CN106207383A - Communications module - Google Patents
Communications module Download PDFInfo
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- CN106207383A CN106207383A CN201510226508.8A CN201510226508A CN106207383A CN 106207383 A CN106207383 A CN 106207383A CN 201510226508 A CN201510226508 A CN 201510226508A CN 106207383 A CN106207383 A CN 106207383A
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- ceramic body
- body layer
- pad electrode
- core structure
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Abstract
The embodiment of the invention discloses a kind of communications module, it includes a core structure, the first and second ceramic body layers being arranged at core structure opposite sides and at least one IC chip.Core structure includes a coil conductor pattern.First ceramic body layer includes that multiple first pad electrode, the second ceramic body layer include multiple second pad electrode.First pad electrode includes one first feed-in pad electrode, one second feed-in pad electrode and multiple illusory pad electrode, and the first feed-in pad electrode and the second feed-in pad electrode are electrically connected with the coil conductor pattern of core structure.IC chip is arranged on the second ceramic body layer, and wherein IC chip includes at least one joint sheet, and it engages with above-mentioned second pad electrode of part.The technical scheme of the embodiment of the present invention can significantly reduce communication module group size so that it is can be widely used in Wearable product.
Description
Technical field
The present invention is related to a kind of communications module, and in particular to a kind of sense for radio communication
Answer system.
Background technology
Mobile phone or any kind of mobile communications device, it has also become the outfit that modern carries with.With
Major function toward mobile communications device is only limitted to call, send the masses such as news in brief or wireless Internet access
Known function.But, along with the progress of science and technology, and owing to mobile phone is easy to carry, industry
Have started to imagination and some is met Function Integration Mechanism needed for daily life to mobile phone, the most contactless
Smart card.So-called contactless smart card, is and makes to set through in-plant induction mode
The chip put in card plays a role.Daily life is applied the occasion of contact type intelligent card at present
The most, such as adopt PayPass TM and VISA WAVE specification non-contact credit card,
The EasyCard of mass transportation systems, the icash card of 7-11, have ID identify function access card with
Member card etc..Above-mentioned smart card can provide user many in terms of daily life conveniently to take
Business, therefore dealer the most actively researches and develops and the above-mentioned intelligent card function with various uses is incorporated into everybody
On the mobile phone that will carry with, allow and originally many also can bring and swipe the card, make for listening to the mobile phone of phone
For stored value card, take mass transportation systems or identify identity.
The above-mentioned mobile phone possessing near-field communication technology function, its internal generally installing includes near-field communication sky
Line (NFC antenna) and relevant IC chip.It is well known, however, that the near-field communication of communications module
Antenna and IC chip system are provided separately, and the most therefore occupy sizable area.Move now
Under the trend of dynamic communication products miniaturization, near-field communication module is also required to reduce its size.Therefore,
How near field communications module miniaturization is become the important topic that this cause personage to be solved.
Summary of the invention
In view of the above problems, one embodiment of the invention provides a kind of communications module, comprising: a magnetic
Cored structure, it includes at least one coil conductor pattern；One first ceramic body layer and one second ceramic body layer,
Laying respectively at the opposite sides of core structure, wherein the first ceramic body layer includes multiple first weld pad electricity
Pole, the second ceramic body layer includes multiple second pad electrode, and wherein the first pad electrode includes one first
Feed-in pad electrode, one second feed-in pad electrode and multiple illusory pad electrode, and the first feed-in weldering
Pad electrode and the second feed-in pad electrode are electrically connected with the coil conductor pattern of core structure；And at least one
IC chip, it is arranged on the second ceramic body layer, and wherein IC chip includes at least one
Joint sheet, it engages with above-mentioned second pad electrode of part.
In one embodiment of the invention, described communications module also includes at least one first middle ceramic body layer
At least one second middle ceramic body layer, this at least one first middle ceramic body layer is positioned at this core structure
With this first ceramic body interlayer, this at least one second middle ceramic body layer be positioned at this core structure with this
Two ceramic body interlayers.
