pressure and/or temperature. Mechanical pressure components, such as presses, can also be used and heat treated in the furnace.

為縮短處理時間,本發明亦可藉由快速燒結工藝,如FAST法(場輔助燒結工藝)來進行壓力與熱處理。 In order to shorten the processing time, the present invention can also be subjected to pressure and heat treatment by a rapid sintering process such as a FAST method (field assisted sintering process).

在對該等構件進行噴鍍前,視情況對待接合之表面進行清洗係有利之舉。根據本發明,可透過電漿蝕刻,化學清洗,在空氣、真空氣氛或H2氣氛下進行調溫,或者透過離子束蝕刻來去除該等表面上的水、OH基、烴以及其他物質。 It is advantageous to perform cleaning on the surface to be joined, as appropriate, before spraying the components. According to the present invention, water, OH groups, hydrocarbons, and other substances on the surfaces can be removed by plasma etching, chemical cleaning, temperature adjustment in air, vacuum atmosphere or H 2 atmosphere, or by ion beam etching.

根據本發明的一種較佳實施方式,該等待噴鍍之構件的熱膨脹係數(WAK)彼此匹配。在某些場合下,例如當本發明所製成之複合構件需要應用於熱負荷情況下時(如用作爐子窗戶或壁爐窗戶時),該等WAK較佳儘可能類似。 According to a preferred embodiment of the invention, the coefficients of thermal expansion (WAK) of the components to be sprayed are matched to each other. In some instances, such as when the composite members made in accordance with the present invention need to be applied under thermal loading conditions (e.g., when used as furnace windows or fireplace windows), such WAKs are preferably as similar as possible.

但在該複合構件的某些用途中,本發明中的該二構件較佳具有不同的熱膨脹係數。本發明提供某種複合構件,其一構件由WAK較高之材料構成時,在另一構件中會產生壓應力。亦即,例如將WAK較低之陶瓷 構件與WAK較高之玻璃連接時,在該陶瓷表面內會產生壓應力,該壓應力可能會增大陶瓷之斷裂強度。 However, in some applications of the composite member, the two members of the present invention preferably have different coefficients of thermal expansion. The present invention provides a composite member in which a member is composed of a material having a higher WAK, and compressive stress is generated in the other member. That is, for example, ceramics with lower WAK When the member is connected to the glass of the WAK, a compressive stress is generated in the surface of the ceramic, and the compressive stress may increase the breaking strength of the ceramic.

根據本發明的一種尤佳實施方式,該所製成之複合構件為(例如)移動電子設備之顯示器的一部分。在此情況下,該複合構件之總厚度非常小。因此,該陶瓷複合構件由一較薄的陶瓷層構成,其例如與化學固化玻璃或與塑膠連接。就此種用途而言,該陶瓷層或該陶瓷構件之厚度<50mm,較佳<1mm,尤佳<0.5mm,最佳<0.1mm。 According to a particularly preferred embodiment of the invention, the fabricated composite member is part of a display of, for example, a mobile electronic device. In this case, the total thickness of the composite member is very small. Thus, the ceramic composite component consists of a thinner ceramic layer, for example bonded to a chemically cured glass or to a plastic. For such use, the ceramic layer or the ceramic member has a thickness of <50 mm, preferably <1 mm, more preferably <0.5 mm, and most preferably <0.1 mm.

本發明之原理是在陶瓷構件與待噴鍍之構件材料之間產生一擴散層。待噴鍍之構件材料亦可輕微地滲入陶瓷表面,接觸層內之柵格亦可有所調整。 The principle of the invention is to create a diffusion layer between the ceramic component and the component material to be sprayed. The material to be sprayed may also slightly penetrate the ceramic surface, and the grid in the contact layer may be adjusted.

該等待噴鍍之構件係以形成一化學反應區的方式材料接合地連接在一起。 The components to be sprayed are joined together in a materially bonded manner to form a chemical reaction zone.

