TW201640743A - Board to board connector - Google Patents

Abstract

The present invention provides a board-to-board connector enabling a low profile and a fine pitch, and having high connection intensity. The board-to-board connector (1) includes: a header (2) including multiple header contacts (4); and a socket (3) including multiple socket contacts (6). The header contacts (4) include a header side contact part (4b). The socket contacts (6) include an oval socket side contact part (6b). The header side contact part (4b) with a planar shape is press-fitted into the oval socket side contact part (6b), and then is matched by a matching part (4d) in order to obtain strong connection intensity. The header (2) and the socket (3) are able to be attached or detached by being rotated around an edge (7b) of a socket body (7) and a support (5d) of a header body (5).

Description

Substrate connector

The present invention relates to a substrate connection connecting circuit boards to each other.

In the prior art, as a substrate connector for electrically connecting printed circuit boards and the like to each other, a bus core having a plurality of female contact members and a pin header having a plurality of pin contact members respectively connected to the respective rows of female contact members The substrate connector is widely known (for example, refer to Patent Document 1).

In the board connector of Patent Document 1, the pin contact member has a plurality of columnar insertion portions that protrude toward the female side. Further, the female contact member includes first to third spring piece portions that respectively contact the insertion portion in a direction orthogonal to the protruding direction of the insertion portion. Further, the pin header and the pinch are connected by inserting the insertion portions of the respective row of pin contacts into the first to third leaf portions of the respective row of female contacts.

When the insertion portion is inserted between the first to third spring piece portions, the first and second spring piece portions are in contact with the insertion portion to be flexed, and the third spring piece portion is inserted into the portion Pushed so as to be in firm contact with the insertion portion. With this strong contact, a good electrical connection between the female contact and the pin contact can be obtained.

According to this, the first to third spring piece portions are bent in a direction orthogonal to the protruding direction of the insertion portion of the pin contact member, and are in contact with the insertion portion from the direction. Therefore, the protruding direction of the insertion portion, that is, the size of the substrate connector is reduced in the direction in which the female and the pin are connected, as compared with the case where the spring pieces are flexed in the protruding direction of the insertion portion. Low backing of the substrate connector.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-27713.

However, with the recent high performance and densification of mobile devices and the like, a higher degree of low profile and a narrow pitch of contacts are required. In this case, the substrate connector of Patent Document 1 has a structure in which the spring piece portion of the female contact member is in contact with the insertion portion of the pin contact member in a direction orthogonal to the direction in which the pin contact member is bent, so that the orthogonal portion is orthogonal. The increase in size in the direction is disadvantageous for achieving narrow pitch.

Further, in the substrate connector of Patent Document 1, when the insertion portion of the pin contact member is inserted between the leaf portions, the first and second leaf portions are in contact with the insertion portion to be deflected, thereby causing the third spring The piece is pushed by the pin contact piece, so the structure is complicated. For this reason, according to the substrate connector of Patent Document 1, it is difficult To achieve further low-profile and narrow pitch.

Moreover, if the narrow pitch is simply formed, the width of each contact is also narrowed, and the rigidity of each contact is lowered, so that the connection strength is lowered.

In view of the above problems of the prior art, it is an object of the present invention to provide a substrate connector which can more easily achieve further low profile and narrow pitch. Still another object of the present invention is to provide a substrate connector capable of maintaining a high connection strength even when a narrow pitch is performed. Further, it is an object of the present invention to provide a contact for an electronic device including a substrate connector which can achieve narrow pitching more easily.

The substrate connector of the present invention includes a pin header mounted on the circuit board and a busbar mounted on the other circuit board, and the pin header and the busbar are opposed to each other in a predetermined posture, and are electrically connected by being pressed in the connection direction. The pin header includes an insulating pin header body and a plurality of conductive pin headers fixed to the pin header body and connected to the busbar side, wherein the busbar has an insulating mother body and a fixed body a plurality of conductive female contact members connected to the main body of the main body and connected to the pin contact member, wherein the pin contact member has a pin side contact that protrudes toward the mother side and is in contact with the female contact member And a pin header side substrate connecting portion that protrudes from the pin header body and is connected to the circuit board, and the row bus bar contact member has a female side contact portion that contacts the pin side contact portion and protrudes from the busbar body And a mother-side substrate connecting portion connected to the other circuit substrate, the mother row The side contact portion has a through hole, and the pin contact side contact portion is inserted into the through hole, and the pin contact side contact portion is in contact with and connected to the through hole by elasticity.

In the present invention, the female contact member has a through hole at the female-side contact portion, and the pin-side contact portion of the pin contact member is connected by the through-hole elastic contact. Therefore, the female contact member does not require a structure such as a spring piece in Patent Document 1, so that the width of the female contact member can be narrowed.

Further, in the present invention, the female-side contact portion is formed in a plate shape in which the axial direction of the female contact member is longer than the width direction, and may be curved toward the needle-discharging side in a side view.

In this way, the female-side contact portion is bent toward the needle-discharging side, and when the needle and the female are connected, the needle-side contact portion first comes into contact with the curved portion of the female-side contact portion. When the bent portion is pressed toward the pin side contact portion, the unexposed portion of the pin contact portion in the axial direction view in the axial direction view expands in a circular arc shape in the width direction. Therefore, since the female-side contact portion of the shape is more likely to expand in the width direction than the flat member, the pin and the female can be smoothly connected.

Further, in the present invention, the female-side contact portion is formed in a plate shape in which the axial direction of the female contact member is longer than the width direction, and may be bent in a V-shape from the center of the through hole in the axial direction view or U-shaped.

According to this configuration, when the pin side contact portion is inserted into the through hole, the portion where the female side contact portion is bent toward the pin side is first abutted against the pin side contact portion, and if it is further pressed toward the pin side contact portion, The center of the row-side contact portion in the axial direction view expands in a circular arc shape in the width direction from the female contact member. Therefore, since the female-side contact portion of the shape is more likely to expand in the width direction than the flat member, the pin and the female can be smoothly connected.

Further, in the present invention, the female-side contact portion is formed in a plate shape in which the axial direction of the female contact member is longer than the width direction, and may be curved in the width direction of the female contact member in plan view. According to this configuration, the length of the through hole can be lengthened as compared with the shape in which the contact portion on the female side is not bent. According to this, the connection strength between the female-side contact portion and the pin-side contact portion can be weakened, so that the connection strength between the female contact member and the pin contact member can be adjusted to an appropriate connection strength.

Further, in the invention, the through hole is a long hole having a long length in the axial direction of the female contact member, and the pin side contact portion has an inner peripheral surface of the through hole or a contact portion of the female side The engaging portion of the back surface may be engaged with the end portion of the through hole in the axial direction.

According to this configuration, since the through hole is a long hole, the axial end portion of the through hole is higher in rigidity than the portion around the other through hole. Therefore, by engaging the engaging portion of the pin side contact portion with the end portion of the through hole in the axial direction, the bonding strength between the pin contact member and the female contact member can be improved.

Further, in the above configuration, preferably, the card contact member is provided in parallel in the longitudinal direction of the pin header body, and the card is disposed in two rows in the width direction of the pin header body. The joint portion is disposed symmetrically with respect to the center of the width direction of the aforementioned pin body.

According to this configuration, the engaging portions of the pin-side contact portions are in a state of being collectively directed outward or collectively toward the inside. When the engaging portions are collectively directed outward, if the pin is pressed toward the female leader, the two rows of the female-side contact portions are collectively pushed outward. When the engaging portions are directed toward the inner side, if the pin is pressed toward the female main body, the two rows of the female side contact portions are collectively pressed toward the inner side. In other words, since the engaging portions of the two rows of pins are combined and function as one set of engaging portions, the bonding strength between the pin contact and the female contact can be improved.

Further, in the invention, the through hole is a long hole having a long length in the axial direction of the female contact member, and the pin side contact portion is formed thicker than a width of the through hole, when the pin header is When the side contact portion is inserted into the through hole, the pin contact side contact portion may be in contact with both inner circumferential surfaces of the through hole in the width direction. According to this configuration, since the pin-side contact portion is pressed into the through-hole of the female-side contact portion, the bonding strength between the two can be further improved.

Further, in the present invention, when the through hole is an elongated hole having a long length in the axial direction of the female contact member, the pin side contact portion is bent in the width direction in plan view, and when inserted into the through hole , the aforementioned pin side contact portion It is also possible to make contact with the inner peripheral surfaces of the through holes in the width direction. According to this configuration, since the pin-side contact portion and the inner peripheral surface of the long hole are in contact at a plurality of positions, the reliability of the connection is improved, and the connection strength between the female contact member and the pin contact member can be improved.

Further, in the present invention, the female-side contact portion may be formed in a plate shape in which the axial direction of the female contact member is longer than the width direction, and is bent in the width direction of the female contact member in plan view. The pin-side contact portion is bent in the same direction as the female-side contact portion in a plan view, and when inserted into the through-hole, the pin-side contact portion and the inner peripheral surface of the through-hole in the width direction are contact. According to this configuration, it is also possible to make the contact point of the two points be 3 points or contact them at 4 or more points in accordance with the curvature of the contact portion on the pin side and the curvature of the through hole.

Further, in the invention, it is preferable that the pin side contact portion is inclined with respect to the axis of the pin contact member in a plan view, and the through hole has a length in the axial direction of the row bus bar contact member from the pin side The contact minister has a width narrower than the inclined width of the aforementioned pin side contact portion in the plan view.

Here, the inclined width of the pin side contact portion means the length in the width direction of the most protruding portion in the width direction of the pin contact side contact portion which is inclined in plan view. According to this configuration, when the pin-side contact portion is inserted into the through-hole of the female-side contact portion, first, the portion which is most protruded in the width direction of the pin-side contact portion comes into contact with the surface of the female-side contact portion. In this state, if Further, when the pin side contact portion is pushed in, the pin side contact portion is reduced in inclination by elastic deformation, and the pin side contact portion is inserted into the through hole.