In one embodiment of the invention, this second ceramic body layer is provided with a plurality of wire, and part institute
State multiple wire to be electrically connected with the plurality of second pad electrode, wherein this first ceramic magnet layer sets
The plurality of wire of part being equipped with in a plurality of wire, and the first ceramic magnet layer and the plurality of first weldering
Pad electrode is electrically connected with, wherein leading on intraphase conductor and the second ceramic magnet layer in the middle part of this first ceramic magnet layer
Line is electrically connected with.
In one embodiment of the invention, this core structure includes multiple ceramic body layer, this core structure
Coil conductor pattern is positioned in the plurality of ceramic body layer, and this coil conductor pattern includes multiple through hole
Conductor and a plurality of linear conductor.
In one embodiment of the invention, the plurality of first pad electrode still includes multiple connection electrode,
And the joint sheet of the plurality of connection electrode and this at least one IC chip is electrically connected with.
In one embodiment of the invention, this core structure includes multiple ceramic body layer, this core structure
Ceramic body layer respectively has one first permeability, and this first ceramic body layer and this second ceramic body layer respectively have
One second permeability, this first permeability is greater than or equal to this second permeability.
In one embodiment of the invention, the ceramic body layer of this core structure is low-temperature co-burning ceramic material.
One embodiment of the invention provides a kind of communications module, including: an antenna structure, it includes one
Core structure, one first ceramic body layer and one second magnetic ceramic body layer, wherein the first ceramic body layer and
Two ceramic body layers lay respectively at the opposite sides of core structure, and the first ceramic body layer includes multiple
One pad electrode, the second ceramic body layer includes multiple second pad electrode；And at least one integrated circuit
Chip, it includes multiple joint sheet, is engaged on the second ceramic body layer the second pad electrode of correspondence.
In one embodiment of the invention, this second ceramic body layer is provided with a plurality of wire, its connecting portion
Divide the plurality of second pad electrode.
In one embodiment of the invention, this core structure includes multiple ceramic body layer, this core structure
Ceramic body layer respectively has one first permeability, and this first ceramic body layer and this second ceramic body layer respectively have
Second permeability, this first permeability is greater than or equal to this second permeability.
Miniature antenna and circuit layout are made in magnetic conductive material by the embodiment of the present invention, collocation collection
After becoming circuit chip, can significantly reduce communications module size so that it is Wearable can be widely used in and produce
In product.Additionally, the ceramic body layer of the core structure of the embodiment of the present invention uses high permeability materials, outward
The ceramic body layer in portion uses the relatively low material of permeability or non-magnet material, thereby at limited one-tenth
This lower offer sufficiently high inductance value of small-sized antenna structure, uses so that corresponding communications module has preferably
Performance.
It is further understood that inventive feature and technology contents for enabling, refers to below in connection with this
Bright detailed description and accompanying drawing, but appended accompanying drawing only provides reference and explanation use, is not used for this
The invention person of being any limitation as.
Accompanying drawing explanation
Fig. 1 shows the perspective exploded view of one embodiment of the invention communications module；
Fig. 2 shows the perspective exploded view at another visual angle of one embodiment of the invention communications module；
Fig. 3 shows the plane graph of one embodiment of the invention communications module lower surface；
Fig. 4 shows the plane graph of one embodiment of the invention communications module top surface；
Fig. 5 shows the generalized section of one embodiment of the invention communications module.
Wherein, description of reference numerals is as follows:
100: communications module
102: the first ceramic body layers
103: connect electrode
104: the first pad electrode
106: the first feed-in pad electrode
108: the second feed-in pad electrode
110: dummy electrode
112: the first middle ceramic body layers
113: the second middle ceramic body layers
114: the first via conductors
115: the three middle ceramic body layers
116: the first linear conductors
118: core structure
120: circle conductive pattern
122: lower ceramic body layer
124: middle ceramic body layer
126: upper ceramic body layer
128: the second middle ceramic body layers
129: the five middle ceramic body layers
132: the second linear conductors
133: the second via conductors
134: the second ceramic body layers
135: third through-hole conductor
136: IC chip
137: fourth hole conductor
138: the second pad electrode
139: fifth hole conductor
140: wire
142: joint sheet
Detailed description of the invention
The following is and illustrate to disclosed herein relevant " communications module " by specific instantiation
Embodiment, following embodiment will be explained in further detail the correlation technique content of the present invention, but
Disclosed content is also not used to limit the technology category of the present invention.