本發明意外發現,本發明之透明複合構件可以不設干擾性中間層的方式透過噴鍍而製造,其 The present inventors have unexpectedly discovered that the transparent composite member of the present invention can be produced by sputtering without interfering intermediate layers.

- RIT>60%,較佳>70%,尤佳>75% - RIT>60%, preferably >70%, especially better >75%

- 斑點頻率<10%,較佳<3%,尤佳<1% - Spot frequency <10%, preferably <3%, especially preferably <1%

- Haze<10%,較佳為5%,尤佳<2%。在平坦度(<10μm,較佳<1μm,尤佳<100nm)及粗糙度(<20nm,較佳<10nm,尤佳<1nm)方面採用較高要求後,便能防止(例如)因表面空隙而出現散射光或者出現干涉圖的情形。 - Haze <10%, preferably 5%, especially preferably <2%. By using higher requirements in terms of flatness (<10 μm, preferably <1 μm, especially <100 nm) and roughness (<20 nm, preferably <10 nm, especially <1 nm), it is possible to prevent, for example, surface voids. In the case of scattered light or an interferogram.

該等接合對採用較薄方案(厚度<1.5mm,較佳<0.75mm,尤佳<0.3mm)時,能夠產生RIT值>80%之更為適宜的接合連接,因為透明 度隨著厚度的減小而增大。其原因在於,陶瓷組分較薄時,原本就極低的缺陷密度(孔隙率<100ppm)進一步降低,光線幾乎不受阻礙地穿過構件。此外在幾何方面的要求亦有所降低,因為玻璃組分及陶瓷組分可發生變形並能被柔軟地貼靠在一起。為此而需要施加某個接合壓力。 These bonding pairs can produce a more suitable joint connection with a RIT value of >80% when using a thinner solution (thickness <1.5 mm, preferably <0.75 mm, especially <0.3 mm) because of the transparent The degree increases as the thickness decreases. The reason for this is that when the ceramic composition is thin, the originally extremely low defect density (porosity < 100 ppm) is further lowered, and the light passes through the member almost unimpeded. In addition, the geometric requirements are also reduced because the glass components and ceramic components can be deformed and can be softly pressed together. To do this, it is necessary to apply a certain joint pressure.

該等較薄的陶瓷組分具有多晶結構,較佳採用鎂鋁尖晶石(MgAl2O4)或多晶剛玉(α-Al2O3)。 The thinner ceramic components have a polycrystalline structure, preferably magnesium aluminate spinel (MgAl 2 O 4 ) or polycrystalline corundum (α-Al 2 O 3 ).

硬質陶瓷足夠薄時,可使其變得柔軟:抗彎剛度與厚度的三次冪成正比,因而較薄的構件實施方案顯著降低剛度。此點在以下情況下尤為明顯:陶瓷厚度<300μm,較佳<200μm,尤佳<100μm。 When the hard ceramic is thin enough, it can be made soft: the bending stiffness is proportional to the third power of the thickness, so the thinner component embodiment significantly reduces the stiffness. This is particularly evident in the case where the ceramic thickness is <300 μm, preferably <200 μm, and particularly preferably <100 μm.

具體言之,本發明描述以下方面: In particular, the present invention describes the following aspects:

‧一種由兩個構件之固定連接構成的複合構件,其中至少一構件為工程陶瓷,且其中該等構件係以不採用連接材料的方式連接。 ‧ A composite member consisting of a fixed connection of two members, at least one of which is an engineered ceramic, and wherein the members are joined in a manner that does not employ a joining material.

‧如前一點之複合構件,其中該二構件係以形成一化學反應區的方式材料接合地相連。 ‧ A composite member according to the previous point, wherein the two members are joined in a materially joined manner in a manner to form a chemical reaction zone.