In this state, the force at which the pin side contact portion is to be restored by the elasticity is generated, so that the inner peripheral surface of the through hole is always pressed. Therefore, the bonding strength of the pin contact and the female contact can be improved.

Preferably, in the above configuration, the engagement portion having the pin-side contact portion and the inner circumferential surface of the through hole or the rear surface of the female-side contact portion is engaged, and the engagement portion and the through hole are The inner circumferential surface in the width direction or the back surface of the female-side contact portion is engaged.

According to this configuration, in the state in which the pin-side contact portion is inserted into the through hole, the engagement force with the engaging portion is generated in addition to the elastic force, so that the bonding strength between the pin contact member and the female contact member can be further improved.

Preferably, in the above configuration, when the plurality of pin contact members are provided in parallel in the longitudinal direction of the pin header body, the inclination of the pin contact side contact portions of the adjacent pin contact members is configured to be inclined in contrast.

According to this configuration, when the inclined pin-side contact portion is inserted into the through hole, a bending moment is generated at the female-side contact portion and the pin-side contact portion. However, if the inclinations of the needle-side contact portions of the adjacent pin contact members are opposite to each other, the bending moment of the adjacent pin-side contact portion and the female-side contact portion is offset. Therefore, the bending moment generated by the pin and the mother as a whole is very small.

Further, in the present invention, preferably, when the female contact members are provided in parallel in the longitudinal direction of the main body, a plurality of the female contact members are disposed between the adjacent female contact members There are grooves or through grooves.

According to this configuration, when the pin-side contact portion is inserted into the through-hole of the female-side contact portion, the contact is made, but at this time, the female-side contact portion is deformed to expand in the width direction. However, since the grooves or the through grooves are provided between the adjacent female contact members, the deformation of the female side contact portions is absorbed by the grooves or the through grooves. For this reason, it is possible to suppress deformation of the entire body of the main body.

Further, in the present invention, preferably, the main body and the pin body are integrally formed in a rectangular parallelepiped shape, and one of the main body or the main body of the pin body is provided with another body to be rotated. Further, the pin header and the receiving portion of the busbar can be attached and detached.

In the previous substrate connector, when the pin and the mother are connected and both are removed, the pin and the mother must be moved in parallel. This is because the connector can be damaged if it is connected or removed with respect to one other. However, it is actually difficult to move the two in parallel, more or less connected to one another for another rotation, and sometimes the connector is damaged.

In the present invention, a receiving portion capable of rotating the other body is provided on one of the main body of the main body or the body of the pin header, and the other can be connected to the other by rotating the other. According to this configuration, when the main body and the pin are connected and removed, the load on the receiving portion is applied to the circuit board side by applying a load of the other body, so that the force applied to the pin body and the main body can be reduced. . For this reason, the possibility of damage to the pin body and the main body can be reduced as compared with the prior connector.

Preferably, in the above configuration, on one of the main body of the main body or the main body of the pin header body, two end engaging portions that protrude toward the other main body and engage with the other main body are provided on both sides in the longitudinal direction. The two-end engagement portion has a chamfered shape that does not interfere with the other body when the pin or the socket is rotated and detached.

According to the both end engagement portions, the both ends of the pin body and the main body in the longitudinal direction are engaged by the both end engagement portions, so that the connection strength of the entire connector can be further improved. Further, since the both end engagement portions have a chamfered shape that does not interfere with the other body when the pin or the female pin is rotated and detached, the pinning and the ejector can be smoothly attached and detached.

Moreover, it is preferable that the contact portion for an electronic device having the board connecting portion has an uneven shape formed on a surface of the board connecting portion facing the circuit board. Preferably, as the uneven shape, the surface of the substrate connecting portion facing the circuit board is formed on the axis side. In the view, it is a V-shape or a ladder shape having a narrower side on the circuit board side. Here, the electronic device includes a substrate connector, and the contact for the electronic device includes the pin contact and the female contact of the above invention. Moreover, the board connecting portion of the present invention conceptually includes the pin side board connecting portion and the mother side board connecting portion of the above invention.

According to this configuration, when the substrate connecting portion is soldered to the pattern of the circuit board, the solder paste is absorbed by the uneven shape to reduce the amount of extrusion in the width direction. Further, in this state, even if the solder paste is melted, it is difficult for the molten solder to spread in the width direction, so that it is difficult to generate a bridge between the adjacent contacts. Therefore, it is particularly effective for a contact of a narrow pitch connector, and can be widely used as a contact for a plurality of electronic devices soldered to a circuit board.

Moreover, it is preferable that a contact for an electronic device having a board connecting portion has a single or a plurality of concavo-convex shapes formed on a surface of the board connecting portion facing the circuit board in the axial direction. In this way, not only a trapezoidal shape having a V-shape in the axial direction view but also a narrower side of the circuit board side is formed, and by forming a single or a plurality of irregularities in the axial direction, the amount of extrusion of the solder paste can be further reduced.

Further, in the contact for an electronic device of the present invention, it is preferable that the substrate connecting portion has a plate shape and a communication hole communicating the surface and the back surface is formed. Further, in the contact for an electronic device of the present invention, the substrate connecting portion is plate-shaped and formed to be inverted in the axial direction view. Glyph or inverted V shape.

In the case of the substrate connecting portion having the communication hole, when the substrate connecting portion is placed on the solder paste applied to the circuit board, the solder paste is extruded through the communication hole toward the surface side of the substrate connecting portion. Further, in the case where the substrate connecting portion is formed in an inverted U shape or an inverted V shape in the axial direction view, if the substrate connecting portion is placed on the solder paste applied to the pattern of the circuit substrate, the solder paste is Squeeze into the interior of the shape of the substrate connection. According to these configurations, the amount of extrusion of the solder paste in the width direction of the substrate connecting portion can be reduced.

As shown in Fig. 1, a substrate connector 1 according to a first embodiment of the present invention is a substrate connector for connecting circuit boards S1 and S2. The substrate connector 1 is composed of a header 2 and a bank 3. The pin header 2 is provided with a pin header 4 made of metal and a pin body 5 made of an insulating synthetic resin.

The row mother 3 also has a metal mother-contact member 6 and a mother body 7 made of an insulating synthetic resin. In the state shown in Fig. 1, the pin contact 4 is in contact with the female contact 6, and the circuit substrates S1, S2 are electrically connected to each other.

Figure 2A is a plan view of the pin header 2. The pin contact members 4 are arranged in parallel in the longitudinal direction of the pin header body 5. Further, the plurality of pin contact members 4 are arranged in the width direction of the pin header body 5 (upward and downward directions in FIG. 2A). 2 lines.

As shown in Fig. 2E, the pin contact member 4 has a pin side body 4a that is fitted into and fixed to the pin body 5, and a pin side contact portion 4b that protrudes from the pin side body 4a toward the mother 3 side, and a row. The needle side body 4a protrudes toward the side surface of the pin header body 5 in the pin side substrate connecting portion 4c.

As shown in Fig. 2D, the pin side contact portion 4b is formed in a flat elliptical shape in plan view. Moreover, as shown in FIG. 2E, the engaging portion 4d is provided on the side of the pin side substrate connecting portion 4c in the longitudinal direction of the pin contact 4.

As shown in FIGS. 1 and 2E, the pin side body 4a is bent to have a substantially crank shape in a side view. The pin side body 4a is integrally formed with the pin body 5 by insert molding, and is mostly embedded in the pin body 5. As shown in FIG. 3B, the pin side substrate connecting portion 4c is chamfered 4e on the surface welded to the circuit board S1, and has a trapezoidal shape on the surface facing the circuit board S1.

As shown in Fig. 2D, the two rows of pin contact members 4 are symmetrically arranged in the width direction of the pin header body 5 (up and down direction in Fig. 2D). In the first embodiment, the engaging portions 4d of the two rows of the needle contact members 4 are disposed in directions opposite to each other in the width direction of the pin header body 5 and opposite to each other. Further, the pin side substrate connecting portion 4c protrudes outward from both sides of the pin body 5.

The pin body 5 is formed of a synthetic resin formed into a substantially rectangular shape. also, In the pin header body 5, a recessed portion 5a into which the main body body 7 is inserted is formed, and peripheral walls 5b and 5c that abut against the outer peripheral surface of the main body main body 7 are formed around the recessed portion 5a.

The end portions 5c on both sides of the peripheral wall in the longitudinal direction of the pin body 5 have substantially the same height as the thickness of the main body 7 (see Fig. 4d) of the main body 3. The portion 5b between the both end portions in the longitudinal direction of the peripheral wall 5b has a lowered height. When the connection and removal of the mother 3 and the pin 2 are performed, the boundary portion between the peripheral wall 5b and the recessed portion 5a is formed as a receiving portion 5d that abuts against the side edge 7b of the rear row main body 7.

Further, on both sides in the longitudinal direction of the pin header body 5, the claws 5e which are the both-end engagement portions of the present invention are formed. When the pin 2 is attached to the center 3, the claw 5e is engaged with the locking hole 7a provided in the main body 7, and the two are firmly coupled. As shown in Fig. 2E, the corner portion of the claw 5e in the width direction is formed into an arcuate chamfer 5f.

4A is a plan view of the mother row 3. The female contact members 6 are arranged in parallel in the longitudinal direction of the main body 7. The plurality of rows of female contacts 6 are arranged in two rows in the width direction of the main body 7.

4C is a cross-sectional view taken along line C-C of FIG. 4B. As shown in FIG. 4C, the female contact member 6 has a female-side body 6a embedded and fixed to the main body 7 and a female-side contact extending from the female-side body 6a along the width direction of the female body 7. 6b and a female parent protruding from the female-side body 6a toward the side of the female body 7 Side substrate connecting portion 6c.

