TW201638283A - Active energy ray-curable adhesive composition for plastic film or sheet - Google Patents

Active energy ray-curable adhesive composition for plastic film or sheet Download PDF

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TW201638283A
TW201638283A TW105106463A TW105106463A TW201638283A TW 201638283 A TW201638283 A TW 201638283A TW 105106463 A TW105106463 A TW 105106463A TW 105106463 A TW105106463 A TW 105106463A TW 201638283 A TW201638283 A TW 201638283A
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component
weight
adhesive composition
active energy
energy ray
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TW105106463A
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TWI692515B (en
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Kazumasa Inata
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Toagosei Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/16Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive

Abstract

The present invention provides an active energy ray-curable adhesive composition for a plastic film, etc. The adhesive composition has low viscosity and superior curability, and whether the atmospheric humidity at the time of application and curing is low or high, the adhesive composition exhibits superior adhesion to films, etc. made of a variety of plastic materials, including (meth)acrylic resins, such as polymethyl methacrylate, and cycloolefin polymers, and also exhibits superior colorlessness and transparency. The present invention relates to an active energy ray-curable adhesive composition for a plastic film or sheet, the adhesive composition containing: ingredient (A), which is an aromatic epoxy compound having a weight-average molecular weight greater than or equal to 500; ingredient (B), which is a polyglycidyl ether of a polyol having two to ten carbon atoms; ingredient (C), which is a compound having two or more oxetanyl groups and having a molecular weight less than or equal to 500; and ingredient (D), which is a photocationic polymerization initiator. The contents of the ingredients (A) to (D) in the entire composition are: ingredient (A): 1 to 30 wt%; ingredient (B): 10 to 70 wt%; ingredient (C): 10 to 70 wt%; and ingredient (D): 0.5 to 10 wt%.

Description

塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物 Active energy ray-curable adhesive composition for plastic film or sheet

本發明係關於一種藉由紫外線、可見光、或電子束等活性能量射線之照射而可將各種塑膠製薄膜或片材接著之活性能量射線硬化型接著劑組成物,進而,適宜使用於液晶顯示器或有機電致發光(EL,Electroluminescence)顯示器等中所使用之各種光學薄膜或片材之製造,且可較佳地用於該等技術領域中。再者,於本說明書中,將丙烯酸酯及/或甲基丙烯酸酯表示為(甲基)丙烯酸酯,將丙烯醯基及/或甲基丙烯醯基表示為(甲基)丙烯醯基,將丙烯酸及/或甲基丙烯酸表示為(甲基)丙烯酸。又,於以下中,於無需特別明示之情形時,將塑膠製薄膜或片材彙總表示為「塑膠薄膜等」,並將薄膜或片材彙總表示為「薄膜等」。 The present invention relates to a composition of an active energy ray-curable adhesive which can be obtained by irradiating various plastic films or sheets by ultraviolet rays, visible light, or electron beam irradiation, etc., and further suitable for use in a liquid crystal display or The manufacture of various optical films or sheets used in organic electroluminescence (EL) displays and the like is preferably used in the fields of technology. In the present specification, acrylate and/or methacrylate are represented by (meth) acrylate, and propylene fluorenyl and/or methacryl fluorenyl are represented by (meth) acrylonitrile. Acrylic acid and/or methacrylic acid is represented by (meth)acrylic acid. In the following, the plastic film or sheet is collectively referred to as "plastic film or the like", and the film or sheet is collectively referred to as "film or the like".

習知,於將塑膠薄膜等薄層被接著體彼此貼合、或將塑膠薄膜等薄層被接著體與包含其與其他素材之薄層被接著體貼合之層壓法中,主要進行如下之乾式層壓法:將包含乙烯-乙酸乙烯酯共聚合體或聚胺基甲酸乙酯系聚合體之溶劑型接著劑組成物塗佈於第1薄層被接著體並使其乾燥後,藉由夾輥(nip roller)等對其壓合第2薄層被接著體。該方法中所使用之接著劑組成物,為了使組成物之塗佈量均一,一般為較多地包含溶劑者,因此於乾燥時會揮散大量溶劑蒸氣,毒性、作業安全性及環境污染性成為問題。 作為解決該等問題之接著劑組成物,正研究無溶劑系接著劑組成物。 Conventionally, in a lamination method in which a thin layer of a plastic film or the like is bonded to each other, or a thin layer of a plastic film or the like and a thin layer including the other material are bonded to the adherend, mainly as follows Dry lamination method: a solvent-based adhesive composition comprising an ethylene-vinyl acetate copolymer or a polyurethane polymer is applied to a first thin layer of a adherend and dried, and then sandwiched A second thin layer of the adherend is pressed against a nip roller or the like. In order to make the coating amount of the composition uniform, the binder composition used in this method generally contains a large amount of solvent. Therefore, a large amount of solvent vapor is volatilized during drying, and toxicity, work safety, and environmental pollution become problem. As a binder composition for solving such problems, a solventless adhesive composition is being studied.

作為無溶劑系接著劑組成物,正廣泛使用2液型接著劑組成物及藉由紫外線或電子束等活性能量射線進行硬化之接著劑組成物。作為2液型接著劑組成物,使用有主要以末端具有羥基之聚合物為主劑、以末端具有異氰酸酯基之聚異氰酸酯化合物為硬化劑之所謂聚胺基甲酸乙酯系接著劑組成物。然而,該組成物存在硬化需要較長時間之缺點。相對於此,活性能量射線硬化型接著劑組成物由於硬化速度較快,故而生產性優異,因此近年來被使用之情形正在增加。 As a solventless adhesive composition, a two-component adhesive composition and an adhesive composition which is cured by active energy rays such as ultraviolet rays or electron beams are widely used. As a two-component type adhesive composition, a so-called polyurethane-based adhesive composition mainly comprising a polymer having a hydroxyl group at its terminal as a main component and a polyisocyanate compound having an isocyanate group at its terminal as a curing agent is used. However, this composition has the disadvantage that it takes a long time to harden. On the other hand, since the active energy ray-curable adhesive composition has a high curing rate and is excellent in productivity, it has been used in recent years.

另一方面,液晶顯示器因薄型、輕量及省消耗電力等特長而被廣泛使用於行動電話、智慧型手機、及平板等行動設備。又,亦普及於個人電腦、電視、汽車導航系統之各種顯示器。又,以行動設備為中心,有機EL顯示器被使用之情形亦正在增加。活性能量射線硬化型接著劑亦被廣泛用於液晶顯示器或有機EL顯示器中所使用之各種光學薄膜等之貼合。 On the other hand, liquid crystal displays are widely used in mobile phones, smart phones, and tablet devices because of their thinness, light weight, and power consumption. In addition, it is also widely used in various displays of personal computers, televisions, and car navigation systems. In addition, the use of organic EL displays is also increasing around mobile devices. Active energy ray-curable adhesives are also widely used for bonding various optical films and the like used in liquid crystal displays or organic EL displays.

作為光學薄膜等,可列舉賦予有防指紋或防光眩等功能性之硬塗薄膜、觸控面板之前面板、偏光板、相位差薄膜、視野角補償薄膜、增亮薄膜、抗反射薄膜、防眩薄膜、透鏡片及擴散片等,該等使用有各種塑膠。 Examples of the optical film and the like include a hard coat film provided with functions such as anti-fingerprint or anti-glare, a front panel of a touch panel, a polarizing plate, a retardation film, a viewing angle compensation film, a brightness enhancement film, an antireflection film, and the like. A glare film, a lens sheet, a diffusion sheet, etc., which are used in various plastics.

該等塑膠中,非晶性之環烯烴聚合物及聚甲基丙烯酸甲酯由於無色透明性及光學等向性等光學特性特別優異,故而被廣泛使用。 Among these plastics, the amorphous cycloolefin polymer and polymethyl methacrylate are widely used because of their excellent optical properties such as colorless transparency and optical isotropic properties.

最近,因靜電容量方式之觸控面板之普及,大量行動 電話被智慧型手機取代,或平板等新製品正普及。又,因有機EL之性能提昇,有機EL顯示器正在發展。如此,行動設備之顯示器到當前仍在繼續進化,此時存在要改變光學薄膜等之構成之情況。此時,存在迫於將表面特性完全不同之塑膠材料接著之必要性之情況。例如,環烯烴聚合物與聚甲基丙烯酸甲酯均為廣泛使用於光學用途之塑膠材料,但前者為非極性,另一方面,後者為高極性,兩者之表面特性完全不同。正需求即便為此種不同種材料亦可將兩者強力地接著,而且硬化後不產生黃變或渾濁、透明性亦優異之活性能量射線硬化型接著劑。又,對於接著劑要求耐濕熱試驗後之接著力降低較小。 Recently, a large number of actions have been made due to the popularity of touch panels in the form of electrostatic capacitance. The phone has been replaced by smart phones, or new products such as tablets are gaining popularity. Also, organic EL displays are being developed due to the improvement in performance of organic EL. As such, the display of the mobile device continues to evolve until now, and there is a case where the composition of the optical film or the like is changed. At this time, there is a case where it is necessary to carry out the plastic material which completely differs in surface characteristics. For example, both cyclic olefin polymers and polymethyl methacrylate are widely used in optical applications for optical applications, but the former is non-polar and on the other hand, the latter is highly polar, and the surface characteristics of the two are completely different. There is a demand for an active energy ray-curable adhesive which is strong in adhesion to both of these different materials and which does not cause yellowing or turbidity and is excellent in transparency. Further, the adhesion reduction after the damp heat resistance test was required for the adhesive was small.

進而,就行動設備而言,由於薄型‧輕量化為重要之課題,故而要求將接著劑之厚度亦減薄。為了較薄地塗佈接著劑,接著劑組成物之低黏度化變得重要。然而,若欲使無溶劑之活性能量射線硬化型接著劑低黏度化,則(甲基)丙烯酸酯系之活性能量射線硬化型接著劑中一般使用之(甲基)丙烯酸胺基甲酸乙酯因其黏度較高而難以使用。因此,利用(甲基)丙烯酸酯系接著劑難以同時實現低黏度化與較強之接著力。 Further, in terms of mobile equipment, since thinness and weight reduction are important issues, it is required to reduce the thickness of the adhesive. In order to apply the adhesive thinner, the low viscosity of the adhesive composition becomes important. However, if the solvent-free active energy ray-curable adhesive is to be low-viscosity, the (meth)acrylic acid ethyl methacrylate used in the (meth)acrylate-based active energy ray-curable adhesive is generally used. Its viscosity is high and it is difficult to use. Therefore, it is difficult to simultaneously achieve low viscosity and strong adhesion by using a (meth) acrylate-based adhesive.

又,於被接著體之至少一者為薄膜之情形時,多要求較強之剝離接著力,為了增強該剝離接著力,有效的是增大接著劑硬化物之動態黏彈性測定之tanδ及增厚接著劑之厚度(非專利文獻1)。換言之,將接著劑之膜厚設為3μm以下難以增強剝離接著力。 Further, in the case where at least one of the adherends is a film, a strong peeling adhesion force is required, and in order to enhance the peeling adhesion force, it is effective to increase tan δ and increase in dynamic viscoelasticity measurement of the cured product of the adhesive. The thickness of the thick adhesive (Non-Patent Document 1). In other words, it is difficult to enhance the peeling adhesion force by setting the film thickness of the adhesive to 3 μm or less.

但,揭示有又以多官能之脂肪族環氧單體作為主成分且包含脂環式環氧單體及/或氧雜環丁烷單體之光陽離子硬化型接著劑,即便接著劑之厚度較薄,對環烯烴聚合物或三乙酸纖維素等 塑膠材料之接著力亦優異(專利文獻1)。 However, a photocation-hardening type adhesive comprising a polyfunctional aliphatic epoxy monomer as a main component and comprising an alicyclic epoxy monomer and/or an oxetane monomer is disclosed, even if the thickness of the adhesive is Thinner, cycloolefin polymer or cellulose triacetate The adhesive force of the plastic material is also excellent (Patent Document 1).