‧如前述點中任一項之複合構件,其中該一構件為工程陶瓷,該另一構件係選自陶瓷、選自第二工程陶瓷、選自透明材料、選自玻璃,較佳選自含鹼鋁矽玻璃,尤佳選自其近表面層被一定壓力預張的含鹼鋁矽玻璃、選自固化玻璃或者選自塑膠。 The composite member according to any one of the preceding claims, wherein the one member is an engineering ceramic selected from the group consisting of ceramics, selected from a second engineering ceramic, selected from a transparent material, selected from the group consisting of glass, preferably selected from the group consisting of The alkali aluminum bismuth glass is preferably selected from the group consisting of alkali-containing aluminum bismuth glass whose near surface layer is pre-tensioned by a certain pressure, selected from cured glass or selected from plastic.

‧如前述點中任一項之複合構件,其中該工程陶瓷具有多晶結構。 The composite member according to any one of the preceding claims, wherein the engineering ceramic has a polycrystalline structure.

‧如前述點中任一項之複合構件,其特徵在於,該工程陶瓷為多晶之透明工程陶瓷。 The composite member according to any one of the preceding claims, characterized in that the engineering ceramic is a polycrystalline transparent engineering ceramic.

‧如前述點中任一項之複合構件,其中該工程陶瓷為多晶之透明工程 陶瓷,較佳為鎂鋁尖晶石(MgAl2O4)或多晶剛玉(α-Al2O3)。 The composite member according to any one of the preceding claims, wherein the engineering ceramic is a polycrystalline transparent engineering ceramic, preferably magnesium aluminum spinel (MgAl 2 O 4 ) or polycrystalline corundum (α-Al 2 O 3 ) .

‧如前述點中任一項之複合構件,其中該複合構件係透明。 The composite member of any of the preceding claims, wherein the composite member is transparent.

‧如前述點中任一項之複合構件,其中該複合構件係透明且其RIT>60%,較佳>70%,尤佳>75%,斑點頻率<10%,較佳<3%,尤佳<1%,Haze(渾濁度)<10%,較佳5%,尤佳<2%。 The composite member according to any one of the preceding claims, wherein the composite member is transparent and has a RIT > 60%, preferably > 70%, particularly preferably > 75%, and a spot frequency < 10%, preferably < 3%, especially Preferably <1%, Haze (hazeness) <10%, preferably 5%, especially preferably <2%.

‧一種製造如前述點中任一項或多項之複合構件的方法,其中將兩個構件,其中至少一構件為工程陶瓷,以不採用連接材料的方式透過噴鍍來連接在一起。 A method of manufacturing a composite member according to any one or more of the preceding claims, wherein the two members, at least one of which is an engineered ceramic, are joined together by sputtering without using a joining material.

‧如前述點中任一項之方法,其中將兩個構件,其中至少一構件為工程陶瓷,以不採用連接材料的方式透過一接合壓力來連接在一起。 </ RTI> The method of any of the preceding claims, wherein the two members, at least one of which is an engineered ceramic, are joined together by a joining pressure without using a joining material.

‧如前述點中任一項之方法,其中將一助黏劑鍍覆在一或兩個構件之表面上再透過該或該等助黏劑將該等構件噴鍍在一起。 The method of any of the preceding claims, wherein an adhesion promoter is plated on the surface of one or both members and the members are sprayed together through the or the adhesion promoter.

‧如前述點中任一項之方法,其中將金屬或金屬氧化物用作助黏劑。 </ RTI> A method according to any one of the preceding claims, wherein a metal or metal oxide is used as an adhesion promoter.

‧如前述點中任一項之方法,其中藉由塗佈法,特別是PVD法(如濺鍍、電子束蒸發、離子輔助沈積)、CVD法或者溶膠-凝膠法來鍍覆該等助黏劑。 The method of any of the preceding claims, wherein the coating is applied by a coating method, in particular a PVD method (such as sputtering, electron beam evaporation, ion assisted deposition), CVD or sol-gel method. Adhesive.

