TW201639237A - Communication module - Google Patents
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Abstract
Description
本發明有關於一種通訊模組,且特別是有關於一種用於無線通訊之感應系統。 The present invention relates to a communication module, and more particularly to an inductive system for wireless communication.
手機或任何類型的行動通訊裝置,已成為現代人隨身攜帶的配備。以往行動通訊裝置的主要功能僅限於撥打電話、發送簡訊或無線上網等大眾已知的功能。然而,隨著科技的進步,且由於手機攜帶方便的特點,業界已開始設想將某些符合日常生活所需的功能整合到手機上,例如非接觸式的智慧卡。所謂非接觸式的智慧卡,即為透過近距離的感應方式來使得設置在卡片內的晶片發揮作用。目前日常生活中應用非接觸式智慧卡的場合非常多,諸如採行PayPass TM與VISA WAVE規格的非接觸式信用卡、大眾運輸系統的悠遊卡、7-11的icash卡、具ID辨識功能的門禁卡與會員卡等等。上述智慧卡可提供使用者在日常生活方面許多非常便利的服務,故業者無不積極研發要將上述具有各種用途的智慧卡功能整合到人人都會隨身攜帶的手機上,讓原本多用來收聽電話的手機亦可拿來刷卡、作為電子錢包、搭大眾運輸系統、或是識別身份。 Mobile phones or any type of mobile communication device have become a portable device for modern people. In the past, the main functions of mobile communication devices were limited to functions such as making calls, sending text messages, or wireless Internet access. However, with the advancement of technology and the convenience of mobile phones, the industry has begun to envision the integration of certain functions required for daily life into mobile phones, such as contactless smart cards. The so-called non-contact smart card is a wafer that is placed in the card by a close-range sensing method. At present, there are many applications for contactless smart cards in daily life, such as contactless credit cards with PayPass TM and VISA WAVE specifications, leisure cards for mass transit systems, iSSH cards with 7-11, and access control with ID identification. Cards and membership cards and more. The above smart card can provide users with many very convenient services in daily life. Therefore, all the developers are actively researching and developing the smart card functions with various uses mentioned above to be integrated into the mobile phones that everyone will carry with them, so that the original ones are used to listen to the telephones. The phone can also be used to swipe cards, as an e-wallet, to take the mass transit system, or to identify themselves.
上述具備近場通訊技術功能的手機,其內部通常裝設包括近場通訊天線(NFC antenna)和相關的積體電路晶片。然而,習知通訊模組之近場通訊天線和積體電路晶片係分開設置,也因此佔用了相當大的面積。在現在今行動通訊產品小型化的趨勢下,近場通訊模組也需要將其尺寸減小。因此,如何將近場通訊模組小型 化成為該項事業人士所欲解決的重要課題。 The above-mentioned mobile phone with near field communication technology is usually equipped with a near field communication antenna (NFC antenna) and an associated integrated circuit chip. However, the near field communication antenna and the integrated circuit chip of the conventional communication module are separately disposed, and thus occupy a considerable area. In the current trend of miniaturization of mobile communication products, near field communication modules also need to reduce their size. Therefore, how to make the near field communication module small It has become an important issue that the business person wants to solve.
鑒於以上之問題,本發明一實施例提供一種通訊模組,其包括:一磁芯結構,其包括至少一線圈導體圖案;一第一陶瓷體層和一第二陶瓷體層,分別位於磁芯結構之相對兩側,其中第一陶瓷體層包括數個第一焊墊電極,第二陶瓷體層包括數個第二焊墊電極,其中第一焊墊電極包括一第一饋入焊墊電極、一第二饋入焊墊電極和數個虛設焊墊電極,且第一饋入焊墊電極和第二饋入焊墊電極電性連接磁芯結構之線圈導體圖案;及至少一積體電路晶片,其設置於第二陶瓷體層上,其中積體電路晶片包括至少一接合墊,其與部份之上述第二焊墊電極接合。 In view of the above problems, an embodiment of the present invention provides a communication module including: a magnetic core structure including at least one coil conductor pattern; a first ceramic body layer and a second ceramic body layer respectively located in the core structure On the opposite sides, wherein the first ceramic body layer comprises a plurality of first pad electrodes, and the second ceramic body layer comprises a plurality of second pad electrodes, wherein the first pad electrode comprises a first feed pad electrode and a second Feeding the pad electrode and the plurality of dummy pad electrodes, and the first feed pad electrode and the second feed pad electrode are electrically connected to the coil conductor pattern of the core structure; and at least one integrated circuit chip is disposed On the second ceramic body layer, wherein the integrated circuit chip includes at least one bonding pad which is bonded to a portion of the second pad electrode.