然而,專利文獻1中所揭示之組成物存在陽離子硬化性較差,硬化所需之能量較大之問題。因此,需要減慢接著步驟之線速、或增加光源數。因此,就生產性之觀點而言,期望硬化性亦優異之活性能量射線硬化型接著劑,具體而言,為利用B型紫外線(UV-B,Ultraviolet-B)(310nm附近)於200mJ/cm2以下之照射量下亦顯現充分之接著力之活性能量射線硬化型接著劑。進而,根據本發明者之研究結果,專利文獻1中所揭示之組成物具有以下問題。即,存在對聚甲基丙烯酸甲酯及(甲基)丙烯酸烷基酯聚合物等(甲基)丙烯酸系樹脂之接著力不充分之問題。除此以外,還存在如下問題:若將接著劑進行塗佈‧硬化時之環境之濕度較高,則接著力會較大地降低。 However, the composition disclosed in Patent Document 1 has a problem that the cation hardenability is poor and the energy required for hardening is large. Therefore, it is necessary to slow down the line speed of the subsequent steps or increase the number of light sources. Therefore, from the viewpoint of productivity, an active energy ray-curable adhesive which is excellent in curability is also desired, specifically, a type B ultraviolet ray (UV-B, Ultraviolet-B) (near 310 nm) at 200 mJ/cm. An active energy ray-curable adhesive which exhibits sufficient adhesion under the irradiation amount of 2 or less. Further, according to the findings of the present inventors, the composition disclosed in Patent Document 1 has the following problems. That is, there is a problem that the adhesion force to the (meth)acrylic resin such as polymethyl methacrylate or alkyl (meth) acrylate polymer is insufficient. In addition to this, there is a problem that if the humidity of the environment is high when the adhesive is applied and hardened, the force is greatly lowered.

[先前技術文獻] [Previous Technical Literature] [非專利文獻] [Non-patent literature]

[非專利文獻1]三刀基鄉,接著,47卷,8號,12~15頁(2003年) [Non-Patent Document 1] Sandaoji Township, followed by 47 volumes, 8th, 12-15 pages (2003)

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2008-63397號公報(申請專利範圍) [Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-63397 (Application No.)

本發明係鑒於上述問題而完成者,目的在於提供一種塑膠薄膜等用活性能量射線硬化型接著劑組成物,其為低黏度且硬 化性優異,不論塗佈‧硬化時之環境濕度低或高,對包含聚甲基丙烯酸甲酯等(甲基)丙烯酸系樹脂或環烯烴聚合物之各種塑膠薄膜等之接著力均優異,且無色透明性亦優異。進而,目的在於提供一種耐濕熱試驗後之接著力降低較小之接著劑組成物。 The present invention has been made in view of the above problems, and an object thereof is to provide an active energy ray-curable adhesive composition for a plastic film or the like which is low in viscosity and hard. Excellent in chemical properties, and excellent in adhesion to various plastic films including (meth)acrylic resins such as polymethyl methacrylate or cycloolefin polymers, etc., regardless of the low or high environmental humidity during coating and hardening, and Colorless transparency is also excellent. Further, it is an object of the invention to provide an adhesive composition having a small decrease in adhesion after the wet heat resistance test.

本發明者等人進行各種研究之結果發現:分別以特定之比例包含重量平均分子量為500以上之芳香族環氧化合物、具有碳數2~10個之多元醇之聚縮水甘油醚、1分子中具有2個以上氧雜環丁烷基之分子量為500以下之化合物、及光陽離子聚合起始劑之活性能量射線硬化型接著劑組成物可解決上述課題,從而完成本發明。 As a result of various studies conducted by the inventors of the present invention, it has been found that an aromatic epoxy compound having a weight average molecular weight of 500 or more, a polyglycidyl ether having a polyhydric alcohol having 2 to 10 carbon atoms, and one molecule are contained in a specific ratio. The active energy ray-curable adhesive composition having two or more oxetanyl groups having a molecular weight of 500 or less and a photocationic polymerization initiator can solve the above problems, and the present invention has been completed.

本發明係關於一種塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其含有: The present invention relates to an active energy ray-curable adhesive composition for a plastic film or sheet comprising:

(A)成分:重量平均分子量為500以上之芳香族環氧化合物 (A) component: an aromatic epoxy compound having a weight average molecular weight of 500 or more

(B)成分:具有碳數2~10個之多元醇之聚縮水甘油醚 (B) component: polyglycidyl ether of a polyol having 2 to 10 carbon atoms

(C)成分:1分子中具有2個以上氧雜環丁烷基之分子量為500以下之化合物 (C) component: a compound having two or more oxetanyl groups having a molecular weight of 500 or less in one molecule

(D)成分:光陽離子聚合起始劑;且上述(A)~(D)成分之含有比例為於組成物整體中, (D) component: a photocationic polymerization initiator; and the content ratio of the above components (A) to (D) is in the entire composition,

(A)成分:1~30重量% (A) Composition: 1 to 30% by weight

(B)成分:10~70重量% (B) Composition: 10 to 70% by weight

(C)成分:10~70重量% (C) Component: 10 to 70% by weight

(D)成分:0.5~10重量%。 (D) Component: 0.5 to 10% by weight.

(B)成分之含有比例較佳為大於(A)成分之含有比 例,且較佳為(B)成分之含有比例以(A)成分及(B)成分之合計量100重量%為基準而為51~99重量%。 The content ratio of the component (B) is preferably larger than the content ratio of the component (A) In addition, it is preferable that the content ratio of the component (B) is 51 to 99% by weight based on 100% by weight of the total of the components (A) and (B).

作為(A)成分,較佳為重量平均分子量1,000~20,000且1分子中所含之環氧基之數為2以上之化合物,又,更佳為雙酚A型環氧樹脂及/或雙酚F型環氧樹脂。作為(B)成分,較佳為具有碳數2~6個之二醇之二縮水甘油醚,更佳為具有碳數4~6個之烷二醇之二縮水甘油醚。作為(C)成分,較佳為下述式(1)所示之氧雜環丁烷化合物。 The component (A) is preferably a compound having a weight average molecular weight of 1,000 to 20,000 and a number of epoxy groups contained in one molecule of 2 or more, and more preferably a bisphenol A type epoxy resin and/or bisphenol. F type epoxy resin. The component (B) is preferably a diglycidyl ether having a diol having 2 to 6 carbon atoms, more preferably a diglycidyl ether having an alkanediol having 4 to 6 carbon atoms. The component (C) is preferably an oxetane compound represented by the following formula (1).

作為(D)成分,較佳為鋶鹽系光陽離子聚合起始劑。 As the component (D), a phosphonium salt photocationic polymerization initiator is preferred.

作為(A)~(D)成分之含有比例,較佳為於組成物整體中含有(A)成分3~20重量%、(B)成分20~65重量%、(C)成分20~60重量%、及(D)成分1~5重量%。較佳為進而於組成物整體中包含水0.05~3重量%。又,較佳為塑膠製薄膜或片材之至少一者為環烯烴聚合物或(甲基)丙烯酸系樹脂。 The content ratio of the components (A) to (D) is preferably 3 to 20% by weight of the component (A), 20 to 65% by weight of the component (B), and 20 to 60% by weight of the component (C). % and (D) components are 1 to 5% by weight. It is preferable to further contain 0.05 to 3% by weight of water in the entire composition. Further, at least one of the plastic film or sheet is preferably a cycloolefin polymer or a (meth)acrylic resin.

又,本發明係關於一種積層體,其係由基材、上述塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物之硬化物、及其他基材所構成者,且上述基材及上述其他基材之兩者或一者為塑膠製薄膜或片材。作為塑膠製薄膜或片材,較佳為其中至少一者為環烯烴聚合物或(甲基)丙烯酸系樹脂。 Further, the present invention relates to a laminate comprising a substrate, a cured film of an active energy ray-curable adhesive composition of the plastic film or sheet, and another substrate, and the substrate and the substrate Both or one of the other substrates described above is a plastic film or sheet. As the plastic film or sheet, at least one of them is preferably a cycloolefin polymer or a (meth)acrylic resin.

又,本發明係關於一種積層體之製造方法,其係將上述組成物塗佈於基材,於塗佈面貼合其他基材,並自上述基材或上 述其他基材之任一者之側照射活性能量射線者,其中,上述基材及上述其他基材之兩者或一者為塑膠製薄膜或片材。 Moreover, the present invention relates to a method for producing a laminated body, wherein the composition is applied to a substrate, and another substrate is bonded to the coated surface, and the substrate or the substrate is coated thereon. The active energy ray is irradiated to the side of any of the other substrates, wherein either or both of the substrate and the other substrate are plastic films or sheets.

根據本發明,可提供一種活性能量射線硬化型接著劑組成物,其係黏度低且硬化性亦優異,不論塗佈‧硬化時之環境濕度高或低,對包含聚甲基丙烯酸甲酯等(甲基)丙烯酸系樹脂之各種塑膠薄膜等之接著力均優異,且無色透明性亦優異。因此,可適宜使用於液晶顯示器或有機EL顯示器等中所使用之各種光學薄膜等之製造。又,於顯示器以外之用途中,例如於窗或建材等中,或對於要求低黏度、硬化性、接著力、及透明性之各種用途均可適宜使用。 According to the present invention, it is possible to provide an active energy ray-curable adhesive composition which has low viscosity and excellent hardenability, and which is high or low in environmental humidity regardless of coating and hardening, and contains polymethyl methacrylate or the like ( Each of the plastic films of the methyl methacrylate resin has excellent adhesion and excellent colorless transparency. Therefore, it can be suitably used for manufacture of various optical films, etc. used in a liquid crystal display, an organic EL display, etc.. Further, in applications other than the display, for example, in windows, building materials, or the like, or for various applications requiring low viscosity, hardenability, adhesion, and transparency, they can be suitably used.

本發明係關於一種塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其含有: The present invention relates to an active energy ray-curable adhesive composition for a plastic film or sheet comprising:

(A)成分:重量平均分子量為500以上之芳香族環氧化合物 (A) component: an aromatic epoxy compound having a weight average molecular weight of 500 or more

(B)成分:具有碳數2~10個之多元醇之聚縮水甘油醚 (B) component: polyglycidyl ether of a polyol having 2 to 10 carbon atoms

(C)成分:1分子中具有2個以上氧雜環丁烷基之分子量為500以下之化合物 (C) component: a compound having two or more oxetanyl groups having a molecular weight of 500 or less in one molecule

(D)成分:光陽離子聚合起始劑;且上述(A)~(D)成分之含有比例為於組成物整體中, (D) component: a photocationic polymerization initiator; and the content ratio of the above components (A) to (D) is in the entire composition,

(A)成分:1~30重量% (A) Composition: 1 to 30% by weight

(B)成分:10~70重量% (B) Composition: 10 to 70% by weight

(C)成分:10~70重量% (C) Component: 10 to 70% by weight

(D)成分:0.5~10重量%。 (D) Component: 0.5 to 10% by weight.

以下,針對(A)~(D)成分、其他成分、及本發明之組成物之較佳使用方法詳細地進行說明。 Hereinafter, the preferred use methods of the components (A) to (D), other components, and the composition of the present invention will be described in detail.

1.(A)成分 1. (A) component

(A)成分為重量平均分子量(以下,稱為「Mw」)為500以上之芳香族環氧化合物。於本發明中,所謂芳香族環氧化合物意指縮水甘油醚基或縮水甘油酯基直接鍵結於芳香環之環氧化合物,且係即便為低分子量之化合物亦被慣用地稱為「環氧樹脂」之化合物。 The component (A) is an aromatic epoxy compound having a weight average molecular weight (hereinafter referred to as "Mw") of 500 or more. In the present invention, the term "aromatic epoxy compound" means an epoxy compound in which a glycidyl ether group or a glycidyl ester group is directly bonded to an aromatic ring, and a compound having a low molecular weight is conventionally referred to as "epoxy". a compound of a resin.

(A)成分之Mw為500以上,較佳為500~50,000之範圍,更佳為1,000~20,000之範圍,進而較佳為1,000~10,000之範圍,尤佳為2,000~10,000之範圍。若Mw未滿500,則於環境濕度相對較高之條件下,與塑膠基材、特別是(甲基)丙烯酸系樹脂之接著力變低。又,基於與此相同之理由,Mw較佳為50,000以下。 The component (A) has a Mw of 500 or more, preferably 500 to 50,000, more preferably 1,000 to 20,000, still more preferably 1,000 to 10,000, and particularly preferably 2,000 to 10,000. If the Mw is less than 500, the adhesion to the plastic substrate, particularly the (meth)acrylic resin, becomes lower under conditions of relatively high ambient humidity. Further, for the same reason, Mw is preferably 50,000 or less.

於本發明中,Mw意指藉由凝膠滲透層析法(GPC,Gel Permeation Chromatography)所測得之聚苯乙烯換算之Mw。再者,作為不屬於(A)成分之低分子量之環氧化合物,亦可使用利用質量分析能測定之絕對分子量。 In the present invention, Mw means a polystyrene-converted Mw measured by gel permeation chromatography (GPC, Gel Permeation Chromatography). Further, as the epoxy compound having a low molecular weight which is not a component (A), an absolute molecular weight which can be measured by mass spectrometry can also be used.