‧如前述點中任一項之方法,其中以1nm至10μm的層厚鍍覆該等助黏劑。 The method of any of the preceding claims, wherein the adhesion promoter is plated with a layer thickness of from 1 nm to 10 μm.

‧如前述點中任一項之方法,其中採用透明的Si及Ti,尤佳採用透明的SiO2、TiO2或ITO(氧化銦錫)為助黏劑。 ‧ The method according to any one of the preceding claims, wherein transparent Si and Ti are used, and transparent SiO 2 , TiO 2 or ITO (indium tin oxide) is particularly preferably used as an adhesion promoter.

‧如前述點中任一項之方法,其中藉由熱解沈積一矽前驅體來實施表面矽化。 </ RTI> A method according to any one of the preceding claims, wherein surface deuteration is carried out by pyrolytic deposition of a precursor.

‧如前述點中任一項之方法,其中透過燃燒單矽烷(SiH4)來為該表面塗佈SiO2The method of any of the preceding claims, wherein the surface is coated with SiO 2 by burning monodecane (SiH 4 ).

‧如前述點中任一項之方法,其中該等待噴鍍構件之表面的平坦度為<10μm,較佳<1μm,尤佳<100nm。 </ RTI> The method of any one of the preceding claims, wherein the surface of the surface to be coated is <10 μm, preferably <1 μm, and more preferably <100 nm.

‧如前述點中任一項之方法,其中使得該等待連接之表面彼此精確配合。 The method of any of the preceding claims, wherein the surfaces of the waiting connection are precisely matched to each other.

‧如前述點中任一項之方法,其中在接合完畢後或者在接合過程中施加壓力及/或溫度。 </ RTI> A method according to any one of the preceding claims, wherein pressure and/or temperature is applied after the joining is completed or during the joining process.

‧如前述點中任一項之方法,其中該等施加之壓力介於大氣壓力與2000MPa之間。 The method of any of the preceding claims, wherein the applied pressure is between atmospheric pressure and 2000 MPa.

‧如前述點中任一項之方法,其中在熱均壓機(HIP)中藉由氣壓(氬氣、氮氣、空氣)來施加壓力。 The method of any of the preceding claims, wherein the pressure is applied by a gas pressure (argon, nitrogen, air) in a hot press (HIP).

‧如前述點中任一項之方法,其中實施該接合過程之溫度範圍介於室溫與低於該構件之熔化溫度/軟化溫度之間,其具有更低的熔化溫度/軟化溫度。 The method of any of the preceding claims, wherein the bonding process is carried out at a temperature ranging between room temperature and below the melting/softening temperature of the member, which has a lower melting/softening temperature.

‧如前述點中任一項之方法,其中為縮短處理時間,採用快速燒結工藝,如FAST法(場輔助燒結工藝)來進行該壓力與熱處理。 The method according to any one of the preceding claims, wherein, in order to shorten the processing time, the pressure and heat treatment are carried out by a rapid sintering process such as a FAST method (field assisted sintering process).

‧如前述點中任一項之方法,其中在對該等構件進行噴鍍前,對該等待接合之表面進行清洗。 The method of any of the preceding claims, wherein the surface to be joined is cleaned prior to spraying the components.

‧如前述點中任一項之方法,其中在對該等構件進行噴鍍前,透過電漿蝕刻,化學清洗,在空氣、真空氣氛或H2氣氛下進行調溫,或者透過離子束蝕刻來去除該等待接合之表面上的有害物質。 </ RTI> The method according to any one of the preceding claims, wherein, prior to spraying the components, plasma etching, chemical cleaning, temperature adjustment in air, vacuum atmosphere or H 2 atmosphere, or ion beam etching Remove the harmful substances on the surface waiting to be joined.

‧如前述點中任一項之方法,其中使得該等待噴鍍之構件的熱膨脹係數(WAK)彼此匹配。 The method of any of the preceding claims, wherein the coefficient of thermal expansion (WAK) of the member to be sprayed is matched to each other.