As shown in FIG. 4B and FIG. 5A, the female-side contact portion 6b is formed in a plan view in a long annular shape in which a through hole, that is, a long hole 6d is provided in a central portion. Further, as shown in FIG. 4C and the like, the long hole 6d of the female-side contact portion 6b is chamfered 6e toward the pin contact 4 side in a cross-sectional view.

As shown in Fig. 1, the length of the long hole 6d is formed longer than the length of the pin side contact portion 4b of the pin contact member 4. On the other hand, the width of the long hole 6d is formed to be slightly narrower than the width of the pin side contact portion 4b. In the first embodiment, the difference in width between the two is about 0.03 mm.

As shown in FIG. 5C, the mother-side substrate connecting portion 6c is the same as the pin-out side substrate connecting portion 4c, and is chamfered 6f on the surface to be soldered to the circuit board S2, and has a trapezoidal shape on the surface facing the circuit board S2.

The main body 7 is formed of a synthetic resin formed into a substantially rectangular shape. Further, the main body 7 is formed with a locking hole 7a that is engaged with the claw 5e of the pin body 5. The width of the main body 7 is formed to be substantially the same width as the width of the concave portion 5a of the pin body 5. Further, as shown in Fig. 4C, the side edge 7b of the main body body 7 is chamfered in an arc shape.

As shown in Fig. 4D, a groove 7c having a V-shape in a cross-sectional view is formed on the front and back surfaces of the main body 7 between the plurality of rows of the female contacts 6. As shown in Figure 4B It is to be noted that the V-shaped groove 7c is formed to have substantially the same length as the length of the long hole 6d of the female contact member 6 in the axial direction.

Next, the attachment and detachment of the substrate connector 1 of the first embodiment will be described with reference to FIGS. 6A and 6B.

First, the pin header 2 and the bank pin 3 are opposed to each other, and the pin header 2 is moved toward the bank 3 side. At this time, as shown in FIG. 6A, the receiving portion 5d of the pin header main body 5 is moved toward the side edge 7b of the main body main body 7, and is brought into contact with the side edge 7b of the main body main body 7. In this state, when the pin 2 is rotated by the receiving portion 5d as a fulcrum and is brought closer to the bank 3, first, the pin contact 4 on the left side of FIG. 6A abuts against the bank contact 6.

At this time, the front end of the engaging portion 4d of the pin-side contact portion 4b abuts against the axial end portion 6g of the long hole 6d of the female-side contact portion 6b, but the front end is mainly elastic by the pin-side contact portion 4b. The axial end portion 6g of the long hole 6d is passed over, and is engaged with the pin side contact portion 4b.

As shown in FIG. 6B, when the pin 2 is rotated from the receiving portion 5d as a fulcrum and further moved closer to the bank 3, the pin contact 4 on the right side of the figure abuts against the bus bar contact 6. Then, the front end of the engaging portion 4d of the pin side contact portion 4b is engaged with the pin side contact portion 4b by elastically passing over the axial end portion 6g of the long hole 6d.

When the pin 2 is further pressed to the side of the mother 3 from this state, the pin side contacts The portion 4b is inserted into the long hole 6d of the female parent side contact portion 6b. At this time, since the distal end portion is formed in a shape in which the distal end is narrowed, the width of the needle-side contact portion 4b is narrower than the width of the long hole 6d, but at the position in FIG. 6B, the needle-side contact portion 4b is The width is wider than the long hole 6d.

For this reason, in the state of FIG. 6B, the female-side contact portion 6b is pushed in the width direction (the horizontal direction in FIG. 4B) by the needle-side contact portion 4b inserted into the long hole 6d. Thus, when the female-side contact portion 6b is pushed in the width direction, the female body 7 that is sandwiched between the pair of female contact members 6 is compressed.

However, since the V-shaped groove 7c is formed in the main body 7 between the female contact members 6, the deformation of the main body 7 which is compressed by the female contact member 6 is deformed by the V-shaped groove 7c. absorb. For this reason, no major deformation occurs in the entire body of the main body 7.

Since the substrate connector 1 according to the first embodiment of the present invention has the above configuration, when the pin 2 and the bank 3 are connected, the pin side contact is pressed into the long hole 6d of each row of the contact members 6. In the state of the portion 4b, the two are firmly connected.

As described above, in the first embodiment, the receiving portion 5d of the pin header main body 5 and the side edge 7b of the main body main body 7 are used as fulcrums, and the pin header 2 can be screwed and connected to the main body 3. Accordingly, among the two rows of the pin contact members 4 and the female contact members 6, the first row is connected, and then the other row is connected.

For this reason, the load applied to the pin body 5 and the main body 7 is reduced to 1/2 as compared with the case where the two rows of contacts are connected at a time, and the load applied to each body is reduced. Therefore, in the board connector 1 of the first embodiment, the connection strength between the respective pin contact members 4 and the bus bar contact members 6 is high, but the connection between the pin header 2 and the bank pins 3 can be smoothly performed.

Further, since the corner portion of the claw 5e in the width direction is formed as an arc-shaped chamfer 5f, even if the pin 2 or the ballast 3 is screwed and connected as described above, the claw 5e does not Since the locking hole 7a is interfered, the pin 2 and the bank 3 can be smoothly connected.

In the first embodiment, the engaging portions 4d of the two rows of the needle contact members 4 are disposed in opposite directions to each other in the width direction of the pin header body 5 in a state in which the pin header 2 and the bank pins 3 are attached. on. Therefore, the two rows of the engaging portions 4d are formed in a shape that is engaged with the axial end portions 6g of the long holes 6d of the set of the female-side contact portions 6b, and the connection strength is increased.

Next, an operation when the pin 2 is removed from the center 3 will be described. In the board connector 1 according to the first embodiment of the present invention, when the header 2 is removed from the carrier 3, the one side edge 7b of the main body 7 is also detached as a fulcrum, so that the mother 3 or the row is discharged. Needle 2 is rotated.

As shown in FIG. 6B, in the substrate connector 1 of the first embodiment, the one side edge 7b of the main body body 7 is used as a fulcrum, and the pin header 2 can be rotated to make the row The right side portion of the needle body 5 in Fig. 6B is moved upward. Accordingly, in FIG. 6B, the left mother body 7 is pressed toward the substrate S2 side by the pin body 5, and the pin body 5 is also pressed toward the substrate S1 side by its reaction force. According to this, it is possible to prevent the female contact member 6 and the pin contact member 4 from falling off from the respective substrates.

Further, when the pin 2 is rotated and detached, since the pin contact 4 and the ejector contact 6 are detached from one of the two rows, it can be used as compared with when the two rows are unloaded at one time. The smaller force is used to complete the removal, reducing the influence on the mother 3 and the pin 2. Therefore, in the substrate connector 1 of the first embodiment, damage to the mother 3 and the header 2 can be prevented.

Further, in the first embodiment, the engaging portion 4d of the pin-side contact portion 4b is engaged with the axial end portion 6g of the long hole 6d of the female-side contact portion 6b. The axial end portion 6g is closer to the row mother substrate connecting portion 6c. Since the mother-side substrate connection portion 6c is soldered to the circuit board S2, it is firmly fixed to the circuit board S2. Therefore, when the engaging portion 4d of the pin-side contact portion 4b is pulled out from the axial end portion 6g of the female-side contact portion 6b, the load applied to the main body 7 can be reduced.

Further, in the first embodiment, the surface on which the pin side substrate connecting portion 4c and the mother side substrate connecting portion 6c are welded to the circuit board is formed in a trapezoidal shape. The pin 2 and the bank 3 are soldered on the circuit boards S1 and S2 by solder paste.

In the case where the mother cell 3 of the first embodiment is mounted on the circuit board S2, first, the solder paste C is applied onto the circuit pattern Pa of the circuit board S2. Solder paste C is uniformly applied to the surface of the circuit pattern Pa. In this state, when the mother 3 is placed at a predetermined position on the circuit board S2, as shown in FIG. 7A, the mother-side board connecting portion 6c of the female contact member 6 has the shape of the extruded solder paste C.

In the mother cell 3 of the first embodiment, the surface of the mother-side substrate connecting portion 6c on the side of the circuit board S2 is formed into a trapezoidal shape by chamfering 6f. According to this, as shown in FIG. 7A, the amount of the solder paste C extruded by the mother-side substrate connecting portion 6c is reduced by only the amount of the chamfer 6f portion. In this state, when the circuit board S2 and the bank 3 are heated in a reflow furnace (not shown), as shown in FIG. 7B, the solder paste C is melted to C', and the mother-side board connecting portion 6c and the circuit are formed. The type Pa is connected.

On the other hand, as shown in FIG. 7C, in the connector 103 of the prior art, since the end faces of the mother-side substrate connecting portion 106 are rectangular, the amount of the solder paste C extruded by the mother-side substrate connecting portion 106 is increased. . For this reason, as shown in Fig. 7D, if the circuit board S2 and the connector 103 are heated in the reflow furnace, there is a concern that the adjacent solder pastes C' are bridged with each other.

In the first embodiment, since the amount of extrusion of the solder paste C on the circuit board S2 in the width direction is small, it is possible to prevent solder paste from the adjacent female contact member 6 when heated in the reflow furnace. C' bridge. This point is also the same in the pin header side substrate connecting portion 4c.

Further, as shown in Fig. 3C, in the first embodiment, the shape of the pin-side contact portion 4b of the pin contact member 4 is formed into a flat elliptical shape in plan view, but is not limited thereto, as shown in Fig. 3D. It is also possible to use the pin contact 4' having the pin side contact portion 4b' which is oblong in plan view. Further, in the second embodiment described below, the pin side contact portion 4b may be processed to be inclined in a plan view with respect to the axial direction of the pin contact member 4.