作為(A)成分,較佳為於25℃下為固形之芳香族環氧化合物,具體而言,較佳為軟化點為40℃以上之芳香族環氧化合物。藉由使用軟化點為40℃以上之芳香族環氧化合物,可於環境濕度相對較高之條件下提昇與塑膠基材、特別是(甲基)丙烯酸系樹脂之接著力。軟化點更佳為50℃以上且200℃以下,進而較佳為60 ℃以上且170℃以下,尤佳為70℃以上且140℃以下。於本發明中,所謂軟化點意指藉由JIS K7234之環球法所測得之測定值。 The component (A) is preferably an aromatic epoxy compound which is solid at 25 ° C. Specifically, an aromatic epoxy compound having a softening point of 40 ° C or higher is preferred. By using an aromatic epoxy compound having a softening point of 40 ° C or higher, the adhesion to a plastic substrate, particularly a (meth)acrylic resin, can be improved under relatively high ambient humidity conditions. The softening point is more preferably 50 ° C or more and 200 ° C or less, and further preferably 60 Above °C and below 170 °C, particularly preferably from 70 ° C to 140 ° C. In the present invention, the softening point means a measured value measured by the ring and ball method of JIS K7234.

關於(A)成分之1分子中所含之環氧基之數,就提昇與塑膠基材之接著力之方面而言,較佳為2以上。又,基於相同之理由,相較於縮水甘油酯基更佳為縮水甘油醚基。 The number of epoxy groups contained in one molecule of the component (A) is preferably 2 or more in terms of improving the adhesion to the plastic substrate. Further, for the same reason, it is more preferably a glycidyl ether group than a glycidyl ester group.

作為(A)成分之較佳具體例,可列舉:Mw為500以上之雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚A與雙酚F及表氯醇聚縮合而成之環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂及雙酚F酚醛清漆型環氧樹脂等。 Preferred examples of the component (A) include a bisphenol A epoxy resin having a Mw of 500 or more, a bisphenol F epoxy resin, and a polycondensation of bisphenol A with bisphenol F and epichlorohydrin. Epoxy resin, phenol novolac type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolac type epoxy resin, and bisphenol F novolak type epoxy resin.

作為(A)成分,更佳為雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚A與雙酚F及表氯醇聚縮合而成之環氧樹脂,進而較佳為雙酚A型環氧樹脂及雙酚F型環氧樹脂,尤佳為雙酚A型環氧樹脂。 More preferably, the component (A) is a bisphenol A epoxy resin, a bisphenol F epoxy resin, an epoxy resin obtained by polycondensation of bisphenol A with bisphenol F and epichlorohydrin, and further preferably a double resin. Phenol type A epoxy resin and bisphenol F type epoxy resin, especially bisphenol A type epoxy resin.

作為(A)成分,可單獨使用上述化合物,或使用兩種以上。(A)成分之含有比例於組成物整體中為1~30重量%。若(A)成分未滿1重量%,則於塗佈‧硬化時之環境濕度較高時,組成物之接著力會降低。又,若(A)成分之含有比例超過30重量%,則組成物之黏度變得過高,塗佈性變差。(A)成分之較佳含有比例於組成物整體中為3~20重量%,更佳為5~15重量%。 As the component (A), the above compounds may be used singly or in combination of two or more. The content ratio of the component (A) is 1 to 30% by weight based on the entire composition. When the component (A) is less than 1% by weight, the adhesion of the composition is lowered when the ambient humidity at the time of coating and hardening is high. In addition, when the content ratio of the component (A) exceeds 30% by weight, the viscosity of the composition becomes too high, and the coatability is deteriorated. The content of the component (A) is preferably from 3 to 20% by weight, more preferably from 5 to 15% by weight, based on the total amount of the composition.

2.(B)成分 2. (B) ingredients

(B)成分為具有碳數2~10個之多元醇之聚縮水甘油醚。再者,具有碳數2~10個之多元醇之「碳數」意指構成自多元醇中除去羥 基之部位之碳之數目。 The component (B) is a polyglycidyl ether having a polyhydric alcohol having 2 to 10 carbon atoms. Furthermore, the "carbon number" of a polyol having 2 to 10 carbon atoms means that the hydroxy group is removed from the polyol. The number of carbons in the base.

作為(B)成分,可列舉:烷烴多元醇之聚縮水甘油醚、環烷烴多元醇之聚縮水甘油醚、聚伸烷基二醇聚縮水甘油醚、及芳香族多元醇之聚縮水甘油醚等。(B)成分較佳為具有碳數2~6個之二醇之二縮水甘油醚,更佳為具有碳數4~6個之烷二醇之二縮水甘油醚。 Examples of the component (B) include a polyglycidyl ether of an alkane polyol, a polyglycidyl ether of a cycloalkanol polyol, a polyalkylene glycol polyglycidyl ether, and a polyglycidyl ether of an aromatic polyol. . The component (B) is preferably a diglycidyl ether having a diol having 2 to 6 carbon atoms, more preferably a diglycidyl ether having an alkanediol having 4 to 6 carbon atoms.

作為(B)成分之具體例,可列舉:乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、環己烷二羥甲基二縮水甘油醚、1,9-壬二醇二縮水甘油醚、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、二丙二醇二縮水甘油醚、三丙二醇二縮水甘油醚、對苯二酚二縮水甘油醚、間苯二酚二縮水甘油醚、三羥甲基丙烷二縮水甘油醚、三羥甲基丙烷三縮水甘油醚、季戊四醇聚縮水甘油醚及二季戊四醇聚縮水甘油醚等。 Specific examples of the component (B) include ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and 1,6. - hexanediol diglycidyl ether, cyclohexane dimethylol diglycidyl ether, 1,9-nonanediol diglycidyl ether, diethylene glycol diglycidyl ether, triethylene glycol diglycidyl ether , dipropylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, hydroquinone diglycidyl ether, resorcinol diglycidyl ether, trimethylolpropane diglycidyl ether, trimethylolpropane tricondensate Glycerol ether, pentaerythritol polyglycidyl ether, dipentaerythritol polyglycidyl ether, and the like.

作為(B)成分,更佳為由乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、對苯二酚二縮水甘油醚、間苯二酚二縮水甘油醚、二乙二醇二縮水甘油醚、二丙二醇二縮水甘油醚等所例示之具有碳數2~6個之二醇之二縮水甘油醚。 More preferably, as the component (B), ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexyl Glycol diglycidyl ether, hydroquinone diglycidyl ether, resorcinol diglycidyl ether, diethylene glycol diglycidyl ether, dipropylene glycol diglycidyl ether, etc., having carbon number 2 to 6 Diglycidyl ether of diol.

作為(B)成分,就所獲得之組成物成為低黏度、硬化物之接著力優異、進而為無色透明之方面而言,尤佳為由1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚及1,6-己二醇二縮水甘油醚等所例示之具有碳數4~6個之烷二醇之二縮水甘油醚。 The component (B) is preferably a 1,4-butanediol diglycidyl ether or a pentylene group because the composition obtained has a low viscosity and an excellent adhesion to a cured product, and is further colorless and transparent. A diglycidyl ether having 4 to 6 carbon atoms of alkanediol exemplified by diol diglycidyl ether and 1,6-hexanediol diglycidyl ether.

作為(B)成分,可單獨使用上述化合物,或使用兩種 以上。(B)成分之含有比例於組成物整體中為10~70重量%。若(B)成分未滿10重量%,則組成物對多數塑膠基材之接著力會降低。又,若(B)成分之含有比例超過70重量%,則組成物之硬化性惡化,接著力亦惡化。(B)成分之較佳含有比例於組成物整體中為20~65重量%,更佳為30~60重量%。又,(B)成分之含有比例,就可使組成物低黏度化且接著力優異之方面而言,較佳為大於(A)成分之含有比例。具體而言,以(A)成分及(B)成分之合計量100重量%為基準,(B)成分較佳為51~99重量%,更佳為65~95重量%。 As the component (B), the above compounds may be used singly or in combination of two the above. The content ratio of the component (B) is from 10 to 70% by weight based on the entire composition. If the component (B) is less than 10% by weight, the adhesion of the composition to most of the plastic substrates may be lowered. In addition, when the content ratio of the component (B) exceeds 70% by weight, the hardenability of the composition is deteriorated, and the force is also deteriorated. The content of the component (B) is preferably from 20 to 65% by weight, more preferably from 30 to 60% by weight, based on the total amount of the composition. Further, the content ratio of the component (B) is preferably such that the composition has a lower viscosity and a higher adhesion strength than the component (A). Specifically, the component (B) is preferably 51 to 99% by weight, and more preferably 65 to 95% by weight based on 100% by weight of the total of the components (A) and (B).

3.(C)成分 3. (C) ingredients

(C)成分為1分子中具有2個以上氧雜環丁烷基且分子量為500以下之化合物。作為(C)成分,就所獲得之組成物成為低黏度之方面、及硬化物之接著力優異之方面而言,更佳為分子量為150~400之化合物,進而較佳之分子量為150~300之範圍。 The component (C) is a compound having two or more oxetanyl groups in one molecule and having a molecular weight of 500 or less. The component (C) is preferably a compound having a molecular weight of 150 to 400, more preferably a molecular weight of 150 to 300, in terms of a low viscosity of the composition obtained and an excellent adhesion of the cured product. range.

作為(C)成分之具體例,可列舉:雙[(3-乙基氧雜環丁烷-3-基)甲基]醚、雙[(3-甲基氧雜環丁烷-3-基)甲基]醚、雙[(氧雜環丁烷-3-基)甲基]醚、1,4-雙{[(3-乙基氧雜環丁烷-3-基)甲氧基]甲基}苯、1,4-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]苯、1,3-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]苯、1,2-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]苯、4,4'-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]聯苯、2,2'-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]聯苯、1,1,1-叁[(3-乙基氧雜環丁烷-3-基)甲氧基甲基]丙烷、1,2-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]乙烷、1,2-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]丙烷、1,4-雙[(3-乙基氧雜環丁烷-3-基)甲氧基]丁烷及1,6-雙[(3-乙基氧雜環丁烷-3-基)甲氧基] 己烷等。 Specific examples of the component (C) include bis[(3-ethyloxetan-3-yl)methyl]ether and bis[(3-methyloxetan-3-yl) )methyl]ether, bis[(oxetan-3-yl)methyl]ether, 1,4-bis{[(3-ethyloxetan-3-yl)methoxy] Methyl}benzene, 1,4-bis[(3-ethyloxetan-3-yl)methoxy]benzene, 1,3-bis[(3-ethyloxetane-3) -yl)methoxy]benzene, 1,2-bis[(3-ethyloxetan-3-yl)methoxy]benzene, 4,4'-bis[(3-ethyloxa) Cyclobutane-3-yl)methoxy]biphenyl, 2,2'-bis[(3-ethyloxetan-3-yl)methoxy]biphenyl, 1,1,1- [[3-ethyloxet-3-yl)methoxymethyl]propane, 1,2-bis[(3-ethyloxetan-3-yl)methoxy] Ethane, 1,2-bis[(3-ethyloxetan-3-yl)methoxy]propane, 1,4-bis[(3-ethyloxetan-3-yl) )methoxy]butane and 1,6-bis[(3-ethyloxetan-3-yl)methoxy] Hexane, etc.

作為(C)成分,尤佳為雙[(3-乙基氧雜環丁烷-3-基)甲基]醚、即下述式(1)所示之氧雜環丁烷化合物。 The component (C) is preferably bis[(3-ethyloxetan-3-yl)methyl]ether, that is, an oxetane compound represented by the following formula (1).

於(C)成分之分子量為500以下之情形時,較佳為150~400、更佳為150~300、尤佳為上述式(1)所示之化合物之情形時,組成物之硬化物即便於玻璃轉移溫度以上之溫度下亦可提高彈性模數。因此,可使組成物之硬化物之耐熱性提高。 When the molecular weight of the component (C) is 500 or less, preferably 150 to 400, more preferably 150 to 300, and particularly preferably a compound represented by the above formula (1), even if the cured product of the composition is cured The modulus of elasticity can also be increased at temperatures above the glass transition temperature. Therefore, the heat resistance of the cured product of the composition can be improved.

作為(C)成分,可單獨使用上述化合物,或使用兩種以上。(C)成分之含有比例於組成物整體中為10~70重量%。若(C)成分未滿10重量%,則組成物之硬化性惡化,接著力亦惡化。又,若(C)成分之含有比例超過70重量%,則組成物對多數塑膠基材之接著力會降低。(C)成分之較佳含有比例於組成物整體中為20~60重量%,更佳為25~55重量%。 As the component (C), the above compounds may be used singly or in combination of two or more. The content ratio of the component (C) is from 10 to 70% by weight based on the entire composition. When the component (C) is less than 10% by weight, the hardenability of the composition is deteriorated, and the force is also deteriorated. Moreover, when the content ratio of the component (C) exceeds 70% by weight, the adhesion of the composition to most plastic substrates is lowered. The content of the component (C) is preferably from 20 to 60% by weight, more preferably from 25 to 55% by weight, based on the total amount of the composition.