‧如前述點中任一項之方法,其中該等待噴鍍之構件的熱膨脹係數(WAK)儘可能類似。 The method of any of the preceding claims, wherein the coefficient of thermal expansion (WAK) of the member to be sprayed is as similar as possible.

‧如前述點中任一項之方法,其中該一構件由WAK較高之材料構成,以便在該另一構件中產生壓應力。 The method of any of the preceding claims, wherein the one member is constructed of a material having a higher WAK to create compressive stress in the other member.

本發明亦有關於本發明之複合構件或者本發明所製成之複合構件的應用,例如用作移動電子設備之顯示器的一部分或者用作爐子窗戶或壁爐窗戶。 The invention also relates to the use of the composite member of the invention or the composite member made in accordance with the invention, for example as part of a display for a mobile electronic device or as a furnace window or a fireplace window.

下面結合若干實例對本發明進行闡述,此等實例不對本發明構成限制。 The invention is described below in connection with a number of examples, which are not intended to limit the invention.

實例1: Example 1:

用化學劑及電漿清洗劑對兩個具有拋光(ra<20nm,較佳ra<10nm,尤佳ra<4nm)表面之方形尖晶石瓷磚進行預處理。在無塵室環境中,在室溫條件下使得該等表面發生接觸、彼此對準並在一熱均壓機中以>500bar,較佳>1000bar,尤佳>1500bar的均壓力進行熱處理。所需溫度為>1200℃,較佳為>1350℃,尤佳為>1500℃。熱處理結束後藉由若干擴散工序建立了材料接合之連接,從而實現RIT值>75%的透明複合構件。 Two square spinel tiles having a polished surface (r a < 20 nm, preferably r a < 10 nm, particularly preferably r a < 4 nm) are pretreated with a chemical agent and a plasma cleaner. In a clean room environment, the surfaces are brought into contact, aligned with one another at room temperature and heat treated in a thermal homogenizer at a pressure equal to >500 bar, preferably >1000 bar, and particularly preferably >1500 bar. The desired temperature is > 1200 ° C, preferably > 1350 ° C, and more preferably > 1500 ° C. After the end of the heat treatment, the joining of the materials is established by a plurality of diffusion processes, thereby realizing a transparent composite member having a RIT value of >75%.

實例2: Example 2:

將一近表面層被一定壓力預張的含鹼鋁矽玻璃與一透明尖晶石陶瓷噴鍍在一起。該等方形檢體之尺寸為10mmx10mm。玻璃厚度為1mm,陶瓷厚度為500μm。平坦度<5μm,粗糙度小於1nm。兩個接合面的斜切邊實現了在該熱處理前的精確定向。該等接合面經過預清洗。該尖晶石陶瓷配設有一較薄的SiO2層,其透過用化學劑(如硝酸)及一水性NH4OH:H2O2溶液在>80℃之較高溫度下進行處理而變得親水。該等檢體之定向完畢後,在一高真空爐中在200至400℃的溫度條件下進行熱處理。熱處理結束後建立了材料接合之連接,從而實現RIT值>75%的透明複合構件。 An alkali-containing aluminum-bismuth glass which is pre-tensioned by a certain pressure layer is sprayed with a transparent spinel ceramic. The dimensions of the square specimens are 10 mm x 10 mm. The glass has a thickness of 1 mm and a ceramic thickness of 500 μm. The flatness is <5 μm and the roughness is less than 1 nm. The beveled edges of the two joint faces achieve precise orientation prior to the heat treatment. The joint faces are pre-cleaned. The spinel ceramic is provided with a thin SiO 2 layer which is treated by a chemical agent such as nitric acid and an aqueous NH 4 OH:H 2 O 2 solution at a higher temperature of >80 ° C. Hydrophilic. After the orientation of the samples is completed, heat treatment is performed in a high vacuum furnace at a temperature of 200 to 400 °C. After the end of the heat treatment, the joining of the materials is established, thereby realizing a transparent composite member with a RIT value of >75%.