Further, in the first embodiment, the groove 7c provided in the main body main body 7 is formed in a V shape in a cross-sectional view. However, the present invention is not limited thereto, and may be a U-shaped or rectangular groove. Further, it may be a through groove that penetrates the main body of the main body 7. Further, as shown in FIG. 2D, in the first embodiment, the engaging portions 4d of the pair of pin side contact portions 4b are disposed to face outward in the width direction of the pin body 5, but the present invention is not limited thereto. It can be configured to face inward and can also be configured to face in the same direction.

Next, a modification of the first embodiment will be described with reference to Figs. 8 and 9 . In the first modification, the shape of the female-side contact portion 6b and the shapes of the both ends of the pin body 5 and the main body 7 in the longitudinal direction are different from those of the first embodiment described above.

As shown in Fig. 8B, the female-side contact portion 6b' of the female contact member 6' of the first modification is bent into a mountain shape in a side view. In the first modification, the female-side contact portion 6b' is flexed linearly to the left and right with the apex as the isosceles triangle in the side view.

By such buckling, the inner peripheral surface of a portion of the long hole 6d' provided in the female-side contact portion 6b' protrudes inward by deformation of the substance due to buckling. For this reason, when the pin side contact portion 4b is inserted into the long hole 6d', since the pin side contact portion 4b is held by the portion which is deformed and protruded, the connection strength between the pin 2 and the bank 3 is improved.

Further, as shown in Fig. 8C, the end portion of the pin header body 5 of the first modification is provided with a claw 5e that is locked to the locking groove 7a' provided at the end portion of the main body body 7 on the left and right peripheral walls 5c. '. On the claw 5e', a chamfered portion 5f' which is easily inserted into the end portion of the main body 7 when connected to the main body 7 is formed.

Next, the action of the pin 2 and the bank 3 in the first modification will be described with reference to Figs. 9A and 9B. 9A and 9B, only the pin contact 4 and the bus bar contact 6' are illustrated, and the description of the other pin body 5, the main body 7 and the like are omitted.

As shown in Fig. 9A, when the pin contact 4 and the female contact 6' are close to each other, the end portion of the pin side contact portion 4b is inserted into the long hole 6d' of the female side contact portion 6b'. In this state, only the front end portion of the pin side contact portion 4b is close to the top portion 6h of the female side contact portion 6b'.

From this state, if the pin contact 4 and the female contact 6' are further approached, the top of the pin side contact portion 4b and the length of the bus bar side contact portion 6b' are provided. The chamfered portion 6e of the hole 6d' abuts, and the pin-side contact portion 4b is inserted into the inside of the female-side contact portion 6b' while being pushed.

At this time, as shown in Fig. 9B, the female-side contact portion 6b' is in a state in which the top portion 6h is pushed to the left and right. In this state, the deformation of the main body 7 due to the deformation of the female-side contact portion 6b' is absorbed by the V-shaped groove 7c provided in the main body 7.

As described above, in the first female embodiment, the female contact portion 6' is bent toward the pin 2 side. For this reason, when viewed from the axial direction of the female contact member 6', when the pin-side contact portion 4b is inserted into the long hole 6d' of the female-side contact portion 6b', the top 6h of the female-side contact portion 6b' is rounded. The arc expands. As a result, the amount of deformation is increased as compared with the flat-shaped mother-side contact portion 6b, and the insertion of the pin-side contact portion 4b is facilitated.

In the above-described first modification, the female-side contact portion 6b' has a shape that is bent linearly to the left and right as a center in the side view as an isosceles triangle, but if it is bent toward the pin 2 side, It can also be flexed into an arc shape.

Next, a second modification of the first embodiment will be described with reference to Figs. 10A to 10C. In the substrate connector of the second modification, the shape of the female-side contact portion 6b" of the female contact member 6" is different from that of the first embodiment. Specifically, as shown in FIG. 10C, the female-side contact portion 6b" is bent into a flat V-shape when viewed from the axial direction by press working.

In the second modification, the female-side contact portion 6b" is processed into the above-described shape, and the width of the long hole 6d" is narrower than the state of the flat plate. The other portions are the same as those of the female contact member 6 of the first embodiment described above.

Here, under the influence of the narrow pitch of each contact member, the width of the punch (not shown) for processing the long hole becomes very narrow, and it is sometimes difficult to secure the strength of the punch. However, in the second modification, the long hole is previously processed by using a punch having a wide width, and is machined into a V shape to form a long hole 6d" having a desired width.

In the second modification, the flat-shaped female-side contact portion is formed into the above-described shape. However, by further processing into a mountain shape in a side view, the female-side contact portion 6b' of the first modification can be formed. shape.

Next, a substrate connector 11 according to a second embodiment of the present invention will be described with reference to Figs. 11 to 22 .

Fig. 11 shows a state in which a circuit board is connected by a substrate connector according to a second embodiment of the present invention. As shown in FIG. 11, the board connector 11 is provided with the pin 12 attached to the circuit board S1, and the pin 13 attached to the other circuit board S2. The two-circuit substrate S1 and S2 are electrically connected by the connection of the pin header 12 and the busbar 13.

Fig. 12A is a plan view of the pin header 12, and Fig. 12B is a side view of the pin header 12. As shown in FIG. 12A and FIG. 12B, the pin header 12 has a vertical direction in the longitudinal direction. The first type of pin contact 14A and the second type of pin contact 14B of the plurality of aligned conductivity and the insulative pin body 15 supporting the pin contacts 14A and 14B.

Here, the arrangement of the pin contact members 14A and 14B is constituted by two rows extending in the longitudinal direction of the pin header 12. Each row is configured by alternately arranging the pin contact members 14A and 14B at a predetermined distance P. The pitch P is, for example, equivalent to 0.35 mm. Further, with respect to one row of the pin contact members 14A and 14B, the other row of the pin contact members 14A and 14B are opposed to each other. Each of the pin contact members 14A and 14B is covered with an insulating resin constituting the pin header body 15 except for a predetermined portion.

The pin header body 15 has a substantially plate shape having a predetermined length, width, and thickness (height). The longitudinal direction and the width direction of the pin header body 15 coincide with the longitudinal direction of each row of the pin contact members 14A and 14B and the direction of the interval between the rows. Each of the row of needle contacts 14A and 14B is disposed along the width direction of the header body 15.

One side opposite to the female 13 of the pin header body 15, that is, the female side, when the pin 12 and the female 13 are connected, the concave portion 15a opposed to the female 13 and the peripheral wall 15b surrounding the concave portion 15a, 15c constitutes. When the header 12 and the female 13 are connected, the female 13 is fitted to the concave portion 15a formed by the peripheral walls 15b and 15c.

The peripheral wall 15c on both sides in the longitudinal direction of the pin body 15 has a row 13 The height of the mother body body 17 (refer to FIG. 15B) is the same. The middle portion of the peripheral wall 15b has a low height, and it is convenient to remove the female 13 which is fitted to the concave portion.

At both end portions in the longitudinal direction of the concave portion 15a, a pin side engaging portion 15d for fixing the female pin 13 to the pin 12 when the pin 12 and the female 13 are connected is provided. The pin side engaging portion 15d has a cross section perpendicular to the width direction of the pin body 15 and has a shape protruding from the concave portion 15a of the pin body 15 in an L shape, and has a female side engaging portion 17d (hereinafter referred to as a rear side). Referring to Fig. 15), the function of fixing the female pin 13 to the pin header 12 is engaged.

Figure 12C is a cross-sectional view taken along line C-C of Figure 12A. As shown in Fig. 12C, the pin contact members 14A and 14B each include a pin side substrate connecting portion 14c that is connected to the circuit pattern of the circuit board S1 (see Fig. 11), and a pin side contact portion 14b that protrudes toward the mother side. . The pin contact members 14A and 14B are covered by the resin of the pin body 15 except for the pin side substrate connecting portion 14c and the portion adjacent thereto and the main end portion of the pin side contact portion 14b.

The pin header body 15 is formed by insert molding with the pin contact members 14A and 14B as insert materials. The pin side contact portion 14b and the pin side substrate connecting portion 14c are covered by plating performed after the pin body 15 is formed. The pin-side substrate connecting portion 14c is configured such that the surface on the circuit board S1 side can be connected to the circuit pattern of the circuit board S1, and protrudes slightly toward the circuit board S1 side from the surface on the circuit board S1 side of the pin header body 15.

Fig. 13A is a plan view of the pin contact member 14A, Fig. 13B is a side view thereof, and Fig. 13C is a front view as seen from the side of the pin side substrate connecting portion 14c. As shown in Fig. 13A, the pin side contact portion 14b has a substantially rectangular cross section, and on the front end side, both side faces of the long side of the rectangle are surfaces in contact with the female contact. The front end side of the pin side contact portion 14b is formed with a chamfered portion 14f that is inserted into the inner side contact portion 16b (see FIG. 16A), which will be described later, and is inclined with respect to the insertion direction, so that the auxiliary pin side contact portion 14b is inserted.

The needle-side contact portion 14b has a distal end portion 14g (see FIG. 17C) that protrudes from the female-side contact portion 16b when inserted into the corresponding female-side contact portion 16b. The pin side contact portion 14b is formed as a portion exposed from the pin body 15 in the pin contact member 14 when the pin body 15 is formed by the above-described insert molding.

The pin side contact portion 14b has a neck portion 14h which is adjacent to the base end side of the portion corresponding to the front end portion 14g and which is a narrow portion which is narrowed in width. When the distal end portion 14g protrudes from the female-side contact portion 16b, the neck portion 14h causes the elastically deformed portion of the pin-side contact portion 14b to be described later to disappear.

Further, the pin side contact portion 14b is along the pin body 15 in the direction from the pin side substrate connecting portion 14c toward the tip end side of the pin contact 14A in the width direction of the pin body 15. The axis in the thickness direction is centered, and only a predetermined acute angle θ is inclined in the counterclockwise direction. Determine the value of the acute angle θ or before The inclination of the chamfered portion 14f is appropriately inserted into the inner side of the female-side contact portion 16b while the pin-side contact portion 14b is appropriately elastically deformed.