4.(D)成分 4. (D) ingredients

(D)成分為光陽離子聚合起始劑。即,為藉由紫外線或電子束等活性能量射線之照射產生陽離子或路易斯酸,使環氧化合物及氧雜環丁烷化合物等陽離子硬化性成分之聚合開始之化合物。作為(D)成分之具體例,可列舉:鋶鹽系光陽離子聚合起始劑、錪鹽系光陽離子聚合起始劑及重氮鹽系光陽離子聚合起始劑等。 The component (D) is a photocationic polymerization initiator. In other words, it is a compound which starts polymerization of a cationically curable component such as an epoxy compound or an oxetane compound by generating a cation or a Lewis acid by irradiation with an active energy ray such as an ultraviolet ray or an electron beam. Specific examples of the component (D) include an onium salt photocationization polymerization initiator, a phosphonium salt photocationization polymerization initiator, and a diazonium salt photocationization polymerization initiator.

作為鋶鹽系光陽離子聚合起始劑之例,例如可列舉: 三苯基鋶六氟磷酸鹽、三苯基鋶六氟銻酸鹽、三苯基鋶肆(五氟苯基)硼酸鹽、二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽、二苯基-4-(苯硫基)苯基鋶六氟銻酸鹽、4,4'-雙(二苯基鋶基)二苯硫醚雙六氟磷酸鹽、4,4'-雙[二(β-羥基乙氧基)苯基二氫硫基]二苯硫醚雙六氟銻酸鹽、4,4'-雙[二(β-羥基乙氧基)苯基二氫硫基]二苯硫醚雙六氟磷酸鹽、7-[二(對甲苯甲醯基)二氫硫基]-2-異丙基9-氧硫六氟銻酸鹽、7-[二(對甲苯甲醯基)二氫硫基]-2-異丙基9-氧硫肆(五氟苯基)硼酸鹽、4-苯基羰基-4'-二苯基二氫硫-二苯硫醚六氟磷酸鹽、4-(對第三丁基苯基羰基)-4'-二苯基二氫硫基-二苯硫醚六氟銻酸鹽、4-(對第三丁基苯基羰基)-4'-二(對甲苯甲醯基)二氫硫基-二苯硫醚肆(五氟苯基)硼酸鹽等三芳基鋶鹽。 Examples of the onium salt-based photocationic polymerization initiator include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, and triphenylsulfonium (pentafluorophenyl) borate. Diphenyl-4-(phenylthio)phenylphosphonium hexafluorophosphate, diphenyl-4-(phenylthio)phenylphosphonium hexafluoroantimonate, 4,4'-bis(diphenylfluorene) Diphenyl sulfide dihexafluorophosphate, 4,4'-bis[bis(β-hydroxyethoxy)phenyldihydrothio]diphenyl sulfide dihexafluoroantimonate, 4,4' - bis[bis(β-hydroxyethoxy)phenyldihydrothio]diphenyl sulfide dihexafluorophosphate, 7-[bis(p-tolylmethyl)dihydrothio]-2-isopropyl 9-oxosulfur Hexafluoroantimonate, 7-[bis(p-tolylmethyl)dihydrothio]-2-isopropyl 9-oxosulfur Bis(pentafluorophenyl)borate, 4-phenylcarbonyl-4'-diphenyldihydrothio-diphenyl sulfide hexafluorophosphate, 4-(p-tert-butylphenylcarbonyl)-4' -diphenyldihydrothio-diphenyl sulfide hexafluoroantimonate, 4-(p-tert-butylphenylcarbonyl)-4'-di(p-tolylmethyl)dihydrothio-diphenyl a triarylsulfonium salt such as thioether quinone (pentafluorophenyl) borate.

作為錪鹽系光陽離子聚合起始劑之例,例如可列舉:二苯基錪肆(五氟苯基)硼酸鹽、二苯基錪六氟磷酸鹽、二苯基錪六氟銻酸鹽、二(4-第三丁基苯基)錪六氟磷酸鹽、二(4-第三丁基苯基)錪六氟銻酸鹽、甲苯基基錪肆(五氟苯基)硼酸鹽、(4-甲基苯基)[4-(2-甲基丙基)苯基]-六氟磷酸鹽、二(4-壬基苯基)錪六氟磷酸鹽、二(4-烷基苯基)錪六氟磷酸鹽等二芳基錪鹽。 Examples of the onium salt-based photocationic polymerization initiator include diphenylphosphonium (pentafluorophenyl) borate, diphenylphosphonium hexafluorophosphate, and diphenylphosphonium hexafluoroantimonate. Bis(4-t-butylphenyl)phosphonium hexafluorophosphate, bis(4-t-butylphenyl)phosphonium hexafluoroantimonate, tolyl Base (pentafluorophenyl)borate, (4-methylphenyl)[4-(2-methylpropyl)phenyl]-hexafluorophosphate, bis(4-mercaptophenyl)anthracene A diarylsulfonium salt such as hexafluorophosphate or bis(4-alkylphenyl)phosphonium hexafluorophosphate.

作為重氮鹽系光陽離子聚合起始劑之例,例如可列舉:重氮苯六氟銻酸鹽、重氮苯六氟磷酸鹽等。 Examples of the diazonium salt-based photocationic polymerization initiator include diazobenzene hexafluoroantimonate and diazobenzene hexafluorophosphate.

(D)成分有市售,可列舉:Adeka Optomer SP-100、SP-150、SP-152、SP-170、SP-172[ADEKA(股)製造]、Photo Initiator 2074(RHODIA公司製造)、Kayarad PCI-220、PCI-620[日本化藥(股)製造]、Irgacure 250(日本汽巴公司製造)、CPI-100P、CPI-110P、CPI-101A、CPI-200K、CPI-210S[SAN-APRO(股)製造]、WPI-113、 WPI-116[和光純藥工業(股)製造]、BBI-102、BBI-103、TPS-102、TPS-103、DTS-102、DTS-103[Midori化學(股)製造]等。 The component (D) is commercially available, and examples thereof include Adeka Optomer SP-100, SP-150, SP-152, SP-170, SP-172 [made by ADEKA], Photo Initiator 2074 (manufactured by RHODIA), and Kayarad. PCI-220, PCI-620 [made by Nippon Kayaku Co., Ltd.], Irgacure 250 (made by Nippon Ciba Company), CPI-100P, CPI-110P, CPI-101A, CPI-200K, CPI-210S [SAN-APRO (share) manufacturing], WPI-113, WPI-116 [manufactured by Wako Pure Chemical Industries, Ltd.], BBI-102, BBI-103, TPS-102, TPS-103, DTS-102, DTS-103 [Midori Chemical Co., Ltd.] and the like.

該等中,基於活性能量射線硬化性優異、無色透明性亦優異之理由,較佳為鋶鹽系光陽離子聚合起始劑,更佳為三芳基鋶鹽。作為三芳基鋶鹽,上述者中較佳為三苯基鋶六氟磷酸鹽及二苯基-4-(苯硫基)苯基鋶六氟磷酸鹽。 Among these, a sulfonium-based photocationic polymerization initiator is preferred, and a triarylsulfonium salt is more preferred because it is excellent in active energy ray hardenability and excellent in colorless transparency. As the triarylsulfonium salt, preferred are triphenylsulfonium hexafluorophosphate and diphenyl-4-(phenylthio)phenylphosphonium hexafluorophosphate.

作為(D)成分,可單獨使用上述化合物,或使用兩種以上。 As the component (D), the above compounds may be used singly or in combination of two or more.

(D)成分之含有比例於組成物整體中為0.5~10重量%,較佳為1~5重量%。若(D)成分之含有比例未滿0.5重量%,則組成物之硬化性變差,若超過10重量%,則組成物之接著力降低,或組成物之硬化物黃變。 The content ratio of the component (D) is from 0.5 to 10% by weight, preferably from 1 to 5% by weight, based on the total amount of the composition. When the content ratio of the component (D) is less than 0.5% by weight, the hardenability of the composition is deteriorated, and if it exceeds 10% by weight, the adhesion of the composition is lowered, or the cured product of the composition is yellowed.

5.其他成分 5. Other ingredients

本發明之組成物以上述(A)~(D)成分作為必需者,但可根據目的而調配各種成分(稱為「其他成分」)。 The composition of the present invention is essential to the above components (A) to (D), but various components (referred to as "other components") may be blended depending on the purpose.

作為其他成分,亦可含有上述(A)成分、(B)成分、及(C)成分以外之陽離子硬化性化合物(以下,稱為「其他陽離子硬化性成分」)。於包含其他陽離子硬化性成分之情形時,該等之含有比例之合計於陽離子硬化性成分之合計量100重量%中,較佳為設為30重量%以下,更佳為設為20重量%以下,進而較佳為設為10重量%以下。作為陽離子硬化性成分,可列舉:(A)成分及(B)成分以外之含環氧基之化合物、(C)成分以外之含氧雜環丁烷基之化合物、及含乙烯醚基之化合物等。 The other component may contain the above-mentioned (A) component, (B) component, and the cation hardening compound other than (C) component (it is hereafter called " other cation hardening component. In the case where the other cationically curable component is contained, the total content of the cationic curable components is preferably 100% by weight or less, and more preferably 20% by weight or less. Further, it is preferably 10% by weight or less. Examples of the cation-curable component include an epoxy group-containing compound other than the component (A) and the component (B), an oxetane group-containing compound other than the component (C), and a vinyl ether group-containing compound. Wait.

作為(A)成分及(B)成分以外之含環氧基之化合物之具體例,可列舉:3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、雙(3,4-環氧環己基甲基)己二酸酯、3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯之己內酯改質物、多元羧酸與3,4-環氧環己基甲醇之酯化物或己內酯改質物、二環戊二烯二氧化物、薴二氧化物、2-(3,4-環氧環己基)乙基三甲氧基矽烷、2-(3,4-環氧環己基)乙基三乙氧基矽烷及4-乙烯環己烷二氧化物等脂環式環氧化合物;雙酚A之二縮水甘油醚(Mw未滿500)、雙酚F之二縮水甘油醚(Mw未滿500)、溴化雙酚A之二縮水甘油醚(Mw未滿500)、苯酚酚醛清漆型環氧樹脂(Mw未滿500)、甲酚酚醛清漆型環氧樹脂(Mw未滿500)、聯苯型環氧樹脂(Mw未滿500)、對苯二甲酸二縮水甘油酯、及鄰苯二甲酸二縮水甘油酯等Mw未滿500之芳香族環氧樹脂;以及聚乙二醇(重複數為6以上)二縮水甘油醚、聚丙二醇(重複數為4以上)二縮水甘油醚、聚1,4-丁二醇(重複數為3以上)二縮水甘油醚、氫化雙酚A二縮水甘油醚、兩末端為羥基之聚丁二烯二縮水甘油醚等碳數為11以上之二醇之二縮水甘油醚等。除該等以外,亦可列舉:環氧化植物油、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧基矽烷、聚丁二烯之內部環氧化物、苯乙烯-丁二烯共聚合體之雙鍵之一部分經環氧化之化合物[例如,大賽璐化學工業(股)製造之「EPOFRIEND」]、及乙烯-丁烯共聚合體與聚異戊二烯之嵌段共聚物之異戊二烯單位之一部分經環氧化之化合物[例如,科騰(KRATON)公司製造之「L-207」等。 Specific examples of the epoxy group-containing compound other than the component (A) and the component (B) include 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and a double (3,4-epoxycyclohexylmethyl) adipate, caprolactone modification of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, polycarboxylic acid Esterified or caprolactone modification with 3,4-epoxycyclohexylmethanol, dicyclopentadiene dioxide, cerium dioxide, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy An alicyclic epoxy compound such as decane, 2-(3,4-epoxycyclohexyl)ethyltriethoxydecane and 4-vinylcyclohexane dioxide; bisphenol A diglycidyl ether (Mw Less than 500), bisphenol F diglycidyl ether (Mw less than 500), brominated bisphenol A diglycidyl ether (Mw less than 500), phenol novolac type epoxy resin (Mw less than 500) , cresol novolak type epoxy resin (Mw less than 500), biphenyl type epoxy resin (Mw less than 500), diglycidyl terephthalate, and diglycidyl phthalate 500% aromatic epoxy resin; and polyethylene glycol (repeated number 6 or more) diglycidyl ether, poly a diol (repeated number of 4 or more) diglycidyl ether, polytetramethylene glycol (repeated number 3 or more) diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, and a polybutytidine having a hydroxyl group at both ends A diglycidyl ether of a diol having a carbon number of 11 or more, such as a diene diglycidyl ether. In addition to these, an epoxidized vegetable oil, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, and an internal epoxy of polybutadiene may also be mentioned. a compound in which a part of the double bond of the styrene-butadiene copolymer is epoxidized [for example, "EPOFRIEND" manufactured by Daicel Chemical Industries Co., Ltd.], and an ethylene-butene copolymer and polyisoprene. One of the isoprene units of the block copolymer is an epoxidized compound [for example, "L-207" manufactured by KRATON Co., Ltd., and the like.