實例3: Example 3:

將一近表面層被一定壓力預張的含鹼鋁矽玻璃與一透明尖晶石陶瓷噴鍍在一起。該等方形檢體之尺寸為10mmx10mm。玻璃厚度為1mm,陶瓷厚度為200μm。平坦度<500nm,粗糙度小於1nm。兩個接合面的斜切邊實現了在該熱處理前的精確定向。該等接合面經過電漿清洗、未經塗佈且親水。該等檢體之定向完畢後,在一高真空爐中在200至400℃的溫度條件下進行熱處理。熱處理結束後建立了材料接合之連接,從而實現RIT值>75%的透明複合構件。 An alkali-containing aluminum-bismuth glass which is pre-tensioned by a certain pressure layer is sprayed with a transparent spinel ceramic. The dimensions of the square specimens are 10 mm x 10 mm. The glass has a thickness of 1 mm and a ceramic thickness of 200 μm. Flatness <500 nm, roughness less than 1 nm. The beveled edges of the two joint faces achieve precise orientation prior to the heat treatment. The joints are plasma cleaned, uncoated and hydrophilic. After the orientation of the samples is completed, heat treatment is performed in a high vacuum furnace at a temperature of 200 to 400 °C. After the end of the heat treatment, the joining of the materials is established, thereby realizing a transparent composite member with a RIT value of >75%.

Claims (31)