Fig. 14A is a plan view of the pin contact member 14B, Fig. 14B is a side view thereof, and Fig. 14C is a front view as seen from the side of the pin side substrate connecting portion 14c. In FIGS. 14A to 14C, the same elements as those in FIGS. 13A to 13C are denoted by the same reference numerals. The pin side contact portion 14b of the pin contact 14B also has the same structure as the pin side contact portion 14b of the pin contact 14.

However, the pin side contact portion 14b of the pin contact member 14B is different from the pin side contact portion 14b of the pin contact member 14A in the oblique direction. In other words, the pin side contact portion 14b of the pin contact 14B is directed from the pin side substrate connecting portion 14c side toward the front end side of the pin contact member 14B in the width direction of the pin header body 15 The axis along the thickness direction of the pin header body 15 is centered, and only a predetermined acute angle θ is inclined in the clockwise direction.

Fig. 15 is a plan view of the row mother 13, and Fig. 15B is a cross-sectional view taken along line B-B. As shown in Figs. 15A and 15B, the mother ball 13 is provided with a plurality of conductive female contact members 16 arranged in the longitudinal direction at the same pitch P as the case of the pin contact members 14A and 14B, and supporting the row mothers The insulating mother body 17 of the contact member 16.

The female contact member 16 has two sides corresponding to the pin contact members 14A and 14B The shape is one line in 20 rows and two rows in the main body 17 of the main body. The rows of the female contact members 16 of each row are symmetrical to each other. Each of the rows of female contacts 16 is covered with an insulating resin constituting the main body 17 except for a predetermined portion.

The main body 17 is formed into a substantially plate shape having a predetermined length, a width, and a thickness (height), and can be fitted into the recessed portion 15a. The longitudinal direction and the width direction of the main body 17 are respectively aligned with the row direction of the row of female contacts 16 and the direction in which the rows are separated. The female contact member 16 extends along the width direction of the female body 17.

At the both end portions of the main body body 17, when the pin header 12 and the shoe mother 13 are connected, the row pin 13 is fixed to the pin header 12, and the row of the pin-side engaging portion 15d of the pin header 12 is engaged. Female side engaging portion 17d. Each of the rows of the female-side engaging portions 17d is configured to be engageable with the corresponding pin-side engaging portion 15d when the pin 12 and the female pin 13 are pressed in the mutually connecting direction, and have a card facing direction and a pin-out side. The cross-sectional shape of the opposite L-shaped portion of the joint portion 15d.

The main body 17 is provided with an opening 17e penetrating the thickness direction thereof and having a substantially rectangular cross section. Each of the openings 17e is provided at a position corresponding to the plating portion 16f (see FIG. 16A) described later for each row of the female contacts 16.

Figure 15C is a cross-sectional view taken along line C-C of Figure 15A. As shown in Fig. 15C, the female contact member 16 is covered by the resin of the main body 17 except for a predetermined portion. row The female body 17 is formed by insert molding with the female contact 16 as an insert material.

Figure 16A is a plan view of the female contact member 16, and Figure 16B is a side view thereof. As shown in FIG. 6A, the female contact member 16 is provided with a flat annular female-side contact portion 16b extending in the longitudinal direction thereof and parallel to the plate surface of the female main body 17, and the circuit board S2 (refer to the figure). 11) The mother-side substrate connecting portion 16c to which the circuit pattern is connected.

The female-side contact portion 16b has a female-side contact surface 16e corresponding to each of the pin-side contact portions 14b of the pin-side contact portion 14b of the pin contact 14A or 14B on the inner side. In other words, the center portion of the annular female-side contact portion 16b is provided with a long hole 16d extending in the longitudinal direction thereof, and the inner wall on both sides in the longitudinal direction thereof constitutes the female-side contact surface 16e.

The female contact member 16 is covered by the resin of the main body 17 except for the mother-side substrate connecting portion 16c and the portion adjacent thereto and the plating portion 16f around the long hole 16d. The mother-side substrate connecting portion 16c and the plating portion 16f are formed by insert molding using the female contact member 16 as an insert material to form the carrier body 17, and then covered by plating.

As shown in FIG. 11, the mother-side substrate connecting portion 16c is such that one side of the circuit board S2 can be connected to the circuit pattern of the circuit board S2, and slightly slightly toward the circuit board as compared with the side surface of the circuit board S2 of the main body 17. The S2 side protrudes. Mother The side contact portion 16b is located between the two plate faces of the main body body 17. In order to arrange the female-side contact portion 16b at this position, the female contact member 16 is bent into a crank shape between the female-side contact portion 16b and the female-side substrate connecting portion 16c.

As described above, the pin side contact portion 14b is inclined only by the predetermined acute angle θ with respect to the width direction of the pin body 15. For this reason, in the posture before the female pin 13 is pressed against the pin header 12 in the connecting direction, the pin-side contact portions 14b are in the female-side contact faces with respect to the corresponding female-side contact portions 16b. 16e is a state in which only the acute angle θ is inclined around the axis along the connecting direction.

When the row pin 13 is pressed against the pin header 12 in the connecting direction, the pin side contact portion 14b is elastically deformed by the chamfered portion 14f to reduce the inclination of the acute angle θ, and the corresponding female side contact portion is inserted. 16b. This elastic deformation is an elastic deformation in which the pin side contact portion 14b is twisted around the axis along the connecting direction. By the insertion of the elastic deformation, the pin side contact portion 14b comes into contact with the female side contact surface 16e of the female side contact portion 16b, and electrical connection between the pin 12 and the bank 13 is established.

As shown in Fig. 15B and Fig. 18A, in order to absorb the deformation generated in the main body 17 by inserting the pin side contact portion 14b into the female side contact portion 16b at this time, the phases on the two faces of the main body 17 are absorbed. A portion between the adjacent female contact members 16 is provided with a V-shaped groove 17c which is long in the width direction of the female main body 17.

The groove 17c is inserted into the female side contact portion 16b at the above-described pin side contact portion 14b. Thereafter, the portion of the female body 17 is prevented from being swelled between the adjacent female contact members 16. Further, instead of the groove 17c, a slit which is a through groove penetrating the main body 17 may be provided, and the slit has the same function as the groove 17c.

Fig. 18A is a partial enlarged view of Fig. 15B. As shown in Fig. 18A, a gap 17f is provided between the side surface of the female-side contact portion 16b of the female contact member 16 and the female body 17. The gap 17f has a absorbing mother-side contact when the needle-side contact portion 14b (see Figs. 13 and 14) of the header contact 14A or 14B is inserted between the female-side contact faces 16e of the female-side contact portion 16b. The deformation of the portion 16b prevents the deformation of the main body 17 from occurring. The width of the gap 17f can be set, for example, to 0.01 mm.

Further, an inclined surface 16g is provided on a portion of both sides in the thickness direction in contact with the main body 17 on both sides of the female-side contact portion 16b. The inclined surface 16g corresponds to an arc shape or a straight line in the cross-sectional view. Further, the inclined surface 16g may be a "spread" which is generated when the female contact 16 is formed by a press process which does not generate a burr on both sides, that is, a so-called extrusion method.

The gap 17f is fitted into the female contact 16 and can be formed when the male body 17 is injection molded. That is, as shown in Fig. 18B, at the time of injection molding, the sleeve 21 is inserted between the female-side contact faces 16e of the female contact member 16, and the female-side contact portion 16b is enlarged by the amount of the gap 17f on both sides simultaneously. Forming material.

Further, after the forming material is solidified, the sleeve 21 is pulled out. At this time, by The elasticity of the female contact member 16 and the female parent side contact portion 16b shrink only the amount of the gap 17f on both sides in the width direction. According to this, the gap 17f is formed. Further, a minute gap is formed between the inner wall of the main body 17 adjacent to the gap 17f and the corresponding inclined surface 16g adjacent to the thickness direction of the main body 17.

Next, the operation when the pin header 12 and the bank 13 are attached and detached will be described. First, with respect to the side of the pin 12 on the side shown in Fig. 12A, the row 13 is opposed to the surface on the side shown in Fig. 15A, and both end portions of the main body 17 are fitted to the peripheral wall 15b of the pin body 15, 15c. As a result, the front ends of the pin-side contact portions 14b of the respective pin contact members 14A and 14B are in contact with the female-side contact portions 16b of the corresponding female contact members 16 to form a state opposed to the long holes 16d.

17A and 17B show the positional relationship of the needle-side contact portion 14b with respect to the female-side contact portion 16b at this time. In Fig. 17A, the positional relationship seen from the side of the mother-side substrate connecting portion 16c of the female contact member 16 is shown, and the positional relationship as viewed from the side of the pin-side contact portion 14b is shown in Fig. 17B.

As shown in FIG. 17A, the pin side contact portion 14b is inclined only by the predetermined acute angle θ with respect to the female contact side contact surface 16e. Therefore, in the positional relationship viewed from the pin side contact portion 14b side, the pin side contact portion 14b The corner portion of the front end portion 14g is extruded from the long hole 16d of the female parent side contact surface 16e. In other words, when the positional relationship is maintained, the needle-side contact portion 14b cannot be inserted into the long hole 16d.

Next, the pin header 12 and the row pin 13 are pushed to each other in the thickness direction, that is, connected direction. At this time, the respective chamfered portions 14f of the pin-side contact portions 14b of the respective pin contact members 14A and 14B and the end edges of the pin-side contact portions 14b of the long holes 16d (the row of the female-side contact faces 16e) The end edge of the needle side contact portion 14b side contacts and slides. According to this, at the end portion of the needle-side contact portion 14b, the force of twisting in the direction in which the predetermined angle θ becomes smaller acts, so that the needle-side contact portion 14b is elastically twisted around the axis along the joint direction. Deformation.