作為(C)成分以外之氧雜環丁烷化合物之具體例,可列舉:如3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷之含有烷氧基烷 基之單官能氧雜環丁烷、如3-乙基-3-苯氧基甲基氧雜環丁烷之含有芳香族基之單官能氧雜環丁烷、3-乙基-3-羥甲基氧雜環丁烷、酚醛清漆型苯酚-甲醛樹脂與3-氯甲基-3-乙基氧雜環丁烷之醚化改質物、3-[(3-乙基氧雜環丁烷-3-基)甲氧基]丙基三甲氧基矽烷、3-[(3-乙基氧雜環丁烷-3-基)甲氧基]丙基三乙氧基矽烷、3-[(3-乙基氧雜環丁烷-3-基)甲氧基]丙基三烷氧基矽烷之水解縮合物、3-乙基氧雜環丁烷-3-基甲醇與矽烷四醇聚縮合物之縮合反應生成物等。 Specific examples of the oxetane compound other than the component (C) include an alkoxyalkyl group such as 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane. Monofunctional oxetane, such as 3-ethyl-3-phenoxymethyl oxetane, aromatic group-containing monofunctional oxetane, 3-ethyl-3-hydroxyl Etherified modified product of methyloxetane, novolac type phenol-formaldehyde resin and 3-chloromethyl-3-ethyloxetane, 3-[(3-ethyloxetane) 3-yl)methoxy]propyltrimethoxydecane, 3-[(3-ethyloxetan-3-yl)methoxy]propyltriethoxydecane, 3-[( Hydrolyzed condensate of 3-ethyloxetane-3-yl)methoxy]propyltrialkoxydecane, polycondensation of 3-ethyloxetane-3-ylmethanol with decanetetraol a condensation reaction product or the like.

作為乙烯醚化合物之具體例,可列舉:環己基乙烯醚、2-乙基己基乙烯醚、十二烷基乙烯醚、4-羥基丁基乙烯醚、二乙二醇單乙烯醚、三乙二醇二乙烯醚、環己烷二甲醇二乙烯醚等。 Specific examples of the vinyl ether compound include cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, lauryl vinyl ether, 4-hydroxybutyl vinyl ether, diethylene glycol monovinyl ether, and triethylene glycol. Alcohol divinyl ether, cyclohexane dimethanol divinyl ether and the like.

本發明之組成物較佳為於組成物整體中包含水0.05~3重量%。藉由將水之含有比例設為0.05%以上,可防止陽離子硬化變得過快,接著力降低之情況。另一方面,藉由將水之含有比例設為3重量%以下,可使組成物之硬化性及接著力提昇。 The composition of the present invention preferably contains 0.05 to 3% by weight of water in the entire composition. By setting the water content ratio to 0.05% or more, it is possible to prevent the cation hardening from becoming too fast and the force to be lowered. On the other hand, by setting the water content ratio to 3% by weight or less, the hardenability and the adhesion of the composition can be improved.

本發明之組成物亦可含有自由基硬化性成分。於包含自由基硬化性成分之情形時,該等之合計量較佳為相對於陽離子硬化性成分之合計量100重量份為120重量份以下,更佳為100重量份以下,進而較佳為50重量份以下。作為其他自由基硬化性成分,可列舉含有(甲基)丙烯醯基之化合物等。又,作為該等之分子量,可選擇各種分子量,且可為單體、寡聚物、及聚合物之任一者。 The composition of the present invention may also contain a radical curable component. In the case of containing a radical curable component, the total amount of these is preferably 120 parts by weight or less, more preferably 100 parts by weight or less, even more preferably 100 parts by weight or less based on 100 parts by total of the total amount of the cationically curable components. Parts by weight or less. Examples of the other radical curable component include a compound containing a (meth) acrylonitrile group. Further, as the molecular weights, various molecular weights may be selected, and any of a monomer, an oligomer, and a polymer may be used.

作為含有(甲基)丙烯醯基之化合物,可列舉分子內具有1個(甲基)丙烯醯基之化合物[以下,稱為「單官能(甲基)丙烯酸酯」]及分子內具有2個以上(甲基)丙烯醯基之化合物[以下,稱為「多官能(甲基)丙烯酸酯」]。 Examples of the compound containing a (meth) acrylonitrile group include a compound having one (meth) acryl fluorenyl group in the molecule (hereinafter referred to as "monofunctional (meth) acrylate)" and two molecules in the molecule. The compound of the above (meth) acrylonitrile group (hereinafter referred to as "polyfunctional (meth) acrylate"].

作為單官能(甲基)丙烯酸酯之具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯基氧基乙酯、(甲基)丙烯酸苄酯、苯酚環氧烷加成物之(甲基)丙烯酸酯、對基苯酚環氧烷加成物之(甲基)丙烯酸酯、鄰苯基苯酚環氧烷加成物之(甲基)丙烯酸酯、壬基苯酚環氧烷加成物之(甲基)丙烯酸酯、2-(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙氧基乙酯、2-乙基己醇之環氧烷加成物之(甲基)丙烯酸酯、戊二醇單(甲基)丙烯酸酯、己二醇單(甲基)丙烯酸酯、二乙二醇之單(甲基)丙烯酸酯、三乙二醇之單(甲基)丙烯酸酯、四乙二醇之單(甲基)丙烯酸酯、聚乙二醇之單(甲基)丙烯酸酯、二丙二醇之單(甲基)丙烯酸酯、三丙二醇之單(甲基)丙烯酸酯、聚丙二醇之單(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-苯氧基丙酯、(甲基)丙烯酸2-羥基-3-丁氧基丙酯、(甲基)丙烯酸四氫呋喃甲酯、己內酯改質(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸(2-乙基-2-甲基-1,3-二氧雜環戊烷-4-基)甲酯、(甲基)丙烯酸(2-異丁基-2-甲基-1,3-二氧雜環戊烷-4-基)甲酯、(甲基)丙烯酸(1,4-二氧雜螺[4,5]癸烷-2-基)甲酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸(3-乙基氧雜環丁烷-3-基)甲酯、異氰酸2-(甲基)丙烯醯氧基乙酯、(甲基) 丙烯酸烯丙酯、N-(甲基)丙烯醯氧基乙基六氫鄰苯二甲醯亞胺、N-(甲基)丙烯醯氧基乙基四氫鄰苯二甲醯亞胺、六氫鄰苯二甲酸2-(甲基)丙烯醯氧基乙酯、琥珀酸2-(甲基)丙烯醯氧基乙酯、ω-羧基-聚己內酯單(甲基)丙烯酸酯、酸式磷酸2-(甲基)丙烯醯氧基乙酯、3-(甲基)丙烯醯氧基丙基三甲氧基矽烷、3-(甲基)丙烯醯氧基丙基二甲氧基甲基矽烷、3-(甲基)丙烯醯氧基丙基三乙氧基矽烷等。於上述環氧烷加成物中,作為環氧烷,可列舉環氧乙烷及環氧丙烷等。 Specific examples of the monofunctional (meth) acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and isopropyl (meth)acrylate. Methyl)butyl acrylate, isobutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, (meth)acrylic acid Lauryl ester, stearyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, (meth) acrylate Cyclohexyl ester, (meth)acrylic acid Ester, 1,4-cyclohexanedimethanol mono(meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl (meth)acrylate Ethyloxyethyl ester, benzyl (meth)acrylate, (meth)acrylate of phenol alkylene oxide adduct, pair (meth) acrylate of a phenol phenol alkylene oxide adduct, a (meth) acrylate of an o-phenylphenol alkylene oxide adduct, a (meth) acrylate of a nonyl phenol alkylene oxide adduct , (meth) acrylate of 2-methoxyethyl (meth) acrylate, ethoxyethoxyethyl (meth) acrylate, alkylene oxide of 2-ethylhexanol, pentane Diol mono(meth)acrylate, hexanediol mono(meth)acrylate, mono(meth)acrylate of diethylene glycol, mono(meth)acrylate of triethylene glycol, tetraethylene Mono (meth) acrylate of alcohol, mono (meth) acrylate of polyethylene glycol, mono (meth) acrylate of dipropylene glycol, mono (meth) acrylate of tripropylene glycol, single of polypropylene glycol ( Methyl) acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-butoxypropyl (meth)acrylate, tetrahydrofuran methyl (meth)acrylate, The lactone is modified with tetrahydrofuran methyl (meth)acrylate, (2-ethyl-2-methyl-1,3-dioxolan-4-yl)methyl (meth)acrylate, (methyl) ) (2-isobutyl-2-methyl-1,3-dioxolan-4-yl)methyl acrylate (Meth)acrylic acid (1,4-dioxaspiro[4,5]decane-2-yl)methyl ester, glycidyl (meth)acrylate, 3,4-epoxy ring of (meth)acrylic acid Hexylmethyl ester, (3-ethyloxetane-3-yl)methyl (meth)acrylate, 2-(methyl)propenyloxyethyl isocyanate, (meth)acrylic acid allyl Ester, N-(methyl)propenyloxyethylhexahydrophthalate, N-(methyl)propenyloxyethyltetrahydrophthalimide, hexahydroortylene 2-(methyl)propenyloxyethyl dicarboxylate, 2-(methyl)propenyloxyethyl succinate, ω-carboxy-polycaprolactone mono(meth)acrylate, acid phosphate 2 -(Meth) propylene methoxyethyl ester, 3-(meth) propylene methoxy propyl trimethoxy decane, 3-(methyl) propylene methoxy propyl dimethoxy methyl decane, 3 -(Methyl)acryloxypropyltriethoxydecane, and the like. In the above alkylene oxide adduct, examples of the alkylene oxide include ethylene oxide and propylene oxide.

作為多官能(甲基)丙烯酸酯之具體例,可列舉:乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、3-甲基-1,5-戊二醇二(甲基)丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯及1,9-壬二醇二(甲基)丙烯酸酯等脂肪族二醇之二(甲基)丙烯酸酯;環己烷二羥甲基二(甲基)丙烯酸酯及三環癸烷二羥甲基二(甲基)丙烯酸酯等脂環式二醇之二(甲基)丙烯酸酯;二乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯及三丙二醇二(甲基)丙烯酸酯等伸烷基二醇二(甲基)丙烯酸酯;新戊二醇與羥基三甲基乙酸及(甲基)丙烯酸之酯化反應產物;雙酚A環氧烷加成物之二(甲基)丙烯酸酯等雙酚系化合物之環氧烷加成物之二(甲基)丙烯酸酯;氫化雙酚A之二(甲基)丙烯酸酯等氫化雙酚系化合物之二(甲基)丙烯酸酯;三羥甲基丙烷三(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇三或四(甲基)丙烯酸酯、二季戊四醇五或六(甲基)丙烯酸酯等多元醇聚(甲基)丙烯酸酯;三羥甲基丙烷環氧烷加成物之三(甲基)丙 烯酸酯、二-三羥甲基丙烷環氧烷加成物之四(甲基)丙烯酸酯、季戊四醇環氧烷加成物之三或四(甲基)丙烯酸酯、二季戊四醇環氧烷加成物之五或六(甲基)丙烯酸酯等多元醇環氧烷加成物之聚(甲基)丙烯酸酯;(甲基)丙烯酸胺基甲酸乙酯;環氧(甲基)丙烯酸酯;以及聚酯(甲基)丙烯酸酯等。聚酯(甲基)丙烯酸酯可為樹枝狀聚合物型之(甲基)丙烯酸酯。於上述環氧烷加成物中,作為環氧烷,可列舉環氧乙烷及環氧丙烷等。 Specific examples of the polyfunctional (meth) acrylate include ethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, and 1,4-butanediol di(meth)acrylate. , neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 2- a di(meth)acrylate of an aliphatic diol such as butyl-2-ethyl-1,3-propanediol di(meth)acrylate or 1,9-nonanediol di(meth)acrylate; Di(meth) acrylate of alicyclic diol such as hexane dihydroxymethyl di(meth) acrylate or tricyclodecane dimethylol di(meth) acrylate; diethylene glycol bis ( Alkyl diol di(meth) acrylate such as methyl acrylate, dipropylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, and tripropylene glycol di (meth) acrylate An esterification reaction product of neopentyl glycol with hydroxytrimethylacetic acid and (meth)acrylic acid; an alkylene oxide compound of a bisphenol compound such as bis(A) alkylene oxide adduct Di(meth)acrylate; hydrogenated bisphenol A di(methyl) Di(meth)acrylate of a hydrogenated bisphenol compound such as an enoate; trimethylolpropane tri(meth)acrylate, di-trimethylolpropane tetra(meth)acrylate, pentaerythritol three or four Polyol (meth) acrylate such as (meth) acrylate, dipentaerythritol penta or hexa (meth) acrylate; tris(meth) propyl trimethylolpropane alkylene oxide adduct Terephthalate, di-trimethylolpropane alkylene oxide adduct tetrakis (meth) acrylate, pentaerythritol alkylene oxide adduct tris or tetra (meth) acrylate, dipentaerythritol alkylene oxide plus a poly(meth)acrylate of a polyol alkylene oxide adduct such as a five or six (meth) acrylate; an ethyl methacrylate; an epoxy (meth) acrylate; And polyester (meth) acrylate and the like. The polyester (meth) acrylate may be a dendrimer type (meth) acrylate. In the above alkylene oxide adduct, examples of the alkylene oxide include ethylene oxide and propylene oxide.