一種由兩個構件之固定連接構成的複合構件,其中至少一構件為工程陶瓷,且其中該等構件係以不採用連接材料的方式連接。 A composite member consisting of a fixed connection of two members, at least one of which is an engineering ceramic, and wherein the members are joined in a manner that does not employ a joining material. 如申請專利範圍第1項之複合構件,其特徵在於,該二構件係以形成一化學反應區的方式材料接合地相連。 A composite member according to the first aspect of the invention, characterized in that the two members are joined in a materially joined manner in such a manner as to form a chemical reaction zone. 如申請專利範圍第1或2項之複合構件,其特徵在於,該一構件為工程陶瓷,該另一構件係選自陶瓷、選自第二工程陶瓷、選自透明材料、選自玻璃,較佳選自含鹼鋁矽玻璃,尤佳選自其近表面層被一定壓力預張的含鹼鋁矽玻璃、選自固化玻璃或者選自塑膠。 The composite member according to claim 1 or 2, wherein the one member is an engineering ceramic, the other member is selected from the group consisting of ceramics, selected from the second engineering ceramics, selected from transparent materials, and selected from the group consisting of glass. Preferably, it is selected from the group consisting of alkali-containing aluminum-bismuth glass, and is preferably selected from the group consisting of alkali-containing aluminum-bismuth glass whose front surface layer is pre-tensioned by a certain pressure, selected from cured glass or selected from plastic. 如前述申請專利範圍中任一項之複合構件,其特徵在於,該工程陶瓷具有多晶結構。 A composite member according to any one of the preceding claims, characterized in that the engineering ceramic has a polycrystalline structure. 如前述申請專利範圍中任一項之複合構件,其特徵在於,該工程陶瓷為多晶之透明工程陶瓷。 A composite member according to any one of the preceding claims, characterized in that the engineering ceramic is a polycrystalline transparent engineering ceramic. 如前述申請專利範圍中任一項之複合構件,其特徵在於,該工程陶瓷為多晶之透明工程陶瓷,較佳為鎂鋁尖晶石(MgAl2O4)或多晶剛玉(α-Al2O3)。 The composite member according to any one of the preceding claims, wherein the engineering ceramic is a polycrystalline transparent engineering ceramic, preferably magnesium aluminum spinel (MgAl 2 O 4 ) or polycrystalline corundum (α-Al). 2 O 3 ). 如前述申請專利範圍中任一項之複合構件,其特徵在於,該複合構件係透明。 A composite member according to any one of the preceding claims, characterized in that the composite member is transparent. 如前述申請專利範圍中任一項之複合構件,其特徵在於,該複合構件係透明且其RIT>60%,較佳>70%,尤佳>75%,斑點頻率<10%,較佳<3%,尤佳<1%,Haze(渾濁度)<10%,較佳5%,尤佳<2%。 A composite member according to any one of the preceding claims, wherein the composite member is transparent and has a RIT > 60%, preferably > 70%, particularly preferably > 75%, and a spot frequency < 10%, preferably < 3%, especially preferably <1%, Haze (turbidity) <10%, preferably 5%, especially preferably <2%. 一種製造如前述申請專利範圍中任一項或多項之複合構件的方法,其 特徵在於,將兩個構件,其中至少一構件為工程陶瓷,以不採用連接材料的方式透過噴鍍來連接在一起。 A method of manufacturing a composite member according to any one or more of the preceding claims, It is characterized in that two members, at least one of which is an engineering ceramic, are joined together by sputtering without using a joining material. 如申請專利範圍第9項之方法,其特徵在於,將兩個構件,其中至少一構件為工程陶瓷,以不採用連接材料的方式透過一接合壓力來連接在一起。 The method of claim 9, wherein the two members, at least one of which is an engineering ceramic, are joined together by a joining pressure without using a joining material. 如申請專利範圍第9或10項之方法,其特徵在於,將一助黏劑鍍覆在一或兩個構件之表面上再透過該或該等助黏劑將該等構件噴鍍在一起。 A method of claim 9 or 10, wherein an adhesion promoter is plated on the surface of one or both members and the members are sprayed together through the or the adhesion promoter. 如前述申請專利範圍中任一項之方法,其特徵在於,將金屬或金屬氧化物用作助黏劑。 A method according to any one of the preceding claims, characterized in that a metal or metal oxide is used as an adhesion promoter. 如前述申請專利範圍中任一項之方法,其特徵在於,藉由塗佈法,特別是PVD法(如濺鍍、電子束蒸發、離子輔助沈積)、CVD法或者溶膠-凝膠法來鍍覆該等助黏劑。 A method according to any one of the preceding claims, characterized in that it is plated by a coating method, in particular a PVD method (such as sputtering, electron beam evaporation, ion assisted deposition), CVD or sol-gel method. Cover these adhesion promoters. 如前述申請專利範圍中任一項之方法,其特徵在於,以1nm至10μm的層厚鍍覆該等助黏劑。 A method according to any one of the preceding claims, characterized in that the adhesion promoters are plated with a layer thickness of from 1 nm to 10 μm. 如前述申請專利範圍中任一項之方法,其特徵在於,採用透明的Si及Ti,尤佳採用透明的SiO2、TiO2或ITO(氧化銦錫)為助黏劑。 