According to this, the front end portion 14g of the pin side contact portion 14b is inserted into the long hole 16d in a posture in which the long hole 16d can be inserted, and the portion other than the chamfered portion 14f in each of the pin side contact portions 14b of the pin side contact portion 14b. It is also in a state of sliding with the corresponding female-side contact surface 16e.

At the same time, the female-side contact portion 16b is deformed and enlarged in the width direction. At this time, since the deformation is absorbed by the gap 17f, the deformation of the main body 17 due to the deformation is suppressed. Further, at this time, since the gap 17f exists between the inclined surface 16g of the female-side contact portion 16b and the inner wall of the female main body 17, the corner portion of the female-side contact portion 16b is not caught on the inner wall and is hindered. The mother side contact portion 16b is enlarged.

When the pin side contact portion 14b continues to be inserted into the long hole 16d, when the plate surface on the pin pin 12 side of the main body body 17 comes into contact with the concave portion 15a of the pin body 15, the end portion 14g before the pin side contact portion 14b The state of protruding from the female side contact portion 16b. That is, the neck portion 14h of the pin side contact portion 14b reaches the end edge of the long hole 16d in the connecting direction side (the side of the connection side of the female side contact surface 16e) The end edge of each of the neck portions 14h is in contact with the female side contact surface 16e of the long hole 16d.

17C and 17D show a state in which the necked portion 14h is in contact with the female-side contact surface 16e. As shown in Figs. 17C and 17D, once this state is reached, the above-described elastic deformation is slightly restored, and the twist is slightly eliminated. According to this, it is difficult for each of the pin side contact portions 14b to be pulled out from the long hole 16d of the corresponding row side contact portion 16b, and is fixed to the row mother side contact portion 16b.

Further, at the same time as this state, the row-side female engaging portions 17d of the main body 17 are engaged with the respective pin-side engaging portions 15d of the pin-receiving body 15, and the male-female body 17 is fixed to the pin-removing body 15. on.

According to this, the electrical connection of the pin header 12 and the bank pin 13 is completed. When the connection is released, a force is applied to the side surface of the main body 17 corresponding to the portion where the height of the peripheral wall 15b of the pin header body 15 is lowered, and the main body 17 is pulled away from the pin body 15, thereby enabling The ejector pin 13 is easily separated from the pin header 12 and the connection is released.

As described above, according to the present embodiment, the female contact member 16 has a simple structure in which only the annular female-side contact portion 16b having the female-side contact surface 16e and the female-side substrate connecting portion 16c are provided on the inner side. Further, the pin contact members 14A and 14B may have only the pin side contact portion 14b and the pin side substrate connecting portion 14c provided only with the pin side contact portion 14b and the chamfer portion 14f. Single structure. Therefore, it is possible to more easily achieve further lowering and narrower pitch of the substrate connector 11.

Further, the pin contact members 14A, 14B and the female contact member 16 are covered by the resin of the pin header body 15 or the main body 17 except for the main portion. Accordingly, while increasing the support strength of the pin header body 15 of the pin contact members 14A and 14B and the support strength of the bus bar body 17 of the female contact member 16, the adjacent pin contact members 14A and 14B can be maintained. And good insulation between the female contact members 16. Therefore, it is possible to more easily achieve further low-profile and narrow pitch.

Further, since the pin contact members 14A and 14B and the female contact member 16 are covered with resin except for the necessary portions, dust enters even when the pin header 12 or the bank pin 13 are mounted on the circuit boards S1 and S2, respectively. The insulation between the pin 12 and the bank 13 is not impaired.

Further, a portion of the main body 17 between the adjacent female-side contact portions 16b is provided with a groove 17c for absorbing the insertion of the female contact portion by the pin-side contact portion 14b of the pin contact members 14A and 14B. The female side contact portion 16b of the row 16 of 16 causes deformation of the portion of the female body portion 17. According to this, it is possible to prevent the bulging portion of the main body portion 17 from being bulged, and it is also possible to smoothly perform the insertion. Therefore, the narrow pitch can be further promoted.

Moreover, the main body body 17 is formed by using the female contact member 16 as an insert material. After the insert molding is formed, the plating portion 16f of the female contact member 16 is covered by plating. Therefore, the plating film can be easily formed only on the plating portion 16f, and the cost of the plating material can be greatly reduced.

Similarly, since the pin header body 15 is formed by insert molding using the pin contact members 14A and 14B as the insert material, the pin header side contact portion 14b and the pin header side substrate connecting portion 14c are plated. Therefore, the same effect can be obtained.

Further, when the pin-side contact portion 14b and the row-side contact portion 16b of the row-side contact portion 16b corresponding thereto are pressed in the direction in which the pin 12 and the pin 13 are connected, they are slid to each other and are generated relative to the pin header. The side contact portion 14b is elastically deformed by twisting, and at the same time, the pin-side contact portion 14b is partially inserted between the female-side contact faces 16e of the female-side contact portion 16b. By this insertion, the pin side contact portion 14b is in electrical contact with the female contact side contact surface 16e. Therefore, the connection between the pins 12 and the rows 13 can be established only by pressing the pin 12 and the row 13 in the connecting direction. In addition, with an extremely simple structure, it can be realized while achieving low-profile and narrow-pitch.

Further, when the end portion 14g protrudes from the female-side contact portion 16b before the pin-side contact portion 14b, the pin-out side contact portion 14b has the constricted portion 14h that causes the elastically deformed portion to disappear. The contact portion 14b is fixed to the female-side contact portion 16b. Therefore, it is possible to accurately maintain the contact of the pin contact members 14A and 14B with the discharge mother without being affected by external vibration and shock. The electrical connection of the piece 16.

Further, the direction of the twist around the axis due to the elastic deformation of the pin side contact portion 14b is opposite to the direction between the adjacent pin contact members 14A and 14B. According to this, the direction of deformation generated around the respective pin contact members 14A and 14B caused by the force for elastically deforming the respective pin side contact portions 14b is on the adjacent pin contact members 14A and 14B. opposite direction. Therefore, since the aforementioned deformation is partially canceled, it is possible to prevent the pin header 12 from being largely deformed or deviated. Further, since the deformation generated around the respective rows of the female contact members 16 is also partially canceled, it is possible to prevent the mother ball 13 from being largely deformed or deviated.

Further, since the gap 17f is provided between the side surface of the female-side contact portion 16b and the female-female body 17, the deformation of the male-female body 17 can be suppressed by the expansion of the female-side contact portion 16b. Further, since the inclined surface 16g is provided in the female-side contact portion 16b, the expansion of the female-side contact portion 16b can be smoothly performed, and the connection between the header 12 and the female 13 can be smoothly performed.

Further, when the needle-side contact portion 14b of the header contact 14A or 14B is inserted between the female-side contact faces 16e of the female-side contact portion 16b, the pin-side contact portion 14b is elastically deformed by twisting, and the female side is displaced. The contact portion 16b produces an enlarged elastic deformation. Therefore, the angle at which the pin side contact portion 14b is elastically twisted is reduced, and the pin side contact portion 14b can be smoothly inserted between the pair of female side contact faces 16e.

Further, since the cross-section of the circuit pattern Pa side of the pin-side substrate connecting portion 14c of the pin contact members 14A and 14B and the row-side substrate connecting portion 16c of the female contact member 16 is octagonal, The amount of the solder paste C extruded from the substrate connection portion can be reduced as compared with the case where the cross section is rectangular. Therefore, in the reflow process, it is possible to prevent the molten solder C' of the adjacent substrate connecting portion from being connected to each other to cause a short circuit.

Next, a modification of the second embodiment will be described with reference to Figs. 19 to 22 . 19A to 19C show the pin contact members 14A' which can be used in place of the pin contact members 14A of Figs. 13A to 13C. 20A to 20C show the pin contact members 14B' which can be used in place of the pin contact members 14B of Figs. 14A to 14C. In FIGS. 19 and 20, the same elements as those in FIGS. 13 and 14 are denoted by the same reference numerals as those in FIGS. 13 and 14. Moreover, FIG. 21 is a view showing the shape of the pin contact member which is a main part of the modification.

As shown in Fig. 19, the pin side contact portion 14b' in the pin contact member 14A', as the pin side contact face, has no necking as in the neck portion 14h of the pin contact member 14 of Fig. 13B. The needle side contact portion 14b'. That is, as shown in Fig. 19B, the width of the pin side contact portion 14b of the pin side contact portion 14b is narrowed at the proximal end side of the distal end portion 14g, but no hyacinoid shape is formed from the portion. Necking, and linear expansion.

In the case of the pin contact member 14B' of Fig. 20, the pin side contact portion thereof 14b' also has the same structure as the pin contact 14A'. The other portions of the pin contact members 14A' and 14B' are the same as those of the pin contact members 14A and 14B of Figs. 13 and 14. In the case of the pin contact members 14A' and 14B', as in the case of the pin contact members 14A and 14B, the female contact member 16 is also connected.

According to the pin contact members 14A' and 14B', since the neck portion 14h of the pin contact members 14A and 14B is not present, the amount of restoration of the elastic deformation as described above using Figs. 17A to 17D, and the pin contact member The situation of 14A and 14B is relatively small. However, since the neck portion 14h is not present, the resistance to the torsion pin side contact portion 14b which is generated when inserted between the female side contact faces 16e of the female contact member 16, and the pin contact members 14A and 14B The situation is higher.

Further, the present invention is not limited to the above embodiment. For example, plating of a predetermined portion of the header contact members 14A and 14B or the female contact member 16 may be performed before the formation of the header body 15 or the carrier body 17.

Further, the shape of the cross section of the pin side substrate connecting portion 14c and the mother side substrate connecting portion 16c is not limited to an octagonal shape, and may be a substantially V shape as shown in Fig. 22A, as shown in the diamond shape of Fig. 22B. 22C heart shape. Also, it may be a hexagon or other polygon as shown in Fig. 22D. In other words, the shape of the uneven shape of the solder paste C can be maintained on the circuit pattern Pa side of the pin side substrate connecting portion 14c or the mother side substrate connecting portion 16c. Just like it.