於本發明之組成物包含自由基硬化性成分之情形時,較佳為以組成物整體為基準,含有光自由基聚合起始劑0.1~10重量%。作為光自由基聚合起始劑,可使用通常能獲取者。 In the case where the composition of the present invention contains a radical curable component, it is preferred to contain 0.1 to 10% by weight of the photoradical polymerization initiator based on the entire composition. As the photoradical polymerization initiator, those which are usually available can be used.

本發明之組成物除該等以外,亦可於無損本發明之效果之範圍內包含硬化性成分以外之各種添加劑。作為各種添加劑,可列舉:熱陽離子聚合起始劑、光敏劑、紫外線吸收劑、光穩定劑、抗氧化劑、聚合抑制劑、矽烷偶合劑、多元醇化合物、聚合物、黏著賦予劑、填料、金屬微粒子、金屬氧化物微粒子、離子捕捉劑、消泡劑、均染劑、色素及顏料等。 In addition to these, the composition of the present invention may contain various additives other than the curable component insofar as the effects of the present invention are not impaired. As various additives, examples thereof include a thermal cationic polymerization initiator, a photosensitizer, an ultraviolet absorber, a light stabilizer, an antioxidant, a polymerization inhibitor, a decane coupling agent, a polyol compound, a polymer, an adhesion-imparting agent, a filler, and a metal. Microparticles, metal oxide microparticles, ion trapping agents, antifoaming agents, leveling agents, pigments, pigments, and the like.

作為聚合物,可列舉:聚(甲基)丙烯酸酯、聚乙酸乙烯酯、聚苯乙烯、聚醚及聚酯等。作為聚合物,亦可使用分子中包含環氧基、氧雜環丁烷基、及乙烯醚基等陽離子聚合性基者。又,亦可使用分子內包含(甲基)丙烯醯基或乙烯基等自由基聚合性基者。 Examples of the polymer include poly(meth)acrylate, polyvinyl acetate, polystyrene, polyether, and polyester. As the polymer, a cationically polymerizable group such as an epoxy group, an oxetane group, or a vinyl ether group may be used in the molecule. Further, a radical polymerizable group such as a (meth)acryl fluorenyl group or a vinyl group may be used in the molecule.

6.塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物 6. Active energy ray hardening type adhesive composition for plastic film or sheet

本發明係關於包含上述(A)~(D)成分作為必需成分之塑膠製薄 膜或片材用活性能量射線硬化型接著劑組成物。 The present invention relates to a plastic thin film comprising the above components (A) to (D) as essential components. The film or sheet is composed of an active energy ray-curable adhesive composition.

本發明之組成物較佳為組成物中之總氯含量為0.1重量%以下。作為使組成物中之總氯含量減少之方法,例如可列舉使用蒸餾精製品作為(B)成分及/或(C)成分之全部或一部分之方法等。 The composition of the present invention preferably has a total chlorine content of 0.1% by weight or less in the composition. As a method of reducing the total chlorine content in the composition, for example, a method in which a distilled refined product is used as all or a part of the component (B) and/or the component (C) can be mentioned.

作為本發明之組成物之製造方法,按照常規方法即可,可藉由將上述(A)~(D)成分、視需要進而將其他成分按照常規方法進行攪拌‧混合而製造。於此情形時,可視需要進行加熱或加溫。 The method for producing the composition of the present invention may be carried out according to a conventional method, and the components (A) to (D) and, if necessary, other components may be stirred and mixed according to a conventional method. In this case, heating or heating may be performed as needed.

作為本發明之組成物之黏度,根據使用目的適當設定即可。為了獲得於使用有塑膠薄膜等之積層體之製造步驟中可使用之塗佈性、即便為薄膜而平滑性亦優異之塗佈面,25℃下之黏度較佳為1,000mPa‧s以下,更佳為10~500mPa‧s,尤佳為20~100mPa‧s。於本發明中,所謂組成物之黏度意指藉由E型黏度計所測得之測定值。 The viscosity of the composition of the present invention may be appropriately set depending on the purpose of use. In order to obtain a coating surface which can be used in a production step using a laminate having a plastic film or the like, and a coating surface which is excellent in smoothness even for a film, the viscosity at 25 ° C is preferably 1,000 mPa ‧ s or less. Good for 10~500mPa‧s, especially for 20~100mPa‧s. In the present invention, the viscosity of the composition means the measured value measured by an E-type viscometer.

本發明之組成物可使用於塑膠薄膜等彼此之接著、塑膠薄膜等與其以外之各種基材(以下,稱為「其他基材」)之接著。即,可用於至少一者為塑膠薄膜等之2種基材之接著。再者,於以下中,於僅記為「基材」之情形時意指塑膠薄膜等及其他基材之總稱。作為其他基材,可列舉:玻璃、金屬氧化物、金屬、木材、紙等。 The composition of the present invention can be used for the subsequent bonding of plastic films and the like, and various substrates other than plastic films (hereinafter referred to as "other substrates"). That is, it can be used for at least one of two types of substrates such as a plastic film. In the following, the term "base material" means a general term for a plastic film or the like and other substrates. Examples of the other substrate include glass, metal oxide, metal, wood, paper, and the like.

作為塑膠薄膜等之材質,例如可列舉:環烯烴聚合物、(甲基)丙烯酸系樹脂、聚苯乙烯、丙烯酸/苯乙烯共聚合體、三乙酸纖維素、乙酸丁酸纖維素、聚氯乙烯、聚偏二氯乙烯、聚乙烯、聚丙烯、丙烯腈-丁二烯-苯乙烯(ABS,acrylonitrile-butadiene-styrene) 樹脂、聚醯胺、聚酯、聚碳酸酯、聚胺基甲酸乙酯、及氯化聚丙烯等。作為(甲基)丙烯酸系樹脂,可列舉:聚甲基丙烯酸甲酯、作為以甲基丙烯酸甲酯為主成分之共聚合體之(甲基)丙烯酸系樹脂、不包含甲基丙烯酸甲酯作為聚合單體之(甲基)丙烯酸系樹脂等。該等塑膠薄膜等中,本發明之組成物可較佳地應用於環烯烴聚合物及(甲基)丙烯酸系樹脂。 Examples of the material of the plastic film or the like include a cycloolefin polymer, a (meth)acrylic resin, polystyrene, an acrylic acid/styrene copolymer, cellulose triacetate, cellulose acetate butyrate, polyvinyl chloride, and the like. Polyvinylidene chloride, polyethylene, polypropylene, acrylonitrile-butadiene-styrene (ABS) Resins, polyamides, polyesters, polycarbonates, polyurethanes, and chlorinated polypropylenes. Examples of the (meth)acrylic resin include polymethyl methacrylate, a (meth)acrylic resin which is a copolymer of methyl methacrylate as a main component, and no methyl methacrylate as a polymerization. A monomeric (meth)acrylic resin or the like. Among the plastic films and the like, the composition of the present invention can be preferably applied to a cycloolefin polymer and a (meth)acrylic resin.

作為金屬氧化物,例如可列舉:氧化錫、氧化銦、氧化鈦、氧化鋅等。作為金屬,例如可列舉:金、銀、銅、鋁、鐵、鎳、鈦等。該等中,於藉由蒸鍍或濺鍍等而形成之透明性之薄膜為基材之情形時,由於多要求屬於本發明之組成物之特徵之一的透明性,故而可更佳地應用。 Examples of the metal oxide include tin oxide, indium oxide, titanium oxide, and zinc oxide. Examples of the metal include gold, silver, copper, aluminum, iron, nickel, titanium, and the like. In the case where the transparent film formed by vapor deposition, sputtering, or the like is used as the substrate, since transparency which is one of the features of the composition of the present invention is required, it can be more preferably applied. .

再者,於塑膠薄膜等為難接著性之材質之情形時,可於塗佈本發明之組成物之前對一者或兩者之表面進行活化處理。作為表面活化處理,可列舉電漿處理、電暈放電處理、藥液處理、粗面化處理及蝕刻處理、火焰處理等,亦可併用該等。 Further, in the case where the plastic film or the like is a material having difficulty in adhesion, the surface of one or both of them may be activated before the composition of the present invention is applied. Examples of the surface activation treatment include plasma treatment, corona discharge treatment, chemical liquid treatment, roughening treatment, etching treatment, flame treatment, and the like, and these may be used in combination.

7.使用方法 7. How to use

作為本發明之組成物之使用方法,按照常規方法即可,可列舉對基材塗佈組成物之後與另一基材貼合,並照射活性能量射線之方法等。本發明之組成物適於將薄層被接著體作為基材進行接著之情形。將薄層被接著體進行接著之情形之使用方法,按照於層壓之製造中通常進行之方法即可。例如可列舉將組成物塗佈於第1薄層被接著體,對其貼合第2薄層被接著體,且進行活性能量射線之照射之方法等。 The method of using the composition of the present invention may be a conventional method, and examples thereof include a method in which a composition is applied to a substrate, and then bonded to another substrate, and an active energy ray is irradiated. The composition of the present invention is suitable for the case where a thin layer is carried out as a substrate by a substrate. The method of using the thin layer to be carried out in the subsequent step may be carried out in accordance with a method generally carried out in the production of lamination. For example, a method in which a composition is applied to a first thin layer adherend, a second thin layer adherend is bonded thereto, and an active energy ray is irradiated is exemplified.

對基材之塗佈按照習知之方法即可,可列舉:自然式塗佈機(natural coater)、刮刀帶型塗佈機(knife belt coater)、浮動刮刀(floating knife)法、輥襯刮刀(knife-over-roll)法、墊襯刮刀(knife-on-blanket)法、噴霧、浸漬法、接觸輥法、擠壓輥(squeeze roll)法、逆轉輥法、氣刀(Air blade)法、淋幕式塗佈機、缺角輪塗佈機、凹版塗佈機、微凹版塗佈機、模具塗佈機及簾幕式塗佈機等之方法。 The coating of the substrate may be carried out according to a conventional method, and examples thereof include a natural coater, a knife belt coater, a floating knife method, and a roll lining blade ( Knife-over-roll method, knife-on-blanket method, spray, dipping method, contact roll method, squeeze roll method, reverse roll method, air blade method, A method such as a curtain coater, a notch coater, a gravure coater, a micro gravure coater, a die coater, and a curtain coater.

又,本發明之組成物之塗佈厚度根據使用之基材及用途進行選擇即可,較佳為0.1~10μm,更佳為1~5μm。 Further, the coating thickness of the composition of the present invention may be selected depending on the substrate to be used and the use, and is preferably 0.1 to 10 μm, more preferably 1 to 5 μm.

作為活性能量射線,可列舉可見光線、紫外線、X射線及電子束等,為了能夠使用經濟之裝置,較佳為紫外線。 Examples of the active energy ray include visible light rays, ultraviolet rays, X-rays, and electron beams. In order to use an economical device, ultraviolet rays are preferable.

作為藉由紫外線進行硬化之情形之光源,可使用各種光源,例如可列舉:加壓或高壓水銀燈、金屬鹵素燈、氙氣燈、無電極放電燈、碳弧燈及發光二極體(LED,Light Emitting Diode)等。該等中,尤佳為高壓水銀燈及金屬鹵素燈。紫外線之照射量,於UV-B區域(310nm附近)中,較佳為10~1,000mJ/cm2,更佳為20~500mJ/cm2,進而較佳為50~200mJ/cm2As a light source in the case of curing by ultraviolet rays, various light sources can be used, and examples thereof include pressurized or high pressure mercury lamps, metal halide lamps, xenon lamps, electrodeless discharge lamps, carbon arc lamps, and light emitting diodes (LED, Light). Emitting Diode) and so on. Among these, high pressure mercury lamps and metal halide lamps are particularly preferred. The amount of ultraviolet radiation, to UV-B region (the vicinity of 310 nm), preferred is 10 ~ 1,000mJ / cm 2, more preferably 20 ~ 500mJ / cm 2, further preferably 50 ~ 200mJ / cm 2.