Fig. 1 shows the perspective exploded view of one embodiment of the invention communications module, and Fig. 2 shows this
The perspective exploded view at bright another visual angle of embodiment communications module.In more detail, the regarding of Fig. 1
Upper surface that angle demonstrates each layer of the present embodiment communications module and the unit being positioned on upper surface, Fig. 2's
Lower surface that visual angle demonstrates each layer of the present embodiment communications module and the unit being positioned on lower surface.Please join
According to Fig. 1 and Fig. 2, and refer to Fig. 3 in the lump, wherein Fig. 3 shows bottom the present embodiment communications module
The plane graph on surface, the present embodiment provides a kind of communications module 100 (or to be referred to as the sense for radio communication
Answer system), it includes one first ceramic body layer 102, and a lower surface of the first ceramic body layer 102 sets
Putting multiple first pad electrode 104, wherein the first pad electrode 104 includes one first feed-in weld pad electricity
Pole 106,1 second feed-in pad electrode 108, multiple illusory (dummy) electrode 110 and multiple company
Receiving electrode 103.First feed-in pad electrode 106 and the second feed-in pad electrode 108 are used as this enforcement
The load point of example antenna structure.Dummy electrode 110 can be electrically connected with other electrodes or be not connected to,
It can be used as heat transmission.Connect electrode 103 and be used as the second weld pad electricity of the top surface with communications module
Pole is electrically connected with, and below will be described in more detail.In an embodiment of the present invention, the first ceramic magnet layer
It is provided with a plurality of wire on 102, and the above-mentioned wire of part and the first pad electrode are electrically connected with.
As shown in Figures 2 and 3, in the present embodiment, the first feed-in pad electrode 106 is positioned at first
The lower left corner of ceramic body layer 102, and the second feed-in pad electrode 108 is positioned at the first ceramic body layer
102 lower right corner, dummy electrode 110 is positioned at the central authorities of the first ceramic body layer 102, and connects electrode 103
It is arranged at two side positions of the first ceramic body layer 102.But, the present invention does not limit the first feed-in weld pad
Electrode the 106, second feed-in pad electrode 108, dummy electrode 110 and connection electrode 103 are in first
The position of ceramic body layer 102, it can change according to the demand of the specification of product and technique.Additionally, this
The bright quantity not limiting the first pad electrode 104, it can optionally change.First ceramic body layer 102
It can be the magnetic material composition of the most ferritic material.In more detail, the first ceramic body layer
102 can be low-temperature co-burning ceramic material, and it uses screen painting to form above-mentioned first pad electrode
104, carry out baking process afterwards.
So that the first pad electrode 104 on the lower surface of the first ceramic body layer 102 can with on it
Structure be electrically connected with, the first ceramic body layer 102 can also include multiple via conductors, it runs through the
The upper surface of one ceramic body layer 102 and lower surface, for succinctly, the through hole in the first ceramic body layer 102
Conductor is not in shown in accompanying drawing.