本發明一實施例提供一種通訊模組,包括:一天線結構,其包括一磁芯結構、一第一陶瓷體層和一第二磁陶瓷體層,其中第一陶瓷體層和第二陶瓷體層分別位於磁芯結構之相對兩側,且第一陶瓷體層中包括數個第一焊墊電極,第二陶瓷體層中包括數個第二焊墊電極;及至少一積體電路晶片,其包括數個接合墊,接合於第二陶瓷體層上對應的第二焊墊電極。 An embodiment of the present invention provides a communication module, including: an antenna structure including a core structure, a first ceramic body layer, and a second magnet ceramic body layer, wherein the first ceramic body layer and the second ceramic body layer are respectively located on the magnetic The opposite sides of the core structure, and the first ceramic body layer includes a plurality of first pad electrodes, the second ceramic body layer includes a plurality of second pad electrodes; and at least one integrated circuit chip including a plurality of bonding pads And bonding to the corresponding second pad electrode on the second ceramic body layer.
本發明之實施例將小型化天線與電路佈局製作於導磁性材料內,搭配積體電路晶片後,可大幅縮小通訊模組尺寸,使其可廣泛的應用於穿戴式產品中。此外,本發明實施例的磁芯結構之陶瓷體層採用高導磁率材料,外部之陶瓷體層採用導磁率相對較低的材料或非導磁材料,藉此在有限的成本下提供小尺寸天線結構足夠高的感值,藉以使得對應的通訊模組有較佳的表現。 In the embodiment of the invention, the miniaturized antenna and the circuit layout are fabricated in the magnetic conductive material, and the integrated circuit chip can greatly reduce the size of the communication module, so that it can be widely applied in the wearable product. In addition, the ceramic body layer of the magnetic core structure of the embodiment of the invention adopts a high magnetic permeability material, and the outer ceramic body layer uses a material with a relatively low magnetic permeability or a non-magnetic magnetic material, thereby providing a small-sized antenna structure at a limited cost. A high sense of value allows the corresponding communication module to perform better.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
100‧‧‧通訊模組 100‧‧‧Communication module
102‧‧‧第一陶瓷體層 102‧‧‧First ceramic body layer
103‧‧‧連接電極 103‧‧‧Connecting electrode
104‧‧‧第一焊墊電極 104‧‧‧First pad electrode
106‧‧‧第一饋入焊墊電極 106‧‧‧First feed pad electrode
108‧‧‧第二饋入焊墊電極 108‧‧‧Second feed pad electrode
110‧‧‧虛設電極 110‧‧‧Dummy electrode
112‧‧‧第一中間陶瓷體層 112‧‧‧First intermediate ceramic body layer
113‧‧‧第二中間陶瓷體層 113‧‧‧Second intermediate ceramic body layer
114‧‧‧第一通孔導體 114‧‧‧First via conductor
115‧‧‧第三中間陶瓷體層 115‧‧‧ Third intermediate ceramic body layer
116‧‧‧第一線狀導體 116‧‧‧First linear conductor
118‧‧‧磁芯結構 118‧‧‧Magnetic core structure
120‧‧‧圈導體圖案 120‧‧‧Circle conductor pattern
122‧‧‧下陶瓷體層 122‧‧‧ lower ceramic layer
124‧‧‧中陶瓷體層 124‧‧‧Chinese ceramic body layer
126‧‧‧上陶瓷體層 126‧‧‧Upper ceramic body layer
128‧‧‧第二中間陶瓷體層 128‧‧‧Second intermediate ceramic body layer
129‧‧‧第五中間陶瓷體層 129‧‧‧The fifth intermediate ceramic layer
132‧‧‧第二線狀導體 132‧‧‧Second wire conductor
133‧‧‧第二通孔導體 133‧‧‧Second via conductor
134‧‧‧第二陶瓷體層 134‧‧‧Second ceramic body layer
135‧‧‧第三通孔導體 135‧‧‧ third via conductor
136‧‧‧積體電路晶片 136‧‧‧Integrated circuit chip
137‧‧‧第四通孔導體 137‧‧‧4th via conductor
138‧‧‧第二焊墊電極 138‧‧‧Second pad electrode
139‧‧‧第五通孔導體 139‧‧‧5th via hole conductor
140‧‧‧導線 140‧‧‧Wire
142‧‧‧接合墊 142‧‧‧ Bonding mat
圖1顯示本發明一實施例通訊模組的立體分解示意圖。 FIG. 1 is a perspective exploded view of a communication module according to an embodiment of the invention.