The method according to any one of the preceding claims, characterized in that transparent Si and Ti are used, and transparent SiO 2 , TiO 2 or ITO (indium tin oxide) is particularly preferably used as an adhesion promoter. 如前述申請專利範圍中任一項之方法,其特徵在於,藉由熱解沈積一矽前驅體來實施表面矽化。 A method according to any one of the preceding claims, characterized in that the surface deuteration is carried out by pyrolytically depositing a ruthenium precursor. 如前述申請專利範圍中任一項之方法,其特徵在於,透過燃燒單矽烷(SiH4)來為該表面塗佈SiO2A method according to any one of the preceding claims, characterized in that the surface is coated with SiO 2 by burning monodecane (SiH 4 ). 如前述申請專利範圍中任一項之方法,其特徵在於,該等待噴鍍構件 之表面的平坦度為<10μm,較佳<1μm,尤佳<100nm。 A method according to any one of the preceding claims, characterized in that the waiting for spraying member The flatness of the surface is <10 μm, preferably <1 μm, and particularly preferably <100 nm. 如前述申請專利範圍中任一項之方法,其特徵在於,使得該等待連接之表面彼此精確配合。 A method according to any one of the preceding claims, characterized in that the surfaces of the waiting connection are precisely matched to one another. 如前述申請專利範圍中任一項之方法,其特徵在於,在接合完畢後或者在接合過程中施加壓力及/或溫度。 A method according to any one of the preceding claims, characterized in that the pressure and/or temperature is applied after the joining is completed or during the joining. 如前述申請專利範圍中任一項之方法,其特徵在於,該等施加之壓力介於大氣壓力與2000MPa之間。 A method according to any one of the preceding claims, wherein the applied pressure is between atmospheric pressure and 2000 MPa. 如前述申請專利範圍中任一項之方法,其特徵在於,在熱均壓機(HIP)中藉由氣壓(氬氣、氮氣、空氣)來施加壓力。 A method according to any one of the preceding claims, characterized in that the pressure is applied by means of air pressure (argon, nitrogen, air) in a hot press (HIP). 如前述申請專利範圍中任一項之方法,其特徵在於,實施該接合過程之溫度範圍介於室溫與低於該構件之熔化溫度/軟化溫度之間,其具有更低的熔化溫度/軟化溫度。 A method according to any one of the preceding claims, wherein the bonding process is carried out at a temperature ranging from room temperature to below the melting/softening temperature of the member, which has a lower melting temperature/softening temperature. 如前述申請專利範圍中任一項之方法,其特徵在於,為縮短處理時間,採用快速燒結工藝,如FAST法(場輔助燒結工藝)來進行該壓力與熱處理。 A method according to any one of the preceding claims, characterized in that, in order to shorten the processing time, the pressure and heat treatment are carried out by a rapid sintering process such as a FAST method (field assisted sintering process). 如前述申請專利範圍中任一項之方法,其特徵在於,在對該等構件進行噴鍍前,對該等待接合之表面進行清洗。 A method according to any one of the preceding claims, characterized in that the surface to be joined is cleaned before the components are sprayed. 如前述申請專利範圍中任一項之方法,其特徵在於,在對該等構件進行噴鍍前,透過電漿蝕刻,化學清洗,在空氣、真空氣氛或H2氣氛下進行調溫,或者透過離子束蝕刻來去除該等待接合之表面上的有害物質。 A method according to any one of the preceding claims, characterized in that before the spraying of the members, plasma etching, chemical cleaning, temperature adjustment in air, vacuum atmosphere or H 2 atmosphere, or through Ion beam etching removes harmful substances on the surface that is awaiting bonding. 如前述申請專利範圍中任一項之方法,其特徵在於,使得該等待噴鍍 之構件的熱膨脹係數(WAK)彼此匹配。 A method according to any one of the preceding claims, characterized in that the waiting for spraying The coefficients of thermal expansion (WAK) of the members match each other. 如前述申請專利範圍中任一項之方法,其特徵在於,該等待噴鍍之構件的熱膨脹係數(WAK)儘可能類似。 A method according to any one of the preceding claims, characterized in that the coefficient of thermal expansion (WAK) of the member to be sprayed is as similar as possible. 如前述申請專利範圍中任一項之方法,其特徵在於,該一構件由WAK較高之材料構成,以便在該另一構件中產生壓應力。 A method according to any one of the preceding claims, wherein the member is constructed of a material having a higher WAK to create a compressive stress in the other member. 一種如申請專利範圍第1至9項中任一項之複合構件或者依照該等方法請求項中任一項所製成之複合構件的應用,用作例如移動電子設備之顯示器的一部分。 An application of a composite member according to any one of claims 1 to 9 or a composite member made according to any of the method claims, as part of a display such as a mobile electronic device. 一種如申請專利範圍第1至9項中任一項之複合構件或者依照該等方法請求項中任一項所製成之複合構件的應用,用作爐子窗戶或壁爐窗戶。 A composite member according to any one of claims 1 to 9 or a composite member made according to any one of the method claims, for use as a furnace window or a fireplace window.
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