於藉由電子束進行硬化之情形時,作為可使用之電子束(EB,electron beam)照射裝置,可使用各種裝置,例如可列舉柯克勞夫-沃耳吞(Cockcroft-Walton)型、凡德格拉夫(Van de Graaff)型及共振變壓器型之裝置等,作為電子束,較佳為具有50~1000eV之能量者,更佳為100~300eV。 In the case of hardening by an electron beam, as an electron beam (EB) irradiation device that can be used, various devices can be used, and for example, a Cockcroft-Walton type can be cited. The Van de Graaff type and the resonance transformer type device, etc., as the electron beam, preferably have an energy of 50 to 1000 eV, more preferably 100 to 300 eV.

8.積層體之製造方法 8. Manufacturing method of laminated body

本發明之組成物可較佳地使用於積層體之製造。作為積層體之 構成係由基材、上述組成物之硬化物、及其他基材所構成之積層體,其中,上述基材及其他基材之兩者或一者為塑膠製薄膜或片材。作為塑膠薄膜等,較佳為至少一者為環烯烴聚合物或(甲基)丙烯酸系樹脂。作為積層體之製造方法,具體而言,可列舉如下方法等:對基材塗佈上述組成物,於該塗佈面貼合其他基材,且自上述基材或上述其他基材之任一者之側照射活性能量射線。於此情形時,使用塑膠薄膜等作為上述基材及上述其他基材之兩者之基材或至少一基材。基材之具體例及較佳例係如上所述。組成物之塗佈方法、組成物之膜厚、活性能量射線之種類之照射條件等亦如上所述。 The composition of the present invention can be preferably used in the manufacture of a laminate. As a laminate The structure is a laminate comprising a substrate, a cured product of the above composition, and another substrate, wherein either or both of the substrate and the other substrate are plastic films or sheets. As a plastic film or the like, at least one of them is preferably a cycloolefin polymer or a (meth)acrylic resin. Specific examples of the method for producing the laminate include a method of applying the above-described composition to a substrate, bonding another substrate to the coated surface, and using any of the substrate or the other substrate. The side of the person illuminates the active energy ray. In this case, a plastic film or the like is used as a substrate or at least one substrate of both the substrate and the other substrate. Specific examples and preferred examples of the substrate are as described above. The coating method of the composition, the film thickness of the composition, and the irradiation conditions of the types of the active energy ray are also as described above.

作為所獲得之積層體之用途,可列舉於液晶顯示器、有機EL顯示器等中所使用之各種光學薄膜等,具體而言可列舉:賦予有防指紋或防光眩等功能性之硬塗膜、觸控面板之前面板、偏光板、相位差膜、視野角補償膜、增亮膜、抗反射膜、防眩膜、透鏡片及擴散片等。 Examples of the use of the obtained laminated body include various optical films used in liquid crystal displays, organic EL displays, and the like, and specific examples thereof include hard coating films having functions such as anti-fingerprint and anti-glare. Touch panel front panel, polarizing plate, retardation film, viewing angle compensation film, brightness enhancement film, anti-reflection film, anti-glare film, lens sheet and diffusion sheet.

[實施例] [Examples]

以下列舉實施例及比較例對本發明更具體地進行說明。但,本發明並不受該等例限定。再者,於以下中,所謂「份」意指重量份,表中之表示調配比例之數值意指重量%。 The present invention will be more specifically described below by way of examples and comparative examples. However, the invention is not limited by the examples. In the following, the term "parts" means parts by weight, and the numerical value in the table indicating the ratio of the proportions means % by weight.

於實施例及比較例中,組成物之製備所使用之各成分如下,以下,以如下方式進行略記。 In the examples and comparative examples, the components used in the preparation of the composition were as follows, and the following are briefly described as follows.

(A)成分 (A) component

‧J-1004:雙酚A型固形環氧樹脂(Mw:4,500,軟化點97℃),三菱化學(股)製造之「jER-1004」 ‧J-1004: Bisphenol A type solid epoxy resin (Mw: 4,500, softening point 97 ° C), "jER-1004" manufactured by Mitsubishi Chemical Corporation

‧J-1007:雙酚A型固形環氧樹脂(Mw:7,000,軟化點128℃),三菱化學(股)製造之「jER-1007」 ‧J-1007: bisphenol A type solid epoxy resin (Mw: 7,000, softening point 128 ° C), "jER-1007" manufactured by Mitsubishi Chemical Corporation

(B)成分 (B) component

‧BD-DGE:1,4-丁二醇二縮水甘油醚(蒸餾精製品),阪本藥品工業(股)製造之「SR-14BJ」 ‧BD-DGE: 1,4-butanediol diglycidyl ether (distilled refined product), "SR-14BJ" manufactured by Sakamoto Pharmaceutical Co., Ltd.

‧HD-DGE:1,6-己二醇二縮水甘油醚(蒸餾精製品),四日市合成(股)製造之「Epogosey HD(D)」 ‧HD-DGE: 1,6-hexanediol diglycidyl ether (distilled refined product), "Epogosey HD (D)" manufactured by Yokkaichi Synthetic Co., Ltd.

‧NPG-DGE:新戊二醇二縮水甘油醚(蒸餾精製品),四日市合成(股)製造之「NPG-DEP(D)」 ‧NPG-DGE: Neopentyl glycol diglycidyl ether (distilled refined product), "NPG-DEP(D)" manufactured by Yokkaichi Synthetic Co., Ltd.

(C)成分 (C) component

‧OXT-221:雙[(3-乙基氧雜環丁烷-3-基)甲基]醚,東亞合成(股)製造之「ARONE OXETANE OXT-221」 ‧OXT-221: bis[(3-ethyloxetan-3-yl)methyl]ether, "ARONE OXETANE OXT-221" manufactured by East Asia Synthetic Co., Ltd.

(D)成分 (D) component

‧110P:三芳基鋶六氟磷酸鹽(有效成分100%),SAN-APRO(股)製造之「CPI-110P」 ‧110P: Triaryl hexafluorophosphate (100% active ingredient), "CPI-110P" manufactured by SAN-APRO Co., Ltd.

(A)'[(A)成分以外之芳香族環氧樹脂] (A) '[Aromatic epoxy resin other than (A) component]

‧J-828:雙酚A型液狀環氧樹脂(Mw:370),三菱化學(股)製造之「jER-828」 ‧J-828: Bisphenol A type liquid epoxy resin (Mw: 370), "jER-828" manufactured by Mitsubishi Chemical Corporation

‧850CRP:雙酚A型環氧樹脂之蒸餾精製品(分子量340),DIC(股)製造之「EPICLON 850-CRP」 ‧850CRP: Distillate refined product of bisphenol A epoxy resin (molecular weight 340), "EDCLON 850-CRP" manufactured by DIC

(A)"[(A)成分以外之環氧樹脂] (A) "Epoxy resin other than [(A) component]

‧聚合物X:製造例1之生成物甲基丙烯酸縮水甘油酯、甲基丙烯酸甲酯、及苯乙烯之共聚合體 ‧Polymer X: a copolymer of the product of Production Example 1 glycidyl methacrylate, methyl methacrylate, and styrene

(其他)[其他成分] (other) [other ingredients]

‧2N-220S:聚酯二醇(數量平均分子量2,000,熔點0℃),豐國製油(股)製造之「HS2N-220S」 ‧2N-220S: Polyester diol (quantitative average molecular weight 2,000, melting point 0 °C), "HS2N-220S" manufactured by Fengguo Oil Co., Ltd.

‧V240:非晶性聚酯樹脂(數量平均分子量15,000,玻璃轉移溫度60℃),東洋紡(股)製造之「Vylon 240」 ‧V240: Amorphous polyester resin (number average molecular weight 15,000, glass transition temperature 60 ° C), "Vylon 240" manufactured by Toyobo Co., Ltd.

‧BR-83:聚甲基丙烯酸甲酯(Mw:40,000,玻璃轉移溫度105℃),三菱麗陽(股)製造之「Dianal BR-83」 ‧BR-83: Polymethyl methacrylate (Mw: 40,000, glass transition temperature 105 ° C), "Dianal BR-83" manufactured by Mitsubishi Rayon Co., Ltd.

‧LA-1114:聚丙烯酸丁酯與聚甲基丙烯酸甲酯之嵌段共聚合體(構成單體單位之主成分為丙烯酸丁酯)(Mw:80,000,於室溫下為液狀),可樂麗(股)製造之「Clarity LA1114」 ‧LA-1114: block copolymer of polybutyl acrylate and polymethyl methacrylate (the main component of the monomer unit is butyl acrylate) (Mw: 80,000, liquid at room temperature), Kura "Clarity LA1114" manufactured by (share)

1.製造例 Manufacturing example 1)製造例1 1) Manufacturing Example 1

將具備油護套之容量1000mL之加壓式攪拌槽型反應器之護套溫度保持於190℃。繼而,一邊將反應器之壓力保持固定,一邊開始將包含甲基丙烯酸縮水甘油酯(30份)、甲基丙烯酸甲酯(45份)、苯乙烯(25份)、作為聚合溶劑之甲基乙基酮(18份)、及作為聚合起始劑之二第三丁基過氧化物(0.25份)之單體混合物以固定之供給速度(48g/min;滯留時間:12分鐘)自原料罐連續供給至反應器, 並將相當於單體混合物之供給量之反應液自出口連續地抽出。於反應剛開始後,反應溫度暫時降低後,確認到因聚合熱而引起之溫度上升,藉由對油護套溫度進行控制,而將反應器之內溫保持於192~194℃。將自反應器內溫穩定後36分鐘之後的時間點設為反應液之採取開始點,自該時間點繼續反應25分鐘,結果為已供給1.2kg之單體混合液,已回收1.2kg之反應液。其後,將反應液導入至薄膜蒸發器,將未反應單體等揮發成分分離,而去除未反應單體等揮發成分,獲得聚合體「聚合物X」。GPC之測定結果為,聚苯乙烯換算之數量平均分子量(Mn)為3,500,Mw為9,900,Tg[示差掃描熱量法(DSC,Differential Scanning Calorimetry)測定,升溫速度10℃/min]為65℃。 The sheath temperature of the pressurized stirred tank reactor having a capacity of 1000 mL of oil jacket was maintained at 190 °C. Then, while maintaining the pressure of the reactor, the glycidyl methacrylate (30 parts), methyl methacrylate (45 parts), styrene (25 parts), and methyl ethyl bromide as a polymerization solvent were started. The monomer mixture of the ketone (18 parts) and the third tert-butyl peroxide (0.25 parts) as a polymerization initiator was continuously supplied from the raw material tank at a fixed supply rate (48 g/min; residence time: 12 minutes). Supply to the reactor, The reaction liquid corresponding to the supply amount of the monomer mixture was continuously withdrawn from the outlet. Immediately after the start of the reaction, the reaction temperature was temporarily lowered, and the temperature rise due to the heat of polymerization was confirmed. The temperature of the oil jacket was controlled to maintain the internal temperature of the reactor at 192 to 194 °C. The time point 36 minutes after the internal temperature of the reactor was stabilized was taken as the starting point of the reaction liquid, and the reaction was continued for 25 minutes from the time point. As a result, 1.2 kg of the monomer mixture was supplied, and 1.2 kg of the reaction was recovered. liquid. Thereafter, the reaction liquid is introduced into a thin film evaporator, and volatile components such as unreacted monomers are separated to remove volatile components such as unreacted monomers, thereby obtaining a polymer "polymer X". As a result of measurement by GPC, the number average molecular weight (Mn) in terms of polystyrene was 3,500, Mw was 9,900, and Tg [measured by Differential Scanning Calorimetry (DSC), and the temperature rise rate was 10 ° C/min] was 65 °C.

2.實施例1~實施例3、比較例1~比較例9 2. Example 1 to Example 3, Comparative Example 1 to Comparative Example 9 1)組成物之製造 1) Fabrication of the composition

將表1及表2所示之各成分以各自之比例調配,並按照常規方法進行攪拌混合,而製備活性能量射線硬化型接著劑組成物。針對所獲得之組成物,藉由東機產業(股)製造之E型黏度計對25℃下之黏度進行測定。 Each of the components shown in Tables 1 and 2 was formulated in a ratio of each of them, and stirred and mixed in accordance with a conventional method to prepare an active energy ray-curable adhesive composition. For the obtained composition, the viscosity at 25 ° C was measured by an E-type viscometer manufactured by Toki Sangyo Co., Ltd.