One first middle ceramic body layer 112 is arranged on the first ceramic body layer 102, same, and first
Middle ceramic body layer 112 can be magnetic material or the nonmagnetic substance group of the most ferritic material
Become.In more detail, the first middle ceramic body layer 112 can be low-temperature co-burning ceramic material.In order to
Make the structure above the first middle ceramic body layer 112 can with the first middle ceramic body layer 112 below electricity
Pole is electrically connected with, and can form multiple first via conductors 114 in the first middle ceramic body layer 112,
It runs through the upper and lower surface of the first middle ceramic body layer 112.One second middle ceramic body layer
113 are arranged on the second ceramic body layer 112, are provided with multiple first in the second middle ceramic body layer 113
Linear conductor 116 and multiple second via conductors 133.One the 3rd middle ceramic body layer 115 is arranged at
On second ceramic body layer 113, the 3rd middle ceramic body layer 115 is provided with multiple third through-hole conductor
135。
One includes that the core structure 118 of at least one coil conductor pattern 120 is arranged at the 3rd ceramic body layer
Above in the of 115.In the present embodiment, core structure 118 includes three ceramic body layers, such as Fig. 1 and
Lower ceramic body layer 122 shown in Fig. 2, middle ceramic body layer 124 and upper ceramic body layer 126, wherein magnetic
The coil conductor pattern 120 of cored structure 118 includes being arranged at lower ceramic body layer 122, middle ceramic body layer
124 and upper ceramic body layer 126 in multiple via conductors and linear conductor.In more detail, this reality
The lower ceramic body layer 122 of the core structure 118 executing example is formed with multiple via conductors and wire is led
Body, forms via conductors, is formed with multiple through hole in upper ceramic body layer 126 in middle ceramic body layer 124
Conductor and linear conductor, form a coil conductor pattern 120 by above-mentioned conductive unit.But, can
To be understood by, the coil conductor pattern 120 of the present embodiment is only signal, and they can be in the way of various
Surrounding into coil conductor pattern, the present invention is without particular limitation of the shape of coil conductor pattern and pattern.Magnetic
Each ceramic body layer 122,124,126 of cored structure 118 can be the magnetic of the most ferritic material
Material forms, and in more detail, each ceramic body layer 122,124,126 of core structure 118 is permissible
For low-temperature co-burning ceramic material.
One the 4th middle ceramic body layer 128 is arranged on core structure 118, the 4th middle ceramic body layer
128 can be the magnetic material composition of the most ferritic material, in more detail, pottery in the middle of the 4th
Porcelain body layer 128 thinks low-temperature co-burning ceramic material.4th middle ceramic body layer 128 can be formed multiple
Fourth hole conductor 137, it runs through the upper and lower surface of the 4th middle ceramic body layer 128, and
4th middle ceramic body layer 128 upper surface can be formed with multiple second linear conductor 132.In one the 5th
Between ceramic body layer 129 be arranged on the 4th middle ceramic body layer 128, the 5th middle ceramic body layer 129
In can form multiple fifth hole conductor 139.
One second ceramic body layer 134 is placed on the 5th middle ceramic body layer 129.Refer to Fig. 1 and Tu
4, wherein Fig. 4 shows the plane graph of the present embodiment communications module top surface, the second ceramic body layer 134
Upper surface form multiple second pad electrode 138, and be formed multiple on the second ceramic body layer 134
Wire 140 and via conductors, wherein via conductors run through the second ceramic body layer 134 upper surface and under
Surface, and via conductors can be located at the second pad electrode 138 times so that the second pad electrode 138 can
It is electrically connected with the conductive unit under it.For succinctly, the via conductors in the second ceramic body layer 134 is not
Shown in accompanying drawing.
In the present embodiment, the ceramic body layer of core structure (such as includes lower ceramic body layer 122, middle pottery
Porcelain body layer 124 and upper ceramic body layer 126) there is one first permeability, the first ceramic body layer 102,
One middle ceramic body layer the 112, second middle ceramic body layer 128 and the second ceramic body layer 134 respectively have
Second permeability, the first permeability is greater than or equal to the second permeability.In other words, core structure 118
Ceramic body layer 122,124,126 use high magnetic capacity material, and the first ceramic body layer 102,
First middle ceramic body layer the 112, second middle ceramic body magnetic 128 and the second ceramic body layer 134 use
The material that magnetic capacity is relatively low, and the circuit structure of antenna is arranged at the pottery of high magnetic capacity material
In porcelain body layer 122,124,126, thereby make the present embodiment communications module can under limited cost,
Increase antenna electric inductance value (inductance value).