In the case where the shape of the cross section of the pin side substrate connecting portion 14c or the mother side substrate connecting portion 16c is V-shaped or heart-shaped, it is press-machined by a V-shaped die corresponding to the pin-side substrate connecting portion 14c or The member portions of the mother-side substrate connecting portion 16c can be easily machined into the shapes.

Further, the pin side substrate connecting portion 14c or the mother side substrate connecting portion 16c and the circuit pattern Pa may be manually connected by using a soldering iron. In this case, as long as the shape of the cross section of the pin side substrate connecting portion 14c or the mother side substrate connecting portion 16c has the uneven shape capable of holding the solder and staying as described above, it is also possible to obtain the above-mentioned adoption. The same method of preventing short circuit when soldering is performed.

Moreover, the pin-side contact portion 14b may be configured to be parallel to the width direction of the pin header main body 15, and the female-side contact surface 16e of the female-side contact portion 16b may be inclined with respect to the width direction of the main body 17.

In other words, when the pin header side contact portion 14b and the corresponding row mother side contact surface 16e press the pin header 12 and the bank pin 13 in the connection direction, the pin header side contact portion 14b is caused to follow the connection by sliding each other. The elastic deformation of the torsion around the axis of the direction is also configured to be in electrical contact with each other.

Next, a substrate according to a third embodiment of the present invention will be described with reference to FIGS. 23 to 26. The connector is described. The same components as those of the above-described embodiment are denoted by the same reference numerals as in the above-described embodiment, and the detailed description thereof will be omitted. As shown in Fig. 23A, the pin contact member 24 of the third embodiment has a pin side body 24a that is fitted and fixed to the pin body 5 (see Fig. 1), and protrudes from the pin side body 24a toward the mother 3 side. The pin side contact portion 24b and the pin side substrate connecting portion 24c projecting from the pin side body 24a toward the side surface of the pin body 5.

As shown in Fig. 23C, the pin side contact portion 24b is curved in the width direction thereof in plan view. This curved shape is formed by punching when the pin contact 24 is punched from the material. Further, as shown in FIG. 23A, the engaging portion 24d is provided on the side of the pin side substrate connecting portion 24c in the longitudinal direction of the pin contact member 24 (the horizontal direction in FIG. 23A).

As shown in FIG. 23E, the pin side substrate connecting portion 24c is subjected to uneven processing on the soldering surface of the circuit board S1 (see FIG. 1). In the third embodiment, a plurality of wedge-shaped grooves 24e are formed in the axial direction of the pin-side substrate connecting portion 24c, and the capacity of the solder paste is further increased. Further, as shown in FIG. 23F, the wedge-shaped groove 24e may be formed to traverse the surface of the pin-side substrate connecting portion 24c.

Here, the pin contact member 24' of Fig. 23D is a modification in which the curvature of the arcuate portion of the pin side contact portion 24b' is larger than that of the pin contact member 24 shown in Fig. 23C. The other configuration of the pin contact members 24, 24' is the same as that of the pin contact member 4 of the first embodiment described above.

As shown in Figs. 24A to 24D, the female contact member 26 of the third embodiment has the female side body 26a which is fitted and fixed to the mother body 7 (refer to Fig. 1) and the female body from the female side body 26a. The mother-side contact portion 26b extending in the width direction of the main body 7 and the female-side substrate connecting portion 26c protruding from the female-side main body 26a toward the side surface of the main body 7.

As shown in FIG. 24A, the female-side contact portion 26b has a long annular shape in which a long hole 26d is provided in a central portion in plan view, and is curved in the width direction. In the present embodiment, the center 26i of the curved portion has an arc shape, and the entire female side contact portion 26b is linearly bent. As a result, the long hole 26d of the female-side contact portion 26b is also formed in a linearly deformed shape except for the central portion.

As shown in FIG. 24B, the mother-side substrate connecting portion 26c is formed in a plurality of wedge-shaped grooves 26f on the welding surface of the circuit board S2 (see FIG. 1) in the same manner as the pin-side substrate connecting portion 24c. Further, as shown in FIG. 24A and the like, the long hole 26d of the female-side contact portion 26b is chamfered 26e.

Here, the curved shape of the female contact member 26' of Fig. 24C, the female parent side contact portion 26b' and the long hole 26d' is not a curved shape as shown in Fig. 24A but a modified example of an arcuate curved shape. The other structure of the female contact members 26, 26' is the same as that of the female contact member 6 of the first embodiment described above.

Next, in the substrate connector of the third embodiment, the pair of pin contacts The connection state of 24, 24' and the female contact members 26, 26' will be described with reference to Fig. 25. Fig. 25A shows the connection state of the pin contact member 24 shown in Fig. 23C and the bus bar contact member 26 shown in Fig. 24A.

In the example shown in Fig. 25A, the curvature of the arcuate portion of the pin side contact portion 24b is reduced as compared with the curvature of the long hole 26d of the female side contact portion 26b. Accordingly, the left side portion of the pin side contact portion 24b in Fig. 25A is in contact with the bent portion of the long hole 26d of the female contact member 26, and the right side portion of the pin side contact portion 24b and the female contact member 26 are shown in Fig. 25A. The inner peripheral surface of the long hole 26d is in contact at two places.

Fig. 25B shows the connection state of the pin contact member 24' shown in Fig. 23D and the bus bar contact member 26' shown in Fig. 24C. In the example shown in Fig. 25B, the curvature of the arcuate portion of the pin side contact portion 24b' is increased as compared with the curvature of the long hole 26d' of the female side contact portion 26b'.

According to this, in Fig. 25B, the left side portion of the needle-side contact portion 24b' is in contact with the inner peripheral surface of the long hole 26d' of the female contact member 26' at two places, and the needle-side contact portion 24b' is shown in Fig. 25B. The right side portion is in contact with the inner peripheral surface of the long hole 26d' of the female contact member 26' at two places.

As described above, in the third embodiment and the modified example, since the pin side contact portions 24b and 24b' and the female side contact portions 26b and 26b' are bent in the width direction in common, the two are in contact with each other, and the conduction can be improved. Reliability, can also improve Connection strength.

Further, in the third embodiment, the pin contact member 24 and the female contact member 26' may be combined, or the pin contact member 24' and the female contact member 26 may be combined. Further, the pin contact members 24 and 24' of the third embodiment may be combined with the bus bar contact members 6, 6', 6" of the first embodiment, or may be in contact with the busbar of the second embodiment. Further, the female contact members 26 and 26' of the third embodiment may be combined with the needle contact member 4 of the first embodiment or the needle contact member 14 of the second embodiment.

Further, in the third embodiment, as shown in Figs. 10A to 10C, the female-side contact portions 26b, 26b' of the female contact members 26, 26' may be bent to be V-shaped or U as viewed from the axial direction thereof. Glyph.

Next, a modification of the board connecting portion as a connector of an electronic device will be described with reference to FIG. Fig. 26A is a modification 34c of the pin side substrate connection portion of the pin contact 4 in the first embodiment. The pin side substrate connecting portion 34c is formed in a plate shape, and is press-formed into a shallow U-shape in the axial view. Further, the pin header side substrate connecting portion 34c is formed with a communication hole 34d that communicates the front surface and the back surface thereof.

When the pin header side substrate connecting portion 34c is placed on the solder paste (not shown) coated on the circuit board, the pin header side substrate connecting portion 34c is formed in the axial direction view. Lighter U-shaped, so in the pin header The amount of the solder paste extruded in the width direction of the side substrate connecting portion 34c is reduced. Further, the solder paste in the portion of the communication hole 34d is extruded from the communication hole 34d toward the surface side of the pin header side substrate connecting portion 34c. According to this, the amount of the solder paste extruded in the width direction of the pin header side substrate connecting portion 34c can be reduced, so that even if the connector is a narrow pitch, the solder bridge between the contacts can be prevented.

Fig. 26B is a modification 36c of the female-side substrate connecting portion of the female contact member 6 in the first embodiment. The mother-side substrate connecting portion 36c is formed in a plate shape, and is press-formed into a shallow V-shape in the axial direction view. Further, a communication hole 36d that communicates the front and back surfaces thereof is formed in the mother-side substrate connecting portion 36c. The mother-side board connecting portion 36c is the same as the above-described pin-side board connecting portion 34c, and can prevent the solder bridge between the contacts.

Fig. 26C is a modification 44c of the pin side substrate connecting portion of the pin contact 4 in the first embodiment. The pin header side substrate connecting portion 44c is formed in a plate shape, and is press-formed into an inverted U shape in the axial direction view. Fig. 26D is a modification 46c of the female-side substrate connecting portion of the female contact member 6 in the first embodiment. The mother-side substrate connecting portion 46c is formed in a plate shape, and is press-formed into an inverted V shape in the axial direction view.

According to the pin-side substrate connection portion 44c and the mother-side substrate connection portion 46c of the above-described shape, when placed on the solder paste applied to the circuit pattern of the circuit substrate, the surface opposite to the circuit substrate is recessed. The glyph or the inverted V shape, so the solder paste is squeezed into the inside of the depressed portion, from the width of each connecting portion The amount of extrusion in the direction is reduced. Therefore, with this configuration, it is also possible to prevent the solder bridge between the contacts.

Further, the respective shapes in the above-described modifications are not limited to the pin contact members or the female contact members, and any shape may be applied as long as the contacts of the electronic components soldered on the printed circuit board are printed. Further, for the shape of the U-shape or the V-shape, the amount of bending or the angle can be appropriately changed. Further, in the case of having the shapes of the communication holes 34d and 36d, the pin side substrate connection portion 34c and the mother side substrate connection portion 36c may have a flat shape, and the direction of the bending process may be the same as that of FIG. 26C or FIG. 26D. The opposite direction.