圖2顯示本發明一實施例通訊模組另一視角的立體分解示意圖。 2 is a perspective exploded view showing another perspective of a communication module according to an embodiment of the present invention.
圖3顯示本發明一實施例通訊模組底部表面之平面圖。 3 is a plan view showing a bottom surface of a communication module in accordance with an embodiment of the present invention.
圖4顯示本發明一實施例通訊模組頂部表面之平面圖。 4 is a plan view showing a top surface of a communication module in accordance with an embodiment of the present invention.
圖5顯示本發明一實施例通訊模組的剖面示意圖。 FIG. 5 is a cross-sectional view showing a communication module according to an embodiment of the present invention.
以下是藉由特定的具體實例來說明本發明所揭露有關“通訊模組”的實施方式,以下的實施方式將進一步詳細說明本發明的相關技術內容,但所揭示的內容並非用以限制本發明的技術範疇。 The following is a specific example to illustrate the implementation of the "communication module" disclosed in the present invention. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the present invention. Technical category.
圖1顯示本發明一實施例通訊模組的立體分解示意圖,圖2顯示本發明一實施例通訊模組另一視角的立體分解示意圖。更詳細來說,圖1之視角顯示出本實施例通訊模組各層之上表面及位於上表面上的單元,圖2之視角顯示出本實施例通訊模組各層之下表面及位於下表面上的單元。請參照圖1和圖2,且一併請參照圖3,其中圖3顯示本實施例通訊模組底部表面之平面圖,本實施例提供一種通訊模組100(或稱為用於無線通訊之感應系統),其包括一第一陶瓷體層102,第一陶瓷體層102之一下表面上設置數個第一焊墊電極104,其中第一焊墊電極104包括一第一饋入焊墊電極106、一第二饋入焊墊電極108、數個虛設(dummy)電極110和數個連接電極103。第一饋入焊墊電極106和第二饋入焊墊電極108用作本實施例天線結構之饋入點。虛設電極110可以與其他電極電性連接或不連接,其可用作散熱用。連接電極103用作與通訊模組之頂部表面的第二焊墊電極電性連接,以下將會更詳細描述。在本發明一實施例中,第一陶磁體層102上設置有數條導線,且部分上述導線與第一焊墊電極電性連接。 1 is a perspective exploded view of a communication module according to an embodiment of the present invention. FIG. 2 is a perspective exploded view showing another perspective of a communication module according to an embodiment of the present invention. In more detail, the perspective of FIG. 1 shows the upper surface of each layer of the communication module of the embodiment and the unit on the upper surface. The viewing angle of FIG. 2 shows the lower surface of each layer of the communication module of the embodiment and the lower surface. Unit. Please refer to FIG. 1 and FIG. 2, and please refer to FIG. 3 together. FIG. 3 is a plan view showing the bottom surface of the communication module of the embodiment. This embodiment provides a communication module 100 (or a sensor for wireless communication). The system includes a first ceramic body layer 102, and a plurality of first pad electrodes 104 are disposed on a lower surface of the first ceramic body layer 102. The first pad electrode 104 includes a first feed pad electrode 106 and a first The second feeds into the pad electrode 108, a plurality of dummy electrodes 110, and a plurality of connection electrodes 103. The first feed pad electrode 106 and the second feed pad electrode 108 serve as feed points for the antenna structure of the present embodiment. The dummy electrode 110 may or may not be electrically connected to other electrodes, and may be used for heat dissipation. The connection electrode 103 serves as a second connection to the second pad electrode of the top surface of the communication module, as will be described in more detail below. In an embodiment of the invention, the first ceramic layer 102 is provided with a plurality of wires, and a portion of the wires are electrically connected to the first pad electrodes.