Fig. 5 shows the generalized section of the present embodiment communications module.As it is shown in figure 5, the present embodiment will
Miniature antenna and circuit layout are made in magnetic conductive material, after collocation IC chip 136,
Can significantly reduce communications module size.In more detail, the present embodiment is by IC chip 136
Joint sheet 142 engages part the second pad electrode 138 on the second ceramic body layer 134, and in second
A plurality of wire 140 is formed on ceramic body layer 134, to carry out circuit layout, some of wires 140
Connect the second pad electrode 138, make part the second pad electrode 138 via above-mentioned wire 140, electricity
Property connect the connection electrode 103 (portion on the first ceramic body layer 102 lower surface below core structure 118
The first pad electrode 104 divided).Preferably, IC chip 136 is positioned at the second ceramic body layer
On 134, and the joint sheet 142 of IC chip 136 is fixed in the second pad electrode of part
138.Additionally, as it is shown in figure 5, the first feed-in pad electrode 106 and the second feed-in pad electrode 108
It is electrically connected with the coiled type conductive pattern 120 of core structure 118.Connect electrode 103 and be electrically connected with the
Wire 140 on two ceramic body layers 134, and it is electrically connected with the second pad electrode 138 via wire 140
And IC chip 136 thereon.It is understood, however, that the present embodiment Fig. 5's is integrated
The row of circuit chip the 136, first pad electrode 104 and the second pad electrode 138 sets and only illustrates,
The present invention is not limited to this row and sets mode, and it can change according to the specification of product.It should be noted that this
Antenna structure and IC chip are integrated in same module by embodiment, and push up most at antenna structure
Upper surface and/or the lower surface of the ceramic body layer in portion carry out circuit layout so that the space of communications module
Can effectively utilize, use the size reducing communications module.
According to above-described embodiment, the present invention has techniques below effect:
1, IC chip is engaged in the antenna structure of communications module and is positioned at by embodiments of the invention
On the second ceramic body layer at top, and on the second ceramic body layer, carry out the circuit layout being correlated with.Change speech
It, the communications module of the present invention includes IC chip and the antenna knot combined in module
Structure, thereby can be greatly reduced the size of communications module so that it is can be widely used in Wearable product
In.
2, the ceramic body layer of the core structure of the embodiment of the present invention uses high permeability materials, outside
Ceramic body layer uses the relatively low material of permeability or non-magnet material, thereby under limited cost
The sufficiently high inductance value of small-sized antenna structure is provided, uses so that corresponding communications module has preferably table
Existing.
The foregoing is only the preferable possible embodiments of the present invention, the non-patent model therefore limiting to the present invention
Enclose, therefore the equivalence techniques change such as using description of the invention and accompanying drawing content to be done, it is both contained in
In protection scope of the present invention.
Claims (10)
1. a communications module, it is characterised in that including:
One core structure, it includes a coil conductor pattern；
One first ceramic body layer and one second ceramic body layer, lay respectively at relative the two of this core structure
Side, wherein this first ceramic body layer includes multiple first pad electrode, and this second ceramic body layer includes many
Individual second pad electrode, wherein said multiple first pad electrode include one first feed-in pad electrode,
One second feed-in pad electrode and multiple illusory pad electrode, and this first feed-in pad electrode and this
Two feed-in pad electrode are electrically connected with the coil conductor pattern of this core structure；And
At least one IC chip, it is arranged on this second ceramic body layer, wherein this integrated circuit
Chip includes at least one joint sheet, and it engages with the plurality of second pad electrode of part.
2. communications module as claimed in claim 1, it is characterised in that described communications module is also wrapped
Including at least one first middle ceramic body layer and at least one second middle ceramic body layer, this is at least one first
Between ceramic body layer be positioned at this core structure and this first ceramic body interlayer, this pottery in the middle of at least one second
Body layer is positioned at this core structure and this second ceramic body interlayer.
3. communications module as claimed in claim 1, it is characterised in that on this second ceramic body layer
It is provided with a plurality of wire, and the plurality of wire of part electrically connects with the plurality of second pad electrode
Connect, the part institute being wherein provided with in a plurality of wire, and the first ceramic magnet layer in this first ceramic magnet layer
State multiple wire to be electrically connected with, wherein in the middle part of this first ceramic magnet layer with the plurality of first pad electrode
Wire on intraphase conductor and the second ceramic magnet layer is electrically connected with.