2)積層體之製造 2) Manufacturing of laminates

於厚度100μm之環烯烴聚合物[商品名ZEONOR ZF-14,日本瑞翁(股)製造,以下稱為「ZEONOR」]、及厚度75μm之添加有UV吸收劑之丙烯酸系樹脂[商品名HI50-75KT-UV,Kuraray(股)製造,以下稱為「丙烯酸系樹脂」]上實施電暈處理作為易接著處理。 繼而,於丙烯酸系樹脂之電暈處理面,利用棒式塗佈機將所獲得之組成物塗佈為3μm厚後,層壓ZEONOR。此時,以ZEONOR之電暈處理面與塗佈面相接之方式進行配置。最後,藉由EYE GRAPHICS(股)製造之帶輸送帶之紫外線照射裝置(使用金屬鹵素燈)自ZEONOR之表面以累計光量100mJ/cm2(UV-B)照射紫外線,而使接著劑組成物硬化。將所獲得之積層體於23℃、相對濕度50%之條件下放置1天後,按照下述方法評價無色透明性及接著力。首先,於23℃、相對濕度70%之條件下實施接著劑之塗佈及硬化。對所獲得之積層體按照後述之評價方法進行評價。將該等結果示於表1、表2。此處,針對接著力良好之組成物亦於23℃、相對濕度30%之條件下製作試驗片,並同樣地進行評價,將該等結果示於表3。 A cycloolefin polymer having a thickness of 100 μm [trade name: ZEONOR ZF-14, manufactured by Japan's Ryan (hereinafter), hereinafter referred to as "ZEONOR"], and an acrylic resin having a thickness of 75 μm to which a UV absorber is added [trade name HI50- 75KT-UV, manufactured by Kuraray Co., Ltd., hereinafter referred to as "acrylic resin", was subjected to corona treatment as an easy-to-continue treatment. Then, on the corona-treated surface of the acrylic resin, the obtained composition was applied to a thickness of 3 μm by a bar coater, and then ZEONOR was laminated. At this time, the corona-treated surface of ZEONOR is placed in contact with the coated surface. Finally, an ultraviolet irradiation device with a conveyor belt manufactured by EYE GRAPHICS (using a metal halide lamp) irradiates ultraviolet rays from the surface of the ZIONOR with a cumulative light amount of 100 mJ/cm 2 (UV-B) to harden the adhesive composition. . After the obtained laminate was allowed to stand at 23 ° C and a relative humidity of 50% for one day, colorless transparency and adhesion were evaluated by the following methods. First, application and hardening of the adhesive were carried out under conditions of 23 ° C and a relative humidity of 70%. The obtained laminate was evaluated in accordance with the evaluation method described later. The results are shown in Tables 1 and 2. Here, the test piece was produced under conditions of 23 ° C and a relative humidity of 30% for the composition having good adhesion, and the evaluation was performed in the same manner, and the results are shown in Table 3.

3.評價方法 3. Evaluation method 1)無色透明性之評價 1) Evaluation of colorless transparency

將5片所獲得之積層體重疊進行目視觀察,並藉由以下基準進行判定。 The laminate obtained by the five sheets was superimposed and visually observed, and judged by the following criteria.

A:完全感覺不到渾濁或黃變 A: I don't feel turbid or yellow at all.

B:略微感覺到渾濁或黃變 B: Slightly turbid or yellowish

C:清楚地感覺到渾濁或黃變 C: Clearly feel turbid or yellow

2)接著力之評價 2) Evaluation of the force

○常溫保管後 ○ After storage at room temperature

將所獲得之積層體切成寬度1英吋、長度15cm,並利用雙面膠帶將聚甲基丙烯酸甲酯(PMMA,polymethyl methacrylate)薄膜之 側貼附於鋁板。繼而,將ZEONOR以剝離速度200mm/min進行90°剝離,測定接著力。此時,將薄膜立即破裂而無法測定者評價為「材料破裂」。於能夠剝離之情形時,於5cm停止剝離,進行如下所示之耐濕熱試驗。 The obtained laminate was cut into a width of 1 inch and a length of 15 cm, and a polymethyl methacrylate film (PMMA) was coated with a double-sided tape. The side is attached to the aluminum plate. Then, ZEONOR was peeled at 90° at a peeling speed of 200 mm/min, and the adhesion was measured. At this time, the film was immediately broken and the unmeasured person was evaluated as "material cracking". In the case where peeling was possible, the peeling was stopped at 5 cm, and the moist heat resistance test shown below was performed.

○耐濕熱試驗後 ○ After the damp heat test

將常溫保管後之測定過接著力之試片投入85℃ 85%之恆溫恆濕槽中2天後,以與「常溫保管後」之測定同樣之方式測定接著力。 The test piece after the measurement of the adhesion after storage at normal temperature was placed in a constant temperature and humidity chamber of 85% at 85 ° C for 2 days, and then the adhesion was measured in the same manner as the measurement after "keeping after normal temperature".

本發明之實施例1~實施例3之組成物不論於23℃ 70%下進行塗佈‧硬化或於23℃ 30%下進行塗佈‧硬化,對ZEONOR及PMMA均顯現出強力之接著力,其接著力於85℃ 85%下保持2天後亦未衰退。另一方面,將(A)成分替換成不屬於(A)成分之雙酚A型液狀環氧樹脂之比較例1~比較例4之組成物於23℃ 70%下進行塗佈‧硬化時,對PMMA之接著力非常低。將實施例1之(A)成分改變為具有環氧基之聚合物X之比較例5之組成物之接著力於23℃ 70%下進行硬化之情形時為強力,於85℃ 85%下保持2天後亦未衰退。然而,於23℃ 30%下進行塗佈‧硬化之情形時,雖常溫保管下之接著力為強力,但於85℃ 85%下2天後,降低至6.5N/英吋。繼而,針對將實施例1之(A)成分變更為各種聚合物之比較例6~比較例9之組成物進行描述。使用BR-83之比較例8之組成物於85℃ 85%下2天後之接著力亦相對良好,但與實施例1及比較例5之組成物相比較差。比較例6及比較例9之組成物於常溫保管後之接著力亦較低,比較例7之組成物於85℃ 85%下2天後之接著力較低。 The compositions of Examples 1 to 3 of the present invention were coated or cured at 70% of 23 ° C or cured at 23 ° C and 30%, and exhibited strong adhesion to both ZEONOR and PMMA. It was then maintained at 85 ° C for 85% and did not decay after 2 days. On the other hand, the composition of Comparative Example 1 to Comparative Example 4 in which the component (A) was replaced with the bisphenol A type liquid epoxy resin which does not belong to the component (A) was coated at 70 ° C and 70%. The adhesion to PMMA is very low. The adhesive force of the composition of Comparative Example 5 in which the component (A) of Example 1 was changed to the polymer X having an epoxy group was strong at the case of hardening at 70 ° C and 70%, and was maintained at 85 ° C and 85%. There was no decline after 2 days. However, in the case of coating and hardening at 30% at 23 ° C, the adhesion at room temperature was strong, but it was lowered to 6.5 N/inch after 2 days at 85% at 85 °C. Next, the composition of Comparative Example 6 to Comparative Example 9 in which the component (A) of Example 1 was changed to various polymers will be described. The composition of Comparative Example 8 using BR-83 was relatively good after 2 days at 85% at 85 ° C, but was inferior to the compositions of Example 1 and Comparative Example 5. The composition of Comparative Example 6 and Comparative Example 9 had a lower adhesion after storage at room temperature, and the composition of Comparative Example 7 had a lower adhesion after 2 days at 85 ° C and 85%.

(產業上之可利用性) (industrial availability)

本發明之組成物可作為塑膠製薄膜等之接著劑使用,尤其可適宜使用於液晶顯示器或有機EL顯示器中所使用之光 學薄膜之接著。 The composition of the present invention can be used as an adhesive for a plastic film or the like, and can be suitably used for light used in a liquid crystal display or an organic EL display. Learn the film.

Claims (14)

一種塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其含有:(A)成分:重量平均分子量為500以上之芳香族環氧化合物(B)成分:具有碳數2~10個之多元醇之聚縮水甘油醚(C)成分:1分子中具有2個以上氧雜環丁烷基且分子量為500以下之化合物(D)成分:光陽離子聚合起始劑;且上述(A)~(D)成分之含有比例為於組成物整體中,(A)成分:1~30重量%(B)成分:10~70重量%(C)成分:10~70重量%(D)成分:0.5~10重量%。 An active energy ray-curable adhesive composition for a plastic film or sheet comprising: (A) component: an aromatic epoxy compound having a weight average molecular weight of 500 or more (B) component: having 2 to 10 carbon atoms Polyglycidyl ether (C) component of a polyhydric alcohol: a compound (D) having two or more oxetanyl groups in one molecule and having a molecular weight of 500 or less: a photocationic polymerization initiator; and the above (A) The content of the component (D) is in the entire composition, (A) component: 1 to 30% by weight (B) Component: 10 to 70% by weight (C) Component: 10 to 70% by weight (D) Component: 0.5 to 10% by weight. 如請求項1之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(B)成分之含有比例係以(A)成分及(B)成分之合計量100重量%為基準,為51~99重量%。 The active energy ray-curable adhesive composition for a plastic film or sheet according to claim 1, wherein the content of the component (B) is based on 100% by weight of the total of the components (A) and (B). , 51 to 99% by weight. 如請求項1或2之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(A)成分係重量平均分子量為1,000~20,000且1分子中所含之環氧基之數為2以上之化合物。 The active energy ray-curable adhesive composition of the plastic film or sheet according to claim 1 or 2, wherein the component (A) has a weight average molecular weight of 1,000 to 20,000 and the number of epoxy groups contained in one molecule It is a compound of 2 or more. 如請求項1至3中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(A)成分為雙酚A型環氧樹脂及/或雙酚F型環氧樹脂。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 3, wherein the component (A) is a bisphenol A epoxy resin and/or a bisphenol F ring Oxygen resin. 如請求項1至4中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(B)成分為具有碳數2~6個之二醇之 二縮水甘油醚。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 4, wherein the component (B) is a diol having 2 to 6 carbon atoms. Diglycidyl ether. 如請求項1至5中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(B)成分為具有碳數4~6個之烷二醇之二縮水甘油醚。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 5, wherein the component (B) is diglycidyl having an alkylene glycol having 4 to 6 carbon atoms. ether. 如請求項1至6中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(C)成分為下述式(1)所示之氧雜環丁烷化合物: The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 6, wherein the component (C) is an oxetane compound represented by the following formula (1) : 如請求項1至7中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,(D)成分為鋶鹽系光陽離子聚合起始劑。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 7, wherein the component (D) is a sulfonium salt-based photocationic polymerization initiator. 如請求項1至8中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,於組成物整體中含有(A)成分3~20重量%、(B)成分20~65重量%、(C)成分20~60重量%、及(D)成分1~5重量%。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 8, wherein the composition contains 3 to 20% by weight of the component (A) and (B) 20 to 65% by weight, (C) component 20 to 60% by weight, and (D) component 1 to 5% by weight. 如請求項1至9中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,於組成物整體中包含水0.05~3重量%。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 9, wherein the composition contains 0.05 to 3% by weight of water as a whole. 如請求項1至10中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物,其中,塑膠製薄膜或片材之至少一者為環烯烴聚合物或(甲基)丙烯酸系樹脂。 The active energy ray-curable adhesive composition for a plastic film or sheet according to any one of claims 1 to 10, wherein at least one of the plastic film or sheet is a cycloolefin polymer or (meth) Acrylic resin. 一種積層體,其係由基材、請求項1至11中任一項之塑膠製薄膜或片材用活性能量射線硬化型接著劑組成物之硬化物、及其他基材所構成者,其中,上述基材及上述其他基材之兩者或一者為塑膠製薄膜或片材。 A laminate comprising a substrate, a cured film of a plastic optical film or sheet of any one of claims 1 to 11 and a cured product of an active energy ray-curable adhesive composition, and other substrate, wherein Both or one of the above substrate and the other substrate is a plastic film or sheet. 如請求項12之積層體,其中,塑膠製薄膜或片材之至少一者為環烯烴聚合物或(甲基)丙烯酸系樹脂。 The laminate according to claim 12, wherein at least one of the plastic film or sheet is a cycloolefin polymer or a (meth)acrylic resin. 一種積層體之製造方法,其係將請求項1至11中任一項之組成物塗佈於基材,對塗佈面貼合其他基材,且自上述基材或上述其他基材之任一者之側照射活性能量射線者,其中,上述基材及上述其他基材之兩者或一者為塑膠製薄膜或片材。 A method for producing a laminate, which comprises applying the composition according to any one of claims 1 to 11 to a substrate, bonding another substrate to the coated surface, and using any of the substrate or the other substrate One side of the active energy ray is irradiated, wherein either or both of the substrate and the other substrate are plastic films or sheets.
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