如圖2和圖3所示,在本實施例中,第一饋入焊墊電極106位於第一陶瓷體層102之左下角,而第二饋入焊墊電極108位於 第一陶瓷體層之102右下角,虛設電極110位於第一陶瓷體層102之中央,且連接電極103設置於第一陶瓷體層102之兩側位置。 然而,本發明不限定第一饋入焊墊電極106、第二饋入焊墊電極108、虛設電極110和連接電極103於第一陶瓷體層102之位置,其可依產品之規格和製程之需求改變。此外,本發明不限定第一焊墊電極104之數量,其可視需要變更。第一陶瓷體層102可以為例如鐵氧體之材料之磁性材料組成。更詳細來說,第一陶瓷體層102可以為低溫共燒陶瓷材料,其使用網版印刷形成上述第一焊墊電極104,之後進行烘烤製程。 As shown in FIG. 2 and FIG. 3, in the present embodiment, the first feed pad electrode 106 is located at the lower left corner of the first ceramic body layer 102, and the second feed pad electrode 108 is located. In the lower right corner of the first ceramic body layer 102, the dummy electrode 110 is located at the center of the first ceramic body layer 102, and the connection electrode 103 is disposed at two sides of the first ceramic body layer 102. However, the present invention does not limit the position of the first feed pad electrode 106, the second feed pad electrode 108, the dummy electrode 110, and the connection electrode 103 to the first ceramic body layer 102, which may be in accordance with product specifications and process requirements. change. Furthermore, the present invention does not limit the number of first pad electrodes 104, which may be changed as needed. The first ceramic body layer 102 may be composed of a magnetic material such as a material of ferrite. In more detail, the first ceramic body layer 102 may be a low temperature co-fired ceramic material which is formed by screen printing to form the first pad electrode 104 described above, followed by a baking process.
為了使得第一陶瓷體層102之下表面上的第一焊墊電極104可與其上的結構電性連接,第一陶瓷體層102中可更包括數個通孔導體,其貫穿第一陶瓷體層102之上表面及下表面,為簡潔,第一陶瓷體層102中的通孔導體並未於圖式中繪示。 In order to make the first pad electrode 104 on the lower surface of the first ceramic body layer 102 electrically connectable to the structure thereon, the first ceramic body layer 102 may further include a plurality of via conductors penetrating through the first ceramic body layer 102. The upper surface and the lower surface are concise, and the via conductors in the first ceramic body layer 102 are not shown in the drawings.
一第一中間陶瓷體層112設置於第一陶瓷體層102上,同樣的,第一中間陶瓷體層112可以為例如鐵氧體之材料之磁性材料或非磁性材料組成。更詳細來說,第一中間陶瓷體層112可以為低溫共燒陶瓷材料。為了使第一中間陶瓷體層112上方之結構可與第一中間陶瓷體層112下方之電極電性連接,可於第一中間陶瓷體層112中形成數個第一通孔導體114,其貫穿第一中間陶瓷體層112之上表面和下表面。一第二中間陶瓷體層113設置於第二陶瓷體層112上,第二中間陶瓷體層113中設有數個第一線狀導體116和數個第二通孔導體133。一第三中間陶瓷體層115設置於第二陶瓷體層113上,第三中間陶瓷體層115中設有數個數個第三通孔導體135。 A first intermediate ceramic body layer 112 is disposed on the first ceramic body layer 102. Similarly, the first intermediate ceramic body layer 112 may be composed of a magnetic material such as a ferrite material or a non-magnetic material. In more detail, the first intermediate ceramic body layer 112 may be a low temperature co-fired ceramic material. In order to make the structure above the first intermediate ceramic body layer 112 electrically connectable to the electrode under the first intermediate ceramic body layer 112, a plurality of first via conductors 114 may be formed in the first intermediate ceramic body layer 112, which penetrate through the first middle The upper surface and the lower surface of the ceramic body layer 112. A second intermediate ceramic layer 113 is disposed on the second ceramic body layer 112. The second intermediate ceramic layer 113 is provided with a plurality of first linear conductors 116 and a plurality of second via conductors 133. A third intermediate ceramic body layer 115 is disposed on the second ceramic body layer 113, and a plurality of third via hole conductors 135 are disposed in the third intermediate ceramic body layer 115.