1, 11‧‧‧ substrate connector

S1, S2‧‧‧ circuit board

2, 12‧‧‧ pin header

3, 13‧‧‧ mother

4, 4', 14, 24‧‧‧ pin contacts

4b, 14b, 24b‧‧‧ pin side contact

4c, 14c, 24c, 34c, 44c‧‧‧ pin header side substrate connection

4d‧‧‧Clock Department

5d‧‧‧Receiving Department

5e‧‧‧ jaws

5f‧‧‧Chamfering

6, 6', 6" ‧ ‧ female contact

6b, 16b, 26b‧‧‧ female side contact

6c, 16c, 26c, 36c, 46c‧‧‧ mother-side substrate connection

6d‧‧‧ long hole

6g‧‧‧axis end

7a‧‧‧ card hole

7b‧‧‧lateral edge

Fig. 1 is a view showing a state in which a circuit board according to an embodiment of the present invention is connected by a substrate connector.

In Fig. 2, A is a plan view of the pin header, B is a B-B line cross-sectional view of A, C is a side view of A, D is a partial enlarged view of A, and E is a cross-sectional view of E-E line of D.

In Fig. 3, A is a side view of the pin contact, B is a front view of the pin contact, C is a plan view of the pin contact, and D is a plan view of a modification of the pin contact.

In Fig. 4, A is a plan view of the mother row, B is a partial enlarged view of A, C is a C-C line sectional view of B, D is a D-D line sectional view of B, and E is a partial sectional view of the E-E line of A.

In Fig. 5, A is a plan view of the female contact, B is a side view of the female contact, and C is a front view of the female contact.

In Fig. 6, A and B are explanatory views showing a process of connecting the pin header and the bus bar.

In FIG. 7, A is a view showing a state in which the mother is placed on the circuit board, B is a view showing a state of the molten solder, and C and D are views showing a state in which the previous mother is placed on the circuit board.

In Fig. 8, A to D are diagrams showing a first modification of the first embodiment.

In Fig. 9, A and B are views showing the state of the pin contact and the mother contact of the first modification.

In Fig. 10, A to C are views showing the female contact of the second modification.

Fig. 11 is a view showing a connection state of the substrate connector of the second embodiment.

In Fig. 12, A is a plan view of the pin header of the second embodiment, B is a side view of the pin header, and C is a cross-sectional view taken along line C-C of A.

In Fig. 13, A to C are views showing the pin contact of the first type of the second embodiment.

In Fig. 14, A to C are views showing a second type of pin contact member of the second embodiment.

In Fig. 15, A is a plan view of the mother of the second embodiment, B is a partial cross-sectional view taken along line B-B of A, and C is a cross-sectional view taken along line C-C of A.

In Fig. 16, A and B are views showing the female contactor of the second embodiment.

In Fig. 17, A and B are views showing a state in which the mother and the pin are in contact with each other in the second embodiment, and C and D are views showing a state in which the mother and the pin are connected in the second embodiment.

In Fig. 18, A is a detailed sectional view showing the main body and the female contact, and B is a view showing a manufacturing process of the female of A.

In Fig. 19, A to C show a modification of the second embodiment, and a view in which the pin contact 14A' used in the pin contact 14A of A to C in Fig. 13 can be replaced.

In Fig. 20, A to C show a modification of the second embodiment, and a view in which the pin contact 14B' used in the pin contact 14B of 14A to 14C is replaced.

Fig. 21 is a view showing the shape of a pin contact member which is a main part of a modification of the second embodiment.

In Fig. 22, A to D are diagrams showing other examples of the shape of the cross section of the substrate connecting portion of the pin and the mother.

In Fig. 23, A to F are explanatory views showing the connector pin of the third embodiment.

In Fig. 24, A to D are explanatory views showing the connector mother of the third embodiment.

In Fig. 25, A and B are explanatory views showing a connection state of the pin header and the leader of the third embodiment.

In Fig. 26, A to D are explanatory views showing other shapes of the contacts for electronic devices.

1‧‧‧Substrate connector

S1, S2‧‧‧ circuit board

2‧‧‧ pin header

3‧‧‧Mother

4‧‧‧ pin contact

4b‧‧‧ pin side contact

4c‧‧‧ pin header side substrate connection

4d‧‧‧Clock Department

5d‧‧‧Receiving Department

5e‧‧‧ jaws

5f‧‧‧Chamfering

6‧‧‧Maternal contact

6b‧‧‧ Female side contact

6c‧‧‧ mother-side substrate connection

6d‧‧‧ long hole

6g‧‧‧axis end

7a‧‧‧ card hole

7b‧‧‧lateral edge

Claims (20)

A board connector comprising: a pin header mounted on a circuit board and a bus bar mounted on another circuit board, wherein the pin header and the bus bar are opposed to each other in a predetermined posture, and are electrically connected by pressing in a connection direction, and are characterized by The pin header includes an insulating pin header body and a plurality of conductive pin contact pins fixed to the pin header body and connected to the busbar side, and the busbar includes an insulating stem body and is fixed to the foregoing a plurality of conductive female contact members connected to the pin header contact member and the pin header contact member, wherein the pin header contact member includes a pin side contact portion that protrudes toward the mating mother side and is in contact with the row female contact member a pin header side substrate connecting portion that protrudes from the pin header body and is connected to the circuit board, and the row bus bar contact member includes a bus bar side contact portion that is in contact with the pin header side contact portion and protrudes from the bank pin body a mother-side substrate connecting portion connected to the other circuit board, wherein the female-side contact portion has a through hole, and the pin-side contact portion is inserted into the through hole, and the pin-side contact is And by the elastic contact with and connected to the through hole. The substrate connector according to the first aspect of the invention, wherein the female-side contact portion is formed in a plate shape in which an axial direction of the female contact member is longer than a width direction, and faces the pin-out side in a side view. bending. The substrate connector according to claim 1 or 2, wherein the female-side contact portion is formed in a plate shape in which an axial direction of the female contact member is longer than a width direction, and the axial direction view is from the foregoing Bending of the center of the through hole It is V-shaped or U-shaped. The substrate connector according to any one of claims 1 to 3, wherein the female-side contact portion is formed in a plate shape in which an axial direction of the female contact member is longer than a width direction, in plan view. Bending toward the width of the female contact. The substrate connector according to any one of claims 1 to 4, wherein the through hole is a long hole having a long axial length of the female contact member, and the pin side contact portion has An engagement portion of the inner circumferential surface of the through hole or the rear surface of the contact portion on the female side contact portion is engaged with the end portion of the through hole in the axial direction. The substrate connector according to claim 5, wherein the pin contact members are provided in parallel in the longitudinal direction of the pin header body, and are arranged in two rows in the width direction of the pin header body. The engaging portion is disposed symmetrically with respect to a center of the pin body in the width direction. The substrate connector according to any one of claims 1 to 6, wherein the through hole is a long hole having a long axial length of the female contact member, the pin side contact portion, and the aforementioned The width of the through hole is formed thicker than when the pin side contact portion is inserted into the through hole, and the pin side contact portion is in contact with both inner circumferential surfaces of the through hole in the width direction. The substrate connector according to any one of claims 1 to 6, wherein the through hole is a long hole having a long axial length of the female contact, and the pin side contact portion is in a plan view. The middle is bent in the width direction, and when inserted into the through hole, the width of the pin side contact portion and the through hole is Contact the two inner circumferences. The substrate connector according to claim 8, wherein the female-side contact portion is formed in a plate shape in which an axial direction of the female contact member is longer than a width direction, and faces the female contact member in plan view. The row-side contact portion is bent in the same direction as the mating-side contact portion in a plan view, and is inserted into the through-hole, and the row-side contact portion and the through-hole are oriented in the width direction. The two inner peripheral surfaces are in contact. The substrate connector according to any one of claims 1 to 9, wherein the pin side contact portion is inclined with respect to an axis of the pin contact member in a plan view, and the through hole is in the row The length of the female contact member in the axial direction is longer than that of the aforementioned pin side, and the width is narrower than the inclined width of the aforementioned pin side contact portion in plan view. The substrate connector according to claim 10, wherein the pin-side contact portion has an engagement portion that engages with an inner circumferential surface of the through hole or a rear surface of the female-side contact portion. The substrate connector according to claim 10, wherein the pin contact member is provided in parallel in the longitudinal direction of the pin body, and is disposed adjacent to the pin contact member. The inclination of the pin side contact portions is opposite to each other. The substrate connector according to any one of claims 1 to 12, wherein the plurality of female contact members are provided in parallel in the longitudinal direction of the main body. The main body of the main body is provided with a groove or a through groove between the adjacent rows of the female contact members. The substrate connector according to any one of claims 1 to 13, wherein the main body and the pin body are integrally formed in a rectangular parallelepiped shape, and the mother body or one of the pin body The body is provided with a receiving portion that can rotate the other body to attach and detach the pin header and the busbar. The substrate connector of claim 14, wherein on the main body of the main body or the body of the pin header body, two sides of the main body are protruded toward the other body and are attached to the other body. The two end engagement portions are chamfered shapes that do not interfere with the other body when the pin or the socket is rotated and detached. A contact for an electronic device having a board connecting portion to be soldered to a circuit board, wherein the board connecting portion has an uneven shape formed on a surface facing the circuit board. The contact for an electronic device according to claim 16, wherein the substrate connecting portion is formed to have a V-shape in the axial direction view or a narrower side of the circuit substrate side in a surface facing the circuit board. shape. The contact for an electronic device according to claim 16 or 17, wherein the substrate connecting portion has a single or a plurality of concavo-convex shapes formed on a surface facing the circuit board in the axial direction. The contact for an electronic device according to claim 16 or 17, wherein The substrate connecting portion has a plate shape, and a communication hole that communicates the surface and the back surface is formed. The contact for an electronic device according to claim 16 or 19, wherein the substrate connecting portion has a plate shape and is formed in an inverted U shape or an inverted V shape in an axial direction view.