4. communications module as claimed in claim 1, it is characterised in that this core structure includes many
Individual ceramic body layer, the coil conductor pattern of this core structure is positioned in the plurality of ceramic body layer, and should
Coil conductor pattern includes multiple via conductors and a plurality of linear conductor.
5. communications module as claimed in claim 1, it is characterised in that the plurality of first weld pad
Electrode still includes multiple connection electrode, and the plurality of connection electrode and this at least one IC chip
Joint sheet be electrically connected with.
6. communications module as claimed in claim 1, it is characterised in that this core structure includes many
Individual ceramic body layer, the ceramic body layer of this core structure respectively has one first permeability, this first ceramic body
Layer and this second ceramic body layer respectively have one second permeability, this first permeability greater than or equal to this
Two permeabilities.
7. communications module as claimed in claim 6, it is characterised in that the pottery of this core structure
Body layer is low-temperature co-burning ceramic material.
8. a communications module, it is characterised in that including:
One antenna structure, it includes a core structure, one first ceramic body layer and one second ceramic body layer,
Wherein this first ceramic body layer and this second ceramic body layer lay respectively at the opposite sides of this core structure,
And this first ceramic body layer includes multiple first pad electrode, this second ceramic body layer includes multiple
Second pad electrode；And
At least one IC chip, it includes multiple joint sheet, is engaged on this second ceramic body layer
The second corresponding pad electrode.
9. communications module as claimed in claim 8, it is characterised in that on this second ceramic body layer
It is provided with a plurality of wire, the plurality of second pad electrode in its coupling part.
10. communications module as claimed in claim 8, it is characterised in that this core structure includes many
Individual ceramic body layer, the ceramic body layer of this core structure respectively has one first permeability, this first ceramic body
Layer and this second ceramic body layer respectively there is the second permeability, this first permeability greater than or equal to this second
Permeability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510226508.8A CN106207383A (en) | 2015-05-06 | 2015-05-06 | Communications module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510226508.8A CN106207383A (en) | 2015-05-06 | 2015-05-06 | Communications module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106207383A true CN106207383A (en) | 2016-12-07 |
Family
ID=57459116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510226508.8A Pending CN106207383A (en) | 2015-05-06 | 2015-05-06 | Communications module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106207383A (en) |
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| CN101960665A (en) * | 2008-03-26 | 2011-01-26 | 株式会社村田制作所 | Radio IC device |
| CN102668241A (en) * | 2010-03-24 | 2012-09-12 | 株式会社村田制作所 | Rfid system |
| CN103295056A (en) * | 2008-05-21 | 2013-09-11 | 株式会社村田制作所 | Wireless IC device |
| CN104081885A (en) * | 2012-12-26 | 2014-10-01 | 株式会社村田制作所 | Substrate with built-in component |
| CN104094292A (en) * | 2012-04-25 | 2014-10-08 | 株式会社村田制作所 | Wireless ic device and wireless communication terminal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1356861A (en) * | 2000-12-07 | 2002-07-03 | 财团法人工业技术研究院 | Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| CN101351817A (en) * | 2006-04-26 | 2009-01-21 | 株式会社村田制作所 | Article provided with electromagnetically coupled module |
| JP2008270778A (en) * | 2007-03-27 | 2008-11-06 | Ngk Spark Plug Co Ltd | Method of manufacturing wiring board with built-in component |
| US20090146314A1 (en) * | 2007-12-07 | 2009-06-11 | Shinko Electric Industries Co., Ltd. | Semiconductor Device |
| CN101960665A (en) * | 2008-03-26 | 2011-01-26 | 株式会社村田制作所 | Radio IC device |
| CN103295056A (en) * | 2008-05-21 | 2013-09-11 | 株式会社村田制作所 | Wireless IC device |
| CN102668241A (en) * | 2010-03-24 | 2012-09-12 | 株式会社村田制作所 | Rfid system |
| CN104094292A (en) * | 2012-04-25 | 2014-10-08 | 株式会社村田制作所 | Wireless ic device and wireless communication terminal |
| CN104081885A (en) * | 2012-12-26 | 2014-10-01 | 株式会社村田制作所 | Substrate with built-in component |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
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