一包括至少一線圈導體圖案120之磁芯結構118設置於第三陶瓷體層115上方。在本實施例中,磁芯結構118包括三個陶瓷體層,例如圖1和圖2所示之下陶瓷體層122、中陶瓷體層124和上陶瓷體層126,其中磁芯結構118之線圈導體圖案120包括設置於 下陶瓷體層122、中陶瓷體層124和上陶瓷體層126中的數個通孔導體和線狀導體。更詳細來說,本實施例之磁芯結構118的下陶瓷體層122中形成有數個通孔導體和線狀導體,中陶瓷體層124中形成通孔導體,上陶瓷體層126中形成有數個通孔導體和線狀導體,藉由上述導電單元形成一線圈導體圖案120。然而,可以理解的是,本實施例的線圈導體圖案120僅為示意,其可以各種的方式圍繞成線圈導體圖案,本發明不特別限定線圈導體圖案的形狀和樣式。磁芯結構118之各陶瓷體層122、124、126可以為例如鐵氧體之材料之磁性材料組成,更詳細來說,磁芯結構118之各陶瓷體層122、124、126可以為低溫共燒陶瓷材料。 A core structure 118 including at least one coil conductor pattern 120 is disposed over the third ceramic body layer 115. In the present embodiment, the core structure 118 includes three ceramic body layers, such as the ceramic body layer 122, the intermediate ceramic body layer 124, and the upper ceramic body layer 126 shown in FIGS. 1 and 2, wherein the coil conductor pattern 120 of the core structure 118 Included in A plurality of via conductors and linear conductors in the lower ceramic body layer 122, the middle ceramic body layer 124, and the upper ceramic body layer 126. In more detail, a plurality of via-hole conductors and linear conductors are formed in the lower ceramic body layer 122 of the core structure 118 of the present embodiment, and via-hole conductors are formed in the middle ceramic body layer 124, and a plurality of through-holes are formed in the upper ceramic body layer 126. The conductor and the linear conductor form a coil conductor pattern 120 by the above-mentioned conductive unit. However, it is to be understood that the coil conductor pattern 120 of the present embodiment is merely illustrative, and may be surrounded by a coil conductor pattern in various manners, and the shape and pattern of the coil conductor pattern are not particularly limited in the present invention. Each of the ceramic body layers 122, 124, 126 of the core structure 118 may be composed of a magnetic material such as a ferrite material. In more detail, each of the ceramic body layers 122, 124, 126 of the core structure 118 may be a low temperature co-fired ceramic. material.
一第四中間陶瓷體層128設置於磁芯結構118上,第四中間陶瓷體層128可以為例如鐵氧體之材料之磁性材料組成,更詳細來說,第四中間陶瓷體層128以為低溫共燒陶瓷材料。第四中間陶瓷體層128中可形成數個第四通孔導體137,其貫穿第四中間陶瓷體層128之上表面和下表面,且第四中間陶瓷體層128上表面可形成有數個第二線狀導體132。一第五中間陶瓷體層129設置於第四中間陶瓷體層128上,第五中間陶瓷體層129中可形成數個第五通孔導體139。 A fourth intermediate ceramic body layer 128 is disposed on the magnetic core structure 118, and the fourth intermediate ceramic body layer 128 may be composed of a magnetic material such as a ferrite material. More specifically, the fourth intermediate ceramic body layer 128 is a low temperature co-fired ceramic. material. A plurality of fourth via conductors 137 may be formed in the fourth intermediate ceramic body layer 128, which penetrate the upper surface and the lower surface of the fourth intermediate ceramic body layer 128, and the upper surface of the fourth intermediate ceramic body layer 128 may be formed with a plurality of second lines. Conductor 132. A fifth intermediate ceramic body layer 129 is disposed on the fourth intermediate ceramic body layer 128, and a plurality of fifth via hole conductors 139 may be formed in the fifth intermediate ceramic body layer 129.
一第二陶瓷體層134置於第五中間陶瓷體層129上。請參照圖1和圖4,其中圖4顯示本實施例通訊模組頂部表面之平面圖,第二陶瓷體層134之上表面形成數個第二焊墊電極138,且第二陶瓷體層134上形成有數個導線140和通孔導體,其中通孔導體貫穿第二陶瓷體層134之上表面和下表面,且通孔導體可位於第二焊墊電極138下,使得第二焊墊電極138可與其下之導電單元電性連接。為簡潔,第二陶瓷體層134中的通孔導體未於圖式中繪示。 A second ceramic body layer 134 is placed over the fifth intermediate ceramic body layer 129. Referring to FIG. 1 and FIG. 4, FIG. 4 is a plan view showing a top surface of the communication module of the embodiment. A plurality of second pad electrodes 138 are formed on the upper surface of the second ceramic body layer 134, and a plurality of second ceramic body layers 134 are formed on the second ceramic body layer 134. a wire 140 and a via conductor, wherein the via conductor extends through the upper surface and the lower surface of the second ceramic body layer 134, and the via conductor can be located under the second pad electrode 138 such that the second pad electrode 138 can be placed therewith The conductive unit is electrically connected. For the sake of brevity, the via conductors in the second ceramic body layer 134 are not shown in the drawings.
在本實施例中,磁芯結構之陶瓷體層(例如包括下陶瓷體層122、中陶瓷體層124和上陶瓷體層126)具有一第一導磁率,第一陶瓷體層102、第一中間陶瓷體層112、第二中間陶瓷體層128和 第二陶瓷體層134各具有第二導磁率,第一導磁率高於或等於第二導磁率。換言之,磁芯結構118之陶瓷體層122、124、126採用高導磁係數材料,而第一陶瓷體層102、第一中間陶瓷體層112、第二中間陶瓷體磁128和第二陶瓷體層134採用導磁係數相對較低的材料,且天線的電路結構設置於高導磁係數材料之陶瓷體層122、124、126中,藉此使得本實施例通訊模組可在有限的成本下,增加天線電感值(inductance value)。 In this embodiment, the ceramic body layer of the core structure (for example, the lower ceramic body layer 122, the middle ceramic body layer 124, and the upper ceramic body layer 126) has a first magnetic permeability, the first ceramic body layer 102, the first intermediate ceramic body layer 112, a second intermediate ceramic body layer 128 and The second ceramic body layers 134 each have a second magnetic permeability, and the first magnetic permeability is higher than or equal to the second magnetic permeability. In other words, the ceramic body layers 122, 124, 126 of the core structure 118 are made of a high permeability material, and the first ceramic body layer 102, the first intermediate ceramic body layer 112, the second intermediate ceramic body 128, and the second ceramic body layer 134 are guided. a material having a relatively low magnetic coefficient, and the circuit structure of the antenna is disposed in the ceramic body layers 122, 124, and 126 of the high magnetic permeability material, thereby enabling the communication module of the embodiment to increase the antenna inductance value at a limited cost. (inductance value).
圖5顯示本實施例通訊模組的剖面示意圖。如圖5所示,本實施例將小型化天線與電路佈局製作於導磁性材料內,搭配積體電路晶片136後,可大幅縮小通訊模組尺寸。更詳細來說,本實施例1將積體電路晶片136之接合墊142接合第二陶瓷體層134上之部分第二焊墊電極138,且於第二陶瓷體層134上形成數條導線140,以進行電路佈局,其中部分的導線140連接第二焊墊電極138,使部份第二焊墊電極138經由上述導線140,電性連接磁芯結構118下方之第一陶瓷體層102下表面上的連接電極103(部分之第一焊墊電極104)。較佳者,積體電路晶片136位於第二陶瓷體層134上,且積體電路晶片136之接合墊142固接於部分之第二焊墊電極138。此外,如圖5所示,第一饋入焊墊電極106與第二饋入焊墊電極108電性連接磁芯結構118之線圈狀導體圖案120。連接電極103電性連接第二陶瓷體層134上之導線140,且經由導線140電性連接第二焊墊電極138及其上之積體電路晶片136。然而,可以理解的是,本實施例圖5之積體電路晶片136、第一焊墊電極104和第二焊墊電極138之排設僅為示意,本發明不限定於此排設方式,其可依產品的規格改變。值得注意的是,本實施例將天線結構和積體電路晶片整合於同一模組內,且在天線結構最頂部之陶瓷體層的上表面及/或下表面進行電路佈局,使得通訊模組之空間可有效的利用,藉以縮小通訊模組之尺寸。 FIG. 5 is a cross-sectional view showing the communication module of the embodiment. As shown in FIG. 5, in this embodiment, the miniaturized antenna and the circuit layout are fabricated in the magnetic conductive material, and the integrated circuit chip 136 can be used to greatly reduce the size of the communication module. In more detail, in the first embodiment, the bonding pad 142 of the integrated circuit wafer 136 is bonded to a portion of the second pad electrode 138 on the second ceramic body layer 134, and a plurality of wires 140 are formed on the second ceramic body layer 134. A circuit layout is performed, in which a portion of the wires 140 are connected to the second pad electrode 138, and a portion of the second pad electrode 138 is electrically connected to the lower surface of the first ceramic body layer 102 under the core structure 118 via the wire 140. Electrode 103 (partial first pad electrode 104). Preferably, the integrated circuit wafer 136 is located on the second ceramic body layer 134, and the bonding pads 142 of the integrated circuit wafer 136 are fixed to a portion of the second pad electrode 138. In addition, as shown in FIG. 5 , the first feed pad electrode 106 and the second feed pad electrode 108 are electrically connected to the coiled conductor pattern 120 of the core structure 118 . The connecting electrode 103 is electrically connected to the wire 140 on the second ceramic body layer 134, and is electrically connected to the second pad electrode 138 and the integrated circuit chip 136 thereon via the wire 140. However, it can be understood that the arrangement of the integrated circuit wafer 136, the first pad electrode 104 and the second pad electrode 138 of FIG. 5 of the present embodiment is merely illustrative, and the present invention is not limited to this arrangement. Can be changed according to the specifications of the product. It should be noted that, in this embodiment, the antenna structure and the integrated circuit chip are integrated into the same module, and the circuit layout is performed on the upper surface and/or the lower surface of the ceramic body layer at the top of the antenna structure, so that the space of the communication module is made. Can be effectively utilized to reduce the size of the communication module.
根據上述實施例,本發明具有以下技術功效: According to the above embodiment, the present invention has the following technical effects:
1、本發明之實施例將積體電路晶片接合於通訊模組之天線結構位於頂部之第二陶瓷體層上,並於第二陶瓷體層上進行相關的電路佈局。換言之,本發明之通訊模組於模組內包括整合在一起之積體電路晶片和天線結構,藉此可大幅度減少通訊模組的尺寸,使其可廣泛的應用於穿戴式產品中。 1. An embodiment of the present invention bonds an integrated circuit die to an antenna structure of a communication module on a second ceramic body layer at the top, and performs an associated circuit layout on the second ceramic body layer. In other words, the communication module of the present invention includes an integrated circuit chip and an antenna structure integrated in the module, thereby greatly reducing the size of the communication module and making it widely applicable to wearable products.
2、本發明實施例的磁芯結構之陶瓷體層採用高導磁率材料,外部之陶瓷體層採用導磁率相對較低的材料或非導磁材料,藉此在有限的成本下提供小尺寸天線結構足夠高的感值,藉以使得對應的通訊模組有較佳的表現。 2. The ceramic body layer of the magnetic core structure of the embodiment of the invention adopts a high magnetic permeability material, and the outer ceramic body layer uses a material with a relatively low magnetic permeability or a non-magnetic magnetic material, thereby providing a small-sized antenna structure at a limited cost. A high sense of value allows the corresponding communication module to perform better.
以上所述僅為本發明的較佳可行實施例,非因此侷限本發明的專利範圍,故舉凡運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的保護範圍內。 The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .
100‧‧‧通訊模組 100‧‧‧Communication module
102‧‧‧第一陶瓷體層 102‧‧‧First ceramic body layer
103‧‧‧連接電極 103‧‧‧Connecting electrode
104‧‧‧第一焊墊電極 104‧‧‧First pad electrode
106‧‧‧第一饋入焊墊電極 106‧‧‧First feed pad electrode
108‧‧‧第二饋入焊墊電極 108‧‧‧Second feed pad electrode
110‧‧‧虛設電極 110‧‧‧Dummy electrode
118‧‧‧磁芯結構 118‧‧‧Magnetic core structure
120‧‧‧圈導體圖案 120‧‧‧Circle conductor pattern
134‧‧‧第二陶瓷體層 134‧‧‧Second ceramic body layer
136‧‧‧積體電路晶片 136‧‧‧Integrated circuit chip
138‧‧‧第二焊墊電極 138‧‧‧Second pad electrode
140‧‧‧導線 140‧‧‧Wire
142‧‧‧接合墊 142‧‧‧ Bonding mat
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